DIODES BAS21TM

BAS21TM
Features
Mechanical Data
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Fast Switching Speed: max. 50ns
Continuous Reverse Voltage: max. 200V
Repetitive Peak Reverse Voltage: max. 250V
Repetitive Peak Forward Current: max. 1A
Small Surface Mount Package
For General Purpose Switching Applications
Lead Free/RoHS Compliant (Note 1)
"Green" Device (Notes 2 and 3)
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Case: SOT26
Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Copper Alloy
leadframe (Lead Free Plating). Solderable per MIL-STD-202,
Method 208
Orientation: See Diagram
Weight: 0.009 grams (approximate)
SOT26
Top View
Internal Schematic
Top View
Ordering Information (Notes 3)
Part Number
BAS21TM-7
Notes:
Case
SOT26
Packaging
3000/Tape & Reel
1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
YM
ADVANCE INFORMATION
SURFACE MOUNT HIGH VOLTAGE SWITCHING DIODE ARRAY
XJJ
XJJ = Product Type Marking Code
YM = Date Code Marking
Y =Year (ex: Z = 2012)
M = Month (ex: 9 = September)
Date Code Key
Year
2011
2012
2013
2014
2015
2016
2017
2018
Code
Y
Z
A
B
C
D
E
F
Month
Code
Jan
1
Feb
2
BAS21TM
Document number: DS35388 Rev. 3 - 2
Mar
3
Apr
4
May
5
Jun
6
1 of 4
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Jul
7
Aug
8
Sep
9
Oct
O
Nov
N
Dec
D
January 2012
© Diodes Incorporated
BAS21TM
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Non-Repetitive Peak Reverse Voltage
Symbol
VRM
VRRM
VRWM
VR
VR(RMS)
IFM
IO
RMS Reverse Voltage
Forward Continuous Current (Note 4)
Average Rectified Output Current (Note 4)
Non-Repetitive Peak Forward Surge Current
@ t = 10μs
@ t = 100μs
@ t = 10ms
IFSM
Unit
V
250
V
177
200
250
10
6
2
V
mA
mA
Value
300
417
-65 to +150
Unit
mW
°C/W
°C
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 4)
Thermal Resistance Junction to Ambient Air (Note 4)
Operating and Storage Temperature Range
Symbol
PD
RθJA
TJ, TSTG
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 5)
Symbol
V(BR)R
Min
250
⎯
⎯
Max
⎯
1.0
1.25
Unit
V
⎯
nA
μA
pF
ns
Forward Voltage
VF
Reverse Current (Note 5)
IR
Total Capacitance
CT
⎯
100
100
5
Reverse Recovery Time
trr
⎯
50
V
Test Condition
IR = 100μA
IF = 100mA
IF = 200mA
VR = 200V
VR = 200V, TJ = 150°C
VR = 0, f = 1.0MHz
IF = IR = 30mA,
Irr = 0.1 x IR, RL = 100Ω
4. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.5.
Short duration pulse test used to minimize self-heating effect.
300
Note 4
250
200
150
100
50
0
0
25
50
75
100
125
150 175
TA, AMBIENT TEMPERATURE (° C)
Fig. 1 Power Derating Curve, Total Package
BAS21TM
Document number: DS35388 Rev. 3 - 2
IF, INSTANTANEOUS FORWARD CURRENT (mA)
Notes:
PD, POWER DISSIPATION (mW)
ADVANCE INFORMATION
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Value
250
1,000
2 of 4
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100
10
1
0.1
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics, Per Element
January 2012
© Diodes Incorporated
100,000
2.0
T A = 150ºC
10,000
TA = 125ºC
1,000
T A = 85ºC
1.8
CT, TOTAL CAPACITANCE (pF)
IR, INSTANTANEOUS REVERSE CURRENT (nA)
ADVANCE INFORMATION
BAS21TM
100
TA = 25ºC
10
TA = -55ºC
1
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.1
0
0
50
100
150
200
250
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 3 Typical Reverse Characteristics, Per Element
1
10
100
Package Outline Dimensions
A
B C
H
K
M
J
L
D
SOT26
Dim Min Max Typ
A
0.35 0.50 0.38
B
1.50 1.70 1.60
C
2.70 3.00 2.80
D
⎯
⎯ 0.95
H
2.90 3.10 3.00
J
0.013 0.10 0.05
K
1.00 1.30 1.10
L
0.35 0.55 0.40
M
0.10 0.20 0.15
0°
8°
α
⎯
All Dimensions in mm
Suggested Pad Layout
C2
Z
C2
C1
G
Dimensions Value (in mm)
Z
3.20
G
1.60
X
0.55
Y
0.80
C1
C2
Y
2.40
0.95
X
BAS21TM
Document number: DS35388 Rev. 3 - 2
3 of 4
www.diodes.com
January 2012
© Diodes Incorporated
BAS21TM
IMPORTANT NOTICE
ADVANCE INFORMATION
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
www.diodes.com
BAS21TM
Document number: DS35388 Rev. 3 - 2
4 of 4
www.diodes.com
January 2012
© Diodes Incorporated