Surface Mount Zero Bias Schottky Detector Diodes Technical Data HSMS-285x Series Features • Surface Mount SOT-23/ SOT-143 Packages SOT-23/SOT-143 Package Lead Code Identification (top view) • Miniature SOT-323 and SOT-363 Packages SINGLE 3 SERIES 3 1 1 • High Detection Sensitivity: up to 50 mV/µW at 915 MHz • Low Flicker Noise: -162 dBV/Hz at 100 Hz 2 #0 UNCONNECTED PAIR 3 4 • Low FIT (Failure in Time) Rate* • Tape and Reel Options Available 1 • Matched Diodes for Consistent Performance • Better Thermal Conductivity for Higher Power Dissipation * For more information see the Surface Mount Schottky Reliability Data Sheet. Pin Connections and Package Marking 3 PLx 2 6 5 4 Notes: 1. Package marking provides orientation and identification. 2. See “Electrical Specifications” for appropriate package marking. #5 2 SOT-323 Package Lead Code Identification (top view) • Lead-free Option Available 1 2 #2 SINGLE 3 SERIES 3 1 1 B 2 C 2 SOT-363 Package Lead Code Identification (top view) BRIDGE QUAD UNCONNECTED TRIO 6 5 1 2 L 4 6 5 3 1 2 4 P 3 Description Agilent’s HSMS-285x family of zero bias Schottky detector diodes has been designed and optimized for use in small signal (Pin < -20 dBm) applications at frequencies below 1.5 GHz. They are ideal for RF/ID and RF Tag applications where primary (DC bias) power is not available. Important Note: For detector applications with input power levels greater than –20 dBm, use the HSMS-282x series at frequencies below 4.0 GHz, and the HSMS-286x series at frequencies above 4.0 GHz. The HSMS-285x series IS NOT RECOMMENDED for these higher power level applications. Available in various package configurations, these detector diodes provide low cost solutions to a wide variety of design problems. Agilent’s manufacturing techniques assure that when two diodes are mounted into a single package, they are taken from adjacent sites on the wafer, assuring the highest possible degree of match. 2 SOT-23/SOT-143 DC Electrical Specifications, TC = +25°C, Single Diode Part Number HSMS- Package Marking Code[1] Lead Code Configuration 2850 2852 2855 P0 P2 P5 0 2 5 Single Series Pair [2,3] Unconnected Pair [2,3] Test Conditions Maximum Forward Voltage VF (mV) 150 Typical Capacitance CT (pF) 250 0.30 IF = 0.1 mA IF = 1.0 mA VR = –0.5 V to –1.0V f = 1 MHz Notes: 1. Package marking code is in white. 2. ∆VF for diodes in pairs is 15.0 mV maximum at 1.0 mA. 3. ∆CT for diodes in pairs is 0.05 pF maximum at –0.5 V. SOT-323/SOT-363 DC Electrical Specifications, TC = +25°C, Single Diode Part Number HSMS- Package Marking Code[1] Lead Code 285B 285C 285L 285P P0 P2 PL PP B C L P Configuration Single [2] Series Pair [2,3] Unconnected Trio Bridge Quad Test Conditions Maximum Forward Voltage VF (mV) 150 250 IF = 0.1 mA IF = 1.0 mA Typical Capacitance CT (pF) 0.30 VR = 0.5 V to –1.0V f = 1 MHz Notes: 1. Package marking code is laser marked. 2. ∆VF for diodes in pairs is 15.0 mV maximum at 1.0 mA. 3. ∆CT for diodes in pairs is 0.05 pF maximum at –0.5 V. RF Electrical Specifications, TC = +25°C, Single Diode Part Number HSMS- Typical Tangential Sensitivity TSS (dBm) @ f = 915 MHz Typical Voltage Sensitivity Typical Video γ (mV/ µW) @ f = 915 MHz Resistance RV (KΩ) 2850 2852 2855 285B 285C 285L 285P –57 40 8.0 Test Conditions Video Bandwidth = 2 MHz Zero Bias Power in = –40 dBm RL = 100 KΩ, Zero Bias Zero Bias 3 Absolute Maximum Ratings, TC = +25°C, Single Diode Symbol Parameter Unit Absolute Maximum[1] SOT-23/143 SOT-323/363 PIV Peak Inverse Voltage V 2.0 2.0 TJ Junction Temperature °C 150 150 TSTG Storage Temperature °C -65 to 150 -65 to 150 TOP Operating Temperature °C -65 to 150 -65 to 150 °C/W 500 150 θ jc Thermal Resistance[2] ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge. Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. TC = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board. Equivalent Linear Circuit Model HSMS-285x chip Rj RS Cj RS = series resistance (see Table of SPICE parameters) C j = junction capacitance (see Table of SPICE parameters) Rj = 8.33 X 10-5 nT Ib + Is where Ib = externally applied bias current in amps Is = saturation current (see table of SPICE parameters) T = temperature, °K n = ideality factor (see table of SPICE parameters) Note: To effectively model the packaged HSMS-285x product, please refer to Application Note AN1124. SPICE Parameters Parameter Units HSMS-285x BV V 3.8 CJ0 pF 0.18 EG eV 0.69 I BV A 3 E -4 IS A 3 E-6 N 1.06 RS Ω 25 PB (VJ) V 0.35 PT (XTI) 2 M 0.5 4 Typical Parameters, Single Diode 10000 RL = 100 KΩ 1000 1 0.1 915 MHz VOLTAGE OUT (mV) 10 100 10 1 10 915 MHz 1 DIODES TESTED IN FIXED-TUNED FR4 MICROSTRIP CIRCUITS. 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 VF – FORWARD VOLTAGE (V) Figure 1. Typical Forward Current vs. Forward Voltage. 3.1 2.9 OUTPUT VOLTAGE (mV) 30 RL = 100 KΩ VOLTAGE OUT (mV) IF – FORWARD CURRENT (mA) 100 2.7 FREQUENCY = 2.45 GHz PIN = -40 dBm RL = 100 KΩ 2.5 2.3 2.1 1.9 1.7 1.5 1.3 MEASUREMENTS MADE USING A 1.1 FR4 MICROSTRIP CIRCUIT. 0.9 0 10 20 30 40 50 60 70 80 90 100 TEMPERATURE (°C) Figure 4. Output Voltage vs. Temperature. 0.1 -50 -40 -30 -20 -10 0 POWER IN (dBm) Figure 2. +25°C Output Voltage vs. Input Power at Zero Bias. 0.3 -50 DIODES TESTED IN FIXED-TUNED FR4 MICROSTRIP CIRCUITS. -40 -30 POWER IN (dBm) Figure 3. +25°C Expanded Output Voltage vs. Input Power. See Figure 2. 5 Applications Information Introduction Agilent’s HSMS-285x family of Schottky detector diodes has been developed specifically for low cost, high volume designs in small signal (Pin < -20 dBm) applications at frequencies below 1.5 GHz. At higher frequencies, the DC biased HSMS-286x family should be considered. In large signal power or gain control applications (Pin > -20 dBm), the HSMS-282x and HSMS-286x products should be used. The HSMS-285x zero bias diode is not designed for large signal designs. Schottky Barrier Diode Characteristics Stripped of its package, a Schottky barrier diode chip consists of a metal-semiconductor barrier formed by deposition of a metal layer on a semiconductor. The most common of several different types, the passivated diode, is shown in Figure 5, along with its equivalent circuit. ;; METAL PASSIVATION N-TYPE OR P-TYPE EPI RS PASSIVATION LAYER SCHOTTKY JUNCTION Cj Rj tance of the diode, controlled by the thickness of the epitaxial layer and the diameter of the Schottky contact. R j is the junction resistance of the diode, a function of the total current flowing through it. 8.33 X 10-5 n T R j = –––––––––––– = R V – R s IS + I b 0.026 = ––––– at 25°C IS + I b where n = ideality factor (see table of SPICE parameters) T = temperature in °K IS = saturation current (see table of SPICE parameters) Ib = externally applied bias current in amps IS is a function of diode barrier height, and can range from picoamps for high barrier diodes to as much as 5 µA for very low barrier diodes. The Height of the Schottky Barrier The current-voltage characteristic of a Schottky barrier diode at room temperature is described by the following equation: Through the choice of p-type or n-type silicon, and the selection of metal, one can tailor the characteristics of a Schottky diode. Barrier height will be altered, and at the same time CJ and RS will be changed. In general, very low barrier height diodes (with high values of IS, suitable for zero bias applications) are realized on p-type silicon. Such diodes suffer from higher values of RS than do the n-type. Thus, p-type diodes are generally reserved for small signal detector applications (where very high values of RV swamp out high RS) and n-type diodes are used for mixer applications (where high L.O. drive levels keep RV low). Measuring Diode Parameters The measurement of the five elements which make up the low frequency equivalent circuit for a packaged Schottky diode (see Figure 6) is a complex task. Various techniques are used for each element. The task begins with the elements of the diode chip itself. CP V - IR I = IS (exp ––––––S - 1) 0.026 ( ) LP N-TYPE OR P-TYPE SILICON SUBSTRATE CROSS-SECTION OF SCHOTTKY BARRIER DIODE CHIP current, IS, and is related to the barrier height of the diode. EQUIVALENT CIRCUIT Figure 5. Schottky Diode Chip. RS is the parasitic series resistance of the diode, the sum of the bondwire and leadframe resistance, the resistance of the bulk layer of silicon, etc. RF energy coupled into RS is lost as heat — it does not contribute to the rectified output of the diode. CJ is parasitic junction capaci- On a semi-log plot (as shown in the Agilent catalog) the current graph will be a straight line with inverse slope 2.3 X 0.026 = 0.060 volts per cycle (until the effect of RS is seen in a curve that droops at high current). All Schottky diode curves have the same slope, but not necessarily the same value of current for a given voltage. This is determined by the saturation RV RS Cj FOR THE HSMS-285x SERIES CP = 0.08 pF LP = 2 nH Cj = 0.18 pF RS = 25 Ω RV = 9 KΩ Figure 6. Equivalent Circuit of a Schottky Diode. 6 RS is perhaps the easiest to measure accurately. The V-I curve is measured for the diode under forward bias, and the slope of the curve is taken at some relatively high value of current (such as 5 mA). This slope is converted into a resistance Rd. 0.026 RS = Rd – –––––– If RV and CJ are very difficult to measure. Consider the impedance of CJ = 0.16 pF when measured at 1 MHz — it is approximately 1 MΩ. For a well designed zero bias Schottky, RV is in the range of 5 to 25 KΩ, and it shorts out the junction capacitance. Moving up to a higher frequency enables the measurement of the capacitance, but it then shorts out the video resistance. The best measurement technique is to mount the diode in series in a 50 Ω microstrip test circuit and measure its insertion loss at low power levels (around -20 dBm) using an HP8753C network analyzer. The resulting display will appear as shown in Figure 7. -10 50 Ω INSERTION LOSS (dB) -15 sets the loss, which plots out as a straight line when frequency is plotted on a log scale. Again, calculation is straightforward. LP and CP are best measured on the HP8753C, with the diode terminating a 50 Ω line on the input port. The resulting tabulation of S11 can be put into a microwave linear analysis program having the five element equivalent circuit with RV, CJ and RS fixed. The optimizer can then adjust the values of LP and CP until the calculated S11 matches the measured values. Note that extreme care must be taken to de-embed the parasitics of the 50 Ω test fixture. Detector Circuits When DC bias is available, Schottky diode detector circuits can be used to create low cost RF and microwave receivers with a sensitivity of -55 dBm to -57 dBm.[1] These circuits can take a variety of forms, but in the most simple case they appear as shown in Figure 8. This is the basic detector circuit used with the HSMS-285x family of diodes. 0.16 pF 50 Ω -20 -25 In the design of such detector circuits, the starting point is the equivalent circuit of the diode, as shown in Figure 6. 50 Ω 9 KΩ -30 50 Ω -35 -40 3 10 100 1000 3000 FREQUENCY (MHz) Figure 7. Measuring CJ and RV. At frequencies below 10 MHz, the video resistance dominates the loss and can easily be calculated from it. At frequencies above 300 MHz, the junction capacitance Of interest in the design of the video portion of the circuit is the diode’s video impedance — the other four elements of the equivalent circuit disappear at all reasonable video frequencies. In general, the lower the diode’s video impedance, the better the design. [1] [2] RF IN Z-MATCH NETWORK RF IN Z-MATCH NETWORK VIDEO OUT VIDEO OUT Figure 8. Basic Detector Circuits. The situation is somewhat more complicated in the design of the RF impedance matching network, which includes the package inductance and capacitance (which can be tuned out), the series resistance, the junction capacitance and the video resistance. Of these five elements of the diode’s equivalent circuit, the four parasitics are constants and the video resistance is a function of the current flowing through the diode. 26,000 RV ≈ –––––– IS + Ib where IS = diode saturation current in µA Ib = bias current in µA Saturation current is a function of the diode’s design,[2] and it is a constant at a given temperature. For the HSMS-285x series, it is typically 3 to 5 µA at 25°C. Saturation current sets the detection sensitivity, video resistance and input RF impedance of the zero bias Schottky detector diode. Agilent Application Note 923, Schottky Barrier Diode Video Detectors. Agilent Application Note 969, An Optimum Zero Bias Schottky Detector Diode. 7 The most difficult part of the design of a detector circuit is the input impedance matching network. For very broadband detectors, a shunt 60 Ω resistor will give good input match, but at the expense of detection sensitivity. When maximum sensitivity is required over a narrow band of frequencies, a reactive matching network is optimum. Such networks can be realized in either lumped or distributed elements, depending upon frequency, size constraints and cost limitations, but certain general design principals exist for all types.[3] Design work begins with the RF impedance of the HSMS-285x series, which is given in Figure 9. 2 0.2 0.6 0 65nH RF INPUT VIDEO OUT WIDTH = 0.050" LENGTH = 0.065" 100 pF WIDTH = 0.015" LENGTH = 0.600" TRANSMISSION LINE DIMENSIONS ARE FOR MICROSTRIP ON 0.032" THICK FR-4. Figure 10. 915 MHz Matching Network for the HSMS-285x Series at Zero Bias. A 65 nH inductor rotates the impedance of the diode to a point on the Smith Chart where a shunt inductor can pull it up to the center. The short length of 0.065" wide microstrip line is used to mount the lead of the diode’s SOT-323 package. A shorted shunt stub of length <λ/4 provides the necessary shunt inductance and simultaneously provides the return circuit for the current generated in the diode. The impedance of this circuit is given in Figure 11. 5 RETURN LOSS (dB) Since no external bias is used with the HSMS-285x series, a single transfer curve at any given frequency is obtained, as shown in Figure 2. -5 -10 -15 -20 0.9 0.93 Figure 12. Input Return Loss. As can be seen, the band over which a good match is achieved is more than adequate for 915 MHz RFID applications. Voltage Doublers To this point, we have restricted our discussion to single diode detectors. A glance at Figure 8, however, will lead to the suggestion that the two types of single diode detectors be combined into a two diode voltage doubler[4] (known also as a full wave rectifier). Such a detector is shown in Figure 13. RF IN 1 0.915 FREQUENCY (GHz) Z-MATCH NETWORK VIDEO OUT 1 GHz 2 3 Figure 13. Voltage Doubler Circuit. 4 6 5 Figure 9. RF Impedance of the HSMS-285x Series at -40 dBm. 915 MHz Detector Circuit Figure 10 illustrates a simple impedance matching network for a 915 MHz detector. [3] FREQUENCY (GHz): 0.9-0.93 Figure 11. Input Impedance. The input match, expressed in terms of return loss, is given in Figure 12. Agilent Application Note 963, Impedance Matching Techniques for Mixers and Detectors. Agilent Application Note 956-4, Schottky Diode Voltage Doubler. [5] Agilent Application Note 965-3, Flicker Noise in Schottky Diodes. [4] Such a circuit offers several advantages. First the voltage outputs of two diodes are added in series, increasing the overall value of voltage sensitivity for the network (compared to a single diode detector). Second, the RF impedances of the two diodes are added in parallel, making the job of reactive matching a bit easier. 8 Such a circuit can easily be realized using the two series diodes in the HSMS-285C. Flicker Noise Reference to Figure 5 will show that there is a junction of metal, silicon, and passivation around the rim of the Schottky contact. It is in this three-way junction that flicker noise[5] is generated. This noise can severely reduce the sensitivity of a crystal video receiver utilizing a Schottky detector circuit if the video frequency is below the noise corner. Flicker noise can be substantially reduced by the elimination of passivation, but such diodes cannot be mounted in non-hermetic packages. p-type silicon Schottky diodes have the least flicker noise at a given value of external bias (compared to n-type silicon or GaAs). At zero bias, such diodes can have extremely low values of flicker noise. For the HSMS-285x series, the noise temperature ratio is given in Figure 14. NOISE TEMPERATURE RATIO (dB) 15 10 5 0 -5 10 100 1000 10000 100000 FREQUENCY (Hz) Figure 14. Typical Noise Temperature Ratio. Noise temperature ratio is the quotient of the diode’s noise power (expressed in dBV/Hz) divided by the noise power of an ideal resistor of resistance R = RV. For an ideal resistor R, at 300°K, the noise voltage can be computed from v = 1.287 X 10-10 √R volts/Hz which can be expressed as 20 log10 v dBV/Hz Thus, for a diode with RV = 9 KΩ, the noise voltage is 12.2 nV/Hz or -158 dBV/Hz. On the graph of Figure 14, -158 dBV/Hz would replace the zero on the vertical scale to convert the chart to one of absolute noise voltage vs. frequency. Diode Burnout Any Schottky junction, be it an RF diode or the gate of a MESFET, is relatively delicate and can be burned out with excessive RF power. Many crystal video receivers used in RFID (tag) applications find themselves in poorly controlled environments where high power sources may be present. Examples are the areas around airport and FAA radars, nearby ham radio operators, the vicinity of a broadcast band transmitter, etc. In such environments, the Schottky diodes of the receiver can be protected by a device known as a limiter diode.[6] Formerly available only in radar warning receivers and other high cost electronic warfare applications, these diodes have been adapted to commercial and consumer circuits. Agilent offers a complete line of surface mountable PIN limiter diodes. Most notably, our HSMP-4820 (SOT-23) can act as a very fast (nanosecond) powersensitive switch when placed [6] between the antenna and the Schottky diode, shorting out the RF circuit temporarily and reflecting the excessive RF energy back out the antenna. Assembly Instructions SOT-323 PCB Footprint A recommended PCB pad layout for the miniature SOT-323 (SC-70) package is shown in Figure 15 (dimensions are in inches). This layout provides ample allowance for package placement by automated assembly equipment without adding parasitics that could impair the performance. Figure 16 shows the pad layout for the six-lead SOT-363. 0.026 0.07 0.035 0.016 Figure 15. PCB Pad Layout (dimensions in inches). 0.026 0.075 0.035 0.016 Figure 16. PCB Pad Layout (dimensions in inches). Agilent Application Note 1050, Low Cost, Surface Mount Power Limiters. 9 SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g., IR or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. Components with a low mass, such as the SOT packages, will reach solder reflow temperatures faster than those with a greater mass. Agilent’s diodes have been qualified to the time-temperature profile shown in Figure 17. This profile is representative of an IR reflow type of surface mount assembly process. After ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste) passes through one or more preheat zones. The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporating solvents from the solder paste. The reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder. The rates of change of temperature for the ramp-up and cooldown zones are chosen to be low enough to not cause deformation of the board or damage to components due to thermal shock. The maximum temperature in the reflow zone (TMAX) should not exceed 235°C. 250 TMAX TEMPERATURE (°C) 200 150 Reflow Zone 100 Preheat Zone Cool Down Zone 50 0 0 60 120 180 TIME (seconds) Figure 17. Surface Mount Assembly Profile. 240 300 These parameters are typical for a surface mount assembly process for Agilent diodes. As a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform reflow of solder. 10 Part Number Ordering Information Part Number HSMS-285x-TR2* No. of Devices 10000 Container 13" Reel HSMS-285x-TR1* HSMS-285x-BLK * 3000 100 7" Reel antistatic bag where x = 0, 2, 5, B, C, L and P for HSMS-285x. For lead-free option, the part number will have the character "G" at the end, eg. HSMS-285x-TR2G for a 10,000 lead-free reel. Package Dimensions Outline 23 (SOT-23) 1.02 (0.040) 0.89 (0.035) Outline SOT-323 (SC-70 3 Lead) 0.54 (0.021) 0.37 (0.015) PACKAGE MARKING CODE (XX) DATE CODE (X) PACKAGE MARKING CODE (XX) 1.30 (0.051) REF. 2.20 (0.087) 2.00 (0.079) XXX DATE CODE (X) 3 1.40 (0.055) 1.20 (0.047) XXX 2.65 (0.104) 2.10 (0.083) 1.35 (0.053) 1.15 (0.045) 2 1 0.650 BSC (0.025) 0.60 (0.024) 0.45 (0.018) 2.04 (0.080) 1.78 (0.070) 0.425 (0.017) TYP. 2.20 (0.087) 1.80 (0.071) TOP VIEW 0.10 (0.004) 0.00 (0.00) 0.152 (0.006) 0.066 (0.003) 3.06 (0.120) 2.80 (0.110) 1.02 (0.041) 0.85 (0.033) 0.30 REF. 1.00 (0.039) 0.80 (0.031) 0.25 (0.010) 0.15 (0.006) 10° 0.30 (0.012) 0.10 (0.004) 0.20 (0.008) 0.10 (0.004) 0.69 (0.027) 0.45 (0.018) 0.10 (0.004) 0.013 (0.0005) DIMENSIONS ARE IN MILLIMETERS (INCHES) SIDE VIEW END VIEW DIMENSIONS ARE IN MILLIMETERS (INCHES) Outline 143 (SOT-143) Outline SOT-363 (SC-70 6 Lead) 0.92 (0.036) 0.78 (0.031) DATE CODE (X) 2 PACKAGE MARKING CODE (XX) 1.30 (0.051) REF. 2.20 (0.087) 2.00 (0.079) XXX DATE CODE (X) 1 PACKAGE MARKING CODE (XX) 1.40 (0.055) 1.20 (0.047) XXX 4 2.65 (0.104) 2.10 (0.083) 1.35 (0.053) 1.15 (0.045) 3 0.60 (0.024) 0.45 (0.018) 2.04 (0.080) 1.78 (0.070) 0.650 BSC (0.025) 0.54 (0.021) 0.37 (0.015) 3.06 (0.120) 2.80 (0.110) 0.425 (0.017) TYP. 2.20 (0.087) 1.80 (0.071) 0.15 (0.006) 0.09 (0.003) 0.10 (0.004) 0.00 (0.00) 0.30 REF. 1.04 (0.041) 0.85 (0.033) 0.10 (0.004) 0.013 (0.0005) 0.69 (0.027) 0.45 (0.018) 1.00 (0.039) 0.80 (0.031) 0.25 (0.010) 0.15 (0.006) 10° 0.30 (0.012) 0.10 (0.004) DIMENSIONS ARE IN MILLIMETERS (INCHES) DIMENSIONS ARE IN MILLIMETERS (INCHES) 0.20 (0.008) 0.10 (0.004) 11 Device Orientation For Outlines SOT-23, -323 REEL TOP VIEW END VIEW 4 mm CARRIER TAPE 8 mm USER FEED DIRECTION ABC For Outline SOT-143 TOP VIEW ABC ABC For Outline SOT-363 END VIEW TOP VIEW 4 mm ABC ABC Note: "AB" represents package marking code. "C" represents date code. COVER TAPE 8 mm ABC END VIEW 4 mm ABC ABC Note: "AB" represents package marking code. "C" represents date code. 8 mm ABC ABC ABC ABC Note: "AB" represents package marking code. "C" represents date code. 12 Tape Dimensions and Product Orientation For Outline SOT-23 P P2 D E P0 F W D1 t1 Ko 9° MAX 13.5° MAX 8° MAX B0 A0 DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A0 B0 K0 P D1 3.15 ± 0.10 2.77 ± 0.10 1.22 ± 0.10 4.00 ± 0.10 1.00 + 0.05 0.124 ± 0.004 0.109 ± 0.004 0.048 ± 0.004 0.157 ± 0.004 0.039 ± 0.002 PERFORATION DIAMETER PITCH POSITION D P0 E 1.50 + 0.10 4.00 ± 0.10 1.75 ± 0.10 0.059 + 0.004 0.157 ± 0.004 0.069 ± 0.004 CARRIER TAPE WIDTH THICKNESS W t1 8.00 +0.30 –0.10 0.229 ± 0.013 0.315 +0.012 –0.004 0.009 ± 0.0005 DISTANCE BETWEEN CENTERLINE CAVITY TO PERFORATION (WIDTH DIRECTION) F 3.50 ± 0.05 0.138 ± 0.002 CAVITY TO PERFORATION (LENGTH DIRECTION) P2 2.00 ± 0.05 0.079 ± 0.002 For Outline SOT-143 P D P2 P0 E F W D1 t1 K0 9° MAX 9° MAX A0 B0 DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A0 B0 K0 P D1 3.19 ± 0.10 2.80 ± 0.10 1.31 ± 0.10 4.00 ± 0.10 1.00 + 0.25 0.126 ± 0.004 0.110 ± 0.004 0.052 ± 0.004 0.157 ± 0.004 0.039 + 0.010 PERFORATION DIAMETER PITCH POSITION D P0 E 1.50 + 0.10 4.00 ± 0.10 1.75 ± 0.10 0.059 + 0.004 0.157 ± 0.004 0.069 ± 0.004 CARRIER TAPE WIDTH THICKNESS W t1 8.00 +0.30 –0.10 0.254 ± 0.013 0.315+0.012 –0.004 0.0100 ± 0.0005 DISTANCE CAVITY TO PERFORATION (WIDTH DIRECTION) F 3.50 ± 0.05 0.138 ± 0.002 CAVITY TO PERFORATION (LENGTH DIRECTION) P2 2.00 ± 0.05 0.079 ± 0.002 Tape Dimensions and Product Orientation For Outlines SOT-323, -363 P P2 D P0 E F W C D1 t1 (CARRIER TAPE THICKNESS) Tt (COVER TAPE THICKNESS) K0 An A0 DESCRIPTION B0 SYMBOL SIZE (mm) SIZE (INCHES) CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A0 B0 K0 P D1 2.40 ± 0.10 2.40 ± 0.10 1.20 ± 0.10 4.00 ± 0.10 1.00 + 0.25 0.094 ± 0.004 0.094 ± 0.004 0.047 ± 0.004 0.157 ± 0.004 0.039 + 0.010 PERFORATION DIAMETER PITCH POSITION D P0 E 1.55 ± 0.05 4.00 ± 0.10 1.75 ± 0.10 0.061 ± 0.002 0.157 ± 0.004 0.069 ± 0.004 CARRIER TAPE WIDTH THICKNESS W t1 8.00 ± 0.30 0.254 ± 0.02 0.315 ± 0.012 0.0100 ± 0.0008 COVER TAPE WIDTH TAPE THICKNESS C Tt 5.4 ± 0.10 0.062 ± 0.001 0.205 ± 0.004 0.0025 ± 0.00004 DISTANCE CAVITY TO PERFORATION (WIDTH DIRECTION) F 3.50 ± 0.05 0.138 ± 0.002 CAVITY TO PERFORATION (LENGTH DIRECTION) P2 2.00 ± 0.05 0.079 ± 0.002 FOR SOT-323 (SC70-3 LEAD) An 8°C MAX ANGLE FOR SOT-363 (SC70-6 LEAD) An 10°C MAX www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (65) 6756 2394 India, Australia, New Zealand: (65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (65) 6755 2044 Taiwan: (65) 6755 1843 Data subject to change. Copyright © 2004 Agilent Technologies, Inc. Obsoletes 5968-7457E March 24, 2004 5989-0479EN