DCR1570L65 Phase Control Thyristor DS5812-3 January 2014 (LN31242) FEATURES KEY PARAMETERS Double Side Cooling High Surge Capability VDRM IT(AV) ITSM dV/dt* dI/dt APPLICATIONS 6500V 1568A 22000A 1500V/µs 300A/µs * Higher dV/dt selections available High Power Drives High Voltage Power Supplies Static Switches VOLTAGE RATINGS Part and Ordering Number DCR1570L65* DCR1570L60 DCR1570L55 DCR1570L50 Repetitive Peak Voltages VDRM and VRRM V 6500 6000 5500 5000 Conditions Tvj = -40°C to 125°C, IDRM = IRRM = 300mA, VDRM, VRRM tp = 10ms, VDSM & VRSM = VDRM & VRRM + 100V respectively Lower voltage grades available. 0 0 * 6200V @ -40 C, 6500V @ 0 C ORDERING INFORMATION When ordering, select the required part number shown in the Voltage Ratings selection table. Outline type code: L (See Package Details for further information) Fig. 1 Package outline For example: DCR1570L65 Note: Please use the complete part number when ordering and quote this number in any future correspondence relating to your order. 1/10 www.dynexsemi.com DCR1570L65 SEMICONDUCTOR CURRENT RATINGS Tcase = 60°C unless stated otherwise Symbol Parameter Test Conditions Max. Units 1570 A Double Side Cooled IT(AV) Mean on-state current IT(RMS) RMS value - 2466 A Continuous (direct) on-state current - 2340 A IT Half wave resistive load SURGE RATINGS Symbol ITSM 2 It Parameter Surge (non-repetitive) on-state current Test Conditions Max. Units 10ms half sine, Tcase = 125°C 22.0 kA VR = 0 2.42 MA s Min. Max. Units 2 I t for fusing 2 THERMAL AND MECHANICAL RATINGS Symbol Rth(j-c) Rth(c-h) Parameter Thermal resistance – junction to case Thermal resistance – case to heatsink Test Conditions Double side cooled DC - 0.0117 °C/W Single side cooled Anode DC - 0.0187 °C/W Cathode DC - 0.0329 °C/W Double side - 0.0025 °C/W - 0.005 °C/W - 125 °C Clamping force 37kN (with mounting compound) Blocking VDRM / VRRM Single side Tvj Virtual junction temperature Tstg Storage temperature range -55 125 °C Fm Clamping force 33 41 kN 2/10 www.dynexsemi.com DCR1570L65 SEMICONDUCTOR DYNAMIC CHARACTERISTICS Symbol IRRM/IDRM Parameter Test Conditions Min. Max. Units Peak reverse and off-state current At VRRM/VDRM, Tcase = 125°C - 300 mA dV/dt Max. linear rate of rise of off-state voltage To 67% VDRM, Tj = 125°C, gate open - 1500 V/µs dI/dt Rate of rise of on-state current From 67% VDRM to 2x IT(AV) Repetitive 50Hz - 150 A/µs Gate source 30V, 10, Non-repetitive - 300 A/µs tr < 0.5µs, Tj = 125°C VT(TO) rT tgd Threshold voltage – Low level 100A to 1500A at Tcase = 125°C - 1.0 V Threshold voltage – High level 1500A to 7200A at Tcase = 125°C - 1.2 V On-state slope resistance – Low level 100A to 1500A at Tcase = 125°C - 0.615 m On-state slope resistance – High level 1500A to 7200A at Tcase = 125°C - 0.5 m VD = 67% VDRM, gate source 30V, 10 - 3 µs - 1200 µs 2000 4500 µC Delay time tr = 0.5µs, Tj = 25°C tq Turn-off time Tj = 125°C, VR = 200V, dI/dt = 1A/µs, dVDR/dt = 20V/µs linear QS Stored charge IT = 2000A, Tj = 125°C, dI/dt – 1A/µs, IL Latching current Tj = 25°C, VD = 5V - 3 A IH Holding current Tj = 25°C, RG-K = , ITM = 500A, IT = 5A - 300 mA 3/10 www.dynexsemi.com DCR1570L65 SEMICONDUCTOR GATE TRIGGER CHARACTERISTICS AND RATINGS Symbol Parameter Test Conditions Max. Units VGT Gate trigger voltage VDRM = 5V, Tcase = 25°C 1.5 V VGD Gate non-trigger voltage At 50% VDRM, Tcase = 125°C 0.4 V IGT Gate trigger current VDRM = 5V, Tcase = 25°C 350 mA IGD Gate non-trigger current At 50% VDRM, Tcase = 125°C 15 mA CURVES Instantaneous on-state current TI - (A) 7000 6000 5000 4000 3000 2000 min 125°C max 125°C min 25°C max 25°C 1000 0 1.0 2.0 3.0 4.0 5.0 Instantaneous on-state voltage V T - (V) Fig.2 Maximum & minimum on-state characteristics VTM EQUATION VTM = A + Bln (IT) + C.IT+D.IT Where A = 0.666848 B = 0.033446 C = 0.000418 D = 0.009666 these values are valid for Tj = 125°C for IT 100A to 7200A 4/10 www.dynexsemi.com DCR1570L65 SEMICONDUCTOR 130 10 120 Mean power dissipation - (kW) o Maximum case temperature, Tcase ( C ) 11 9 8 7 6 5 180 4 120 3 90 2 60 1 30 90 100 60 90 30 80 70 60 50 40 30 20 10 0 0 1000 2000 3000 0 500 1000 1500 2000 2500 Mean on-state current, IT(AV) - (A) Mean on-state current, IT(AV) - (A) Fig.3 On-state power dissipation – sine wave Fig.4 Maximum permissible case temperature, double side cooled – sine wave 130 180 120 110 100 120 12 90 11 Mean power dissipation - (kW) o 120 110 0 Maximum heatsink temperature, THeatsink - ( C ) 180 60 90 30 80 70 60 50 40 30 20 10 10 9 8 7 6 d.c. 5 180 4 120 90 3 60 2 30 1 0 0 0 500 1000 1500 2000 2500 Mean on-state current, IT(AV) - (A) Fig.5 Maximum permissible heatsink temperature, double side cooled – sine wave 0 1000 2000 3000 4000 Mean on-state current, IT(AV) - (A) Fig.6 On-state power dissipation – rectangular wave 5/10 www.dynexsemi.com DCR1570L65 130 130 d.c. 120 Maximum heatsik temperature Theatsink - (oC) T - (°C) Maximum permissible case temperature ,case SEMICONDUCTOR 180 110 120 100 90 90 60 80 30 70 60 50 40 30 20 10 0 d.c. 120 180 110 120 100 90 90 60 80 30 70 60 50 40 30 20 10 0 0 1000 2000 3000 4000 0 Mean on-state current, IT(AV) - (A) 1000 2000 Fig.7 Maximum permissible case temperature, double side cooled – rectangular wave Anode side cooled 35 Cathode side cooled 2 2.6074 3 4.2073 4 4.041 0.008639 0.0533503 0.3309504 1.612 0.9647 2.8312 4.9433 9.909 0.0096096 0.0627037 0.4198958 8.908 0.9285 2.9366 2.3581 26.683 0.0093033 0.0621535 0.3092235 5.835 Ri (°C/kW) Ti (s) Double Side Cooling Anode Side Cooling Cathode Sided Cooling 1 0.8342 Ri (°C/kW) Ti (s) Thermal Impedance, tZhj-c ( °C/kW) 4000 Fig.8 Maximum permissible heatsink temperature, double side cooled – rectangular wave Double side cooled 30 3000 Mean on-state current, IT(AV) - (A) Ri (°C/kW) Ti (s) Zth = [Ri x ( 1-exp. (t/ti))] 25 Rth(j-c) Conduction 20 Tables show the increments of thermal resistance R th(j-c) when the device operates at conduction angles other than d.c. 15 Double side cooling Zth (z) 10 5 0 0.001 0.01 0.1 1 10 100 ° 180 120 90 60 30 15 sine. 1.45 1.68 1.93 2.16 2.34 2.42 rect. 0.98 1.40 1.64 1.90 2.19 2.34 Anode Side Cooling Zth (z) ° 180 120 90 60 30 15 sine. 1.43 1.66 1.90 2.12 2.30 2.37 rect. 0.97 1.39 1.62 1.88 2.15 2.30 Cathode Sided Cooling Zth (z) ° 180 120 90 60 30 15 sine. 1.44 1.66 1.91 2.14 2.31 2.39 rect. 0.97 1.39 1.63 1.89 2.17 2.31 Time ( s ) Fig.9 Maximum (limit) transient thermal impedance – junction to case (°C/kW) 6/10 www.dynexsemi.com DCR1570L65 SEMICONDUCTOR Fig.10 Multi-cycle surge current Fig.11 Single-cycle surge current 25000 700 Reverse recovery current, RI R - (A) Qs (Max) = 5265.1*(di/dt)0.4473 Stored Charge, Qs- (uC) 20000 15000 Qs(Min)=2592.3*(di/dt)0.5818 10000 Conditions: Tj = 125° C, VRpeak ~ 4500V VRM ~ 3000V snubber as appropriate to control reverse voltages 5000 5 10 15 20 25 600 500 400 300 Irr (Min)= 37.17*(di/dt)0.8012 Conditions: Tj = 125° C, VRpeak ~ 4500V VRM ~ 3000V snubber as appropriate to control reverse voltages 200 100 0 0 Irr (Max) = 53.831*(di/dt)0.729 30 Rate of change of on-state current, di/dt - (A/us) 0 0 5 10 15 20 25 30 Rate of decay of on-state current, di/dt - (A/us) Fig.12 Reverse recovery charge Fig.13 Reverse recovery current 7/10 www.dynexsemi.com DCR1570L65 SEMICONDUCTOR Fig14 Gate Characteristics 30 Lower Limit Upper Limit 5W 10W 20W 50W 100W 150W -40C Gate trigger voltage, VGT - (V) 25 20 15 10 5 0 0 1 2 3 4 5 6 7 8 9 10 Gate trigger current, IGT - (A) Fig. 15 Gate characteristics 8/10 www.dynexsemi.com DCR1570L65 SEMICONDUCTOR PACKAGE DETAILS For further package information, please contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Device DCR1374SBA18 DCR1375SBA28 DCR1376SBA36 DCR2690L22 DCR2480L28 DCR2040L42 DCR1850L52 DCR1570L65 DCR1300L85 Maximum Minimum Thickness Thickness (mm) (mm) 34.515 33.965 34.59 34.04 34.82 34.27 34.515 33.965 34.59 34.04 34.82 34.27 34.94 34.39 35.2 34.65 35.56 35.01 Nominal weight: 1500g Clamping force: 37kN ±10% Lead length: 420mm Lead terminal connector: M4 ring Package outline type code: L Fig.16 Package outline 9/10 www.dynexsemi.com DCR1570L65 SEMICONDUCTOR IMPORTANT INFORMATION: This publication is provided for information only and not for resale. The products and information in this publication are intended for use by appropriately trained technical personnel. Due to the diversity of product applications, the information contained herein is provided as a general guide only and does not constitute any guarantee of suitability for use in a specific application.The user must evaluate the suitability of the product and the completeness of the product data for the application. The user is responsible for product selection and ensuring all safety and any warning requirements are met. Should additional product information be needed please contact Customer Service. Although we have endeavoured to carefully compile the information in this publication it may contain inaccuracies or typographical errors. The information is provided without any warranty or guarantee of any kind. This publication is an uncontrolled document and is subject to change without notice. When referring to it please ensure that it is the most up to date version and has not been superseded. The products are not intended for use in applications where a failure or malfunction may cause loss of life, injury or damage to property. The user must ensure that appropriate safety precautions are taken to prevent or mitigate the consequences of a product failure or malfunction. The products must not be touched when operating because there is a danger of electrocution or severe burning. Always use protective safety equipment such as appropriate shields for the product and wear safety glasses. Even when disconnected any electric charge remaining in the product must be discharged and allowed to cool before safe handling using protective gloves. Extended exposure to conditions outside the product ratings may affect reliability leading to premature product failure. Use outside the product ratings is likely to cause permanent damage to the product. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture, a large current to flow or high voltage arcing, resulting in fire or explosion. Appropriate application design and safety precautions should always be followed to protect persons and property. Product Status & Product Ordering: We annotate datasheets in the top right hand corner of the front page, to indicate product status if it is not yet fully approved for production. The annotations are as follows:Target Information: Provisional Information: Preliminary Information: No Annotation: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Some initial development work has been performed. The datasheet represents a view of the end product based on very limited information. Certain details will change. The product design is complete and final characterisation for volume production is in progress.The datasheet represents the product as it is now understood but details may change. The product has been approved for production and unless otherwise notified by Dynex any product ordered will be supplied to the current version of the data sheet prevailing at the time of our order acknowledgement. All products and materials are sold and services provided subject to Dynex’s conditions of sale, which are available on request. Any brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LIMITED Doddington Road, Lincoln, Lincolnshire, LN6 3LF United Kingdom. Phone: +44 (0) 1522 500500 Fax: +44 (0) 1522 500550 Web: http://www.dynexsemi.com Dynex Semiconductor Ltd. CUSTOMER SERVICE Phone: +44 (0) 1522 502753 / 502901 Fax: +44 (0) 1522 500020 e-mail: [email protected] Technical Documentation – Not for resale. 10/10 www.dynexsemi.com