Fairchild FODB102 Single channel microcoupler Datasheet

FODB100, FODB101, FODB102
Single Channel Microcoupler™
tm
Features
Description
■ Low profile package
The FODB100, FODB101 and FODB102 single channel
MICROCOUPLERS™ are all Pb-free, low profile
miniature surface mount optocouplers in a Ball Grid
Array (BGA) package. Each consists of an aluminum
gallium arsenide (AlGaAs) infrared emitting diode driving
a silicon phototransistor.
■
■
■
■
■
■
■
■
■
■
(1.20mm maximum mounted height)
Land pattern allows for optimum board space savings
High Current Transfer Ratio (CTR) at low IF
Minimum isolation distance of 0.45mm
High steady state isolation voltage of 2500Vrms
Data rates up to 120Kbit/s (NRZ)
Minimum creepage distance of 2mm
Wide operating temperature range of -40°C to +125°C
Available in tape and reel quantities of 3000 units
Applicable to Pb-free Infrared Ray reflow (260°C max)
UL and VDE approved
Schematic
ANODE 1
4 COLLECTOR
Applications
CATHODE 2
■ Primarily suited for DC-DC converters
3 EMITTER
■ For ground loop isolation, signal to noise isolation
Communications – chargers, adapters
Consumer – appliances, set top boxes
Industrial – power supplies, motor control
Package Dimensions
3.50 ± 0.10
A
2.50
1
4
2
3
3.50 ± 0.10
2.50
BALL #1
INDICATOR
4
3
BOTTOM VIEW
0.98 MAX
Ø 0.80 MIN
0.65 MAX
B
(Ø2.30)
2
1
0.35 MAX
0.25 MIN
TOP VIEW
0.10 C B A
1.20 MAX
C
©2004 Fairchild Semiconductor Corporation
FODB100, FODB101, FODB102 Rev. 1.0.0
0.85 MAX
0.68 MIN
SEATING
PLANE
1
NOTES: UNLESS OTHERWISE SPECIFIED
A) ALL DIMENSIONS ARE IN MILLIMETERS.
B) NO JEDEC REGISTRATION REFERENCE AS
OF NOVEMBER 2002.
0.10 C
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FODB100, FODB101, FODB102 Single Channel Microcoupler™
July 2006
Symbol
Parameter
Value
Units
TOTAL PACKAGE
TSTG
Storage Temperature
-55 to +150
°C
TOPR
Operating Temperature
-40 to +125
°C
Junction Temperature
130
°C
Continuous Forward Current
30
mA
Tj
EMITTER
IF (avg)
VR
Reverse Input Voltage
6
V
PD
Power Dissipation
40
mW
0.39
mW/°C
Derate linearly (above 25°C)
DETECTOR
PD
Continuous Collector Current
50
mA
Power Dissipation
150
mW
Derate linearly (above 25°C)
1.42
mW/°C
VCEO
Collector-Emitter Voltage
75
V
VECO
Emitter-Collector Voltage
7
V
2
FODB100, FODB101, FODB102 Rev. 1.0.0
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FODB100, FODB101, FODB102 Single Channel Microcoupler™
Absolute Maximum Ratings (TA = 25°C Unless otherwise specified)
Individual Component Characteristics
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
1.5
V
10
µA
EMITTER
VF
Forward Voltage
IF = 2mA
IR
Reverse Current
VR = 6V
BVCEO
Breakdown Voltage
Collector to Emitter
IC = 100µA, IF = 0
75
V
BVECO
Emitter to Collector
IE = 100µA, IF = 0
7
V
1.0
DETECTOR
ICEO
Collector Dark
CCE
Capacitance
Current(1)
VCE = 75V, IF = 0
VCE = 0V, f = 1MHz
100
nA
8
pF
Transfer Characteristics
Symbol
CTR
Characteristic
Test Conditions
Current Transfer Ratio(2)
IF = 1mA, VCE = 5V
CTRCE(SAT) Saturated Current Transfer IF = 1.6mA, VCE = 0.4V
Ratio (Collector to Emitter)
IF = 1.0mA, VCE = 0.4V
VCE (SAT)
Saturation Voltage
Min.
Typ.
100
100
%
75
IF = 3.0mA, IC = 1.8mA
0.4
tr
Rise Time (Non-Saturated) IC = 2mA, VCE = 5 V, RL = 1kΩ
1
tf
Fall Time (Non-Saturated)
IC = 2mA, VCE = 5 V, RL = 1kΩ
5
Propagation Delay
High to Low
IF = 1.6mA, VCC = 5.0 V, RL = 750Ω
3
IF = 1.6mA, VCC = 5.0 V, RL = 4.7kΩ
12
Propagation Delay
Low to High
IF = 1.6mA, VCC = 5.0 V, RL = 750Ω
5
IF = 1.6mA, VCC = 5.0 V, RL = 4.7kΩ
19
TPLH
Unit
%
IF = 1.6mA, IC = 1.6mA
TPHL
Max.
V
µs
µs
µs
Isolation Characteristics
Symbol
VISO
RISO
CISO
Characteristic
Test Conditions
Steady State Isolation Voltage(3) RH ≤ 50%, TA = 25°C, t = 1 sec
Resistance (input to output)(3)
Capacitance (input to
output)(3)
VI-O = 500VDC
f = 1MHz
Min.
Typ.
Max.
Unit
2500
V(rms)
1012
Ω
0.3
0.5
pF
Notes:
1. The white dome area is sensitive to high intensity ambient light or any light source in the 500nm to 1200nm
wavelength range. If such a light source is present, the part should be covered or protected. If the white dome is
exposed to such a light source, the output leakage parameter of the phototransistor will increase.
2. CTR bin (FODB100 only)
FODB101: 100% – 200%
FODB102: 150% – 300%
3. Pin 1 and Pin 2 are shorted as input and Pin 3 and Pin 4 are shorted as output.
3
FODB100, FODB101, FODB102 Rev. 1.0.0
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FODB100, FODB101, FODB102 Single Channel Microcoupler™
Electrical Characteristics (TA = 25°C Unless otherwise specified)
Normalized CTR @ 25°C
1.2
IF = 2mA @ VCE = 2V
1
IF = 1mA @ VCE = 2V
0.8
0.6
IF = 500µA @ VCE = 2V
0.4
0.2
0
25
40
60
80
100
120
1.2
IF = 2mA @ VCE = 5V
1
IF = 1mA @ VCE = 5V
0.8
IF = 500µA @ VCE = 5V
0.6
0.4
0.2
0
25
140
Temperature (°C)
100
60
80
Temperature (°C)
Fig. 3 Current Transfer Ratio vs.
Collector to Emitter Voltage
Fig. 4 Current Transfer Ratio vs.
Collector Saturation Voltage
500
40
350
2mA
1mA
300
120
140
1mA
300
400
CTR (%)
Fig. 2 Normalized CTR vs. Temperature (VCE = 5V)
500µA
250
CTR (%)
Normalized CTR @ 25°C
Fig. 1 Normalized CTR vs. Temperature (VCE = 2V)
500µA
200
2mA
200
150
100
100
50
0
0
0
2
4
6
8
10
0
VCE (V)
0.2
0.4
0.6
0.8
1.0
Collector Saturation Voltage (V)
Fig. 5 Baud Rate vs. Load Resistor
Baud Rate – Kbit/s
200
IF = 1.47 mA
Ta = 23C, PRSG = (28-1)
BER < 10-6
150
100
Vcc = 12V
50
Vcc = 5V
0
200
400
600
800 1000 1200 1400
RL - Load Resistor - Ohms
4
FODB100, FODB101, FODB102 Rev. 1.0.0
1600
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FODB100, FODB101, FODB102 Single Channel Microcoupler™
Typical Performance Characteristics
Embossed Carrier Tape Configuration
D0
P0
T
E1
F
K0
Wc
W
E2
B0
Tc
D1
P1
A0
User Direction of Feed
Dimensions are in millimeter
Pkg type
A0
Optocoupler
(12mm)
3.80
±0.10
B0
W
D0
D1
E1
E2
3.80
±0.10
12.0
+0.3/
–0.1
1.50
+0.25/
–0.00
1.50
+0.25/
–0.00
1.75
±0.10
10.25
min
F
5.50
±0.05
P1
P0
K0
8.0
±0.1
4.0
±0.1
1.40
±0.10
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481
rotational and lateral movement requirements (see sketches A, B, and C).
T
0.279
±0.02
Tc
9.2
±0.3
0.06
±0.02
0.5mm
maximum
20 deg maximum
Typical
component
cavity
center line
B0
Wc
0.5mm
maximum
20 deg maximum component rotation
Typical
component
center line
Sketch A (Side or Front Sectional View)
Sketch C (Top View)
A0
Component Rotation
Component lateral movement
Sketch B (Top View)
Component Rotation
Optocoupler Reel Configuration
W1 Measured at Hub
B Min
Dim C
Dim D
min
Dim A
max
Dim N
DETAIL AA
See detail AA
W3
13" Diameter Reel
W2 max Measured at Hub
Dimension are in inches and millimeters
Tape Size
12mm
Reel
Option
13" Dia
Dim A
13.00
330
Dim B
0.059
1.5
Dim C
512 +0.020/–0.008
13 +0.5/–0.2
Dim D
0.795
20.2
7.00
178
5
FODB100, FODB101, FODB102 Rev. 1.0.0
Dim N
Dim W1
0.488 +0.078/–0.000
12.4 +2/–0
Dim W2
0.724
18.4
Dim W3 (LSL–USL)
0.469 – 0.606
11.9 – 15.4
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FODB100, FODB101, FODB102 Single Channel Microcoupler™
Tape and Reel Specifications
4
3
4
3
Definitions
5
1
X Y TT
B100 C
V
1
2
7
6
2
Ball #1
Indicator
1
Fairchild logo
2
Device number (FODB100)
3
One digit year code e.g. “E” for 2004
4
6-week date code character
5
Die Run Code
6
Assembly package code
7
VDE 0884 approved (Optional)
Note: The device number prefix of “FOD”
will be ommitted in the part number
Recommended Footprint Drawing for PCB Layout
Ø0.65
4
3
2.50
1
2.50
2
Note:
1. All dimensions in millimeters (mm)
2. It is recommended to use 6 mils of stencil thickness on PCB
6
FODB100, FODB101, FODB102 Rev. 1.0.0
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FODB100, FODB101, FODB102 Single Channel Microcoupler™
Marking Information
Entrance
Zone 1
Zone 2
Zone 3
Zone 4
Zone 5
Cooling
270.00
236.25
Temperature (°C)
202.50
168.75
135.00
101.25
67.50
33.75
0.00
0.66
1.31
1.97
2.63
3.28
3.94
4.60
5.26
5.91
6.57
7.23
7.88
Time (min.)
Reflow Profile for Pb Free
Convection Reflow
Average ramp-up rate (183°C to peak)
Preheat Temperature 125(±25)°C to 200°C
3°C/sec max
60-180°C
Temperature maintained above 220°C
60-150 sec
Time within 5°C of actual peak temperature
20-40 sec
260 ±5°C
6°C/sec max
Peak temperature range
Ramp down rate
Time 25°C to peak temperature
8min max
Note: Surface Mount Adhesives (SMA) isn’t recommended to be used on the dome area (white dome).
7
FODB100, FODB101, FODB102 Rev. 1.0.0
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FODB100, FODB101, FODB102 Single Channel Microcoupler™
Recommended Infrared Reflow Soldering Profile
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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER
ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S
WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which,
(a) are intended for surgical implant into the body, or (b) support or
sustain life, or (c) whose failure to perform when properly used in
accordance with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve
design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I20
8
FODB100, FODB101, FODB102 Rev. 1.0.0
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FODB100, FODB101, FODB102 Single Channel Microcoupler™
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