Panasonic ECEA160UR33W Aluminium electrolytic capacitors/su Datasheet

Aluminium Electrolytic Capacitors/SU
( Radial Lead Type)
Series: SU
Discontinued
Type: A
■ Features Life time:85°C 2000h
■Specifications
Operating Temp. Range
Rated W.V. Range
-40 to +85°C
6.3 to 100V.DC
0.1 to 15000 µF
Nominal Cap. Range
Capacitance Tolerance
-25 to +85°C
160 to 450V.DC
0.47 to 220 µF
20% (120Hz/+20°C)
I <0.03 CV or 4 ( µA) after 1 minutes
I <0.01 CV or 3 ( µA) after 2 minutes
DC Leakage Current
I <0.06 CV + 10 ( µA) after 2 minutes
( Whichever is the greater )
W.V. (V)
tan δ
tan δ
6.3 10 16 25 35 50 63 100 160 200 250 350 400 450
0.22 0.19 0.16 0.14 0.12 0.10 0.09 0.08 0.16 0.18 0.18 0.20 0.20 0.20
Add 0.02 per 1000 µF for products of 1000 µF or more. (120 Hz/+20°C )
W.V. (V)
Z(-25°C)/Z(+20°C)
Z(-40°C)/Z(+20°C)
Characteristics at
Low Temperature
6.3
4
8
10
3
6
16
2
4
25
2
4
35
2
3
50
2
3
1.Add 0.5 per 1000 µF for products of 1000 µF or more.
2.Add 1.0 per 1000 µF for products of 1000 µF or more.
63
2
3
100 160 200 250 350 400 450
2
2
2
3
5 15 15
3
-
(Impedance ratio at 120Hz)
After applying rated working voltage for 2000 hours at +85°C and then being stabilized at +20°C,
capacitor shall meet the following limits.
Capacitance change
tan δ
DC leakage current
Endurance
±20% of initial measured value
<150% of initial specified value
< lnitial specified value
After storage for 1000 hours at +85°C with no voltage applied and then being
stabilized at +20°C, capacitor shall meet the limits specified in -Endurance-.
Shelf Line
■ Explanation of Part Number
E
C
E
A
Common code
U
Shape
W.V. code
Series
Capacitance code
Suffix
■ Dimensions in mm (not to scale)
φ8>
φ10<
P.V.C. Sleeve
φd±0.05
Vent
P± 0.5
P± 0.5
(>6.3mmdia)
L
L <16:L+1.0 max
L >20:L+2.0 max
Body Dia. φD
14 min
φD+0.5 max.
3 min
Lead Dia. φd
5
0.5
6.3
0.5
8
0.6
10
0.6
12.5
0.6
16
0.8
18
0.8
Lead space P
2
2.5
3.5
5
5
7.5
7.5
φD+0.5 max.
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.
Mar. 2005
Ñ EE1 Ñ
Aluminium Electrolytic Capacitors/SU
Discontinued
■ Case size / Ripple current
W.V. (V)
Cap. ( F)
6.3 (0J)
10 (1A)
16 (1C)
25 (1E)
DxL(mm)(mA) r.m.s (120Hz/+85°C)
35 (1V)
50 (1H)
63(1J)
0.1 (0R1)
5
x 11
1.3
0.22 (R22)
5
x 11
2.9
0.33 (R33)
5
x 11
4.4
0.47 (R47)
5
x 11
5
1.0 (010)
5
x 11
10
2.2 (2R2)
5
x 11
20
3.3 (3R3)
5
x 11
35
4.7 (4R7)
5
x 11
45
60
5
x 11
65
5
95
5
x 11
100
105
10
(100)
22
(220)
33
(330)
47
(470)
100
(101)
5
220
(221)
6.3 x 11.2
330
(331)
6.3 x 11.2
470
(471)
8
1000
2200
3300
4700
6800
10000
15000
x 11
x 11.5
(102) 10 x 12.5
(222) 12.5 x 20
(332) 12.5 x 20
(472) 16
(682) 16
x 25
(103) 16
(153) 18
x 31.5
x 25
x 35.5
W.V. (V)
Cap. ( F)
130
240
300
380
580
890
1020
1170
1270
1450
1700
5
1.0 (010)
5
2.2 (2R2)
5
3.3 (3R3)
5
4.7 (4R7)
x 11
x 11
x 11
x 11
10
(100)
x 11
6.3 x 11.2
22
(220)
8
33
(330) 10
(470) 10
100
220
330
470
150
x 11.5
x 16
400
8
10
12.5 x 20
12.5 x 25
16 x 25
5
250
330
630
920
1090
1200
x 31.5 1400
x 35.5 1600
16
18
100( 2A)
0.47 (R47)
47
x 11
6.3 x 11.2
8 x 11.5
5
160 (2C)
10
5
20
6.3 x 11.2
x 11
5
x 11
90
11
110
5
x 11
110
110
6.3 x 11.2 110
6.3 x 11.2
6.3 x 11.2
11
130
5
x 11
130
130
6.3 x 11.2 130
8
x 11.5
160
11.2
180
6.3 x 11.2
210
8
x 12.5
270
11.5
280
8
x 11.5
x 11.5 250 10
400 10
x 16
x 20
450
11.5
350 10
x 12.5
500 12.5 x 20
650 12.5 x 25
550
400 (2G)
450(2W)
12.5
20
25
25
31
8
40
10
x 11.5 36
x 12.5 45
66
10
x 16
10
x 20
13
110
x 20
144
x 16
(101) 12.5 x 20
(221) 16 x 25
180 ❉12
350 16
x 20
180
(331) 16
(471) 16
700
550 ❉18
x 25
5
5 x 11
6.3 x 11.2
180 8 x 11.5
310 10 x 12.5
390 10 x 16
350 10
440 10
x 20
480 10
70
130
750
x 31.5 1100
35.5 1600
40 ❉ 6.3 x 11.2
8 x 11.5
50
x 12.5
5
x 35.5 1500
31.5 1360 18
22
10
50
x 20
550 12.5 x 20
680 12.5 x 20
900 16 x 25 1050 16
850 12.5 x 25
1000 16 x 25
1200 16 x 31.5 1250 18 x 35.5 1300
1200 16 x 31.5 1300 18 x 35.5 1400
x 16
440 10
200 (2D)
x 16
x 25
x 31.5
11
75
6.3 x 11.2
70
x 11
x 11
30
6.3 x 11.2 16
6.3 x 11.2 27
30
x 11
x 11
5
11
250 (2E)
350 (2V)
9.5
115 ❉10
145 ❉10
x 11.5
x 12.5
5 x
5 x
5 x
5 x
6.3 x
8 x
8 x
10 x
10 x
12.5 x
16 x
16 x
18 x
300
x 31.5 510
❉12.5 x 20
12.5 x 25
16
6.3 x 11.2
x 11.5
10 x 12.5
10 x 12.5
8
72 ❉10 x 16
126 ❉12.5 x 20
12.5 x 25
160
16 x 25
193
18 6.3 x 11.2
18
31 10
x 12.5
28
40 10
x 16
35
49 10
x 16
40
81 10
x 20
70
8 x 11.5
10 x 12.5
18 10
28 10
x 12.5
19
x 16
29
10 x 16
10 x 16
35 10 x 20
45 12.5 x 20
35
70 12.5 x 25
110 16 x 31.5
144 12.5 x 25
110
171 16
x 25
140
12.5x 20
16 x 25
16 x 25
210 16
x 31.5
170
16 x 31.5
140 18
170
50
75
110
x 31.5
150
Case size
Ripple
Current
x 31.5 330 ❉ 18 x 31.5 320
900
(
) shows W.V. and capacitance code
❉ Place suffix “W” at the end of Part No.
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.
Mar. 2005
Ñ EE2 Ñ
Aluminum Electrolytic Capacitor
Application Guidelines
1.2 Operating Temperature and Life Expectancy
1. Circuit Design
E n s u r e t h a t operational and mounting conditions
follw the specified conditions detailed in the catalog
and specification sheets.
1.1 Operating Temperature and Frequency
E l e c t r o l y t i c c a p a c i t o r e l e c t r i c a l p a ra m e t e r s a r e
normally specified at 20°C temperature and 120Hz
frequency. These parameter s var y with changes in
t e m p e r a t u r e a n d f r e q u e n c y. C i r c u i t d e s i g n e r s
should take these changes into consideration.
(1) Effects of o p e ra t i n g t e m p e ra t u r e on electrical
parameters
a ) A t h i g h e r t e m p e ra t u r e s, l e a k a g e c u r r e n t a n d
c a p a c i t a n c e i n c r e a s e while equivalent series
resistance(ESR) decreases.
b)At l o w e r t e m p e r a t u r e s , l e a k a g e c u r r e n t a n d
c a p a c i t a n c e decrease while equivalent series
resistance(ESR) increases.
(2) Effects of fr e q u e n c y on e l e c t r i c a l p a r a m e t e r s
a)At higher frequencies, capacitance and
impedance decrease while tan δ increases.
b)At lower frequencies, r ipple current generated
heat will ri s e d u e t o a n increase in equivalent
series resistance (ESR).
(1) Expected life is affected by operating temperature.
Generally, each 10°C reduction in temperature
will double the expected life. Use capacitors at
the lowest possible temperature below the
maximum guaranteed temperature.
(2) I f o p e ra t i n g c o n d i t i o n s ex c e e d t h e m a x i m u m
guaranteed limit, rapid eIectrical parameter
deterioration will occur, and irreversible damage
will result.
Check for maximum capacitor operating temperatures including ambient temperature, inter nal
capacitor temperature rise caused by ripple current,
a n d t h e e f fe c t s o f r a d i a t e d h e a t f r o m p ow e r
transistors, IC?s or resistors.
Avoid placing components which could conduct
heat to the capacitor from the back side of the circuit
board.
(3)The formula for calculating expected Iife at lower
operating temperatures is as fllows;
L2 = L1 x 2
4
100
90
80
Initial failure period
Random failure period
1
70
Failure rate
Capacitor Ambient Temperature
24h
3
60
50
40
(h)
operatYears
ion
8h/d Years
■ Failure rate curve
1. 85°C2000h
2.105°C1000h
3.105°C2000h
4.105°C5000h
120
2
2000
where,
L1: Guaranteed life (h) at temperature, T1° C
L2: Expected life (h) at temperature,T2°C
T1: Maximum operating temperature (°C)
T2: Actual operating temperature, ambient
temperature + temperature rise due to
ripple currentheating(°C)
A quick eference capacitor guide for estimating
exected life is included for your reference.
■ Expected Life Estimate Quick Reference Guide
110
T1-T2
10
5000
10,000
20,000
1
2
3
3
6
10
Wear failure period
Life Time
50,000 100,000 200,000
4 5
7
15 20
20
Time
30
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.
– EE16 –
Mar. 2005
Aluminum Electrolytic Capacitor
■ Typical failure modes and their factors
Faliure mode
Faliure mechanism (internal phenomenon)
Production factor
Application factor
Overvoltage applied
Increase in
internal pressure
Vent operates
Capacitance
reduction
Increase in inter•
nal temperature
•
Reduced anode foil
capacitance
•
•
•
•
•
Reduced cathode
foil capacitance
tan d increase
•
Excessive ripple current
•
Reverse voltage applied
•
Severe charging-discharging
AC voltage applied
•
Defect of oxide film
•
•
•
Deterioration of
oxide film
Leakage current
increase
•
Used for a high temperature
Insufficient
electrolyte
•
•
Used for a long period of time
Electrolyte evaporation
•
Insulation breakdown of film
or electrolytic paper
Short circuit
Metal particles
in capacitor
•
•
•
Stress applied to leads
Burr(s) on foil leads
Leads improperly
connected
Leads improperly connected
Open
•
•
Mechanical stress
•
Use of Halogenated solvent
Corrosion
•
Infiltration of Cl
Use of adhesive
Use of coating material
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.
Mar. 2005
– EE17 –
Aluminum Electrolytic Capacitor
1.3 Common Application Conditions to Avoid
The following misapplication load conditions will
cause rapid deter ioration to capacitor electr ical
p a r a m e t e r s. l n a d d i t i o n , ra p i d h e a t i n g a n d g a s
generation within the capacitor can occur causing
the pressure relief vent to operate and resuItant
leakage of electrolyte. Under extreme conditions,
explosion and fire could result. Leakinq electrolyte
is combustible and electrically conductive.
The vinyl sleeve of the capacitor can be damaged
i f s o l d e r p a s s e s t h r o u g h a l e a d h o l e for
subsequently processed parts. Special care when
locating hole positions in proximity to capacitors is
recommended.
(3) Circuit Board Hole Spacing
The circuit board holes spacing should match the
capacitor lead wire spacing within the specified
tolerances. Incorrect spacing can cause excessive
lead wire stress during the insertion process. This
may resuIt in premature capacitor failure due to
short or open circuit, increased leakage current,
or electrolyte leakage.
(1) Reverse Voltaqe
DC capacitors have polarity. Verify correct polarity
before inser tion. For circuits with changing or
uncertain polarity,use DC bipolar capacitors. DC
bipolar capacitors are not suitable for use in AC
circuits.
(4)Land/Pad Pattern
The circuit board land/pad pattern size for chip
capacitors is specified in the following table.
(2) Charqe/Discharqe Applications
Standard capacitors are not suitable for use in
repeating charge/discharge applications. For
charqe/discharqe applications consult us and advise
actual conditions.
[ Table of Board Land Size vs. Capacitor Size ]
(3) Overvoltage
c
Do not appIy voltaqes exceeding the maximum
specified rated voltages. Voltage up to the surge
voltage rating are acceptable for short periods of
time. Ensure that the sum of the DC voltage and
the superimposed AC ripple vo l t a g e does not
exceed the rated voltage.
b
(4) Ripple Current
(1) Capacitors Connected in Parallel
The circuit resistance can closely approximate the
ser ies resistance of the capacitor causing an
imbalance of ripple current loads w i t h in the
capacitors. Careful design of wiring methods can
minimize the possibility of excessive ripple currents
applied to a capacitor.
b
Size
A(φ3)
B(φ4)
C(φ5)
D(φ6.3)
E(φ8 x 6.2L)
F(φ8 x 10.2L)
G(φ10 x 10.2L)
Do not apply ripple currents exceeding the maximum
specified value. For high ripple current applications,
use a capacitor designed for high rippIe currents
or contact us with your requirements.
Ensure that allowable ripple currents superimposed
on low DC bias voltages do not cause reverse voltage
conditions.
1.4 Using Two or More Capacitors in Series
or Parallel
a
Board land part
a
0.6
1.0
1.5
1.8
2.2
3.1
4.6
b
2.2
2.5.
2.8
3.2
4.0
4.0
4.1
(mm)
c
1.5
1.6
1.6
1.6
1.6
2.0
2.0
Among others, when the size a is wide , back fillet can
not be made, decreasing fitting strength.
❉ Decide considering mounting condition, solderability
and fitting strength, etc. based on the design
standards of your company.
(2) Capacitors Connected in Series
Normal DC leakage current differences among
capacitors can cause voltage imbalances. The use
of voltage divider shunt resistors with consideration
to leakage currents, can prevent capacitor voltage
imbaIances.
1.5 Capacitor Mounting Considerations
(1) DoubIe - Sided Circuit Boards
Avoid wiring Pattern runs which pass between
the mounted capacitor and the circuit board. When
dipping into a solder bath, excess solder may collect
u n d e r t h e c a p a c i t o r by c a p i l l a r y a c t i o n a n d
shortcircuit the anode and cathode terminals.
(2) Circuit Board Hole Positioning
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.
– EE18 –
Mar. 2005
Aluminum Electrolytic Capacitor
(5)Clearance for Case Mounted Pressure
Relief Vents
2. Capacitor Handling Techniques
2.1 Considerations Before Using
Capacitors with case mounted pressure relief vents
require sufficient clearance to allow for proper vent
operation. The minimum clearances are dependent
on capacitor diameters as follows.
f6.3 to f16 mm : 2 mm minimum,
f18 to f35 mm : 3 mm minimum.
f40 mm or greater: 5 mm minimum
(6)Clearance for Seal Mounted Pressure
Relief Vents
A hole in the circuit board directly under the seal
vent location is required to allow proper release
of pressure.
(7)Wiring Near the Pressure Relief Vent
Avoid locating high voltage or high current wiring
or circuit board paths above the pressure relief
vent. Flammable, high temperature gas exceeding
100°C may be released which could dissolve the
wire insulation and ignite.
(8)Circuit Board Patterns Under the Capacitor
Avoid circuit board runs under the capacitor as
electrolyte leakage could cause an electrical short.
(9)Screw Terminal Capacitor Mounting
Do not orient the capacitor with the screw terminal
side of the capacitor facing downwards.
● Tighten the terminal and mounting bracket screws
within the torque range specified in the
specification.
●
1.6Electrical Isolation of the Capacitor
Completely isolate the capacitor as follows.
● Between the cathode and the case (except for
axially leaded B types) and between the anode
terminal and other circuit paths.
● Between the extra mounting terminals (on T types)
and the anode terminal, cathode terminal, and
other circuit paths.
1.7 Capacitor Sleeve
The vinyl sleeve or laminate coating is intended for
marking and identification purposes and is not meant
to electrically insulate the capacitor.
The s l e e v i n g may split or crack if immersed into
solvents such as toluene or xylene, and then exposed
to high temperatures.
(1) Capacitors have a finite life. Do not reuse or
recycle capacitors from used equipment.
(2) Transient recovery voltage may be generated in
the capacitor due to dielectric absorption. If
required, this voltage can be discharged with a
resistor with a value of about 1 kΩ.
(3) Capacitors stored for long periods of time may
exhibit an increase in leakage current. This can
be corrected by gradually applying rated voltage
in series with a resistor of approximately 1 kΩ.
(4) If capacitors are dropped, they can be damaged
mechanically or electrically. Avoid using dropped
capacitors.
(5) Dented or crushed capacitors should not be
used. The seal integrity can be compromised
and loss of electrolyte/shortened life can result.
2.2 Capacitor Insertion
(1) Verify the correct capacitance and rated voltage
of the capacitor.
(2) Verify the correct polarity of the capacitor before
inserting.
(3) Verify the correct hole spacing before insertion
(land pattern size on chip type) to avoid stress
on the terminals.
(4) Ensure that the auto insertion equipment lead
clinching operation does not stress the capacitor
leads where they enter the seal of the capacitor.
For chip type capacitors, excessive mounting
pressure can cause high leakage current, short
circuit, or disconnection.
2.3 Manual Soldering
(1) O b s e r v e t e m p e r a t u r e a n d t i m e s o l d e r i n g
specifications or do not exceed temperatures of
350°C for 3 seconds or less.
(2) If lead wires must be formed to meet terminal
board hole spacing, avoid stress on the leadwire
where it enters the capacitor seal.
(3) If a soldered capacitor must be removed and
reinserted, avoid excessive stress to the capacitor
leads.
(4) Aviod touching the tip of the soldering iron to the
capacitor, to prevent melting of the vinyl sleeve.
Always consider safety when designing equipment
and circuits. Plan for worst case failure modes such
as short circuits and open circuits which could occur
during use.
(1)Provide protection circuits and protection devices
to allow safe failure modes.
(2)Design redundant or secondary circuits where
possible to assure continued operation in case of
main circuit failure.
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.
Mar. 2005
– EE19 –
Aluminum Electrolytic Capacitor
2.4
Flow Soldering
(1) Don not immerse the c a p a c i t o r body into the
solder bath as excessive internal pressure could
result.
(2) Observe proper soldering conditions (temperature,
time, etc.). Do not exceed the specified limits.
(3) Do not allow other parts or components to touch
the capacitor during soldering.
2.5
2.6 Other Soldering Considerations
Rapid temperature rises during the preheat
operation and resin bonding operation can cause
cracking of the capacitor vinyl sleeve. For heat
curing, do not exceed 150°C for a maximum time of
2 minutes.
2.7 Capacitor Handling after Soldering
Reflow Soldering for Chip Capacitors
(1) For reflow, use a thermal conduction system such
as infrared radiation (IR) or hot blast. Vapor heat
transfer systems (VPS) are not recommended.
(2) Observe proper soldering conditions (temperature,
time, etc.). Do not exceed the specified limits.
(3) Reflow should be performed one time. Consult us
for additional reflow restrictions.
(1) Avoid movement of the capacitor after soldering
to prevent excessive stress on the leadwires
where they enter the seal.
(2) Do not use the capacitor as a handle when
moving the circuit board assembly.
(3) Avoid striking the capacitor after assembly to
prevent failure due to excessive shock.
Parts upper part temperature (°C)
5 (s)
250
Peak
temperature
200
150
160°C
Time in
200°C or more
120 (s)
100
50
Time
Peak temperature (°C)
Chip capacitor reflow guaranteed condition
240
230
220
210
10
20
30
40
50
60
Time in 200°C or more (s)
(φ3 to 6.3φ)
Peak temperature (°C)
Circuit Board Cleaning
(1) Circuit boards can be immersed or ultrasonically
cleaned using suitable cleaning solvents for up
to 5 minutes and up to 60°C maximum
temperatures. The boards should be thoroughly
rinsed and dried.
Recommended cleaning solvents include
Pine Alpha ST-100S, Sunelec B-12, DK Beclear
CW-5790, Aqua Cleaner 210SEP, Cold Cleaner
P3-375, Telpen Cleaner EC-7R, Clean-thru 750H,
Clean-thru 750L, Clean thru 710M, Techno
Cleaner 219, Techno Care FRW-17, Techno
Care FRW-1, Techno Care FRV-1, IPA (isopropyl
alcohol)
✽ The use of ozone depleting cleaning agents are
not recommended in the interest of protecting
the environment.
0
240
230
220
210
0
10
20
30
40
50
60
Time in 200°C or more (s)
(φ8 to φ10)
Peak temperature (°C)
2.8
EB Series
240
230
220
(2) Avoid using the following solvent groups unless
specifically allowed for in the specification;
● Halogenated cleaning solvents: except for solvent
resistant capacitor types, halogenated solvents
can p e r m e a t e t h e s e a l a n d c a u s e i n t e r n a l
capacitor corrosion and failure. For solvent
resistant capacitors, carefully follow the
temperature and time requirements of the
specificaion. 1-1-1 trichloroe thane should never
be used on any aluminium electrolytic capacitor.
● Alkali solvents: could attack and dissolve the
aluminum case.
● Petroleum based solvents: deterioration of the
rubber seal could result.
● Xylene: deterioration of the rubber seal could
result.
● Acetone: removal of the ink markings on the
vinyl sleeve could result.
210
0
10
20
30
40
50
Time in 200°C or more (s)
(φ10 to φ18)
60
✽ Temperature measuring method: Measure
temperature in assuming quantitative production, by
sticking the thermo-couple to the capacitor upper
part with epoxy adhesives.
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.
– EE20 –
Mar. 2005
Aluminum Electrolytic Capacitor
(3) A thorough drying after cleaning is required to
remove residual cleaning solvents which may be
trapped b e t w e e n the capacitor and the circuit
board. Avoid drying temperatures which exceed
the maximum rated temperature of the capacitor.
(4) Monitor the contamination levels of the cleaning
solvents during use by electrical conductivity, pH,
specific gravity, or water content. Chlorine levels
can rise with contamination and adversely affect
the performance of the capacitor.
3.2 Electrical Precautions
✽ Please consult us for additonal information about
acceptable cleaning solvents or cleaning methods.
4. Emergency Procedures
Type
Series
Cleaning permitted
Surface mount type
V(Except EB
Series)
L
Lead type
Bi-polar SU
M
KA
Bi-polar KA
FB
FC
GA
NHG
EB
TA
TS UP
TS HA
L
L(~ 100V)
L
L
L
L
L
L(~ 100V)
L(~ 100V)
L
L(~ 100V)
L(~ 100V)
Snap-in type
(1) Avoid touching the terminals of the capacitor as
possible electric shock could result. The exposed
aluminium case is not insulated and could also
cause electric shock if touched.
(2)Avoid short circuiting the area between the
capacitor terminals with conductive materials
including liquids such as acids or alkaline solutions.
(1) I f t h e p r e s s u r e r e l i e f v e n t o f t h e c a p a c i t o r
operates, immediately turn off the equipment and
disconnect from the power source. This will
minimize additional damage caused by the
vaporizing electrolyte.
(2) Avoid contact with the escaping electrolyte gas
which can exceed 100°C temperatures.
If electrolyte or gas enters the eye, immediately
flush the eye with large amounts of water.
If electrolyte or gas is ingested by mouth, gargle
with water. If electrolyte contacts the skin, wash
with soap and water.
5. Long Term Storage
2.9 Mounting Adhesives and Coating Agents
When using mounting adhesives or coating agents to
control humidity, avoid using materials containing
halogenated solvents. Also, avoid the use of
chloroprene based polymers.
✽ After applying adhesives or coatings, dry thoroughly
to prevent residual solvents from being trapped
between the capacitor and the circuit board.
Leakage current of a capacitor increases with long
storage times. The aluminium oxide film deteriorates
as a function of temperature and time. If used
without reconditioning, an abnormally high current
will be required to restore the oxide film. This current
surge could cause the circuit or the capacitor to fail.
Capacitor should be reconditioned by applying rated
voltage in series with a 1000 Ω, current limiting
resistor for a time period of 30 minutes.
5.1 Environmental Conditions (Storage)
3. Precautions for using capacitors
3.1 Environmental Conditions
C a p a c i t o r s s h o u l d not b e u s e d i n t h e f o l l o w i n g
environments.
(1) Temperature exposure above the maximum rated
or below the minimum rated temperature of the
capacitor.
(2) Direct contact with water, salt water, or oil.
(3) H i g h h u m i d i t y c o n d i t i o n s w h e r e w a t e r c o u l d
condense on the capacitor.
(4) Exposure to toxic gases such as hydrogen sulfide,
sulfuric acid, nitric acid, chlorine, or ammonia.
(5) Exposure to ozone, radiation, or ultraviolet rays.
(6) V i b r a t i o n a n d s h o c k c o n d i t i o n s e x c e e d i n g
specified requirements.
Capacitors should not be stored in the following
environments.
(1) Temperature exposure above 35°C or below 15 °C.
(2) Direct contact with water, salt water, or oil.
(3) High humidity conditions where water could
condense on the capacitor.
(4) E x p o s u r e t o t o x i c g a s e s s u c h a s h y d r o g e n
sulfide,sulfuric acid, nitric acid, chlorine, or
ammonia.
(5) Exposure to ozone, radiation, or ultraviolet rays.
(6) V i b r a t i o n a n d s h o c k c o n d i t i o n s e x c e e d i n g
specified requirements.
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.
Mar. 2005
– EE21 –
Aluminum Electrolytic Capacitor
6. Capacitor Disposal
When disposing of capacitors, use one of the
following methods.
● Incinerate after crushing the capacitor or
puncturing the can wall (to prevent explosion due
to internal pressure rise). Capacitors should be
incinerated at high temperatures to prevent the
release of toxic gases such as chlorine from the
polyvinyl chloride sleeve, etc.
● Dispose of as solid waste.
● Local laws may have specific disposal
requirements which must be followed.
The application guidelines above are taken from:
Technical Report EIAJ RCR-2367 issued by the Japan
Electronic Industry Association, Inc. Guideline of notabilia for aluminium electrolytic
capacitors with non-solid electrolytic for use in
electronic equipment.
Refer to this Technical Report for additional details.
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.
– EE22 –
Mar. 2005
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