Top View Features Directly mounts to target PCB (needs tooling holes) with hardware Minimum real estate required Compression plate distributes forces evenly A 49.225mm [1.938"] Clamshell lid Materials: A 1 42.60mm [1.677"] 10 2 Side View (Section AA) Socket Base: Black anodized 7075 Aluminum. Height = 6 mm. 3 Compression Plate: Black anodized 7075 Aluminum. Thickness = 12 mm. 4 Compression Screw: Clear anodized 7075 Aluminum. Height = 27 mm, Fluted Knob 4 5 Assembled 38mm + IC thickness Clam Shell Lid: Black anodized 7075 Aluminum. Height = 20 mm. 1 6 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. Elastomer Guide: Non-clad FR4. Thickness = 0.75mm. 7 Socket Base Screw: Socket Head Cap Screw, alloy steel with black oxide finish, 0-80 Thread, 5/8" long. 8 Backing Plate: Black anodized 7075 Aluminum 9 Insulation Plate: FR4/G10 10 Latch: Black anodized 7075 Aluminum. 3 2 6 5 9 Customer's PCB 8 7 CG-BGA-4002 Drawing © 2007 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: A Drawing: Umer Qureshi Date: 10/30/07 File: CG-BGA-4002 Dwg Modified: All Tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 Recommended PCB Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes. 2.7375mm* 25.00mm(x2) 1.00mm typ. Orientation Mark Ø 0.850mm Ø 0.51mmPAD 22.105mm 32.225mm±0.125mm 0.000mm (x2) -0.025mm 7.58mm±0.13mm 6.33mm±0.13mm 5.08mm Socket Size 2.72mm Backing Plate Size Ø 1.61mm±0.05mm(x4) Mounting Hole 1.25mm±0.13mm Target PCB Recommendations Total thickness: 1.5mm min. Plating: Gold or Solder finish 29.725mm Sqr. 2.50mm±0.13mm Datum CG-BGA-4002 Drawing © 2007 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com 32.600mm±0.125mm 34.725mm±0.125mm Sqr. DXF DATA WILL BE PROVIDED Status: Released Scale: 3:1 Rev: A Drawing: Umer Qureshi Date: 10/30/07 File: CG-BGA-4002 Dwg Modified: Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. PAGE 2 of 4 Compatible BGA Spec DETAIL Y D X e E 3 Øb Ø0.25 Z X Y Ø0.10 0.20 TOP VIEW 5 DETAIL A A1 4 DIM 1. Dimensions are in millimeters. 2. Interpret dimensions and toleraces per ASME Y14.5M-1994. 0.20 Z Z BOTTOM VIEW SIDE VIEW 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plame Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. 0.2 Z MIN MAX 2.5 A A1 0.6 0.4 b 0.70 D 27.00 BSC E 27.00 BSC e 1.0 BSC 26x26 Array CG-BGA-4002 Drawing © 2007 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: A Drawing: Umer Qureshi Date: 10/30/07 File: CG-BGA-4002 Dwg Modified: PAGE 3 of 4 2.50mm 1.27mm (x4) 2.50mm 34.725mm 29.725mm±0.025mm (x4) 5.00mm 10.03mm Top View 10.00mm Sqr. 16.00mm (x4) 34.725mm 1.59mm Insulation Plate Side View 6.35mm Backing Plate Description: Backing Plate with Insulation Plate CG-BGA-4002 Drawing © 2007 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: A Drawing: Umer Qureshi Date: 10/30/07 File: CG-BGA-4002 Dwg Modified: All dimensions are in mm. All tolerences are +/- 0.125mm. (Unless stated otherwise) PAGE 4 of 4