PulseCore I2010AG-08TR Low frequency emi reduction ic Datasheet

P2010A
November 2006
rev 0.2
Low Frequency EMI Reduction IC
Features
electromagnetic interference (EMI) at the clock source
•
FCC approved method of EMI attenuation
which provides system wide reduction of EMI of all clock
•
Provides up to 20dB of EMI suppression
dependent signals. The P2010A allows significant system
•
Generates a low EMI spread spectrum clock of the
cost savings by reducing the number of circuit board layers
input frequency
and shielding that are traditionally required to pass EMI
Optimized for 10MHz to 35MHz input frequency
regulations.
range
The P2010A uses the most efficient and optimized
Internal loop filter minimizes external components
modulation
and board space
implemented in a proprietary all-digital method.
•
•
•
4 selectable spread ranges
•
SSON control pin for spread spectrum enable and
profile
•
Wide operating range (3V to 5V)
•
16mA output drives
•
TTL or CMOS compatible outputs
•
Low power CMOS design
•
Available in 8 pin SOIC and TSSOP Packages
the
FCC
and
is
to “spread” the bandwidth of a synthesized clock and, more
importantly,
Low Cycle-to-cycle jitter
by
The P2010A modulates the output of a single PLL in order
disable options
•
approved
decreases
the
peak
amplitudes
of
its
harmonics. This results in significantly lower system EMI
compared to the typical narrow band signal produced by
oscillators and most frequency generators. Lowering EMI
by increasing a signal’s bandwidth is called “spread
spectrum clock generation”.
Applications
Product Description
The P2010A is a selectable spread spectrum frequency
The P2010A is targeted towards the embedded controller
market and PC peripheral markets including scanners,
facsimile, MFP’s, printers, PDA, IA, and GPS devices.
modulator designed specifically for PC peripheral and
embedded controller markets. The P2010A reduces
Block Diagram
FS0
SR1
SSON
VDD
PLL
Modulation
XIN
XOUT
Crystal
Oscillator
Frequency
Divider
Feedback
Divider
Phase
Detector
Loop
Filter
VCO
Output
Divider
ModOUT
VSS
PulseCore Semiconductor Corporation
1715 S. Bascom Ave Suite 200, Campbell, CA 95008 • Tel: 408-879-9077 • Fax: 408-879-9018
www.pulsecoresemi.com
Notice: The information in this document is subject to change without notice.
P2010A
November 2006
rev 0.2
Pin Configuration
XIN/CLK 11
XOUT 22
88 VDD
P2040C
P2010A
77 SR0
FS0 33
66 ModOUT
VSS 44
55
SSON
Pin Description
Pin#
Pin Name
Type
Description
1
XIN/CLK
I
Connect to crystal or externally generated clock signal.
2
XOUT
I
Connect to crystal. No connect if externally generated clock signal is used.
3
FS0
I
Digital logic input used to select Input Frequency Range (see Table 1).
This pin has an internal pull-up resistor.
4
VSS
P
Ground Connection. Connect to system ground.
5
SSON
I
Digital logic input used to enable Spread Spectrum function (Active Low).
Spectrum function enable when low. This pin has an internal pull-low resistor.
6
ModOUT
O
Spread Spectrum Clock Output.
7
SR0
I
Digital logic input used to select Spreading Range (see Table 1).
This pin has an internal pull-up resistor.
8
VDD
P
Connect to +3.3V or +5.0V
Spread
Table 1 - Spread Range Selection
FS0
SR0
Spreading Range
Input Frequency
Modulation rate
1
0
+/- 1.50%
10MHz to 20MHz
(Fin/10)*20.83KHz
1
1
+/- 2.50%
10MHz to 20MHz
(Fin/10)*20.83KHz
0
0
+/- 1.25%
20MHz to 35MHz
(Fin/10)*20.83KHz
0
1
+/- 2.00%
20MHz to 35MHz
(Fin/10)*20.83KHz
Low Frequency EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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P2010A
November 2006
rev 0.2
Spread Spectrum Selection
Table 1 illustrates the possible spread spectrum options. The optimal setting should minimize system EMI to the fullest
without affecting system performance. The spreading is described as a percentage deviation of the center frequency
(Note: the center frequency is the frequency of the external reference input on XIN/CLK, Pin 1).
Example of a typical printer or scanner application that operates on a clock frequency of 16MHz:
A spreading selection of FS0=1 and SR0=1 provides a percentage deviation of +/-2.50%* (see Table 1) of Center
Frequency. This results in the frequency on ModOUT being swept from 16.40MHz to 15.60MHz at a modulation rate of
33.33KHz (see Table 1). This particular example (see Figure below) given here is a common EMI reduction method for
scanner, printer or embedded applications and has already been adopted by most of the leading manufacturers.
Note: Spreading range selection varies from different system manufacturers and their designs.
P2010A Application Schematic for Flat-Bed Scanner
VDD
16MHz Crystal Input
1 XIN/CLK
VDD 8
2 XOUT
SR0 7
3 FS0
ModOUT 6
4 VSS
SSON 5
P2010A
0.1µF
Connected to CLK input pin of the system
Low Frequency EMI Reduction IC
Notice: The information in this document is subject to change without notice.
3 of 8
P2010A
November 2006
rev 0.2
Absolute Maximum Ratings
Symbol
Parameter
VDD, VIN
Voltage on any pin with respect to Ground
TSTG
Storage temperature
Unit
-0.5 to +7
V
-65 to +125
°C
-40 to+85
°C
Max. Soldering Temperature (10 sec)
260
°C
Junction Temperature
150
°C
2
KV
TA
Operating temperature
Ts
TJ
TDV
Rating
Static Discharge Voltage
(As per JEDEC STD22- A114-B)
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect
device reliability.
DC Electrical Characteristics
Symbol
Parameter
Min
Typ
Max
Unit
VIL
Input Low Voltage
GND
-
0.8
V
VIH
Input High Voltage
2.0
-
VDD + 0.3
V
IIL
Input Low Current (pull-up resistor on inputs SR0, FS0)
-
-
-35
µA
IIH
Input High Current (pull-down resistor on input SSON)
-
-
35
µA
IXOL
XOUT output low current (at 0.4V, VDD = 3.3V)
-
3
-
mA
IXOH
XOUT output high current (at 2.5V, VDD = 3.3V)
-
3
-
mA
VOL
Output Low Voltage (VDD=3.3V, IOL = 20mA)
-
-
0.4
V
VOH
Output High Voltage (VDD=3.3V, IOH = 20mA)
2.5
-
-
V
IDD
Static Supply Current
-
0.6
-
mA
ICC
Dynamic Supply Current (3.3V and 15pF loading)
4
6
8
mA
2.7
3.3
5.5
V
VDD
tON
ZOUT
Operating Voltage
Power Up Time (First locked clock cycle after power up)
0.18
mS
50
Ω
Clock Output Impedance
AC Electrical Characteristics
Symbol
fIN
Parameter
Input Frequency
tJC
Output rise time
(Measured at 0.8V to 2.0V)
Output fall time
(Measured at 2.0V to 0.8V)
Jitter (Cycle to cycle)
tD
Output duty cycle
tLH*
tHL*
Min
Typ
Max
Unit
10
20
35
MHz
0.7
0.9
1.1
nS
0.6
0.8
1.0
nS
-
-
360
pS
45
50
55
%
*tLH and tHL are measured into a capacitive load of 15pF
Low Frequency EMI Reduction IC
Notice: The information in this document is subject to change without notice.
4 of 8
P2010A
November 2006
rev 0.2
Package Information
8-lead (150-mil) SOIC Package
H
E
D
A2
A
C
A1
D
θ
e
L
B
Dimensions
Symbol
Inches
Min
Max
Millimeters
Min
Max
A1
0.004
0.010
0.10
0.25
A
0.053
0.069
1.35
1.75
A2
0.049
0.059
1.25
1.50
B
0.012
0.020
0.31
0.51
C
0.007
0.010
0.18
0.25
D
0.193 BSC
4.90 BSC
E
0.154 BSC
3.91 BSC
e
0.050 BSC
1.27 BSC
H
0.236 BSC
6.00 BSC
L
0.016
0.050
0.41
1.27
θ
0°
8°
0°
8°
Low Frequency EMI Reduction IC
Notice: The information in this document is subject to change without notice.
5 of 8
P2010A
November 2006
rev 0.2
8-lead TSSOP (4.40-MM Body)
H
E
D
A2
A
C
θ
e
A1
L
B
Dimensions
Symbol
Inches
Min
Millimeters
Max
A
Min
Max
0.043
1.10
A1
0.002
0.006
0.05
0.15
A2
0.033
0.037
0.85
0.95
B
0.008
0.012
0.19
0.30
c
0.004
0.008
0.09
0.20
D
0.114
0.122
2.90
3.10
E
0.169
0.177
4.30
4.50
e
0.026 BSC
0.65 BSC
H
0.252 BSC
6.40 BSC
L
0.020
0.028
0.50
0.70
θ
0°
8°
0°
8°
Low Frequency EMI Reduction IC
Notice: The information in this document is subject to change without notice.
6 of 8
P2010A
November 2006
rev 0.2
Ordering Information
Part number
Marking
Package Type
Temperature
P2010AF-08ST
P2010AF
8-Pin SOIC, Tube, Pb Free
Commercial
P2010AF-08SR
P2010AF
8-Pin SOIC, Tape and Reel, Pb Free
Commercial
P2010AG-08ST
P2010AG
8-Pin SOIC, Tube, Green
Commercial
P2010AG-08SR
P2010AG
8-Pin SOIC, Tape and Reel, Green
Commercial
I2010AF-08ST
I2010AF
8-Pin SOIC, Tube, Pb Free
I2010AF-08SR
I2010AF
8-Pin SOIC, Tape and Reel, Pb Free
Industrial
I2010AG-08ST
I2010AG
8-Pin SOIC, Tube, Green
Industrial
I2010AG-08SR
I2010AG
8-Pin SOIC, Tape and Reel, Green
Industrial
P2010AF-08TT
P2010AF
8-Pin TSSOP, Tube, Pb Free
Industrial
Commercial
P2010AF-08TR
P2010AF
8-Pin TSSOP, Tape and Reel, Pb Free
Commercial
P2010AG-08TT
P2010AG
8-Pin TSSOP, Tube, Green
Commercial
P2010AG-08TR
P2010AG
8-Pin TSSOP, Tape and Reel, Green
Commercial
I2010AF-08TT
I2010AF
8-Pin TSSOP, Tube, Pb Free
Industrial
I2010AF-08TR
I2010AF
8-Pin TSSOP, Tape and Reel, Pb Free
Industrial
I2010AG-08TT
I2010AG
8-Pin TSSOP, Tube, Green
Industrial
I2010AG-08TR
I2010AG
8-Pin TSSOP, Tape and Reel, Green
Industrial
Device Ordering Information
P 2 0 1 0 A
F - 0 8 - S T
SR - SOIC, T/R
TT – TSSOP, TUBE
TR - TSSOP, T/R
ST – SOIC, TUBE
PIN COUNT
F = LEAD FREE AND RoHS COMPLIANT PART
G = GREEN PACKAGE, LEAD FREE, and RoHS
Deviation (%) and Spread option Identifier
DEVICE NUMBER
P = Commercial Temperature Range (0°C to 70°C)
I = Industrial Temperature Range (-40°C to 85°C)
Licensed under US patent #5,488,627, #6,646,463 and #5,631,920.
Low Frequency EMI Reduction IC
Notice: The information in this document is subject to change without notice.
7 of 8
P2010A
November 2006
rev 0.2
PulseCore Semiconductor Corporation
1715 S. Bascom Ave Suite 200
Campbell, CA 95008
Tel: 408-879-9077
Fax: 408-879-9018
www.pulsecoresemi.com
Copyright © PulseCore Semiconductor
All Rights Reserved
Part Number: P2010A
Document Version: 0.2
Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003
© Copyright 2006 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or
registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their
respective companies. PulseCore reserves the right to make changes to this document and its products at any time without
notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein
represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct
this data at any time, without notice. If the product described herein is under development, significant changes to these
specifications are possible. The information in this product data sheet is intended to be general descriptive information for
potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or
customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product
described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products
including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual
property rights, except as express agreed to in PulseCore’s Terms and Conditions of Sale (which are available from
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The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights,
trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products
for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result
in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the
manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use.
Low Frequency EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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