Diode Semiconductor Korea Surface mount zener diode FEATURES BZT52B2V4-BZT52B51 Pb z Planar die construction. z “B” for ±2% tolerance. z General purpose, medium current. z Ideally suited for automated assembly processes. Lead-free APPLICATIONS z Zener diode. z Ultra-small surface mount package. SOD-123 ORDERING INFORMATION Type No. Marking BZT52B2V4-BZT52B51 See table 2 Package Code SOD-123 MAXIMUM RATING @ Ta=25℃ unless otherwise specified Characteristic Symbol Value Unit VF 0.9 V Power Dissipation Pd 500 mW Thermal resistance,junction to ambient air RθjA 305 ℃/W Junction temperature Tj 150 ℃ Storage temperature range Tstg -65-150 ℃ Forward Voltage @ IF=10mA Notes: 1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm2 2. Short duration test pulse used to minimize self-heating effect. 3. When provided, otherwise, parts are provided with date code only, and type number identifications appears on reel only. 4. f = 1KHz www.diode.kr Diode Semiconductor Korea Surface mount zener diode BZT52B2V4-BZT52B51 ELECTRICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified Type Number Maximum Zener Impedance Zener Voltage Range Marking Code VZ@IZT IZT Nom(V) Min(V) Max(V) mA ZZT@IZT ZZK@IZK Ω IZK mA BZT52B2V4 W1• 2.4 2.35 2.45 5 85 600 1.0 BZT52B2V7 W2• 2.7 2.65 2.75 5 83 500 1.0 BZT52B3V0 W3• 3.0 2.94 3.06 5 95 500 1.0 BZT52B3V3 W4• 3.3 3.23 3.37 5 95 500 1.0 BZT52B3V6 W5• 3.6 3.53 3.67 5 95 500 1.0 BZT52B3V9 W6• 3.9 3.82 3.98 5 95 500 1.0 BZT52B4V3 W7• 4.3 4.21 4.39 5 95 500 1.0 BZT52B4V7 W8• 4.7 4.61 4.79 5 78 500 1.0 BZT52B5V1 W9• 5.1 5 5.2 5 60 480 1.0 BZT52B5V6 WA• 5.6 5.49 5.71 5 40 400 1.0 BZT52B6V2 WB• 6.2 6.08 6.32 5 10 200 1.0 BZT52B6V8 WC• 6.8 6.66 6.94 5 8 150 1.0 BZT52B7V5 WD• 7.5 7.35 7.65 5 7 50 1.0 BZT52B8V2 WE• 8.2 8.04 8.36 5 7 50 1.0 BZT52B9V1 WF• 9.1 8.92 9.28 5 10 50 1.0 BZT52B10 WG• 10 9.8 10.2 5 15 70 1.0 BZT52B11 WH• 11 10.8 11.2 5 20 70 1.0 BZT52B12 WI• 12 11.8 12.2 5 20 90 1.0 BZT52B13 WJ• 13 12.7 13.3 5 25 110 1.0 BZT52B15 WK• 15 14.7 15.3 5 30 110 1.0 BZT52B16 WL• 16 15.7 16.3 5 40 170 1.0 BZT52B18 WM• 18 17.6 18.4 5 50 170 1.0 BZT52B20 WN• 20 19.6 20.4 5 50 220 1.0 BZT52B22 WO• 22 21.6 22.4 5 55 220 1.0 BZT52B24 WP• 24 23.5 24.5 5 80 220 1.0 BZT52B27 WQ• 27 26.5 27.5 5 80 250 1.0 BZT52B30 WR• 30 29.4 30.6 5 80 250 1.0 BZT52B33 WS• 33 32.3 33.7 5 80 250 1.0 BZT52B36 WT• 36 35.3 36.7 5 90 250 1.0 BZT52B39 WU• 39 38.2 39.8 5 90 300 1.0 BZT52B43 WV• 43 42.1 43.9 5 100 700 1.0 BZT52B47 WW• 47 46.1 47.9 5 100 750 1.0 BZT52B51 X1• 51 50 52 5 100 750 1.0 www.diode.kr Diode Semiconductor Korea Surface mount zener diode BZT52B2V4-BZT52B51 TYPICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified www.diode.kr Diode Semiconductor Korea Surface mount zener diode BZT52B2V4-BZT52B51 PACKAGE OUTLINE Plastic surface mounted package SOD-123 SOD-123 K B C A D H E Dim Min Max A 1.4 1.8 B 2.55 2.85 C 1.15 Typical D 0.5 0.6 E 0.3 0.4 H 0.02 0.10 J J K 0.1 Typical 3.55 3.85 All Dimensions in mm SOLDERING FOOTPRINT Unit : mm PACKAGE INFORMATION Device Package Shipping BZT52B2V4-BZT52B51 SOD-123 3000/Tape&Reel www.diode.kr