ETC2 CMT2217AW-EQR Low-cost 300 â 960 mhz ook stand-alone rf receiver Datasheet

CMT2210/17AW
CMT2210/17AW
Low-Cost 300 – 960 MHz OOK Stand-Alone RF Receiver
Features
Applications


Low-Cost Consumer Electronics Applications
 Very Easy Development with RFPDK

Home and Building Automation
 All Features Programmable

Infrared Receiver Replacements

Embedded EEPROM

Industrial Monitoring and Controls
 300 to 480 MHz (CMT2210AW)

Remote Automated Meter Reading
 300 to 960 MHz (CMT2217AW)

Remote Lighting Control System
Frequency Range

Symbol Rate: 0.1 to 40 ksps

Wireless Alarm and Security Systems

Sensitivity: -113 dBm at 1 ksps, 0.1% BER

Remote Keyless Entry (RKE)

Configurable Receiver Bandwidth: 50 to 500 kHz

3-wire SPI Interface for EEPROM Programming

Stand-Alone, No External MCU Control Required

Configurable Duty-Cycle Operation Mode

Supply Voltage: 1.8 to 3.6 V


Ordering Information
Part Number
Frequency
Package
MOQ
Low Power Consumption: 3.8 mA
CMT2210AW-EQR
433.920 MHz
QFN16
5,000 pcs
Low Sleep Current
CMT2210AW-ESR
433.920 MHz
SOP16
2,500 pcs
CMT2217AW-EQR
868.350 MHz
QFN16
5,000 pcs
 60 nA when Sleep Timer Off
 440 nA when Sleep Timer On

RoHS Compliant

16-pin QFN 3x3 and SOP16 Package Options
More Ordering Info: See Page 21
Descriptions
The CMT2210/17AW devices are ultra low power, high
performance, low-cost OOK stand-alone RF receiver for
various 300 to 960 MHz wireless applications. The
CMT2210AW covers the frequency range from 300 to 480
MHz while the CMT2217AW covers the 300 to 960 MHz
QFN16 (3X 3)
frequency range. They are part of the CMOSTEK
SOP16
NextGenRFTM family, which includes a complete line of
transmitters, receivers and transceivers. An embedded
NC
12
VCOP
CMOSTEK USB Programmer and RFPDK. Alternatively, in
nRSTO
features to be programmed into the device using the
VCON
EEPROM allows the frequency, symbol rate and other
11
10
9
stock products of 433.92/868.35 MHz are available for
GND 13
8
XIN
immediate demands without the need of EEPROM
RFIN 14
7
XOUT
programming. When the CMT2210/17AW is always on, it
GND 15
6
CLKO
5
DOUT
nRSTO
15
NC
XIN
3
14
4
13
XOUT
GND
5
12
CLKO
DOUT
VDD
6
11
1
2
3
4
CSB
7
10
NC
GND
RFIN
SCL
receiving sensitivity. It consumes even less power when
16
2
CSB
VDD 16
1
SDA
consumes only 3.8 mA current while achieving -113 dBm
VCOP
VCON
SDA
8
9
NC
SCL
working in duty-cycle operation mode via the built-in sleep
timer. The CMT2210/17AW receiver together with the
CMT211x transmitter enables an ultra low cost RF link.
Copyright © By CMOSTEK
Rev 1.3 | Page 1/28
CMT2210/17AW Top View
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CMT2210/17AW
Typical Application
9
10
NC
11
CMT2210/17AW
GND
CLKO
VDD
1
X1
C2
J1
VDD
7
1
2
3
4
CSB
6
5
C3
SDA
SCL
5
DOUT
NC
CSB
C0
DOUT
8
4
16
XOUT
U1
SCL
15
VDD
RFIN
XIN
3
14
L1
SDA
C1
GND
2
13
nRSTO
ANT
VCOP
VCON
12
L2
EEPROM Programming
SCL
SDA
CSB
Note: Connector J1 is for
Figure 1. CMT2210/17AW Typical Application Schematic
Table 1. BOM of 433.92/868.35 MHz Typical Application
Designator
[1]
Value (Match to 50Ω ANT)
Value (Common Used ANT)
433.92 MHz
433.92 MHz
Descriptions
868.35 MHz
Unit
Manufacturer
868.35 MHz
CMT2210/17AW, low-cost
U1
300 – 960 MHz OOK
-
-
-
CMOSTEK
26
26
MHz
EPSON
nH
Murata LQG18
nH
Murata LQG18
pF
Murata GRM15
stand-alone RF receiver
X1
L1
±20 ppm, SMD32*25 mm,
crystal
±5%, 0603 multi-layer chip
inductor
±5%, 0603 multi-layer chip
[2]
L2
inductor, for QFN16
±5%, 0603 multi-layer chip
inductor, for SOP16
27
6.8
33
6.8
22
3.9
22
3.9
15
--
15
--
3.3
2.7
2.7
2.7
C1
±0.25 pF, 0402 NP0, 50 V
C0
±20%, 0402 X7R, 25 V
0.1
0.1
uF
Murata GRM15
C2, C3
±5%, 0402 NP0, 50 V
27
27
pF
Murata GRM15
Note:
[1]. The 868.35 MHz application is for CMT2217AW only.
[2]. CMT2210AW devices in QFN16 and SOP16 packages share the same BOM except for the L2.
Table 2. Product Selection Table
Product
CMT2210AW
CMT2217AW
Modulation/
Frequency
Sensitivity
Rx Current
OOK/
-113 dBm
3.8 mA
300-480 MHz
(433.92 MHz, 1 ksps, 0.1% BER)
(433.92 MHz)
OOK/
-110 dBm
5.2 mA
300-960 MHz
(868.35 MHz, 1 ksps, 0.1% BER)
(868.35 MHz)
Rev 1.3 | Page 2/28
Embedded
EEPROM
√
√
Package
QFN16(3x3)/
SOP16
QFN16(3x3)
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CMT2210/17AW
Abbreviations
Abbreviations used in this data sheet are described below
AGC
Automatic Gain Control
PC
Personal Computer
AN
Application Notes
PCB
Printed Circuit Board
BER
Bit Error Rate
PLL
Phase Lock Loop
BOM
Bill of Materials
PN9
Pseudorandom Noise 9
BSC
Basic Spacing between Centers
POR
Power On Reset
BW
Bandwidth
PUP
Power Up
DC
Direct Current
QFN
Quad Flat No-lead
EEPROM
Electrically Erasable Programmable Read-Only
RF
Radio Frequency
Memory
RFPDK
RF Products Development Kit
ESD
Electro-Static Discharge
RoHS
Restriction of Hazardous Substances
ESR
Equivalent Series Resistance
RSSI
Received Signal Strength Indicator
Ext
Extended
Rx
Receiving, Receiver
IF
Intermediate Frequency
SAR
Successive Approximation Register
LNA
Low Noise Amplifier
SOP
Small Outline Package
LO
Local Oscillator
SPI
Serial Port Interface
LPOSC
Low Power Oscillator
TH
Threshold
Max
Maximum
Tx
Transmission, Transmitter
MCU
Microcontroller Unit
Typ
Typical
Min
Minimum
USB
Universal Serial Bus
MOQ
Minimum Order Quantity
VCO
Voltage Controlled Oscillator
NP0
Negative-Positive-Zero
WOR
Wake On Radio
NC
Not Connected
XOSC
Crystal Oscillator
OOK
On-Off Keying
XTAL/Xtal
Crystal
Rev 1.3 | Page 3/28
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CMT2210/17AW
Table of Contents
1. Electrical Characteristics ............................................................................................................................................ 5
1.1 Recommended Operation Conditions ................................................................................................................... 5
1.2 Absolute Maximum Ratings................................................................................................................................... 5
1.3 Receiver Specifications ......................................................................................................................................... 6
1.4 Crystal Oscillator ................................................................................................................................................... 7
1.5 LPOSC .................................................................................................................................................................. 7
2. Pin Descriptions .......................................................................................................................................................... 8
3. Typical Performance Characteristics ....................................................................................................................... 10
4. Typical Application Schematic ................................................................................................................................. 11
5. Functional Descriptions ............................................................................................................................................ 12
5.1 Overview ............................................................................................................................................................. 12
5.2 Modulation, Frequency and Symbol Rate ........................................................................................................... 12
5.3 Embedded EEPROM and RFPDK ...................................................................................................................... 13
5.4 All Configurable Options ..................................................................................................................................... 13
5.5 Internal Blocks Description .................................................................................................................................. 15
5.5.1
5.5.2
RF Front-end and AGC ............................................................................................................................ 15
IF Filter..................................................................................................................................................... 15
5.5.3
5.5.4
RSSI ........................................................................................................................................................ 15
SAR ADC ................................................................................................................................................. 15
5.5.5
5.5.6
Crystal Oscillator ...................................................................................................................................... 16
Frequency Synthesizer ............................................................................................................................ 16
5.5.7
LPOSC..................................................................................................................................................... 16
5.6 Operation Mode .................................................................................................................................................. 16
5.7 Always Receive Mode ......................................................................................................................................... 17
5.8 Duty-Cycle Receive Mode ................................................................................................................................... 18
5.9 Easy Duty-Cycle Configurations.......................................................................................................................... 19
5.10 The nRSTO ......................................................................................................................................................... 19
5.11 The CLKO ........................................................................................................................................................... 20
6. Ordering Information ................................................................................................................................................. 21
7. Package Outline......................................................................................................................................................... 22
8. Top Marking ............................................................................................................................................................... 24
8.1 CMT2210/17AW Top Marking ............................................................................................................................. 24
9. Other Documentations .............................................................................................................................................. 26
10. Document Change List.............................................................................................................................................. 27
11. Contact Information .................................................................................................................................................. 28
Rev 1.3 | Page 4/28
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CMT2210/17AW
1. Electrical Characteristics
VDD = 3.3 V, TOP = 25 ℃, FRF = 433.92 MHz, sensitivities are measured in receiving a PN9 sequence and matching to 50 Ω
impedance, with the BER of 0.1%. All measurements are performed using the board CMT2210/17AW-EM V1.0, unless otherwise
noted.
1.1 Recommended Operation Conditions
Table 3. Recommended Operation Conditions
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Operation Voltage Supply
VDD
1.8
3.6
V
Operation Temperature
TOP
-40
85
℃
Supply Voltage Slew Rate
1
mV/us
1.2 Absolute Maximum Ratings
Table 4. Absolute Maximum Ratings
Parameter
Symbol
Conditions
[1]
Min
Max
Unit
Supply Voltage
VDD
-0.3
3.6
V
Interface Voltage
VIN
-0.3
VDD + 0.3
V
Junction Temperature
TJ
-40
125
℃
Storage Temperature
TSTG
-50
150
℃
Soldering Temperature
TSDR
255
℃
-2
2
kV
-100
100
mA
[2]
Lasts at least 30 seconds
ESD Rating
Human Body Model (HBM)
Latch-up Current
@ 85 ℃
Notes:
[1]. Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress
rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
[2]. The CMT2210/17AW is high-performance RF integrated circuits with VCON/P pins having an ESD rating < 2 kV HBM.
Handling and assembly of this device should only be done at ESD-protected workstations.
Caution! ESD sensitive device. Precaution should be used when handling the device in order
to prevent permanent damage.
Rev 1.3 | Page 5/28
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CMT2210/17AW
1.3 Receiver Specifications
Table 5. Receiver Specifications
Parameter
Symbol
Frequency Range
FRF
Symbol Rate
SR
S433.92
Sensitivity
S868.35
Saturation Input Signal
Level
Working Current
IDD
ISLEEP
Frequency Resolution
FRES
Settle Time
Min
TLOCK
480
MHz
300
960
MHz
0.1
40
ksps
FRF = 433.92 MHz, SR = 1 ksps, BER =
-113
dBm
-110
dBm
10
dBm
3.8
mA
FRF = 868.35 MHz
5.2
mA
When sleep timer is on
440
nA
When sleep timer is off
60
nA
24.8
Hz
150
us
52
dB
74
dB
75
dB
35
dB
-25
dBm
0.1%
FRF = 868.35 MHz, SR = 1 ksps, BER =
0.1%
FRF = 433.92 MHz
From XOSC settled
SR = 1 ksps, ±2 MHz offset, CW
interference
SR = 1 ksps, ±10 MHz offset, CW
interference
Image Rejection Ratio
IMR
rd
Input 3 Order Intercept
Point
Receiver Bandwidth
IIP3
IF = 280 kHz
Two tone test at 1 MHz and 2 MHz offset
frequency. Maximum system gain settings
BW
Receiver Start-up Time
TSTART-UP
Receiver Wake-up Time
TWAKE-UP
Unit
300
interference
BI
Max
CMT2217AW
SR = 1 ksps, ±1 MHz offset, CW
Blocking Immunity
Typ
CMT2210AW
PLVL
Sleep Current
Frequency Synthesizer
Conditions
50
From power up to receive, in Always
Receive Mode
From sleep to receive, in Duty-Cycle
Receive Mode
Rev 1.3 | Page 6/28
500
kHz
7.3
ms
0.61
ms
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CMT2210/17AW
1.4 Crystal Oscillator
Table 6. Crystal Oscillator Specifications
Parameter
Symbol
[1]
Crystal Frequency
Conditions
FXTAL
Min
Typ
Max
Unit
26
26
26
MHz
[2]
Crystal Tolerance
±20
Load Capacitance
CLOAD
Crystal ESR
10
15
Rm
[3]
XTAL Startup Time
tXTAL
ppm
20
pF
60
Ω
400
us
Notes:
[1]. The CMT2210/17AW can directly work with external 26 MHz reference clock input to XIN pin (a coupling capacitor is
required) with peak-to-peak amplitude of 0.3 to 0.7 V.
[2]. This is the total tolerance including (1) initial tolerance, (2) crystal loading, (3) aging, and (4) temperature dependence.
The acceptable crystal tolerance depends on RF frequency and channel spacing/bandwidth.
[3]. This parameter is to a large degree crystal dependent.
1.5 LPOSC
Table 7. LPOSC Specifications
Parameter
Symbol
Calibrated Frequency[1]
FLPOSC
Frequency Accuracy
Temperature Coefficient
After calibration
[2]
Supply Voltage Coefficient
Initial Calibration Time
Conditions
[3]
tLPOSC-CAL
Min
Typ
Max
Unit
1
kHz
1
%
-0.02
%/°C
+0.5
%/V
4
ms
Notes:
[1]. The LPOSC is automatically calibrated to the crystal oscillator during the PUP state, and is periodically calibrated since
then.
[2]. Frequency drifts when temperature changes after calibration.
[3]. Frequency drifts when supply voltage changes after calibration.
Rev 1.3 | Page 7/28
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CMT2210/17AW
VCON
VCOP
nRSTO
NC
2. Pin Descriptions
12
11
10
9
7
XOUT
GND 15
6
CLKO
VDD 16
5
DOUT
1
2
3
4
NC
RFIN 14
SCL
XIN
SDA
8
CSB
GND 13
Figure 2. CMT2210/17AW Pin Assignments in QFN16 (3x3) Package
Table 8. CMT2210/17AW Pin Descriptions in QFN16 (3x3) Package
Pin Number
Name
I/O
Descriptions
1
CSB
I
2
SDA
IO
3
SCL
I
4,9
NC
NA
Not connected, leave floating
5
DOUT
O
Received data output
6
CLKO
O
Programmable clock output to drive an external MCU
7
XOUT
O
Crystal oscillator output
3-wire SPI chip select input for EEPROM programming, internally pulled high
3-wire SPI data input and output for EEPROM programming
3-wire SPI clock input for EEPROM programming, internally pulled low
8
XIN
I
Crystal oscillator input or external reference clock input
10
nRSTO
O
Active-low power-on-reset output to reset an external MCU
11
VCOP
12
VCON
IO
VCO tank, connected to an external inductor
13, 15
GND
I
Ground
14
RFIN
I
RF signal input to the LNA
16
VDD
I
Power supply input
Rev 1.3 | Page 8/28
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CMT2210/17AW
VCOP
1
16
nRSTO
VCON
2
15
NC
GND
3
14
XIN
RFIN
4
13
XOUT
GND
5
12
CLKO
VDD
6
11
DOUT
CSB
7
10
NC
SDA
8
9
SCL
Figure 3. CMT2210AW Pin Assignments in SOP16 Package
Table 9. CMT2210AW Pin Assignments in SOP16 Package
Pin Number
Name
1
VCOP
2
VCON
I/O
IO
Descriptions
VCO tank, connected to an external inductor
3, 5
GND
I
Ground
4
RFIN
I
RF signal input to the LNA
6
VDD
I
Power supply input
7
CSB
I
3-wire SPI chip select input for EEPROM programming
8
SDA
IO
9
SCL
I
3-wire SPI clock input for EEPROM programming
3-wire SPI data input and output for EEPROM programming
10,15
NC
-
Not connected, leave floating
11
DOUT
O
Received data output
12
CLKO
O
Programmable clock output to drive an external MCU
13
XOUT
O
Crystal oscillator output
14
XIN
I
Crystal oscillator input or external reference clock input
16
nRSTO
O
Active-low power-on-reset output to reset an external MCU
Rev 1.3 | Page 9/28
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CMT2210/17AW
3. Typical Performance Characteristics
Current vs. Supply Voltage
Current vs. Temperature
6.60
5.50
6.20
Current Consumption (mA)
6.00
Current Consumption (mA)
5.00
4.50
4.00
3.50
868.35 MHz
3.00
433.92 MHz
2.50
5.80
868.35MHz/3.6V
5.40
868.35MHz/3.3V
5.00
868.35MHz/1.8V
433.92MHz/3.6V
4.60
433.92MHz/3.3V
4.20
433.92MHz/1.8V
3.80
3.40
2.00
3.00
1.60
1.85
2.10
2.35
2.60
2.85
3.10
3.35
3.60
3.85
-50
-30
-10
Supply Voltage (V)
10
30
50
70
90
Temperature (℃)
Figure 5. Current vs. Voltage, FRF = 433.92 /
Figure 4. Current vs. Temperature, FRF =
868.35 MHz, SR = 1 ksps
433.92/868.35 MHz, SR = 1 ksps
Sensitivity vs. Temperature
Sensitivity vs. Supply Voltage
-108
-107.0
-109
-108.0
-110
Sensitivity (dBm)
Sensitivity (dBm)
-109.0
-110.0
868.35 MHz
-111.0
433.92 MHz
-112.0
-111
-112
-113
868.35 MHz
-113.0
-114
-114.0
-115
-115.0
433.92 MHz
-116
1.6
1.9
2.2
2.5
2.8
3.1
3.4
3.7
4
-60
-40
-20
0
20
40
60
80
100
Temperature (℃)
Supply Voltage (V)
Figure 7. Sensitivity vs. Supply Voltage, SR
Figure 6. Sensitivity vs. Temperature, FRF = 433.92
= 1 ksps, BER = 0.1%
/ 868.35 MHz, SR = 1 ksps, BER = 0.1%
Sensitivity vs. BER
Sensitivity vs. Symbol Rate
-108
-90
-109
-110
Sensitivity (dBm)
Sensitivity (dBm)
-95
-100
-105
868.35 MHz
-110
433.92 MHz
-111
-112
-113
-114
-115
-115
-116
-120
0
5
10
15
20
25
30
35
40
-117
0.01%
Symbol Rate (ksps)
868.35 MHz
433.92 MHz
0.10%
1.00%
10.00%
Bit Error Rate
Figure 8. Sensitivity vs. SR, FRF = 433.92 /
Figure 9. Sensitivity vs. BER, FRF = 433.92
868.35 MHz, VDD = 3.3 V, BER = 0.1%
/ 868.35MHz, VDD = 3.3 V, SR = 1 ksps
Rev 1.3 | Page 10/28
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CMT2210/17AW
4. Typical Application Schematic
9
NC
11
10
XOUT
U1
CMT2210/17AW
GND
CLKO
VDD
CSB
X1
C2
J1
VDD
7
1
2
3
4
CSB
C3
6
SDA
SCL
5
5
DOUT
NC
SCL
8
4
1
CSB
C0
DOUT
3
16
XIN
SCL
15
VDD
RFIN
SDA
14
L1
2
C1
GND
SDA
13
nRSTO
ANT
VCOP
VCON
12
L2
Figure 10. Typical Application Schematic
Notes:
1.
Connector J1 is a must for the CMT2210/17AW EEPROM access during development or manufacture.
2.
The general layout guidelines are listed below. For more design details, please refer to “AN107 CMT221x Schematic and
PCB Layout Design Guideline”.

Use as much continuous ground plane metallization as possible.

Use as many grounding vias (especially near to the GND pins) as possible to minimize series parasitic inductance
between the ground pour and the GND pins.
3.

Avoid using long and/or thin transmission lines to connect the components.

Place C0 as close to the CMT2210/17AW as possible for better filtering.
The table below shows the BOM of typical application.
Table 10. BOM of 433.92/868.35 MHz Typical Application
Designator
[1]
Value (Match to 50Ω ANT)
Value (Common Used ANT)
433.92 MHz
433.92 MHz
Descriptions
868.35 MHz
Unit
Manufacturer
868.35 MHz
CMT2210/17AW, low-cost
U1
300 – 960 MHz OOK
-
-
-
CMOSTEK
26
26
MHz
EPSON
nH
Murata LQG18
nH
Murata LQG18
pF
Murata GRM15
stand-alone RF receiver
X1
L1
±20 ppm, SMD32*25 mm,
crystal
±5%, 0603 multi-layer chip
inductor
±5%, 0603 multi-layer chip
L2[2]
inductor, for QFN16
±5%, 0603 multi-layer chip
inductor, for SOP16
27
6.8
33
6.8
22
3.9
22
3.9
15
--
15
--
3.3
2.7
2.7
2.7
C1
±0.25 pF, 0402 NP0, 50 V
C0
±20%, 0402 X7R, 25 V
0.1
0.1
uF
Murata GRM15
C2, C3
±5%, 0402 NP0, 50 V
27
27
pF
Murata GRM15
Note:
[1]. The 868.35 MHz application is for CMT2217AW only.
[2]. CMT2210AW devices in QFN16 and SOP16 packages share the same BOM except for the L2.
Rev 1.3 | Page 11/28
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CMT2210/17AW
5. Functional Descriptions
AGC
I-LMT
I-MXR
RFI
Image
Rejection
Band-pass
Filter
LNA
GND
Q-MXR
OOK
DEMOD
RSSI
CSB
Radio
Controller
SAR
3-wire SPI
AFC & AGC
SCL
SDA
Q-LMT
VCO
Loop
Filter
LO GEN
PFD/CP
26 MHz
EEPROM
LDOs
DIVIDER
LPOSC
VDD
GND
Bandgap
AFC & Σ-Δ Modulator
XOSC
CLKO
DOUT
POR
VCON
VCOP
nRSTO
XIN
XOUT
Figure 11. Functional Block Diagram
5.1 Overview
The CMT2210/17AW devices are ultra low power, high performance, low-cost OOK stand-alone RF receiver for various 300 to
960 MHz wireless applications. The CMT2210AW covers the frequency range from 300 to 480 MHz while the CMT2217AW
covers the 300 to 960 MHz frequency range. They are part of the CMOSTEK NextGenRFTM family, which includes a complete
line of transmitters, receivers and transceivers. The chip is based on a fully integrated, low-IF receiver architecture. The low-IF
architecture facilitates a very low external component count and does not suffer from powerline - induced interference problems.
The synthesizer contains a VCO and a low noise fractional-N PLL with an output frequency resolution of 24.8 Hz. The VCO
operates at 2x the Local Oscillator (LO) frequency to reduce spurious emissions. Every analog block is calibrated on each
Power-on Reset (POR) to the internal reference voltage. The calibration helps the device to finely work under different
temperatures and supply voltages. The baseband filtering and demodulation is done by the digital demodulator. The
demodulated signal is output to the external MCU via the DOUT pin. No external MCU control is needed in the applications.
The 3-wire SPI interface is only used for configuring the device. The configuration can be done with the RFPDK and the USB
Programmer. The RF Frequency, symbol rate and other product features are all configurable. This saves the cost and simplifies
the design, development and manufacture. Alternatively, in stock products of 433.92/868.35 MHz are available for immediate
demands with no need of EEPROM programming. The CMT2210/17AW operates from 1.8 to 3.6 V so that it can finely work with
most batteries to their useful power limits. The receive current is only 3.8 mA at 433.92 MHz and 5.2 mA at 868.35 MHz. The
CMT2210/17AW receiver together with the CMT211x transmitter enables an ultra low cost RF link.
5.2 Modulation, Frequency and Symbol Rate
The CMT2210/17AW supports OOK demodulation with the symbol rate from 0.1 to 40 ksps. The CMT2210AW continuously
covers the frequency range from 300 to 480 MHz, including the license free ISM frequency band around 315 MHz and 433.92
MHz. And the CMT2217AW covers the frequency range from 300 MHz to 960 MHz, including the license free ISM frequency
band around 315 MHz, 433.92 MHz, 868.35 MHz and 915 MHz. The internal frequency synthesizer contains a high-purity VCO
and a low noise fractional-N PLL with an output frequency resolution of 24.8 Hz. See the table below for the demodulation,
frequency and symbol rate information.
Rev 1.3 | Page 12/28
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CMT2210/17AW
Table 11. Modulation, Frequency and Symbol Rate
Parameter
Value
Demodulation
Unit
OOK
-
Frequency (CMT2210AW)
300 to 480
MHz
Frequency (CMT2217AW)
300 to 960
MHz
Frequency Resolution
Symbol Rate
24.8
Hz
0.1 to 40
ksps
5.3 Embedded EEPROM and RFPDK
The RFPDK is a PC application developed to help the user to configure the CMOSTEK NextGenRFTM products in the most
intuitional way. The user only needs to connect the USB Programmer between the PC and the device, fill in/select the proper
value of each parameter on the RFPDK, and click the “Burn” button to program the configurations into the device. The
configurations of the device will then remain unchanged until the next programming. No external MCU control is required in the
application program.
The RFPDK also allows the user to save the active configuration into a list by clicking on the “List” button, so that the saved
configuration can be directly reloaded from the list in the future. Furthermore, it supports exporting the configuration into a
hexadecimal file by clicking on the “Export” button. This file can be used to burn the same configuration into a large amount of
devices during the mass production. See the figure below for the accessing of the EEPROM.
CMT2210/17AW
RFPDK
EEPROM
CSB
Interface
SCL
SDA
CMOSTEK USB
Programmer
Figure 12. Accessing Embedded EEPROM
For more details of the CMOSTEK USB Programmer and the RFPDK, please refer to “AN103 CMT211xA-221xA One-Way RF
Link Development Kits Users Guide”.
5.4 All Configurable Options
Beside the demodulation, frequency and symbol rate, more options can be used to customize the device. The following is a table
of all the configurable options. On the RFPDK, the Basic Mode only contains a few options allowing the user to perform easy and
fast configurations. The Advanced Mode shows all the options that allow the user to customize the device in a deeper level. The
options in “Basic Mode” are a subset of that in the “Advanced Mode”.
Rev 1.3 | Page 13/28
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CMT2210/17AW
Table 12. Configurable Parameters in RFPDK
Category
Parameters
Frequency (CMT2210AW)
Frequency (CMT2217AW)
Demodulation
Symbol Rate
RF
Settings
Descriptions
The receive radio frequency, the range is from
300 to 480 MHz, with resolution of 0.001 MHz.
The receive radio frequency, the range is from
300 to 960 MHz, with resolution of 0.001 MHz.
The demodulation type, only OOK
demodulation is supported in this product.
The receiver symbol rate, the range is from 0.1
to 40 ksps, with resolution of 0.1 ksps.
Squelch TH
The threshold of the squelch circuit to suppress
(CMT2210AW/CMT2217AW)
the noise, the range is from 0 to 255.
Xtal Tol. | Rx BW
(CMT2210AW/CMT2217AW)
Default
Mode
433.920 MHz
868.350 MHz
Advanced
Basic
2.4 ksps
Advanced
Basic
54 / 40
Advanced
±150 ppm | 200
the Tx and the Rx, the range is from 0 to ±300
kHz
Basic
ppm. And the calculated BW is configured and
/ ±40 ppm | 100
Advanced
kHz
settled after power up. The options are: 78, 155,
Basic
310 us
Advanced
310, 620, 1240 or 2480 us.
Sleep Time
Rx Time
Advanced
Basic
OOK
Time for the device to wait for the crystal to get
Duty-Cycle Mode
Basic
The sum of the crystal frequency tolerance of
displayed.
Xtal Stabilizing Time
Basic
Advanced
Turn on/off the duty-cycle receive mode, the
options are: on or off.
The sleep time in duty-cycle receive mode, the
range is from 3 to 134,152,192 ms.
The receive time in duty-cycle receive mode,
the range is from 0.04 to 2,683,043.00 ms.
Basic
On
Advanced
Basic
3 ms
Advanced
Basic
2,000 ms
Advanced
The extended receive time in duty-cycle receive
Rx Time Ext
mode, the range is from 0.04 to 2,683,043.00
200.00 ms
Advanced
Off
Advanced
ms. It is only available when WOR is on.
Wake-On Radio
Operation
Settings
Turn on/off the wake-on radio function, the
options are: on or off.
The condition to wake on the radio. The options
Wake-On Condition
are: Extended by Preamble, or Extended by
RSSI. It is only available when WOR is on.
System Clock Output
Turn on/off the system clock output on CLKO,
the options are: on or off.
Extended by
Preamble
Advanced
Off
Advanced
6.5 MHz
Advanced
Peak TH
Advanced
60 / 50
Advanced
The system clock output frequency, the options
are: 13.000, 6.500, 4.333, 3.250, 2.600, 2.167,
System Clock
Frequency
1.857, 1.625, 1.444, 1.300, 1.182, 1.083, 1.000,
0.929, 0.867, 0.813, 0.765, 0.722, 0.684, 0.650,
0.619, 0.591, 0.565, 0.542, 0.520, 0.500, 0.481,
0.464, 0.448, 0.433, 0.419 or 0.406 MHz. It is
only available when System Clock Output is on.
Demod Method
are: Peak TH, or Fixed TH
The threshold value when the Demod Method is
OOK
Settings
The OOK demodulation methods, the options
Fixed Demod TH
(CMT2210AW/CMT2217AW)
“Fixed TH”, the minimum input value is the
value of Squelch Threshold set on the RFPDK,
the maximum value is 255.
Rev 1.3 | Page 14/28
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CMT2210/17AW
Category
Parameters
Peak Drop
Peak Drop Step
Descriptions
Turn on/off the RSSI peak drop function, the
options are on, or off.
The RSSI peak drop step, the options are: 1, 2,
3, 5, 6, 9, 12 or 15.
The RSSI peak drop rate, the options are: 1
Peak Drop Rate
step/4 symbols, 1 step/2 symbols, 1 step /1
symbol, or 1 step/0.5 symbol.
AGC
Decode
Settings
Automatic Gain Control, the options are: on or
off.
Default
Mode
On
Advanced
1
Advanced
1 step /
4 symbols
Advanced
On
Advanced
2-byte
Advanced
The size of the valid preamble, the options are:
Preamble
1-byte, 2-byte, 3-byte, or 4-byte. It is only
available when WOR is on.
5.5 Internal Blocks Description
5.5.1 RF Front-end and AGC
The CMT2210/17AW features a low-IF receiver. The RF front-end of the receiver consists of a Low Noise Amplifier (LNA), I/Q
mixer and a wide-band power detector. Only a low-cost inductor and a capacitor are required for matching the LNA to any
common used antennas. The input RF signal induced on the antenna is amplified and down-converted to the IF frequency for
further processing.
By means of the wide-band power detector and the attenuation networks built around the LNA, the Automatic Gain Control (AGC)
loop regulates the RF front-end’s gain to get the best system linearity, selectivity and sensitivity performance, even though the
receiver suffers from strong out-of-band interference.
5.5.2 IF Filter
The signals coming from the RF front-end are filtered by the fully integrated 3rd-order band-pass image rejection IF filter which
achieves over 35 dB image rejection ratio typically. The IF center frequency is dynamically adjusted to enable the IF filter to
locate to the right frequency band, thus the receiver sensitivity and out-of-band interference attenuation performance are kept
optimal despite the manufacturing process tolerances. The IF bandwidth is automatically computed according to the three basic
system parameters input from the RFPDK: RF frequency, Xtal tolerance, and symbol rate.
5.5.3 RSSI
The subsequent multistage I/Q Log amplifiers enhance the output signal from IF filter before it is fed for demodulation. Receive
Signal Strength Indicator (RSSI) generators are included in both Log amplifiers which produce DC voltages that are directly
proportional to the input signal level in both of I and Q path. The resulting RSSI is a sum of both these two paths. Extending from
the nominal sensitivity level, the RSSI achieves over 66 dB dynamic range.
The CMT2210/17AW integrates a patented DC-offset cancellation engine. The receiver sensitivity performance benefits a lot
from the novel, fast and accurate DC-offset removal implementation.
5.5.4 SAR ADC
The on-chip 8-bit SAR ADC digitalizes the RSSI for OOK demodulation.
Rev 1.3 | Page 15/28
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CMT2210/17AW
5.5.5 Crystal Oscillator
The crystal oscillator is used as the reference clock for the PLL frequency synthesizer and system clock for the digital blocks. A
26 MHz crystal should be used with appropriate loading capacitors (C2 and C3 in Figure 10 of Page 11). The values of the
loading capacitors depend on the total load capacitance CL specified for the crystal. The total load capacitance seen between the
XIN and XOUT pin should equal CL for the crystal to oscillate at 26 MHz.
CL =
1
+ Cparasitic
1
1
+
C3
C2
The parasitic capacitance is constituted by the input capacitance and PCB tray capacitance. The ESR of the crystal should be
within the specification in order to ensure a reliable start-up. An external signal source can easily be used in place of a
conventional XTAL and should be connected to the XIN pin. The incoming clock signal is recommended to have a peak-to-peak
swing in the range of 300 mV to 700 mV and AC-coupled to the XIN pin.
5.5.6 Frequency Synthesizer
A fractional-N frequency synthesizer is used to generate the LO frequency for the down conversion I/Q mixer. The frequency
synthesizer is fully integrated except the VCO tank inductor which enables the ultra low-power receiver system design. Using the
26 MHz reference clock provided by the crystal oscillator or the external clock source, it can generate any receive frequency
between 300 to 480 MHz with a frequency resolution of 24.8 Hz.
The VCO always operates at 2x of LO frequency. A high Q (at VCO frequency) tank inductor should be chosen to ensure the
VCO oscillates at any conditions meanwhile burns less power and gets better phase noise performance. In addition, properly
layout the inductor matters a lot of achieving a good phase noise performance and less spurious emission. The recommended
VCO inductors for different LO frequency bands are shown as bellow.
Table 13. VCO Inductor for 315/433.92/868.35/915 MHz Frequency Band
LO Frequency Band (MHz)
315
433.92
868.35
915
VCO Inductor for QFN16 package (nH)
33
22
3.9
3.9
VCO Inductor for SOP16 package (nH)
27
15
--
--
Multiple subsystem calibrations are performed dynamically to ensure the frequency synthesizer operates reliably in any working
conditions.
5.5.7 LPOSC
An internal 1 kHz low power oscillator is integrated in the CMT2210/17AW. It generates a clock to drive the sleep timer to
periodically wake the device from sleep state. The Sleep Time can be configured from 3 to 134,152,192 ms (more than 37 hours)
when the device works in duty-cycle receive mode. Since the frequency of the LPOSC drifts when the temperature and supply
voltage change, it is automatically calibrated during the PUP state, and is periodically calibrated since then. The calibration
scheme allows the LPOSC to maintain its frequency tolerance to less than ±1%.
5.6 Operation Mode
An option “Duty-Cycle On-Off” on the RFPDK allows the user to determine how the device behaves. The device is able to work in
two operation modes, as shown in the figure below.
Rev 1.3 | Page 16/28
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CMT2210/17AW
PUP
PUP
SLEEP
SLEEP
RX
XTAL
TUNE
TUNE
RX
Always Receive Mode
(“Duty-Cycle Mode” is set to Off )
Duty-Cycle Receive Mode
(“Duty-Cycle Mode” is set to On )
Figure 13. Two different operation modes
Power Up (PUP) State
Once the device is powered up, the device will go through the Power Up (PUP) sequence which includes the task of releasing the
Power-On Reset (POR), turning on the crystal and calibrating the internal blocks. The PUP takes about 4 ms to finish in the
always receive mode, and about 9.5 ms to finish in the duty-cycle receive mode. This is because that the LPOSC and sleep timer
is turned off in the always receive mode, while it must be turned on and calibrated during the PUP in the duty-cycle receive mode.
The average current of the PUP sequence is about 0.9 mA.
SLEEP State
In this state, all the internal blocks are powered down except the sleep timer. In Always Receive Mode, the sleep time is fixed at
about 3 ms. In Duty-Cycle Receive Mode, the sleep time is defined by the option “Sleep Time” on the RFPDK. The sleep current
is about 60 nA in the always receive mode, and about 440 nA (with LPOSC and sleep timer turned on) in the duty-cycle receive
mode.
XTAL State
The XTAL state only exists in the duty-cycle receive mode. Once the device wakes up from the SLEEP State, the crystal oscillator
restarts to work. The option “XTAL Stabilizing Time” on the RFPDK defines the time for the device to wait for the crystal oscillator
to settle. The current consumption in this state is about 520 uA.
TUNE State
The device is tuned to the desired frequency defined by the option “Frequency” on the RFPDK and ready to receive. It usually
takes approximately 300 us to complete the tuning sequence. The current consumption in this state is about 2 mA.
RX State
The device receives the incoming signals and outputs the demodulated data from the DOUT pin. In duty-cycle receive mode, the
device only stays in the RX State for a certain amount of time, which is defined by the option “Rx Time” on the RFPDK. The
current in this state is about 3.8 mA.
5.7 Always Receive Mode
If the duty-cycle receive mode is turned off, the device will go through the Power Up (PUP) sequence, stay in the SLEEP state for
about 3 ms, tune the receive frequency, and finally stay in the RX state until the device is powered down. The power up sequence,
which takes about 4 ms to finish, includes the task of turning on the crystal and calibrating the internal blocks. The device will
continuously receive the incoming RF signals during the RX state and send out the demodulated data on the DOUT pin. The
configurable system clock is also output from the CLKO pin if it is enabled in the Advanced Mode on the RFPDK. The figure
below shows the timing characteristics and current consumption of the device from the PUP to RX.
Rev 1.3 | Page 17/28
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CMT2210/17AW
Data
(DOUT pin)
System Clock
(CLKO pin)
3.8 mA
Current
2.0 mA
900 uA
440 nA
SLEEP
PUP
about 4 ms
about
3 ms
State
RX
TUNE
about
300 us
Figure 14. Timing and Current Consumption for Always Receive Mode
5.8 Duty-Cycle Receive Mode
If the duty-cycle mode is turned on, after the PUP the device will automatically repeat the sequence of SLEEP, XTAL, TUNE and
RX until the device is powered down. This allows the device to re-tune the synthesizer regularly to adept to the changeable
environment and therefore remain its highest performance. The device will continuously receive any incoming signals during the
RX state and send out the demodulated data on the DOUT pin. The configurable system clock output is output from the CLKO
pin during the TUNE and RX state. The PUP sequence consumes about 9.5 ms which is longer than the 4 ms in the Always
Receive Mode. This is because the LPOSC, which drives the sleep timer, must be calibrated during the PUP.
Data
(DOUT pin)
System Clock
(CLKO pin)
3.8 mA
3.8 mA
Current
2.0 mA
900 uA
440 nA
2.0 mA
520 uA
PUP
SLEEP
XTAL
about 9.5 ms
Sleep
Time
Xtal Stabilizing
Time
440 nA
TUNE
about
300 us
520 uA
RX
SLEEP
XTAL
TUNE
Rx Time
Sleep
Time
Xtal Stabilizing
Time
about
300 us
RX
State
Rx Time
Figure 15. Timing and Current Consumption for Duty-Cycle Receive Mode
It is strongly recommended for the user to turn on the duty-cycle receive mode option. The advantages are:

Maintaining the highest performance of the device by regular frequency re-tune.

Increasing the system stability by regular sleep (resetting most of the blocks).

Saving power consumptions of both of the Tx and Rx device.
As long as the Sleep Time and Rx Time are properly configured, the transmitted data can always be captured by the device.
Rev 1.3 | Page 18/28
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CMT2210/17AW
5.9 Easy Duty-Cycle Configurations
When the user wants to take the advantage of maintaining the highest system stability and performance, and the power
consumption is not the first concern in the system, the Easy Configuration can be used to let the device to work in the duty-cycle
mode without complex calculations, the following is a good example:
TX Data
T = Packet Length (72 ms)
A missed packet
Two missed packets
RX State
SLEEP, XTAL and TUNE
T = Sleep Time (3 ms) +
XTAL Stabilizing Time (310 us) +
Tuning Time (300 us) = 3.61 ms
time
RX
T = Rx Time (1000 ms)
output data corrupted
output data corrupted
Data
(DOUT pin)
Figure 16. Tx and Rx relationship of Easy Configuration
In this example, the Tx device transmits the data at 1.2 ksps and there are 60 symbols in one data packet. Thus, the packet
length is 50 ms. The user can do the following:

Set the Sleep Time to the minimum value of 3 ms.

Set the Rx Time to 1 second which is much longer than the packet length.

Let the Tx device to send out 3 continuous data packets in each transmission.
Because the Sleep Time is very short, the non-receive time is only about 3.61 ms (the sum of the Sleep Time, XTAL stabilizing
time and the tuning time), which is much shorter than the packet length of 50 ms. Therefore, this non-receive time period will only
have a change to corrupt no more than 2 packets receiving. During the non-receive time period, the DOUT pin will output logic 0.
Because the Rx Time is very long, and 3 continuous data packets are sent in each transmission, there is at least 1 packet that
can be completely received by the device and sent out via the DOUT pin with no corruption. The external MCU will only need to
observe the DOUT pin status to perform data capturing and further data processing.
If the system power consumption is a sensitive and important factor in the application, the Precise Configuration can be used.
Also, based on the duty-cycle receive mode, the “Wake-On Radio” technique allows the device to even save more power. For the
precise duty-cycle configurations and the use of wake-on radio, please refer to the “AN108 CMT2210/17AW Configuration
Guideline”.
5.10 The nRSTO
By default, an active low reset signal is generated by the internal POR and output via the nRSTO pin. It can be used to reset the
external MCU if it is required.
Rev 1.3 | Page 19/28
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CMT2210/17AW
Trise
VDD
Vth
TPOR
(POR)
nRSTO
Figure 17. nRSTO Timing Characteristics
On the above figure, Trise is the time taken for the VDD to rise from 0 V to its ultimate stabilized level. After the internal Power-On
Reset circuit detects that the VDD has risen over the threshold voltage (Vth), it takes the time TPOR for the POR to change its state
from logical 0 to 1. The Vth is about 1.2 V. The value of TPOR varies according to the time taken for the VDD to rise from 0 to 3 V, as
listed in the table below. When the VDD falls, the nRSTO follows with the VDD simultaneously.
Table 14. TPOR Timing Characteristics
TRISE (us)
TPOR (us)
3,000
500
1,000
300
300
160
100
100
30
70
10
60
5.11 The CLKO
A clock divided down from the crystal oscillator clock is output via the CLKO pin if the “System Clock Output” is set to “On” on the
RFPDK. This clock can be used to drive the external MCU, and is available when the device is in the XTAL, TUNE and RX states.
The clock frequency is selected by the option “System Clock Frequency”.
More details of using the CLKO can be referred to the “AN108 CMT2210/17AW Configuration Guideline”.
Rev 1.3 | Page 20/28
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CMT2210/17AW
6. Ordering Information
Table 15. CMT2210/17AW Ordering Information
Part Number
CMT2210AW-EQR[1]
CMT2210AW-ESR[1]
CMT2210AW-ESB[1]
CMT2217AW-EQR[1]
Descriptions
Low-Cost 300 – 480 MHz OOK
Stand-Alone RF Receiver
Low-Cost 300 – 480 MHz OOK
Stand-Alone RF Receiver
Low-Cost 300 – 480 MHz OOK
Stand-Alone RF Receiver
Low-Cost 300 – 960 MHz OOK
Stand-Alone RF Receiver
Package
Package
Type
Option
QFN16 (3x3)
Tape & Reel
SOP16
Tape & Reel
SOP16
Tube
QFN16 (3x3)
Tape & Reel
Operating
MOQ /
Condition
Multiple
1.8 to 3.6 V,
-40 to 85 ℃
1.8 to 3.6 V,
-40 to 85 ℃
1.8 to 3.6 V,
-40 to 85 ℃
1.8 to 3.6 V,
-40 to 85 ℃
5,000
2,500
1,000
5,000
Note:
[1]. “E” stands for extended industrial product grade, which supports the temperature range from -40 to +85 ℃.
“Q” stands for the package type of QFN16 (3x3).
“S” stands for the package type of SOP16.
“R” stands for the tape and reel package option, the minimum order quantity (MOQ) is 5,000 pieces for QFN package
type and 1,000 pieces for SOP package type.
“B” stands for the tube package option, the MOQ is 1,000 pieces for SOP16 package type.
The default frequency for CMT2210AW is 433.920 MHz, and for CMT2217AW is 868.350 MHz. Please refer to the Table
12 in Page 14 for details of other settings.
Visit www.cmostek.com/products to know more about the product and product line.
Contact [email protected] or your local sales representatives for more information.
Rev 1.3 | Page 21/28
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CMT2210/17AW
7. Package Outline
The 16-pin QFN 3x3 illustrates the package details for the CMT2210/17AW. The table below lists the values for the dimensions
shown in the illustration.
D
e
L
b
E2
E
D2
16
16
1
1
Bottom View
c
A1
A
Top View
Side View
Figure 18. 16-Pin QFN 3x3 Package
Table 16. 16-Pin QFN 3x3 Package Dimensions
Symbol
Size (millimeters)
Min
Max
A
0.7
0.8
A1
—
0.05
b
0.18
0.30
c
0.18
0.25
D
2.90
3.10
D2
1.55
1.75
e
0.50 BSC
E
2.90
3.10
E2
1.55
1.75
L
0.35
0.45
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CMT2210/17AW
The CMT2210AW is also available in the SOP16 package, see below figures and tables for the dimension details.
D
A3
h
A2 A
0.25
c
A1
θ
L
L1
E1
b
E
e
Figure 19. SOP16 Package
Table 17. SOP16 Package Dimensions
Size (millimeters)
Symbol
Min
Typ
Max
A
-
-
1.75
A1
0.05
-
0.225
A2
1.30
1.40
1.50
A3
0.60
0.65
0.70
b
0.39
-
0.48
c
0.21
-
0.26
D
9.70
9.90
10.10
E
5.80
6.00
6.20
E1
3.70
3.90
4.10
e
1.27 BSC
h
0.25
-
0.50
L
0.50
-
0.80
L1
θ
1.05 BSC
0
-
Rev 1.3 | Page 23/28
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CMT2210/17AW
8. Top Marking
8.1 CMT2210/17AW Top Marking
2 1 0 A
2 1 7 A
①②③④
①②③④
Y WW
Y WW
Figure 20. CMT2210 (Left) and CMT2217AW (Right) Top Marking in QFN16 Package
Table 18. CMT2210/17AW QFN16 Top Marking Explanation
Mark Method
Laser
Pin 1 Mark
Circle’s diameter = 0.3 mm
Font Size
0.5 mm, right-justified
Line 1 Marking
Line 2 Marking
Line 3 Marking
210A, represents part number CMT2210AW
217A, represents part number CMT2217AW
①②③④ Internal tracking number
Date code assigned by the assembly house. Y represents the last digit of the mold year and
WW represents the workweek
Rev 1.3 | Page 24/28
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CMT2210/17AW
CMT 2 2 1 0 A
Y Y W W ①②③④⑤⑥
Figure 21. CMT2210AW Top Marking in SOP16 Package
Table 19. CMT2210AW SOP16 Top Marking Explanation
Mark Method
Laser
Pin 1 Mark
Circle’s diameter = 1 mm
Font Size
0.35 mm, right-justified
Line 1 Marking
CMT2210A, represents part number CMT2210AW
YYWW is the Date code assigned by the assembly house. YY represents the last two digits of the
Line 2 Marking
mold year and WW represents the workweek
①②③④⑤⑥ is the internal tracking number
Rev 1.3 | Page 25/28
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CMT2210/17AW
9. Other Documentations
Table 20. Other Documentations for CMT2210/17AW
Brief
AN103
AN107
AN108
Name
Descriptions
CMT211xA-221xA One-Way RF Link
Development Kits Users Guide
User’s Guides for CMT211xA and CMT221xA Development Kits,
including Evaluation Board and Evaluation Module, CMOSTEK
USB Programmer and RFPDK.
CMT221x Schematic and PCB Layout
Design Guideline
Details of CMT2210/13/17/19AW and CMT2210LW PCB
schematic and layout design rules, RF matching network and
other application layout design related issues.
CMT2210/17A Configuration Guideline
Details of configuring CMT2210/17AW features on the RFPDK.
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CMT2210/17AW
10. Document Change List
Table 21. Document Change List
Rev. No.
Chapter
Description of Changes
0.9
All
Initial released version
2014-06-14
1.0
5
Update Section 5.7 and Figure 14
2014-06-30
1.1
All
Add Product CMT2217AW to the datasheet
2015-01-23
1.2
All
Add SOP16 to product CMT2210AW
2015-05-04
1.3
All
Update the VCO inductor for CMT2210AW in SOP16 package
2015-06-17
Rev 1.3 | Page 27/28
Date
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CMT2210/17AW
11. Contact Information
Hope Microelectronics Co., Ltd
Address: 2/F,Building3,Pingshan Private Enterprise science and Technology Park,Xili Town,Nanshan
District,Shenzhen,China
Tel: +86-755-82973805
Fax: +86-755-82973550
Email: [email protected]
[email protected]
Website: http://www.hoperf.com
http://www.hoperf.cn
Copyright. CMOSTEK Microelectronics Co., Ltd. All rights are reserved.
The information furnished by CMOSTEK is believed to be accurate and reliable. However, no responsibility is assumed for
inaccuracies and specifications within this document are subject to change without notice. The material contained herein is
the exclusive property of CMOSTEK and shall not be distributed, reproduced, or disclosed in whole or in part without prior
written permission of CMOSTEK. CMOSTEK products are not authorized for use as critical components in life support
devices or systems without express written approval of CMOSTEK. The CMOSTEK logo is a registered trademark of
CMOSTEK Microelectronics Co., Ltd. All other names are the property of their respective owners.
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