Material Content Data Sheet Sales Product Name 2EDL05I06PF MA# MA001135212 Package PG-DSO-8-53 Issued 29. August 2013 Weight* 80.25 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver acrylic resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 0.952 1.19 0.008 0.01 0.034 0.04 419 0.673 0.84 8388 27.330 34.06 34.95 340572 349484 0.185 0.23 0.23 2305 2305 0.099 0.12 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.19 11865 11865 105 1237 5.359 6.68 44.162 55.03 61.83 550316 618333 0.814 1.01 1.01 10142 10142 0.090 0.11 0.11 1116 1116 0.119 0.15 0.423 0.53 66780 1486 0.68 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 5269 6755 1000000