2.5 VOLT HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATION
32,768 x 20/65,536 x 10, 65,536 x 20/131,072 x 10
131,072 x 20/262,144 x 10, 262,144 x 20/524,288 x 10
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FEATURES:
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Choose among the following memory organizations:
IDT72T2098 32,768 x 20/65,536 x 10
IDT72T20108 65,536 x 20/131,072 x 10
IDT72T20118 131,072 x 20/262,144 x 10
IDT72T20128 262,144 x 20/524,288 x 10
Up to 250MHz Operation of Clocks
- 4ns read/write cycle time, 3.2ns access time
Users selectable input port to output port data rates, 500Mb/s
Data Rate
-DDR to DDR
-DDR to SDR
-SDR to DDR
-SDR to SDR
User selectable HSTL or LVTTL I/Os
Read Enable & Read Clock Echo outputs aid high speed operation
2.5V LVTTL or 1.8V, 1.5V HSTL Port Selectable Input/Ouput voltage
3.3V Input tolerant
Mark & Retransmit, resets read pointer to user marked position
Write Chip Select (WCS) input enables/disables Write
Operations
Read Chip Select (RCS) synchronous to RCLK
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IDT72T2098, IDT72T20108
IDT72T20118, IDT72T20128
Programmable Almost-Empty and Almost-Full flags, each flag
can default to one of four preselected offsets
Dedicated serial clock input for serial programming of flag offsets
User selectable input and output port bus sizing
-x20 in to x20 out
-x20 in to x10 out
-x10 in to x20 out
-x10 in to x10 out
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty and Full flags signal FIFO status
Select IDT Standard timing (using EF and FF flags) or First
Word Fall Through timing (using OR and IR flags)
Output enable puts data outputs into High-Impedance state
JTAG port, provided for Boundary Scan function
208 Ball Grid array (PBGA), 17mm x 17mm, 1mm pitch
Easily expandable in depth and width
Independent Read and Write Clocks (permit reading and writing
simultaneously)
High-performance submicron CMOS technology
Industrial temperature range (-40°°C to +85°°C) is available
FUNCTIONAL BLOCK DIAGRAM
D0 -Dn (x20, x10)
WEN
WCS
SREN SEN SCLK
WCLK
WSDR
INPUT REGISTER
WRITE CONTROL
LOGIC
WRITE POINTER
IW
OW
BUS
CONFIGURATION
MRS
RESET
LOGIC
PRS
TCK
TRST
TMS
TDO
Vref
FF/IR
PAF
EF/OR
PAE
FLAG
LOGIC
RAM ARRAY
32,768 x 20 or 65,536 x 10
65,536 x 20 or 131,072 x 10
131,072 x 20 or 262,144 x 10
262,144 x 20 or 524,288 x 10
FWFT
FSEL0
FSEL1
READ POINTER
RT
MARK
RSDR
READ
CONTROL
LOGIC
OUTPUT REGISTER
JTAG CONTROL
(BOUNDARY SCAN)
RCLK
REN
RCS
TDI
HSTL
SI
SO
OFFSET REGISTER
HSTL I/0
CONTROL
EREN
OE
Q0 -Qn (x20, x10)
5996 drw01
ERCLK
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The TeraSync is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
DECEMBER 2003
1
2003 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
DSC-5996/8
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
PIN CONFIGURATIONS
A1 BALL PAD CORNER
A
VCC
VCC
DNC
D1
D4
D7
D9
GND
GND
Q1
Q3
Q5
Q7
Q9
VDDQ
VDDQ
DNC
DNC
DNC
D2
D5
D8
HSTL
GND
GND
Q0
Q2
Q4
Q6
Q8
DNC
DNC
DNC
DNC
D0
D3
D6
VCC
VCC
GND
GND
VDDQ
VDDQ
VDDQ
VDDQ
DNC
DNC
DNC
DNC
DNC
DNC
VCC
VCC
VCC
VCC
GND
GND
VDDQ
VDDQ
VDDQ
VDDQ
DNC
DNC
DNC
DNC
TDI
TRST
GND
VDDQ
MARK
DNC
DNC
TCK
TMS
TDO
VDDQ
VDDQ
RCS
RT
REN
WCLK
FWFT
PAF
VDDQ
GND
GND
GND
GND
GND
VDDQ
OE
RCLK
WEN
WCS
FF/IR
VDDQ
GND
GND
GND
GND
GND
VDDQ
SCLK
SI
MRS
FSEL1
FSEL0
GND
GND
GND
GND
GND
GND
VDDQ
SEN
SREN
IW
DNC
PRS
VCC
GND
GND
GND
GND
GND
VDDQ
SO
EREN
WSDR
RSDR
OW
VCC
GND
VDDQ
PAE
ERCLK
DNC
DNC
DNC
VCC
VDDQ
EF/OR
DNC
DNC
DNC
DNC
DNC
VCC
VCC
VCC
VCC
GND
GND
VDDQ
VDDQ
VDDQ
VDDQ
DNC
DNC
DNC
DNC
DNC
D18
GND
VCC
VCC
VCC
GND
GND
VDDQ
VDDQ
VDDQ
VDDQ
DNC
DNC
DNC
DNC
DNC
D19
D16
D14
D12
D10
GND
GND
Q19
Q17
Q15
Q13
Q11
DNC
DNC
VCC
VCC
VREF
D17
D15
D13
D11
GND
GND
Q18
Q16
Q14
Q12
Q10
VDDQ
VDDQ
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
16
5996 drw02
NOTE:
1. DNC - Do Not Connect.
PBGA: 1mm pitch, 17mm x 17mm (BB208-1, order code: BB)
TOP VIEW
2
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
Both the input and output port can be selected for either 2.5V LVTTL or HSTL
operation. This can be achieved by tying the HSTL signal LOW for LVTTL or
HIGH for HSTL voltage operation. When the read port is setup for HSTL mode,
the Read Chip Select (RCS) input also has the benefit of disabling the read port
inputs, providing additional power savings.
There is the option of selecting different data rates on the input and output ports
of the device. There are a total of four combinations to choose from, Double Data
Rate to Double Data Rate (DDR to DDR), DDR to Single Data Rate (DDR to
SDR), SDR to DDR, and SDR to SDR. The clocking can be set up using the
WSDR and RSDR pins. For example, to set up the input to output combination
of DDR to SDR, WSDR will be HIGH and RSDR will be LOW. Read and write
operations are initiated on the rising edge of RCLK and WCLK respectively,
never on the falling edge. If REN or WEN is asserted after a rising edge of clock,
no read or write operations will be possible on the falling edge of that same pulse.
An Output Enable (OE) input is provided for high-impedance control of the
outputs. A read Chip Select (RCS) input is also provided for synchronous
enable/disable of the read port control input, REN. The RCS input is synchronized to the read clock, and also provides high-impedance controls to the Qn
data outputs. When RCS is disabled, REN will be disabled internally and the
data outputs will be in High-Impedance. Unlike the Read Chip Select signal
however, OE is not synchronous to RCLK. Outputs are high-impedance shortly
after a delay time when the OE transitions from LOW to HIGH.
The Echo Read Enable (EREN) and Echo Read Clock (ERCLK) outputs
are used to provide tighter synchronization between the data being transmitted
from the Qn outputs and the data being received by the input device. These
output signals from the read port are required for high-speed data communications. Data read from the read port is available on the output bus with respect
to EREN and ERCLK, which is useful when data is being read at high-speed
operations where synchronization is important.
The frequencies of both the RCLK and WCLK signals may vary from 0 to fMAX
with complete independence. There are no restrictions on the frequency of one
clock input with respect to another.
There are two possible timing modes of operation with these devices: IDT
Standard mode and First Word Fall Through (FWFT) mode.
In IDT Standard mode, the first word written to an empty FIFO will not appear
on the data output lines unless a specific read operation is performed. A read
operation, which consists of activating REN and enabling a rising RCLK edge,
will shift the word from internal memory to the data output lines. Be aware that
in Double Data Rate (DDR) mode only the IDT Standard mode is available.
In FWFT mode, the first word written to an empty FIFO is clocked directly to
the data output lines after three transitions of RCLK. A read operation does not
have to be performed to access the first word written to the FIFO. However,
subsequent words written to the FIFO do require a LOW on REN for access.
The state of the FWFT input during Master Reset determines the timing mode
in use.
For applications requiring more data storage capacity than a single FIFO can
provide, the FWFT timing mode permits depth expansion by chaining FIFOs
in series (i.e. the data outputs of one FIFO are connected to the corresponding
data inputs of the next). No external logic is required.
These FIFOs have four flag pins, EF/OR (Empty Flag or Output Ready), FF/
IR (Full Flag or Input Ready), PAE (Programmable Almost-Empty flag), and
PAF (Programmable Almost-Full flag). The EF and FF functions are selected
in IDT Standard mode. The IR and OR functions are selected in FWFT mode.
PAE and PAF are always available for use, irrespective of timing mode.
PAE and PAF flags can be programmed independently to switch at any point
in memory. Programmable offsets mark the location within the internal memory
that activates the PAE and PAF flags and can only be programmed serially. To
program the offsets, set SEN active and data can be loaded via the Serial Input
DESCRIPTION:
The IDT72T2098/72T20108/72T20118/72T20128 are exceptionally deep,
extremely high speed, CMOS First-In-First-Out (FIFO) memories with the ability
to read and write data on both rising and falling edges of clock. The device has
a flexible x20/x10 Bus-Matching mode and the option to select Single or Double
Data clock rates for input and output ports. These FIFOs offer several key user
benefits:
• Flexible x20/x10 Bus-Matching on both read and write ports
• Ability to read and write on both rising and falling edges of a clock
• User selectable Single or Double Data Rate of input and output ports
• A user selectable MARK location for retransmit
• User selectable I/O structure for HSTL or LVTTL
• The first word data latency period, from the time the first word is written to
an empty FIFO to the time it can be read, is fixed and short.
• High density offerings up to 5Mbit
• High speed operation of up to 250MHz
Bus-Matching Double Data Rate FIFOs are particularly appropriate for
network, video, telecommunications, data communications and other applications that require fast data transfer on both rising and falling edges of the clock.
This is a great alternative to increasing data rate without extending the width of
the bus or the speed of the device. They are also effective in applications that
need to buffer large amounts of data and match busses of unequal sizes.
Each FIFO has a data input port (Dn) and a data output port (Qn), both of
which can assume either a 20-bit or a 10-bit width as determined by the state
of external control pins Input Width (IW), Output Width (OW) during the Master
Reset cycle.
The input port is controlled by a Write Clock (WCLK) input and a Write Enable
(WEN) input. Data present on the Dn data inputs can be written into the FIFO
on every rising and falling edge of WCLK when WEN is asserted and Write
Single Data Rate (WSDR) pin held HIGH. Data can be selected to write only
on the rising edges of WCLK if WSDR is asserted. To guarantee functionality
of the device, WEN must be a controlled signal and not tied to ground. This is
important because WEN must be HIGH during the time when the Master Reset
(MRS) pulse is LOW. In addition, the WSDR pin must be tied HIGH or LOW.
It is not a controlled signal and cannot be changed during FIFO operation.
Write operations can be selected for either Single or Double Data Rate mode.
For Single Data Rate operation, writing into the FIFO requires the Write Single
Data Rate (WSDR) pin to be asserted. Data will be written into the FIFO on the
rising edge of WCLK when the Write Enable (WEN) is asserted. For Double
Data Rate operations, writing into the FIFO requires WSDR to be deasserted.
Data will be written into the FIFO on both rising and falling edge of WCLK when
WEN is asserted.
The output port is controlled by a Read Clock (RCLK) input and a Read
Enable (REN) input. Data is read from the FIFO on every rising and falling edge
of RCLK when REN is asserted and Read Single Data Rate (RSDR) pin held
HIGH. Data can be selected to read only on the rising edges of RCLK if RSDR
is asserted. To guarantee functionality of the device, REN must be a controlled
signal and not tied to ground. This is important because REN must be HIGH
during the time when the Master Reset (MRS) pulse is LOW. In addition, the
RSDR pin must be tied HIGH or LOW. It is not a controlled signal and cannot
be changed during FIFO operation.
Read operations can be selected for either Single or Double Data Rate mode.
Similar to the write operations, reading from the FIFO in single data rate requires
the Read Single Data Rate (RSDR) pin to be asserted. Data will be read from
the FIFO on the rising edge of RCLK when the Read Enable (REN) is asserted.
For Double Data Rate operations, reading into the FIFO requires RSDR to be
deasserted. Data will be read out of the FIFO on both rising and falling edge
of RCLK when and REN is asserted.
3
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
This device includes a Retransmit from Mark feature that utilizes two control
inputs, MARK and RT (Retransmit). If the MARK input is enabled with respect
to the RCLK, the memory location being read at the point will be marked. Any
subsequent retransmit operation (when RT goes LOW), will reset the read
pointer to this “marked” location.
The device can be configured with different input and output bus widths as
previously stated. These rates are: x20 to x20, x20 to x10, x10 to x20 and x10
to x10.
If, at any time, the FIFO is not actively performing an operation, the chip will
automatically power down. Once in the power down state, the standby supply
current consumption is minimized. Initiating any operation (by activating control
inputs) will immediately take the device out of the power down state.
A JTAG test port is provided, here the FIFO has fully functional boundary
Scan feature, compliant with IEEE 1449.1 Standard Test Access Port and
Boundary Scan Architecture.
The Double Data Rate FIFO has the capability of operating in either LVTTL
or HSTL mode. HSTL mode can be selected by enabling the HSTL pin. Both
input and output ports will operate in either HSTL or LVTTL mode, but cannot
be selected independent of one another.
The IDT72T2098/72T20108/72T20118/72T20128 are fabricated using
IDT’s high-speed submicron CMOS technology.
DESCRIPTION (CONTINUED)
(SI) pin at the rising edge of SCLK. To read out the offset registers serially, set
SREN active and data can be read out via the Serial Output (SO) pin at the rising
edge of SCLK. Four default offset settings are also provided, so that PAE can
be marked at a predefined number of locations from the empty boundary and
the PAF threshold can also be marked at similar predefined values from the full
boundary. The default offset values are set during Master Reset by the state
of the FSEL0 and FSEL1 pins.
During Master Reset (MRS), the following events occur: the read and write
pointers are set to the first location of the internal FIFO memory, the FWFT pin
selects IDT Standard mode or FWFT mode, the bus width configuration of the
read and write port is determined by the state of IW and OW, and the default offset
values for the programmable flags are set.
The Partial Reset (PRS) also sets the read and write pointers to the first
location of the memory. However, the timing mode and the values stored in the
programmable offset registers before Partial Reset remain unchanged. The
flags are updated according to the timing mode and offsets in effect. PRS is useful
for resetting a device in mid-operation, when reprogramming programmable
flags would be undesirable.
The timing of the PAE and PAF flags are synchronous to RCLK and WCLK,
respectively. The PAE flag is asserted upon the rising edge of RCLK only and
not WCLK. Similarly the PAF is asserted and updated on the rising edge of
WCLK only and not RCLK.
4
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
PARTIAL RESET (PRS)
MASTER RESET (MRS)
WRITE CLOCK (WCLK)
READ CLOCK (RCLK)
WRITE ENABLE (WEN)
READ ENABLE (REN)
WRITE CHIP SELECT (WCS)
WRITE SINGLE DATA RATE (WSDR)
(x20, x10) DATA IN (D0 - Dn)
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
OUTPUT ENABLE (OE)
IDT
72T2098
72T20108
72T20118
72T20128
READ CHIP SELECT (RCS)
READ SINGLE DATA RATE (RSDR)
(x20, x10) DATA OUT (Q0 - Qn)
RCLK ECHO (ERCLK)
SERIAL CLOCK (SCLK)
REN ECHO (EREN)
SERIAL ENABLE(SEN)
MARK
SERIAL READ ENABLE(SREN)
FIRST WORD FALL THROUGH (FWFT)
SERIAL INPUT (SI)
RETRANSMIT (RT)
EMPTY FLAG/OUTPUT READY (EF/OR)
SERIAL OUTPUT (SO)
FULL FLAG/INPUT READY (FF/IR)
PROGRAMMABLE ALMOST-FULL (PAF)
PROGRAMMABLE ALMOST-EMPTY (PAE)
5996 drw03
OUTPUT WIDTH (OW)
INPUT WIDTH (IW)
Figure 1. Single Device Configuration Signal Flow Diagram
TABLE 1 — BUS-MATCHING CONFIGURATION MODES
IW
OW
Write Port Width
Read Port Width
L
L
x20
x20
L
H
x20
x10
H
L
x10
x20
H
H
x10
x10
NOTE:
1. Pin status during Master Reset.
TABLE 2 — DATA RATE-MATCHING CONFIGURATION MODES
WSDR
RSDR
Write Port Width
Read Port Width
H
H
Double Data Rate
Double Data Rate
H
L
Double Data Rate
Single Data Rate
L
H
Single Data Rate
Double Data Rate
L
L
Single Data Rate
Single Data Rate
NOTE:
1. Pin status during Master Reset.
2. Data Rate Matching can be used in conjunction with Bus-Matching modes.
5
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
PIN DESCRIPTION
Symbol &
Name
Pin No.
D0-D19
Data Inputs
(See Pin No.
table for details)
I/O TYPE
Description
HSTL-LVTTL Data inputs for a 20-, or 10-bit bus. When using 10- bit mode, the unused input pins are in a don’t care
INPUT
state. The data bus is sampled on both rising and falling edges of WCLK when WEN is enabled and DDR
Mode is enabled or on the rising edges of WCLK only in SDR Mode.
EF/OR
(M14)
Empty Flag/
Output Ready
HSTL-LVTTL In the IDT Standard mode, the EF function is selected. EF indicates whether or not the FIFO memory is
OUTPUT
empty. In FWFT mode, the OR function is selected. OR indicates whether or not there is valid data available
at the outputs.
ERCLK
(L16)
Echo Read
Clock
HSTL-LVTTL Read Clock Echo output, must be equal to or faster than the Qn data outputs.
OUTPUT
EREN
(K16)
Echo Read
Enable
HSTL-LVTTL Read Enable Echo output, used in conjunction with ERCLK.
OUTPUT
FF/IR
(H3)
Full Flag/
Input Ready
HSTL-LVTTL In the IDT Standard mode, the FF function is selected. FF indicates whether or not the FIFO memory is
OUTPUT
empty. In FWFT mode, the IR function is selected. IR indicates whether or not there is space available
for writing to the FIFO memory.
FSEL0(1)
(J3)
Flag Select Bit 0
LVTTL
INPUT
During Master Reset, this input along with FSEL1 will select the default offset values for the programmable
flags PAE and PAF. There are four possible settings available.
FSEL1(1)
(J2)
Flag Select Bit 1
LVTTL
INPUT
During Master Reset, this input along with FSEL0 will select the default offset values for the programmable
flags PAE and PAF. There are four possible settings available.
FWFT
(G2)
First Word Fall
Through
LVTTL
INPUT
During Master reset, selects First Word Fall Through or IDT Standard mode. FWFT is not available in
DDR mode. In SDR mode, the first word will always fall through on the rising edge.
HSTL(1)
(B7)
HSTL Select
LVTTL
INPUT
This input pin is used to select HSTL or 2.5V LVTTL device operation. If HSTL inputs are required, this
input must be tied HIGH, otherwise it should be tied LOW.
IW(1)
(K1)
Input Width
LVTTL
During Master Reset, this pin, along with OW selects the bus width of the read and write port.
INPUT
MARK
(E14)
Mark Read
Pointer for
Retransmit
HSTL-LVTTL When this pin is asserted the current location of the read pointer will be marked. Any subsequent Retransmit
INPUT
operation will reset the read pointer to this position. There is an unlimited number to times to set the mark
location, but only the most recent location marked will be acknowledged.
MRS
(J1)
Master Reset
HSTL-LVTTL MRS initializes the read and write pointers to zero and sets the output registers to all zeros. During Master
INPUT
Reset, the FIFO is configured for either FWFT or IDT Standard mode, Bus-Matching configurations,
programmable flag default settings, and single or double data clock mode.
OE
(G15)
Output Enable
HSTL-LVTTL When HIGH, data outputs Q0-Q19 are in high impedance. When LOW, the data outputs Q0-Q19 are enabled.
INPUT
No other outputs are affected by OE.
OW(1)
(L3)
Output Width
PAE
(L15)
Programmable
Almost-Empty
Flag
PAF
(G3)
Programmable HSTL-LVTTL PAF goes HIGH if the number of free locations in the FIFO memory is more than offset m, which is stored
Almost-Full Flag
OUTPUT
in the Full Offset register. PAF goes LOW if the number of free locations in the FIFO memory is less than
or equal to m.
PRS
(K3)
Partial Reset
HSTL-LVTTL PRS initializes the read and write pointers to zero and sets the output registers to all zeros. During Partial
INPUT
Reset, the existing mode (IDT standard or FWFT) and programmable flag settings are not affected.
Q0-Q19
Data Outputs
(See Pin No.
table for details)
HSTL-LVTTL Data outputs for a 20-, or 10-bit bus. When in 10- bit mode, the unused output pins should not be connected.
OUTPUT
The output data is clocked on both rising and falling edges of RCLK when REN is enabled and DDR Mode
is enabled or on the rising edges of RCLK only in SDR Mode.
RCLK
(G16)
HSTL-LVTTL Input clock when used in conjunction with REN for reading data from the FIFO memory and output
INPUT
register.
Read Clock
LVTTL
INPUT
During Master Reset, this pin along with IW selects the bus width of the read and write port.
HSTL-LVTTL PAE goes HIGH if the number of words in the FIFO memory is greater than or equal to offset n, which is
OUTPUT
stored in the Empty Offset register. PAE goes LOW if the number of words in the FIFO memory is less than
offset n.
6
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
PIN DESCRIPTION (CONTINUED)
Symbol &
Pin No.
Name
I/O TYPE
Description
RCS
(F14)
Read Chip
Select
HSTL-LVTTL RCS provides synchronous enable/disable control of the read port and High-Impedance control of the
INPUT
Qn data outputs, synchronous to RCLK. When using RCS the OE pin must be tied LOW. During Master
or Partial Reset the RCS input is don’t care, if OE is LOW the data outputs will be Low-Impedance regardless
of RCS.
REN
(F16)
Read Enable
HSTL-LVTTL When LOW and in DDR mode, REN along with a rising and falling edge of RCLK will send data in FIFO
INPUT
memory to the output register and read the current data in output register. In SDR mode data will only
be read on the rising edge of RCLK only.
RSDR(1)
(L2)
Read Single
Data Rate
RT
(F15)
Retransmit
SCLK
(H15)
Serial Clock
SEN
(J15)
Serial Input
Enable
HSTL-LVTTL SEN used in conjunction with SI and SCLK enables serial loading of the programmable flag offsets.
INPUT
SREN
(J16)
Serial Read
Enable
HSTL-LVTTL SREN used in conjunction with SO and SCLK enables serial reading of the programmable flag offsets.
INPUT
SI
(H16)
Serial Input
HSTL-LVTTL This input pin is used to load serial data into the programmable flag offsets. Used in conjunction with SEN
INPUT
and SCLK.
SO
(K15)
Serial Output
HSTL-LVTTL This output pin is used to read data from the programmable flag offsets. Used in conjunction with SREN
OUTPUT
and SCLK.
TCK(2)
(F1)
JTAG Clock
HSTL-LVTTL Clock input for JTAG function. One of four terminals required by IEEE Standard 1149.1-1990. Test
INPUT
operations of the device are synchronous to TCK. Data from TMS and TDI are sampled on the rising edge
of TCK and outputs change on the falling edge of TCK. If the JTAG function is not used this signal needs
to be tied to GND.
TDI(2)
(E2)
JTAG Test Data HSTL-LVTTL One of four terminals required by IEEE Standard 1149.1-1990. During the JTAG boundary scan
Input
INPUT
operation, test data serially loaded via the TDI on the rising edge of TCK to either the Instruction Register,
ID Register and Bypass Register. An internal pull-up resistor forces TDI HIGH if left unconnected.
TDO(2)
(F3)
JTAG Test Data HSTL-LVTTL One of four terminals required by IEEE Standard 1149.1-1990. During the JTAG boundary scan
Output
OUTPUT
operation, test data serially loaded output via the TDO on the falling edge of TCK from either the Instruction
Register, ID Register and Bypass Register. This output is high impedance except when shifting, while in
SHIFT-DR and SHIFT-IR controller states.
TMS(2)
(F2)
JTAG Mode
Select
HSTL-LVTTL TMS is a serial input pin. One of four terminals required by IEEE Standard 1149.1-1990. TMS directs the
INPUT
the device through its TAP controller states. An internal pull-up resistor forces TMS HIGH if left unconnected.
TRST(2)
(E3)
JTAG Reset
HSTL-LVTTL TRST is an asynchronous reset pin for the JTAG controller. The JTAG TAP controller does not
INPUT
automatically reset upon power-up, thus it must be reset by either this signal or by setting TMS= HIGH
for five TCK cycles. If the TAP controller is not properly reset then the FIFO outputs will always be in highimpedance. If the JTAG function is used but the user does not want to use TRST, then TRST can be tied
with MRS to ensure proper FIFO operation. If the JTAG function is not used then this signal needs to be
tied to GND. An internal pull-up resistor forces TRST HIGH if left unconnected.
WCLK
(G1)
Write Clock
HSTL-LVTTL Input clock when used in conjunction with WEN for writing data into the FIFO memory.
INPUT
WCS
(H2)
Write Chip Select HSTL-LVTTL The WCS pin an be regarded as a second WEN input, enabling/disabling write operations.
INPUT
WEN
(H1)
Write Enable
LVTTL
INPUT
When LOW, this input pin sets the read port to Single Data Clock mode. When HIGH, the read port will
operate in Double Data Clock mode. This pin must be tied either HIGH or LOW and cannot toggle during
operation.
HSTL-LVTTL RT asserted on the rising edge of RCLK initializes the read pointer to the first location in memory. EF flag
INPUT
is set to LOW (OR to HIGH in FWFT mode). The write pointer, offset registers, and flag settings are not
affected. If a mark has been set via the MARK input pin, then the read pointer will initialize to the mark location
when RT is asserted.
LVTTL
INPUT
A rising edge of SCLK will clock the serial data present on the SI input into the offset registers provided
that SEN is enabled. A rising edge of SCLK will also read data out of the offset registers provided that SREN
is enabled.
HSTL-LVTTL When LOW and in DDR mode, WEN along with a rising and falling edge of WCLK will write data into the
INPUT
FIFO memory. In SDR mode data will only be read on the rising edge of RCLK only.
7
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
PIN DESCRIPTION (CONTINUED)
Symbol &
Pin No.
Name
I/O TYPE
Description
WSDR(1)
(L1)
Write Single Data
Rate
LVTTL
INPUT
When LOW, this input pin sets the write port to Single Data Clock mode. When HIGH, the write port will
operate in Double Data Clock mode. This pin must be tied either HIGH or LOW and cannot toggle during
operation.
VCC
(See below)
+2.5V Supply
INPUT
There are VCC supply inputs and must be connected to the 2.5V supply rail.
VDDQ
(See below)
O/P Rail Voltage
INPUT
This pin should be tied to the desired voltage rail for providing power to the output drivers. Nominally 1.5V
or 1.8V for HSTL, 2.5V for LVTTL.
GND
(See below)
Ground Pin
INPUT
These are Ground pins are for the core device and must be connected to the GND rail.
Vref
(T3)
Reference
Voltage
INPUT
This is a Voltage Reference input and must be connected to a voltage level determined in the Recommended
DC Operating Conditions section. This provides the reference voltage when using HSTL class inputs.
If HSTL class inputs are not being used, this pin can be left floating.
NOTES:
1. Inputs should not change state after Master Reset.
2. These pins are for the JTAG port. Please refer to pages 24-27 and Figures 5-7.
PIN NUMBER TABLE
Symbol
Name
I/O TYPE
Pin Number
D0-19
Data Inputs
HSTL-LVTTL D0-C3, D1-A4, D2-B4, D3-C4, D4-A5, D5-B5, D6-C5, D7-A6, D8-B6, D9-A7, D10-R7, D11-T7,
INPUT
D12-R6, D13-T6, D14-R5, D15-T5, D16-R4, D17-T4, D18-P3, D19-R3
Q0-19
Data Outputs
HSTL-LVTTL Q0-B10, Q1-A10, Q2-B11, Q3-A11, Q4-B12, Q5-A12, Q6-B13, Q7-A13, Q8-B14, Q9-A14, Q10-T14
OUTPUT Q11-R14, Q12-T13, Q13-R13, Q14-T12, Q15-R12, Q16-T11, Q17-R11, Q18-T10, Q19-R10
VCC
+2.5V Supply
INPUT
A(1,2), C(6,7), D(4-7), K4, L4, M4, N(4-7), P(5-7), T(1,2)
VDDQ
O/P Rail Voltage
INPUT
A(15,16), C(10-13), D(10-13), E13, F(4,13), G(4,14), H(4,14), J14, K14, L14, M13, N(10-13),
P(10-13), T(15,16)
GND
Ground Pin
INPUT
A(8,9), B(8,9), C(8,9), D(8,9), E4, G(7-10,13), H(7-10,13), J(4,7-10,13), K(7-10,13), L13, N(8,9),
P(4,8,9), R(8,9), T(8,9)
DNC
Do Not Connect
—
A3, B(1-3,15,16), C(1,2,14-16), D(1-3,14-16), E(1,15,16), K2, M(1-3,15,16), N(1-3,14-16), P(1,2,14-16),
R(1,2,15,16)
8
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
ABSOLUTE MAXIMUM RATINGS
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
CAPACITANCE (TA = +25°C, f = 1.0MHz)
Symbol
VTERM
Rating
Terminal Voltage
with respect to GND
Commercial
–0.5 to +3.6(2)
Unit
V
TSTG
Storage Temperature
–55 to +125
°C
IOUT
DC Output Current
–50 to +50
mA
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
2. Compliant with JEDEC JESD8-5. VCC terminal only.
Symbol
Parameter(1)
Conditions
Max.
Unit
CIN(2,3)
Input
Capacitance
VIN = 0V
10(3)
pF
COUT(1,2)
Output
Capacitance
VOUT = 0V
10
pF
NOTES:
1. With output deselected, (OE ≥ VIH).
2. Characterized values, not currently tested.
3. CIN for Vref is 20pF.
RECOMMENDED DC OPERATING CONDITIONS
Symbol
VCC
GND
Parameter
Min.
Supply Voltage
Supply Voltage
Typ.
Max.
Unit
2.375
0
2.5
0
2.625
0
V
V
VIH
Input High Voltage
LVTTL
eHSTL
HSTL
1.7
VREF+0.2
VREF+0.2
—
—
—
3.45
—
—
V
V
V
VIL
Input Low Voltage
LVTTL
eHSTL
HSTL
-0.3
—
—
—
—
—
0.7
VREF-0.2
VREF-0.2
V
V
V
eHSTL
HSTL
0.8
0.68
0.9
0.75
1.0
0.9
V
V
0
—
70
°C
-40
—
85
°C
Voltage Reference Input
VREF
(HSTL only)
TA
Operating Temperature Commercial
TA
Operating Temperature Industrial
NOTE:
1. VREF is only required for HSTL or eHSTL inputs. VREF should be tied LOW for LVTTL operation.
DC ELECTRICAL CHARACTERISTICS
(Commercial: VCC = 2.5V ± 0.125V, TA = 0°C to +70°C;Industrial: VCC = 2.5V ± 0.125V, TA = -40°C to +85°C)
Symbol
Parameter
ILI
Input Leakage Current
ILO
Output Leakage Current
VOH(5)
Output Logic “1” Voltage,
VOL
Output Logic “0” Voltage,
ICC1(1,2)
Active VCC Current (VCC = 2.5V)
ICC2(1)
Standby VCC Current (VCC = 2.5V)
Min.
Max.
Unit
–10
10
µA
–10
10
µA
VDDQ -0.4
VDDQ -0.4
VDDQ -0.4
—
—
—
—
—
—
0.4V
0.4V
0.4V
V
V
V
V
V
V
I/O = LVTTL
I/O = HSTL
I/O = eHSTL
—
—
—
20
60
60
mA
mA
mA
I/O = LVTTL
I/O = HSTL
I/O = eHSTL
—
—
—
10
50
50
mA
mA
mA
IOH = –8 mA @VDDQ = 2.5V ± 0.125V (LVTTL)
IOH = –8 mA @VDDQ = 1.8V ± 0.1V (eHSTL)
IOH = –8 mA @VDDQ = 1.5V ± 0.1V (HSTL)
IOL = 8 mA @VDDQ = 2.5V ± 0.125V (LVTTL)
IOL = 8 mA @VDDQ = 1.8V ± 0.1V (eHSTL)
IOL = 8 mA @VDDQ = 1.5V ± 0.1V (HSTL)
NOTES:
1. Both WCLK and RCLK toggling at 20MHz. Data inputs toggling at 10MHz. WCS = HIGH, REN or RCS = HIGH.
2. Typical ICC1 calculation: for LVTTL I/O ICC1 (mA) = 0.6mA x fs, fs = WCLK frequency = RCLK frequency (in MHz)
for HSTL or eHSTL I/O ICC1 (mA) = 38mA + (0.7mA x fs), fs = WCLK frequency = RCLK frequency (in MHz)
3. Typical IDDQ calculation: With Data Outputs in High-Impedance: IDDQ (mA) = 0.15mA x fs
With Data Outputs in Low-Impedance: IDDQ (mA) = (CL x VDDQ x fs x 2N)/2000
fs = WCLK frequency = RCLK frequency (in MHz), VDDQ = 2.5V for LVTTL; 1.5V for HSTL; 1.8V for eHSTL, N = Number of outputs switching.
tA = 25°C, CL = capacitive load (pf)
4. Total Power consumed: PT = [(VCC x ICC) + (VDDQ x IDDQ)].
5. Outputs are not 3.3V tolerant.
9
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
AC ELECTRICAL CHARACTERISTICS(1)
(Commercial: VCC = 2.5V ± 5%, TA = 0°C to +70°C;Industrial: VCC = 2.5V ± 5%, TA = -40°C to +85°C)
0
0
0
Unit
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
µs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Symbol
fS1
fS2
tA
tASO
tCLK1
tCLK2
tCLKH1
tCLKH2
tCLKL1
tCLKL2
tDS
tDH
tENS
tENH
tWCSS
tWCSH
fC
tSCLK
tSCKH
tSCKL
tSDS
tSDH
tSENS
tSENH
tRS
tRSS
tHRSS
tRSR
tRSF
tOLZ
tOE
tOHZ
tWFF
tREF
tPAFS
tPAES
tERCLK
tCLKEN
tRCSLZ
tRCSHZ
tSKEW1
tSKEW2
tSKEW3
Parameter
Clock Cycle Frequency SDR
Clock Cycle Frequency DDR
Data Access Time
Data Access Serial Output Time
Clock Cycle Time SDR
Clock Cycle Time DDR
Clock High Time SDR
Clock High Time DDR
Clock Low Time SDR
Clock Low Time DDR
Data Setup Time
Data Hold Time
Enable Setup Time
Enable Hold Time
WCS setup time
WCS hold time
Clock Cycle Frequency (SCLK)
Serial Clock Cycle
Serial Clock High
Serial Clock Low
Serial Data In Setup
Serial Data In Hold
Serial Enable Setup
Serial Enable Hold
Reset Pulse Width(3)
Reset Setup Time
HSTL Reset Setup Time
Reset Recovery Time
Reset to Flag and Output Time
Output Enable to Output in Low Z(4)
Output Enable to Output Valid
Output Enable to Output in High Z(4)
Write Clock to FF or IR
Read Clock to EF or OR
Write Clock to Programmable Almost-Full Flag
Read Clock to Programmable Almost-Empty Flag
RCLK to Echo RCLK output
RCLK to Echo REN output
RCLK to Active from High-Z
RCLK to High-Z(4)
Skew time between RCLK and WCLK for EF/OR and FF/IR
Skew time between RCLK & WCLK for EF/OR & FF/IR in DDR mode
Skew time between RCLK and WCLK for PAE and PAF
Commercial
IDT72T2098L4
IDT72T20108L4
IDT72T20118L4
IDT72T20128L4
Min.
Max.
—
250
—
150
0.6
3.2
0.6
3.2
4
—
6.7
—
1.8
—
2.8
—
1.8
—
2.8
—
1.2
—
0.5
—
1.2
—
0.5
—
1.2
—
0.5
—
—
10
100
—
45
—
45
—
15
—
5
—
5
—
5
—
30
—
15
—
4
—
10
—
—
10
0
—
—
3.2
—
3.2
—
3.2
—
3.2
—
3.2
—
3.2
—
3.6
—
3.2
—
3.2
—
3.2
3.5
—
3.5
—
4
—
Commercial
IDT72T2098L5
IDT72T20108L5
IDT72T20118L5
IDT72T20128L5
Min.
Max.
—
200
—
150
0.6
3.6
0.6
3.6
5
—
6.7
—
2.3
—
2.8
—
2.3
—
2.8
—
1.5
—
0.5
—
1.5
—
0.5
—
1.5
—
0.5
—
—
10
100
—
45
—
45
—
15
—
5
—
5
—
5
—
30
—
15
—
4
—
10
—
—
12
0
—
—
3.6
—
3.6
—
3.6
—
3.6
—
3.6
—
3.6
—
4
—
3.6
—
3.6
—
3.6
4
—
4
—
5
—
Com’l & Ind’l(2)
Commercial
IDT72T2098L6-7 IDT72T2098L10
IDT72T20108L6-7 IDT72T20108L10
IDT72T20118L6-7 IDT72T20118L10
IDT72T20128L6-7 IDT72T20128L10
Min.
Max.
Min.
Max.
Unit
—
150
—
100
MHz
—
150
—
100
MHz
0.6
3.8
0.6
4.5
ns
0.6
3.8
0.6
4.5
ns
6.7
—
10
—
ns
6.7
—
10
—
ns
2.8
—
4.5
—
ns
2.8
—
4.5
—
ns
2.8
—
4.5
—
ns
2.8
—
4.5
—
ns
2.0
—
3.0
—
ns
0.5
—
0.5
—
ns
2.0
—
3.0
—
ns
0.5
—
0.5
—
ns
2.0
—
3.0
—
ns
0.5
—
0.5
—
ns
—
10
—
10
MHz
100
—
100
—
ns
45
—
45
—
ns
45
—
45
—
ns
15
—
15
—
ns
5
—
5
—
ns
5
—
5
—
ns
5
—
5
—
ns
30
—
30
—
ns
15
—
15
—
ns
4
—
4
—
µs
10
—
10
—
ns
—
15
—
15
ns
0
—
0
—
ns
—
3.8
—
4.5
ns
—
3.8
—
4.5
ns
—
3.8
—
4.5
ns
—
3.8
—
4.5
ns
—
3.8
—
4.5
ns
—
3.8
—
4.5
ns
—
4.3
—
5
ns
—
3.8
—
4.5
ns
—
3.8
—
4.5
ns
—
3.8
—
4.5
ns
5
—
7
—
ns
5
—
7
—
ns
6
—
8
—
ns
NOTES:
1. All AC timings apply to both IDT Standard mode and First Word Fall Through mode.
2. Industrial temperature range product for the 6-7ns speed grade is available as a standard device. All other speed grades are available by special order.
3. Pulse widths less than minimum values are not allowed.
4. Values guaranteed by design, not currently tested.
10
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
AC TEST LOADS
HSTL
1.5V AC TEST CONDITIONS
Input Pulse Levels
Input Rise/Fall Times
Input Timing Reference Levels
Output Reference Levels
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
VDDQ/2
0.25 to 1.25V
0.4ns
0.75
VDDQ/2
50Ω
Z0 = 50Ω
I/O
5996 drw04
NOTE:
1. VDDQ = 1.5V±.
Figure 2a. AC Test Load
EXTENDED HSTL
1.8V AC TEST CONDITIONS
5
0.4 to 1.4V
0.4ns
0.9
VDDQ/2
tCD
(Typical, ns)
Input Pulse Levels
Input Rise/Fall Times
Input Timing Reference Levels
Output Reference Levels
6
4
3
2
1
NOTE:
1. VDDQ = 1.8V±.
20 30 50
80 100
Capacitance (pF)
200
5996 drw04a
Figure 2b. Lumped Capacitive Load, Typical Derating
2.5V LVTTL
2.5V AC TEST CONDITIONS
Input Pulse Levels
Input Rise/Fall Times
Input Timing Reference Levels
Output Reference Levels
GND to 2.5V
1ns
VCC/2
VDDQ/2
NOTE:
1. For LVTTL VCC = VDDQ.
11
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
OUTPUT ENABLE & DISABLE TIMING
Output
Enable
Output
Disable
VIH
OE
VIL
tOE & tOLZ
Output VCC
Normally
2
LOW
tOHZ
VCC
2
100mV
100mV
VOL
VOH
100mV
Output
Normally VCC
HIGH 2
100mV
VCC
2
5996 drw04b
NOTES:
1. REN is HIGH.
2. RCS is LOW.
READ CHIP SELECT ENABLE & DISABLE TIMING
VIH
tENH
RCS
VIL
tENS
RCLK
tRCSHZ
tRCSLZ
Output VCC
Normally
2
LOW
Output
Normally VCC
HIGH 2
VCC
2
100mV
100mV
VOL
VOH
100mV
100mV
VCC
2
5996 drw04c
NOTES:
1. REN is HIGH.
2. OE is LOW.
12
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
If the FIFO is full, the first read operation will cause FF to go HIGH.
Subsequent read operations will cause PAF to go HIGH at the conditions
described in Table 3. If further read operations occur, without write operations,
PAE will go LOW when there are n words in the FIFO, where n is the empty
offset value. Continuing read operations will cause the FIFO to become empty.
When the last word has been read from the FIFO, the EF will go LOW inhibiting
further read operations. REN is ignored when the FIFO is empty.
When configured in IDT Standard mode, the EF and FF outputs are double
register-buffered outputs. IDT Standard mode is available when the device is
configured in both Single Data Rate mode and Double Data Rate mode.
Relevant timing diagrams for IDT Standard mode can be found in Figure
10, 11, 12, 13, 14, 15, 16, 17, 18 and 23.
FUNCTIONAL DESCRIPTION
TIMING MODES: IDT STANDARD vs FIRST WORD FALL THROUGH
(FWFT) MODE
The IDT72T2098/72T20108/72T20118/72T20128 support two different
timing modes of operation: IDT Standard mode or First Word Fall Through
(FWFT) mode. The selection of which mode will operate is determined during
Master Reset, by the state of the FWFT input.
If, at the time of Master Reset, FWFT is LOW, then IDT Standard mode will
be selected. This mode uses the Empty Flag (EF) to indicate whether or not
there are any words present in the FIFO. It also uses the Full Flag function (FF)
to indicate whether or not the FIFO has any free space for writing. In IDT
Standard mode, every word read from the FIFO, including the first, must be
requested using the Read Enable (REN) and RCLK.
If, at the time of Master Reset, FWFT is HIGH, then FWFT mode will be
selected. This mode uses Output Ready (OR) to indicate whether or not there
is valid data at the data outputs (Qn). It also uses Input Ready (IR) to indicate
whether or not the FIFO has any free space for writing. In the FWFT mode,
the first word written to an empty FIFO goes directly to Qn after three RCLK rising
edges, REN = LOW is not necessary. Subsequent words must be accessed
using the Read Enable (REN) and RCLK.
Various signals, both input and output signals operate differently depending
on which timing mode is in effect.
FIRST WORD FALL THROUGH MODE (FWFT)
In this mode, the status flags, IR, PAF, PAE, and OR operate in the manner
outlined in Table 5. To write data into the FIFO, WEN must be LOW. Data
presented to the DATA IN lines will be clocked into the FIFO on subsequent
transitions of WCLK. After the first write is performed, the Output Ready (OR)
flag will go LOW. Subsequent writes will continue to fill up the FIFO. PAE will go
HIGH after n+2 words have been loaded into the FIFO, where n is the empty
offset value. The default setting for these values are stated in the footnote of Table
2. This parameter is also user programmable. See section on Programmable
Flag Offset Loading.
Again, if no reads are performed, the PAF will go LOW after (D-m) writes
to the FIFO. If x20 Input or x20 Output bus Width is selected, (D-m) = (32,769-m)
writes for the IDT72T2098, (65,537-m) writes for the IDT72T20108, (131,073-m)
writes for the IDT72T20118 and (262,145-m) writes for the IDT72T20128. If
both x10 Input and x10 Output bus Widths are selected, (D-m) = (65,537-m)
writes for the IDT72T2098, (131,073-m) writes for the IDT72T20108,
(262,145-m) writes for the IDT72T20118 and (524,289-m) writes for the
IDT72T20128. The offset m is the full offset value. The default setting for these
values are stated in the footnote of Table 3.
When the FIFO is full, the Input Ready (IR) flag will go HIGH, inhibiting further
write operations. If no reads are performed after a reset, IR will go HIGH after
D writes to the FIFO. If x18 Input or x18 Output bus Width is selected, D = 32,769
writes for the IDT72T2098, 65,537 writes for the IDT72T20108, 131,073 writes
for the IDT72T20118 and 262,145 writes for the IDT72T20128. If both x10 Input
and x10 Output bus Widths are selected, D = 65,537 writes for the IDT72T2098,
131,073 writes for the IDT72T20108, 262,145 writes for the IDT72T20118 and
524,289 writes for the IDT72T20128, respectively. Note that the additional word
in FWFT mode is due to the capacity of the memory plus output register.
If the FIFO is full, the first read operation will cause the IR flag to go LOW.
Subsequent read operations will cause the PAF to go HIGH at the conditions
described in Table 5. If further read operations occur, without write operations,
the PAE will go LOW when there are n+1 words in the FIFO, where n is the empty
offset value. Continuing read operations will cause the FIFO to become empty.
When the last word has been read from the FIFO, OR will go HIGH inhibiting
further read operations. REN is ignored when the FIFO is empty.
When configured in FWFT mode, the OR flag output is triple registerbuffered, and the IR flag output is double register-buffered. FWFT mode is only
available when the device is configured in Single Data Rate mode.
Relevant timing diagrams for FWFT mode can be found in Figure 19, 20,
21, 22, and 24.
IDT STANDARD MODE
In this mode, the status flags, FF, PAF, PAE, and EF operate in the manner
outlined in Table 4. To write data into to the FIFO, Write Enable (WEN) must
be LOW. Data presented to the DATA IN lines will be clocked into the FIFO on
subsequent transitions of the Write Clock (WCLK). After the first write is
performed, the Empty Flag (EF) will go HIGH. Subsequent writes will continue
to fill up the FIFO. The Programmable Almost-Empty flag (PAE) will go HIGH
after n + 1 words have been loaded into the FIFO, where n is the empty offset
value. The default setting for these values are listed in Table 2. This parameter
is also user programmable. See section on Programmable Flag Offset Loading.
Continuing to write data into the FIFO will cause the Programmable AlmostFull flag (PAF) to go LOW. Again, if no reads are performed, the PAF will go
LOW after (D-m) writes to the FIFO. If x20 Input or x20 Output bus Width is
selected, (D-m) = (32,768-m) writes for the IDT72T2098, (65,536-m) writes
for the IDT72T20108, (131,072-m) writes for the IDT72T20118 and
(262,144-m) writes for the IDT72T20128. If both x10 Input and x10 Output bus
Widths are selected, (D-m) = (65,536-m) writes for the IDT72T2098, (131,072-m)
writes for the IDT72T20108, (262,144-m) writes for the IDT72T20118 and
(524,288-m) writes for the IDT72T20128. The offset “m” is the full offset value.
The default setting for these values are listed in Table 3. This parameter is also
user programmable. See the section on Programmable Flag Offset Loading.
When the FIFO is full, the Full Flag (FF) will go LOW, inhibiting further write
operations. If no reads are performed after a reset, FF will go LOW after D writes
to the FIFO. If the x20 Input or x20 Output bus Width is selected, D = 32,768
writes for the IDT72T2098, 65,536 writes for the IDT72T20108, 131,072 writes
for the IDT72T20118 and 262,144 writes for the IDT72T20128. If both x10
Input and x10 Output bus Widths are selected, D = 65,536 writes for the
IDT72T2098, 131,072 writes for the IDT72T20108, 262,144 writes for the
IDT72T20118 and 524,288 writes for the IDT72T20128, respectively.
13
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
TABLE 3 — DEFAULT PROGRAMMABLE
FLAG OFFSETS
will load data from the SI input into the offset registers. SCLK runs at a nominal
speed of 10MHz at the maximum. The programming sequence starts with one
bit for each SCLK rising edge, starting with the Empty Offset LSB and ending
with the Full Offset MSB. The total number of bits per device is listed in Figure
3, Programmable Flag Offset Programming Sequence. See Figure 25,
Loading of Programmable Flag Registers, for the timing diagram for this mode.
The PAE and PAF can show a valid status only after the complete set of bits (for
all offset registers) has been entered. The registers can be reprogrammed as
long as the complete set of new offset bits is entered.
In addition to loading offset values into the FIFO, it is also possible to read
the current offset values. Similar to loading offset values, set SREN LOW and
the rising edge of SCLK will send data from the offset registers out to the SO output
port. When initializing a read to the offset registers, data will be read starting from
the first location in the register, regardless of where it was last read.
Figure 3, Programmable Flag Offset Programming Sequence, summarizes
the control pins and sequence for programming offset registers and reading and
writing into the FIFO.
The offset registers may be programmed (and reprogrammed) any time
after Master Reset. Valid programming ranges are from 0 to D-1.
IDT72T2098, 72T20108, 72T20118, 72T20128
FSEL1
H
L
H
L
FSEL0
H
H
L
L
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
Offsets n,m
255
127
63
7
NOTES:
1. n = empty offset for PAE.
2. m = full offset for PAF.
PROGRAMMING FLAG OFFSETS
Full and Empty Flag offset values are user programmable. The IDT72T2098/
72T20108/72T20118/72T20128 have internal registers for these offsets.
There are four selectable default offset values during Master Reset. These offset
values are shown in Table 3. The offset values can also be programmed serially
into the FIFO. To load offset values, set SEN LOW and the rising edge of SCLK
TABLE 4 STATUS FLAGS FOR IDT STANDARD MODE
IW = OW = x10
IW ≠ OW or
IW = OW = x20
IDT72T2098
0
(1)
1 to n
Number of
Words in
FIFO
IDT72T2098
IDT72T20108
IDT72T20118
IDT72T20108
IDT72T20118
IDT72T20128
FF
PAF PAE EF
0
0
0
0
H
H
L
1 to n(1)
1 to n(1)
1 to n(1)
1 to n(1)
H
H
L
H
(65,537) to (131,072-(m+1)) (131,073) to (262,144-(m+1)) (262,145) to (524,288-(m+1))
H
H
H
H
(16,385) to (32,768-(m+1)) (32,769) to (65,536-(m+1))
(32,768-m) to 32,767
32,768
IDT72T20128
L
(65,536-m) to 65,535
(131,072-m) to 131,071
(262,144-m) to 262,143
(524,288-m) to 524,287
H
L
H
H
65,536
131,072
262,144
524,288
L
L
H
H
IDT72T20128
NOTE:
1. See table 3 for values for n, m.
TABLE 5 STATUS FLAGS FOR FWFT MODE
IW = OW = x10
IW ≠ OW or
IW = OW = x20
Number of
Words in
FIFO
IDT72T2098
IDT72T2098
IDT72T20108
IDT72T20118
IDT72T20108
IDT72T20118
IDT72T20128
IR
PAF PAE OR
0
0
0
0
0
L
H
L
H
1 to n(1)
1 to n(1)
1 to n(1)
1 to n(1)
1 to n(1)
L
H
L
L
(16,386) to (32,764-(m+1))
(32,770) to (65,537-(m+1))
L
H
H
L
L
H
L
L
H
L
(32,764-m) to 32,768
32,769
(65,538) to (131,073-(m+1)) (131,074) to (262,145-(m+1)) (262,146) to (524,289-(m+1))
(65,537-m) to 65,536
(131,073-m) to 131,072
65,537
131,073
(262,145-m) to 262,144
262,145
(524,289-m) to 524,288
524,289
H
L
5996 drw05
NOTE:
1. See table 3 for values for n, m.
2. Number of Words in FIFO = FIFO Depth + Output Register.
3. FWFT mode available only in Single Data Rate mode.
14
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
WSDR
RSDR
WEN
REN
SEN
SREN
WCLK
RCLK
X
X
1
1
0
1
X
X
IDT72T2098
IDT72T20108
IDT72T20118
IDT72T20128
SCLK
x10 to x10 Mode
X
1
1
1
0
X
X
Serial Write to registers:
In SDR Mode:
30 bits for the IDT72T2098
32 bits for the IDT72T20108
34 bits for the IDT72T20118
36 bits for the IDT72T20128
1 bit for each rising SCLK edge
Starting with Empty Offset (LSB)
Ending with Full Offset (MSB)
1 bit for each rising SCLK edge
Starting with Empty Offset (LSB)
Ending with Full Offset (MSB)
Serial Write to registers:
In DDR Mode:
30 bits for the IDT72T2098
32 bits for the IDT72T20108
34 bits for the IDT72T20118
36 bits for the IDT72T20128
Serial Write to registers:
In DDR Mode:
28 bits for the IDT72T2098
30 bits for the IDT72T20108
32 bits for the IDT72T20118
34 bits for the IDT72T20128
1 bit for each rising SCLK edge
Starting with Empty Offset (LSB)
Ending with Full Offset (MSB)
1 bit for each rising SCLK edge
Starting with Empty Offset (LSB)
Ending with Full Offset (MSB)
All Other Modes
Serial Read From registers:
In SDR Mode:
32 bits for the IDT72T2098
34 bits for the IDT72T20108
36 bits for the IDT72T20118
38 bits for the IDT72T20128
Serial Read from registers:
In SDR Mode:
30 bits for the IDT72T2098
32 bits for the IDT72T20108
34 bits for the IDT72T20118
36 bits for the IDT72T20128
1 bit for each rising SCLK edge
Starting with Empty Offset (LSB)
Ending with Full Offset (MSB)
1 bit for each rising SCLK edge
Starting with Empty Offset (LSB)
Ending with Full Offset (MSB)
Serial Read from registers:
In DDR Mode:
30 bits for the IDT72T2098
32 bits for the IDT72T20108
34 bits for the IDT72T20118
36 bits for the IDT72T20128
Serial Read from registers:
In DDR Mode:
28 bits for the IDT72T2098
30 bits for the IDT72T20108
32 bits for the IDT72T20118
34 bits for the IDT72T20128
1 bit for each rising SCLK edge
Starting with Empty Offset (LSB)
Ending with Full Offset (MSB)
1 bit for each rising SCLK edge
Starting with Empty Offset (LSB)
Ending with Full Offset (MSB)
1
1
0
1
X
X
X
X
Write Memory (DDR)
0
1
0
1
X
X
X
X
Write Memory (SDR)
1
1
1
0
X
X
X
X
1
0
1
0
X
X
X
X
Read Memory (SDR)
X
X
1
1
X
X
X
X
No Operation
X
All Other Modes
Serial Write to registers:
In SDR Mode:
32 bits for the IDT72T2098
34 bits for the IDT72T20108
36 bits for the IDT72T20118
38 bits for the IDT72T20128
x10 to x10 Mode
X
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
Read Memory (DDR)
5996 drw06
NOTES:
1. The programming sequence applies to both IDT Standard and FWFT modes.
2. When the input or output ports are in DDR mode, the depth is reduced by half but the overall density remains the same. For example, the IDT72T2098 in SDR mode is
32,768 x 20/65,536 x 10 = 655,360, in DDR mode the configuration becomes 16,384 x 40/32,768 x 20 = 655,360. In both cases, the total density are the same.
Figure 3. Programmable Flag Offset Programming Sequence
15
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
RETRANSMIT FROM MARK OPERATION
The Retransmit from Mark feature allows FIFO data to be read repeatedly
starting at a user-selected position. The FIFO is first put into retransmit mode
that will “mark” a beginning word and also set a pointer that will prevent
ongoing FIFO write operations from over-writing retransmit data. The retransmit data can be read repeatedly any number of times from the “marked”
position. The FIFO can be taken out of retransmit mode at any time to allow
normal device operation. The “mark” position can be selected any number of
times, each selection over-writing the previous mark location.
In Double Data Rate, data is always marked in pairs. That is, the unit of data
read on the rising and falling edge of WCLK. If the data marked was read on
the falling edge of RCLK, then the marked data will be the unit of data read from
the rising and falling edge of that particular RCLK edge. Refer to Figure 23,
Retransmit from Mark in Double Data Rate Mode, for the timing diagram in
this mode. Retransmit operation is available in both IDT standard and FWFT
modes.
During IDT standard mode the FIFO is put into retransmit mode by a Lowto-High transition on RCLK when the MARK input is HIGH and EF is HIGH.
The rising RCLK edge marks the data present in the FIFO output register as
the first retransmit data. Again, the data is marked in pairs. Thus if the data
marked was read on the falling edge of RCLK, the first part of retransmit will
read out the data read on the rising edge of RCLK, followed by the data on the
falling edge (the marked data). The FIFO remains in retransmit mode until a
rising edge on RCLK occurs while MARK is LOW.
Once a marked location has been set, a retransmit can be initiated by a
rising edge on RCLK while the Retransmit input (RT) is LOW. REN must be
HIGH (reads disabled) before bringing RT LOW. The device indicates the start
of retransmit setup by setting EF LOW, also preventing reads. When EF goes
HIGH, retransmit setup is complete and read operations may begin starting
with the first unit of data at the MARK location. Since IDT standard mode is
selected, every word read including the first “marked” word following a retransmit setup requires a LOW on REN.
Note, write operations may continue as normal during all retransmit functions,
however write operations to the “marked” location will be prevented. See Figure
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
23, Retransmit from Mark in Double Data Rate Mode, for the relevant timing
diagram.
During FWFT mode the FIFO is put into retransmit mode by a rising RCLK
edge when the MARK input is HIGH and OR is LOW. The rising RCLK edge
marks the data present in the FIFO output register as the first retransmit data.
The data is marked in pairs. The FIFO remains in retransmit mode until a
rising RCLK edge occurs while MARK is LOW.
Once a marked location has been set, a retransmit can be initiated by a
rising RCLK edge while the Retransmit input (RT) is LOW. REN must be
HIGH (reads disabled) before bringing RT LOW. The device indicates the
start of retransmit setup by setting OR HIGH, preventing read operations.
When OR goes LOW, retransmit setup is complete and on the next rising
RCLK edge (RT goes HIGH), the contents of the first retransmit location are
loaded onto the output register. Since FWFT mode is selected, the first word
appears on the outputs regardless of REN, a LOW on REN is not required for
the first word. Reading all subsequent words requires a LOW on REN to
enable the rising RCLK edge. See Figure 24, Retransmit from Mark (FWFT
mode) for the relevant timing diagram.
Before a retransmit can be performed, there must be at least 1280 bits (or
160 bytes) of data between the write pointer and mark location.That is, 20 bits
x64 for the x20 mode and 10 bits x128 for the x10 mode. Also, once the Mark
is set, the write pointer will not increment past the marked location, preventing
overwrites of retransmit data.
HSTL/LVTTL I/O
This device supports both LVTTL and HSTL logic levels on the input and
output signals. If LVTTL is desired, a LOW on the HSTL pin will set the inputs
and outputs to LVTTL mode. If HSTL is desired, a HIGH on the HSTL pin will
set the inputs and outputs to HSTL mode. VREF is the input voltage reference
used in HSTL mode. Typically a logic HIGH in HSTL would be Vref + 0.2V and
a logic LOW would be VREF – 0.2V. Table 6 illustrates which pins are and are
not associated with this feature. Note that all “Static Pins” must be tied to Vcc or
GND. These pins are LVTTL only and are purely device configuration pins.
TABLE 6 — I/O CONFIGURATION
HSTL SELECT
STATIC PINS
HIGH = HSTL
LOW = LVTTL
LVTTL ONLY
Write Port
Dn (I/P)
WCLK (I/P)
WEN (I/P)
WCS (I/P)
Read Port
Qn (O/P)
RCLK (I/P)
REN (I/P)
RCS (I/P)
MARK (I/P)
OE (I/P)
RT (I/P)
Signal Pins
EF/OR (O/P)
PAF (O/P)
PAE (O/P)
FF/IR (O/P)
ERCLK (O/P)
EREN (O/P)
SCLK (I/P)
SI (I/P)
SO (O/P)
MRS (I/P)
PRS (I/P)
TCK (I/P)
TMS (I/P)
16
TRST (I/P)
TDI (I/P)
TDO (O/P)
SEN (I/P)
SREN (I/P)
Static Pins
IW (I/P)
OW (I/P)
HSTL (I/P)
FSEL1 (I/P)
FSEL0 (I/P)
FWFT (I/P)
WSDR (I/P)
RSDR (I/P)
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
If FWFT mode has been selected, the OR flag will go HIGH on the rising
edge of RCLK that retransmit was initiated. OR will return LOW on the next
rising edge of RCLK, which signifies that retransmit setup is complete. Under
FWFT mode, the contents in the marked memory location will be loaded onto
the output register on the next rising edge of RCLK. To access all subsequent
data, a read operation will be required.
Subsequent retransmit operations may be performed, each time the read
pointer returning to the “marked” location. See Figure 24, Retransmit from
Mark (FWFT Mode) for the relevant timing diagram.
SIGNAL DESCRIPTION
INPUTS:
DATA IN (D0 – Dn)
Data inputs for 20-bit wide data, (D0 – D19), or data inputs for 10-bit wide
data (D0 – D9).
CONTROLS:
MASTER RESET (MRS)
A Master Reset is accomplished whenever the MRS input is taken to a LOW
state. This operation sets the internal read and write pointers to the first location
of the RAM array. PAE will go LOW and PAF will go HIGH.
If FWFT is LOW during Master Reset then IDT Standard mode along with
EF and FF are selected. EF will go LOW and FF will go HIGH, If FWFT is
HIGH, then the First Word Fall Through (FWFT) mode, along with IR and OR
are selected. OR will go HIGH and IR will go LOW.
All control settings such as OW, IW, WSDR, RSDR, FSEL0 and FSEL1 are
defined during the Master Reset cycle.
During a Master Reset the output register is initialized to all zeros. A Master
Reset is required after power up before a write operation can take place. MRS
is asynchronous.
See Figure 8, Master Reset Timing, for the relevant timing diagram.
MARK
The MARK input is used to select Retransmit mode of operation. On a rising
edge of RCLK while MARK is HIGH will mark the memory location of the data
currently present on the output register, in addition placing the device in
retransmit mode. Note, there must be a minimum of 1280 bits (or 160 bytes) of
data between the write pointer and mark location. That is, 20 bits x64 for the
x20 mode and 10 bits x128 for the x10 mode. Also, once the MARK is set, the
write pointer will not increment past the “marked” location until the MARK is
deasserted. This prevents “overwriting” of retransmit data.
The MARK input must remain HIGH during the whole period of retransmit
mode, a falling edge of RCLK while MARK is LOW will take the device out of
retransmit mode and into normal mode. Any number of MARK locations can
be set during FIFO operation, only the last marked location taking effect. Once
a mark location has been set the write pointer cannot be incremented past this
marked location. During retransmit mode write operations to the device may
continue without hindrance.
PARTIAL RESET (PRS)
A Partial Reset is accomplished whenever the PRS input is taken to a LOW
state. As in the case of the Master Reset, the internal read and write pointers
are set to the first location of the RAM array. PAE goes LOW and PAF goes
HIGH.
Whichever mode was active at the time of Partial Reset will remain active
after Partial Reset. If IDT Standard Mode is active, then FF will go HIGH and
EF will go LOW. If the First Word Fall Through mode is active, then OR will go
HIGH and IR will go LOW.
Following Partial Reset, all values held in the offset registers remain unchanged. The output register is initialized to all zeroes. PRS is asynchronous.
Partial Reset is useful for resetting the read and write pointers to zero without
affecting the values of the programmable flag offsets and the timing mode of the
FIFO.
See Figure 9, Partial Reset Timing, for the relevant timing diagram.
FIRST WORD FALL THROUGH (FWFT)
During Master Reset, the state of the FWFT input determines whether the
device will operate in IDT Standard mode or First Word Fall Through (FWFT)
mode.
If, at the time of Master Reset, FWFT is LOW, then IDT Standard mode will
be selected. This mode uses the Empty Flag (EF) to indicate whether or not
there are any words present in the FIFO memory. It also uses the Full Flag
function (FF) to indicate whether or not the FIFO memory has any free space
for writing. In IDT Standard mode, every word read from the FIFO, including
the first, must be requested using the Read Enable (REN) and RCLK.
If, at the time of Master Reset, FWFT is HIGH, then FWFT mode will be
selected. This mode uses Output Ready (OR) to indicate whether or not there
is valid data at the outputs (Qn) to be read. It also uses Input Ready (IR) to
indicate whether or not the FIFO memory has any free space for writing. In the
FWFT mode, the first word written to an empty FIFO goes directly to Qn after
three RCLK rising edges, bringing REN LOW is not necessary. Subsequent
words must be accessed using the Read Enable (REN) and RCLK. Note that
FWFT mode can only be used when the device is configured to Single Data
Rate (SDR) mode.
RETRANSMIT (RT)
The Retransmit (RT) input is used in conjunction with the MARK input.
Together they provide a means by which data previously read out of the FIFO
can be reread any number of times. When the retransmit operation is selected
(i.e. after data has been marked), a rising edge on RCLK while RT is LOW will
reset the read pointer back to the memory location set by the user via the
MARK input.
If IDT Standard mode has been selected, the EF flag will go LOW on the
rising edge of RCLK that retransmit was initiated (i.e. rising edge of RCLK
while RT is LOW). EF will go back to HIGH on the next rising edge of RCLK,
which signifies that retransmit setup is complete. The next read operation will
access data from the “marked” memory location.
Subsequent retransmit operations may be performed, each time the read
pointer returning to the “marked” location. See Figure 23, Retransmit from
Mark in Double Data Rate Mode (IDT Standard Mode) for the relevant timing
diagram.
WRITE CLOCK (WCLK)
A write cycle is initiated on the rising and/or falling edge of the WCLK input.
If the Write Single Data Rate (WSDR) pin is selected, data will be written only
on the rising edge of WCLK, provided that WEN and WCS are LOW. If the
WSDR is not selected, data will be written on both the rising and falling edge of
WCLK, provided that WEN and WCS are LOW. Data setup and hold times
must be met with respect to the LOW-to-HIGH transition of the WCLK. It is
permissible to stop the WCLK. Note that while WCLK is idle, the FF, IR, and
17
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
PAF flags will not be updated. The write and read clocks can either be
independent or coincident.
WRITE ENABLE (WEN)
When the WEN input is LOW, data may be loaded into the FIFO RAM array
on the rising edge of every WCLK cycle if the device is not full. Data is stored
in the RAM array sequentially and independently of any ongoing read operation.
When WEN is HIGH, no new data is written in the RAM array on each
WCLK cycle.
To prevent data overflow in the IDT Standard mode, FF will go LOW,
inhibiting further write operations. Upon the completion of a valid read cycle,
FF will go HIGH, allowing a write to occur. The FF is updated by two WCLK
cycles + tSKEW after the RCLK cycle.
To prevent data overflow in the FWFT mode, IR will go HIGH, inhibiting
further write operations. Upon the completion of a valid read cycle, IR will go
LOW, allowing a write to occur. The IR flag is updated by two WCLK cycles +
tSKEW after the valid RCLK cycle.
WEN is ignored when the FIFO is full in either IDT Standard mode or
FWFT.
WRITE SINGLE DATA RATE (WSDR)
When the Write Single Data Rate pin is LOW, the write port will be set to
Single Data Rate mode. In this mode, all write operations are based only on
the rising edge of WCLK, provided that WEN and WCS are LOW. When
WSDR is HIGH, the read port will be set to Double Data Rate mode. In this
mode, all write operations are based on both the rising and falling edge of
WCLK, provided that WEN and WCS are LOW, on the rising edge of WCLK.
READ CLOCK (RCLK)
A read cycle is initiated on the rising and/or falling edge of the RCLK input.
If the Read Single Data Rate (RSDR) pin is selected, data will be read only on
the rising edge of RCLK, provided that REN and RCS are LOW. If the RSDR
is not selected, data will be read on both the rising and falling edge of WCLK,
provided that REN and RCS are LOW, on the rising edge of RCLK. Setup and
hold times must be met with respect to the LOW-to-HIGH transition of the
RCLK. It is permissible to stop the RCLK. Note that while RCLK is idle, the EF/
OR and PAE flags will not be updated. Write and Read Clocks can be independent or coincident.
READ ENABLE (REN)
When Read Enable is LOW, data is loaded from the RAM array into the
output register on the rising edge of every RCLK cycle if the device is not
empty.
When the REN input is HIGH, the output register holds the previous data
and no new data is loaded into the output register. The data outputs Q0-Qn
maintain the previous data value.
In IDT Standard mode, every word accessed at Qn, including the first word
written to an empty FIFO, must be requested using REN provided that the
Read Chip Select (RCS) is LOW. When the last word has been read from the
FIFO, the Empty Flag (EF) will go LOW, inhibiting further read operations.
REN is ignored when the FIFO is empty. Once a write is performed, EF will go
HIGH allowing a read to occur. Both RCS and REN must be active LOW for
data to be read out on the rising edge of RCLK.
In FWFT mode, the first word written to an empty FIFO automatically goes
to the outputs Qn, on the third valid LOW-to-HIGH transition of RCLK + tSKEW
after the first write. REN and RCS do not need to be asserted LOW for the First
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
Word to fall through to the output register. All subsequent words require that a
read operation to be executed using REN and RCS. The LOW-to-HIGH
transition of RCLK after the last word has been read from the FIFO will make
Output Ready (OR) go HIGH with a true read (RCLK with REN and RCS
LOW), inhibiting further read operations. REN is ignored when the FIFO is
empty.
READ SINGLE DATA RATE (RSDR)
When the Read Single Data Rate pin is LOW, the read port will be set to
Single Data Rate mode. In this mode, all read operations are based only on
the rising edge of RCLK, provided that REN and RCS are LOW. When RSDR
is HIGH, the read port will be set to Double Data Rate mode. In this mode, all
read operations are based on both the rising and falling edge of RCLK,
provided that REN and RCS are LOW, on the rising edge of RCLK.
SERIAL CLOCK (SCLK)
The serial clock is used to load and read data in the programmable offset
registers. Data from the Serial Input (SI) can be loaded into the offset registers
on the rising edge of SCLK provided that SEN is LOW. Data can be read from
the offset registers via the Serial Output (SO) on the rising edge of SCLK
provided that SREN is LOW. The serial clock can operate at a maximum
frequency of 10MHz and its parameters are different than the FIFO system
clock.
SERIAL ENABLE (SEN)
The SEN input is an enable used for serial programming of the programmable offset registers. It is used in conjunction with SI and SCLK when programming the offset registers. When SEN is LOW, data at the Serial In (SI)
input can be loaded into the offset register, one bit for each LOW-to-HIGH
transition of SCLK.
When SEN is HIGH, the offset registers retain the previous settings and no
offsets are loaded. SEN functions the same way in both IDT Standard and
FWFT modes.
SERIAL READ ENABLE (SREN)
The SREN output is an enable used for reading the value of the programmable offset registers. It is used in conjunction with SI and SCLK when reading
from the offset registers. When SREN is LOW, data can be read out of the offset
register from the SO output, one bit for each LOW-to-HIGH transition of SCLK.
When SREN is HIGH, the reading of the offset registers will stop. Whenever SREN is activated values in the offset registers are read starting from the
first location in the offset registers and not from where the last offset value was
read. SREN functions the same way in both IDT Standard and FWFT modes.
SERIAL IN (SI)
This pin acts as a serial input for loading PAE and PAF offsets into the
programmable offset registers. It is used in conjunction with the Serial Clock
(SCLK) and the Serial Enable (SEN). Data from this input can be loaded into
the offset register, one bit for each LOW-to-HIGH transition of SCLK provided
that SEN is LOW.
SERIAL OUT (SO)
This pin acts as a serial output for reading the values of the PAE and PAF
offsets in the programmable offset registers. It is used in conjunction with the
Serial Clock (SCLK) and the Serial Enable Output (SREN). Data from the
offset register can be read out using this pin, one-bit for each LOW-to-HIGH
transition of SCLK provided that SREN is LOW.
18
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
OUTPUT ENABLE (OE)
When Output Enable is LOW, the parallel output buffers receive data from
the output register. When OE is HIGH, the output data bus (Qn) goes into a
high-impedance state. During Master or Partial Reset the OE is the only input
that can place the output data bus into high-impedance. During reset the RCS
input can be HIGH or LOW and has no effect on the output data bus.
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
OUTPUTS:
DATA OUT (Q0-Q19)
(Q0 – Q19) are data outputs for 20-bit wide data, or (Q0 – Q9) are data
outputs for 10-bit wide data.
FULL FLAG (FF/IR)
This is a dual purpose pin. In IDT Standard mode, the Full Flag (FF) function
is selected. When the FIFO is full, FF will go LOW, inhibiting further write
operations. When FF is HIGH, the FIFO is not full. If no reads are performed
after a reset (either MRS or PRS), FF will go LOW after D writes to the FIFO.
If x20 Input or x20 Output bus width is selected, D = 32,768 for the IDT72T2098,
65,536 for the IDT72T20108, 131,072 for the IDT72T20118 and 262,144 for
the IDT72T20128. If both x10 Input and x10 Output bus widths are selected,
D = 65,536 for the IDT72T2098, 131,072 for the IDT72T20108, 262,144 for
the IDT72T20118 and 524,288 for the IDT72T20128. See Figure 10, Write
Cycle and Full Flag Timing (IDT Standard Mode), for the relevant timing
information.
In FWFT mode, the Input Ready (IR) function is selected. IR goes LOW
when memory space is available for writing in data. When there is no longer
any free space left, IR goes HIGH, inhibiting further write operations. If no reads
are performed after a reset (either MRS or PRS), IR will go HIGH after D writes
to the FIFO. If x20 Input or x20 Output bus Width is selected, D = 32,769 for the
IDT72T2098, 65,537 for the IDT72T20108, 131,073 for the IDT72T20118 and
262,145 for the IDT72T20128. If both x10 Input and x10 Output bus Widths are
selected, D = 65,537 for the IDT72T2098, 131,073 for the IDT72T20108,
262,145 for the IDT72T20118 and 524,289 for the IDT72T20128. See Figure
19, Write Timing (FWFT Mode), for the relevant timing information.
The IR status not only measures the contents of the FIFO memory, but also
counts the presence of a word in the output register. Thus, in FWFT mode, the
total number of writes necessary to deassert IR is one greater than needed to
assert FF in IDT Standard mode.
FF/IR is synchronous and updated on the rising edge of WCLK. FF/IR are
double register-buffered outputs.
Note, when the device is in Retransmit mode, this flag is a comparison of the
write pointer to the “marked” location. This differs from normal mode where this
flag is a comparison of the write pointer to the read pointer.
READ CHIP SELECT (RCS)
The Read Chip Select input provides synchronous control of the Read
output port. When RCS goes LOW, the next rising edge of RCLK causes the
Qn outputs to go to the low-impedance state. When RCS goes HIGH, the next
RCLK rising edge causes the Qn outputs to return to high-impedance. During
a Master or Partial Reset the RCS input has no effect on the Qn output bus, OE
is the only input that provides high-impedance control of the Qn outputs. If OE
is LOW, the Qn data outputs will be low-impedance regardless of RCS until the
first rising edge of RCLK after a reset is complete. Then if RCS is HIGH the
data outputs will go to high-impedance.
The RCS input does not effect the operation of the flags. For example, when
the first word is written to an empty FIFO, the EF will still go from LOW to HIGH
based on a rising edge of RCLK, regardless of the state of the RCS input.
Also, when operating the FIFO in FWFT mode the first word written to an
empty FIFO will still be clocked through to the output register based on RCLK,
regardless of the state of RCS. For this reason the user should pay extra
attention when a data word is written to an empty FIFO in FWFT mode. If RCS
is HIGH when an empty FIFO is written into, the first word will fall through to the
output register but will not be available on the Qn outputs because they are in
high-impedance. The user must take RCS active LOW to access this first word,
placing the output bus in low-impedance. REN must remain HIGH for at least
one cycle after RCS has gone LOW. A rising edge of RCLK with RCS and
REN LOW will read out the next word. Care must be taken so as not to lose the
first word written to an empty FIFO when RCS is HIGH. Refer to Figure 22,
RCS and REN Read Operation (FWFT Mode). The RCS pin must also be
active (LOW) in order to perform a Retransmit. See Figure 18 for Read Cycle
and Read Chip Select Timing (IDT Standard Mode). See Figure 21 for Read
Cycle and Read Chip Select Timing (FWFT Mode).
WRITE CHIP SELECT (WCS)
The WCS disables all Write Port inputs (data only) if it is held HIGH. To
perform normal operations on the write port, the WCS must be enabled.
EMPTY FLAG (EF/OR)
This is a dual-purpose pin. In the IDT Standard mode, the Empty Flag (EF)
function is selected. When the FIFO is empty, EF will go LOW, inhibiting further
read operations. When EF is HIGH, the FIFO is not empty. See Figure 12, Read
Cycle, Empty Flag and First Word Latency Timing (IDT Standard Mode), for
the relevant timing information.
In FWFT mode, the Output Ready (OR) function is selected. OR goes LOW
at the same time that the first word written to an empty FIFO appears valid on
the outputs. OR stays LOW after the RCLK LOW to HIGH transition that shifts the
last word from the FIFO memory to the outputs. OR goes HIGH only with a true
read (RCLK with REN = LOW). The previous data stays at the outputs, indicating
the last word was read. Further data reads are inhibited until OR goes LOW
again. See Figure 20, Read Timing (FWFT Mode), for the relevant timing
information.
EF/OR is synchronous and updated on the rising edge of RCLK.
In IDT Standard mode, EF is a double register-buffered output. In FWFT
mode, OR is a triple register-buffered output.
HSTL SELECT (HSTL)
The inputs that were listed in Table 6 can be setup to be either HSTL or
LVTTL. If HSTL is HIGH, then HSTL operation of those signals will be selected. If HSTL is LOW , then LVTTL will be selected.
BUS-MATCHING (IW, OW)
The pins IW, and OW are used to define the input and output bus widths.
During Master Reset, the state of these pins is used to configure the device bus
sizes. See Table 1 for control settings. All flags will operate on the word/byte
size boundary as defined by the selection of bus width. See Table 7 for BusMatching Write to Read Ratio.
FLAG SELECT BITS (FSEL0 and FSEL1)
These pins will select the four default offset values for the PAE and PAF flags
during Master Reset. The four possible settings are listed on Table 3. Note that
the status of these inputs should not change after Master Reset.
19
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
PROGRAMMABLE ALMOST-FULL FLAG (PAF)
The Programmable Almost-Full flag (PAF) will go LOW when the FIFO
reaches the almost-full condition. In IDT Standard mode, if no reads are
performed after reset (MRS), PAF will go LOW after (D - m) words are written
to the FIFO. If x20 Input or x20 Output bus width is selected, PAF will go LOW
after (32,768-m) writes for the IDT72T2098, (65,536-m) writes for the
IDT72T20108, (131,072-m) writes for the IDT72T20118 and (262,144-m)
writes for the IDT72T20128. If both x10 Input and x10 Output bus widths are
selected, PAF will go LOW after (65,536-m) writes for the IDT72T2098,
(131,072-m) writes for the IDT72T20108, (262,144-m) writes for the
IDT72T20118 and (524,288-m) writes for the IDT72T20128, respectively.
The offset “m” is the full offset value. The default setting for this value is listed in
Table 3.
In FWFT mode, if x20 Input or x20 Output bus width is selected, PAF will go
LOW after (32,769-m) writes for the IDT72T2098, (65,537-m) writes for the
IDT72T20108, (131,073-m) writes for the IDT72T20118 and (262,145-m)
writes for the IDT72T20128. If both x10 Input and x10 Output bus widths are
selected, PAF will go LOW after (65,537-m) writes for the IDT72T2098,
(131,073-m) writes for the IDT72T20108, (262,145-m) writes for the
IDT72T20118 and (524,289-m) writes for the IDT72T20128, respectively.
The offset m is the full offset value. The default setting for this value is listed in
Table 3.
See Figure 29, Programmable Almost-Full Flag Timing (IDT Standard and
FWFT Mode), for the relevant timing information.
Note, when the device is in Retransmit mode, this flag is a comparison of the
write pointer to the “marked” location. This differs from normal mode where this
flag is a comparison of the write pointer to the read pointer.
PROGRAMMABLE ALMOST-EMPTY FLAG (PAE)
The Programmable Almost-Empty flag (PAE) will go LOW when the FIFO
reaches the almost-empty condition. In IDT Standard mode, PAE will go LOW
when there are n words or less in the FIFO. The offset “n” is the empty offset
value. The default setting for this value is stated in the footnote of Table 3.
In FWFT mode, the PAE will go LOW when there are n+1 words or less in
the FIFO. The default setting for this value is stated in Table 3.
See Figure 30, Programmable Almost-Empty Flag Timing (IDT Standard
and FWFT Mode), for the relevant timing information.
ECHO READ CLOCK (ERCLK)
The Echo Read Clock output is provided in both HSTL and LVTTL mode,
selectable via HSTL. The ERCLK is a free-running clock output, it will always
follow the RCLK input regardless of REN and RCS.
The ERCLK output follows the RCLK input with an associated delay. This
delay provides the user with a more effective read clock source when reading
data from the Qn outputs. This is especially helpful at high speeds when
variables within the device may cause changes in the data access times.
These variations in access time maybe caused by ambient temperature, supply voltage, or device characteristics. The ERCLK output also compensates
for any trace length delays between the Qn data outputs and receiving devices inputs.
Any variations effecting the data access time will also have a corresponding
effect on the ERCLK output produced by the FIFO device, therefore the
ERCLK output level transitions should always be at the same position in time
relative to the data outputs. Note, that ERCLK is guaranteed by design to be
slower than the slowest Qn, data output. Refer to Figure 4, Echo Read Clock
and Data Output Relationship, Figure 27, Echo Read Clock & Read Enable
Operation in Double Data Rate Mode and Figure 28, Echo RCLK & Echo
REN Operation for timing information.
ECHO READ ENABLE (EREN)
The Echo Read Enable output is provided in both HSTL and LVTTL mode,
selectable via HSTL.
The EREN output is provided to be used in conjunction with the ERCLK
output and provides the reading device with a more effective scheme for
reading data from the Qn output port at high speeds. The EREN output is
controlled by internal logic that behaves as follows: The EREN output is active
LOW for the RCLK cycle that a new word is read out of the FIFO. That is, a
rising edge of RCLK will cause EREN to go active, LOW if both REN and RCS
are active, LOW and the FIFO is NOT empty.
RCLK
tERCLK
tERCLK
ERCLK
tA
tD
tA
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
tD
QSLOWEST(3)
5996 drw07
NOTES:
1. REN is LOW.
2. tERCLK > tA, guaranteed by design.
3. Qslowest is the data output with the slowest access time, tA.
4. Time, tD is greater than zero, guaranteed by design.
5. REN = RCS = OE = 0.
Figure 4. Echo Read Clock and Data Output Relationship
20
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
TABLE 7 — BUS-MATCHING WRITE TO READ RATIO
ONE WRITE TO ONE READ (1:1)
x20 DDR Input to x20 DDR Output
Configuration
WSDR
H
RSDR
H
IW
L
x20 SDR Input to x20 SDR Output
Configuration
WSDR
L
OW
L
DDR Write Clock x20 Data In
Positive Edge 1 D[19:0] <= W1
Negative Edge 1 D[19:0] <= W2
RSDR
H
IW
L
SDR Write Clock x20 Data In
Positive Edge 1 D[19:10] <= B1
Positive Edge 1 D[9:0] <= B2
RSDR
H
IW
H
OW
L
x10 DDR Input to x20 SDR Output
Configuration
WSDR
H
OW
H
IW
H
OW
L
SDR Read Clock x20 Data Out
Positive Edge 1 Q[19:10] <= B1
Positive Edge 1 Q[9:0] <= B2
x10 SDR Input to x10 SDR Output
Configuration
WSDR
L
OW
H
DDR Write Clock x10 Data In
Positive Edge 1 D[9:0] <= B1
Negative Edge 1 D[9:0] <= B2
RSDR
L
DDR Write Clock x10 Data In
Positive Edge 1 D[9:0] <= B1
Negative Edge 1 D[9:0] <= B2
DDR Read Clock x10 Data Out
Positive Edge 1 Q[9:0] <= B1
Negative Edge 1 Q[9:0] <= B2
x10 DDR Input to x10 DDR Output
Configuration
WSDR
H
IW
L
SDR Write Clock x20 Data In
SDR Read Clock x20 Data Out
Positive Edge 1 D[19:0] <= W1 Positive Edge 1 Q[19:0] <= W1
DDR Read Clock x20 Data Out
Positive Edge 1 Q[19:0] <= W1
Negative Edge 1 Q[19:0] <= W2
x20 SDR Input to x10 DDR Output
Configuration
WSDR
L
RSDR
L
DDR Read Clock x10 Data Out
Positive Edge 1 Q[9:0] <= B1
Negative Edge 1 Q[9:0] <= B2
RSDR
L
IW
H
SDR Write Clock x10 Data In
Positive Edge 1 D[9:0] <= B1
OW
H
SDR Read Clock x10 Data Out
Positive Edge 1 Q[9:0] <= B1
ONE WRITE TO TWO READ (1:2)
x20 DDR Input to x20 SDR Output
Configuration
WSDR
H
RSDR
L
IW
L
x20 SDR Input to x10 SDR Output
Configuration
WSDR
L
OW
L
DDR Write Clock x20 Data In
Positive Edge 1 D[19:0] <= W1
Negative Edge 1 D[19:0] <= W2
SDR Read Clock x20 Data Out
Positive Edge 1 Q[19:0] <= W1
Positive Edge 2 Q[19:0] <= W2
RSDR
H
DDR Write Clock
Positive Edge 1
Positive Edge 1
Negative Edge 1
Negative Edge 1
IW
L
x20 Data In
D[19:10] <= B1
D[9:0] <= B2
D[19:10] <= B3
D[9:0] <= B4
OW
H
SDR Read Clock x10 Data Out
Positive Edge 1 Q[9:0] <= B1
Positive Edge 2 Q[9:0] <= B2
x10 DDR Input to x10 SDR Output
Configuration
OW
H
DDR Read Clock
Positive Edge 1
Negative Edge 1
Positive Edge 2
Negative Edge 2
IW
L
SDR Write Clock x20 Data In
Positive Edge 1 D[19:10] <= B1
Positive Edge 1 D[9:0] <= B2
x20 DDR Input to x10 DDR Output
Configuration
WSDR
H
RSDR
L
WSDR
H
x10 Data Out
Q[9:0] <= B1
Q[9:0] <= B2
Q[9:0] <= B3
Q[9:0] <= B4
RSDR
L
IW
H
OW
H
DDR Write Clock x10 Data In
SDR Read Clock x10 Data Out
Positive Edge 1 D[19:10] <= B1 Positive Edge 1 Q[9:0] <= B1
Negative Edge 1 D[9:0] <= B2 Positive Edge 2 Q[9:0] <= B2
21
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
TABLE 7 — BUS-MATCHING WRITE TO READ RATIO (CONTINUED)
ONE WRITE TO FOUR READ (1:4)
x20 DDR Input to x10 SDR Output
Configuration
WSDR
H
RSDR
L
DDR Write Clock
Positive Edge 1
Positive Edge 1
Negative Edge 1
Negative Edge 1
IW
L
x20 Data In
D[19:10] <= B1
D[9:0] <= B2
D[19:10] <= B3
D[9:0] <= B4
OW
L
SDR Read Clock
Positive Edge 1
Positive Edge 2
Positive Edge 3
Positive Edge 4
x10 Data Out
Q[9:0] <= B1
Q[9:0] <= B2
Q[9:0] <= B3
Q[9:0] <= B4
TWO WRITE TO ONE READ (2:1)
x20 SDR Input to x20 DDR Output
Configuration
WSDR
L
RSDR
H
IW
L
x10 DDR Input to x20 DDR Output
Configuration
WSDR
H
OW
L
DDR Write Clock
Positive Edge 1
Negative Edge 1
Positive Edge 2
Negative Edge 2
SDR Write Clock x20 Data In
DDR Read Clock x20 Data Out
Positive Edge 1 D[19:0] <= W1 Positive Edge 1 Q[19:0] <= W1
Positive Edge 2 D[19:0] <= W2 Negative Edge 1 Q[19:0] <= W2
x10 SDR Input to x20 SDR Output
Configuration
WSDR
L
RSDR
L
IW
H
WSDR
L
OW
L
x10 SDR Input to x20 DDR Output
Configuration
SDR Write Clock
Positive Edge 1
Positive Edge 2
Positive Edge 3
Positive Edge 4
IW
H
x10 Data In
D[9:0] <= B1
D[9:0] <= B2
D[9:0] <= B3
D[9:0] <= B4
OW
L
DDR Read Clock
Positive Edge 1
Positive Edge 1
Negative Edge 1
Negative Edge 1
x10 Data In
D[9:0] <= B1
D[9:0] <= B2
D[9:0] <= B3
D[9:0] <= B4
OW
L
DDR Read Clock
Positive Edge 1
Postive Edge 1
Negative Edge 1
Negative Edge 1
x20 Data Out
Q[19:10] <= B1
Q[9:0] <= B2
Q[19:10] <= B3
Q[9:0] <= B4
RSDR
H
IW
H
OW
H
DDR Write Clock x10 Data In
SDR Read Clock x10 Data Out
Positive Edge 1 D[9:0] <= B1 Positive Edge 1 Q[9:0] <= B1
Positive Edge 2 D[9:0] <= B3 Negative Edge 1 Q[9:0] <= B3
FOUR WRITE TO ONE READ (4:1)
RSDR
H
IW
H
x10 SDR Input to x10 DDR Output
Configuration
SDR Write Clock x10 Data In
SDR Read Clock x20 Data Out
Positive Edge 1 D[19:10] <= B1 Positive Edge 1 Q[19:10] <= B1
Positive Edge 2 D[9:0] <= B2
Positive Edge 1 Q[9:0] <= B2
WSDR
L
RSDR
H
x20 Data Out
Q[19:10] <= B1
Q[9:0] <= B2
Q[19:0] <= B3
Q[9:0] <= B4
22
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
TABLE 8 — TSKEW MEASUREMENT
Data Port
Configuration
DDR Input
to
DDR Output
DDR Input
to
SDR Output
Status Flags
TSKEW Measurement
EF & PAE
Negative Edge WCLK to
Positive Edge RCLK
FF & PAF
Negative Edge RCLK to
Positive Edge WCLK
Negative Edge WCLK to
Positive Edge RCLK
EF & PAE
FF & PAF
SDR Input
to
DDR Output
EF & PAE
FF & PAF
SDR Input
to
SDR Output
EF & PAE
FF & PAF
Positive Edge RCLK to
Positive Edge WCLK
Positive Edge WCLK to
Positive Edge RCLK
Negative Edge RCLK to
Positive Edge WCLK
Positive Edge WCLK to
Positive Edge RCLK
Positive Edge RCLK to
Positive Edge WCLK
23
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
JTAG TIMING SPECIFICATION
tTCK
t4
t1
t2
TCK
t3
TDI/
TMS
tDS
tDH
TDO
TDO
tDO
t6
TRST
5996 drw08
Notes to diagram:
t1 = tTCKLOW
t2 = tTCKHIGH
t3 = tTCKFALL
t4 = tTCKRISE
t5 = tRST (reset pulse width)
t6 = tRSR (reset recovery)
t5
Figure 5. Standard JTAG Timing
JTAG
AC ELECTRICAL CHARACTERISTICS
(vcc = 2.5V ± 5%; Tcase = 0°C to +85°C)
Parameter
Symbol
SYSTEM INTERFACE PARAMETERS
Min.
IDT72T2098
IDT72T20108
IDT72T20118
IDT72T20128
Test Conditions
Parameter
Symbol
Data Output
tDO(1)
-
20
ns
Data Output Hold
tDOH(1)
0
-
ns
Data Input
tDS
tDH
10
10
-
ns
trise=3ns
tfall=3ns
Min.
Test
Conditions
Max. Units
NOTE:
1. 50pf loading on external output signals.
JTAG Clock Input Period tTCK
-
100
-
ns
JTAG Clock HIGH
tTCKHIGH
-
40
-
ns
JTAG Clock Low
tTCKLOW
-
40
-
ns
JTAG Clock Rise Time
tTCKRISE
-
-
5(1)
ns
JTAG Clock Fall Time
tTCKFALL
-
-
5(1)
ns
JTAG Reset
tRST
-
50
-
ns
JTAG Reset Recovery
tRSR
-
50
-
ns
NOTE:
1. Guaranteed by design.
24
Max. Units
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
The Standard JTAG interface consists of four basic elements:
Test Access Port (TAP)
TAP controller
Instruction Register (IR)
Data Register Port (DR)
JTAG INTERFACE
•
•
•
•
Five additional pins (TDI, TDO, TMS, TCK and TRST) are provided to
support the JTAG boundary scan interface. The IDT72T2098/72T20108/
72T20118/72T20128 incorporates the necessary tap controller and modified
pad cells to implement the JTAG facility.
Note that IDT provides appropriate Boundary Scan Description Language
program files for these devices.
The following sections provide a brief description of each element. For a
complete description refer to the IEEE Standard Test Access Port Specification
(IEEE Std. 1149.1-1990).
The Figure below shows the standard Boundary-Scan Architecture
DeviceID Reg.
Mux
Boundary Scan Reg.
Bypass Reg.
TDO
TDI
T
A
TMS
TCLK
TRST
P
TAP
Controller
clkDR, ShiftDR
UpdateDR
Instruction Decode
clklR, ShiftlR
UpdatelR
Instruction Register
Control Signals
5996 drw09
Figure 6. Boundary Scan Architecture
THE TAP CONTROLLER
The Tap controller is a synchronous finite state machine that responds to
TMS and TCLK signals to generate clock and control signals to the Instruction
and Data Registers for capture and update of data.
TEST ACCESS PORT (TAP)
The Tap interface is a general-purpose port that provides access to the
internal of the processor. It consists of four input ports (TCLK, TMS, TDI, TRST)
and one output port (TDO).
25
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
1
Test-Logic
Reset
0
0
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
Run-Test/
Idle
1
SelectDR-Scan
1
SelectIR-Scan
1
0
1
0
Capture-IR
1
Capture-DR
0
0 0
Shift-DR
1
Input = TMS
EXit1-DR
1
1
0
1
Exit2-DR
Exit2-IR
0
1
1
Update-DR
0
0
Pause-IR
1
1
1
Exit1-IR
0 0
Pause-DR
0
0
Shift-IR
Update-IR
1
0
5996 drw10
NOTES:
1. Five consecutive TCK cycles with TMS = 1 will reset the TAP.
2. TAP controller does not automatically reset upon power-up. The user must provide a reset to the TAP controller (either by TRST or TMS).
3. TAP controller must be reset before normal FIFO operations can begin.
Figure 7. TAP Controller State Diagram
Capture-IR In this controller state, the shift register bank in the Instruction
Register parallel loads a pattern of fixed values on the rising edge of TCK. The
last two significant bits are always required to be “01”.
Shift-IR In this controller state, the instruction register gets connected
between TDI and TDO, and the captured pattern gets shifted on each rising edge
of TCK. The instruction available on the TDI pin is also shifted in to the instruction
register.
Exit1-IR This is a controller state where a decision to enter either the PauseIR state or Update-IR state is made.
Pause-IR This state is provided in order to allow the shifting of instruction
register to be temporarily halted.
Exit2-DR This is a controller state where a decision to enter either the ShiftIR state or Update-IR state is made.
Update-IR In this controller state, the instruction in the instruction register is
latched in to the latch bank of the Instruction Register on every falling edge of
TCK. This instruction also becomes the current instruction once it is latched.
Capture-DR In this controller state, the data is parallel loaded in to the data
registers selected by the current instruction on the rising edge of TCK.
Shift-DR, Exit1-DR, Pause-DR, Exit2-DR and Update-DR These
controller states are similar to the Shift-IR, Exit1-IR, Pause-IR, Exit2-IR and
Update-IR states in the Instruction path.
Refer to the IEEE Standard Test Access Port Specification (IEEE Std.
1149.1) for the full state diagram
All state transitions within the TAP controller occur at the rising edge of the
TCLK pulse. The TMS signal level (0 or 1) determines the state progression
that occurs on each TCLK rising edge. The TAP controller takes precedence
over the FIFO memory and must be reset after power up of the device. See
TRST description for more details on TAP controller reset.
Test-Logic-Reset All test logic is disabled in this controller state enabling the
normal operation of the IC. The TAP controller state machine is designed in such
a way that, no matter what the initial state of the controller is, the Test-Logic-Reset
state can be entered by holding TMS at high and pulsing TCK five times. This
is the reason why the Test Reset (TRST) pin is optional.
Run-Test-Idle In this controller state, the test logic in the IC is active only if
certain instructions are present. For example, if an instruction activates the self
test, then it will be executed when the controller enters this state. The test logic
in the IC is idles otherwise.
Select-DR-Scan This is a controller state where the decision to enter the
Data Path or the Select-IR-Scan state is made.
Select-IR-Scan This is a controller state where the decision to enter the
Instruction Path is made. The Controller can return to the Test-Logic-Reset state
other wise.
26
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
THE INSTRUCTION REGISTER
JTAG INSTRUCTION REGISTER
The Instruction register allows instruction to be serially input into the device
when the TAP controller is in the Shift-IR state. The instruction is decoded to
perform the following:
•
Select test data registers that may operate while the instruction is
current. The other test data registers should not interfere with chip
operation and the selected data register.
•
Define the serial test data register path that is used to shift data between
TDI and TDO during data register scanning.
The Instruction Register is a 4 bit field (i.e.IR3, IR2, IR1, IR0) to decode 16
different possible instructions. Instructions are decoded as follows.
The Instruction register allows an instruction to be shifted in serially into the
processor at the rising edge of TCLK.
The Instruction is used to select the test to be performed, or the test data
register to be accessed, or both. The instruction shifted into the register is latched
at the completion of the shifting process when the TAP controller is at UpdateIR state.
The instruction register must contain 4 bit instruction register-based cells
which can hold instruction data. These mandatory cells are located nearest the
serial outputs they are the least significant bits.
Hex
Value
0x02
0x01
0x03
0x0F
TEST DATA REGISTER
The Test Data register contains three test data registers: the Bypass, the
Boundary Scan register and Device ID register.
These registers are connected in parallel between a common serial input
and a common serial data output.
The following sections provide a brief description of each element. For a
complete description, refer to the IEEE Standard Test Access Port Specification
(IEEE Std. 1149.1-1990).
Instruction
Function
IDCODE
SAMPLE/PRELOAD
HI-IMPEDANCE
BYPASS
Select Chip Identification data register
Select Boundary Scan Register
JTAG
Select Bypass Register
Table 8. JTAG Instruction Register Decoding
The following sections provide a brief description of each instruction. For
a complete description refer to the IEEE Standard Test Access Port Specification
(IEEE Std. 1149.1-1990).
TEST BYPASS REGISTER
The register is used to allow test data to flow through the device from TDI
to TDO. It contains a single stage shift register for a minimum length in serial path.
When the bypass register is selected by an instruction, the shift register stage
is set to a logic zero on the rising edge of TCLK when the TAP controller is in
the Capture-DR state.
The operation of the bypass register should not have any effect on the
operation of the device in response to the BYPASS instruction.
IDCODE
The optional IDCODE instruction allows the IC to remain in its functional mode
and selects the optional device identification register to be connected between
TDI and TDO. The device identification register is a 32-bit shift register containing
information regarding the IC manufacturer, device type, and version code.
Accessing the device identification register does not interfere with the operation
of the IC. Also, access to the device identification register should be immediately
available, via a TAP data-scan operation, after power-up of the IC or after the
TAP has been reset using the optional TRST pin or by otherwise moving to the
Test-Logic-Reset state.
THE BOUNDARY-SCAN REGISTER
The Boundary Scan Register allows serial data TDI be loaded in to or read
out of the processor input/output ports. The Boundary Scan Register is a part
of the IEEE 1149.1-1990 Standard JTAG Implementation.
SAMPLE/PRELOAD
The required SAMPLE/PRELOAD instruction allows the IC to remain in a
normal functional mode and selects the boundary-scan register to be connected
between TDI and TDO. During this instruction, the boundary-scan register can
be accessed via a date scan operation, to take a sample of the functional data
entering and leaving the IC.
THE DEVICE IDENTIFICATION REGISTER
The Device Identification Register is a Read Only 32-bit register used to
specify the manufacturer, part number and version of the processor to be
determined through the TAP in response to the IDCODE instruction.
IDT JEDEC ID number is 0xB3. This translates to 0x33 when the parity
is dropped in the 11-bit Manufacturer ID field.
For the IDT72T2098/72T20108/72T20118/72T20128, the Part Number
field contains the following values:
Device
IDT72T2098
IDT72T20108
IDT72T20118
IDT72T20128
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
HIGH-IMPEDANCE
The optional High-Impedance instruction sets all outputs (including two-state
as well as three-state types) of an IC to a disabled (high-impedance) state and
selects the one-bit bypass register to be connected between TDI and TDO.
During this instruction, data can be shifted through the bypass register from TDI
to TDO without affecting the condition of the IC outputs.
Part# Field
04AB
04AA
04A9
04A8
BYPASS
The required BYPASS instruction allows the IC to remain in a normal
functional mode and selects the one-bit bypass register to be connected
between TDI and TDO. The BYPASS instruction allows serial data to be
transferred through the IC from TDI to TDO without affecting the operation of
the IC.
31(MSB)
28 27
12 11
1 0(LSB)
Version (4 bits) Part Number (16-bit) Manufacturer ID (11-bit)
0X0
0X33
1
IDT72T2098/108/118/128 JTAG Device Identification Register
27
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
tRS
MRS
tRSS
tRSR
tRSS
tRSR
tRSS
tRSR
REN
WEN
FWFT(2)
tRSS
FSEL0(2),
FSEL1
tRSS
OW,
IW(2)
tHRSS
HSTL(2
tRSS
tRSR
tRSS
tRSR
WSDR
(2)
RSDR(2)
tRSS
RT
tRSS
SEN
tRSS
SREN
tRSF
If FWFT = HIGH, OR = HIGH
EF/OR
If FWFT = LOW, EF = LOW
tRSF
If FWFT = LOW, FF = HIGH
FF/IR
If FWFT = HIGH, IR = LOW
tRSF
PAE
tRSF
PAF
tRSF
OE = HIGH
Q0 - Qn
OE = LOW
5996 drw11
NOTE:
1. During Master Reset the High-Impedance control of the Qn data outputs is provided by OE only, RCS can be HIGH or LOW until the first rising edge of RCLK after Master Reset
is complete.
2. The status of these pins are latched in when the Master Reset pulse is LOW.
Figure 8. Master Reset Timing
28
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
tRS
PRS
tRSS
tRSR
REN
tRSS
tRSR
WEN
tRSS
RT
tRSS
SEN
tRSS
SREN
If FWFT = HIGH, OR = HIGH
tRSF
EF/OR
If FWFT = LOW, EF = LOW
If FWFT = LOW, FF = HIGH
tRSF
FF/IR
If FWFT = HIGH, IR = LOW
tRSF
PAE
tRSF
PAF
tRSF
OE = HIGH
Q0 - Qn
OE = LOW
5995 drw12
NOTE:
1. During Partial Reset the High-Impedance control of the Qn data outputs is provided by OE only, RCS can be HIGH or LOW until the first rising edge of RCLK after Master Reset
is complete.
Figure 9. Partial Reset Timing
29
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
WCLK
1
(1)
tCLK1
tCLKL1
tCLKH1
NO WRITE
2
tSKEW1
tDS
NO WRITE
1
(1)
tSKEW1
tDH
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
2
DX+1
DX
D0 - D19
tWFF
tDH
tDS
tWFF
tWFF
tWFF
FF
WEN
RCLK
tENS
tENS
tENH
tENH
REN
tENS
RCS
tA
Q0 - Q19
tA
DATA READ
NEXT DATA READ
5996 drw13
tRCSLZ
NOTES:
1. tSKEW1 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that FF will go HIGH (after one WCLK cycle plus tWFF). If the time between the
rising edge of the RCLK and the rising edge of the WCLK is less than tSKEW1, then the FF deassertion may be delayed one extra WCLK cycle.
2. OE = LOW, EF = HIGH.
3. WCS = LOW.
4. WCLK must be free running for FF to update.
Figure 10. Write Cycle and Full Flag Timing (IDT Standard Mode)
30
Data in Output Register
tENS
tA
tENH
tA
Data Read
tSKEW2(1)
1
2
Next Data Read
tWFF
tDS
Dx
tCLKL2
Dx+1
tDH
tCLK2
tDS
tWFF
tDH
tCLKH2
tENS
tA
tENH
tA
Next Data
tSKEW2(1)
1
NO WRITE
2
Next Data Read
tWFF
Dx+2
tDS
tDH
Dx+3
tDS
tWFF
tDH
5996 drw14
31
Figure 11. Write Cycle and Full Flag Timing in Double Data Rate Mode (IDT Standard Mode)
NOTES:
1. tSKEW2 is the minimum time between a falling RCLK edge and a rising WCLK edge to guarantee that FF will go HIGH (after one WCLK cycle plus tWFF). If the time between the falling edge of the RCLK and the rising edge of WCLK
is less than tSKEW2, then FF deassertion may be delayed one extra WCLK cycle.
2. OE = LOW, EF = HIGH.
3. WCS = LOW, RCS = LOW, WSDR = HIGH and RSDR = HIGH.
4. WCLK must be free running for FF to update.
Q0-Q19
REN
RCLK
WEN
FF
D0-D19
WCLK
NO WRITE
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
tCLKH1
1
RCLK
tENS
tCLK1
tCLKL1
2
tENS
tENH
REN
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
tENH
tENS
tENH
NO OPERATION
NO OPERATION
tREF
tREF
tREF
EF
tA
tA
LAST WORD
Q0 - Q19
tOLZ
LAST WORD
tOHZ
tOE
tA
D0
D1
tOLZ
OE
(1)
tSKEW1
WCLK
tENH
tENS
tENS
tENH
WEN
tWCSS
tWCSH
WCS
tDS
D0 - D19
D0
tDH
tDS
tDH
D1
5996 drw15
NOTES:
1. tSKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus tREF). If the time between the
rising edge of WCLK and the rising edge of RCLK is less than tSKEW1, then EF deassertion may be delayed one extra RCLK cycle.
2. First data word latency = tSKEW1 + 1*TRCLK + tREF.
3. RCS is LOW.
4. RCLK must be free running for EF to update.
Figure 12. Read Cycle, Output Enable, Empty Flag and First Data Word Latency (IDT Standard Mode)
32
33
tOLZ
tOE
tA
tREF
Dn-1
tA
tDS
tWCSS
tENS
D0
tDH
tWCSH
tDS
tENH
Dn
D1
tDH
NO Read
tSKEW2(1)
tOHZ
1
NO Read
tOLZ
2
tREF
tCLKH2
tCLK2
Dn
tCLKL2
tA
tREF
D0
tA
D1
NO Read
5996 drw16
Figure 13. Read Cycle, Output Enable, Empty Flag and First Data Word Latency in Double Data Rate Mode (IDT Standard Mode)
NOTES:
1. tSKEW2 is the minimum time between a falling WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus tREF). If the time between the falling edge of WCLK and the rising edge of RCLK
is less than tSKEW2, then EF deassertion may be delayed one extra RCLK cycle.
2. REN = LOW.
3. First data word latency = tSKEW1 + 1*tRCLK + tREF.
4. RCS = LOW, WSDR = HIGH and RSDR = HIGH.
5. RCLK must be free running for EF to update.
D0-D19
WCS
WEN
WCLK
OE
Q0-Q19
EF
RCLK
NO Read
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
34
tDS
tWCSS
tENS
W0 - W1
tDH
1
W2 - W3
tDS
twcSH
tENH
tDH
Previous Data in Ouput Register
tSKEW2(1)
tREF
2
tENS
tA
W0
tA
W1
tA
W2
tA
tREF
tENH
5996 drw17
W3
Figure 14. Read Cycle, Empty Flag and First Data Word Latency in x20 DDR to x10 SDR with Bus-Matching and Rate-Matching (IDT Standard Mode)
NOTES:
1. tSKEW2 is the minimum time between a falling WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus tREF). If the time between the falling edge of WCLK and the rising edge of RCLK
is less than tSKEW2, then EF deassertion may be delayed one extra RCLK cycle.
2. REN = LOW.
3. First data word latency = tSKEW1 + 1*tRCLK + tREF.
4. RCS = LOW, WSDR = HIGH and RSDR = HIGH.
5. RCLK must be free running for EF to update.
D0-D19
WCS
WEN
WCLK
Q0-Q9
EF
REN
RCLK
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
35
tDS
W0
tDH
Previous Data
tENS
tA
tA
tDS
Last
Word
tREF
tENH
W1
tDH
tDS
W2
tDH
tDS
W3
tDH
tENH
Last 20-bit Word
tSKEW(1)
1
2
tCLK2
tREF
tCLKH2
tENS
tCLKL2
tA
tREF
tENH
tA
W0-W1
5996 drw18
W2-W3
Figure 15. Read Cycle and Empty Flag in x10 SDR to x20 DDR with Bus-Matching and Rate-Matching (IDT Standard Mode)
NOTES:
1. tSKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus tREF). If the time between the rising edge of WCLK and the rising edge of RCLK is
less than tSKEW1, then EF deassertion may be delayed one extra RCLK cycle.
2. OE = LOW.
3. First data word latency = tSKEW1 + 1*tRCLK + tREF.
4. RCS = LOW, WCS = LOW, WSDR = LOW and RSDR = HIGH.
5. RCLK must be free running for EF to update.
D0-D9
WEN
WCLK
Q0-Q19
EF
REN
RCLK
NO Read
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
36
tRCSLZ
tENS
tENS
tSKEW1(1)
tENH
tA
1
tWFF
2
tDS
tWFF
Wx+1
tDS
tDH
tCLKL2
tCLK2
DATA READ
Wx
tDH
tCLKH2
tENS
tSKEW1(1)
tENH
tA
1
NO WRITE
tWFF
2
Wx+3
tDS
tWFF
Wx+2
tDH
NEXT DATA READ
tDS
5996 drw19
tDH
Figure 16. Write Cycle and Full Flag Timing in x10 DDR to x20 SDR with Bus-Matching and Rate-Matching (IDT Standard Mode)
NOTES:
1. tSKEW1 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that FF will go HIGH (after one WCLK cycle plus tWFF). If the time between the rising edge of the RCLK and the rising edge of the
WCLK is less than tSKEW1, then the FF deassertion may be delayed one extra WCLK cycle.
2. OE = LOW, EF = HIGH.
3. WCS = LOW.
4. WCLK must be free running for FF to update.
Q0-Q19
RCS
REN
RCLK
WEN
FF
D0-D9
WCLK
NO WRITE
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
tRCSLZ
tENS
tENS
tENH
tA
tA
DATA
READ
tSKEW2(1)
1
tWFF
2
tDS
DATA READ
Wx
tDH
tCLKH1
tDS
tCLKH1
tCLK1
tWFF
Wx+1
tDH
tENS
tENH
tA
tA
NEXT DATA
READ
tSKEW2(1)
NO WRITE
1
tDS
tENS
NEXT DATA READ
tWFF
2
tDH
tRCSHZ
Wx+2
tDH
tWFF
Wx+3
tDS
5996 drw20
37
Figure 17. Write Cycle and Full Flag in x20 SDR to x10 DDR (IDT Standard Mode)
NOTES:
1. tSKEW2 is the minimum time between a falling RCLK edge and a rising WCLK edge to guarantee that FF will go HIGH (after one WCLK cycle plus tWFF). If the time between the falling edge of the RCLK and the rising edge of WCLK
is less than tSKEW2, then FF deassertion may be delayed one extra WCLK cycle.
2. OE = LOW, EF = HIGH.
3. WCS = LOW, RCS = LOW, WSDR = HIGH and RSDR = HIGH.
4. WCLK must be free running for FF to update.
Q0-Q9
RCS
REN
RCLK
WEN
FF
D0-D19
WCLK
NO WRITE
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
2
1
RCLK
tENS
REN
tENS
tENS
tENH
tENS
RCS
tREF
tREF
EF
tRCSLZ
Q0 - Qn
tRCSHZ
tA
tRCSLZ
tRCSHZ
tA
LAST DATA-1
LAST DATA
tSKEW1(1)
WCLK
tENS
tENH
WEN
tDS
Dn
tDH
Dx
5996 drw21
NOTES:
1. tSKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus tREF). If the time between the
rising edge of WCLK and the rising edge of RCLK is less than tSKEW1, then EF deassertion may be delayed one extra RCLK cycle.
2. First data word latency = tSKEW1 + 1*TRCLK + tREF.
3. OE is LOW.
4. RCLK must be free running for EF to update.
Figure 18. Read Cycle and Read Chip Select (IDT Standard Mode)
38
39
W1
W2
1
tENS
tSKEW1(1)
tDH
2
tRCSLZ
W3
PREVIOUS DATA IN OUTPUT REGISTER
tDS
tENS
3
tREF
tA
W4
tDS
W[n +2]
W[n+3]
1
tPAES
tSKEW2 (2)
2
W[n+4]
W[
D-1 +1
2
]
tDS
W[
D-1 +2
2
]
W[
D-1 +3
2
]
W1
W[D-m-2]
tDS
W[D-m-1]
W[D-m]
1
tPAFS
W[D-m+1]
W[D-m+2]
W[D-1]
WD
5996 drw22
tWFF
tENH
Figure 19. Write Timing (FWFT Mode)
NOTES:
1. tSKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that OR will go LOW after two RCLK cycles plus tREF. If the time between the rising edge of WCLK and the rising edge of RCLK
is less than tSKEW1, then OR assertion may be delayed one extra RCLK cycle.
2. tSKEW2 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that PAE will go HIGH after one RCLK cycle plus tPAES. If the time between the rising edge of WCLK and the rising edge of RCLK
is less than tSKEW2, then the PAE deassertion may be delayed one extra RCLK cycle.
3. OE = LOW
4. n = PAE offset, m = PAF offset and D = maximum FIFO depth.
5. D = 16,385 for IDT72T2098, 32,769 for IDT72T20108, 65,537 for IDT72T20118, 131,073 for IDT72T20128.
6. First data word latency = tSKEW1 + 2*TRCLK + tREF.
IR
PAF
PAE
OR
Q0 - Qn
REN
RCS
RCLK
D0 - Dn
WEN
WCLK
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
40
tDS
tENS
W1
tOHZ
WD
tENS
tWFF
tDH
tENH
W1
tOE
tA
W2
1
(1)
tSKEW1
tA
2
tWFF
W3
(2)
Wm+2
tSKEW2
W[m+3]
tA
tPAFS
W[m+4]
W[
2
D-1 + 1
]
W[
tA
2
D-1 + 2
]
W[D-n-1]
tA
W[D-n]
1
tPAES
W[D-n+1]
W[D-n+2]
W[D-1]
tA
tENS
WD
5996 drw23
tREF
Figure 20. Read Timing (FWFT Mode)
NOTES:
1. tSKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that OR will go LOW after two RCLK cycles plus tREF. If the time between the rising edge of WCLK and the rising edge of RCLK
is less than tSKEW1, then OR assertion may be delayed one extra RCLK cycle.
2. tSKEW2 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that PAE will go HIGH after one RCLK cycle plus tPAES. If the time between the rising edge of WCLK and the rising edge of RCLK
is less than tSKEW2, then the PAE deassertion may be delayed one extra RCLK cycle.
3. OE = LOW
4. n = PAE offset, m = PAF offset and D = maximum FIFO depth.
5. D = 16,385 for IDT72T2098, 32,769 for IDT72T20108, 65,537 for IDT72T20118, 131,073 for IDT72T20128.
6. First data word latency = tSKEW1 + 2*TRCLK + tREF.
IR
PAF
PAE
OR
Q0 - Qn
OE
REN
RCLK
D0 - Dn
WEN
WCLK
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
41
tDS
tENS
W1
WD
tENS
tRCSHZ
tENH
tENS
tWFF
tDH
tENH
W2
tRCSLZ
1
(1)
tSKEW1
tA
2
tWFF
W3
(2)
Wm+2
tSKEW2
W[m+3]
tA
tPAFS
W[m+4]
+ 1]
W [ D-1
2
+ 2]
W [ D-1
2
tA
W[D-n-1]
tA
W[D-n]
1
tPAES
W[D-n+1]
W[D-n+2]
W[D-1]
tA
tENS
WD
5996 drw24
tREF
Figure 21. Read Cycle and Read Chip Select Timing (FWFT Mode)
NOTES:
1. tSKEW1 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that IR will go LOW after one WCLK cycle plus tWFF. If the time between the rising edge of RCLK and the rising edge of WCLK is
less than tSKEW1, then the IR assertion may be delayed one extra WCLK cycle.
2. tSKEW2 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that PAF will go HIGH after one WCLK cycle plus tPAFS. If the time between the rising edge of RCLK and the rising edge of WCLK
is less than tSKEW2, then the PAF deassertion may be delayed one extra WCLK cycle.
3. n = PAE Offset, m = PAF offset and D = maximum FIFO depth.
4. D = 16,385 for IDT72T2098, 32,769 for IDT72T20108, 65,537 for IDT72T20118, 131,073 for IDT72T20128.
5. OE = LOW.
6. RCLK must be free running for EF to update.
IR
PAF
PAE
OR
Q0 - Qn
RCS
REN
RCLK
D0 - Dn
WEN
WCLK
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
HIGH-Z
tDS
tENS
W1
tDH
tSKEW
tDS
1
W2
tDH
tENH
2
tREF
3
1st Word falls through to
O/P register on this cycle
tENS
tRCSLZ
W1
tENS
tA
tENH
W2
tENS
tRCSHZ
tENH
tENS
tENS
tRCSLZ
tREF
W2
5996 drw25
42
Figure 22 . RCS and REN Read Operation (FWFT Mode)
NOTES:
1. It is very important that the REN be held HIGH for at least one cycle after RCS has gone LOW. If REN goes LOW on the same cycle as RCS or earlier, then Word, W1 will be lost, Word, W2 will be read on the output when the
bus goes to LOW-Z.
2. The 1st Word will fall through to the output register regardless of REN and RCS. However, subsequent reads require that both REN and RCS be active, LOW.
3. RCS functions similarly to OE, when RCS is HIGH the read pointer will not increment.
Dn
WEN
WCLK
Qn
OR
RCS
REN
RCLK
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
43
WMK
tENS
tENH
tA
WMK+2
tA
WMK+1
tA
WMK+3
tA
WMK+4
tENS
tA
WMK+6
tA
WMK+5
tENS
tSKEW2
tREF
tENH
1
tREF
WMK+n
tCLK2
tENS
Figure 23 . Retransmit from MARK in Double Data Rate Mode (IDT Standard Mode)
tPAES(7)
tA
2
tPAFS
2
tCLKL2
NOTES:
1. Retransmit setup is complete when EF returns HIGH.
2. OE = LOW;RCS = LOW.
3. RT must be HIGH when reading from FIFO.
4. Once MARK is set, the write pointer will not increment past the ‘marked’ location, preventing overwrites of Retransmit data.
5. Before a “MARK” can be set there must be at least 160 bytes of data between the Write Pointer and Read Pointer locations. (160 bytes = 16 words = 8 long words).
6. RCLK must be free running for EF to update.
7. A transition in the PAE flag may not occur until one RCLK cycle later than shown.
8. In DDR mode the MARK function will “MARK” words only on even word boundaries (i.e. Rising edge of RCLK).
PAF
WCLK
PAE
EF
RT
MARK
Q0-Qn
REN
RCLK
1
tCLKH2
tA
WMK
tA
WMK+1
tA
5996 drw26
WMK+2
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
44
WMK-1
tENS
tA
tENS
WMK
tENH
tA
WMK+1
tA
tA
tENS
tENS
tENS
WMK+n
1
tSKEW2
tREF
tENH
2
tPAFS
tA
1
tREF
Figure 24. Retransmit from Mark (FWFT Mode)
NOTES:
1. Retransmit setup is complete when OR returns LOW.
2. OE = LOW;RCS = LOW.
3. RT must be HIGH when reading from FIFO.
4. Once MARK is set, the write pointer will not increment past the ‘marked’ location, preventing overwrites of Retransmit data.
5. Before a “MARK” can be set there must be at least 160 bytes of data between the Write Pointer and Read Pointer locations. (160 bytes = 16 words = 8 long words).
6. RCLK must be free running for EF to update.
7. A transition in the PAE flag may not occur until one RCLK cycle later than shown.
PAF
WEN
WCLK
PAE
OR
RT
MARK
Qn
REN
RCLK
WMK
tENS
tA
2
tPAES(7)
WMK+1
tA
5996 drw27
WMK+2
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
tSCKH
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
tSCLK
tSCKL
SCLK
tSENH
tSENS
tENH
SEN
tSDH
tSDS
(1)
BIT 1
SI
BIT X
(1)
BIT 1
BIT X
EMPTY OFFSET
5996 drw28
FULL OFFSET
NOTE:
1. In SDR mode, X = 16 for the IDT72T2098, X = 17 for the IDT72T20108, X = 18 for the IDT72T20118, X = 19 for the IDT72T20128 for X10 mode. X = 15 for the IDT72T2098,
X = 16 for the IDT72T20108, X = 17 for the IDT72T20118, X = 18 for the IDT72T20128 for all other modes.
2. In DDR mode, X = 15 for the IDT72T2098, X = 16 for the IDT72T20108, X = 17 for the IDT72T20118, X = 18 for the IDT72T20128 for X10 to X10 mode. X = 14 for the IDT72T2098,
X = 15 for the IDT72T20108, X = 16 for the IDT72T20118, X = 17 for the IDT 72T20128 for all other modes.
Figure 25. Loading of Programmable Flag Registers (IDT Standard and FWFT Modes)
tSCKH
tSCLK
tSCKL
SCLK
tSENH
tSENS
tENH
SREN
tSOA
tSOA
SO
(1)
BIT 0
BIT X
EMPTY OFFSET
(1)
BIT 0
BIT X
FULL OFFSET
5996 drw29
NOTE:
1. In SDR mode, X = 15 for the IDT72T2098, X = 17 for the IDT72T20108, X = 18 for the IDT72T20118, X = 19 for the IDT72T20128 for X10 mode. X = 15 for the IDT72T2098,
X = 16 for the IDT72T20108, X = 17 for the IDT20118, X = 18 for the IDT72T20128 for all other modes.
2. In DDR mode, X = 15 for the IDT72T2098, X = 16 for the IDT72T20108, X = 17 for the IDT72T20118, X = 18 for the IDT20128, for X10 to X10 mode. X = 14 for the IDT72T72098,
X = 15 for the IDT72T20108, X = 16 for the IDT72T20118, X = 17 for the IDT72T20128 for all other modes.
3. Offset register values are always read starting from the first location in the offset register upon initiating SREN.
Figure 26. Reading of Programmable Flag Registers (IDT Standard and FWFT Modes)
45
tOLZ
tENS
WD-10
tA
tCLKEN
tERCLK
WD-9
tA
WD-8
tA
tENH
WD-7
tA
WD-6
tOLZ
tCLKEN
tOLZ
tCLKEN
tENS
WD-6
tA
WD-5
tA
WD-4
tA
tENH
WD-3
tA
WD-2
tCLKEN
tENS
tA
tREF
tCLKEN
tA
WD-1
46
EF
1
1
1
1
0
RCLK
↑
↑
↑
↑
↑
0
0
1
1
X
RCS
0
1
0
1
X
0
1
1
1
1
EREN
Figure 27. Echo Read Clock & Read Enable Operation in Double Data Rate Mode (IDT Standard Mode Only)
REN
Last Word WD
tCLKEN
NO Read
NOTES:
1. The EREN output is “or gated” to RCS and REN and will follow these inputs provided that the FIFO is not empty. If the FIFO is empty, EREN will go HIGH to indicate that there is no new word available.
2. The EREN output is synchronous to RCLK.
3. OE = LOW.
4. The truth table for EREN is shown below:
Qn
EF
EREN
RCS
REN
ERCLK
RCLK
NO Read
5996 drw30
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
WCLK
tENS
tENH
WEN
tDS
tDH
tDS
Wn+1
D0 - Dn
tDH
tDS
Wn+2
tDH
Wn+3
tSKEW1
1
RCLK
2
b
a
e
d
c
h
g
f
i
tERCLK
ERCLK
tENS
REN
tENH
tENS
RCS
tCLKEN
tCLKEN
tCLKEN
tCLKEN
EREN
tRCSLZ
HIGH-Z
Qn
tA
tA
Wn+1
Wn+2
Wn+3
tREF
tREF
OR
tA
tA
O/P
Reg.
Wn Last Word
Wn+1
tA
Wn+2
Wn+3
5996 drw31
NOTE:
1. The O/P Register is the internal output register. Its contents are available on the Qn output bus only when RCS and OE are both active, LOW, that is the bus is not in HighImpedance state.
2. OE is LOW.
Cycle:
a&b. At this point the FIFO is empty, OR is HIGH.
RCS and REN are both disabled, the output bus is High-Impedance.
c.
Word Wn+1 falls through to the output register, OR goes active, LOW.
RCS is HIGH, therefore the Qn outputs are High-Impedance. EREN goes LOW to indicate that a new word has been placed on the output register.
d.
EREN goes HIGH, no new word has been placed on the output register on this cycle.
e.
No Operation.
f.
RCS is LOW on this cycle, therefore the Qn outputs go to Low-Impedance and the contents of the output register (Wn+1) are made available.
NOTE: In FWFT mode is important to take RCS active LOW at least one cycle ahead of REN, this ensures the word (Wn+1) currently in the output register is made
available for at least one cycle.
g.
REN goes active LOW, this reads out the second word, Wn+2.
EREN goes active LOW to indicate a new word has been placed into the output register.
h.
Word Wn+3 is read out, EREN remains active, LOW indicating a new word has been read out.
NOTE: Wn+3 is the last word in the FIFO.
i.
This is the next enabled read after the last word, Wn+3 has been read out. OR flag goes HIGH and EREN goes HIGH to indicate that there is no new word available.
3. OE is LOW.
4. The truth table for EREN is shown below:
RCLK
OR
RCS
REN
EREN
↑
↑
↑
↑
↑
0
0
0
0
1
0
0
1
1
X
0
1
0
1
X
0
1
1
1
1
Figure 28. Echo RCLK and Echo REN Operation (FWFT Mode Only)
47
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
tCLKL1
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
tCLKL1
WCLK
1
2
1
tENS
2
tENH
WEN
tPAFS
PAF
tPAFS
(2)
D-(m+1) words
(2)
in FIFO
D - m words in FIFO
(2)
D - (m +1) words in FIFO
(3)
tSKEW3
RCLK
tENH
tENS
REN
5996 drw32
NOTES:
1. m = PAF offset.
2. D = maximum FIFO Depth.
In IDT Standard mode: if x20 Input or x20 Output bus Width is selected, D = 32,768 for the IDT72T2098, 65,536 for the IDT72T20108, 131,072 for the IDT72T20118, 262,144 for
the IDT72T20128. If both x10 Input and x10 Output bus Widths are selected, D = 65,536 for the IDT72T2098, 131,072 for the IDT72T20108, 262,144 for the IDT72T20118, 524,288
for the IDT72T20128.
In FWFT mode: if x20 Input or x20 Output bus Width is selected, D = 32,769 for the IDT72T2098, 65,537 for the IDT72T20108, 131,073 for the IDT72T20118, 262,145 for the IDT72T20128.
If both x10 Input and x10 Output bus Widths are selected, D = 65,537 for the IDT72T2098, 131,073 for the IDT72T20108, 262,145 for the IDT72T20118, 524,289 for the IDT72T20128.
3. PAF is asserted and updated on the rising edge of WCLK only.
4. tSKEW3 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that PAF will go HIGH (after one WCLK cycle plus tPAFS). If the time between the
rising edge of RCLK and the rising edge of WCLK is less than tSKEW3, then the PAF deassertion time may be delayed one extra WCLK cycle.
5. RCS = LOW.
Figure 29. Programmable Almost-Full Flag Timing (IDT Standard and FWFT Modes)
tCLKH1
tCLKL1
WCLK
tENS
tENH
WEN
(2)
PAE
(2)
n words in FIFO ,
(3)
n + 1 words in FIFO
(4)
tSKEW3
RCLK
1
n words in FIFO ,
(3)
n + 1 words in FIFO
(2)
n + 1 words in FIFO ,
(3)
n + 2 words in FIFO
tPAES
2
tPAES
1
tENS
2
tENH
REN
5996 drw33
NOTES:
1. n = PAE offset.
2. For IDT Standard Mode.
3. For FWFT Mode.
4. PAE is asserted and updated on the rising edge of RCLK only.
5. tSKEW3 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that PAE will go HIGH (after one RCLK cycle plus tPAES). If the time between the
rising edge of WCLK and the rising edge of RCLK is less than tSKEW3, then the PAE deassertion may be delayed one extra RCLK cycle.
6. RCS = LOW.
Figure 30. Programmable Almost-Empty Flag Timing (IDT Standard and FWFT Modes)
48
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
avoided by creating composite flags, that is, ANDing EF of every FIFO, and
separately ANDing FF of every FIFO. In FWFT mode, composite flags can
be created by ORing OR of every FIFO, and separately ORing IR of every
FIFO.
Figure 31 demonstrates a width expansion using two IDT72T2098/
72T20108/72T20118/72T20128 devices. D0 - D19 from each device form a
40-bit wide input bus and Q0-Q19 from each device form a 40-bit wide output
bus. Any word width can be attained by adding additional IDT72T2098/
72T20108/72T20118/72T20128 devices.
OPTIONAL CONFIGURATIONS
WIDTH EXPANSION CONFIGURATION
Word width may be increased simply by connecting together the control
signals of multiple devices. Status flags can be detected from any one device.
The exceptions are the EF and FF functions in IDT Standard mode and the IR
and OR functions in FWFT mode. Because of variations in skew between RCLK
and WCLK, it is possible for EF/FF deassertion and IR/OR assertion to vary
by one cycle between FIFOs. In IDT Standard mode, such problems can be
SERIAL CLOCK (SCLK)
PARTIAL RESET (PRS)
MASTER RESET (MRS)
FIRST WORD FALL THROUGH
(FWFT)
RETRANSMIT (RT)
Dm+1 - Dn
m+n
DATA IN
D0 - Dm
m
n
READ CLOCK (RCLK)
READ CHIP SELECT (RCS)
WRITE CLOCK (WCLK)
READ ENABLE (REN)
WRITE ENABLE (WEN)
FULL FLAG/INPUT READY (FF/IR) #1
IDT
72T2098
72T20108
72T20118
72T20128
IDT
72T2098
72T20108
72T20118
72T20128
PROGRAMMABLE (PAE)
EMPTY FLAG/OUTPUT READY (EF/OR) #1
(1)
GATE
OUTPUT ENABLE (OE)
FULL FLAG/INPUT READY (FF/IR) #2
PROGRAMMABLE (PAF)
(1)
GATE
EMPTY FLAG/OUTPUT READY (EF/OR) #2
FIFO
#1
FIFO
#2
m
n
Qm+1 - Qn
m+n
DATA OUT
Q0 - Qm
NOTES:
1. Use an AND gate in IDT Standard mode, an OR gate in FWFT mode.
2. Do not connect any output control signals directly together.
3. FIFO #1 and FIFO #2 must be the same depth, but may be different word widths.
Figure 31. Block Diagram of Width Expansion
For the x20 Input or x20 Output bus Width: 32,768 x 20, 65,536 x 20, 131,072 x 20 and 262,144 x 20
For both x10 Input and x10 Output bus Widths: 65,536 x 10, 131,072 x 10, 262,144 x 10 and 524,288 x 10
49
5996 drw34
IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS
32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
FWFT
TRANSFER CLOCK
WRITE CLOCK
WRITE ENABLE
INPUT READY
FWFT
WCLK
WEN
IR
FWFT
RCLK
IDT
72T2098
72T20108
72T20118
72T20128
REN
IR
RCS
n
Dn
WEN
Qn
GND
n
READ CLOCK
RCLK
IDT
OR
OE
DATA IN
WCLK
72T2098
72T20108
72T20118
72T20128
RCS
READ CHIP SELECT
READ ENABLE
REN
OR
OUTPUT READY
OE
OUTPUT ENABLE
n
Dn
DATA OUT
Qn
5996 drw35
Figure 32. Block Diagram of Depth Expansion in Single Data Rate Mode
For the x20 Input or x20 Output bus Width: 65,536 x 20, 131,072 x 20, 262,144 x 20 and 524,288 x 20
For both x10 Input and x10 Output bus Widths: 131,072 x 10, 262,144 x 10, 524,288 x 10 and 1,048,576 x 10
DEPTH EXPANSION CONFIGURATION IN SINGLE DATA RATE
(FWFT MODE ONLY)
The IDT72T2098 can easily be adapted to applications requiring depths
greater than 32,768 when the x20 Input or x20 Output bus width is selected,
65,536 for the IDT72T20108, 131,072 for the IDT72T20118 and 262,144 for
the IDT72T20128. When both x10 Input and x10 Output bus widths are
selected, depths greater than 65,536 can be adapted for the IDT72T2098,
131,072 for the IDT72T20108, 262,144 for the IDT72T20118 and 524,288 for
the IDT72T20128. In FWFT mode, the FIFOs can be connected in series (the
data outputs of one FIFO connected to the data inputs of the next) with no external
logic necessary. The resulting configuration provides a total depth equivalent
to the sum of the depths associated with each single FIFO. Figure 32 shows a
depth expansion using two IDT72T2098/72T20108/72T20118/72T20128
devices.
Care should be taken to select FWFT mode during Master Reset for all FIFOs
in the depth expansion configuration. Also, the devices must be operating in
Single Data Rate mode since that is the only mode available in FWFT. The first
word written to an empty configuration will pass from one FIFO to the next ("ripple
down") until it finally appears at the outputs of the last FIFO in the chain – no read
operation is necessary but the RCLK of each FIFO must be free-running. Each
time the data word appears at the outputs of one FIFO, that device's OR line goes
LOW, enabling a write to the next FIFO in line.
For an empty expansion configuration, the amount of time it takes for OR of
the last FIFO in the chain to go LOW (i.e. valid data to appear on the last FIFO's
outputs) after a word has been written to the first FIFO is the sum of the delays
for each individual FIFO:
(N – 1)*(4*transfer clock) + 3*TRCLK
where N is the number of FIFOs in the expansion and TRCLK is the RCLK period.
Note that extra cycles should be added for the possibility that the tSKEW1
specification is not met between WCLK and transfer clock, or RCLK and transfer
clock, for the OR flag.
The "ripple down" delay is only noticeable for the first word written to an empty
depth expansion configuration. There will be no delay evident for subsequent
words written to the configuration.
The first free location created by reading from a full depth expansion
configuration will "bubble up" from the last FIFO to the previous one until it finally
moves into the first FIFO of the chain. Each time a free location is created in one
FIFO of the chain, that FIFO's IR line goes LOW, enabling the preceding FIFO
to write a word to fill it.
For a full expansion configuration, the amount of time it takes for IR of the first
FIFO in the chain to go LOW after a word has been read from the last FIFO is
the sum of the delays for each individual FIFO:
(N – 1)*(3*transfer clock) + 2 TWCLK
where N is the number of FIFOs in the expansion and TWCLK is the WCLK
period. Note that extra cycles should be added for the possibility that the tSKEW1
specification is not met between RCLK and transfer clock, or WCLK and transfer
clock, for the IR flag.
The Transfer Clock line should be tied to either WCLK or RCLK, whichever
is faster. Both these actions result in data moving, as quickly as possible, to the
end of the chain and free locations to the beginning of the chain.
50
ORDERING INFORMATION
IDT
XXXXX
X
XX
X
Device Type
Power
Speed
Package
X
Process /
Temperature
Range
BLANK
I(1)
Commercial (0°C to +70°C)
Industrial (-40°C to +85°C)
BB
Plastic Ball Grid Array (PBGA, BB208-1)
4
5
6-7
10
Commercial Only
Commercial Only
Commercial and Industrial
Commercial Only
L
Low Power
72T2098
72T20108
72T20118
72T20128
32,768 x 20/65,536 x 10 2.5V High-Speed TeraSyncTM DDR/SDR FIFO
65,536 x 20/131,072 x 10 2.5V High-Speed TeraSyncTM DDR/SDR FIFO
131,072 x 20/262,144 x 10 2.5V High-Speed TeraSyncTM DDR/SDR FIFO
262,144 x 20/524,288 x 10 2.5V High-Speed TeraSyncTM DDR/SDR FIFO
Clock Cycle Time (tCLK)
Speed in Nanoseconds
5996 drw36
NOTE:
1. Industrial temperature range product for the 6-7ns speed grade is available as a standard device. All other speed grades are available by special order.
DATASHEET DOCUMENT HISTORY
03/01/2002
04/08/2002
04/24/2002
05/24/2002
11/21/2002
02/11/2003
03/20/2003
12/17/2003
pgs.
pgs.
pgs.
pgs.
pgs.
pgs.
pgs.
pgs.
1, 4, 6, 8, 9, and 22.
1, 8, 9, 11, 32-35, 41, 45-47, and 50.
19, and 27.
2, 6-9, and 12.
1, and 10.
7, 8, and 26.
24, 26, 27, and 43.
10, 30-33, 35-37, 43, and 48.
CORPORATE HEADQUARTERS
2975 Stender Way
Santa Clara, CA 95054
for SALES:
800-345-7015 or 408-727-6116
fax: 408-492-8674
www.idt.com
51
for Tech Support:
408-330-1753
email: [email protected]