MCNIX MX23L6414XI-12 64m-bit mask rom Datasheet

PRELIMINARY
MX23L6414
64M-BIT MASK ROM
FEATURES
PIN DESCRIPTION
• Bit organization
- 8Mb x 8 (byte mode)
- 4Mb x 16 (word mode)
• Fast access time
- Random access:90/25ns(max.)
• Page Size
- 8 words per page
• Current
- Operating:20mA
- Standby:15uA(max.)
• Supply voltage
- VCC : 2.7 ~ 3.6V
- VCCQ : 2.7 ~ 3.6V
• Package
- 64 ball mini BGA (10.0mm X 13.0mm, ball pitch
1.0mm)
- 56 pin TSOP (14mm x 20mm)
• Temperature
- -25~85° C
Symbol
A0~A22
Pin Function
Address Inputs, A0 not used in word
mode
D0~D15
Data Outputs
CE0#, CE1# Chip Enable Input
CE2#
OE#
Output Enable Input
BYTE#
Word/Byte mode Selection
VCC
Power Supply Pin
VCCQ
Output VCC Pin
GND
Ground Pin
NC
No Connection
CHIP ENABLE TRUTH TABLE
CE2#
CE1#
CE0#
L
L
L
L
L
H
L
H
L
L
H
H
H
L
L
H
L
H
H
H
L
H
H
H
Note: for single-chip applications, CE2#,
strapped to GND.
Device
Enabled
Disabled
Disabled
Disabled
Enabled
Enabled
Enabled
Disabled
CE1# can be
PIN CONFIGURATION
56 TSOP (Normal Type)
A22
CE1#
A21
A20
A19
A18
A17
A16
VCC
A15
A14
A13
A12
CE0#
NC
NC
A11
A10
A9
A8
GND
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
MX23L6414
P/N:PM0766
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
NC
NC
OE#
NC
D15
D7
D14
D6
GND
D13
D5
D12
D4
VCCQ
GND
D11
D3
D10
D2
VCC
D9
D1
D8
D0
A0
BYTE#
NC
CE2#
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MX23L6414
64 Mini BGA (Top View, Balls Facing Down)
A1
A2
A3
A4
A5
A6
A7
A8
A1
A6
A8
NC
A13
VCC
A18
A22
B1
B2
B3
B4
B5
B6
B7
B8
A2
GND
A9
CE0#
A14
NC
A19
CE1#
C1
C2
C3
C4
C5
C6
C7
C8
A3
A7
A10
A12
A15
NC
A20
A21
D1
D2
D3
D4
D5
D6
D7
D8
A4
A5
A11
NC
NC
NC
A16
A17
E1
E2
E3
E4
E5
E6
E7
E8
D8
D1
D9
D3
D4
NC
D15
NC
F1
F2
F3
F4
F5
F6
F7
F8
BYTE#
D0
D10
D11
D12
NC
NC
OE#
G1
G2
G3
G4
G5
G6
G7
G8
NC
A0
D2
VCCQ
D5
D6
D14
NC
H1
H2
H3
H4
H5
H6
H7
H8
CE2#
NC
VCC
GND
GND
D7
NC
D13
13.0 mm
10.0 mm
MODE SELECTION
CE#
OE#
Byte#
D0~D7
D8~D15
Power
Disabled
X
X
High Z
High Z
Stand-by
Enabled
H
X
High Z
High Z
Active
Enabled
L
L
D0~D7
High Z
Active
Enabled
L
H
D0~D7
D8~D15
Active
ORDER INFORMATION
Part No.
MX23L6414TI-90
MX23L6414TI-10
MX23L6414TI-12
MX23L6414XI-90
MX23L6414XI-10
MX23L6414XI-12
MX23L6414XI-12G
Speed
90ns
100ns
120ns
90ns
100ns
120ns
120ns
Package
56 pin TSOP
56 pin TSOP
56 pin TSOP
64 ball mini BGA
64 ball mini BGA
64 ball mini BGA
64 ball mini BGA
Grade
Industrial
Industrial
Industrial
Industrial
Industrial
Industrial
Industrial
Remark
Pb-free
Note: Industrial grade temperature: -25 ~ 85° C
Commercial grade temperature: 0 ~ 70° C
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REV. 1.5, MAY. 26, 2005
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MX23L6414
ABSOLUTE MAXIMUM RATINGS
Item
Voltage on any Pin Relative to VSS
Ambient Operating Temperature
Storage Temperature
Symbol
VIN
Topr
Tstg
Ratings
-0.3V to 3.9V
-25° C to 85° C
-65° C to 125° C
DC CHARACTERISTICS (Ta = -25° C ~ 85° C, VCC = 2.7V~3.6V)
Item
Symbol
MIN.
MAX.
Conditions
Output High Voltage
VOH
2.4V
-
IOH = -400uA
Output Low Voltage
VOL
-
0.4V
IOL = 1.6mA
Input High Voltage
VIH
2.2V
VCCQ+0.5V
Input Low Voltage
VIL
-0.5V
0.8V
Input Leakage Current
ILI
-
10uA
0V, VCC
Output Leakage Current
ILO
-10
10uA
0V, VCC
Operating Current
ICC
-
20mA
f=5MHz, CE#=VIL, OE#=VIH
all output open
Standby Current (CMOS)
ISTB
-
15uA
CE#>VCC-0.2V
Input Capacitance
CIN
-
10pF
Ta = 25° C, f = 1MHZ
COUT
-
10pF
Ta = 25° C, f = 1MHZ
Output Capacitance
AC CHARACTERISTICS (Ta = -25° C ~ 85° C, VCC = 2.7V~3.6V)
Item
Symbol
23L6414-90
23L6414-10
23L6414-12
MIN.
MAX.
MIN.
MAX.
MIN.
MAX.
Read Cycle Time
tRC
90ns
-
100ns
-
120ns
-
Address Access Time
tAA
-
90ns
-
100ns
-
120ns
Chip Enable Access Time
tACE
-
90ns
-
100ns
-
120ns
Page Mode Access Time
tPA
-
25ns
-
25ns
-
25ns
Output Enable Time
tOE
-
25ns
-
25ns
-
25ns
Output Hold After Address
tOH
0ns
-
0ns
-
0ns
-
Output High Z Delay
tHZ
-
20ns
-
20ns
-
20ns
Note:Output high-impedance delay (tHZ) is measured
from OE# or CE# going high, and this parameter guaranteed by design over the full voltage and temperature
operating range - not tested.
P/N:PM0766
REV. 1.5, MAY. 26, 2005
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MX23L6414
AC Test Conditions
Input Pulse Levels
Input Rise and Fall Times
Input Timing Level
Output Timing Level
Output Load
0.4V~2.4V
5ns
1.5V
1.5V
See Figure
100pF output load
capacitance
IOH (load)=-400uA
DOUT
IOL (load)=1.6mA
C<100pF
Note:No output loading is present in tester load board.
Active loading is used and under software programming control.
TIMING DIAGRAM
Output loading capacitance includes load board's and all stray capacitance.
RANDOM READ
ADD
ADD
ADD
ADD
tRC
tACE
CE#
tOE
OE#
tOH
tAA
VALID
DATA
VALID
tHZ
VALID
PAGE READ
VALID ADD
A4-A22
A0,A1,A2,A3
2'nd ADD
1'st ADD
tAA
DATA
3'rd ADD
tPA
VALID
VALID
VALID
Note: CE#, OE# are enable.
Page size is 8 words in 16-bit mode, 16 bytes in 8-bit mode.
P/N:PM0766
REV. 1.5, MAY. 26, 2005
4
MX23L6414
REVISION HISTORY
Revision
1.0
1.1
1.2
1.3
1.4
1.5
Description
Page
1. Random access:90/35(max.)-->80/25(max.)
P1,3
2. Add page size -- 8 words per page
P1
3. Package:64 ball mini BGA(8.0mmx10.0mm)-->64ball mini BGA
P1
(10.0x13.0mm)
4. Add Order Information
P2
5. Modify Standby Current:10uA-->15uA
P1,3
6. Change heading as "RELIMINARY ”
P1
1. Modify DC Characteristics--VOH:VCCQ-0.2V-->2.4V, IOH=-100uA--> P3
-400uA, VOL:0.2V-->0.4V, IOL:100uA-->1.6mA, VIH:2.0-->2.2V
2. Modify AC Test Conditions--Input Pulse Levels:0~VCCQ-->0.4V~2.4V, P4
Input/Output Timing Level:VCCQx0.5-->1.5V, Output Load:30pF-->
100pF output load capacitance
Add CE#=VIL, OE#=VIH in DC Characteristics's ICC
P3
1. Modify fast access time:80ns-->90ns
P1~3
1. Modify Operating Current : 40 --> 20mA
P1,3
1. Added Pb-free package
P2
P/N:PM0766
Date
AUG/29/2001
SEP/10/2001
OCT/02/2001
MAY/07/2002
DEC/31/2002
MAY/26/2005
REV. 1.5, MAY. 26, 2005
5
MX23L6414
MACRONIX INTERNATIONAL CO., LTD.
Headquarters:
TEL:+886-3-578-6688
FAX:+886-3-563-2888
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http : //www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.
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