MC10SX1189 Fibre Channel Coaxial Cable Driver and Loop Resiliency Circuit Description The MC10SX1189 is a differential receiver, differential transmitter specifically designed to drive coaxial cables. It incorporates the output cable drive capability of the MC10EL89 Coaxial Cable Driver with additional circuitry to multiplex the output cable drive source between the cable receiver or the local transmitter inputs. The multiplexer control circuitry is TTL compatible for ease of operation. The MC10SX1189 is useful as a bypass element for Fibre Channel-Arbitrated Loop (FC-AL) or Serial Storage Architecture (SSA) applications, to create loop style interconnects with fault tolerant, active switches at each device node. This device is particularly useful for back panel applications where small size is desirable. The EL89 style drive circuitry produces swings twice as large as a standard PECL output. When driving a coaxial cable, proper termination is required at both ends of the line to minimize reflections. The 1.6 V output swings allow for proper termination at both ends of the cable, while maintaining the required swing at the receiving end of the cable. Because of the larger output swings, the QT, QT outputs are terminated into the thevenin equivalent of 50 W to VCC − 3.0 V instead of 50 W to VCC − 2.0 V. www.onsemi.com FIBRE CHANNEL COAXIAL CABLE DRIVER AND LOOP RESILIENCY CIRCUIT 16 1 SOIC−16 CASE 751B−05 MARKING DIAGRAM* 10SX1189G AWLYWW Features • 425 ps Propagation Delay • 1.6 V Output Swing on the Cable Driving Output • Operation Range: • • • • ♦ VCC = 4.5 V to 5.5 V 75 kW Internal Input Pull Down Resistors >1000 V ESD Protection Transistor Count = 102 These Devices are Pb-Free, Halogen Free and are RoHS Compliant 10SX1189 = Specific Device Code A = Assembly Location WL = Wafer Lot Y = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION Device MC10SX1189DG © Semiconductor Components Industries, LLC, 2016 August, 2016 − Rev. 5 1 Package Shipping SOIC−16 (Pb-Free) 48 Units/Tube Publication Order Number: MC10SX1189/D MC10SX1189 TRUTH TABLE VCC DR DR GND VBB DT DT SEL 16 15 14 13 12 11 10 9 SEL Function L H DR → QT DT → QT PIN NAMES 1 2 3 4 5 6 7 QR QR VCC NC VCC QT QT Function DR/DR QR/QR Differential Input from Receive Cable Buffered Differential Output from Receive Cable Differential Input to Transmit Cable Buffered Differential Output to Transmit Cable Multiplexer Control Signal (TTL) Positive Power Supply Ground Reference Voltage Output DT/DT QT/QT 8 VCC Figure 1. Pinout: SOIC−16 (Top View) LOCAL RECEIVE DATA (ECL LEVELS) Pins SEL VCC GND VBB QR QR DR DR FROM INPUT CABLE (ECL LEVELS) VBB 1 LOCAL TRANSMIT DATA (ECL LEVELS) DT DT 0 QT QT TO OUTPUT CABLE (ENHANCED SWING) SEL (TTL) Figure 2. LOGIC DIAGRAM Table 1. ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit VCC Power Supply Voltage (Referenced to GND) 0 to +7.0 Vdc VIN Input Voltage (Referenced to GND) 0 to +6.0 Vdc IOUT Output Current Continuous Surge TA TSTG 50 100 mA Operating Temperature Range −40 to +85 °C Storage Temperature Range −50 to +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. www.onsemi.com 2 MC10SX1189 Table 2. DC CHARACTERISTICS (VCC = 5.0 V, VEE = 0 V) -40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit VOH Output Voltage High (QR,QR) VCC = 5.0 V, GND = 0 V (Notes 1, 2) 3.92 4.05 4.22 3.97 4.11 4.27 4.00 4.16 4.30 V VOL Output Voltage Low (QR,QR) VCC = 5.0 V, GND = 0 V (Notes 1, 2) 3.05 3.23 3.35 3.07 3.24 3.37 3.10 3.25 3.41 V VOH Output Voltage High (QT,QT) VCC = 5.0 V, GND = 0 V (Notes 1, 3) 3.83 3.95 4.10 3.88 4.02 4.15 3.90 4.09 4.17 V VOL Output Voltage Low (QT,QT) VCC = 5.0 V, GND = 0 V (Notes 1, 3) 1.90 2.33 2.50 1.85 2.26 2.45 1.85 2.23 2.45 V ICC Quiescent Supply Current (Note 4) 20 25 42 23 27 47 25 28 47 mA VIH Input Voltage High (DR,DR & DT,DT) VCC = 5.0 V, GND = 0 V (Note 1) 3.77 4.11 3.87 4.19 3.94 4.28 V VIL Input Voltage Low (DR,DR & DT,DT) VCC = 5.0 V, GND = 0 V (Note 1) 3.05 3.50 3.05 3.52 3.05 3.56 V VIH Input Voltage High SEL 2.0 VIL Input Voltage Low SEL VBB Output Reference Voltage VCC = 5.0 V, GND = 0 V (Note 1) IIH Input HIGH Current IIL Input LOW Current 2.0 2.0 0.8 3.57 3.63 3.70 0.8 3.65 150 0.5 V 3.70 3.75 3.69 150 0.5 0.5 3.75 0.8 V 3.81 V 150 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Values will track 1:1 with the VCC supply. VEE can vary +0.5 V to −0.5 V. 2. Outputs loaded with 50 W to VCC − 2.0 V. 3. Outputs loaded with 50 W to VCC − 3.0 V. 4. Outputs open circuited. www.onsemi.com 3 MC10SX1189 Table 3. AC CHARACTERISTICS (VCC = 4.5 V to 5.5 V) (Note 1) −40°C Symbol tPLH, tPHL Characteristic Propagation Delay to Output DR → QR (Diff) (SE) DR → QT (Diff) (SE) DT → QT (Diff) (SE) Min Typ 0 to 85°C Max Min Typ Max Unit ps Condition Note 2 Note 3 175 150 250 225 225 200 300 300 425 425 400 400 450 500 650 700 650 725 225 175 300 250 275 225 325 325 450 450 425 425 500 550 650 700 650 725 Propagation Delay SEL → QT,QT 450 600 850 500 650 800 tr, tf Rise TimeQR,QR Fall Time 100 100 275 275 400 400 125 125 275 275 400 400 ps 20% to 80% 80% to 20% tr, tf Rise TimeQT,QT Fall Time 150 150 300 300 550 550 150 150 300 300 550 550 ps 20% to 80% 80% to 20% ps Note 4 15 15 1.5V to 50% Pt tskew Within Device Skew VPP Minimum Input Swing 200 1000 200 1000 mV Note 5 VCMR Common Mode Range 3.00 4.35 3.00 4.35 V Note 6 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. VEE can vary +0.5 V to −0.5 V. 2. The differential propagation delay is defined as the delay from the crossing points of the differential input signals to the crossing point of the differential output signals. 3. The single-ended propagation delay is defined as the delay from the 50% point of the input signal to the 50% point of the output signal. 4. Duty cycle skew is the difference between tPLH and tPHL propagation delay through a device. 5. Minimum input swing for which AC parameters are guaranteed. 6. The CMR range is referenced to the most positive side of the differential input signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPP Min and 1.0 V. www.onsemi.com 4 MC10SX1189 PACKAGE DIMENSIONS SOIC−16 CASE 751B−05 ISSUE K −A− 16 9 1 8 −B− P NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS AAND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 8 PL 0.25 (0.010) M B S DIM A B C D F G J K M P R G R K F X 45 _ C −T− SEATING PLANE STYLE 5: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 16 PL 0.25 (0.010) STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. J M D MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 COLLECTOR BASE EMITTER NO CONNECTION EMITTER BASE COLLECTOR COLLECTOR BASE EMITTER NO CONNECTION EMITTER BASE COLLECTOR EMITTER COLLECTOR STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. DRAIN, DYE #1 DRAIN, #1 DRAIN, #2 DRAIN, #2 DRAIN, #3 DRAIN, #3 DRAIN, #4 DRAIN, #4 GATE, #4 SOURCE, #4 GATE, #3 SOURCE, #3 GATE, #2 SOURCE, #2 GATE, #1 SOURCE, #1 STYLE 6: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. M T B S A S CATHODE ANODE NO CONNECTION CATHODE CATHODE NO CONNECTION ANODE CATHODE CATHODE ANODE NO CONNECTION CATHODE CATHODE NO CONNECTION ANODE CATHODE STYLE 3: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. COLLECTOR, DYE #1 BASE, #1 EMITTER, #1 COLLECTOR, #1 COLLECTOR, #2 BASE, #2 EMITTER, #2 COLLECTOR, #2 COLLECTOR, #3 BASE, #3 EMITTER, #3 COLLECTOR, #3 COLLECTOR, #4 BASE, #4 EMITTER, #4 COLLECTOR, #4 CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE ANODE ANODE ANODE ANODE ANODE ANODE ANODE ANODE STYLE 7: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. SOURCE N‐CH COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) GATE P‐CH COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) SOURCE P‐CH SOURCE P‐CH COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) GATE N‐CH COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) SOURCE N‐CH STYLE 4: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. SOLDERING FOOTPRINT COLLECTOR, DYE #1 COLLECTOR, #1 COLLECTOR, #2 COLLECTOR, #2 COLLECTOR, #3 COLLECTOR, #3 COLLECTOR, #4 COLLECTOR, #4 BASE, #4 16X EMITTER, #4 0.58 BASE, #3 EMITTER, #3 BASE, #2 EMITTER, #2 BASE, #1 EMITTER, #1 www.onsemi.com 5 8X 6.40 16X 1 1.12 16 1.27 PITCH 8 9 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MC10SX1189 ECLinPS is a registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 www.onsemi.com 6 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MC10SX1189/D