Material Content Data Sheet Sales Product Name IPP100N04S2-04 MA# MA000275862 Package PG-TO220-3-1 Issued 29. August 2013 Weight* 2040.89 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7439-89-6 7440-50-8 12.294 0.60 0.816 0.04 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.60 6024 6024 400 0.245 0.01 815.335 39.95 40.00 399499 120 400020 7.860 0.39 0.39 3851 3851 8.771 0.43 4297 96.476 4.73 479.456 23.49 28.65 234925 286494 21.462 1.05 1.05 10516 10516 0.244 0.01 0.001 0.00 0.192 0.01 0.154 0.01 7.350 0.36 0.177 0.01 0.590 0.03 589.466 28.88 47272 120 0.01 1 75 0.38 3602 2. 3. 289 28.92 288828 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 3771 87 Important Remarks: 1. 120 94 289204 1000000