AP2161/ AP2171 1A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH Description Pin Assignments The AP2161 and AP2171 are integrated high-side power switches ( Top View ) optimized for Universal Serial Bus (USB) and other hot-swap applications. The family of devices complies with USB 2.0 and GND 1 8 NC IN 2 7 OUT IN 3 6 OUT EN 4 5 FLG available with both polarities of Enable input. They offer current and thermal limiting and short circuit protection as well as controlled rise time and under-voltage lockout functionality. A 7ms deglitch capability on the open-drain Flag output prevents false over-current reporting and does not require any external components. SO-8 All devices are available in SO-8, MSOP-8EP, SOT25, and U-DFN2018-6 packages Features Single USB Port Power Switches Over-Current and Thermal Protection 1.5A Accurate Current Limiting Reverse Current Blocking 95mΩ On-Resistance Input Voltage Range: 2.7V – 5.5V 0.6ms Typical Rise Time Very Low Shutdown Current: 1µA (max) Fault Report (FLG) with Blanking Time (7ms typ) ESD Protection: 4kV HBM, 300V MM Active Low (AP2161) or Active High (AP2171) Enable Ambient Temperature Range: -40°C to +85°C SOT25, SO-8, MSOP-8EP (Exposed Pad), and U-DFN2018-6: Available in “Green” Molding Compound (No Br, Sb) Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) UL Recognized, File Number E322375 IEC60950-1 CB Scheme Certified Applications Consumer electronics – LCD TV & Monitor, Game Machines Communications – Set-Top-Box, GPS, Smartphone ( Top View ) GND 1 6 OUT IN 2 5 OUT EN 3 4 FLG U-DFN2018-6 Computing – Laptop, Desktop, Servers, Printers, Docking Station, HUB Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. AP2161/ AP2171 Document number: DS31564 Rev. 7 - 2 1 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2161/ AP2171 Typical Applications Circuit AP2171 Enable Active High IN Power Supply 2.7V to 5.5V 10k 10uF Load OUT 0.1uF 0.1uF 120uF FLG EN ON GND OFF Available Options Part Number Channel Enable Pin (EN) Current Limit (typ) Recommended Maximum Continuous Load Current AP2161 AP2171 1 1 Active Low Active High 1.5A 1.5A 1.0A 1.0A Pin Descriptions Pin Number Pin Name SO-8 MSOP-8EP SOT25 U-DFN2018-6 GND IN EN 1 2, 3 4 1 2, 3 4 2 5 4 1 2 3 FLG 5 5 3 4 OUT NC 6, 7 8 6, 7 8 1 N/A 5, 6 N/A Exposed tab - Exposed tab - Exposed tab AP2161/ AP2171 Document number: DS31564 Rev. 7 - 2 Function Ground Voltage input pin (all IN pins must be tied together externally) Enable input, active low (AP2161) or active high (AP2171) Over-current and over-temperature fault report; open-drain flag is active low when triggered Voltage output pin (all OUT pins must be tied together externally) No internal connection; recommend tie to OUT pins Exposed pad. It should be connected to GND and thermal mass for enhanced thermal impedance. It should not be used as electrical ground conduction path. 2 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2161/ AP2171 Functional Block Diagram AP2161, AP2171 IN Current Sense OUT Current Limit FLG UVLO Driver EN Thermal Sense Deglitch GND Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol ESD HBM Parameter Human Body Model ESD Protection Machine Model ESD Protection for MSOP-8EP, SOT25 packages ESD MM Machine Model ESD Protection for U-DFN2018-6, SO-8 packages Input Voltage Ratings 4 Units kV 400 V 300 V 6.5 V VOUT Output Voltage VIN +0.3 V VEN , VFLG Enable Voltage 6.5 V VIN Maximum Continuous Load Current ILOAD Internal Limited A 150 °C -65 to +150 °C Maximum Junction Temperature TJ(MAX) Storage Temperature Range (Note 4) TST Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C) Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol Parameter VIN Input voltage IOUT Output Current Min 2.7 Max 5.5 Units V 0 1.0 A TA Operating Ambient Temperature -40 +85 C VIH High-Level Input Voltage on EN or EN 2.0 VIN V VIL Low-Level Input Voltage on EN or EN 0 0.8 V AP2161/ AP2171 Document number: DS31564 Rev. 7 - 2 3 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2161/ AP2171 Electrical Characteristics (@TA = +25°C, VIN = +5V, unless otherwise specified.) Symbol Parameter Test Conditions Min Typ Max Unit 1.6 1.9 2.5 V VUVLO Input UVLO RLOAD = 1kΩ ISHDN Input Shutdown Current Disabled, IOUT = 0 0.5 1 A IQ Input Quiescent Current Enabled, IOUT = 0 45 70 µA ILEAK Input Leakage Current Disabled, OUT grounded 1 µA IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at VIN RDS(ON) Switch on-resistance VIN = 5V, IOUT = 1A TA = +25°C VIN = 3.3V, IOUT = 1A TA = +25°C Enabled into short circuit, CL = 68µF VIN = 5V, VOUT = 4.6V, CL = 68µF, -40°C ≤ TA ≤ +85°C ITrig Current limiting trigger threshold Output Current Slew rate (<100A/s) , CL=68µF ISINK EN Input leakage VEN = 5V tD(ON) tR tD(OFF) tF 115 110 120 140 140 -40°C ≤ TA ≤ +85°C Over-Load Current Limit ILIMIT µA 95 90 -40°C ≤ TA ≤ +85°C Short-Circuit Current Limit ISHORT 1 SOT25, MSOP-8EP, SO-8 U-DFN2018-6 mΩ 170 1.2 1.1 1.5 A 1.9 2.0 A A 1 µA Output turn-on delay time CL = 1µF, RLOAD = 10Ω 0.05 Output turn-on rise time CL = 1µF, RLOAD = 10Ω 0.6 ms Output turn-off delay time CL = 1µF, RLOAD = 10Ω 0.01 Output turn-off fall time CL = 1µF, RLOAD = 10Ω 0.05 0.1 20 40 Ω 7 15 ms 1.5 ms ms ms Fault Flag RFLG FLG output FET on-resistance IFLG = 10mA tBlank FLG blanking time CIN = 10µF, CL = 68µF 4 Over-Temperature Protection TSHDN Thermal Shutdown Threshold THYS Thermal Shutdown Hysteresis θJA Notes: Thermal Resistance Junction-toAmbient C Enabled, RLOAD = 1kΩ 140 25 C SO-8 (Note 5) 110 °C/W MSOP-8EP (Note 6) SOT25 (Note 7) 60 157 °C/W °C/W U-DFN2018-6 (Note 8) 70 °C/W 5. Test condition for SO-8: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout. 6. Test condition for MSOP-8EP: Device mounted on 2” x 2” FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane. 7. Test condition for SOT25: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout. 8. Test condition for U-DFN2018-6: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom layer 1.0”x1.4” ground plane. AP2161/ AP2171 Document number: DS31564 Rev. 7 - 2 4 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2161/ AP2171 Typical Performance Characteristics VEN 50% TD(ON) TF TD(ON) 90% 10% TD(OFF) TR TF 90% 50% 50% TD(OFF) TR VOUT VEN 50% VOUT 10% 90% 10% 90% 10% Figure 1 Voltage Waveforms: AP2161 (left), AP2171 (right) All Enable Plots are for AP2171 Active High Turn-On Delay and Rise Time Turn-Off Delay and Fall Time Ven 5V/div Ven 5V/div CL = 1µF Vout 2V/div TA = +25°C Vout 2V/div RL = 10Ω CL = 1µF TA = +25°C RL = 10Ω 500µs/div 500µs/div Turn-On Delay and Rise Time Turn-Off Delay and Fall Time Ven 5V/div Ven 5V/div CL = 100µF TA = +25°C Vout 2V/div Vout 2V/div RL = 10Ω CL = 100µF TA = +25°C RL = 10Ω 500µs/div 500µs/div AP2161/ AP2171 Document number: DS31564 Rev. 7 - 2 5 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2161/ AP2171 Typical Performance Characteristics (cont.) Short Circuit Current, Device Enabled Into Short Inrush Current Ven 5V/div Ven 5V/div CL=100µF VIN = 5V TA = +25°C RL = 5Ω Iout 200mA/div VIN = 5V CL=470µF TA = +25°C Iout 500mA/div CL = 68µF CL=220µF 500µs/div 1ms/div 1 Ω Load Connected to Enabled Device 2Ω Load Connected to Enabled Device VIN = 5V TA = +25°C Vflag 2V/div CL = 68µF Iout 1A/div VIN = 5V TA = +25°C Vflag 2V/div CL= 68µF Iout 1A/div 2ms/div 2ms/div Short Circuit with Blanking Time and Recovery Power On VIN = 5V TA = +25°C Vout 5V/div Vflag 5V/div CL = 68µF Iout 500mA/di v Vflag 5V/div TA = +25°C CL = 68µF RL = 5Ω Ven 5V/div Iout 1A/div Vin 5V/div 20ms/div AP2161/ AP2171 Document number: DS31564 Rev. 7 - 2 1ms/div 6 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2161/ AP2171 Typical Performance Characteristics (cont.) UVLO Increasing UVLO Decreasing TA = +25°C Vin 2V/div CL = 68µF Vin 2V/div RL = 5Ω TA = +25°C CL = 68µF RL = 5Ω Iout 500mA/div 1ms/div 10ms/div Turn-On Time vs Input Voltage Turn-Off Time vs Input Voltage 750 30 700 29 650 29 Turn-Off Time (us) Turn-On Time (us) Iout 500mA/div 600 550 500 450 400 CL = 1µF 350 CL = 1µF RL = 10Ω 28 TA = +25°C 28 27 27 26 RL = 10Ω 300 26 TA = +25°C 25 250 1.5 2 2.5 3 3.5 4 4.5 5 5.5 1.5 6 2 2.5 3 3.5 4 4.5 5 5.5 6 Input Voltage (V) Input Voltage (V) Fall Time vs Input Voltage Rise Time vs Input Voltage 22 650 600 22 Fall Time (us) Rise Time (us) 550 500 450 400 CL = 1µF 350 RL = 10Ω 300 TA = +25°C 21 21 CL = 1µF 20 RL = 10Ω 20 TA = +25°C 19 250 2 2.5 3 3.5 4 4.5 5 5.5 6 2 AP2161/ AP2171 Document number: DS31564 Rev. 7 - 2 2.5 3 3.5 4 4.5 5 5.5 6 Input Voltage (V) Input Voltage (V) 7 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2161/ AP2171 Typical Performance Characteristics (cont.) Supply Current, Output Disabled vs Ambient Temperature Supply Current, Output Enabled vs Ambient Temperature 63 Supply Current, Output Disabled (uA) Supply Current, Output Enabled (uA) 68 Vin=5.0V 58 Vin=5.5V 53 48 43 38 33 Vin=3.3V Vin=2.7V Vin=5.5V 0.8 Vin=3.3V 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Vin=2.7V 0.0 28 -60 -40 -20 0 20 40 60 80 -60 100 -40 -20 Static Drain-Source On-State Resistance vs Ambient Temperature 20 40 60 1.56 Short-Circuit Output Current (A) Vin=2.7V 160 150 140 130 Vin=3.3V 110 100 Vin=5V 90 80 -40 -20 0 20 40 100 CL=100µF 1.55 Vin=3.3V 1.54 Vin=2.7V Vin=5.0V 1.53 1.52 1.51 1.50 1.49 1.48 1.47 1.46 Vin=5.5V 1.45 -60 80 Short-Circuit Output Current vs Ambient Temperature 170 Static Drain-Source On-State Resistance (mΩ) 0 Ambient Temperature (°C) Ambient Temperature (°C) 120 Vin=5.0V 60 80 100 -60 -40 -20 Ambient Temperature (°C) 0 20 40 60 80 100 Ambient Temperature (°C) Threshold Trip Current vs Input Voltage Undervoltage Lockout vs Ambient Temperature 1.99 2.20 Threshold Trip Current (A) Undervoltage Lockout (V) 1.98 2.10 UVLO Rising 2.00 1.90 1.80 UVLO Falling 1.70 1.97 1.96 1.95 1.94 1.93 1.92 TA = +25°C 1.91 CL = 68µF 1.90 1.89 1.88 1.60 -60 -40 -20 0 20 40 60 80 100 2.8 AP2161/ AP2171 Document number: DS31564 Rev. 7 - 2 3.3 3.8 4.3 4.8 5.3 Input Voltage (V) Ambient Temperature (°C) 8 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2161/ AP2171 Typical Performance Characteristics (cont.) Current Limit Response vs Peak Current Current Limit Response (us) 120 100 80 VIN = 5V 60 TA = +25°C 40 20 0 0 2 4 6 8 10 12 Peak Current (A) AP2161/ AP2171 Document number: DS31564 Rev. 7 - 2 9 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2161/ AP2171 Application Information Power Supply Considerations A 0.01-μF to 0.1-μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value electrolytic capacitor on the input (10-μF minimum) and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-μF to 0.1-μF ceramic capacitor improves the immunity of the device to short-circuit transients. Over-current and Short Circuit Protection An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an over-current condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN has been applied. The AP2161/AP2171 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT. In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT. In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2161/AP2171 is capable of delivering current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode and is set at ILIMIT. Note that when the output has been shorted to GND at extremely low temperature (< -30°C), a minimum 120-μF electrolytic capacitor on the output pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature characteristics of less than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic capacitor type is Panasonic FC series. FLG Response When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout. The AP2161/AP2171 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: 2 PD = RDS(ON)× I Finally, calculate the junction temperature: TJ = PD x RθJA + TA Where: TA = Ambient temperature °C RθJA = Thermal resistance PD = Total power dissipation Thermal Protection Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The AP2161/AP2171 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately 145°C due to excessive power dissipation in an over-current or short-circuit condition, the internal thermal sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch. AP2161/ AP2171 Document number: DS31564 Rev. 7 - 2 10 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2161/ AP2171 Application Information (cont.) Under-Voltage Lockout (UVLO) Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. Host/Self-Powered And Bus-Powered HUBs Hosts and self-powered hubs have a local power supply that powers the embedded functions and the downstream ports (see Figure 2). This power supply must provide from 5.25V to 4.75V to the board side of the downstream connection under full-load and no-load conditions. Hosts and SPHs are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop PCs, monitors, printers, and stand-alone hubs. Figure 2 Typical One-Port USB Host / Self-Powered Hub Generic Hot-Plug Applications In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. Due to the controlled rise times and fall times of the AP2161/AP2171, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2161/AP2171 also ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion. By placing the AP2161/AP2171 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system surge current and provides a hot-plugging mechanism for any device. AP2161/ AP2171 Document number: DS31564 Rev. 7 - 2 11 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2161/ AP2171 Ordering Information Part Number Package Code Packaging AP21X1WG-7 AP21X1SG-13 AP21X1MPG-13 AP21X1FMG-7 W S MP FM SOT25 SO-8 MSOP-8EP U-DFN2018-6 7”/13” Tape and Reel Quantity Part Number Suffix 3000/Tape & Reel -7 2500/Tape & Reel -13 2500/Tape & Reel -13 3000/Tape & Reel -7 Marking Information (1) SO-8 ( Top view ) 8 7 6 5 Logo Part Number 8 : Active Low 9 : Active High YY WW X X 2 1 (2) 1 : 1 Channel G : Green YY : Year : 08, 09,10~ WW : Week : 01~52; 52 represents 52 and 53 week X : Internal Code AP21X X 3 4 MSOP-8EP ( Top view ) 8 7 Logo AP21X X 1 Document number: DS31564 Rev. 7 - 2 5 Y W XE Part Number 8 : Active Low 9 : Active High AP2161/ AP2171 6 2 3 A~Z : Green MSOP -8EP Y : Year : 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week ; z represents 52 and 53 week 1 : 1 Channel 4 12 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2161/ AP2171 Marking Information (cont.) (3) SOT25 ( Top View ) 4 7 5 XX Y W X 1 (4) 2 3 XX : Identification code Y : Year 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : A~Z : Green Device AP2161W AP2171W Package type SOT25 SOT25 Identification Code HT HU Device Package type Identification Code AP2161FM AP2171FM U-DFN2018-6 U-DFN2018-6 HT HU U-DFN2018-6 AP2161/ AP2171 Document number: DS31564 Rev. 7 - 2 13 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2161/ AP2171 Package Outline Dimensions (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. Package Type: SO-8 0.254 (1) E1 E A1 L Gauge Plane Seating Plane Detail ‘A’ 7°~9° h 45° Detail ‘A’ A2 A A3 b e D (2) SO-8 Dim Min Max A 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25 b 0.3 0.5 D 4.85 4.95 E 5.90 6.10 E1 3.85 3.95 e 1.27 Typ h 0.35 L 0.62 0.82 0 8 All Dimensions in mm Package Type: MSOP-8EP D 4X 10 ° 0.25 D1 x E E2 Gauge Plane Seating Plane a y 1 4X 10 ° 8Xb e Detail C E3 A1 A3 L c A2 A D E1 See Detail C AP2161/ AP2171 Document number: DS31564 Rev. 7 - 2 14 of 18 www.diodes.com MSOP-8EP Dim Min Max Typ A 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 D 2.90 3.10 3.00 D1 1.60 2.00 1.80 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E2 1.30 1.70 1.50 E3 2.85 3.05 2.95 e 0.65 L 0.40 0.80 0.60 a 0° 8° 4° x 0.750 y 0.750 All Dimensions in mm March 2013 © Diodes Incorporated AP2161/ AP2171 Package Outline Dimensions (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. (3) Package Type: SOT25 A SOT25 Dim Min Max Typ A 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D 0.95 H 2.90 3.10 3.00 J 0.013 0.10 0.05 K 1.00 1.30 1.10 L 0.35 0.55 0.40 M 0.10 0.20 0.15 N 0.70 0.80 0.75 0° 8° All Dimensions in mm B C H K J (4) M N L D Package Type: U-DFN2018-6 A3 A U-DFN2018-6 Dim Min Max Typ A 0.545 0.605 0.575 A1 0 0.05 0.02 A3 0.13 b 0.15 0.25 0.20 D 1.750 1.875 1.80 D2 1.30 1.50 1.40 e 0.50 E 1.95 2.075 2.00 E2 0.90 1.10 1.00 L 0.20 0.30 0.25 z 0.30 All Dimensions in mm SEATING PLANE A1 Pin#1 ID D D2 L E2 E z e AP2161/ AP2171 Document number: DS31564 Rev. 7 - 2 b 15 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2161/ AP2171 Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (1) Package Type: SO-8 X Dimensions X Y C1 C2 C1 C2 Value (in mm) 0.60 1.55 5.4 1.27 Y (2) Package Type: MSOP-8EP X C Y G Dimensions Y2 C G X X1 Y Y1 Y2 Y1 X1 (3) Value (in mm) 0.650 0.450 0.450 2.000 1.350 1.700 5.300 Package Type: SOT25 C2 Z C2 Dimensions Value (in mm) Z 3.20 G 1.60 X 0.55 Y 0.80 C1 G C1 C2 Y 2.40 0.95 X AP2161/ AP2171 Document number: DS31564 Rev. 7 - 2 16 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2161/ AP2171 Suggested Pad Layout (cont.) Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (4) Package Type: U-DFN2018-6 X C Y Dimensions C G X X1 Y Y1 Y1 G Value (in mm) 0.50 0.20 0.25 1.60 0.35 1.20 X1 Taping Orientation (Note 9) For U-DFN2018-6 Notes: 9. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf AP2161/ AP2171 Document number: DS31564 Rev. 7 - 2 17 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2161/ AP2171 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. 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LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2013, Diodes Incorporated www.diodes.com AP2161/ AP2171 Document number: DS31564 Rev. 7 - 2 18 of 18 www.diodes.com March 2013 © Diodes Incorporated