1/3 STRUCTURE Silicon Monolithic Integrated Circuit PRODUCT SERIES Single-Phase Full-Wave Motor Driver for Fan Motor TYPE ＢＨ６７６６ＦＶＭ FEATURES Soft switched drive 〇ABSOLUTE MAXIMUM RATINGS Symbol Limit Unit Supply voltage Vcc 7 V Power dissipation Pd 585＊ mW Topr -40～+105 ℃ Parameter Operating temperature Storage temperature Output current FG signal output current Tstg -55～+150 ℃ Iomax 630＊＊ mA IFG 5 mA 7 V 150 ℃ Unit V V VFG FG signal output voltage Tjmax Junction temperature ＊ Reduce by 4.68mW/℃ over 25℃. (On 70.0mm×70.0mm×1.6mm glass epoxy board) ＊＊ This value is not to exceed Pd. Vcc=4.0V～6.0V At Vcc=2.0V～4.0V,output current tolerance reduces. 〇OPERATING CONDITIONS Parameter Symbol Operating supply voltage range Vcc Limit 2.0～6.0 Hall input voltage range VH 0.4～Vcc-1.1 ＊This product is not designed for production against radioactive rays. REV. E 2/3 〇ELECTRICAL CHARACTERISTICS (Unless otherwise specified Ta=25℃,Vcc=5V) Min. Limit Typ. Max. Icc VHOFS - 5 - 8 ±6 mA mV VO - 0.6 0.9 V GIO VFGL IFGL VHYS VHB 45 ±5 1.1 48 ±10 1.3 51 0.3 5 ±15 1.5 dB V μA mV V Symbol Parameter Circuit current Input offset voltage Output voltage Unit Conditions Io＝250mA Upper and Lower total Input-output Gain FG low voltage FG leak current Input hysteresis voltage Hall bias voltage IFG=3mA VFG=7V IHB=-5mA 〇PACKAGE OUTLINES 0.29 ± 0.15 0.6 ± 0.2 8 2.8 ± 0.1 4.0 ± 0.2 2.9 ± 0.1 5 H 6 7 6 6 1 4 0.9Max. 0.75 ± 0.05 0.08 ± 0.05 0.475 Lot No. 0.145 +0.05 −0.03 0.22 +0.05 −0.04 0.08 M 0.08 S 0.65 MSOP8(UNIT:mm) 〇BLOCK DIAGRAM 〇Terminal name OUT2 GND 150kΩ 1 Pin No. 8 500Ω 1 2 3 4 5 6 7 8 + H+ 2 Hall Bias OUT1 7 TSD + HB - Vcc 500Ω 3 6 150kΩ H- 4 + - FG 5 REV. E Terminal name OUT2 H+ HB HFG Vcc OUT1 GND 3/3 〇CAUTIONS ON USE 1) Absolute maximum ratings An excess in the absolute maximum rations, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. 3) Power supply line Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a capacitor between power supply and GND for routing regenerated current. And fully ensure that the capacitor characteristics have no problem before determine a capacitor value. (when applying electrolytic capacitors, capacitance characteristic values are reduced at low temperatures) 4) GND potential The potential of GND pin must be minimum potential in all operating conditions. Also ensure that all terminals except GND terminal do not fall below GND voltage including transient characteristics. However, it is possible that the motor output terminal may deflect below GND because of influence by back electromotive force of motor. Malfunction may possibly occur depending on use condition, environment, and property of individual motor. Please make fully confirmation that no problem is found on operation of IC. 5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation(Pd) in actual operating conditions. 6) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 7) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 8) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO. 9) Thermal shut down circuit The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175℃(typ.) and has a hysteresis width of 25℃(typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an open state. TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operation this circuit or use the IC in an environment where the operation of this circuit is assumed. 10) Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 11) GND wiring pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. 12) Capacitor between output and GND When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it is possible that the current charged in the capacitor may flow into the output resulting in destruction. Keep the capacitor between output and GND below 100uF. 13) IC terminal input When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below GND is applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic element causes mutual interference between circuits, resulting in malfunction as well as destruction in the last. Do not use in a manner where parasitic element is actuated. REV. E Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. 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