IDT IDT79RV5000200BS272 Multi-issue 64-bit microprocessor Datasheet

79RC5000
MULTI-ISSUE
64-BIT MICROPROCESSOR
◆
Large, efficient on-chip caches
– 32KB Instruction Cache, 32KB Data Cache
– 2-set associative in each cach
– Virtually indexed and physically tagged to minimize cache
flushes
– Write-back and write-through selectable on a per page basis
– Critical word first cache miss processing
– Supports back-to-back loads and stores in any combination at
full pipeline rate
◆
High-performance memory system
– Large primary caches integrated on-chip
– Secondary cache control interface on-chip
– High-frequency 64-bit bus interface runs up to 125MHz
– Aggregate bandwidth of on-chip caches, system interface of
5.6GB/s
– High-performance write protocols for graphics and data
communications
◆ Compatible with a variety of operating systems
– Windows™ CE
– Numerous MIPS-compatible real-time operating systems
◆ Uses input system clock, with processor pipeline clock
multiplied by a factor of 2-8
◆ Industrial and commercial temperature range
◆
Dual issue super-scalar execution core
– 250 MHz frequency
– Dual issue floating-point ALU operations with other instruction
classes
– Traditional 5-stage pipeline, minimizes load and branch latencies
◆ Single-cycle repeat rate for most floating point ALU
operations
◆ High level of performance for a variety of applications
– High-performance 64-bit integer unit achieves 330 dhrystone
MIPS (dhrystone 2.1)
– Ultra high-performance floating-point accelerator, directly
implementing single- and double-precision operations
achieves 500mflops
– Extremely large on-chip primary cache
– On-chip secondary cache controller
◆ MIPS-IV 64-bit ISA for improved computation
– Compound floating-point operations for 3D graphics and
floating-point DSP
– Conditional move operations
◆ Large on-chip TLB
◆
Active power management, including use of WAIT operation
Phase Lock Loop
Data Set A
Instruction Set A
Data Tag A
Store B uffer
DT LB Physical
Instruction Select
SysAD
Integer Instruction Register
Address B uffer
W rite Buffer
FP Instruction Register
Instruction Tag A
Read Buffer
ITL B Physical
Data Set B
Instruction Set B
Instruction Tag B
DB us
FPIB us
IntIB us
Control
Tag
AuxTag
L oad Aligner
Unpacker/Packer
Joint T LB
Integer Register File
Coprocessor 0
System /M emory
Control
DVA
IVA
PC Increm enter
B ranch Adder
Instruction TL B Virtual
Integer Control
Floating Point
M Add,Add,Sub, Cvt
Div, SqRt
Floating-point Control
Floating Point Register File
Integer/Address Adder
Data T LB Virtual
Shifter/Store Aligner
Logic Unit
AB us
Integer M ultiply, Divide
Program Counter
The IDT logo is a registered trademark and RC32134, RC32364, RC64145, RC64474, RC64475, RC4650, RC4640, RC4600,RC4700 RC3081, RC3052, RC3051, RC3041, RISController, and RISCore are trademarks of Integrated Device Technology, Inc.
1 of 15
 2001 Integrated Device Technology, Inc.
April 10, 2001
DSC 5719
79RC5000
The RC5000 serves many performance critical embedded applications, such as high-end internetworking systems, color printers, and
graphics terminals.
The RC5000 implements the MIPS-IV 64-bit ISA, including CP1 and
CP1X functional units (and their instruction set).
The RC5000 is optimized for high-performance applications, with
special emphasis on system bandwidth and floating point operations,
through integration of high-performance computational units and a highperformance memory hierarchy. For this class of application, the result
is a relatively low-cost CPU capable of approximately 330 Dhrystone
MIPS.
The RC5000 is a limited dual-issue machine that utilizes a traditional
5-stage integer pipeline. This basic integer pipeline of the RC5000 is
illustrated in Figure 1. The integer instruction execution speed is tabulated (in number of pipeline clocks) as follows:
2SHUDWLRQ
IDT’s objectives in offering the RC5000 include:
◆ Offering a high performance upgrade path to existing embedded
customers in the internetworking, office automation and
visualization markets.
◆
Providing a significant improvement in the floating- point
performance currently available in a moderately priced MIPS
CPU.
◆ Providing improvements in the memory hierarchy of desktop
systems by using large primary caches and integrating a
secondary cache controller.
◆ Enabling improvements in performance through the use of the
MIPS-IV ISA.
/DWHQF\
5HSHDW
Load
2
1
Store
2
1
MULT/MULTU
8
8
DMULT/DMULTU
12
12
DIV/DIVU
36
36
DDIV/DDIVU
68
68
Other Integer ALU
1
1
Branch
2
2
Jump
2
2
Table 1 Integer Instruction Execution Speed
The RC5000 recognizes two general classes of instructions for multiissue:
◆ Floating-point ALU
◆
All others
These instruction classes are pre-decoded by the RC5000, as they
are brought on-chip. The pre-decoded information is stored in the
instruction cache.
The RC5000’s short pipeline keeps the load and branch latencies
very low. The caches contain special logic that allows any combination
of loads and stores to execute in back-to-back cycles without requiring
pipeline slips or stalls. (This assumes that the operation does not miss
in the cache.)
Assuming that there are no pending resource conflicts, the RC5000
can issue one instruction per class per pipeline clock cycle. Note that
this broad separation of classes insures that there are no data dependencies to restrict multi-issue.
However, long-latency resources in either the floating-point ALU (e.g.
DIV or SQRT instructions) or instructions in the integer unit (such as
multiply) can restrict the issue of instructions. Note that the R5000 does
not perform out-of-order or speculative execution; instead, the pipeline
slips until the required resource becomes available.
There are no alignment restrictions on dual-issue instruction pairs.
The RC5000 fetches two instructions from the cache per cycle. Thus, for
optimal performance, compilers should attempt to align branch targets
to allow dual-issue on the first target cycle, since the instruction cache
only performs aligned fetches.
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April 10, 2001
79RC5000
I0
1I
2I
I1
1R
2R
1A
2A
1D
2D
1W
2W
1I
2I
1R
2R
1A
2A
1D
2D
1W
2W
1I
2I
1R
2R
1A
2A
1D
2D
I2
1
W
I3
1I
I4
2I
1R
2R
1A
2A
1D
1I
2I
1R
2R
1A
one cycle
Figure 1 R5000 Integer Pipeline Stages
Key to Figure
1I-1R
Instruction cache access
2I
Instruction virtual to physical address translation
2A-2D
Data cache access and load align
1D
Data virtual to physical address translation
1D-2D
Virtual to physical address translation
2R
Register file read
2R
Bypass calculation
2R
Instruction decode
2R
Branch address calculation
1A
Issue or slip decision
1A-2A
Integer add, logical, shift
1A
Data virtual address calculation
2A
Store align
1A
Branch decision
2W
Register file write
3 of 15
April 10, 2001
79RC5000
!
! "
"
where P is the maximum power consumption at hot temperature,
calculated by using the maximum ICC specification for the device.
Typical values for ∅CA at various airflows are shown in Table 1.
The RC5000 contains the following computational units:
Integer ALU. The RC5000 implements a full, single-cycle 64-bit ALU
for all integer ALU functions other than multiply and divide. Bypassing is
used to support back-to-back ALU operations at the full pipeline rate,
without requiring stalls for data dependencies.
∅CA
Integer Multiply/Divide Unit. This unit is separated from the primary
ALU, to allow these longer latency operations to run in parallel with other
operations. The pipeline stalls only if an attempt to access the HI or LO
registers is made before the operation completes.
Airflow (ft/min)
0
200
400
600
800
1000
PGA
16
7
5
3
2.5
2
BGA
14
6
4
3
2.5
2
Table 2 Thermal Resistance (ýCA) at Various Airflows
Note: The RC5000 implements advanced power management to substantially reduce the average power dissipation of
the device. This operation is described in the IDT79RV5000
RISC Microprocessor Reference Manual.
Floating-point ALU. This unit is responsible for all CP1/CP1X ALU
operations other than DIV/SQRT. The unit is pipelined to allow a singlecycle repeat rate for single-precision operations
Floating-point DIV/SQRT unit. This unit is separated from the other
floating-point ALU, so that these long latency operations do not prevent
the issue of other floating point operations.
$
In addition, the RC5000 implements separate logical units to implement loads, stores, and branches.
Per the RC5000 Documentation errata, Revision 1.0, dated February
1999 and per the RC5000 Device errata, dated February 1999, mode
bits 20, 33 and 37 must be set to 1.
The input clock operates in a frequency range of 33MHz to 100MHz.
The pipeline frequency for the RC5000 is 2 to 8 times the input clock (up
to the maximum for the speed grade of CPU).
#
# The RC5000 utilizes special packaging techniques, to improve the
thermal properties of high-speed processors. The RC5000 is packaged
using cavity down packaging in a 223-pin PGA package with integral
thermal slug, and a 272-pin BGA package. These packages effectively
dissipate the power of the CPU, increasing device reliability.
The RC5000 utilizes an all-aluminum package with the die attached
to a normal copper lead frame mounted to the aluminum casing. Due to
the heat-spreading effect of the aluminum, the package allows for an
efficient thermal transfer between the die and the case. The aluminum
offers less internal resistance from one end of the package to the other,
reducing the temperature gradient across the package and therefore
presenting a greater area for convection and conduction to the PCB for
a given temperature. Even nominal amounts of airflow will dramatically
reduce the junction temperature of the die, resulting in cooler operation.
The RC5000 is guaranteed in a case temperature range of 0° to
+85° C. The type of package, speed (power) of the device, and airflow
conditions affect the equivalent ambient temperature conditions that will
meet this specification.
%
% & '
January 1996: Corrected pin list for Clock/Control, Initialization, and
Secondary Cache interfaces in Pin Description section. Changed pins
AA19 and AA21 from Vcc to Vss in Advance Pin-Out section.
March 1997: Upgraded data sheet status from “Preliminary” to Final.
Added section on thermal considerations. Added section on absolute
maximum ratings.
June 1997: Revised Power Consumption and System Interface
Parameters.
September 1997: Added user notation on Boot Mode Bits 20 and 33
for 200 MHz frequency.
June 1998: Added 250 MHz. Changed naming conventions.
June 1999: Added 267 MHz and 300 MHz.
October 28, 1999: Added industrial temperature data and revised
package designation code in the Ordering Information section.
March 23, 2000: Expanded the data presentation in the System
Interface Parameters table and revised the values in this table.
April 10, 2001: In the Data Output and Data Output Hold categories
of the System Interface Parameters table, changed values in the Min
column for all speeds from 1.5 and 1.0 to 0.
The equivalent allowable ambient temperature, TA, can be calculated
using the thermal resistance from case to ambient (∅CA) of the given
package.
The following equation relates ambient and case temperatures:
TA = T C - P * ∅CA
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April 10, 2001
79RC5000
( 2
8
SysCmd(8:0)
ScTDE*
SysCmdP
ScTOE*
ValidIn*
ScCLR*
ValidOut*
ScDCE*
ExtRqst*
ScDOE*
Release*
ScCWE*
16
WrRdy*
ScLine (15:0)
Secondary Cache Interface
ScTCE*
9
RdRdy*
ScMATCH
ScVALID
RC5000
Logic
Symbol
SysClock
VccP
6
Int (5:0)*
NMI*
VssP
Vcc
Vss
34
BigEndian
34
ModeClock
ModeIN
VccOk
ColdReset*
Initialization
Interface
Clock Interface
ScWord (1:0)
Reset*
JTDI
JTDO
JTMS
JTAG
Interface
System Interface
SysADC(7:0)
64
Interrupt
Interface
SysAD(63:0)
JTCK
Figure 2 RC5000 Logic Symbol Diagram
5 of 15
April 10, 2001
79RC5000
! The RC5000 implements a bus similar to that of the RC4700. Table 2 lists and describes the RC5000 signals.
System interface
ExtRqst*
Input
External Request.
Signals that the system interface needs to submit an external request.
Release*
Output
Release Interface.
Signals that the processor is releasing the system interface to slave state
RdRdy*
Input
Read Ready.
Signals that an external agent can now accept a processor read.
WrRdy*
Input
Write Ready.
Signals that an external agent can now accept a processor write request.
ValidIn*
Input
Valid Input.
Signals that an external agent is now driving a valid address or data on the SysAD bus and a valid command or data identifier on the
SysCmd bus.
ValidOut*
Output
Valid Output.
Signals that the processor is now driving a valid address or data on the SysAD bus and a valid command or data identifier on the
SysCmd bus.
SysAD(63:0)
Input/
Output
System Address/Data bus.
A 64-bit address and data bus for communication between the processor and an external agent.
SysADC(7:0)
Input/
Output
System Address/Data check bus.
An 8-bit bus containing parity check bits for the SysAD bus during data bus cycles.
SysCmd(8:0)
Input/
Output
System Command/data identifier bus.
A 9-bit bus for command and data identifier transmission between the processor and an external agent.
SysCmdP
Input/
Output
Reserved System Command/data identifier bus parity.
For the RC5000, unused on input and zero on output.
Clock/control interface
SysClock
Input
Master Clock.
Master clock input at the bus frequency. The pipeline clock is derived by multiplying this clock up.
VCCP
Input
Quiet VCC for PLL.
Quiet VCC for the internal phase locked loop.
VSSP
Input
Quiet VSS for PLL.
Quiet VSS for the internal phase locked loop.
Interrupt interface
Int(5:0)*
Input
Interrupt.
Six general processor interrupts, bit-wise ORed with bits 5:0 of the interrupt register.
NMI*
Input
Non-maskable interrupt. Non-maskable interrupt, ORed with bit 6 of the interrupt register.
JTDI
Input
JTAG Data In.
Connected directly to JTDO. No JTAG implemented; should be pulled High.
JTCK
Input
JTAG Clock Input.
Unused input; should be pulled High.
JTAG interface:
Table 3: RC5000 Signal Names and Descriptions (Page 1 of 2)
6 of 15
April 10, 2001
79RC5000
JTDO
Output
JTAG Data Out.
Connected directly to JTDI. If no external scan used, this is a no connect.
JTMS
Input
JTAG Command.
Unused input. Should be pulled High.
Initialization interface:
VCCOk
Input
VCC is OK.
When asserted, this signal indicates to the RC5000 that the power supply has been above Vcc minimum for more than 100 milliseconds
and will remain stable. The assertion of VCCOk initiates the reading of the boot-time mode control serial stream.
ColdReset*
Input
Cold Reset.
This signal must be asserted for a power on reset or a cold reset. ColdReset must be de-asserted synchronously with SysClock.
Reset*
Input
Reset.
This signal must be asserted for any reset sequence. It may be asserted synchronously or asynchronously for a cold reset, or syn chronously to initiate a warm reset. Reset must be synchronously de-asserted with SysClock.
ModeClock
Output
Boot Mode Clock.
Serial boot-mode data clock output at the system clock frequency divided by two hundred and fifty six.
ModeIn
Input
Boot Mode Data In.
Serial boot-mode data input.
BigEndian
Input
Endian mode select.
Allows the system to change the processor addressing mode without rewriting the mode ROM. If endianness is to be specified by using
the BigEndian pin, program mode ROM bit 8 to 0; if endianness is to be specified by the mode ROM, ground the BigEndian pin.
Secondary cache interface:
ScCLR*
Output
Secondary Cache Block Clear.
Clears all valid bits in those Tag RAM’s which support this function.
ScCWE*(1:0)
Output
Secondary Cache Write Enable.
Asserted during writes to the secondary cache
ScDCE*(1:0)
Output
Data RAM Chip Enable.
Chip Enable for Secondary Cache Data RAM
ScDOE*
Input
Data RAM Output Enable.
Asserted by the external agent to enable data onto the SysAD bus
ScLine (15:0)
Output
Data RAM Output Enable.
Cache line index for secondary cache
ScMATCH
Input
Secondary cache Tag Match.
Asserted by Tag RAM on Secondary cache tag match
ScTCE*
Output
Secondary cache Tag RAM Chip Enable.
Chip enable for secondary cache tag RAM.
ScTDE*
Output
Secondary cache Tag RAM Data Enable.
Data Enable for Secondary Cache Tag RAM.
ScTOE*
Output
Secondary cache Tag RAM Output Enable.
Tag RAM Output enable for Secondary Cache Tag RAM’s
ScWord (1:0)
Input/
Output
Secondary cache Word Index.
Determines correct double-word of Secondary cache Index
ScValid
Input/
Output
Secondary cache Valid.
Always driven by the CPU except during a cache probe operation, when it is driven by the tag RAM.
Table 3: RC5000 Signal Names and Descriptions (Page 2 of 2)
7 of 15
April 10, 2001
79RC5000
) *
* Note: Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
!
" #$
!
% VTERM
Terminal Voltage with respect to GND
–0.51 to +4.6
–0.51 to +4.6
V
TC
Operating Temperature (case)
0 to +85
-40 to +85
°C
TBIAS
Case Temperature Under Bias
–55 to +125
–55 to +125
°C
TSTG
Storage Temperature
–55 to +125
–55 to +125
°C
IIN
DC Input Current
202
203
mA
DC Output Current
504
505
mA
IOUT
1.
IN minimum = –2.0V for pulse width less than 15ns. VIN should not exceed VCC +0.5 Volts.
2.
.When VIN < 0V or VIN > VCC.
3.
.When VIN < 0V or VIN > VCC.
4.
Not more than one output should be shorted at a time. Duration of the short should not exceed 30 seconds.
5.
Not more than one output should be shorted at a time. Duration of the short should not exceed 30 seconds.
## !
! !
!
# !! ' + &#
$
'''
&
Commercial
0°C to + 85°C (Case)
0V
3.3V±5%
Industrial
-40°C to +85°C (Case)
0V
3.3V±5%
(VCC= 3.3V± 5%; Tcase = 0°C to +85°C for commercial or Tcase = -40°C to +85°C for industrial)
Clo
Clock Param
aramete
eter s—RC50
RC500
5000
Note: Boot Mode Bits 20, 33 and 37 must be set to “1” for all frequencies
()'*+,
-''*+,
-'*+,
Min
Max
Min
Max
Min
Max
% Pipeline Clock Frequency
PCLk
100
180
100
200
100
250
SysClock HIGH
tSCHIGH
3
—
3
—
3
—
ns
SysClock LOW
tSCLOW
3
—
3
—
3
—
ns
SysClock Frequency
—
33
90
33
100
33
125
MHz
SysClock Period
tSCP
11.1
30
10
30
8
30
ns
SysClock Rise Time1
tSCRise
—
2.5
—
2
—
2
ns
SysClock Fall Time1
tSCFall
—
2.5
—
2
—
2
ns
ModeClock Period
tModeCKP
—
256
tSCP
—
256
tSCP
—
256
tSCP
ns
1.
Rise and Fall times are measured between 10% and 90%
8 of 15
April 10, 2001
79RC5000
Capaciti
apacitiv
itive Load Deration—RC5000
Deration—RC5000
Load Derate
CLD
()'*+,
# —
-''*+,
-'*+,
Min
Max
Min
Max
Min
Max
—
2
—
2
—
2
% ns/25pF
' , -
-
Note: 50 pf loading on external output signals
-'*+,
-'' *+,
()' *+,
.
.
.
/' *+, 0$ (''*+, 0$ (- *+, 0$ % 12$
12$
12$
# Min
Data Output
tDO = Max
tDM = Min
Data Output Hold tDOH1
tDS
Data Input
1.
tDH
mode 14..13 = 10 (fastest, 100%) 01
Max
Min
Max
Min
Max
7
01
5
01
4.7
ns
mode 14..13 = 11 (83%)
01
8
01
7
01
5
ns
mode 14..13 = 00 (67%)
01
9
01
9
01
6
ns
mode 14..13 = 01 (slowest, 50%)
01
11
01
11
01
7
ns
mode 14..13 = 10 (fastest)
0
—
0
—
0
—
ns
mode 14..13 = 11 (83%)
0
—
0
—
0
—
ns
mode 14..13 = 00 (67%)
0
—
0
—
0
—
ns
mode 14..13 = 01 (slowest)
0
—
0
—
0
—
ns
trise = 3ns
tfall = 3ns
1.5
—
1.5
—
1.5
—
ns
0.5
—
0.5
—
0.5
—
ns
Guaranteed by design.
,
, -
# ()'*+, -''*+, . -'*+, .
. /' *+, ('' *+, (- *+, % Min
Max
Min
Max
Min
Max
# Mode Data Setup
tDS
—
4
—
4
—
4
—
ns
Master Clock Cycle
Mode Data Hold
tDH
—
0
—
0
—
0
—
ns
Master Clock Cycle
9 of 15
April 10, 2001
79RC5000
(Vcc = 3.3V± 5%; Tcase = 0°C to +85°C for commercial or Tcase = -40°C to +85°C for industrial)
()'*+,
-''*+,
-'*+3
# Min
Max
Min
Max
Min
Max
VOL
—
0.1V
—
0.1V
—
0.1V
VOH
VCC
- 0.1V
—
VCC
- 0.1V
—
VCC
- 0.1V
—
VOL
—
0.4V
—
0.4V
—
0.4V
VOH
2.4V
—
2.4V
—
2.4V
—
VIL
–0.5V
0.2VCC
–0.5V
0.2VCC
–0.5V
0.2VCC
—
VIH
0.7VCC
VCC +
0.5V
0.7VCC
VCC +
0.5V
0.7VCC
VCC +
0.5V
—
IIN
—
±10uA
—
±10uA
—
±10uA
0 ≤ VIN ≤ VCC
CIN
—
10pF
—
10pF
—
10pF
—
CIO
—
10pF
—
10pF
—
10pF
—
Cclk
—
10pF
—
10pF
—
10pF
I/OLEAK
—
20uA
—
20uA
—
20uA
|IOUT|= 20uA
|IOUT|= 4mA
Input/Output Leakage
()'*+,
-''*+,
-'*+,
# Max
Max
Max
System Condition
180/45MHz
200/50MHz
250/62.5MHz —
Icc
Standby
120mA
120mA
120mA
CL = 50 pF
Active
1100mA
1300mA
1800mA
CL = 50pF
Pipelined writes or write re-issue
Tc = 25oC
10 of 15
April 10, 2001
79RC5000
' !
! , The RC5000 is available in two packages, the 223-pin CPGA and the 272-ball SBGA. The 223-pin CPGA package is shown in Figure 2 and Table
3; information on the SBGA package is shown in Figure 3 and Table 4.
V
U
T
R
P
N
M
L
K
223-Pin CPGA
J
H
G
F
E
D
C
B
A
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18
Figure 3 RC5000 223-pin CPGA Pin Orientation (Bottom View)
11 of 15
April 10, 2001
79RC5000
../0 1
1 4 1$
1$ 1$
1$
1$
1$ A2
Vcc
C5
SysADC[6]
E18
Vcc
K17
VssP
R6
SysAD[51]
U9
SysAD[63]
A3
Vss
C6
SysAD[16]
F1
Vcc
K18
Vss
R7
SysAD[55]
U10
SysAD[13]
A4
Vcc
C7
SysAD[50]
F2
Reserved
L1
Vss
R8
SysAD[27]
U11
SysAD[11]
A5
Vss
C8
SysAD[22]
F3
ScValid
L2
SysCmd[8]
R9
SysAD[31]
U12
SysAD[9]
A6
Vss
C9
SysAD[24]
F4
INT[1]*
L3
SysCmd[7]
R10
SysAD[43]
U13
SysAD[37]
A7
Vcc
C10
SysAD[28]
F15
ScDCE[0]*
L4
SysCmd[5]
R11
SysAD[39]
U14
SysAD[3]
A8
Vss
C11
SysAD[62]
F16
ScCWE[0]*
L15
ScLine[12]
R12
SysAD[35]
U15
ScWord[0]
A9
Vcc
C12
SysAD[44]
F17
ScTDE*
L16
ScLine[14]
R13
SysAD[1]
U16
Vcc
A10
Vss
C13
SysAD[10]
F18
Vss
L17
ScLine[15]
R14
ScWord[1]
U17
Vss
A11
Vcc
C14
SysAD[38]
G1
Vss
L18
Vcc
R15
ScLine[0]
U18
Vss
A12
Vss
C15
SysAD[4]
G2
Reserved
M1
Vcc
R16
ScLine[3]
V1
Vss
A13
Vcc
C16
SysAD[34]
G3
Reserved
M2
SysCmd[6]
R17
ScLine[6]
V2
Vss
A14
Vss
C17
SysAD[2]
G4
Reserved
M3
SysCmd[4]
R18
Vss
V3
Vcc
A15
Vss
C18
Vss
G15
ScCLR*
M4
SysCmd[1]
T1
Vss
V4
Vss
A16
Vcc
D1
Vss
G16
ScTCE*
M15
ScLine[8]
T2
SysAD[15]
V5
Vss
A17
Vss
D2I
INT3*
G17
ModeIn
M16
ScLine[10]
T3
SysAD[47]
V6
Vcc
A18
Vss
D3
INT5*
G18
Vcc
M17
ScLine[13]
T4
SysAD[17]
V7
Vss
B1
Vss
D4
Release*
H1
Vcc
M18
Vss
T5
SysAD[19]
V8
Vcc
B2
Vss
D5
Vcc
H2
Reserved
N1
Vss
T6
SysAD[23]
V9
Vss
B3
Vcc
D6
SysADC[2]
H3
Reserved
N2
SysCmd[3]
T7
SysAD[57]
V10
Vcc
B4
SysADC[4]
D7
SysAD[48]
H4
Reserved
N3
SysCmd[2]
T8
SysAD[29]
V11
Vss
B5
SysADC[0]
D8
SysAD[52]
H15
VccOK
N4
SysADC[7]
T9
Vcc
V12
Vcc
B6]
SysAD[18
D9
SysAD[56]
H16
ModeClock
N15
ScLine[5]
T10
SysAD[45]
V13
Vss
B7]
SysAD[20]
D10
SysAD[60]
H17
SysClock
N16
ScLine[7]
T11
SysAD[41]
V14
Vcc
B8
SysAD[54]
D11
SysAD[14]
H18
Vss
N17
ScLine[11]
T12
SysAD[7]
V15
Vss
B9
SysAD[26]
D12S
SysAD[42]
J1
Vss
N18
Vcc
T13
SysAD[5]
V16
Vss
B10
0SysAD[58]
D13
SysAD[8]
J2
WrRdy*
P1
Vcc
T14
SysAD[33]
V17
Vcc
B11
SysAD[30]
D14
SysAD[36]
J3
ValidIn*
P2
SysCmd[0]
T15
Reset*
V18
Vss
B12
SysAD[46]
D15
ColdReset*
J4
ExtReq*
P3
SysCmdP
T16
ScLine[1]
B13
SysAD[12]
D16
SysAD[0]
J15
JTDO
P4
SysADC[1]
T17
Vcc
B14
SysAD[40]
D17
ScTOE*
J16
JTDI
P15
ScLine[2]
T18
Vcc
B15
SysAD[6]
D18
Vcc
J17
JTCK
P16
ScLine[4]
U1
Vcc
B16
Vss
E1
Vss
J18
Vcc
P17
ScLine[9]
U2
Vcc
B17
Vcc
E2
INT[0]*
K1
Vcc
P18
Vss
U3
Vss
B18
Vcc
E3
INT[2]*
K2
ScMatch
R1
Vcc
U4
SysAD[21]
C1
Vcc
E4
NT[4]*
K3
RdRdy*
R2
SysADC[5]
U5
SysAD[53]
C2
Vcc
E15
SysAD[32]
K4S
cDOE*
R3
SysADC[3]
U6
SysAD[25]
C3
ValidOut*
E16
ScDCE[1]*
K15
JTMS
R4
BigEndian
U7
SysAD[59]
C4
NMI*
E17
ScCWE[1]*
K16
VccP
R5
SysAD[49]
U8
SysAD[61]
12 of 15
April 10, 2001
79RC5000
.2.0 1
1 21 20 19 18 17 16 15 14 13 12 11 10 9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
272-Ball SBGA
L
M
N
P
R
T
U
V
W
Y
AA
Figure 4 Ball Grid Array Package (Bottom View)
13 of 15
April 10, 2001
79RC5000
.2.0 1
1 Pkg Pin Function
Pkg Pin Function
Pkg Pin
Function
Pkg Pin Function
Pkg Pin
Function
Pkg Pin Function
AA1
B5
D9
Vss
J2
P21
SysAD55
W1
Vss
SysAD0
SysAD46
Vss
AA2
Vcc
B6
ScTOE*
D10
Vcc
J3
SysAD14
R1
Vss
W2
Vcc
AA3
Vss
B7
ScCLR*
D11
Vccp
J4
Vss
R2
SysAD18
W3
Vcc
AA4
ValidOut*
B8
ScTDE*
D12
Vcc
J18
Vss
R3
SysAD48
W4
Vcc
AA5
Vss
B9
ModeClock
D13
Vss
J19
SysAD9
R4
Vcc
W5
Int*5
AA6
Int*0
B10
JTDI
D14
Vcc
J20
SysAD41
R18
Vcc
W6
Int*4
AA7
Vss
B11
JTCK
D15
Vcc
J21
Vss
R19
SysAD53
W7
Int*1
AA8
Reserved
B12
N/C
D16
Vss
K1
SysAD60
R20
SysAD23
W8
Reserved
AA9
Vss
B13
ScLine14
D17
Vcc
K2
SysAD30
R21
Vss
W9
Reserved
AA10
WrRdy*
B14
ScLine10
D18
Vss
K3
SysAD62
T1
SysAD16
W10
Reserved
AA11
Vss
B15
ScLine9
D19
Vcc
K4
Vcc
T2
SysADC0
W11
ValidIn*
AA12
ScMatch
B16
ScLine6
D20
Vcc
K18
Vcc
T3
SysADC2
W12
ScDOE*
AA13
Vss
B17
ScLine3
D21
Vcc
K19
SysAD11
T4
Vss
W13
SysCmd7
AA14
SysCmd6
B18
ScLine1
E1
Vss
K20
SysAD43
T18
Vss
W14
SysCmd4
AA15
Vss
B19
Vcc
E2
SysAD36
K21
SysAD13
T19
SysAD19
W15
SysCmd1
AA16
SysCmd2
B20
Vcc
E3
SysAD4
L1
Vss
T20
SysAD51
W16
SysADC7
AA17
Vss
B21
Vcc
E4
Vcc
L2
SysAD58
T21
SysAD21
W17
SysADC5
AA18
SysADC3
C1
Vss
E18
Vcc
L3
SysAD28
U1
Vss
W18
SysAD47
AA19
Vss
C2
Vcc
E19
ScWord1
L4
Vcc
U2
SysADC4
W19
BigEndian
AA20
Vcc
C3
ColdReset*
E20
ScWord0
L18
Vcc
U3
SysADC6
W20
Vcc
AA21
Vss
C4
SysAD34
E21
Vss
L19
SysAD45
U4
Vcc
W21
Vss
A1
Vss
C5
ScDCE*1
F1
SysAD8
L20
SysAD63
U18
Vcc
Y1
Vcc
A2
Vcc
C6
ScDCE*0
F2
SysAD38
L21
Vss
U19
SysAD17
Y2
Vcc
A3
Vss
C7
ScCWE*0
F3
SysAD6
M1
SysAD26
U20
SysAD49
Y3
Vcc
A4
SysAD32
C8
ScTCE*
F4
Vss
M2
SysAD56
U21
Vss
Y4
Release*
A5
Vss
C9
ModeIn
F18
Vss
M3
SysAD24
V1
Vcc
Y5
Int*3
A6
ScCWE*1
C10
JTDO
F19
SysAD1
M4
Vcc
V2
Vcc
Y6
Int*2
A7
Vss
C11
Vssp
F20
SysAD33
M18
Vcc
V3
Vcc
Y7
ScValid
A8
VCCOK
C12
JTMS
F21
SysAD3
M19
SysAD29
V4
Vss
Y8
Reserved
A9
Vss
C13
ScLine13
G1
Vss
M20
SysAd61
V5
NMI*
Y9
Reserved
A10
MasterClk
C14
ScLine11
G2
SysAD10
M21
SysAD31
V6
Vss
Y10
Reserved
A11
Vss
C15
ScLine8
G3
SysAD40
N1
Vss
V7
Vcc
Y11
ExtRqst*
A12
ScLine15
C16
ScLine5
G4
Vcc
N2
SysAD54
V8
Vcc
Y12
RdRdy*
A13
Vss
C17
ScLine4
G18
Vcc
N3
SysAD22
V9
Vss
Y13
SysCmd8
A14
ScLine12
C18
ScLine0
G19
SysAD35
N4
Vss
V10
Vcc
Y14
SysCmd5
A15
Vss
C19
Reset*
G20
SysAD5
N18
Vss
V11
Vcc
Y15
SysCmd3
A16
ScLine7
C20
Vcc
G21
Vss
N19
SysAD27
V12
Vcc
Y16
SysCmd0
A17
Vss
C21
Vss
H1
SysAD42
N20
SysAD59
V13
Vss
Y17
SysCmdP
A18
ScLine2
D1
Vcc
H2
SysAD44
N21
Vss
V14
Vcc
Y18
SysADC1
A19
Vss
D2
Vcc
H3
SysAD12
P1
SysAD50
V15
Vcc
Y19
SysAD15
A20
Vcc
D3
Vcc
H4
Vcc
P2
SysAD52
V16
Vss
Y20
Vcc
A21
Vss
D4
Vss
H18
Vcc
P3
SysAD20
V17
Vcc
Y21
Vcc
B1
Vcc
D5
Vcc
H19
SysAD7
P4
Vcc
V18
Vss
B2
Vcc
D6
Vss
H20
SysAD39
P18
Vcc
V19
Vcc
B3
Vcc
D7
Vcc
H21
SysAD37
P19
SysAD25
V20
Vcc
B4
SysAD2
D8
Vcc
J1
Vss
P20
SysAD57
V21
Vcc
14 of 15
April 10, 2001
79RC5000
#
# ,
, IDT79
YY
Operating
Voltage
XXXX
999
Device
Type
Speed
A
Package
A
Temp range/
Process
Blank
Commercial Temperature
(0°C to +85°C Case)
I
Industrial Temperature
(-40°C to +85°C Case)
G
223-ball CPGA
BS272 272-ball SBGA
180
200
250
180 MHz Pipeline
200 MHz Pipeline
250 MHz Pipeline
5000
Multi-Issue
64-bit Microprocessor
RV
3.3+/-5%
! " IDT79RV5000 - 180, 200MHz
G
CPGA package
IDT79RV5000 - 180, 200, 250MHz
BS272
SBGA package
IDT79RV5000 - 180, 200MHz
BS272 I
SBGA package
CORPORATE HEADQUARTERS
2975 Stender Way
Santa Clara, CA 95054
for SALES:
800-345-7015 or 408-727-6116
fax: 408-330-1748
www.idt.com
for Tech Support:
email: [email protected]
phone: 408-492-8208
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
15 of 15
April 10, 2001
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