P2010A November 2006 rev 0.2 Low Frequency EMI Reduction IC Features electromagnetic interference (EMI) at the clock source • FCC approved method of EMI attenuation which provides system wide reduction of EMI of all clock • Provides up to 20dB of EMI suppression dependent signals. The P2010A allows significant system • Generates a low EMI spread spectrum clock of the cost savings by reducing the number of circuit board layers input frequency and shielding that are traditionally required to pass EMI Optimized for 10MHz to 35MHz input frequency regulations. range The P2010A uses the most efficient and optimized Internal loop filter minimizes external components modulation and board space implemented in a proprietary all-digital method. • • • 4 selectable spread ranges • SSON control pin for spread spectrum enable and profile • Wide operating range (3V to 5V) • 16mA output drives • TTL or CMOS compatible outputs • Low power CMOS design • Available in 8 pin SOIC and TSSOP Packages the FCC and is to “spread” the bandwidth of a synthesized clock and, more importantly, Low Cycle-to-cycle jitter by The P2010A modulates the output of a single PLL in order disable options • approved decreases the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most frequency generators. Lowering EMI by increasing a signal’s bandwidth is called “spread spectrum clock generation”. Applications Product Description The P2010A is a selectable spread spectrum frequency The P2010A is targeted towards the embedded controller market and PC peripheral markets including scanners, facsimile, MFP’s, printers, PDA, IA, and GPS devices. modulator designed specifically for PC peripheral and embedded controller markets. The P2010A reduces Block Diagram FS0 SR1 SSON VDD PLL Modulation XIN XOUT Crystal Oscillator Frequency Divider Feedback Divider Phase Detector Loop Filter VCO Output Divider ModOUT VSS PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200, Campbell, CA 95008 • Tel: 408-879-9077 • Fax: 408-879-9018 www.pulsecoresemi.com Notice: The information in this document is subject to change without notice. P2010A November 2006 rev 0.2 Pin Configuration XIN/CLK 11 XOUT 22 88 VDD P2040C P2010A 77 SR0 FS0 33 66 ModOUT VSS 44 55 SSON Pin Description Pin# Pin Name Type Description 1 XIN/CLK I Connect to crystal or externally generated clock signal. 2 XOUT I Connect to crystal. No connect if externally generated clock signal is used. 3 FS0 I Digital logic input used to select Input Frequency Range (see Table 1). This pin has an internal pull-up resistor. 4 VSS P Ground Connection. Connect to system ground. 5 SSON I Digital logic input used to enable Spread Spectrum function (Active Low). Spectrum function enable when low. This pin has an internal pull-low resistor. 6 ModOUT O Spread Spectrum Clock Output. 7 SR0 I Digital logic input used to select Spreading Range (see Table 1). This pin has an internal pull-up resistor. 8 VDD P Connect to +3.3V or +5.0V Spread Table 1 - Spread Range Selection FS0 SR0 Spreading Range Input Frequency Modulation rate 1 0 +/- 1.50% 10MHz to 20MHz (Fin/10)*20.83KHz 1 1 +/- 2.50% 10MHz to 20MHz (Fin/10)*20.83KHz 0 0 +/- 1.25% 20MHz to 35MHz (Fin/10)*20.83KHz 0 1 +/- 2.00% 20MHz to 35MHz (Fin/10)*20.83KHz Low Frequency EMI Reduction IC Notice: The information in this document is subject to change without notice. 2 of 8 P2010A November 2006 rev 0.2 Spread Spectrum Selection Table 1 illustrates the possible spread spectrum options. The optimal setting should minimize system EMI to the fullest without affecting system performance. The spreading is described as a percentage deviation of the center frequency (Note: the center frequency is the frequency of the external reference input on XIN/CLK, Pin 1). Example of a typical printer or scanner application that operates on a clock frequency of 16MHz: A spreading selection of FS0=1 and SR0=1 provides a percentage deviation of +/-2.50%* (see Table 1) of Center Frequency. This results in the frequency on ModOUT being swept from 16.40MHz to 15.60MHz at a modulation rate of 33.33KHz (see Table 1). This particular example (see Figure below) given here is a common EMI reduction method for scanner, printer or embedded applications and has already been adopted by most of the leading manufacturers. Note: Spreading range selection varies from different system manufacturers and their designs. P2010A Application Schematic for Flat-Bed Scanner VDD 16MHz Crystal Input 1 XIN/CLK VDD 8 2 XOUT SR0 7 3 FS0 ModOUT 6 4 VSS SSON 5 P2010A 0.1µF Connected to CLK input pin of the system Low Frequency EMI Reduction IC Notice: The information in this document is subject to change without notice. 3 of 8 P2010A November 2006 rev 0.2 Absolute Maximum Ratings Symbol Parameter VDD, VIN Voltage on any pin with respect to Ground TSTG Storage temperature Unit -0.5 to +7 V -65 to +125 °C -40 to+85 °C Max. Soldering Temperature (10 sec) 260 °C Junction Temperature 150 °C 2 KV TA Operating temperature Ts TJ TDV Rating Static Discharge Voltage (As per JEDEC STD22- A114-B) Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. DC Electrical Characteristics Symbol Parameter Min Typ Max Unit VIL Input Low Voltage GND - 0.8 V VIH Input High Voltage 2.0 - VDD + 0.3 V IIL Input Low Current (pull-up resistor on inputs SR0, FS0) - - -35 µA IIH Input High Current (pull-down resistor on input SSON) - - 35 µA IXOL XOUT output low current (at 0.4V, VDD = 3.3V) - 3 - mA IXOH XOUT output high current (at 2.5V, VDD = 3.3V) - 3 - mA VOL Output Low Voltage (VDD=3.3V, IOL = 20mA) - - 0.4 V VOH Output High Voltage (VDD=3.3V, IOH = 20mA) 2.5 - - V IDD Static Supply Current - 0.6 - mA ICC Dynamic Supply Current (3.3V and 15pF loading) 4 6 8 mA 2.7 3.3 5.5 V VDD tON ZOUT Operating Voltage Power Up Time (First locked clock cycle after power up) 0.18 mS 50 Ω Clock Output Impedance AC Electrical Characteristics Symbol fIN Parameter Input Frequency tJC Output rise time (Measured at 0.8V to 2.0V) Output fall time (Measured at 2.0V to 0.8V) Jitter (Cycle to cycle) tD Output duty cycle tLH* tHL* Min Typ Max Unit 10 20 35 MHz 0.7 0.9 1.1 nS 0.6 0.8 1.0 nS - - 360 pS 45 50 55 % *tLH and tHL are measured into a capacitive load of 15pF Low Frequency EMI Reduction IC Notice: The information in this document is subject to change without notice. 4 of 8 P2010A November 2006 rev 0.2 Package Information 8-lead (150-mil) SOIC Package H E D A2 A C A1 D θ e L B Dimensions Symbol Inches Min Max Millimeters Min Max A1 0.004 0.010 0.10 0.25 A 0.053 0.069 1.35 1.75 A2 0.049 0.059 1.25 1.50 B 0.012 0.020 0.31 0.51 C 0.007 0.010 0.18 0.25 D 0.193 BSC 4.90 BSC E 0.154 BSC 3.91 BSC e 0.050 BSC 1.27 BSC H 0.236 BSC 6.00 BSC L 0.016 0.050 0.41 1.27 θ 0° 8° 0° 8° Low Frequency EMI Reduction IC Notice: The information in this document is subject to change without notice. 5 of 8 P2010A November 2006 rev 0.2 8-lead TSSOP (4.40-MM Body) H E D A2 A C θ e A1 L B Dimensions Symbol Inches Min Millimeters Max A Min Max 0.043 1.10 A1 0.002 0.006 0.05 0.15 A2 0.033 0.037 0.85 0.95 B 0.008 0.012 0.19 0.30 c 0.004 0.008 0.09 0.20 D 0.114 0.122 2.90 3.10 E 0.169 0.177 4.30 4.50 e 0.026 BSC 0.65 BSC H 0.252 BSC 6.40 BSC L 0.020 0.028 0.50 0.70 θ 0° 8° 0° 8° Low Frequency EMI Reduction IC Notice: The information in this document is subject to change without notice. 6 of 8 P2010A November 2006 rev 0.2 Ordering Information Part number Marking Package Type Temperature P2010AF-08ST P2010AF 8-Pin SOIC, Tube, Pb Free Commercial P2010AF-08SR P2010AF 8-Pin SOIC, Tape and Reel, Pb Free Commercial P2010AG-08ST P2010AG 8-Pin SOIC, Tube, Green Commercial P2010AG-08SR P2010AG 8-Pin SOIC, Tape and Reel, Green Commercial I2010AF-08ST I2010AF 8-Pin SOIC, Tube, Pb Free I2010AF-08SR I2010AF 8-Pin SOIC, Tape and Reel, Pb Free Industrial I2010AG-08ST I2010AG 8-Pin SOIC, Tube, Green Industrial I2010AG-08SR I2010AG 8-Pin SOIC, Tape and Reel, Green Industrial P2010AF-08TT P2010AF 8-Pin TSSOP, Tube, Pb Free Industrial Commercial P2010AF-08TR P2010AF 8-Pin TSSOP, Tape and Reel, Pb Free Commercial P2010AG-08TT P2010AG 8-Pin TSSOP, Tube, Green Commercial P2010AG-08TR P2010AG 8-Pin TSSOP, Tape and Reel, Green Commercial I2010AF-08TT I2010AF 8-Pin TSSOP, Tube, Pb Free Industrial I2010AF-08TR I2010AF 8-Pin TSSOP, Tape and Reel, Pb Free Industrial I2010AG-08TT I2010AG 8-Pin TSSOP, Tube, Green Industrial I2010AG-08TR I2010AG 8-Pin TSSOP, Tape and Reel, Green Industrial Device Ordering Information P 2 0 1 0 A F - 0 8 - S T SR - SOIC, T/R TT – TSSOP, TUBE TR - TSSOP, T/R ST – SOIC, TUBE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE, LEAD FREE, and RoHS Deviation (%) and Spread option Identifier DEVICE NUMBER P = Commercial Temperature Range (0°C to 70°C) I = Industrial Temperature Range (-40°C to 85°C) Licensed under US patent #5,488,627, #6,646,463 and #5,631,920. Low Frequency EMI Reduction IC Notice: The information in this document is subject to change without notice. 7 of 8 P2010A November 2006 rev 0.2 PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com Copyright © PulseCore Semiconductor All Rights Reserved Part Number: P2010A Document Version: 0.2 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003 © Copyright 2006 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in PulseCore’s Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusively according to PulseCore’s Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use. Low Frequency EMI Reduction IC Notice: The information in this document is subject to change without notice. 8 of 8