AXK(5/6)F For board-to-board For board-to-FPC P5KF Series Narrow pitch connectors (0.5mm pitch) m 3m 3. m 8m 5. Socket 2. Strong resistance to adverse environments! Utilizes “ ” construction for high contact reliability. 3. Simple lock structure provides tactile feedback to ensure excellent mating/unmating operation feel. Header 5. The lower connector bottom surface construction prevents contact and shorts between the PCB and metal terminals. Benefits include freedom in pattern wiring, helping to make PCB’s smaller. <Socket> <Header> Simple lock mechanism RoHS compliant Connector bottom: Create any thru-hole and pattern wiring. 4. Effective mating length 0.55mm In addition to achieving a low profile of 1.5mm between PCBs, the effective mating length has been extended to ensure that there is latitude for insertion. FEATURES 1. Two-piece structure and 0.5mm pitch. The product lineup includes mated heights of 1.5mm, 2.0mm and 2.5mm. 6. Gull-wing-shaped terminals to facilitate visual inspections. APPLICATIONS Digital devices, such as digital still cameras and digital video cameras. 0.55mm ORDERING INFORMATION AXK 4 7 Y G 5F: Narrow Pitch Connector P5KF (0.5 mm pitch) Socket 6F: Narrow Pitch Connector P5KF (0.5 mm pitch) Header Number of pins (2 digits) Mated height <Socket> 3: For mated height 1.5 mm 5: For mated height 2.0 mm and 2.5 mm <Header> 3: For mated height 1.5 mm and 2.0 mm 5: For mated height 2.5 mm Functions 4: Without positioning bosses Surface treatment (Contact portion / Terminal portion) <Socket> 7: Ni plating on base, Au plating on surface/Ni plating on base, Au plating on surface (for Ni barrier available) Contact portion <Socket> Y: V notch type product (chamfered on both ends) <Header> Y: V notch type product Packing G: 2,000 pieces embossed tape and plastic reel × 2 Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ ACCTB23E 201303-T AXK(5/6)F PRODUCT TYPES Part No. Mated height 1.5 mm 2.0 mm 2.5 mm Packing No. of pins Socket Header 10 12 14 16 18 20 22 24 26 30 32 34 40 50 60 70 80 10 12 14 16 18 20 22 24 26 30 34 40 50 60 70 80 100 10 12 14 16 20 22 24 30 34 40 50 60 70 80 100 AXK5F10347YG AXK5F12347YG AXK5F14347YG AXK5F16347YG AXK5F18347YG AXK5F20347YG AXK5F22347YG AXK5F24347YG AXK5F26347YG AXK5F30347YG AXK5F32347YG AXK5F34347YG AXK5F40347YG AXK5F50347YG AXK5F60347YG AXK5F70347YG AXK5F80347YG AXK5F10547YG AXK5F12547YG AXK5F14547YG AXK5F16547YG AXK5F18547YG AXK5F20547YG AXK5F22547YG AXK5F24547YG AXK5F26547YG AXK5F30547YG AXK5F34547YG AXK5F40547YG AXK5F50547YG AXK5F60547YG AXK5F70547YG AXK5F80547YG AXK5F00547YG AXK5F10547YG AXK5F12547YG AXK5F14547YG AXK5F16547YG AXK5F20547YG AXK5F22547YG AXK5F24547YG AXK5F30547YG AXK5F34547YG AXK5F40547YG AXK5F50547YG AXK5F60547YG AXK5F70547YG AXK5F80547YG AXK5F00547YG AXK6F10347YG AXK6F12347YG AXK6F14347YG AXK6F16347YG AXK6F18347YG AXK6F20347YG AXK6F22347YG AXK6F24347YG AXK6F26347YG AXK6F30347YG AXK6F32347YG AXK6F34347YG AXK6F40347YG AXK6F50347YG AXK6F60347YG AXK6F70347YG AXK6F80347YG AXK6F10347YG AXK6F12347YG AXK6F14347YG AXK6F16347YG AXK6F18347YG AXK6F20347YG AXK6F22347YG AXK6F24347YG AXK6F26347YG AXK6F30347YG AXK6F34347YG AXK6F40347YG AXK6F50347YG AXK6F60347YG AXK6F70347YG AXK6F80347YG AXK6F00347YG AXK6F10547YG AXK6F12547YG AXK6F14547YG AXK6F16547YG AXK6F20547YG AXK6F22547YG AXK6F24547YG AXK6F30547YG AXK6F34547YG AXK6F40547YG AXK6F50547YG AXK6F60547YG AXK6F70547YG AXK6F80547YG AXK6F00547YG Inner carton (1-reel) Outer carton 2,000 pieces 4,000 pieces Notes: 1. Regarding ordering units, During production: Please make orders in 1-reel units. Samples for mounting confirmation: Available in units of 50 pieces. Please contact our sales office. Samples: Small lot orders are possible. Please consult us. 2. The standard type comes without positioning bosses. Connectors with positioning bosses are available for on-demand production. 3. The 11th digit “Y” in the socket/header part number indicates the connector has a V notch. (For details, please consult one of our sales offices.) ACCTB23E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ AXK(5/6)F SPECIFICATIONS 1. Characteristics Item Rated current Rated voltage Electrical Breakdown voltage characteristics Insulation resistance Specifications 0.5A/pin contact (Max. 10 A at total pin contacts) 60V AC/DC 150V AC for 1 minute Detection current: 1mA Min. 1,000MΩ (initial) Using 500V DC megger Contact resistance Max. 90mΩ Composite insertion force Mechanical Composite removal force characteristics Contact holding force Min. 0.981N/pin contact –55°C to +85°C Storage temperature Based on the contact resistance measurement method specified by JIS C 5402. Max. 0.981N/pin contacts × pin contacts (initial) Min. 0.0588N/pin contacts × pin contacts Ambient temperature Soldering heat resistance Conditions Max. peak temperature of 260°C (on the surface of the PC board around the connector terminals) 300°C within 5 seconds, 350°C within 3 seconds –55°C to +85°C (product only) –40°C to +50°C (emboss packing) Measuring the maximum force. As the contact is axially pull out. No freezing at low temperatures Infrared reflow soldering Soldering iron No freezing at low temperatures. No dew condensation. Conformed to MIL-STD-202F, method 107G Environmental Thermal shock resistance characteristics (header and socket mated) Humidity resistance (header and socket mated) Saltwater spray resistance (header and socket mated) H2S resistance (header and socket mated) Lifetime Insertion and removal life characteristics 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 120 hours, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 48 hours, contact resistance max. 90mΩ 50 times Order Temperature (°C) 1 –55 −30 2 3 85 +30 4 –55 −30 Time (minutes) 30 Max. 5 30 Max. 5 Bath temperature 40±2°C, humidity 90 to 95% R.H. Bath temperature 35±2°C, saltwarter concentration 5±1% Bath temperature 40±2°C, gas concentration 3±1 ppm, humidity 75 to 80% R.H. Repeated insertion and removal speed of max. 200 times/hours Mated height 1.5mm, 20 pin contacts; Socket: 0.06g Header: 0.04g Unit weight 2. Material and surface treatment Part name Molded portion Material LCP resin (UL94V-0) Contact/Post Copper alloy Panasonic Corporation Surface treatment — Contact portion: Ni plating on base, Au plating on surface Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal) The section close to the soldering portion has a nickel barrier. (The nickel base is exposed.) Automation Controls Business Division industrial.panasonic.com/ac/e/ ACCTB23E 201303-T AXK(5/6)F DIMENSIONS (Unit: mm) The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/ • Socket (Mated height: 1.5mm, 2.0mm, 2.5mm) CAD Data A 0.50±0.05 Dimension table (mm) No. of pins 10 12 14 16 18 20 22 24 26 30 32 34 40 50 60 70 80 100 A 5.50 6.00 6.50 7.00 7.50 8.00 8.50 9.00 9.50 10.50 11.00 11.50 13.00 15.50 18.00 20.50 23.00 28.00 0.10 B±0.1 0.50±0.05 C 0.20±0.03 B 2.00 2.50 3.00 3.50 4.00 4.50 5.00 5.50 6.00 7.00 7.50 8.00 9.50 12.00 14.50 17.00 19.50 24.50 (0.80) 1.70 (Suction face) 4.80 4.20 5.80 (0.80) 0.12±0.03 General tolerance: ±0.2 Mated height 1.5 mm 2.0 mm, 2.5 mm C 1.35 1.85 • Header (Mated height: 1.5mm, 2.0mm, 2.5mm) CAD Data A 0.10 C 1.80 0.12±0.03 3.30 0.50±0.05 0.20±0.03 B 2.00 2.50 3.00 3.50 4.00 4.50 5.00 5.50 6.00 7.00 7.50 8.00 9.50 12.00 14.50 17.00 19.50 24.50 (Suction face) 2.50 A 5.50 6.00 6.50 7.00 7.50 8.00 8.50 9.00 9.50 10.50 11.00 11.50 13.00 15.50 18.00 20.50 23.00 28.00 0.96 No. of pins 10 12 14 16 18 20 22 24 26 30 32 34 40 50 60 70 80 100 (0.75) 0.50±0.05 Dimension table (mm) (0.75) B±0.1 General tolerance: ±0.2 Mated height 1.5 mm, 2.0 mm 2.5 mm • Socket and header are mated Mated height: 1.5 mm 1.50±0.15 ACCTB23E 201303-T Panasonic Corporation Mated height: 2.0 mm 2.00±0.15 Automation Controls Business Division Mated height: 2.5 mm 2.50±0.15 industrial.panasonic.com/ac/e/ C 1.25 1.75 AXK(5/6)F EMBOSSED TAPE DIMENSIONS (unit: mm, Common for respective contact type, socket and header) • Tape dimensions (Conforming to JIS C 0806:1990. However, some tapes have mounting hole pitches that do not comply with the standard.) Tape I Tape II A±0.3 Taping reel D±1 A±0.3 C Label B C Pull out direction 4 2 12.0 1.5+0.1 0 dia. Top cover tape 1.75 380 dia. 1.75 Pull out direction • Plastic reel dimensions (Conforming to EIAJ ET–7200B) 4 2 Embossed carrier tape Embossed mounting-hole 12.0 1.5+0.1 0 dia. Dimension table (mm) Suffix: G (1 reel, 2,000 pieces embossed tape: Plastic reel package) Mated height No. of pins Type of taping A B C D Quantity per reel Socket and header are common: 1.5mm, 2.0mm, 2.5mm 10 to 58 60 to 70 72 to 100 Tape I Tape II Tape II 24.00 32.00 44.00 — 28.40 40.40 11.50 14.20 20.20 25.40 33.40 45.40 2,000 pcs. 2,000 pcs. 2,000 pcs. Connector orientation with respect to direction of progress of embossed tape Type Common for P5KF Direction of tape progress Socket Header Note: There is no indication on this product regarding top-bottom or left-right orientation. Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ ACCTB23E 201303-T AXK(5/6)F NOTES • Socket • Header Recommended PC board pattern (TOP VIEW) B±0.05 0.50±0.05 0.25±0.05 0.50±0.05 B±0.05 0.50±0.05 0.25±0.05 1.60±0.05 4.30±0.05 0.50±0.05 Recommended PC board pattern (TOP VIEW) 4.00±0.05 6.80±0.05 1. As shown below, excess force during insertion may result in damage to the connector or removal of the solder. Also, to prevent connector damage please confirm the correct position before mating connectors. 2. Keep the PC board warp no more than 0.03 mm in relation to the overall length of the connector. 0.125±0.05 0.30±0.05 0.125±0.05 0.30±0.05 Recommended metal mask pattern Recommended metal mask pattern Metal mask thickness: When 150 µm (Opening area ratio: 56%) Metal mask thickness: When 150 µm (Opening area ratio: 58%) 0.50±0.01 0.23±0.01 B±0.01 0.50±0.01 4.30±0.01 (0.85) B±0.01 0.50±0.01 (0.85) (0.85) 5.10±0.01 6.80±0.01 0.50±0.01 0.23±0.01 2.60±0.01 3. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. (0.85) Max. 0.03mm Recommended metal mask pattern Recommended metal mask pattern Metal mask thickness: When 120 µm (Opening area ratio: 69%) Metal mask thickness: When 120 µm (Opening area ratio: 72%) 0.50±0.01 0.23±0.01 (1.05) B±0.01 0.50±0.01 4.30±0.01 (1.05) (1.05) 2.20±0.01 B±0.01 0.50±0.01 4.70±0.01 6.80±0.01 0.50±0.01 0.23±0.01 (1.05) Max. 0.03mm * See the dimension table on page 85 for more information on the B dimension of the socket and header. Please refer to the latest product specifications when designing your product. ACCTB23E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ Notes on Using Narrow pitch Connectors Notes on Using Narrow pitch Connectors Regarding the design of devices and PC board patterns 1) When connecting several connectors together by stacking, make sure to maintain proper accuracy in the design of structure and mounting equipment so that the connectors are not subjected to twisting and torsional forces. 2) With mounting equipment, there may be up to a ±0.2 to 0.3-mm error in positioning. Be sure to design PC boards and patterns while taking into consideration the performance and abilities of the required equipment. 3) Some connectors have tabs embossed on the body to aid in positioning. When using these connectors, make sure that the PC board is designed with positioning holes to match these tabs. 4) To ensure the required mechanical strength when soldering the connector terminals, make sure the PC board meets recommended PC board pattern design dimensions given. 5) For all connectors of the narrow pitch series, to prevent the PC board from coming off during vibrations or impacts, and to prevent loads from falling directly on the soldered portions, be sure to design some means to fix the PC board in place. Example) Secure in place with screws Screw Spacer Connector PC board Spacer When connecting PC boards, take appropriate measures to prevent the connector from coming off. 6) Notes when using a FPC. (1) When the connector is soldered to an FPC board, during its insertion and removal procedures, forces may be applied to the terminals and cause the soldering to come off. It is recommended to use a reinforcement board on the backside of the FPC board to which the connector is being connected. Please make the reinforcement board dimensions bigger than the outer limits of the recommended PC board pattern (should be approximately 1 mm greater than the outer limit). Material should be glass epoxy or polyimide, and the thickness should be between 0.2 and 0.3 mm. (2) Collisions, impacts, or turning of FPC boards, may apply forces on the connector and cause it to come loose. Therefore, make to design retaining plates or screws that will fix the connector in place. 7) The narrow pitch connector series is designed to be compact and thin. Although ease of handling has been taken into account, take care when mating the connectors, as displacement or angled mating could damage or deform the connector. Regarding the selection of the connector placement machine and the mounting procedures 1) Select the placement machine taking into consideration the connector height, required positioning accuracy, and packaging conditions. 2) Be aware that if the catching force of the placement machine is too great, it may deform the shape of the connector body or connector terminals. 3) Be aware that during mounting, external forces may be applied to the connector contact surfaces and terminals and cause deformations. ACCTB48E 201303-T 4) Depending on the size of the connector being used, self alignment may not be possible. In such cases, be sure to carefully position the terminal with the PC board pattern. 5) The positioning bosses give an approximate alignment for positioning on the PC board. For accurate positioning of the connector when mounting it to the PC board, we recommend using an automatic positioning machine. Panasonic Corporation Automation Controls Business Division 6) Excessive mounter chucking force may deform the molded or metal part of the connector. Consult us in advance if chucking is to be applied. industrial.panasonic.com/ac/e/ Notes on Using Narrow pitch Connectors Regarding soldering Terminal Soldering conditions Please use the reflow temperature profile conditions recommended below for reflow soldering. Please contact us before using a temperature profile other than that described below (e.g. lead-free solder). • Narrow pitch connectors (except P8 type) Upper limited (Solder heat resistance) Lower limited (Solder wettability) Temperature Peak temperature 260°C 230°C 180°C 150°C 4) Consult us when using a screenprinting thickness other than that recommended. 5) When mounting on both sides of the PC board and the connector is mounting on the underside, use adhesives or other means to ensure the connector is properly fixed to the PC board. (Double reflow soldering on the same side is possible.) 6) N2 reflow, conducting reflow soldering in a nitrogen atmosphere, increases the solder flow too greatly, enabling wicking to occur. Make sure that the solder feed rate and temperature profile are appropriate. Panasonic Corporation 25 sec. 70 sec. Time • Narrow pitch connector (P8) Table A Product name Soldering iron temperature SMD type connectors 300°C within 5 sec. 350°C within 3 sec. 2) Do not allow flux to spread onto the connector leads or PC board. This may lead to flux rising up to the connector inside. 3) Touch the soldering iron to the foot pattern. After the foot pattern and connector terminal are heated, apply the solder wire so it melts at the end of the connector terminals. Temperature 245°C max. Apply the solder wire here Peak temperature 200°C Preheating Terminal 60 to 120 sec. PC board foot pattern 220°C 200°C Preheating 60 to 120 sec. 155 to 165°C Paste solder Peak temperature 2. Hand soldering 1) Set the soldering iron so that the tip temperature is less than that given in the table below. So ld iro erin n g 1. Reflow soldering 1) Measure the recommended profile temperature for reflow soldering by placing a sensor on the PC board near the connector surface or terminals. (The setting for the sensor will differ depending on the sensor used, so be sure to carefully read the instructions that comes with it.) 2) As for cream solder printing, screen printing is recommended. 3) To determine the relationship between the screen opening area and the PCboard foot pattern area, refer to the diagrams in the recommended patterns for PC boards and metal masks. Make sure to use the terminal tip as a reference position when setting. Avoid an excessive amount of solder from being applied, otherwise, interference by the solder will cause an imperfect contact. Small angle as possible up to 45 degrees Within 30 sec. Time For products other than the ones above, please refer to the latest product specifications. 7) The temperatures are measured at the surface of the PC board near the connector terminals. (The setting for the sensor will differ depending on the sensor used, so be sure to carefully read the instructions that comes with it.) 8) The temperature profiles given in this catalog are values measured when using the connector on a resin-based PC board. When performed reflow soldering on a metal board (iron, aluminum, etc.) or a metal table to mount on a FPC, make sure there is no deformation or discoloration of the connector beforehand and then begin mounting. 9) Consult us when using a screenprinting thickness other than that recommended. 10) Some solder and flux types may cause serious solder or flux creeping. Solder and flux characteristics should be taken into consideration when setting the reflow soldering conditions. Automation Controls Business Division PC board Pattern 4) Be aware that soldering while applying a load on the connector terminals may cause improper operation of the connector. 5) Thoroughly clean the soldering iron. 6) Flux from the solder wire may get on the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and clean off any solder before use. 7) For soldering of prototype devices during product development, you can perform soldering at the necessary locations by heating with a hot-air gun by applying cream solder to the foot pattern beforehand. However, at this time, make sure that the air pressure does not move connectors by carefully holding them down with tweezers or other similar tool. Also, be careful not to go too close to the connectors and melt any of the molded components. 8) If an excessive amount of solder is applied during manual soldering, the solder may creep up near the contact points, or solder interference may cause imperfect contact. 3. Solder reworking 1) Finish reworking in one operation. 2) For reworking of the solder bridge, use a soldering iron with a flat tip. To prevent flux from climbing up to the contact surfaces, do not add more flux. 3) Keep the soldering iron tip temperature below the temperature given in Table A. industrial.panasonic.com/ac/e/ ACCTB48E 201303-T Notes on Using Narrow pitch Connectors Handling Single Components 1) Make sure not to drop or allow parts to fall from work bench 2) Excessive force applied to the terminals could cause warping, come out, or weaken the adhesive strength of the solder. Handle with care. 3) Repeated bending of the terminals may cause terminals to break. 4) Do not insert or remove the connector when it is not soldered. Forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. 5) Excessive prying-force applied to one end may cause product breakage and separation of the solder joints at the terminal. Excessive force applied for insertion in a pivot action as shown may also cause product breakage. Align the header and socket positions before connecting them. Cleaning flux from PC board 3) Since some powerful cleaning solutions may dissolve molded components of the connector and wipe off or discolor printed letters, we recommend aqua pura electronic parts cleaners. Please consult us if you wish to use other types of cleaning fluids. 4) Please note that the surfaces of molded parts may whiten when cleaned with alcohol. Handling the PC board Some connectors may change color slightly if subjected to ultraviolet rays during storage. This is normal and will not affect the operation of the connector. 3) When storing the connectors with the PC boards assembled and components alreeady set, be careful not to stack them up so the connectors are subjected to excessive forces. 4) Avoid storing the connectors in locations with excessive dust. The dust may accumulate and cause improper connections at the contact surfaces. 3) Before soldering, try not to insert or remove the connector more than absolutely necessary. 4) When coating the PC board after soldering the connector to prevent the deterioration of insulation, perform the coating in such a way so that the coating does not get on the connector. 5) There may be variations in the colors of products from different production lots. This is normal. 6) The connectors are not meant to be used for switching. 7) Be sure not to allow external pressure to act on connectors when assembling PCBs or moving in block assemblies. 1) To increase the cleanliness of the cleaning fluid and cleaning operations, prepare equipment for cleaning process beginning with boil cleaning, ultrasonic cleaning, and then vapor cleaning. 2) Carefully oversee the cleanliness of the cleaning fluids to make sure that the contact surfaces do not become dirty from the cleaning fluid itself. • Handling the PC board after mounting the connector When cutting or bending the PC board after mounting the connector, be careful that the soldered sections are subjected to excessive force. The soldered areas should not be subjected to force. Storage of connectors 1) To prevent problems from voids or air pockets due to heat of reflow soldering, avoid storing the connectors in areas of high humidity. When storing the connectors for more than six months, be sure to consider storage area where the humidity is properly controlled. 2) Depending on the connector type, the color of the connector may vary from connector to connector depending on when it is produced. Other Notes 1) These products are made for the design of compact and lightweight devices and therefore the thickness of the molded components has been made very thin. Therefore, be careful during insertion and removal operations for excessive forces applied may damage the products. 2) Dropping of the products or rough mishandling may bend or damage the terminals and possibly hinder proper reflow soldering. ACCTB48E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ Notes on Using Narrow pitch Connectors Regarding sample orders to confirm proper mounting When ordering samples to confirm proper mounting with the placement machine, connectors are delivered in 50piece units in the condition given right. Consult a sale representative for ordering sample units. Please refer to the latest product specifications when designing your product. Condition when delivered from manufacturing Reel Embossed tape amount required for the mounting Required number of products for sample production (Delivery can also be made on a reel by customer request.) (Unit 50 pcs.) Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ ACCTB48E 201303-T