LANSDALE MC12079D 2.8 ghz prescaler mecl pll components ã·64/128/256 prescaler Datasheet

ML12079
2.8 GHz Prescaler
MECL PLL Components
÷64/128/256 Prescaler
Legacy Device: Motorola MC12079
The ML12079 is a single modulus divide by 64, 128, 256 prescaler
for low power frequency division of a 2.8 GHz (typical) high frequency input signal. Divide ratio control inputs SW1 and SW2 select the
required divide ratio of ÷64, ÷128, or ÷256.
An external load resistor is required to terminate the output. A 1.2
kΩ resistor is recommended to achieve a 1.6 Vpp output swing, when
dividing a 1.1 GHz input signal by the minimum divide ratio of 64,
assuming a 12 pF load. Output current can be minimized dependent
on conditions such as output frequency, capacitive load being driven,
and output voltage swing required. Typical values for load resistors
are included in the Vout specification for various divide ratios at 2.8
GHz input frequency.
•
•
•
•
2.8 GHz Toggle Frequency
Supply Voltage 4.5 to 5.5 V
Low Supply Current 9mA Typical at VCC = 5.0 V
Operating Temperature Range of TA = –40 to 85°C
NOTE:
SW2
Divide Ratio
H
H
64
H
L
128
L
H
128
L
L
256
1
SO 8 = -5P
PLASTIC PACKAGE
CASE 751
8
1
P DIP 8 = PP
PLASTIC PACKAGE
CASE 626
FUNCTIONAL TABLE
SW1
8
CROSS REFERENCE/ORDERING INFORMATION
MOTOROLA
PACKAGE
LANSDALE
P DIP 8
MC12079P
ML12079PP
SO 8
MC12079D
ML12079-5P
Note: Lansdale lead free (Pb) product, as it
becomes available, will be identified by a part
number prefix change from ML to MLE.
SW1 & SW2: H = VCC, L = Open.
MAXIMUM RATINGS
Characteristic
Power Supply Voltage, Pin 2
Operating Temperature Range
Storage Temperature Range
Maximum Output Current, Pin 4
Symbol
Range
Unit
VCC
–0.5 to 7.0
Vdc
TA
–40 to 85
°C
Tstg
–65 to 150
°C
IO
4.0
mA
PIN CONNECTIONS
IN
VCC
SW1
OUT
1
8
2
7
3
6
4
5
IN
NC
SW2
Gnd
(Top View)
Page 1 of 4
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Issue A
ML12079
LANSDALE Semiconductor, Inc.
ELECTRICAL CHARACTERISTICS (VCC = 4.5 to 5.5 V; TA = –40 to 85°C, unless otherwise noted.)
Parameter
Symbol
Min
Typ
Max
Unit
ft
0.25
3.4
2.8
GHz
ICC
–
9.0
11.5
mA
Vin
400
100
–
–
1000
1000
mVpp
Divide Ratio Control Input High (SW)
VIH
VCC
VCC
VCC
V
Divide Ratio Control Input Low (SW)
VIL
Open
Open
Open
–
Output Voltage Swing
Vout
1.0
1.6
–
Vpp
Toggle Frequency (Sine Wave)
Supply Current Output (Pin 2)
Input Voltage Sensitivity
250–500 MHz
500–2800 MHz
(CL = 12 pF; RL = 1.2 kΩ; IO = 2.7 mA)1
(CL = 12 pF; RL = 2.2 kΩ; IO = 1.5 mA)2
(CL = 12 pF; RL = 3.9 kΩ; IO = 0.85 mA)3
NOTES: 1. Divide ratio of ÷64 at 2.8 GHz.
2. Divide ratio of ÷128 at 2.8 GHz.
3. Divide ratio of ÷256 at 2.8 GHz.
Figure 1. Logic Diagram (ML12079)
In
In
D
QB
D
Q
D
QB
C
Q
C
QB
C
Q
D
QB
D
QB
D
QB
C
Q
C
Q
C
Q
D
Q
D
QB
C
QB
C
Q
Out
SW2
SW1
Figure 2. AC Test Circuit
VCC = 4.5 to 5.5 V
C3
SINE WAVE GENERATOR
C1
VCC
IN
SW1
50 Ω
SW2
C2
IN
OUT
GND
Page 2 of 4
CL
www.lansdale.com
RL
EXTERNAL COMPONENTS
C1 = C2 = 1000 pF
C3 = 0.1 µF
CL = 12 pF (Including Scope and Jig Capacitance)
RL = 1.2 kΩ (for ÷64 at 2.8 GHz)
Issue A
ML12079
LANSDALE Semiconductor, Inc.
Figure 3. Input Signal Amplitude versus Input Frequency
+15.0
+1257.40
+10.0
+707.11
+5.0
+397.64
0
+223.61
OPERATING
WINDOW
+125.74
–10.0
+70.71
–15.0
+39.76
–20.0
+22.36
–25.0
+12.57
–30.0
+7.07
–35.0
+3.98
–40.0
+2.24
–45.0
+1.26
–50.0
0
400
800
1200
1600
2000
2400
2800
3200
mVrms
AMPLITUDE (dBm)
–5.0
+0.71
3600
FREQUENCY (MHz)
Divide Ratio = 64; VCC = 5.0 V; TA = 25°C
Figure 4. Output Amplitude versus Input Frequency
2000
1200
800
mVpp
1600
400
0
400
800
1200
1600
2000
2400
2800
3200
0
3600
FREQUENCY (MHz)
Page 3 of 4
www.lansdale.com
Issue A
ML12079
LANSDALE Semiconductor, Inc.
OUTLINE DIMENSIONS
8
P DIP 8 = PP
PLASTIC PACKAGE
(ML12079PP)
CASE 626–05
ISSUE K
5
–B–
1
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4
F
–A–
NOTE 2
L
DIM
A
B
C
D
F
G
H
J
K
L
M
N
C
J
–T–
N
SEATING
PLANE
D
M
K
G
H
0.13 (0.005)
T A
M
B
M
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
C
5
0.25
H
E
M
B
M
1
4
h
B
X 45
e
A
C
SEATING
PLANE
L
0.10
A1
B
0.25
M
C B
S
A
INCHES
MIN
MAX
0.370
0.400
0.240
0.260
0.155
0.175
0.015
0.020
0.040
0.070
0.100 BSC
0.030
0.050
0.008
0.012
0.115
0.135
0.300 BSC
–––
10
0.030
0.040
M
SO 8 = -5P
PLASTIC PACKAGE
(ML12079-5P)
CASE 751–06
ISSUE T
D
A
MILLIMETERS
MIN
MAX
9.40
10.16
6.10
6.60
3.94
4.45
0.38
0.51
1.02
1.78
2.54 BSC
0.76
1.27
0.20
0.30
2.92
3.43
7.62 BSC
–––
10
0.76
1.01
S
DIM
A
A1
B
C
D
E
e
H
h
L
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.35
0.49
0.19
0.25
4.80
5.00
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0
7
Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s
technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.
Page 4 of 4
www.lansdale.com
Issue A
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