A3959 DMOS Full-Bridge PWM Motor Driver Features and Benefits Description ▪ ±3 A, 50 V Output Rating ▪ Low rDS(on) Outputs (270 mΩ, Typical) ▪ Mixed, Fast, and Slow Current-Decay Modes ▪ Synchronous Rectification for Low Power Dissipation ▪ Internal UVLO and Thermal-Shutdown Circuitry ▪ Crossover-Current Protection ▪ Internal Oscillator for Digital PWM Timing Designed for pulse width modulated (PWM) current control of DC motors, the A3959 is capable of output currents to ±3 A and operating voltages to 50 V. Internal fixed off-time PWM currentcontrol timing circuitry can be adjusted via control inputs to operate in slow, fast, and mixed current-decay modes. PHASE and ENABLE input terminals are provided for use in controlling the speed and direction of a DC motor with externally applied PWM-control signals. Internal synchronous rectification control circuitry is provided to reduce power dissipation during PWM operation. Packages: Internal circuit protection includes thermal shutdown with hysteresis, undervoltage monitoring of supply and charge pump, and crossover-current protection. Special power-up sequencing is not required. Package B, 24-pin DIP with exposed tabs The A3959 provides a choice of three power packages, a 24-pin DIP with batwing tabs (package suffix ‘B’), a 24-lead SOIC with four internally-fused pins (package suffix ‘LB’), and a thin (<1.2 mm) 28-pin TSSOP with an exposed thermal pad (suffix ‘LP’). In all cases, the power pins and tabs are at ground potential and need no electrical isolation. Each package is lead (Pb) free, with 100% matte tin leadframes. Package LB, 24-pin SOIC with internally fused pins Package LP, 28-pin TSSOP with exposed thermal pad Not to scale Functional Block Diagram VBB VDD TO VDD UNDERVOLTAGE & FAULT DETECT CP2 CP1 CHARGE PUMP BANDGAP VDD CREG TSD CP + LOGIC SUPPLY CHARGE PUMP LOAD SUPPLY BANDGAP REGULATOR VREG SLEEP PHASE CONTROL LOGIC ENABLE GATE DRIVE OUTA EXT MODE OUTB SENSE TO VDD BLANK PFD1 PWM TIMER CS ZERO CURRENT DETECT RS PFD2 ROSC OSC CURRENT SENSE REFERENCE BUFFER & w10 REF VREF Dwg. FP-048-2A 29319.37K A3959 DMOS Full-Bridge PWM Motor Driver Selection Guide Part Number A3959SB-T A3959SLB-T A3959SLBTR-T A3959SLP-T A3959SLPTR-T Package Packing 24-pin DIP with exposed tabs 24-pin SOIC with internally fused pins 24-pin SOIC with internally fused pins 28-pin TSSOP with exposed thermal pad 28-pin TSSOP with exposed thermal pad 15 per tube 31 per tube 1000 per reel 50 per tube 4000 per reel Absolute Maximum Ratings Rating Units Load Supply Voltage Characteristic VBB 50 V Logic Supply Voltage VDD 7.0 V Input Voltage VIN Continuous –0.3 to VDD + 0.3 V tw < 30 ns –1.0 to VDD + 1.0 V Sense Voltage VS Continuous 0.5 V tw < 3 μs 2.5 V VDD V Repetitive ±3.0 A Peak, < 3 μs ±6.0 A Reference Voltage Output Current Symbol Notes VREF IOUT Output current rating may be limited by duty cycle, ambient temperature, and heat sinking. Under any set of conditions, do not exceed the specified current rating or a junction temperature of 150°C. Package Power Dissipation PD See Thermal Characteristics Operating Ambient Temperature TA Range S Maximum Junction Temperature TJ(max) Storage Temperature Tstg Fault conditions that produce excessive junction temperature will activate the device’s thermal shutdown circuitry. These conditions can be tolerated but should be avoided. – – –20 to 85 ºC 150 ºC –55 to 150 ºC Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 2 A3959 DMOS Full-Bridge PWM Motor Driver Thermal Characteristics Characteristic Symbol Package Power Dissipation PD Test Conditions Value Units B package 3.3 W LB package 2.5 W LP package 3.1 W 54 ºC/W 36 ºC/W 4-layer PCB, based on JEDEC standard 26 ºC/W 1-layer PCB, minimal exposed copper area 77 ºC/W 2-layer PCB, 1-in.2 2-oz copper exposed area 51 ºC/W 4-layer PCB, based on JEDEC standard 35 ºC/W 1-layer PCB, minimal exposed copper area 100 ºC/W 2-layer PCB, 1-in.2 2-oz copper exposed area 40 ºC/W 4-layer PCB, based on JEDEC standard 28 ºC/W 1-layer PCB, minimal exposed copper area B Package Package Thermal Resistance, Junction to Ambient RθJA 2-layer PCB, LB Package LP Package 1-in.2 2-oz copper exposed area Package Thermal Resistance, Junction to Tab RθJT B and LB packages 6 ºC/W Package Thermal Resistance, Junction to Pad RθJP LP package 2 ºC/W *Additional thermal information available on Allegro website. ALLOWABLE PACKAGE POWER DISSIPATION (W) 5 SUFFIX 'B', RQJA = 26oC/W SUFFIX 'LP', RQJA = 28oC/W SUFFIX 'LB', RQJA = 35oC/W 4-LAYER BOARD 4 3 2 1 SUFFIX 'B', RQJA = 36oC/W 0 SUFFIX 'LP', RQJA = 40oC/W SUFFIX 'LB', RQJA = 51oC/W 2-LAYER BOARD, 1 SQ. IN. COPPER EA. SIDE 25 50 75 100 TEMPERATURE IN o C 125 150 Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 3 A3959 DMOS Full-Bridge PWM Motor Driver ELECTRICAL CHARACTERISTICS at TA = +25°C, VBB = 50 V, VDD = 5.0 V, VSENSE = 0.5 V, fPWM < 50 kHz (unless noted otherwise) Characteristics Symbol Test Conditions Min. Typ. Max. Units Output Drivers Load Supply Voltage Range VBB Output Leakage Current IDSS Output On Resistance rDS(on) Operating 9.5 – 50 V During sleep mode 0 – 50 V VOUT = VBB – <1.0 20 μA VOUT = 0 V – <-1.0 -20 μA Source driver, IOUT = -3 A – 270 300 mΩ Sink driver, IOUT = 3 A – 270 300 mΩ 300 600 1000 ns – – 1.6 V Crossover Delay Body Diode Forward Voltage Load Supply Current VF IBB Source diode, IF = -3 A Sink diode, IF = 3 A – – 1.6 V fPWM < 50 kHz – 4.0 7.0 mA Charge pump on, outputs disabled – 2.0 5.0 mA Sleep mode – – 20 μA 4.5 5.0 5.5 V Control Logic Logic Supply Voltage Range Logic Input Voltage Logic Input Current (all inputs except ENABLE) Logic Supply Current ENABLE Input Current VDD Operating VIN(1) 2.0 – – V VIN(0) – – 0.8 V – <1.0 20 μA IIN(1) VIN = 2.0 V IIN(0) VIN = 0.8 V – <-2.0 -20 μA fPWM < 50 kHz – 6.0 10 mA IDD Sleep mode – – 2.0 mA IIN(1) VIN = 2.0 V – 40 100 μA IIN(0) VIN = 0.8 V – 16 40 μA ROSC shorted to GROUND 3.25 4.25 5.25 MHz ROSC = 51 kΩ 3.65 4.25 4.85 MHz 0.0 – VDD V Internal OSC frequency fOSC Reference Input Volt. Range VREF Operating Reference Input Current IREF VREF = VDD – – ±1.0 μA Comparator Input Offset Voltage VIO VREF = 0 V – ±5.0 – mV Continued next page … Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 4 A3959 DMOS Full-Bridge PWM Motor Driver ELECTRICAL CHARACTERISTICS (continued) at TA = +25°C, VBB = 50 V, VDD = 5.0 V, VSENSE = 0.5 V, fPWM < 50 kHz (unless noted otherwise) Characteristics Reference Divider Ratio Gm Error (Note 3) Symbol Test Conditions – EGm Min. Typ. Max. Units – 10 – – VREF = VDD – – ±4.0 % VREF = 0.5 V – – ±14 % 600 750 1200 ns 0.5 Ein to 0.9 Eout: PWM change to source on Propagation Delay Times Thermal Shutdown Temp. Thermal Shutdown Hysteresis UVLO Enable Threshold UVLO Hysteresis NOTES: PWM change to source off 50 150 350 ns PWM change to sink on 600 750 1200 ns PWM change to sink off 50 100 150 ns TJ – 165 – °C ∆TJ – 15 – °C 3.90 4.2 4.45 V 0.05 0.10 – V tpd UVLO Increasing VDD ∆UVLO 1. Typical Data is for design information only. 2. Negative current is defined as coming out of (sourcing) the specified device terminal. 3. Gm error = ([VREF/10] – VSENSE)/(VREF/10) where VSENSE = ITRIP•RS. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 5 A3959 DMOS Full-Bridge PWM Motor Driver FUNCTIONAL DESCRIPTION VREG. This internally generated voltage is used to operate the sink-side DMOS outputs. The VREG terminal should be decoupled with a 0.22 μF capacitor to ground. VREG is internally monitored and in the case of a fault condition, the outputs of the device are disabled. Charge Pump. The charge pump is used to generate a gate-supply voltage greater than VBB to drive the sourceside DMOS gates. A 0.22 μF ceramic capacitor should be connected between CP1 and CP2 for pumping purposes. A 0.22 μF ceramic capacitor should be connected between CP and VBB to act as a reservoir to operate the high-side DMOS devices. The CP voltage is internally monitored and, in the case of a fault condition, the source outputs of the device are disabled. PHASE Logic. The PHASE input terminal determines if the device is operating in the “forward” or “reverse” state. PHASE OUTA OUTB 0 Low High 1 High Low ENABLE Logic. The ENABLE input terminal allows external PWM. ENABLE high turns on the selected sinksource pair. ENABLE low switches off the source driver or the source and sink driver, depending on EXT MODE, and the load current decays. If ENABLE is kept high, the current will rise until it reaches the level set by the internal current-control circuit. ENABLE Outputs 0 Chopped 1 On EXT MODE Logic. When using external PWM current control, the EXT MODE input determines the current path during the chopped cycle. With EXT MODE low, fast decay mode, the opposite pair of selected outputs will be enabled during the off cycle. With EXT MODE high, slow decay mode, both sink drivers are on with ENABLE low. EXT MODE Decay 0 Fast 1 Slow Current Regulation. Load current is regulated by an internal fixed off-time PWM control circuit. When the outputs of the DMOS H bridge are turned on, the current increases in the motor winding until it reaches a trip value determined by the external sense resistor (RS) and the applied analog reference voltage (VREF): ITRIP = VREF/10RS At the trip point, the sense comparator resets the sourceenable latch, turning off the source driver. The load inductance then causes the current to recirculate for the fixed off-time period. The current path during recirculation is determined by the configuration of slow/mixed/fast current-decay mode via PFD1 and PFD2. Oscillator. The PWM timer is based on an internal oscillator set by a resistor connected from the ROSC terminal to VDD. Typical value of 4 MHz is set with a 51 kΩ resistor. The allowable range of the resistor is from 20 kΩ to 100 kΩ. fOSC = 204 x 109/ROSC. If ROSC is not pulled up to VDD, it must be shorted to ground. Fixed Off Time. The A3959 is set for a fixed off time of 96 cycles of the internal oscillator, typically 24 μs with a 4 MHz oscillator. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 6 A3959 DMOS Full-Bridge PWM Motor Driver FUNCTIONAL DESCRIPTION (continued) Internal Current-Control Mode. Inputs PFD1 and PFD2 determine the current-decay method after an overcurrent event is detected at the SENSE input. In slowdecay mode, both sink drivers are turned on for the fixed off-time period. Mixed-decay mode starts out in fast-decay mode for a portion (15% or 48%) of the fixed off time, and then is followed by slow decay for the remainder of the period. PFD2 PFD1 % toff Decay 0 0 0 Slow 0 1 15 Mixed 1 0 48 Mixed 1 1 100 Fast PWM Blank Timer. When a source driver turns on, a current spike occurs due to the reverse-recovery currents of the clamp diodes and/or switching transients related to distributed capacitance in the load. To prevent this current spike from erroneously resetting the source-enable latch, the sense comparator is blanked. The blank timer runs after the off-time counter to provide the blanking function. The blank timer is reset when ENABLE is chopped or PHASE is changed. For external PWM control, a PHASE change or ENABLE on will trigger the blanking function. The duration is determined by the BLANK input and the oscilator. BLANK tblank 0 6/fosc 1 12/fosc Synchronous Rectification. When a PWM off cycle is triggered, either by an ENABLE chop command or internal fixed off-time cycle, load current will recirculate according to the decay mode selected by the control logic. The A3959 synchronous rectification feature will turn on the appropriate pair of DMOS outputs during the current decay and effectively short out the body diodes with the low rDS(on) driver. This will reduce power dissipation significantly and can eliminate the need for external Schottky diodes. Synchronous rectification will prevent reversal of load current by turning off all outputs when a zero-current level is detected. Shutdown. In the event of a fault (excessive junction temperature, or low voltage on CP or VREG) the outputs of the device are disabled until the fault condition is removed. At power up, and in the event of low VDD, the UVLO circuit disables the drivers. Braking. The braking function is implemented by driving the device in slow-decay mode via EXTMODE and applying an enable chop command. Because it is possible to drive current in either direction through the DMOS drivers, this configuration effectively shorts out the motor-generated BEMF as long as the ENABLE chop mode is asserted. It is important to note that the internal PWM current-control circuit will not limit the current when braking, because the current does not flow through the sense resistor. The maximum brake current can be approximated by VBEMF/RL. Care should be taken to ensure that the maximum ratings of the device are not exceeded in worst-case braking situations of high speed and high inertial loads. SLEEP Logic. The SLEEP input terminal is used to minimize power consumption when when not in use. This disables much of the internal circuitry including the regulator and charge pump. Logic low will put the device into sleep mode, logic high will allow normal operation. Note: If the sleep mode is not used, connect a 5 kΩ pullup resistor between the SLEEP terminal and VDD. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 7 A3959 DMOS Full-Bridge PWM Motor Driver FUNCTIONAL DESCRIPTION (continued) Current Sensing. To minimize inaccuracies in sensing the ITRIP current level, which may be caused by ground trace IR drops, the sense resistor should have an independent ground return to the ground terminal of the device. For low-value sense resistors the IR drops in the PCB sense resistor’s traces can be significant and should be taken into account. The use of sockets should be avoided as they can introduce variation in RS due to their contact resistance. The maximum value of RS is given as RS = 0.5/ITRIP. Thermal Protection. Circuitry turns off all drivers when the junction temperature reaches 165°C typically. It is intended only to protect the device from failures due to excessive junction temperatures and should not imply that output short circuits are permitted. Thermal shutdown has a hysteresis of approximately 15°C. Layout. A star ground system located close to the driver is recommended. The printed wiring board should use a heavy ground plane. For optimum electrical and thermal performance, the driver should be soldered directly onto the board. The ground side of RS should have an individual path to the ground terminals of the device. This path should be as short as is possible physically and should not have any other components connected to it. It is recommended that a 0.1 μF capacitor be placed between SENSE and ground as close to the device as possible; the load supply terminal, VBB, should be decoupled with an electrolytic capacitor (> 47 μF is recommended) placed as close to the device as is possible. On the 28-lead TSSOP package, the copper ground plane located under the exposed thermal pad is typically used as a star ground. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 8 A3959 DMOS Full-Bridge PWM Motor Driver PHASE ROSC 3 CHARGE PUMP ı θ 24 CP 23 VREG 22 4 21 CP CP2 SLEEP CP1 OUTB 1 2 3 PHASE 4 ROSC 5 GROUND 6 24 23 NC Q 22 VREG SLEEP NO CONNECTION 21 OUTB 20 LOAD SUPPLY 19 GROUND CP 1 CP2 2 CP1 3 NC 4 PHASE 6 GROUND GROUND 7 8 LOGIC SUPPLY 99 ENABLE 10 PFD2 BLANK 20 LOAD SUPPLY 19 GROUND 18 GROUND 17 V DD 11 12 ÷10 PWM TIMER SENSE 16 OUTA 15 EXT MODE 14 REF 13 PFD1 GROUND LOGIC SUPPLY VBB LOGIC GROUND VBB 7 8 ENABLE 9 PFD2 10 BLANK 11 PFD1 12 18 V DD 17 PWM TIMER 5 LOGIC GROUND NC ÷10 GROUND 5 ROSC 6 GROUND 7 GROUND 8 LOGIC SUPPLY 9 ENABLE 10 SENSE 16 OUTA 15 NO CONNECTION 14 EXT MODE 13 REF NC 11 PFD 2 12 BLANK 13 PFD1 14 CHARGE PUMP 2 NC Q VBB LOGIC 1 CP1 Package LP (TSSOP) V DD PWM TIMER CP2 Package LB (SOIC) CHARGE PUMP Package B (DIP) NC ÷10 28 GROUND 27 VREG 26 SLEEP 25 NO CONNECTION 24 OUTB 23 LOAD SUPPLY 22 NC 21 SENSE 20 NC 19 NC 18 OUTA 17 NO CONNECTION 16 EXT MODE 15 REF Dwg. PP-069-5A Dwg. PP-069-4 Terminal List Terminal Name Terminal Description CP Reservoir capacitor (typically 0.22 μF) CP1 & CP2 The charge pump capacitor (typically 0.22 μF) NC PHASE B (DIP) LB (SOIC) LP (TSSOP) 24 1 1 1&2 2&3 2&3 No (internal) connection — — 4 Logic input for direction control 3 4 5 ROSC Oscillator resistor GROUND Grounds 4 5 6 5, 6, 7, 8* 6, 7 7, 8* LOGIC SUPPLY VDD, the low voltage (typically 5 V) supply 9 8 9 ENABLE Logic input for enable control 10 9 10 NC No (internal) connection – – 11 PFD2 Logic-level input for fast decay 11 10 12 BLANK Logic-level input for blanking control 12 11 13 PFD1 Logic-level input for fast decay 13 12 14 REF VREF, the load current reference input voltage 14 13 15 EXT MODE Logic input for PWM mode control 15 14 16 NO CONNECT No (Internal) connection — 15 17 OUTA One of two DMOS bridge outputs to the motor 16 16 18 NC No (internal) connection – – 19, 20 SENSE Sense resistor 17 17 21 NC No (internal) connection – – 22 GROUND Grounds 18, 19* 18, 19 — LOAD SUPPLY VBB, the high-current, 9.5 V to 50 V, motor supply 20 20 23 OUTB One of two DMOS bridge outputs to the motor 21 21 24 NO CONNECT No (Internal) connection — 22 25 SLEEP Logic-level Input for sleep operation 22 23 26 VREG Regulator decoupling capacitor (typically 0.22 μF) 23 24 27 GROUND Ground — — 28* * For the B (DIP) package only, there is an indeterminate resistance between the substrate grounds (pins 6, 7, 18, and 19) and the grounds at pins 5 and 8. Pins 5 and 8, and 6, 7, 18, or 19 must be connected together externally. For the LP (TSSOP) package, the grounds at terminals 7, 8, and 28 should be connected together at the exposed pad beneath the device. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 9 A3959 DMOS Full-Bridge PWM Motor Driver B package 24-pin DIP +0.25 30.10 –0.64 24 +0.10 0.38 –0.05 +0.76 6.35 –0.25 +0.38 10.92 –0.25 5.33 MAX For Reference Only (reference JEDEC MS-001 BE) Dimensions in millimeters 7.62 A 1 2 +0.51 3.30 –0.38 1.27 MIN 2.54 +0.25 1.52 –0.38 Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Terminal #1 mark area 0.018 0.46 ±0.12 LB package 24-pin SOICW 15.40±0.20 4° ±4 24 +0.07 0.27 –0.06 10.30±0.33 7.50±0.10 A 9.60 +0.44 0.84 –0.43 2.20 1 2 0.25 24X SEATING PLANE 0.10 C 0.41 ±0.10 1.27 C SEATING PLANE GAUGE PLANE 1.27 0.65 B PCB Layout Reference View 2.65 MAX 0.20 ±0.10 For reference only Pins 6 and 7, and 18 and 19 internally fused Dimensions in millimeters (Reference JEDEC MS-013 AD) Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Terminal #1 mark area B Reference pad layout (reference IPC SOIC127P1030X265-24M) All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary to meet application process requirements and PCB layout tolerances Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 10 A3959 DMOS Full-Bridge PWM Motor Driver LP package 28-pin TSSOP 0.45 9.70 ±0.10 4° ±4 28 +0.05 0.15 –0.06 0.65 28 1.65 B 3.00 4.40 ±0.10 6.40 ±0.20 3.00 6.10 0.60 ±0.15 A 1 (1.00) 2 5.00 0.25 28X SEATING PLANE 0.10 C +0.05 0.25 –0.06 0.65 C 1 2 SEATING PLANE GAUGE PLANE 5.00 C PCB Layout Reference View 1.20 MAX 0.10 MAX For reference only (reference JEDEC MO-153 AET) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Terminal #1 mark area B Exposed thermal pad (bottom surface) C Reference land pattern layout (reference IPC7351 SOP65P640X120-29CM); All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary to meet application process requirements and PCB layout tolerances; when mounting on a multilayer PCB, thermal vias at the exposed thermal pad land can improve thermal dissipation (reference EIA/JEDEC Standard JESD51-5) Copyright ©2001-2008, Allegro MicroSystems, Inc. The products described here are manufactured under one or more U.S. patents or U.S. patents pending. Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the failure of that life support device or system, or to affect the safety or effectiveness of that device or system. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. For the latest version of this document, visit our website: www.allegromicro.com Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 11