Freescale MCF5213CAF66 Mcf5213 coldfire microcontroller Datasheet

Document Number: MCF5213EC
Rev. 4, 6/2010
MCF5213
MCF5213 ColdFire
Microcontroller
LQFP–64
10 mm x 10 mm
QFN–64
9 mm x 9 mm
MAPBGA–81
10 mm x 10 mm
LQFP–100
14 mm x 14 mm
The MCF5213 microcontroller family is a member of the
ColdFire® family of reduced instruction set computing
(RISC) microprocessors.
This document provides an overview of the 32-bit MCF5213
microcontroller, focusing on its highly integrated and diverse
feature set.
This 32-bit device is based on the Version 2 ColdFire core
operating at a frequency up to 80 MHz, offering high
performance and low power consumption. On-chip memories
connected tightly to the processor core include up to
256 Kbytes of flash memory and 32 Kbytes of static random
access memory (SRAM). On-chip modules include:
• V2 ColdFire core delivering 76 MIPS (Dhrystone 2.1) at
80 MHz running from internal flash memory with Multiply
Accumulate (MAC) Unit and hardware divider
• FlexCAN controller area network (CAN) module
• Three universal asynchronous/synchronous
receiver/transmitters (UARTs)
• Inter-integrated circuit (I2C™) bus interface module
• Queued serial peripheral interface (QSPI) module
• Eight-channel 12-bit fast analog-to-digital converter
(ADC)
• Four-channel direct memory access (DMA) controller
• Four 32-bit input capture/output compare timers with
DMA support (DTIM)
• Four-channel general-purpose timer (GPT) capable of
input capture/output compare, pulse width modulation
(PWM), and pulse accumulation
• Eight-channel/Four-channel, 8-bit/16-bit pulse width
modulation timer
• Two 16-bit periodic interrupt timers (PITs)
• Programmable software watchdog timer
• Interrupt controller capable of handling 57 sources
• Clock module with 8 MHz on-chip relaxation oscillator
and integrated phase-locked loop (PLL)
• Test access/debug port (JTAG, BDM)
Freescale reserves the right to change the detail specifications as may be required to permit
improvements in the design of its products.
© Freescale Semiconductor, Inc., 2010. All rights reserved.
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Freescale Semiconductor
Data Sheet: Technical Data
1
2
Family Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.1 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
1.3 Reset Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
1.4 PLL and Clock Signals . . . . . . . . . . . . . . . . . . . . . . . . .20
1.5 Mode Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
1.6 External Interrupt Signals . . . . . . . . . . . . . . . . . . . . . . .21
1.7 Queued Serial Peripheral Interface (QSPI). . . . . . . . . .21
1.8 I2C I/O Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
1.9 UART Module Signals . . . . . . . . . . . . . . . . . . . . . . . . . .22
1.10 DMA Timer Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
1.11 ADC Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
1.12 General Purpose Timer Signals . . . . . . . . . . . . . . . . . .23
1.13 Pulse Width Modulator Signals . . . . . . . . . . . . . . . . . . .23
1.14 Debug Support Signals . . . . . . . . . . . . . . . . . . . . . . . . .23
1.15 EzPort Signal Descriptions . . . . . . . . . . . . . . . . . . . . . .24
1.16 Power and Ground Pins . . . . . . . . . . . . . . . . . . . . . . . .25
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
2.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
2.2 Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . .27
2.3 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .28
3
4
2.4 Flash Memory Characteristics . . . . . . . . . . . . . . . . . . .
2.5 EzPort Electrical Specifications . . . . . . . . . . . . . . . . . .
2.6 ESD Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.7 DC Electrical Specifications. . . . . . . . . . . . . . . . . . . . .
2.8 Clock Source Electrical Specifications . . . . . . . . . . . .
2.9 General Purpose I/O Timing . . . . . . . . . . . . . . . . . . . .
2.10 Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.11 I2C Input/Output Timing Specifications . . . . . . . . . . . .
2.12 Analog-to-Digital Converter (ADC) Parameters. . . . . .
2.13 Equivalent Circuit for ADC Inputs . . . . . . . . . . . . . . . .
2.14 DMA Timers Timing Specifications . . . . . . . . . . . . . . .
2.15 QSPI Electrical Specifications . . . . . . . . . . . . . . . . . . .
2.16 JTAG and Boundary Scan Timing . . . . . . . . . . . . . . . .
2.17 Debug AC Timing Specifications . . . . . . . . . . . . . . . . .
Mechanical Outline Drawings . . . . . . . . . . . . . . . . . . . . . . . .
3.1 64-pin LQFP Package . . . . . . . . . . . . . . . . . . . . . . . . .
3.2 64 QFN Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3 81 MAPBGA Package . . . . . . . . . . . . . . . . . . . . . . . . .
3.4 100-pin LQFP Package . . . . . . . . . . . . . . . . . . . . . . . .
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
30
31
31
32
33
33
34
35
36
37
38
38
39
41
42
43
46
50
52
54
MCF5213 ColdFire Microcontroller, Rev. 4
2
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Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Table of Contents
Family Configurations
Family Configurations
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
1
Table 1. MCF5213 Family Configurations
Module
5211
5212
5213
•
•
•
ColdFire Version 2 Core with MAC
(Multiply-Accumulate Unit)
System Clock
66, 80 MHz
Performance (Dhrystone 2.1 MIPS)
63
up to 76
Flash / Static RAM (SRAM)
128/16 Kbytes
256/32 Kbytes
Interrupt Controller (INTC)
•
•
•
Fast Analog-to-Digital Converter (ADC)
•
•
•
FlexCAN 2.0B Module
note1
—
•
Four-channel Direct-Memory Access (DMA)
•
•
•
Watchdog Timer Module (WDT)
•
•
•
Programmable Interval Timer Module (PIT)
2
2
2
Four-Channel General-Purpose Timer
3
3
3
32-bit DMA Timers
4
4
4
QSPI
•
•
•
UARTs
3
3
3
I2C
•
•
•
PWM
8
8
8
General Purpose I/O Module (GPIO)
•
•
•
Chip Configuration and Reset Controller Module
•
•
•
Background Debug Mode (BDM)
•
•
•
•
•
•
64 LQFP
64 QFN
81 MAPBGA
64 LQFP
81 MAPBGA
81 MAPBGA
100 LQFP
See
2
JTAG - IEEE 1149.1 Test Access Port
Package
1
2
FlexCAN is available on the MCF5211 only in the 64 QFN package.
The full debug/trace interface is available only on the 100-pin packages. A reduced debug interface is
bonded on smaller packages.
MCF5213 ColdFire Microcontroller, Rev. 4
Freescale Semiconductor
3
1.1
Block Diagram
Figure 1 shows a top-level block diagram of the device. Package options for this family are described later in this document.
EzPQ
EzPCK
EzPort
EzPCS
Interrupt
Controller
Arbiter
UART
0
4 CH DMA
To/From PADI
GPTn
QSPI_DIN,
QSPI_DOUT
QSPI_CLK,
QSPI_CSn
UART
1
DTIM
0
SWT
UART
2
DTIM
1
I2C
DTIM
2
QSPI
PADI – Pin Muxing
EzPD
UTXDn
URXDn
URTSn
UCTSn
DTINn/DTOUTn
CANRX
DTIM
3
CANTX
PWMn
MUX
JTAG_EN
V2 ColdFire CPU
IFP
JTAG
TAP
AN[7:0]
32 Kbytes
SRAM
(4K×16)×4
ADC
VRH
FlexCAN
OEP
VRL
MAC
256 Kbytes
Flash
(32K×16)×4
PMM
PORTS
(GPIO)
CIM
RSTI
RSTO
VSTBY
Edge
Port
PLL OCO
CLKGEN
EXTAL
XTAL
PIT0
PIT1
GPT
PWM
CLKOUT
CLKMOD0 CLKMOD1
To/From Interrupt Controller
Figure 1. Block Diagram
MCF5213 ColdFire Microcontroller, Rev. 4
4
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Family Configurations
1.2
1.2.1
Features
Feature Overview
The MCF5213 family includes the following features:
•
•
•
•
•
•
Version 2 ColdFire variable-length RISC processor core
— Static operation
— 32-bit address and data paths on-chip
— Up to 80 MHz processor core frequency
— Sixteen general-purpose, 32-bit data and address registers
— Implements ColdFire ISA_A with extensions to support the user stack pointer register and four new instructions
for improved bit processing (ISA_A+)
— Multiply-Accumulate (MAC) unit with 32-bit accumulator to support 16×16 → 32 or 32×32 → 32 operations
— Illegal instruction decode that allows for 68-Kbyte emulation support
System debug support
— Real-time trace for determining dynamic execution path
— Background debug mode (BDM) for in-circuit debugging (DEBUG_B+)
— Real-time debug support, with six hardware breakpoints (4 PC, 1 address and 1 data) configurable into a 1- or
2-level trigger
On-chip memories
— 32-Kbyte dual-ported SRAM on CPU internal bus, supporting core and DMA access with standby power supply
support
— 256 Kbytes of interleaved flash memory supporting 2-1-1-1 accesses
Power management
— Fully static operation with processor sleep and whole chip stop modes
— Rapid response to interrupts from the low-power sleep mode (wake-up feature)
— Clock enable/disable for each peripheral when not used
FlexCAN 2.0B module
— Based on and includes all existing features of the Freescale TouCAN module
— Full implementation of the CAN protocol specification version 2.0B
– Standard data and remote frames (up to 109 bits long)
– Extended data and remote frames (up to 127 bits long)
– Zero to eight bytes data length
– Programmable bit rate up to 1 Mbit/sec
— Flexible message buffers (MBs), totalling up to 16 message buffers of 0–8 byte data length each, configurable as
Rx or Tx, all supporting standard and extended messages
— Unused MB space can be used as general purpose RAM space
— Listen-only mode capability
— Content-related addressing
— No read/write semaphores
— Three programmable mask registers: global for MBs 0–13, special for MB14, and special for MB15
— Programmable transmit-first scheme: lowest ID or lowest buffer number
— Time stamp based on 16-bit free-running timer
— Global network time, synchronized by a specific message
— Maskable interrupts
Three universal asynchronous/synchronous receiver transmitters (UARTs)
MCF5213 ColdFire Microcontroller, Rev. 4
Freescale Semiconductor
5
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Family Configurations
•
•
•
•
•
•
— 16-bit divider for clock generation
— Interrupt control logic with maskable interrupts
— DMA support
— Data formats can be 5, 6, 7 or 8 bits with even, odd, or no parity
— Up to two stop bits in 1/16 increments
— Error-detection capabilities
— Modem support includes request-to-send (RTS) and clear-to-send (CTS) lines for two UARTs
— Transmit and receive FIFO buffers
I2C module
— Interchip bus interface for EEPROMs, LCD controllers, A/D converters, and keypads
— Fully compatible with industry-standard I2C bus
— Master and slave modes support multiple masters
— Automatic interrupt generation with programmable level
Queued serial peripheral interface (QSPI)
— Full-duplex, three-wire synchronous transfers
— Up to four chip selects available
— Master mode operation only
— Programmable bit rates up to half the CPU clock frequency
— Up to 16 pre-programmed transfers
Fast analog-to-digital converter (ADC)
— Eight analog input channels
— 12-bit resolution
— Minimum 1.125 μs conversion time
— Simultaneous sampling of two channels for motor control applications
— Single-scan or continuous operation
— Optional interrupts on conversion complete, zero crossing (sign change), or under/over low/high limit
— Unused analog channels can be used as digital I/O
Four 32-bit timers with DMA support
— 12.5 ns resolution at 80 MHz
— Programmable sources for clock input, including an external clock option
— Programmable prescaler
— Input capture capability with programmable trigger edge on input pin
— Output compare with programmable mode for the output pin
— Free run and restart modes
— Maskable interrupts on input capture or output compare
— DMA trigger capability on input capture or output compare
Four-channel general purpose timer
— 16-bit architecture
— Programmable prescaler
— Output pulse-widths variable from microseconds to seconds
— Single 16-bit input pulse accumulator
— Toggle-on-overflow feature for pulse-width modulator (PWM) generation
— One dual-mode pulse accumulation channel
Pulse-width modulation timer
— Operates as eight channels with 8-bit resolution or four channels with 16-bit resolution
MCF5213 ColdFire Microcontroller, Rev. 4
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Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Family Configurations
Family Configurations
•
•
•
•
•
•
Programmable period and duty cycle
Programmable enable/disable for each channel
Software selectable polarity for each channel
Period and duty cycle are double buffered. Change takes effect when the end of the current period is reached
(PWM counter reaches zero) or when the channel is disabled.
— Programmable center or left aligned outputs on individual channels
— Four clock sources (A, B, SA, and SB) provide for a wide range of frequencies
— Emergency shutdown
Two periodic interrupt timers (PITs)
— 16-bit counter
— Selectable as free running or count down
Software watchdog timer
— 32-bit counter
— Low-power mode support
Clock generation features
— One to 10 MHz crystal, 8 MHz on-chip trimmed relaxation oscillator, or external oscillator reference options
— Two to 10 MHz reference frequency for normal PLL mode
— System can be clocked from PLL or directly from crystal oscillator or relaxation oscillator
— Low power modes supported
— 2n (n ≤ 0 ≤ 15) low-power divider for extremely low frequency operation
Interrupt controller
— Uniquely programmable vectors for all interrupt sources
— Fully programmable level and priority for all peripheral interrupt sources
— Seven external interrupt signals with fixed level and priority
— Unique vector number for each interrupt source
— Ability to mask any individual interrupt source or all interrupt sources (global mask-all)
— Support for hardware and software interrupt acknowledge (IACK) cycles
— Combinatorial path to provide wake-up from low-power modes
DMA controller
— Four fully programmable channels
— Dual-address transfer support with 8-, 16-, and 32-bit data capability, along with support for 16-byte (4×32-bit)
burst transfers
— Source/destination address pointers that can increment or remain constant
— 24-bit byte transfer counter per channel
— Auto-alignment transfers supported for efficient block movement
— Bursting and cycle-steal support
— Software-programmable DMA requests for the UARTs (3) and 32-bit timers (4)
Reset
— Separate reset in and reset out signals
— Seven sources of reset:
– Power-on reset (POR)
– External
– Software
– Watchdog
– Loss of clock
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
—
—
—
—
MCF5213 ColdFire Microcontroller, Rev. 4
Freescale Semiconductor
7
•
•
•
1.2.2
– Loss of lock
– Low-voltage detection (LVD)
— Status flag indication of source of last reset
Chip configuration module (CCM)
— System configuration during reset
— Selects one of six clock modes
— Configures output pad drive strength
— Unique part identification number and part revision number
General purpose I/O interface
— Up to 56 bits of general purpose I/O
— Bit manipulation supported via set/clear functions
— Programmable drive strengths
— Unused peripheral pins may be used as extra GPIO
JTAG support for system level board testing
V2 Core Overview
The version 2 ColdFire processor core is comprised of two separate pipelines decoupled by an instruction buffer. The two-stage
instruction fetch pipeline (IFP) is responsible for instruction-address generation and instruction fetch. The instruction buffer is
a first-in-first-out (FIFO) buffer that holds prefetched instructions awaiting execution in the operand execution pipeline (OEP).
The OEP includes two pipeline stages. The first stage decodes instructions and selects operands (DSOC); the second stage
(AGEX) performs instruction execution and calculates operand effective addresses, if needed.
The V2 core implements the ColdFire instruction set architecture revision A+ with support for a separate user stack pointer
register and four new instructions to assist in bit processing. Additionally, the core includes the multiply-accumulate (MAC)
unit for improved signal processing capabilities. The MAC implements a three-stage arithmetic pipeline, optimized for 16x16
bit operations, with support for one 32-bit accumulator. Supported operands include 16- and 32-bit signed and unsigned
integers, signed fractional operands, and a complete set of instructions to process these data types. The MAC provides support
for execution of DSP operations within the context of a single processor at a minimal hardware cost.
1.2.3
Integrated Debug Module
The ColdFire processor core debug interface is provided to support system debugging with low-cost debug and emulator
development tools. Through a standard debug interface, access to debug information and real-time tracing capability is provided
on 100-lead packages. This allows the processor and system to be debugged at full speed without the need for costly in-circuit
emulators.
The on-chip breakpoint resources include a total of nine programmable 32-bit registers: an address and an address mask register,
a data and a data mask register, four PC registers, and one PC mask register. These registers can be accessed through the
dedicated debug serial communication channel or from the processor’s supervisor mode programming model. The breakpoint
registers can be configured to generate triggers by combining the address, data, and PC conditions in a variety of single- or
dual-level definitions. The trigger event can be programmed to generate a processor halt or initiate a debug interrupt exception.
This device implements revision B+ of the ColdFire Debug Architecture.
The processor’s interrupt servicing options during emulator mode allow real-time critical interrupt service routines to be
serviced while processing a debug interrupt event. This ensures the system continues to operate even during debugging.
To support program trace, the V2 debug module provides processor status (PST[3:0]) and debug data (DDATA[3:0]) ports.
These buses and the PSTCLK output provide execution status, captured operand data, and branch target addresses defining
processor activity at the CPU’s clock rate. The device includes a new debug signal, ALLPST. This signal is the logical AND of
the processor status (PST[3:0]) signals and is useful for detecting when the processor is in a halted state (PST[3:0] = 1111).
MCF5213 ColdFire Microcontroller, Rev. 4
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Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Family Configurations
The full debug/trace interface is available only on the 100-pin packages. However, every product features the dedicated debug
serial communication channel (DSI, DSO, DSCLK) and the ALLPST signal.
1.2.4
JTAG
The processor supports circuit board test strategies based on the Test Technology Committee of IEEE and the Joint Test Action
Group (JTAG). The test logic includes a test access port (TAP) consisting of a 16-state controller, an instruction register, and
three test registers (a 1-bit bypass register, a 256-bit boundary-scan register, and a 32-bit ID register). The boundary scan register
links the device’s pins into one shift register. Test logic, implemented using static logic design, is independent of the device
system logic.
The device implementation can:
•
•
•
•
•
Perform boundary-scan operations to test circuit board electrical continuity
Sample system pins during operation and transparently shift out the result in the boundary scan register
Bypass the device for a given circuit board test by effectively reducing the boundary-scan register to a single bit
Disable the output drive to pins during circuit-board testing
Drive output pins to stable levels
1.2.5
1.2.5.1
On-Chip Memories
SRAM
The dual-ported SRAM module provides a general-purpose 32-Kbyte memory block that the ColdFire core can access in a
single cycle. The location of the memory block can be set to any 32-Kbyte boundary within the 4-Gbyte address space. This
memory is ideal for storing critical code or data structures and for use as the system stack. Because the SRAM module is
physically connected to the processor's high-speed local bus, it can quickly service core-initiated accesses or
memory-referencing commands from the debug module.
The SRAM module is also accessible by the DMA. The dual-ported nature of the SRAM makes it ideal for implementing
applications with double-buffer schemes, where the processor and a DMA device operate in alternate regions of the SRAM to
maximize system performance.
1.2.5.2
Flash Memory
The ColdFire flash module (CFM) is a non-volatile memory (NVM) module that connects to the processor’s high-speed local
bus. The CFM is constructed with four banks of 32-Kbyte×16-bit flash memory arrays to generate 256 Kbytes of 32-bit flash
memory. These electrically erasable and programmable arrays serve as non-volatile program and data memory. The flash
memory is ideal for program and data storage for single-chip applications, allowing for field reprogramming without requiring
an external high voltage source. The CFM interfaces to the ColdFire core through an optimized read-only memory controller
that supports interleaved accesses from the 2-cycle flash memory arrays. A backdoor mapping of the flash memory is used for
all program, erase, and verify operations, as well as providing a read datapath for the DMA. Flash memory may also be
programmed via the EzPort, which is a serial flash memory programming interface that allows the flash memory to be read,
erased and programmed by an external controller in a format compatible with most SPI bus flash memory chips.
1.2.6
Power Management
The device incorporates several low-power modes of operation entered under program control and exited by several external
trigger events. An integrated power-on reset (POR) circuit monitors the input supply and forces an MCU reset as the supply
voltage rises. The low voltage detector (LVD) monitors the supply voltage and is configurable to force a reset or interrupt
condition if it falls below the LVD trip point. The RAM standby switch provides power to RAM when the supply voltage to the
chip falls below the standby battery voltage.
MCF5213 ColdFire Microcontroller, Rev. 4
Freescale Semiconductor
9
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Family Configurations
1.2.7
FlexCAN
The FlexCAN module is a communication controller implementing version 2.0 of the CAN protocol parts A and B. The CAN
protocol can be used as an industrial control serial data bus, meeting the specific requirements of reliable operation in a harsh
EMI environment with high bandwidth. This instantiation of FlexCAN has 16 message buffers.
1.2.8
UARTs
The device has three full-duplex UARTs that function independently. The three UARTs can be clocked by the system bus clock,
eliminating the need for an external clock source. On smaller packages, the third UART is multiplexed with other digital I/O
functions.
1.2.9
I2C Bus
The I2C bus is an industry-standard, two-wire, bidirectional serial bus that provides a simple, efficient method of data exchange
and minimizes the interconnection between devices. This bus is suitable for applications requiring occasional communications
over a short distance between many devices.
1.2.10
QSPI
The queued serial peripheral interface (QSPI) provides a synchronous serial peripheral interface with queued transfer capability.
It allows up to 16 transfers to be queued at once, minimizing the need for CPU intervention between transfers.
1.2.11
Fast ADC
The fast ADC consists of an eight-channel input select multiplexer and two independent sample and hold (S/H) circuits feeding
separate 12-bit ADCs. The two separate converters store their results in accessible buffers for further processing.
The ADC can be configured to perform a single scan and halt, a scan when triggered, or a programmed scan sequence repeatedly
until manually stopped.
The ADC can be configured for sequential or simultaneous conversion. When configured for sequential conversions, up to eight
channels can be sampled and stored in any order specified by the channel list register. Both ADCs may be required during a
scan, depending on the inputs to be sampled.
During a simultaneous conversion, both S/H circuits are used to capture two different channels at the same time. This
configuration requires that a single channel may not be sampled by both S/H circuits simultaneously.
Optional interrupts can be generated at the end of the scan sequence if a channel is out of range (measures below the low
threshold limit or above the high threshold limit set in the limit registers) or at several different zero crossing conditions.
1.2.12
DMA Timers (DTIM0–DTIM3)
There are four independent, DMA transfer capable 32-bit timers (DTIM0, DTIM1, DTIM2, and DTIM3) on the device. Each
module incorporates a 32-bit timer with a separate register set for configuration and control. The timers can be configured to
operate from the system clock or from an external clock source using one of the DTINn signals. If the system clock is selected,
it can be divided by 16 or 1. The input clock is further divided by a user-programmable 8-bit prescaler that clocks the actual
timer counter register (TCRn). Each of these timers can be configured for input capture or reference (output) compare mode.
Timer events may optionally cause interrupt requests or DMA transfers.
MCF5213 ColdFire Microcontroller, Rev. 4
10
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Family Configurations
1.2.13
General Purpose Timer (GPT)
The general purpose timer (GPT) is a four-channel timer module consisting of a 16-bit programmable counter driven by a
seven-stage programmable prescaler. Each of the four channels can be configured for input capture or output compare.
Additionally, channel three, can be configured as a pulse accumulator.
A timer overflow function allows software to extend the timing capability of the system beyond the 16-bit range of the counter.
The input capture and output compare functions allow simultaneous input waveform measurements and output waveform
generation. The input capture function can capture the time of a selected transition edge. The output compare function can
generate output waveforms and timer software delays. The 16-bit pulse accumulator can operate as a simple event counter or a
gated time accumulator.
1.2.14
Periodic Interrupt Timers (PIT0 and PIT1)
The two periodic interrupt timers (PIT0 and PIT1) are 16-bit timers that provide interrupts at regular intervals with minimal
processor intervention. Each timer can count down from the value written in its PIT modulus register or it can be a free-running
down-counter.
1.2.15
Pulse-Width Modulation (PWM) Timers
The device has an 8-channel, 8-bit PWM timer. Each channel has a programmable period and duty cycle as well as a dedicated
counter. Each of the modulators can create independent continuous waveforms with software-selectable duty rates from 0% to
100%. The PWM outputs have programmable polarity, and can be programmed as left aligned outputs or center aligned outputs.
For higher period and duty cycle resolution, each pair of adjacent channels ([7:6], [5:4], [3:2], and [1:0]) can be concatenated
to form a single 16-bit channel. The module can, therefore, be configured to support 8/0, 6/1, 4/2, 2/3, or 0/4 8-/16-bit channels.
1.2.16
Software Watchdog Timer
The watchdog timer is a 32-bit timer that facilitates recovery from runaway code. The watchdog counter is a free-running
down-counter that generates a reset on underflow. To prevent a reset, software must periodically restart the countdown.
1.2.17
Phase-Locked Loop (PLL)
The clock module contains a crystal oscillator, 8 MHz on-chip relaxation oscillator (OCO), phase-locked loop (PLL), reduced
frequency divider (RFD), low-power divider status/control registers, and control logic. To improve noise immunity, the PLL,
crystal oscillator, and relaxation oscillator have their own power supply inputs: VDDPLL and VSSPLL. All other circuits are
powered by the normal supply pins, VDD and VSS.
1.2.18
Interrupt Controller (INTC)
The device has a single interrupt controller that supports up to 63 interrupt sources. There are 56 programmable sources, 49 of
which are assigned to unique peripheral interrupt requests. The remaining seven sources are unassigned and may be used for
software interrupt requests.
1.2.19
DMA Controller
The direct memory access (DMA) controller provides an efficient way to move blocks of data with minimal processor
intervention. It has four channels that allow byte, word, longword, or 16-byte burst line transfers. These transfers are triggered
by software explicitly setting a DCRn[START] bit or by the occurrence of certain UART or DMA timer events.
MCF5213 ColdFire Microcontroller, Rev. 4
Freescale Semiconductor
11
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Family Configurations
1.2.20
Reset
The reset controller determines the source of reset, asserts the appropriate reset signals to the system, and keeps track of what
caused the last reset. There are seven sources of reset:
•
•
•
•
•
•
•
External reset input
Power-on reset (POR)
Watchdog timer
Phase locked-loop (PLL) loss of lock
PLL loss of clock
Software
Low-voltage detector (LVD)
Control of the LVD and its associated reset and interrupt are managed by the reset controller. Other registers provide status flags
indicating the last source of reset and a control bit for software assertion of the RSTO pin.
1.2.21
GPIO
Nearly all pins on the device have general purpose I/O capability and are grouped into 8-bit ports. Some ports do not use all
eight bits. Each port has registers that configure, monitor, and control the port pin.
1.2.22
Part Numbers and Packaging
This product is RoHS-compliant. Refer to the product page at freescale.com or contact your sales office for up-to-date RoHS
information.
Table 3. Orderable Part Number Summary
Freescale Part
Number
Description
MCF5211CAE66
MCF5211 Microcontroller
66
MCF5211CEP66
MCF5211 Microcontroller, FlexCAN
MCF5211LCEP66
Speed Flash/SRAM
(MHz)
(Kbytes)
Package
Temp range
(°C)
128 / 16
64 LQFP
-40 to +85
66
128 / 16
64 QFN
-40 to +85
MCF5211 Microcontroller
66
128 / 16
64 QFN
-40 to +85
MCF5211LCVM66
MCF5211 Microcontroller
66
128 / 16
81 MAPBGA
-40 to +85
MCF5211LCVM80
MCF5211 Microcontroller
80
128 / 16
81 MAPBGA
-40 to +85
MCF5212CAE66
MCF5212 Microcontroller
66
256 / 32
64 LQFP
-40 to +85
MCF5212LCVM66
MCF5212 Microcontroller
66
256 / 32
81 MAPBGA
-40 to +85
MCF5212LCVM80
MCF5212 Microcontroller
80
256 / 32
81 MAPBGA
-40 to +85
MCF5213CAF66
MCF5213 Microcontroller, FlexCAN
66
256 / 32
100 LQFP
-40 to +85
MCF5213CAF80
MCF5213 Microcontroller, FlexCAN
80
256 / 32
100 LQFP
-40 to +85
MCF5213LCVM66
MCF5213 Microcontroller, FlexCAN
66
256 / 32
81 MAPBGA
-40 to +85
MCF5213LCVM80
MCF5213 Microcontroller, FlexCAN
80
256 / 32
81 MAPBGA
-40 to +85
MCF5213 ColdFire Microcontroller, Rev. 4
12
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Family Configurations
VDD
VDD
VSS
URTS1
TEST
UCTS0
URXD0
UTXD0
URTS0
SCL
SDA
QSPI_CS3
QSPI_CS2
VDD
VSS
QSPI_DIN
QSPI_DOUT
QSPI_CLK
QSPI_CS1
QSPI_CS0
RCON
VDD
VDD
VSS
VSS
Freescale Semiconductor
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
URXD1
UTXD1
UCTS1
RSTO
RSTI
IRQ7
IRQ6
VDD
VSS
IRQ5
IRQ4
IRQ3
IRQ2
IRQ1
ALLPST
DSCLK
DDATA3
DDATA2
VSS
VDD
DSO
DSI
DDATA1
DDATA0
BKPT
Figure 2 shows the pinout configuration for the 100 LQFP.
100 LQFP
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
VSS
VDDPLL
EXTAL
XTAL
VSSPLL
PST3
PST2
VDD
VSS
PST1
PST0
PSTCLK
PWM7
GPT3
GPT2
PWM5
GPT1
GPT0
VDD
VSS
VSTBY
AN4
AN5
AN6
AN7
Figure 2. 100 LQFP Pin Assignments
Figure 3 shows the pinout configuration for the 81 MAPBGA.
MCF5213 ColdFire Microcontroller, Rev. 4
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
JTAG_EN
UCTS2
URXD2
UTXD2
URTS2
DTIN2
DTIN3
PWM3
VDD
VSS
DTIN0
DTIN1
PWM1
CLKMOD1
CLKMOD0
VDD
VSS
AN0
AN1
AN2
AN3
VSSA
VRL
VRH
VDDA
Family Configurations
13
1
2
3
4
5
6
7
8
9
A
VSS
UTXD1
RSTI
IRQ5
IRQ3
ALLPST
TDO
TMS
VSS
B
URTS1
URXD1
RSTO
IRQ6
IRQ2
TRST
TDI
VDDPLL
EXTAL
C
UCTS0
TEST
UCTS1
IRQ7
IRQ4
IRQ1
TCLK
VSSPLL
XTAL
D
URXD0
UTXD0
URTS0
VSS
VDD
VSS
PWM7
GPT3
GPT2
E
SCL
SDA
VDD
VDD
VDD
VDD
VDD
PWM5
GPT1
F
QSPI_CS3
QSPI_CS2
QSPI_DIN
VSS
VDD
VSS
GPT0
VSTBY
AN4
G
QSPI_DOUT
QSPI_CLK
RCON
DTIN1
CLKMOD0
AN2
AN3
AN5
AN6
H
QSPI_CS0
QSPI_CS1
DTIN3
DTIN0
CLKMOD1
AN1
VSSA
VDDA
AN7
J
VSS
JTAG_EN
DTIN2
PWM3
PWM1
AN0
VRL
VRH
VSSA
Figure 3. 81 MAPBGA Pin Assignments
MCF5213 ColdFire Microcontroller, Rev. 4
14
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Family Configurations
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
VSS
URXD1
UTXD1
UCTS1
RSTO
RSTI
IRQ7
IRQ4
IRQ1
ALLPST
DSCLK
VSS
VDD
DSO
DSI
BKPT
Figure 4 shows the pinout configuration for the 64 LQFP and 64 QFN.
VDD
URTS1
TEST
UCTS0
URXD0
UTXD0
URTS0
SCL
SDA
VDD
VSS
QSPI_DIN
QSPI_DOUT
QSPI_CLK
QSPI_CS0
RCON
Freescale Semiconductor
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
64-Pin Packages
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
VDDPLL
EXTAL
XTAL
VSSPLL
PSTCLK
GPT3
GPT2
GPT1
GPT0
VDD
VSS
VSTBY
AN4
AN5
AN6
AN7
Figure 4. 64 LQFP and 64 QFN Pin Assignments
MCF5213 ColdFire Microcontroller, Rev. 4
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
JTAG_EN
DTIN2
DTIN3
VDD
VSS
DTIN0
DTIN1
CLKMOD0
AN0
AN1
AN2
AN3
VSSA
VRL
VRH
VDDA
Family Configurations
15
Table 4. Pin Functions by Primary and Alternate Purpose
Drive
Slew Rate / Pull-up /
Strength /
Control1 Pull-down2
1
Control
MCF5213 ColdFire Microcontroller, Rev. 4
Pin
Group
Primary
Function
Secondary
Function
Tertiary
Function
Quaternary
Function
ADC
AN7
—
—
GPIO
Low
FAST
AN6
—
—
GPIO
Low
AN5
—
—
GPIO
AN4
—
—
AN3
—
AN2
Pin on 81
MAPBGA
Pin on 64
LQFP/QFN
—
51
H9
33
FAST
—
52
G9
34
Low
FAST
—
53
G8
35
GPIO
Low
FAST
—
54
F9
36
—
GPIO
Low
FAST
—
46
G7
28
—
—
GPIO
Low
FAST
—
45
G6
27
AN1
—
—
GPIO
Low
FAST
—
44
H6
26
AN0
—
—
GPIO
Low
FAST
—
43
J6
25
SYNCA3
—
—
—
N/A
N/A
—
—
—
—
3
—
—
—
N/A
N/A
—
—
—
—
VDDA
—
—
—
N/A
N/A
—
50
H8
32
VSSA
—
—
—
N/A
N/A
—
47
H7, J9
29
VRH
—
—
—
N/A
N/A
—
49
J8
31
VRL
—
—
—
N/A
N/A
—
48
J7
30
EXTAL
—
—
—
N/A
N/A
—
73
B9
47
XTAL
—
—
—
N/A
N/A
—
72
C9
46
VDDPLL
—
—
—
N/A
N/A
—
74
B8
48
VSSPLL
—
—
—
N/A
N/A
—
71
C8
45
ALLPST
—
—
—
High
FAST
—
86
A6
55
DDATA[3:0]
—
—
GPIO
High
FAST
—
84,83,78,77
—
—
PST[3:0]
—
—
GPIO
High
FAST
—
70,69,66,65
—
—
SCL
CANTX4
PSRR[0]
pull-up5
10
E1
8
SDA
3
PSRR[0]
5
11
E2
9
SYNCB
Clock
Generation
Debug Data
Freescale Semiconductor
Pin on
100 LQFP
2C
I
CANRX
UTXD2
URXD2
GPIO
GPIO
PDSR[0]
PDSR[0]
pull-up
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Family Configurations
16
Table 4 shows the pin functions by primary and alternate purpose, and illustrates which packages contain each pin.
Freescale Semiconductor
Table 4. Pin Functions by Primary and Alternate Purpose (continued)
Drive
Slew Rate / Pull-up /
Strength /
Control1 Pull-down2
Control1
Pin
Group
Primary
Function
Secondary
Function
Tertiary
Function
Quaternary
Function
Interrupts
IRQ7
—
—
GPIO
Low
FAST
IRQ6
—
—
GPIO
Low
IRQ5
—
—
GPIO
IRQ4
—
—
IRQ3
—
IRQ2
—
MCF5213 ColdFire Microcontroller, Rev. 4
JTAG/BDM
Mode
Selection7
PWM
Pin on
100 LQFP
Pin on 81
MAPBGA
Pin on 64
LQFP/QFN
pull-up
95
C4
58
FAST
pull-up
94
B4
—
Low
FAST
pull-up
91
A4
—
GPIO
Low
FAST
pull-up
90
C5
57
—
GPIO
Low
FAST
pull-up
89
A5
—
—
GPIO
Low
FAST
pull-up
88
B5
—
87
C6
56
IRQ1
SYNCA
PWM1
GPIO
High
FAST
pull-up5
JTAG_EN
—
—
—
N/A
N/A
pull-down
26
J2
17
64
C7
44
TCLK/
PSTCLK
CLKOUT
—
—
High
FAST
pull-up6
TDI/DSI
—
—
—
N/A
N/A
pull-up6
79
B7
50
TDO/DSO
—
—
—
High
FAST
—
80
A7
51
76
A8
49
TMS
/BKPT
—
—
—
N/A
N/A
pull-up6
TRST
/DSCLK
—
—
—
N/A
N/A
pull-up6
85
B6
54
CLKMOD0
—
—
—
N/A
N/A
pull-down7
40
G5
24
39
H5
—
—
—
—
N/A
N/A
RCON/
EZPCS
—
—
—
N/A
N/A
pull-up
21
G3
16
PWM7
—
—
GPIO
PDSR[31]
PSRR[31]
—
63
D7
—
PWM5
—
—
GPIO
PDSR[30]
PSRR[30]
—
60
E8
—
PWM3
—
—
GPIO
PDSR[29]
PSRR[29]
—
33
J4
—
PWM1
—
—
GPIO
PDSR[28]
PSRR[28]
—
38
J5
—
17
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Family Configurations
CLKMOD1
pull-down7
Drive
Slew Rate / Pull-up /
Strength /
Control1 Pull-down2
Control1
MCF5213 ColdFire Microcontroller, Rev. 4
Pin
Group
Primary
Function
Secondary
Function
Tertiary
Function
Quaternary
Function
QSPI
QSPI_DIN/
EZPD
CANRX4
URXD1
GPIO
PDSR[2]
PSRR[2]
QSPI_DOUT/
EZPQ
CANTX4
UTXD1
GPIO
PDSR[1]
QSPI_CLK/
EZPCK
SCL
URTS1
GPIO
QSPI_CS3
SYNCA
SYNCB
QSPI_CS2
—
QSPI_CS1
—
QSPI_CS0
9
Reset
Test
Timers, 16-bit
Timers, 32-bit
Freescale Semiconductor
UART 0
SDA
Pin on
100 LQFP
Pin on 81
MAPBGA
Pin on 64
LQFP/QFN
—
16
F3
12
PSRR[1]
—
17
G1
13
PDSR[3]
PSRR[3]
pull-up8
18
G2
14
GPIO
PDSR[7]
PSRR[7]
—
12
F1
—
—
GPIO
PDSR[6]
PSRR[6]
—
13
F2
—
—
GPIO
PDSR[5]
PSRR[5]
—
19
H2
—
PSRR[4]
pull-up8
20
H1
15
96
A3
59
97
B3
60
UCTS1
GPIO
PDSR[4]
RSTI
—
—
—
N/A
N/A
pull-up9
RSTO
—
—
—
high
FAST
—
TEST
—
—
—
N/A
N/A
pull-down
GPT3
—
PWM7
GPIO
PDSR[23]
5
C2
3
PSRR[23]
pull-up
10
62
D8
43
61
D9
42
GPT2
—
PWM5
GPIO
PDSR[22]
PSRR[22]
pull-up10
GPT1
—
PWM3
GPIO
PDSR[21]
PSRR[21]
pull-up10
59
E9
41
10
58
F7
40
GPT0
—
PWM1
GPIO
PDSR[20]
PSRR[20]
pull-up
DTIN3
DTOUT3
PWM6
GPIO
PDSR[19]
PSRR[19]
—
32
H3
19
DTIN2
DTOUT2
PWM4
GPIO
PDSR[18]
PSRR[18]
—
31
J3
18
DTIN1
DTOUT1
PWM2
GPIO
PDSR[17]
PSRR[17]
—
37
G4
23
DTIN0
DTOUT0
PWM0
GPIO
PDSR[16]
PSRR[16]
—
36
H4
22
UCTS0
CANRX
—
GPIO
PDSR[11]
PSRR[11]
—
6
C1
4
URTS0
CANTX
—
GPIO
PDSR[10]
PSRR[10]
—
9
D3
7
URXD0
—
—
GPIO
PDSR[9]
PSRR[9]
—
7
D1
5
UTXD0
—
—
GPIO
PDSR[8]
PSRR[8]
—
8
D2
6
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Family Configurations
18
Table 4. Pin Functions by Primary and Alternate Purpose (continued)
Freescale Semiconductor
Table 4. Pin Functions by Primary and Alternate Purpose (continued)
Drive
Slew Rate / Pull-up /
Strength /
Control1 Pull-down2
Control1
Pin
Group
Primary
Function
Secondary
Function
Tertiary
Function
Quaternary
Function
UART 1
UCTS1
SYNCA
URXD2
GPIO
PDSR[15]
PSRR[15]
URTS1
SYNCB
UTXD2
GPIO
PDSR[14]
URXD1
—
—
GPIO
UTXD1
—
—
UCTS2
—
URTS2
UART 2
MCF5213 ColdFire Microcontroller, Rev. 4
FlexCAN
Pin on
100 LQFP
Pin on 81
MAPBGA
Pin on 64
LQFP/QFN
—
98
C3
61
PSRR[14]
—
4
B1
2
PDSR[13]
PSRR[13]
—
100
B2
63
GPIO
PDSR[12]
PSRR[12]
—
99
A2
62
—
GPIO
PDSR[27]
PSRR[27]
—
27
—
—
—
—
GPIO
PDSR[26]
PSRR[26]
—
30
—
—
URXD2
—
—
GPIO
PDSR[25]
PSRR[25]
—
28
—
—
UTXD2
—
—
GPIO
PDSR[24]
PSRR[24]
—
29
—
—
4,11
N/A
N/A
—
—
—
—
CANTX4,11
N/A
N/A
—
—
—
—
F8
37
CANRX
VSTBY
VSTBY
—
—
—
N/A
N/A
—
55
VDD
VDD
—
—
—
N/A
N/A
—
1,2,14,22,
23,34,41,
57,68,81,93
VSS
VSS
—
—
—
N/A
N/A
—
3,15,24,25,3 A1,A9,D4,D
5,42,56,
6,F4,F6,J1
67,75,82,92
D5,E3–E7, 1,10,20,39,5
F5
2
11,21,38,
53,64
1
19
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Family Configurations
The PDSR and PSSR registers are described in the General Purpose I/O chapter. All programmable signals default to 2 mA drive and FAST slew rate in
normal (single-chip) mode.
2 All signals have a pull-up in GPIO mode.
3 These signals are multiplexed on other pins.
4 CAN signals are available just on the MCF5211 QFN.
5 For primary and GPIO functions only.
6 Only when JTAG mode is enabled.
7 CLKMOD0 and CLKMOD1 have internal pull-down resistors; however, the use of external resistors is very strongly recommended.
8 For secondary and GPIO functions only.
9 RSTI has an internal pull-up resistor; however, the use of an external resistor is very strongly recommended.
10 For GPIO function. Primary Function has pull-up control within the GPT module.
11 CANTX and CANRX are secondary functions only.
1.3
Reset Signals
Table 5 describes signals used to reset the chip or as a reset indication.
Table 5. Reset Signals
1.4
Signal Name
Abbreviation
Function
I/O
Reset In
RSTI
Primary reset input to the device. Asserting RSTI for at least 8 CPU
clock cycles immediately resets the CPU and peripherals.
I
Reset Out
RSTO
Driven low for 1024 CPU clocks after the reset source has deasserted.
O
PLL and Clock Signals
Table 6 describes signals used to support the on-chip clock generation circuitry.
Table 6. PLL and Clock Signals
1.5
Signal Name
Abbreviation
External Clock In
EXTAL
Crystal
XTAL
Clock Out
CLKOUT
Function
I/O
Crystal oscillator or external clock input except when the on-chip
relaxation oscillator is used.
I
Crystal oscillator output except when CLKMOD0=0, then sampled as
part of the clock mode selection mechanism.
O
This output signal reflects the internal system clock.
O
Mode Selection
Table 7 describes signals used in mode selection; Table 8 describes the particular clocking modes.
Table 7. Mode Selection Signals
Signal Name
Clock Mode Selection
Abbreviation
Function
I/O
CLKMOD[1:0] Selects the clock boot mode.
I
Reset Configuration
RCON
The Serial Flash Programming mode is entered by asserting the
RCON pin (with the TEST pin negated) as the chip comes out of
reset. During this mode, the EzPort has access to the flash memory
which can be programmed from an external device.
Test
TEST
Reserved for factory testing only and in normal modes of operation
should be connected to VSS to prevent unintentional activation of
test functions.
I
Table 8. Clocking Modes
CLKMOD[1:0]
XTAL
Configure the clock mode.
00
0
PLL disabled, clock driven by external oscillator
00
1
PLL disabled, clock driven by on-chip oscillator
01
N/A
10
0
PLL in normal mode, clock driven by external oscillator
10
1
PLL in normal mode, clock driven by on-chip oscillator
11
N/A
PLL disabled, clock driven by crystal
PLL in normal mode, clock driven by crystal
MCF5213 ColdFire Microcontroller, Rev. 4
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Family Configurations
Family Configurations
External Interrupt Signals
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from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
1.6
Table 9 describes the external interrupt signals.
Table 9. External Interrupt Signals
1.7
Signal Name
Abbreviation
External Interrupts
IRQ[7:1]
Function
External interrupt sources.
I/O
I
Queued Serial Peripheral Interface (QSPI)
Table 10 describes the QSPI signals.
Table 10. Queued Serial Peripheral Interface (QSPI) Signals
Signal Name
QSPI Synchronous
Serial Output
Abbreviation
Function
QSPI_DOUT Provides the serial data from the QSPI and can be programmed to be
driven on the rising or falling edge of QSPI_CLK.
O
QSPI Synchronous
Serial Data Input
QSPI_DIN
Provides the serial data to the QSPI and can be programmed to be
sampled on the rising or falling edge of QSPI_CLK.
I
QSPI Serial Clock
QSPI_CLK
Provides the serial clock from the QSPI. The polarity and phase of
QSPI_CLK are programmable.
O
Synchronous Peripheral QSPI_CS[3:0] QSPI peripheral chip select; can be programmed to be active high or
Chip Selects
low.
1.8
I/O
O
I2C I/O Signals
Table 11 describes the I2C serial interface module signals.
Table 11. I2C I/O Signals
Signal Name
Abbreviation
Function
I/O
Serial Clock
SCLn
Open-drain clock signal for the for the I2C interface. When the bus is
In master mode, this clock is driven by the I2C module; when the bus
is in slave mode, this clock becomes the clock input.
I/O
Serial Data
SDAn
Open-drain signal that serves as the data input/output for the I2C
interface.
I/O
MCF5213 ColdFire Microcontroller, Rev. 4
Freescale Semiconductor
21
1.9
UART Module Signals
Table 12 describes the UART module signals.
Table 12. UART Module Signals
Signal Name
Abbreviation
Function
I/O
Transmit Serial Data
Output
UTXDn
Transmitter serial data outputs for the UART modules. The output is
held high (mark condition) when the transmitter is disabled, idle, or in
the local loopback mode. Data is shifted out, LSB first, on this pin at
the falling edge of the serial clock source.
O
Receive Serial Data
Input
URXDn
Receiver serial data inputs for the UART modules. Data is received on
this pin LSB first. When the UART clock is stopped for power-down
mode, any transition on this pin restarts the clock.
I
Clear-to-Send
UCTSn
Indication to the UART modules that they can begin data
transmission.
I
Request-to-Send
URTSn
Automatic request-to-send outputs from the UART modules. This
signal can also be configured to be asserted and negated as a
function of the RxFIFO level.
O
1.10
DMA Timer Signals
Table 13 describes the signals of the four DMA timer modules.
Table 13. DMA Timer Signals
Signal Name
Abbreviation
DMA Timer Input
DTIN
DMA Timer Output
DTOUT
1.11
Function
I/O
Event input to the DMA timer modules.
I
Programmable output from the DMA timer modules.
O
ADC Signals
Table 14 describes the signals of the Analog-to-Digital Converter.
Table 14. ADC Signals
Signal Name
Abbreviation
Function
I/O
Analog Inputs
AN[7:0]
Inputs to the analog-to-digital converter.
I
Analog Reference
VRH
Reference voltage high and low inputs.
I
I
VRL
Analog Supply
VDDA
Isolate the ADC circuitry from power supply noise.
—
VSSA
ADC Sync Inputs
SYNCA /
SYNCB
—
These signals can initiate an analog-to-digital conversion
process.
I
MCF5213 ColdFire Microcontroller, Rev. 4
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Family Configurations
General Purpose Timer Signals
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1.12
Table 15 describes the general purpose timer signals.
Table 15. GPT Signals
Signal Name
Abbreviation
General Purpose Timer
Input/Output
GPT[3:0]
1.13
Function
I/O
Inputs to or outputs from the general purpose timer module.
I/O
Pulse Width Modulator Signals
Table 16 describes the PWM signals.
Table 16. PWM Signals
Signal Name
Abbreviation
PWM Output Channels
PWM[7:0]
1.14
Function
Pulse width modulated output for PWM channels.
I/O
O
Debug Support Signals
These signals are used as the interface to the on-chip JTAG controller and the BDM logic.
Table 17. Debug Support Signals
Signal Name
Abbreviation
JTAG Enable
JTAG_EN
Test Reset
Function
I/O
Select between debug module and JTAG signals at reset.
I
TRST
This active-low signal is used to initialize the JTAG logic
asynchronously.
I
Test Clock
TCLK
Used to synchronize the JTAG logic.
I
Test Mode Select
TMS
Used to sequence the JTAG state machine. TMS is sampled on the
rising edge of TCLK.
I
Test Data Input
TDI
Serial input for test instructions and data. TDI is sampled on the rising
edge of TCLK.
I
Test Data Output
TDO
Serial output for test instructions and data. TDO is tri-stateable and is
actively driven in the shift-IR and shift-DR controller states. TDO
changes on the falling edge of TCLK.
O
Development Serial
Clock
DSCLK
Development Serial Clock - Internally synchronized input. (The logic
level on DSCLK is validated if it has the same value on two
consecutive rising bus clock edges.) Clocks the serial communication
port to the debug module during packet transfers. Maximum frequency
is PSTCLK/5. At the synchronized rising edge of DSCLK, the data
input on DSI is sampled and DSO changes state.
I
Breakpoint
BKPT
Breakpoint - Input used to request a manual breakpoint. Assertion of
BKPT puts the processor into a halted state after the current
instruction completes. Halt status is reflected on processor
status/debug data signals (PST[3:0] and PSTDDATA[7:0]) as the
value 0xF. If CSR[BKD] is set (disabling normal BKPT functionality),
asserting BKPT generates a debug interrupt exception in the
processor.
I
MCF5213 ColdFire Microcontroller, Rev. 4
Freescale Semiconductor
23
Table 17. Debug Support Signals (continued)
Signal Name
Abbreviation
Function
I/O
Development Serial
Input
DSI
Development Serial Input - Internally synchronized input that provides
data input for the serial communication port to the debug module, after
the DSCLK has been seen as high (logic 1).
I
Development Serial
Output
DSO
Development Serial Output - Provides serial output communication for
debug module responses. DSO is registered internally. The output is
delayed from the validation of DSCLK high.
O
Debug Data
DDATA[3:0]
Display captured processor data and breakpoint status. The CLKOUT
signal can be used by the development system to know when to
sample DDATA[3:0].
O
Processor Status Clock
PSTCLK
Processor Status Clock - Delayed version of the processor clock. Its
rising edge appears in the center of valid PST and DDATA output.
PSTCLK indicates when the development system should sample PST
and DDATA values.
If real-time trace is not used, setting CSR[PCD] keeps PSTCLK, and
PST and DDATA outputs from toggling without disabling triggers.
Non-quiescent operation can be reenabled by clearing CSR[PCD],
although the external development systems must resynchronize with
the PST and DDATA outputs.
PSTCLK starts clocking only when the first non-zero PST value (0xC,
0xD, or 0xF) occurs during system reset exception processing.
O
Processor Status
Outputs
PST[3:0]
Indicate core status. Debug mode timing is synchronous with the
processor clock; status is unrelated to the current bus transfer. The
CLKOUT signal can be used by the development system to know
when to sample PST[3:0].
O
All Processor Status
Outputs
ALLPST
Logical AND of PST[3:0]. The CLKOUT signal can be used by the
development system to know when to sample ALLPST.
O
1.15
EzPort Signal Descriptions
Table contains a list of EzPort external signals.
Table 18. EzPort Signal Descriptions
Signal Name
Abbreviation
Function
I/O
EzPort Clock
EZPCK
Shift clock for EzPort transfers.
I
EzPort Chip Select
EZPCS
Chip select for signalling the start and end of
serial transfers.
I
EzPort Serial Data In
EZPD
EZPD is sampled on the rising edge of
EZPCK.
I
EzPort Serial Data Out
EZPQ
EZPQ transitions on the falling edge of
EZPCK.
O
MCF5213 ColdFire Microcontroller, Rev. 4
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Family Configurations
1.16
Power and Ground Pins
The pins described in Table 19 provide system power and ground to the chip. Multiple pins are provided for adequate current
capability. All power supply pins must have adequate bypass capacitance for high-frequency noise suppression.
Table 19. Power and Ground Pins
Signal Name
Abbreviation
Function
PLL Analog Supply
VDDPLL,
VSSPLL
Dedicated power supply signals to isolate the sensitive PLL analog
circuitry from the normal levels of noise present on the digital power
supply.
Positive Supply
VDD
These pins supply positive power to the core logic.
Ground
VSS
This pin is the negative supply (ground) to the chip.
MCF5213 ColdFire Microcontroller, Rev. 4
Freescale Semiconductor
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Family Configurations
2
Electrical Characteristics
This section contains electrical specification tables and reference timing diagrams for the microcontroller unit, including
detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications.
NOTE
The parameters specified in this data sheet supersede any values found in the module
specifications.
2.1
Maximum Ratings
Table 20. Absolute Maximum Ratings1, 2
Rating
Symbol
Value
Unit
VDD
–0.3 to +4.0
V
Clock synthesizer supply voltage
VDDPLL
–0.3 to +4.0
V
RAM standby supply voltage
VSTBY
–0.3 to +4.0
V
VIN
–0.3 to +4.0
V
EXTAL pin voltage
VEXTAL
0 to 3.3
V
XTAL pin voltage
VXTAL
0 to 3.3
V
IDD
25
mA
TA
(TL - TH)
–40 to 856
°C
Tstg
–65 to 150
°C
Supply voltage
Digital input voltage
3
Instantaneous maximum current
Single pin limit (applies to all pins)4, 5
Operating temperature range (packaged)
Storage temperature range
1
2
3
4
5
6
Functional operating conditions are given in DC Electrical Specifications. Absolute Maximum Ratings
are stress ratings only, and functional operation at the maxima is not guaranteed. Stress beyond
those listed may affect device reliability or cause permanent damage to the device.
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher
than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if
unused inputs are tied to an appropriate logic voltage level (VSS or VDD).
Input must be current limited to the IDD value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive and negative clamp voltages, then
use the larger of the two values.
All functional non-supply pins are internally clamped to VSS and VDD.
The power supply must maintain regulation within operating VDD range during instantaneous and
operating maximum current conditions. If positive injection current (Vin > VDD) is greater than IDD, the
injection current may flow out of VDD and could result in the external power supply going out of
regulation. Ensure that the external VDD load shunts current greater than maximum injection current.
This is the greatest risk when the MCU is not consuming power (e.g., no clock).
Depending on the packaging; see the orderable part number summary.
MCF5213 ColdFire Microcontroller, Rev. 4
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Electrical Characteristics
Electrical Characteristics
Current Consumption
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2.2
Table 21. Current Consumption in Low-Power Mode1,2
8MHz (Typ)3 16MHz (Typ)2 64MHz (Typ)2 80MHz (Typ)2
Units
Stop mode 3 (Stop 11)4
0.13
mA
4
2.29
Mode
Stop mode 2 (Stop 10)
4,5
2.80
3.08
4.76
5.38
Stop mode 0 (Stop 00)4
2.80
3.08
4.76
5.39
Wait / Doze
11.12
20.23
30.17
33.36
Run
12.40
22.74
39.92
45.47
Stop mode 1 (Stop 01)
1
All values are measured with a 3.30 V power supply
Refer to the Power Management chapter in the MCF5213 Reference Manual for more information on
low-power modes.
3 CLKOUT and all peripheral clocks except UART0 and CFM off before entering low power mode. CLKOUT
is disabled. All code executed from flash memory. Code run from SRAM reduces power consumption
further. Tests performed at room temperature.
4 See the description of the Low-Power Control Register (LPCR) in the MCF5213 Reference Manual for
more information on stop modes 0–3.
5 Results are identical to STOP 00 for typical values because they only differ by CLKOUT power
consumption. CLKOUT is already disabled in this instance prior to entering low power mode.
2
50.00
45.00
40.00
mA @ 3.3V
35.00
Stop 0 - Flash
Stop 1 - Flash
Stop 2 - Flash
Stop 3 - Flash
Wait/Doze - Flash
Run - Flash
30.00
25.00
20.00
15.00
10.00
5.00
0.00
0
8
16
24
32
40
48
56
64
72
80
System Clock (MHz)
Typical Current Consumption in Low-Power Modes
MCF5213 ColdFire Microcontroller, Rev. 4
Freescale Semiconductor
27
Table 22. Typical Active Current Consumption Specifications
Symbol
Typical1
Active
(SRAM)
Typical1
Active
(Flash)
Peak2
Unit
IDD
—
3.48
—
mA
8 MHz core & I/O
7.28
13.37
19.02
16 MHz core & I/O
12.08
25.08
35.66
64 MHz core & I/O
40.14
54.62
85.01
80 MHz core & I/O
49.2
64.09
100.03
Characteristic
1 MHz core & I/O
RAM standby supply current
• Normal operation: VDD > VSTBY - 0.3 V
• Transient condition: VSTBY - 0.3 V > VDD > VSS + 0.5 V
• Standby operation: VDD < VSS + 0.5 V
ISTBY
Analog supply current
• Normal operation
• Low-power stop
IDDA
N/A3
N/A3
N/A3
—
—
—
—
N/A3
N/A3
N/A3
μA
mA
μA
16
50
mA
μA
1
Tested at room temperature with CPU polling a status register. All clocks were off except the UART and CFM (when
running from flash memory).
2 Peak current measured with all modules active, and default drive strength with matching load.
3
Due to the errata “Non-functional RAM Standby Supply” in the MCF5213 Device Errata, VSTBY should be connected
directly to VDD and cannot be used for RAM standby operation.
2.3
Thermal Characteristics
Table 23 lists thermal resistance values.
Table 23. Thermal Characteristics
Characteristic
100 LQFP
Symbol
Value
Unit
Single layer board (1s)
θJA
531,2
°C/W
Junction to ambient, natural convection
Four layer board (2s2p)
θJA
1,3
39
°C/W
Junction to ambient, (@200 ft/min)
Single layer board (1s)
θJMA
421,3
°C/W
Four layer board (2s2p)
θJMA
331,3
°C/W
—
θJB
254
°C/W
—
θJC
95
°C/W
Ψjt
26
°C/W
Tj
105
Junction to ambient, natural convection
Junction to ambient, (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
Natural convection
—
o
C
MCF5213 ColdFire Microcontroller, Rev. 4
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Electrical Characteristics
Table 23. Thermal Characteristics (continued)
Characteristic
Symbol
Value
Unit
Single layer board (1s)
θJA
611,2
°C/W
Four layer board (2s2p)
θJA
352,3
°C/W
Junction to ambient, (@200 ft/min)
Single layer board (1s)
θJMA
2,3
50
°C/W
Junction to ambient, (@200 ft/min)
Four layer board (2s2p)
θJMA
312,3
°C/W
81 MAPBGA Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
64 LQFP
2
°C/W
Tj
105
—
o
C
Four layer board (2s2p)
θJA
°C/W
Junction to ambient (@200 ft/min)
Single layer board (1s)
θJMA
501,3
°C/W
Junction to ambient (@200 ft/min)
Four layer board (2s2p)
θJMA
361,3
°C/W
—
θJB
264
°C/W
—
θJC
95
°C/W
Ψjt
26
°C/W
Tj
105
oC
Single layer board (1s)
θJA
681,2
°C/W
Four layer board (2s2p)
θJA
241,3
°C/W
Junction to ambient (@200 ft/min)
Single layer board (1s)
θJMA
551,3
°C/W
Junction to ambient (@200 ft/min)
Four layer board (2s2p)
θJMA
191,3
°C/W
—
θJB
84
°C/W
—
θJC
0.65
°C/W
Ψjt
36
°C/W
Tj
105
oC
Junction to ambient, natural convection
Junction to case (bottom)
Junction to top of package
Maximum operating junction temperature
6
Ψjt
Natural convection
Junction to ambient, natural convection
Junction to board
5
°C/W
6
°C/W
Junction to ambient, natural convection
4
12
431,3
Maximum operating junction temperature
3
θJC
62
Junction to top of package
2
—
°C/W
5
20
θJA
Junction to case
1
θJB
Single layer board (1s)
Junction to ambient, natural convection
Junction to board
64 QFN
—
4
Natural convection
—
Natural convection
—
1,2
θJA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of θJA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the Ψjt parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
MCF5213 ColdFire Microcontroller, Rev. 4
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from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Electrical Characteristics
The average chip-junction temperature (TJ) in °C can be obtained from:
T J = T A + ( P D × Θ JMA ) (1)
Where:
TA
= ambient temperature, °C
ΘJA
= package thermal resistance, junction-to-ambient, °C/W
PD
= PINT + PI/O
PINT
= chip internal power, IDD × VDD, watts
PI/O
= power dissipation on input and output pins — user determined, watts
For most applications PI/O < PINT and can be ignored. An approximate relationship between PD and TJ (if PI/O is neglected) is:
P D = K ÷ ( T J + 273°C )
(2)
Solving equations 1 and 2 for K gives:
K = PD × (TA + 273 °C) + ΘJMA × PD 2 (3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring PD (at equilibrium)
for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving equations (1) and (2) iteratively for
any value of TA.
2.4
Flash Memory Characteristics
The flash memory characteristics are shown in Table 24 and Table 25.
Table 24. SGFM Flash Program and Erase Characteristics
(VDD = 3.0 to 3.6 V)
Parameter
System clock (read only)
System clock (program/erase)2
1
2
Symbol
Min
Typ
Max
Unit
fsys(R)
0
—
66.67 or 801
MHz
fsys(P/E)
0.15
—
66.67 or 801
MHz
Depending on packaging; see the orderable part number summary.
Refer to the flash memory section for more information
Table 25. SGFM Flash Module Life Characteristics
(VDD = 3.0 to 3.6 V)
Parameter
Symbol
Value
Unit
P/E
10,0002
Cycles
Retention
10
Years
Maximum number of guaranteed program/erase cycles1 before failure
Data retention at average operating temperature of 85°C
1
2
A program/erase cycle is defined as switching the bits from 1 → 0 → 1.
Reprogramming of a flash memory array block prior to erase is not required.
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Electrical Characteristics
Electrical Characteristics
EzPort Electrical Specifications
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2.5
Table 26. EzPort Electrical Specifications
Name
2.6
Characteristic
Min
Max
Unit
EP1
EPCK frequency of operation (all commands except READ)
—
fsys / 2
MHz
EP1a
EPCK frequency of operation (READ command)
—
fsys / 8
MHz
EP2
EPCS_b negation to next EPCS_b assertion
2 × Tcyc
—
ns
EP3
EPCS_B input valid to EPCK high (setup)
5
—
ns
EP4
EPCK high to EPCS_B input invalid (hold)
5
—
ns
EP5
EPD input valid to EPCK high (setup)
2
—
ns
EP6
EPCK high to EPD input invalid (hold)
5
—
ns
EP7
EPCK low to EPQ output valid (out setup)
—
12
ns
EP8
EPCK low to EPQ output invalid (out hold)
0
—
ns
EP9
EPCS_B negation to EPQ tri-state
—
12
ns
ESD Protection
Table 27. ESD Protection Characteristics1, 2
Characteristics
Symbol
Value
Units
ESD target for Human Body Model
HBM
2000
V
ESD target for Machine Model
MM
200
V
Rseries
1500
Ω
C
100
pF
Rseries
0
Ω
C
200
pF
Number of pulses per pin (HBM)
• Positive pulses
• Negative pulses
—
—
1
1
Number of pulses per pin (MM)
• Positive pulses
• Negative pulses
—
—
3
3
Interval of pulses
—
1
HBM circuit description
MM circuit description
—
—
sec
1
All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for
Automotive Grade Integrated Circuits.
2 A device is defined as a failure if after exposure to ESD pulses the device no longer
meets the device specification requirements. Complete DC parametric and functional
testing is performed per applicable device specification at room temperature followed by
hot temperature, unless specified otherwise in the device specification.
MCF5213 ColdFire Microcontroller, Rev. 4
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31
2.7
DC Electrical Specifications
Table 28. DC Electrical Specifications 1
Characteristic
Symbol
Min
Max
Unit
Supply voltage
VDD
3.0
3.6
V
Standby voltage
VSTBY
1.8
3.6
V
Input high voltage
VIH
0.7 × VDD
4.0
V
Input low voltage
VIL
VSS – 0.3
0.35 × VDD
V
VHYS
0.06 × VDD
—
mV
Low-voltage detect trip voltage (VDD falling)
VLVD
2.15
2.3
V
Low-voltage detect hysteresis (VDD rising)
VLVDHYS
60
120
mV
Iin
–1.0
1.0
μA
Output high voltage (all input/output and all output pins)
IOH = –2.0 mA
VOH
VDD – 0.5
—
V
Output low voltage (all input/output and all output pins)
IOL = 2.0mA
VOL
—
0.5
V
Output high voltage (high drive)
IOH = -5 mA
VOH
VDD – 0.5
—
V
Output low voltage (high drive)
IOL = 5 mA
VOL
—
0.5
V
Output high voltage (low drive)
IOH = -2 mA
VOH
VDD - 0.5
—
V
Output low voltage (low drive)
IOL = 2 mA
VOL
—
0.5
V
Weak internal pull Up device current, tested at VIL Max.3
IAPU
–10
–130
μA
Input Capacitance 4
• All input-only pins
• All input/output (three-state) pins
Cin
—
—
7
7
Input hysteresis
2
Input leakage current
Vin = VDD or VSS, digital pins
pF
1
Refer to Table 29 for additional PLL specifications.
Only for pins: IRQ1, IRQ2. IRQ3, IRQ4, IRQ5, IRQ6. IRQ7, RSTIN_B, RCON_B, PCS0, SCK, I2C_SDA, I2C_SCL,
TCLK, TRST_B
3 Refer to Table 4 for pins having internal pull-up devices.
4 This parameter is characterized before qualification rather than 100% tested.
2
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Electrical Characteristics
2.8
Clock Source Electrical Specifications
Table 29. PLL Electrical Specifications
(VDD and VDDPLL = 2.7 to 3.6 V, VSS = VSSPLL = 0 V)
Characteristic
Symbol
Min
Max
fref_crystal
fref_ext
1
2
10.0
10.0
0
fref / 32
66.67 or 802
66.67 or 802
fLOR
100
1000
kHz
fSCM
1
5
MHz
Crystal start-up time 5, 6
tcst
—
10
ms
EXTAL input high voltage
• External reference
VIHEXT
2.0
VDD
EXTAL input low voltage
• External reference
VILEXT
VSS
0.8
MHz
PLL reference frequency range
• Crystal reference
• External reference
System frequency 1
• External clock mode
• On-chip PLL frequency
fsys
Loss of reference frequency 3, 5
Self clocked mode frequency
Unit
4
MHz
V
V
PLL lock time4,7
tlpll
—
500
μs
Duty cycle of reference 4
tdc
40
60
% fref
Frequency un-LOCK range
fUL
–1.5
1.5
% fref
Frequency LOCK range
fLCK
–0.75
0.75
% fref
CLKOUT period jitter 4, 5, 8 ,9, measured at fSYS Max
• Peak-to-peak (clock edge to clock edge)
• Long term (averaged over 2 ms interval)
Cjitter
—
—
10
.01
% fsys
7.84
8.16
MHz
foco
On-chip oscillator frequency
1
2
3
4
5
6
7
8
9
All internal registers retain data at 0 Hz.
Depending on packaging; see the orderable part number summary.
Loss of Reference Frequency is the reference frequency detected internally, which transitions the PLL into self clocked mode.
Self clocked mode frequency is the frequency at which the PLL operates when the reference frequency falls below fLOR with
default MFD/RFD settings.
This parameter is characterized before qualification rather than 100% tested.
Proper PC board layout procedures must be followed to achieve specifications.
This specification applies to the period required for the PLL to relock after changing the MFD frequency control bits in the
synthesizer control register (SYNCR).
Jitter is the average deviation from the programmed frequency measured over the specified interval at maximum fsys.
Measurements are made with the device powered by filtered supplies and clocked by a stable external clock signal. Noise
injected into the PLL circuitry via VDDPLL and VSSPLL and variation in crystal oscillator frequency increase the Cjitter percentage
for a given interval.
Based on slow system clock of 40 MHz measured at fsys max.
2.9
General Purpose I/O Timing
GPIO can be configured for certain pins of the QSPI, DDR Control, timer, UART, and Interrupt interfaces. When in GPIO mode,
the timing specification for these pins is given in Table 30 and Figure 5.
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Electrical Characteristics
The GPIO timing is met under the following load test conditions:
50 pF / 50 Ω for high drive
25 pF / 25 Ω for low drive
•
•
Table 30. GPIO Timing
NUM
Characteristic
Symbol
Min
Max
Unit
G1
CLKOUT High to GPIO Output Valid
tCHPOV
—
10
ns
G2
CLKOUT High to GPIO Output Invalid
tCHPOI
1.5
—
ns
G3
GPIO Input Valid to CLKOUT High
tPVCH
9
—
ns
G4
CLKOUT High to GPIO Input Invalid
tCHPI
1.5
—
ns
CLKOUT
G2
G1
GPIO Outputs
G3
G4
GPIO Inputs
Figure 5. GPIO Timing
2.10
Reset Timing
Table 31. Reset and Configuration Override Timing
(VDD = 3.0 to 3.6 V, VSS = 0 V, TA = TL to TH)1
NUM
1
2
Characteristic
Symbol
Min
Max
Unit
R1
RSTI input valid to CLKOUT High
tRVCH
9
—
ns
R2
CLKOUT High to RSTI Input invalid
tCHRI
1.5
—
ns
tRIVT
5
—
tCYC
tCHROV
—
10
ns
2
R3
RSTI input valid time
R4
CLKOUT High to RSTO Valid
All AC timing is shown with respect to 50% VDD levels unless otherwise noted.
During low power STOP, the synchronizers for the RSTI input are bypassed and RSTI is asserted asynchronously to the
system. Thus, RSTI must be held a minimum of 100 ns.
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Electrical Characteristics
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Electrical Characteristics
CLKOUT
1R1
R2
R3
RSTI
R4
R4
RSTO
Figure 6. RSTI and Configuration Override Timing
2.11
I2C Input/Output Timing Specifications
Table 32 lists specifications for the I2C input timing parameters shown in Figure 7.
Table 32. I2C Input Timing Specifications between I2C_SCL and I2C_SDA
Num
Characteristic
Min
Max
Units
11
Start condition hold time
2 × tCYC
—
ns
I2
Clock low period
8 × tCYC
—
ns
I3
SCL/SDA rise time (VIL = 0.5 V to VIH = 2.4 V)
—
1
ms
I4
Data hold time
0
—
ns
I5
SCL/SDA fall time (VIH = 2.4 V to VIL = 0.5 V)
—
1
ms
I6
Clock high time
4 × tCYC
—
ns
I7
Data setup time
0
—
ns
I8
Start condition setup time (for repeated start condition only)
2 × tCYC
—
ns
I9
Stop condition setup time
2 × tCYC
—
ns
Table 33 lists specifications for the I2C output timing parameters shown in Figure 7.
Table 33. I2C Output Timing Specifications between I2C_SCL and I2C_SDA
Num
111
I2
1
Characteristic
Min
Max
Units
Start condition hold time
6 × tCYC
—
ns
Clock low period
10 × tCYC
—
ns
—
—
μs
7 × tCYC
—
ns
—
3
ns
I32
I2C_SCL/I2C_SDA rise time
(VIL = 0.5 V to VIH = 2.4 V)
I41
Data hold time
I53
I2C_SCL/I2C_SDA fall time
(VIH = 2.4 V to VIL = 0.5 V)
I61
Clock high time
10 × tCYC
—
ns
I71
Data setup time
2 × tCYC
—
ns
Start condition setup time (for repeated start
condition only)
20 × tCYC
—
ns
Stop condition setup time
10 × tCYC
—
ns
I8
1
I91
MCF5213 ColdFire Microcontroller, Rev. 4
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1
Output numbers depend on the value programmed into the IFDR; an IFDR programmed with the
maximum frequency (IFDR = 0x20) results in minimum output timings as shown in Table 33. The I2C
interface is designed to scale the actual data transition time to move it to the middle of the SCL low
period. The actual position is affected by the prescale and division values programmed into the IFDR;
however, the numbers given in Table 33 are minimum values.
2
Because SCL and SDA are open-collector-type outputs, which the processor can only actively drive
low, the time SCL or SDA take to reach a high level depends on external signal capacitance and pull-up
resistor values.
3
Specified at a nominal 50-pF load.
Figure 7 shows timing for the values in Table 32 and Table 33.
I2
SCL
I1
I6
I4
I5
I3
I8
I7
I9
SDA
Figure 7. I2C Input/Output Timings
2.12
Analog-to-Digital Converter (ADC) Parameters
Table 34 lists specifications for the analog-to-digital converter.
Table 34. ADC Parameters1
Name
Characteristic
Min
Typical
Max
Unit
VREFL
Low reference voltage
VSSA
—
VSSA
V
VREFH
High reference voltage
VDDA
—
VDDA
V
VDDA
ADC analog supply voltage
3.0
3.3
3.6
V
VADIN
Input voltages
VREFL
—
VREFH
V
RES
Resolution
12
—
12
Bits
INL
Integral non-linearity (full input signal range)2
—
±2.5
±3
LSB3
INL
Integral non-linearity (10% to 90% input signal range)4
—
±2.5
±3
LSB
DNL
Differential non-linearity
—
–1 < DNL < +1
<+1
LSB
Monotonicity
GUARANTEED
fADIC
ADC internal clock
0.1
—
5.0
MHz
RAD
Conversion range
VREFL
—
VREFH
V
—
6
13
tAIC cycles6
time5
tADPU
ADC power-up
tREC
Recovery from auto standby
—
0
1
tAIC cycles
tADC
Conversion time
—
6
—
tAIC cycles
tADS
Sample time
—
1
—
tAIC cycles
CADI
Input capacitance
—
See Figure 8
—
pF
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Electrical Characteristics
Table 34. ADC Parameters1 (continued)
Name
Characteristic
XIN
Input impedance
3
4
5
6
7
Unit
—
See Figure 8
—
W
—
—
3
mA
IVREFH
VREFH current
—
0
—
mA
Offset voltage internal reference
—
±8
±15
mV
Gain error (transfer path)
.99
1
1.01
—
Offset voltage external reference
—
±3
9
mV
SNR
Signal-to-noise ratio
—
62 to 66
—
dB
THD
Total harmonic distortion
—
−75
—
dB
SFDR
Spurious free dynamic range
—
67 to 70.3
—
dB
SINAD
Signal-to-noise plus distortion
—
61 to 63.9
—
dB
ENOB
Effective number of bits
9.1
10.6
—
Bits
VOFFSET
2
Max
Input injection
EGAIN
per pin
Typical
IADI
VOFFSET
1
current7,
Min
All measurements are preliminary pending full characterization, and made at VDD = 3.3V, VREFH = 3.3V, and VREFL = ground
INL measured from VIN = VREFL to VIN = VREFH
LSB = Least Significant Bit
INL measured from VIN = 0.1VREFH to VIN = 0.9VREFH
Includes power-up of ADC and VREF
ADC clock cycles
Current that can be injected or sourced from an unselected ADC signal input without impacting the performance of the ADC
2.13
Equivalent Circuit for ADC Inputs
Figure 10-17 shows the ADC input circuit during sample and hold. S1 and S2 are always open/closed at the same time that S3
is closed/open. When S1/S2 are closed & S3 is open, one input of the sample and hold circuit moves to (VREFH-VREFL)/2, while
the other charges to the analog input voltage. When the switches are flipped, the charge on C1 and C2 are averaged via S3, with
the result that a single-ended analog input is switched to a differential voltage centered about (VREFH-VREFL)/2. The switches
switch on every cycle of the ADC clock (open one-half ADC clock, closed one-half ADC clock). There are additional
capacitances associated with the analog input pad, routing, etc., but these do not filter into the S/H output voltage, as S1 provides
isolation during the charge-sharing phase. One aspect of this circuit is that there is an on-going input current, which is a function
of the analog input voltage, VREF and the ADC clock frequency.
125W ESD Resistor
8pF noise damping capacitor
3
Analog Input
4
S1
C1
S/H
S3
1
1.
2.
2
(VREFH- VREFL)/ 2
S2
C2
C1 = C2 = 1pF
Parasitic capacitance due to package, pin-to-pin and pin-to-package base coupling; 1.8pF
Parasitic capacitance due to the chip bond pad, ESD protection devices and signal routing; 2.04pF
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Electrical Characteristics
3.
4.
5.
Equivalent resistance for the channel select mux; 100 Ωs
Sampling capacitor at the sample and hold circuit. Capacitor C1 is normally disconnected from the input and is only
connected to it at sampling time; 1.4pF
1
Equivalent input impedance, when the input is selected =
(ADC Clock Rate) × (1.4×10-12)
Figure 8. Equivalent Circuit for A/D Loading
2.14
DMA Timers Timing Specifications
Table 35 lists timer module AC timings.
Table 35. Timer Module AC Timing Specifications
Characteristic1
Name
1
Min
Max
Unit
T1
DTIN0 / DTIN1 / DTIN2 / DTIN3 cycle time
3 × tCYC
—
ns
T2
DTIN0 / DTIN1 / DTIN2 / DTIN3 pulse width
1 × tCYC
—
ns
All timing references to CLKOUT are given to its rising edge.
2.15
QSPI Electrical Specifications
Table 36 lists QSPI timings.
Table 36. QSPI Modules AC Timing Specifications
Name
Characteristic
Min
Max
Unit
QS1
QSPI_CS[3:0] to QSPI_CLK
1
510
tCYC
QS2
QSPI_CLK high to QSPI_DOUT valid
—
10
ns
QS3
QSPI_CLK high to QSPI_DOUT invalid (Output hold)
2
—
ns
QS4
QSPI_DIN to QSPI_CLK (Input setup)
9
—
ns
QS5
QSPI_DIN to QSPI_CLK (Input hold)
9
—
ns
The values in Table 36 correspond to Figure 9.
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Electrical Characteristics
QS1
QSPI_CS[3:0]
QSPI_CLK
QS2
QSPI_DOUT
QS3
QS4
QS5
QSPI_DIN
Figure 9. QSPI Timing
2.16
JTAG and Boundary Scan Timing
Table 37. JTAG and Boundary Scan Timing
Characteristics1
Num
1
Symbol
Min
Max
Unit
J1
TCLK frequency of operation
fJCYC
DC
1/4
fsys/2
J2
TCLK cycle period
tJCYC
4 × tCYC
—
ns
J3
TCLK clock pulse width
tJCW
26
—
ns
J4
TCLK rise and fall times
tJCRF
0
3
ns
J5
Boundary scan input data setup time to TCLK rise
tBSDST
4
—
ns
J6
Boundary scan input data hold time after TCLK rise
tBSDHT
26
—
ns
J7
TCLK low to boundary scan output data valid
tBSDV
0
33
ns
J8
TCLK low to boundary scan output high Z
tBSDZ
0
33
ns
J9
TMS, TDI input data setup time to TCLK rise
tTAPBST
4
—
ns
J10
TMS, TDI Input data hold time after TCLK rise
tTAPBHT
10
—
ns
J11
TCLK low to TDO data valid
tTDODV
0
26
ns
J12
TCLK low to TDO high Z
tTDODZ
0
8
ns
J13
TRST assert time
tTRSTAT
100
—
ns
J14
TRST setup time (negation) to TCLK high
tTRSTST
10
—
ns
JTAG_EN is expected to be a static signal. Hence, it is not associated with any timing.
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Electrical Characteristics
J2
J3
J3
VIH
TCLK
(input)
J4
VIL
J4
Figure 10. Test Clock Input Timing
TCLK
VIL
VIH
J5
Data Inputs
J6
Input Data Valid
J7
Data Outputs
Output Data Valid
J8
Data Outputs
J7
Data Outputs
Output Data Valid
Figure 11. Boundary Scan (JTAG) Timing
TCLK
VIL
VIH
J9
TDI
TMS
J10
Input Data Valid
J11
TDO
Output Data Valid
J12
TDO
J11
TDO
Output Data Valid
Figure 12. Test Access Port Timing
TCLK
14
TRST
13
Figure 13. TRST Timing
MCF5213 ColdFire Microcontroller, Rev. 4
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Electrical Characteristics
Debug AC Timing Specifications
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2.17
Table 38 lists specifications for the debug AC timing parameters shown in Figure 15.
Table 38. Debug AC Timing Specification
66/80 MHz
Num
1
Characteristic
Units
Min
Max
D1
PST, DDATA to CLKOUT setup
4
—
ns
D2
CLKOUT to PST, DDATA hold
1.5
—
ns
D3
DSI-to-DSCLK setup
1 × tCYC
—
ns
D41
DSCLK-to-DSO hold
4 × tCYC
—
ns
D5
DSCLK cycle time
5 × tCYC
—
ns
D6
BKPT input data setup time to CLKOUT rise
4
—
ns
D7
BKPT input data hold time to CLKOUT rise
1.5
—
ns
D8
CLKOUT high to BKPT high Z
0.0
10.0
ns
DSCLK and DSI are synchronized internally. D4 is measured from the synchronized DSCLK input relative to
the rising edge of CLKOUT.
Figure 14 shows real-time trace timing for the values in Table 38.
CLKOUT
D1
D2
PST[3:0]
DDATA[3:0]
Figure 14. Real-Time Trace AC Timing
MCF5213 ColdFire Microcontroller, Rev. 4
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41
Figure 15 shows BDM serial port AC timing for the values in Table 38.
CLKOUT
D5
DSCLK
D3
DSI
Current
Next
D4
DSO
Past
Current
Figure 15. BDM Serial Port AC Timing
3
Mechanical Outline Drawings
This section describes the physical properties of the device and its derivatives.
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Mechanical Outline Drawings
3.1
64-pin LQFP Package
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Mechanical Outline Drawings
43
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Mechanical Outline Drawings
Freescale Semiconductor
MCF5213 ColdFire Microcontroller, Rev. 4
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Mechanical Outline Drawings
45
3.2
46
64 QFN Package
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Mechanical Outline Drawings
Freescale Semiconductor
MCF5213 ColdFire Microcontroller, Rev. 4
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Mechanical Outline Drawings
47
MCF5213 ColdFire Microcontroller, Rev. 4
48
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Mechanical Outline Drawings
Freescale Semiconductor
MCF5213 ColdFire Microcontroller, Rev. 4
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Mechanical Outline Drawings
49
3.3
50
81 MAPBGA Package
MCF5213 ColdFire Microcontroller, Rev. 4
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Mechanical Outline Drawings
Freescale Semiconductor
MCF5213 ColdFire Microcontroller, Rev. 4
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Mechanical Outline Drawings
51
3.4
52
100-pin LQFP Package
MCF5213 ColdFire Microcontroller, Rev. 4
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Mechanical Outline Drawings
Freescale Semiconductor
MCF5213 ColdFire Microcontroller, Rev. 4
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Mechanical Outline Drawings
53
4
Revision History
Table 39. Revision History
Revision
2
Description
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Formatting, layout, spelling, and grammar corrections.
Added revision history.
Corrected signal names in block diagram to match those in signal description table.
Added the following footnote to the MCF5211 FlexCAN entry:
“FlexCAN is available on the MCF5211 only in the 64 QFN package.”
Added an entry for standby voltage (VSTBY) to the “DC electrical specifications” table.
Deleted the PSTCLK cycle time row in the “Debug AC timing specifications” table.
Changed the frequency above the “Min” and “Max” column headings in the “Debug AC timing
specifications” table (was 166 MHz, is 66/80 MHz).
Changed the minimum value for SNR, THD, SFDR, and SINAD in the “ADC parameters” table (was
TBD, is “—”).
In the “Pin Functions by Primary and Alternate Purpose” table, changed the value in the
“Pull-up/pull-down” column for IRQ2-IRQ6 (was “—”, is “pull-up”).
Added values for IOH and IOL to the “DC electrical specifications” table.
Added load test condition information to the “General Purpose I/O Timing” section.
Deleted the “80 MHz (Peak)” column from the “Current Consumption in Low-Power Mode” table.
In the “Typical Active Current Consumption Specifications” table, changed the typical active (SRAM)
and peak IDD values for the 1 MHz core & I/O entry (were TBD, are “—”).
Changed the ISTBY values In the “Typical Active Current Consumption Specifications” table (were 0 or
TBD, are “—”) and added an explanatory footnote referring to the MCF5213 Device Errata.
Changed the IDDA values In the “Typical Active Current Consumption Specifications” table (were TBD,
are 16 mA for normal operation and 50 μA for low-power stop).
3
• Formatting, layout, spelling, and grammar corrections.
• Synchronized the “Pin Functions by Primary and Alternate Purpose” table in this document and the
reference manual.
• Restructured the part number summary table to include full orderable parts, and changed its name (was
“Part Number Summary”, is “Orderable Part Number Summary”).
• Updated the family configurations table to show that FlexCAN is not available on the MCF5212.
• Added specifications for VLVD and VLVDHYS to the “DC electrical specifications” table.
4
• In Table 34, changed the Min value of VREFL to VSSA, the Max value of VREFL to VSSA, and the Min value
of VREFH to VDDA.
• Added EzPort timings.
• Updated clocking features.
MCF5213 ColdFire Microcontroller, Rev. 4
54
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MCF5211, MCF5212, MCF5213 in 81 MAPBGA packages
Revision History