NB3N2304NZ 3.3V 1:4 Clock Fanout Buffer Description The NB3N2304NZ is a low skew 1−to 4 clock fanout buffer, designed for high speed clock distribution such as in PCI−X applications. The NB3N2304NZ guarantees low output−to−output skew. Optimal design, layout and processing minimizes skew within a device and from device−to−device. The Output Enable (OE) pin forces the outputs LOW when LOW. http://onsemi.com MARKING DIAGRAM* 40N YWW AG Features Input/Output Clock Frequency up to 140 MHz Low Skew Outputs (100 ps) Output Enable Operating Range: VDD = 3.0 V to 3.6 V Ideal for PCI−X and networking clocks Packaged in 8−pin TSSOP, 4.4 mm x 3 mm Industrial Temperature Range These are Pb−Free Devices* TSSOP−8 DT SUFFIX CASE 948S XX M • • • • • • • • 1 DFN8 MN SUFFIX CASE 506AA A Y WW G 1 4 = Assembly Location = Year = Work Week = Pb−Free Package *For additional marking information, refer to Application Note AND8002/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Figure 1. Simplified Logic Diagram ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2007 January, 2007 − Rev. 1 1 Publication Order Number: NB3N2304NZ/D NB3N2304NZ Logic Control OE IN 1 8 Q4 OE 2 7 Q3 Q1 3 6 VDD GND 4 5 Q2 Q1 Q2 IN Q3 Q4 Figure 3. NB3N2304NZ Package Pinout (Top View) Figure 2. Block Diagram Table 1. PIN DESCRIPTION Pin # Pin Name Type 1 IN LVCMOS/LVTTL Input Clock Input 2 OE LVCMOS/LVTTL Input Output Enable for the clock outputs. Outputs are enabled when forced HIGH. Outputs are forced to logic LOW when OE is forced LOW. 3 Q1 LVCMOS/LVTTL Output 4 GND Power 5 Q2 (LV)CMOS/(LV)TTL Input 6 VDD Power 7 Q3 (LV)CMOS/(LV)TTL Output Clock Output 3 8 Q4 (LV)CMOS/(LV)TTL Input Clock Output 4 Description Clock Output 1 Negative Supply Voltage; Connect to Ground, 0 V Clock Output 2 Positive Supply Voltage (3.0 V to 3.6 V) Table 2. OE, OUTPUT ENABLE FUNCTION TABLE Inputs Outputs IN OE L L L H L L L H L H H H http://onsemi.com 2 NB3N2304NZ Table 3. ATTRIBUTES Characteristics ESD Protection Value Human Body Model Machine Model > 2kV > 200 V Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Flammability Rating Level 1 Oxygen Index: 28 to 34 UL 94 V−O @ 0.125 in Transistor Count 480 Devices Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Table 4. MAXIMUM RATINGS Symbol Parameter Rating Unit VDD + 0.5V V Input Voltage GND – 0.5 v VI v VDD + 0.5 V TA Operating Temperature Range, Industrial w −40 to v +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) qJC Thermal Resistance (Junction−to−Case) TSOL Wave Solder VDD Positive Power Supply VI Condition 1 Condition 2 GND = 0 V 0 lfpm 500 lfpm Pb−Free (Note 2) TSSOP−8 °C/W °C/W TSSOP−8 °C/W 265 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 2. EDEC standard multilayer board − 2S2P (2 signal, 2 power). http://onsemi.com 3 NB3N2304NZ Table 5. DC CHARACTERISTICS VDD = 3.0 V to 3.6 V, GND = 0 V, TA = −40°C to +85°C Symbol Characteristic Min Typ Max Unit 12 25 mA IDD Power Supply Current @ 66.66 MHz, Unloaded Outputs VOH Output HIGH Voltage − IOH = −24 mA −IOH = −12 mA VOL Output LOW Voltage −IOL = 24 mA −IOL = 12 mA VIH Input HIGH Voltage, IN and OE (Note 3) VIL Input LOW Voltage, IN and OE (Note 3) 0.8 V IIH Input HIGH Current, VIN = VDD −50 50 mA IIL Input LOW Current, VIN = 0 V −100 100 mA CIN Input Capacitance, IN, OE 7 pF 2.0 2.4 V 0.8 0.55 2.0 V V 5 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 3. IN input has a threshold voltage of VDD/2. Table 6. AC CHARACTERISTICS VDD = 3.0 V to 3.6 V, GND = 0 V, TA = −40°C to +85°C (Note 4) (Figure 4) Symbol Characteristic Min fin Input Clock Frequency DC tDCskew Duty Cycle Skew = t2 ÷ t1 (Figure 4) Measured at 1.5 V 40 tr/tf Output Rise and Fall Times; 0.8 V to 2.0 V tpd Propagation Delay, IN−to−Qn (Note 5) tskew Output−to−Output Skew; (Note 5) tpu Powerup Time for VDD to Reach Minimum Specified Voltage 2.5 0.05 Typ Max Unit 140 MHz 50 60 % 0.9 1.5 ns 3.5 5 ns 100 ps 50 ms NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. All outputs loaded equally with CL = 25 pF to GND. Duty cycle out = duty in. A 0.01 mF decoupling capacitor should be connected between VDD and GND. 5. Measured on rising edges at VDD B 2; all outputs with equal loading. http://onsemi.com 4 NB3N2304NZ t1 Duty Cycle Timing t2 1.5 V 1.5 V 1.5 V All Outputs Rise/Fall Time 2.0 V 0.8 V OUTPUT 2.0 V 0.8 V tr tf 3.3 V 0V Output−Output Skew 1.5 V OUTPUT 1.5 V OUTPUT tSKEW Input−Output Propagation Delay VDD/2 INPUT VDD/2 OUTPUT tpd Figure 4. Switching Waveforms ORDERING INFORMATION Device Package Shipping† NB3N2304NZDTG TSSOP−8 (Pb−Free) 100 Units / Rail NB3N2304NZDTR2G TSSOP−8 (Pb−Free) 2500 / Tape & Reel NB3N2304NZMNR4G* DFN8 (Pb−Free) 1000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *Contact a sales representative. http://onsemi.com 5 NB3N2304NZ PACKAGE DIMENSIONS TSSOP−8 CASE 948S−01 ISSUE B 8x 0.20 (0.008) T U K REF 0.10 (0.004) S 2X L/2 8 0.20 (0.008) T U B −U− 1 S T U S 5 L PIN 1 IDENT M J J1 4 V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. S ÇÇÇ ÉÉÉ ÉÉÉ ÇÇÇ ÉÉÉ K1 K A −V− SECTION N−N −W− C 0.076 (0.003) D −T− SEATING DETAIL E G PLANE P 0.25 (0.010) N M N P1 F DETAIL E http://onsemi.com 6 DIM A B C D F G J J1 K K1 L M P P1 MILLIMETERS MIN MAX 2.90 3.10 4.30 4.50 −−− 1.10 0.05 0.15 0.50 0.70 0.65 BSC 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ −−− 2.20 −−− 3.20 INCHES MIN MAX 0.114 0.122 0.169 0.177 −−− 0.043 0.002 0.006 0.020 0.028 0.026 BSC 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ −−− 0.087 −−− 0.126 NB3N2304NZ PACKAGE DIMENSIONS DFN8 CASE 506AA−01 ISSUE D D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B PIN ONE REFERENCE ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ 2X 0.10 C 2X 0.10 C TOP VIEW MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.10 1.30 2.00 BSC 0.70 0.90 0.50 BSC 0.20 −−− 0.25 0.35 A 0.10 C 8X DIM A A1 A3 b D D2 E E2 e K L E 0.08 C (A3) SIDE VIEW A1 SEATING PLANE C D2 e e/2 4 1 8X L E2 K 8 5 8X b 0.10 C A B 0.05 C NOTE 3 BOTTOM VIEW ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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