PRELIMINARY CM1426 LCD and Camera EMI Filter Array with ESD Protection Features Product Description • The CM1426 is a family of pi-style EMI filter arrays with ESD protection, which integrates four, six and eight filters (C-R-C) in a Chip Scale Package with 0.50mm pad pitch. The CM1426 has component values of 8.5pF-100Ω-8.5pF per channel. The CM1426 has a cut-off frequency of 230MHz and can be used in applications where the data rates are as high as 92Mbps. The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes safely dissipate ESD strikes of ±8kV, well beyond the maximum requirement of the IEC61000-42 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±15kV. • • • • • • • • • • Four, six and eight channels of EMI filtering with integrated ESD protection 0.5mm pitch, 10-bump, 1.96mm x 1.33mm footprint Chip Scale Package (CM1426-04) 0.5mm pitch, 15-bump, 2.96mm x 1.33mm footprint Chip Scale Package (CM1426-06) 0.5mm pitch, 20-bump, 3.96mm x 1.33mm footprint Chip Scale Package (CM1426-08) Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network ±8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±15kV ESD protection on each channel (HBM) Greater than 20dB attenuation (typical) at 1 GHz Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance Optiguard™ coated for improved reliability at assembly Lead-free version available These devices are particularly well-suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of their small package and easyto-use pin assignments. In particular, the CM1426 is ideal for EMI filtering and protecting data and control lines for the I/O data ports, LCD display and camera interface in mobile handsets. Applications • • • • • • LCD and Camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. Wireless handsets Handheld PCs/PDAs LCD and camera modules The CM1426 incorporates Optiguard™ which results in improved reliability at assembly. The CM1426 is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing. Electrical Schematic 100Ω FILTER+ESDn* (Pins A1-An) 8.5pF 8.5pF FILTER+ESDn* (Pins C1-Cn) GND* (Pins B1-Bm) * See Package/Pinout Diagram 1 of 4, 6 or 8 EMI/RFI + ESD Channels for expanded pin information. © 2005 California Micro Devices Corp. All rights reserved. 08/30/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 1 PRELIMINARY CM1426 PACKAGE / PINOUT DIAGRAMS BOTTOM VIEW TOP VIEW (Bumps Up View) (Bumps Down View) Orientation Marking (see note 2) 1 2 3 4 FILTER1 FILTER2 FILTER3 FILTER4 C1 C2 C3 C4 A GND N264 B GND B1 C B2 FILTER1 FILTER2 FILTER3 FILTER4 A1 A2 A3 A4 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 C1 C2 C3 C4 C5 C6 Orientation Marking A1 CM1426-04CS/CP 10 Bump CSP Package Orientation Marking (see note 2) 1 2 3 4 5 6 A GND N266 B GND B1 B2 B3 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 A1 A2 A3 A4 A5 A6 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 C1 C2 C3 C4 C5 C6 C7 Orientation Marking C GND A1 CM1426-06CS/CP 15 Bump CSP Package Orientation Marking (see note 2) 1 2 3 4 5 6 7 8 A GND N268 B GND B1 Orientation Marking C GND B2 FILTER8 C8 GND B3 B4 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 A1 A2 A3 A4 A5 A6 A7 A8 A1 CM1426-08CS/CP 20 Bump CSP Package Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS PIN(s) NAME A1 FILTER1 A2 FILTER2 A3 DESCRIPTION PIN(s) NAME DESCRIPTION Filter + ESD Channel 1 C1 FILTER1 Filter + ESD Channel 1 Filter + ESD Channel 2 C2 FILTER2 Filter + ESD Channel 2 FILTER3 Filter + ESD Channel 3 C3 FILTER3 Filter + ESD Channel 3 A4 FILTER4 Filter + ESD Channel 4 C4 FILTER4 Filter + ESD Channel 4 A5 FILTER5 Filter + ESD Channel 5 C5 FILTER5 Filter + ESD Channel 5 A6 FILTER6 Filter + ESD Channel 6 C6 FILTER6 Filter + ESD Channel 6 A7 FILTER7 Filter + ESD Channel 7 C7 FILTER7 Filter + ESD Channel 7 A8 FILTER8 Filter + ESD Channel 8 C8 FILTER8 Filter + ESD Channel 8 B1-B4 GND Device Ground © 2005 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 08/30/05 PRELIMINARY CM1426 Ordering Information PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish Bumps Package Ordering Part Number1 Part Marking Ordering Part Number1 10 CSP CM1426-04CS N264 CM1426-04CP N264 15 CSP CM1426-06CS N266 CM1426-06CP N266 20 CSP CM1426-08CS N268 CM1426-08CP N268 Part Marking Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 500 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1) SYMBOL R PARAMETER CONDITIONS Resistance MIN TYP MAX UNITS 80 100 120 Ω Total Channel Capacitance At 2.5VDC Reverse Bias, 1MHz, 30mVAC 13.6 17 20.4 pF C Capacitance C1 At 2.5VDC Reverse Bias, 1MHz, 30mVAC 6.8 8.5 10.2 pF VDIODE Standoff Voltage IDIODE=10μA 6.0 ILEAK Diode Leakage Current (reverse bias) VDIODE= 3.3V 0.1 1 μA VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10mA ILOAD = -10mA 6.8 -0.8 9.0 -0.4 V V VESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 CTOTAL 5.6 -1.5 V Notes 2 and 3 ±15 kV ±8 kV © 2005 California Micro Devices Corp. All rights reserved. 08/30/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 3 PRELIMINARY CM1426 ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1) RDYN fC Dynamic Resistance Positive Negative Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω 2.3 0.9 Ω Ω 230 MHz R=100Ω, C=17pF Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: These parameters are guaranteed by design and characterization. © 2005 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 08/30/05 PRELIMINARY CM1426 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B1) Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B1) © 2005 California Micro Devices Corp. All rights reserved. 08/30/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 5 PRELIMINARY CM1426 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2) Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2) © 2005 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 08/30/05 PRELIMINARY CM1426 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B3) Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B3) © 2005 California Micro Devices Corp. All rights reserved. 08/30/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 7 PRELIMINARY CM1426 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 7. Insertion Loss vs. Frequency (A7-C7 to GND B4) Figure 8. Insertion Loss vs. Frequency (A8-C8 to GND B4) © 2005 California Micro Devices Corp. All rights reserved. 8 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 08/30/05 PRELIMINARY CM1426 Performance Information (cont’d) Capacitance (Normalized) Typical Diode Capacitance vs. Input Voltage DC Voltage Figure 9. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) © 2005 California Micro Devices Corp. All rights reserved. 08/30/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 9 PRELIMINARY CM1426 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous (183°C) 60 seconds Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste 240°C Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 10. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 11. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 12. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2005 California Micro Devices Corp. All rights reserved. 10 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 08/30/05 PRELIMINARY CM1426 Mechanical Details CSP Mechanical Specifications CM1426 devices are supplied in custom Chip Scale Packages (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. CM1426-04 Mechanical Specifications The package dimensions for the CM1426-04 are presented below. Mechanical Package Diagrams PACKAGE DIMENSIONS Package Custom CSP Bumps 10 Min Nom Max A1 1.915 1.960 2.005 0.0754 0.0772 0.0789 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 A B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 C A2 0.091 Max 1 2 3 4 C2 # per tape and reel Nom C1 B2 B1 Inches Min OptiGuardTM Coating A1 B4 B3 Dim Millimeters BOTTOM VIEW 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS 0.0110 D1 D2 SIDE VIEW DIMENSIONS IN MILLIMETERS Package Dimensions for CM1426-04 Chip Scale Package 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1426-04 1.96 x 1.33 x 0.644 2.08 x 1.45 x 0.71 8mm 178mm (7") 3500 4mm 4mm 10 Pitches cumulative tolerance on tape ±0.2 mm Po Top Cover Tape Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment Center lines of cavity P1 User direction of feed Figure 13. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 08/30/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 11 PRELIMINARY CM1426 Mechanical Details (cont’d) CM1426-06 Mechanical Specifications The package dimensions for the CM1426-06 are presented below. Mechanical Package Diagrams PACKAGE DIMENSIONS Package Custom CSP Bumps 15 C1 Millimeters Inches Nom Max A1 2.915 2.960 3.005 0.1148 0.1165 0.1183 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 B A2 Max C2 Nom 0.091 B2 B1 C Min # per tape and reel Min OptiGuardTM Coating A1 B4 B3 Dim BOTTOM VIEW A 1 2 3 4 5 6 D1 D2 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW DIMENSIONS IN MILLIMETERS 0.0110 Package Dimensions for CM1426-06 Chip Scale Package 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 CM1426-06 2.96 x 1.33 x 0.644 3.10 x 1.45 x 0.74 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 8mm 178mm (7") 3500 4mm 4mm 10 Pitches cumulative tolerance on tape ±0.2 mm Po Top Cover Tape Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment Center lines of cavity P1 User direction of feed Figure 14. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 12 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 08/30/05 PRELIMINARY CM1426 Mechanical Details (cont’d) CM1426-08 Mechanical Specifications The package dimensions for the CM1426-08 are presented below. Mechanical Package Diagrams PACKAGE DIMENSIONS Custom CSP Bumps 20 Inches Nom Max Min 3.915 3.960 4.005 Nom B Max A 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel A 0.1541 0.1559 0.1577 A2 0.091 A2 A1 C Millimeters Min B2 B1 C2 Dim A1 C1 B4 B3 Package OptiGuardTM Coating BOTTOM VIEW 1 2 3 4 5 6 7 8 D1 D2 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW DIMENSIONS IN MILLIMETERS Package Dimensions for CM1426-08 Chip Scale Package 0.0110 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1426-08 3.96 x 1.33 x 0.644 4.11 x 1.57 x 0.76 8mm 178mm (7") 3500 4mm 4mm 10 Pitches cumulative tolerance on tape ±0.2 mm Po Top Cover Tape Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment Center lines of cavity P1 User direction of feed Figure 15. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 08/30/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 13