Lattice LC4064ZE7TN64IES 1.8v in-system programmable ultra low power pld Datasheet

®
ispMACH 4000ZE Family
1.8V In-System Programmable
Ultra Low Power PLDs
August 2008
Data Sheet DS1022
■ Broad Device Offering
Features
• 32 to 256 macrocells
• Multiple temperature range support
– Commercial: 0 to 90°C junction (Tj)
– Industrial: -40 to 105°C junction (Tj)
• Space-saving packages
■ High Performance
• fMAX = 260MHz maximum operating frequency
• tPD = 4.4ns propagation delay
• Up to four global clock pins with programmable
clock polarity control
• Up to 80 PTs per output
■ Easy System Integration
• Operation with 3.3V, 2.5V, 1.8V or 1.5V
LVCMOS I/O
• 5V tolerant I/O for LVCMOS 3.3, LVTTL, and PCI
interfaces
• Hot-socketing support
• Open-drain output option
• Programmable output slew rate
• 3.3V PCI compatible
• I/O pins with fast setup path
• Input hysteresis*
• 1.8V core power supply
• IEEE 1149.1 boundary scan testable
• IEEE 1532 ISC compliant
• 1.8V In-System Programmable (ISP™) using
Boundary Scan Test Access Port (TAP)
• Pb-free package options (only)
• On-chip user oscillator and timer*
■ Ease of Design
• Flexible CPLD macrocells with individual clock,
reset, preset and clock enable controls
• Up to four global OE controls
• Individual local OE control per I/O pin
• Excellent First-Time-FitTM and refit
• Wide input gating (36 input logic blocks) for fast
counters, state machines and address decoders
■ Ultra Low Power
•
•
•
•
Standby current as low as 10µA typical
1.8V core; low dynamic power
Operational down to 1.6V VCC
Superior solution for power sensitive consumer
applications
• Per pin pull-up, pull-down or bus keeper
control*
• Power Guard with multiple enable signals*
*New enhanced features over original ispMACH 4000Z
Table 1. ispMACH 4000ZE Family Selection Guide
ispMACH 4032ZE
ispMACH 4064ZE
ispMACH 4128ZE
ispMACH 4256ZE
32
64
128
256
Macrocells
tPD (ns)
4.4
4.7
5.8
5.8
tS (ns)
2.2
2.5
2.9
2.9
tCO (ns)
3.0
3.2
3.8
3.8
fMAX (MHz)
260
241
200
200
Supply Voltages (V)
1.8V
1.8V
1.8V
1.8V
Packages1 (I/O + Dedicated Inputs)
48-Pin TQFP (7 x 7mm)
32+4
32+4
64-Ball csBGA (5 x 5mm)
32+4
48+4
100-Pin TQFP (14 x 14mm)
64+10
144-Pin TQFP (20 x 20mm)
144-Ball csBGA (7 x 7mm)
64+10
64+10
64+10
96+4
96+14
96+4
108+4
1. Pb-free only.
© 2008 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
1
DS1022_01.2
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
Introduction
The high performance ispMACH 4000ZE family from Lattice offers an ultra low power CPLD solution. The new family is based on Lattice’s industry-leading ispMACH 4000 architecture. Retaining the best of the previous generation,
the ispMACH 4000ZE architecture focuses on significant innovations to combine high performance with low power
in a flexible CPLD family. For example, the family’s new Power Guard feature minimizes dynamic power consumption by preventing internal logic toggling due to unnecessary I/O pin activity.
The ispMACH 4000ZE combines high speed and low power with the flexibility needed for ease of design. With its
robust Global Routing Pool and Output Routing Pool, this family delivers excellent First-Time-Fit, timing predictability, routing, pin-out retention and density migration.
The ispMACH 4000ZE family offers densities ranging from 32 to 256 macrocells. There are multiple density-I/O
combinations in Thin Quad Flat Pack (TQFP) and Chip Scale BGA (csBGA) packages ranging from 32 to 176 pins/
balls. Table 1 shows the macrocell, package and I/O options, along with other key parameters.
A user programmable internal oscillator and a timer are included in the device for tasks like LED control, keyboard
scanner and similar housekeeping type state machines. This feature can be optionally disabled to save power.
The ispMACH 4000ZE family has enhanced system integration capabilities. It supports a 1.8V supply voltage and
3.3V, 2.5V, 1.8V and 1.5V interface voltages. Additionally, inputs can be safely driven up to 5.5V when an I/O bank
is configured for 3.3V operation, making this family 5V tolerant. The ispMACH 4000ZE also offers enhanced I/O
features such as slew rate control, PCI compatibility, bus-keeper latches, pull-up resistors, pull-down resistors,
open drain outputs and hot socketing. Pull-up, pull-down and bus-keeper features are controllable on a “per-pin”
basis. The ispMACH 4000ZE family members are 1.8V in-system programmable through the IEEE Standard 1532
interface. IEEE Standard 1149.1 boundary scan testing capability also allows product testing on automated test
equipment. The 1532 interface signals TCK, TMS, TDI and TDO are referenced to VCC (logic core).
Overview
The ispMACH 4000ZE devices consist of multiple 36-input, 16-macrocell Generic Logic Blocks (GLBs) interconnected by a Global Routing Pool (GRP). Output Routing Pools (ORPs) connect the GLBs to the I/O Blocks (IOBs),
which contain multiple I/O cells. This architecture is shown in Figure 1.
VCCO1
GND
TCK
TMS
TDI
TDO
VCC
GND
GOE0
GOE1
VCCO0
GND
CLK0/I
CLK1/I
CLK2/I
CLK3/I
Figure 1. Functional Block Diagram
OSC
16
Generic
Logic
Block
36
I/O
Block
ORP
16
36
16
16
36
36
2
Generic
Logic
Block
I/O
Block
16
ORP
I/O Bank 1
16
16
I/O Bank 0
ORP
Generic
Logic
Block
Global Routing Pool
I/O
Block
Generic
Logic
Block
I/O
Block
16
ORP
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
The I/Os in the ispMACH 4000ZE are split into two banks. Each bank has a separate I/O power supply. Inputs can
support a variety of standards independent of the chip or bank power supply. Outputs support the standards compatible with the power supply provided to the bank. Support for a variety of standards helps designers implement
designs in mixed voltage environments. In addition, 5V tolerant inputs are specified within an I/O bank that is connected to a VCCO of 3.0V to 3.6V for LVCMOS 3.3, LVTTL and PCI interfaces.
Architecture
There are a total of two GLBs in the ispMACH 4032ZE, increasing to 16 GLBs in the ispMACH 4256ZE. Each GLB
has 36 inputs. All GLB inputs come from the GRP and all outputs from the GLB are brought back into the GRP to
be connected to the inputs of any other GLB on the device. Even if feedback signals return to the same GLB, they
still must go through the GRP. This mechanism ensures that GLBs communicate with each other with consistent
and predictable delays. The outputs from the GLB are also sent to the ORP. The ORP then sends them to the associated I/O cells in the I/O block.
Generic Logic Block
The ispMACH 4000ZE GLB consists of a programmable AND array, logic allocator, 16 macrocells and a GLB clock
generator. Macrocells are decoupled from the product terms through the logic allocator and the I/O pins are decoupled from macrocells through the ORP. Figure 2 illustrates the GLB.
To GRP
CLK3
CLK2
CLK1
CLK0
Figure 2. Generic Logic Block
Clock
Generator
1+OE
1+OE
1+OE
1+OE
To ORP
16 MC Feedback Signals
16 Macrocells
Logic Allocator
36 Inputs
from GRP
AND Array
36 Inputs,
83 Product Terms
1+OE
1+OE
1+OE
1+OE
To Product Term
Output Enable Sharing.
Also, To Input Enable of
Power Guard on I/Os
in the block.
AND Array
The programmable AND Array consists of 36 inputs and 83 output product terms. The 36 inputs from the GRP are
used to form 72 lines in the AND Array (true and complement of the inputs). Each line in the array can be connected to any of the 83 output product terms via a wired-AND. Each of the 80 logic product terms feed the logic
allocator with the remaining three control product terms feeding the Shared PT Clock, Shared PT Initialization and
Shared PT OE. The Shared PT Clock and Shared PT Initialization signals can optionally be inverted before being
fed to the macrocells.
Every set of five product terms from the 80 logic product terms forms a product term cluster starting with PT0.
There is one product term cluster for every macrocell in the GLB. Figure 3 is a graphical representation of the AND
Array.
3
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
Figure 3. AND Array
In[0]
In[34]
In[35]
PT0
PT1
PT2
PT3
PT4
Cluster 0
PT75
PT76
PT77
Cluster 15
PT78
PT79
PT80 Shared PT Clock
PT81 Shared PT Initialization
PT82 Shared PTOE/BIE
Note:
Indicates programmable fuse.
Enhanced Logic Allocator
Within the logic allocator, product terms are allocated to macrocells in product term clusters. Each product term
cluster is associated with a macrocell. The cluster size for the ispMACH 4000ZE family is 4+1 (total 5) product
terms. The software automatically considers the availability and distribution of product term clusters as it fits the
functions within a GLB. The logic allocator is designed to provide two speed paths: 20-PT Speed Locking path and
an up to 80-PT path. The availability of these two paths lets designers trade timing variability for increased performance.
The enhanced Logic Allocator of the ispMACH 4000ZE family consists of the following blocks:
• Product Term Allocator
• Cluster Allocator
• Wide Steering Logic
Figure 4 shows a macrocell slice of the Logic Allocator. There are 16 such slices in the GLB.
Figure 4. Macrocell Slice
to to
n-1 n-2
from from
n-1 n-4
From
n-4
1-80
PTs
5-PT
n
To XOR (MC)
Cluster
to
n+1
Individual Product
Term Allocator
from from
n+2 n+1
Cluster
Allocator
4
To n+4
SuperWIDE™
Steering Logic
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
Product Term Allocator
The product term allocator assigns product terms from a cluster to either logic or control applications as required
by the design being implemented. Product terms that are used as logic are steered into a 5-input OR gate associated with the cluster. Product terms that used for control are steered either to the macrocell or I/O cell associated
with the cluster. Table 2 shows the available functions for each of the five product terms in the cluster.
Table 2. Individual PT Steering
Product Term
Logic
PTn
Logic PT
Single PT for XOR/OR
Control
PTn+1
Logic PT
Individual Clock (PT Clock)
PTn+2
Logic PT
Individual Initialization or Individual Clock Enable (PT Initialization/CE)
PTn+3
Logic PT
Individual Initialization (PT Initialization)
PTn+4
Logic PT
Individual OE (PTOE)
Cluster Allocator
The cluster allocator allows clusters to be steered to neighboring macrocells, thus allowing the creation of functions
with more product terms. Table 3 shows which clusters can be steered to which macrocells. Used in this manner,
the cluster allocator can be used to form functions of up to 20 product terms. Additionally, the cluster allocator
accepts inputs from the wide steering logic. Using these inputs, functions up to 80 product terms can be created.
Table 3. Available Clusters for Each Macrocell
Macrocell
Available Clusters
M0
—
C0
C1
C2
M1
C0
C1
C2
C3
M2
C1
C2
C3
C4
M3
C2
C3
C4
C5
M4
C3
C4
C5
C6
M5
C4
C5
C6
C7
M6
C5
C6
C7
C8
M7
C6
C7
C8
C9
M8
C7
C8
C9
C10
M9
C8
C9
C10
C11
M10
C9
C10
C11
C12
M11
C10
C11
C12
C13
M12
C11
C12
C13
C14
M13
C12
C13
C14
C15
M14
C13
C14
C15
—
M15
C14
C15
—
—
Wide Steering Logic
The wide steering logic allows the output of the cluster allocator n to be connected to the input of the cluster allocator n+4. Thus, cluster chains can be formed with up to 80 product terms, supporting wide product term functions
and allowing performance to be increased through a single GLB implementation. Table 4 shows the product term
chains.
5
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
Table 4. Product Term Expansion Capability
Expansion
Chains
Macrocells Associated with Expansion Chain
(with Wrap Around)
Max PT/
Macrocell
Chain-0
M0 → M4 → M8 → M12 → M0
75
Chain-1
M1 → M5 → M9 → M13 → M1
80
Chain-2
M2 → M6 → M10 → M14 → M2
75
Chain-3
M3 → M7 → M11 → M15 → M3
70
Every time the super cluster allocator is used, there is an incremental delay of tEXP . When the super cluster allocator is used, all destinations other than the one being steered to, are given the value of ground (i.e., if the super cluster is steered to M (n+4), then M (n) is ground).
Macrocell
The 16 macrocells in the GLB are driven by the 16 outputs from the logic allocator. Each macrocell contains a programmable XOR gate, a programmable register/latch, along with routing for the logic and control functions.
Figure 5 shows a graphical representation of the macrocell. The macrocells feed the ORP and GRP. A direct input
from the I/O cell allows designers to use the macrocell to construct high-speed input registers. A programmable
delay in this path allows designers to choose between the fastest possible set-up time and zero hold time.
Figure 5. Macrocell
Power-up
Initialization
Shared PT Initialization
PT Initialization (optional)
PT Initialization/CE (optional)
Delay
From I/O Cell
R
From Logic Allocator
D/T/L
P
To ORP
Q
To GRP
CE
Single PT
Block CLK0
Block CLK1
Block CLK2
Block CLK3
PT Clock (optional)
Shared PT Clock
Enhanced Clock Multiplexer
The clock input to the flip-flop can select any of the four block clocks along with the shared PT clock, and true and
complement forms of the optional individual term clock. An 8:1 multiplexer structure is used to select the clock. The
eight sources for the clock multiplexer are as follows:
• Block CLK0
• Block CLK1
6
Lattice Semiconductor
•
•
•
•
•
•
ispMACH 4000ZE Family Data Sheet
Block CLK2
Block CLK3
PT Clock
PT Clock Inverted
Shared PT Clock
Ground
Clock Enable Multiplexer
Each macrocell has a 4:1 clock enable multiplexer. This allows the clock enable signal to be selected from the following four sources:
• PT Initialization/CE
• PT Initialization/CE Inverted
• Shared PT Clock
• Logic High
Initialization Control
The ispMACH 4000ZE family architecture accommodates both block-level and macrocell-level set and reset capability. There is one block-level initialization term that is distributed to all macrocell registers in a GLB. At the macrocell level, two product terms can be “stolen” from the cluster associated with a macrocell to be used for set/reset
functionality. A reset/preset swapping feature in each macrocell allows for reset and preset to be exchanged, providing flexibility.
Note that the reset/preset swapping selection feature affects power-up reset as well. All flip-flops power up to a
known state for predictable system initialization. If a macrocell is configured to SET on a signal from the block-level
initialization, then that macrocell will be SET during device power-up. If a macrocell is configured to RESET on a
signal from the block-level initialization or is not configured for set/reset, then that macrocell will RESET on powerup. To guarantee initialization values, the VCC rise must be monotonic, and the clock must be inactive until the reset
delay time has elapsed.
GLB Clock Generator
Each ispMACH 4000ZE device has up to four clock pins that are also routed to the GRP to be used as inputs.
These pins drive a clock generator in each GLB, as shown in Figure 6. The clock generator provides four clock signals that can be used anywhere in the GLB. These four GLB clock signals can consist of a number of combinations
of the true and complement edges of the global clock signals.
Figure 6. GLB Clock Generator
CLK0
Block CLK0
CLK1
Block CLK1
CLK2
Block CLK2
CLK3
Block CLK3
7
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
Output Routing Pool (ORP)
The Output Routing Pool allows macrocell outputs to be connected to any of several I/O cells within an I/O block.
This provides greater flexibility in determining the pinout and allows design changes to occur without affecting the
pinout. The output routing pool also provides a parallel capability for routing macrocell-level OE product terms. This
allows the OE product term to follow the macrocell output as it is switched between I/O cells. The enhanced ORP of
the ispMACH 4000ZE family consists of the following elements:
• Output Routing Multiplexers
• OE Routing Multiplexers
Figure 7 shows the structure of the ORP from the I/O cell perspective. This is referred to as an ORP slice. Each
ORP has as many ORP slices as there are I/O cells in the corresponding I/O block.
Figure 7. ORP Slice
OE Routing Multiplexer
From PTOE
To I/O
Cell
OE
Output Routing Multiplexer
From Macrocell
To I/O
Cell
Output Routing Multiplexers
The details of connections between the macrocells and the I/O cells vary across devices and within a device
dependent on the maximum number of I/Os available. Tables 5-7 provide the connection details.
Table 5. GLB/MC/ORP Combinations for ispMACH 4256ZE
GLB/MC
ORP Mux Input Macrocells
[GLB] [MC 0]
M0, M1, M2, M3, M4, M5, M6, M7
[GLB] [MC 1]
M2, M3, M4, M5, M6, M7, M8, M9
[GLB] [MC 2]
M4, M5, M6, M7, M8, M9, M10, M11
[GLB] [MC 3]
M6, M7, M8, M9, M10, M11, M12, M13
[GLB] [MC 4]
M8, M9, M10, M11, M12, M13, M14, M15
[GLB] [MC 5]
M10, M11, M12, M13, M14, M15, M0, M1
[GLB] [MC 6]
M12, M13, M14, M15, M0, M1, M2, M3
[GLB] [MC 7]
M14, M15, M0, M1, M2, M3, M4, M5
8
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
Table 6. GLB/MC/ORP Combinations for ispMACH 4128ZE
GLB/MC
ORP Mux Input Macrocells
[GLB] [MC 0]
M0, M1, M2, M3, M4, M5, M6, M7
[GLB] [MC 1]
M1, M2, M3, M4, M5, M6, M7, M8
[GLB] [MC 2]
M2, M3, M4, M5, M6, M7, M8, M9
[GLB] [MC 3]
M4, M5, M6, M7, M8, M9, M10, M11
[GLB] [MC 4]
M5, M6, M7, M8, M9, M10, M11, M12
[GLB] [MC 5]
M6, M7, M8, M9, M10, M11, M12, M13
[GLB] [MC 6]
M8, M9, M10, M11, M12, M13, M14, M15
[GLB] [MC 7]
M9, M10, M11, M12, M13, M14, M15, M0
[GLB] [MC 8]
M10, M11, M12, M13, M14, M15, M0, M1
[GLB] [MC 9]
M12, M13, M14, M15, M0, M1, M2, M3
[GLB] [MC 10]
M13, M14, M15, M0, M1, M2, M3, M4
[GLB] [MC 11]
M14, M15, M0, M1, M2, M3, M4, M5
Table 7. GLB/MC/ORP Combinations for ispMACH 4032ZE and 4064ZE
GLB/MC
ORP Mux Input Macrocells
[GLB] [MC 0]
M0, M1, M2, M3, M4, M5, M6, M7
[GLB] [MC 1]
M1, M2, M3, M4, M5, M6, M7, M8
[GLB] [MC 2]
M2, M3, M4, M5, M6, M7, M8, M9
[GLB] [MC 3]
M3, M4, M5, M6, M7, M8, M9, M10
[GLB] [MC 4]
M4, M5, M6, M7, M8, M9, M10, M11
[GLB] [MC 5]
M5, M6, M7, M8, M9, M10, M11, M12
[GLB] [MC 6]
M6, M7, M8, M9, M10, M11, M12, M13
[GLB] [MC 7]
M7, M8, M9, M10, M11, M12, M13, M14
[GLB] [MC 8]
M8, M9, M10, M11, M12, M13, M14, M15
[GLB] [MC 9]
M9, M10, M11, M12, M13, M14, M15, M0
[GLB] [MC 10]
M10, M11, M12, M13, M14, M15, M0, M1
[GLB] [MC 11]
M11, M12, M13, M14, M15, M0, M1, M2
[GLB] [MC 12]
M12, M13, M14, M15, M0, M1, M2, M3
[GLB] [MC 13]
M13, M14, M15, M0, M1, M2, M3, M4
[GLB] [MC 14]
M14, M15, M0, M1, M2, M3, M4, M5
[GLB] [MC 15]
M15, M0, M1, M2, M3, M4, M5, M6
Output Enable Routing Multiplexers
The OE Routing Pool provides the corresponding local output enable (OE) product term to the I/O cell.
I/O Cell
The I/O cell contains the following programmable elements: output buffer, input buffer, OE multiplexer, Power Guard
and bus maintenance circuitry. Figure 8 details the I/O cell.
9
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
Figure 8. I/O Cell
GOE 0
GOE 1
GOE 2
GOE 3
I/O Bus Maintenance
From ORP
VCCO
VCCO
VCC
From ORP
Power Guard
0
To Macrocell
1
To GRP
Power Guard Disable Fuse (PGDF)
Block Input Enable (BIE)
(From Block PT)
Each output supports a variety of output standards dependent on the VCCO supplied to its I/O bank. Outputs can
also be configured for open drain operation. Each input can be programmed to support a variety of standards, independent of the VCCO supplied to its I/O bank. The I/O standards supported are:
• LVTTL
• LVCMOS 3.3
• LVCMOS 2.5
• LVCMOS 1.8
• LVCMOS 1.5
• 3.3V PCI Compatible
All of the I/Os and dedicated inputs have the capability to provide a bus-keeper latch, pull-up resistor or pull-down
resistor selectable on a “per-pin” basis. A fourth option is to provide none of these. The default in both hardware
and software is such that when the device is erased or if the user does not specify, the input structure is configured
to be a Pull-down Resistor.
Each ispMACH 4000ZE device I/O has an individually programmable output slew rate control bit. Each output can
be individually configured for fast slew or slow slew. The typical edge rate difference between fast and slow slew
setting is 20%. For high-speed designs with long, unterminated traces, the slow-slew rate will introduce fewer
reflections, less noise and keep ground bounce to a minimum. For designs with short traces or well terminated
lines, the fast slew rate can be used to achieve the highest speed.
The ispMACH 4000ZE family has an always on, 200mV typical hysteresis for each input operational at 3.3V and
2.5V. This provides improved noise immunity for slow transitioning signals.
Power Guard
Power Guard allows easier achievement of standby current in the system. As shown in Figure 9, this feature consists of an enabling multiplexer between an I/O pin and input buffer, and its associated circuitry inside the device.
If the enable signal (E) is held low, all inputs (D) can be optionally isolated (guarded), such that, if any of these were
toggled, it would not cause any toggle on internal pins (Q), thus, a toggling I/O pin will not cause any internal
dynamic power consumption.
10
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
Figure 9. Power Guard
Power Guard
D
0
Q
1
E
All the I/O pins in a block share a common Power Guard Enable signal. For a block of I/Os, this signal is called a
Block Input Enable (BIE) signal. BIE can be internally generated using MC logic, or could come from external
sources using one of the user I/O or input pins.
Any I/O pin in the block can be programmed to ignore the BIE signal. Thus, the feature can be enabled or disabled
on a pin-by-pin basis.
Figure 10 shows Power Guard and BIE across multiple I/Os in a block that has eight I/Os.
Figure 10. Power Guard and BIE in a Block with 8 I/Os
Power Guard
0
To Macrocell
1
I/O 0
To GRP
Power Guard
0
To Macrocell
1
I/O 1
To GRP
Block Input Enable (BIE)
From Block PT. The Block PT
is part of the block AND Array,
and can be driven by signals
from the GRP.
Power Guard
0
To Macrocell
To GRP
11
1
I/O 7
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
The number of BIE inputs, thus the number of Power Guard “Blocks” that can exist in a device, depends on the
device size. Table 8 shows the number of BIE signals available in the ispMACH 4000ZE family. The number of I/Os
available in each block is shown in the Ordering Information section of this data sheet.
Table 8. Number of BIE Signals Available in ispMACH 4000ZE Devices
Number of Logic Blocks, Power
Guard Blocks and BIE Signals
Device
ispMACH 4032ZE
Two (Blocks: A and B)
ispMACH 4064ZE
Four (Blocks: A, B, C and D)
ispMACH 4128ZE
Eight (Blocks: A, B, C, …, H)
ispMACH 4256ZE
Sixteen (Blocks: A, B, C, …, P)
Power Guard for Dedicated Inputs
Power Guard can optionally be applied to the dedicated inputs. The dedicated inputs and clocks are controlled by
the BIE of the logic blocks shown in Tables 9 and 10.
Table 9. Dedicated Clock Inputs to BIE Association
CLK/I
32 MC Block
64MC Block
128MC Block
256MC Block
CLK0 / I
A
A
A
A
CLK1 / I
A
B
D
H
CLK2 / I
B
C
E
I
CLK3 / I
B
D
H
P
Table 10. Dedicated Inputs to BIE Association
Dedicated Input
4064ZE Block
4128ZE Block
4256ZE Block
0
A
B
D
1
B
C
E
2
B
D
G
3
C
F
G
4
D
G
J
5
D
H
L
6
—
—
M
7
—
—
O
8
—
—
O
9
—
—
B
For more information on the Power Guard function refer to TN1174, Advanced Features of the ispMACH 4000ZE.
Global OE (GOE) and Block Input Enable (BIE) Generation
Most ispMACH 4000ZE family devices have a 4-bit wide Global OE (GOE) Bus (Figure 11), except the ispMACH
4032 device that has a 2-bit wide Global OE Bus (Figure 12). This bus is derived from a 4-bit internal global OE
(GOE) PT bus and two dual purpose I/O or GOE pins. Each signal that drives the bus can optionally be inverted.
Each GLB has a block-level OE PT that connects to all bits of the Global OE PT bus with four fuses. Hence, for a
256-macrocell device (with 16 blocks), each line of the bus is driven from 16 OE product terms. Figures 9 and 10
show a graphical representation of the global OE generation.
The block-level OE PT of each GLB is also tied to Block Input Enable (BIE) of that block. Hence, for a 256-macrocell device (with 16 blocks), each block's BIE signal is driven by block-level OE PT from each block.
12
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
Figure 11. Global OE Generation for All Devices Except ispMACH 4032ZE
Internal Global OE
PT Bus
(4 lines)
Global OE
Shared PTOE
(Block 0)
BIE0
Shared PTOE
(Block n)
BIEn
4-Bit
Global OE Bus
Global
Fuses
GOE (0:3)
to I/O cells
Fuse connection
Hard wired
Figure 12. Global OE Generation for ispMACH 4032ZE
Internal Global OE
PT Bus
(2 lines)
Shared PTOE
(Block 0)
BIE0
Shared PTOE
(Block 1)
BIE1
Global OE
Global
Fuses
4-Bit
Global OE Bus
GOE (3:0)
to I/O cells
Fuse connection
Hard wired
On-Chip Oscillator and Timer
An internal oscillator is provided for use in miscellaneous housekeeping functions such as watchdog heartbeats,
digital de-glitch circuits and control state machines. The oscillator is disabled by default to save power. Figure 13
shows the block diagram of the oscillator and timer block.
13
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
Figure 13. On-Chip Oscillator and Timer
OSCOUT
DYNOSCDIS
OSCTIMER
TIMERRES
TIMEROUT
Table 11. On-Chip Oscillator and Timer Signal Names
Signal Name
Input or Output
Optional /
Required
OSCOUT
Output
Optional
Oscillator Output (Nominal Frequency: 5MHz)
TIMEROUT
Output
Optional
Oscillator Frequency Divided by an integer TIMER_DIV (Default 128)
Description
TIMERRES
Input
Optional
Reset the Timer
DYNOSCDIS
Input
Optional
Disables the Oscillator, resets the Timer and saves the power.
OSCTIMER has two outputs, OSCOUT and TIMEROUT. The outputs feed into the Global Routing Pool (GRP).
From GRP, these signals can drive any macrocell input, as well as any output pin (with macrocell bypass). The output OSCOUT is the direct oscillator output with a typical frequency of 5MHz, whereas, the output TIMEROUT is the
oscillator output divided by an attribute TIMER_DIV.
The attribute TIMER_DIV can be: 128 (7 bits), 1024 (10 bits) or 1,048,576 (20 bits). The divided output is provided
for those user situations, where a very slow clock is desired. If even a slower toggling clock is desired, then the programmable macrocell resources can be used to further divide down the TIMEROUT output.
Figure 14 shows the simplified relationship among OSCOUT, TIMERRES and TIMEROUT. In the diagram, the signal “R” is an internal reset signal that is used to synchronize TIMERRES to OSCOUT. This adds one extra clock
cycle delay for the first timer transition after TIMERRES.
Figure 14. Relationship Among OSCOUT, TIMERRES and TIMEROUT
-1
0
1
2n / 2
2
2n
OSCOUT
MPW
TIMERRES
R (Internal)
TIMEROUT
Note: n = Number of bits in the divider (7, 10 or 20)
Metastability: If the signal TIMERRES is not synchronous to OSCOUT, it could make a
difference of one or two clock cycles to the TIMEROUT going high the first time.
14
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
Some Simple Use Scenarios
The following diagrams show a few simple examples that omit optional signals for the OSCTIMER block:
A. An oscillator giving 5MHz nominal clock
B. An oscillator that can be disabled with an external signal (5MHz nominal clock)
C. An oscillator giving approximately 5 Hz nominal clock (TIMER_DIV = 220 (1,048,576))
D. An oscillator giving two output clocks: ~5MHz and ~5KHz (TIMER_DIV= 210 (1,024))
OSCTIME R
TI ME R_DIV= N /A
DYNOS CD IS
OSCOUT
(A) A simple 5MHz oscillator.
OSCTIME R
20
TI ME R_DIV= 2
OSCTIME R
TI ME R_DIV= N /A
OSCOUT
(B) An oscillator with dynamic disable.
OSCTIME R
10
TI ME R_DIV= 2
TIMEROUT
(C) A simple 5Hz oscillator.
OSCOUT
TIMEROUT
(D) Oscillator with two outputs (5MHz and 5KHz).
OSCTIMER Integration With CPLD Fabric
The OSCTIMER is integrated into the CPLD fabric using the Global Routing Pool (GRP). The macrocell (MC) feedback path for two macrocells is augmented with a programmable multiplexer, as shown in Figure 15. The OSCTIMER outputs (OSCOUT and TIMEROUT) can optionally drive the GRP lines, whereas the macrocell outputs can
drive the optional OSCTIMER inputs TIMERRES and DYNOSCDIS.
Figure 15. OSCTIMER Integration With CPLD Fabric
A Regular Macrocell
Macrocell
Feedback
Signal
To GRP
OSC Macrocell
Macrocell 15
Feedback
Signal
1
0
To GRP
OSCOUT
TIMER Macrocell
DYNOSCDIS
Macrocell 15
Feedback
Signal
1
0
To GRP
TIMEROUT
TIMERRES
Table 12 shows how these two MCs are designated in each of the ispMACH4000ZE device.
15
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
Table 12. OSC and TIMER MC Designation
Block Number
MC Number
ispMACH 4032ZE
Device
OSC MC
TIMER MC
Macrocell
A
B
15
15
ispMACH 4064ZE
OSC MC
TIMER MC
A
D
15
15
ispMACH 4128ZE
OSC MC
TIMER MC
A
G
15
15
ispMACH 4256ZE
OSC MC
TIMER MC
C
F
15
15
Zero Power/Low Power and Power Management
The ispMACH 4000ZE family is designed with high speed low power design techniques to offer both high speed
and low power. With an advanced E2 low power cell and non sense-amplifier design approach (full CMOS logic
approach), the ispMACH 4000ZE family offers fast pin-to-pin speeds, while simultaneously delivering low standby
power without needing any “turbo bits” or other power management schemes associated with a traditional senseamplifier approach.
The zero power ispMACH 4000ZE is based on the 1.8V ispMACH 4000Z family. With innovative circuit design
changes, the ispMACH 4000ZE family is able to achieve the industry’s lowest static power.
IEEE 1149.1-Compliant Boundary Scan Testability
All ispMACH 4000ZE devices have boundary scan cells and are compliant to the IEEE 1149.1 standard. This
allows functional testing of the circuit board on which the device is mounted through a serial scan path that can
access all critical logic notes. Internal registers are linked internally, allowing test data to be shifted in and loaded
directly onto test nodes, or test node data to be captured and shifted out for verification. In addition, these devices
can be linked into a board-level serial scan path for more board-level testing. The test access port operates with an
LVCMOS interface that corresponds to the power supply voltage.
I/O Quick Configuration
To facilitate the most efficient board test, the physical nature of the I/O cells must be set before running any continuity tests. As these tests are fast, by nature, the overhead and time that is required for configuration of the I/Os’
physical nature should be minimal so that board test time is minimized. The ispMACH 4000ZE family of devices
allows this by offering the user the ability to quickly configure the physical nature of the I/O cells. This quick configuration takes milliseconds to complete, whereas it takes seconds for the entire device to be programmed. Lattice's
ispVM™ System programming software can either perform the quick configuration through the PC parallel port, or
can generate the ATE or test vectors necessary for a third-party test system.
IEEE 1532-Compliant In-System Programming
Programming devices in-system provides a number of significant benefits including: rapid prototyping, lower inventory levels, higher quality and the ability to make in-field modifications. All ispMACH 4000ZE devices provide InSystem Programming (ISP™) capability through the Boundary Scan Test Access Port. This capability has been
implemented in a manner that ensures that the port remains complaint to the IEEE 1149.1 standard. By using IEEE
1149.1 as the communication interface through which ISP is achieved, users get the benefit of a standard, welldefined interface. All ispMACH 4000ZE devices are also compliant with the IEEE 1532 standard.
The ispMACH 4000ZE devices can be programmed across the commercial temperature and voltage range. The
PC-based Lattice software facilitates in-system programming of ispMACH 4000ZE devices. The software takes the
JEDEC file output produced by the design implementation software, along with information about the scan chain,
and creates a set of vectors used to drive the scan chain. The software can use these vectors to drive a scan chain
via the parallel port of a PC. Alternatively, the software can output files in formats understood by common auto-
16
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
mated test equipment. This equipment can then be used to program ispMACH 4000ZE devices during the testing
of a circuit board.
User Electronic Signature
The User Electronic Signature (UES) allows the designer to include identification bits or serial numbers inside the
device, stored in E2CMOS memory. The ispMACH 4000ZE device contains 32 UES bits that can be configured by
the user to store unique data such as ID codes, revision numbers or inventory control codes.
Security Bit
A programmable security bit is provided on the ispMACH 4000ZE devices as a deterrent to unauthorized copying
of the array configuration patterns. Once programmed, this bit defeats readback of the programmed pattern by a
device programmer, securing proprietary designs from competitors. Programming and verification are also
defeated by the security bit. The bit can only be reset by erasing the entire device.
Hot Socketing
The ispMACH 4000ZE devices are well-suited for applications that require hot socketing capability. Hot socketing a
device requires that the device, during power-up and down, can tolerate active signals on the I/Os and inputs without being damaged. Additionally, it requires that the effects of I/O pin loading be minimal on active signals. The
ispMACH 4000ZE devices provide this capability for input voltages in the range 0V to 3.0V.
Density Migration
The ispMACH 4000ZE family has been designed to ensure that different density devices in the same package have
the same pin-out. Furthermore, the architecture ensures a high success rate when performing design migration
from lower density parts to higher density parts. In many cases, it is possible to shift a lower utilization design targeted for a high density device to a lower density device. However, the exact details of the final resource utilization
will impact the likely success in each case.
17
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
Absolute Maximum Ratings1, 2, 3
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . -0.5 to 2.5V
Output Supply Voltage (VCCO) . . . . . . . . . . . . . . . -0.5 to 4.5V
Input or I/O Tristate Voltage Applied4, 5 . . . . . . . . . -0.5 to 5.5V
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . -65 to 150°C
Junction Temperature (Tj) with Power Applied . . . -55 to 150°C
1. Stress above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional
operation of the device at these or any other conditions above those indicated in the operational sections of this specification
is not implied.
2. Compliance with Lattice Thermal Management document is required.
3. All voltages referenced to GND.
4. Undershoot of -2V and overshoot of (VIH (MAX) + 2V), up to a total pin voltage of 6V is permitted for a duration of <20ns.
5. Maximum of 64 I/Os per device with VIN > 3.6V is allowed.
Recommended Operating Conditions
Symbol
VCC
Tj
Parameter
Supply Voltage
Min.
Max.
Units
Standard Voltage Operation
1.7
1.9
V
Extended Voltage Operation
1
1.6
1.9
V
0
90
°C
-40
105
°C
Junction Temperature (Commercial)
Junction Temperature (Industrial)
1. Devices operating at 1.6V can expect performance degradation up to 35%.
Erase Reprogram Specifications
Parameter
Min.
Max.
Units
1,000
—
Cycles
Min.
Typ.
Max.
Units
0 ≤ VIN ≤ 3.0V, Tj = 105°C
—
±30
±150
µA
0 ≤ VIN ≤ 3.0V, Tj = 130°C
—
±30
±200
µA
Erase/Reprogram Cycle
Note: Valid over commercial temperature range.
Hot Socketing Characteristics1,2,3
Symbol
IDK
Parameter
Input or I/O Leakage Current
Condition
1. Insensitive to sequence of VCC or VCCO. However, assumes monotonic rise/fall rates for VCC and VCCO, provided (VIN - VCCO) ≤ 3.6V.
2. 0 < VCC < VCC (MAX), 0 < VCCO < VCCO (MAX).
3. IDK is additive to IPU, IPD or IBH. Device defaults to pull-up until fuse circuitry is active.
18
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
I/O Recommended Operating Conditions
VCCO (V)1
Min.
Max.
LVTTL
Standard
3.0
3.6
LVCMOS 3.3
3.0
3.6
Extended LVCMOS 3.3
2.7
3.6
LVCMOS 2.5
2.3
2.7
LVCMOS 1.8
1.65
1.95
LVCMOS 1.5
1.4
1.6
PCI 3.3
3.0
3.6
1. Typical values for VCCO are the average of the min. and max. values.
DC Electrical Characteristics
Over Recommended Operating Conditions
Symbol
Parameter
IIL, IIH1, 2 Input Leakage Current
Condition
0 ≤ VIN < VCCO
Min.
Typ.
Max.
Units
—
0.5
1
µA
Input High Leakage Current
VCCO < VIN ≤ 5.5V
—
—
10
µA
IPU
I/O Weak Pull-up Resistor Current
0 ≤ VIN ≤ 0.7VCCO
-20
—
-150
µA
IPD
I/O Weak Pull-down Resistor Current VIL (MAX) ≤ VIN ≤ VIH (MAX)
30
—
150
µA
IBHLS
Bus Hold Low Sustaining Current
VIN = VIL (MAX)
30
—
—
µA
IIH
1
IBHHS
Bus Hold High Sustaining Current
VIN = 0.7 VCCO
-20
—
—
µA
IBHLO
Bus Hold Low Overdrive Current
0V ≤ VIN ≤ VBHT
—
—
150
µA
IBHHO
Bus Hold High Overdrive Current
VBHT ≤ VIN ≤ VCCO
—
—
-150
µA
VBHT
Bus Hold Trip Points
—
VCCO * 0.35
—
VCCO * 0.65
V
C1
I/O Capacitance3
C2
Clock Capacitance3
C3
Global Input Capacitance3
VCCO = 3.3V, 2.5V, 1.8V, 1.5V
—
VCC = 1.8V, VIO = 0 to VIH (MAX)
—
VCCO = 3.3V, 2.5V, 1.8V, 1.5V
—
VCC = 1.8V, VIO = 0 to VIH (MAX)
—
VCCO = 3.3V, 2.5V, 1.8V, 1.5V
—
VCC = 1.8V, VIO = 0 to VIH (MAX)
—
8
6
6
—
—
—
—
—
—
pf
pf
pf
1. Input or I/O leakage current is measured with the pin configured as an input or as an I/O with the output driver tristated. It is not
measured with the output driver active. Bus maintenance circuits are disabled.
2. IIH excursions of up to 1.5µA maximum per pin above the spec limit may be observed for certain voltage conditions on no more than 10% of
the device’s I/O pins.
3. Measured TA = 25°C, f = 1.0MHz.
19
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
Supply Current
Symbol
Parameter
Condition
Min.
Typ.
Max. Units
ispMACH 4032ZE
1, 2, 3, 5, 6
ICC
ICC4, 5, 6
Operating Power Supply Current
Standby Power Supply Current
Vcc = 1.8V, TA = 25°C
—
50
—
µA
Vcc = 1.9V, TA = 0 to 70°C
—
58
—
µA
Vcc = 1.9V, TA = -40 to 85°C
—
60
—
µA
Vcc = 1.8V, TA = 25°C
—
10
—
µA
Vcc = 1.9V, TA = 0 to 70°C
—
13
25
µA
Vcc = 1.9V, TA = -40 to 85°C
—
15
40
µA
Vcc = 1.8V, TA = 25°C
—
80
—
µA
Vcc = 1.9V, TA = 0 to 70°C
—
89
—
µA
ispMACH 4064ZE
1, 2, 3, 5, 6
ICC
ICC4, 5, 6
Operating Power Supply Current
Standby Power Supply Current
Vcc = 1.9V, TA = -40 to 85°C
—
92
—
µA
Vcc = 1.8V, TA = 25°C
—
11
—
µA
Vcc = 1.9V, TA = 0 to 70°C
—
15
30
µA
Vcc = 1.9V, TA = -40 to 85°C
—
18
50
µA
Vcc = 1.8V, TA = 25°C
—
168
—
µA
Vcc = 1.9V, TA = 0 to 70°C
—
190
—
µA
Vcc = 1.9V, TA = -40 to 85°C
—
195
—
µA
Vcc = 1.8V, TA = 25°C
—
12
—
µA
Vcc = 1.9V, TA = 0 to 70°C
—
16
40
µA
Vcc = 1.9V, TA = -40 to 85°C
—
19
60
µA
Vcc = 1.8V, TA = 25°C
—
341
—
µA
Vcc = 1.9V, TA = 0 to 70°C
—
361
—
µA
Vcc = 1.9V, TA = -40 to 85°C
—
372
—
µA
Vcc = 1.8V, TA = 25°C
—
13
—
µA
Vcc = 1.9V, TA = 0 to 70°C
—
32
65
µA
Vcc = 1.9V, TA = -40 to 85°C
—
43
100
µA
ispMACH 4128ZE
ICC1, 2, 3, 5, 6 Operating Power Supply Current
ICC4, 5, 6
Standby Power Supply Current
ispMACH 4256ZE
1, 2, 3, 5, 6
ICC
ICC4, 5, 6
1.
2.
3.
4.
5.
6.
Operating Power Supply Current
Standby Power Supply Current
Frequency = 1.0 MHz.
Device configured with 16-bit counters.
ICC varies with specific device configuration and operating frequency.
VCCO = 3.6V, VIN = 0V or VCCO, bus maintenance turned off. VIN above VCCO will add transient current above the specified standby ICC.
Includes VCCO current without output loading.
This operating supply current is with the internal oscillator disabled. Enabling the internal oscillator adds approximately 15µA typical current
plus additional current from any logic it drives.
20
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
I/O DC Electrical Characteristics
Over Recommended Operating Conditions
VIH
VIL
Standard
LVTTL
LVCMOS 3.3
LVCMOS 2.5
LVCMOS 1.8
Min (V)
Max (V)
Min (V)
Max (V)
-0.3
0.80
2.0
5.5
-0.3
-0.3
-0.3
LVCMOS 1.52
-0.3
PCI 3.3
-0.3
0.80
2.0
0.70
IOL1
(mA)
IOH1
(mA)
0.40
VCCO - 0.40
8.0
-4.0
0.20
VCCO - 0.20
0.1
-0.1
0.40
VCCO - 0.40
8.0
-4.0
0.20
VCCO - 0.20
0.1
-0.1
0.40
VCCO - 0.40
8.0
-4.0
0.20
VCCO - 0.20
0.1
-0.1
0.40
VCCO - 0.45
2.0
-2.0
0.20
VCCO - 0.20
0.1
-0.1
0.40
VCCO - 0.45
2.0
-2.0
0.20
VCCO - 0.20
0.1
-0.1
0.1 VCCO
0.9 VCCO
1.5
-0.5
3.6
0.65 * VCC
0.35 * VCC
VOH
Min (V)
5.5
1.70
0.35 * VCC
VOL
Max (V)
3.6
0.65 * VCC
3.6
0.3 * 3.3 * (VCC / 1.8) 0.5 * 3.3 * (VCC / 1.8)
5.5
1. The average DC current drawn by I/Os between adjacent bank GND connections, or between the last GND in an I/O bank and the end of
the I/O bank, as shown in the logic signals connection table, shall not exceed n*8mA. Where n is the number of I/Os between bank GND
connections or between the last GND in a bank and the end of a bank.
2. For 1.5V inputs, there may be an additional DC current drawn from VCC, if the ispMACH 4000ZE VCC and the VCC of the driving device
(VCCd-d; that determines steady state VIH) are in the extreme range of their specifications. Typically, DC current drawn from VCC will be
2µA per input.
1.8V VCCO
Typical I/O Output Current (mA)
60
50
IOL
IOH
40
30
20
10
0
0
0.5
1.0
1.5
VO Output Voltage (V)
21
2.0
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4000ZE External Switching Characteristics
Over Recommended Operating Conditions
LC4032ZE
LC4064ZE
-4
Parameter
Description1, 2
All Devices
-4
Min.
Max.
-5
Min.
Max.
-7
Min.
Max.
Min.
Max.
Units
tPD
20-PT combinatorial propagation delay
—
4.4
—
4.7
—
5.8
—
7.5
ns
tS
GLB register setup time before clock
2.2
—
2.5
—
2.9
—
4.5
—
ns
tST
GLB register setup time before clock with
T-type register
2.4
—
2.7
—
3.1
—
4.7
—
ns
tSIR
GLB register setup time before clock, input
register path
1.0
—
1.1
—
1.3
—
1.4
—
ns
tSIRZ
GLB register setup time before clock with zero
hold
2.0
—
2.1
—
2.9
—
4.0
—
ns
tH
GLB register hold time after clock
0.0
—
0.0
—
0.0
—
0.0
—
ns
tHT
GLB register hold time after clock with T-type
register
0.0
—
0.0
—
0.0
—
0.0
—
ns
tHIR
GLB register hold time after clock, input
register path
1.0
—
1.0
—
1.3
—
1.3
—
ns
tHIRZ
GLB register hold time after clock, input
register path with zero hold
0.0
—
0.0
—
0.0
—
0.0
—
ns
tCO
GLB register clock-to-output delay
—
3.0
—
3.2
—
3.8
—
4.5
ns
tR
External reset pin to output delay
—
5.0
—
6.0
—
7.5
—
9.0
ns
tRW
External reset pulse duration
1.5
—
1.7
—
2.0
—
4.0
—
ns
tPTOE/DIS
Input to output local product term output
enable/disable
—
7.0
—
8.0
—
8.2
—
9.0
ns
tGPTOE/DIS
Input to output global product term output
enable/disable
—
6.5
—
7.0
—
10.0
—
10.5
ns
tGOE/DIS
Global OE input to output enable/disable
—
4.5
—
4.5
—
5.5
—
7.0
ns
tCW
Global clock width, high or low
1.0
—
1.5
—
1.8
—
3.3
—
ns
tGW
Global gate width low (for low transparent) or
high (for high transparent)
1.0
—
1.5
—
1.8
—
3.3
—
ns
tWIR
Input register clock width, high or low
fMAX (Int.)3 Clock frequency with internal feedback
fMAX (Ext.)
clock frequency with external feedback,
[1 / (tS + tCO)]
1.0
—
1.5
—
1.8
—
3.3
—
ns
260
—
241
—
200
—
172
—
MHz
192
—
175
—
149
—
111
—
MHz
1. Timing numbers are based on default LVCMOS 1.8 I/O buffers. Use timing adjusters provided to calculate other standards.
2. Measured using standard switching GRP loading of 1 and 1 output switching.
3. Standard 16-bit counter using GRP feedback.
Timing v.0.8
22
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
Timing Model
The task of determining the timing through the ispMACH 4000ZE family, like any CPLD, is relatively simple. The
timing model provided in Figure 16 shows the specific delay paths. Once the implementation of a given function is
determined either conceptually or from the software report file, the delay path of the function can easily be determined from the timing model. The Lattice design tools report the timing delays based on the same timing model for
a particular design. Note that the internal timing parameters are given for reference only, and are not tested. The
external timing parameters are tested and guaranteed for every device. For more information on the timing model
and usage, please refer to technical note TN1168, ispMACH 4000ZE Timing Model Design and Usage Guidelines.
Figure 16. ispMACH 4000ZE Timing Model
Oscillator/ Timer
Delays
tOSCDIS
tOSCEN
tOSCOD
From
Feedback
Routing/GLB Delays
tFBK
tPDi
IN
tIN
tIOI
tPGRT
SCLK
tROUTE
tBLA
tMCELL
tEXP
DATA
Q
tINREG
tINDIO
tGCLK_IN
tIOI
tPGRT
tBIE
tGOE
tIOI
tPGRT
Control
Delays
tORP
tBUF
tIOO
tEN
tDIS
Feedback
Out
In/Out
Delays
tPTCLK
tBCLK
C.E.
tPTSR
tBSR
S/R
MC Reg.
OE
Feedback
Register/Latch
Delays
tGPTOE
tPTOE
In/Out
Delays
Note: Italicized items are optional delay adders.
23
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4000ZE Internal Timing Parameters
Over Recommended Operating Conditions
LC4032ZE
LC4064ZE
-4
Parameter
Description
-4
Min.
Max.
Min.
Max.
Units
—
0.85
—
0.90
ns
In/Out Delays
tIN
Input Buffer Delay
tGCLK_IN
Global Clock Input Buffer Delay
—
1.60
—
1.60
ns
tGOE
Global OE Pin Delay
—
2.25
—
2.25
ns
tBUF
Delay through Output Buffer
—
0.75
—
0.90
ns
tEN
Output Enable Time
—
2.25
—
2.25
ns
tDIS
Output Disable Time
—
1.35
—
1.35
ns
tPGSU
Input Power Guard Setup Time
—
3.30
—
3.55
ns
tPGH
Input Power Guard Hold Time
—
0.00
—
0.00
ns
tPGPW
Input Power Guard BIE Minimum Pulse Width
—
5.00
—
5.00
ns
tPGRT
Input Power Guard Recovery Time Following BIE
Dissertation
—
5.00
—
5.00
ns
tROUTE
Delay through GRP
—
1.60
—
1.70
ns
tPDi
Macrocell Propagation Delay
—
0.25
—
0.25
ns
tMCELL
Macrocell Delay
—
0.65
—
0.65
ns
tINREG
Input Buffer to Macrocell Register Delay
—
0.90
—
1.00
ns
tFBK
Internal Feedback Delay
—
0.55
—
0.55
ns
tORP
Output Routing Pool Delay
—
0.30
—
0.30
ns
0.70
—
0.85
—
ns
Routing Delays
Register/Latch Delays
tS
D-Register Setup Time (Global Clock)
tS_PT
D-Register Setup Time (Product Term Clock)
1.25
—
1.85
—
ns
tH
D-Register Hold Time
1.50
—
1.65
—
ns
tST
T-Register Setup Time (Global Clock)
0.90
—
1.05
—
ns
tST_PT
T-register Setup Time (Product Term Clock)
1.45
—
1.65
—
ns
tHT
T-Resister Hold Time
1.50
—
1.65
—
ns
tSIR
D-Input Register Setup Time (Global Clock)
0.85
—
0.80
—
ns
tSIR_PT
D-Input Register Setup Time (Product Term Clock)
1.45
—
1.45
—
ns
tHIR
D-Input Register Hold Time (Global Clock)
1.15
—
1.30
—
ns
tHIR_PT
D-Input Register Hold Time (Product Term Clock)
0.90
—
1.10
—
ns
tCOi
Register Clock to Output/Feedback MUX Time
—
0.35
—
0.40
ns
tCES
Clock Enable Setup Time
1.00
—
2.00
—
ns
tCEH
Clock Enable Hold Time
0.00
—
0.00
—
ns
tSL
Latch Setup Time (Global Clock)
0.70
—
0.95
—
ns
tSL_PT
Latch Setup Time (Product Term Clock)
1.45
—
1.85
—
ns
tHL
Latch Hold Time
1.40
—
1.80
—
ns
tGOi
Latch Gate to Output/Feedback MUX Time
—
0.40
—
0.35
ns
tPDLi
Propagation Delay through Transparent Latch to Output/
Feedback MUX
—
0.30
—
0.25
ns
tSRi
Asynchronous Reset or Set to Output/Feedback MUX
Delay
—
0.30
—
0.30
ns
24
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4000ZE Internal Timing Parameters (Cont.)
Over Recommended Operating Conditions
Parameter
LC4064ZE
-4
-4
Min.
Max.
Min.
Max.
Units
Asynchronous Reset or Set Recovery Delay
—
2.00
—
1.70
ns
tBCLK
GLB PT Clock Delay
—
1.20
—
1.30
ns
tPTCLK
Macrocell PT Clock Delay
—
1.40
—
1.50
ns
tBSR
Block PT Set/Reset Delay
—
1.10
—
1.85
ns
tPTSR
Macrocell PT Set/Reset Delay
—
1.20
—
1.90
ns
tBIE
Power Guard Block Input Enable Delay
—
1.60
—
1.70
ns
tPTOE
Macrocell PT OE Delay
—
2.30
—
3.15
ns
tGPTOE
Global PT OE Delay
—
1.80
—
2.15
ns
—
5.00
—
ns
tSRR
Description
LC4032ZE
Control Delays
Internal Oscillator
tOSCSU
Oscillator DYNOSCDIS Setup Time
5.00
tOSCH
Oscillator DYNOSCDIS Hold Time
5.00
—
5.00
—
ns
tOSCEN
Oscillator OSCOUT Enable Time (To Stable)
—
5.00
—
5.00
ns
tOSCOD
Oscillator Output Delay
—
4.00
—
4.00
ns
tOSCNOM
Oscillator OSCOUT Nominal Frequency
5.00
MHz
tOSCvar
Oscillator Variation of Nominal Frequency
—
30
—
30
%
tTMRCO20
Oscillator TIMEROUT Clock (Negative Edge) to Out
(20-Bit Divider)
—
12.50
—
12.50
ns
tTMRCO10
Oscillator TIMEROUT Clock (Negative Edge) to Out
(10-Bit Divider)
—
7.50
—
7.50
ns
tTMRCO7
Oscillator TIMEROUT Clock (Negative Edge) to Out
(7-Bit Divider)
—
6.00
—
6.00
ns
tTMRRSTO
Oscillator TIMEROUT Reset to Out (Going Low)
—
5.00
—
5.00
ns
tTMRRR
Oscillator TIMEROUT Asynchronous Reset Recovery
Delay
—
4.00
—
4.00
ns
tTMRRSTPW
Oscillator TIMEROUT Reset Minimum Pulse Width
3.00
—
3.00
—
ns
Optional Delay Adjusters
5.00
Base Parameter
tINDIO
Input Register Delay
tINREG
—
1.00
—
1.00
ns
tEXP
Product Term Expander Delay
tMCELL
—
0.40
—
0.40
ns
tBLA
Additional Block Loading Adders
tROUTE
—
0.04
—
0.05
ns
tIOI Input Buffer Delays
LVTTL_in
Using LVTTL standard
tIN, tGCLK_IN, tGOE
—
0.60
—
0.60
ns
LVCMOS15_in
Using LVCMOS 1.5 Standard
tIN, tGCLK_IN, tGOE
—
0.20
—
0.20
ns
LVCMOS18_in
Using LVCMOS 1.8 Standard
tIN, tGCLK_IN, tGOE
—
0.00
—
0.00
ns
LVCMOS25_in
Using LVCMOS 2.5 Standard with
Hysteresis
tIN, tGCLK_IN, tGOE
—
0.80
—
0.80
ns
LVCMOS33_in
Using LVCMOS 3.3 Standard with
Hysteresis
tIN, tGCLK_IN, tGOE
—
0.80
—
0.80
ns
PCI_in
Using PCI Compatible Input with
Hysteresis
tIN, tGCLK_IN, tGOE
—
0.80
—
0.80
ns
tIOO Output Buffer Delays
LVTTL_out
Output Configured as TTL Buffer
tEN, tDIS, tBUF
—
0.20
—
0.20
ns
LVCMOS15_out
Output Configured as 1.5V Buffer
tEN, tDIS, tBUF
—
0.20
—
0.20
ns
25
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4000ZE Internal Timing Parameters (Cont.)
Over Recommended Operating Conditions
Parameter
Description
LC4032ZE
LC4064ZE
-4
-4
Min.
Max.
Min.
Max.
Units
LVCMOS18_out
Output Configured as 1.8V Buffer
tEN, tDIS, tBUF
—
0.00
—
0.00
ns
LVCMOS25_out
Output Configured as 2.5V Buffer
tEN, tDIS, tBUF
—
0.10
—
0.10
ns
LVCMOS33_out
Output Configured as 3.3V Buffer
tEN, tDIS, tBUF
—
0.20
—
0.20
ns
PCI_out
Output Configured as PCI Compati- tEN, tDIS, tBUF
ble Buffer
—
0.20
—
0.20
ns
Slow Slew
Output Configured for Slow Slew
Rate
—
1.00
—
1.00
ns
tEN, tBUF
Note: Internal Timing Parameters are not tested and are for reference only. Refer to the timing model in this data sheet for further details.
Timing v.0.8
26
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4000ZE Internal Timing Parameters (Cont.)
Over Recommended Operating Conditions
All Devices
-5
Parameter
Description
-7
Min.
Max.
Min.
Max.
Units
—
1.05
—
1.90
ns
In/Out Delays
tIN
Input Buffer Delay
tGCLK_IN
Global Clock Input Buffer Delay
—
1.95
—
2.15
ns
tGOE
Global OE Pin Delay
—
3.00
—
4.30
ns
tBUF
Delay through Output Buffer
—
1.10
—
1.30
ns
tEN
Output Enable Time
—
2.50
—
2.70
ns
tDIS
Output Disable Time
—
2.50
—
2.70
ns
tPGSU
Input Power Guard Setup Time
—
4.30
—
5.60
ns
tPGH
Input Power Guard Hold Time
—
0.00
—
0.00
ns
tPGPW
Input Power Guard BIE Minimum Pulse Width
—
6.00
—
8.00
ns
tPGRT
Input Power Guard Recovery Time Following BIE Dissertation
—
5.00
—
7.00
ns
tROUTE
Delay through GRP
—
2.25
—
2.50
ns
tPDi
Macrocell Propagation Delay
—
0.45
—
0.50
ns
tMCELL
Macrocell Delay
—
0.65
—
1.00
ns
tINREG
Input Buffer to Macrocell Register Delay
—
1.00
—
1.00
ns
tFBK
Internal Feedback Delay
—
0.75
—
0.30
ns
tORP
Output Routing Pool Delay
—
0.30
—
0.30
ns
Routing Delays
Register/Latch Delays
tS
D-Register Setup Time (Global Clock)
0.90
—
1.25
—
ns
tS_PT
D-Register Setup Time (Product Term Clock)
2.00
—
2.35
—
ns
tH
D-Register Hold Time
2.00
—
3.25
—
ns
tST
T-Register Setup Time (Global Clock)
1.10
—
1.45
—
ns
tST_PT
T-register Setup Time (Product Term Clock)
2.20
—
2.65
—
ns
tHT
T-Resister Hold Time
2.00
—
3.25
—
ns
tSIR
D-Input Register Setup Time (Global Clock)
1.20
—
0.65
—
ns
tSIR_PT
D-Input Register Setup Time (Product Term Clock)
1.45
—
1.45
—
ns
tHIR
D-Input Register Hold Time (Global Clock)
1.40
—
2.05
—
ns
tHIR_PT
D-Input Register Hold Time (Product Term Clock)
1.10
—
1.20
—
ns
tCOi
Register Clock to Output/Feedback MUX Time
—
0.45
—
0.75
ns
tCES
Clock Enable Setup Time
2.00
—
2.00
—
ns
tCEH
Clock Enable Hold Time
0.00
—
0.00
—
ns
tSL
Latch Setup Time (Global Clock)
0.90
—
1.55
—
ns
tSL_PT
Latch Setup Time (Product Term Clock)
2.00
—
2.05
—
ns
tHL
Latch Hold Time
2.00
—
1.17
—
ns
tGOi
Latch Gate to Output/Feedback MUX Time
—
0.35
—
0.33
ns
tPDLi
Propagation Delay through Transparent Latch to Output/
Feedback MUX
—
0.25
—
0.25
ns
tSRi
Asynchronous Reset or Set to Output/Feedback MUX
Delay
—
0.95
—
0.28
ns
27
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4000ZE Internal Timing Parameters (Cont.)
Over Recommended Operating Conditions
All Devices
-5
Parameter
Min.
Max.
Min.
Max.
Units
Asynchronous Reset or Set Recovery Delay
—
1.80
—
1.67
ns
tBCLK
GLB PT Clock Delay
—
1.45
—
0.95
ns
tPTCLK
Macrocell PT Clock Delay
—
1.45
—
1.15
ns
tBSR
Block PT Set/Reset Delay
—
1.85
—
1.83
ns
tPTSR
Macrocell PT Set/Reset Delay
—
1.85
—
2.72
ns
tBIE
Power Guard Block Input Enable Delay
—
1.75
—
1.95
ns
tPTOE
Macrocell PT OE Delay
—
2.40
—
1.90
ns
tGPTOE
Global PT OE Delay
—
4.20
—
3.40
ns
—
5.00
—
ns
tSRR
Description
-7
Control Delays
Internal Oscillator
tOSCSU
Oscillator DYNOSCDIS Setup Time
5.00
tOSCH
Oscillator DYNOSCDIS Hold Time
5.00
—
5.00
—
ns
tOSCEN
Oscillator OSCOUT Enable Time (To Stable)
—
5.00
—
5.00
ns
tOSCOD
Oscillator Output Delay
—
4.00
—
4.00
ns
tOSCNOM
Oscillator OSCOUT Nominal Frequency
5.00
MHz
tOSCvar
Oscillator Variation of Nominal Frequency
—
30
—
30
%
tTMRCO20
Oscillator TIMEROUT Clock (Negative Edge) to Out
(20-Bit Divider)
—
12.50
—
14.50
ns
tTMRCO10
Oscillator TIMEROUT Clock (Negative Edge) to Out
(10-Bit Divider)
—
7.50
—
9.50
ns
tTMRCO7
Oscillator TIMEROUT Clock (Negative Edge) to Out
(7-Bit Divider)
—
6.00
—
8.00
ns
tTMRRSTO
Oscillator TIMEROUT Reset to Out (Going Low)
—
5.00
—
7.00
ns
tTMRRR
Oscillator TIMEROUT Asynchronous Reset Recovery
Delay
—
4.00
—
6.00
ns
tTMRRSTPW
Oscillator TIMEROUT Reset Minimum Pulse Width
3.00
—
5.00
—
ns
Optional Delay Adjusters
5.00
Base Parameter
tINDIO
Input Register Delay
tINREG
—
1.60
—
2.60
ns
tEXP
Product Term Expander Delay
tMCELL
—
0.45
—
0.50
ns
tBLA
Additional Block Loading Adders
tROUTE
—
0.05
—
0.05
ns
tIOI Input Buffer Delays
LVTTL_in
Using LVTTL standard
tIN, tGCLK_IN, tGOE
—
0.60
—
0.60
ns
LVCMOS15_in
Using LVCMOS 1.5 standard
tIN, tGCLK_IN, tGOE
—
0.20
—
0.20
ns
LVCMOS18_in
Using LVCMOS 1.8 standard
tIN, tGCLK_IN, tGOE
—
0.00
—
0.00
ns
LVCMOS25_in
Using LVCMOS 2.5 standard with
Hysteresis
tIN, tGCLK_IN, tGOE
—
0.80
—
0.80
ns
LVCMOS33_in
Using LVCMOS 3.3 standard with
Hysteresis
tIN, tGCLK_IN, tGOE
—
0.80
—
0.80
ns
PCI_in
Using PCI compatible input with
Hysteresis
tIN, tGCLK_IN, tGOE
—
0.80
—
0.80
ns
tEN, tDIS, tBUF
—
0.20
—
0.20
ns
tIOO Output Buffer Delays
LVTTL_out
Output configured as TTL buffer
28
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4000ZE Internal Timing Parameters (Cont.)
Over Recommended Operating Conditions
All Devices
-5
Parameter
Description
-7
Min.
Max.
Min.
Max.
Units
LVCMOS15_out
Output configured as 1.5V buffer
tEN, tDIS, tBUF
—
0.20
—
0.20
ns
LVCMOS18_out
Output configured as 1.8V buffer
tEN, tDIS, tBUF
—
0.00
—
0.00
ns
LVCMOS25_out
Output configured as 2.5V buffer
tEN, tDIS, tBUF
—
0.10
—
0.10
ns
LVCMOS33_out
Output configured as 3.3V buffer
tEN, tDIS, tBUF
—
0.20
—
0.20
ns
PCI_out
Output configured as PCI compati- tEN, tDIS, tBUF
ble buffer
—
0.20
—
0.20
ns
Slow Slew
Output configured for slow slew rate tEN, tBUF
—
1.00
—
1.00
ns
Note: Internal Timing Parameters are not tested and are for reference only. Refer to the timing model in this data sheet for further details.
Timing v.0.8
29
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
Boundary Scan Waveforms and Timing Specifications
Symbol
Parameter
Min.
Max.
Units
tBTCP
TCK [BSCAN test] clock cycle
40
—
ns
tBTCH
TCK [BSCAN test] pulse width high
20
—
ns
tBTCL
TCK [BSCAN test] pulse width low
20
—
ns
tBTSU
TCK [BSCAN test] setup time
8
—
ns
tBTH
TCK [BSCAN test] hold time
10
—
ns
tBRF
TCK [BSCAN test] rise and fall time
50
—
mV/ns
tBTCO
TAP controller falling edge of clock to valid output
—
10
ns
tBTOZ
TAP controller falling edge of clock to data output disable
—
10
ns
tBTVO
TAP controller falling edge of clock to data output enable
—
10
ns
tBTCPSU
BSCAN test Capture register setup time
8
—
ns
tBTCPH
BSCAN test Capture register hold time
10
—
ns
tBTUCO
BSCAN test Update reg, falling edge of clock to valid output
—
25
ns
tBTUOZ
BSCAN test Update reg, falling edge of clock to output disable
—
25
ns
tBTUOV
BSCAN test Update reg, falling edge of clock to output enable
—
25
ns
30
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
Power Consumption
ispMACH 4000ZE
Typical ICC vs. Frequency
70
60
4256ZE
Icc (mA)
50
40
4128ZE
30
4064ZE
20
4032ZE
10
0
0
50
100
150
200
250
300
Frequency (MHz)
Power Estimation Coefficients1
Device
A
B
ispMACH 4032ZE
0.010
0.009
ispMACH 4064ZE
0.011
0.009
ispMACH 4128ZE
0.012
0.009
ispMACH 4256ZE
0.013
0.009
1. For further information about the use of these coefficients, refer to Technical Note
TN1175, Power Estimation in ispMACH 4000ZE Devices.
31
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
Switching Test Conditions
Figure 17 shows the output test load that is used for AC testing. The specific values for resistance, capacitance,
voltage, and other test conditions are shown in Table 13.
Figure 17. Output Test Load, LVTTL and LVCMOS Standards
VCCO
R1
Test
Point
DUT
R2
CL
0213A/ispm4k
Table 13. Test Fixture Required Components
Test Condition
LVCMOS I/O, (L -> H, H -> L)
R1
CL1
R2
106Ω 106Ω
LVCMOS I/O (Z -> H)
∞
LVCMOS I/O (Z -> L)
LVCMOS I/O (H -> Z)
LVCMOS I/O (L -> Z)
Timing Ref.
VCCO
LVCMOS 3.3 = 1.5V
LVCMOS 3.3 = 3.0V
LVCMOS 2.5 =
VCCO
2
LVCMOS 2.5 = 2.3V
LVCMOS 1.8 =
VCCO
2
LVCMOS 1.8 = 1.65V
LVCMOS 1.5 =
VCCO
2
LVCMOS 1.5 = 1.4V
35pF
106Ω
35pF
106Ω
∞
∞
106Ω
106Ω
∞
1. CL includes test fixtures and probe capacitance.
32
1.5V
3.0V
35pF
1.5V
3.0V
5pF
VOH - 0.3
3.0V
5pF
VOL + 0.3
3.0V
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
Signal Descriptions
Signal Names
Description
TMS
Input – This pin is the IEEE 1149.1 Test Mode Select input, which is used to control
the state machine.
TCK
Input – This pin is the IEEE 1149.1 Test Clock input pin, used to clock through the
state machine.
TDI
Input – This pin is the IEEE 1149.1 Test Data In pin, used to load data.
TDO
Output – This pin is the IEEE 1149.1 Test Data Out pin used to shift data out.
GOE0/IO, GOE1/IO
These pins are configured to be either Global Output Enable Input or as general I/O
pins.
GND
Ground
NC
Not Connected
VCC
The power supply pins for logic core and JTAG port.
CLK0/I, CLK1/I, CLK2/I, CLK3/I
These pins are configured to be either CLK input or as an input.
VCCO0, VCCO1
The power supply pins for each I/O bank.
Input/Output1 – These are the general purpose I/O used by the logic array. y is GLB
reference (alpha) and z is macrocell reference (numeric). z: 0-15.
yzz
ispMACH 4032ZE
y: A-B
ispMACH 4064ZE
y: A-D
ispMACH 4128ZE
y: A-H
ispMACH 4256ZE
y: A-P
1. In some packages, certain I/Os are only available for use as inputs. See the signal connections table for details.
ORP Reference Table
4032ZE
4064ZE
4128ZE
4256ZE
Number of I/Os
32
32
48
64
64
96
64
96
108
Number of GLBs
2
4
4
4
8
8
16
16
16
Number of
I/Os per GLB
16
8
Mixture of
9, 10,
14, 15
16
8
12
4
6
Mixture of
6, 7, 8
Reference ORP
Table (I/Os per
GLB)
16
8
9, 10,
14, 15
16
8
12
4
6
6, 7, 8
33
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4000ZE Power Supply and NC Connections1
48 TQFP2
Signal
64 csBGA3, 4
100 TQFP2
VCC
12, 36
E4, D5
25, 40, 75, 90
VCCO0
VCCO (Bank 0)
6
4032ZE: E3
4064ZE: E3, F4
13, 33, 95
VCCO1
VCCO (Bank 1)
30
4032ZE: D6
4064ZE: D6, C6
45, 63, 83
GND
13, 37
D4, E5
1, 26, 51, 76
GND (Bank 0)
5
D4, E5
7, 18, 32, 96
GND (Bank 1)
29
D4, E5
46, 57, 68, 82
NC
—
—
—
1. All grounds must be electrically connected at the board level. However, for the purposes of I/O current loading, grounds are associated with
the bank shown.
2. Pin orientation follows the conventional order from pin 1 marking of the top side view and counter-clockwise.
3. Pin orientation A1 starts from the upper left corner of the top side view with alphabetical order ascending vertically and numerical order
ascending horizontally.
4. All bonded grounds are connected to the following two balls, D4 and E5.
34
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4000ZE Power Supply and NC Connections1 (Cont.)
144 csBGA3
Signal
VCC
144 TQFP2
H5, H8, E8, E5
36, 57, 108, 129
VCCO0
E4, F4, G4, J5, D5
VCCO (Bank 0)
3, 19, 34, 47, 136
J8, H9, G9, F9, D8
VCCO1
VCCO (Bank 1)
64, 75, 91, 106, 119
GND
F6, G6, G7, F7
1, 37, 73, 109
GND (Bank 0)
G5, H4, H6, E6, F5
10, 184, 27, 46, 127, 137
GND (Bank 1)
H7, J9, G8, F8, E7
55, 65, 82, 904, 99, 118
NC
4064ZE: E4, B2, B1, D2, D3, E1, H1, H3, H2, L1, G4, 4128ZE: 17, 20, 38, 45, 72, 89, 92, 110, 117, 144
M1, K3, M2, M4, L5, H7, L8, M8, L10, K9, M11, H9, 4256ZE: 18, 90
L12, L11, J12, J11, H10, D10, F10, D12, B12, F9,
A12, C10, B10, A9, B8, E6, B5, A5, C4, B3, A2
4128ZE: D2, D3, H2, M1, K3, M11, J12, J11, D12,
A12, C10, A2
1. All grounds must be electrically connected at the board level. However, for the purposes of I/O current loading, grounds are associated with
the bank shown.
2. Pin orientation follows the conventional order from pin 1 marking of the top side view and counter-clockwise.
3. Pin orientation A1 starts from the upper left corner of the top side view with alphabetical order ascending vertically and numerical order
ascending horizontally.
4. For the LC4256ZE, pins 18 and 90 are no connects.
35
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4032ZE and 4064ZE Logic Signal Connections: 48 TQFP
ispMACH 4032ZE
ispMACH 4064ZE
Pin Number
Bank Number
GLB/MC/Pad
GLB/MC/Pad
1
-
TDI
TDI
2
0
A5
A8
3
0
A6
A10
4
0
A7
A11
5
0
GND (Bank 0)
GND (Bank 0)
6
0
VCCO (Bank 0)
VCCO (Bank 0)
7
0
A8
B15
8
0
A9
B12
9
0
A10
B10
10
0
A11
B8
11
-
TCK
TCK
12
-
VCC
VCC
13
-
GND
GND
14
0
A12
B6
15
0
A13
B4
16
0
A14
B2
17
0
A15
B0
18
0
CLK1/I
CLK1/I
19
1
CLK2/I
CLK2/I
20
1
B0
C0
21
1
B1
C1
22
1
B2
C2
23
1
B3
C4
24
1
B4
C6
25
-
TMS
TMS
26
1
B5
C8
27
1
B6
C10
28
1
B7
C11
29
1
GND (Bank 1)
GND (Bank 1)
30
1
VCCO (Bank 1)
VCCO (Bank 1)
31
1
B8
D15
32
1
B9
D12
33
1
B10
D10
34
1
B11
D8
35
-
TDO
TDO
36
-
VCC
VCC
37
-
GND
GND
38
1
B12
D6
39
1
B13
D4
40
1
B14
D2
41
1
B15/GOE1
D0/GOE1
42
1
CLK3/I
CLK3/I
36
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4032ZE and 4064ZE Logic Signal Connections: 48 TQFP (Cont.)
ispMACH 4032ZE
ispMACH 4064ZE
GLB/MC/Pad
GLB/MC/Pad
Pin Number
Bank Number
43
0
CLK0/I
CLK0/I
44
0
A0/GOE0
A0/GOE0
45
0
A1
A1
46
0
A2
A2
47
0
A3
A4
48
0
A4
A6
37
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4032ZE and 4064ZE Logic Signal Connections: 64 csBGA
ispMACH 4032ZE
ispMACH 4064ZE
Ball Number
Bank Number
GLB/MC/Pad
GLB/MC/Pad
B2
-
TDI
TDI
B1
0
A5
A8
C2
0
A6
A10
C1
0
A7
A11
GND*
0
GND (Bank 0)
GND (Bank 0)
C3
0
NC
A12
E3
0
VCCO (Bank 0)
VCCO (Bank 0)
D1
0
A8
B15
D2
0
NC
B14
E1
0
A9
B13
D3
0
A10
B12
F1
0
A11
B11
E2
0
NC
B10
G1
0
NC
B9
F2
0
NC
B8
H1
-
TCK
TCK
E4
-
VCC
VCC
GND*
-
GND
GND
G2
0
A12
B6
H2
0
NC
B5
H3
0
A13
B4
GND*
0
NC
GND (Bank 0)
F4
0
NC
VCCO (Bank 0)
G3
0
A14
B3
F3
0
NC
B2
H4
0
A15
B0
G4
0
CLK1/I
CLK1/I
H5
1
CLK2/I
CLK2/I
F5
1
B0
C0
G5
1
B1
C1
G6
1
B2
C2
H6
1
B3
C4
F6
1
B4
C5
H7
1
NC
C6
H8
-
TMS
TMS
G7
1
B5
C8
F7
1
B6
C10
G8
1
B7
C11
GND*
1
GND (Bank 0)
GND (Bank 1)
F8
1
NC
C12
D6
1
VCCO (Bank 1)
VCCO (Bank 1)
E8
1
B8
D15
38
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4032ZE and 4064ZE Logic Signal Connections: 64 csBGA (Cont.)
ispMACH 4032ZE
ispMACH 4064ZE
GLB/MC/Pad
Ball Number
Bank Number
GLB/MC/Pad
E7
1
NC
D14
E6
1
B9
D13
D7
1
B10
D12
D8
1
NC
D11
C5
1
NC
D10
C7
1
B11
D9
C8
1
NC
D8
B8
-
TDO
TDO
D5
-
VCC
VCC
GND*
-
GND
GND
A8
1
B12
D7
A7
1
NC
D6
B7
1
NC
D5
A6
1
B13
D4
GND*
1
NC
GND (Bank 1)
C6
1
NC
VCCO (Bank 1)
B6
1
B14
D3
A5
1
NC
D2
B5
1
B15/GOE1
D0/GOE1
A4
1
CLK3/I
CLK3/I
C4
0
CLK0/I
CLK0/I
B4
0
A0/GOE0
A0/GOE0
B3
0
A1
A1
A3
0
A2
A2
A2
0
A3
A4
A1
0
A4
A6
* All bonded grounds are connected to the following two balls, D4 and E5.
39
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4064ZE, 4128ZE and 4256ZE Logic Signal Connections:
100 TQFP
Pin
Number
Bank
Number
LC4064ZE
LC4128ZE
LC4256ZE
GLB/MC/Pad
GLB/MC/Pad
GLB/MC/Pad
1
-
GND
GND
GND
2
-
TDI
TDI
TDI
3
0
A8
B0
C12
4
0
A9
B2
C10
5
0
A10
B4
C6
6
0
A11
B6
C2
7
0
GND (Bank 0)
GND (Bank 0)
GND (Bank 0)
8
0
A12
B8
D12
9
0
A13
B10
D10
10
0
A14
B12
D6
11
0
A15
B13
D4
12*
0
I
I
I
13
0
VCCO (Bank 0)
VCCO (Bank 0)
VCCO (Bank 0)
14
0
B15
C14
E4
15
0
B14
C12
E6
16
0
B13
C10
E10
17
0
B12
C8
E12
18
0
GND (Bank 0)
GND (Bank 0)
GND (Bank 0)
19
0
B11
C6
F2
20
0
B10
C5
F6
21
0
B9
C4
F10
22
0
B8
C2
F12
23*
0
I
I
I
24
-
TCK
TCK
TCK
25
-
VCC
VCC
VCC
26
-
GND
GND
GND
27*
0
I
I
I
28
0
B7
D13
G12
29
0
B6
D12
G10
30
0
B5
D10
G6
31
0
B4
D8
G2
32
0
GND (Bank 0)
GND (Bank 0)
GND (Bank 0)
33
0
VCCO (Bank 0)
VCCO (Bank 0)
VCCO (Bank 0)
34
0
B3
D6
H12
35
0
B2
D4
H10
36
0
B1
D2
H6
37
0
B0
D0
H2
38
0
CLK1/I
CLK1/I
CLK1/I
39
1
CLK2/I
CLK2/I
CLK2/I
40
-
VCC
VCC
VCC
41
1
C0
E0
I2
40
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4064ZE, 4128ZE and 4256ZE Logic Signal Connections:
100 TQFP (Cont.)
Pin
Number
Bank
Number
LC4064ZE
LC4128ZE
LC4256ZE
GLB/MC/Pad
GLB/MC/Pad
GLB/MC/Pad
42
1
C1
E2
I6
43
1
C2
E4
I10
44
1
C3
E6
I12
45
1
VCCO (Bank 1)
VCCO (Bank 1)
VCCO (Bank 1)
46
1
GND (Bank 1)
GND (Bank 1)
GND (Bank 1)
47
1
C4
E8
J2
48
1
C5
E10
J6
49
1
C6
E12
J10
50
1
C7
E14
J12
51
-
GND
GND
GND
52
-
TMS
TMS
TMS
53
1
C8
F0
K12
54
1
C9
F2
K10
55
1
C10
F4
K6
56
1
C11
F6
K2
57
1
GND (Bank 1)
GND (Bank 1)
GND (Bank 1)
58
1
C12
F8
L12
59
1
C13
F10
L10
60
1
C14
F12
L6
61
1
C15
F13
L4
62*
1
I
I
I
63
1
VCCO (Bank 1)
VCCO (Bank 1)
VCCO (Bank 1)
64
1
D15
G14
M4
65
1
D14
G12
M6
66
1
D13
G10
M10
67
1
D12
G8
M12
68
1
GND (Bank 1)
GND (Bank 1)
GND (Bank 1)
69
1
D11
G6
N2
70
1
D10
G5
N6
71
1
D9
G4
N10
72
1
D8
G2
N12
73*
1
I
I
I
74
-
TDO
TDO
TDO
75
-
VCC
VCC
VCC
76
-
GND
GND
GND
77*
1
I
I
I
78
1
D7
H13
O12
79
1
D6
H12
O10
80
1
D5
H10
O6
81
1
D4
H8
O2
82
1
GND (Bank 1)
GND (Bank 1)
GND (Bank 1)
41
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4064ZE, 4128ZE and 4256ZE Logic Signal Connections:
100 TQFP (Cont.)
LC4064ZE
LC4128ZE
LC4256ZE
Pin
Number
Bank
Number
GLB/MC/Pad
GLB/MC/Pad
GLB/MC/Pad
83
1
VCCO (Bank 1)
VCCO (Bank 1)
VCCO (Bank 1)
84
1
D3
H6
P12
85
1
D2
H4
P10
86
1
D1
H2
P6
87
1
D0/GOE1
H0/GOE1
P2/GOE1
88
1
CLK3/I
CLK3/I
CLK3/I
89
0
CLK0/I
CLK0/I
CLK0/I
90
-
VCC
VCC
VCC
91
0
A0/GOE0
A0/GOE0
A2/GOE0
92
0
A1
A2
A6
93
0
A2
A4
A10
94
0
A3
A6
A12
95
0
VCCO (Bank 0)
VCCO (Bank 0)
VCCO (Bank 0)
96
0
GND (Bank 0)
GND (Bank 0)
GND (Bank 0)
97
0
A4
A8
B2
98
0
A5
A10
B6
99
0
A6
A12
B10
100
0
A7
A14
B12
* This pin is input only.
42
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4064ZE, 4128ZE and 4256ZE Logic Signal Connections:
144 csBGA
Ball
Number
Bank
Number
LC4064ZE
LC4128ZE
LC4256ZE
GLB/MC/Pad
GLB/MC/Pad
GLB/MC/Pad
F6
-
GND
GND
GND
A1
-
TDI
TDI
TDI
E4
0
NC Ball
VCCO (Bank 0)
VCCO (Bank 0)
B2
0
NC Ball
B0
C12
B1
0
NC Ball
B1
C10
C3
0
A8
B2
C8
C2
0
A9
B4
C6
C1
0
A10
B5
C4
D1
0
A11
B6
C2
G5
0
GND (Bank 0)
GND (Bank 0)
GND (Bank 0)
D2
0
NC Ball
NC Ball
D14
D3
0
NC Ball
NC Ball
D12
E1
0
NC Ball
B8
D10
E2
0
A12
B9
D8
F2
0
A13
B10
D6
D4
0
A14
B12
D4
F1
0
A15
B13
D2
F3*
0
I
B14
D0
F4
0
VCCO (Bank 0)
VCCO (Bank 0)
VCCO (Bank 0)
G1
0
B15
C14
E0
E3
0
B14
C13
E2
G2
0
B13
C12
E4
G3
0
B12
C10
E6
H1
0
NC Ball
C9
E8
H3
0
NC Ball
C8
E10
H2
0
NC Ball
NC Ball
E12
H4
0
GND (Bank 0)
GND (Bank 0)
GND (Bank 0)
J1
0
B11
C6
F2
J3
0
B10
C5
F4
J2
0
B9
C4
F6
K1
0
B8
C2
F8
K2*
0
I
C1
F10
L1
0
NC Ball
C0
F12
G4
0
NC Ball
VCCO (Bank 0)
VCCO (Bank 0)
L2
-
TCK
TCK
TCK
H5
-
VCC
VCC
VCC
G6
-
GND
GND
GND
M1
0
NC Ball
NC Ball
G14
K3
0
NC Ball
NC Ball
G12
M2
0
NC Ball
D14
G10
L3*
0
I
D13
G8
43
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4064ZE, 4128ZE and 4256ZE Logic Signal Connections:
144 csBGA (Cont.)
Ball
Number
Bank
Number
LC4064ZE
LC4128ZE
LC4256ZE
GLB/MC/Pad
GLB/MC/Pad
GLB/MC/Pad
J4
0
B7
D12
G6
K4
0
B6
D10
G4
M3
0
B5
D9
G2
L4
0
B4
D8
G0
H6
0
GND (Bank 0)
GND (Bank 0)
GND (Bank 0)
J5
0
VCCO (Bank 0)
VCCO (Bank 0)
VCCO (Bank 0)
M4
0
NC Ball
D6
H12
L5
0
NC Ball
D5
H10
K5
0
B3
D4
H8
J6
0
B2
D2
H6
M5
0
B1
D1
H4
K6
0
B0
D0
H2
L6
0
CLK1/I
CLK1/I
CLK1/I
H7
1
NC Ball
GND (Bank 1)
GND (Bank 1)
M6
1
CLK2/I
CLK2/I
CLK2/I
H8
-
VCC
VCC
VCC
K7
1
C0
E0
I2
M7
1
C1
E1
I4
L7
1
C2
E2
I6
J7
1
C3
E4
I8
L8
1
NC Ball
E5
I10
M8
1
NC Ball
E6
I12
J8
1
VCCO (Bank 1)
VCCO (Bank 1)
VCCO (Bank 1)
J9
1
GND (Bank 1)
GND (Bank 1)
GND (Bank 1)
M9
1
C4
E8
J2
L9
1
C5
E9
J4
K8
1
C6
E10
J6
M10
1
C7
E12
J8
L10
1
NC Ball
E13
J10
K9
1
NC Ball
E14
J12
M11
1
NC Ball
NC Ball
J14
G7
-
GND
GND
GND
M12
-
TMS
TMS
TMS
H9
1
NC Ball
VCCO (Bank 1)
VCCO (Bank 1)
L12
1
NC Ball
F0
K12
L11
1
NC Ball
F1
K10
K10
1
C8
F2
K8
K12
1
C9
F4
K6
J10
1
C10
F5
K4
K11
1
C11
F6
K2
G8
1
GND (Bank 1)
GND (Bank 1)
GND (Bank 1)
44
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4064ZE, 4128ZE and 4256ZE Logic Signal Connections:
144 csBGA (Cont.)
Ball
Number
Bank
Number
LC4064ZE
LC4128ZE
LC4256ZE
GLB/MC/Pad
GLB/MC/Pad
GLB/MC/Pad
J12
1
NC Ball
NC Ball
L14
J11
1
NC Ball
NC Ball
L12
H10
1
NC Ball
F8
L10
H12
1
C12
F9
L8
G11
1
C13
F10
L6
H11
1
C14
F12
L4
G12
1
C15
F13
L2
G10*
1
I
F14
L0
G9
1
VCCO (Bank 1)
VCCO (Bank 1)
VCCO (Bank 1)
F12
1
D15
G14
M0
F11
1
D14
G13
M2
E11
1
D13
G12
M4
E12
1
D12
G10
M6
D10
1
NC Ball
G9
M8
F10
1
NC Ball
G8
M10
D12
1
NC Ball
NC Ball
M12
F8
1
GND (Bank 1)
GND (Bank 1)
GND (Bank 1)
E10
1
D11
G6
N2
D11
1
D10
G5
N4
E9
1
D9
G4
N6
C12
1
D8
G2
N8
C11*
1
I
G1
N10
B12
1
NC Ball
G0
N12
F9
1
NC Ball
VCCO (Bank 1)
VCCO (Bank 1)
B11
-
TDO
TDO
TDO
E8
-
VCC
VCC
VCC
F7
-
GND
GND
GND
A12
1
NC Ball
NC Ball
O14
C10
1
NC Ball
NC Ball
O12
B10
1
NC Ball
H14
O10
A11*
1
I
H13
O8
D9
1
D7
H12
O6
B9
1
D6
H10
O4
C9
1
D5
H9
O2
A10
1
D4
H8
O0
E7
1
GND (Bank 1)
GND (Bank 1)
GND (Bank 1)
D8
1
VCCO (Bank 1)
VCCO (Bank 1)
VCCO (Bank 1)
A9
1
NC Ball
H6
P12
B8
1
NC Ball
H5
P10
C8
1
D3
H4
P8
A8
1
D2
H2
P6
45
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4064ZE, 4128ZE and 4256ZE Logic Signal Connections:
144 csBGA (Cont.)
Ball
Number
Bank
Number
LC4064ZE
LC4128ZE
LC4256ZE
GLB/MC/Pad
GLB/MC/Pad
GLB/MC/Pad
D7
1
D1
H1
P4
B7
1
D0/GOE1
H0/GOE1
P2/GOE1
C7
1
CLK3/I
CLK3/I
CLK3/I
E6
0
NC Ball
GND (Bank 0)
GND (Bank 0)
A7
0
CLK0/I
CLK0/I
CLK0/I
E5
-
VCC
VCC
VCC
D6
0
A0/GOE0
A0/GOE0
A2/GOE0
B6
0
A1
A1
A4
A6
0
A2
A2
A6
C6
0
A3
A4
A8
B5
0
NC Ball
A5
A10
A5
0
NC Ball
A6
A12
D5
0
VCCO (Bank 0)
VCCO (Bank 0)
VCCO (Bank 0)
F5
0
GND (Bank 0)
GND (Bank 0)
GND (Bank 0)
A4
0
A4
A8
B2
B4
0
A5
A9
B4
C5
0
A6
A10
B6
A3
0
A7
A12
B8
C4
0
NC Ball
A13
B10
B3
0
NC Ball
A14
B12
A2
0
NC Ball
NC Ball
B14
* This pin is input only for the LC4064ZE.
46
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4128ZE and 4256ZE Logic Signal Connections: 144 TQFP
LC4128ZE
LC4256ZE
Pin Number
Bank Number
GLB/MC/Pad
GLB/MC/Pad
1
-
GND
GND
2
-
TDI
TDI
3
0
VCCO (Bank 0)
VCCO (Bank 0)
4
0
B0
C12
5
0
B1
C10
6
0
B2
C8
7
0
B4
C6
8
0
B5
C4
9
0
B6
C2
10
0
GND (Bank 0)
GND (Bank 0)
11
0
B8
D14
12
0
B9
D12
13
0
B10
D10
14
0
B12
D8
15
0
B13
D6
16
0
B14
D4
17*
0
NC
I
18
0
GND (Bank 0)
NC
19
0
VCCO (Bank 0)
VCCO (Bank 0)
20*
0
NC
I
21
0
C14
E2
22
0
C13
E4
23
0
C12
E6
24
0
C10
E8
25
0
C9
E10
26
0
C8
E12
27
0
GND (Bank 0)
GND (Bank 0)
28
0
C6
F2
29
0
C5
F4
30
0
C4
F6
31
0
C2
F8
32
0
C1
F10
33
0
C0
F12
34
0
VCCO (Bank 0)
VCCO (Bank 0)
35
-
TCK
TCK
36
-
VCC
VCC
37
-
GND
GND
38*
0
NC
I
39
0
D14
G12
40
0
D13
G10
41
0
D12
G8
42
0
D10
G6
47
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4128ZE and 4256ZE Logic Signal Connections: 144 TQFP (Cont.)
LC4128ZE
LC4256ZE
Pin Number
Bank Number
GLB/MC/Pad
GLB/MC/Pad
43
0
D9
G4
44
0
D8
G2
45*
0
NC
I
46
0
GND (Bank 0)
GND (Bank 0)
47
0
VCCO (Bank 0)
VCCO (Bank 0)
48
0
D6
H12
49
0
D5
H10
50
0
D4
H8
51
0
D2
H6
52
0
D1
H4
53
0
D0
H2
54
0
CLK1/I
CLK1/I
55
1
GND (Bank 1)
GND (Bank 1)
56
1
CLK2/I
CLK2/I
57
-
VCC
VCC
58
1
E0
I2
59
1
E1
I4
60
1
E2
I6
61
1
E4
I8
62
1
E5
I10
63
1
E6
I12
64
1
VCCO (Bank 1)
VCCO (Bank 1)
65
1
GND (Bank 1)
GND (Bank 1)
66
1
E8
J2
67
1
E9
J4
68
1
E10
J6
69
1
E12
J8
70
1
E13
J10
71
1
E14
J12
72*
1
NC
I
73
-
GND
GND
74
-
TMS
TMS
75
1
VCCO (Bank 1)
VCCO (Bank 1)
76
1
F0
K12
77
1
F1
K10
78
1
F2
K8
79
1
F4
K6
80
1
F5
K4
81
1
F6
K2
82
1
GND (Bank 1)
GND (Bank 1)
83
1
F8
L14
84
1
F9
L12
85
1
F10
L10
48
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4128ZE and 4256ZE Logic Signal Connections: 144 TQFP (Cont.)
LC4128ZE
LC4256ZE
Pin Number
Bank Number
GLB/MC/Pad
GLB/MC/Pad
86
1
F12
L8
87
1
F13
L6
88
1
F14
L4
89*
1
NC
I
90
1
GND (Bank 1)
NC
91
1
VCCO (Bank 1)
VCCO (Bank 1)
92*
1
NC
I
93
1
G14
M2
94
1
G13
M4
95
1
G12
M6
96
1
G10
M8
97
1
G9
M10
98
1
G8
M12
99
1
GND (Bank 1)
GND (Bank 1)
100
1
G6
N2
101
1
G5
N4
102
1
G4
N6
103
1
G2
N8
104
1
G1
N10
105
1
G0
N12
106
1
VCCO (Bank 1)
VCCO (Bank 1)
107
-
TDO
TDO
108
-
VCC
VCC
109
-
GND
GND
110*
1
NC
I
111
1
H14
O12
112
1
H13
O10
113
1
H12
O8
114
1
H10
O6
115
1
H9
O4
116
1
H8
O2
117*
1
NC
I
118
1
GND (Bank 1)
GND (Bank 1)
119
1
VCCO (Bank 1)
VCCO (Bank 1)
120
1
H6
P12
121
1
H5
P10
122
1
H4
P8
123
1
H2
P6
124
1
H1
P4
125
1
H0/GOE1
P2/GOE1
126
1
CLK3/I
CLK3/I
127
0
GND (Bank 0)
GND (Bank 0)
128
0
CLK0/I
CLK0/I
49
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
ispMACH 4128ZE and 4256ZE Logic Signal Connections: 144 TQFP (Cont.)
Pin Number
Bank Number
LC4128ZE
LC4256ZE
GLB/MC/Pad
GLB/MC/Pad
129
-
VCC
VCC
130
0
A0/GOE0
A2/GOE0
131
0
A1
A4
132
0
A2
A6
133
0
A4
A8
134
0
A5
A10
135
0
A6
A12
136
0
VCCO (Bank 0)
VCCO (Bank 0)
137
0
GND (Bank 0)
GND (Bank 0)
138
0
A8
B2
139
0
A9
B4
140
0
A10
B6
141
0
A12
B8
142
0
A13
B10
143
0
A14
B12
144*
0
NC
I
* This pin is input only for the LC4256ZE.
50
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
Part Number Description
LC XXXX XX – XX XX XXX X XX
Production Status
Blank = Final production device
ES = Engineering samples
Device Family
Device Number
4032 = 32 Macrocells
4064 = 64 Macrocells
4128 = 128 Macrocells
4256 = 256 Macrocells
Operating Temperature Range
C = Commercial
I = Industrial
Pin/Ball Count
48 (1.0 mm thickness)
64
100
144
Power
ZE = Zero Power, Enhanced
Speed
4 = 4.4ns (4032ZE Only)
4 = 4.7ns (4064ZE Only)
5 = 5.8ns (All Devices)
7 = 7.5ns (All Devices)
Package
TN = Lead-free TQFP
MN = Lead-free csBGA
ispMACH 4000ZE Family Speed Grade Offering
-4
-5
-7
Com
Com
Ind
Com
Ind
ispMACH 4032ZE
✔
✔
✔
✔
✔
ispMACH 4064ZE
✔
✔
✔
✔
✔
ispMACH 4128ZE
✔
✔
✔
ispMACH 4256ZE
✔
✔
✔
Ordering Information
Note: ispMACH 4000ZE devices are dual marked except for the slowest commercial speed grade. For example, the
commercial speed grade LC4128ZE-5TN100C is also marked with the industrial grade -7I. The commercial grade
is always one speed grade faster than the associated dual mark industrial grade. The slowest commercial speed
grade devices are marked as commercial grade only. The markings appear as follows:
Figure 18. Mark Format for 100 TQFP and 144 TQFP Packages
ispMACH
ispMACH
LC4128ZE
5TN100C-7I
LC4128ZE
7TN100C
Datecode
Datecode
Dual Mark
Single Mark
Figure 19. Mark Format for 48 TQFP, 64 csBGA and 144 csBGA Packages
ispMACH
ispMACH
LC4032ZE
5MN-7I
LC4032ZE
7MN
Datecode
Datecode
Dual Mark
Single Mark
51
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
Lead-Free Packaging
Commercial Devices
Device
LC4032ZE
LC4046ZE
LC4128ZE
LC4256ZE
Pin/Ball
Count
I/O
Grade
Lead-Free TQFP
48
32
C
5.8
Lead-Free TQFP
48
32
C
7.5
Lead-Free TQFP
48
32
C
1.8
4.4
Lead-Free csBGA
64
32
C
1.8
5.8
Lead-Free csBGA
64
32
C
32
1.8
7.5
Lead-Free csBGA
64
32
C
64
1.8
4.7
Lead-Free TQFP
48
32
C
LC4064ZE-5TN48C
64
1.8
5.8
Lead-Free TQFP
48
32
C
LC4064ZE-7TN48C
64
1.8
7.5
Lead-Free TQFP
48
32
C
LC4064ZE-4TN100C
64
1.8
4.7
Lead-Free TQFP
100
64
C
LC4064ZE-5TN100C
64
1.8
5.8
Lead-Free TQFP
100
64
C
LC4064ZE-7TN100C
64
1.8
7.5
Lead-Free TQFP
100
64
C
LC4064ZE-4MN64C
64
1.8
4.7
Lead-Free csBGA
64
48
C
LC4064ZE-5MN64C
64
1.8
5.8
Lead-Free csBGA
64
48
C
LC4064ZE-7MN64C
64
1.8
7.5
Lead-Free csBGA
64
48
C
LC4064ZE-4MN144C
64
1.8
4.7
Lead-Free csBGA
144
64
C
LC4064ZE-5MN144C
64
1.8
5.8
Lead-Free csBGA
144
64
C
LC4064ZE-7MN144C
64
1.8
7.5
Lead-Free csBGA
144
64
C
LC4128ZE-5TN100C
128
1.8
5.8
Lead-Free TQFP
100
64
C
LC4128ZE-7TN100C
128
1.8
7.5
Lead-Free TQFP
100
64
C
LC4128ZE-5TN144C
128
1.8
5.8
Lead-Free TQFP
144
96
C
LC4128ZE-7TN144C
128
1.8
7.5
Lead-Free TQFP
144
96
C
LC4128ZE-5MN144C
128
1.8
5.8
Lead-Free csBGA
144
96
C
Part Number
Macrocells
Voltage
tPD
LC4032ZE-4TN48C
32
1.8
4.4
LC4032ZE-5TN48C
32
1.8
LC4032ZE-7TN48C
32
1.8
LC4032ZE-4MN64C
32
LC4032ZE-5MN64C
32
LC4032ZE-7MN64C
LC4064ZE-4TN48C
Package
LC4128ZE-7MN144C
128
1.8
7.5
Lead-Free csBGA
144
96
C
LC4256ZE-5TN100C
256
1.8
5.8
Lead-Free TQFP
100
64
C
LC4256ZE-7TN100C
256
1.8
7.5
Lead-Free TQFP
100
64
C
LC4256ZE-5TN144C
256
1.8
5.8
Lead-Free TQFP
144
96
C
LC4256ZE-7TN144C
256
1.8
7.5
Lead-Free TQFP
144
96
C
LC4256ZE-5MN144C
256
1.8
5.8
Lead-Free csBGA
144
108
C
LC4256ZE-7MN144C
256
1.8
7.5
Lead-Free csBGA
144
108
C
52
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
Industrial
Device
LC4032ZE
LC4064ZE
LC4128ZE
LC4256ZE
Pin/Ball
Count
I/O
Grade
Lead-Free TQFP
48
32
I
Lead-Free TQFP
48
32
I
5.8
Lead-Free csBGA
64
32
I
7.5
Lead-Free csBGA
64
32
I
1.8
5.8
Lead-Free TQFP
48
32
I
1.8
7.5
Lead-Free TQFP
48
32
I
64
1.8
5.8
Lead-Free TQFP
100
64
I
64
1.8
7.5
Lead-Free TQFP
100
64
I
LC4064ZE-5MN64I
64
1.8
5.8
Lead-Free csBGA
64
48
I
LC4064ZE-7MN64I
64
1.8
7.5
Lead-Free csBGA
64
48
I
LC4064ZE-5MN144I
64
1.8
5.8
Lead-Free csBGA
144
64
I
LC4064ZE-7MN144I
64
1.8
7.5
Lead-Free csBGA
144
64
I
LC4128ZE-7TN100I
128
1.8
7.5
Lead-Free TQFP
100
64
I
LC4128ZE-7TN144I
128
1.8
7.5
Lead-Free TQFP
144
96
I
LC4128ZE-7MN144I
128
1.8
7.5
Lead-Free csBGA
144
96
I
LC4256ZE-7TN100I
256
1.8
7.5
Lead-Free TQFP
100
64
I
LC4256ZE-7TN144I
256
1.8
7.5
Lead-Free TQFP
144
96
I
LC4256ZE-7MN144I
256
1.8
7.5
Lead-Free csBGA
144
108
I
Part Number
Macrocells
Voltage
tPD
LC4032ZE-5TN48I
32
1.8
5.8
LC4032ZE-7TN48I
32
1.8
7.5
LC4032ZE-5MN64I
32
1.8
LC4032ZE-7MN64I
32
1.8
LC4064ZE-5TN48I
64
LC4064ZE-7TN48I
64
LC4064ZE-5TN100I
LC4064ZE-7TN100I
Package
For Further Information
In addition to this data sheet, the following technical notes may be helpful when designing with the ispMACH
4000ZE family:
• TN1168 – ispMACH 4000ZE Timing Model Design and Usage Guidelines
• TN1174 – Advanced Features of the ispMACH 4000ZE
• TN1175 – Power Estimation and Management for ispMACH 4000ZE Devices
Technical Support Assistance
Hotline: 1-800-LATTICE (North America)
+1-503-268-8001 (Outside North America)
e-mail: [email protected]
Internet: www.latticesemi.com
53
Lattice Semiconductor
ispMACH 4000ZE Family Data Sheet
Revision History
Date
Version
Change Summary
April 2008
01.0
Initial release.
July 2008
01.1
Updated Features bullets.
Updated typical Hysteresis voltage.
Updated Power Guard for Dedicated Inputs section.
Updated DC Electrical Characteristics table.
Updated Supply Current table.
Updated I/O DC Electrical Characteristics table and note 2.
Updated ispMACH 4000ZE Timing Model.
Added new parameters for the Internal Oscillator.
Updated ORP Reference table.
Updated Power Supply and NC Connections table.
Updated 100 TQFP Logic Signal Connections table with LC4128ZE and 4256ZE.
Updated 144 csBGA Logic Signal Connections table with LC4128ZE and 4256ZE.
Added 144 TQFP Logic Signal Connections table.
August 2008
01.2
Data sheet status changed from advance to final.
Updated Supply Current table.
Updated External Switching Characteristics.
Updated Internal Timing Parameters.
Updated Power Consumption graph and Power Estimation Coefficients table.
Updated Ordering Information mark format example.
54