AD ADG820BRM 0.5 n cmos 1.8 v to 5.5 v 2:1 mux/spdt switch Datasheet

a
0.5 n CMOS
1.8 V to 5.5 V 2:1 Mux/SPDT Switches
ADG819/ADG820
FEATURES
Low On Resistance 0.8 n Max at 125°C
0.25 n Max On Resistance Flatness
1.8 V to 5.5 V Single Supply
200 mA Current Carrying Capability
Automotive Temperature Range: –40°C to +125°C
Rail-to-Rail Operation
6-Lead SOT-23 Package, 8-Lead /SOIC Package, and
6-Bump MicroCSP (Micro Chip Scale Package) ADG819
Fast Switching Times
Typical Power Consumption (<0.01 /W)
TTL-/CMOS-Compatible Inputs
Pin Compatible with the ADG719 (ADG819)
FUNCTIONAL BLOCK DIAGRAM
ADG819/
ADG820
S2
D
S1
IN
SWITCHES SHOWN
FOR A LOGIC “1” INPUT
APPLICATIONS
Power Routing
Battery-Powered Systems
Communication Systems
Data Acquisition Systems
Cellular Phones
Modems
PCMCIA Cards
Hard Drives
Relay Replacement
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The ADG819 and the ADG820 are monolithic, CMOS, SPDT
(single-pole, double-throw) switches. These switches are designed
on a submicron process that provides low power dissipation yet
gives high switching speed, low On resistance, and low leakage
currents.
2. 1.8 V to 5.5 V single-supply operation
Low power consumption and an operating supply range of 1.8 V
to 5.5 V make the ADG819 and ADG820 ideal for battery-pow­
ered, portable instruments.
1. Very low ON resistance, 0.5 Ω typical
3. High current carrying capability
4. Tiny 6-lead SOT-23 package, 8-lead µSOIC package,
and 2 × 3 bump 1.14 mm × 2.18 mm MicroCSP package
(ADG819 only)
Each switch of the ADG819 and the ADG820 conducts equally
well in both directions when on. The ADG819 exhibits break­
before-make switching action, thus preventing momentary shorting
when switching channels. The ADG820 exhibits make-before­
break action.
The ADG819 and the ADG820 are available in a 6-lead SOT-23
package and an 8-lead µSOIC package. The ADG819 is also
available in a 2 × 3 bump 1.14 mm × 2.18 mm MicroCSP
package. This chip occupies only a 1.14 mm × 2.18 mm area,
making it the ideal candidate for space-constrained applications.
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
www.analog.com
Fax: 781/326-8703
© Analog Devices, Inc., 2002
ADG819/ADG820–SPECIFICATIONS1 (V
Parameter
25°C
ANALOG SWITCH
Analog Signal Range
ON Resistance (RON)
DD =
5 V ± 10%, GND = 0 V.)
–40°C to –40°C to
+85°C
+125°C2
0 V to VDD
0.5
0.6
ON Resistance Match Between
Channels (∆RON)
ON Resistance Flatness (RFLAT(ON))
LEAKAGE CURRENTS
Source OFF Leakage IS (OFF)
Channel ON Leakage ID, IS (ON)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
IINL or IINH
0.06
0.08
0.1
0.17
± 0.01
± 0.25
± 0.01
± 0.25
0.7
0.8
0.1
0.12
0.2
0.25
Test Conditions/Comments
V
Ω typ
Ω max
VS = 0 V to VDD, IS = 100 mA;
Test Circuit 1
Ω typ
Ω max
Ω typ
Ω max
VS = 0 V to VDD, IS = 100 mA
VS = 0 V to VDD, IS = 100 mA
VDD = 5.5 V
VS = 4.5 V/1 V, VD = 1 V/4.5 V;
Test Circuit 2
VS = VD = 1 V, or VS = VD = 4.5 V;
Test Circuit 3
±3
± 10
±3
± 25
nA typ
nA max
nA typ
nA max
2.0
0.8
V min
V max
± 0.1
µA typ
µA max
pF typ
VIN = VINL or VINH
ns typ
ns max
ns typ
ns max
ns typ
ns min
RL = 50 Ω, CL = 35 pF,
VS = 3 V; Test Circuit 4
RL = 50 Ω, CL = 35 pF,
VS = 3 V; Test Circuit 4
RL = 50 Ω, CL = 35 pF,
VS1 = VS2 = 3 V; Test Circuit 5
RL = 50 Ω, CL = 35 pF,
VS = 3 V; Test Circuit 4
RL = 50 Ω, CL = 35 pF,
VS = 3 V; Test Circuit 4
RL = 50 Ω, CL = 35 pF,
VS = 0 V; Test Circuit 6
VS = 2.5 V, RS = 0 Ω, CL = 1 nF;
Test Circuit 7
RL = 50 Ω, CL = 5 pF, f = 100 kHz;
Test Circuit 8
RL = 50 Ω, CL = 5 pF, f = 100 kHz;
Test Circuit 10
RL = 50 Ω, CL = 5 pF; Test Circuit 9
f = 1 MHz
f = 1 MHz
0.005
CIN, Digital Input Capacitance
Unit
5
3
DYNAMIC CHARACTERISTICS
ADG819
tON
tOFF
Break-Before-Make Time Delay, tBBM
35
45
10
16
5
50
55
18
21
1
ADG820
tON
Make-Before-Break Time Delay, tMBB
10
18
26
40
15
Charge Injection
20
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
Off Isolation
–71
dB typ
Channel-to-Channel Crosstalk
–72
dB typ
Bandwidth –3 dB
CS (OFF)
CD, CS (ON)
17
80
300
MHz typ
pF typ
pF typ
tOFF
20
22
45
50
1
VDD = 5.5 V
Digital Inputs = 0 V or 5.5 V
POWER REQUIREMENTS
IDD
0.001
1.0
2.0
µA typ
µA max
NOTES
1
Temperature range is as follows: –40°C to +125°C.
2
ON resistance parameters tested with I S = 10 mA.
3
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
–2–
REV. 0
ADG819/ADG820
SPECIFICATIONS1(V
DD
= 2.7 V to 3.6 V, GND = 0 V.)
Parameter
25°C
ANALOG SWITCH
Analog Signal Range
ON Resistance (RON)
–40°C to –40°C to
+85°C
+125°C2
0 V to VDD
0.7
1.4
ON Resistance Match Between
Channels (∆RON)
1.5
1.6
0.13
0.13
LEAKAGE CURRENTS
Source OFF Leakage IS (OFF)
Channel ON Leakage ID, IS (ON)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
IINL or IINH
V
Ω typ
Ω max
VS = 0 V to VDD, IS = 100 mA;
Test Circuit 1
0.25
± 0.01
± 0.25
± 0.01
± 0.25
VS = 0 V to VDD, IS = 100 mA
VS = 0 V to VDD, IS = 100 mA
VDD = 3.6 V
VS = 3.3 V/1 V, VD = 1 V/3.3 V;
Test Circuit 2
VS = VD = 1 V, or VS = VD = 3.3 V;
Test Circuit 3
±3
± 10
±3
± 25
nA typ
nA max
nA typ
nA max
2.0
0.8
V min
V max
± 0.1
µA typ
µA max
pF typ
VIN = VINL or VINH
ns typ
ns max
ns typ
ns max
ns typ
ns min
RL = 50 Ω, CL = 35 pF,
VS = 1.5 V; Test Circuit 4
RL = 50 Ω, CL = 35 pF,
VS = 1.5 V; Test Circuit
RL = 50 Ω, CL = 35 pF,
VS1 = VS2 = 1.5 V; Test Circuit 5
RL = 50 Ω, CL = 35 pF,
VS = 1.5 V; Test Circuit 4
RL = 50 Ω, CL = 35 pF,
VS = 1.5 V; Test Circuit 4
RL = 50 Ω, CL = 35 pF,
VS = 1.5 V; Test Circuit 6
VS = 1.5 V, RS = 0 Ω, CL = 1 nF;
Test Circuit 7
RL = 50 Ω, CL = 5 pF, f = 100 kHz;
Test Circuit 8
RL = 50 Ω, CL = 5 pF, f = 100 kHz;
Test Circuit 10
RL = 50 Ω, CL = 5 pF; Test Circuit 9
f = 1 MHz
f = 1 MHz
0.005
5
CIN, Digital Input Capacitance
Test Conditions/Comments
Ω typ
Ω max
Ω typ
0.06
ON Resistance Flatness (RFLAT(ON))
Unit
3
DYNAMIC CHARACTERISTICS
ADG819
tON
tOFF
Break-Before-Make Time Delay, tBBM
40
60
10
16
40
65
70
18
21
1
ADG820
tON
Make-Before-Break Time Delay, tMBB
20
35
30
45
10
Charge Injection
10
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
Off Isolation
–71
dB typ
Channel-to-Channel Crosstalk
–72
dB typ
Bandwidth –3 dB
CS (OFF)
CD, CS (ON)
17
80
300
MHz typ
pF typ
pF typ
tOFF
40
45
50
55
1
POWER REQUIREMENTS
IDD
VDD = 3.6 V
Digital Inputs = 0 V or 3.6 V
0.001
1.0
2.0
NOTES
1
Temperature range is as follows: –40°C to +125°C.
2
ON resistance parameters tested with I S = 10 mA.
3
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
REV. 0
–3–
µA typ
µA max
ADG819/ADG820
ABSOLUTE MAXIMUM RATINGS 1
MicroCSP Package
!JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . . TBD
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . 300°C
IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . 235°C
(TA = 25°C, unless otherwise noted.)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog Inputs2 . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V or
. . . . . . . . . . . . . . . . . . . . . . . 30 mA, Whichever Occurs First
Digital Inputs2 . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V or
. . . . . . . . . . . . . . . . . . . . . . . 30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA
. . . . . . . . . . . . . . . . (Pulsed at 1 ms, 10% Duty Cycle Max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . 200 mA
Operating Temperature Range
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Automotive . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +125°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
µSOIC Package
!JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206°C/W
!JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 44°C/W
SOT-23 Package (4-Layer Board)
!JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 119°C/W
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma­
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2
Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
Table I. Truth Table for the ADG819/ADG820
IN
Switch S1
Switch S2
0
1
ON
OFF
OFF
ON
PIN CONFIGURATIONS
8-Lead µSOIC
(RM-8)
6-Lead SOT-23
(RJ-6)
2 X 3 MicroCSP
TOP VIEW
(BUMPS AT THE BOTTOM)
NOT TO SCALE
IN 1
VDD 2
ADG819/
ADG820
6
S2
D 1
5
D
S1 2
TOP VIEW
GND 3 (Not to Scale) 4 S1
8
S2
7
NC
1
6
TOP VIEW 6 IN
(Not to Scale)
5 NC
VDD 4
D
VDD
ADG819/
ADG820
GND 3
NC = NO CONNECT
S2
IN
2
5
S1
GND
3
4
ADG819 ONLY
ORDERING GUIDE
Model Option
Temperature Range
Brand1
Package Description
Package
ADG819BRM
ADG819BRT
ADG819BCB
ADG820BRM
ADG820BRT
–40°C to +125°C
–40°C to +125°C
–40°C to +85°C
–40°C to +125°C
–40°C to +125°C
SNB
SNB
SNB
SPB
SPB
µSOIC (MicroSmall Outline IC)
SOT-23 (Plastic Surface-Mount)
MicroCSP (Micro Chip Scale Package)
µSOIC (MicroSmall Outline IC)
SOT-23 (Plastic Surface-Mount)
RM-8
RJ-62
CB-62
RM-8
RJ-62
NOTES
1
Branding on these packages is limited to three characters due to space constraints.
2
Contact factory for availability.
–4–
REV. 0
ADG819/ADG820
TERMINOLOGY
VDD
GND
IDD
S
D
IN
RON
∆RON
RFLAT(ON)
IS (OFF)
ID, IS (ON)
VD (VS)
VINL
VINH
IINL(IINH)
CS (OFF)
CD, CS (ON)
tON
tOFF
tBBM
tMBB
Charge Injection
Crosstalk
OFF Isolation
Bandwidth
ON Response
Insertion Loss
Most Positive Power Supply Potential
Ground (0 V) Reference
Positive Supply Current
Source Terminal. May be an input or output.
Drain Terminal. May be an input or output.
Logic Control Input
Ohmic Resistance between D and S
ON Resistance Match between Any Two Channels, i.e., RON max – RON min
Flatness is defined as the difference between the maximum and minimum value of ON resistance as
measured over the specified analog signal range.
Source Leakage Current with the Switch OFF
Channel Leakage Current with the Switch ON
Analog Voltage on Terminals D, S
Maximum Input Voltage for Logic “0”
Minimum Input Voltage for Logic “1”
Input Current of the Digital Input
OFF Switch Source Capacitance
ON Switch Capacitance
Delay between applying the digital control input and the output switching ON.
Delay between applying the digital control input and the output switching OFF.
OFF time or ON time measured between the 90% points of both switches when switching
from one address state to another.
ON time measured between the 80% points of both switches when switching from one
address state to another.
A measure of the glitch impulse transferred from the digital input to the analog output during switching.
A measure of unwanted signal coupled through from one channel to another as a result of parasitic
capacitance.
A measure of unwanted signal coupling through an OFF switch.
Frequency at which the output is attenuated by –3 dB.
Frequency Response of the ON Switch
Loss due to the ON Resistance of the Switch
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although the ADG819/
ADG820 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
REV. 0
–5–
WARNING!
ESD SENSITIVE DEVICE
ADG819/ADG820 –Typical Performance Characteristics
1.0
1.0
VDD = 3V
TA = 25°C
0.9
VDD = 2.7V
TA = +125°C
0.8
0.8
0.7
ON RESISTANCE – n
ON RESISTANCE – n
TA = +85°C
VDD = 3V
0.6
0.5
VDD = 3.3V
0.4
VDD = 4.5V VDD = 5V
0.3
0.6
TA = +25°C
0.4
TA = –40°C
VDD = 5.5V
0.2
0.2
0.1
0
0
1
2
3
4
0
0
5
0.5
1.0
1.5
2.5
3.0
TPC 4. ON Resistance vs. VD (VS) for Different Temperatures
TPC 1. ON Resistance vs. VD (VS)
10
1.0
TA = 25°C
9 VDD = 1.8V
VDD = 5V
8
0.8
ON RESISTANCE – n
ON RESISTANCE – n
2.0
VD, VS – V
VD, VS – V
7
6
5
4
3
TA = +125°C
TA = +85°C
0.6
0.4
TA = +25°C
TA = –40°C
2
0.2
1
0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0
0
1.8
1
2
VD, VS – V
3
4
5
VD, VS – V
TPC 2. ON Resistance vs. VD (VS)
TPC 5. ON Resistance vs. VD (VS) for Different Temperatures
50
10
VDD = 3V, 5V
40
VDD = 3V
tON
VDD = 5V
6
TIME – ns
LEAKAGE CURRENTS – nA
8
4
ID, IS (ON)
30
20
2
–2
0
10
IS (OFF)
0
20
40
60
80
100
0
–40
120
TEMPERATURE – °C
VDD = 3V, 5V
tOFF
–20
0
20
40
60
80
100
120
TEMPERATURE – °C
TPC 3. Leakage Currents vs. Temperatures
TPC 6. tON/tOFF Times vs. Temperature (ADG819)
–6–
REV. 0
ADG819/ADG820
250
1
VDD = 3V, 5V
TA = 25°C
TA = 25°C
0
150
ATTENUATION – dB
CHARGE INJECTION – pC
200
100
VDD = 5V
50
VDD = 3V
0
–50
–1
–2
–3
–4
–100
–5
–150
–200
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
–6
0.2
5.0
1
FREQUENCY – MHz
TPC 7. Charge Injection vs. Source Voltage
TPC 10. ON Response vs. Frequency
0
1.8
VDD = 5V, 3V
–10 TA = 25°C
TA = 25°C
LOGIC THRESHOLD VOLTAGE – V
1.6
ATTENUATION – dB
–20
–30
–40
–50
–60
–70
–80
1
RISING
1.2
FALLING
1.0
0.8
0.6
0.4
0
2
FREQUENCY – MHz
1
2
3
4
5
TPC 11. Logic Threshold vs. Supply Voltage
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
0.1
0
VDD – V
TPC 8. OFF Isolation vs. Frequency
ATTENUATION – dB
1.4
0.2
–90
0.1
1
2
FREQUENCY – MHz
TPC 9. Crosstalk vs. Frequency
REV. 0
30
10
VS – V
–7–
6
ADG819/ADG820
Test Circuits
IDS
V1
S
VS
IS (OFF)
D
D
Test Circuit 1. ON Resistance
S
NC
VD
VS
RON = V1 / IOS
ID (ON)
ID (OFF)
S
D
NC = NO CONNECT
VD
Test Circuit 3. ON Leakage
Test Circuit 2. OFF Leakage
VDD
0.1/F
VIN
VDD
50%
90%
VOUT
VS
RL
50n
IN
50%
90%
CL
35pF
t OFF
t ON
GND
Test Circuit 4. Switching Times
VDD
0.1/F
VDD
VS1
VS2
S1
VIN
D
VOUT
RL
50n
S2
IN
VOUT
CL
35pF
90%
0V
50%
90%
t BBM
GND
VIN
50%
0V
t BBM
Test Circuit 5. Break-Before-Make Time Delay, tBBM (ADG819 Only)
VDD
0.1/F
VIN
VDD
VS1
VD
VS2
IN
VIN
RL2
300n
RL1
300n
CL2
35pF
CL1
35pF
VS1
VS2
0V
50%
50%
90%
80% VD
80% VD
t MBB
GND
Test Circuit 6. Make-Before-Break Time Delay, tMBB (ADG820 Only)
–8–
REV. 0
ADG819/ADG820
VDD
VOUT
VOUT
QINJ = CL X
VDD
RS
VS
SW OFF
VOUT
VIN
CL
1nF
IN
SW OFF
SW ON
SW ON
VIN
GND
SW OFF
Test Circuit 7. Charge Injection
VDD
0.1/F
VDD
NETWORK
ANALYZER
S
IN
50n
50n
VS
VOUT
D
RL
50n
GND
VIN
OFF ISOLATION = 20 LOG
VOUT
VS
Test Circuit 8. OFF Isolation
VDD
0.1/F
VDD
NETWORK
ANALYZER
S
IN
50n
VS
VOUT
D
RL
50n
GND
VIN
VOUT WITH SWITCH
INSERTION LOSS = 20 LOG
VOUT WITHOUT SWITCH
Test Circuit 9. Bandwidth
VDD
0.1/F
NETWORK
ANALYZER
VDD
S1
VOUT
RL
50n
50n
D
R
50n
S2
IN
VS
GND
CHANNEL-TO-CHANNEL CROSSTALK = 20 LOG
VOUT
VS
Test Circuit 10. Channel-to-Channel Crosstalk
REV. 0
–9–
VOUT
SW OFF
ADG819/ADG820
OUTLINE DIMENSIONS
6-Lead Plastic Surface-Mount Package
(RJ-6)
Dimensions shown in inches and (mm)
0.1220 (3.10)
0.1063 (2.70)
6
5
4
0.0709 (1.80)
0.0591 (1.50)
0.1181 (3.00)
0.0984 (2.50)
1
2
3
PIN 1
0.0374 (0.95)
BSC
0.0748
(1.90)
BSC
0.0512 (1.30)
0.0354 (0.90)
0.0571 (1.45)
0.0354 (0.90)
10°
0°
0.0197 (0.50) SEATING
0.0091 (0.23)
0.0098 (0.25) PLANE
0.0031 (0.08)
0.0059 (0.15)
0.0000 (0.00)
COPLANARITY
0.0217 (0.55)
0.0138 (0.35)
8-Lead /SOIC Package
(RM-8)
Dimensions shown in inches and (mm)
0.1220 (3.10)
0.1142 (2.90)
8
5
0.1988 (5.05)
0.1870 (4.75)
0.1220 (3.10)
0.1142 (2.90)
1
4
PIN 1
0.0256 (0.65) BSC
0.1201 (3.05)
0.1118 (2.84)
COPLANARITY
0.0059 (0.15)
0.0020 (0.05)
0.1201 (3.05)
0.1118 (2.84)
0.0429 (1.09)
0.0370 (0.94)
0.0181 (0.46)
0.0079 (0.20)
SEATING
PLANE
0.0110 (0.28)
0.0031 (0.08)
33°
27°
0.0280 (0.71)
0.0161 (0.41)
2 × 3 Array for MicroCSP
(CB-6)
Dimensions shown in millimeters and (inches)
0.44 (0.0173)
0.36 (0.0142)
0.28 (0.0110)
1.34 (0.0528)
1.14 (0.0449)
0.94 (0.0370)
PIN 1
IDENTIFIER
0.67 (0.0264)
0.57 (0.0224)
0.47 (0.0185)
SEATING
PLANE
0.32 (0.0126)
0.32 (0.0126)
NOM
0.50 (0.0197)
BALL PITCH
2.38 (0.0937)
2.18 (0.0858)
1.98 (0.0780)
0.59 (0.0232)
0.24 (0.0094)
0.22 (0.0087) COPLANARITY
0.20 (0.0079)
0.50 (0.0860)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
–10–
REV. 0
–11–
–12–
PRINTED IN U.S.A.
C02801–0–5/02(0)