ON MC100E196 Programmable delay chip Datasheet

 SEMICONDUCTOR TECHNICAL DATA
The MC10E/100E196 is a programmable delay chip (PDC) designed
primarily for very accurate differential ECL input edge placement
applications.
The delay section consists of a chain of gates and a linear ramp delay
adjust organized as shown in the logic symbol. The first two delay
elements feature gates that have been modified to have delays 1.25 and
1.5 times the basic gate delay of approximately 80 ps. These two
elements provide the E196 with a digitally-selectable resolution of
approximately 20 ps. The required device delay is selected by the seven
address inputs D[0:6], which are latched on chip by a high signal on the
latch enable (LEN) control.
The FTUNE input takes an analog voltage and applies it to an internal
linear ramp for reducing the 20 ps resolution still further. The FTUNE input
is what differentiates the E196 from the E195.
An eighth latched input, D7, is provided for cascading multiple PDC’s
for increased programmable range. The cascade logic allows full control
of multiple PDC’s, at the expense of only a single added line to the data
bus for each additional PDC, without the need for any external gating.
•
•
•
•
•
•
•
PROGRAMMABLE
DELAY CHIP
2.0ns Worst Case Delay Range
≈20ps/Delay Step Resolution
Linear Input for Tighter Resolution
>1.0GHz Bandwidth
On Chip Cascade Circuitry
Extended 100E VEE Range of –4.2 to –5.46V
75KΩ Input Pulldown Resistors
FN SUFFIX
PLASTIC PACKAGE
CASE 776-02
PIN NAMES
Pin
Function
IN/IN
EN
D[0:7]
Q/Q
LEN
SET MIN
SET MAX
CASCADE
FTUNE
Signal Input
Input Enable
Mux Select Inputs
Signal Output
Latch Enable
Min Delay Set
Max Delay Set
Cascade Signal
Linear Voltage Input
LOGIC DIAGRAM – SIMPLIFIED
VBB
FTUNE
11
IN
IN
EN
* 1.25
0
0
1
1
0
1
1
0
1
1
4 GATES
1
0
8 GATES
1
0
16 GATES
1
0
1
* 1.5
0
1
CASCADE
LEN
LEN
SET MIN
SET MAX
D0
* DELAYS ARE 25% OR 50% LONGER THAN
* STANDARD (STANDARD ≈ 80 PS)
7 BIT LATCH
D1
D2
D3
D5
D6
D7
12/93
 Motorola, Inc. 1996
2–1
LINEAR
RAMP
Q
LATCH
D
D4
Q
Q
1
REV 2
CASCADE
CASCADE
MC10E196 MC100E196
Pinout: 28-Lead PLCC (Top View)
D2
D3
D4
D5
D6
D7
NC
25
24
23
22
21
20
19
18
FTUNE
D0
27
17
NC
LEN
28
16
VCC
VEE
1
15
VCCO
IN
2
14
Q
IN
3
13
Q
VBB
4
12
VCCO
7
8
9
NC
NC
EN
10
11
CASCADE
6
CASCADE
5
SET MAX
26
SET MIN
D1
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0°C
Symbol
Characteristic
IIH
Input HIGH Current
IEE
Power Supply Current
10E
100E
Min
Typ
25°C
Max
Min
Typ
150
85°C
Max
Min
Typ
150
Max
150
Unit
Condition
µA
mA
130
130
156
156
130
130
156
156
130
150
156
179
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0°C
Symbol
25°C
85°C
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
tPLH
tPHL
Propagation Delay
IN to Q; Tap = 0
IN to Q; Tap = 127
EN to Q; Tap = 0
D7 to CASCADE
1210
3320
1250
300
1360
3570
1450
450
1510
3820
1650
700
1240
3380
1275
300
1390
3630
1475
450
1540
3880
1675
700
1440
3920
1350
300
1590
4270
1650
450
1765
4720
1950
700
tRANGE
Programmable Range
tPD (max) – tPD (min)
2000
2175
2050
2240
2375
2580
55
115
250
505
1000
17
34
68
136
272
544
1088
55
115
250
515
1030
17.5
35
70
140
280
560
1120
65
140
305
620
1240
21
42
84
168
336
672
1344
D1
D0
D1
D0
D1
D0
∆t
Step Delay
D0 High
D1 High
D2 High
D3 High
D4 High
D5 High
D6 High
Lin
Linearity
tSKEW
Duty Cycle Skew
tPHL–tPLH
MOTOROLA
Unit
Notes
ps
ps
ps
105
180
325
620
1190
105
180
325
620
1220
6
120
205
380
740
1450
7
ps
±30
±30
2–2
±30
1
ECLinPS and ECLinPS Lite
DL140 — Rev 4
MC10E196 MC100E196
AC CHARACTERISTICS (continued) (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0°C
Symbol
ts
th
tR
Characteristic
Min
Typ
Setup Time
D to LEN
D to IN
EN to IN
200
800
200
0
Hold Time
LEN to D
IN to EN
500
0
250
Release Time
EN to IN
SET MAX to LEN
SET MIN to LEN
300
800
800
25°C
Max
Min
Typ
200
800
200
0
500
0
250
85°C
Max
Min
Typ
200
800
200
0
500
0
250
Max
Unit
Notes
ps
2
3
ps
tjit
Jitter
tr
tf
Output Rise/Fall Time
20–80% (Q)
20–80% (CASCADE)
4
ps
300
800
800
<5.0
300
800
800
<5.0
5
<5.0
ps
8
ps
125
300
225
450
325
650
125
300
225
450
325
650
125
300
225
450
325
650
1. Duty cycle skew guaranteed only for differential operation measured from the cross point of the input to the cross point of the output.
2. This setup time defines the amount of time prior to the input signal the delay tap of the device must be set.
3. This setup time is the minimum time that EN must be asserted prior to the next transition of IN/IN to prevent an output response greater than
±75 mV to that IN/IN transition.
4. This hold time is the minimum time that EN must remain asserted after a negative going IN or positive going IN to prevent an output response
greater than ±75 mV to that IN/IN transition.
5. This release time is the minimum time that EN must be deasserted prior to the next IN/IN transition to ensure an output response that meets
the specified IN to Q propagation delay and transition times.
6. Specification limits represent the amount of delay added with the assertion of each individual delay control pin. The various combinations of
asserted delay control inputs will typically realize D0 resolution steps across the specified programmable range.
7. The linearity specification guarantees to which delay control input the programmable steps will be monotonic (i.e. increasing delay steps for
increasing binary counts on the control inputs Dn). Typically the device will be monotonic to the D0 input, however under worst case conditions
and process variation, delays could decrease slightly with increasing binary counts when the D0 input is the LSB. With the D1 input as the LSB
the device is guaranteed to be monotonic over all specified environmental conditions and process variation.
8. The jitter of the device is less than what can be measured without resorting to very tedious and specialized measurement techniques.
ANALOG INPUT CHARACTERISTICS
Ftune = VCC to VEE
140
100
90
PROPAGATION DELAY (ps)
PROPAGATION DELAY (ps)
120
100
80
60
40
80
70
60
50
40
30
20
20
0
–4.5
10
–3.5
–2.5
–1.5
0
–5
–0.5
FTUNE VOLTAGE (V)
–3
–2
–1
0
FTUNE VOLTAGE (V)
Propagation Delay versus Ftune Voltage
(100E196)
ECLinPS and ECLinPS Lite
DL140 — Rev 4
–4
Propagation Delay versus Ftune Voltage
(10E196)
2–3
MOTOROLA
MC10E196 MC100E196
USING THE FTUNE ANALOG INPUT
expanded for larger E195 chains. The D7 input of the E195 is
the cascade control pin. With the interconnect scheme of
Figure 1 when D7 is asserted it signals the need for a larger
programmable range than is achievable with a single device.
The analog FTUNE pin on the E196 device is intended to
enhance the 20 ps resolution capabilities of the fully digital
E195. The level of resolution obtained is dependent on the
number of increments applied to the appropriate range on the
FTUNE pin.
An expansion of the latch section of the block diagram is
pictured below. Use of this diagram will simplify the
explanation of how the cascade circuitry works. When D7 of
chip #1 above is low the cascade output will also be low while
the cascade bar output will be a logical high. In this condition
the SET MIN pin of chip #2 will be asserted and thus all of the
latches of chip #2 will be reset and the device will be set at its
minimum delay. Since the RESET and SET inputs of the
latches are overriding any changes on the A0–A6 address bus
will not affect the operation of chip #2.
To provide another level of resolution the FTUNE pin must
be capable of adjusting the delay by greater than the 20 ps
digital resolution. From the provided graphs one sees that this
requirement is easily achieved as over the entire FTUNE
voltage range a 100 ps delay can be achieved. This extra
analog range ensures that the FTUNE pin will be capable even
under worst case conditions of covering the digital
resolution.Typically the analog input will be driven by an
external DAC to provide a digital control with very fine analog
output steps. The final resolution of the device will be
dependent on the width of the DAC chosen.
Chip #1 on the other hand will have both SET MIN and SET
MAX de-asserted so that its delay will be controlled entirely by
the address bus A0–A6. If the delay needed is greater than
can be achieved with 31.75 gate delays (1111111 on the
A0–A6 address bus) D7 will be asserted to signal the need to
cascade the delay to the next E195 device. When D7 is
asserted the SET MIN pin of chip #2 will be de-asserted and
the delay will be controlled by the A0–A6 address bus. Chip #1
on the other hand will have its SET MAX pin asserted
resulting in the device delay to be independent of the A0–A6
address bus.
To determine the voltage range necessary for the FTUNE
input, the graphs provided should be used. As an example if a
range of 40 ps is selected to cover worst case conditions and
ensure coverage of the digital range, from the 100E196 graph
a voltage range of –3.25 V to –4.0 V would be necessary on the
FTUNE pin. Obviously there are numerous voltage ranges
which can be used to cover a given delay range, users are
given the flexibility to determine which one best fits their
designs.
When the SET MAX pin of chip #1 is asserted the D0 and D1
latches will be reset while the rest of the latches will be set. In
addition, to maintain monotonicity an additional gate delay is
selected in the cascade circuitry. As a result when D7 of chip
#1 is asserted the delay increases from 31.75 gates to 32
gates. A 32 gate delay is the maximum delay setting for
the E195.
Cascading Multiple E196’s
To increase the programmable range of the E195 internal
cascade circuitry has been included. This circuitry allows for
the cascading of multiple E195’s without the need for any
external gating. Furthermore this capability requires only one
more address line per added E195. Obviously cascading
multiple PDC’s will result in a larger programmable range,
however, this increase is at the expense of a longer minimum
delay.
When cascading multiple PDC’s it will prove more cost
effective to use a single E196 for the MSB of the chain while
using E195 for the lower order bits. This is due to the fact that
only one fine tune input is needed to further reduce the delay
step resolution.
Figure 1 illustrates the interconnect scheme for cascading
two E195’s. As can be seen, this scheme can easily be
ADDRESS BUS (A0–A6)
LINEAR
INPUT
CASCADE
EN
VBB
CASCADE
IN
SET MIN
INPUT
SET MAX
VEE
IN
LEN
Q
VEE
IN
Q
IN
VCC0
D7
D6
D5
D3
D4
E196
Chip #2
VCC
VCC0
Q
VBB
CASCADE
VCC
VCC0
CASCADE
E196
Chip #1
SET MAX
D0
EN
LEN
FTUNE
D1
SET MIN
FTUNE
D1
D0
D2
D7
D6
D5
D4
D3
D2
A7
Q
OUTPUT
VCC0
Figure 1. Cascading Interconnect Architecture
MOTOROLA
2–4
ECLinPS and ECLinPS Lite
DL140 — Rev 4
MC10E196 MC100E196
TO SELECT MULTIPLEXERS
BIT 0
D0
BIT 1
Q0
D1
BIT 2
Q1
D2
BIT 3
Q2
D3
BIT 4
Q3
D4
BIT 5
Q4
D5
BIT 6
Q5
BIT 7
CASCADE
D6
Q6
LEN
LEN
LEN
LEN
LEN
LEN
LEN
Reset Reset
Reset Reset
Reset Reset
Reset Reset
Reset Reset
Reset Reset
Reset Reset
D7
Q7
CASCADE
LEN
Reset Reset
SET MIN
SET MAX
Figure 2. Expansion of the Latch Section of the E195 Block Diagram
ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–5
MOTOROLA
MC10E196 MC100E196
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
0.007 (0.180)
B
Y BRK
-N-
T L –M
M
U
0.007 (0.180)
X
G1
M
S
N
T L –M
S
S
N
S
D
Z
-L-
-M-
D
W
28
V
1
C
A
0.007 (0.180)
M
R
0.007 (0.180)
M
T L –M
S
T L –M
S
N
S
N
S
H
S
N
S
0.007 (0.180)
M
T L –M
N
S
S
0.004 (0.100)
G
J
-T-
K
SEATING
PLANE
F
VIEW S
G1
T L –M
S
N
0.007 (0.180)
M
T L –M
S
N
S
VIEW S
S
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
MOTOROLA
T L –M
K1
E
S
S
VIEW D-D
Z
0.010 (0.250)
0.010 (0.250)
2–6
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.485 0.495
0.485 0.495
0.165 0.180
0.090 0.110
0.013 0.019
0.050 BSC
0.026 0.032
0.020
—
0.025
—
0.450 0.456
0.450 0.456
0.042 0.048
0.042 0.048
0.042 0.056
—
0.020
2°
10°
0.410 0.430
0.040
—
MILLIMETERS
MIN
MAX
12.32 12.57
12.32 12.57
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
—
0.64
—
11.43
11.58
11.43
11.58
1.07
1.21
1.07
1.21
1.07
1.42
—
0.50
2°
10°
10.42 10.92
1.02
—
ECLinPS and ECLinPS Lite
DL140 — Rev 4
MC10E196 MC100E196
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