Microchip MCP9701 Low-power linear active thermistorâ ¢ ic Datasheet

MCP9700/9700A
MCP9701/9701A
Low-Power Linear Active Thermistor™ ICs
Features
Description
• Tiny Analog Temperature Sensor
• Available Packages: SC-70-5, TO-92-3
• Wide Temperature Measurement Range:
- -40°C to +125°C
• Accuracy:
- ±2°C (max.), 0°C to +70°C (MCP9700A/9701A)
- ±4°C (max.), 0°C to +70°C (MCP9700/9701)
• Optimized for Analog-to-Digital Converters
(ADCs):
- 10.0 mV/°C (typ.) MCP9700/9700A
- 19.5 mV/°C (typ.) MCP9701/9701A
• Wide Operating Voltage Range:
- VDD = 2.3V to 5.5V MCP9700/9700A
- VDD = 3.1V to 5.5V MCP9701/9701A
• Low Operating Current: 6 µA (typ.)
• Optimized to Drive Large Capacitive Loads
The MCP9700/9700A and MCP9701/9701A family of
Linear Active Thermistor™ Intergrated Circuit (IC) is an
analog temperature sensor that converts temperature
to analog voltage. It’s a low-cost, low-power sensor
with an accuracy of ±2°C from 0°C to +70°C
(MCP9700A/9701A) ±4°C from 0°C to +70°C
(MCP9700/9701) while consuming 6 µA (typ.) of
operating current.
Typical Applications
The MCP9700/9700A and MCP9701/9701A provide a
low-cost solution for applications that require measurement of a relative change of temperature. When measuring relative change in temperature from +25°C, an
accuracy of ±1°C (typ.) can be realized from 0°C to
+70°C. This accuracy can also be achieved by applying
system calibration at +25°C.
•
•
•
•
•
•
Hard Disk Drives and Other PC Peripherals
Entertainment Systems
Home Appliance
Office Equipment
Battery Packs and Portable Equipment
General Purpose Temperature Monitoring
Typical Application Circuit
VDD
VSS
PICmicro® ANI
MCU
Unlike resistive sensors (such as thermistors), the
Linear Active Thermistor IC does not require an
additional signal-conditioning circuit. Therefore, the
biasing circuit development overhead for thermistor
solutions can be avoided by implementing this low-cost
device. The voltage output pin (VOUT) can be directly
connected to the ADC input of a microcontroller. The
MCP9700/9700A and MCP9701/9701A temperature
coefficients are scaled to provide a 1°C/bit resolution
for an 8-bit ADC with a reference voltage of 2.5V and
5V, respectively.
In addition, this family is immune to the effects of
parasitic capacitance and can drive large capacitive
loads. This provides Printed Circuit Board (PCB) layout
design flexibility by enabling the device to be remotely
located from the microcontroller. Adding some
capacitance at the output also helps the output
transient response by reducing overshoots or
undershoots. However, capacitive load is not required
for sensor output stability.
Package Type
VDD
Cbypass
0.1 µF
5-Pin SC-70
MCP9700/9700A
MCP9701/9701A
VDD
MCP9700
GND
VOUT
NC 1
3-Pin TO-92
MCP9700/9701
Only
5 NC
123
GND 2
VOUT 3
4 VDD
Bottom
View
1
VDD VOUT GND
© 2006 Microchip Technology Inc.
DS21942C-page 1
MCP9700/9700A and MCP9701/9701A
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
VDD:...................................................................... 6.0V
†Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
Storage temperature: ........................ -65°C to +150°C
Ambient Temp. with Power Applied:.. -40°C to +125°C
Junction Temperature (TJ):................................. 150°C
ESD Protection On All Pins (HBM:MM):.... (4 kV:200V)
Latch-Up Current at Each Pin: ...................... ±200 mA
DC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated:
MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load.
MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load.
Parameter
Sym
Min
Typ
Max
Unit
Conditions
Operating Voltage Range
VDD
VDD
2.3
3.1
—
—
5.5
5.5
V
V
Operating Current
IDD
—
6
12
µA
Δ°C/ΔVDD
—
0.1
—
°C/V
TA = +25°C
TACY
—
±1
—
°C
TA = 0°C to +70°C
TACY
-2.0
—
+2.0
°C
MCP9700A/9701A
TA = -40°C to +125°C
TACY
-2.0
—
+4.0
°C
MCP9700A
TA = -10°C to +125°C
TACY
-2.0
—
+4.0
°C
MCP9701A
TA = 0°C to +70°C
TACY
-4.0
—
+4.0
°C
MCP9700/9701
TA = -40°C to +125°C
TACY
-4.0
—
+6.0
°C
MCP9700
TA = -10°C to +125°C
TACY
-4.0
—
+6.0
°C
MCP9701
Output Voltage, TA = 0°C
V0°C
—
500
—
mV
MCP9700/9700A
Output Voltage, TA = 0°C
V0°C
—
400
—
mV
MCP9701/9701A
TC
—
10.0
—
mV/°C MCP9700/9700A
TC
—
19.5
—
mV/°C MCP9701/9701A
VONL
—
±0.5
—
°C
Output Current
IOUT
—
—
100
µA
Output Impedance
ZOUT
—
20
—
Ω
IOUT = 100 µA, f = 500 Hz
ΔVOUT/
ΔIOUT
—
1
—
Ω
TA = 0°C to +70°C,
IOUT = 100 µA
Power Supply
Power Supply Rejection
MCP9700/9700A
MCP9701/9701A
Sensor Accuracy (Notes 1, 2)
Sensor Output
Temperature Coefficient
Output Non-linearity
Output Load Regulation
Note 1:
2:
3:
4:
TA = 0°C to +70°C (Note 2)
The MCP9700/9700A family accuracy is tested with VDD = 3.3V, while the MCP9701/9701A accuracy is
tested with VDD = 5.0V.
The MCP9700/9700A and MCP9701/9701A family is characterized using the first-order or linear equation,
as shown in Equation 4-2.
The MCP9700/9700A and MCP9701/9701A family is characterized and production tested with a
capacitive load of 1000 pF.
SC-70-5 package thermal response with 1x1 inch, dual-sided copper clad, TO-92-3 package thermal
response without PCB (leaded).
DS21942C-page 2
© 2006 Microchip Technology Inc.
MCP9700/9700A and MCP9701/9701A
DC ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated:
MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load.
MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load.
Parameter
Turn-on Time
Sym
Min
Typ
Max
Unit
tON
—
800
—
µs
Typical Load Capacitance (Note 3)
CLOAD
—
—
1000
pF
SC-70 Thermal Response to 63%
tRES
—
1.3
—
s
TO-92 Thermal Response to 63%
tRES
—
1.65
—
s
Note 1:
2:
3:
4:
Conditions
30°C (Air) to +125°C
(Fluid Bath) (Note 4)
The MCP9700/9700A family accuracy is tested with VDD = 3.3V, while the MCP9701/9701A accuracy is
tested with VDD = 5.0V.
The MCP9700/9700A and MCP9701/9701A family is characterized using the first-order or linear equation,
as shown in Equation 4-2.
The MCP9700/9700A and MCP9701/9701A family is characterized and production tested with a
capacitive load of 1000 pF.
SC-70-5 package thermal response with 1x1 inch, dual-sided copper clad, TO-92-3 package thermal
response without PCB (leaded).
M
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated:
MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load.
MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load.
Parameters
Sym
Min
Typ
Max
Units
Conditions
TA
-40
—
+125
°C
MCP9700/9700A
(Note)
TA
-10
—
+125
°C
MCP9701/9701A
(Note)
Operating Temperature Range
TA
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Resistance, SC-70-5
θJA
—
331
—
°C/W
Thermal Resistance, TO-92-3
θJA
—
131.9
—
°C/W
Temperature Ranges
Specified Temperature Range
Thermal Package Resistances
Note:
Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+150°C).
© 2006 Microchip Technology Inc.
DS21942C-page 3
MCP9700/9700A and MCP9701/9701A
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V; GND
= Ground, Cbypass = 0.1 µF.
4.0
6.0
4.0
MCP9701A
VDD= 5.0V
2.0
1.0
Accuracy (°C)
Accuracy (°C)
3.0
Spec. Limits
0.0
-1.0
-50
-25
25
50
TA (°C)
75
100
125
0.0
-2.0
-4.0
-25
0
25
50
TA (°C)
75
100
-50
' Accuracy Due to Load (°C)
Accuracy (°C)
MCP9701/
MCP9701A
VDD= 5.5V
VDD= 3.1V
2.0
-50
-25
0
25
50
TA (°C)
75
100
125
0.2
MCP9701/MCP9701A
VDD = 5.0V
0.1
0
MCP9700/MCP9700A
VDD = 3.3V
-0.1
ILOAD = 100 µA
-0.2
125
-50
-25
0
25
50
TA (°C)
75
100
125
FIGURE 2-5:
Changes in Accuracy vs.
Ambient Temperature (Due to Load).
FIGURE 2-2:
Accuracy vs. Ambient
Temperature, with VDD.
12.0
Load Regulation 'V/'I (:)
4.0
10.0
MCP9701
MCP9701A
8.0
IDD (µA)
MCP9700
VDD= 3.3V
FIGURE 2-4:
Accuracy vs. Ambient
Temperature (MCP9700/9701).
6.0
MCP9700/
MCP9700A
VDD = 5.5V
VDD = 2.3V
Spec. Limits
0.0
-4.0
0
FIGURE 2-1:
Accuracy vs. Ambient
Temperature (MCP9700A/9701A).
4.0
2.0
-2.0
MCP9700A
VDD= 3.3V
-2.0
MCP9701
VDD= 5.0V
6.0
MCP9700
MCP9700A
4.0
2.0
0.0
3.0
2.0
MCP9700/MCP9700A
MCP9701/MCP9701A
VDD = 3.3V
IOUT = 50 µA
IOUT = 100 µA
IOUT = 200 µA
1.0
0.0
-50
-25
FIGURE 2-3:
Temperature.
DS21942C-page 4
0
25
50
TA (°C)
75
100
Supply Current vs.
125
-50
-25
0
25
50
TA (°C)
75
100
125
FIGURE 2-6:
Load Regulation vs.
Ambient Temperature.
© 2006 Microchip Technology Inc.
MCP9700/9700A and MCP9701/9701A
Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V; GND
= Ground, Cbypass = 0.1 µF.
30%
15%
Normalized PSRR (°C/V)
Normalized PSRR (°C/V)
0.20
0.15
MCP9700/MCP9700A
VDD= 2.3V to 4.0V
0.05
0.00
-25
0
25
50
TA (°C)
75
100
125
FIGURE 2-9:
Power Supply Rejection
(Δ°C/ΔVDD) vs. Ambient Temperature.
© 2006 Microchip Technology Inc.
500
480
20.0
19.9
19.8
19.7
FIGURE 2-11:
Occurrences vs. Temperature
Coefficient (MCP9701/9701A).
0.30
MCP9700/MCP9700A
VDD= 2.3V to 5.5V
-50
19.7
TC (mV/°C)
FIGURE 2-8:
Occurrences vs. Temperature
Coefficient (MCP9700/9700A).
0.10
19.6
19.5
19.4
19.3
MCP9701
MCP9701A
VDD = 5.0V
108 samples
19.2
45%
40%
35%
30%
25%
20%
15%
10%
5%
0%
19.3
Occurrences
10.5
10.4
10.3
10.2
10.2
10.1
10.0
9.9
9.8
9.8
9.7
Occurrences
MCP9700
MCP9700A
VDD = 3.3V
108 samples
TC (mV/°C)
0.25
460
FIGURE 2-10:
Output Voltage at 0°C
(MCP9701/9701A).
FIGURE 2-7:
Output Voltage at 0°C
(MCP9700/9700A).
0.30
440
V0°C (mV)
V0°C (mV)
45%
40%
35%
30%
25%
20%
15%
10%
5%
0%
420
300
600
580
560
540
520
500
480
460
0%
440
5%
0%
420
5%
400
10%
380
10%
20%
360
15%
340
20%
25%
MCP9701
MCP9701A
VDD = 5.0V
108 samples
320
25%
35%
MCP9700
MCP9700A
VDD = 3.3V
108 samples
400
Occurrences
30%
Occurrences
35%
0.25
MCP9701/MCP9701A
VDD= 3.1V to 5.5V
0.20
0.15
0.10
MCP9701/MCP9701A
VDD= 3.1V to 4.0V
0.05
0.00
-50
-25
0
25
50
TA (°C)
75
100
125
FIGURE 2-12:
Power Supply Rejection
(Δ°C/ΔVDD) vs. Temperature.
DS21942C-page 5
MCP9700/9700A and MCP9701/9701A
Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V; GND
= Ground, Cbypass = 0.1 µF.
1.6
3.0
TA = 26°C
1.4
2.5
1.0
VOUT (V)
0.8
0.6
0.4
MCP9701
MCP9701A
2.0
1.5
1.0
MCP9700
MCP9700A
0.5
0.2
0.0
0.0
-50
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
-25
Output Voltage vs. Power
2.5
VDD_STEP = 5V
TA = 26°C
IDD
8
1.7
0.8
VOUT
VDD_RAMP = 5V/ms
TA = 26°C
125
30.0
18.0
6.0
-6.0
VOUT
1.0
-18.0
0.5
-30.0
0.0
-42.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Time (ms)
Time (ms)
Output vs. Settling Time to
FIGURE 2-17:
Ramp VDD.
130
Output vs. Settling Time to
SC70-5
1 in. x 1 in. Copper Clad
PCB
80
Leaded, without PCB
SC70-5
TO92-3
55
30
Output Impedance (:)
1000
105
TA (°C)
100
2.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-2.5
-0.1
-1.7
0
FIGURE 2-14:
step VDD.
75
1.5
-0.8
2
IDD
2.5
0.0
4
50
Output Voltage vs. Ambient
3.0
VOUT (V)
6
VOUT (V)
FIGURE 2-16:
Temperature.
IDD (mA)
12
10
25
TA (°C)
VDD (V)
FIGURE 2-13:
Supply.
0
IDD (µA)
VOUT (V)
1.2
VDD = 5.0V
IOUT = 100 µA
TA = 26°C
100
10
1
-2
0
2
FIGURE 2-15:
Fluid Bath).
DS21942C-page 6
4
6
8 10
Time (s)
12
14
16
18
Thermal Response (Air to
0.1
0.1
FIGURE 2-18:
Frequency.
1
1
10
100
1K
10
100
1000
Frequency (Hz)
10K
100K
10000 100000
Output Impedance vs.
© 2006 Microchip Technology Inc.
MCP9700/9700A and MCP9701/9701A
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
SC-70
Pin No.
TO-92
Symbol
1
—
NC
2
3
GND
Power Ground Pin
3
2
VOUT
Output Voltage Pin
4
1
VDD
Power Supply Input
5
—
NC
No Connect
3.1
Function
No Connect
Power Ground Pin (GND)
GND is the system ground pin.
3.2
Output Voltage Pin (VOUT)
The sensor output can be measured at VOUT. The
voltage range over the operating temperature range for
the MCP9700/9700A is 100 mV to 1.75V and for the
MCP9701/9701A, 200 mV to 3V .
3.3
Power Supply Input (VDD)
The operating voltage as specified in the “DC
Electrical Characteristics” table is applied to VDD.
© 2006 Microchip Technology Inc.
DS21942C-page 7
MCP9700/9700A and MCP9701/9701A
APPLICATIONS INFORMATION
The Linear Active Thermistor™ IC uses an internal
diode to measure temperature. The diode electrical
characteristics have a temperature coefficient that
provides a change in voltage based on the relative
ambient temperature from -40°C to 125°C. The change
in voltage is scaled to a temperature coefficient of
10.0 mV/°C (typ.) for the MCP9700/9700A and
19.5 mV/°C (typ.) for the MCP9701/9701A. The output
voltage at 0°C is also scaled to 500 mV (typ.) and
400 mV (typ.) for the MCP9700/9700A and
MCP9701/9701A, respectively. This linear scale is
described in the first-order transfer function shown in
Equation 4-1.
EQUATION 4-1:
For higher accuracy using a sensor compensation
technique, refer to AN1001 “IC Temperature Sensor
Accuracy
Compensation
with
a
PICmicro®
Microcontroller” (DS01001). The application note
shows that if the MCP9700 is compensated in addition
to room temperature calibration, the sensor accuracy
can be improved to ±0.5°C (typ.) accuracy over the
operating temperature (Figure 4-2).
6.0
100 Samples
4.0
Accuracy (°C)
4.0
SENSOR TRANSFER
FUNCTION
2.0
Spec. Limits
0.0
+ V
Average
- V
-2.0
V OUT = T C • T A + V 0°C
-4.0
-50
-25
Where:
TA = Ambient Temperature
FIGURE 4-2:
Sensor Accuracy.
V0°C = Sensor Output Voltage at 0°C
Improving Accuracy
The MCP9700/9700A and MCP9701/9701A accuracy
can be improved by performing a system calibration at
a specific temperature. For example, calibrating the
system at +25°C ambient improves the measurement
accuracy to a ±0.5°C (typ.) from 0°C to +70°C, as
shown in Figure 4-1. Therefore, when measuring
relative temperature change, this family measures
temperature with higher accuracy.
3.0
Accuracy (°C)
2.0
1.0
0.0
-1.0
-3.0
-25
FIGURE 4-1:
vs. Temperature.
0
25
50
TA (°C)
75
100
125
Relative Accuracy to +25°C
The change in accuracy from the calibration
temperature is due to the output non-linearity from the
first-order equation, as specified in Equation 4-2. The
accuracy can be further improved by compensating for
the output non-linearity.
DS21942C-page 8
4.2
75
100
125
MCP9700/9700A Calibrated
Shutdown Using Microcontroller
I/O Pin
The MCP9700/9700A and MCP9701/9701A family of
low operating current of 6 µA (typ.) makes it ideal for
battery-powered
applications.
However,
for
applications that require tighter current budget, this
device can be powered using a microcontroller
Input/Output (I/O) pin. The I/O pin can be toggled to
shut down the device. In such applications, the
microcontroller internal digital switching noise is
emitted to the MCP9700/9700A and MCP9701/9701A
as power supply noise. This switching noise compromises measurement accuracy. Therefore, a decoupling
capacitor and series resistor will be necessary to filter
out the system noise.
4.3
VDD= 3.3V
10 Samples
-50
50
The compensation technique provides a linear
temperature reading. A firmware look-up table can be
generated to compensate for the sensor error.
TC = Temperature Coefficient
-2.0
25
Temperature (°C)
VOUT = Sensor Output Voltage
4.1
0
Layout Considerations
The MCP9700/9700A and MCP9701/9701A family
does not require any additional components to operate.
However, it is recommended that a decoupling
capacitor of 0.1 µF to 1 µF be used between the VDD
and GND pins. In high-noise applications, connect the
power supply voltage to the VDD pin using a 200Ω
resistor with a 1 µF decoupling capacitor. A high
frequency ceramic capacitor is recommended. It is
necessary for the capacitor to be located as close as
possible to the VDD and GND pins in order to provide
effective noise protection. In addition, avoid tracing
digital lines in close proximity to the sensor.
© 2006 Microchip Technology Inc.
MCP9700/9700A and MCP9701/9701A
4.4
Thermal Considerations
The MCP9700/9700A and MCP9701/9701A family
measures temperature by monitoring the voltage of a
diode located in the die. A low-impedance thermal path
between the die and the PCB is provided by the pins.
Therefore, the sensor effectively monitors the
temperature of the PCB. However, the thermal path for
the ambient air is not as efficient because the plastic
device package functions as a thermal insulator from
the die. However, the plastic device package
insulates the die and restricts device thermal
response. This limitation applies to plastic-packaged
silicon temperature sensors. If the application requires
measuring ambient air, the PCB needs to be designed
with proper thermal conduction to the sensor pins.
The MCP9700/9700A and MCP9701/9701A is
designed to source/sink 100 µA (max.). The power
dissipation due to the output current is relatively
insignificant. The effect of the output current can be
described using Equation 4-2.
EQUATION 4-2:
EFFECT OF SELFHEATING
T J – T A = θ JA ( V DD I DD + ( V DD – V OUT ) I OUT )
Where:
TJ = Junction Temperature
TA = Ambient Temperature
θJA = Package Thermal Resistance
(331°C/W)
VOUT = Sensor Output Voltage
IOUT = Sensor Output Current
IDD = Operating Current
VDD = Operating Voltage
At TA = +25°C (VOUT = 0.75V) and maximum
specification of IDD = 12 µA, VDD = 5.5V and
IOUT = +100 µA, the self-heating due to power
dissipation (TJ – TA) is 0.179°C.
© 2006 Microchip Technology Inc.
DS21942C-page 9
MCP9700/9700A and MCP9701/9701A
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
5-Lead SC-70 (MCP9700/MCP9700A)
XXN (Front)
YWW (Back)
Device
Example:
Code
MCP9700/9700A
AUN
MCP9701/9701A
AVN
AU2 (Front)
622 (Back)
Note: Applies to 5-Lead SC-70.
5-Lead SC-70 (MCP9701/MCP9701A)
XXNN
Device
Example:
Code
MCP9700/9700A
AUNN
MCP9701/9701A
AVNN
AV25
Note: Applies to 5-Lead SC-70.
3-Lead TO-92 (MCP9700/MCP9701)
XXXXXX
XXXXXX
XXXXXX
YWWNNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS21942C-page 10
Example
MCP
9700E
e3
TO^^
622256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2006 Microchip Technology Inc.
MCP9700/9700A and MCP9701/9701A
5-Lead Plastic Small Outline Transistor (LT) (SC-70)
E
E1
D
p
B
n
1
Q1
A2
c
A1
L
Units
Dimension Limits
A
MILLIMETERS*
INCHES
MIN
NOM
MAX
MIN
NOM
MAX
Pitch
n
p
Overall Height
A
.031
.043
0.80
Molded Package Thickness
A2
.031
.039
0.80
1.00
Standoff
A1
.000
.004
0.00
0.10
Number of Pins
5
5
.026 (BSC)
0.65 (BSC)
1.10
Overall Width
E
.071
.094
1.80
2.40
Molded Package Width
E1
.045
.053
1.15
1.35
Overall Length
D
.071
.087
1.80
2.20
Foot Length
L
.004
.012
0.10
0.30
Q1
.004
.016
0.10
0.40
Lead Thickness
c
.004
.007
0.10
0.18
Lead Width
B
.006
.012
0.15
0.30
Top of Molded Pkg to
Lead Shoulder
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
JEITA (EIAJ) Standard: SC-70
Drawing No. C04-061
© 2006 Microchip Technology Inc.
Revised 07-19-05
DS21942C-page 11
MCP9700/9700A and MCP9701/9701A
3-Lead Plastic Transistor Outline (TO) (TO-92)
E1
D
n
1
L
1
2
3
α
B
p
c
A
R
Units
Dimension Limits
n
p
β
INCHES*
NOM
3
.050
.130
.143
.175
.186
.170
.183
.085
.090
.500
.555
.014
.017
.016
.019
4
5
2
3
MIN
MAX
MILLIMETERS
NOM
3
1.27
3.30
3.62
4.45
4.71
4.32
4.64
2.16
2.29
12.70
14.10
0.36
0.43
0.41
0.48
4
5
2
3
MIN
Number of Pins
Pitch
Bottom to Package Flat
A
.155
Overall Width
E1
.195
Overall Length
D
.195
Molded Package Radius
R
.095
Tip to Seating Plane
L
.610
c
Lead Thickness
.020
Lead Width
B
.022
α
6
Mold Draft Angle Top
β
Mold Draft Angle Bottom
4
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-92
Drawing No. C04-101
DS21942C-page 12
MAX
3.94
4.95
4.95
2.41
15.49
0.51
0.56
6
4
© 2006 Microchip Technology Inc.
MCP9700/9700A and MCP9701/9701A
APPENDIX A:
REVISION HISTORY
Revision C (June 2006)
• Added the MCP9700A and MCP9701A devices to
data sheet
• Added TO92 package for the MCP9700/MCP9701
Revision B (October 2005)
The following is the list of modifications:
• Added Section 3.0 “Pin Descriptions”
• Added the Linear Active Thermistor™ IC
trademark
• Removed the 2nd order temperature equation and
the temperature coeficient histogram
• Added a reference to AN1001 and corresponding
verbiage
• Added Figure 4-2 and corresponding verbiage
Revision A (November 2005)
• Original Release of this Document.
© 2006 Microchip Technology Inc.
DS21942C-page 13
MCP9700/9700A and MCP9701/9701A
NOTES:
DS21942C-page 14
© 2006 Microchip Technology Inc.
MCP9700/9700A and MCP9701/9701A
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
Device:
–
X
/XX
Temperature
Range
Package
MCP9700T:
Linear Active Thermistor™ IC,
Tape and Reel, Pb free
MCP9700AT: Linear Active Thermistor™ IC,
Tape and Reel, Pb free
MCP9701T:
Linear Active Thermistor™ IC,
Tape and Reel, Pb free
MCP9701AT: Linear Active Thermistor™ IC,
Tape and Reel, Pb free
Temperature Range: E
Package:
= -40°C to +125°C
LT =
TO =
Examples:
a)
MCP9700T-E/LT:
b)
MCP9700-E/TO:
c)
MCP9700AT-E/LT:
a)
MCP9701T-E/LT:
b)
MCP9701-E/TO:
c)
MCP9701AT-E/LT:
Linear Active Thermistor™
IC, Tape and Reel,
5LD SC-70 package.
Linear Active Thermistor™
IC, 3LD TO-92 package.
Linear Active Thermistor™
IC, Tape and Reel,
5LD SC-70 package.
Linear Active Thermistor™
IC, Tape and Reel,
5LD SC-70 package.
Linear Active Thermistor™
IC, 3LD TO-92 package.
Linear Active Thermistor™
IC, Tape and Reel,
5LD SC-70 package.
Plastic Small Outline Transistor, 5-lead
Plastic Plastic Transistor Outline, 3-lead
(MCP9700, MCP9701 only)
© 2006 Microchip Technology Inc.
DS21942C-page 15
MCP9700/9700A and MCP9701/9701A
NOTES:
DS21942C-page 16
© 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi,
MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM,
PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo,
PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select
Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,
WiperLock and ZENA are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2006, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
© 2006 Microchip Technology Inc.
DS21942C-page 17
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DS21942C-page 18
06/08/06
© 2006 Microchip Technology Inc.