Renesas HD64F2128 Single-chip microcomputer Datasheet

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April 1, 2003
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Hitachi Single-Chip Microcomputer
H8S/2128 Series
H8S/2127
HD6432127RW, HD6432127R
H8S/2126
HD6432126RW, HD6432126R
H8S/2124 Series
H8S/2122
HD6432122
H8S/2120
HD6432120
H8S/2128 F-ZTAT
HD64F2128
Hardware Manual
ADE-602-114B
Rev. 3.0
03/26/01
Hitachi, Ltd.
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s
patent, copyright, trademark, or other intellectual property rights for information contained in
this document. Hitachi bears no responsibility for problems that may arise with third party’s
rights, including intellectual property rights, in connection with use of the information
contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you
have received the latest product standards or specifications before final design, purchase or
use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.
However, contact Hitachi’s sales office before using the product in an application that
demands especially high quality and reliability or where its failure or malfunction may directly
threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear
power, combustion control, transportation, traffic, safety equipment or medical equipment for
life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi
particularly for maximum rating, operating supply voltage range, heat radiation characteristics,
installation conditions and other characteristics. Hitachi bears no responsibility for failure or
damage when used beyond the guaranteed ranges. Even within the guaranteed ranges,
consider normally foreseeable failure rates or failure modes in semiconductor devices and
employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi
product does not cause bodily injury, fire or other consequential damage due to operation of
the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document
without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi
semiconductor products.
Preface
The H8S/2128 Series and H8S/2124 Series comprise high-performance microcomputers with a
32-bit H8S/2000 CPU core, and a set of on-chip supporting functions required for system
configuration.
The H8S/2000 CPU can execute basic instructions in one state, and is provided with sixteen
internal 16-bit general registers with a 32-bit configuration, and a concise and optimized
instruction set. The CPU can handle a 16-Mbyte linear address space (architecturally 4 Gbytes).
Programs based on the high-level language C can also be run efficiently.
Single-power-supply flash memory (F-ZTAT™*) and mask ROM versions are available,
providing a quick and flexible response to conditions from ramp-up through full-scale volume
production, even for applications with frequently changing specifications.
On-chip peripheral functions include a 16-bit free-running timer module (FRT), 8-bit timer
module (TMR), watchdog timer module (WDT), two PWM timers (PWM and PWMX), a serial
communication interface (SCI), A/D converter (ADC), and I/O ports. An I2C bus interface (IIC)
can also be incorporated as an option.
An on-chip data transfer controller (DTC) is also provided, enabling high-speed data transfer
without CPU intervention.
The H8S/2128 Series has all the above on-chip supporting functions, and can also be provided
with an IIC module as an options. The H8S/2124 Series comprises reduced-function versions, with
fewer TMR, and no PWM, IIC, or DTC modules.
Use of the H8S/2128 or H8S/2124 Series enables compact, high-performance systems to be
implemented easily. The various timer functions and their interconnectability (timer connection),
plus the interlinked operation of the I2C bus interface and data transfer controller (DTC), in
particular, make these devices ideal for use in PC monitors. In addition, the combination of FZTAT TM and reduced-function versions is ideal for system applications in which on-chip program
memory is essential to meet performance requirements, product start-up times are short, and
program modifications may be necessary after end-product assembly.
This manual describes the hardware of the H8S/2128 Series and H8S/2124 Series. Refer to the
H8S/2600 Series and H8S/2000 Series Programming Manual for a detailed description of the
instruction set.
Note: * F-ZTATTM (Flexible-ZTAT) is a trademark of Hitachi, Ltd.
On-Chip Supporting Modules
Series
H8S/2128 Series
H8S/2124 Series
Product names
H8S/2128, 2127
H8S/2122, 2120
Bus controller (BSC)
Available (8 bits)
Available (8 bits)
Data transfer controller (DTC)
Available
—
8-bit PWM timer (PWM)
×16
—
14-bit PWM timer (PWMX)
×2
—
16-bit free-running timer (FRT)
×1
×1
8-bit timer (TMR)
×4
×3
Timer connection
Available
—
Watchdog timer (WDT)
×2
×2
Serial communication interface (SCI)
×2
×2
I C bus interface (IIC)
×2 (option)
—
A/D converter
×8 (analog inputs)
×8 (analog inputs)
×8 (expansion A/D inputs) ×8 (expansion A/D inputs)
2
Revisions and Additions in this Edition
Page
Item
Revisions (See Manual for Details)
—
Preface
On-Chip Supporting Modules
Modification
1
1.1 Overview
Modification of on-chip ROM size
4, 5
Table 1.1 Overview
Modification of memory, products lineup
24, 26
Table 1.4 Pin Functions
Modification of SCI, port 4, and port 5
27 to
72
2. CPU
Modification of TAS instruction
Addition of note on STM/LDM instructions
70, 71
2.10 Usage Notes
Addition
76
3.2.2 System Control Register (SYSCR)
Modification of bit 6; IOS enable (IOSE)
description
78
3.2.4 Serial/Timer Control Register (STCR)
Modification of bit 7 to 5 description
81
3.5 Memory Map in Each Operating Mode
Addition of description: “Do not ... ”
89
Table 4.1 Exception Types and Priority
Modification of description
145
6.4.5 Wait Control
Modification of Figure 6.7 Example of Wait
State Insertion Timing
180,
183
8.1 Over Viwe
Table 8.1 H8/2128 Series Port Functions
Modification of port 2 description
Table 8.2 H8/2124 Series Port Functions
Modification of port 2 description
219
Table 9.2 PWM Timer Module Registers
Addition of note 2
231
Table 10.2 Register Configuration
Addition of note 2
249
11.2.4 Output Compare Register AR and AF
(OCRAR, OCRAF)
Modification
265
11.3.5 Timing of Input Capture Flag (ICF) setting
Modification of Figure 11.11 Setting of Input
Capture Flag (ICFA/B/C/D)
267
Figure 11.16 Input Capture Mask Signal Clearing
Timing
Modification
269
Figure 11.18 FRC write-Clear Contention
Modification
270
Figure 11.19 FRC write-Increment Contention
Modification
271
Figure 11.20 Contention between OCR Write and
Compare-match (When automatic Addition
Function Is Not Used)
Modification
272
Figure 11.21 Contention between OCRAR/OCRA
write and Compare-match (When automatic
Addition Function Is Used)
Modification
288
12.2.6 Serial/Timer Control Register (STCR)
Modification
290
12.2.8 Timer Connection Register S (TCONRS)
Modification
291
12.2.11 Input Capture Register R, and F
(TICRR,TICRF)
[TMRX Additional Functions]
Addition of reference
299
12.3.6 Input Capture Operation
Addition
301
12.4 Interrupt Sources
Modification of table number
Page
Item
Revisions (See Manual for Details)
302
12.5 8-Bit Timer Application Example
Modification of figure number
302
12.6 Usage Notes
Modification of the number for figures and
tables
311
Table 13.1 Timer Connection Input Output Pins
Addition of description
323
Figure 13.2 Timing Chart for PWM decoding
Modification
324
13.3.2 Clamp Waveform Generation
(CL1/CL2/CL3 signal generation)
Modification
341
14.2.2 Timer Control/Status Register (TCSR)
Addition of note on bit 7
350
14.5.5 OVF Flag Clear Condition
Addition
420
431
2
Modification of TDRE description
2
Addition of bit 1 description
2
16.2.1 I C Bus Data Register (ICDR)
16.2.5 I C Bus Control Register (ICCR)
433
16.2.6 I C Bus Status Register (ICSR)
Addition of description
438
16.2.7 Serial/Timer Control Register
Modification
444
16.3.2 Master Transmit Operation
Modification
446
16.3.3 Master Receive Operation
Modification
450
16.3.5 Slave Transmit Operation
Modification
453
16.3.7 Automatic Switching from formatless Mode
to I2C Bus Format
Addition of description
456
16.3.9 Noise Canceller
Modification of Figure 16.14 Flow Chart for
Master Transmit Mode (Example)
457
Modification of Figure 16.15 Flow Chart for
Master Receive Mode (Example)
459,
460
16.3.11 Initialization of Internal State
Modification
465
16.4 Usage Note
Addition of note on Start Condition Issuance
for Transmission
Addition of note on I2C Bus Interface Stop
Condition Instruction Issuance
467
493
18.1 Overview
Modification
495
18.3 Operation
Modification
497
19.1 Overview
Modification
499
19.3 Operation
Modification
511,
512
19.5.4 Serial/Timer Control Register (STCR)
Modification of description on bit 3
527
19.9 Interrupt Handling When
Programming/Erasing Flash Memory
Modification
528
19.10 Flash Memory Programmer Mode
Modification
540
19.12 Note on Switching from F-ZTAT Version to
Mask ROM Version
Addition
543
Figure 20.1 Block Diagram of Clock Pulse
Generator
Modification
549
Figure 20.7 External Clock Output Setting Delay
Timing
Modification
Page
Item
Description
551
20.9 Clock Selection Circuit
Modification
557
Table 21.3 Power-Down State Registers
Addition of note 2
566
Table 21.4 MSTP Bits and Corresponding On-chip
Supporting Modules
Addition of description
574
21.10.1 Subactive Mode
Modification
589
Figure 22.3 Output Load Circuit
Modification
592
Table 22.6 Control Signal Timing
Modification
606
Figure 22.21 SCK Clock Input Timing
Figure 22.22 SCI Input/Output Timing
(Synchronous Mode)
Modification
609
Table 22.10 A/D Conversion Characteristics
Addition of note 6
611
Table 22.12 Flash Memory Characteristics
Modification
615
23 Electrical Characteristics [H8S/2124 Series]
Addition
643
Appendix A
Addition of note on STM/LDM instruction
713 to
718
B.2 Register Selection Conditions
Addition of condition
737
B.3 H`FF86,H`FF87
Modification of notes
813
Table F.1 H8S/2128 Series and H8S/2124 Series
Product Code Lineup
Modification
Contents
Section 1 Overview ..............................................................................................................
1.1
1.2
1.3
1
Overview ............................................................................................................................ 1
Internal Block Diagram ...................................................................................................... 6
Pin Arrangement and Functions ......................................................................................... 8
1.3.1 Pin Arrangement ................................................................................................... 8
1.3.2 Pin Functions in Each Operating Mode ................................................................ 14
1.3.3 Pin Functions......................................................................................................... 21
Section 2 CPU ........................................................................................................................ 27
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
Overview ............................................................................................................................
2.1.1 Features .................................................................................................................
2.1.2 Differences between H8S/2600 CPU and H8S/2000 CPU ...................................
2.1.3 Differences from H8/300 CPU..............................................................................
2.1.4 Differences from H8/300H CPU...........................................................................
CPU Operating Modes .......................................................................................................
Address Space ....................................................................................................................
Register Configuration .......................................................................................................
2.4.1 Overview ...............................................................................................................
2.4.2 General Registers ..................................................................................................
2.4.3 Control Registers...................................................................................................
2.4.4 Initial Register Values ...........................................................................................
Data Formats ......................................................................................................................
2.5.1 General Register Data Formats .............................................................................
2.5.2 Memory Data Formats ..........................................................................................
Instruction Set ....................................................................................................................
2.6.1 Overview ...............................................................................................................
2.6.2 Instructions and Addressing Modes ......................................................................
2.6.3 Table of Instructions Classified by Function ........................................................
2.6.4 Basic Instruction Formats......................................................................................
2.6.5 Notes on Use of Bit-Manipulation Instructions ....................................................
Addressing Modes and Effective Address Calculation......................................................
2.7.1 Addressing Mode ..................................................................................................
2.7.2 Effective Address Calculation...............................................................................
Processing States ................................................................................................................
2.8.1 Overview ...............................................................................................................
2.8.2 Reset State .............................................................................................................
2.8.3 Exception-Handling State .....................................................................................
2.8.4 Program Execution State .......................................................................................
2.8.5 Bus-Released State................................................................................................
27
27
28
29
29
30
35
36
36
37
38
39
40
40
42
43
43
44
46
55
56
56
56
59
63
63
64
65
66
66
i
2.8.6 Power-Down State ................................................................................................
2.9 Basic Timing ......................................................................................................................
2.9.1 Overview ...............................................................................................................
2.9.2 On-Chip Memory (ROM, RAM) ..........................................................................
2.9.3 On-Chip Supporting Module Access Timing........................................................
2.9.4 External Address Space Access Timing................................................................
2.10 Usage Note .........................................................................................................................
2.10.1 TAS Instruction .....................................................................................................
2.10.2 STM/LDT Instruction ...........................................................................................
66
67
67
67
69
70
70
70
70
Section 3 MCU Operating Modes.................................................................................... 73
3.1
3.2
3.3
3.4
3.5
Overview ............................................................................................................................
3.1.1 Operating Mode Selection ....................................................................................
3.1.2 Register Configuration ..........................................................................................
Register Descriptions..........................................................................................................
3.2.1 Mode Control Register (MDCR) ..........................................................................
3.2.2 System Control Register (SYSCR) .......................................................................
3.2.3 Bus Control Register (BCR) .................................................................................
3.2.4 Serial/Timer Control Register (STCR) .................................................................
Operating Mode Descriptions ............................................................................................
3.3.1 Mode 1 ..................................................................................................................
3.3.2 Mode 2 ..................................................................................................................
3.3.3 Mode 3 ..................................................................................................................
Pin Functions in Each Operating Mode..............................................................................
Memory Map in Each Operating Mode..............................................................................
73
73
74
74
74
75
77
78
80
80
80
80
81
81
Section 4 Exception Handling ........................................................................................... 89
4.1
4.2
4.3
4.4
4.5
4.6
Overview ............................................................................................................................
4.1.1 Exception Handling Types and Priority................................................................
4.1.2 Exception Handling Operation..............................................................................
4.1.3 Exception Sources and Vector Table ....................................................................
Reset ...................................................................................................................................
4.2.1 Overview ...............................................................................................................
4.2.2 Reset Sequence......................................................................................................
4.2.3 Interrupts after Reset .............................................................................................
Interrupts ............................................................................................................................
Trap Instruction ..................................................................................................................
Stack Status after Exception Handling ...............................................................................
Notes on Use of the Stack ..................................................................................................
89
89
90
90
92
92
92
94
95
96
97
98
Section 5 Interrupt Controller............................................................................................ 99
5.1
ii
Overview ............................................................................................................................ 99
5.1.1 Features ................................................................................................................. 99
5.2
5.3
5.4
5.5
5.6
5.7
5.1.2 Block Diagram ...................................................................................................... 100
5.1.3 Pin Configuration .................................................................................................. 100
5.1.4 Register Configuration .......................................................................................... 101
Register Descriptions.......................................................................................................... 101
5.2.1 System Control Register (SYSCR) ....................................................................... 101
5.2.2 Interrupt Control Registers A to C (ICRA to ICRC) ............................................ 102
5.2.3 IRQ Enable Register (IER) ................................................................................... 103
5.2.4 IRQ Sense Control Registers H and L (ISCRH, ISCRL)...................................... 104
5.2.5 IRQ Status Register (ISR) ..................................................................................... 105
5.2.6 Address Break Control Register (ABRKCR)........................................................ 106
5.2.7 Break Address Registers A, B, C (BARA, BARB, BARC).................................. 107
Interrupt Sources ................................................................................................................ 108
5.3.1 External Interrupts................................................................................................. 108
5.3.2 Internal Interrupts.................................................................................................. 109
5.3.3 Interrupt Exception Vector Table.......................................................................... 109
Address Breaks................................................................................................................... 112
5.4.1 Features ................................................................................................................. 112
5.4.2 Block Diagram ...................................................................................................... 112
5.4.3 Operation ............................................................................................................... 113
5.4.4 Usage Notes .......................................................................................................... 113
Interrupt Operation ............................................................................................................. 115
5.5.1 Interrupt Control Modes and Interrupt Operation ................................................. 115
5.5.2 Interrupt Control Mode 0 ...................................................................................... 118
5.5.3 Interrupt Control Mode 1 ...................................................................................... 120
5.5.4 Interrupt Exception Handling Sequence ............................................................... 123
5.5.5 Interrupt Response Times...................................................................................... 125
Usage Notes........................................................................................................................ 126
5.6.1 Contention between Interrupt Generation and Disabling...................................... 126
5.6.2 Instructions that Disable Interrupts ....................................................................... 127
5.6.3 Interrupts during Execution of EEPMOV Instruction .......................................... 127
DTC Activation by Interrupt .............................................................................................. 128
5.7.1 Overview ............................................................................................................... 128
5.7.2 Block Diagram ...................................................................................................... 128
5.7.3 Operation ............................................................................................................... 129
Section 6 Bus Controller ..................................................................................................... 131
6.1
6.2
Overview ............................................................................................................................ 131
6.1.1 Features ................................................................................................................. 131
6.1.2 Block Diagram ...................................................................................................... 132
6.1.3 Pin Configuration .................................................................................................. 133
6.1.4 Register Configuration .......................................................................................... 133
Register Descriptions.......................................................................................................... 134
6.2.1 Bus Control Register (BCR) ................................................................................. 134
iii
6.3
6.4
6.5
6.6
6.7
6.2.2 Wait State Control Register (WSCR).................................................................... 135
Overview of Bus Control.................................................................................................... 137
6.3.1 Bus Specifications ................................................................................................. 137
6.3.2 Advanced Mode .................................................................................................... 138
6.3.3 Normal Mode ........................................................................................................ 138
6.3.4 I/O Select Signal.................................................................................................... 138
Basic Bus Interface............................................................................................................. 139
6.4.1 Overview ............................................................................................................... 139
6.4.2 Data Size and Data Alignment.............................................................................. 139
6.4.3 Valid Strobes ......................................................................................................... 141
6.4.4 Basic Timing ......................................................................................................... 142
6.4.5 Wait Control.......................................................................................................... 144
Burst ROM Interface .......................................................................................................... 146
6.5.1 Overview ............................................................................................................... 146
6.5.2 Basic Timing ......................................................................................................... 146
6.5.3 Wait Control.......................................................................................................... 147
Idle Cycle............................................................................................................................ 148
6.6.1 Operation ............................................................................................................... 148
6.6.2 Pin States in Idle Cycle ......................................................................................... 149
Bus Arbitration ................................................................................................................... 149
6.7.1 Overview ............................................................................................................... 149
6.7.2 Operation ............................................................................................................... 149
6.7.3 Bus Transfer Timing ............................................................................................. 150
Section 7 Data Transfer Controller [H8S/2128 Series] ............................................. 151
7.1
7.2
7.3
iv
Overview ............................................................................................................................ 151
7.1.1 Features ................................................................................................................. 151
7.1.2 Block Diagram ...................................................................................................... 152
7.1.3 Register Configuration .......................................................................................... 153
Register Descriptions.......................................................................................................... 154
7.2.1 DTC Mode Register A (MRA).............................................................................. 154
7.2.2 DTC Mode Register B (MRB).............................................................................. 156
7.2.3 DTC Source Address Register (SAR) ................................................................... 157
7.2.4 DTC Destination Address Register (DAR) ........................................................... 157
7.2.5 DTC Transfer Count Register A (CRA) ............................................................... 157
7.2.6 DTC Transfer Count Register B (CRB)................................................................ 158
7.2.7 DTC Enable Registers (DTCER) .......................................................................... 158
7.2.8 DTC Vector Register (DTVECR) ......................................................................... 159
7.2.9 Module Stop Control Register (MSTPCR) ........................................................... 160
Operation............................................................................................................................ 161
7.3.1 Overview ............................................................................................................... 161
7.3.2 Activation Sources ................................................................................................ 163
7.3.3 DTC Vector Table ................................................................................................. 164
7.4
7.5
7.3.4 Location of Register Information in Address Space ............................................. 166
7.3.5 Normal Mode ........................................................................................................ 167
7.3.6 Repeat Mode ......................................................................................................... 168
7.3.7 Block Transfer Mode ............................................................................................ 169
7.3.8 Chain Transfer....................................................................................................... 171
7.3.9 Operation Timing .................................................................................................. 172
7.3.10 Number of DTC Execution States ........................................................................ 173
7.3.11 Procedures for Using the DTC.............................................................................. 175
7.3.12 Examples of Use of the DTC ................................................................................ 176
Interrupts ............................................................................................................................ 178
Usage Notes........................................................................................................................ 178
Section 8 I/O Ports................................................................................................................ 179
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
Overview ............................................................................................................................ 179
Port 1 .................................................................................................................................. 185
8.2.1 Overview ............................................................................................................... 185
8.2.2 Register Configuration .......................................................................................... 186
8.2.3 Pin Functions in Each Mode ................................................................................. 188
8.2.4 MOS Input Pull-Up Function................................................................................ 189
Port 2 .................................................................................................................................. 190
8.3.1 Overview ............................................................................................................... 190
8.3.2 Register Configuration .......................................................................................... 192
8.3.3 Pin Functions in Each Mode ................................................................................. 194
8.3.4 MOS Input Pull-Up Function................................................................................ 195
Port 3 .................................................................................................................................. 196
8.4.1 Overview ............................................................................................................... 196
8.4.2 Register Configuration .......................................................................................... 197
8.4.3 Pin Functions in Each Mode ................................................................................. 199
8.4.4 MOS Input Pull-Up Function................................................................................ 200
Port 4 .................................................................................................................................. 201
8.5.1 Overview ............................................................................................................... 201
8.5.2 Register Configuration .......................................................................................... 202
8.5.3 Pin Functions......................................................................................................... 203
Port 5 .................................................................................................................................. 206
8.6.1 Overview ............................................................................................................... 206
8.6.2 Register Configuration .......................................................................................... 206
8.6.3 Pin Functions......................................................................................................... 208
Port 6 .................................................................................................................................. 209
8.7.1 Overview ............................................................................................................... 209
8.7.2 Register Configuration .......................................................................................... 209
8.7.3 Pin Functions......................................................................................................... 211
Port 7 .................................................................................................................................. 214
8.8.1 Overview ............................................................................................................... 214
v
8.8.2
8.8.3
Register Configuration .......................................................................................... 215
Pin Functions......................................................................................................... 215
Section 9 8-Bit PWM Timers [H8S/2128 Series] ....................................................... 217
9.1
9.2
9.3
Overview ............................................................................................................................ 217
9.1.1 Features ................................................................................................................. 217
9.1.2 Block Diagram ...................................................................................................... 218
9.1.3 Pin Configuration .................................................................................................. 219
9.1.4 Register Configuration .......................................................................................... 219
Register Descriptions.......................................................................................................... 220
9.2.1 PWM Register Select (PWSL).............................................................................. 220
9.2.2 PWM Data Registers (PWDR0 to PWDR15) ....................................................... 222
9.2.3 PWM Data Polarity Registers A and B (PWDPRA and PWDPRB) .................... 222
9.2.4 PWM Output Enable Registers A and B (PWOERA and PWOERB).................. 223
9.2.5 Peripheral Clock Select Register (PCSR) ............................................................. 224
9.2.6 Port 1 Data Direction Register (P1DDR).............................................................. 225
9.2.7 Port 2 Data Direction Register (P2DDR).............................................................. 225
9.2.8 Port 1 Data Register (P1DR) ................................................................................. 225
9.2.9 Port 2 Data Register (P2DR) ................................................................................. 225
9.2.10 Module Stop Control Register (MSTPCR) ........................................................... 226
Operation ............................................................................................................................ 227
9.3.1 Correspondence between PWM Data Register Contents and
Output Waveform.................................................................................................. 227
Section 10 14-Bit PWM D/A ............................................................................................ 229
10.1 Overview ............................................................................................................................ 229
10.1.1 Features ................................................................................................................. 229
10.1.2 Block Diagram ...................................................................................................... 230
10.1.3 Pin Configuration .................................................................................................. 230
10.1.4 Register Configuration .......................................................................................... 231
10.2 Register Descriptions.......................................................................................................... 231
10.2.1 PWM D/A Counter (DACNT) .............................................................................. 231
10.2.2 D/A Data Registers A and B (DADRA and DADRB).......................................... 232
10.2.3 PWM D/A Control Register (DACR) ................................................................... 233
10.2.4 Module Stop Control Register (MSTPCR) ........................................................... 235
10.3 Bus Master Interface .......................................................................................................... 236
10.4 Operation ............................................................................................................................ 239
Section 11 16-Bit Free-Running Timer.......................................................................... 243
11.1 Overview ............................................................................................................................ 243
11.1.1 Features ................................................................................................................. 243
11.1.2 Block Diagram ...................................................................................................... 244
11.1.3 Input and Output Pins............................................................................................ 245
vi
11.2
11.3
11.4
11.5
11.6
11.1.4 Register Configuration .......................................................................................... 246
Register Descriptions.......................................................................................................... 247
11.2.1 Free-Running Counter (FRC)................................................................................ 247
11.2.2 Output Compare Registers A and B (OCRA, OCRB) .......................................... 247
11.2.3 Input Capture Registers A to D (ICRA to ICRD) ................................................. 248
11.2.4 Output Compare Registers AR and AF (OCRAR, OCRAF)................................ 249
11.2.5 Output Compare Register DM (OCRDM)............................................................ 250
11.2.6 Timer Interrupt Enable Register (TIER) ............................................................... 250
11.2.7 Timer Control/Status Register (TCSR) ................................................................. 252
11.2.8 Timer Control Register (TCR) .............................................................................. 255
11.2.9 Timer Output Compare Control Register (TOCR) ............................................... 257
11.2.10 Module Stop Control Register (MSTPCR) ........................................................... 259
Operation ............................................................................................................................ 260
11.3.1 FRC Increment Timing ......................................................................................... 260
11.3.2 Output Compare Output Timing ........................................................................... 261
11.3.3 FRC Clear Timing................................................................................................. 262
11.3.4 Input Capture Input Timing .................................................................................. 262
11.3.5 Timing of Input Capture Flag (ICF) Setting ......................................................... 264
11.3.6 Setting of Output Compare Flags A and B (OCFA, OCFB) ................................ 265
11.3.7 Setting of FRC Overflow Flag (OVF) .................................................................. 266
11.3.8 Automatic Addition of OCRA and OCRAR/OCRAF .......................................... 266
11.3.9 ICRD and OCRDM Mask Signal Generation ....................................................... 267
Interrupts ............................................................................................................................ 268
Sample Application ............................................................................................................ 268
Usage Notes........................................................................................................................ 269
Section 12 8-Bit Timers ...................................................................................................... 275
12.1 Overview ............................................................................................................................ 275
12.1.1 Features ................................................................................................................. 275
12.1.2 Block Diagram ...................................................................................................... 276
12.1.3 Pin Configuration .................................................................................................. 277
12.1.4 Register Configuration .......................................................................................... 278
12.2 Register Descriptions.......................................................................................................... 279
12.2.1 Timer Counter (TCNT) ......................................................................................... 279
12.2.2 Time Constant Register A (TCORA).................................................................... 280
12.2.3 Time Constant Register B (TCORB) .................................................................... 281
12.2.4 Timer Control Register (TCR) .............................................................................. 281
12.2.5 Timer Control/Status Register (TCSR) ................................................................. 285
12.2.6 Serial/Timer Control Register (STCR) ................................................................. 288
12.2.7 System Control Register (SYSCR) ....................................................................... 289
12.2.8 Timer Connection Register S (TCONRS) ............................................................ 290
12.2.9 Input Capture Register (TICR) [TMRX Additional Function] ............................. 290
12.2.10 Time Constant Register C (TCORC) [TMRX Additional Function].................... 291
vii
12.3
12.4
12.5
12.6
12.2.11 Input Capture Registers R and F (TICRR, TICRF)
[TMRX Additional Functions].............................................................................. 291
12.2.12 Timer Input Select Register (TISR) [TMRY Additional Function]...................... 292
12.2.13 Module Stop Control Register (MSTPCR) ........................................................... 293
Operation ............................................................................................................................ 294
12.3.1 TCNT Incrementation Timing .............................................................................. 294
12.3.2 Compare-Match Timing........................................................................................ 295
12.3.3 TCNT External Reset Timing ............................................................................... 297
12.3.4 Timing of Overflow Flag (OVF) Setting .............................................................. 297
12.3.5 Operation with Cascaded Connection ................................................................... 298
12.3.6 Input Capture Operation........................................................................................ 299
Interrupt Sources ................................................................................................................ 301
8-Bit Timer Application Example...................................................................................... 302
Usage Notes........................................................................................................................ 302
12.6.1 Contention between TCNT Write and Clear......................................................... 303
12.6.2 Contention between TCNT Write and Increment ................................................. 304
12.6.3 Contention between TCOR Write and Compare-Match ....................................... 305
12.6.4 Contention between Compare-Matches A and B.................................................. 306
12.6.5 Switching of Internal Clocks and TCNT Operation.............................................. 306
Section 13 Timer Connection [H8S/2128 Series] ....................................................... 309
13.1 Overview ............................................................................................................................ 309
13.1.1 Features ................................................................................................................. 309
13.1.2 Block Diagram ...................................................................................................... 310
13.1.3 Input and Output Pins............................................................................................ 311
13.1.4 Register Configuration .......................................................................................... 312
13.2 Register Descriptions.......................................................................................................... 312
13.2.1 Timer Connection Register I (TCONRI) .............................................................. 312
13.2.2 Timer Connection Register O (TCONRO) ........................................................... 314
13.2.3 Timer Connection Register S (TCONRS) ............................................................ 316
13.2.4 Edge Sense Register (SEDGR) ............................................................................. 319
13.2.5 Module Stop Control Register (MSTPCR) ........................................................... 321
13.3 Operation ............................................................................................................................ 322
13.3.1 PWM Decoding (PDC Signal Generation) ........................................................... 322
13.3.2 Clamp Waveform Generation (CL1/CL2/CL3 Signal Generation) ...................... 324
13.3.3 Measurement of 8-Bit Timer Divided Waveform Period ..................................... 325
13.3.4 IHI Signal and 2fH Modification .......................................................................... 327
13.3.5 IVI Signal Fall Modification and IHI Synchronization ........................................ 329
13.3.6 Internal Synchronization Signal Generation
(IHG/IVG/CL4 Signal Generation)....................................................................... 330
13.3.7 HSYNCO Output .................................................................................................. 333
13.3.8 VSYNCO Output .................................................................................................. 334
13.3.9 CBLANK Output .................................................................................................. 335
viii
Section 14 Watchdog Timer (WDT) ............................................................................... 337
14.1 Overview ............................................................................................................................ 337
14.1.1 Features ................................................................................................................. 337
14.1.2 Block Diagram ...................................................................................................... 338
14.1.3 Pin Configuration .................................................................................................. 339
14.1.4 Register Configuration .......................................................................................... 340
14.2 Register Descriptions.......................................................................................................... 340
14.2.1 Timer Counter (TCNT) ......................................................................................... 340
14.2.2 Timer Control/Status Register (TCSR) ................................................................. 341
14.2.3 System Control Register (SYSCR) ....................................................................... 344
14.2.4 Notes on Register Access...................................................................................... 345
14.3 Operation ............................................................................................................................ 346
14.3.1 Watchdog Timer Operation................................................................................... 346
14.3.2 Interval Timer Operation ...................................................................................... 347
14.3.3 Timing of Setting of Overflow Flag (OVF).......................................................... 348
14.4 Interrupts ............................................................................................................................ 348
14.5 Usage Notes........................................................................................................................ 349
14.5.1 Contention between Timer Counter (TCNT) Write and Increment...................... 349
14.5.2 Changing Value of CKS2 to CKS0....................................................................... 349
14.5.3 Switching between Watchdog Timer Mode and Interval Timer Mode ................ 349
14.5.4 Counter Value in Transitions between High-Speed Mode, Subactive Mode, and
Watch Mode .......................................................................................................... 350
14.5.5 OVF Flag Clear Condition .................................................................................... 350
Section 15 Serial Communication Interface (SCI) ..................................................... 351
15.1 Overview ............................................................................................................................ 351
15.1.1 Features ................................................................................................................. 351
15.1.2 Block Diagram ...................................................................................................... 353
15.1.3 Pin Configuration .................................................................................................. 353
15.1.4 Register Configuration .......................................................................................... 354
15.2 Register Descriptions.......................................................................................................... 355
15.2.1 Receive Shift Register (RSR)................................................................................ 355
15.2.2 Receive Data Register (RDR) ............................................................................... 355
15.2.3 Transmit Shift Register (TSR) .............................................................................. 356
15.2.4 Transmit Data Register (TDR).............................................................................. 356
15.2.5 Serial Mode Register (SMR)................................................................................. 357
15.2.6 Serial Control Register (SCR)............................................................................... 359
15.2.7 Serial Status Register (SSR).................................................................................. 363
15.2.8 Bit Rate Register (BRR)........................................................................................ 367
15.2.9 Serial Interface Mode Register (SCMR) ............................................................... 375
15.2.10 Module Stop Control Register (MSTPCR) ........................................................... 376
15.3 Operation ............................................................................................................................ 377
15.3.1 Overview ............................................................................................................... 377
ix
15.3.2 Operation in Asynchronous Mode ........................................................................ 379
15.3.3 Multiprocessor Communication Function ............................................................ 391
15.3.4 Operation in Synchronous Mode .......................................................................... 399
15.4 SCI Interrupts ..................................................................................................................... 408
15.5 Usage Notes........................................................................................................................ 409
Section 16 I2 C Bus Interface (IIC) [H8S/2128 Series Option] ............................... 413
16.1 Overview ............................................................................................................................ 413
16.1.1 Features ................................................................................................................. 413
16.1.2 Block Diagram ...................................................................................................... 414
16.1.3 Input/Output Pins .................................................................................................. 416
16.1.4 Register Configuration.......................................................................................... 417
16.2 Register Descriptions.......................................................................................................... 418
16.2.1 I2C Bus Data Register (ICDR) .............................................................................. 418
16.2.2 Slave Address Register (SAR) .............................................................................. 421
16.2.3 Second Slave Address Register (SARX) .............................................................. 422
16.2.4 I2C Bus Mode Register (ICMR)............................................................................ 423
16.2.5 I2C Bus Control Register (ICCR).......................................................................... 426
16.2.6 I2C Bus Status Register (ICSR)............................................................................. 433
16.2.7 Serial/Timer Control Register (STCR) ................................................................. 438
16.2.8 DDC Switch Register (DDCSWR) ....................................................................... 439
16.2.9 Module Stop Control Register (MSTPCR) ........................................................... 441
16.3 Operation ............................................................................................................................ 442
16.3.1 I2C Bus Data Format.............................................................................................. 442
16.3.2 Master Transmit Operation ................................................................................... 444
16.3.3 Master Receive Operation ..................................................................................... 446
16.3.4 Slave Receive Operation ....................................................................................... 448
16.3.5 Slave Transmit Operation...................................................................................... 450
16.3.6 IRIC Setting Timing and SCL Control ................................................................. 452
16.3.7 Automatic Switching from Formatless Mode to I 2C Bus Format......................... 453
16.3.8 Operation Using the DTC ..................................................................................... 454
16.3.9 Noise Canceler ...................................................................................................... 455
16.3.10 Sample Flowcharts ................................................................................................ 455
16.3.11 Initialization of Internal State................................................................................ 459
16.4 Usage Notes........................................................................................................................ 461
Section 17 A/D Converter .................................................................................................. 469
17.1 Overview ............................................................................................................................ 469
17.1.1 Features ................................................................................................................. 469
17.1.2 Block Diagram ...................................................................................................... 470
17.1.3 Pin Configuration .................................................................................................. 471
17.1.4 Register Configuration .......................................................................................... 472
17.2 Register Descriptions.......................................................................................................... 472
x
17.3
17.4
17.5
17.6
17.2.1 A/D Data Registers A to D (ADDRA to ADDRD) .............................................. 472
17.2.2 A/D Control/Status Register (ADCSR) ................................................................ 473
17.2.3 A/D Control Register (ADCR).............................................................................. 476
17.2.4 Keyboard Comparator Control Register (KBCOMP) ........................................... 477
17.2.5 Module Stop Control Register (MSTPCR) ........................................................... 478
Interface to Bus Master ...................................................................................................... 479
Operation ............................................................................................................................ 480
17.4.1 Single Mode (SCAN = 0)...................................................................................... 480
17.4.2 Scan Mode (SCAN = 1) ........................................................................................ 482
17.4.3 Input Sampling and A/D Conversion Time .......................................................... 484
17.4.4 External Trigger Input Timing .............................................................................. 485
Interrupts ............................................................................................................................ 485
Usage Notes........................................................................................................................ 486
Section 18 RAM .................................................................................................................... 493
18.1 Overview ............................................................................................................................ 493
18.1.1 Block Diagram ...................................................................................................... 493
18.1.2 Register Configuration .......................................................................................... 494
18.2 System Control Register (SYSCR) .................................................................................... 494
18.3 Operation ............................................................................................................................ 495
18.3.1 Expanded Mode (Modes 1, 2, and 3 (EXPE = 1)) ................................................ 495
18.3.2 Single-Chip Mode (Modes 2 and 3 (EXPE = 0)).................................................. 495
Section 19 ROM .................................................................................................................... 497
19.1 Overview ............................................................................................................................ 497
19.1.1 Block Diagram ...................................................................................................... 497
19.1.2 Register Configuration .......................................................................................... 498
19.2 Register Descriptions.......................................................................................................... 498
19.2.1 Mode Control Register (MDCR) .......................................................................... 498
19.3 Operation ............................................................................................................................ 499
19.4 Overview of Flash Memory................................................................................................ 500
19.4.1 Features ................................................................................................................. 500
19.4.2 Block Diagram ...................................................................................................... 501
19.4.3 Flash Memory Operating Modes .......................................................................... 502
19.4.4 Pin Configuration .................................................................................................. 506
19.4.5 Register Configuration .......................................................................................... 506
19.5 Register Descriptions.......................................................................................................... 507
19.5.1 Flash Memory Control Register 1 (FLMCR1)...................................................... 507
19.5.2 Flash Memory Control Register 2 (FLMCR2)...................................................... 509
19.5.3 Erase Block Registers 1 and 2 (EBR1, EBR2)...................................................... 510
19.5.4 Serial/Timer Control Register (STCR) ................................................................. 511
19.6 On-Board Programming Modes ......................................................................................... 513
19.6.1 Boot Mode............................................................................................................. 513
xi
19.7
19.8
19.9
19.10
19.11
19.12
19.6.2 User Program Mode .............................................................................................. 518
Programming/Erasing Flash Memory ................................................................................ 520
19.7.1 Program Mode....................................................................................................... 520
19.7.2 Program-Verify Mode ........................................................................................... 521
19.7.3 Erase Mode............................................................................................................ 523
19.7.4 Erase-Verify Mode................................................................................................ 523
Flash Memory Protection ................................................................................................... 525
19.8.1 Hardware Protection.............................................................................................. 525
19.8.2 Software Protection ............................................................................................... 525
19.8.3 Error Protection ..................................................................................................... 526
Interrupt Handling when Programming/Erasing Flash Memory........................................ 527
Flash Memory Writer Mode............................................................................................... 528
19.10.1 PROM Mode Setting............................................................................................ 528
19.10.2 Socket Adapters and Memory Map ..................................................................... 529
19.10.3 Writer Mode Operation........................................................................................ 529
19.10.4 Memory Read Mode ............................................................................................ 531
19.10.5 Auto-Program Mode ............................................................................................ 534
19.10.6 Auto-Erase Mode ................................................................................................. 535
19.10.7 Status Read Mode ................................................................................................ 536
19.10.8 Status Polling ....................................................................................................... 538
19.10.9 Writer Mode Transition Time.............................................................................. 538
19.10.10Notes On Memory Programming......................................................................... 539
Flash Memory Programming and Erasing Precautions...................................................... 539
Note on Switching from F-ZTAT Version to Mask ROM Version ................................... 540
Section 20 Clock Pulse Generator ................................................................................... 543
20.1 Overview ............................................................................................................................ 543
20.1.1 Block Diagram ...................................................................................................... 543
20.1.2 Register Configuration .......................................................................................... 543
20.2 Register Descriptions.......................................................................................................... 544
20.2.1 Standby Control Register (SBYCR) ..................................................................... 544
20.2.2 Low-Power Control Register (LPWRCR) ............................................................ 545
20.3 Oscillator ............................................................................................................................ 545
20.3.1 Connecting a Crystal Resonator............................................................................ 545
20.3.2 External Clock Input ............................................................................................. 547
20.4 Duty Adjustment Circuit .................................................................................................... 550
20.5 Medium-Speed Clock Divider............................................................................................ 550
20.6 Bus Master Clock Selection Circuit ................................................................................... 550
20.7 Subclock Input Circuit........................................................................................................ 550
20.8 Subclock Waveform Shaping Circuit................................................................................. 551
20.9 Clock Selection Circuit ...................................................................................................... 551
xii
Section 21 Power-Down State .......................................................................................... 553
21.1 Overview ............................................................................................................................ 553
21.1.1 Register Configuration .......................................................................................... 557
21.2 Register Descriptions.......................................................................................................... 557
21.2.1 Standby Control Register (SBYCR) ..................................................................... 557
21.2.2 Low-Power Control Register (LPWRCR) ............................................................ 559
21.2.3 Timer Control/Status Register (TCSR) ................................................................. 561
21.2.4 Module Stop Control Register (MSTPCR) ........................................................... 562
21.3 Medium-Speed Mode ......................................................................................................... 563
21.4 Sleep Mode......................................................................................................................... 564
21.4.1 Sleep Mode............................................................................................................ 564
21.4.2 Clearing Sleep Mode ............................................................................................. 564
21.5 Module Stop Mode ............................................................................................................. 565
21.5.1 Module Stop Mode................................................................................................ 565
21.5.2 Usage Note ............................................................................................................ 566
21.6 Software Standby Mode ..................................................................................................... 567
21.6.1 Software Standby Mode........................................................................................ 567
21.6.2 Clearing Software Standby Mode ......................................................................... 567
21.6.3 Setting Oscillation Settling Time after Clearing Software Standby Mode ........... 568
21.6.4 Software Standby Mode Application Example ..................................................... 568
21.6.5 Usage Note ............................................................................................................ 569
21.7 Hardware Standby Mode.................................................................................................... 570
21.7.1 Hardware Standby Mode ...................................................................................... 570
21.7.2 Hardware Standby Mode Timing.......................................................................... 571
21.8 Watch Mode ....................................................................................................................... 572
21.8.1 Watch Mode .......................................................................................................... 572
21.8.2 Clearing Watch Mode ........................................................................................... 572
21.9 Subsleep Mode ................................................................................................................... 573
21.9.1 Subsleep Mode ...................................................................................................... 573
21.9.2 Clearing Subsleep Mode ....................................................................................... 573
21.10 Subactive Mode.................................................................................................................. 574
21.10.1 Subactive Mode..................................................................................................... 574
21.10.2 Clearing Subactive Mode...................................................................................... 574
21.11 Direct Transition ................................................................................................................ 575
21.11.1 Overview of Direct Transition .............................................................................. 575
Section 22 Electrical Characteristics [H8S/2128 Series, H8S/2128 F-ZTAT] . 577
22.1 Absolute Maximum Ratings............................................................................................... 577
22.2 DC Characteristics.............................................................................................................. 578
22.3 AC Characteristics.............................................................................................................. 589
22.3.1 Clock Timing ........................................................................................................ 590
22.3.2 Control Signal Timing .......................................................................................... 592
xiii
22.3.3 Bus Timing............................................................................................................ 594
22.3.4 Timing of On-Chip Supporting Modules.............................................................. 601
22.4 A/D Conversion Characteristics ......................................................................................... 609
22.5 Flash Memory Characteristics............................................................................................ 611
22.6 Usage Note ......................................................................................................................... 613
Section 23 Electrical Characteristics [H8S/2124 Series] .......................................... 615
23.1 Absolute Maximum Ratings............................................................................................... 615
23.2 DC Characteristics.............................................................................................................. 616
23.3 AC Characteristics.............................................................................................................. 623
23.3.1 Clock Timing ........................................................................................................ 624
23.3.2 Control Signal Timing .......................................................................................... 626
23.3.3 Bus Timing............................................................................................................ 628
23.3.4 Timing of On-Chip Supporting Modules.............................................................. 635
23.4 A/D Conversion Characteristics ......................................................................................... 640
23.5 Usage Note ......................................................................................................................... 642
Appendix A Instruction Set................................................................................................ 643
A.1
A.2
A.3
A.4
A.5
Instruction........................................................................................................................... 643
Instruction Codes................................................................................................................ 661
Operation Code Map .......................................................................................................... 675
Number of States Required for Execution.......................................................................... 679
Bus States During Instruction Execution ........................................................................... 692
Appendix B Internal I/O Registers .................................................................................. 708
B.1
B.2
B.3
Addresses............................................................................................................................ 708
Register Selection Conditions ............................................................................................ 713
Functions ............................................................................................................................ 719
Appendix C I/O Port Block Diagrams............................................................................ 787
C.1
C.2
C.3
C.4
C.5
C.6
C.7
Port 1 Block Diagram.........................................................................................................
Port 2 Block Diagrams .......................................................................................................
Port 3 Block Diagram.........................................................................................................
Port 4 Block Diagrams .......................................................................................................
Port 5 Block Diagrams .......................................................................................................
Port 6 Block Diagrams .......................................................................................................
Port 7 Block Diagrams .......................................................................................................
787
789
795
796
801
804
809
Appendix D Pin States ........................................................................................................ 810
D.1
Port States in Each Processing State .................................................................................. 810
Appendix E Timing of Transition to and Recovery from Hardware
Standby Mode................................................................................................ 812
xiv
E.1
E.2
Timing of Transition to Hardware Standby Mode ............................................................. 812
Timing of Recovery from Hardware Standby Mode.......................................................... 812
Appendix F Product Code Lineup ................................................................................... 813
Appendix G Package Dimensions.................................................................................... 815
xv
Section 1 Overview
1.1
Overview
The H8S/2128 Series and H8S/2124 Series comprise microcomputers (MCUs) built around the
H8S/2000 CPU, employing Hitachi’s proprietary architecture, and equipped with supporting
modules on-chip.
The H8S/2000 CPU has an internal 32-bit architecture, is provided with sixteen 16-bit general
registers and a concise, optimized instruction set designed for high-speed operation, and can
address a 16-Mbyte linear address space. The instruction set is upward-compatible with H8/300
and H8/300H CPU instructions at the object-code level, facilitating migration from the H8/300,
H8/300L, or H8/300H Series.
On-chip supporting modules required for system configuration include a data transfer controller
(DTC) bus master, ROM and RAM memory, a16-bit free-running timer module (FRT), 8-bit timer
module (TMR), watchdog timer module (WDT), two PWM timers (PWM and PWMX), serial
communication interface (SCI), A/D converter (ADC), and I/O ports. An I2C bus interface (IIC)
can also be incorporated as an option.
The on-chip ROM is either flash memory (F-ZTAT™*) or mask ROM, with a capacity of 64 or
32 kbytes. (128 kbytes in the H8S/2128 F-ZTAT) ROM is connected to the CPU via a 16-bit data
bus, enabling both byte and word data to be accessed in one state. Instruction fetching has been
speeded up, and processing speed increased.
Three operating modes, modes 1 to 3, are provided, and there is a choice of address space and
single-chip mode or externally expanded modes.
The features of the H8S/2128 Series and H8S/2124 Series are shown in Table 1.1.
Note: * F-ZTATTM is a trademark of Hitachi, Ltd.
1
Table 1.1
Overview
Item
Specifications
CPU
•
•
•
•
Operating modes
•
General-register architecture
 Sixteen 16-bit general registers (also usable as sixteen 8-bit
registers or eight 32-bit registers)
High-speed operation suitable for real-time control
 Maximum operating frequency: 20 MHz/5 V, 10 MHz/3 V
 High-speed arithmetic and logic operations
8/16/32-bit register-register add/subtract: 50 ns (20 MHz operation)
16 × 16-bit register-register multiply: 1000 ns (20 MHz operation)
32 ÷ 16-bit register-register divide: 1000 ns (20 MHz operation)
Instruction set suitable for high-speed operation
 Sixty-five basic instructions
 8/16/32-bit transfer/arithmetic and logic instructions
 Unsigned/signed multiply and divide instructions
 Powerful bit-manipulation instructions
Two CPU operating modes
 Normal mode: 64-kbyte address space
 Advanced mode: 16-Mbyte address space
Three MCU operating modes
External Data Bus
CPU Operating
Mode Mode
Description
On-Chip Initial
ROM
Value
Maximum
Value
1
Normal
Expanded mode
with on-chip ROM
disabled
Disabled 8 bits
8 bits
2
Advanced
Expanded mode
with on-chip ROM
enabled
Enabled
8 bits
Single-chip mode
3
Normal
Expanded mode
with on-chip ROM
enabled
Single-chip mode
Bus controller
•
•
2
8 bits
None
Enabled
8 bits
8 bits
None
2-state or 3-state access space can be designated for external
expansion areas
Number of program wait states can be set for external expansion areas
Item
Specifications
Data transfer
controller (DTC)
(H8S/2128 Series)
•
•
•
•
Can be activated by internal interrupt or software
Multiple transfers or multiple types of transfer possible for one
activation source
Transfer possible in repeat mode, block transfer mode, etc.
Request can be sent to CPU for interrupt that activated DTC
16-bit free-running
timer module
(FRT: 1 channel)
•
8-bit timer module
(2 channels: TMR0,
TMR1)
Each channel has:
Timer connection and
8-bit timer module
(2 channels: TMRX,
TMRY)
(Timer connection and
TMRX provided in
H8S/2128 Series)
Input/output and FRT, TMR1, TMRX, TMRY can be interconnected
•
•
•
•
•
•
One 16-bit free-running counter (also usable for external event
counting)
Two output compare outputs
Four input capture inputs (with buffer operation capability)
One 8-bit up-counter (also usable for external event counting)
Two timer constant registers
The two channels can be connected
•
Measurement of input signal or frequency-divided waveform pulse
width and cycle (FRT, TMR1)
Output of waveform obtained by modification of input signal edge (FRT,
TMR1)
Determination of input signal duty cycle (TMRX)
Output of waveform synchronized with input signal (FRT, TMRX,
TMRY)
Automatic generation of cyclical waveform (FRT, TMRY)
Watchdog timer
module
(WDT: 2 channels)
•
•
Watchdog timer or interval timer function selectable
Subclock operation capability (channel 1 only)
8-bit PWM timer
module (PWM)
(H8S/2128 Series)
•
•
•
•
Up to 16 outputs
Pulse duty cycle settable from 0 to 100%
Resolution: 1/256
1.25 MHz maximum carrier frequency (20 MHz operation)
14-bit PWM timer
module (PWMX)
(H8S/2128 Series)
•
•
•
Up to 2 outputs
Resolution: 1/16384
312.5 kHz maximum carrier frequency (20 MHz operation)
•
•
•
Serial communication •
interface
•
(SCI: 2 channels, SCI0,
SCI1)
Asynchronous mode or synchronous mode selectable
Multiprocessor communication function
3
Item
Specifications
A/D converter
•
•
•
•
•
Resolution: 10 bits
Input: 8 channels (dedicated analog input pins)
8 channels (expansion A/D input pins)
High-speed conversion: 6.7 µs minimum conversion time (20 MHz
operation)
Single or scan mode selectable
Sample-and-hold function
A/D conversion can be activated by external trigger or timer trigger
I/O ports
•
•
43 input/output pins (including 24 with LED drive capability)
8 input-only pins
Memory
•
•
Flash memory or mask ROM
High-speed static RAM
•
Product Name
ROM
RAM
H8S/2128
128 kbytes
4 kbytes
H8S/2122,
H8S/2127
64 kbytes
2 kbytes
H8S/2120,
H8S/2126
32 kbytes
2 kbytes
Interrupt controller
•
•
•
Four external interrupt pins (NMI, IRQ0 to IRQ2)
33 internal interrupt sources
Three priority levels settable
Power-down state
•
•
•
•
•
•
Medium-speed mode
Sleep mode
Module stop mode
Software standby mode
Hardware standby mode
Subclock operation
Clock pulse generator •
Built-in duty correction circuit
Packages
•
•
•
64-pin plastic DIP (DP-64S)
64-pin plastic QFP (FP-64A)
80-pin plastic TQFP (TFP-80C)
I 2C bus interface
(IIC: 2 channels)
(option in H8S/2128
Series)
•
•
•
•
Conforms to Philips I2C bus interface standard
Single master mode/slave mode
Arbitration lost condition can be identified
Supports two slave addresses
4
Item
Specifications
Product lineup
(preliminary)
Product Code
Series
Mask ROM
Versions
F-ZTAT™
Versions
ROM/RAM
(Bytes)
H8S/2128
—
HD64F2128
128 k/4 k
HD6432127R
—
64 k/2 k
—
32 k/2 k
—
64 k/2 k
—
32 k/2 k
HD6432127RW*
HD6432126R
Packages
DP-64S,
FP-64A,
TFP-80C
HD6432126RW*
H8S/2124
HD6432122
HD6432120
2
Note: * “W” indicates the I C bus option.
5
1.2
Internal Block Diagram
An internal block diagram of the H8S/2128 Series is shown in figure 1.1, and an internal block
diagram of the H8S/2124 Series in figure 1.2.
Port 3
Port 2
P17/A7/PW7
P16/A6/PW6
P15/A5/PW5
P14/A4/PW4
P13/A3/PW3
P12/A2/PW2
P11/A1/PW1/PWX1
P10/A0/PW0/PWX0
P52/SCK0/SCL0
P51/RXD0
P50/TXD0
Peripheral address bus
Bus controller
P27/A15/PW15/SCK1/CBLANK
P26/A14/PW14/RxD1
P25/A13/PW13/TxD1
P24/A12/PW12/SCL1
P23/ A11/PW11/SDA1
P22/A10/PW10
P21/A9/PW9
P20/A8/PW8
Port 1
RAM
Peripheral data bus
Port 4
DTC
P37/D7
P36/D6
P35/D5
P34/D4
P33/D3
P32/D2
P31/D1
P30/D0
Port 5
P77/AN7
P76/AN6
P75/AN5
P74/AN4
P73/AN3
P72/AN2
P71/AN1
P70/AN0
ROM
Port 6
P67/TMOX/TMO1/CIN7/HSYNCO
P66/FTOB/TMRI1/CIN6/CSYNCI
P65/FTID/TMCI1/CIN5/HSYNCI
P64/FTIC/TMO0/CIN4/CLAMPO
P63/FTIB/TMRI0/CIN3/VFBACKI
P62/FTIA/CIN2/VSYNCI/TMIY
P61/FTOA/CIN1/VSYNCO
P60/FTCI/TMCI0/CIN0/HFBACKI/TMIX
Interrupt
controller
WDT0, WDT1
8-bit PWM
14-bit PWM
16-bit FRT
8-bit timer × 4ch
Timer connection
(TMR0, TMR1,
TMRX, TMRY)
Port 7
P47/WAIT/SDA0
P46/ø/EXCL
P45/AS/IOS
P44/WR
P43/RD
P42/IRQ0
P41/IRQ1
P40/IRQ2/ADTRG
H8S/2000 CPU
Internal address bus
MD1
MD0
EXTAL
XTAL
STBY
RES
NMI
Internal data bus
Clock pulse generator
VCC1
VCC2
VSS
VSS
SCI × 2ch
IIC × 2ch (option)
10-bit A/D
Figure 1.1 Internal Block Diagram of H8S/2128 Series
6
AVCC
AVSS
Port 3
Port 2
P27/ A15/SCK1
P26/ A14/RxD1
P25/ A13/TxD1
P24/ A12
P23/ A11
P22/ A10
P21/ A9
P20/ A8
Port 1
P17/ A7
P16/ A6
P15/ A5
P14/ A4
P13/ A3
P12/ A2
P11/ A1
P10/ A0
P52/ SCK0
P51/ RXD0
P50/ TXD0
Peripheral address bus
Peripheral data bus
Bus controller
Internal address bus
Port 4
P37/ D7
P36/ D6
P35/ D5
P34/ D4
P33/ D3
P32/ D2
P31/ D1
P30/ D0
Port 5
P77/ AN7
P76/ AN6
P75/ AN5
P74/ AN4
P73/ AN3
P72/ AN2
P71/ AN1
P70/ AN0
ROM
WDT0, WDT1
RAM
Port 6
P67/TMO1/CIN7
P66/ FTOB/TMRI1/CIN6
P65/ FTID/TMCI1/CIN5
P64/ FTIC/TMO0/CIN4
P63/ FTIB/TMRI0/CIN3
P62/ FTIA/ C I N 2 /TMIY
P61/ FTOA/CIN1
P60/ FTCI/TMCI0/CIN0
H8S/2000 CPU
Interrupt
controller
16-bit FRT
8-bit timer × 3ch
(TMR0, TMR1,
TMRY)
Port 7
P47/ WAIT
P46/ ø/EXCL
P45/ AS/IOS
P44/ WR
P43/ RD
P42/ IRQ0
P41/ IRQ1
P40/ IRQ2/ ADTRG
Clock pulse generator
MD1
MD0
EXTAL
XTAL
STBY
RES
NMI
Internal data bus
VCC1
VCC2
VSS
VSS
SCI × 2ch
10-bit A/D
AVCC
AVSS
Figure 1.2 Internal Block Diagram of H8S/2124 Series
7
1.3
Pin Arrangement and Functions
1.3.1
Pin Arrangement
The pin arrangement of the H8S/2128 Series is shown in figures 1.3 to 1.5, and the pin
arrangement of the H8S/2124 Series in figures 1.6 to 1.8.
ADTRG/IRQ2/P40
IRQ1/P41
IRQ0/P42
RD/P43
WR/P44
IOS/AS/P45
EXCL/ø/P46
SDA0/WAIT/P47
TxD0/P50
RxD0/P51
SCL0/SCK0/P52
RES
NMI
VCC2
STBY
VSS
XTAL
EXTAL
MD1
MD0
AVSS
AN0/P70
AN1/P71
AN2/P72
AN3/P73
AN4/P74
AN5/P75
AN6/P76
AN7/P77
AVCC
TMIX/HFBACKI/CIN0/TMCI0/FTCI/P60
VSYNCO/CIN1/FTOA/P61
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
P37/D7
P36/D6
P35/D5
P34/D4
P33/D3
P32/D2
P31/D1
P30/D0
P10/A0/PW0/PWX0
P11/A1/PW1/PWX1
P12/A2/PW2
P13/A3/PW3
P14/A4/PW4
P15/A5/PW5
P16/A6/PW6
P17/A7/PW7
VSS
P20/A8/PW8
P21/A9/PW9
P22/A10/PW10
P23/A11/PW11/SDA1
P24/A12/PW12/SCL1
P25/A13/PW13/TxD1
P26/A14/PW14/RxD1
P27/A15/PW15/SCK1/CBLANK
VCC1
P67/TMOX/TMO1/CIN7/HSYNCO
P66/FTOB/TMRI1/CIN6/CSYNCI
P65/FTID/TMCI1/CIN5/HSYNCI
P64/FTIC/TMO0/CIN4/CLAMPO
P63/FTIB/TMRI0/CIN3/VFBACKI
P62/FTIA/CIN2/VSYNCI/TMIY
Figure 1.3 Pin Arrangement of H8S/2128 Series (DP-64S: Top View)
8
P10/A0/PW0/PWX0
P11/A1/PW1/PWX1
P12/A2/PW2
P13/A3/PW3
P14/A4/PW4
P15/A5/PW5
P16/A6/PW6
P17/A7/PW7
VSS
P20/A8/PW8
P21/A9/PW9
P22/A10/PW10
P23/A11/PW11/SDA1
P24/A12/PW12/SCL1
P25/A13/PW13/TxD1
P26/A14/PW14/RxD1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
CBLANK/SCK1/PW15/A15/P27
VCC1
HSYNCO/CIN7/TMO1/TMOX/P67
CSYNCI/CIN6/TMRI1/FTOB/P66
HSYNCI/CIN5/TMCI1/FTID/P65
CLAMPO/CIN4/TMO0/FTIC/P64
VFBACKI /CIN3/TMRI0/FTIB/P63
TMIY/VSYNCI/CIN2/FTIA/P62
VSYNCO/CIN1/FTOA/P61
TMIX/HFBACKI/CIN0/TMCI0/FTCI/P60
AVCC
AN7/P77
AN6/P76
AN5/P75
AN4/P74
AN3/P73
TxD0/P50
RxD0/P51
SCL0/SCK0/P52
RES
NMI
VCC2
STBY
VSS
XTAL
EXTAL
MD1
MD0
AVSS
AN0/P70
AN1/P71
AN2/P72
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
P30/D0
P31/D1
P32/D2
P33/D3
P34/D4
P35/D5
P36/D6
P37/D7
P40/IRQ2/ADTRG
P41/IRQ1
P42/IRQ0
P43/RD
P44/WR
P45/AS/IOS
P46/ø/EXCL
P47/WAIT/SDA0
Figure 1.4 Pin Arrangement of H8S/2128 Series (FP-64A: Top View)
9
P10/A0/PW0/PWX0
P11/A1/PW1/PWX1
P12/A2/PW2
P13/A3/PW3
P14/A4/PW4
VSS
P15/A5/PW5
P16/A6/PW6
P17/A7/PW7
VSS
VSS
VSS
P20/A8/PW8
P21/A9/PW9
P22/A10/PW10
VSS
P23/A11/PW11/SDA1
P24/A12/PW12/SCL1
P25/A13/PW13/TxD1
P26/A14/PW14/RxD1
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
CBLANK/SCK1/PW15/A15/P27
VCC1
HSYNCO/CIN7/TMO1/TMOX/P67
CSYNCI/CIN6/TMRI1/FTOB/P66
HSYNCI/CIN5/TMCI1/FTID/P65
CLAMPO/CIN4/TMO0/FTIC/P64
VSS
VFBACKI /CIN3/TMRI0/FTIB/P63
TMIY/VSYNCI/CIN2/FTIA/P62
VSS
VSYNCO/CIN1/FTOA/P61
VSS
TMIX/HFBACKI/CIN0/TMCI0/FTCI/P60
AVCC
AN7/P77
AN6/P76
VSS
AN5/P75
AN4/P74
AN3/P73
TxD0/P50
RxD0/P51
SCL0/SCK0/P52
RES
NMI
VCC2
STBY
VSS
VSS
VSS
XTAL
VSS
EXTAL
MD1
VSS
MD0
AVSS
AN0/P70
AN1/P71
AN2/P72
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
P30/D0
P31/D1
P32/D2
P33/D3
P34/D4
VSS
P35/D5
P36/D6
P37/D7
VSS
P40/IRQ2/ADTRG
P41/IRQ1
VSS
P42/IRQ0
P43/RD
VSS
P44/WR
P45/AS/IOS
P46/ø/EXCL
P47/WAIT/SDA0
Figure 1.5 Pin Arrangement of H8S/2128 Series (TFP-80C: Top View)
10
ADTRG/IRQ2/P40
IRQ1/P41
IRQ0/P42
RD/P43
WR/P44
IOS/AS/P45
EXCL/ø/P46
WAIT/P47
TxD0/P50
RxD0/P51
SCK0/P52
RES
NMI
VCC2
STBY
VSS
XTAL
EXTAL
MD1
MD0
AVSS
AN0/P70
AN1/P71
AN2/P72
AN3/P73
AN4/P74
AN5/P75
AN6/P76
AN7/P77
AVCC
CIN0/TMCI0/FTCI/P60
CIN1/FTOA/P61
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
P37/D7
P36/D6
P35/D5
P34/D4
P33/D3
P32/D2
P31/D1
P30/D0
P10/A0
P11/A1
P12/A2
P13/A3
P14/A4
P15/A5
P16/A6
P17/A7
VSS
P20/A8
P21/A9
P22/A10
P23/A11
P24/A12
P25/A13/TxD1
P26/A14/RxD1
P27/A15/SCK1
VCC1
P67/TMO1/CIN7
P66/FTOB/TMRI1/CIN6
P65/FTID/TMCI1/CIN5
P64/FTIC/TMO0/CIN4
P63/FTIB/TMRI0/CIN3
P62/FTIA/CIN2/TMIY
Figure 1.6 Pin Arrangement of H8S/2124 Series (DP-64S: Top View)
11
P10/A0
P11/A1
P12/A2
P13/A3
P14/A4
P15/A5
P16/A6
P17/A7
VSS
P20/A8
P21/A9
P22/A10
P23/A11
P24/A12
P25/A13/TxD1
P26/A14/RxD1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
A15/P27/SCK1
VCC1
CIN7/TMO1/P67
CIN6/TMRI1/FTOB/P66
CIN5/TMCI1/FTID/P65
CIN4/TMO0/FTIC/P64
CIN3/TMRI0/FTIB/P63
TMIY/CIN2/FTIA/P62
CIN1/FTOA/P61
CIN0/TMCI0/FTCI/P60
AVCC
AN7/P77
AN6/P76
AN5/P75
AN4/P74
AN3/P73
TxD0/P50
RxD0/P51
SCK0/P52
RES
NMI
VCC2
STBY
VSS
XTAL
EXTAL
MD1
MD0
AVSS
AN0/P70
AN1/P71
AN2/P72
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
P30/D0
P31/D1
P32/D2
P33/D3
P34/D4
P35/D5
P36/D6
P37/D7
P40/IRQ2/ADTRG
P41/IRQ1
P42/IRQ0
P43/RD
P44/WR
P45/AS/IOS
P46/ø/EXCL
P47/WAIT
Figure 1.7 Pin Arrangement of H8S/2124 Series (FP-64A: Top View)
12
P10/A0
P11/A1
P12/A2
P13/A3
P14/A4
VSS
P15/A5
P16/A6
P17/A7
VSS
VSS
VSS
P20/A8
P21/A9
P22/A10
VSS
P23/A11
P24/A12
P25/A13/TxD1
P26/A14/RxD1
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
A15/P27/SCK1
VCC1
CIN7/TMO1/P67
CIN6/TMRI1/FTOB/P66
CIN5/TMCI1/FTID/P65
CIN4/TMO0/FTIC/P64
VSS
CIN3/TMRI0/FTIB/P63
TMIY/CIN2/FTIA/P62
VSS
CIN1/FTOA/P61
VSS
CIN0/TMCI0/FTCI/P60
AVCC
AN7/P77
AN6/P76
VSS
AN5/P75
AN4/P74
AN3/P73
TxD0/P50
RxD0/P51
SCK0/P52
RES
NMI
VCC2
STBY
VSS
VSS
VSS
XTAL
VSS
EXTAL
MD1
VSS
MD0
AVSS
AN0/P70
AN1/P71
AN2/P72
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
P30/D0
P31/D1
P32/D2
P33/D3
P34/D4
VSS
P35/D5
P36/D6
P37/D7
VSS
P40/IRQ2/ADTRG
P41/IRQ1
VSS
P42/IRQ0
P43/RD
VSS
P44/WR
P45/AS/IOS
P46/ø/EXCL
P47/WAIT
Figure 1.8 Pin Arrangement of H8S/2124 Series (TFP-80C: Top View)
13
1.3.2
Pin Functions in Each Operating Mode
Tables 1.2 and 1.3 show the pin functions of the H8S/2128 Series and H8S/2124 Series in each of
the operating modes.
Table 1.2
H8S/2128 Series Pin Functions in Each Operating Mode
Pin Name
Pin No.
DP-64S FP-64A TFP-80C Mode 1
Single-Chip
Modes
Flash
Memory
Progr am
Mode 2 (EXPE = 1) Mode 2 (EXPE = 0) mer
Mode 3 (EXPE = 1) Mode 3 (EXPE = 0) Mode
Expanded Modes
1
57
71
P40/IRQ2/ADTRG P40/IRQ2/ADTRG
P40/IRQ2/ADTRG
VCC
2
58
72
P41/IRQ1
P41/IRQ1
P41/IRQ1
VCC
—
—
73
VSS
VSS
VSS
VSS
3
59
74
P42/IRQ0
P42/IRQ0
P42/IRQ0
VSS
4
60
75
RD
RD
P43
WE
—
—
76
VSS
VSS
VSS
VSS
5
61
77
WR
WR
P44
FA15
6
62
78
AS/IOS
AS/IOS
P45
FA16
7
63
79
ø/P46/EXCL
P46/ø/EXCL
P46/ø/EXCL
NC
8
64
80
P47/WAIT/SDA0 P47/WAIT/SDA0
P47/SDA0
VCC
9
1
1
P50/TxD0
P50/TxD0
P50/TxD0
NC
10
2
2
P51/RxD0
P51/RxD0
P51/RxD0
FA17
11
3
3
P52/SCK0/SCL0 P52/SCK0/SCL0
P52/SCK0/SCL0
NC
12
4
4
RES
RES
RES
RES
13
5
5
NMI
NMI
NMI
FA9
14
6
6
VCC2
VCC2
VCC2
VCC
15
7
7
STBY
STBY
STBY
VCC
16
8
8
VSS
VSS
VSS
VSS
—
—
9
VSS
VSS
VSS
VSS
—
—
10
VSS
VSS
VSS
VSS
17
9
11
XTAL
XTAL
XTAL
XTAL
—
—
12
VSS
VSS
VSS
VSS
18
10
13
EXTAL
EXTAL
EXTAL
EXTAL
19
11
14
MD1
MD1
MD1
VSS
14
Pin Name
Single-Chip
Modes
DP-64S FP-64A TFP-80C Mode 1
Flash
Memory
Progr am
Mode 2 (EXPE = 1) Mode 2 (EXPE = 0) mer
Mode 3 (EXPE = 1) Mode 3 (EXPE = 0) Mode
—
—
15
VSS
VSS
VSS
VSS
20
12
16
MD0
MD0
MD0
VSS
21
13
17
AVSS
AVSS
AVSS
VSS
22
14
18
P70/AN0
P70/AN0
P70/AN0
NC
23
15
19
P71/AN1
P71/AN1
P71/AN1
NC
24
16
20
P72/AN2
P72/AN2
P72/AN2
NC
25
17
21
P73/AN3
P73/AN3
P73/AN3
NC
26
18
22
P74/AN4
P74/AN4
P74/AN4
NC
27
19
23
P75/AN5
P75/AN5
P75/AN5
NC
—
—
24
VSS
VSS
VSS
VSS
28
20
25
P76/AN6
P76/AN6
P76/AN6
NC
29
21
26
P77/AN7
P77/AN7
P77/AN7
NC
30
22
27
AVCC
AVCC
AVCC
VCC
31
23
28
P60/FTCI/TMCI0/ P60/FTCI/TMCI0/
CIN0/HFBACKI/ CIN0/HFBACKI/
TMIX
TMIX
P60/FTCI/TMCI0/
CIN0/HFBACKI/
TMIX
NC
—
—
29
VSS
VSS
VSS
32
24
30
P61/FTOA/CIN1/ P61/FTOA/CIN1/
VSYNCO
VSYNCO
P61/FTOA/CIN1/
VSYNCO
NC
—
—
31
VSS
VSS
VSS
VSS
33
25
32
P62/FTIA/CIN2/
VSYNCI/TMIY
P62/FTIA/CIN2/
VSYNCI/TMIY
P62/FTIA/CIN2/
VSYNCI/TMIY
NC
34
26
33
P63/FTIB/TMRI0/ P63/FTIB/TMRI0/
CIN3/VFBACKI
CIN3/VFBACKI
P63/FTIB/TMRI0/
CIN3/VFBACKI
NC
—
—
34
VSS
VSS
VSS
35
27
35
P64/FTIC/TMO0/ P64/FTIC/TMO0/
CIN4/CLAMPO
CIN4/CLAMPO
P64/FTIC/TMO0/
CIN4/CLAMPO
NC
36
28
36
P65/FTID/TMCI1/ P65/FTID/TMCI1/
CIN5/HSYNCI
CIN5/HSYNCI
P65/FTID/TMCI1/
CIN5/HSYNCI
NC
37
29
37
P66/FTOB/TMRI1/ P66/FTOB/TMRI1/
CIN6/CSYNCI
CIN6/CSYNCI
P66/FTOB/TMRI1/
CIN6/CSYNCI
NC
Pin No.
Expanded Modes
VSS
VSS
15
Pin Name
Pin No.
DP-64S FP-64A TFP-80C Mode 1
Single-Chip
Modes
Flash
Memory
Progr am
Mode 2 (EXPE = 1) Mode 2 (EXPE = 0) mer
Mode 3 (EXPE = 1) Mode 3 (EXPE = 0) Mode
Expanded Modes
38
30
38
P67/TMOX/
TMO1/CIN7/
HSYNCO
P67/TMOX/TMO1/
CIN7/HSYNCO
P67/TMO1/TMOX/
CIN7/HSYNCO
VSS
39
31
39
VCC1
VCC1
VCC1
VCC
40
32
40
A15
A15/P27/PW15/
SCK1/CBLANK
P27/PW15/
SCK1/CBLANK
CE
41
33
41
A14
A14/P26/PW14/
RxD1
P26/PW14/
RxD1
FA14
42
34
42
A13
A13/P25/PW13/
TxD1
P25/PW13/
TxD1
FA13
43
35
43
A12
A12/P24/PW12/
SCL1
P24/PW12/SCL1
FA12
44
36
44
A11
A11/P23/PW11/
SDA1
P23/PW11/SDA1
FA11
—
—
45
VSS
VSS
VSS
VSS
45
37
46
A10
A10/P22/PW10
P22 /PW10
FA10
46
38
47
A9
A9 /P21/PW9
P21/PW9
OE
47
39
48
A8
A8 /P20 /PW8
P20/PW8
FA8
—
—
49
VSS
VSS
VSS
VSS
48
40
50
VSS
VSS
VSS
VSS
—
—
51
VSS
VSS
VSS
VSS
49
41
52
A7
A7/P17/PW7
P17/PW7
FA7
50
42
53
A6
A6/P16/PW6
P16/PW6
FA6
51
43
54
A5
A5/P15/PW5
P15/PW5
FA5
—
—
55
VSS
VSS
VSS
VSS
52
44
56
A4
A4/P14/PW4
P14/PW4
FA4
53
45
57
A3
A3/P13/PW3
P13/PW3
FA3
54
46
58
A2
A2/P12/PW2
P12/PW2
FA2
55
47
59
A1
A1/P11/PW1/PWX1 P11/PW1/PWX1
FA1
56
48
60
A0
A0/P10/PW0/PWX0 P10/PW0/PWX0
FA0
16
Pin Name
Single-Chip
Modes
DP-64S FP-64A TFP-80C Mode 1
Flash
Memory
Progr am
Mode 2 (EXPE = 1) Mode 2 (EXPE = 0) mer
Mode 3 (EXPE = 1) Mode 3 (EXPE = 0) Mode
57
49
61
D0
D0
P30
FO0
58
50
62
D1
D1
P31
FO1
59
51
63
D2
D2
P32
FO2
60
52
64
D3
D3
P33
FO3
61
53
65
D4
D4
P34
FO4
—
—
66
VSS
VSS
VSS
VSS
62
54
67
D5
D5
P35
FO5
63
55
68
D6
D6
P36
FO6
64
56
69
D7
D7
P37
FO7
—
—
70
VSS
VSS
VSS
VSS
Pin No.
Expanded Modes
17
Table 1.3
H8S/2124 Series Pin Functions in Each Operating Mode
Pin Name
Pin No.
DP-64S FP-64A TFP-80C Mode 1
Single-Chip
Modes
Flash
Memory
Progr am
Mode 2 (EXPE = 1) Mode 2 (EXPE = 0) mer
Mode 3 (EXPE = 1) Mode 3 (EXPE = 0) Mode
Expanded Modes
1
57
71
P40/IRQ2/ADTRG P40/IRQ2/ADTRG
P40/IRQ2/ADTRG
VCC
2
58
72
P41/IRQ1
P41/IRQ1
P41/IRQ1
VCC
—
—
73
VSS
VSS
VSS
VSS
3
59
74
P42/IRQ0
P42/IRQ0
P42/IRQ0
VSS
4
60
75
RD
RD
P43
WE
—
—
76
VSS
VSS
VSS
VSS
5
61
77
WR
WR
P44
FA15
6
62
78
AS/IOS
AS/IOS
P45
FA16
7
63
79
P46/ø/EXCL
P46/ø/EXCL
P46/ø/EXCL
NC
8
64
80
P47/WAIT
P47/WAIT
P47
VCC
9
1
1
P50/TxD0
P50/TxD0
P50/TxD0
NC
10
2
2
P51/RxD0
P51/RxD0
P51/RxD0
FA17
11
3
3
P52/SCK0
P52/SCK0
P52/SCK0
NC
12
4
4
RES
RES
RES
RES
13
5
5
NMI
NMI
NMI
FA9
14
6
6
VCC2
VCC2
VCC2
VCC
15
7
7
STBY
STBY
STBY
VCC
16
8
8
VSS
VSS
VSS
VSS
—
—
9
VSS
VSS
VSS
VSS
—
—
10
VSS
VSS
VSS
VSS
17
9
11
XTAL
XTAL
XTAL
XTAL
—
—
12
VSS
VSS
VSS
VSS
18
10
13
EXTAL
EXTAL
EXTAL
EXTAL
19
11
14
MD1
MD1
MD1
VSS
—
—
15
VSS
VSS
VSS
VSS
20
12
16
MD0
MD0
MD0
VSS
21
13
17
AVSS
AVSS
AVSS
VSS
22
14
18
P70/AN0
P70/AN0
P70/AN0
NC
18
Pin Name
Single-Chip
Modes
DP-64S FP-64A TFP-80C Mode 1
Flash
Memory
Progr am
Mode 2 (EXPE = 1) Mode 2 (EXPE = 0) mer
Mode 3 (EXPE = 1) Mode 3 (EXPE = 0) Mode
23
15
19
P71/AN1
P71/AN1
P71/AN1
NC
24
16
20
P72/AN2
P72/AN2
P72/AN2
NC
25
17
21
P73/AN3
P73/AN3
P73/AN3
NC
26
18
22
P74/AN4
P74/AN4
P74/AN4
NC
27
19
23
P75/AN5
P75/AN5
P75/AN5
NC
—
—
24
VSS
VSS
VSS
VSS
28
20
25
P76/AN6
P76/AN6
P76/AN6
NC
29
21
26
P77/AN7
P77/AN7
P77/AN7
NC
30
22
27
AVCC
AVCC
AVCC
VCC
31
23
28
P60/FTCI/TMCI0/ P60/FTCI/TMCI0/
CIN0
CIN0
P60/FTCI/TMCI0/
CIN0
NC
—
—
29
VSS
VSS
VSS
VSS
32
24
30
P61/FTOA/CIN1
P61/FTOA/CIN1
P61/FTOA/CIN1
NC
—
—
31
VSS
VSS
VSS
VSS
33
25
32
P62/FTIA/CIN2/
TMIY
P62/FTIA/CIN2/
TMIY
P62/FTIA/CIN2/
TMIY
NC
34
26
33
P63/FTIB/TMRI0/ P63/FTIB/TMRI0/
CIN3
CIN3
P63/FTIB/TMRI0/
CIN3
NC
—
—
34
VSS
VSS
VSS
35
27
35
P64/FTIC/TMO0/ P64/FTIC/TMO0/
CIN4
CIN4
P64/FTIC/TMO0/
CIN4
NC
36
28
36
P65/FTID/TMCI1/ P65/FTID/TMCI1/
CIN5
CIN5
P65/FTID/TMCI1/
CIN5
NC
37
29
37
P66/FTOB/TMRI1/ P66/FTOB/TMRI1/
CIN6
CIN6
P66/FTOB/TMRI1/
CIN6
NC
38
30
38
P67/TMO1/CIN7
P67/TMO1/CIN7
P67/TMO1/CIN7
VSS
39
31
39
VCC1
VCC1
VCC1
VCC
40
32
40
A15
A15/P27/SCK1
P27/SCK1
CE
41
33
41
A14
A14/P26/RxD1
P26/RxD1
FA14
Pin No.
Expanded Modes
VSS
19
Pin Name
Single-Chip
Modes
DP-64S FP-64A TFP-80C Mode 1
Flash
Memory
Progr am
Mode 2 (EXPE = 1) Mode 2 (EXPE = 0) mer
Mode 3 (EXPE = 1) Mode 3 (EXPE = 0) Mode
42
34
42
A13
A13/P25/TxD1
P25/TxD1
FA13
43
35
43
A12
A12/P24
P24
FA12
44
36
44
A11
A11/P23
P23
FA11
—
—
45
VSS
VSS
VSS
VSS
45
37
46
A10
A10/P22
P22
FA10
46
38
47
A9
A9 /P21
P21
OE
47
39
48
A8
A8 /P20
P20
FA8
—
—
49
VSS
VSS
VSS
VSS
48
40
50
VSS
VSS
VSS
VSS
—
—
51
VSS
VSS
VSS
VSS
49
41
52
A7
A7/P17
P17
FA7
50
42
53
A6
A6/P16
P16
FA6
51
43
54
A5
A5/P15
P15
FA5
—
—
55
VSS
VSS
VSS
VSS
52
44
56
A4
A4/P14
P14
FA4
53
45
57
A3
A3/P13
P13
FA3
54
46
58
A2
A2/P12
P12
FA2
55
47
59
A1
A1/P11
P11
FA1
56
48
60
A0
A0/P10
P10
FA0
57
49
61
D0
D0
P30
FO0
58
50
62
D1
D1
P31
FO1
59
51
63
D2
D2
P32
FO2
60
52
64
D3
D3
P33
FO3
61
53
65
D4
D4
P34
FO4
—
—
66
VSS
VSS
VSS
VSS
62
54
67
D5
D5
P35
FO5
63
55
68
D6
D6
P36
FO6
64
56
69
D7
D7
P37
FO7
—
—
70
VSS
VSS
VSS
VSS
Pin No.
20
Expanded Modes
1.3.3
Pin Functions
Table 1.4 summarizes the functions of the H8S/2128 Series and H8S/2124 Series pins.
Table 1.4
Pin Functions
Pin No.
Type
Symbol
DP-64S FP-64A
TFP-80C
I/O
Name and Function
Power
supply
VCC1,
VCC2
14, 39
6, 31
6, 39
Input
Power supply: For connection to
the power supply. All VCC1 and
VCC2 pins should be connected to
the system power supply.
VSS
16, 48
8, 40
8, 9, 10, Input
12, 15, 24,
29, 31, 34,
45, 49, 50,
51, 55, 66,
70, 73, 76
Ground: For connection to the
power supply (0 V). All VSS pins
should be connected to the system
power supply (0 V).
XTAL
17
9
11
Input
Connected to a crystal oscillator.
See section 21, Clock Pulse
Generator, for typical connection
diagrams for a crystal oscillator and
external clock input.
EXTAL
18
10
13
Input
Connected to a crystal oscillator.
The EXTAL pin can also input an
external clock. See section 21,
Clock Pulse Generator, for typical
connection diagrams for a crystal
oscillator and external clock input.
ø
7
63
79
Output System clock: Supplies the
system clock to external devices.
EXCL
7
63
79
Input
Clock
External subclock input: Input a
32.768 kHz external subclock.
21
Pin No.
Type
Symbol
DP-64S FP-64A
TFP-80C
I/O
Name and Function
Operating
mode
control
MD1
MD0
19
20
14
16
Input
Mode pins: These pins set the
operating mode. The relation
between the settings of pins MD1
and MD0 and the operating mode
is shown below. These pins should
not be changed while the MCU is
operating.
11
12
Operating
MD1 MD0 Mode
Description
0
1
Mode 1
Normal
Expanded mode
with on-chip
ROM disabled
1
0
Mode 2
Advanced
Expanded mode
with on-chip
ROM enabled
Single-chip
mode
1
1
Mode 3
Normal
Expanded mode
with on-chip
ROM enabled
Single-chip
mode
RES
12
4
4
Input
Reset input: When this pin is
driven low, the chip is reset.
STBY
15
7
7
Input
Standby: When this pin is driven
low, a transition is made to
hardware standby mode.
Address
bus
A15 to
A0
40 to 47, 32 to 39, 40 to 44,
49 to 56 41 to 48 46 to 48,
52 to 54,
56 to 60
Data bus
D7 to D0 64 to 57 56 to 49 69 to 67,
65 to 61
System
control
22
Output Address bus: These pins output
an address.
Input/
output
Data bus: These pins constitute a
bidirectional data bus.
Pin No.
Type
Symbol
DP-64S FP-64A
TFP-80C
I/O
Name and Function
Bus
control
WAIT
8
64
80
Input
Wait: Requests insertion of a wait
state in the bus cycle when
accessing external 3-state address
space.
RD
4
60
75
Output Read: When this pin is low, it
indicates that the external address
space is being read.
WR
5
61
77
Output Write: When this pin is low, it
indicates that the external address
space is being written to.
AS/IOS
6
62
78
Output Address strobe: When this pin is
low, it indicates that address output
on the address bus is valid.
NMI
13
5
5
Input
IRQ0 to
IRQ2
1 to 3
57 to 59 71, 72, 74 Input
Interrupt request 0 to 2: These
pins request a maskable interrupt
31
23
28
Input
FRT counter clock input: Input pin
for an external clock signal for the
free-running counter (FRC).
FTOA
32
24
30
Output FRT output compare A output:
The output compare A output pin.
FTOB
37
29
37
Output FRT output compare B output:
The output compare B output pin.
FTIA
33
25
32
Input
FRT input capture A input: The
input capture A input pin.
FTIB
34
26
33
Input
FRT input capture B input: The
input capture B input pin.
FTIC
25
27
35
Input
FRT input capture C input: The
input capture C input pin.
FTID
36
28
36
Input
FRT input capture D input: The
input capture D input pin.
Interrupt
signals
16-bit free- FTCI
running
timer (FRT)
Nonmaskable interrupt: Requests
a nonmaskable interrupt.
23
Pin No.
Type
Symbol
DP-64S FP-64A
TFP-80C
I/O
8-bit timer
(TMR0,
TMR1,
TMRX,
TMRY)
TMO0
TMO1
TMOX
35
38
38
27
30
30
35
38
38
Output Compare-match output: TMR0,
TMR1, and TMRX compare-match
output pins.
TMCI0
TMCI1
31
36
23
28
28
36
Input
Counter external clock input:
TMR0 and TMR1 input pins for the
external clock input to the counter.
TMRI0
TMRI1
34
37
26
29
33
37
Input
Counter external reset input:
TMR0 and TMR1 counter reset
input pins.
TMIX
TMIY
31
33
23
25
28
32
Input
Counter external clock input and
reset input: TMRX and TMRY
counter clock input pins and reset
input pins.
TxD0
TxD1
9
42
1
34
1
42
Output Transmit data: Data output pins.
RxD0
RxD1
10
41
2
33
2
41
Input
Receive data: Data input pins.
SCK0
SCK1
11
40
3
32
3
40
Input/
output
Serial clock: Clock input/output
pins.
Serial communication
interface
(SCI0,
SCI1)
Name and Function
The SCK0 output type is NMOS
push-pull only by the H8S/2128
Series and is CMOS output in the
H8S/2124 Series.
A/D
converter
24
AN7 to
AN0
29 to 22 21 to 14 26, 25,
23 to 18
Input
Analog 7 to 0: Analog input pins.
CIN0 to
CIN7
31 to 38 23 to 30 28, 30,
32 to 33,
35 to 38
Input
Expansion A/D input: Expansion
A/D input pins can be connected to
the A/D converter, but as they are
also used as digital I/O pins,
precision falls to the equivalent of
6-bit resolution.
ADTRG
1
Input
A/D conversion external trigger
input: Pin for input of an external
trigger to start A/D conversion.
57
71
Pin No.
Type
Symbol
DP-64S FP-64A
TFP-80C
I/O
Name and Function
A/D
converter
AVCC
30
27
Input
Analog power supply: The
reference power supply pin for the
A/D converter.
22
When the A/D converter is not
used, this pin should be connected
to the system power supply (+5 V
or +3 V).
AVSS
21
13
17
Input
Analog ground: The ground pin for
the A/D converter. This pin should
be connected to the system power
supply (0 V).
PWM timer PW15 to 40 to 47, 32 to 39, 40 to 44,
(PWM)
PW0
49 to 56 41 to 48 46 to 48,
52 to 54,
56 to 60
Output PWM timer output: PWM timer
pulse output pins.
14-bit PWM PWX0
PWX1
timer
(PWMX)
56
55
48
47
60
59
Output PWMX timer output: PWM D/A
pulse output pins.
Timer
VSYNCI
connection HSYNCI
CSYNCI
VFBACKI
HFBACKI
33
36
37
34
31
25
28
29
26
23
32
36
37
33
28
Input
VSYNCO
HSYNCO
CLAMPO
CBLANK
32
38
35
40
24
30
27
32
30
38
35
40
Output Timer connection output: Timer
connection synchronous signal
output pins.
SCL0
SCL1
11
43
3
35
3
43
Input/
output
I 2C clock input/output (channels
0 and 1): I2C clock I/O pins. These
pins have a bus drive function.
The SCL0 output form is NMOS
open-drain.
SDA0
SDA1
8
44
64
36
80
44
Input/
output
I 2C clock input/output (channels
0 and 1): I2C clock I/O pins. These
pins have a bus drive function.
The SDA0 output form is NMOS
open-drain.
I 2C bus
interface
(IIC)
(option)
Timer connection input: Timer
connection synchronous signal
input pins.
25
Pin No.
Type
Symbol
DP-64S FP-64A
I/O ports
P17 to
P10
26
TFP-80C
I/O
Name and Function
49 to 56 41 to 48 52 to 54,
56 to 60
Input/
output
Port 1: Eight input/output pins. The
data direction of each pin can be
selected in the port 1 data direction
register (P1DDR). These pins have
built-in MOS input pull-ups, and
also have LED drive capability.
P27 to
P20
40 to 47 32 to 39 40 to 44,
46 to 48
Input/
output
Port 2: Eight input/output pins. The
data direction of each pin can be
selected in the port 2 data direction
register (P2DDR). These pins have
built-in MOS input pull-ups, and
also have LED drive capability.
P37 to
P30
64 to 57 56 to 49 69 to 67,
65 to 61
Input/
output
Port 3: Eight input/output pins. The
data direction of each pin can be
selected in the port 3 data direction
register (P3DDR). These pins have
built-in MOS input pull-ups, and
also have LED drive capability.
P47 to
P40
8 to 1
64 to 57 80 to 77,
75, 74,
72, 71
Input/
output
Port 4: Eight input/output pins. The
data direction of each pin can be
selected in the port 4 data direction
register (P4DDR). (Except P46)
P47 is an NMOS push-pull output
only by the H8S/2128 Series.
P52 to
P50
11 to 9
3 to 1
Input/
output
Port 5: Three input/output pins.
The data direction of each pin can
be selected in the port 5 data
direction register (P5DDR). P52 is
an NMOS push-pull output only by
the H8S/2128 Series and is an
CMOS output in the H8S/2124
Series.
P67 to
P60
38 to 31 30 to 23 38 to 35,
33, 32,
30, 28
Input/
output
Port 6: Eight input/output pins. The
data direction of each pin can be
selected in the port 6 data direction
register (P6DDR).
P77 to
P70
29 to 22 21 to 14 26, 25,
23 to 18
Input
Port 7: Eight input pins.
3 to 1
Section 2 CPU
2.1
Overview
The H8S/2000 CPU is a high-speed central processing unit with an internal 32-bit architecture that
is upward-compatible with the H8/300 and H8/300H CPUs. The H8S/2000 CPU has sixteen 16-bit
general registers, can address a 16-Mbyte (architecturally 4-Gbyte) linear address space, and is
ideal for realtime control.
2.1.1
Features
The H8S/2000 CPU has the following features.
• Upward-compatible with H8/300 and H8/300H CPUs
 Can execute H8/300 and H8/300H object programs
• General-register architecture
 Sixteen 16-bit general registers (also usable as sixteen 8-bit registers or eight 32-bit
registers)
• Sixty-five basic instructions
 8/16/32-bit arithmetic and logic instructions
 Multiply and divide instructions
 Powerful bit-manipulation instructions
• Eight addressing modes
 Register direct [Rn]
 Register indirect [@ERn]
 Register indirect with displacement [@(d:16,ERn) or @(d:32,ERn)]
 Register indirect with post-increment or pre-decrement [@ERn+ or @–ERn]
 Absolute address [@aa:8, @aa:16, @aa:24, or @aa:32]
 Immediate [#xx:8, #xx:16, or #xx:32]
 Program-counter relative [@(d:8,PC) or @(d:16,PC)]
 Memory indirect [@@aa:8]
• 16-Mbyte address space
 Program: 16 Mbytes
 Data:
16 Mbytes (4 Gbytes architecturally)
27
• High-speed operation
 All frequently-used instructions execute in one or two states
 Maximum clock rate:
20 MHz
 8/16/32-bit register-register add/subtract: 50 ns
 8 × 8-bit register-register multiply:
600 ns
 16 ÷ 8-bit register-register divide:
600 ns
 16 × 16-bit register-register multiply:
1000 ns
 32 ÷ 16-bit register-register divide:
1000 ns
• Two CPU operating modes
 Normal mode
 Advanced mode
• Power-down state
 Transition to power-down state by SLEEP instruction
 CPU clock speed selection
2.1.2
Differences between H8S/2600 CPU and H8S/2000 CPU
The differences between the H8S/2600 CPU and the H8S/2000 CPU are shown below.
• Register configuration
The MAC register is supported only by the H8S/2600 CPU.
• Basic instructions
The four instructions MAC, CLRMAC, LDMAC, and STMAC are supported only by the
H8S/2600 CPU.
• Number of execution states
The number of execution states of the MULXU and MULXS instructions differ as follows.
Number of Execution States
Instruction
Mnemonic
H8S/2600
H8S/2000
MULXU
MULXU.B Rs, Rd
3
12
MULXU.W Rs, ERd
4
20
MULXS.B Rs, Rd
4
13
MULXS.W Rs, ERd
5
21
MULXS
There are also differences in the address space, EXR register functions, power-down state, etc.,
depending on the product.
28
2.1.3
Differences from H8/300 CPU
In comparison to the H8/300 CPU, the H8S/2000 CPU has the following enhancements.
• More general registers and control registers
 Eight 16-bit extended registers, and one 8-bit control register, have been added.
• Expanded address space
 Normal mode supports the same 64-kbyte address space as the H8/300 CPU.
 Advanced mode supports a maximum 16-Mbyte address space.
• Enhanced addressing
 The addressing modes have been enhanced to make effective use of the 16-Mbyte address
space.
• Enhanced instructions
 Addressing modes of bit-manipulation instructions have been enhanced.
 Signed multiply and divide instructions have been added.
 Two-bit shift instructions have been added.
 Instructions for saving and restoring multiple registers have been added.
 A test and set instruction has been added.
• Higher speed
 Basic instructions execute twice as fast.
2.1.4
Differences from H8/300H CPU
In comparison to the H8/300H CPU, the H8S/2000 CPU has the following enhancements.
• Additional control register
 One 8-bit control register has been added.
• Enhanced instructions
 Addressing modes of bit-manipulation instructions have been enhanced.
 Two-bit shift instructions have been added.
 Instructions for saving and restoring multiple registers have been added.
 A test and set instruction has been added.
• Higher speed
 Basic instructions execute twice as fast.
29
2.2
CPU Operating Modes
The H8S/2000 CPU has two operating modes: normal and advanced. Normal mode supports a
maximum 64-kbyte address space. Advanced mode supports a maximum 16-Mbyte total address
space (architecturally the maximum total address space is 4 Gbytes, with a maximum of 16
Mbytes for the program area and a maximum of 4 Gbytes for the data area). The mode is selected
by the mode pins of the microcontroller.
Normal mode
Maximum 64 kbytes for program
and data areas combined
CPU operating modes
Advanced mode
Maximum 16 Mbytes for
program and data areas
combined
Figure 2.1 CPU Operating Modes
(1) Normal Mode
The exception vector table and stack have the same structure as in the H8/300 CPU.
Address Space: A maximum address space of 64 kbytes can be accessed.
Extended Registers (En): The extended registers (E0 to E7) can be used as 16-bit registers, or as
the upper 16-bit segments of 32-bit registers. When En is used as a 16-bit register it can contain
any value, even when the corresponding general register (Rn) is used as an address register. If the
general register is referenced in the register indirect addressing mode with pre-decrement (@–Rn)
or post-increment (@Rn+) and a carry or borrow occurs, however, the value in the corresponding
extended register (En) will be affected.
Instruction Set: All instructions and addressing modes can be used. Only the lower 16 bits of
effective addresses (EA) are valid.
30
Exception Vector Table and Memory Indirect Branch Addresses: In normal mode the top area
starting at H'0000 is allocated to the exception vector table. One branch address is stored per 16
bits. The configuration of the exception vector table in normal mode is shown in figure 2.2. For
details of the exception vector table, see section 4, Exception Handling.
H'0000
H'0001
H'0002
H'0003
H'0004
H'0005
H'0006
H'0007
H'0008
H'0009
H'000A
H'000B
Reset exception vector
(Reserved for system use)
Exception
vector table
Exception vector 1
Exception vector 2
Figure 2.2 Exception Vector Table (Normal Mode)
The memory indirect addressing mode (@@aa:8) employed in the JMP and JSR instructions uses
an 8-bit absolute address included in the instruction code to specify a memory operand that
contains a branch address. In normal mode the operand is a 16-bit word operand, providing a 16bit branch address. Branch addresses can be stored in the top area from H'0000 to H'00FF. Note
that this area is also used for the exception vector table.
31
Stack Structure: When the program counter (PC) is pushed onto the stack in a subroutine call,
and the PC and condition-code register (CCR) are pushed onto the stack in exception handling,
they are stored as shown in figure 2.3. The extended control register (EXR) is not pushed onto the
stack. For details, see section 4, Exception Handling.
SP
PC
(16 bits)
SP
CCR
CCR*
PC
(16 bits)
(a) Subroutine Branch
(b) Exception Handling
Note: * Ignored when returning.
Figure 2.3 Stack Structure in Normal Mode
(2) Advanced Mode
Address Space: Linear access is provided to a 16-Mbyte maximum address space (architecturally
a maximum 16-Mbyte program area and a maximum 4-Gbyte data area, with a maximum of 4
Gbytes for program and data areas combined).
Extended Registers (En): The extended registers (E0 to E7) can be used as 16-bit registers, or as
the upper 16-bit segments of 32-bit registers or address registers.
Instruction Set: All instructions and addressing modes can be used.
32
Exception Vector Table and Memory Indirect Branch Addresses: In advanced mode the top
area starting at H'00000000 is allocated to the exception vector table in units of 32 bits. In each 32
bits, the upper 8 bits are ignored and a branch address is stored in the lower 24 bits (figure 2.4).
For details of the exception vector table, see section 4, Exception Handling.
H'00000000
Reserved
Reset exception vector
H'00000003
H'00000004
Reserved
H'00000007
H'00000008
Exception vector table
H'0000000B
(Reserved for system use)
H'0000000C
H'00000010
Reserved
Exception vector 1
Figure 2.4 Exception Vector Table (Advanced Mode)
The memory indirect addressing mode (@@aa:8) employed in the JMP and JSR instructions uses
an 8-bit absolute address included in the instruction code to specify a memory operand that
contains a branch address. In advanced mode the operand is a 32-bit longword operand, providing
a 32-bit branch address. The upper 8 bits of these 32 bits are a reserved area that is regarded as
H'00. Branch addresses can be stored in the area from H'00000000 to H'000000FF. Note that the
first part of this range is also the exception vector table.
33
Stack Structure: In advanced mode, when the program counter (PC) is pushed onto the stack in a
subroutine call, and the PC and condition-code register (CCR) are pushed onto the stack in
exception handling, they are stored as shown in figure 2.5. The extended control register (EXR) is
not pushed onto the stack. For details, see section 4, Exception Handling.
SP
Reserved
PC
(24 bits)
(a) Subroutine Branch
CCR
SP
PC
(24 bits)
(b) Exception Handling
Figure 2.5 Stack Structure in Advanced Mode
34
2.3
Address Space
Figure 2.6 shows a memory map of the H8S/2000 CPU. The H8S/2000 CPU provides linear
access to a maximum 64-kbyte address space in normal mode, and a maximum 16-Mbyte
(architecturally 4-Gbyte) address space in advanced mode.
H'0000
H'00000000
H'FFFF
Program area
H'00FFFFFF
Data area
Cannot be
used by the
H8S/2128
Series or
H8S/2124
Series
H'FFFFFFFF
(a) Normal Mode
(b) Advanced Mode
Figure 2.6 Memory Map
35
2.4
Register Configuration
2.4.1
Overview
The CPU has the internal registers shown in figure 2.7. There are two types of registers: general
registers and control registers.
General Registers (Rn) and Extended Registers (En)
15
07
07
0
ER0
E0
R0H
R0L
ER1
E1
R1H
R1L
ER2
E2
R2H
R2L
ER3
E3
R3H
R3L
ER4
E4
R4H
R4L
ER5
E5
R5H
R5L
ER6
E6
R6H
R6L
ER7 (SP)
E7
R7H
R7L
Control Registers (CR)
23
0
PC
7 6 5 4 3 2 1 0
EXR* T — — — — I2 I1 I0
7 6 5 4 3 2 1 0
CCR I UI H U N Z V C
Legend:
SP:
PC:
EXR:
T:
I2 to I0:
CCR:
I:
UI:
Stack pointer
Program counter
Extended control register
Trace bit
Interrupt mask bits
Condition-code register
Interrupt mask bit
User bit or interrupt mask bit
H:
U:
N:
Z:
V:
C:
Half-carry flag
User bit
Negative flag
Zero flag
Overflow flag
Carry flag
Note: * Does not affect operation in the H8S/2128 Series and H8S/2124 Series.
Figure 2.7 CPU Registers
36
2.4.2
General Registers
The CPU has eight 32-bit general registers. These general registers are all functionally alike and
can be used as both address registers and data registers. When a general register is used as a data
register, it can be accessed as a 32-bit, 16-bit, or 8-bit register. When the general registers are used
as 32-bit registers or address registers, they are designated by the letters ER (ER0 to ER7).
The ER registers divide into 16-bit general registers designated by the letters E (E0 to E7) and R
(R0 to R7). These registers are functionally equivalent, providing a maximum of sixteen 16-bit
registers. The E registers (E0 to E7) are also referred to as extended registers.
The R registers divide into 8-bit general registers designated by the letters RH (R0H to R7H) and
RL (R0L to R7L). These registers are functionally equivalent, providing a maximum of sixteen 8bit registers.
Figure 2.8 illustrates the usage of the general registers. The usage of each register can be selected
independently.
• Address registers
• 32-bit registers
• 16-bit registers
• 8-bit registers
E registers (extended registers)
(E0 to E7)
RH registers
(R0H to R7H)
ER registers
(ER0 to ER7)
R registers
(R0 to R7)
RL registers
(R0L to R7L)
Figure 2.8 Usage of General Registers
General register ER7 has the function of stack pointer (SP) in addition to its general-register
function, and is used implicitly in exception handling and subroutine calls. Figure 2.9 shows the
stack.
37
Free area
SP (ER7)
Stack area
Figure 2.9 Stack
2.4.3
Control Registers
The control registers are the 24-bit program counter (PC), 8-bit extended control register (EXR),
and 8-bit condition-code register (CCR).
(1) Program Counter (PC): This 24-bit counter indicates the address of the next instruction the
CPU will execute. The length of all CPU instructions is 2 bytes (one word), so the least significant
PC bit is ignored. (When an instruction is fetched, the least significant PC bit is regarded as 0.)
(2) Extended Control Register (EXR): An 8-bit register. In the H8S/2128 Series and H8S/2124
Series, this register does not affect operation.
Bit 7—Trace Bit (T): This bit is reserved. In the H8S/2128 Series and H8S/2124 Series, this bit
does not affect operation.
Bits 6 to 3—Reserved: These bits are reserved. They are always read as 1.
Bits 2 to 0—Interrupt Mask Bits (I2 to I0): These bits are reserved. In the H8S/2128 Series and
H8S/2124 Series, these bits do not affect operation.
(3) Condition-Code Register (CCR): This 8-bit register contains internal CPU status
information, including an interrupt mask bit (I) and half-carry (H), negative (N), zero (Z),
overflow (V), and carry (C) flags.
Bit 7—Interrupt Mask Bit (I): Masks interrupts other than NMI when set to 1. (NMI is accepted
regardless of the I bit setting.) The I bit is set to 1 by hardware at the start of an exceptionhandling sequence. For details, refer to section 5, Interrupt Controller.
38
Bit 6—User Bit or Interrupt Mask Bit (UI): Can be written and read by software using the
LDC, STC, ANDC, ORC, and XORC instructions. This bit can also be used as an interrupt mask
bit. For details, refer to section 5, Interrupt Controller.
Bit 5—Half-Carry Flag (H): When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B, or NEG.B
instruction is executed, this flag is set to 1 if there is a carry or borrow at bit 3, and cleared to 0
otherwise. When the ADD.W, SUB.W, CMP.W, or NEG.W instruction is executed, the H flag is
set to 1 if there is a carry or borrow at bit 11, and cleared to 0 otherwise. When the ADD.L,
SUB.L, CMP.L, or NEG.L instruction is executed, the H flag is set to 1 if there is a carry or
borrow at bit 27, and cleared to 0 otherwise.
Bit 4—User Bit (U): Can be written and read by software using the LDC, STC, ANDC, ORC, and
XORC instructions.
Bit 3—Negative Flag (N): Stores the value of the most significant bit (sign bit) of data.
Bit 2—Zero Flag (Z): Set to 1 to indicate zero data, and cleared to 0 to indicate non-zero data.
Bit 1—Overflow Flag (V): Set to 1 when an arithmetic overflow occurs, and cleared to 0
otherwise.
Bit 0—Carry Flag (C): Set to 1 when a carry occurs, and cleared to 0 otherwise. Used by:
• Add instructions, to indicate a carry
• Subtract instructions, to indicate a borrow
• Shift and rotate instructions, to store the carry
The carry flag is also used as a bit accumulator by bit-manipulation instructions.
Some instructions leave some or all of the flag bits unchanged. For the action of each instruction
on the flag bits, refer to Appendix A.1, List of Instructions.
Operations can be performed on the CCR bits by the LDC, STC, ANDC, ORC, and XORC
instructions. The N, Z, V, and C flags are used as branching conditions for conditional branch
(Bcc) instructions.
2.4.4
Initial Register Values
Reset exception handling loads the CPU’s program counter (PC) from the vector table, clears the
trace bit in EXR to 0, and sets the interrupt mask bits in CCR and EXR to 1. The other CCR bits
and the general registers are not initialized. In particular, the stack pointer (ER7) is not initialized.
The stack pointer should therefore be initialized by an MOV.L instruction executed immediately
after a reset.
39
2.5
Data Formats
The CPU can process 1-bit, 4-bit (BCD), 8-bit (byte), 16-bit (word), and 32-bit (longword) data.
Bit-manipulation instructions operate on 1-bit data by accessing bit n (n = 0, 1, 2, …, 7) of byte
operand data. The DAA and DAS decimal-adjust instructions treat byte data as two digits of 4-bit
BCD data.
2.5.1
General Register Data Formats
Figure 2.10 shows the data formats in general registers.
Data Type
General Register
Data Format
1-bit data
RnH
7
0
7 6 5 4 3 2 1 0
Don’t care
Don’t care
7
0
7 6 5 4 3 2 1 0
4 3
7
0
Upper digit Lower digit
Don’t care
Don’t care
4 3
7
0
Upper digit Lower digit
1-bit data
4-bit BCD data
4-bit BCD data
Byte data
RnL
RnH
RnL
RnH
7
0
Don’t care
MSB
Byte data
LSB
RnL
7
0
Don’t care
MSB
Figure 2.10 General Register Data Formats
40
LSB
Data Type
General Register
Word data
Rn
Data Format
15
0
MSB
Word data
En
15
0
MSB
Longword data
LSB
ERn
31
MSB
LSB
16 15
En
0
Rn
LSB
Legend:
ERn: General register ER
En:
General register E
Rn:
General register R
RnH: General register RH
RnL: General register RL
MSB: Most significant bit
LSB: Least significant bit
Figure 2.10 General Register Data Formats (cont)
41
2.5.2
Memory Data Formats
Figure 2.11 shows the data formats in memory. The CPU can access word data and longword data
in memory, but word or longword data must begin at an even address. If an attempt is made to
access word or longword data at an odd address, no address error occurs but the least significant
bit of the address is regarded as 0, so the access starts at the preceding address. This also applies to
instruction fetches.
Data Type
Address
Data Format
7
1-bit data
Address L
Byte data
Address L MSB
Word data
7
0
6
5
4
2
1
0
LSB
Address 2M MSB
Address 2M + 1
Longword data
3
LSB
Address 2N MSB
Address 2N + 1
Address 2N + 2
Address 2N + 3
LSB
Figure 2.11 Memory Data Formats
When ER7 (SP) is used as an address register to access the stack, the operand size should be word
size or longword size.
42
2.6
Instruction Set
2.6.1
Overview
The H8S/2000 CPU has 65 types of instructions. The instructions are classified by function in
table 2.1.
Table 2.1
Instruction Classification
Function
Instructions
Data transfer
MOV
1
POP* , PUSH*
5
LDM* , STM*
1
MOVFPE* , MOVTPE*
Arithmetic
operations
Types
BWL
5
WL
5
3
Size
L
3
B
ADD, SUB, CMP, EG
BWL
ADDX, SUBX, DAA, DAS
B
INC, DEC
BWL
ADDS, SUBS
L
MULXU, DIVXU, MULXS, DIVXS
BW
EXTU, EXTS
WL
TAS*
4
19
B
Logic operations
AND, OR, XOR, NOT
BWL
4
Shift
SHAL, SHAR, SHLL, SHLR, ROTL, ROTR, ROTXL, ROTXR BWL
8
Bit manipulation
BSET, BCLR, BNOT, BTST, BLD, BILD, BST, BIST, BAND,
BIAND, BOR, BIOR, BXOR, BIXOR
B
14
Branch
Bcc* 2, JMP, BSR, JSR, RTS
—
5
System control
TRAPA, RTE, SLEEP, LDC, STC, ANDC, ORC, XORC, NOP —
9
Block data transfer EEPMOV
—
1
Total: 65 types
Notes: B: byte size; W: word size; L: longword size.
1. POP.W Rn and PUSH.W Rn are identical to MOV.W @SP+, Rn and MOV.W Rn,
@-SP.
POP.L ERn and PUSH.L ERn are identical to MOV.L @SP+, ERn and MOV.L ERn,
@-SP.
2. Bcc is the general name for conditional branch instructions.
3. Cannot be used in the H8S/2128 Series or H8S/2124 Series.
4. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
5. Only registers ER0 to ER6 should be used when using the STM/LDM instruction.
43
2.6.2
Instructions and Addressing Modes
Table 2.2 indicates the combinations of instructions and addressing modes that the H8S/2000 CPU
can use.
Table 2.2
Combinations of Instructions and Addressing Modes
@aa:24
@aa:32
@(d:8,PC)
@(d:16,PC)
@@aa:8
—
BWL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
WL
LDM* 3, STM* 3
—
—
—
—
—
—
—
—
—
—
—
—
—
L
MOVFPE* 1,
MOVTPE* 1
—
—
—
—
—
—
—
B
—
—
—
—
—
—
@ERn
ADD, CMP
BWL BWL
—
—
—
—
—
—
—
—
—
—
—
—
SUB
WL
BWL
—
—
—
—
—
—
—
—
—
—
—
—
B
B
—
—
—
—
—
—
—
—
—
—
—
—
ADDX, SUBX
ADDS, SUBS
—
L
—
—
—
—
—
—
—
—
—
—
—
—
INC, DEC
—
BWL
—
—
—
—
—
—
—
—
—
—
—
—
DAA, DAS
—
B
—
—
—
—
—
—
—
—
—
—
—
—
MULXU,
DIVXU
—
BW
—
—
—
—
—
—
—
—
—
—
—
—
MULXS,
DIVXS
—
BW
—
—
—
—
—
—
—
—
—
—
—
—
NEG
—
BWL
—
—
—
—
—
—
—
—
—
—
—
—
EXTU, EXTS
—
WL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
TAS*
Logic
operations
Rn
BWL BWL BWL BWL BWL BWL
2
AND, OR,
XOR
NOT
Shift
BWL BWL
B
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
BWL
—
—
—
—
—
—
—
—
—
—
—
—
—
BWL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Bit manipulation
—
B
B
—
—
—
B
B
—
B
Branch
Bcc, BSR
—
—
—
—
—
—
—
—
—
—
JMP, JSR
—
—
—
—
—
—
—
—
RTS
—
—
—
—
—
—
—
—
Note:
44
—
@aa:16
BWL
—
MOV
Arithmetic
operations
@–ERn/@ERn+
@aa:8
Data
transfer
@(d:32,ERn)
B
POP, PUSH
Instruction
#xx
Function
@(d:16,ERn)
Addressing Modes
—
—
—
—
—
—
—
—
—
—
—
—
—
1. Cannot be used in the H8S/2128 Series or H8S/2124 Series.
2. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
3. Only registers ER0 to ER6 should be used when using the STM/LDM instruction.
@(d:16,ERn)
@(d:32,ERn)
@–ERn/@ERn+
@aa:8
@aa:16
@aa:24
@aa:32
@(d:8,PC)
@(d:16,PC)
@@aa:8
TRAPA
—
—
—
—
—
—
—
—
—
—
—
—
—
RTE
—
—
—
—
—
—
—
—
—
—
—
—
—
SLEEP
—
—
—
—
—
—
—
—
—
—
—
—
—
LDC
B
B
W
W
W
W
—
W
—
W
—
—
—
—
STC
—
B
W
W
W
W
—
W
—
W
—
—
—
—
ANDC, ORC,
XORC
B
—
—
—
—
—
—
—
—
—
—
—
—
—
NOP
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Instruction
Block data transfer
—
@ERn
System
control
Rn
Function
#xx
Addressing Modes
BW
Legend:
B: Byte
W: Word
L: Longword
45
2.6.3
Table of Instructions Classified by Function
Table 2.3 summarizes the instructions in each functional category. The notation used in table 2.3 is
defined below.
Operation Notation
Rd
General register (destination)*
Rs
General register (source)*
Rn
General register*
ERn
General register (32-bit register)
(EAd)
Destination operand
(EAs)
Source operand
EXR
Extended control register
CCR
Condition-code register
N
N (negative) flag in CCR
Z
Z (zero) flag in CCR
V
V (overflow) flag in CCR
C
C (carry) flag in CCR
PC
Program counter
SP
Stack pointer
#IMM
Immediate data
disp
Displacement
+
Addition
–
Subtraction
×
Multiplication
÷
Division
∧
Logical AND
∨
Logical OR
⊕
Logical exclusive OR
→
Move
¬
NOT (logical complement)
:8/:16/:24/:32
8-, 16-, 24-, or 32-bit length
Note: * General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0 to
R7, E0 to E7), and 32-bit registers (ER0 to ER7).
46
Table 2.3
Instructions Classified by Function
Type
Instruction
Size* 1
Function
Data transfer
MOV
B/W/L
(EAs) → Rd, Rs → (EAd)
Moves data between two general registers or between a
general register and memory, or moves immediate data
to a general register.
MOVFPE
B
Cannot be used in the H8S/2128 Series or H8S/2124
Series.
MOVTPE
B
Cannot be used in the H8S/2128 Series or H8S/2124
Series.
POP
W/L
@SP+ → Rn
Pops a general register from the stack.
POP.W Rn is identical to MOV.W @SP+, Rn.
POP.L ERn is identical to MOV.L @SP+, ERn.
PUSH
W/L
Rn → @–SP
Pushes a general register onto the stack.
PUSH.W Rn is identical to MOV.W Rn, @–SP.
PUSH.L ERn is identical to MOV.L ERn, @–SP.
3
L
@SP+ → Rn (register list)
Pops two or more general registers from the stack.
STM* 3
L
Rn (register list) → @–SP
Pushes two or more general registers onto the stack.
LDM*
47
Type
Instruction
Size* 1
Function
Arithmetic
operations
ADD
SUB
B/W/L
Rd ± Rs → Rd, Rd ± #IMM → Rd
Performs addition or subtraction on data in two general
registers, or on immediate data and data in a general
register. (Immediate byte data cannot be subtracted from
byte data in a general register. Use the SUBX or ADD
instruction.)
ADDX
SUBX
B
Rd ± Rs ± C → Rd, Rd ± #IMM ± C → Rd
Performs addition or subtraction with carry on byte data
in two general registers, or on immediate data and data
in a general register.
INC
DEC
B/W/L
Rd ± 1 → Rd, Rd ± 2 → Rd
Increments or decrements a general register by 1 or 2.
(Byte operands can be incremented or decremented by
1 only.)
ADDS
SUBS
L
Rd ± 1 → Rd, Rd ± 2 → Rd, Rd ± 4 → Rd
Adds or subtracts the value 1, 2, or 4 to or from data in a
32-bit register.
DAA
DAS
B
Rd decimal adjust → Rd
Decimal-adjusts an addition or subtraction result in a
general register by referring to the CCR to produce 4-bit
BCD data.
MULXU
B/W
Rd × Rs → Rd
Performs unsigned multiplication on data in two general
registers: either 8 bits × 8 bits → 16 bits or 16 bits ×
16 bits → 32 bits.
MULXS
B/W
Rd × Rs → Rd
Performs signed multiplication on data in two general
registers: either 8 bits × 8 bits → 16 bits or 16 bits ×
16 bits → 32 bits.
DIVXU
B/W
Rd ÷ Rs → Rd
Performs unsigned division on data in two general
registers: either 16 bits ÷ 8 bits → 8-bit quotient and 8-bit
remainder or 32 bits ÷ 16 bits → 16-bit quotient and 16bit remainder.
48
Type
Instruction
Size* 1
Function
Arithmetic
operations
DIVXS
B/W
Rd ÷ Rs → Rd
Performs signed division on data in two general
registers: either 16 bits ÷ 8 bits → 8-bit quotient and 8-bit
remainder or 32 bits ÷ 16 bits → 16-bit quotient and 16bit remainder.
CMP
B/W/L
Rd – Rs, Rd – #IMM
Compares data in a general register with data in another
general register or with immediate data, and sets CCR
bits according to the result.
NEG
B/W/L
0 – Rd → Rd
Takes the two's complement (arithmetic complement) of
data in a general register.
EXTU
W/L
Rd (zero extension) → Rd
Extends the lower 8 bits of a 16-bit register to word size,
or the lower 16 bits of a 32-bit register to longword size,
by padding with zeros on the left.
EXTS
W/L
Rd (sign extension) → Rd
Extends the lower 8 bits of a 16-bit register to word size,
or the lower 16 bits of a 32-bit register to longword size,
by extending the sign bit.
TAS
B
@ERd – 0, 1 → (<bit 7> of @ERd)* 2
Tests memory contents, and sets the most significant bit
(bit 7) to 1.
49
Type
Instruction
Size* 1
Function
Logic
operations
AND
B/W/L
Rd ∧ Rs → Rd, Rd ∧ #IMM → Rd
Performs a logical AND operation on a general register
and another general register or immediate data.
OR
B/W/L
Rd ∨ Rs → Rd, Rd ∨ #IMM → Rd
Performs a logical OR operation on a general register
and another general register or immediate data.
XOR
B/W/L
Rd ⊕ Rs → Rd, Rd ⊕ #IMM → Rd
Performs a logical exclusive OR operation on a general
register and another general register or immediate data.
NOT
B/W/L
¬ (Rd) → (Rd)
Takes the one's complement (logical complement) of
general register contents.
SHAL
SHAR
B/W/L
Rd (shift) → Rd
Performs an arithmetic shift on general register contents.
A 1-bit or 2-bit shift is possible.
SHLL
SHLR
B/W/L
Rd (shift) → Rd
Performs a logical shift on general register contents.
A 1-bit or 2-bit shift is possible.
ROTL
ROTR
B/W/L
Rd (rotate) → Rd
Rotates general register contents.
1-bit or 2-bit rotation is possible.
ROTXL
ROTXR
B/W/L
Rd (rotate) → Rd
Rotates general register contents through the carry flag.
1-bit or 2-bit rotation is possible.
Shift
operations
50
Type
Instruction
Size* 1
Function
Bitmanipulation
instructions
BSET
B
1 → (<bit-No.> of <EAd>)
Sets a specified bit in a general register or memory
operand to 1. The bit number is specified by 3-bit
immediate data or the lower three bits of a general
register.
BCLR
B
0 → (<bit-No.> of <EAd>)
Clears a specified bit in a general register or memory
operand to 0. The bit number is specified by 3-bit
immediate data or the lower three bits of a general
register.
BNOT
B
¬ (<bit-No.> of <EAd>) → (<bit-No.> of <EAd>)
Inverts a specified bit in a general register or memory
operand. The bit number is specified by 3-bit immediate
data or the lower three bits of a general register.
BTST
B
¬ (<bit-No.> of <EAd>) → Z
Tests a specified bit in a general register or memory
operand and sets or clears the Z flag accordingly. The
bit number is specified by 3-bit immediate data or the
lower three bits of a general register.
BAND
B
C ∧ (<bit-No.> of <EAd>) → C
ANDs the carry flag with a specified bit in a general
register or memory operand and stores the result in the
carry flag.
BIAND
B
C ∧ ¬ (<bit-No.> of <EAd>) → C
ANDs the carry flag with the inverse of a specified bit in
a general register or memory operand and stores the
result in the carry flag.
The bit number is specified by 3-bit immediate data.
BOR
B
C ∨ (<bit-No.> of <EAd>) → C
ORs the carry flag with a specified bit in a general
register or memory operand and stores the result in the
carry flag.
BIOR
B
C ∨ ¬ (<bit-No.> of <EAd>) → C
ORs the carry flag with the inverse of a specified bit in a
general register or memory operand and stores the
result in the carry flag.
The bit number is specified by 3-bit immediate data.
51
Type
Instruction
Size* 1
Function
Bitmanipulation
instructions
BXOR
B
C ⊕ (<bit-No.> of <EAd>) → C
Exclusive-ORs the carry flag with a specified bit in a
general register or memory operand and stores the
result in the carry flag.
BIXOR
B
C ⊕ ¬ (<bit-No.> of <EAd>) → C
Exclusive-ORs the carry flag with the inverse of a
specified bit in a general register or memory operand
and stores the result in the carry flag.
The bit number is specified by 3-bit immediate data.
BLD
B
(<bit-No.> of <EAd>) → C
Transfers a specified bit in a general register or memory
operand to the carry flag.
BILD
B
¬ (<bit-No.> of <EAd>) → C
Transfers the inverse of a specified bit in a general
register or memory operand to the carry flag.
The bit number is specified by 3-bit immediate data.
BST
B
C → (<bit-No.> of <EAd>)
Transfers the carry flag value to a specified bit in a
general register or memory operand.
BIST
B
¬ C → (<bit-No.> of <EAd>)
Transfers the inverse of the carry flag value to a
specified bit in a general register or memory operand.
The bit number is specified by 3-bit immediate data.
52
Type
Instruction
Size* 1
Function
Branch
instructions
Bcc
—
Branches to a specified address if a specified condition
is true. The branching conditions are listed below.
Mnemonic
Description
Condition
BRA(BT)
Always (true)
Always
BRN(BF)
Never (false)
Never
BHI
High
C∨Z=0
BLS
Low or same
C∨Z=1
BCC(BHS)
Carry clear
(high or same)
C=0
BCS(BLO)
Carry set (low)
C=1
BNE
Not equal
Z=0
BEQ
Equal
Z=1
BVC
Overflow clear
V=0
BVS
Overflow set
V=1
BPL
Plus
N=0
BMI
Minus
N=1
BGE
Greater or equal
N⊕V=0
BLT
Less than
N⊕V=1
BGT
Greater than
Z∨(N ⊕ V) = 0
BLE
Less or equal
Z∨(N ⊕ V) = 1
JMP
—
Branches unconditionally to a specified address.
BSR
—
Branches to a subroutine at a specified address.
JSR
—
Branches to a subroutine at a specified address.
RTS
—
Returns from a subroutine
53
Size* 1
Function
System control TRAPA
instructions
RTE
—
Starts trap-instruction exception handling.
—
Returns from an exception-handling routine.
SLEEP
—
Causes a transition to a power-down state.
LDC
B/W
(EAs) → CCR, (EAs) → EXR
Moves contents of a general register or memory or
immediate data to CCR or EXR. Although CCR and EXR
are 8-bit registers, word-size transfers are performed
between them and memory. The upper 8 bits are valid.
STC
B/W
CCR → (EAd), EXR → (EAd)
Transfers CCR or EXR contents to a general register or
memory. Although CCR and EXR are 8-bit registers,
word-size transfers are performed between them and
memory. The upper 8 bits are valid.
ANDC
B
CCR ∧ #IMM → CCR, EXR ∧ #IMM → EXR
Logically ANDs the CCR or EXR contents with
immediate data.
ORC
B
CCR ∨ #IMM → CCR, EXR ∨ #IMM → EXR
Logically ORs the CCR or EXR contents with immediate
data.
XORC
B
CCR ⊕ #IMM → CCR, EXR ⊕ #IMM → EXR
Logically exclusive-ORs the CCR or EXR contents with
immediate data.
NOP
—
PC + 2 → PC
Only increments the program counter.
Type
54
Instruction
Type
Instruction
Size* 1
Function
Block data
transfer
instructions
EEPMOV.B
—
if R4L ≠ 0 then
Repeat @ER5+ → @ER6+
R4L–1 → R4L
Until R4L = 0
else next;
EEPMOV.W
—
if R4 ≠ 0 then
Repeat @ER5+ → @ER6+
R4–1 → R4
Until R4 = 0
else next;
Block transfer instruction. Transfers the number of data
bytes specified by R4L or R4 from locations starting at
the address indicated by ER5 to locations starting at the
address indicated by ER6. After the transfer, the next
instruction is executed.
Note:
2.6.4
1. Size refers to the operand size.
2. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
B: Byte
W: Word
L: Longword
3. Only registers ER0 to ER6 should be used when using the STM/LDM instruction.
Basic Instruction Formats
The CPU instructions consist of 2-byte (1-word) units. An instruction consists of an operation
field (op field), a register field (r field), an effective address extension (EA field), and a condition
field (cc).
Operation Field: Indicates the function of the instruction, the addressing mode, and the operation
to be carried out on the operand. The operation field always includes the first four bits of the
instruction. Some instructions have two operation fields.
Register Field: Specifies a general register. Address registers are specified by 3 bits, data registers
by 3 bits or 4 bits. Some instructions have two register fields. Some have no register field.
Effective Address Extension: Eight, 16, or 32 bits specifying immediate data, an absolute
address, or a displacement.
Condition Field: Specifies the branching condition of Bcc instructions.
Figure 2.12 shows examples of instruction formats.
55
(1) Operation field only
op
NOP, RTS, etc.
(2) Operation field and register fields
op
rm
rn
ADD.B Rn, Rm, etc.
(3) Operation field, register fields, and effective address extension
op
rn
rm
MOV.B @(d:16, Rn), Rm, etc.
EA (disp)
(4) Operation field, effective address extension, and condition field
op
cc
EA (disp)
BRA d:16, etc
Figure 2.12 Instruction Formats (Examples)
2.6.5
Notes on Use of Bit-Manipulation Instructions
The BSET, BCLR, BNOT, BST, and BIST instructions read a byte of data, carry out bit
manipulation, then write back the byte of data. Caution is therefore required when using these
instructions on a register containing write-only bits, or a port.
The BCLR instruction can be used to clear internal I/O register flags to 0. In this case, the relevant
flag need not be read beforehand if it is clear that it has been set to 1 in an interrupt handling
routine, etc.
2.7
Addressing Modes and Effective Address Calculation
2.7.1
Addressing Mode
The CPU supports the eight addressing modes listed in table 2.4. Each instruction uses a subset of
these addressing modes. Arithmetic and logic instructions can use the register direct and
immediate modes. Data transfer instructions can use all addressing modes except program-counter
relative and memory indirect. Bit-manipulation instructions use register direct, register indirect, or
absolute addressing mode to specify an operand, and register direct (BSET, BCLR, BNOT, and
BTST instructions) or immediate (3-bit) addressing mode to specify a bit number in the operand.
56
Table 2.4
Addressing Modes
No.
Addressing Mode
Symbol
1
Register direct
Rn
2
Register indirect
@ERn
3
Register indirect with displacement
@(d:16,ERn)/@(d:32,ERn)
4
Register indirect with post-increment
Register indirect with pre-decrement
@ERn+
@-ERn
5
Absolute address
@aa:8/@aa:16/@aa:24/@aa:32
6
Immediate
#xx:8/#xx:16/#xx:32
7
Program-counter relative
@(d:8,PC)/@(d:16,PC)
8
Memory indirect
@@aa:8
Register Direct—Rn: The register field of the instruction code specifies an 8-, 16-, or 32-bit
general register containing the operand. R0H to R7H and R0L to R7L can be specified as 8-bit
registers. R0 to R7 and E0 to E7 can be specified as 16-bit registers. ER0 to ER7 can be specified
as 32-bit registers.
Register Indirect—@ERn: The register field of the instruction code specifies an address register
(ERn) which contains the address of the operand in memory. If the address is a program
instruction address, the lower 24 bits are valid and the upper 8 bits are all assumed to be 0 (H'00).
Register Indirect with Displacement—@(d:16, ERn) or @(d:32, ERn): A 16-bit or 32-bit
displacement contained in the instruction is added to an address register (ERn) specified by the
register field of the instruction, and the sum gives the address of a memory operand. A 16-bit
displacement is sign-extended when added.
Register Indirect with Post-Increment or Pre-Decrement—@ERn+ or @-ERn:
• Register indirect with post-increment—@ERn+
The register field of the instruction code specifies an address register (ERn) which contains the
address of a memory operand. After the operand is accessed, 1, 2, or 4 is added to the address
register contents and the sum is stored in the address register. The value added is 1 for byte
access, 2 for word access, or 4 for longword access. For word or longword access, the register
value should be even.
• Register indirect with pre-decrement—@-ERn
The value 1, 2, or 4 is subtracted from an address register (ERn) specified by the register field
in the instruction code, and the result becomes the address of a memory operand. The result is
also stored in the address register. The value subtracted is 1 for byte access, 2 for word access,
or 4 for longword access. For word or longword access, the register value should be even.
57
Absolute Address—@aa:8, @aa:16, @aa:24, or @aa:32: The instruction code contains the
absolute address of a memory operand. The absolute address may be 8 bits long (@aa:8), 16 bits
long (@aa:16), 24 bits long (@aa:24), or 32 bits long (@aa:32).
To access data, the absolute address should be 8 bits (@aa:8), 16 bits (@aa:16), or 32 bits
(@aa:32) long. For an 8-bit absolute address, the upper 24 bits are all assumed to be 1 (H'FFFF).
For a 16-bit absolute address the upper 16 bits are a sign extension. A 32-bit absolute address can
access the entire address space.
A 24-bit absolute address (@aa:24) indicates the address of a program instruction. The upper 8
bits are all assumed to be 0 (H'00).
Table 2.5 indicates the accessible absolute address ranges.
Table 2.5
Absolute Address Access Ranges
Absolute Address
Data address
Normal Mode
Advanced Mode
8 bits (@aa:8)
H'FF00 to H'FFFF
H'FFFF00 to H'FFFFFF
16 bits (@aa:16)
H'0000 to H'FFFF
H'000000 to H'007FFF,
H'FF8000 to H'FFFFFF
32 bits (@aa:32)
Program instruction
address
H'000000 to H'FFFFFF
24 bits (@aa:24)
Immediate—#xx:8, #xx:16, or #xx:32: The instruction contains 8-bit (#xx:8), 16-bit (#xx:16), or
32-bit (#xx:32) immediate data as an operand.
The ADDS, SUBS, INC, and DEC instructions contain immediate data implicitly. Some bit
manipulation instructions contain 3-bit immediate data in the instruction code, specifying a bit
number. The TRAPA instruction contains 2-bit immediate data in its instruction code, specifying a
vector address.
Program-Counter Relative—@(d:8, PC) or @(d:16, PC): This mode is used in the Bcc and
BSR instructions. An 8-bit or 16-bit displacement contained in the instruction is sign-extended and
added to the 24-bit PC contents to generate a branch address. Only the lower 24 bits of this branch
address are valid; the upper 8 bits are all assumed to be 0 (H'00). The PC value to which the
displacement is added is the address of the first byte of the next instruction, so the possible
branching range is –126 to +128 bytes (–63 to +64 words) or –32766 to +32768 bytes (–16383 to
+16384 words) from the branch instruction. The resulting value should be an even number.
58
Memory Indirect—@@aa:8: This mode can be used by the JMP and JSR instructions. The
instruction code contains an 8-bit absolute address specifying a memory operand. This memory
operand contains a branch address. The upper bits of the absolute address are all assumed to be 0,
so the address range is 0 to 255 (H'0000 to H'00FF in normal mode, H'000000 to H'0000FF in
advanced mode). In normal mode the memory operand is a word operand and the branch address
is 16 bits long. In advanced mode the memory operand is a longword operand, the first byte of
which is assumed to be all 0 (H'00).
Note that the first part of the address range is also the exception vector area. For further details,
refer to section 4, Exception Handling.
Specified
by @aa:8
Branch address
Specified
by @aa:8
Reserved
Branch address
(a) Normal Mode
(b) Advanced Mode
Figure 2.13 Branch Address Specification in Memory Indirect Mode
If an odd address is specified in word or longword memory access, or as a branch address, the
least significant bit is regarded as 0, causing data to be accessed or an instruction code to be
fetched at the address preceding the specified address. (For further information, see section 2.5.2,
Memory Data Formats.)
2.7.2
Effective Address Calculation
Table 2.6 indicates how effective addresses are calculated in each addressing mode. In normal
mode the upper 8 bits of the effective address are ignored in order to generate a 16-bit address.
59
Table 2.6
Effective Address Calculation
No.
Addressing Mode and
Instruction Format
1
Register direct (Rn)
op
2
Effective Address
Calculation
Effective Address (EA)
Operand is general register
contents.
rm rn
Register indirect (@ERn)
31
0
3
24 23
0
Don’t
care
General register contents
op
31
r
Register indirect with displacement
@(d:16, ERn) or @(d:32, ERn)
31
0
General register contents
31
op
r
disp
31
0
0
Sign extension
4
24 23
Don’t
care
disp
Register indirect with post-increment or pre-decrement
•
Register indirect with post-increment @ERn+
31
0
24 23
0
Don’t
care
General register contents
op
31
r
1, 2, or
4
•
Register indirect with pre-decrement @-ERn
31
0
General register contents
31
op
r
Operand
Size
Byte
Word
Longword
60
24 23
Don’t
care
Value
Added
1
2
4
1, 2, or
4
0
No.
Addressing Mode and
Instruction Format
5
Absolute address
Effective Address
Calculation
Effective Address (EA)
@aa:8
31
op
24 23
Don’t
care
abs
@aa:16
abs
@aa:24
31
op
24 23
0
H'FFFF
24 23 16 15
Sign
Don’t extencare
sion
31
op
87
0
0
Don’t
care
abs
@aa:32
op
31
abs
6
Immediate #xx:8/#xx:16/#xx:32
op
7
24 23
0
Don’t
care
Operand is immediate data.
IMM
Program-counter relative
@(d:8, PC)/@(d:16, PC)
0
23
PC contents
op
disp
23
Sign
extension
0
disp
31
24 23
0
Don’t
care
61
No.
Addressing Mode and
Instruction Format
8
Memory indirect @@aa:8
•
Effective Address
Calculation
Effective Address (EA)
Normal mode
op
abs
31
87
H'000000
0
abs
31
24 23
Don’t
care
16 15
0
H'00
0
15
Memory
contents
•
Advanced mode
op
abs
31
87
H'000000
31
abs
0
Memory contents
62
0
31
24 23
Don’t
care
0
2.8
Processing States
2.8.1
Overview
The CPU has five main processing states: the reset state, exception-handling state, program
execution state, bus-released state, and power-down state. Figure 2.14 shows a diagram of the
processing states. Figure 2.15 indicates the state transitions.
Reset state
The CPU and all on-chip supporting modules have been
initialized and are stopped.
Exception-handling
state
A transient state in which the CPU changes the normal
processing flow in response to a reset, interrupt, or trap
instruction.
Processing
states
Program execution
state
The CPU executes program instructions in sequence.
Bus-released state
The external bus has been released in response to a bus
request signal from a bus master other than the CPU.
Sleep mode
Power-down state
CPU operation is stopped
to conserve power.*
Software standby
mode
Hardware standby
mode
Note: * The power-down state also includes a medium-speed mode, module stop mode,
sub-active mode, sub-sleep mode, and watch mode.
Figure 2.14 Processing States
63
End of bus request
Bus request
Program execution
state
End of bus
request
SLEEP
instruction
with
LSON = 0,
PSS = 0,
SSBY = 1
Bus
request
Bus-released state
End of
exception
handling
SLEEP
instruction
with
LSON = 0,
SSBY = 0
Request for
exception
handling
Sleep mode
Interrupt
request
Exception-handling state
External interrupt
Software standby mode
RES = high
Reset state*1
STBY = high, RES = low
Hardware standby mode*2
Power-down state*3
Notes: 1. From any state except hardware standby mode, a transition to the reset state occurs whenever RES
goes low. A transition can also be made to the reset state when the watchdog timer overflows.
2. From any state, a transition to hardware standby mode occurs when STBY goes low.
3. The power-down state also includes a watch mode, subactive mode, subsleep mode, etc. For details,
refer to section 21, Power-Down State.
Figure 2.15 State Transitions
2.8.2
Reset State
When the RES input goes low all current processing stops and the CPU enters the reset state. All
interrupts are disabled in the reset state. Reset exception handling starts when the RES signal
changes from low to high.
The reset state can also be entered by a watchdog timer overflow. For details, refer to section 14,
Watchdog Timer.
64
2.8.3
Exception-Handling State
The exception-handling state is a transient state that occurs when the CPU alters the normal
processing flow due to a reset, interrupt, or trap instruction. The CPU fetches a start address
(vector) from the exception vector table and branches to that address.
Types of Exception Handling and Their Priority: Exception handling is performed for resets,
interrupts, and trap instructions. Table 2.7 indicates the types of exception handling and their
priority. Trap instruction exception handling is always accepted in the program execution state.
Exception handling and the stack structure depend on the interrupt control mode set in SYSCR.
Table 2.7
Exception Handling Types and Priority
Priority
Type of Exception
Detection Timing
Start of Exception Handling
High
Reset
Synchronized with clock
Exception handling starts
immediately after a low-to-high
transition at the RES pin, or
when the watchdog timer
overflows.
Interrupt
End of instruction
execution or end of
exception-handling
sequence* 1
When an interrupt is requested,
exception handling starts at the
end of the current instruction or
current exception-handling
sequence.
Trap instruction
When TRAPA instruction
is executed
Exception handling starts when
a trap (TRAPA) instruction is
executed.* 2
Low
Notes: 1. Interrupts are not detected at the end of the ANDC, ORC, XORC, and LDC instructions,
or immediately after reset exception handling.
2. Trap instruction exception handling is always accepted in the program execution state.
Reset Exception Handling: After the RES pin has gone low and the reset state has been entered,
when RES goes high again, reset exception handling starts. When reset exception handling starts
the CPU fetches a start address (vector) from the exception vector table and starts program
execution from that address. All interrupts, including NMI, are disabled during reset exception
handling and after it ends.
Interrupt Exception Handling and Trap Instruction Exception Handling: When interrupt or
trap-instruction exception handling begins, the CPU references the stack pointer (ER7) and pushes
the program counter and other control registers onto the stack. Next, the CPU alters the settings of
the interrupt mask bits in the control registers. Then the CPU fetches a start address (vector) from
the exception vector table and program execution starts from that start address.
65
Figure 2.16 shows the stack after exception handling ends.
Normal mode
SP
Advanced mode
CCR
CCR*
SP
PC
(16 bits)
CCR
PC
(24 bits)
Note: * Ignored when returning.
Figure 2.16 Stack Structure after Exception Handling (Examples)
2.8.4
Program Execution State
In this state the CPU executes program instructions in sequence.
2.8.5
Bus-Released State
This is a state in which the bus has been released in response to a bus request from a bus master
other than the CPU. While the bus is released, the CPU halts except for internal operations.
There is one other bus master in addition to the CPU: the data transfer controller (DTC).
For further details, refer to section 6, Bus Controller.
2.8.6
Power-Down State
The power-down state includes both modes in which the CPU stops operating and modes in which
the CPU does not stop. There are five modes in which the CPU stops operating: sleep mode,
software standby mode, hardware standby mode, subsleep mode, and watch mode. There are also
three other power-down modes: medium-speed mode, module stop mode, and subactive mode. In
medium-speed mode, the CPU and other bus masters operate on a medium-speed clock. Module
stop mode permits halting of the operation of individual modules, other than the CPU. Subactive
mode, subsleep mode, and watch mode are power-down modes that use subclock input. For
details, refer to section 21, Power-Down State.
66
Sleep Mode: A transition to sleep mode is made if the SLEEP instruction is executed while the
software standby bit (SSBY) in the standby control register (SBYCR) and the LSON bit in the
low-power control register (LPWRCR) are both cleared to 0. In sleep mode, CPU operations stop
immediately after execution of the SLEEP instruction. The contents of CPU registers are retained.
Software Standby Mode: A transition to software standby mode is made if the SLEEP
instruction is executed while the SSBY bit in SBYCR is set to 1 and the LSON bit in LPWRCR
and the PSS bit in the WDT1 timer control/status register (TCSR) are both cleared to 0. In
software standby mode, the CPU and clock halt and all MCU operations stop. As long as a
specified voltage is supplied, the contents of CPU registers and on-chip RAM are retained. The
I/O ports also remain in their existing states.
Hardware Standby Mode: A transition to hardware standby mode is made when the STBY pin
goes low. In hardware standby mode, the CPU and clock halt and all MCU operations stop. The
on-chip supporting modules are reset, but as long as a specified voltage is supplied, on-chip RAM
contents are retained.
2.9
Basic Timing
2.9.1
Overview
The CPU is driven by a system clock, denoted by the symbol ø. The period from one rising edge
of ø to the next is referred to as a “state.” The memory cycle or bus cycle consists of one, two, or
three states. Different methods are used to access on-chip memory, on-chip supporting modules,
and the external address space.
2.9.2
On-Chip Memory (ROM, RAM)
On-chip memory is accessed in one state. The data bus is 16 bits wide, permitting both byte and
word transfer instruction. Figure 2.17 shows the on-chip memory access cycle. Figure 2.18 shows
the pin states.
67
Bus cycle
T1
ø
Internal address bus
Address
Internal read signal
Read
access
Internal data bus
Read data
Internal write signal
Write
access
Internal data bus
Write data
Figure 2.17 On-Chip Memory Access Cycle
Bus cycle
T1
ø
Address bus
Unchanged
AS
High
RD
High
WR
High
Data bus
High impedance
Figure 2.18 Pin States during On-Chip Memory Access
68
2.9.3
On-Chip Supporting Module Access Timing
The on-chip supporting modules are accessed in two states. The data bus is either 8 bits or 16 bits
wide, depending on the particular internal I/O register being accessed. Figure 2.19 shows the
access timing for the on-chip supporting modules. Figure 2.20 shows the pin states.
Bus cycle
T1
T2
ø
Internal address bus
Address
Internal read signal
Read
access
Internal data bus
Read data
Internal write signal
Write
access
Internal data bus
Write data
Figure 2.19 On-Chip Supporting Module Access Cycle
69
Bus cycle
T1
T2
ø
Address bus
Unchanged
AS
High
RD
High
WR
High
Data bus
High impedance
Figure 2.20 Pin States during On-Chip Supporting Module Access
2.9.4
External Address Space Access Timing
The external address space is accessed with an 8-bit data bus width in a two-state or three-state
bus cycle. In three-state access, wait states can be inserted. For further details, refer to section 6,
Bus Controller.
2.10
Usage Notes
2.10.1
TAS Instruction
Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. The TAS
instruction is not generated by the Hitachi H8S and H8/300 series C/C++ compilers. If the TAS
instruction is used as a user-defined intrinsic function, ensure that only register ER0, ER1, ER4, or
ER5 is used.
2.10.2
STM/LDM Instruction
ER7 is not used as the register that can be saved (STM)/restored (LDM) when using STM/LDM
instruction, because ER7 is the stack pointer. Two, three, or four registers can be saved /restored
by one STM/LDM instruction. The following ranges can be specified in the register list.
70
Two registers: ER0—ER1, ER2—ER3, or ER4—ER5
Three registers: ER0—ER2 or ER4—ER6
Four registers: ER0—ER3
The STM/LDM instruction including ER7 is not generated by the Hitachi H8S and H8/300 series
C/C++ compilers.
71
72
Section 3 MCU Operating Modes
3.1
Overview
3.1.1
Operating Mode Selection
The H8S/2128 Series and H8S/2124 Series have three operating modes (modes 1 to 3). These
modes enable selection of the CPU operating mode and enabling/disabling of on-chip ROM, by
setting the mode pins (MD1 and MD0).
Table 3.1 lists the MCU operating modes.
Table 3.1
MCU Operating Mode Selection
MCU
Operating
Mode
MD1
0
0
1
2
1
MD0
CPU
Operating
Mode
Description
On-Chip
ROM
0
—
—
—
1
Normal
Expanded mode with on-chip ROM disabled
Disabled
0
Advanced
Expanded mode with on-chip ROM enabled
Enabled
Single-chip mode
3
1
Normal
Expanded mode with on-chip ROM enabled
Single-chip mode
The CPU’s architecture allows for 4 Gbytes of address space, but the H8S/2128 Series and
H8S/2124 Series actually access a maximum of 16 Mbytes. However, as there are 16 external
address output pins, advanced mode is enabled only in single-chip mode or in expanded mode
with on-chip ROM enabled when a specific area in the external address space is accessed using
IOS. The external data bus width is 8 bits.
Mode 1 is an externally expanded mode that allows access to external memory and peripheral
devices. With modes 2 and 3, operation begins in single-chip mode after reset release, but a
transition can be made to external expansion mode by setting the EXPE bit in MDCR.
The H8S/2128 Series and H8S/2124 Series can only be used in modes 1 to 3. These means that the
mode pins must select one of these modes. Do not changes the inputs at the mode pins during
operation.
73
3.1.2
Register Configuration
The H8S/2128 Series and H8S/2124 Series have a mode control register (MDCR) that indicates
the inputs at the mode pins (MD1 and MD0), a system control register (SYSCR) and bus control
register (BCR) that control the operation of the MCU, and a serial/timer control register (STCR)
that controls the operation of the supporting modules. Table 3.2 summarizes these registers.
Table 3.2
MCU Registers
Name
Abbreviation
R/W
Initial Value
Address*
Mode control register
MDCR
R/W
Undetermined
H'FFC5
System control register
SYSCR
R/W
H'09
H'FFC4
Bus control register
BCR
R/W
H'D7
H'FFC6
Serial/timer control register
STCR
R/W
H'00
H'FFC3
Note: * Lower 16 bits of the address.
3.2
Register Descriptions
3.2.1
Mode Control Register (MDCR)
Bit
7
6
5
4
3
2
1
0
EXPE
—
—
—
—
—
MDS1
MDS0
Initial value
—*
0
0
0
0
0
—*
—*
Read/Write
R/W*
—
—
—
—
—
R
R
Note: * Determined by pins MD1 and MD0.
MDCR is an 8-bit read-only register that indicates the operating mode setting and the current
operating mode of the MCU.
The EXPE bit is initialized in coordination with the mode pin states by a reset and in hardware
standby mode.
74
Bit 7—Expanded Mode Enable (EXPE): Sets expanded mode. In mode 1, this bit is fixed at 1
and cannot be modified. In modes 2 and 3, this bit has an initial value of 0, and can be read and
written.
Bit 7
EXPE
Description
0
Single chip mode is selected
1
Expanded mode is selected
Bits 6 to 2—Reserved: These bits cannot be modified and are always read as 0.
Bits 1 and 0—Mode Select 1 and 0 (MDS1, MDS0): These bits indicate the input levels at pins
MD1 and MD0 (the current operating mode). Bits MDS1 and MDS0 correspond to MD1 and
MD0. MDS1 and MDS0 are read-only bits—they cannot be written to. The mode pin (MD1 and
MD0) input levels are latched into these bits when MDCR is read.
3.2.2
System Control Register (SYSCR)
7
6
5
4
3
2
1
0
CS2E
IOSE
INTM1
INTM0
XRST
NMIEG
HIE
RAME
Initial value
0
0
0
0
1
0
0
1
Read/Write
R/W
R/W
R
R/W
R
R/W
R/W
R/W
Bit
SYSCR is an 8-bit readable/writable register that performs selection of system pin functions, reset
source monitoring, interrupt control mode selection, NMI detected edge selection, supporting
module register access control, and RAM address space control.
Only bits 7, 6, 3, 1, and 0 are described here. For a detailed description of these bits, refer also to
the description of the relevant modules (bus controller, watchdog timer, RAM, etc.). For
information on bits 5, 4, and 2, see section 5.2.1, System Control Register (SYSCR).
SYSCR is initialized to H'09 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bit 7—Chip Select 2 Enable (CS2E): Specifies the location of the host interface control pin. As
these series do not include an on-chip host interface, this bit should not be set to 1.
75
Bit 6—IOS Enable (IOSE): Controls the function of the AS/IOS pin in expanded mode.
Bit 6
IOSE
Description
0
The AS/IOS pin functions as the address strobe pin (AS)
(Low output when accessing an external area)
1
(Initial value)
The AS/IOS pin functions as the I/O strobe pin (IOS)
(Low output when accessing a specified address from H'(FF)F000 to H'(FF)FE4F)
Bit 3—External Reset (XRST): Indicates the reset source. When the watchdog timer is used, a
reset can be generated by watchdog timer overflow as well as by external reset input. XRST is a
read-only bit. It is set to 1 by an external reset and cleared to 0 by watchdog timer overflow.
Bit 3
XRST
Description
0
A reset is generated by watchdog timer overflow
1
A reset is generated by an external reset
(Initial value)
Bit 1—Host Interface Enable (HIE): Enables or disables CPU access to on-chip supporting
function registers.
This bit controls CPU access to the 8-bit timer (channel X and Y) data registers and control
registers (TCRX/TCRY, TCSRX/TCSRY, TICRR/TCORAY, TICRF/TCORBY,
TCNTX/TCNTY, TCORC/TISR, TCORAX, and TCORBX), and the timer connection control
registers (TCONRI, TCONRO, TCONRS, and SEDGR).
Bit 1
HIE
Description
0
In areas H'(FF)FFF0 to H'(FF)FFF7 and H'(FF)FFFC to H'(FF)FFFF,
CPU access to 8-bit timer (channel X and Y) data registers and control
registers, and timer connection control registers, is permitted
1
In areas H'(FF)FFF0 to H'(FF)FFF7 and H'(FF)FFFC to H'(FF)FFFF,
CPU access to 8-bit timer (channel X and Y) data registers and control
registers, and timer connection control registers, is not permitted
76
(Initial value)
Bit 0—RAM Enable (RAME): Enables or disables the on-chip RAM. The RAME bit is
initialized when the reset state is released. It is not initialized in software standby mode.
Bit 0
RAME
Description
0
On-chip RAM is disabled
1
On-chip RAM is enabled
3.2.3
(Initial value)
Bus Control Register (BCR)
7
Bit
ICIS1
6
5
4
3
ICIS0 BRSTRM BRSTS1 BRSTS0
2
1
0
—
IOS1
IOS0
Initial value
1
1
0
1
0
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
BCR is an 8-bit readable/writable register that specifies the external memory space access mode,
and the I/O area range when the AS pin is designated for use as the I/O strobe. For details on bits 7
to 2, see section 6.2.1, Bus Control Register (BCR).
BCR is initialized to H'D7 by a reset and in hardware standby mode.
Bits 1 and 0—IOS Select 1 and 0 (IOS1, IOS0): These bits specify the addresses for which the
AS/IOS pin output goes low when IOSE = 1.
BCR
Bit 1
Bit 0
IOS1
IOS0
Description
0
0
The AS/IOS pin output goes low in accesses to addresses
H'(FF)F000 to H'(FF)F03F
1
The AS/IOS pin output goes low in accesses to addresses
H'(FF)F000 to H'(FF)F0FF
0
The AS/IOS pin output goes low in accesses to addresses
H'(FF)F000 to H'(FF)F3FF
1
The AS/IOS pin output goes low in accesses to addresses
H'(FF)F000 to H'(FF)FE4F
(Initial value)
1
77
3.2.4
Serial/Timer Control Register (STCR)
Bit
7
6
5
4
3
2
1
0
—
IICX1
IICX0
IICE
FLSHE
—
ICKS1
ICKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
STCR is an 8-bit readable/writable register that controls register access, the IIC operating mode
(when the on-chip IIC option is included), an on-chip flash memory (in F-ZTAT versions), and
also selects the TCNT input clock. For details of functions other than register access control, see
the descriptions of the relevant modules. If a module controlled by STCR is not used, do not write
1 to the corresponding bit.
STCR is initialized to H'00 by a reset and in hardware standby mode.
Bit 7—Reserved: Do not write 1 to this bit.
Bits 6 and 5—I2C Transfer Rate Select 1 and 0 (IICX1, IICX0): These bits control the
operation of the I2C bus interface when the on-chip IIC option is included. For details, see section
16.2.7, Serial/Timer Control Register (STCR).
Bit 4—I2C Master Enable (IICE): Controls CPU access to the I2C bus interface data registers
and control registers (ICCR, ICSR, ICDR/SARX, and ICMR/SAR), the PWMX data registers and
control registers (DADRAH/DACR, DADRAL, DADRBH/DACNTH, and DADRBL/DACNTL),
and the SCI control registers (SMR, BRR, and SCMR).
Bit 4
IICE
Description
0
Addresses H'(FF)FF88 and H'(FF)89, and H'(FF)FF8E and
H'(FF)FF8F, are used for SCI1 control register access
Addresses H'(FF)FFD8 and H'(FF)FFD9, and H'(FF)FFDE and
H'(FF)FFDF, are used for SCI0 control register access
1
Addresses H'(FF)FF88 and H'(FF)FF89, and H'(FF)FF8E and
H'(FF)FF8F, are used for IIC1 data register and control register access
Addresses H'(FF)FFA0 and H'(FF)FFA1, and H'(FF)FFA6 and
H'(FF)FFA7, are used for PWMX data register and control register
access
Addresses H'(FF)FFD8 and H'(FF)FFD9, and H'(FF)FFDE and
H'(FF)FFDF, are used for IIC0 data register and control register access
78
(Initial value)
Bit 3—Flash Memory Control Register Enable (FLSHE): Controls CPU access to the flash
memory control registers (FLMCR1, FLMCR2, EBR1, and EBR2), the power-down mode control
registers (SBYCR, LPWRCR, MSTPCRH, and MSTPCRL), and the supporting module control
register (PCSR).
Bit 3
FLSHE
Description
0
Addresses H'(FF)F80 to H'(FF)F87 are used for power-down mode
control register and supporting module control register access
1
Addresses H'(FF)FF80 to H'(FF)FF87 are used for flash memory control
register access
(Initial value)
Bit 2—Reserved: Do not write 1 to this bit.
Bits 1 and 0—Internal Clock Source Select 1 and 0 (ICKS1, ICKS0): These bits, together with
bits CKS2 to CKS0 in TCR, select the clock to be input to TCNT. For details, see section 12.2.4,
Timer Control Register (TCR).
79
3.3
Operating Mode Descriptions
3.3.1
Mode 1
The CPU can access a 64-kbyte address space in normal mode. The on-chip ROM is disabled.
Ports 1 and 2 function as an address bus, port 3 function as a data bus, and part of port 4 carries
bus control signals.
3.3.2
Mode 2
The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is enabled.
After a reset, single-chip mode is set, and the EXPE bit in MDCR must be set to 1 in order to use
external addresses. However, as these series have a maximum of 16 address outputs, an external
address can be specified correctly only when the I/O strobe function of the AS/IOS pin is used.
When the EXPE bit in MDCR is set to 1, ports 1 and 2 function as input ports after a reset. They
can be set to output addresses by setting the corresponding bits in the data direction register
(DDR) to 1. Port 3 function as a data bus, and part of port 4 carries bus control signals.
3.3.3
Mode 3
The CPU can access a 64-kbyte address space in normal mode. The on-chip ROM is enabled.
After a reset, single-chip mode is set, and the EXPE bit in MDCR must be set to 1 in order to use
external addresses.
When the EXPE bit in MDCR is set to 1, ports 1 and 2 function as input ports after a reset. They
can be set to output addresses by setting the corresponding bits in the data direction register
(DDR) to 1. Port 3 function as a data bus, and part of port 4 carries bus control signals.
In products with an on-chip ROM capacity of 64 kbytes or more, the amount of on-chip ROM that
can be used is limited to 56 kbytes.
80
3.4
Pin Functions in Each Operating Mode
The pin functions of ports 1 to 4 vary depending on the operating mode. Table 3.3 shows their
functions in each operating mode.
Table 3.3
Pin Functions in Each Mode
Port
Mode 1
Mode 2
Mode 3
Port 1
A
P*/A
P*/A
Port 2
A
P*/A
P*/A
Port 3
D
P*/D
P*/D
P47
P*/C
P*/C
P*/C
P46
C */P
P*/C
P*/C
P45 to P43
C
P*/C
P*/C
P42 to P40
P
P
P
Port 4
Legend:
P: I/O port
A: Address bus output
D: Data bus I/O
C: Control signals, clock I/O
*: After reset
3.5
Memory Map in Each Operating Mode
Figures 3.1 to 3.3 show memory maps for each of the operating modes.
The address space is 64 kbytes in modes 1 and 3 (normal modes), and 16 Mbytes in mode 2
(advanced mode).
The on-chip ROM capacity is 32 kbytes (H8S/2126 and H8S/2120), 64 kbytes (H8S/2127 and
H8S/2122), or 128 kbytes (H8S/2128), but for products with an on-chip ROM capacity of 64
kbytes or more, the amount of on-chip ROM that can be used is limited to 56 kbytes in mode 3
(normal mode).
Do not access the reserved areas and register addresses in internal I/O registers for modules which
are not supported by the product.
For details, see section 6, Bus Controller.
81
Mode 1
(normal expanded mode
with on-chip ROM disabled)
H'0000
Mode 3/EXPE = 1
(normal expanded mode
with on-chip ROM enabled)
H'0000
External address
space
Mode 3/EXPE = 0
(normal single-chip mode)
H'0000
On-chip ROM
H'DFFF
On-chip ROM
H'DFFF
External address
space
H'E080
H'E080
H'E080
On-chip RAM*
On-chip RAM*
H'EFFF
H'EFFF
H'EFFF
External address
space
H'FE50
H'FEFF Internal I/O registers 2
On-chip RAM
H'FF00
(128 bytes)*
H'FF7F
H'FF80
Internal I/O registers 1
H'FFFF
On-chip RAM
External address
space
H'FE50
H'FEFF Internal I/O registers 2
On-chip RAM
H'FF00
(128 bytes)*
H'FF7F
H'FF80
Internal I/O registers 1
H'FFFF
H'FE50
H'FEFF Internal I/O registers 2
On-chip RAM
H'FF00
(128 bytes)
H'FF7F
H'FF80
Internal I/O registers 1
H'FFFF
Note: * External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
Figure 3.1 H8S/2128 Memory Map in Each Operating Mode
82
Mode 2/EXPE = 1
(advanced expanded mode
with on-chip ROM enabled)
H'000000
Mode 2/EXPE = 0
(advanced single-chip mode)
H'000000
On-chip ROM
H'01FFFF
H'020000
On-chip ROM
H'01FFFF
External address*2
space
H'FFE080
H'FFE080
On-chip RAM*1
H'FFEFFF
External address*2
space
H'FFFE50
H'FFFEFF Internal I/O registers 2
On-chip RAM
H'FFFF00
(128 bytes)*1
H'FFFF7F
H'FFFF80
Internal I/O registers 1
H'FFFFFF
On-chip RAM
H'FFEFFF
H'FFFE50
H'FFFEFF
H'FFFF00
H'FFFF7F
H'FFFF80
H'FFFFFF
Internal I/O registers 2
On-chip RAM
(128 bytes)
Internal I/O registers 1
Notes: 1. External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
2. For these models, the maximum number of external address pins is 16. An
external address can only be specified correctly for an area that uses the I/O
strobe function.
Figure 3.1 H8S/2128 Memory Map in Each Operating Mode (cont)
83
Mode 1
(normal expanded mode
with on-chip ROM disabled)
H'0000
Mode 3/EXPE = 1
(normal expanded mode
with on-chip ROM enabled)
H'0000
Mode 3/EXPE = 0
(normal single-chip mode)
H'0000
On-chip ROM
External address
space
H'DFFF
On-chip ROM
H'DFFF
External address
space
Reserved area*
Reserved area*
H'E880
H'EFFF
H'E080
H'E080
H'E080
On-chip RAM*
External address
space
H'FE50
H'FEFF Internal I/O registers 2
On-chip RAM
H'FF00
(128 bytes)*
H'FF7F
H'FF80
Internal I/O registers 1
H'FFFF
H'E880
H'EFFF
On-chip RAM*
Reserved area
H'E880
H'EFFF
On-chip RAM
External address
space
H'FE50
H'FEFF Internal I/O registers 2
On-chip RAM
H'FF00
(128 bytes)*
H'FF7F
H'FF80
Internal I/O registers 1
H'FFFF
H'FE50
H'FEFF Internal I/O registers 2
On-chip RAM
H'FF00
(128 bytes)
H'FF7F
H'FF80
Internal I/O registers 1
H'FFFF
Note: * External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
Figure 3.2 H8S/2127 and H8S/2122 Memory Map in Each Operating Mode
84
Mode 2/EXPE = 1
(advanced expanded mode
with on-chip ROM enabled)
H'000000
Mode 2/EXPE = 0
(advanced single-chip mode)
H'000000
On-chip ROM
H'00FFFF
On-chip ROM
H'00FFFF
Reserved area
H'01FFFF
H'020000
Reserved area
H'01FFFF
External address
space*2
H'FFE080
H'FFE080
Reserved area*1
H'FFE880
H'FFEFFF
On-chip RAM*1
Reserved area
H'FFE880
H'FFEFFF
On-chip RAM
External address
space*2
H'FFFE50
H'FFFEFF Internal I/O registers 2
On-chip RAM
H'FFFF00
(128 bytes)*1
H'FFFF7F
H'FFFF80
Internal I/O registers 1
H'FFFFFF
H'FFFE50
H'FFFEFF
H'FFFF00
H'FFFF7F
H'FFFF80
H'FFFFFF
Internal I/O registers 2
On-chip RAM
(128 bytes)
Internal I/O registers 1
Notes: 1. External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
2. For these models, the maximum number of external address pins is 16. An
external address can only be specified correctly for an area that uses the I/O
strobe function.
Figure 3.2 H8S/2127 and H8S/2122 Memory Map in Each Operating Mode (cont)
85
Mode 1
(normal expanded mode
with on-chip ROM disabled)
H'0000
Mode 3/EXPE = 1
(normal expanded mode
with on-chip ROM enabled)
H'0000
Mode 3/EXPE = 0
(normal single-chip mode)
H'0000
On-chip ROM
On-chip ROM
External address
space
H'7FFF
H'7FFF
Reserved area
Reserved area
H'DFFF
H'DFFF
External address
space
H'E080
H'E880
H'EFFF
H'E080
H'E080
Reserved area*
Reserved area*
On-chip RAM*
External address
space
H'FE50
H'FEFF Internal I/O registers 2
On-chip RAM
H'FF00
(128 bytes)*
H'FF7F
H'FF80
Internal I/O registers 1
H'FFFF
H'E880
H'EFFF
On-chip RAM*
Reserved area
H'E880
H'EFFF
On-chip RAM
External address
space
H'FE50
H'FEFF Internal I/O registers 2
On-chip RAM
H'FF00
(128 bytes)*
H'FF7F
H'FF80
Internal I/O registers 1
H'FFFF
H'FE50
H'FEFF Internal I/O registers 2
On-chip RAM
H'FF00
(128 bytes)
H'FF7F
H'FF80
Internal I/O registers 1
H'FFFF
Note: * External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
Figure 3.3 H8S/2126 and H8S/2120 Memory Map in Each Operating Mode
86
Mode 2/EXPE = 1
(advanced expanded mode
with on-chip ROM enabled)
H'000000
Mode 2/EXPE = 0
(advanced single-chip mode)
H'000000
On-chip ROM
H'007FFF
On-chip ROM
H'007FFF
Reserved area
H'01FFFF
H'020000
Reserved area
H'01FFFF
External address
space*2
H'FFE080
H'FFE080
Reserved area*1
H'FFE880
H'FFEFFF
On-chip RAM*1
Reserved area
H'FFE880
H'FFEFFF
On-chip RAM
External address
space*2
H'FFFE50
H'FFFEFF Internal I/O registers 2
On-chip RAM
H'FFFF00
(128 bytes)*1
H'FFFF7F
H'FFFF80
Internal I/O registers 1
H'FFFFFF
H'FFFE50
H'FFFEFF
H'FFFF00
H'FFFF7F
H'FFFF80
H'FFFFFF
Internal I/O registers 2
On-chip RAM
(128 bytes)
Internal I/O registers 1
Notes: 1. External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
2. For these models, the maximum number of external address pins is 16. An
external address can only be specified correctly for an area that uses the I/O
strobe function.
Figure 3.3 H8S/2126 and H8S/2120 Memory Map in Each Operating Mode (cont)
87
88
Section 4 Exception Handling
4.1
Overview
4.1.1
Exception Handling Types and Priority
As table 4.1 indicates, exception handling may be caused by a reset, trap instruction, or interrupt.
Exception handling is prioritized as shown in table 4.1. If two or more exceptions occur
simultaneously, they are accepted and processed in order of priority. Trap instruction exceptions
are accepted at all times in the program execution state.
Exception handling sources, the stack structure, and the operation of the CPU vary depending on
the interrupt control mode set by the INTM0 and INTM1 bits in SYSCR.
Table 4.1
Exception Types and Priority
Priority
Exception Type
Start of Exception Handling
High
Reset
Starts immediately after a low-to-high transition at the RES
pin, or when the watchdog timer overflows.
Trace
Starts when execution of the current instruction or exception
handling ends, if the trace (T) bit is set to 1. (Cannot be used
in the H8S/2128 Series and H8S/2124 Series.)
Interrupt
Starts when execution of the current instruction or exception
handling ends, if an interrupt request has been issued.* 1
Direct transition
Started by a direct transition resulting from execution of a
SLEEP instruction.
Low
Trap instruction (TRAPA)*2 Started by execution of a trap instruction (TRAPA).
Notes: 1. Interrupt detection is not performed on completion of ANDC, ORC, XORC, or LDC
instruction execution, or on completion of reset exception handling.
2. Trap instruction exception handling requests are accepted at all times in the program
execution state.
89
4.1.2
Exception Handling Operation
Exceptions originate from various sources. Trap instructions and interrupts are handled as follows:
1. The program counter (PC) and condition-code register (CCR) are pushed onto the stack.
2. The interrupt mask bits are updated. The T bit is cleared to 0.
3. A vector address corresponding to the exception source is generated, and program execution
starts from that address.
For a reset exception, steps 2 and 3 above are carried out.
4.1.3
Exception Sources and Vector Table
The exception sources are classified as shown in figure 4.1. Different vector addresses are
assigned to different exception sources.
Table 4.2 lists the exception sources and their vector addresses.
Reset
Trace
Exception
sources
(Cannot be used in the H8S/2128 Series or H8S/2124 Series)
External interrupts: NMI, IRQ2 to IRQ0
Interrupts
Internal interrupts: interrupt sources in
on-chip supporting modules
Direct transition
Trap instruction
Figure 4.1 Exception Sources
90
Table 4.2
Exception Vector Table
Vector Address* 1
Exception Source
Vector Number
Normal Mode
Advanced Mode
Reset
0
H'0000 to H'0001
H'0000 to H'0003
Reserved for system use
1
H'0002 to H'0003
H'0004 to H'0007
2
H'0004 to H'0005
H'0008 to H'000B
3
H'0006 to H'0007
H'000C to H'000F
4
H'0008 to H'0009
H'0010 to H'0013
5
H'000A to H'000B
H'0014 to H'0017
6
H'000C to H'000D
H'0018 to H'001B
7
H'000E to H'000F
H'001C to H'001F
8
H'0010 to H'0011
H'0020 to H'0023
9
H'0012 to H'0013
H'0024 to H'0027
10
H'0014 to H'0015
H'0028 to H'002B
11
H'0016 to H'0017
H'002C to H'002F
12
H'0018 to H'0019
H'0030 to H'0033
13
H'001A to H'001B
H'0034 to H'0037
14
H'001C to H'001D
H'0038 to H'003B
15
H'001E to H'001F
H'003C to H'003F
IRQ0
16
H'0020 to H'0021
H'0040 to H'0043
IRQ1
17
H'0022 to H'0023
H'0044 to H'0047
IRQ2
18
H'0024 to H'0025
H'0048 to H'004B
19
H'0026 to H'0027
H'004C to H'004F
20
H'0028 to H'0029
H'0050 to H'0053
21
H'002A to H'002B
H'0054 to H'0057
22
H'002C to H'002D
H'0058 to H'005B
23
H'002E to H'002F
H'005C to H'005F
24

103
H'0030 to H'0031

H'00CE to H'00CF
H'0060 to H'0063

H'019C to H'019F
Direct transition
External interrupt
NMI
Trap instruction (4 sources)
Reserved for system use
External interrupt
Reserved
Internal interrupt*
2
Notes: 1. Lower 16 bits of the address.
2. For details on internal interrupt vectors, see section 5.3.3, Interrupt Exception Vector
Table.
91
4.2
Reset
4.2.1
Overview
A reset has the highest exception priority.
When the RES pin goes low, all processing halts and the MCU enters the reset state. A reset
initializes the internal state of the CPU and the registers of on-chip supporting modules.
Immediately after a reset, interrupt control mode 0 is set.
Reset exception handling begins when the RES pin changes from low to high.
H8S/2128 Series and H8S/2124 Series MCUs can also be reset by overflow of the watchdog timer.
For details, see section 14, Watchdog Timer.
4.2.2
Reset Sequence
The MCU enters the reset state when the RES pin goes low.
To ensure that the chip is reset, hold the RES pin low for at least 20 ms when powering on. To
reset the chip during operation, hold the RES pin low for at least 20 states. For pin states in a reset,
see Appendix D.1, Port States in Each Processing State.
When the RES pin goes high after being held low for the necessary time, the chip starts reset
exception handling as follows:
[1] The internal state of the CPU and the registers of the on-chip supporting modules are
initialized, and the I bit is set to 1 in CCR.
[2] The reset exception vector address is read and transferred to the PC, and program execution
starts from the address indicated by the PC.
Figures 4.2 and 4.3 show examples of the reset sequence.
92
Vector Internal
Fetch of first program
fetch processing instruction
ø
RES
Internal
address bus
(1)
(3)
Internal read
signal
Internal write
signal
Internal data
bus
High
(2)
(4)
(1) Reset exception vector address ((1) = H'0000)
(2) Start address (contents of reset exception vector address)
(3) Start address ((3) = (2))
(4) First program instruction
Figure 4.2 Reset Sequence (Mode 3)
93
Vector fetch
Internal
Fetch of first
processing program instruction
*
*
*
(1)
(3)
(5)
ø
RES
Address bus
RD
High
WR
(2)
D7 to D0
(4)
(6)
(1) (3) Reset exception vector address ((1) = H'0000, (3) = H'0001)
(2) (4) Start address (contents of reset exception vector address)
(5) Start address ((5) = (2) (4))
(6) First program instruction
Note: * 3 program wait states are inserted.
Figure 4.3 Reset Sequence (Mode 1)
4.2.3
Interrupts after Reset
If an interrupt is accepted after a reset but before the stack pointer (SP) is initialized, the PC and
CCR will not be saved correctly, leading to a program crash. To prevent this, all interrupt requests,
including NMI, are disabled immediately after a reset. Since the first instruction of a program is
always executed immediately after the reset state ends, make sure that this instruction initializes
the stack pointer (example: MOV.L #xx:32, SP).
94
4.3
Interrupts
Interrupt exception handling can be requested by four external sources (NMI and IRQ2 to IRQ0),
and internal sources in the on-chip supporting modules. Figure 4.4 shows the interrupt sources and
the number of interrupts of each type.
The on-chip supporting modules that can request interrupts include the watchdog timer (WDT),
16-bit free-running timer (FRT), 8-bit timer (TMR), serial communication interface (SCI), data
transfer controller (DTC), A/D converter (ADC), I2C bus interface (option). Each interrupt source
has a separate vector address.
NMI is the highest-priority interrupt. Interrupts are controlled by the interrupt controller. The
interrupt controller has two interrupt control modes and can assign interrupts other than NMI and
address break to either three priority/mask levels to enable multiplexed interrupt control.
For details on interrupts, see section 5, Interrupt Controller.
External
interrupts
Interrupts
Internal
interrupts
NMI (1)
IRQ2 to IRQ0 (3)
WDT* (2)
FRT (7)
TMR (10)
SCI (8)
DTC (1)
ADC (1)
IIC (3) (option)
Other (1)
Note: Numbers in parentheses are the numbers of interrupt sources.
* When the watchdog timer is used as an interval timer, it generates an interrupt
request at each counter overflow.
Figure 4.4 Interrupt Sources and Number of Interrupts
95
4.4
Trap Instruction
Trap instruction exception handling starts when a TRAPA instruction is executed. Trap instruction
exception handling can be executed at all times in the program execution state.
The TRAPA instruction fetches a start address from a vector table entry corresponding to a vector
number from 0 to 3, as specified in the instruction code.
Table 4.3 shows the status of CCR and EXR after execution of trap instruction exception handling.
Table 4.3
Status of CCR and EXR after Trap Instruction Exception Handling
CCR
EXR
Interrupt Control Mode
I
UI
I2 to I0
T
0
1
—
—
—
1
1
1
—
—
Legend:
1: Set to 1
0: Cleared to 0
—: Retains value prior to execution.
96
4.5
Stack Status after Exception Handling
Figure 4.5 shows the stack after completion of trap instruction exception handling and interrupt
exception handling.
SP
CCR
CCR*
PC
(16 bits)
Interrupt control modes 0 and 1
Note: * Ignored on return.
Figure 4.5 (1) Stack Status after Exception Handling (Normal Mode)
SP
CCR
PC
(24bits)
Interrupt control modes 0 and 1
Note: * Ignored on return.
Figure 4.5 (2) Stack Status after Exception Handling (Advanced Mode)
97
4.6
Notes on Use of the Stack
When accessing word data or longword data, the H8S/2128 Series or H8S/2124 Series chip
assumes that the lowest address bit is 0. The stack should always be accessed by word transfer
instruction or longword transfer instruction, and the value of the stack pointer (SP: ER7) should
always be kept even. Use the following instructions to save registers:
PUSH.W
Rn
(or MOV.W Rn, @-SP)
PUSH.L
ERn
(or MOV.L ERn, @-SP)
Use the following instructions to restore registers:
POP.W
Rn
(or MOV.W @SP+, Rn)
POP.L
ERn
(or MOV.L @SP+, ERn)
Setting SP to an odd value may lead to a malfunction. Figure 4.6 shows an example of what
happens when the SP value is odd.
CCR
SP
R1L
SP
PC
PC
SP
H'FFEFFA
H'FFEFFB
H'FFEFFC
H'FFEFFD
H'FFEFFF
TRAPA instruction executed
SP set to H'FFEFFF
MOV.B R1L, @–ER7
Data saved above SP
Contents of CCR lost
Legend:
CCR: Condition-code register
PC: Program counter
R1L: General register R1L
SP: Stack pointer
Note: This diagram illustrates an example in which the interrupt control mode is 0, in advanced
mode.
Figure 4.6 Operation when SP Value is Odd
98
Section 5 Interrupt Controller
5.1
Overview
5.1.1
Features
H8S/2128 Series and H8S/2124 Series MCUs control interrupts by means of an interrupt
controller. The interrupt controller has the following features:
• Two interrupt control modes
 Either of two interrupt control modes can be set by means of the INTM1 and INTM0 bits in
the system control register (SYSCR).
• Priorities settable with ICR
 An interrupt control register (ICR) is provided for setting interrupt priorities. Three priority
levels can be set for each module for all interrupts except NMI and address break.
• Independent vector addresses
 All interrupt sources are assigned independent vector addresses, making it unnecessary for
the source to be identified in the interrupt handling routine.
• Four external interrupt pins
 NMI is the highest-priority interrupt, and is accepted at all times. A rising or falling edge at
the NMI pin can be selected for the NMI interrupt.
 Falling edge, rising edge, or both edge detection, or level sensing, at pins IRQ2 to IRQ0
can be selected for interrupts IRQ2 to IRQ0.
• DTC control
 DTC activation is controlled by means of interrupts.
99
5.1.2
Block Diagram
A block diagram of the interrupt controller is shown in Figure 5.1.
CPU
INTM1 INTM0
SYSCR
NMIEG
NMI input
NMI input unit
IRQ input
IRQ input unit
ISR
ISCR
Interrupt
request
Vector
number
Priority
determination
IER
I, UI
Internal interrupt
requests
SWDTEND to IICI1
CCR
ICR
Interrupt controller
Legend:
ISCR:
IER:
ISR:
ICR:
SYSCR:
IRQ sense control register
IRQ enable register
IRQ status register
Interrupt control register
System control register
Figure 5.1 Block Diagram of Interrupt Controller
5.1.3
Pin Configuration
Table 5.1 summarizes the pins of the interrupt controller.
Table 5.1
Interrupt Controller Pins
Name
Symbol
I/O
Function
Nonmaskable interrupt
NMI
Input
Nonmaskable external interrupt; rising or
falling edge can be selected
External interrupt
requests 2 to 0
IRQ2 to IRQ0 Input
100
Maskable external interrupts; rising, falling, or
both edges, or level sensing, can be selected
5.1.4
Register Configuration
Table 5.2 summarizes the registers of the interrupt controller.
Table 5.2
Interrupt Controller Registers
Name
Abbreviation
R/W
Initial Value
Address* 1
System control register
SYSCR
R/W
H'09
H'FFC4
IRQ sense control register H
ISCRH
R/W
H'00
H'FEEC
IRQ sense control register L
ISCRL
R/W
H'00
H'FEED
IRQ enable register
IER
R/W
H'F8
H'FFC2
H'00
H'FEEB
2
IRQ status register
ISR
R/(W)*
Interrupt control register A
ICRA
R/W
H'00
H'FEE8
Interrupt control register B
ICRB
R/W
H'00
H'FEE9
Interrupt control register C
ICRC
R/W
H'00
H'FEEA
Address break control register
ABRKCR
R/W
H'00
H'FEF4
Break address register A
BARA
R/W
H'00
H'FEF5
Break address register B
BARB
R/W
H'00
H'FEF6
Break address register C
BARC
R/W
H'00
H'FEF7
Notes: 1. Lower 16 bits of the address.
2. Only 0 can be written, for flag clearing.
5.2
Register Descriptions
5.2.1
System Control Register (SYSCR)
Bit
7
6
5
4
3
2
1
0
CS2E
IOSE
INTM1
INTM0
XRST
NMIEG
HIE
RAME
Initial value
0
0
0
0
1
0
0
1
Read/Write
R/W
R/W
R
R/W
R
R/W
R/W
R/W
SYSCR is an 8-bit readable/writable register of which bits 5, 4, and 2 select the interrupt control
mode and the detected edge for NMI.
Only bits 5, 4, and 2 are described here; for details on the other bits, see section 3.2.2, System
Control Register (SYSCR).
SYSCR is initialized to H'09 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
101
Bits 5 and 4—Interrupt Control Mode 1 and 0 (INTM1, INTM0): These bits select one of four
interrupt control modes for the interrupt controller. The INTM1 bit must not be set to 1.
Bit 5
Bit 4
INTM1
INTM0
Interrupt
Control Mode
Description
0
0
0
Interrupts are controlled by I bit
1
1
Interrupts are controlled by I and UI bits and ICR
0
2
Cannot be used in the H8S/2128 Series or H8S/2124 Series
1
3
Cannot be used in the H8S/2128 Series or H8S/2124 Series
1
(Initial value)
Bit 2—NMI Edge Select (NMIEG): Selects the input edge for the NMI pin.
Bit 2
NMIEG
Description
0
Interrupt request generated at falling edge of NMI input
1
Interrupt request generated at rising edge of NMI input
5.2.2
(Initial value)
Interrupt Control Registers A to C (ICRA to ICRC)
7
6
5
4
3
2
1
0
ICR7
ICR6
ICR5
ICR4
ICR3
ICR2
ICR1
ICR0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
The ICR registers are three 8-bit readable/writable registers that set the interrupt control level for
interrupts other than NMI and address break.
The correspondence between ICR settings and interrupt sources is shown in table 5.3.
The ICR registers are initialized to H'00 by a reset and in hardware standby mode.
Bit n—Interrupt Control Level (ICRn): Sets the control level for the corresponding interrupt
source.
Bit n
ICRn
Description
0
Corresponding interrupt source is control level 0 (non-priority)
1
Corresponding interrupt source is control level 1 (priority)
(Initial value)
(n = 7 to 0)
102
Table 5.3
Correspondence between Interrupt Sources and ICR Settings
Bits
Register 7
6
5
4
3
2
1
ICRA
IRQ0
IRQ1
IRQ2
—
—
DTC
Watchdog Watchdog
timer 0
timer 1
ICRB
A/D
Freeconverter running
timer
—
—
—
8-bit
8-bit
8-bit
timer
timer
timer
channel 0 channel 1 channels
X, Y
ICRC
SCI
SCI
—
channel 0 channel 1
5.2.3
—
IIC
IIC
channel 0 channel 1
(option) (option)
0
—
—
IRQ Enable Register (IER)
Bit
7
6
5
4
3
2
1
0
—
—
—
—
—
IRQ2E
IRQ1E
IRQ0E
Initial value
1
1
1
1
1
0
0
0
Read/Write
R
R
R
R
R
R/W
R/W
R/W
IER is an 8-bit readable/writable register that controls enabling and disabling of interrupt requests
IRQ2 to IRQ0.
IER is initialized to H'F8 by a reset and in hardware standby mode.
Bits 7 to 3—Reserved: These bits cannot be modified and are always read as 0.
Bits 2 to 0—IRQ2 to IRQ0 Enable (IRQ2E to IRQ0E): These bits select whether IRQ2 to
IRQ0 are enabled or disabled.
Bit n
IRQnE
Description
0
IRQn interrupt disabled
1
IRQn interrupt enabled
(Initial value)
(n = 2 to 0)
103
5.2.4
IRQ Sense Control Registers H and L (ISCRH, ISCRL)
• ISCRH
Bit
15
14
13
12
11
10
9
8
—
—
—
—
—
—
—
—
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
—
—
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
• ISCRL
Bit
IRQ2SCB IRQ2SCA IRQ1SCB IRQ1SCA IRQ0SCB IRQ0SCA
ISCRH and ISCRL are 8-bit readable/writable registers that select rising edge, falling edge, or
both edge detection, or level sensing, for the input at pins IRQ2 to IRQ0.
Each of the ISCR registers is initialized to H'00 by a reset and in hardware standby mode.
ISCRH Bits 7 to 0, ISCRL Bits 7 and 6—Reserved: Do not write 1 to this bit.
ISCRL Bits 5 to 0—IRQ2 Sense Control A and B (IRQ2SCA, IRQ2SCB) to IRQ0 Sense
Control A and B (IRQ0SCA, IRQ0SCB)
ISCRL Bits 5 to 0
IRQ2SCB to
IRQ0SCB
IRQ2SCA to
IRQ0SCA
0
0
Interrupt request generated at IRQ2 to IRQ0 input low level
(Initial value)
1
Interrupt request generated at falling edge of IRQ2 to IRQ0 input
0
Interrupt request generated at rising edge of IRQ2 to IRQ0 input
1
Interrupt request generated at both falling and rising edges of
IRQ2 to IRQ0 input
1
104
Description
5.2.5
IRQ Status Register (ISR)
Bit
7
6
5
4
3
2
1
0
—
—
—
—
—
IRQ2F
IRQ1F
IRQ0F
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R/(W)*
R/(W)*
R/(W)*
Note: * Only 0 can be written, to clear the flag.
ISR is an 8-bit readable/writable register that indicates the status of IRQ2 to IRQ0 interrupt
requests.
ISR is initialized to H'00 by a reset and in hardware standby mode.
Bits 7 to 3—Reserved
Bits 2 to 0—IRQ2 to IRQ0 Flags (IRQ2F to IRQ0F): These bits indicate the status of IRQ2 to
IRQ0 interrupt requests.
Bit n
IRQnF
Description
0
[Clearing conditions]
•
•
•
1
(Initial value)
Cleared by reading IRQnF when set to 1, then writing 0 in IRQnF
When interrupt exception handling is executed when low-level detection is set
(IRQnSCB = IRQnSCA = 0) and IRQn input is high
When IRQn interrupt exception handling is executed when falling, rising, or both-edge
detection is set (IRQnSCB = 1 or IRQnSCA = 1)
[Setting conditions]
•
•
•
•
When IRQn input goes low when low-level detection is set (IRQnSCB = IRQnSCA =
0)
When a falling edge occurs in IRQn input when falling edge detection is set
(IRQnSCB = 0, IRQnSCA = 1)
When a rising edge occurs in IRQn input when rising edge detection is set
(IRQnSCB = 1, IRQnSCA = 0)
When a falling or rising edge occurs in IRQn input when both-edge detection is set
(IRQnSCB = IRQnSCA = 1)
(n = 2 to 0)
105
5.2.6
Address Break Control Register (ABRKCR)
Bit
7
6
5
4
3
2
1
0
CMF
—
—
—
—
—
—
BIE
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
—
—
—
—
—
—
R/W
ABRKCR is an 8-bit readable/writable register that performs address break control.
ABRKCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bit 7—Condition Match Flag (CMF): This is the address break source flag, used to indicate that
the address set by BAR has been prefetched. When the CMF flag and BIE flag are both set to 1, an
address break is requested.
Bit 7
CMF
Description
0
[Clearing condition]
When address break interrupt exception handling is executed
1
(Initial value)
[Setting condition]
When address set by BARA to BARC is prefetched while BIE = 1
Bits 6 to 1—Reserved: These bits cannot be modified and are always read as 0.
Bit 0—Break Interrupt Enable (BIE): Selects address break enabling or disabling.
Bit 0
BIE
Description
0
Address break disabled
1
Address break enabled
106
(Initial value)
5.2.7
Break Address Registers A, B, C (BARA, BARB, BARC)
Bit
BARA
7
6
5
4
3
2
1
0
A23
A22
A21
A20
A19
A18
A17
A16
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
Bit
A15
A14
A13
A12
A11
A10
A9
A8
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
BARB
7
6
5
4
3
2
1
0
A7
A6
A5
A4
A3
A2
A1
—
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
—
Bit
BARC
BAR consists of three 8-bit readable/writable registers (BARA, BARB, and BARC), and is used to
specify the address at which an address break is to be executed.
Each of the BAR registers is initialized to H'00 by a reset and in hardware standby mode. They are
not initialized in software standby mode.
BARA Bits 7 to 0—Address 23 to 16 (A23 to A16)
BARB Bits 7 to 0—Address 15 to 8 (A15 to A8)
BARC Bits 7 to 1—Address 7 to 1 (A7 to A1)
These bits specify the address at which an address break is to be executed. BAR bits A23 to A1
are compared with internal address bus lines A23 to A1, respectively.
The address at which the first instruction byte is located should be specified as the break address.
Occurrence of the address break condition may not be recognized for other addresses.
In normal mode, no comparison is made with address lines A23 to A16.
BARC Bit 0—Reserved: This bit cannot be modified and is always read as 0.
107
5.3
Interrupt Sources
Interrupt sources comprise external interrupts (NMI and IRQ2 to IRQ0) and internal interrupts.
5.3.1
External Interrupts
There are four external interrupt sources: NMI, and IRQ2 to IRQ0. NMI, and IRQ2 to IRQ0 can
be used to restore the H8S/2128 Series or H8S/2124 Series chip from software standby mode.
NMI Interrupt: NMI is the highest-priority interrupt, and is always accepted by the CPU
regardless of the interrupt control mode and the status of the CPU interrupt mask bits. The
NMIEG bit in SYSCR can be used to select whether an interrupt is requested at a rising edge or a
falling edge on the NMI pin.
The vector number for NMI interrupt exception handling is 7.
IRQ2 to IRQ0 Interrupts: Interrupts IRQ2 to IRQ0 are requested by an input signal at pins IRQ2
to IRQ0. Interrupts IRQ2 to IRQ0 have the following features:
• Using ISCR, it is possible to select whether an interrupt is generated by a low level, falling
edge, rising edge, or both edges, at pins IRQ2 to IRQ0.
• Enabling or disabling of interrupt requests IRQ2 to IRQ0 can be selected with IER.
• The interrupt control level can be set with ICR.
• The status of interrupt requests IRQ2 to IRQ0 is indicated in ISR. ISR flags can be cleared to 0
by software.
A block diagram of interrupts IRQ2 to IRQ0 is shown in figure 5.2.
IRQnE
IRQnSCA, IRQnSCB
IRQnF
Edge/level
detection circuit
S
Q
R
IRQn input
Clear signal
Note: n: 2 to 0
Figure 5.2 Block Diagram of Interrupts IRQ2 to IRQ0
108
IRQn interrupt
request
Figure 5.3 shows the timing of IRQnF setting.
ø
IRQn
input pin
IRQnF
Figure 5.3 Timing of IRQnF Setting
The vector numbers for IRQ2 to IRQ0 interrupt exception handling are 18 to 16.
Detection of IRQ2 to IRQ0 interrupts does not depend on whether the relevant pin has been set for
input or output. Therefore, when a pin is used as an external interrupt input pin, do not clear the
corresponding DDR bit to 0 and use the pin as an I/O pin for another function.
As interrupt request flags IRQ2F to IRQ0F are set when the setting condition is met, regardless of
the IER setting, only the necessary flags should be referenced.
5.3.2
Internal Interrupts
There are 32 sources for internal interrupts from on-chip supporting modules, plus one software
interrupt source (address break).
• For each on-chip supporting module there are flags that indicate the interrupt request status,
and enable bits that select enabling or disabling of these interrupts. If any one of these is set to
1, an interrupt request is issued to the interrupt controller.
• The interrupt control level can be set by means of ICR.
• The DTC can be activated by an FRT, TMR, SCI, or other interrupt request. When the DTC is
activated by an interrupt, the interrupt control mode and interrupt mask bits have no effect.
5.3.3
Interrupt Exception Vector Table
Table 5.4 shows interrupt exception handling sources, vector addresses, and interrupt priorities.
For default priorities, the lower the vector number, the higher the priority.
Priorities among modules can be set by means of ICR. The situation when two or more modules
are set to the same priority, and priorities within a module, are fixed as shown in table 5.4.
109
Table 5.4
Interrupt Sources, Vector Addresses, and Interrupt Priorities
Origin of
Interrupt
Source
Vector Address
Vector
Normal
Number Mode
Advanced
Mode
7
H'000E
H'00001C
16
H'0020
H'000040
ICRA7
IRQ1
17
H'0022
H'000044
ICRA6
IRQ2
18
H'0024
H'000048
ICRA5
Interrupt Source
NMI
IRQ0
External
pin
ICR
High
Reserved
—
19
to
23
H'0026
to
H'002E
H'00004C
to
H'00005C
SWDTEND (software
activation interrupt end)
DTC
24
H'0030
H'000060
ICRA2
WOVI0 (interval timer)
Watchdog
timer 0
25
H'0032
H'000064
ICRA1
WOVI1 (interval timer)
Watchdog
timer 1
26
H'0034
H'000068
ICRA0
Address break (PC break)
—
27
H'0036
H'00006C
ADI (A/D conversion end)
A/D
28
H'0038
H'000070
Reserved
—
29
to
47
H'003A
to
H'005E
H'000074
to
H'0000BC
ICIA (input capture A)
ICIB (input capture B)
ICIC (input capture C)
ICID (input capture D)
OCIA (output compare A)
OCIB (output compare B)
FOVI (overflow)
Reserved
Free-running 48
timer
49
50
51
52
53
54
55
H'0060
H'0062
H'0064
H'0066
H'0068
H'006A
H'006C
H'006E
H'0000C0
H'0000C4
H'0000C8
H'0000CC
H'0000D0
H'0000D4
H'0000D8
H'0000DC
Reserved
—
H'0070
to
H'007E
H'0000E0
to
H'0000FC
110
56
to
63
Priority
ICRB7
ICRB6
Low
Table 5.4
Interrupt Sources, Vector Addresses, and Interrupt Priorities (cont)
Interrupt Source
Origin of
Interrupt
Source
Vector Address
Vector
Normal
Number Mode
Advanced
Mode
ICR
Priority
CMIA0 (compare-match A)
CMIB0 (compare-match B)
OVI0 (overflow)
Reserved
8-bit timer
channel 0
64
65
66
67
H'0080
H'0082
H'0084
H'0086
H'000100
H'000104
H'000108
H'00010C
ICRB3 High
CMIA1 (compare-match A)
CMIB1 (compare-match B)
OVI1 (overflow)
Reserved
8-bit timer
channel 1
68
69
70
71
H'0088
H'008A
H'008C
H'008E
H'000110
H'000114
H'000118
H'00011C
ICRB2
CMIAY (compare-match A)
CMIBY (compare-match B)
OVIY (overflow)
ICIX (input capture X)
8-bit timer
channels
Y, X
72
73
74
75
H'0090
H'0092
H'0094
H'0096
H'000120
H'000124
H'000128
H'00012C
ICRB1
Reserved
—
76
to
79
H'0098
to
H'009E
H'000130
to
H'00013C
ERI0 (receive error 0)
RXI0 (reception completed 0)
TXI0 (transmit data empty 0)
TEI0 (transmission end 0)
SCI
channel 0
80
81
82
83
H'00A0
H'00A2
H'00A4
H'00A6
H'000140
H'000144
H'000148
H'00014C
ICRC7
ERI1 (receive error 1)
RXI1 (reception completed 1)
TXI1 (transmit data empty 1)
TEI1 (transmission end 1)
SCI
channel 1
84
85
86
87
H'00A8
H'00AA
H'00AC
H'00AE
H'000150
H'000154
H'000158
H'00015C
ICRC6
Reserved
—
84
to
91
H'00B0
to
H'00B6
H'000160
to
H'00016C
IICI0 (1-byte transmission/
reception completed)
DDCSWI (format switch)
IIC channel 0 92
(option)
93
H'00B8
H'000170
H'00BA
H'000174
IICI1 (1-byte transmission/
reception completed)
Reserved
IIC channel 1 94
(option)
95
H'00BC
H'000178
H'00BE
H'00017C
Reserved
—
H'00C0
to
H'00CE
H'000180
to
H'00019C
96
to
103
ICRC4
ICRC3
Low
111
5.4
Address Breaks
5.4.1
Features
With the H8S/2128 Series and H8S/2124 Series, it is possible to identify the prefetch of a specific
address by the CPU and generate an address break interrupt, using the ABRKCR and BAR
registers. When an address break interrupt is generated, address break interrupt exception handling
is executed.
This function can be used to detect the beginning of execution of a bug location in the program,
and branch to a correction routine.
5.4.2
Block Diagram
A block diagram of the address break function is shown in figure 5.4.
BAR
Comparator
ABRKCR
Match
signal
Control logic
Address break
interrupt request
Internal address
Prefetch signal
(internal signal)
Figure 5.4 Block Diagram of Address Break Function
112
5.4.3
Operation
ABRKCR and BAR settings can be made so that an address break interrupt is generated when the
CPU prefetches the address set in BAR. This address break function issues an interrupt request to
the interrupt controller when the address is prefetched, and the interrupt controller determines the
interrupt priority. When the interrupt is accepted, interrupt exception handling is started on
completion of the currently executing instruction. With an address break interrupt, interrupt mask
control by the I and UI bits in the CPU’s CCR is ineffective.
The register settings when the address break function is used are as follows.
1. Set the break address in bits A23 to A1 in BAR.
2. Set the BIE bit in ABRKCR to 1 to enable address breaks. An address break will not be
requested if the BIE bit is cleared to 0.
When the setting condition occurs, the CMF flag in ABRKCR is set to 1 and an interrupt is
requested. If necessary, the source should be identified in the interrupt handling routine.
5.4.4
Usage Notes
• With the address break function, the address at which the first instruction byte is located
should be specified as the break address. Occurrence of the address break condition may not be
recognized for other addresses.
• In normal mode, no comparison is made with address lines A23 to A16.
• If a branch instruction (Bcc, BSR), jump instruction (JMP, JSR), RTS instruction, or RTE
instruction is located immediately before the address set in BAR, execution of this instruction
will output a prefetch signal for that address, and an address break may be requested. This can
be prevented by not making a break address setting for an address immediately following one
of these instructions, or by determining within the interrupt handling routine whether interrupt
handling was initiated by a genuine condition occurrence.
• As an address break interrupt is generated by a combination of the internal prefetch signal and
address, the timing of the start of interrupt exception handling depends on the content and
execution cycle of the instruction at the set address and the preceding instruction. Figure 5.5
shows some address timing examples.
113
• Program area in on-chip memory, 1-state execution instruction at specified break address
Instruction Instruction Instruction Instruction Instruction Internal
fetch
fetch
fetch
fetch
fetch
operation
Vector
fetch
Stack save
Internal Instruction
fetch
operation
ø
Address bus
H'0310
H'0312
H'0314
H'0316
H'0318
SP-2
SP-4
H'0036
Interrupt exception handling
NOP
NOP
NOP
execution execution execution
Break request
signal
H'0310
H'0312
H'0314
H'0316
NOP
NOP
NOP
NOP
Breakpoint
NOP instruction is executed at breakpoint address H'0312 and
next address, H'0314; fetch from address H'0316 starts after
end of exception handling.
• Program area in on-chip memory, 2-state execution instruction at specified break address
Instruction Instruction Instruction Instruction Instruction Internal
fetch
fetch
fetch
fetch
fetch
operation
Vector
fetch
Stack save
Internal Instruction
operation
fetch
ø
Address bus
H'0310
H'0312
H'0314
NOP
execution
H'0316
H'0318
SP-2
SP-4
H'0036
Interrupt exception handling
MOV.W
execution
Break request
signal
H'0310
H'0312
H'0316
H'0318
NOP
MOV.W #xx:16,Rd
NOP
NOP
Breakpoint
MOV instruction is executed at breakpoint address H'0312,
NOP instruction at next address, H'0316, is not executed;
fetch from address H'0316 starts after end of exception handling.
• Program area in external memory (2-state access, 16-bit-bus access),
1-state execution instruction at specified break address
Instruction
fetch
Instruction
fetch
H'0310
H'0312
Instruction
fetch
Internal
operation
Stack save
Vector
fetch
Internal
operation
ø
Address bus
H'0314
SP-2
SP-4
H'0036
Interrupt exception handling
NOP
execution
Break request
signal
H'0310
H'0312
H'0314
H'0316
NOP
NOP
NOP
NOP
Breakpoint
NOP instruction at breakpoint address H'0312 is not executed;
fetch from address H'0312 starts after end of exception handling.
Figure 5.5 Examples of Address Break Timing
114
5.5
Interrupt Operation
5.5.1
Interrupt Control Modes and Interrupt Operation
Interrupt operations in the H8S/2128 Series and H8S/2124 Series differ depending on the interrupt
control mode.
NMI and address break interrupts are accepted at all times except in the reset state and the
hardware standby state. In the case of IRQ interrupts and on-chip supporting module interrupts, an
enable bit is provided for each interrupt. Clearing an enable bit to 0 disables the corresponding
interrupt request. Interrupt sources for which the enable bits are set to 1 are controlled by the
interrupt controller.
Table 5.5 shows the interrupt control modes.
The interrupt controller performs interrupt control according to the interrupt control mode set by
the INTM1 and INTM0 bits in SYSCR, the priorities set in ICR, and the masking state indicated
by the I and UI bits in the CPU’s CCR.
Table 5.5
Interrupt Control Modes
SYSCR
Interrupt
Priority Setting
Control Mode INTM1 INTM0 Register
Interrupt
Mask Bits Description
0
I
0
0
ICR
Interrupt mask control is
performed by the I bit
Priority can be set with ICR
1
1
ICR
I, UI
3-level interrupt mask control
is performed by the I and UI
bits
Priority can be set with ICR
115
Figure 5.6 shows a block diagram of the priority decision circuit.
I
UI
ICR
Interrupt
source
Interrupt
acceptance control
and 3-level mask
control
Default priority
determination
Vector
number
Interrupt control modes
0 and 1
Figure 5.6 Block Diagram of Interrupt Control Operation
Interrupt Acceptance Control and 3-Level Control: In interrupt control modes 0 and 1,
interrupt acceptance control and 3-level mask control is performed by means of the I and UI bits in
CCR, and ICR (control level).
Table 5.6 shows the interrupts selected in each interrupt control mode.
Table 5.6
Interrupts Selected in Each Interrupt Control Mode
Interrupt Mask Bits
Interrupt Control Mode
I
UI
Selected Interrupts
0
0
*
All interrupts (control level 1 has priority)
1
*
NMI and address break interrupts
0
*
All interrupts (control level 1 has priority)
1
0
NMI, address break interrupts, and control
level 1 interrupts
1
NMI and address break interrupts
1
Legend:
*: Don’t care
116
Default Priority Determination: The priority is determined for the selected interrupt, and a
vector number is generated.
If the same value is set for ICR, acceptance of multiple interrupts is enabled, and so only the
interrupt source with the highest priority according to the preset default priorities is selected and
has a vector number generated.
Interrupt sources with a lower priority than the accepted interrupt source are held pending.
Table 5.7 shows operations and control signal functions in each interrupt control mode.
Table 5.7
Operations and Control Signal Functions in Each Interrupt Control Mode
Control Mode
INTM1
INTM0
0
0
0
1
1
Interrupt Acceptance Control
3-Level Control
Setting
Interrupt
Default Priority
I
UI
ICR
Determination
T (Trace)
O
IM
—
PR
O
—
O
IM
IM
PR
O
—
Legend:
O: Interrupt operation control performed
IM: Used as interrupt mask bit
PR: Sets priority
—: Not used
117
5.5.2
Interrupt Control Mode 0
Enabling and disabling of IRQ interrupts and on-chip supporting module interrupts can be set by
means of the I bit in the CPU’s CCR, and ICR. Interrupts are enabled when the I bit is cleared to 0,
and disabled when set to 1. Control level 1 interrupt sources have higher priority.
Figure 5.7 shows a flowchart of the interrupt acceptance operation in this case.
1. If an interrupt source occurs when the corresponding interrupt enable bit is set to 1, an interrupt
request is sent to the interrupt controller.
2. When interrupt requests are sent to the interrupt controller, a control level 1 interrupt,
according to the control level set in ICR, has priority for selection, and other interrupt requests
are held pending. If a number of interrupt requests with the same control level setting are
generated at the same time, the interrupt request with the highest priority according to the
priority system shown in table 5.4 is selected.
3. The I bit is then referenced. If the I bit is cleared to 0, the interrupt request is accepted. If the I
bit is set to 1, only NMI and address break interrupts are accepted, and other interrupt requests
are held pending.
4. When an interrupt request is accepted, interrupt exception handling starts after execution of the
current instruction has been completed.
5. The PC and CCR are saved to the stack area by interrupt exception handling. The PC saved on
the stack shows the address of the first instruction to be executed after returning from the
interrupt handling routine.
6. Next, the I bit in CCR is set to 1. This disables all interrupts except NMI and address break.
7. A vector address is generated for the accepted interrupt, and execution of the interrupt handling
routine starts at the address indicated by the contents of that vector address.
118
Program execution state
No
Interrupt generated?
Yes
Yes
NMI?
No
No
Control level 1
interrupt?
Hold pending
Yes
No
No
IRQ0?
Yes
IRQ0?
No
Yes
IRQ1?
Yes
No
IRQ1?
Yes
IICI1
IICI1
Yes
Yes
I = 0?
No
Yes
Save PC and CCR
I←1
Read vector address
Branch to interrupt handling routine
Figure 5.7 Flowchart of Procedure Up to Interrupt Acceptance in
Interrupt Control Mode 0
119
5.5.3
Interrupt Control Mode 1
Three-level masking is implemented for IRQ interrupts and on-chip supporting module interrupts
by means of the I and UI bits in the CPU’s CCR, and ICR.
• Control level 0 interrupt requests are enabled when the I bit is cleared to 0, and disabled when
set to 1.
• Control level 1 interrupt requests are enabled when the I bit or UI bit is cleared to 0, and
disabled when both the I bit and the UI bit are set to 1.
For example, if the interrupt enable bit for an interrupt request is set to 1, and H'20, H'00, and H'00
are set in ICRA, ICRB, and ICRC, respectively, (i.e. IRQ2 interrupts are set to control level 1 and
other interrupts to control level 0), the situation is as follows:
• When I = 0, all interrupts are enabled
(Priority order: NMI > IRQ2 > address break > IRQ0 > IRQ1 ...)
• When I = 1 and UI = 0, only NMI, IRQ2, and address break interrupts are enabled
• When I = 1 and UI = 1, only NMI and address break interrupts are enabled
Figure 5.8 shows the state transitions in these cases.
I←0
All interrupts enabled
Only NMI, address break,
and IRQ2 interrupts enabled
I←1, UI←0
I←0
UI←0
Exception handling execution
or I←1, UI←1
Exception handling execution
or UI←1
Only NMI and address break
interrupts enabled
Figure 5.8 Example of State Transitions in Interrupt Control Mode 1
120
Figure 5.9 shows a flowchart of the interrupt acceptance operation in this case.
1. If an interrupt source occurs when the corresponding interrupt enable bit is set to 1, an interrupt
request is sent to the interrupt controller.
2. When interrupt requests are sent to the interrupt controller, a control level 1 interrupt,
according to the control level set in ICR, has priority for selection, and other interrupt requests
are held pending. If a number of interrupt requests with the same control level setting are
generated at the same time, the interrupt request with the highest priority according to the
priority system shown in table 5.4 is selected.
3. The I bit is then referenced. If the I bit is cleared to 0, the UI bit has no effect.
An interrupt request set to interrupt control level 0 is accepted when the I bit is cleared to 0. If
the I bit is set to 1, only NMI and address break interrupts are accepted, and other interrupt
requests are held pending.
An interrupt request set to interrupt control level 1 has priority over an interrupt request set to
interrupt control level 0, and is accepted if the I bit is cleared to 0, or if the I bit is set to 1 and
the UI bit is cleared to 0.
When both the I bit and the UI bit are set to 1, only NMI and address break interrupts are
accepted, and other interrupt requests are held pending.
4. When an interrupt request is accepted, interrupt exception handling starts after execution of the
current instruction has been completed.
5. The PC and CCR are saved to the stack area by interrupt exception handling. The PC saved on
the stack shows the address of the first instruction to be executed after returning from the
interrupt handling routine.
6. Next, the I and UI bits in CCR are set to 1. This disables all interrupts except NMI and address
break.
7. A vector address is generated for the accepted interrupt, and execution of the interrupt handling
routine starts at the address indicated by the contents of that vector address.
121
Program execution state
No
Interrupt generated?
Yes
Yes
NMI?
No
No
Control level 1
interrupt?
Hold pending
Yes
IRQ0?
Yes
No
No
IRQ0?
No
Yes
IRQ1?
No
IRQ1?
Yes
Yes
IICI1
IICI1
Yes
Yes
No
I = 0?
Yes
UI = 0?
I = 0?
No
No
Yes
Yes
Save PC and CCR
I ← 1, UI ← 1
Read vector address
Branch to interrupt handling routine
Figure 5.9 Flowchart of Procedure Up to Interrupt Acceptance in
Interrupt Control Mode 1
122
5.5.4
Interrupt Exception Handling Sequence
Figure 5.10 shows the interrupt exception handling sequence. The example shown is for the case
where interrupt control mode 0 is set in advanced mode, and the program area and stack area are
in on-chip memory.
123
Figure 5.10 Interrupt Exception Handling
124
(1)
(2)
(4)
(3)
Instruction
prefetch
Internal
operation
Instruction prefetch address (Not executed.
This is the contents of the saved PC, the return address.)
(2) (4) Instruction code (Not executed.)
(3)
Instruction prefetch address (Not executed.)
(5)
SP-2
(7)
SP-4
(1)
Internal
data bus
Internal
write signal
Internal
read signal
Internal
address bus
Interrupt
request signal
ø
Interrupt level determination
Wait for end of instruction
Interrupt
acceptance
(5)
(7)
(8)
(9)
(10)
Vector fetch
(12)
(11)
Internal
operation
(14)
(13)
Interrupt handling
routine instruction
prefetch
(6) (8)
Saved PC and saved CCR
(9) (11) Vector address
(10) (12) Interrupt handling routine start address (vector
address contents)
(13)
Interrupt handling routine start address ((13) = (10) (12))
(14)
First instruction of interrupt handling routine
(6)
Stack
5.5.5
Interrupt Response Times
The H8S/2128 Series and H8S/2124 Series are capable of fast word access to on-chip memory,
and high-speed processing can be achieved by providing the program area in on-chip ROM and
the stack area in on-chip RAM.
Table 5.8 shows interrupt response times—the interval between generation of an interrupt request
and execution of the first instruction in the interrupt handling routine. The symbols used in table
5.8 are explained in table 5.9.
Table 5.8
Interrupt Response Times
Number of States
No.
Item
1
Normal Mode
Advanced Mode
3
3
1
Interrupt priority determination*
2
Number of wait states until executing
instruction ends* 2
1 to 19+2·SI
1 to 19+2·SI
3
PC, CCR stack save
2·S K
2·S K
4
Vector fetch
SI
2·S I
2·S I
2·S I
2
2
11 to 31
12 to 32
5
6
Instruction fetch*
3
Internal processing*
4
Total (using on-chip memory)
Notes: 1.
2.
3.
4.
Table 5.9
Two states in case of internal interrupt.
Refers to MULXS and DIVXS instructions.
Prefetch after interrupt acceptance and interrupt handling routine prefetch.
Internal processing after interrupt acceptance and internal processing after vector fetch.
Number of States in Interrupt Handling Routine Execution
Object of Access
External Device
8-Bit Bus
Symbol
Internal Memory
2-State Access
3-State Access
Instruction fetch
SI
1
4
6+2m
Branch address read
SJ
Stack manipulation
SK
Legend:
m: Number of wait states in an external device access
125
5.6
Usage Notes
5.6.1
Contention between Interrupt Generation and Disabling
When an interrupt enable bit is cleared to 0 to disable interrupts, the disabling becomes effective
after execution of the instruction.
In other words, when an interrupt enable bit is cleared to 0 by an instruction such as BCLR or
MOV, if an interrupt is generated during execution of the instruction, the interrupt concerned will
still be enabled on completion of the instruction, and so interrupt exception handling for that
interrupt will be executed on completion of the instruction. However, if there is an interrupt
request of higher priority than that interrupt, interrupt exception handling will be executed for the
higher-priority interrupt, and the lower-priority interrupt will be ignored.
The same also applies when an interrupt source flag is cleared to 0.
Figure 5.11 shows an example in which the CMIEA bit in 8-bit timer register TCR is cleared to 0.
TCR write cycle by CPU
CMIA exception handling
ø
Internal
address bus
TCR address
Internal
write signal
CMIEA
CMFA
CMIA
interrupt signal
Figure 5.11 Contention between Interrupt Generation and Disabling
The above contention will not occur if an enable bit or interrupt source flag is cleared to 0 while
the interrupt is masked.
126
5.6.2
Instructions that Disable Interrupts
Instructions that disable interrupts are LDC, ANDC, ORC, and XORC. After any of these
instructions is executed, all interrupts, including NMI, are disabled and the next instruction is
always executed. When the I bit or UI bit is set by one of these instructions, the new value
becomes valid two states after execution of the instruction ends.
5.6.3
Interrupts during Execution of EEPMOV Instruction
Interrupt operation differs between the EEPMOV.B instruction and the EEPMOV.W instruction.
With the EEPMOV.B instruction, an interrupt request (including NMI) issued during the transfer
is not accepted until the move is completed.
With the EEPMOV.W instruction, if an interrupt request is issued during the transfer, interrupt
exception handling starts at a break in the transfer cycle. The PC value saved on the stack in this
case is the address of the next instruction.
Therefore, if an interrupt is generated during execution of an EEPMOV.W instruction, the
following coding should be used.
L1:
EEPMOV.W
MOV.W
R4,R4
BNE
L1
127
5.7
DTC Activation by Interrupt
5.7.1
Overview
The DTC can be activated by an interrupt. In this case, the following options are available:
• Interrupt request to CPU
• Activation request to DTC
• Both of the above
For details of interrupt requests that can be used to activate the DTC, see section 7, Data Transfer
Controller.
5.7.2
Block Diagram
Figure 5.12 shows a block diagram of the DTC and interrupt controller.
Interrupt
request
IRQ
interrupt
On-chip
supporting
module
Interrupt source
clear signal
DTC activation
request vector
number
Selection
circuit
Select
signal
Clear signal
DTCER
Control logic
DTC
Clear signal
DTVECR
SWDTE
clear signal
Interrupt controller
Determination of
priority
Figure 5.12 Interrupt Control for DTC
128
CPU interrupt
request vector
number
CPU
I, UI
5.7.3
Operation
The interrupt controller has three main functions in DTC control.
Selection of Interrupt Source: It is possible to select DTC activation request or CPU interrupt
request with the DTCE bit of DTCERA to DTCERE in the DTC.
After a DTC data transfer, the DTCE bit can be cleared to 0 and an interrupt request sent to the
CPU in accordance with the specification of the DISEL bit of MRB in the DTC.
When the DTC performs the specified number of data transfers and the transfer counter reaches 0,
following the DTC data transfer the DTCE bit is cleared to 0 and an interrupt request is sent to the
CPU.
Determination of Priority: The DTC activation source is selected in accordance with the default
priority order, and is not affected by mask or priority levels. See section 7.3.3, DTC Vector Table,
for the respective priorities.
Operation Order: If the same interrupt is selected as a DTC activation source and a CPU
interrupt source, the DTC data transfer is performed first, followed by CPU interrupt exception
handling.
Table 5.10 summarizes interrupt source selection and interrupt source clearance control according
to the settings of the DTCE bit of DTCERA to DTCERE in the DTC and the DISEL bit of MRB
in the DTC.
Table 5.10 Interrupt Source Selection and Clearing Control
Settings
DTC
Interrupt Source Selection/Clearing Control
DTCE
DISEL
DTC
CPU
0
*
×
∆
1
0
∆
×
1
∆
Legend
∆: The relevant interrupt is used. Interrupt source clearing is performed.
(The CPU should clear the source flag in the interrupt handling routine.)
: The relevant interrupt is used. The interrupt source is not cleared.
×: The relevant bit cannot be used.
*: Don’t care
Usage Note: SCI, IIC, and A/D converter interrupt sources are cleared when the DTC reads or
writes to the prescribed register, and are not dependent upon the DISEL bit.
129
130
Section 6 Bus Controller
6.1
Overview
The H8S/2128 Series and H8S/2124 Series have a built-in bus controller (BSC) that allows
external address space bus specifications, such as bus width and number of access states, to be set.
The bus controller also has a bus arbitration function, and controls the operation of the internal bus
masters: the CPU and data transfer controller (DTC).
6.1.1
Features
The features of the bus controller are listed below.
• Basic bus interface
 2-state access or 3-state access can be selected
 Program wait states can be inserted
• Burst ROM interface
 External space can be designated as ROM interface space
 1-state or 2-state burst access can be selected
• Idle cycle insertion
 An idle cycle can be inserted when an external write cycle immediately follows an external
read cycle
• Bus arbitration function
 Includes a bus arbiter that arbitrates bus mastership between the CPU and DTC
131
6.1.2
Block Diagram
Figure 6.1 shows a block diagram of the bus controller.
External bus control signals
Internal
control signals
Bus controller
Bus mode signal
WSCR
BCR
WAIT
Internal
data bus
Wait controller
CPU bus request signal
DTC bus request signal
Bus arbiter
CPU bus acknowledge signal
DTC bus acknowledge signal
Figure 6.1 Block Diagram of Bus Controller
132
6.1.3
Pin Configuration
Table 6.1 summarizes the pins of the bus controller.
Table 6.1
Bus Controller Pins
Name
Symbol
I/O
Function
Address strobe
AS
Output
Strobe signal indicating that address output on
address bus is enabled (when IOSE bit is 0)
I/O select
IOS
Output
I/O select signal (when IOSE bit is 1)
Read
RD
Output
Strobe signal indicating that external space is
being read
Write
WR
Output
Strobe signal indicating that external space is
being written to, and that data bus is enabled
Wait
WAIT
Input
Wait request signal when external 3-state access
space is accessed
6.1.4
Register Configuration
Table 6.2 summarizes the registers of the bus controller.
Table 6.2
Bus Controller Registers
Name
Abbreviation
R/W
Initial Value
Address*
Bus control register
BCR
R/W
H'D7
H'FFC6
Wait state control register
WSCR
R/W
H'33
H'FFC7
Note: * Lower 16 bits of the address.
133
6.2
Register Descriptions
6.2.1
Bus Control Register (BCR)
Bit
7
6
5
4
3
2
1
0
ICIS1
ICIS0
—
IOS1
IOS0
Initial value
1
1
0
1
0
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
BRSTRM BRSTS1 BRSTS0
BCR is an 8-bit readable/writable register that specifies the external memory space access mode,
and the extent of the I/O area when the I/O strobe function has been selected for the AS pin.
BCR is initialized to H'D7 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bit 7—Idle Cycle Insert 1 (ICIS1): Reserved. Do not write 0 to this bit.
Bit 6—Idle Cycle Insert 0 (ICIS0): Selects whether or not a one-state idle cycle is to be inserted
between bus cycles when successive external read and external write cycles are performed.
Bit 6
ICIS0
Description
0
Idle cycle not inserted in case of successive external read and external write cycles
1
Idle cycle inserted in case of successive external read and external write cycles
(Initial value)
Bit 5—Burst ROM Enable (BRSTRM): Selects whether external space is designated as a burst
ROM interface space. The selection applies to the entire external space .
Bit 5
BRSTRM
Description
0
Basic bus interface
1
Burst ROM interface
(Initial value)
Bit 4—Burst Cycle Select 1 (BRSTS1): Selects the number of burst cycles for the burst ROM
interface.
134
Bit 4
BRSTS1
Description
0
Burst cycle comprises 1 state
1
Burst cycle comprises 2 states
(Initial value)
Bit 3—Burst Cycle Select 0 (BRSTS0): Selects the number of words that can be accessed in a
burst ROM interface burst access.
Bit 3
BRSTS0
Description
0
Max. 4 words in burst access
1
Max. 8 words in burst access
(Initial value)
Bit 2—Reserved: Do not write 0 to this bit.
Bits 1 and 0—IOS Select 1 and 0 (IOS1, IOS0): See table 6.4.
6.2.2
Wait State Control Register (WSCR)
7
6
5
4
3
2
1
0
RAMS
RAM0
ABW
AST
WMS1
WMS0
WC1
WC0
Initial value
0
0
1
1
0
0
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
WSCR is an 8-bit readable/writable register that specifies the data bus width, number of access
states, wait mode, and number of wait states for external memory space. The on-chip memory and
internal I/O register bus width and number of access states are fixed, irrespective of the WSCR
settings.
WSCR is initialized to H'33 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bit 7—RAM Select (RAMS)/Bit 6—RAM Area Setting (RAM0): Reserved bits.
Bit 5—Bus Width Control (ABW): Specifies whether the external memory space is 8-bit access
space or 16-bit access space.
However, a 16-bit access space cannot be specified for these series, and therefore 0 should not be
written to this bit.
135
Bit 5
ABW
Description
0
External memory space is designated as 16-bit access space (A 16-bit access space
cannot be specified for these series)
1
External memory space is designated as 8-bit access space
(Initial value)
Bit 4—Access State Control (AST): Specifies whether the external memory space is 2-state
access space or 3-state access space, and simultaneously enables or disables wait state insertion.
Bit 4
AST
Description
0
External memory space is designated as 2-state access space
Wait state insertion in external memory space accesses is disabled
1
External memory space is designated as 3-state access space
Wait state insertion in external memory space accesses is enabled
(Initial value)
Bits 3 and 2—Wait Mode Select 1 and 0 (WMS1, WMS0): These bits select the wait mode
when external memory space is accessed while the AST bit is set to 1.
Bit 3
Bit 2
WMS1
WMS0
Description
0
0
Program wait mode
1
Wait-disabled mode
0
Pin wait mode
1
Pin auto-wait mode
1
(Initial value)
Bits 1 and 0—Wait Count 1 and 0 (WC1, WC0): These bits select the number of program wait
states when external memory space is accessed while the AST bit is set to 1.
Bit 1
Bit 0
WC1
WC0
Description
0
0
No program wait states are inserted
1
1 program wait state is inserted in external memory space accesses
0
2 program wait states are inserted in external memory space accesses
1
3 program wait states are inserted in external memory space accesses
(Initial value)
1
136
6.3
Overview of Bus Control
6.3.1
Bus Specifications
The external space bus specifications consist of three elements: bus width, number of access
states, and wait mode and number of program wait states.
The bus width and number of access states for on-chip memory and internal I/O registers are
fixed, and are not affected by the bus controller.
Bus Width: A bus width of 8 or 16 bits can be selected with the ABW bit. A 16-bit access space
cannot be specified for these series.
Number of Access States: Two or three access states can be selected with the AST bit.
When 2-state access space is designated, wait insertion is disabled. The number of access states on
the burst ROM interface is determined without regard to the AST bit setting.
Wait Mode and Number of Program Wait States: When 3-state access space is designated by
the AST bit, the wait mode and the number of program wait states to be inserted automatically is
selected with WMS1, WMS0, WC1, and WC0. From 0 to 3 program wait states can be selected.
Table 6.3 shows the bus specifications for each basic bus interface area.
Table 6.3
Bus Specifications for Each Area (Basic Bus Interface)
Bus Specifications (Basic Bus Interface)
Access
States
Program
Wait States
ABW
AST
WMS1 WMS0 WC1
WC0
Bus Width
0
0
—
—
—
—
Cannot be used in the H8S/2128 Series or
H8S/2124 Series.
1
0
—
—
—
—
8
2
0
1
0
1
—
—
8
3
0
—*
—*
0
0
3
0
1
1
1
0
2
1
3
Note: * Except when WMS1 = 0 and WMS0 = 1
137
6.3.2
Advanced Mode
The H8S/2128 and H8S/2124 have 16 address output pins, so there are no pins for output of the
upper address bits (A16 to A23) in advanced mode. H'FFF000 to H'FFFE4F can be accessed by
designating the AS pin as an I/O strobe pin. The accessible external space is therefore H'FFF000
to H'FFFE4F even when expanded mode with ROM enabled is selected in advanced mode.
The initial state of the external space is basic bus interface, three-state access space. In ROMenabled expanded mode, the space excluding the on-chip ROM, on-chip RAM, and internal I/O
registers is external space. The on-chip RAM is enabled when the RAME bit in the system control
register (SYSCR) is set to 1; when the RAME bit is cleared to 0, the on-chip RAM is disabled and
the corresponding space becomes external space.
6.3.3
Normal Mode
The initial state of the external memory space is basic bus interface, three-state access space. In
ROM-disabled expanded mode, the space excluding the on-chip RAM and internal I/O registers is
external space. In ROM-enabled expanded mode, the space excluding the on-chip ROM, on-chip
RAM, and internal I/O registers is external space. The on-chip RAM is enabled when the RAME
bit in the system control register (SYSCR) is set to 1; when the RAME bit is cleared to 0, the onchip RAM is disabled and the corresponding space becomes external space.
6.3.4
I/O Select Signal
In the H8S/2128 Series and H8S/2124 Series, an I/O select signal (IOS) can be output, with the
signal output going low when the designated external space is accessed.
Figure 6.2 shows an example of IOS signal output timing.
Bus cycle
T1
T2
ø
Address bus
External address in IOS set range
IOS
Figure 6.2 IOS Signal Output Timing
138
T3
Enabling or disabling of IOS signal output is controlled by the setting of the IOSE bit in SYSCR.
In expanded mode, this pin operates as the AS output pin after a reset, and therefore the IOSE bit
in SYSCR must be set to 1 in order to use this pin as the IOS signal output. See section 8, I/O
Ports, for details.
The range of addresses for which the IOS signal is output can be set with bits IOS1 and IOS0 in
BCR. The IOS signal address ranges are shown in table 6.4.
Table 6.4
IOS Signal Output Range Settings
IOS1
IOS0
IOS Signal Output Range
0
0
H'(FF)F000 to H'(FF)F03F
1
H'(FF)F000 to H'(FF)F0FF
0
H'(FF)F000 to H'(FF)F3FF
1
H'(FF)F000 to H'(FF)FE4F
1
6.4
Basic Bus Interface
6.4.1
Overview
(Initial value)
The basic bus interface enables direct connection of ROM, SRAM, and so on.
The bus specifications can be selected with the AST bit, and the WMS1, WMS0, WC1, and WC0
bits (see table 6.3).
6.4.2
Data Size and Data Alignment
Data sizes for the CPU and other internal bus masters are byte, word, and longword. The bus
controller has a data alignment function, and when accessing external space, controls whether the
upper data bus (D15 to D8) or lower data bus (D7 to D0) is used according to the bus
specifications for the area being accessed (8-bit access space or 16-bit access space) and the data
size.
These series only have an upper data bus, and only 8-bit access space alignment is used. In these
series, the upper data bus pins are designated D7 to D0.
8-Bit Access Space: Figure 6.3 illustrates data alignment control for the 8-bit access space. With
the 8-bit access space, the upper data bus (D15 to D8) is always used for accesses. The amount of
data that can be accessed at one time is one byte: a word access is performed as two byte accesses,
and a longword access, as four byte accesses.
139
Upper data bus
Lower data bus
D15
D8 D7
D0
Byte size
Word size
1st bus cycle
2nd bus cycle
1st bus cycle
Longword size
2nd bus cycle
3rd bus cycle
4th bus cycle
Figure 6.3 Access Sizes and Data Alignment Control (8-Bit Access Space)
16-Bit Access Space (Cannot be Used in the H8S/2128 Series or H8S/2124 Series): Figure 6.4
illustrates data alignment control for the 16-bit access space. With the 16-bit access space, the
upper data bus (D15 to D8) and lower data bus (D7 to D0) are used for accesses. The amount of
data that can be accessed at one time is one byte or one word, and a longword access is executed
as two word accesses.
In byte access, whether the upper or lower data bus is used is determined by whether the address is
even or odd. The upper data bus is used for an even address, and the lower data bus for an odd
address.
Lower data bus
Upper data bus
D15
D8 D7
D0
Byte size
• Even address
Byte size
• Odd address
Word size
Longword
size
1st bus cycle
2nd bus cycle
Figure 6.4 Access Sizes and Data Alignment Control (16-Bit Access Space)
140
6.4.3
Valid Strobes
Table 6.5 shows the data buses used and valid strobes for the access spaces.
In a read, the RD signal is valid without discrimination between the upper and lower halves of the
data bus.
In a write, the HWR signal is valid for the upper half of the data bus, and the LWR signal for the
lower half.
These series only have an upper data bus, and only the RD and HWR signals are valid. In these
series, the HWR signal pin is designated WR.
Table 6.5
Data Buses Used and Valid Strobes
Area
Access Read/
Size
Write
Valid
Address Strobe
8-bit access space
Byte
—
Read
RD
Upper Data Bus Lower Data Bus
(D7 to D0)*3
(D15 to D8)*1
Valid
2
Port, etc.
Write
—
HWR*
16-bit access space Byte
Read
Even
RD
Valid
(Cannot be used in
the H8S/2128 Series
or H8S/2124 Series)
Invalid
Valid
Write
Even
HWR
Valid
Undefined
Odd
LWR
Undefined
Valid
Read
—
RD
Valid
Valid
Write
—
HWR, LWR Valid
Valid
Odd
Word
Port, etc.
Invalid
Notes: Undefined: Undefined data is output.
Invalid: Input state; input value is ignored.
Port, etc.: Pins are used as port or on-chip supporting module input/output pins, and not as
data bus pins.
1. The pin names in these series are D7 to D0.
2. The pin name in these series is WR.
3. There are no lower data bus pins in these series.
141
6.4.4
Basic Timing
8-Bit 2-State Access Space: Figure 6.5 shows the bus timing for an 8-bit 2-state access space.
When an 8-bit access space is accessed, the upper half (D15 to D8) of the data bus is used.
Wait states cannot be inserted.
These series have no lower data bus (D7 to D0) pins or LWR pin. In these series, the upper data
bus (D15 to D8) pins are designated D7 to D0, and the HWR signal pin is designated WR.
Bus cycle
T2
T1
ø
Address bus
AS/IOS (IOSE = 1)
AS/IOS (IOSE = 0)
RD
Read
D15 to D8
Valid
D7 to D0
Invalid
HWR
Write
D15 to D8
Valid
Figure 6.5 Bus Timing for 8-Bit 2-State Access Space
142
8-Bit 3-State Access Space: Figure 6.6 shows the bus timing for an 8-bit 3-state access space.
When an 8-bit access space is accessed, the upper half (D15 to D8) of the data bus is used.
Wait states can be inserted.
These series have no lower data bus (D7 to D0) pins or LWR pin. In these series, the upper data
bus (D15 to D8) pins are designated D7 to D0, and the HWR signal pin is designated WR.
Bus cycle
T1
T2
T3
ø
Address bus
AS/IOS (IOSE = 1)
AS/IOS (IOSE = 0)
RD
Read
D15 to D8
Valid
D7 to D0
Invalid
HWR
Write
D15 to D8
Valid
Figure 6.6 Bus Timing for 8-Bit 3-State Access Space
143
6.4.5
Wait Control
When accessing external space, the MCU can extend the bus cycle by inserting one or more wait
states (TW). There are three ways of inserting wait states: program wait insertion, pin wait insertion
using the WAIT pin, and a combination of the two.
Program Wait Mode
In program wait mode, the number of TW states specified by bits WC1 and WC0 are always
inserted between the T2 and T 3 states when external space is accessed.
Pin Wait Mode
In pin wait mode, the number of TW states specified by bits WC1 and WC0 are always inserted
between the T 2 and T 3 states when external space is accessed. If the WAIT pin is low at the fall of
ø in the last T2 or TW state, another TW state is inserted. If the WAIT pin is held low, TW states are
inserted until it goes high.
Pin wait mode is useful for inserting four or more wait states, or for changing the number of TW
states for different external devices.
Pin Auto-Wait Mode
In pin auto-wait mode, if the WAIT pin is low at the fall of the system clock in the T2 state, the
number of TW states specified by bits WC1 and WC0 are inserted between the T2 and T 3 states
when external space is accessed. No additional TW states are inserted even if the WAIT pin
remains low. Pin auto-wait mode can be used for an easy interface to low-speed memory, simply
by routing the chip select signal to the WAIT pin.
Figure 6.7 shows an example of wait state insertion timing.
144
By program wait
T1
T2
Tw
By WAIT pin
Tw
Tw
T3
ø
WAIT
Address bus
AS (IOSE = 0)
RD
Read
Data bus
Read data
WR
Write
Data bus
Note:
Write data
indicates the timing of WAIT pin sampling using the ø clock.
Figure 6.7 Example of Wait State Insertion Timing
The settings after a reset are: 3-state access, insertion of 3 program wait states, and WAIT input
disabled.
145
6.5
Burst ROM Interface
6.5.1
Overview
With the H8S/2128 Series and H8S/2124 Series, external space area 0 can be designated as burst
ROM space, and burst ROM interfacing can be performed.
External space can be designated as burst ROM space by means of the BRSTRM bit in BCR.
Consecutive burst accesses of a maximum of 4 words or 8 words can be performed for CPU
instruction fetches only. One or two states can be selected for burst access.
6.5.2
Basic Timing
The number of states in the initial cycle (full access) of the burst ROM interface is in accordance
with the setting of the AST bit. Also, when the AST bit is set to 1, wait state insertion is possible.
One or two states can be selected for the burst cycle, according to the setting of the BRSTS1 bit in
BCR. Wait states cannot be inserted.
When the BRSTS0 bit in BCR is cleared to 0, burst access of up to 4 words is performed; when
the BRSTS0 bit is set to 1, burst access of up to 8 words is performed.
The basic access timing for burst ROM space is shown in figure 6.8 (a) and (b). The timing shown
in figure 6.8 (a) is for the case where the AST and BRSTS1 bits are both set to 1, and that in figure
6.8 (b) is for the case where both these bits are cleared to 0.
Full access
T1
T2
Burst access
T3
T1
T2
T1
T2
ø
Only lower address changed
Address bus
AS/IOS (IOSE = 0)
RD
Data bus
Read data
Read data
Read data
Figure 6.8 (a) Example of Burst ROM Access Timing (When AST = BRSTS1 = 1)
146
Full access
T1
T2
Burst access
T1
T1
ø
Only lower address changed
Address bus
AS/IOS (IOSE = 0)
RD
Data bus
Read data
Read data Read data
Figure 6.8 (b) Example of Burst ROM Access Timing (When AST = BRSTS1 = 0)
6.5.3
Wait Control
As with the basic bus interface, either program wait insertion or pin wait insertion using the WAIT
pin can be used in the initial cycle (full access) of the burst ROM interface. See section 6.4.5, Wait
Control.
Wait states cannot be inserted in a burst cycle.
147
6.6
Idle Cycle
6.6.1
Operation
When the H8S/2128 Series or H8S/2124 Series chip accesses external space, it can insert a 1-state
idle cycle (T I) between bus cycles when a write cycle occurs immediately after a read cycle. By
inserting an idle cycle it is possible, for example, to avoid data collisions between ROM, with a
long output floating time, and high-speed memory, I/O interfaces, and so on.
If an external write occurs after an external read while the ICIS0 bit in BCR is set to 1, an idle
cycle is inserted at the start of the write cycle. This is enabled in advanced mode and normal
mode.
Figure 6.9 shows an example of the operation in this case. In this example, bus cycle A is a read
cycle from ROM with a long output floating time, and bus cycle B is a CPU write cycle. In (a), an
idle cycle is not inserted, and a collision occurs in cycle B between the read data from ROM and
the CPU write data. In (b), an idle cycle is inserted, and a data collision is prevented.
Bus cycle A
T1
T2
Bus cycle A
Bus cycle B
T3
T1
T2
T1
RD
WR
Data bus
,,
Long output
floating time
(a) Idle cycle not inserted
TI
T1
Address bus
RD
WR
Data bus
Data collision
(b) Idle cycle inserted
Figure 6.9 Example of Idle Cycle Operation
148
T3
ø
ø
Address bus
T2
Bus cycle B
T2
6.6.2
Pin States in Idle Cycle
Table 6.5 shows pin states in an idle cycle.
Table 6.5
Pin States in Idle Cycle
Pins
Pin State
A15 to A0, IOS
Contents of next bus cycle
D7 to D0
High impedance
AS
High
RD
High
WR
High
6.7
Bus Arbitration
6.7.1
Overview
The H8S/2128 Series and H8S/2124 Series have a bus arbiter that arbitrates bus master operations.
There are two bus masters, the CPU and the DTC, which perform read/write operations when they
have possession of the bus. Each bus master requests the bus by means of a bus request signal. The
bus arbiter determines priorities at the prescribed timing, and permits use of the bus by means of a
bus request acknowledge signal. The selected bus master then takes possession of the bus and
begins its operation.
6.7.2
Operation
The bus arbiter detects the bus masters’ bus request signals, and if the bus is requested, sends a bus
request acknowledge signal to the bus master making the request. If there are bus requests from
both bus masters, the bus request acknowledge signal is sent to the one with the higher priority.
When a bus master receives the bus request acknowledge signal, it takes possession of the bus
until that signal is canceled.
The order of priority of the bus masters is as follows:
(High)
DTC
>
CPU
(Low)
149
6.7.3
Bus Transfer Timing
Even if a bus request is received from a bus master with a higher priority than that of the bus
master that has acquired the bus and is currently operating, the bus is not necessarily transferred
immediately. There are specific times at which each bus master can relinquish the bus.
CPU: The CPU is the lowest-priority bus master, and if a bus request is received from the DTC,
the bus arbiter transfers the bus to the DTC. The timing for transfer of the bus is as follows:
• The bus is transferred at a break between bus cycles. However, if a bus cycle is executed in
discrete operations, as in the case of a longword-size access, the bus is not transferred between
the operations.
See appendix A.5, Bus States during Instruction Execution, for timings at which the bus is not
transferred.
• If the CPU is in sleep mode, it transfers the bus immediately.
DTC: The DTC sends the bus arbiter a request for the bus when an activation request is generated.
The DTC does not release the bus until it has completed a series of processing operations.
150
Section 7 Data Transfer Controller [H8S/2128 Series]
Provided in the H8S/2128 Series; not provided in the H8S/2124 Series.
7.1
Overview
The H8S/2128 Series includes a data transfer controller (DTC). The DTC can be activated by an
interrupt or software, to transfer data.
7.1.1
Features
• Transfer possible over any number of channels
 Transfer information is stored in memory
 One activation source can trigger a number of data transfers (chain transfer)
• Wide range of transfer modes
 Normal, repeat, and block transfer modes available
 Incrementing, decrementing, and fixing of transfer source and destination addresses can be
selected
• Direct specification of 16-Mbyte address space possible
 24-bit transfer source and destination addresses can be specified
• Transfer can be set in byte or word units
• A CPU interrupt can be requested for the interrupt that activated the DTC
 An interrupt request can be issued to the CPU after one data transfer ends
 An interrupt request can be issued to the CPU after all specified data transfers have ended
• Activation by software is possible
• Module stop mode can be set
 The initial setting enables DTC registers to be accessed. DTC operation is halted by setting
module stop mode
151
7.1.2
Block Diagram
Figure 7.1 shows a block diagram of the DTC.
The DTC’s register information is stored in the on-chip RAM*. A 32-bit bus connects the DTC to
the on-chip RAM (1 kbyte), enabling 32-bit/1-state reading and writing of the DTC register
information.
Note: * When the DTC is used, the RAME bit in SYSCR must be set to 1.
Internal address bus
On-chip
RAM
CPU interrupt
request
Internal data bus
Legend:
MRA, MRB: DTC mode registers A and B
CRA, CRB: DTC transfer count registers A and B
SAR:
DTC source address register
DAR:
DTC destination address register
DTCERA to DTCERE: DTC enable registers A to E
DTVECR: DTC vector register
Figure 7.1 Block Diagram of DTC
152
Register information
MRA MRB
CRA
CRB
DAR
SAR
DTC
Control logic
DTC activation
request
DTVECR
Interrupt
request
DTCERA
to
DTCERE
Interrupt controller
7.1.3
Register Configuration
Table 7.1 summarizes the DTC registers.
Table 7.1
DTC Registers
Name
Abbreviation
R/W
Initial Value
Address* 1
DTC mode register A
MRA
—* 2
Undefined
—* 3
DTC mode register B
MRB
—* 2
Undefined
—* 3
DTC source address register
SAR
—* 2
Undefined
—* 3
DTC destination address register
DAR
—* 2
Undefined
—* 3
DTC transfer count register A
CRA
—* 2
Undefined
—* 3
DTC transfer count register B
CRB
—* 2
Undefined
—* 3
DTC enable registers
DTCER* 4
R/W
H'00
H'FEEE to H'FEF2
DTC vector register
DTVECR*
4
R/W
H'00
H'FEF3
Module stop control register
MSTPCRH
R/W
H'3F
H'FF86
MSTPCRL
R/W
H'FF
H'FF87
Notes: 1. Lower 16 bits of the address.
2. Registers within the DTC cannot be read or written to directly.
3. Allocated to on-chip RAM addresses H'EC00 to H'EFFF as register information.They
cannot be located in external memory space.
When the DTC is used, do not clear the RAME bit in SYSCR to 0.
4. The H8S/2124 Series does not include an on-chip DTC, and therefore the DTCER and
DTVECR register addresses should not be accessed by the CPU.
153
7.2
Register Descriptions
7.2.1
DTC Mode Register A (MRA)
7
Bit
Initial value
Read/Write
6
5
4
3
2
1
0
SM1
SM0
DM1
DM0
MD1
MD0
DTS
Sz
Undefined
—
Undefined
—
Undefined
—
Undefined
—
Undefined
—
Undefined
—
Undefined
—
Undefined
—
MRA is an 8-bit register that controls the DTC operating mode.
Bits 7 and 6—Source Address Mode 1 and 0 (SM1, SM0): These bits specify whether SAR is
to be incremented, decremented, or left fixed after a data transfer.
Bit 7
Bit 6
SM1
SM0
Description
0
—
SAR is fixed
1
0
SAR is incremented after a transfer
(by 1 when Sz = 0; by 2 when Sz = 1)
1
SAR is decremented after a transfer
(by 1 when Sz = 0; by 2 when Sz = 1)
Bits 5 and 4—Destination Address Mode 1 and 0 (DM1, DM0): These bits specify whether
DAR is to be incremented, decremented, or left fixed after a data transfer.
Bit 5
Bit 4
DM1
DM0
Description
0
—
DAR is fixed
1
0
DAR is incremented after a transfer
(by 1 when Sz = 0; by 2 when Sz = 1)
1
DAR is decremented after a transfer
(by 1 when Sz = 0; by 2 when Sz = 1)
154
Bits 3 and 2—DTC Mode (MD1, MD0): These bits specify the DTC transfer mode.
Bit 3
Bit 2
MD1
MD0
Description
0
0
Normal mode
1
Repeat mode
0
Block transfer mode
1
—
1
Bit 1—DTC Transfer Mode Select (DTS): Specifies whether the source side or the destination
side is set to be a repeat area or block area, in repeat mode or block transfer mode.
Bit 1
DTS
Description
0
Destination side is repeat area or block area
1
Source side is repeat area or block area
Bit 0—DTC Data Transfer Size (Sz): Specifies the size of data to be transferred.
Bit 0
Sz
Description
0
Byte-size transfer
1
Word-size transfer
155
7.2.2
DTC Mode Register B (MRB)
Bit
Initial value
Read/Write
7
6
5
4
3
2
1
0
CHNE
DISEL
—
—
—
—
—
—
Undefined
—
Undefined
—
Undefined
—
Undefined
—
Undefined
—
Undefined
—
Undefined
—
Undefined
—
MRB is an 8-bit register that controls the DTC operating mode.
Bit 7—DTC Chain Transfer Enable (CHNE): Specifies chain transfer. In chain transfer,
multiple data transfers can be performed consecutively in response to a single transfer request.
With data transfer for which CHNE is set to 1, there is no determination of the end of the specified
number of transfers, clearing of the interrupt source flag, or clearing of DTCER.
Bit 7
CHNE
Description
0
End of DTC data transfer (activation waiting state is entered)
1
DTC chain transfer (new register information is read, then data is transferred)
Bit 6—DTC Interrupt Select (DISEL): Specifies whether interrupt requests to the CPU are
disabled or enabled after a data transfer.
Bit 6
DISEL
Description
0
After a data transfer ends, the CPU interrupt is disabled unless the transfer counter is
0 (the DTC clears the interrupt source flag of the activating interrupt to 0)
1
After a data transfer ends, the CPU interrupt is enabled (the DTC does not clear the
interrupt source flag of the activating interrupt to 0)
Bits 5 to 0—Reserved: In the H8S/2128 Series these bits have no effect on DTC operation, and
should always be written with 0.
156
7.2.3
DTC Source Address Register (SAR)
23
Bit
Initial value
Read/write
22
21
20
19
4
Unde- Unde- Unde- Unde- Undefined fined fined fined fined
— — — — —
3
2
1
0
Unde- Unde- Unde- Unde- Undefined fined fined fined fined
— — — — —
SAR is a 24-bit register that designates the source address of data to be transferred by the DTC.
For word-size transfer, specify an even source address.
7.2.4
DTC Destination Address Register (DAR)
23
Bit
Initial value
Read/write
22
21
20
19
4
Unde- Unde- Unde- Unde- Undefined fined fined fined fined
— — — — —
3
2
1
0
Unde- Unde- Unde- Unde- Undefined fined fined fined fined
— — — — —
DAR is a 24-bit register that designates the destination address of data to be transferred by the
DTC. For word-size transfer, specify an even destination address.
7.2.5
DTC Transfer Count Register A (CRA)
Bit
Initial value
Read/Write
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Undefined fined fined fined fined fined fined fined fined fined fined fined fined fined fined fined
— — — — — — — — — — — — — — — —
CRAH
CRAL
CRA is a 16-bit register that designates the number of times data is to be transferred by the DTC.
In normal mode, the entire CRA register functions as a 16-bit transfer counter (1 to 65,536). It is
decremented by 1 every time data is transferred, and transfer ends when the count reaches H'0000.
In repeat mode or block transfer mode, CRA is divided into two parts: the upper 8 bits (CRAH)
and the lower 8 bits (CRAL). CRAH holds the number of transfers while CRAL functions as an 8bit transfer counter (1 to 256). CRAL is decremented by 1 every time data is transferred, and the
contents of CRAH are transferred when the count reaches H'00. This operation is repeated.
157
7.2.6
DTC Transfer Count Register B (CRB)
15
Bit
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Undefined fined fined fined fined fined fined fined fined fined fined fined fined fined fined fined
— — — — — — — — — — — — — — — —
Initial value
Read/Write
CRB is a 16-bit register that designates the number of times data is to be transferred by the DTC in
block transfer mode. It functions as a 16-bit transfer counter (1 to 65,536) that is decremented by 1
every time data is transferred, and transfer ends when the count reaches H'0000.
7.2.7
DTC Enable Registers (DTCER)
7
6
5
4
3
2
1
0
DTCE7
DTCE6
DTCE5
DTCE4
DTCE3
DTCE2
DTCE1
DTCE0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
The DTC enable registers comprise five 8-bit readable/writable registers, DTCERA to DTCERE,
with bits corresponding to the interrupt sources that can activate the DTC. These bits enable or
disable DTC service for the corresponding interrupt sources.
The DTC enable registers are initialized to H'00 by a reset and in hardware standby mode.
Bit n—DTC Activation Enable (DTCEn)
Bit n
DTCEn
0
Description
DTC activation by interrupt is disabled
(Initial value)
[Clearing conditions]
1
•
When data transfer ends with the DISEL bit set to 1
•
When the specified number of transfers end
DTC activation by interrupt is enabled
[Holding condition]
When the DISEL bit is 0 and the specified number of transfers have not ended
(n = 7 to 0)
A DTCE bit can be set for each interrupt source that can activate the DTC. The correspondence
between interrupt sources and DTCE bits is shown in table 7.4, together with the vector number
generated by the interrupt controller in each case.
158
For DTCE bit setting, read/write operations must be performed using bit-manipulation instructions
such as BSET and BCLR. For the initial setting only, however, when multiple activation sources
are set at one time, it is possible to disable interrupts and write after executing a dummy read on
the relevant register.
7.2.8
DTC Vector Register (DTVECR)
7
Bit
6
5
4
3
2
0
1
SWDTE DTVEC6 DTVEC5 DTVEC4 DTVEC3 DTVEC2 DTVEC1 DTVEC0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: * A value of 1 can always be written to the SWDTE bit, but 0 can only be written after 1
is read.
DTVECR is an 8-bit readable/writable register that enables or disables DTC activation by
software, and sets a vector number for the software activation interrupt.
DTVECR is initialized to H'00 by a reset and in hardware standby mode.
Bit 7—DTC Software Activation Enable (SWDTE): Specifies enabling or disabling of DTC
software activation. To clear the SWDTE bit by software, read SWDTE when set to 1, then write 0
in the bit.
Bit 7
SWDTE
0
Description
DTC software activation is disabled
(Initial value)
[Clearing condition]
When the DISEL bit is 0 and the specified number of transfers have
not ended
1
DTC software activation is enabled
[Holding conditions]
•
When data transfer ends with the DISEL bit set to 1
•
When the specified number of transfers end
•
During software-activated data transfer
Bits 6 to 0—DTC Software Activation Vectors 6 to 0 (DTVEC6 to DTVEC0): These bits
specify a vector number for DTC software activation.
The vector address is H'0400 + (vector number) << 1 (where << 1 indicates a 1-bit left shift). For
example, if DTVEC6 to DTVEC0 = H'10, the vector address is H'0420.
159
7.2.9
Module Stop Control Register (MSTPCR)
MSTPCRH
Bit
15
14
13
12
11
MSTPCRL
10
9
8
MSTP15 MSTP14 MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTP8
Initial value
Read/Write
0
0
1
1
1
1
1
1
7
6
5
4
3
2
1
0
MSTP7 MSTP6 MSTP5 MSTP4 MSTP3 MSTP2 MSTP1 MSTP0
1
1
1
1
1
1
1
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR, comprising two 8-bit readable/writable registers, performs module stop mode control.
When the MSTP14 bit in MSTPCR is set to 1, the DTC operation stops at the end of the bus cycle
and a transition is made to module stop mode. Note that 1 cannot be written to the MSTP14 bit
when the DTC is being activated. For details, see section 21.5, Module Stop Mode.
MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in
software standby mode.
MSTPCRH Bit 6—Module Stop (MSTP14): Specifies the DTC module stop mode.
MSTPCRH
Bit 6
MSTP14
Description
0
DTC module stop mode is cleared
1
DTC module stop mode is set
160
(Initial value)
7.3
Operation
7.3.1
Overview
When activated, the DTC reads register information that is already stored in memory and transfers
data on the basis of that register information. After the data transfer, it writes updated register
information back to memory. Pre-storage of register information in memory makes it possible to
transfer data over any required number of channels. Setting the CHNE bit to 1 makes it possible to
perform a number of transfers with a single activation.
Figure 7.2 shows a flowchart of DTC operation.
Start
Read DTC vector
Next transfer
Read register information
Data transfer
Write register information
CHNE = 1?
Yes
No
Transfer counter = 0
or DISEL = 1?
Yes
No
Clear activation flag
Clear DTCER
End
Interrupt exception
handling
Figure 7.2 Flowchart of DTC Operation
161
The DTC transfer mode can be normal mode, repeat mode, or block transfer mode.
The 24-bit SAR designates the DTC transfer source address and the 24-bit DAR designates the
transfer destination address. After each transfer, SAR and DAR are independently incremented,
decremented, or left fixed.
Table 7.2 outlines the functions of the DTC.
Table 7.2
DTC Functions
Address Registers
Transfer Mode
• Normal mode
 One transfer request transfers one
byte or one word
 Memory addresses are incremented
or decremented by 1 or 2
 Up to 65,536 transfers possible
• Repeat mode
 One transfer request transfers one
byte or one word
 Memory addresses are incremented
or decremented by 1 or 2
 After the specified number of transfers
(1 to 256), the initial state resumes and
operation continues
• Block transfer mode
 One transfer request transfers a block
of the specified size
 Block size is from 1 to 256 bytes or
words
 Up to 65,536 transfers possible
 A block area can be designated at either
the source or destination
162
Activation Source
• IRQ
• FRT ICI, OCI
• 8-bit timer CMI
• SCI TXI or RXI
• A/D converter ADI
• IIC IICI
• Software
Transfer
Source
Transfer
Destination
24 bits
24 bits
7.3.2
Activation Sources
The DTC operates when activated by an interrupt or by a write to DTVECR by software (software
activation). An interrupt request can be directed to the CPU or DTC, as designated by the
corresponding DTCER bit. The interrupt request is directed to the DTC when the corresponding
bit is set to 1, and to the CPU when the bit is cleared to 0.
At the end of one data transfer (or the last of the consecutive transfers in the case of chain transfer)
the interrupt source or the corresponding DTCER bit is cleared. Table 7.3 shows activation
sources and DTCER clearing.
The interrupt source flag for RXI0, for example, is the RDRF flag in SCI0.
Table 7.3
Activation Sources and DTCER Clearing
When DISEL Bit Is 0 and
Specified Number of Transfers
Have Not Ended
When DISEL Bit Is 1 or
Specified Number of Transfers
Have Ended
Software
activation
SWDTE bit cleared to 0
•
SWDTE bit held at 1
•
Interrupt request sent to CPU
Interrupt
activation
•
Corresponding DTCER bit
held at 1
•
Corresponding DTCER bit cleared
to 0
•
Activation source flag cleared
to 0
•
Activation source flag held at 1
•
Activation source interrupt request
sent to CPU
Activation
Source
Figure 7.3 shows a block diagram of activation source control. For details see section 5, Interrupt
Controller.
163
Source flag cleared
Clear
control
Clear
DTCER
Clear request
On-chip
supporting
module
IRQ interrupt
Interrupt
request
DTVECR
Selection circuit
Select
DTC
Interrupt controller
CPU
Interrupt mask
Figure 7.3 Block Diagram of DTC Activation Source Control
When an interrupt has been designated a DTC activation source, existing CPU mask level and
interrupt controller priorities have no effect. If there is more than one activation source at the same
time, the DTC is activated in accordance with the default priorities.
7.3.3
DTC Vector Table
Figure 7.4 shows the correspondence between DTC vector addresses and register information.
Table 7.4 shows the correspondence between activation sources, vector addresses, and DTCER
bits. When the DTC is activated by software, the vector address is obtained from: H'0400 +
DTVECR[6:0] << 1 (where << 1 indicates a 1-bit left shift). For example, if DTVECR is H'10, the
vector address is H'0420.
The DTC reads the start address of the register information from the vector address set for each
activation source, and then reads the register information from that start address. The register
information can be placed at predetermined addresses in the on-chip RAM. The start address of
the register information should be an integral multiple of four.
The configuration of the vector address is the same in both normal and advanced modes, a 2-byte
unit being used in both cases. These two bytes specify the lower bits of the address in the on-chip
RAM.
164
Table 7.4
Interrupt Sources, DTC Vector Addresses, and Corresponding DTCEs
Interrupt Source
Origin of
Vector
Interrupt Source Number
Vector
Address
DTCE*
Priority
Write to DTVECR
Software
H'0400 +
DTVECR
[6:0] << 1
—
High
16
H'0420
DTCEA7
IRQ1
17
H'0422
DTCEA6
IRQ2
18
H'0424
DTCEA5
IRQ3
19
H'0426
DTCEA4
DTVECR
(Decimal
indication)
IRQ0
External pin
ADI (A/D conversion end)
A/D
28
H'0438
DTCEA3
ICIA (FRT input capture A)
FRT
48
H'0460
DTCEA2
ICIB (FRT input capture B)
49
H'0462
DTCEA1
OCIA (FRT output compare A)
52
H'0468
DTCEA0
OCIB (FRT output compare B)
54
H'046A
DTCEB7
CMIA0 (TMR0 compare-match A) TMR0
64
H'0480
DTCEB2
CMIB0 (TMR0 compare-match B)
65
H'0482
DTCEB1
CMIA1 (TMR1 compare-match A) TMR1
68
H'0488
DTCEB0
CMIB1 (TMR1 compare-match B)
69
H'048A
DTCEC7
CMIAY (TMRY compare-match A) TMRY
72
H'0490
DTCEC6
CMIBY (TMRY compare-match B)
73
H'0492
DTCEC5
81
H'04A2
DTCEC2
82
H'04A4
DTCEC1
SCI channel 1
85
H'04AA
DTCEC0
86
H'04AC
DTCED7
IICI0 (IIC0 1-byte transmission/
reception completed)
IIC0 (option)
92
H'04B8
DTCED4
IICI1 (IIC1 1-byte transmission/
reception completed)
IIC1 (option)
94
H'04BC
DTCED3
RXI0 (reception completed 0)
SCI channel 0
TXI0 (transmit data empty 0)
RXI1 (reception completed 1)
TXI1 (transmit data empty 1)
Low
Note: * DTCE bits with no corresponding interrupt are reserved, and should be written with 0.
165
DTC vector
address
Register information
start address
Register information
Chain transfer
Figure 7.4 Correspondence between DTC Vector Address and Register Information
7.3.4
Location of Register Information in Address Space
Figure 7.5 shows how the register information should be located in the address space.
Locate the MRA, SAR, MRB, DAR, CRA, and CRB registers, in that order, from the start address
of the register information (vector address contents). In chain transfer, locate the register
information in consecutive areas.
Locate the register information in the on-chip RAM (addresses: H'FFEC00 to H'FFEFFF).
Lower address
0
Register information
start address
Chain transfer
1
2
3
MRA
SAR
MRB
DAR
CRA
Register information
CRB
MRA
SAR
MRB
DAR
CRA
CRB
Register information
for 2nd transfer
in chain transfer
4 bytes
Figure 7.5 Location of DTC Register Information in Address Space
166
7.3.5
Normal Mode
In normal mode, one operation transfers one byte or one word of data.
From 1 to 65,536 transfers can be specified. Once the specified number of transfers have ended, a
CPU interrupt can be requested.
Table 7.5 lists the register information in normal mode and figure 7.6 shows memory mapping in
normal mode.
Table 7.5
Register Information in Normal Mode
Name
Abbreviation
Function
DTC source address register
SAR
Transfer source address
DTC destination address register
DAR
Transfer destination address
DTC transfer count register A
CRA
Transfer count
DTC transfer count register B
CRB
Not used
SAR
DAR
Transfer
Figure 7.6 Memory Mapping in Normal Mode
167
7.3.6
Repeat Mode
In repeat mode, one operation transfers one byte or one word of data.
From 1 to 256 transfers can be specified. Once the specified number of transfers have ended, the
initial address register state specified by the transfer counter and repeat area resumes and transfer
is repeated. In repeat mode the transfer counter does not reach H'00, and therefore CPU interrupts
cannot be requested when DISEL = 0.
Table 7.6 lists the register information in repeat mode and figure 7.7 shows memory mapping in
repeat mode.
Table 7.6
Register Information in Repeat Mode
Name
Abbreviation
Function
DTC source address register
SAR
Transfer source address
DTC destination address register
DAR
Transfer destination address
DTC transfer count register AH
CRAH
Holds number of transfers
DTC transfer count register AL
CRAL
Transfer count
DTC transfer count register B
CRB
Not used
SAR or
DAR
Repeat area
Transfer
Figure 7.7 Memory Mapping in Repeat Mode
168
DAR or
SAR
7.3.7
Block Transfer Mode
In block transfer mode, one operation transfers one block of data. Either the transfer source or the
transfer destination is specified as a block area.
The block size is 1 to 256. When the transfer of one block ends, the initial state of the block size
counter and the address register specified in the block area is restored. The other address register is
successively incremented or decremented, or left fixed.
From 1 to 65,536 transfers can be specified. Once the specified number of transfers have ended, a
CPU interrupt is requested.
Table 7.7 lists the register information in block transfer mode and figure 7.8 shows memory
mapping in block transfer mode.
Table 7.7
Register Information in Block Transfer Mode
Name
Abbreviation
Function
DTC source address register
SAR
Transfer source address
DTC destination address register
DAR
Transfer destination address
DTC transfer count register AH
CRAH
Holds block size
DTC transfer count register AL
CRAL
Block size count
DTC transfer count register B
CRB
Transfer counter
169
First block
SAR or
DAR
·
·
·
Block area
Transfer
Nth block
Figure 7.8 Memory Mapping in Block Transfer Mode
170
DAR or
SAR
7.3.8
Chain Transfer
Setting the CHNE bit to 1 enables a number of data transfers to be performed consecutively in
response to a single transfer request. SAR, DAR, CRA, CRB, MRA, and MRB, which define data
transfers, can be set independently.
Figure 7.9 shows memory mapping for chain transfer.
Source
Destination
Register information
CHNE = 1
DTC vector
address
Register information
start address
Register information
CHNE = 0
Source
Destination
Figure 7.9 Memory Mapping in Chain Transfer
In the case of transfer with CHNE set to 1, an interrupt request to the CPU is not generated at the
end of the specified number of transfers or by setting of the DISEL bit to 1, and the interrupt
source flag for the activation source is not affected.
171
7.3.9
Operation Timing
Figures 7.10 to 7.12 show examples of DTC operation timing.
ø
DTC activation
request
DTC
request
Data transfer
Vector read
Address
Read Write
Transfer
information read
Transfer
information write
Figure 7.10 DTC Operation Timing (Normal Mode or Repeat Mode)
ø
DTC activation
request
DTC request
Data transfer
Vector read
Address
Read Write Read Write
Transfer
information read
Transfer
information write
Figure 7.11 DTC Operation Timing (Block Transfer Mode, with Block Size of 2)
172
ø
DTC activation
request
DTC
request
Data transfer
Data transfer
Read Write
Read Write
Vector read
Address
Transfer
information
read
Transfer
Transfer
information information
write
read
Transfer
information
write
Figure 7.12 DTC Operation Timing (Chain Transfer)
7.3.10
Number of DTC Execution States
Table 7.8 lists execution phases for a single DTC data transfer, and table 7.9 shows the number of
states required for each execution phase.
Table 7.8
DTC Execution Phases
Mode
Vector Read
I
Register Information
Read/Write
Data Read
J
K
Data Write
L
Internal
Operation
M
Normal
1
6
1
1
3
Repeat
1
6
1
1
3
Block transfer
1
6
N
N
3
N: Block size (initial setting of CRAH and CRAL)
173
Table 7.9
Number of States Required for Each Execution Phase
Object of Access
OnChip
RAM
OnChip
ROM
Internal I/O
Registers
External Devices
Bus width
32
16
8
16
8
8
Access states
1
1
2
2
2
3
Execution
phase
Vector read
SI
—
1
—
—
4
6+2m
Register
information
read/write
SJ
1
—
—
—
—
—
Byte data read
SK
1
1
2
2
2
3+m
Word data read
SK
1
1
4
2
4
6+2m
Byte data write
SL
1
1
2
2
2
3+m
Word data write
SL
1
1
4
2
4
6+2m
Internal operation SM
1
1
1
1
1
1
The number of execution states is calculated from the formula below. Note that Σ means the sum
of all transfers activated by one activation event (the number for which the CHNE bit is set to one,
plus 1).
Number of execution states = I · SI + Σ (J · SJ + K · SK + L · SL) + M · SM
For example, when the DTC vector address table is located in on-chip ROM, normal mode is set,
and data is transferred from the on-chip ROM to an internal I/O register, the time required for the
DTC operation is 13 states. The time from activation to the end of the data write is 10 states.
174
7.3.11
Procedures for Using the DTC
Activation by Interrupt: The procedure for using the DTC with interrupt activation is as follows:
1. Set the MRA, MRB, SAR, DAR, CRA, and CRB register information in the on-chip RAM.
2. Set the start address of the register information in the DTC vector address.
3. Set the corresponding bit in DTCER to 1.
4. Set the enable bits for the interrupt sources to be used as the activation sources to 1. The DTC
is activated when an interrupt used as an activation source is generated.
5. After the end of one data transfer, or after the specified number of data transfers have ended,
the DTCE bit is cleared to 0 and a CPU interrupt is requested. If the DTC is to continue
transferring data, set the DTCE bit to 1.
Activation by Software: The procedure for using the DTC with software activation is as follows:
1. Set the MRA, MRB, SAR, DAR, CRA, and CRB register information in the on-chip RAM.
2. Set the start address of the register information in the DTC vector address.
3. Check that the SWDTE bit is 0.
4. Write 1 in the SWDTE bit and the vector number to DTVECR.
5. Check the vector number written to DTVECR.
6. After the end of one data transfer, if the DISEL bit is 0 and a CPU interrupt is not requested,
the SWDTE bit is cleared to 0. If the DTC is to continue transferring data, set the SWDTE bit
to 1. When the DISEL bit is 1, or after the specified number of data transfers have ended, the
SWDTE bit is held at 1 and a CPU interrupt is requested.
175
7.3.12
Examples of Use of the DTC
Normal Mode: An example is shown in which the DTC is used to receive 128 bytes of data via
the SCI.
1. Set MRA to fixed source address (SM1 = SM0 = 0), incrementing destination address (DM1 =
1, DM0 = 0), normal mode (MD1 = MD0 = 0), and byte size (Sz = 0). The DTS bit can have
any value. Set MRB for one data transfer by one interrupt (CHNE = 0, DISEL = 0). Set the
SCI RDR address in SAR, the start address of the RAM area where the data will be received in
DAR, and 128 (H'0080) in CRA. CRB can be set to any value.
2. Set the start address of the register information at the DTC vector address.
3. Set the corresponding bit in DTCER to 1.
4. Set the SCI to the appropriate receive mode. Set the RIE bit in SCR to 1 to enable the reception
complete (RXI) interrupt. Since the generation of a receive error during the SCI reception
operation will disable subsequent reception, the CPU should be enabled to accept receive error
interrupts.
5. Each time reception of one byte of data ends on the SCI, the RDRF flag in SSR is set to 1, an
RXI interrupt is generated, and the DTC is activated. The receive data is transferred from RDR
to RAM by the DTC. DAR is incremented and CRA is decremented. The RDRF flag is
automatically cleared to 0.
6. When CRA becomes 0 after the 128 data transfers have ended, the RDRF flag is held at 1, the
DTCE bit is cleared to 0, and an RXI interrupt request is sent to the CPU. The interrupt
handling routine should perform wrap-up processing.
176
Software Activation: An example is shown in which the DTC is used to transfer a block of 128
bytes of data by means of software activation. The transfer source address is H'1000 and the
destination address is H'2000. The vector number is H'60, so the vector address is H'04C0.
1. Set MRA to incrementing source address (SM1 = 1, SM0 = 0), incrementing destination
address (DM1 = 1, DM0 = 0), block transfer mode (MD1 = 1, MD0 = 0), and byte size (Sz =
0). The DTS bit can have any value. Set MRB for one block transfer by one interrupt (CHNE =
0). Set the transfer source address (H'1000) in SAR, the destination address (H'2000) in DAR,
and 128 (H'8080) in CRA. Set 1 (H'0001) in CRB.
2. Set the start address of the register information at the DTC vector address (H'04C0).
3. Check that the SWDTE bit in DTVECR is 0. Check that there is currently no transfer activated
by software.
4. Write 1 to the SWDTE bit and the vector number (H'60) to DTVECR. The write data is H'E0.
5. Read DTVECR again and check that it is set to the vector number (H'60). If it is not, this
indicates that the write failed. This is presumably because an interrupt occurred between steps
3 and 4 and led to a different software activation. To activate this transfer, go back to step 3.
6. If the write was successful, the DTC is activated and a block of 128 bytes of data is transferred.
7. After the transfer, an SWDTEND interrupt occurs. The interrupt handling routine should clear
the SWDTE bit to 0 and perform other wrap-up processing.
177
7.4
Interrupts
An interrupt request is issued to the CPU when the DTC finishes the specified number of data
transfers, or a data transfer for which the DISEL bit was set to 1. In the case of interrupt activation,
the interrupt set as the activation source is generated. These interrupts to the CPU are subject to
CPU mask level and interrupt controller priority level control.
In the case of activation by software, a software-activated data transfer end interrupt (SWDTEND)
is generated.
When the DISEL bit is 1 and one data transfer has ended, or the specified number of transfers
have ended, after data transfer ends, the SWDTE bit is held at 1 and an SWDTEND interrupt is
generated. The interrupt handling routine should clear the SWDTE bit to 0.
When the DTC is activated by software, an SWDTEND interrupt is not generated during a data
transfer wait or during data transfer even if the SWDTE bit is set to 1.
7.5
Usage Notes
Module Stop: When the MSTP14 bit in MSTPCR is set to 1, the DTC clock stops, and the DTC
enters the module stop state. However, 1 cannot be written in the MSTP14 bit while the DTC is
operating. When the DTC is placed in the module stop state, the DTCER registers must all be in
the cleared state when the MSTP14 bit is set to 1.
On-Chip RAM: The MRA, MRB, SAR, DAR, CRA, and CRB registers are all located in on-chip
RAM. When the DTC is used, the RAME bit in SYSCR must not be cleared to 0.
DTCE Bit Setting: For DTCE bit setting, read/write operations must be performed using bitmanipulation instructions such as BSET and BCLR. For the initial setting only, however, when
multiple activation sources are set at one time, it is possible to disable interrupts and write after
executing a dummy read on the relevant register.
178
Section 8 I/O Ports
8.1
Overview
The H8S/2128 Series and H8S/2124 Series have six I/O ports (ports 1 to 6), and one input-only
port (port 7).
Tables 8.1 and 8.2 summarize the port functions. The pins of each port also have other functions.
Each port includes a data direction register (DDR) that controls input/output (not provided for the
input-only port) and data registers (DR) that store output data.
Ports 1 to 3 have a built-in MOS input pull-up function. Ports 1 to 3 have a MOS input pull-up
control register (PCR), in addition to DDR and DR, to control the on/off status of the MOS input
pull-ups.
Ports 1 to 6 can drive a single TTL load and 30 pF capacitive load. All the I/O ports can drive a
Darlington transistor when in output mode. Ports 1 to 3 can drive an LED (10 mA sink current).
In the H8S/2128 Series, P52 in port 5 and P47 in port 4 are NMOS push-pull outputs.
Note that the H8S/2124 Series has subset specifications that do not include some supporting
modules. For differences in pin functions, see table 8.1, H8S/2128 Series Port Functions, and table
8.2, H8S/2124 Series Port Functions.
179
Table 8.1
H8S/2128 Series Port Functions
Expanded Modes
Port
Description Pins
Mode 1
Mode 2, Mode 3
(EXPE = 1)
Mode 2, Mode 3
(EXPE = 0)
I/O port also functioning
as PWM timer output
(PW7 to PW0, PWX1,
PWX0)
Port 1 • 8-bit I/O
port
• Built-in
MOS input
pull-ups
• LED drive
capability
P17 to P10/
A7 to A0/
PW7 to PW0/
PWX1, PWX0
Lower
address
output
(A7 to A0)
When DDR = 0
(after reset):
input port
Port 2 • 8-bit I/O
port
• Built-in
MOS input
pull-ups
• LED drive
capability
P27/A15/PW15/
SCK1/CBLANK
Upper
address
output
(A15 to A8)
When DDR = 0
(after reset):
input port, SCI1
I/O pins (TxD1,
RxD1, SCK1) or
timer connection
output
(CBLANK)
P26/A14/PW14/
RxD1
P25/A13/PW13/
TxD1
P24/A12/PW12/
SCL1
P23/A11/PW11/
SDA1
P22/A10/PW10
P21/A9/PW9
P20/A8/PW8
P37 to P30/
Port 3 • 8-bit I/O
port
D7 to D0
• Built-in
MOS input
pull-ups
• LED drive
capability
180
Single-Chip Mode
When DDR = 1:
lower address
output (A7 to
A0) or PWM
timer output
(PW7 to PW0,
PWX1, PWX0)
When DDR = 1:
upper address
output (A15 to
A8), PWM timer
output (PW15 to
PW12), SCI1
I/O pins (TxD1,
RxD1, SCK1) or
timer connection
output
(CBLANK), or
output ports
(P27 to P24)
Data bus input/output (D7 to
D0)
I/O port also functioning
as PWM timer output
(PW15 to PW8), SCI1
I/O pins (TxD1, RxD1,
SCK1) and timer
connection output
(CBLANK), I2C bus
interface 1 (option) I/O
pins (SCL1, SDA1), and
I/O port
I/O port
Expanded Modes
Port
Description Pins
Port 4 • 8-bit I/O
port
Mode 1
Mode 2, Mode 3
(EXPE = 1)
P47/WAIT/SDA0
I/O port also functioning as
expanded data bus control
input (WAIT) and I2C bus
interface 0 (option)
input/output (SDA0)
P46/ø/EXCL
When DDR
= 0: input
port or
EXCL input
Single-Chip Mode
Mode 2, Mode 3
(EXPE = 0)
I/O port also functioning
as I 2C bus interface 0
(option) input/output
(SDA0)
When DDR = 0 (after reset): input port or
EXCL input
When DDR = 1: ø output
When DDR
= 1 (after
reset): ø
output
P45/AS/IOS
P44/WR
Expanded data bus control
output (AS/IOS, WR, RD)
I/O port
P43/RD
P42/IRQ0
Port 5 • 3-bit I/O
port
P41/IRQ1
I/O port also functioning as external interrupt input (IRQ0,
IRQ1)
P40/IRQ2/
ADTRG
I/O port also functioning as external interrupt input (IRQ2),
and A/D converter external trigger input (ADTRG)
P52/SCK0/SCL0
I/O port also functioning as SCI0 input/output (TxD0,
RxD0, SCK0) and I 2C bus interface 0 (option) input/output
(SCL0)
P51/RxD0
P50/TxD0
181
Expanded Modes
Port
Description Pins
Port 6 • 8-bit I/O
port
Mode 1
Mode 2, Mode 3
(EXPE = 1)
Single-Chip Mode
Mode 2, Mode 3
(EXPE = 0)
P67/TMOX/
TMO1/CIN7/
HSYNCO
I/O port also functioning as FRT input/output (FTCI, FTOA,
FTIA, FTIB, FTIC, FTID, FTOB), 8-bit timer 0 and 1
input/output (TMCI0, TMRI0, TMO0, TMCI1, TMRI1,
TMO1), 8-bit timer X and Y input/output (TMOX, TMIX,
P66/FTOB/
TMIY), timer connection input/output (HSYNCO, CSYNCI,
TMRI1/CIN6/
HSYNCI, CLAMPO, VFBACKI, VSYNCI, VSYNCO,
CSYNCI
HFBACKI), and expansion A/D converter input (CIN7 to
P65/FTID/TMCI1/ CIN0)
CIN5/HSYNCI
P64/FTIC/TMO0/
CIN4/CLAMPO
P63/FTIB/TMRI0/
CIN3/VFBACKI
P62/FTIA/TMIY/
CIN2/VSYNCI
P61/FTOA/CIN1/
VSYNCO
P60/FTCI/TMIX/
TMCI0/CIN0/
HFBACKI
Port 7 • 8-bit input
port
P77/AN7
P76/AN6
P75/AN5
P74/AN4
P73/AN3
P72/AN2
P71/AN1
P70/AN0
182
Input port also functioning as A/D converter analog input
(AN7 to AN0)
Table 8.2
H8S/2124 Series Port Functions
Expanded Modes
Port
Description Pins
Mode 1
Mode 2, Mode 3
(EXPE = 1)
Mode 2, Mode 3
(EXPE = 0)
I/O port
P17 to P10/
Port 1 • 8-bit I/O
port
A7 to A0
• Built-in
MOS input
pull-ups
• LED drive
capability
Lower
address
output (A7 to
A0)
When DDR = 0
(after reset):
input port
Port 2 • 8-bit I/O
port
• Built-in
MOS input
pull-ups
• LED drive
capability
Upper
address
output (A15
to A8)
When DDR = 0
(after reset):
input port or
SCI1 I/O pins
(TxD1, RxD1,
SCK1)
P27/A15/SCK1
P26/A14/RxD1
P25/A13/TxD1
P24/A12
P23/A11
P22/A10
P21/A9
P20/A8
Single-Chip Mode
When DDR = 1:
lower address
output (A7 to
A0)
I/O port also functioning
as SCI1 I/O pins (TxD1,
RxD1, SCK1)
When DDR = 1:
upper address
output (A15 to
A8), SCI1 I/O
pins (TxD1,
RxD1, SCK1) or
output ports
(P27 to P24)
P37 to P30/
Port 3 • 8-bit I/O
port
D7 to D0
• Built-in
MOS input
pull-ups
• LED drive
capability
Data bus input/output (D7 to
D0)
I/O port
Port 4 • 8-bit I/O
port
P47/WAIT
I/O port also functioning as
expanded data bus control
input (WAIT)
I/O port
P46/ø/EXCL
When DDR
= 0: input
port or
EXCL input
When DDR = 0 (after reset): input port or
EXCL input
When DDR = 1: ø output
When DDR
= 1 (after
reset): ø
output
183
Expanded Modes
Port
Description Pins
Port 4 • 8-bit I/O
port
P45/AS/IOS
P44/WR
Mode 1
Mode 2, Mode 3
(EXPE = 1)
Expanded data bus control
output(AS/IOS, WR, RD)
Single-Chip Mode
Mode 2, Mode 3
(EXPE = 0)
I/O port
P43/RD
P42/IRQ0
P41/IRQ1
Port 5 • 3-bit I/O
port
I/O port also functioning as external interrupt input (IRQ0,
IRQ1)
I/O port also functioning
as external interrupt
input (IRQ2) and A/D
converter external
trigger input (ADTRG)
P40/IRQ2/
ADTRG
I/O port also functioning as
external interrupt input (IRQ2),
and A/D converter external
trigger input (ADTRG)
P52/SCK0
I/O port also functioning as SCI0 input/output (TxD0,
RxD0, SCK0)
P51/RxD0
P50/TxD0
Port 6 • 8-bit I/O
port
P67/TMO1/CIN7
I/O port also functioning as FRT input/output (FTCI, FTOA,
FTIA, FTIB, FTIC, FTID, FTOB), 8-bit timer 0 and 1
input/output (TMCI0, TMRI0, TMO0, TMCI1, TMRI1,
TMO1), 8-bit timer Y input (TMIY), and expansion A/D
P65/FTID/TMCI1/ converter input (CIN7 to CIN0)
CIN5
P66/FTOB/
TMRI1/CIN6
P64/FTIC/TMO0/
CIN4
P63/FTIB/TMRI0/
CIN3
P62/FTIA/TMIY/
CIN2
P61/FTOA/CIN1
P60/FTCI/TMCI0/
CIN0
Port 7 • 8-bit input
port
P77/AN7
P76/AN6
P75/AN5
P74/AN4
P73/AN3
P72/AN2
P71/AN1
P70/AN0
184
Input port also functioning as A/D converter analog input
(AN7 to AN0)
8.2
Port 1
8.2.1
Overview
Port 1 is an 8-bit I/O port. Port 1 pins also function as address bus output pins as 8-bit PWM
output pins (PW7 to PW0) (H8S/2128 Series only), and as 14-bit PWM output pins (PWX1 to
PWX0) (H8S/2128 Series only). Port 1 functions change according to the operating mode. Port 1
has a built-in MOS input pull-up function that can be controlled by software.
Figure 8.1 shows the port 1 pin configuration.
Port 1
Port 1 pins
Pin functions in mode 1
P17/A7/PW7
A7 (Output)
P16/A6/PW6
A6 (Output)
P15/A5/PW5
A5 (Output)
P14/A4/PW4
A4 (Output)
P13/A3/PW3
A3 (Output)
P12/A2/PW2
A2 (Output)
P11/A1/PW1/PWX1
A1 (Output)
P10/A0/PW0/PWX0
A0 (Output)
Pin functions in modes 2 and 3 (EXPE = 1)
A7 (Output)/P17 (Input)/PW7 (Output)
A6 (Output)/P16 (Input)/PW6 (Output)
A5 (Output)/P15 (Input)/PW5 (Output)
A4 (Output)/P14 (Input)/PW4 (Output)
A3 (Output)/P13 (Input)/PW3 (Output)
A2 (Output)/P12 (Input)/PW2 (Output)
A1 (Output)/P11 (Input)/PW1 (Output)/PWX1 (Output)
A0 (Output)/P10 (Input)/PW0 (Output)/PWX0 (Output)
Pin functions in modes 2 and 3 (EXPE = 0)
P17 (I/O)/PW7 (Output)
P16 (I/O)/PW6 (Output)
P15 (I/O)/PW5 (Output)
P14 (I/O)/PW4 (Output)
P13 (I/O)/PW3 (Output)
P12 (I/O)/PW2 (Output)
P11 (I/O)/PW1 (Output)/PWX1 (Output)
P10 (I/O)/PW0 (Output)/PWX0 (Output)
Figure 8.1 Port 1 Pin Functions
185
8.2.2
Register Configuration
Table 8.3 shows the port 1 register configuration.
Table 8.3
Port 1 Registers
Name
Abbreviation
R/W
Initial Value
Address*
Port 1 data direction register
P1DDR
W
H'00
H'FFB0
Port 1 data register
P1DR
R/W
H'00
H'FFB2
Port 1 MOS pull-up control
register
P1PCR
R/W
H'00
H'FFAC
Note: * Lower 16 bits of the address.
Port 1 Data Direction Register (P1DDR)
Bit
7
6
5
4
3
2
1
0
P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
P1DDR is an 8-bit write-only register, the individual bits of which specify input or output for the
pins of port 1. P1DDR cannot be read; if it is, an undefined value will be returned.
P1DDR is initialized to H'00 by a reset and in hardware standby mode. It retains its prior state in
software standby mode. The address output pins maintain their output state in a transition to
software standby mode.
• Mode 1
The corresponding port 1 pins are address outputs, regardless of the P1DDR setting.
In hardware standby mode, the address outputs go to the high-impedance state.
• Modes 2 and 3 (EXPE = 1)
The corresponding port 1 pins are address outputs or PWM outputs when P1DDR bits are set
to 1, and input ports when cleared to 0.
P10 and P11 can be designated as PWMX outputs regardless of P1DDR, but to ensure normal
execution of external space accesses, this designation should not be used.
• Modes 2 and 3 (EXPE = 0)
The corresponding port 1 pins are output ports or PWM outputs when P1DDR bits are set to 1,
and input ports when cleared to 0.
P10 and P11 can be designated as PWMX outputs regardless of P1DDR.
186
Port 1 Data Register (P1DR)
Bit
Initial value
R/W
7
6
5
4
3
2
1
0
P17DR
P16DR
P15DR
P14DR
P13DR
P12DR
P11DR
P10DR
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
P1DR is an 8-bit readable/writable register that stores output data for the port 1 pins (P17 to P10).
If a port 1 read is performed while P1DDR bits are set to 1, the P1DR values are read directly,
regardless of the actual pin states. If a port 1 read is performed while P1DDR bits are cleared to 0,
the pin states are read.
P1DR is initialized to H'00 by a reset and in hardware standby mode. It retains its prior state in
software standby mode.
Port 1 MOS Pull-Up Control Register (P1PCR)
Bit
7
6
5
4
3
2
1
0
P17PCR P16PCR P15PCR P14PCR P13PCR P12PCR P11PCR P10PCR
Initial value
R/W
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
P1PCR is an 8-bit readable/writable register that controls the port 1 built-in MOS input pull-ups
on a bit-by-bit basis.
In modes 2 and 3, the MOS input pull-up is turned on when a P1PCR bit is set to 1 while the
corresponding P1DDR bit is cleared to 0 (input port setting).
P1PCR is initialized to H'00 by a reset and in hardware standby mode. It retains its prior state in
software standby mode.
187
8.2.3
Pin Functions in Each Mode
Mode 1: In mode 1, port 1 pins automatically function as address outputs. The port 1 pin functions
are shown in figure 8.2.
A7 (Output)
A6 (Output)
A5 (Output)
A4 (Output)
Port 1
A3 (Output)
A2 (Output)
A1 (Output)
A0 (Output)
Figure 8.2 Port 1 Pin Functions (Mode 1)
Modes 2 and 3 (EXPE = 1): In modes 2 and 3 (when EXPE = 1), port 1 pins function as address
outputs, PWM outputs, or input ports, and input or output can be specified on a bit-by-bit basis.
When a bit in P1DDR is set to 1, the corresponding pin functions as an address output or PWM
output, and when cleared to 0, as an input port. P10 and P11 can be designated as PWMX outputs
regardless of P1DDR, but to ensure normal execution of external space accesses, this designation
should not be used.
The port 1 pin functions are shown in figure 8.3.
Port 1
When P1DDR = 1
and PWOERA = 0
When P1DDR = 0
When P1DDR = 1
and PWOERA = 1
A7 (Output)
P17 (Input)
PW7 (Output)
A6 (Output)
P16 (Input)
PW6 (Output)
A5 (Output)
P15 (Input)
PW5 (Output)
A4 (Output)
P14 (Input)
PW4 (Output)
A3 (Output)
P13 (Input)
PW3 (Output)
A2 (Output)
P12 (Input)
PW2 (Output)
A1 (Output)/PWX1 (Output)
P11 (Input)/PWX1 (Output)
PW1 (Output)/PWX1 (Output)
A0 (Output)/PWX0 (Output)
P10 (Input)/PWX0 (Output)
PW0 (Output)/PWX0 (Output)
Figure 8.3 Port 1 Pin Functions (Modes 2 and 3 (EXPE = 1))
188
Modes 2 and 3 (EXPE = 0): In modes 2 and 3 (when EXPE = 0), port 1 pins function as PWM
outputs or I/O ports, and input or output can be specified on a bit-by-bit basis. When a bit in
P1DDR is set to 1, the corresponding pin functions as a PWM output or output port, and when
cleared to 0, as an input port. P10 and P11 can be designated as PWMX outputs regardless of
P1DDR.
The port 1 pin functions are shown in figure 8.4.
Port 1
P1n: Input pin when P1DDR = 0,
output pin when P1DDR = 1
and PWOERA = 0
When P1DDR = 1
and PWOERA = 1
P17 (I/O)
PW7 (Output)
P16 (I/O)
PW6 (Output)
P15 (I/O)
PW5 (Output)
P14 (I/O)
PW4 (Output)
P13 (I/O)
PW3 (Output)
P12 (I/O)
PW2 (Output)
P11 (I/O)/PWX1 (Output)
PW1 (Output)/PWX1 (Output)
P10 (I/O)/PWX0 (Output)
PW0 (Output)/PWX0 (Output)
Figure 8.4 Port 1 Pin Functions (Modes 2 and 3 (EXPE = 0))
8.2.4
MOS Input Pull-Up Function
Port 1 has a built-in MOS input pull-up function that can be controlled by software. This MOS
input pull-up function can be used in modes 2 and 3, and can be specified as on or off on a bit-bybit basis.
When a P1DDR bit is cleared to 0 in mode 2 or 3, setting the corresponding P1PCR bit to 1 turns
on the MOS input pull-up for that pin.
The MOS input pull-up function is in the off state after a reset and in hardware standby mode. The
prior state is retained in software standby mode.
Table 8.4 summarizes the MOS input pull-up states.
189
Table 8.4
MOS Input Pull-Up States (Port 1)
Mode
Reset
Hardware
Standby Mode
Software
Standby Mode
In Other
Operations
1
Off
Off
Off
Off
2, 3
Off
Off
On/Off
On/Off
Legend:
Off:
MOS input pull-up is always off.
On/Off: On when P1DDR = 0 and P1PCR = 1; otherwise off.
8.3
Port 2
8.3.1
Overview
Port 2 is an 8-bit I/O port. Port 2 pins also function as address bus output pins, 8-bit PWM output
pins (PW15 to PW8) (H8S/2128 Series only), the timer connection output pin (CBLANK)
(H8S/2128 Series only), IIC1 I/O pins (SCL1, SDA1) (option in H8S/2128 Series only), and SCI1
I/O pins (SCK1, RxD1, TxD1). Port 2 functions change according to the operating mode. Port 2
has a built-in MOS input pull-up function that can be controlled by software.
Figure 8.5 shows the port 2 pin configuration.
190
Port 2
Port 2 pins
Pin functions in mode 1
P27/A15/PW15/SCK1/CBLANK
A15 (Output)
P26/A14/PW14/RxD1
A14 (Output)
P25/A13/PW13/TxD1
A13 (Output)
P24/A12/PW12/SCL1
A12 (Output)
P23/A11/PW11/SDA1
A11 (Output)
P22/A10/PW10
A10 (Output)
P21/A9/PW9
A9 (Output)
P20/A8/PW8
A8 (Output)
Pin functions in modes 2 and 3 (EXPE = 1)
A15 (Output)/P27 (Input)/PW15 (Output)/SCK1(I/O)/CBLANK (Output)
A14 (Output)/P26 (Input)/PW14 (Output)/RxD1 (Input)
A13 (Output)/P25 (Input)/PW13 (Output)/TxD1 (Output)
A12 (Output)/P24 (Input)/PW12 (Output)/SCL1 (I/O)
A11 (Output)/P23 (Input)/PW11 (Output)/SDA1 (I/O)
A10 (Output)/P22 (Input)/PW10 (Output)
A9 (Output)/P21 (Input)/PW9 (Output)
A8 (Output)/P20 (Input)/PW8 (Output)
Pin functions in modes 2 and 3 (EXPE = 0)
P27 (I/O)/PW15 (Output)/SCK1(I/O)/CBLANK (Output)
P26 (I/O)/PW14 (Output)/RxD1 (Input)
P25 (I/O)/PW13 (Output)/TxD1 (Output)
P24 (I/O)/PW12 (Output)/SCL1 (I/O)
P23 (I/O)/PW11 (Output)/SDA1 (I/O)
P22 (I/O)/PW10 (Output)
P21 (I/O)/PW9 (Output)
P20 (I/O)/PW8 (Output)
Figure 8.5 Port 2 Pin Functions
191
8.3.2
Register Configuration
Table 8.5 shows the port 2 register configuration.
Table 8.5
Port 2 Registers
Name
Abbreviation
R/W
Initial Value
Address*
Port 2 data direction register
P2DDR
W
H'00
H'FFB1
Port 2 data register
P2DR
R/W
H'00
H'FFB3
Port 2 MOS pull-up control
register
P2PCR
R/W
H'00
H'FFAD
Note: * Lower 16 bits of the address.
Port 2 Data Direction Register (P2DDR)
Bit
7
6
5
4
3
2
1
0
P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
P2DDR is an 8-bit write-only register, the individual bits of which specify input or output for the
pins of port 2. P2DDR cannot be read; if it is, an undefined value will be returned.
P2DDR is initialized to H'00 by a reset and in hardware standby mode. It retains its prior state in
software standby mode. The address output pins maintain their output state in a transition to
software standby mode.
• Mode 1
The corresponding port 2 pins are address outputs, regardless of the P2DDR setting.
In hardware standby mode, the address outputs go to the high-impedance state.
• Modes 2 and 3 (EXPE = 1)
The corresponding port 2 pins are address outputs or PWM outputs when P2DDR bits are set
to 1, and input ports when cleared to 0. P27 to P24 are switched from address outputs to output
ports by setting the IOSE bit to 1.
P27 to P23 can be used as an on-chip supporting module output pin regardless of the P2DDR
setting, but to ensure normal access to external space, P27 should not be set as an on-chip
supporting module output pin when port 2 pins are used as address output pins.
• Modes 2 and 3 (EXPE = 0)
The corresponding port 2 pins are output ports or PWM outputs when P2DDR bits are set to 1,
and input ports when cleared to 0.
192
P27 to P23 can be used as an on-chip supporting module output pin regardless of the P2DDR
setting.
Port 2 Data Register (P2DR)
Bit
Initial value
R/W
7
6
5
4
3
2
1
0
P27DR
P26DR
P25DR
P24DR
P23DR
P22DR
P21DR
P20DR
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
P2DR is an 8-bit readable/writable register that stores output data for the port 2 pins (P27 to P20).
If a port 2 read is performed while P2DDR bits are set to 1, the P2DR values are read directly,
regardless of the actual pin states. If a port 2 read is performed while P2DDR bits are cleared to 0,
the pin states are read.
P2DR is initialized to H'00 by a reset and in hardware standby mode. It retains its prior state in
software standby mode.
Port 2 MOS Pull-Up Control Register (P2PCR)
Bit
7
6
5
4
3
2
1
0
P27PCR P26PCR P25PCR P24PCR P23PCR P22PCR P21PCR P20PCR
Initial value
R/W
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
P2PCR is an 8-bit readable/writable register that controls the port 2 built-in MOS input pull-ups
on a bit-by-bit basis.
In modes 2 and 3, the MOS input pull-up is turned on when a P2PCR bit is set to 1 while the
corresponding P2DDR bit is cleared to 0 (input port setting).
P2PCR is initialized to H'00 by a reset and in hardware standby mode. It retains its prior state in
software standby mode.
193
8.3.3
Pin Functions in Each Mode
Mode 1: In mode 1, port 2 pins automatically function as address outputs. The port 2 pin functions
are shown in figure 8.6.
A15 (Output)
A14 (Output)
A13 (Output)
Port 2
A12 (Output)
A11 (Output)
A10 (Output)
A9 (Output)
A8 (Output)
Figure 8.6 Port 2 Pin Functions (Mode 1)
Modes 2 and 3 (EXPE = 1): In modes 2 and 3 (when EXPE = 1), port 2 pins function as address
outputs, PWM outputs, or I/O ports, and input or output can be specified on a bit-by-bit basis.
When a bit in P2DDR is set to 1, the corresponding pin functions as an address output or PWM
output, and when cleared to 0, as an input port. P27 to P24 are switched from address outputs to
output ports by setting the IOSE bit to 1. P27 to P23 can be used as an on-chip supporting module
output pin regardless of the P2DDR setting, but to ensure normal access to external space, P27
should not be set as an on-chip supporting module output pin when port 2 pins are used as address
output pins.
The port 2 pin functions are shown in figure 8.7.
When P2DDR = 1
and PWOERB = 0
When P2DDR = 0
When P2DDR = 1
and PWOERB = 1
A15 (Output)/P27 (Output) P27 (Input)/SCK1 (I/O)/CBLANK (Output) PW15 (Output)/SCK1 (I/O)/CBLANK (Output)
Port 2
A14 (Output)/P26 (Output) P26 (Input)/RxD1 (Input)
PW14 (Output)/RxD1 (Input)
A13 (Output)/P25 (Output) P25 (Input)/TxD1 (Output)
PW13 (Output)/TxD1 (Output)
A12 (Output)/P24 (Output) P24 (Input)/SCL1 (I/O)
PW12 (Output)/SCL1 (I/O)
A11 (Output)
P23 (Input)/SDA1 (I/O)
PW11 (Output)/SDA1 (I/O)
A10 (Output)
P22 (Input)
PW10 (Output)
A9 (Output)
P21 (Input)
PW9 (Output)
A8 (Output)
P20 (Input)
PW8 (Output)
Figure 8.7 Port 2 Pin Functions (Modes 2 and 3 (EXPE = 1))
194
Modes 2 and 3 (EXPE = 0): In modes 2 and 3 (when EXPE = 0), port 2 pins function as PWM
outputs, the timer connection output (CBLANK), IIC1 I/O pins (SCL1, SDA1), SCI1 I/O pins
(SCK1, RxD1, TxD1), or I/O ports, and input or output can be specified on a bit-by-bit basis.
When a bit in P2DDR is set to 1, the corresponding pin functions as a PWM output or output port,
and when cleared to 0, as an input port. P27 to P23 can be used as an on-chip supporting module
output pin regardless of the P2DDR setting.
The port 2 pin functions are shown in figure 8.8.
Port 2
P2n: Input pin when P2DDR = 0,
output pin when P2DDR = 1
and PWOERB = 0
When P2DDR = 1
and PWOERB = 1
P27 (I/O)/SCK1 (I/O)/CBLANK (Output)
PW15 (Output)/SCK1 (I/O)/CBLANK (Output)
P26 (I/O)/RxD1 (Input)
PW14 (Output)/RxD1 (Input)
P25 (I/O)/TxD1 (Output)
PW13 (Output)/TxD1 (Output)
P24 (I/O)/SCL1 (I/O)
PW12 (Output)/SCL1 (I/O)
P23 (I/O)/SDA1 (I/O)
PW11 (Output)/SDA1 (I/O)
P22 (I/O)
PW10 (Output)
P21 (I/O)
PW9 (Output)
P20 (I/O)
PW8 (Output)
Figure 8.8 Port 2 Pin Functions (Modes 2 and 3 (EXPE = 0))
8.3.4
MOS Input Pull-Up Function
Port 2 has a built-in MOS input pull-up function that can be controlled by software. This MOS
input pull-up function can be used in modes 2 and 3, and can be specified as on or off on a bit-bybit basis.
When a P2DDR bit is cleared to 0 in mode 2 or 3, setting the corresponding P2PCR bit to 1 turns
on the MOS input pull-up for that pin.
The MOS input pull-up function is in the off state after a reset and in hardware standby mode. The
prior state is retained in software standby mode.
Table 8.6 summarizes the MOS input pull-up states.
195
Table 8.6
MOS Input Pull-Up States (Port 2)
Mode
Reset
Hardware
Standby Mode
Software
Standby Mode
In Other
Operations
1
Off
Off
Off
Off
2, 3
Off
Off
On/Off
On/Off
Legend:
Off:
MOS input pull-up is always off.
On/Off: On when P2DDR = 0 and P2PCR = 1; otherwise off.
8.4
Port 3
8.4.1
Overview
Port 3 is an 8-bit I/O port. Port 3 pins also function as data bus I/O pins. Port 3 functions change
according to the operating mode. Port 3 has a built-in MOS input pull-up function that can be
controlled by software.
Figure 8.9 shows the port 3 pin configuration.
Port 3
Port 3 pins
Pin functions in modes
1, 2 and 3 (EXPE = 1)
Pin functions in modes
2 and 3 (EXPE = 0)
P37/D7
D7 (I/O)
P37 (I/O)
P36/D6
D6 (I/O)
P36 (I/O)
P35/D5
D5 (I/O)
P35 (I/O)
P34/D4
D4 (I/O)
P34 (I/O)
P33/D3
D3 (I/O)
P33 (I/O)
P32/D2
D2 (I/O)
P32 (I/O)
P31/D1
D1 (I/O)
P31 (I/O)
P30/D0
D0 (I/O)
P30 (I/O)
Figure 8.9 Port 3 Pin Functions
196
8.4.2
Register Configuration
Table 8.7 shows the port 3 register configuration.
Table 8.7
Port 3 Registers
Name
Abbreviation
R/W
Initial Value
Address*
Port 3 data direction register
P3DDR
W
H'00
H'FFB4
Port 3 data register
P3DR
R/W
H'00
H'FFB6
Port 3 MOS pull-up control
register
P3PCR
R/W
H'00
H'FFAE
Note: * Lower 16 bits of the address.
Port 3 Data Direction Register (P3DDR)
Bit
7
6
5
4
3
2
1
0
P37DDR P36DDR P35DDR P34DDR P33DDR P32DDR P31DDR P30DDR
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
P3DDR is an 8-bit write-only register, the individual bits of which specify input or output for the
pins of port 3. P3DDR cannot be read; if it is, an undefined value will be returned.
P3DDR is initialized to H'00 by a reset and in hardware standby mode. It retains its prior state in
software standby mode.
• Modes 1, 2, and 3 (EXPE = 1)
The input/output direction specified by P3DDR is ignored, and pins automatically function as
data I/O pins.
After a reset, and in hardware standby mode or software standby mode, the data I/O pins go to
the high-impedance state.
• Modes 2 and 3 (EXPE = 0)
The corresponding port 3 pins are output ports when P3DDR bits are set to 1, and input ports
when cleared to 0.
197
Port 3 Data Register (P3DR)
7
6
5
4
3
2
1
0
P37DR
P36DR
P35DR
P34DR
P33DR
P32DR
P31DR
P30DR
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
P3DR is an 8-bit readable/writable register that stores output data for the port 3 pins (P37 to P30).
If a port 3 read is performed while P3DDR bits are set to 1, the P3DR values are read directly,
regardless of the actual pin states. If a port 3 read is performed while P3DDR bits are cleared to 0,
the pin states are read.
P3DR is initialized to H'00 by a reset and in hardware standby mode. It retains its prior state in
software standby mode.
Port 3 MOS Pull-Up Control Register (P3PCR)
Bit
7
6
5
4
3
2
1
0
P37PCR P36PCR P35PCR P34PCR P33PCR P32PCR P31PCR P30PCR
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
P3PCR is an 8-bit readable/writable register that controls the port 3 built-in MOS input pull-ups
on a bit-by-bit basis.
In modes 2 and 3 (when EXPE = 0), the MOS input pull-up is turned on when a P3PCR bit is set
to 1 while the corresponding P3DDR bit is cleared to 0 (input port setting).
P3PCR is initialized to H'00 by a reset and in hardware standby mode. It retains its prior state in
software standby mode.
198
8.4.3
Pin Functions in Each Mode
Modes 1, 2, and 3 (EXPE = 1): In modes 1, 2, and 3 (when EXPE = 1), port 3 pins automatically
function as data I/O pins. The port 3 pin functions are shown in figure 8.10.
D7 (I/O)
D6 (I/O)
D5 (I/O)
Port 3
D4 (I/O)
D3 (I/O)
D2 (I/O)
D1 (I/O)
D0 (I/O)
Figure 8.10 Port 3 Pin Functions (Modes 1, 2, and 3 (EXPE = 1))
Modes 2 and 3 (EXPE = 0): In modes 2 and 3 (when EXPE = 0), port 3 functions as an I/O port,
and input or output can be specified on a bit-by-bit basis. When a bit in P3DDR is set to 1, the
corresponding pin functions as an output port, and when cleared to 0, as an input port.
The port 3 pin functions are shown in figure 8.11.
P37 (I/O)
P36 (I/O)
P35 (I/O)
Port 3
P34 (I/O)
P33 (I/O)
P32 (I/O)
P31 (I/O)
P30 (I/O)
Figure 8.11 Port 3 Pin Functions (Modes 2 and 3 (EXPE = 0))
199
8.4.4
MOS Input Pull-Up Function
Port 3 has a built-in MOS input pull-up function that can be controlled by software. This MOS
input pull-up function can be used in modes 2 and 3 (when EXPE = 0), and can be specified as on
or off on a bit-by-bit basis.
When a P3DDR bit is cleared to 0 in mode 2 or 3 (when EXPE = 0), setting the corresponding
P3PCR bit to 1 turns on the MOS input pull-up for that pin.
The MOS input pull-up function is in the off state after a reset and in hardware standby mode. The
prior state is retained in software standby mode.
Table 8.8 summarizes the MOS input pull-up states.
Table 8.8
MOS Input Pull-Up States (Port 3)
Hardware
Standby Mode
Software
Standby Mode
In Other
Operations
1, 2, 3 (EXPE = 1) Off
Off
Off
Off
2, 3 (EXPE = 0)
Off
On/Off
On/Off
Mode
Reset
Off
Legend:
Off:
MOS input pull-up is always off.
On/Off: On when P3DDR = 0 and P3PCR = 1; otherwise off.
200
8.5
Port 4
8.5.1
Overview
Port 4 is an 8-bit I/O port. Port 4 pins also function as the IRQ0 to IRQ2 input pins, A/D converter
external trigger input pin (ADTRG), IIC0 I/O pin (SDA0) (option in H8S/2128 Series only),
subclock input pin (EXCL), bus control signal I/O pins (AS/IOS, RD, WR, WAIT), and system
clock (ø) output pin. In the H8S/2128 Series, P47 is an NMOS push-pull output. SDA0 is an
NMOS open-drain output, and has direct bus drive capability.
Figure 8.12 shows the port 4 pin configuration.
Port 4
Port 4 pins
Pin functions in modes 1, 2 and 3 (EXPE = 1)
P47/WAIT/SDA0
WAIT (Input)/P47 (I/O)/SDA0 (I/O)
P46/ø/EXCL
ø (Output)/P46 (Input)/EXCL (Input)
P45/AS/IOS
AS (Output)/IOS (Output)
P44/WR
WR (Output)
P43/RD
RD (Output)
P42/IRQ0
P42 (I/O)/IRQ0 (Input)
P41/IRQ1
P41 (I/O)/IRQ1 (Input)
P40/IRQ2/ADTRG
P40 (I/O)/IRQ2 (Input)/ADTRG (Input)
Pin functions in modes 2 and 3 (EXPE = 0)
P47 (I/O)/SDA0 (I/O)
P46 (Input)/ø (Output)/EXCL (Input)
P45 (I/O)
P44 (I/O)
P43 (I/O)
P42 (I/O)/IRQ0 (Input)
P41 (I/O)/IRQ1 (Input)
P40 (I/O)/IRQ2 (Input)/ADTRG (Input)
Figure 8.12 Port 4 Pin Functions
201
8.5.2
Register Configuration
Table 8.9 summarizes the port 4 registers.
Table 8.9
Port 4 Registers
Name
Abbreviation
R/W
Initial Value
Address*1
Port 4 data direction register
P4DDR
W
H'40/H'00* 2
H'FFB5
Port 4 data register
P4DR
R/W
H'00
H'FFB7
Notes: 1. Lower 16 bits of the address.
2. Initial value depends on the mode.
Port 4 Data Direction Register (P4DDR)
Bit
7
6
5
4
3
2
1
0
P47DDR P46DDR P45DDR P44DDR P43DDR P42DDR P41DDR P40DDR
Mode 1
Initial value
0
1
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Modes 2 and 3
P4DDR is an 8-bit write-only register, the individual bits of which specify input or output for the
pins of port 4. P4DDR cannot be read; if it is, an undefined value will be returned.
P4DDR is initialized to H'40 (mode 1) or H'00 (modes 2 and 3) by a reset and in hardware standby
mode. It retains its prior state in software standby mode.
• Modes 1, 2, and 3 (EXPE = 1)
Pin P47 functions as a bus control input (WAIT), IIC0 I/O pin (SDA0), or I/O port, according
to the wait mode setting. When P47 functions as an I/O port, it becomes an output port when
P47DDR is set to 1, and an input port when P47DDR is cleared to 0.
Pin P46 functions as the ø output pin when P46DDR is set to 1, and as the subclock input
(EXCL) or an input port when P46DDR is cleared to 0.
Pins P45 to P43 automatically become bus control outputs (AS/IOS, WR, RD), regardless of
the input/output direction indicated by P45DDR to P43DDR.
Pins P42 to P40 become output ports when P42DDR to P40DDR are set to 1, and input ports
when P42DDR to P40DDR are cleared to 0.
202
• Modes 2 and 3 (EXPE = 0)
When the corresponding P4DDR bits are set to 1, pin P46 functions as the ø output pin and
pins P47 and P45 to P40 become output ports. When P4DDR bits are cleared to 0, the
corresponding pins become input ports.
Port 4 Data Register (P4DR)
Bit
7
6
5
4
3
2
1
0
P47DR
P46DR
P45DR
P44DR
P43DR
P42DR
P41DR
P40DR
Initial value
0
—*
0
0
0
0
0
0
Read/Write
R/W
R
R/W
R/W
R/W
R/W
R/W
R/W
Note: * Determined by the state of pin P46.
P4DR is an 8-bit readable/writable register that stores output data for the port 4 pins (P47 to P40).
With the exception of P46, if a port 4 read is performed while P4DDR bits are set to 1, the P4DR
values are read directly, regardless of the actual pin states. If a port 4 read is performed while
P4DDR bits are cleared to 0, the pin states are read.
P4DR is initialized to H'00 by a reset and in hardware standby mode. It retains its prior state in
software standby mode.
8.5.3
Pin Functions
Port 4 pins also function as the IRQ0 to IRQ2 input pins, A/D converter input pin (ADTRG), IIC0
I/O pin (SDA0), subclock input pin (EXCL), bus control signal I/O pins (AS/IOS, RD, WR,
WAIT), and system clock (ø) output pin. The pin functions differ between the mode 1, 2, and 3
(EXPE = 1) expanded modes and the mode 2 and 3 (EXPE = 0) single-chip modes. The port 4 pin
functions are shown in table 8.10.
203
Table 8.10 Port 4 Pin Functions
Pin
Selection Method and Pin Functions
P47/WAIT/SDA0
The pin function is switched as shown below according to the combination of
operating mode, bit WMS1 in WSCR, bit ICE in ICCR of IIC0, and bit P47DDR.
Operating
mode
Modes 1, 2, 3 (EXPE = 1)
WMS1
0
ICE
P47DDR
Pin function
Modes 2, 3 (EXPE = 0)
1
0
1
—
—
0
1
0
1
—
—
0
1
—
P47
input
pin
P47
output
pin
SDA0
I/O pin
WAIT
input
pin
P47
input
pin
P47
output
pin
SDA0
I/O pin
In the H8S/2128 Series, when this pin is set as the P47 output pin, it is an
NMOS push-pull output. SDA0 is an NMOS open-drain output, and has direct
bus drive capability.
P46/ø/EXCL
The pin function is switched as shown below according to the combination of
bit EXCLE in LPWRCR and bit P46DDR.
P46DDR
0
EXCLE
Pin function
1
0
1
0
P46 input pin
EXCL input pin
ø output pin
When this pin is used as the EXCL input pin, P46DDR should be cleared to 0.
P45/AS/IOS
The pin function is switched as shown below according to the combination of
operating mode, bits IOSE in SYSCR, and bit P45DDR.
Operating
mode
Modes 1, 2, 3
(EXPE = 1)
P45DDR
—
IOSE
Pin function
P44/WR
0
1
0
1
—
—
AS
output pin
IOS
output pin
P45
input pin
P45
output pin
The pin function is switched as shown below according to the combination of
operating mode, and bit P44DDR.
Operating
mode
Modes 1, 2, 3
(EXPE = 1)
P44DDR
—
0
1
WR
output pin
P44
input pin
P44
output pin
Pin function
204
Modes 2, 3 (EXPE = 0)
Modes 2, 3 (EXPE = 0)
Pin
Selection Method and Pin Functions
P43/RD/IOR
The pin function is switched as shown below according to the combination of
operating mode, and bit P43DDR.
Operating
mode
Modes 1, 2, 3
(EXPE = 1)
P43DDR
—
0
1
RD output pin
P43 input pin
P43 output pin
Pin function
P42/IRQ0
P42DDR
Pin function
Modes 2, 3 (EXPE = 0)
0
1
P42 input pin
P42 output pin
IRQ0 input pin
When bit IRQ0E in IER is set to 1, this pin is used as the IRQ0 input pin.
P41/IRQ1
P41DDR
Pin function
0
1
P41 input pin
P41 output pin
IRQ1 input pin
When bit IRQ1E in IER is set to 1, this pin is used as the IRQ1 input pin.
P40/IRQ2/ADTRG
P40DDR
Pin function
0
1
P40 input pin
P40 output pin
IRQ2 input pin, ADTRG input pin
When the IRQ2E bit in IER is set to 1, this pin is used as the IRQ2 input pin.
When TRGS1 and TRGS0 bit in ADCR of the A/D converter are both set to 1,
this pin is used as the ADTRG input pin.
205
8.6
Port 5
8.6.1
Overview
Port 5 is a 3-bit I/O port. Port 5 pins also function as SCI0 I/O pins (TxD0, RxD0, SCK0), and the
IIC0 I/O pin (SCL0) (option in H8S/2128 Series only). In the H8S/2128 Series, P52 and SCK0 are
NMOS push-pull outputs, and SCL0 is an NMOS open-drain output. Port 5 pin functions are the
same in all operating modes.
Figure 8.13 shows the port 5 pin configuration.
Port 5 pins
P52 (I/O)/SCK0 (I/O)/SCL0 (I/O)
Port 5
P51 (I/O)/RxD0 (Input)
P50 (I/O)/TxD0 (Output)
Figure 8.13 Port 5 Pin Functions
8.6.2
Register Configuration
Table 8.11 shows the port 5 register configuration.
Table 8.11 Port 5 Registers
Name
Abbreviation
R/W
Initial Value
Address*
Port 5 data direction register
P5DDR
W
H'F8
H'FFB8
Port 5 data register
P5DR
R/W
H'F8
H'FFBA
Note: * Lower 16 bits of the address.
206
Port 5 Data Direction Register (P5DDR)
7
6
5
4
3
—
—
—
—
—
Initial value
1
1
1
1
1
0
0
0
Read/Write
—
—
—
—
—
W
W
W
Bit
2
1
0
P52DDR P51DDR P50DDR
P5DDR is an 8-bit write-only register, the individual bits of which specify input or output for the
pins of port 5. P5DDR cannot be read; if it is, an undefined value will be returned. Bits 7 to 3 are
reserved.
Setting a P5DDR bit to 1 makes the corresponding port 5 pin an output pin, while clearing the bit
to 0 makes the pin an input pin.
P5DDR is initialized to H'F8 by a reset and in hardware standby mode. It retains its prior state in
software standby mode. As SCI0 is initialized, the pin states are determined by the IIC0 ICCR,
P5DDR, and P5DR specifications.
Port 5 Data Register (P5DR)
Bit
7
6
5
4
3
2
1
0
—
—
—
—
—
P52DR
P51DR
P50DR
Initial value
1
1
1
1
1
0
0
0
Read/Write
—
—
—
—
—
R/W
R/W
R/W
P5DR is an 8-bit readable/writable register that stores output data for the port 5 pins (P52 to P50).
If a port 5 read is performed while P5DDR bits are set to 1, the P5DR values are read directly,
regardless of the actual pin states. If a port 5 read is performed while P5DDR bits are cleared to 0,
the pin states are read.
Bits 7 to 3 are reserved; they cannot be modified and are always read as 1.
P5DR is initialized to H'F8 by a reset and in hardware standby mode. It retains its prior state in
software standby mode.
207
8.6.3
Pin Functions
Port 5 pins also function as SCI0 I/O pins (TxD0, RxD0, SCK0) and the IIC0 I/O pin (SCL0). The
port 5 pin functions are shown in table 8.12.
Table 8.12 Port 5 Pin Functions
Pin
Selection Method and Pin Functions
P52/SCK0/SCL0
The pin function is switched as shown below according to the combination of
bits CKE1 and CKE0 in SCR, bit C/A in SMR of SCI0, bit ICE in ICCR of IIC0,
and bit P52DDR.
ICE
0
CKE1
0
C/A
Pin function
1
0
1
—
0
1
—
—
0
—
—
—
—
0
CKE0
P52DDR
1
0
0
1
P52
P52
SCK0
SCK0
SCK0
input pin output pin output pin output pin input pin
SCL0
I/O pin
When this pin is used as the SCL0 I/O pin, bits CKE1 and CKE0 in SCR of
SCI0 and bit C/A in SMR of SCI0 must all be cleared to 0.
SCL0 is an NMOS open-drain output, and has direct bus drive capability.
In the H8S/2128 Series, when set as the P52 output pin or SCK0 output pin,
this pin is an NMOS push-pull output.
P51/RxD0
The pin function is switched as shown below according to the combination of
bit RE in SCR of SCI0 and bit P51DDR.
RE
P51DDR
Pin function
P50/TxD0
0
0
1
—
P51 input pin
P51 output pin
RxD input pin
The pin function is switched as shown below according to the combination of
bit TE in SCR of SCI0 and bit P50DDR.
TE
P50DDR
Pin function
208
1
0
1
0
1
—
P50 input pin
P50 output pin
TxD0 output pin
8.7
Port 6
8.7.1
Overview
Port 6 is an 8-bit I/O port. Port 6 pins also function as the 16-bit free-running timer (FRT) I/O pins
(FTOA, FTOB, FTIA to FTID, FTCI), timer 0 and 1 (TMR0, TMR1) I/O pins (TMCI0, TMRI0,
TMO0, TMCI1, TMRI1, TMO1), timer X (TMRX) I/O pins (TMOX, TMIX) (H8S/2128 Series
only), the timer Y (TMRY) input pin (TMIY), timer connection I/O pins (CSYNCI, HSYNCI,
HSYNCO, HFBACKI, VSYNCI, VSYNCO, VFBACKI, CLAMPO) (H8S/2128 Series only), and
expansion A/D converter input pins (CIN7 to CIN0). Port 6 pin functions are the same in all
operating modes.
Figure 8.14 shows the port 6 pin configuration.
Port 6 pins
P67 (I/O)/TMOX (Output)/TMO1 (Output)/CIN7 (Input)/HSYNCO (Output)
P66 (I/O)/FTOB (Output)/TMRI1 (Input)/CIN6 (Input)/CSYNCI (Input)
P65 (I/O)/FTID (Input)/TMCI1 (Input)/CIN5 (Input)/HSYNCI (Input)
Port 6
P64 (I/O)/FTIC (Input)/TMO0 (Output)/CIN4 (Input)/CLAMPO (Output)
P63 (I/O)/FTIB (Input)/TMRI0 (Input)/CIN3 (Input)/VFBACKI (Input)
P62 (I/O)/FTIA (Input)/CIN2 (Input)/VSYNCI (Input)/TMIY (Input)
P61 (I/O)/FTOA (Output)/CIN1 (Input)/VSYNCO (Output)
P60 (I/O)/FTCI (Input)/TMCIO (Input)/CIN0 (Input)/HFBACKI (Input)/TMIX (Input)
Figure 8.14 Port 6 Pin Functions
8.7.2
Register Configuration
Table 8.13 shows the port 6 register configuration.
Table 8.13 Port 6 Registers
Name
Abbreviation R/W
Initial Value
Address*
Port 6 data direction register
P6DDR
W
H'00
H'FFB9
Port 6 data register
P6DR
R/W
H'00
H'FFBB
Note: * Lower 16 bits of the address.
209
Port 6 Data Direction Register (P6DDR)
Bit
7
6
5
4
3
2
1
0
P67DDR P66DDR P65DDR P64DDR P63DDR P62DDR P61DDR P60DDR
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
P6DDR is an 8-bit write-only register, the individual bits of which specify input or output for the
pins of port 6. P6DDR cannot be read; if it is, an undefined value will be returned.
Setting a P6DDR bit to 1 makes the corresponding port 6 pin an output pin, while clearing the bit
to 0 makes the pin an input pin.
P6DDR is initialized to H'00 by a reset and in hardware standby mode. It retains its prior state in
software standby mode.
Port 6 Data Register (P6DR)
7
6
5
4
3
2
1
0
P67DR
P66DR
P65DR
P64DR
P63DR
P62DR
P61DR
P60DR
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
P6DR is an 8-bit readable/writable register that stores output data for the port 6 pins (P67 to P60).
If a port 6 read is performed while P6DDR bits are set to 1, the P6DR values are read directly,
regardless of the actual pin states. If a port 6 read is performed while P6DDR bits are cleared to 0,
the pin states are read.
P6DR is initialized to H'00 by a reset and in hardware standby mode. It retains its prior state in
software standby mode.
210
8.7.3
Pin Functions
Port 6 pins also function as the 16-bit free-running timer (FRT) I/O pins (FTOA, FTOB, FTIA to
FTID, FTCI), timer 0 and 1 (TMR0, TMR1) I/O pins (TMCI0, TMRI0, TMO0, TMCI1, TMRI1,
TMO1), timer X (TMRX) I/O pins (TMOX, TMIX), the timer Y (TMRY) input pin (TMIY),
timer connection I/O pins (CSYNCI, HSYNCI, HSYNCO, HFBACKI, VSYNCI, VSYNCO,
VFBACKI, CLAMPO), and expansion A/D converter input pins (CIN7 to CIN0). The port 6 pin
functions are shown in table 8.14.
Table 8.14 Port 6 Pin Functions
Pin
Selection Method and Pin Functions
P67/TMO1/TMOX/ The pin function is switched as shown below according to the combination of
CIN7/HSYNCO
bits OS3 to OS0 in TCSR of TMR1 and TMRX, bit HOE in TCONRO of the
timer connection function, and bit P67DDR.
HOE
0
TMRX:
OS3 to 0
All 0
TMR1:
OS3 to 0
P67DDR
Pin function
1
All 0
Not all 0
—
Not all 0
—
—
0
1
—
—
—
P67
input pin
P67
output pin
TMO1
output pin
TMOX
output pin
HSYNCO
output pin
CIN7 input pin
It can always be used as the CIN7 input pin.
P66/FTOB/TMRI1/ The pin function is switched as shown below according to the combination of
CIN6/CSYNCI
bit OEB in TOCR of the FRT and bit P66DDR.
OEB
P66DDR
Pin function
0
1
0
1
—
P66 input pin
P66 output pin
FTOB output pin
TMRI1 input pin, CSYNCI input pin, CIN6 input pin
This pin is used as the TMRI1 input pin when bits CCLR1 and CCLR0 are both
set to 1 in TCR of TMR1.
It can always be used as the CSYNCI or CIN6 input pin.
211
Pin
P65/FTID/TMCI1/
CIN5/HSYNCI
Selection Method and Pin Functions
P65DDR
Pin function
0
1
P65 input pin
P65 output pin
FTID input pin, TMCI1 input pin, HSYNCI input pin,
CIN5 input pin
This pin is used as the TMCI1 input pin when an external clock is selected with
bits CKS2 to CKS0 in TCR of TMR1.
It can always be used as the FTID, HSYNCI or CIN5 input pin.
P64/FTIC/TMO0/
CIN4/CLAMPO
The pin function is switched as shown below according to the combination of
bits OS3 to OS0 in TCSR of TMR0, bit CLOE in TCONRO of the timer
connection function, and bit P64DDR.
CLOE
0
OS3 to 0
P64DDR
Pin function
All 0
1
Not all 0
—
0
1
—
—
P64 input pin
P64 output pin
TMO0
output pin
CLAMPO
output pin
FTIC input pin, CIN4 input pin
This pin can always be used as the FTIC or CIN4 input pin.
P63/FTIB/TMRI0/
CIN3/VFBACKI
P63DDR
Pin function
0
1
P63 input pin
P63 output pin
FTIB input pin, TMRI0 input pin, VFBACKI input pin,
CIN3 input pin
This pin is used as the TMRI0 input pin when bits CCLR1 and CCLR0 are both
set to 1 in TCR of TMR0.
It can always be used as the FTIB, VFBACKI or CIN3 input pin.
P62/FTIA/CIN2/
VSYNCI/TMIY
P62DDR
Pin function
0
1
P62 input pin
P62 output pin
FTIA input pin, VSYNCI input pin, TMIY input pin, CIN2 input pin
This pin can always be used as the FTIA, TMIY, VSYNCI or CIN2 input pin.
212
Pin
Selection Method and Pin Functions
P61/FTOA/CIN1/
VSYNCO
The pin function is switched as shown below according to the combination of
bit OEA in TOCR of the FRT, bit VOE in TCONRO of the timer connection
function, and bit P61DDR.
VOE
0
OEA
P61DDR
Pin function
1
0
1
0
0
1
—
—
P61 input pin
P61 output pin
FTOA0
output pin
VSYNCO
output pin
CIN1 input pin
When this pin is used as the VSYNCO pin, the OEA bit in TOCR of the FRT
must be cleared. This pin can always be used as the CIN1 pin.
P60/FTCI/TMCI0/
CIN0/HFBACKI/
TMIX
P60DDR
Pin function
0
1
P60 I/O pin
P60 output pin
FTCI input pin, TMCI0 input pin, HFBACKI input pin,
CIN0 input pin, TMIX input pin
This pin is used as the FTCI input pin when an external clock is selected with
bits CKS1 and CKS0 in TCR of the FRT.
It is used as the TMCI0 input pin when an external clock is selected with bits
CKS2 to CKS0 in TCR of TMR0.
It can always be used as the TMIX, HFBACKI, CIN0 input pin.
213
8.8
Port 7
8.8.1
Overview
Port 7 is an 8-bit input port. Port 7 pins also function as the A/D converter analog input pins (AN0
to AN7). Port 7 functions are the same in all operating modes.
Figure 8.15 shows the port 7 pin configuration.
Port 7 pins
P77 (Input)/AN7 (Input)
P76 (Input)/AN6 (Input)
P75 (Input)/AN5 (Input)
Port 7
P74 (Input)/AN4 (Input)
P73 (Input)/AN3 (Input)
P72 (Input)/AN2 (Input)
P71 (Input)/AN1 (Input)
P70 (Input)/AN0 (Input)
Figure 8.15 Port 7 Pin Functions
214
8.8.2
Register Configuration
Table 8.16 shows the port 7 register configuration. Port 7 is an input-only port, and does not have
a data direction register or data register.
Table 8.16 Port 7 Registers
Name
Abbreviation
R/W
Initial Value
Address*
Port 7 input data register
P7PIN
R
Undefined
H'FFBE
Note: * Lower 16 bits of the address.
Port 7 Input Data Register (P7PIN)
7
Bit
P77PIN
6
5
4
3
2
P76PIN P75PIN P74PIN P73PIN P72PIN
1
0
P71PIN P70PIN
Initial value
—*
—*
—*
—*
—*
—*
—*
—*
Read/Write
R
R
R
R
R
R
R
R
Note: * Determined by the state of pins P77 to P70.
When a P7PIN read is performed, the pin states are always read.
8.8.3
Pin Functions
Port 7 pins also function as the A/D converter analog input pins (AN0 to AN7).
215
216
Section 9 8-Bit PWM Timers [H8S/2128 Series]
9.1
Overview
The H8/2128 Series has an on-chip pulse width modulation (PWM) timer module with sixteen
outputs. Sixteen output waveforms are generated from a common time base, enabling PWM
output with a high carrier frequency to be produced using pulse division. The PWM timer module
has sixteen 8-bit PWM data registers (PWDRs), and an output pulse with a duty cycle of 0 to
100% can be obtained as specified by PWDR and the port data register (P1DR or P2DR).
9.1.1
Features
The PWM timer module has the following features.
• Operable at a maximum carrier frequency of 1.25 MHz using pulse division (at 20 MHz
operation)
• Duty cycles from 0 to 100% with 1/256 resolution (100% duty realized by port output)
• Direct or inverted PWM output, and PWM output enable/disable control
217
9.1.2
Block Diagram
Figure 9.1 shows a block diagram of the PWM timer module.
PWDR0
P11/PW1
Comparator 1
PWDR1
P12/PW2
Comparator 2
PWDR2
P13/PW3
Comparator 3
PWDR3
P14/PW4
Comparator 4
PWDR4
Comparator 5
PWDR5
Comparator 6
PWDR6
Comparator 7
PWDR7
Comparator 8
PWDR8
P15/PW5
P16/PW6
P17/PW7
P20/PW8
P21/PW9
P22/PW10
Comparator 9
PWDR9
Comparator 10
PWDR10
Comparator 11
PWDR11
P24/PW12
Comparator 12
PWDR12
P25/PW13
Comparator 13
PWDR13
P26/PW14
Comparator 14
PWDR14
P27/PW15
Comparator 15
PWDR15
TCNT
Clock
selection
P23/PW11
PWDPRB
PWDPRA
PWOERB
PWOERA
P2DDR
P1DDR
P2DR
P1DR
Legend:
PWSL:
PWDR:
PWDPRA:
PWDPRB:
PWOERA:
PWOERB:
PCSR:
P1DDR:
P2DDR:
P1DR:
P2DR:
PWM register select
PWM data register
PWM data polarity register A
PWM data polarity register B
PWM output enable register A
PWM output enable register B
Peripheral clock select register
Port 1 data direction register
Port 2 data direction register
Port 1 data register
Port 2 data register
Module
data bus
ø/16
ø/8
ø/4
ø/2
ø
Internal clock
Figure 9.1 Block Diagram of PWM Timer Module
218
Bus interface
Comparator 0
Port/PWM output control
P10/PW0
PWSL
PCSR
Internal
data bus
9.1.3
Pin Configuration
Table 9.1 shows the PWM output pin.
Table 9.1
Pin Configuration
Name
Abbreviation
I/O
Function
PWM output pin 0 to 15
PW0 to PW15
Output
PWM timer pulse output 0 to 15
9.1.4
Register Configuration
Table 9.2 lists the registers of the PWM timer module.
Table 9.2
PWM Timer Module Registers
Name
Abbreviation
R/W
Initial Value
Address* 1
PWM register select
PWSL
R/W
H'20
H'FFD6
PWM data registers 0 to 15
PWDR0 to
PWDR15
R/W
H'00
H'FFD7
PWM data polarity register A
PWDPRA
R/W
H'00
H'FFD5
PWM data polarity register B
PWDPRB
R/W
H'00
H'FFD4
PWM output enable register A
PWOERA
R/W
H'00
H'FFD3
PWM output enable register B
PWOERB
R/W
H'00
H'FFD2
Port 1 data direction register
P1DDR
W
H'00
H'FFB0
Port 2 data direction register
P2DDR
W
H'00
H'FFB1
Port 1 data register
P1DR
R/W
H'00
H'FFB2
Port 2 data register
P2DR
R/W
H'00
H'FFB3
Peripheral clock select register
PCSR
R/W
H'00
H'FF82* 2
Module stop control register
MSTPCRH
R/W
H'3F
H'FF86
MSTPCRL
R/W
H'FF
H'FF87
Notes: 1. Lower 16 bits of the address.
2. Some of the 8-bit PWM timer registers are assigned to the same addresses as other
registers. Register selection is performed with the FLSHE bit in the serial/timer control
register (STCR).
219
9.2
Register Descriptions
9.2.1
PWM Register Select (PWSL)
Bit
7
6
PWCKE PWCKS
5
4
3
2
1
0
—
—
RS3
RS2
RS1
RS0
Initial value
0
0
1
0
0
0
0
0
Read/Write
R/W
R/W
—
—
R/W
R/W
R/W
R/W
PWSL is an 8-bit readable/writable register used to select the PWM timer input clock and the
PWM data register.
PWSL is initialized to H'20 by a reset, and in the standby modes, watch mode, subactive mode,
subsleep mode, and module stop mode.
Bits 7 and 6—PWM Clock Enable, PWM Clock Select (PWCKE, PWCKS): These bits,
together with bits PWCKA and PWCKB in PCSR, select the internal clock input to TCNT in the
PWM timer.
PWSL
PCSR
Bit 7
Bit 6
Bit 2
Bit 1
PWCKE
PWCKS
PWCKB
PWCKA
Description
0
—
—
—
Clock input is disabled
1
0
—
—
ø (system clock) is selected
1
0
0
ø/2 is selected
1
ø/4 is selected
0
ø/8 is selected
1
ø/16 is selected
1
(Initial value)
The PWM resolution, PWM conversion period, and carrier frequency depend on the selected
internal clock, and can be found from the following equations.
Resolution (minimum pulse width) = 1/internal clock frequency
PWM conversion period = resolution × 256
Carrier frequency = 16/PWM conversion period
Thus, with a 20 MHz system clock (ø), the resolution, PWM conversion period, and carrier
frequency are as shown below.
220
Table 9.3
Resolution, PWM Conversion Period, and Carrier Frequency when ø = 20 MHz
Internal Clock
Frequency
Resolution
PWM Conversion
Period
Carrier Frequency
ø
50 ns
12.8 µs
1250 kHz
ø/2
100 ns
25.6 µs
625 kHz
ø/4
200 ns
51.2 µs
312.5 kHz
ø/8
400 ns
102.4 µs
156.3 kHz
ø/16
800 ns
204.8 µs
78.1 kHz
Bit 5—Reserved: This bit is always read as 1 and cannot be modified.
Bit 4—Reserved: This bit is always read as 0 and cannot be modified.
Bits 3 to 0—Register Select (RS3 to RS0): These bits select the PWM data register.
Bit 3
Bit 2
Bit 1
Bit 0
RS3
RS2
RS1
RS0
Register Selection
0
0
0
0
PWDR0 selected
1
PWDR1 selected
0
PWDR2 selected
1
PWDR3 selected
0
PWDR4 selected
1
PWDR5 selected
0
PWDR6 selected
1
PWDR7 selected
0
PWDR8 selected
1
PWDR9 selected
0
PWDR10 selected
1
PWDR11 selected
0
PWDR12 selected
1
PWDR13 selected
0
PWDR14 selected
1
PWDR15 selected
1
1
0
1
1
0
0
1
1
0
1
221
9.2.2
PWM Data Registers (PWDR0 to PWDR15)
Bit
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Each PWDR is an 8-bit readable/writable register that specifies the duty cycle of the basic pulse to
be output, and the number of additional pulses. The value set in PWDR corresponds to a 0 or 1
ratio in the conversion period. The upper 4 bits specify the duty cycle of the basic pulse as 0/16 to
15/16 with a resolution of 1/16. The lower 4 bits specify how many extra pulses are to be added
within the conversion period comprising 16 basic pulses. Thus, a specification of 0/256 to 255/256
is possible for 0/1 ratios within the conversion period. For 256/256 (100%) output, port output
should be used.
PWDR is initialized to H'00 by a reset, and in the standby modes, watch mode, subactive mode,
subsleep mode, and module stop mode.
9.2.3
PWM Data Polarity Registers A and B (PWDPRA and PWDPRB)
PWDPRA
Bit
7
6
5
4
3
2
1
0
OS7
OS6
OS5
OS4
OS3
OS2
OS1
OS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PWDPRB
Bit
7
6
5
4
3
2
1
0
OS15
OS14
OS13
OS12
OS11
OS10
OS9
OS8
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Each PWDPR is an 8-bit readable/writable register that controls the polarity of the PWM output.
Bits OS0 to OS15 correspond to outputs PW0 to PW15.
222
PWDPR is initialized to H'00 by a reset and in hardware standby mode.
OS
Description
0
PWM direct output (PWDR value corresponds to high width of output)
1
PWM inverted output (PWDR value corresponds to low width of output)
9.2.4
PWM Output Enable Registers A and B (PWOERA and PWOERB)
(Initial value)
PWOERA
Bit
7
6
5
4
3
2
1
0
OE7
OE6
OE5
OE4
OE3
OE2
OE1
OE0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
OE15
OE14
OE13
OE12
OE11
OE10
OE9
OE8
PWOERB
Bit
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Each PWOER is an 8-bit readable/writable register that switches between PWM output and port
output. Bits OE15 to OE0 correspond to outputs PW15 to PW0. To set a pin in the output state, a
setting in the port direction register is also necessary. Bits P17DDR to P10DDR correspond to
outputs PW7 to PW0, and bits P27DDR to P20DDR correspond to outputs PW15 to PW8.
PWOER is initialized to H'00 by a reset and in hardware standby mode.
DDR
OE
Description
0
0
Port input
1
Port input
0
Port output or PWM 256/256 output
1
PWM output (0 to 255/256 output)
1
(Initial value)
223
9.2.5
Peripheral Clock Select Register (PCSR)
Bit
7
6
5
4
3
—
—
—
—
—
2
1
PWCKB PWCKA
0
—
Initial value
0
0
0
0
0
0
0
0
Read/Write
—
—
—
—
—
R/W
R/W
—
PCSR is an 8-bit readable/writable register that selects the PWM timer input clock.
PCSR is initialized to H'00 by a reset, and in hardware standby mode.
Bits 7 to 3—Reserved: These bits cannot be modified and are always read as 0.
Bits 2 and 1—PWM Clock Select (PWCKB, PWCKA): Together with bits PWCKE and
PWCKS in PWSL, these bits select the internal clock input to TCNT in the PWM timer. For
details, see section 9.2.1, PWM Register Select (PWSL).
Bit 0—Reserved: Do not set this bit to 1.
9.2.6
Port 1 Data Direction Register (P1DDR)
Bit
7
6
5
4
3
2
1
0
P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
P1DDR is an 8-bit write-only register that specifies the input/output direction and PWM output for
each pin of port 1 on a bit-by-bit basis.
Port 1 pins are multiplexed with pins PW0 to PW7. The bit corresponding to a pin to be used for
PWM output should be set to 1.
For details on P1DDR, see section 8.2, Port 1.
224
9.2.7
Port 2 Data Direction Register (P2DDR)
Bit
7
6
5
4
3
2
1
0
P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
P2DDR is an 8-bit write-only register that specifies the input/output direction and PWM output for
each pin of port J on a bit-by-bit basis.
Port 2 pins are multiplexed with pins PW8 to PW15. The bit corresponding to a pin to be used for
PWM output should be set to 1.
For details on P2DDR, see section 8.3, Port 2.
9.2.8
Port 1 Data Register (P1DR)
Bit
7
6
5
4
3
2
1
0
P17DR
P16DR
P15DR
P14DR
P13DR
P12DR
P11DR
P10DR
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
P1DR is an 8-bit readable/writable register used to fix PWM output at 1 (when OS = 0) or 0 (when
OS = 1).
For details on P1DR, see section 8.2, Port 1.
9.2.9
Port 2 Data Register (P2DR)
Bit
7
6
5
4
3
2
1
0
P27DR
P26DR
P25DR
P24DR
P23DR
P22DR
P21DR
P20DR
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
P2DR is an 8-bit readable/writable register used to fix PWM output at 1 (when OS = 0) or 0 (when
OS = 1).
For details on P2DR, see section 8.3, Port 2.
225
9.2.10
Module Stop Control Register (MSTPCR)
MSTPCRH
Bit
7
6
5
4
3
MSTPCRL
2
1
0
7
6
5
4
3
2
1
0
MSTP15 MSTP14 MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTP8 MSTP7 MSTP6 MSTP5 MSTP4 MSTP3 MSTP2 MSTP1 MSTP0
Initial value
Read/Write
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR comprises two 8-bit readable/writable registers, and is used to perform module stop
mode control.
When the MSTP11 bit is set to 1, 8-bit PWM timer operation is halted and a transition is made to
module stop mode. For details, see section 21.5, Module Stop Mode.
MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in
software standby mode.
MSTPCRH Bit 3—Module Stop (MSTP11): Specifies PWM module stop mode.
MSTPCRH
Bit 3
MSTP11
Description
0
PWM module stop mode is cleared
1
PWM module stop mode is set
226
(Initial value)
9.3
Operation
9.3.1
Correspondence between PWM Data Register Contents and Output Waveform
The upper 4 bits of PWDR specify the duty cycle of the basic pulse as 0/16 to 15/16 with a
resolution of 1/16, as shown in table 9.4.
Table 9.4
Duty Cycle of Basic Pulse
Upper 6 Bits
000000
Basic Pulse Waveform (Internal)
0 1 2 3 4 5 6 7 8 9 A B C D E F 0
000001
000010
000011
000100
000101
000110
000111
..
.
111000
111001
111010
111011
111100
111101
111110
111111
227
The lower 4 bits of PWDR specify the position of pulses added to the 16 basic pulses, as shown in
table 9.5. An additional pulse consists of a high period (when OS = 0) with a width equal to the
resolution, added before the rising edge of a basic pulse. When the upper 4 bits of PWDR are
0000, there is no rising edge of the basic pulse, but the timing for adding pulses is the same.
Table 9.5
Position of Pulses Added to Basic Pulses
Basic Pulse No.
Lower 4 Bits 0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0000
0001
Yes
0010
Yes
Yes
0011
Yes
Yes
Yes
Yes
0100
Yes
Yes
Yes
0101
Yes
Yes
Yes
Yes
Yes
0110
Yes
Yes
Yes
Yes
Yes
Yes
0111
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
1000
Yes
Yes
Yes
Yes
Yes
Yes
Yes
1001
Yes
Yes
Yes
Yes
Yes
Yes
Yes Yes Yes
1010
Yes
Yes
Yes Yes Yes
Yes
Yes
Yes Yes Yes
1011
Yes
Yes
Yes Yes Yes
Yes Yes Yes
Yes Yes Yes
1100
Yes Yes Yes
Yes Yes Yes
Yes Yes Yes
Yes Yes Yes
1101
Yes Yes Yes
Yes Yes Yes
Yes Yes Yes Yes Yes Yes Yes
1110
Yes Yes Yes Yes Yes Yes Yes
Yes Yes Yes Yes Yes Yes Yes
1111
Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
No additional pulse
Resolution width
Additional pulse provided
Additional pulse
Figure 9.2 Example of Additional Pulse Timing (When Upper 4 Bits of PWDR = 1000)
228
Section 10 14-Bit PWM D/A
10.1
Overview
The H8S/2128 Series and H8S/2124 Series have an on-chip 14-bit pulse-width modulator (PWM)
with two output channels.
Each channel can be connected to an external low-pass filter to operate as a 14-bit D/A converter.
Both channels share the same counter (DACNT) and control register (DACR).
10.1.1
Features
The features of the 14-bit PWM D/A are listed below.
• The pulse is subdivided into multiple base cycles to reduce ripple.
• Two resolution settings and two base cycle settings are available
The resolution can be set equal to one or two system clock cycles. The base cycle can be set
equal to T × 64 or T × 256, where T is the resolution.
• Four operating rates
The two resolution settings and two base cycle settings combine to give a selection of four
operating rates.
229
10.1.2
Block Diagram
Figure 10.1 shows a block diagram of the PWM D/A module.
Internal clock
ø
Internal data bus
ø/2
Clock
Clock selection
Bus interface
Basic cycle
compare-match A
PWX0
Fine-adjustment
pulse addition A
PWX1
Basic cycle
compare-match B
Fine-adjustment
pulse addition B
Comparator
A
DADRA
Comparator
B
DADRB
Control logic
Basic cycle overflow
DACNT
DACR
Module data bus
Legend:
DACR:
DADRA:
DADRB:
DACNT:
PWM D/A control register ( 6 bits)
PWM D/A data register A (15 bits)
PWM D/A data register B (15 bits)
PWM D/A counter (14 bits)
Figure 10.1 PWM D/A Block Diagram
10.1.3
Pin Configuration
Table 10.1 lists the pins used by the PWM D/A module.
Table 10.1 Input and Output Pins
Channel
Name
Abbr.
I/O
Function
A
PWM output pin 0
PWX0
Output
PWM output, channel A
B
PWM output pin 1
PWX1
Output
PWM output, channel B
230
10.1.4
Register Configuration
Table 10.2 lists the registers of the PWM D/A module.
Table 10.2 Register Configuration
Name
Abbreviation
R/W
Initial value
Address* 1
PWM D/A control register
DACR
R/W
H'30
H'FFA0* 2
PWM D/A data register A high
DADRAH
R/W
H'FF
H'FFA0* 2
PWM D/A data register A low
DADRAL
R/W
H'FF
H'FFA1* 2
PWM D/A data register B high
DADRBH
R/W
H'FF
H'FFA6* 2
PWM D/A data register B low
DADRBL
R/W
H'FF
H'FFA7* 2
PWM D/A counter high
DACNTH
R/W
H'00
H'FFA6* 2
PWM D/A counter low
DACNTL
R/W
H'03
H'FFA7* 2
Module stop control register
MSTPCRH
R/W
H'3F
H'FF86
MSTPCRL
R/W
H'FF
H'FF87
Notes: 1. Lower 16 bits of the address.
2. The 14-bit PWM timer registers are assigned to the same addresses as other registers.
Register selection is performed with the IICE bit in the serial/timer control register
(STCR). DADRAH and DACR, and DADRB and DACNT, have the same address.
Switching is performed with the REGS bit in DACNT or DADRB.
10.2
Register Descriptions
10.2.1
PWM D/A Counter (DACNT)
DACNTH
DACNTL
Bit (CPU)
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
BIT (Counter)
7
6
5
4
3
2
1
0
8
9
10
11
12
13
—
—
— REGS
Initial value
Read/Write
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
1
1
—
R/W
DACNT is a 14-bit readable/writable up-counter that increments on an input clock pulse. The
input clock is selected by the clock select bit (CKS) in DACR. The CPU can read and write the
DACNT value, but since DACNT is a 16-bit register, data transfers between it and the CPU are
performed using a temporary register (TEMP). See section 10.3, Bus Master Interface, for details.
231
DACNT functions as the time base for both PWM D/A channels. When a channel operates with
14-bit precision, it uses all DACNT bits. When a channel operates with 12-bit precision, it uses the
lower 12 (counter) bits and ignores the upper two (counter) bits.
DACNT is initialized to H'0003 by a reset, in the standby modes, watch mode, subactive mode,
subsleep mode, and module stop mode, and by the PWME bit.
Bit 1 of DACNTL (CPU) is not used, and is always read as 1.
DACNTL Bit 0—Register Select (REGS): DADRA and DACR, and DADRB and DACNT, are
located at the same addresses. The REGS bit specifies which registers can be accessed. The REGS
bit can be accessed regardless of whether DADRB or DACNT is selected.
Bit 0
REGS
Description
0
DADRA and DADRB can be accessed
1
DACR and DACNT can be accessed
10.2.2
(Initial value)
D/A Data Registers A and B (DADRA and DADRB)
DADRH
DADRL
Bit (CPU)
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Bit (Data)
13
12
11
10
9
8
7
6
5
4
3
2
1
0
—
—
DADRA
Initial value
DA13 DA12 DA11 DA10 DA9 DA8 DA7 DA6 DA5 DA4 DA3 DA2 DA1 DA0 CFS
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
—
1
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
DADRB
DA13 DA12 DA11 DA10 DA9 DA8 DA7 DA6 DA5 DA4 DA3 DA2 DA1 DA0 CFS REGS
Initial value
Read/Write
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
—
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
There are two 16-bit readable/writable D/A data registers: DADRA and DADRB. DADRA
corresponds to PWM D/A channel A, and DADRB to PWM D/A channel B. The CPU can read
and write the PWM D/A data register values, but since DADRA and DADRB are 16-bit registers,
data transfers between them and the CPU are performed using a temporary register (TEMP). See
section 10.3, Bus Master Interface, for details.
The least significant (CPU) bit of DADRA is not used and is always read as 1.
DADR is initialized to H'FFFF by a reset, and in the standby modes, watch mode, subactive mode,
subsleep mode, and module stop mode.
232
Bits 15 to 3—PWM D/A Data 13 to 0 (DA13 to DA0): The digital value to be converted to an
analog value is set in the upper 14 bits of the PWM D/A data register.
In each base cycle, the DACNT value is continually compared with these upper 14 bits to
determine the duty cycle of the output waveform, and to decide whether to output a fineadjustment pulse equal in width to the resolution. To enable this operation, the data register must
be set within a range that depends on the carrier frequency select bit (CFS). If the DADR value is
outside this range, the PWM output is held constant.
A channel can be operated with 12-bit precision by keeping the two lowest data bits (DA0 and
DA1) cleared to 0 and writing the data to be converted in the upper 12 bits. The two lowest data
bits correspond to the two highest counter (DACNT) bits.
Bit 1—Carrier Frequency Select (CFS)
Bit 1
CFS
Description
0
Base cycle = resolution (T) × 64
DADR range = H'0401 to H'FFFD
1
Base cycle = resolution (T) × 256
DADR range = H'0103 to H'FFFF
(Initial value)
DADRA Bit 0—Reserved: This bit cannot be modified and is always read as 1.
DADRB Bit 0—Register Select (REGS): DADRA and DACR, and DADRB and DACNT, are
located at the same addresses. The REGS bit specifies which registers can be accessed. The REGS
bit can be accessed regardless of whether DADRB or DACNT is selected.
Bit 0
REGS
Description
0
DADRA and DADRB can be accessed
1
DACR and DACNT can be accessed
10.2.3
(Initial value)
PWM D/A Control Register (DACR)
7
6
5
4
3
2
1
0
TEST
PWME
—
—
OEB
OEA
OS
CKS
Initial value
0
0
1
1
0
0
0
0
Read/Write
R/W
R/W
—
—
R/W
R/W
R/W
R/W
Bit
233
DACR is an 8-bit readable/writable register that selects test mode, enables the PWM outputs, and
selects the output phase and operating speed.
DACR is initialized to H'30 by a reset, and in the standby modes, watch mode, subactive mode,
subsleep mode, and module stop mode.
Bit 7—Test Mode (TEST): Selects test mode, which is used in testing the chip. Normally this bit
should be cleared to 0.
Bit 7
TEST
Description
0
PWM (D/A) in user state: normal operation
1
PWM (D/A) in test state: correct conversion results unobtainable
(Initial value)
Bit 6—PWM Enable (PWME): Starts or stops the PWM D/A counter (DACNT).
Bit 6
PWME
Description
0
DACNT operates as a 14-bit up-counter
1
DACNT halts at H'0003
(Initial value)
Bits 5 and 4—Reserved: These bits cannot be modified and are always read as 1.
Bit 3—Output Enable B (OEB): Enables or disables output on PWM D/A channel B.
Bit 3
OEB
Description
0
PWM (D/A) channel B output (at the PWX1 pin) is disabled
1
PWM (D/A) channel B output (at the PWX1 pin) is enabled
(Initial value)
Bit 2—Output Enable A (OEA): Enables or disables output on PWM D/A channel A.
Bit 2
OEA
Description
0
PWM (D/A) channel A output (at the PWX0 pin) is disabled
1
PWM (D/A) channel A output (at the PWX0 pin) is enabled
234
(Initial value)
Bit 1—Output Select (OS): Selects the phase of the PWM D/A output.
Bit 1
OS
Description
0
Direct PWM output
1
Inverted PWM output
(Initial value)
Bit 0—Clock Select (CKS): Selects the PWM D/A resolution. If the system clock (ø) frequency
is 10 MHz, resolutions of 100 ns and 200 ns can be selected.
Bit 0
CKS
Description
0
Operates at resolution (T) = system clock cycle time (tcyc )
1
Operates at resolution (T) = system clock cycle time (tcyc ) × 2
10.2.4
(Initial value)
Module Stop Control Register (MSTPCR)
MSTPCRH
Bit
7
6
5
4
3
MSTPCRL
2
1
0
7
6
5
4
3
2
1
0
MSTP15 MSTP14 MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTP8 MSTP7 MSTP6 MSTP5 MSTP4 MSTP3 MSTP2 MSTP1 MSTP0
Initial value
Read/Write
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR comprises two 8-bit readable/writable registers, and is used to perform module stop
mode control.
When the MSTP11 bit is set to 1, 14-bit PWM timer operation is halted and a transition is made to
module stop mode. For details, see section 21.5, Module Stop Mode.
MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in
software standby mode.
MSTPCRH Bit 3—Module Stop (MSTP11): Specifies PWMX module stop mode.
MSTPCRH
Bit 3
MSTP11
Description
0
PWMX module stop mode is cleared
1
PWMX module stop mode is set
(Initial value)
235
10.3
Bus Master Interface
DACNT, DADRA, and DADRB are 16-bit registers. The data bus linking the bus master and the
on-chip supporting modules, however, is only 8 bits wide. When the bus master accesses these
registers, it therefore uses an 8-bit temporary register (TEMP).
These registers are written and read as follows (taking the example of the CPU interface).
• Write
When the upper byte is written, the upper-byte write data is stored in TEMP. Next, when the
lower byte is written, the lower-byte write data and TEMP value are combined, and the
combined 16-bit value is written in the register.
• Read
When the upper byte is read, the upper-byte value is transferred to the CPU and the lower-byte
value is transferred to TEMP. Next, when the lower byte is read, the lower-byte value in
TEMP is transferred to the CPU.
These registers should always be accessed 16 bits at a time using an MOV instruction (by word
access or two consecutive byte accesses), and the upper byte should always be accessed before the
lower byte. Correct data will not be transferred if only the upper byte or only the lower byte is
accessed. Also note that a bit manipulation instruction cannot be used to access these registers.
Figure 10.2 shows the data flow for access to DACNT. The other registers are accessed similarly.
Example 1: Write to DACNT
MOV.W R0, @DACNT
; Write R0 contents to DACNT
Example 2: Read DADRA
MOV.W @DADRA, R0
; Copy contents of DADRA to R0
Table 10.3 Read and Write Access Methods for 16-Bit Registers
Read
Write
Register Name
Word
Byte
Word
Byte
DADRA and DADRB
Yes
Yes
Yes
×
DACNT
Yes
×
Yes
×
Notes: Yes: Permitted type of access. Word access includes successive byte accesses to the
upper byte (first) and lower byte (second).
×:
This type of access may give incorrect results.
236
Upper-Byte Write
CPU
(H'AA)
Upper byte
Module data bus
Bus
interface
TEMP
(H'AA)
DACNTH
(
)
DACNTL
(
)
Lower-Byte Write
CPU
(H'57)
Lower byte
Module data bus
Bus
interface
TEMP
(H'AA)
DACNTH
(H'AA)
DACNTL
(H'57)
Figure 10.2 (a) Access to DACNT (CPU Writes H'AA57 to DACNT)
237
Upper-Byte Read
CPU
(H'AA)
Upper byte
Module data bus
Bus
interface
TEMP
(H'57)
DACNTH
(H'AA)
DACNTL
(H'57)
Lower-Byte Read
CPU
(H'57)
Lower byte
Module data bus
Bus
interface
TEMP
(H'57)
DACNTH
(
)
DACNTL
(
)
Figure 10.2 (b) Access to DACNT (CPU Reads H'AA57 from DACNT)
238
10.4
Operation
A PWM waveform like the one shown in figure 10.3 is output from the PWMX pin. When OS =
0, the value in DADR corresponds to the total width (TL ) of the low (0) pulses output in one
conversion cycle (256 pulses when CFS = 0, 64 pulses when CFS = 1). When OS = 1, the output
waveform is inverted and the DADR value corresponds to the total width (TH) of the high (1)
output pulses. Figure 10.4 shows the types of waveform output available.
1 conversion cycle
(T × 214 (= 16384))
tf
Basic cycle
(T × 64 or T × 256)
tL
T: Resolution
m
TL = ∑ tLn (when OS = 0)
n=1
(When CFS = 0, m = 256; when CFS = 1, m = 64)
Figure 10.3 PWM D/A Operation
Table 10.4 summarizes the relationships of the CKS, CFS, and OS bit settings to the resolution,
base cycle, and conversion cycle. The PWM output remains flat unless DADR contains at least a
certain minimum value. Table 10.4 indicates the range of DADR settings that give an output
waveform like the one in figure 10.3, and lists the conversion cycle length when low-order DADR
bits are kept cleared to 0, reducing the conversion precision to 12 bits or 10 bits.
239
Table 10.4 Settings and Operation (Examples when ø = 10 MHz)
Fixed DADR Bits
Bit Data
Resolution
Base
Conversion TL (if OS = 0)
CKS T (µs)
CFS Cycle (µs) Cycle (µs) TH (if OS = 1)
0
0.1
0
6.4
1638.4
Precision
Conversion
(Bits)
3 2 1 0 Cycle* (µs)
1. Always low (or high) 14
1638.4
(DADR = H'0001 to
H'03FD)
2. (Data value) × T
12
0 0 409.6
10
0 0 0 0 102.4
(DADR = H'0401 to
H'FFFD)
1
25.6
1638.4
1. Always low (or high) 14
1638.4
(DADR = H'0003 to
H'00FF)
2. (Data value) × T
12
0 0 409.6
10
0 0 0 0 102.4
(DADR = H'0103 to
H'FFFF)
1
0.2
0
12.8
3276.8
1. Always low (or high) 14
3276.8
(DADR = H'0001 to
H'03FD)
2. (Data value) × T
12
0 0 819.2
10
0 0 0 0 204.8
(DADR = H'0401 to
H'FFFD)
1
51.2
3276.8
1. Always low (or high) 14
3276.8
(DADR = H'0003 to
H'00FF)
2. (Data value) × T
12
0 0 819.2
10
0 0 0 0 204.8
(DADR = H'0103 to
H'FFFF)
Note: * This column indicates the conversion cycle when specific DADR bits are fixed.
240
1. OS = 0 (DADR corresponds to TL)
a. CFS = 0 [base cycle = resolution (T) × 64]
1 conversion cycle
tf1
tL1
tf2
tf255
tL2
tL3
tL255
tf256
tL256
tf1 = tf2 = tf3 = · · · = tf255 = tf256 = T × 64
tL1 + tL2 + tL3 + · · · + tL255 + tL256 = TL
Figure 10.4 (1) Output Waveform
b. CFS = 1 [base cycle = resolution (T) × 256]
1 conversion cycle
tf1
tL1
tf2
tL2
tf63
tL3
tL63
tf64
tL64
tf1 = tf2 = tf3 = · · · = tf63 = tf64 = T × 256
tL1 + tL2 + tL3 + · · · + tL63 + tL64 = TL
Figure 10.4 (2) Output Waveform
241
2. OS = 1 (DADR corresponds to TH)
a. CFS = 0 [base cycle = resolution (T) × 64]
1 conversion cycle
tf1
tH1
tf2
tf255
tH2
tH3
tH255
tf256
tH256
tf1 = tf2 = tf3 = · · · = tf255 = tf256 = T × 64
tH1 + tH2 + tH3 + · · · + tH255 + tH256 = TH
Figure 10.4 (3) Output Waveform
b. CFS = 1 [base cycle = resolution (T) × 256]
1 conversion cycle
tf1
tH1
tf2
tH2
tf63
tH3
tH63
tf1 = tf2 = tf3 = · · · = tf63 = tf64 = T × 256
tH1 + tH2 + tH3 + · · · + tH63 + tH64 = TH
Figure 10.4 (4) Output Waveform
242
tf64
tH64
Section 11 16-Bit Free-Running Timer
11.1
Overview
The H8S/2128 Series and H8S/2124 Series have a single-channel on-chip 16-bit free-running
timer (FRT) module that uses a 16-bit free-running counter as a time base. Applications of the
FRT module include rectangular-wave output (up to two independent waveforms), input pulse
width measurement, and measurement of external clock periods.
11.1.1
Features
The features of the free-running timer module are listed below.
• Selection of four clock sources
 The free-running counter can be driven by an internal clock source (ø/2, ø/8, or ø/32), or an
external clock input (enabling use as an external event counter).
• Two independent comparators
 Each comparator can generate an independent waveform.
• Four input capture channels
 The current count can be captured on the rising or falling edge (selectable) of an input
signal.
 The four input capture registers can be used separately, or in a buffer mode.
• Counter can be cleared under program control
 The free-running counters can be cleared on compare-match A.
• Seven independent interrupts
 Two compare-match interrupts, four input capture interrupts, and one overflow interrupt
can be requested independently.
• Special functions provided by automatic addition function
 The contents of OCRAR and OCRAF can be added to the contents of OCRA automatically,
enabling a periodic waveform to be generated without software intervention.
 The contents of ICRD can be added automatically to the contents of OCRDM × 2, enabling
input capture operations in this interval to be restricted.
243
11.1.2
Block Diagram
Figure 11.1 shows a block diagram of the free-running timer.
External
clock source
Internal
clock sources
ø/2
ø/8
ø/32
FTCI
Clock select
OCRA R/F (H/L)
+
Clock
OCRA (H/L)
Comparematch A
Comparator A
FTOA
Overflow
FTOB
Clear
Bus interface
FRC (H/L)
Comparematch B
OCRB (H/L)
Control
logic
Input capture
FTIA
ICRA (H/L)
ICRB (H/L)
FTIB
Internal
data bus
Module data bus
Comparator B
ICRC (H/L)
FTIC
ICRD (H/L)
FTID
+
Comparator M
Compare-match M
×1
×2
OCRDM L
TCSR
TIER
TCR
TOCR
ICIA
ICIB
ICIC
ICID
OCIA
OCIB
FOVI
Legend:
OCRA, B:
FRC:
ICRA, B, C, D:
TCSR:
Interrupt signals
Output compare register A, B (16 bits)
Free-running counter (16 bits)
Input capture register A, B, C, D (16 bits)
Timer control/status register (8 bits)
TIER: Timer interrupt enable register (8 bits)
TCR: Timer control register (8 bits)
TOCR: Timer output compare control
register (8 bits)
Figure 11.1 Block Diagram of 16-Bit Free-Running Timer
244
11.1.3
Input and Output Pins
Table 11.1 lists the input and output pins of the free-running timer module.
Table 11.1 Input and Output Pins of Free-Running Timer Module
Name
Abbreviation
I/O
Function
Counter clock input
FTCI
Input
FRC counter clock input
Output compare A
FTOA
Output
Output compare A output
Output compare B
FTOB
Output
Output compare B output
Input capture A
FTIA
Input
Input capture A input
Input capture B
FTIB
Input
Input capture B input
Input capture C
FTIC
Input
Input capture C input
Input capture D
FTID
Input
Input capture D input
245
11.1.4
Register Configuration
Table 11.2 lists the registers of the free-running timer module.
Table 11.2 Register Configuration
Name
Abbreviation
R/W
Timer interrupt enable register
TIER
R/W
2
Initial Value
Address* 1
H'01
H'FF90
H'00
H'FF91
Timer control/status register
TCSR
R/(W)*
Free-running counter
FRC
R/W
H'0000
H'FF92
Output compare register A
OCRA
R/W
H'FFFF
H'FF94* 3
Output compare register B
OCRB
R/W
H'FFFF
H'FF94* 3
Timer control register
TCR
R/W
H'00
H'FF96
Timer output compare control
register
TOCR
R/W
H'00
H'FF97
Input capture register A
ICRA
R
H'0000
H'FF98* 4
Input capture register B
ICRB
R
H'0000
H'FF9A* 4
Input capture register C
ICRC
R
H'0000
H'FF9C* 4
Input capture register D
ICRD
R
H'0000
H'FF9E
Output compare register AR
OCRAR
R/W
H'FFFF
H'FF98* 4
Output compare register AF
OCRAF
R/W
H'FFFF
H'FF9A* 4
Output compare register DM
OCRDM
R/W
H'0000
H'FF9C* 4
Module stop control register
MSTPCRH
R/W
H'3F
H'FF86
MSTPCRL
R/W
H'FF
H'FF87
Notes: 1. Lower 16 bits of the address.
2. Bits 7 to 1 are read-only; only 0 can be written to clear the flags.
Bit 0 is readable/writable.
3. OCRA and OCRB share the same address. Access is controlled by the OCRS
bit in TOCR.
4. ICRA, ICRB, and ICRC share the same addresses with OCRAR, OCRAF, and
OCRDM. Access is controlled by the ICRS bit in TOCR.
246
11.2
Register Descriptions
11.2.1
Free-Running Counter (FRC)
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
FRC is a 16-bit readable/writable up-counter that increments on an internal pulse generated from a
clock source. The clock source is selected by bits CKS1 and CKS0 in TCR.
FRC can also be cleared by compare-match A.
When FRC overflows from H'FFFF to H'0000, the overflow flag (OVF) in TCSR is set to 1.
FRC is initialized to H'0000 by a reset and in hardware standby mode.
11.2.2
Output Compare Registers A and B (OCRA, OCRB)
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/ Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
OCRA and OCRB are 16-bit readable/writable registers, the contents of which are continually
compared with the value in the FRC. When a match is detected, the corresponding output compare
flags (OCFA or OCFB) is set in TCSR.
In addition, if the output enable bit (OEA or OEB) in TOCR is set to 1, when OCR and FRC
values match, the logic level selected by the output level bit (OLVLA or OLVLB) in TOCR is
output at the output compare pin (FTOA or FTOB). Following a reset, the FTOA and FTOB
output levels are 0 until the first compare-match.
OCR is initialized to H'FFFF by a reset and in hardware standby mode.
247
11.2.3
Input Capture Registers A to D (ICRA to ICRD)
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
There are four input capture registers, A to D, each of which is a 16-bit read-only register.
When the rising or falling edge of the signal at an input capture input pin (FTIA to FTID) is
detected, the current FRC value is copied to the corresponding input capture register (ICRA to
ICRD). At the same time, the corresponding input capture flag (ICFA to ICFD) in TCSR is set to
1. The input capture edge is selected by the input edge select bits (IEDGA to IEDGD) in TCR.
ICRC and ICRD can be used as ICRA and ICRB buffer registers, respectively, and made to
perform buffer operations, by means of buffer enable bits A and B (BUFEA, BUFEB) in TCR.
Figure 11.2 shows the connections when ICRC is specified as the ICRA buffer register (BUFEA =
1). When ICRC is used as the ICRA buffer, both rising and falling edges can be specified as
transitions of the external input signal by setting IEDGA ≠ IEDGC. When IEDGA = IEDGC,
either the rising or falling edge is designated. See table 11.3.
Note: The FRC contents are transferred to the input capture register regardless of the value of the
input capture flag (ICF).
IEDGA BUFEA IEDGC
FTIA
Edge detect and
capture signal
generating circuit
ICRC
ICRA
Figure 11.2 Input Capture Buffering (Example)
248
FRC
Table 11.3 Buffered Input Capture Edge Selection (Example)
IEDGA
IEDGC
Description
0
0
Captured on falling edge of input capture A (FTIA)
1
Captured on both rising and falling edges of input capture A (FTIA)
1
(Initial value)
0
1
Captured on rising edge of input capture A (FTIA)
To ensure input capture, the width of the input capture pulse should be at least 1.5 system clock
periods (1.5ø). When triggering is enabled on both edges, the input capture pulse width should be
at least 2.5 system clock periods (2.5ø).
ICR is initialized to H'0000 by a reset and in hardware standby mode.
11.2.4
Output Compare Registers AR and AF (OCRAR, OCRAF)
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
OCRAR and OCRAF are 16-bit readable/writable registers.
When the OCRAMS bit in TOCR is set to 1, the operation of OCRA is changed to include the use
of OCRAR and OCRAF. The contents of OCRAR and OCRAF are automatically added
alternately to OCRA, and the result is written to OCRA. The write operation is performed on the
occurrence of compare-match A. In the first compare-match A after the OCRAMS bit is set to 1,
OCRAF is added.
The operation due to compare-match A varies according to whether the compare-match follows
addition of OCRAR or OCRAF. The value of the OLVLA bit in TOCR is ignored, and 1 is output
on a compare-match A following addition of OCRAF, while 0 is output on a compare-match A
following addition of OCRAR.
When the OCRA automatically addition function is used, do not set internal clock ø/2 as the FRC
counter input clock together with an OCRAR (or OCRAF) value of H'0001 or less.
OCRAR and OCRAF are initialized to H'FFFF by a reset and in hardware standby mode.
249
11.2.5
Output Compare Register DM (OCRDM)
Bit
15
14
13
12
11
10
9
8
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
R/W R/W R/W R/W R/W R/W R/W R/W
OCRDM is a 16-bit readable/writable register in which the upper 8 bits are fixed at H'00.
When the ICRDMS bit in TOCR is set to 1 and the contents of OCRDM are other than H'0000,
the operation of ICRD is changed to include the use of OCRDM. The point at which input capture
D occurs is taken as the start of a mask interval. Next, twice the contents of OCRDM is added to
the contents of ICRD, and the result is compared with the FRC value. The point at which the
values match is taken as the end of the mask interval. New input capture D events are disabled
during the mask interval.
A mask interval is not generated when the ICRDMS bit is set to 1 and the contents of OCRDM are
H'0000.
OCRDM is initialized to H'0000 by a reset and in hardware standby mode.
11.2.6
Timer Interrupt Enable Register (TIER)
Bit
7
6
5
4
3
2
1
0
ICIAE
ICIBE
ICICE
ICIDE
OCIAE
OCIBE
OVIE
—
Initial value
0
0
0
0
0
0
0
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
—
TIER is an 8-bit readable/writable register that enables and disables interrupts.
TIER is initialized to H'01 by a reset and in hardware standby mode.
Bit 7—Input Capture Interrupt A Enable (ICIAE): Selects whether to request input capture
interrupt A (ICIA) when input capture flag A (ICFA) in TCSR is set to 1.
Bit 7
ICIAE
Description
0
Input capture interrupt request A (ICIA) is disabled
1
Input capture interrupt request A (ICIA) is enabled
250
(Initial value)
Bit 6—Input Capture Interrupt B Enable (ICIBE): Selects whether to request input capture
interrupt B (ICIB) when input capture flag B (ICFB) in TCSR is set to 1.
Bit 6
ICIBE
Description
0
Input capture interrupt request B (ICIB) is disabled
1
Input capture interrupt request B (ICIB) is enabled
(Initial value)
Bit 5—Input Capture Interrupt C Enable (ICICE): Selects whether to request input capture
interrupt C (ICIC) when input capture flag C (ICFC) in TCSR is set to 1.
Bit 5
ICICE
Description
0
Input capture interrupt request C (ICIC) is disabled
1
Input capture interrupt request C (ICIC) is enabled
(Initial value)
Bit 4—Input Capture Interrupt D Enable (ICIDE): Selects whether to request input capture
interrupt D (ICID) when input capture flag D (ICFD) in TCSR is set to 1.
Bit 4
ICIDE
Description
0
Input capture interrupt request D (ICID) is disabled
1
Input capture interrupt request D (ICID) is enabled
(Initial value)
Bit 3—Output Compare Interrupt A Enable (OCIAE): Selects whether to request output
compare interrupt A (OCIA) when output compare flag A (OCFA) in TCSR is set to 1.
Bit 3
OCIAE
Description
0
Output compare interrupt request A (OCIA) is disabled
1
Output compare interrupt request A (OCIA) is enabled
(Initial value)
Bit 2—Output Compare Interrupt B Enable (OCIBE): Selects whether to request output
compare interrupt B (OCIB) when output compare flag B (OCFB) in TCSR is set to 1.
Bit 2
OCIBE
Description
0
Output compare interrupt request B (OCIB) is disabled
1
Output compare interrupt request B (OCIB) is enabled
(Initial value)
251
Bit 1—Timer Overflow Interrupt Enable (OVIE): Selects whether to request a free-running
timer overflow interrupt (FOVI) when the timer overflow flag (OVF) in TCSR is set to 1.
Bit 1
OVIE
Description
0
Timer overflow interrupt request (FOVI) is disabled
1
Timer overflow interrupt request (FOVI) is enabled
(Initial value)
Bit 0—Reserved: This bit cannot be modified and is always read as 1.
11.2.7
Timer Control/Status Register (TCSR)
Bit
7
6
5
4
3
2
1
0
ICFA
ICFB
ICFC
ICFD
OCFA
OCFB
OVF
CCLRA
0
0
0
0
R/(W)*
R/(W)*
R/(W)*
R/W
Initial value
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/(W)*
Note: * Only 0 can be written in bits 7 to 1 to clear these flags.
TCSR is an 8-bit register used for counter clear selection and control of interrupt request signals.
TCSR is initialized to H'00 by a reset and in hardware standby mode.
Timing is described in section 11.3, Operation.
Bit 7—Input Capture Flag A (ICFA): This status flag indicates that the FRC value has been
transferred to ICRA by means of an input capture signal. When BUFEA = 1, ICFA indicates that
the old ICRA value has been moved into ICRC and the new FRC value has been transferred to
ICRA.
ICFA must be cleared by software. It is set by hardware, however, and cannot be set by software.
Bit 7
ICFA
Description
0
[Clearing condition]
Read ICFA when ICFA = 1, then write 0 in ICFA
1
[Setting condition]
When an input capture signal causes the FRC value to be transferred to
ICRA
252
(Initial value)
Bit 6—Input Capture Flag B (ICFB): This status flag indicates that the FRC value has been
transferred to ICRB by means of an input capture signal. When BUFEB = 1, ICFB indicates that
the old ICRB value has been moved into ICRD and the new FRC value has been transferred to
ICRB.
ICFB must be cleared by software. It is set by hardware, however, and cannot be set by software.
Bit 6
ICFB
Description
0
[Clearing condition]
(Initial value)
Read ICFB when ICFB = 1, then write 0 in ICFB
1
[Setting condition]
When an input capture signal causes the FRC value to be transferred to ICRB
Bit 5—Input Capture Flag C (ICFC): This status flag indicates that the FRC value has been
transferred to ICRC by means of an input capture signal. When BUFEA = 1, on occurrence of the
signal transition in FTIC (input capture signal) specified by the IEDGC bit, ICFC is set but data is
not transferred to ICRC. Therefore, in buffer operation, ICFC can be used as an external interrupt
signal (by setting the ICICE bit to 1).
ICFC must be cleared by software. It is set by hardware, however, and cannot be set by software.
Bit 5
ICFC
Description
0
[Clearing condition]
(Initial value)
Read ICFC when ICFC = 1, then write 0 in ICFC
1
[Setting condition]
When an input capture signal is received
Bit 4—Input Capture Flag D (ICFD): This status flag indicates that the FRC value has been
transferred to ICRD by means of an input capture signal. When BUFEB = 1, on occurrence of the
signal transition in FTID (input capture signal) specified by the IEDGD bit, ICFD is set but data is
not transferred to ICRD. Therefore, in buffer operation, ICFD can be used as an external interrupt
by setting the ICIDE bit to 1.
ICFD must be cleared by software. It is set by hardware, however, and cannot be set by software.
253
Bit 4
ICFD
Description
0
[Clearing condition]
(Initial value)
Read ICFD when ICFD = 1, then write 0 in ICFD
1
[Setting condition]
When an input capture signal is received
Bit 3—Output Compare Flag A (OCFA): This status flag indicates that the FRC value matches
the OCRA value. This flag must be cleared by software. It is set by hardware, however, and
cannot be set by software.
Bit 3
OCFA
0
Description
[Clearing condition]
(Initial value)
Read OCFA when OCFA = 1, then write 0 in OCFA
1
[Setting condition]
When FRC = OCRA
Bit 2—Output Compare Flag B (OCFB): This status flag indicates that the FRC value matches
the OCRB value. This flag must be cleared by software. It is set by hardware, however, and cannot
be set by software.
Bit 2
OCFB
Description
0
[Clearing condition]
(Initial value)
Read OCFB when OCFB = 1, then write 0 in OCFB
1
[Setting condition]
When FRC = OCRB
Bit 1—Timer Overflow Flag (OVF): This status flag indicates that the FRC has overflowed
(changed from H'FFFF to H'0000). This flag must be cleared by software. It is set by hardware,
however, and cannot be set by software.
254
Bit 1
OVF
Description
0
[Clearing condition]
(Initial value)
Read OVF when OVF = 1, then write 0 in OVF
1
[Setting condition]
When FRC changes from H'FFFF to H'0000
Bit 0—Counter Clear A (CCLRA): This bit selects whether the FRC is to be cleared at comparematch A (when the FRC and OCRA values match).
Bit 0
CCLRA
Description
0
FRC clearing is disabled
1
FRC is cleared at compare-match A
11.2.8
(Initial value)
Timer Control Register (TCR)
Bit
7
6
5
4
3
2
1
0
IEDGA
IEDGB
IEDGC
IEDGD
BUFEA
BUFEB
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
TCR is an 8-bit readable/writable register that selects the rising or falling edge of the input capture
signals, enables the input capture buffer mode, and selects the FRC clock source.
TCR is initialized to H'00 by a reset and in hardware standby mode
Bit 7—Input Edge Select A (IEDGA): Selects the rising or falling edge of the input capture A
signal (FTIA).
Bit 7
IEDGA
Description
0
Capture on the falling edge of FTIA
1
Capture on the rising edge of FTIA
(Initial value)
Bit 6—Input Edge Select B (IEDGB): Selects the rising or falling edge of the input capture B
signal (FTIB).
255
Bit 6
IEDGB
Description
0
Capture on the falling edge of FTIB
1
Capture on the rising edge of FTIB
(Initial value)
Bit 5—Input Edge Select C (IEDGC): Selects the rising or falling edge of the input capture C
signal (FTIC).
Bit 5
IEDGC
Description
0
Capture on the falling edge of FTIC
1
Capture on the rising edge of FTIC
(Initial value)
Bit 4—Input Edge Select D (IEDGD): Selects the rising or falling edge of the input capture D
signal (FTID).
Bit 4
IEDGD
Description
0
Capture on the falling edge of FTID
1
Capture on the rising edge of FTID
(Initial value)
Bit 3—Buffer Enable A (BUFEA): Selects whether ICRC is to be used as a buffer register for
ICRA.
Bit 3
BUFEA
Description
0
ICRC is not used as a buffer register for input capture A
1
ICRC is used as a buffer register for input capture A
(Initial value)
Bit 2—Buffer Enable B (BUFEB): Selects whether ICRD is to be used as a buffer register for
ICRB.
Bit 2
BUFEB
Description
0
ICRD is not used as a buffer register for input capture B
1
ICRD is used as a buffer register for input capture B
256
(Initial value)
Bits 1 and 0—Clock Select (CKS1, CKS0): Select external clock input or one of three internal
clock sources for the FRC. External clock pulses are counted on the rising edge of signals input to
the external clock input pin (FTCI).
Bit 1
Bit 0
CKS1
CKS0
Description
0
0
ø/2 internal clock source
1
ø/8 internal clock source
0
ø/32 internal clock source
1
External clock source (rising edge)
1
11.2.9
(Initial value)
Timer Output Compare Control Register (TOCR)
Bit
7
6
ICRDMS OCRAMS
5
4
3
2
1
0
ICRS
OCRS
OEA
OEB
OLVLA
OLVLB
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
TOCR is an 8-bit readable/writable register that enables output from the output compare pins,
selects the output levels, switches access between output compare registers A and B, controls the
ICRD and OCRA operating mode, and switches access to input capture registers A, B, and C.
TOCR is initialized to H'00 by a reset and in hardware standby mode.
Bit 7—Input Capture D Mode Select (ICRDMS): Specifies whether ICRD is used in the normal
operating mode or in the operating mode using OCRDM.
Bit 7
ICRDMS
Description
0
The normal operating mode is specified for ICRD
1
The operating mode using OCRDM is specified for ICRD
(Initial value)
Bit 6—Output Compare A Mode Select (OCRAMS): Specifies whether OCRA is used in the
normal operating mode or in the operating mode using OCRAR and OCRAF.
257
Bit 6
OCRAMS
Description
0
The normal operating mode is specified for OCRA
1
The operating mode using OCRAR and OCRAF is specified for OCRA
(Initial value)
Bit 5—Input Capture Register Select (ICRS): The same addresses are shared by ICRA and
OCRAR, by ICRB and OCRAF, and by ICRC and OCRDM. The ICRS bit determines which
registers are selected when the shared addresses are read or written to. The operation of ICRA,
ICRB, and ICRC is not affected.
Bit 5
ICRS
Description
0
The ICRA, ICRB, and ICRC registers are selected
1
The OCRAR, OCRAF, and OCRDM registers are selected
(Initial value)
Bit 4—Output Compare Register Select (OCRS): OCRA and OCRB share the same address.
When this address is accessed, the OCRS bit selects which register is accessed. This bit does not
affect the operation of OCRA or OCRB.
Bit 4
OCRS
Description
0
The OCRA register is selected
1
The OCRB register is selected
(Initial value)
Bit 3—Output Enable A (OEA): Enables or disables output of the output compare A signal
(FTOA).
Bit 3
OEA
Description
0
Output compare A output is disabled
1
Output compare A output is enabled
(Initial value)
Bit 2—Output Enable B (OEB): Enables or disables output of the output compare B signal
(FTOB).
258
Bit 2
OEB
Description
0
Output compare B output is disabled
1
Output compare B output is enabled
(Initial value)
Bit 1—Output Level A (OLVLA): Selects the logic level to be output at the FTOA pin in
response to compare-match A (signal indicating a match between the FRC and OCRA values).
When the OCRAMS bit is 1, this bit is ignored.
Bit 1
OLVLA
Description
0
0 output at compare-match A
1
1 output at compare-match A
(Initial value)
Bit 0—Output Level B (OLVLB): Selects the logic level to be output at the FTOB pin in
response to compare-match B (signal indicating a match between the FRC and OCRB values).
Bit 0
OLVLB
Description
0
0 output at compare-match B
1
1 output at compare-match B
11.2.10
(Initial value)
Module Stop Control Register (MSTPCR)
MSTPCRH
Bit
7
6
5
4
3
MSTPCRL
2
1
0
7
6
5
4
3
2
1
0
MSTP15 MSTP14 MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTP8 MSTP7 MSTP6 MSTP5 MSTP4 MSTP3 MSTP2 MSTP1 MSTP0
Initial value
Read/Write
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR, comprising two 8-bit readable/writable registers, performs module stop mode control.
When the MSTP13 bit is set to 1, FRT operation is stopped at the end of the bus cycle, and
module stop mode is entered. For details, see section 21.5, Module Stop Mode.
MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in
software standby mode.
259
MSTPCRH Bit 5—Module Stop (MSTP13): Specifies the FRT module stop mode.
Bit 5
MSTPCRH
Description
0
FRT module stop mode is cleared
1
FRT module stop mode is set
11.3
Operation
11.3.1
FRC Increment Timing
(Initial value)
FRC increments on a pulse generated once for each period of the selected (internal or external)
clock source.
Internal Clock: Any of three internal clocks (ø/2, ø/8, or ø/32) created by division of the system
clock (ø) can be selected by making the appropriate setting in bits CKS1 and CKS0 in TCR.
Figure 11.3 shows the increment timing.
ø
Internal
clock
FRC input
clock
FRC
N–1
N
N+1
Figure 11.3 Increment Timing with Internal Clock Source
External Clock: If external clock input is selected by bits CKS1 and CKS0 in TCR, FRC
increments on the rising edge of the external clock signal.
The pulse width of the external clock signal must be at least 1.5 system clock (ø) periods. The
counter will not increment correctly if the pulse width is shorter than 1.5 system clock periods.
Figure 11.4 shows the increment timing.
260
ø
External
clock input pin
FRC input
clock
FRC
N
N+1
Figure 11.4 Increment Timing with External Clock Source
11.3.2
Output Compare Output Timing
When a compare-match occurs, the logic level selected by the output level bit (OLVLA or
OLVLB) in TOCR is output at the output compare pin (FTOA or FTOB). Figure 11.5 shows the
timing of this operation for compare-match A.
ø
FRC
N
OCRA
N+1
N
N
N+1
N
Compare-match A
signal
Clear*
OLVLA
Output compare A
output pin FTOA
Note: * Vertical arrows (
) indicate instructions executed by software.
Figure 11.5 Timing of Output Compare A Output
261
11.3.3
FRC Clear Timing
FRC can be cleared when compare-match A occurs. Figure 11.6 shows the timing of this
operation.
ø
Compare-match A
signal
FRC
N
H'0000
Figure 11.6 Clearing of FRC by Compare-Match A
11.3.4
Input Capture Input Timing
Input Capture Input Timing: An internal input capture signal is generated from the rising or
falling edge of the signal at the input capture pin, as selected by the corresponding IEDGx (x = A
to D) bit in TCR. Figure 11.7 shows the usual input capture timing when the rising edge is
selected (IEDGx = 1).
ø
Input capture
input pin
Input capture
signal
Figure 11.7 Input Capture Signal Timing (Usual Case)
If the upper byte of ICRA/B/C/D is being read when the corresponding input capture signal
arrives, the internal input capture signal is delayed by one system clock (ø) period. Figure 11.8
shows the timing for this case.
262
ICRA/B/C/D read cycle
T1
T2
ø
Input capture
input pin
Input capture
signal
Figure 11.8 Input Capture Signal Timing (Input Capture Input when ICRA/B/C/D is Read)
Buffered Input Capture Input Timing: ICRC and ICRD can operate as buffers for ICRA and
ICRB.
Figure 11.9 shows how input capture operates when ICRA and ICRC are used in buffer mode and
IEDGA and IEDGC are set to different values (IEDGA = 0 and IEDGC = 1, or IEDG A = 1 and
IEDGC = 0), so that input capture is performed on both the rising and falling edges of FTIA.
ø
FTIA
Input capture
signal
FRC
n
ICRA
M
ICRC
m
n+1
N
N+1
n
n
N
M
M
n
Figure 11.9 Buffered Input Capture Timing (Usual Case)
263
When ICRC or ICRD is used as a buffer register, its input capture flag is set by the selected
transition of its input capture signal. For example, if ICRC is used to buffer ICRA, when the edge
transition selected by the IEDGC bit occurs on the FTIC input capture line, ICFC will be set, and
if the ICIEC bit is set, an interrupt will be requested. The FRC value will not be transferred to
ICRC, however.
In buffered input capture, if the upper byte of either of the two registers to which data will be
transferred (ICRA and ICRC, or ICRB and ICRD) is being read when the input signal arrives,
input capture is delayed by one system clock (ø) period. Figure 11.10 shows the timing when
BUFEA = 1.
Read cycle:
CPU reads ICRA or ICRC
T1
T2
ø
FTIA
Input capture
signal
Figure 11.10 Buffered Input Capture Timing (Input Capture Input when ICRA or ICRC is
Read)
11.3.5
Timing of Input Capture Flag (ICF) Setting
The input capture flag ICFx (x = A, B, C, D) is set to 1 by the internal input capture signal. The
FRC value is simultaneously transferred to the corresponding input capture register (ICRx). Figure
11.11 shows the timing of this operation.
264
ø
Input capture
signal
ICFA/B/C/D
N
FRC
ICRA/B/C/D
N
Figure 11.11 Setting of Input Capture Flag (ICFA/B/C/D)
11.3.6
Setting of Output Compare Flags A and B (OCFA, OCFB)
The output compare flags are set to 1 by an internal compare-match signal generated when the
FRC value matches the OCRA or OCRB value. This compare-match signal is generated at the last
state in which the two values match, just before FRC increments to a new value.
Accordingly, when the FRC and OCR values match, the compare-match signal is not generated
until the next period of the clock source. Figure 11.12 shows the timing of the setting of OCFA
and OCFB.
ø
FRC
N
OCRA or OCRB
N+1
N
Compare-match
signal
OCFA or OCFB
Figure 11.12 Setting of Output Compare Flag (OCFA, OCFB)
265
11.3.7
Setting of FRC Overflow Flag (OVF)
The FRC overflow flag (OVF) is set to 1 when FRC overflows (changes from H'FFFF to H'0000).
Figure 11.13 shows the timing of this operation.
ø
FRC
H'FFFF
H'0000
Overflow signal
OVF
Figure 11.13 Setting of Overflow Flag (OVF)
11.3.8
Automatic Addition of OCRA and OCRAR/OCRAF
When the OCRAMS bit in TOCR is set to 1, the contents of OCRAR and OCRAF are
automatically added to OCRA alternately, and when an OCRA compare-match occurs a write to
OCRA is performed. The OCRA write timing is shown in figure 11.14.
ø
FRC
N
N+1
OCRA
N
N+A
OCRAR, F
A
Compare-match
signal
Figure 11.14 OCRA Automatic Addition Timing
266
11.3.9
ICRD and OCRDM Mask Signal Generation
When the ICRDMS bit in TOCR is set to 1 and the contents of OCRDM are other than H'0000, a
signal that masks the ICRD input capture function is generated.
The mask signal is set by the input capture signal. The mask signal setting timing is shown in
figure 11.15.
The mask signal is cleared by the sum of the ICRD contents and twice the OCRDM contents, and
an FRC compare-match. The mask signal clearing timing is shown in figure 11.16.
ø
Input capture
signal
Input capture
mask signal
Figure 11.15 Input Capture Mask Signal Setting Timing
ø
FRC
N
ICRD +
OCRDM × 2
N+1
N
Compare-match
signal
Input capture
mask signal
Figure 11.16 Input Capture Mask Signal Clearing Timing
267
11.4
Interrupts
The free-running timer can request seven interrupts (three types): input capture A to D (ICIA,
ICIB, ICIC, ICID), output compare A and B (OCIA and OCIB), and overflow (FOVI). Each
interrupt can be enabled or disabled by an enable bit in TIER. Independent signals are sent to the
interrupt controller for each interrupt. Table 11.4 lists information about these interrupts.
Table 11.4 Free-Running Timer Interrupts
Interrupt
Description
DTC Activation
Priority
ICIA
Requested by ICFA
Possible
High
ICIB
Requested by ICFB
Possible
ICIC
Requested by ICFC
Not possible
ICID
Requested by ICFD
Not possible
OCIA
Requested by OCFA
Possible
OCIB
Requested by OCFB
Possible
FOVI
Requested by OVF
Not possible
11.5
Low
Sample Application
In the example below, the free-running timer is used to generate pulse outputs with a 50% duty
cycle and arbitrary phase relationship. The programming is as follows:
• The CCLRA bit in TCSR is set to 1.
• Each time a compare-match interrupt occurs, software inverts the corresponding output level
bit in TOCR (OLVLA or OLVLB).
FRC
H'FFFF
Counter clear
OCRA
OCRB
H'0000
FTOA
FTOB
Figure 11.17 Pulse Output (Example)
268
11.6
Usage Notes
Application programmers should note that the following types of contention can occur in the freerunning timer.
Contention between FRC Write and Clear: If an internal counter clear signal is generated
during the state after an FRC write cycle, the clear signal takes priority and the write is not
performed.
Figure 11.18 shows this type of contention.
FRC write cycle
T1
T2
ø
Address
FRC address
Internal write
signal
Counter clear
signal
FRC
N
H'0000
Figure 11.18 FRC Write-Clear Contention
269
Contention between FRC Write and Increment: If an FRC increment pulse is generated during
the state after an FRC write cycle, the write takes priority and FRC is not incremented.
Figure 11.19 shows this type of contention.
FRC write cycle
T1
T2
ø
Address
FRC address
Internal write signal
FRC input clock
FRC
N
M
Write data
Figure 11.19 FRC Write-Increment Contention
270
Contention between OCR Write and Compare-Match: If a compare-match occurs during the
state after an OCRA or OCRB write cycle, the write takes priority and the compare-match signal
is inhibited.
Figure 11.20 shows this type of contention.
If automatic addition of OCRAR/OCRAF to OCRA is selected, and a compare-match occurs in
the cycle following the OCRA, OCRAR, and OCRAF write cycle, the OCRA, OCRAR, and
OCRAF write takes priority and the compare-match signal is inhibited. Consequently, the result of
the automatic addition is not written to OCRA. The timing is shown in figure 11.21.
OCRA or OCRB write cycle
T1
T2
ø
Address
OCR address
Internal write signal
FRC
N
OCR
N
N+1
M
Write data
Compare-match
signal
Inhibited
Figure 11.20 Contention between OCR Write and Compare-Match
(When Automatic Addition Function Is Not Used)
271
ø
Address
OCRAR (OCRAF)
address
Internal write signal
OCRAR (OCRAF)
Old Data
New Data
Inhibited
Compare-match
signal
FRC
N
OCRA
N
N+1
No automatic addition, as compare-match
signal is inhibited
Figure 11.21 Contention between OCRAR/OCRAF Write and Compare-Match
(When Automatic Addition Function Is Used)
Switching of Internal Clock and FRC Operation: When the internal clock is changed, the
changeover may cause FRC to increment. This depends on the time at which the clock select bits
(CKS1 and CKS0) are rewritten, as shown in table 11.5.
When an internal clock is used, the FRC clock is generated on detection of the falling edge of the
internal clock scaled from the system clock (ø). If the clock is changed when the old source is high
and the new source is low, as in case no. 3 in table 11.5, the changeover is regarded as a falling
edge that triggers the FRC increment clock pulse.
Switching between an internal and external clock can also cause FRC to increment.
272
Table 11.5 Switching of Internal Clock and FRC Operation
Timing of Switchover by
No. Means of CKS1 and CKS0 BitsFRC Operation
1
Switching from
low to low
Clock before
switchover
Clock after
switchover
FRC clock
N+1
N
FRC
CKS bit rewrite
2
Switching from
low to high
Clock before
switchover
Clock after
switchover
FRC clock
FRC
N
N+1
N+2
CKS bit rewrite
3
Switching from
high to low
Clock before
switchover
Clock after
switchover
*
FRC clock
FRC
N
N+1
N+2
CKS bit rewrite
4
Switching from
high to high
Clock before
switchover
Clock after
switchover
FRC clock
FRC
N
N+1
N+2
CKS bit rewrite
Note: * Generated on the assumption that the switchover is a falling edge; FRC is incremented.
273
274
Section 12 8-Bit Timers
12.1
Overview
The H8S/2128 Series and H8S/2124 Series include an 8-bit timer module with two channels
(TMR0 and TMR1). Each channel has an 8-bit counter (TCNT) and two time constant registers
(TCORA and TCORB) that are constantly compared with the TCNT value to detect comparematches. The 8-bit timer module can be used as a multifunction timer in a variety of applications,
such as generation of a rectangular-wave output with an arbitrary duty cycle.
The H8S/2128 Series also has two similar 8-bit timer channels (TMRX and TMRY), and the
H8S/2124 Series has one (TMRY). These channels can be used in a connected configuration using
the timer connection function. TMRX and TMRY have greater input/output and interrupt function
related restrictions than TMR0 and TMR1.
12.1.1
Features
• Selection of clock sources
 TMR0, TMR1: The counter input clock can be selected from six internal clocks and an
external clock (enabling use as an external event counter).
 TMRX, TMRY: The counter input clock can be selected from three internal clocks and an
external clock (enabling use as an external event counter).
• Selection of three ways to clear the counters
 The counters can be cleared on compare-match A or B, or by an external reset signal.
• Timer output controlled by two compare-match signals
 The timer output signal in each channel is controlled by two independent compare-match
signals, enabling the timer to be used for various applications, such as the generation of
pulse output or PWM output with an arbitrary duty cycle.
(Note: TMRY does not have a timer output pin.)
• Cascading of the two channels (TMR0, TMR1)
 Operation as a 16-bit timer can be performed using channel 0 as the upper half and channel
1 as the lower half (16-bit count mode).
 Channel 1 can be used to count channel 0 compare-match occurrences (compare-match
count mode).
• Multiple interrupt sources for each channel
 TMR0, TMR1, TMRY: Two compare-match interrupts and one overflow interrupt can be
requested independently.
 TMRX: One input capture source is available.
275
12.1.2
Block Diagram
Figure 12.1 shows a block diagram of the 8-bit timer module (TMR0 and TMR1).
TMRX and TMRY have a similar configuration, but cannot be cascaded. TMRX also has an input
capture function. For details, see section 13, Timer Connection.
External clock
sources
Internal clock
sources
TMCI0
TMCI1
TMR0
ø/8, ø/2
ø/64, ø/32
ø/1024, ø/256
TMR1
ø/8, ø/2
ø/64, ø/128
ø/1024, ø/2048
TMRX
ø
ø/2
ø/4
TMRY
ø/4
ø/256
ø/2048
Clock 1
Clock 0
Clock select
TCORA0
Compare-match A1
Compare-match A0 Comparator A0
Comparator A1
TCNT1
TCNT0
Clear 0
Clear 1
Compare-match B1
Compare-match B0 Comparator B0
TMO1
TMRI1
Comparator B1
Control logic
TCORB0
TCORB1
TCSR0
TCSR1
TCR0
TCR1
CMIA0
CMIB0
OVI0
CMIA1
CMIB1
OVI1
Interrupt signals
Figure 12.1 Block Diagram of 8-Bit Timer Module
276
Internal bus
Overflow 1
Overflow 0
TMO0
TMRI0
TCORA1
12.1.3
Pin Configuration
Table 12.1 summarizes the input and output pins of the 8-bit timer module.
Table 12.1 8-Bit Timer Input and Output Pins
Channel
Name
Symbol*
I/O
Function
0
Timer output
TMO0
Output
Output controlled by compare-match
Timer clock input
TMCI0
Input
External clock input for the counter
Timer reset input
TMRI0
Input
External reset input for the counter
Timer output
TMO1
Output
Output controlled by compare-match
Timer clock input
TMCI1
Input
External clock input for the counter
Timer reset input
TMRI1
Input
External reset input for the counter
Timer output
TMOX
Output
Output controlled by compare-match
Timer clock/
reset input
HFBACKI/TMIX Input
(TMCIX/TMRIX)
External clock/reset input for the
counter
Timer clock/reset
input
VSYNCI/TMIY Input
(TMCIY/TMRIY)
External clock/reset input for the
counter
1
X
Y
Note: * The abbreviations TMO, TMCI, and TMRI are used in the text, omitting the channel number.
Channel X and Y I/O pins have the same internal configuration as channels 0 and 1, and
therefore the same abbreviations are used.
277
12.1.4
Register Configuration
Table 12.2 summarizes the registers of the 8-bit timer module.
Table 12.2 8-Bit Timer Registers
Channel
Name
Abbreviation* 3 R/W
0
Timer control register 0
TCR0
1
Common
Y
2
Address* 1
H'00
H'FFC8
Timer control/status register 0
TCSR0
R/(W)*
H'00
H'FFCA
Time constant register A0
TCORA0
R/W
H'FF
H'FFCC
Time constant register B0
TCORB0
R/W
H'FF
H'FFCE
Time counter 0
TCNT0
R/W
H'00
H'FFD0
Timer control register 1
TCR1
R/W
H'00
H'FFC9
Timer control/status register 1
TCSR1
R/(W)*2
H'10
H'FFCB
Time constant register A1
TCORA1
R/W
H'FF
H'FFCD
Time constant register B1
TCORB1
R/W
H'FF
H'FFCF
Timer counter 1
TCNT1
R/W
H'00
H'FFD1
Serial/timer control register
STCR
R/W
H'00
H'FFC3
Module stop control register
X
R/W
Initial value
MSTPCRH
R/W
H'3F
H'FF86
MSTPCRL
R/W
H'FF
H'FF87
Timer connection register S
TCONRS
R/W
H'00
H'FFFE
Timer control register X
TCRX
R/W
H'00
H'FFF0
Timer control/status register X
TCSRX
R/(W)*2
H'00
H'FFF1
Time constant register AX
TCORAX
R/W
H'FF
H'FFF6
Time constant register BX
TCORBX
R/W
H'FF
H'FFF7
Timer counter X
TCNTX
R/W
H'00
H'FFF4
Time constant register C
TCORC
R/W
H'FF
H'FFF5
Input capture register R
TICRR
R
H'00
H'FFF2
Input capture register F
TICRF
R
H'00
H'FFF3
Timer control register Y
TCRY
R/W
H'00
H'FFF0
Timer control/status register Y
TCSRY
R/(W)*2
H'00
H'FFF1
Time constant register AY
TCORAY
R/W
H'FF
H'FFF2
Time constant register BY
TCORBY
R/W
H'FF
H'FFF3
Timer counter Y
TCNTY
R/W
H'00
H'FFF4
Timer input select register
TISR
R/W
H'FE
H'FFF5
Notes: 1. Lower 16 bits of the address.
2. Only 0 can be written in bits 7 to 5, to clear these flags.
3. The abbreviations TCR, TCSR, TCORA, TCORB, and TCNT are used in the text,
omitting the channel designation (0, 1, X, or Y).
278
Each pair of registers for channel 0 and channel 1 comprises a 16-bit register with the upper 8 bits
for channel 0 and the lower 8 bits for channel 1, so they can be accessed together by word access.
(Access is not divided into two 8-bit accesses.)
Certain of the channel X and channel Y registers are assigned to the same address. The TMRX/Y
bit in TCONRS determines which register is accessed.
12.2
Register Descriptions
12.2.1
Timer Counter (TCNT)
TCNT0
TCNT1
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
TCNTX,TCNTY
Bit
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Each TCNT is an 8-bit readable/writable up-counter.
TCNT0 and TCNT1 comprise a single 16-bit register, so they can be accessed together by word
access.
TCNT increments on pulses generated from an internal or external clock source. This clock source
is selected by clock select bits CKS2 to CKS0 in TCR.
TCNT can be cleared by an external reset input signal or compare-match signal. Counter clear bits
CCLR1 and CCLR0 in TCR select the method of clearing.
When TCNT overflows from H'FF to H'00, the overflow flag (OVF) in TCSR is set to 1.
The timer counters are initialized to H'00 by a reset and in hardware standby mode.
279
12.2.2
Time Constant Register A (TCORA)
TCORA0
TCORA1
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
TCORAX, TCORAY
Bit
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
TCORA is an 8-bit readable/writable register.
TCORA0 and TCORA1 comprise a single 16-bit register, so they can be accessed together by
word access.
TCORA is continually compared with the value in TCNT. When a match is detected, the
corresponding compare-match flag A (CMFA) in TCSR is set. Note, however, that comparison is
disabled during the T2 state of a TCORA write cycle.
The timer output can be freely controlled by these compare-match signals and the settings of
output select bits OS1 and OS0 in TCSR.
TCORA is initialized to H'FF by a reset and in hardware standby mode.
280
12.2.3
Time Constant Register B (TCORB)
TCORB0
TCORB1
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
TCORBX, TCORBY
Bit
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
TCORB is an 8-bit readable/writable register. TCORB0 and TCORB1 comprise a single 16-bit
register, so they can be accessed together by word access.
TCORB is continually compared with the value in TCNT. When a match is detected, the
corresponding compare-match flag B (CMFB) in TCSR is set. Note, however, that comparison is
disabled during the T2 state of a TCORB write cycle.
The timer output can be freely controlled by these compare-match signals and the settings of
output select bits OS3 and OS2 in TCSR.
TCORB is initialized to H'FF by a reset and in hardware standby mode.
12.2.4
Timer Control Register (TCR)
Bit
7
6
5
4
3
2
1
0
CMIEB
CMIEA
OVIE
CCLR1
CCLR0
CKS2
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
TCR is an 8-bit readable/writable register that selects the clock source and the time at which
TCNT is cleared, and enables interrupts.
TCR is initialized to H'00 by a reset and in hardware standby mode.
For details of the timing, see section 12.3, Operation.
281
Bit 7—Compare-Match Interrupt Enable B (CMIEB): Selects whether the CMFB interrupt
request (CMIB) is enabled or disabled when the CMFB flag in TCSR is set to 1.
Note that a CMIB interrupt is not requested by TMRX, regardless of the CMIEB value.
Bit 7
CMIEB
Description
0
CMFB interrupt request (CMIB) is disabled
1
CMFB interrupt request (CMIB) is enabled
(Initial value)
Bit 6—Compare-Match Interrupt Enable A (CMIEA): Selects whether the CMFA interrupt
request (CMIA) is enabled or disabled when the CMFA flag in TCSR is set to 1.
Note that a CMIA interrupt is not requested by TMRX, regardless of the CMIEA value.
Bit 6
CMIEA
Description
0
CMFA interrupt request (CMIA) is disabled
1
CMFA interrupt request (CMIA) is enabled
(Initial value)
Bit 5—Timer Overflow Interrupt Enable (OVIE): Selects whether the OVF interrupt request
(OVI) is enabled or disabled when the OVF flag in TCSR is set to 1.
Note that an OVI interrupt is not requested by TMRX, regardless of the OVIE value.
Bit 5
OVIE
Description
0
OVF interrupt request (OVI) is disabled
1
OVF interrupt request (OVI) is enabled
(Initial value)
Bits 4 and 3—Counter Clear 1 and 0 (CCLR1, CCLR0): These bits select the method by which
the timer counter is cleared: by compare-match A or B, or by an external reset input.
Bit 4
Bit 3
CCLR1
CCLR0
Description
0
0
Clearing is disabled
1
Cleared on compare-match A
0
Cleared on compare-match B
1
Cleared on rising edge of external reset input
1
282
(Initial value)
Bits 2 to 0—Clock Select 2 to 0 (CKS2 to CKS0): These bits select whether the clock input to
TCNT is an internal or external clock.
The input clock can be selected from either six or three clocks, all divided from the system clock
(ø). The falling edge of the selected internal clock triggers the count.
When use of an external clock is selected, three types of count can be selected: at the rising edge,
the falling edge, and both rising and falling edges.
Some functions differ between channel 0 and channel 1, because of the cascading function.
TCR
STCR
Bit 2 Bit 1 Bit 0 Bit 1
Bit 0
Channel CKS2 CKS1 CKS0 ICKS1 ICKS0 Description
0
1
0
0
0
—
—
Clock input disabled
(Initial value)
0
0
1
—
0
ø/8 internal clock source, counted on the falling edge
0
0
1
—
1
ø/2 internal clock source, counted on the falling edge
0
1
0
—
0
ø/64 internal clock source, counted on the falling
edge
0
1
0
—
1
ø/32 internal clock source, counted on the falling
edge
0
1
1
—
0
ø/1024 internal clock source, counted on the falling
edge
0
1
1
—
1
ø/256 internal clock source, counted on the falling
edge
1
0
0
—
—
Counted on TCNT1 overflow signal*
0
0
0
—
—
Clock input disabled
0
0
1
0
—
ø/8 internal clock source, counted on the falling edge
0
0
1
1
—
ø/2 internal clock source, counted on the falling edge
0
1
0
0
—
ø/64 internal clock source, counted on the falling
edge
0
1
0
1
—
ø/128 internal clock source, counted on the falling
edge
0
1
1
0
—
ø/1024 internal clock source, counted on the falling
edge
0
1
1
1
—
ø/2048 internal clock source, counted on the falling
edge
1
0
0
—
—
Counted on TCNT0 compare-match A*
(Initial value)
283
TCR
STCR
Bit 2 Bit 1 Bit 0 Bit 1
Bit 0
Channel CKS2 CKS1 CKS0 ICKS1 ICKS0 Description
X
0
0
0
—
—
Clock input disabled
0
0
1
—
—
Counted on ø internal clock source
0
1
0
—
—
ø/2 internal clock source, counted on the falling edge
0
1
1
—
—
ø/4 internal clock source, counted on the falling edge
1
0
0
—
—
Clock input disabled
0
0
0
—
—
Clock input disabled
0
0
1
—
—
ø/4 internal clock source, counted on the falling edge
0
1
0
—
—
ø/256 internal clock source, counted on the falling
edge
0
1
1
—
—
ø/2048 internal clock source, counted on the falling
edge
1
0
0
—
—
Clock input disabled
Common 1
0
1
—
—
External clock source, counted at rising edge
1
1
0
—
—
External clock source, counted at falling edge
1
1
1
—
—
External clock source, counted at both rising and
falling edges
Y
(Initial value)
(Initial value)
Note: * If the count input of channel 0 is the TCNT1 overflow signal and that of channel 1 is the
TCNT0 compare-match signal, no incrementing clock will be generated. Do not use this
setting.
284
12.2.5
Timer Control/Status Register (TCSR)
TCSR0
Bit
7
6
5
4
3
2
1
0
CMFB
CMFA
OVF
ADTE
OS3
OS2
OS1
OS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
CMFB
CMFA
OVF
—
OS3
OS2
OS1
OS0
Initial value
0
0
0
1
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
—
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
CMFB
CMFA
OVF
ICF
OS3
OS2
OS1
OS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
CMFB
CMFA
OVF
ICIE
OS3
OS2
OS1
OS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/W
R/W
R/W
R/W
R/W
TCSR1
Bit
TCSRX
Bit
TCSRY
Bit
Note: * Only 0 can be written in bits 7 to 5, and in bit 4 in TCSRX, to clear these flags.
TCSR is an 8-bit register that indicates compare-match and overflow statuses (and input capture
status in TMRX only), and controls compare-match output.
TCSR0, TCSRX, and TCSRY are initialized to H'00, and TCSR1 is initialized to H'10, by a reset
and in hardware standby mode.
Bit 7—Compare-Match Flag B (CMFB): Status flag indicating whether the values of TCNT and
TCORB match.
285
Bit 7
CMFB
Description
0
[Clearing conditions]
1
•
Read CMFB when CMFB = 1, then write 0 in CMFB
•
When the DTC is activated by a CMIB interrupt
(Initial value)
[Setting condition]
When TCNT = TCORB
Bit 6—Compare-match Flag A (CMFA): Status flag indicating whether the values of TCNT and
TCORA match.
Bit 6
CMFA
Description
0
[Clearing conditions]
1
•
Read CMFA when CMFA = 1, then write 0 in CMFA
•
When the DTC is activated by a CMIA interrupt
(Initial value)
[Setting condition]
When TCNT = TCORA
Bit 5 —Timer Overflow Flag (OVF): Status flag indicating that TCNT has overflowed (changed
from H'FF to H'00).
Bit 5
OVF
Description
0
[Clearing condition]
(Initial value)
Read OVF when OVF = 1, then write 0 in OVF
1
[Setting condition]
When TCNT overflows from H'FF to H'00
TCSR0
Bit 4—A/D Trigger Enable (ADTE): Enables or disables A/D converter start requests by
compare-match A.
Bit 4
ADTE
Description
0
A/D converter start requests by compare-match A are disabled
1
A/D converter start requests by compare-match A are enabled
286
(Initial value)
TCSR1
Bit 4—Reserved: This bit cannot be modified and is always read as 1.
TCSRX
Bit 4—Input Capture Flag (ICF): Status flag that indicates detection of a rising edge followed
by a falling edge in the external reset signal after the ICST bit in TCONRI has been set to 1.
Bit 4
ICF
Description
0
[Clearing condition]
(Initial value)
Read ICF when ICF = 1, then write 0 in ICF
1
[Setting condition]
When a rising edge followed by a falling edge is detected in the external reset signal
after the ICST bit in TCONRI has been set to 1
TCSRY
Bit 4—Input Capture Interrupt Enable (ICIE): Selects enabling or disabling of the interrupt
request by ICF (ICIX) when the ICF bit in TCSRX is set to 1.
Bit 4
ICIE
Description
0
Interrupt request by ICF (ICIX) is disabled
1
Interrupt request by ICF (ICIX) is enabled
(Initial value)
Bits 3 to 0—Output Select 3 to 0 (OS3 to OS0): These bits specify how the timer output level is
to be changed by a compare-match of TCOR and TCNT.
OS3 and OS2 select the effect of compare-match B on the output level, OS1 and OS0 select the
effect of compare-match A on the output level, and both of them can be controlled independently.
Note, however, that priorities are set such that: trigger output > 1 output > 0 output. If comparematches occur simultaneously, the output changes according to the compare-match with the higher
priority.
Timer output is disabled when bits OS3 to OS0 are all 0.
After a reset, the timer output is 0 until the first compare-match occurs.
287
Bit 3
Bit 2
OS3
OS2
Description
0
0
No change when compare-match B occurs
1
0 is output when compare-match B occurs
0
1 is output when compare-match B occurs
1
Output is inverted when compare-match B occurs (toggle output)
1
(Initial value)
Bit 1
Bit 0
OS1
OS0
Description
0
0
No change when compare-match A occurs
1
0 is output when compare-match A occurs
0
1 is output when compare-match A occurs
1
Output is inverted when compare-match A occurs (toggle output)
1
12.2.6
(Initial value)
Serial/Timer Control Register (STCR)
7
6
5
4
3
2
1
0
—
IICX1
IICX0
IICE
FLSHE
—
ICKS1
ICKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
STCR is an 8-bit readable/writable register that controls register access, the IIC operating mode
(when the on-chip IIC option is included), and on-chip flash memory (in F-ZTAT versions), and
also selects the TCNT input clock.
For details on functions not related to the 8-bit timers, see section 3.2.4, Serial/Timer Control
Register (STCR), and the descriptions of the relevant modules. If a module controlled by STCR is
not used, do not write 1 to the corresponding bit.
STCR is initialized to H'00 by a reset and in hardware standby mode.
Bit 7—Reserved: Do not write 1 to this bit.
Bits 6 and 5—I2C Transfer Rate Select 1 and 0 (IICX1, IICX0): These bits control the
operation of the I2C bus interface when the IIC option is included on-chip. For details see section
16.2.7, Serial/Timer Control Register (STCR).
288
Bit 4—I2C Master Enable (IICE): Controls CPU access to the I2C bus interface data and control
registers, PWMX data and control registers, and SCI control registers. For details see section
3.2.4, Serial /Timer Control Register (STCR).
Bit 3—Flash Memory Control Register Enable (FLSHE): Controls CPU access to the flash
memory control registers, power-down state control registers, and peripheral module control
registers. For details see section 3.2.4, Serial /Timer Control Register (STCR).
Bit 2—Reserved: Do not write 1 to this bit.
Bits 1 and 0—Internal Clock Select 1 and 0 (ICKS1, ICKS0): These bits, together with bits
CKS2 to CKS0 in TCR, select the clock to be input to TCNT. For details, see section 12.2.4,
Timer Control Register.
12.2.7
System Control Register (SYSCR)
Bit
7
6
5
4
3
2
1
0
CS2E
IOSE
INTM1
INTM0
XRST
NMIEG
HIE
RAME
Initial value
0
0
0
0
1
0
0
1
Read/Write
R/W
R/W
R
R/W
R
R/W
R/W
R/W
Only bit 1 is described here. For details on functions not related to the 8-bit timers, see sections
3.2.2 and 5.2.1, System Control Register (SYSCR), and the descriptions of the relevant modules.
Bit 1—Host Interface Enable (HIE): Controls CPU access to 8-bit timer (channel X and Y) data
registers and control registers, and timer connection control registers.
Bit 1
HIE
Description
0
CPU access to 8-bit timer (channel X and Y) data registers and control
registers, and timer connection control registers, is enabled
1
CPU access to 8-bit timer (channel X and Y) data registers and control registers, and
timer connection control registers, is disabled
(Initial value)
289
12.2.8
Timer Connection Register S (TCONRS)
7
Bit
6
5
4
3
2
1
0
TMRX/Y ISGENE HOMOD1HOMOD0 VOMOD1 VOMOD0 CLMOD1 CLMOD0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
TCONRS is an 8-bit readable/writable register that controls access to the TMRX and TMRY
registers and timer connection operation.
TCONRS is initialized to H'00 by a reset and in hardware standby mode.
Bit 7—TMRX/TMRY Access Select (TMRX/Y): The TMRX and TMRY registers can only be
accessed when the HIE bit in SYSCR is cleared to 0. In the H8S/2128 Series, some of the TMRX
registers and the TMRY registers are assigned to the same memory space addresses (H'FFF0 to
H'FFF5), and the TMRX/Y bit determines which registers are accessed. In the H8S/2124 Series,
there is no control of TMRY register access by this bit.
Accessible Registers
Bit 7
TMRX/Y
H'FFF0
H'FFF1
H'FFF2
H'FFF3
H'FFF4
H'FFF5
H'FFF6
0
TCRX
(Initial value) (TMRX)
TCSRX
(TMRX)
TICRR
(TMRX)
TICRF
(TMRX)
TCNTX
(TMRX)
TCORC
(TMRX)
TCORAX TCORBX
(TMRX) (TMRX)
1
TCSRY
(TMRY)
TCORAY TCORBY TCNTY
(TMRY) (TMRY) (TMRY)
TISR
(TMRY)
TCRY
(TMRY)
12.2.9
H'FFF7
Input Capture Register (TICR) [TMRX Additional Function]
Bit
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
Read/Write
—
—
—
—
—
—
—
—
TICR is an 8-bit internal register to which the contents of TCNT are transferred on the falling edge
of external reset input. The CPU cannot read or write to TICR directly.
The TICR function is used in timer connection. For details, see section 13, Timer Connection.
290
12.2.10
Time Constant Register C (TCORC) [TMRX Additional Function]
7
Bit
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
TCORC is an 8-bit readable/writable register. The sum of the contents of TCORC and TICR is
continually compared with the value in TCNT. When a match is detected, a compare-match C
signal is generated. Note, however, that comparison is disabled during the T2 state of a TCORC
write cycle and a TICR input capture cycle.
TCORC is initialized to H'FF by a reset and in hardware standby mode.
The TCORC function is used in timer connection. For details, see section 13, Timer Connection.
12.2.11
Input Capture Registers R and F (TICRR, TICRF) [TMRX Additional Functions]
Bit
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
TICRR and TICRF are 8-bit read-only registers. When the ICST bit in TCONRI is set to 1,
TICRR and TICRF capture the contents of TCNT successively on the rise and fall of the external
reset input. When one capture operation ends, the ICST bit is cleared to 0.
TICRR and TICRF are each initialized to H'00 by a reset and in hardware standby mode.
The TICRR and TICRF functions are used in timer connection. For details, see 12.3.6 Input
Capture Operation and section 13, Timer Connection.
291
12.2.12
Timer Input Select Register (TISR) [TMRY Additional Function]
7
6
5
4
3
2
1
0
—
—
—
—
—
—
—
IS
Initial value
1
1
1
1
1
1
1
0
Read/Write
—
—
—
—
—
—
—
R/W
Bit
TISR is an 8-bit readable/writable register that selects the external clock/reset signal source for the
counter.
TISR is initialized to H'FE by a reset and in hardware standby mode.
Bits 7 to 1—Reserved: Do not write 0 to these bits.
Bit 0—Input Select (IS): Selects the internal synchronization signal (IVG signal) or the timer
clock/reset input pin (VSYNCI/TMIY (TMCIY/TMRIY)) as the external clock/reset signal source
for the counter.
Bit 0
IS
Description
0
IVG signal is selected (H8S/2128 Series)
External clock/reset input is disabled (H8S/2124 Series)
1
VSYNCI/TMIY (TMCIY/TMRIY) is selected
292
(Initial value)
12.2.13
Module Stop Control Register (MSTPCR)
MSTPCRH
Bit
7
6
5
4
3
MSTPCRL
2
1
0
7
6
5
4
3
2
1
0
MSTP15 MSTP14 MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTP8 MSTP7 MSTP6 MSTP5 MSTP4 MSTP3 MSTP2 MSTP1 MSTP0
Initial value
Read/Write
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR comprises two 8-bit readable/writable registers, and is used to perform module stop
mode control.
When the MSTP12 bit or MSTP8 bit is set to 1, 8-bit timer operation is halted on channels 0 and 1
or channels X and Y, respectively, and a transition is made to module stop mode. For details, see
section 21.5, Module Stop Mode.
MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in
software standby mode.
MSTPCRH Bit 4—Module Stop (MSTP12): Specifies 8-bit timer (channel 0/1) module stop
mode.
MSTPCRH
Bit 4
MSTP12
Description
0
8-bit timer (channel 0/1) module stop mode is cleared
1
8-bit timer (channel 0/1) module stop mode is set
(Initial value)
MSTPCRH Bit 0—Module Stop (MSTP8): Specifies 8-bit timer (channel X/Y) and timer
connection module stop mode.
MSTPCRH
Bit 0
MSTP8
Description
0
8-bit timer (channel X/Y) and timer connection module stop mode is cleared
1
8-bit timer (channel X/Y) and timer connection module stop mode
is set
(Initial value)
293
12.3
Operation
12.3.1
TCNT Incrementation Timing
TCNT is incremented by input clock pulses (either internal or external).
Internal Clock: An internal clock created by dividing the system clock (ø) can be selected by
setting bits CKS2 to CKS0 in TCR. Figure 12.2 shows the count timing.
ø
Internal clock
TCNT input
clock
TCNT
N–1
N
N+1
Figure 12.2 Count Timing for Internal Clock Input
External Clock: Three incrementation methods can be selected by setting bits CKS2 to CKS0 in
TCR: at the rising edge, the falling edge, and both rising and falling edges.
Note that the external clock pulse width must be at least 1.5 states for incrementation at a single
edge, and at least 2.5 states for incrementation at both edges. The counter will not increment
correctly if the pulse width is less than these values.
Figure 12.3 shows the timing of incrementation at both edges of an external clock signal.
294
ø
External clock
input pin
TCNT input
clock
TCNT
N–1
N
N+1
Figure 12.3 Count Timing for External Clock Input
12.3.2
Compare-Match Timing
Setting of Compare-Match Flags A and B (CMFA, CMFB): The CMFA and CMFB flags in
TCSR are set to 1 by a compare-match signal generated when the TCOR and TCNT values match.
The compare-match signal is generated at the last state in which the match is true, just before the
timer counter is updated.
Therefore, when TCOR and TCNT match, the compare-match signal is not generated until the
next incrementation clock input. Figure 12.4 shows this timing.
ø
TCNT
N
TCOR
N
N+1
Compare-match
signal
CMF
Figure 12.4 Timing of CMF Setting
295
Timer Output Timing: When compare-match A or B occurs, the timer output changes as
specified by the output select bits (OS3 to OS0) in TCSR. Depending on these bits, the output can
remain the same, be set to 0, be set to 1, or toggle.
Figure 12.5 shows the timing when the output is set to toggle at compare-match A.
ø
Compare-match A
signal
Timer output
pin
Figure 12.5 Timing of Timer Output
Timing of Compare-Match Clear: TCNT is cleared when compare-match A or B occurs,
depending on the setting of the CCLR1 and CCLR0 bits in TCR. Figure 12.6 shows the timing of
this operation.
ø
Compare-match
signal
TCNT
N
Figure 12.6 Timing of Compare-Match Clear
296
H'00
12.3.3
TCNT External Reset Timing
TCNT is cleared at the rising edge of an external reset input, depending on the settings of the
CCLR1 and CCLR0 bits in TCR. The width of the clearing pulse must be at least 1.5 states. Figure
12.7 shows the timing of this operation.
ø
External reset
input pin
Clear signal
TCNT
N–1
N
H'00
Figure 12.7 Timing of Clearing by External Reset Input
12.3.4
Timing of Overflow Flag (OVF) Setting
OVF in TCSR is set to 1 when the timer count overflows (changes from H'FF to H'00). Figure
12.8 shows the timing of this operation.
ø
TCNT
H'FF
H'00
Overflow signal
OVF
Figure 12.8 Timing of OVF Setting
297
12.3.5
Operation with Cascaded Connection
If bits CKS2 to CKS0 in either TCR0 or TCR1 are set to B'100, the 8-bit timers of the two
channels are cascaded. With this configuration, a single 16-bit timer can be used (16-bit timer
mode) or compare-matches of 8-bit channel 0 can be counted by the timer of channel 1 (comparematch count mode). In this case, the timer operates as described below.
16-Bit Count Mode: When bits CKS2 to CKS0 in TCR0 are set to B'100, the timer functions as a
single 16-bit timer with channel 0 occupying the upper 8 bits and channel 1 occupying the lower 8
bits.
• Setting of compare-match flags
 The CMF flag in TCSR0 is set to 1 when a 16-bit compare-match occurs.
 The CMF flag in TCSR1 is set to 1 when a lower 8-bit compare-match occurs.
• Counter clear specification
 If the CCLR1 and CCLR0 bits in TCR0 have been set for counter clear at compare-match,
the 16-bit counter (TCNT0 and TCNT1 together) is cleared when a 16-bit compare-match
occurs. The 16-bit counter (TCNT0 and TCNT1 together) is cleared even if counter clear
by the TMRI0 pin has also been set.
 The settings of the CCLR1 and CCLR0 bits in TCR1 are ignored. The lower 8 bits cannot
be cleared independently.
• Pin output
 Control of output from the TMO0 pin by bits OS3 to OS0 in TCSR0 is in accordance with
the 16-bit compare-match conditions.
 Control of output from the TMO1 pin by bits OS3 to OS0 in TCSR1 is in accordance with
the lower 8-bit compare-match conditions.
Compare-Match Count Mode: When bits CKS2 to CKS0 in TCR1 are B'100, TCNT1 counts
compare-match A’s for channel 0.
Channels 0 and 1 are controlled independently. Conditions such as setting of the CMF flag,
generation of interrupts, output from the TMO pin, and counter clearing are in accordance with the
settings for each channel.
Usage Note: If the 16-bit count mode and compare-match count mode are set simultaneously, the
input clock pulses for TCNT0 and TCNT1 are not generated and thus the counters will stop
operating. Simultaneous setting of these two modes should therefore be avoided.
298
12.3.6
Input Capture Operation
TMRX has input capture registers(TICR,TICRR,TICRF). Using TICRR and TICRF, capture
operation is performed at once and narrow pulse width can be measured under the control of ICST
bit in TCONRI register in timer connection.
When TMRIX detects rising edge and falling edge sequentially after ICTST is set to 1, current
values of TCNT registers are transferred to TICRR and TICRF, and ICST bit is cleared to 0.
Input signal to the TMRIX is switched by setting other bits in TCONRI register.
(1) Input capture input timing
Figure 12.9 shows the operation timing when input capture function is enabled.
φ
TMRIX
Input capture
signal
TCNTX
n
TICRR
M
TICRF
m
n+1
n
N
N+1
n
m
N
Figure 12.9 Timing of Input Capture Operation
If an input capture input occurs at the time when TICRR or TICRF is read, input capture signal is
delayed one system clock(φ) period.
299
T1
TICRR, TICRF read cycle
T2
φ
TMRIX
Input capture
signal
Figure 12.10 Timing of Input Capture Signal (Input Capture Input Occurs When TICRR or
TICRF is Read)
(2) Selection of input capture input signal
Input signal to the TMRIX is switched by the setting of the bits in TCONRI register in timer
connection.
Figure 12.11 and figure 12.12 shows the input capture signal selection.
For details, see 13.2.1 Timer Connection Register I (TCONRI)
TMRX
TMIX pin
Polarity
inversion
Signal
selection
TMRI1 pin
Polarity
inversion
TMCI1 pin
Polarity
inversion
HFINV,
HIINV
SIMOD1,
SIMOD0
TMRIX
ICST
Figure 12.11 Input Capture Signal Selection
300
Table 12.3 Input Capture Signal Selection
TCONRI
Bit 4
Bit 7
Bit 6
Bit 3
Bit 1
ICST
SIMOD1
SIMOD0
HFINV
HIINV
0
—
—
—
—
Input capture function is not used
1
0
0
0
—
Input signal at the TMIX pin is
selected
1
—
Inverted signal of the TMIX pin input
is selected
—
0
Input signal at the TMRI1 pin is
selected
—
1
Inverted signal of the TMRI1 pin
input is selected
—
0
Input signal at the TMCI1 pin is
selected
—
1
Inverted signal of the TMCI1 pin
input is selected
1
1
12.4
1
Description
Interrupt Sources
The TMR0, TMR1, and TMRY 8-bit timers can generate three types of interrupt: compare-match
A and B (CMIA and CMIB), and overflow (OVI). TMRX can generate only an ICIX interrupt. An
interrupt is requested when the corresponding interrupt enable bit is set in TCR or TCSR.
Independent signals are sent to the interrupt controller for each interrupt. It is also possible to
activate the DTC by means of CMIA and CMIB interrupts from TMR0, TMR1 and TMRY.
An overview of 8-bit timer interrupt sources is given in tables 12.4 to 12.6.
Table 12.4 TMR0 and TMR1 8-Bit Timer Interrupt Sources
Interrupt source
Description
DTC Activation
Interrupt Priority
CMIA
Requested by CMFA
Possible
High
CMIB
Requested by CMFB
Possible
OVI
Requested by OVF
Not possible
Low
Table 12.5 TMRX 8-Bit Timer Interrupt Source
Interrupt source
Description
DTC Activation
ICIX
Requested by ICF
Not possible
301
Table 12.6 TMRY 8-Bit Timer Interrupt Sources
Interrupt source
Description
DTC Activation
Interrupt Priority
CMIA
Requested by CMFA
Possible
High
CMIB
Requested by CMFB
Possible
OVI
Requested by OVF
Not possible
12.5
Low
8-Bit Timer Application Example
In the example below, the 8-bit timer is used to generate a pulse output with a selected duty cycle,
as shown in figure 12.12. The control bits are set as follows:
• In TCR, CCLR1 is cleared to 0 and CCLR0 is set to 1 so that the timer counter is cleared by a
TCORA compare-match.
• In TCSR, bits OS3 to OS0 are set to B'0110, causing 1 output at a TCORA compare-match and
0 output at a TCORB compare-match.
With these settings, the 8-bit timer provides output of pulses at a rate determined by TCORA with
a pulse width determined by TCORB. No software intervention is required.
TCNT
H'FF
Counter clear
TCORA
TCORB
H'00
TMO
Figure 12.12 Pulse Output (Example)
12.6
Usage Notes
Application programmers should note that the following kinds of contention can occur in the 8-bit
timer module.
302
12.6.1
Contention between TCNT Write and Clear
If a timer counter clock pulse is generated during the T2 state of a TCNT write cycle, the clear
takes priority, so that the counter is cleared and the write is not performed. Figure 12.13 shows this
operation.
TCNT write cycle by CPU
T1
T2
ø
Address
TCNT address
Internal write signal
Counter clear signal
TCNT
N
H'00
Figure 12.13 Contention between TCNT Write and Clear
303
12.6.2
Contention between TCNT Write and Increment
If a timer counter clock pulse is generated during the T2 state of a TCNT write cycle, the write
takes priority and the counter is not incremented. Figure 12.14 shows this operation.
TCNT write cycle by CPU
T1
T2
ø
Address
TCNT address
Internal write signal
TCNT input clock
TCNT
N
M
Counter write data
Figure 12.14 Contention between TCNT Write and Increment
304
12.6.3
Contention between TCOR Write and Compare-Match
During the T2 state of a TCOR write cycle, the TCOR write has priority even if a compare-match
occurs and the compare-match signal is disabled. Figure 12.15 shows this operation.
With TMRX, an ICR input capture contends with a compare-match in the same way as with a
write to TCORC. In this case, the input capture has priority and the compare-match signal is
inhibited.
TCOR write cycle by CPU
T1
T2
ø
Address
TCOR address
Internal write signal
TCNT
N
N+1
TCOR
N
M
TCOR write data
Compare-match signal
Inhibited
Figure 12.15 Contention between TCOR Write and Compare-Match
305
12.6.4
Contention between Compare-Matches A and B
If compare-matches A and B occur at the same time, the 8-bit timer operates in accordance with
the priorities for the output states set for compare-match A and compare-match B, as shown in
table 12.7.
Table 12.7 Timer Output Priorities
Output Setting
Priority
Toggle output
High
1 output
0 output
No change
12.6.5
Low
Switching of Internal Clocks and TCNT Operation
TCNT may increment erroneously when the internal clock is switched over. Table 12.8 shows the
relationship between the timing at which the internal clock is switched (by writing to the CKS1
and CKS0 bits) and the TCNT operation
When the TCNT clock is generated from an internal clock, the falling edge of the internal clock
pulse is detected. If clock switching causes a change from high to low level, as shown in no. 3 in
table 12.8, a TCNT clock pulse is generated on the assumption that the switchover is a falling
edge. This increments TCNT.
Erroneous incrementation can also happen when switching between internal and external clocks.
306
Table 12.8 Switching of Internal Clock and TCNT Operation
No.
1
Timing of Switchover
by Means of CKS1
and CKS0 Bits
TCNT Clock Operation
Switching from low
to low* 1
Clock before
switchover
Clock after
switchover
TCNT clock
TCNT
N
N+1
CKS bit rewrite
2
Switching from low
to high* 2
Clock before
switchover
Clock after
switchover
TCNT clock
TCNT
N
N+1
N+2
CKS bit rewrite
307
No.
3
Timing of Switchover
by Means of CKS1
and CKS0 Bits
TCNT Clock Operation
Switching from high
to low* 3
Clock before
switchover
Clock after
switchover
*4
TCNT clock
TCNT
N
N+1
N+2
CKS bit rewrite
4
Switching from high
to high
Clock before
switchover
Clock after
switchover
TCNT clock
TCNT
N
N+1
N+2
CKS bit rewrite
Notes: 1.
2.
3.
4.
308
Includes switching from low to stop, and from stop to low.
Includes switching from stop to high.
Includes switching from high to stop.
Generated on the assumption that the switchover is a falling edge; TCNT is
incremented.
Section 13 Timer Connection [H8S/2128 Series]
Provided in the H8S/2128 Series; not provided in the H8S/2124 Series.
13.1
Overview
H8S/2128 Series allows interconnection between a combination of input signals, the input/output
of the single free-running timer (FRT) channel, and the three 8-bit timer channels (TMR1, TMRX,
and TMRY). This capability can be used to implement complex functions such as PWM decoding
and clamp waveform output. All the timers are initially set for independent operation.
13.1.1
Features
The features of the timer connection facility are as follows.
• Five input pins and four output pins, all of which can be designated for phase inversion.
Positive logic is assumed for all signals used within the timer connection facility.
• An edge-detection circuit is connected to the input pins, simplifying signal input detection.
• TMRX can be used for PWM input signal decoding.
• TMRX can be used for clamp waveform generation.
• An external clock signal divided by TMR1 can be used as the FRT capture input signal.
• An internal synchronization signal can be generated using the FRT and TMRY.
• A signal generated/modified using an input signal and timer connection can be selected and
output.
309
310
Figure 13.1 Block Diagram of Timer Connection Facility
HFBACKI/
FTCI/TMIX/
TMCIO
CSYNCI/
TMRI1/FTOB
HSYNCI/
TMCI1/FTID
FTIC
VFBACKI/
FTIB/TMRI0
VSYNCI/
FTIA/TMIY
Phase
inversion
Phase
inversion
Phase
inversion
Phase
inversion
Phase
inversion
Edge
detection
Edge
detection
Edge
detection
Edge
detection
Edge
detection
IHI
signal
selection
IVI
signal
selection
FRT
input
selection
IVI signal
IHI signal
Read
flag
Read
flag
16-bit FRT
Vertical sync
signal modify
FTOA
ICR +1C
compare-match
ICR
8-bit TMRX
PWM decoding
PDC signal
TMRI
CMA
TMO
CMB
CMB
TMCI
8-bit TMR1 TMO
Clamp waveform generation
CM1C
TMRI
TMCI
TMR1
input
selection
Blanking waveform
generation
SET RES
2f H mask generation
2f H mask/flag
FTIB OCRA +VR, +VF CMA(R)
FTIC ICRD +1M, +2M CMA(F)
compare-match
FTOB
FTID
CM1M CM2M
FTIA
SET
sync
RES
CL2 signal
CL3 signal
CL1 signal
RES
Vertical
sync signal
generation
SET
CLO
signal
selection
CL4 signal
FRT
output
selection
Phase
inversion
Phase
inversion
Phase
inversion
TMOX
TMO1
output
selection
TMRI/TMCI
8-bit TMRY
TMO
IVO signal
Phase
inversion
CL4 generation
IHO
signal
selection
TMIY
signal
selection
IVG
signal
IVO
signal
selection
CLAMP0/
FTIC/
TMO0
HSYNCO/
TMO1/
TMOX
CBLANK
IHG signal
VSYNCO/
FTOA
13.1.2
Block Diagram
Figure 13.1 shows a block diagram of the timer connection facility.
13.1.3
Input and Output Pins
Table 13.1 lists the timer connection input and output pins.
Table 13.1 Timer Connection Input and Output Pins
Name
Abbreviation
Input/
Output
Vertical synchronization
signal input pin
VSYNCI
Input
Vertical synchronization signal
input pin
or FTIA input pin/TMIY input pin
Horizontal synchronization
signal input pin
HSYNCI
Input
Horizontal synchronization signal
input pin
or FTID input pin/TMCI1 input pin
Composite synchronization
signal input pin
CSYNCI
Input
Composite synchronization signal
input pin
or TMRI1 input pin/FTOB output
pin
Spare vertical synchronization
signal input pin
VFBACKI
Input
Spare vertical synchronization
signal input pin
or FTIB input pin/TMRI0 input pin
Spare horizontal
synchronization signal input
pin
HFBACKI
Input
Spare horizontal synchronization
signal input pin
or FTCI input pin/TMCI0 input
pin/TMIX input pin
Vertical synchronization
signal output pin
VSYNCO
Output
Vertical synchronization signal
output pin
or FTOA output pin
Horizontal synchronization
signal output pin
HSYNCO
Output
Horizontal synchronization signal
output pin
or TMO1 output pin/TMOX output
pin
Clamp waveform output pin
CLAMPO
Output
Clamp waveform output pin
or TMO0 output pin/FTIC input pin
Blanking waveform output pin
CBLANK
Output
Blanking waveform output pin
Function
311
13.1.4
Register Configuration
Table 13.2 lists the timer connection registers. Timer connection registers can only be accessed
when the HIE bit in SYSCR is 0.
Table 13.2 Register Configuration
Name
Abbreviation
R/W
Initial Value
Address* 1
Timer connection register I
TCONRI
R/W
H'00
H'FFFC
Timer connection register O
TCONRO
R/W
H'00
H'FFFD
Timer connection register S
TCONRS
R/W
H'00
2
H'00*
H'FFFE
3
Edge sense register
SEDGR
R/(W)*
H'FFFF
Module stop control register
MSTPRH
R/W
H'3F
H'FF86
MSTPRL
R/W
H'FF
H'FF87
Notes: 1. Lower 16 bits of the address.
2. Bits 7 to 2: Only 0 can be written to clear the flags.
3. Bits 1 and 0: Undefined (reflect the pin states).
13.2
Register Descriptions
13.2.1
Timer Connection Register I (TCONRI)
Bit
7
6
5
SIMOD1 SIMOD0 SCONE
4
3
2
1
0
ICST
HFINV
VFINV
HIINV
VIINV
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
TCONRI is an 8-bit readable/writable register that controls connection between timers, the signal
source for synchronization signal input, phase inversion, etc.
TCONR1 is initialized to H'00 by a reset and in hardware standby mode.
312
Bits 7 and 6—Input Synchronization Mode Select 1 and 0 (SIMOD1, SIMOD0): These bits
select the signal source of the IHI and IVI signals.
Bit 7
Bit 6
SIMOD1
SIMOD0
Mode
0
0
No signal
1
S-on-G mode
CSYNCI input
PDC input
0
Composite mode
HSYNCI input
PDC input
1
Separate mode
HSYNCI input
VSYNCI input
1
Description
IHI Signal
(Initial value) HFBACKI input
IVI Signal
VFBACKI input
Bit 5—Synchronization Signal Connection Enable (SCONE): Selects the signal source of the
FRT FTI input and the TMR1 TMCI1/TMRI1 input.
Bit 5
Description
SCONE
Mode
FTIA
FTIB
FTIC
FTID
TMCI1 TMRI1
0
Normal connection (Initial value) FTIA
input
FTIB
input
FTIC
input
FTID
input
TMCI1 TMRI1
input
input
1
Synchronization signal
connection mode
TMO1
signal
VFBACKI IHI
input
signal
IVI
signal
IHI
signal
IVI
inverse
signal
Bit 4—Input Capture Start Bit (ICST): The TMRX external reset input (TMRIX) is connected
to the IHI signal. TMRX has input capture registers (TICR, TICRR, and TICRF). TICRR and
TICRF can measure the width of a short pulse by means of a single capture operation under the
control of the ICST bit. When a rising edge followed by a falling edge is detected on TMRIX after
the ICST bit is set to 1, the contents of TCNT at those points are captured into TICRR and TICRF,
respectively, and the ICST bit is cleared to 0.
Bit 4
ICST
Description
0
The TICRR and TICRF input capture functions are stopped
(Initial value)
[Clearing condition]
When a rising edge followed by a falling edge is detected on TMRIX
1
The TICRR and TICRF input capture functions are operating
(Waiting for detection of a rising edge followed by a falling edge on TMRIX)
[Setting condition]
When 1 is written in ICST after reading ICST = 0
313
Bits 3 to 0—Input Synchronization Signal Inversion (HFINV, VFINV, HIINV, VIINV):
These bits select inversion of the input phase of the spare horizontal synchronization signal
(HFBACKI), the spare vertical synchronization signal (VFBACKI), the horizontal
synchronization signal and composite synchronization signal (HSYNCI, CSYNCI), and the
vertical synchronization signal (VSYNCI).
Bit 3
HFINV
Description
0
The HFBACKI pin state is used directly as the HFBACKI input
1
The HFBACKI pin state is inverted before use as the HFBACKI input
(Initial value)
Bit 2
VFINV
Description
0
The VFBACKI pin state is used directly as the VFBACKI input
1
The VFBACKI pin state is inverted before use as the VFBACKI input
(Initial value)
Bit 1
HIINV
Description
0
The HSYNCI and CSYNCI pin states are used directly as the HSYNCI
and CSYNCI inputs
1
(Initial value)
The HSYNCI and CSYNCI pin states are inverted before use as the HSYNCI and
CSYNCI inputs
Bit 0
VIINV
Description
0
The VSYNCI pin state is used directly as the VSYNCI input
1
The VSYNCI pin state is inverted before use as the VSYNCI input
13.2.2
(Initial value)
Timer Connection Register O (TCONRO)
Bit
7
6
5
4
3
2
HOE
VOE
CLOE
CBOE
HOINV
VOINV
1
0
CLOINV CBOINV
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
314
TCONRO is an 8-bit readable/writable register that controls output signal output, phase inversion,
etc.
TCONRO is initialized to H'00 by a reset and in hardware standby mode.
Bits 7 and 4—Output Enable (HOE, VOE, CLOE, CBOE): These bits control
enabling/disabling of horizontal synchronization signal (HSYNCO), vertical synchronization
signal (VSYNCO), clamp waveform (CLAMPO), and blanking waveform (CBLANK) output.
When output is disabled, the state of the relevant pin is determined by the port DR and DDR, FRT,
TMR, and PWM settings.
Output enabling/disabling control does not affect the port, FRT, or TMR input functions, but some
FRT and TMR input signal sources are determined by the SCONE bit in TCONRI.
Bit 7
HOE
Description
0
The P67/TMO1/TMOX/CIN7/HSYNCO pin functions as the
P67/TMO1/TMOX/CIN7 pin
1
The P67/TMO1/TMOX/CIN7/HSYNCO pin functions as the HSYNCO pin
(Initial value)
Bit 6
VOE
Description
0
The P61/FTOA/CIN1/VSYNCO pin functions as the P61/FTOA/CIN1 pin (Initial value)
1
The P61/FTOA/CIN1/VSYNCO pin functions as the VSYNCO pin
Bit 5
CLOE
Description
0
The P64/FTIC/CIN4/CLAMPO pin functions as the P64/FTIC/CIN4 pin
1
The P64/FTIC/CIN4/CLAMPO pin functions as the CLAMPO pin
(Initial value)
Bit 4
CBOE
Description
0
The P27/A15/PW15/CBLANK pin functions as the P27/A15/PW15 pin
1
In mode 1 (expanded mode with on-chip ROM disabled):
The P27/A15/PW15/CBLANK pin functions as the A15 pin
(Initial value)
In modes 2 and 3 (modes with on-chip ROM enabled):
The P27/A15/PW15/CBLANK pin functions as the CBLANK pin
315
Bits 3 to 0—Output Synchronization Signal Inversion (HOINV, VOINV, CLOINV,
CBOINV): These bits select inversion of the output phase of the horizontal synchronization signal
(HSYNCO), the vertical synchronization signal (VSYNCO), the clamp waveform (CLAMPO),
and the blank waveform (CBLANK).
Bit 3
HOINV
Description
0
The IHO signal is used directly as the HSYNCO output
1
The IHO signal is inverted before use as the HSYNCO output
(Initial value)
Bit 2
VOINV
Description
0
The IVO signal is used directly as the VSYNCO output
1
The IVO signal is inverted before use as the VSYNCO output
(Initial value)
Bit 1
CLOINV
Description
0
The CLO signal (CL1, CL2, CL3, or CL4 signal) is used directly as the
CLAMPO output
1
The CLO signal (CL1, CL2, CL3, or CL4 signal) is inverted before use as
the CLAMPO output
(Initial value)
Bit 0
CBOINV
Description
0
The CBLANK signal is used directly as the CBLANK output
1
The CBLANK signal is inverted before use as the CBLANK output
13.2.3
(Initial value)
Timer Connection Register S (TCONRS)
Bit
7
6
5
4
3
2
1
0
TMRX/Y ISGENE HOMOD1 HOMOD0VOMOD1 VOMOD0 CLMOD1 CLMOD0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
316
TCONRS is an 8-bit readable/writable register that selects 8-bit timer TMRX/TMRY access and
the synchronization signal output signal source and generation method.
TCONRS is initialized to H'00 by a reset and in hardware standby mode.
Bit 7—TMRX/TMRY Access Select (TMRX/Y): The TMRX and TMRY registers can only be
accessed when the HIE bit in SYSCR is cleared to 0. In the H8S/2128 Series, some of the TMRX
registers and the TMRY registers are assigned to the same memory space addresses (H'FFF0 to
H'FFF5), and the TMRX/Y bit determines which registers are accessed. In the H8S/2124 Series,
there is no control of TMRY register access by this bit.
Bit 7
TMRX/Y
Description
0
The TMRX registers are accessed at addresses H'FFF0 to H'FFF5
1
The TMRY registers are accessed at addresses H'FFF0 to H'FFF5
(Initial value)
Bit 6—Internal Synchronization Signal Select (ISGENE): Selects internal synchronization
signals (IHG, IVG, and CL4 signals) as the signal sources for the IHO, IVO, and CLO signals.
Bits 5 and 4—Horizontal Synchronization Output Mode Select 1 and 0 (HOMOD1,
HOMOD0): These bits select the signal source and generation method for the IHO signal.
Bit 6
Bit 5
Bit 4
ISGENE
VOMOD1
VOMOD0
Description
0
0
0
The IHI signal (without 2fH modification)
is selected
1
The IHI signal (with 2fH modification) is selected
0
The CL1 signal is selected
1
(Initial value)
1
1
0
0
The IHG signal is selected
1
1
0
1
317
Bits 3 and 2—Vertical Synchronization Output Mode Select 1 and 0 (VOMOD1, VOMOD0):
These bits select the signal source and generation method for the IVO signal.
Bit 6
Bit 3
Bit 2
ISGENE
VOMOD1
VOMOD0
Description
0
0
0
The IVI signal (without fall modification
or IHI synchronization) is selected
1
The IVI signal (without fall modification, with IHI
synchronization) is selected
0
The IVI signal (with fall modification, without IHI
synchronization) is selected
1
The IVI signal (with fall modification and IHI
synchronization) is selected
0
The IVG signal is selected
1
1
0
(Initial value)
1
1
0
1
Bits 1 and 0—Clamp Waveform Mode Select 1 and 0 (CLMOD1, CLMOD0): These bits
select the signal source for the CLO signal (clamp waveform).
Bit 6
Bit 1
Bit 0
ISGENE
CLMOD1
CLMOD2
Description
0
0
0
The CL1 signal is selected
1
The CL2 signal is selected
0
The CL3 signal is selected
1
1
1
0
0
1
1
0
1
318
The CL4 signal is selected
(Initial value)
13.2.4
Edge Sense Register (SEDGR)
Bit
Initial value
Read/Write
7
6
5
VEDG
HEDG
CEDG
0
0
*1
R/(W)
4
0
*1
R/(W)
HFEDG VFEDG PREQF
0
*1
R/(W)
2
3
0
0
*1
R/(W)
*1
R/(W)
R/(W)
*1
1
0
IHI
IVI
—*2
—*2
R
R
Notes: 1. Only 0 can be written, to clear the flags.
2. The initial value is undefined since it depends on the pin states.
SEDGR is an 8-bit readable/writable register used to detect a rising edge on the timer connection
input pins and the occurrence of 2fH modification, and to determine the phase of the IVI and IHI
signals.
The upper 6 bits of SEDGR are initialized to 0 by a reset and in hardware standby mode. The
initial value of the lower 2 bits is undefined, since it depends on the pin states.
Bit 7—VSYNCI Edge (VEDG): Detects a rising edge on the VSYNCI pin.
Bit 7
VEDG
Description
0
[Clearing condition]
When 0 is written in VEDG after reading VEDG = 1
1
[Setting condition]
When a rising edge is detected on the VSYNCI pin
(Initial value)
Bit 6—HSYNCI Edge (HEDG): Detects a rising edge on the HSYNCI pin.
Bit 6
HEDG
Description
0
[Clearing condition]
When 0 is written in HEDG after reading HEDG = 1
1
[Setting condition]
When a rising edge is detected on the HSYNCI pin
(Initial value)
319
Bit 5—CSYNCI Edge (CEDG): Detects a rising edge on the CSYNCI pin.
Bit 5
CEDG
Description
0
[Clearing condition]
When 0 is written in CEDG after reading CEDG = 1
1
[Setting condition]
When a rising edge is detected on the CSYNCI pin
(Initial value)
Bit 4—HFBACKI Edge (HFEDG): Detects a rising edge on the HFBACKI pin.
Bit 4
HFEDG
Description
0
[Clearing condition]
When 0 is written in HFEDG after reading HFEDG = 1
1
[Setting condition]
When a rising edge is detected on the HFBACKI pin
(Initial value)
Bit 3—VFBACKI Edge (VFEDG): Detects a rising edge on the VFBACKI pin.
Bit 3
VFEDG
Description
0
[Clearing condition]
When 0 is written in VFEDG after reading VFEDG = 1
1
[Setting condition]
When a rising edge is detected on the VFBACKI pin
(Initial value)
Bit 2—Pre-Equalization Flag (PREQF): Detects the occurrence of an IHI signal 2fH
modification condition. The generation of a falling/rising edge in the IHI signal during a mask
interval is expressed as the occurrence of a 2fH modification condition. For details, see section
13.3.4, IHI Signal 2fH Modification.
Bit 2
PREQF
Description
0
[Clearing condition]
When 0 is written in PREQF after reading PREQF = 1
1
[Setting condition]
When an IHI signal 2fH modification condition is detected
320
(Initial value)
Bit 1—IHI Signal Level (IHI): Indicates the current level of the IHI signal. Signal source and
phase inversion selection for the IHI signal depends on the contents of TCONRI. Read this bit to
determine whether the input signal is positive or negative, then maintain the IHI signal at positive
phase by modifying TCONRI.
Bit 1
IHI
Description
0
The IHI signal is low
1
The IHI signal is high
Bit 0—IVI Signal Level (IVI): Indicates the current level of the IVI signal. Signal source and
phase inversion selection for the IVI signal depends on the contents of TCONRI. Read this bit to
determine whether the input signal is positive or negative, then maintain the IVI signal at positive
phase by modifying TCONRI.
Bit 0
IVI
Description
0
The IVI signal is low
1
The IVI signal is high
13.2.5
Module Stop Control Register (MSTPCR)
MSTPCRH
Bit
7
6
5
4
3
MSTPCRL
2
1
0
7
6
5
4
3
2
1
0
MSTP15 MSTP14 MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTP8 MSTP7 MSTP6 MSTP5 MSTP4 MSTP3 MSTP2 MSTP1 MSTP0
Initial value
Read/Write
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR, comprising two 8-bit readable/writable registers, performs module stop mode control.
When the MSTP13, MSTP12, and MSTP8 bits are set to 1, the 16-bit free-running timer, 8-bit
timer channels 0 and 1 and channels X and Y, and timer connection, respectively, halt and enter
module stop mode at the end of the bus cycle. See section 21.5, Module Stop Mode, for details.
MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in
software standby mode.
321
MSTPCRH Bit 5—Module Stop (MSTP13): Specifies FRT module stop mode.
MSTPCRH
Bit 5
MSTP13
Description
0
FRT module stop mode is cleared
1
FRT module stop mode is set
(Initial value)
MSTPCRH Bit 4—Module Stop (MSTP12): Specifies 8-bit timer channel 0 and 1 module stop
mode.
MSTPCRH
Bit 4
MSTP12
Description
0
8-bit timer channel 0 and 1 module stop mode is cleared
1
8-bit timer channel 0 and 1 module stop mode is set
(Initial value)
MSTPCRH Bit 0—Module Stop (MSTP8): Specifies 8-bit timer channel X and Y and timer
connection module stop mode.
MSTPCRH
Bit 0
MSTP8
Description
0
8-bit timer channel X and Y and timer connection module stop mode is cleared
1
8-bit timer channel X and Y and timer connection module stop mode is
set
13.3
Operation
13.3.1
PWM Decoding (PDC Signal Generation)
(Initial value)
The timer connection facility and TMRX can be used to decode a PWM signal in which 0 and 1
are represented by the pulse width. To do this, a signal in which a rising edge is generated at
regular intervals must be selected as the IHI signal.
The timer counter (TCNT) in TMRX is set to count the internal clock pulses and to be cleared on
the rising edge of the external reset signal (IHI signal). The value to be used as the threshold for
deciding the pulse width is written in TCORB. The PWM decoder contains a delay latch which
uses the IHI signal as data and compare-match signal B (CMB) as a clock, and the state of the IHI
signal (the result of the pulse width decision) at the compare-match signal B timing after TCNT is
322
reset by the rise of the IHI signal is output as the PDC signal. The pulse width setting using
TICRR and TICRF of TMRX can be used to determine the pulse width decision threshold.
Examples of TCR and TCORB settings are shown in tables 13.3 and 13.4, and the timing chart is
shown in figure 13.2.
Table 13.3 Examples of TCR Settings
Bit(s)
Abbreviation
Contents
Description
7
CMIEB
0
6
CMIEA
0
Interrupts due to compare-match and overflow
are disabled
5
OVIE
0
4 and 3
CCLR1, CCLR0
11
TCNT is cleared by the rising edge of the
external reset signal (IHI signal)
2 to 0
CKS2 to CKS0
001
Incremented on internal clock: ø
Table 13.4 Examples of TCORB (Pulse Width Threshold) Settings
ø:10 MHz
ø: 12 MHz
ø: 16 MHz
ø: 20 MHz
H'07
0.8 µs
0.67 µs
0.5 µs
0.4 µs
H'0F
1.6 µs
1.33 µs
1 µs
0.8 µs
H'1F
3.2 µs
2.67 µs
2 µs
1.6 µs
H'3F
6.4 µs
5.33 µs
4 µs
3.2 µs
H'7F
12.8 µs
10.67 µs
8 µs
6.4 µs
IHI signal
Determination of IHI signal
state at compare-match
PDC signal
TCNT
TCORB
(threshold)
Counter reset
by IHI signal
Counter cleared
by TCNT overflow
IHI signal state at 2nd compare-match
is not determined
Figure 13.2 Timing Chart for PWM Decoding
323
13.3.2
Clamp Waveform Generation (CL1/CL2/CL3 Signal Generation)
The timer connection facility and TMRX can be used to generate signals with different duty cycles
and rising/falling edges (clamp waveforms) in synchronization with the input signal (IHI signal).
Three clamp waveforms can be generated: the CL1, CL2, and CL3 signals. In addition, the CL4
signal can be generated using TMRY.
The CL1 signal rises simultaneously with the rise of the IHI signal, and when the CL1 signal is
high, the CL2 signal rises simultaneously with the fall of the IHI signal. The fall of both the CL1
and the CL2 signal can be specified by TCORA.
The rise of the CL3 signal can be specified as simultaneous with the sampling of the fall of the IHI
signal using the system clock, and the fall of the CL3 signal can be specified by TCORC. The CL3
signal falls at the rise of the IHI signal.
TCNT in TMRX is set to count internal clock pulses and to be cleared on the rising edge of the
external reset signal (IHI signal).
The value to be used as the CL1 signal pulse width is written in TCORA. Write a value of H'02 or
more in TCORA when internal clock ø is selected as the TMRX counter clock, and a value or
H'01 or more when ø/2 is selected. When internal clock ø is selected, the CL1 signal pulse width is
(TCORA set value + 3 ± 0.5). When the CL2 signal is used, the setting must be made so that this
pulse width is greater than the IHI signal pulse width.
The value to be used as the CL3 signal pulse width is written in TCORC. The TICR register in
TMRX captures the value of TCNT at the inverse of the external reset signal edge (in this case, the
falling edge of the IHI signal). The timing of the fall of the CL3 signal is determined by the sum of
the contents of TICR and TCORC. Caution is required if the rising edge of the IHI signal precedes
the fall timing set by the contents of TCORC, since the IHI signal will cause the CL3 signal to fall.
Examples of TMRX TCR settings are the same as those in table 13.3. The clamp waveform timing
charts are shown in figures 13.3 and 13.4.
Since the rise of the CL1 and CL2 signals is synchronized with the edge of the IHI signal, and
their fall is synchronized with the system clock, the pulse width variation is equivalent to the
resolution of the system clock.
Both the rise and the fall of the CL3 signal are synchronized with the system clock and the pulse
width is fixed, but there is a variation in the phase relationship with the IHI signal equivalent to
the resolution of the system clock.
324
IHI signal
CL1 signal
CL2 signal
TCNT
TCORA
Figure 13.3 Timing Chart for Clamp Waveform Generation (CL1 and CL2 Signals)
IHI signal
CL3 signal
TCNT
TICR+TCORC
TICR
Figure 13.4 Timing Chart for Clamp Waveform Generation (CL3 Signal)
13.3.3
Measurement of 8-Bit Timer Divided Waveform Period
The timer connection facility, TMR1, and the free-running timer (FRT) can be used to measure the
period of an IHI signal divided waveform. Since TMR1 can be cleared by a rising edge of inverted
IVI signal, the rise and fall of the IHI signal divided waveform can be virtually synchronized with
the IVI signal. This enables period measurement to be carried out efficiently.
To measure the period of an IHI signal divided waveform, TCNT in TMR1 is set to count the
external clock (IHI signal) pulses and to be cleared on the rising edge of the external reset signal
(inverted IVI signal). The value to be used as the division factor is written in TCORA, and the
TMO output method is specified by the OS bits in TCSR. Examples of TMR1 TCR and TCSR
settings are shown in table 13.5, and the timing chart for measurement of the IVI signal and IHI
signal divided waveform periods is shown in figure 13.5. The period of the IHI signal divided
waveform is given by (ICRD(3) – ICRD(2)) × the resolution.
325
Table 13.5 Examples of TCR and TCSR Settings
Register
Bit(s)
Abbreviation
Contents
Description
TCR in TMR1
7
CMIEB
0
Interrupts due to compare-match
and overflow are disabled
6
CMIEA
0
5
OVIE
0
4 and 3 CCLR1, CCLR0
11
TCNT is cleared by the rising edge
of the external reset signal (inverted
IVI signal)
2 to 0
CKS2 to CKS0
101
TCNT is incremented on the rising
edge of the external clock (IHI
signal)
3 to 0
OS3 to OS0
0011
Not changed by compare-match B;
output inverted by compare-match A
(toggle output): division by 512
TCSR in TMR1
1001
TCR in FRT
6
IEDGB
0/1
or
when TCORB < TCORA, 1 output
on compare-match B, and 0 output
on compare-match A: division by
256
0: FRC value is transferred to ICRB
on falling edge of input capture input
B (IHI divided signal waveform)
1: FRC value is transferred to ICRB
on rising edge of input capture input
B (IHI divided signal waveform)
TCSR in FRT
326
1 and 0 CKS1, CKS0
01
FRC is incremented on internal
clock: ø/8
0
0
FRC clearing is disabled
CCLRA
IVI signal
IHI signal
divided
waveform
ICRB(4)
ICRB(3)
ICRB(2)
ICRB(1)
FRC
ICRB
Figure 13.5 Timing Chart for Measurement of IVI Signal and
IHI Signal Divided Waveform Periods
13.3.4
IHI Signal and 2fH Modification
By using the timer connection FRT, even if there is a part of the IHI signal with twice the
frequency, this can be eliminated. In order for this function to operate properly, the duty cycle of
the IHI signal must be approximately 30% or less, or approximately 70% or above.
The 8-bit OCRDM contents or twice the OCRDM contents can be added automatically to the data
captured in ICRD in the FRT, and compare-matches generated at these points. The interval
between the two compare-matches is called a mask interval. A value equivalent to approximately
1/3 the IHI signal period is written in OCRDM. ICRD is set so that capture is performed on the
rise of the IHI signal.
Since the IHI signal supplied to the IHO signal selection circuit is normally set on the rise of the
IHI signal and reset on the fall, its waveform is the same as that of the original IHI signal. When
2fH modification is selected, IHI signal edge detection is disabled during mask intervals. Capture
is also disabled during these intervals.
Examples of FRT TCR settings are shown in table 13.6, and the 2fH modification timing chart is
shown in figure 13.6.
327
Table 13.6 Examples of TCR, TCSR, TCOR, and OCRDM Settings
Register
Bit(s)
Abbreviation
Contents
Description
TCR in FRT
4
IEDGD
1
FRC value is transferred to ICRD on
the rising edge of input capture input
D (IHI signal)
1 and 0
CKS1, CKS0
01
FRC is incremented on internal clock:
ø/8
TCSR in FRT
0
CCLRA
0
FRC clearing is disabled
TCOR in FRT
7
ICRDMS
1
ICRD is set to the operating mode in
which OCRDM is used
OCRDM7 to 0
H'01 to H'FF Specifies the period during which
ICRD operation is masked
OCRDM in FRT 7 to 0
IHI signal
(without 2fH
modification)
IHI signal
(with 2fH
modification)
Mask interval
ICRD + OCRDM × 2
ICRD + OCRDM
FRC
ICRD
Figure 13.6 2fH Modification Timing Chart
328
13.3.5
IVI Signal Fall Modification and IHI Synchronization
By using the timer connection TMR1, the fall of the IVI signal can be shifted backward by the
specified number of IHI signal waveforms. Also, the fall of the IVI signal can be synchronized
with the rise of the IHI signal.
To perform 8-bit timer divided waveform period measurement, TCNT in TMR1 is set to count
external clock (IHI signal) pulses, and to be cleared on the rising edge of the external reset signal
(inverse of the IVI signal). The number of IHI signal pulses until the fall of the IVI signal is
written in TCORB.
Since the IVI signal supplied to the IVO signal selection circuit is normally set on the rise of the
IVI signal and reset on the fall, its waveform is the same as that of the original IVI signal. When
fall modification is selected, a reset is performed on a TMR1 TCORB compare-match.
The fall of the waveform generated in this way can be synchronized with the rise of the IHI signal,
regardless of whether or not fall modification is selected.
Examples of TMR1 TCORB, TCR, and TCSR settings are shown in table 13.7, and the fall
modification/IHI synchronization timing chart is shown in figure 13.7.
Table 13.7 Examples of TCORB, TCR, and TCSR Settings
Register
Bit(s)
Abbreviation
Contents
Description
TCR in
TMR1
7
CMIEB
0
Interrupts due to compare-match and
overflow are disabled
6
CMIEA
0
5
OVIE
0
4 and 3
CCLR1,
CCLR0
11
TCNT is cleared by the rising edge of the
external reset signal (inverse of the IVI
signal)
2 to 0
CKS2 to CKS0
101
TCNT is incremented on the rising edge of
the external clock (IHI signal)
3 to 0
OS3 to OS0
0011
Not changed by compare-match B; output
inverted by compare-match A (toggle
output)
TCSR in
TMR1
1001
TOCRB in TMR1
H'03
(example)
or
when TCORB < TCORA, 1 output on
compare-match B, 0 output on comparematch A
Compare-match on the 4th (example) rise
of the IHI signal after the rise of the
inverse of the IVI signal
329
IHI signal
IVI signal (PDC signal)
IVO signal
(without fall modification,
with IHI synchronization)
IVO signal
(with fall modification,
without IHI synchronization)
IVO signal
(with fall modification
and IHI synchronization)
TCNT
0
1
2
3
4
5
TCNT = TCORB (3)
Figure 13.7 Fall Modification/IHI Synchronization Timing Chart
13.3.6
Internal Synchronization Signal Generation (IHG/IVG/CL4 Signal Generation)
By using the timer connection FRT and TMRY, it is possible to automatically generate internal
signals (IHG and IVG signals) corresponding to the IHI and IVI signals. As the IHG signal is
synchronized with the rise of the IVG signal, the IHG signal period must be made a divisor of the
IVG signal period in order to keep it constant. In addition, the CL4 signal can be generated in
synchronization with the IHG signal.
The contents of OCRA in the FRT are updated by the automatic addition of the contents of
OCRAR or OCRAF, alternately, each time a compare-match occurs. A value corresponding to the
0 interval of the IVG signal is written in OCRAR, and a value corresponding to the 1 interval of
the IVG signal is written in OCRAF. The IVG signal is set by a compare-match after an OCRAR
addition, and reset by a compare-match after an OCRAF addition.
The IHG signal is the TMRY 8-bit timer output. TMRY is set to count internal clock pulses, and
to be cleared on TCORA compare-match, to fix the period and set the timer output. TCORB is set
so as to reset the timer output. The IVG signal is connected as the TMRY reset input (TMRI), and
the rise of the IVG signal can be treated in the same way as a TCORA compare-match.
The CL4 signal is a waveform that rises within one system clock period after the fall of the IHG
signal, and has a 1 interval of 6 system clock periods.
Examples of settings of TCORA, TCORB, TCR, and TCSR in TMRY, and OCRAR, OCRAF,
and TCR in the FRT, are shown in table 13.8, and the IHG signal/IVG signal timing chart is
shown in figure 13.8.
330
Table 13.8 Examples of OCRAR, OCRAF, TOCR, TCORA, TCORB, TCR, and TCSR
Settings
Register
Bit(s)
Abbreviation
Contents
Description
TCR in
TMRY
7
CMIEB
0
Interrupts due to compare-match and
overflow are disabled
6
CMIEA
0
5
OVIE
0
4 and 3
CCLR1,
CCLR0
01
2 to 0
CKS2 to CKS0 001
TCNT is incremented on internal clock:
ø/4
3 to 0
OS3 to OS0
0110
0 output on compare-match B
1 output on compare-match A
TOCRA in
TMRY
H'3F
(example)
IHG signal period = ø × 256
TOCRB in
TMRY
H'03
(example)
IHG signal 1 interval = ø × 16
01
FRC is incremented on internal clock: ø/8
OCRAR in FRT
H'7FEF
(example)
IVG signal 0
interval =
ø × 262016
OCRAF in FRT
H'000F
(example)
IVG signal 1
interval = ø × 128
1
OCRA is set to the operating mode in
which OCRAR and OCRAF are used
TCSR in
TMRY
TCR in FRT
TOCR in FRT
1 and 0
6
CKS1,
CKS0
OCRAMS
TCNT is cleared by compare-match A
IVG signal period =
ø × 262144 (1024
times IHG signal)
331
IVG signal
OCRA (1) =
OCRA (0) +
OCRAF
OCRA (2) =
OCRA (1) +
OCRAR
OCRA (3) =
OCRA (2) +
OCRAF
OCRA (4) =
OCRA (3) +
OCRAR
OCRA
FRC
6 system clocks
6 system clocks
6 system clocks
CL4
signal
IHG
signal
TCORA
TCORB
TCNT
Figure 13.8 IVG Signal/IHG Signal/CL4 Signal Timing Chart
332
13.3.7
HSYNCO Output
With the HSYNCO output, the meaning of the signal source to be selected and use or non-use of
modification varies according to the IHI signal source and the waveform required by external
circuitry. The meaning of the HSYNCO output in each mode is shown in table 13.9.
Table 13.9 Meaning of HSYNCO Output in Each Mode
Mode
IHI Signal
IHO Signal
Meaning of IHO Signal
No signal
HFBACKI
input
IHI signal (without
2fH modification)
HFBACKI input is output directly
IHI signal (with 2fH
modification)
Meaningless unless there is a double-frequency
part in the HFBACKI input
CL1 signal
HFBACKI input 1 interval is changed before output
IHG signal
Internal synchronization signal is output
IHI signal (without
2fH modification)
CSYNCI input (composite synchronization signal)
is output directly
IHI signal (with 2fH
modification)
Double-frequency part of CSYNCI input (composite
synchronization signal) is eliminated before output
CL1 signal
CSYNCI input (composite synchronization signal)
horizontal synchronization signal part is separated
before output
IHG signal
Internal synchronization signal is output
IHI signal (without
2fH modification)
HSYNCI input (composite synchronization signal)
is output directly
IHI signal (with 2fH
modification)
Double-frequency part of HSYNCI input (composite
synchronization signal) is eliminated before output
CL1 signal
HSYNCI input (composite synchronization signal)
horizontal synchronization signal part is separated
before output
IHG signal
Internal synchronization signal is output
IHI signal (without
2fH modification)
HSYNCI input (horizontal synchronization signal) is
output directly
IHI signal (with 2fH
modification)
Meaningless unless there is a double-frequency
part in the HSYNCI input (horizontal
synchronization signal)
CL1 signal
HSYNCI input (horizontal synchronization signal) 1
interval is changed before output
IHG signal
Internal synchronization signal is output
S-on-G
mode
CSYNCI
input
Composite HSYNCI
mode
input
Separate
mode
HSYNCI
input
333
13.3.8
VSYNCO Output
With the VSYNCO output, the meaning of the signal source to be selected and use or non-use of
modification varies according to the IVI signal source and the waveform required by external
circuitry. The meaning of the VSYNCO output in each mode is shown in table 13.10.
Table 13.10 Meaning of VSYNCO Output in Each Mode
Mode
IVI Signal
IVO Signal
Meaning of IVO Signal
No signal
VFBACKI
input
IVI signal (without fall
modification or IHI
synchronization)
VFBACKI input is output directly
IVI signal (without fall
modification, with IHI
synchronization)
Meaningless unless VFBACKI input is
synchronized with HFBACKI input
IVI signal (with fall
modification, without IHI
synchronization)
VFBACKI input fall is modified before output
IVI signal (with fall
modification and IHI
synchronization)
VFBACKI input fall is modified and signal is
synchronized with HFBACKI input before
output
IVG signal
Internal synchronization signal is output
IVI signal (without fall
modification or IHI
synchronization)
CSYNCI/HSYNCI input (composite
synchronization signal) vertical
synchronization signal part is separated
before output
IVI signal (without fall
modification, with IHI
synchronization)
CSYNCI/HSYNCI input (composite
synchronization signal) vertical
synchronization signal part is separated, and
signal is synchronized with CSYNCI/HSYNCI
input before output
IVI signal (with fall
modification, without IHI
synchronization)
CSYNCI/HSYNCI input (composite
synchronization signal) vertical
synchronization signal part is separated, and
fall is modified before output
IVI signal (with fall
modification and IHI
synchronization)
CSYNCI/HSYNCI input (composite
synchronization signal) vertical
synchronization signal part is separated, fall is
modified, and signal is synchronized with
CSYNCI/HSYNCI input before output
IVG signal
Internal synchronization signal is output
PDC signal
S-on-G
mode or
composite
mode
334
Mode
IVI Signal
IVO Signal
Meaning of IVO Signal
Separate
mode
VSYNCI
input
IVI signal (without fall
modification or IHI
synchronization)
VSYNCI input (vertical synchronization signal)
is output directly
IVI signal (without fall
modification, with IHI
synchronization)
Meaningless unless VSYNCI input (vertical
synchronization signal) is synchronized with
HSYNCI input (horizontal synchronization
signal)
IVI signal (with fall
modification, without IHI
synchronization)
VSYNCI input (vertical synchronization signal)
fall is modified before output
IVI signal (with fall
modification and IHI
synchronization)
VSYNCI input (vertical synchronization signal)
fall is modified and signal is synchronized with
HSYNCI input (horizontal synchronization
signal) before output
IVG signal
Internal synchronization signal is output
13.3.9
CBLANK Output
Using the signals generated/selected with timer connection, it is possible to generate a waveform
based on the composite synchronization signal (blanking waveform).
One kind of blanking waveform is generated by combining HFBACKI and VFBACKI inputs,
with the phase polarity made positive by means of bits HFINV and VFINV in TCONRI, with the
IVO signal.
The composition logic is shown in figure 13.9.
HFBACKI input (positive)
VFBACKI input (positive)
Falling edge sensing
Reset
Rising edge sensing
Set
Q
CBLANK signal
(positive)
IVO signal (positive)
Figure 13.9 CBLANK Output Waveform Generation
335
336
Section 14 Watchdog Timer (WDT)
14.1
Overview
These series have an on-chip watchdog timer/watch timer with two channels (WDT0, WDT1).
The WDT outputs an overflow signal if a system crash prevents the CPU from writing to the timer
counter, allowing it to overflow. At the same time, the WDT can also generate an internal reset
signal or internal NMI interrupt signal.
When this watchdog function is not needed, the WDT can be used as an interval timer. In interval
timer mode, an interval timer interrupt is generated each time the counter overflows.
14.1.1
Features
• Switchable between watchdog timer mode and interval timer mode
 WOVI interrupt generation in interval timer mode
• Internal reset or internal interrupt generated when the timer counter overflows
 Choice of internal reset or NMI interrupt generation in watchdog timer mode
• Choice of 8 (WDT0) or 16 (WDT1) counter input clocks
 Maximum WDT interval: system clock period × 131072 × 256
 Subclock can be selected for the WDT1 input counter
Maximum interval when the subclock is selected: subclock period × 256 × 256
337
14.1.2
Block Diagram
Figures 14.1 (a) and (b) show block diagrams of WDT0 and WDT1.
Internal NMI
interrupt request
signal*2
Interrupt
control
Overflow
Clock
Clock
select
Reset
control
Internal reset
signal*1
ø/2
ø/64
ø/128
ø/512
ø/2048
ø/8192
ø/32768
ø/131072
Internal clock
source
TCNT
TCSR
Module bus
Bus
interface
WDT
Legend:
TCSR: Timer control/status register
TCNT:
Timer counter
Notes: 1. For the internal reset signal, the reset of the WDT that overflowed first has priority.
2. The internal NMI interrupt request signal can be output independently by either WDT0 or
WDT1. The interrupt controller does not distinguish between NMI interrupt requests
from WDT0 and WDT1.
Figure 14.1 (a) Block Diagram of WDT0
338
Internal bus
WOVI
(interrupt request
signal)
Internal NMI
(interrupt request
signal)*2
Interrupt
control
Overflow
Clock
Clock
select
Reset
control
Internal reset
signal*1
ø/2
ø/64
ø/128
ø/512
ø/2048
ø/8192
ø/32768
ø/131072
Internal clock
source
TCNT
øSUB/2
øSUB/4
øSUB/8
øSUB/16
øSUB/32
øSUB/64
øSUB/128
øSUB/256
TCSR
Module bus
Bus
interface
Internal bus
WOVI
(interrupt request
signal)
WDT
Legend:
TCSR: Timer control/status register
TCNT:
Timer counter
Notes: 1. For the internal reset signal, the reset of the WDT that overflowed first has priority.
2. The internal NMI interrupt request signal can be output independently by either WDT0 or
WDT1. The interrupt controller does not distinguish between NMI interrupt requests
from WDT0 and WDT1.
Figure 14.1 (b) Block Diagram of WDT1
14.1.3
Pin Configuration
Table 14.1 describes the WDT input pin.
Table 14.1 WDT Pin
Name
Symbol
I/O
Function
External subclock input pin
EXCL
Input
WDT1 prescaler counter input clock
339
14.1.4
Register Configuration
The WDT has four registers, as summarized in table 14.2. These registers control clock selection,
WDT mode switching, the reset signal, etc.
Table 14.2 WDT Registers
Address* 1
Channel
0
1
Common
Name
Abbreviation R/W
Timer control/status
register 0
TCSR0
R/(W)*
Timer counter 0
TCNT0
R/W
3
3
Initial Value
Write*2
Read
H'00
H'FFA8
H'FFA8
H'00
H'FFA8
H'FFA9
H'00
H'FFEA
H'FFEA
Timer control/status
register 1
TCSR1
R/(W)*
Timer counter 1
TCNT1
R/W
H'00
H'FFEA
H'FFEB
System control
register
SYSCR
R/W
H'09
H'FFC4
H'FFC4
Notes: 1. Lower 16 bits of the address.
2. For details of write operations, see section 14.2.4, Notes on Register Access.
3. Only 0 can be written in bit 7, to clear the flag.
14.2
Register Descriptions
14.2.1
Timer Counter (TCNT)
Bit
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
TCNT is an 8-bit readable/writable* up-counter.
When the TME bit is set to 1 in TCSR, TCNT starts counting pulses generated from the internal
clock source selected by bits CKS2 to CKS0 in TCSR. When the TCNT value overflows (changes
from H'FF to H'00), the OVF flag in TCSR is set to 1, and an internal reset, NMI interrupt, interval
timer interrupt (WOVI), etc., can be generated, according to the mode selected by the WT/IT bit
and RST/NMI bit.
TCNT is initialized to H'00 by a reset, in hardware standby mode, or when the TME bit is cleared
to 0. It is not initialized in software standby mode.
340
Note: * The method of writing to TCNT is more complicated than for most other registers, to
prevent accidental overwriting. For details see section 14.2.4, Notes on Register Access.
14.2.2
Timer Control/Status Register (TCSR)
• TCSR0
Bit
7
6
5
4
3
2
1
0
OVF
WT/IT
TME
RSTS
RST/NMI
CKS2
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: * Only 0 can be written, to clear the flag.
• TCSR1
Bit
7
6
5
4
3
2
1
0
OVF
WT/IT
TME
PSS
RST/NMI
CKS2
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: * Only 0 can be written, to clear the flag.
TCSR is an 8-bit readable/writable* register. Its functions include selecting the clock source to be
input to TCNT, and the timer mode.
TCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software
standby mode.
Note: * The method of writing to TCSR is more complicated than for most other registers, to
prevent accidental overwriting. For details see section 14.2.4, Notes on Register Access.
341
Bit 7—Overflow Flag (OVF): A status flag that indicates that TCNT has overflowed from H'FF
to H'00.
Bit 7
OVF
Description
0
[Clearing conditions]
1
•
Write 0 in the TME bit
•
Read TCSR when OVF = 1*, then write 0 in OVF
(Initial value)
[Setting condition]
When TCNT overflows (changes from H'FF to H'00)
(When internal reset request generation is selected in watchdog timer mode, OVF is
cleared automatically by the internal reset.)
Note: * When OVF flag is polled and the interval timer interrupt is disabled, OVF = 1 must be read
at least twice.
Bit 6—Timer Mode Select (WT/IT): Selects whether the WDT is used as a watchdog timer or
interval timer. If used as an interval timer, the WDT generates an interval timer interrupt request
(WOVI) when TCNT overflows. If used as a watchdog timer, the WDT generates a reset or NMI
interrupt when TCNT overflows.
Bit 6
WT/IT
Description
0
Interval timer: Sends the CPU an interval timer interrupt request (WOVI)
when TCNT overflows
(Initial value)
1
Watchdog timer: Generates a reset or NMI interrupt when TCNT
overflows
Bit 5—Timer Enable (TME): Selects whether TCNT runs or is halted.
Bit 5
TME
Description
0
TCNT is initialized to H'00 and halted
1
TCNT counts
TCSR0 Bit 4—Reset Select (RSTS): Reserved. This bit should not be set to 1.
342
(Initial value)
TCSR1 Bit 4—Prescaler Select (PSS): Selects the input clock source for TCNT in WDT1. For
details, see the description of the CKS2 to CKS0 bits below.
TCSR1
Bit 4
PSS
Description
0
TCNT counts ø-based prescaler (PSM) divided clock pulses
1
TCNT counts øSUB-based prescaler (PSS) divided clock pulses
(Initial value)
Bit 3—Reset or NMI (RST/NMI): Specifies whether an internal reset or NMI interrupt is
requested on TCNT overflow in watchdog timer mode.
Bit 3
RST/NMI
Description
0
An NMI interrupt is requested
1
An internal reset is requested
(Initial value)
Bits 2 to 0—Clock Select 2 to 0 (CKS2 to CKS0): These bits select an internal clock source,
obtained by dividing the system clock (ø), or subclock (øSUB) for input to TCNT.
• WDT0 input clock selection
Bit 2
Bit 1
Bit 0
CKS2
CKS1
CKS0
Clock
Overflow Period* (when ø = 20 MHz)
0
0
0
ø/2 (Initial value)
25.6 µs
1
ø/64
819.2 µs
0
ø/128
1.6 ms
1
ø/512
6.6 ms
0
ø/2048
26.2 ms
1
ø/8192
104.9 ms
0
ø/32768
419.4 ms
1
ø/131072
1.68 s
1
1
0
1
Description
Note: * The overflow period is the time from when TCNT starts counting up from H'00 until overflow
occurs.
343
• WDT1 input clock selection
Bit 4
Bit 2
Bit 1
Bit 0
PSS
CKS2
CKS1
CKS0
Clock
0
0
0
0
ø/2 (Initial value) 25.6 µs
1
ø/64
819.2 µs
0
ø/128
1.6 ms
1
ø/512
6.6 ms
0
ø/2048
26.2 ms
1
ø/8192
104.9 ms
0
ø/32768
419.4 ms
1
ø/131072
1.68 s
0
øSUB/2
15.6 ms
1
øSUB/4
31.3 ms
0
øSUB/8
62.5 ms
1
øSUB/16
125 ms
0
øSUB/32
250 ms
1
øSUB/64
500 ms
0
øSUB/128
1s
1
øSUB/256
2s
1
1
0
1
1
0
0
1
1
0
1
Description
Overflow Period* (when ø = 20 MHz
and øSUB = 32.768 kHz)
Note: * The overflow period is the time from when TCNT starts counting up from H'00 until overflow
occurs.
14.2.3
System Control Register (SYSCR)
7
6
5
4
3
2
1
0
CS2E
IOSE
INTM1
INTM0
XRST
NMIEG
HIE
RAME
Initial value
0
0
0
0
1
0
0
1
Read/Write
R/W
R/W
R
R/W
R
R/W
R/W
R/W
Bit
Only bit 3 is described here. For details on functions not related to the watchdog timer, see
sections 3.2.2 and 5.2.1, System Control Register (SYSCR), and the descriptions of the relevant
modules.
344
Bit 3—External Reset (XRST): Indicates the reset source. When the watchdog timer is used, a
reset can be generated by watchdog timer overflow in addition to external reset input. XRST is a
read-only bit. It is set to 1 by an external reset, and when the RST/NMI bit is 1, is cleared to 0 by
an internal reset due to watchdog timer overflow.
Bit 3
XRST
Description
0
Reset is generated by an internal reset due to watchdog timer
overflow
1
Reset is generated by external reset input
14.2.4
(Initial value)
Notes on Register Access
The watchdog timer’s TCNT and TCSR registers differ from other registers in being more difficult
to write to. The procedures for writing to and reading these registers are given below.
Writing to TCNT and TCSR (Example of WDT0): These registers must be written to by a word
transfer instruction. They cannot be written to with byte transfer instructions.
Figure 14.2 shows the format of data written to TCNT and TCSR. TCNT and TCSR both have the
same write address. For a write to TCNT, the upper byte of the written word must contain H'5A
and the lower byte must contain the write data. For a write to TCSR, the upper byte of the written
word must contain H'A5 and the lower byte must contain the write data. This transfers the write
data from the lower byte to TCNT or TCSR.
TCNT write
15
8 7
H'5A
Address: H'FFA8
0
Write data
TCSR write
15
Address: H'FFA8
8 7
H'A5
0
Write data
Figure 14.2 Format of Data Written to TCNT and TCSR (Example of WDT0)
Reading TCNT and TCSR (Example of WDT0): These registers are read in the same way as
other registers. The read addresses are H'FFA8 for TCSR, and H'FFA9 for TCNT.
345
14.3
Operation
14.3.1
Watchdog Timer Operation
To use the WDT as a watchdog timer, set the WT/IT and TME bits in TCSR to 1. Software must
prevent TCNT overflows by rewriting the TCNT value (normally by writing H'00) before
overflow occurs. This ensures that TCNT does not overflow while the system is operating
normally. If TCNT overflows without being rewritten because of a system crash or other error, an
internal reset or NMI interrupt request is generated.
When the RST/NMI bit is set to 1, the chip is reset for 518 system clock periods (518 ø) by a
counter overflow. This is illustrated in figure 14.3.
When the RST/NMI bit cleared to 0, an NMI interrupt request is generated by a counter overflow.
An internal reset request from the watchdog timer and reset input from the RES pin are handled
via the same vector. The reset source can be identified from the value of the XRST bit in SYSCR.
If a reset caused by an input signal from the RES pin and a reset caused by WDT overflow occur
simultaneously, the RES pin reset has priority, and the XRST bit in SYSCR is set to 1.
An NMI interrupt request from the watchdog timer and an interrupt request from the NMI pin are
handled via the same vector. Simultaneous handling of a watchdog timer NMI interrupt request
and an NMI pin interrupt request must therefore be avoided.
TCNT value
Overflow
H'FF
Time
H'00
WT/IT = 1
TME = 1
H'00 written
to TCNT
OVF = 1*
WT/IT = 1 H'00 written
TME = 1 to TCNT
Internal reset signal
WT/IT:
TME:
OVF:
Note: *
518 system clock periods
Timer mode select bit
Timer enable bit
Overflow flag
Cleared to 0 by an internal reset when OVF is set to 1. XRST is cleared to 0.
Figure 14.3 Operation in Watchdog Timer Mode
346
14.3.2
Interval Timer Operation
To use the WDT as an interval timer, clear the WT/IT bit in TCSR to 0 and set the TME bit to 1.
An interval timer interrupt (WOVI) is generated each time TCNT overflows, provided that the
WDT is operating as an interval timer, as shown in figure 14.4. This function can be used to
generate interrupt requests at regular intervals.
TCNT count
Overflow
H'FF
Overflow
Overflow
Overflow
Time
H'00
WT/IT = 0
TME = 1
WOVI
WOVI
WOVI
WOVI
Legend:
WOVI: Interval timer interrupt request generation
Figure 14.4 Operation in Interval Timer Mode
347
14.3.3
Timing of Setting of Overflow Flag (OVF)
The OVF bit in TCSR is set to 1 if TCNT overflows during interval timer operation. At the same
time, an interval timer interrupt (WOVI) is requested. This timing is shown in figure 14.5.
If NMI request generation is selected in watchdog timer mode, when TCNT overflows the OVF
bit in TCSR is set to 1 and at the same time an NMI interrupt is requested.
ø
TCNT
H'FF
H'00
Overflow signal
(internal signal)
OVF
Figure 14.5 Timing of OVF Setting
14.4
Interrupts
During interval timer mode operation, an overflow generates an interval timer interrupt (WOVI).
The interval timer interrupt is requested whenever the OVF flag is set to 1 in TCSR. OVF must be
cleared to 0 in the interrupt handling routine. When NMI interrupt request generation is selected in
watchdog timer mode, an overflow generates an NMI interrupt request.
348
14.5
Usage Notes
14.5.1
Contention between Timer Counter (TCNT) Write and Increment
If a timer counter clock pulse is generated during the T2 state of a TCNT write cycle, the write
takes priority and the timer counter is not incremented. Figure 14.6 shows this operation.
TCNT write cycle
T1
T2
ø
Address
Internal write signal
TCNT input clock
TCNT
N
M
Counter write data
Figure 14.6 Contention between TCNT Write and Increment
14.5.2
Changing Value of CKS2 to CKS0
If bits CKS2 to CKS0 in TCSR are written to while the WDT is operating, errors could occur in
the incrementation. Software must stop the watchdog timer (by clearing the TME bit to 0) before
changing the value of bits CKS2 to CKS0.
14.5.3
Switching between Watchdog Timer Mode and Interval Timer Mode
If the mode is switched from watchdog timer to interval timer, or vice versa, while the WDT is
operating, errors could occur in the incrementation. Software must stop the watchdog timer (by
clearing the TME bit to 0) before switching the mode.
349
14.5.4
Counter Value in Transitions between High-Speed Mode, Subactive Mode, and
Watch Mode
If the mode is switched between high-speed mode and subactive mode or between high-speed
mode and watch mode when WDT1 is used as a realtime clock counter, an error will occur in the
counter value when the internal clock is switched.
When the mode is switched from high-speed mode to subactive mode or watch mode, the
increment timing is delayed by approximately 2 or 3 clock cycles when the WDT1 control clock is
switched from the main clock to the subclock.
Also, since the main clock oscillator is halted during subclock operation, when the mode is
switched from watch mode or subactive mode to high-speed mode, the clock is not supplied until
internal oscillation stabilizes. As a result, after oscillation is started, counter incrementing is
halted during the oscillation stabilization time set by bits STS2 to STS0 in SBYCR, and there is a
corresponding discrepancy in the counter value.
Caution is therefore required when using WDT1 as the realtime clock counter.
No error occurs in the counter value while WDT1 is operating in the same mode.
14.5.5
OVF Flag Clear Condition
To clear OVF flag in WOVI handling routine, read TCSR when OVF=1, then write with 0 to
OVF, as stated above. When WOVI is masked and OVF flag is poling, if contention between
OVF flag set and TCSR read is occurred, OVF=1 is read but OVF can not be cleared by writing
with 0 to OVF.
In this case, reading TCSR when OVF=1 two times meet the requirements of OVF clear condition.
Please read TCSR when OVF=1 two times before writing with 0 to OVF.
LOOP
350
BTST.B
BEQ
MOV.B
MOV.W
MOV.W
#7,@TCSR
LOOP
@TCSR,R0L
#H’A521,R0
R0,@TCSR
;
;
;
;
;
OVF flag read
if OVF=1, exit from loop
OVF=1 read again
OVF flag clear
:
Section 15 Serial Communication Interface (SCI)
15.1
Overview
These series are equipped with a serial communication interface (SCI) with two independent
channels. The SCI can handle both asynchronous and clocked synchronous serial communication.
A function is also provided for serial communication between processors (multiprocessor
communication function).
15.1.1
Features
SCI features are listed below.
• Choice of asynchronous or synchronous serial communication mode
Asynchronous mode
 Serial data communication is executed using an asynchronous system in which
synchronization is achieved character by character
Serial data communication can be carried out with standard asynchronous communication
chips such as a Universal Asynchronous Receiver/Transmitter (UART) or Asynchronous
Communication Interface Adapter (ACIA)
 A multiprocessor communication function is provided that enables serial data
communication with a number of processors
 Choice of 12 serial data transfer formats
Data length:
7 or 8 bits
Stop bit length:
1 or 2 bits
Parity:
Even, odd, or none
Multiprocessor bit:
1 or 0
 Receive error detection: Parity, overrun, and framing errors
 Break detection:
Break can be detected by reading the RxD pin level
directly in case of a framing error
Synchronous mode
 Serial data communication is synchronized with a clock
Serial data communication can be carried out with other chips that have a synchronous
communication function
 One serial data transfer format
Data length:
8 bits
 Receive error detection: Overrun errors detected
351
• Full-duplex communication capability
 The transmitter and receiver are mutually independent, enabling transmission and reception
to be executed simultaneously
 Double-buffering is used in both the transmitter and the receiver, enabling continuous
transmission and continuous reception of serial data
• LSB-first or MSB-first transfer can be selected
 This selection can be made regardless of the communication mode (with the exception of 7bit data transfer in asynchronous mode)*
Note: * LSB-first transfer is used in the examples in this section.
• Built-in baud rate generator allows any bit rate to be selected
• Choice of serial clock source: internal clock from baud rate generator or external clock from
SCK pin
• Capability of transmit and receive clock output
 The P 27/SCK1 is CMOS type output
 The P 52/SCK0 pin is an NMOS push-pull type output in the H8S/2128 series and a CMOS
output in the H8S/2124 series (when the P52/SCK0 pin is used as an output in the
H8S/2128 series, external pull-up resistor must be connected in order to output high level)
• Four interrupt sources
 Four interrupt sources (transmit-data-empty, transmit-end, receive-data-full, and receive
error) that can issue requests independently
 The transmit-data-empty interrupt and receive-data-full interrupt can activate the data
transfer controller (DTC) to execute data transfer
352
15.1.2
Block Diagram
Bus interface
Figure 15.1 shows a block diagram of the SCI.
Module data bus
RDR
RxD
TDR
RSR
BRR
SCMR
SSR
SCR
SMR
TSR
ø
ø/4
Baud rate
generator
ø/16
Transmission/
reception control
TxD
Parity generation
Parity check
SCK
Legend:
RSR:
RDR:
TSR:
TDR:
SMR:
SCR:
SSR:
SCMR:
BRR:
Internal
data bus
ø/64
Clock
External clock
TEI
TXI
RXI
ERI
Receive shift register
Receive data register
Transmit shift register
Transmit data register
Serial mode register
Serial control register
Serial status register
Serial interface mode register
Bit rate register
Figure 15.1 Block Diagram of SCI
15.1.3
Pin Configuration
Table 15.1 shows the serial pins used by the SCI.
Table 15.1 SCI Pins
Channel
0
1
Pin Name
Symbol*
I/O
Function
Serial clock pin 0
SCK0
I/O
SCI0 clock input/output
Receive data pin 0
RxD0
Input
SCI0 receive data input
Transmit data pin 0
TxD0
Output
SCI0 transmit data output
Serial clock pin 1
SCK1
I/O
SCI1 clock input/output
Receive data pin 1
RxD1
Input
SCI1 receive data input
Transmit data pin 1
TxD1
Output
SCI1 transmit data output
Note: * The abbreviations SCK, RxD, and TxD are used in the text, omitting the channel number.
353
15.1.4
Register Configuration
The SCI has the internal registers shown in table 15.2. These registers are used to specify
asynchronous mode or synchronous mode, the data format, and the bit rate, and to control the
transmitter/receiver.
Table 15.2 SCI Registers
Channel
Name
Abbreviation
R/W
Initial Value Address* 1
0
Serial mode register 0
SMR0
R/W
H'00
H'FFD8* 3
Bit rate register 0
BRR0
R/W
H'FF
H'FFD9* 3
Serial control register 0
SCR0
R/W
H'00
H'FFDA
Transmit data register 0
TDR0
R/W
H'FF
H'FFDB
H'84
H'FFDC
1
Common
2
Serial status register 0
SSR0
R/(W)*
Receive data register 0
RDR0
R
H'00
H'FFDD
Serial interface mode register 0 SCMR0
R/W
H'F2
H'FFDE* 3
Serial mode register 1
SMR1
R/W
H'00
H'FF83* 3
Bit rate register 1
BRR1
R/W
H'FF
H'FF89* 3
Serial control register 1
SCR1
R/W
H'00
H'FF8A
Transmit data register 1
TDR1
R/W
H'FF
H'FF8B
H'84
H'FF8C
2
Serial status register 1
SSR1
R/(W)*
Receive data register 1
RDD1
R
H'00
H'FF8D
Serial interface mode register 1 SCMR1
R/W
H'F2
H'FF8E* 3
Module stop control register
MSTPCRH
R/W
H'3F
H'FF86
MSTPCRL
R/W
H'FF
H'FF87
Notes: 1. Lower 16 bits of the address.
2. Only 0 can be written, to clear flags.
3. Some serial communication interface registers are assigned to the same addresses as
other registers. In this case, register selection is performed by the IICE bit in the serial
timer control register (STCR).
354
15.2
Register Descriptions
15.2.1
Receive Shift Register (RSR)
Bit
7
6
5
4
3
2
1
0
Read/Write
—
—
—
—
—
—
—
—
RSR is a register used to receive serial data.
The SCI sets serial data input from the RxD pin in RSR in the order received, starting with the
LSB (bit 0), and converts it to parallel data. When one byte of data has been received, it is
transferred to RDR automatically.
RSR cannot be directly read or written to by the CPU.
15.2.2
Receive Data Register (RDR)
Bit
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
RDR is a register that stores received serial data.
When the SCI has received one byte of serial data, it transfers the received serial data from RSR to
RDR where it is stored, and completes the receive operation. After this, RSR is receive-enabled.
Since RSR and RDR function as a double buffer in this way, continuous receive operations can be
performed.
RDR is a read-only register, and cannot be written to by the CPU.
RDR is initialized to H'00 by a reset, and in standby mode, watch mode, subactive mode, subsleep
mode, and module stop mode.
355
15.2.3
Transmit Shift Register (TSR)
Bit
7
6
5
4
3
2
1
0
Read/Write
—
—
—
—
—
—
—
—
TSR is a register used to transmit serial data.
To perform serial data transmission, the SCI first transfers transmit data from TDR to TSR, then
sends the data to the TxD pin starting with the LSB (bit 0).
When transmission of one byte is completed, the next transmit data is transferred from TDR to
TSR, and transmission started, automatically. However, data transfer from TDR to TSR is not
performed if the TDRE bit in SSR is set to 1.
TSR cannot be directly read or written to by the CPU.
15.2.4
Transmit Data Register (TDR)
Bit
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
TDR is an 8-bit register that stores data for serial transmission.
When the SCI detects that TSR is empty, it transfers the transmit data written in TDR to TSR and
starts serial transmission. Continuous serial transmission can be carried out by writing the next
transmit data to TDR during serial transmission of the data in TSR.
TDR can be read or written to by the CPU at all times.
TDR is initialized to H'FF by a reset, and in standby mode, watch mode, subactive mode, subsleep
mode, and module stop mode.
356
15.2.5
Serial Mode Register (SMR)
Bit
7
6
5
4
3
2
1
0
C/A
CHR
PE
O/E
STOP
MP
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
SMR is an 8-bit register used to set the SCI’s serial transfer format and select the baud rate
generator clock source.
SMR can be read or written to by the CPU at all times.
SMR is initialized to H'00 by a reset, and in standby mode, watch mode, subactive mode, subsleep
mode, and module stop mode.
Bit 7—Communication Mode (C/A): Selects asynchronous mode or synchronous mode as the
SCI operating mode.
Bit 7
C/A
Description
0
Asynchronous mode
1
Synchronous mode
(Initial value)
Bit 6—Character Length (CHR): Selects 7 or 8 bits as the data length in asynchronous mode. In
synchronous mode, a fixed data length of 8 bits is used regardless of the CHR setting.
Bit 6
CHR
Description
0
8-bit data
1
7-bit data*
(Initial value)
Note: * When 7-bit data is selected, the MSB (bit 7) of TDR is not transmitted, and LSB-first/MSBfirst selection is not available.
Bit 5—Parity Enable (PE): In asynchronous mode, selects whether or not parity bit addition is
performed in transmission, and parity bit checking in reception. In synchronous mode, or when a
multiprocessor format is used, parity bit addition and checking is not performed, regardless of the
PE bit setting.
357
Bit 5
PE
Description
0
Parity bit addition and checking disabled
1
Parity bit addition and checking enabled*
(Initial value)
Note: * When the PE bit is set to 1, the parity (even or odd) specified by the O/E bit is added to
transmit data before transmission. In reception, the parity bit is checked for the parity (even
or odd) specified by the O/E bit.
Bit 4—Parity Mode (O/E): Selects either even or odd parity for use in parity addition and
checking.
The O/E bit setting is only valid when the PE bit is set to 1, enabling parity bit addition and
checking, in asynchronous mode. The O/E bit setting is invalid in synchronous mode, when parity
bit addition and checking is disabled in asynchronous mode, and when a multiprocessor format is
used.
Bit 4
O/E
Description
0
Even parity* 1
1
Odd parity*
(Initial value)
2
Notes: 1. When even parity is set, parity bit addition is performed in transmission so that the total
number of 1 bits in the transmit character plus the parity bit is even.
In reception, a check is performed to see if the total number of 1 bits in the receive
character plus the parity bit is even.
2. When odd parity is set, parity bit addition is performed in transmission so that the total
number of 1 bits in the transmit character plus the parity bit is odd.
In reception, a check is performed to see if the total number of 1 bits in the receive
character plus the parity bit is odd.
Bit 3—Stop Bit Length (STOP): Selects 1 or 2 bits as the stop bit length in asynchronous mode.
The STOP bit setting is only valid in asynchronous mode. If synchronous mode is set the STOP
bit setting is invalid since stop bits are not added.
Bit 3
STOP
Description
0
1 stop bit* 1
1
2 stop bits*
(Initial value)
2
Notes: 1. In transmission, a single 1 bit (stop bit) is added to the end of a transmit character
before it is sent.
2. In transmission, two 1 bits (stop bits) are added to the end of a transmit character
before it is sent.
358
In reception, only the first stop bit is checked, regardless of the STOP bit setting. If the second
stop bit is 1, it is treated as a stop bit; if it is 0, it is treated as the start bit of the next transmit
character.
Bit 2—Multiprocessor Mode (MP): Selects multiprocessor format. When multiprocessor format
is selected, the PE bit and O/E bit parity settings are invalid. The MP bit setting is only valid in
asynchronous mode; it is invalid in synchronous mode.
For details of the multiprocessor communication function, see section 15.3.3, Multiprocessor
Communication Function.
Bit 2
MP
Description
0
Multiprocessor function disabled
1
Multiprocessor format selected
(Initial value)
Bits 1 and 0—Clock Select 1 and 0 (CKS1, CKS0): These bits select the clock source for the
baud rate generator. The clock source can be selected from ø, ø/4, ø/16, and ø/64, according to the
setting of bits CKS1 and CKS0.
For the relation between the clock source, the bit rate register setting, and the baud rate, see
section 15.2.8, Bit Rate Register.
Bit 1
Bit 0
CKS1
CKS0
Description
0
0
ø clock
1
ø/4 clock
0
ø/16 clock
1
ø/64 clock
1
15.2.6
(Initial value)
Serial Control Register (SCR)
Bit
7
6
5
4
3
2
1
0
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
SCR is a register that performs enabling or disabling of SCI transfer operations, serial clock output
in asynchronous mode, and interrupt requests, and selection of the serial clock source.
359
SCR can be read or written to by the CPU at all times.
SCR is initialized to H'00 by a reset, and in standby mode, watch mode, subactive mode, subsleep
mode, and module stop mode.
Bit 7—Transmit Interrupt Enable (TIE): Enables or disables transmit-data-empty interrupt
(TXI) request generation when serial transmit data is transferred from TDR to TSR and the TDRE
flag in SSR is set to 1.
Bit 7
TIE
Description
0
Transmit-data-empty interrupt (TXI) request disabled*
1
Transmit-data-empty interrupt (TXI) request enabled
(Initial value)
Note: * TXI interrupt request cancellation can be performed by reading 1 from the TDRE flag, then
clearing it to 0, or clearing the TIE bit to 0.
Bit 6—Receive Interrupt Enable (RIE): Enables or disables receive-data-full interrupt (RXI)
request and receive-error interrupt (ERI) request generation when serial receive data is transferred
from RSR to RDR and the RDRF flag in SSR is set to 1.
Bit 6
RIE
Description
0
Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request
disabled*
(Initial value)
1
Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request
enabled
Note: * RXI and ERI interrupt request cancellation can be performed by reading 1 from the RDRF,
FER, PER, or ORER flag, then clearing the flag to 0, or clearing the RIE bit to 0.
Bit 5—Transmit Enable (TE): Enables or disables the start of serial transmission by the SCI.
Bit 5
TE
Description
0
Transmission disabled* 1
1
Transmission enabled*
(Initial value)
2
Notes: 1. The TDRE flag in SSR is fixed at 1.
2. In this state, serial transmission is started when transmit data is written to TDR and the
TDRE flag in SSR is cleared to 0.
SMR setting must be performed to decide the transmission format before setting the TE
bit to 1.
360
Bit 4—Receive Enable (RE): Enables or disables the start of serial reception by the SCI.
Bit 4
RE
Description
0
Reception disabled* 1
1
Reception enabled*
(Initial value)
2
Notes: 1. Clearing the RE bit to 0 does not affect the RDRF, FER, PER, and ORER flags, which
retain their states.
2. Serial reception is started in this state when a start bit is detected in asynchronous
mode or serial clock input is detected in synchronous mode.
SMR setting must be performed to decide the reception format before setting the RE bit
to 1.
Bit 3—Multiprocessor Interrupt Enable (MPIE): Enables or disables multiprocessor interrupts.
The MPIE bit setting is only valid in asynchronous mode when receiving with the MP bit in SMR
set to 1.
The MPIE bit setting is invalid in synchronous mode or when the MP bit is cleared to 0.
Bit 3
MPIE
0
Description
Multiprocessor interrupts disabled (normal reception performed)
(Initial value)
[Clearing conditions]
1
•
When the MPIE bit is cleared to 0
•
When data with MPB = 1 is received
Multiprocessor interrupts enabled*
Receive interrupt (RXI) requests, receive-error interrupt (ERI) requests, and setting
of the RDRF, FER, and ORER flags in SSR are disabled until data with the
multiprocessor bit set to 1 is received.
Note: * When receive data including MPB = 0 is received, receive data transfer from RSR to RDR,
receive error detection, and setting of the RDRF, FER, and ORER flags in SSR , is not
performed. When receive data with MPB = 1 is received, the MPB bit in SSR is set to 1, the
MPIE bit is cleared to 0 automatically, and generation of RXI and ERI interrupts (when the
TIE and RIE bits in SCR are set to 1) and FER and ORER flag setting is enabled.
Bit 2—Transmit End Interrupt Enable (TEIE): Enables or disables transmit-end interrupt
(TEI) request generation if there is no valid transmit data in TDR when the MSB is transmitted.
361
Bit 2
TEIE
Description
0
Transmit-end interrupt (TEI) request disabled*
1
Transmit-end interrupt (TEI) request enabled*
(Initial value)
Note: * TEI cancellation can be performed by reading 1 from the TDRE flag in SSR, then clearing it
to 0 and clearing the TEND flag to 0, or clearing the TEIE bit to 0.
Bits 1 and 0—Clock Enable 1 and 0 (CKE1, CKE0): These bits are used to select the SCI clock
source and enable or disable clock output from the SCK pin. The combination of the CKE1 and
CKE0 bits determines whether the SCK pin functions as an I/O port, the serial clock output pin, or
the serial clock input pin.
The setting of the CKE0 bit, however, is only valid for internal clock operation (CKE1 = 0) in
asynchronous mode. The CKE0 bit setting is invalid in synchronous mode, and in the case of
external clock operation (CKE1 = 1). The setting of bits CKE1 and CKE0 must be carried out
before the SCI’s operating mode is determined using SMR.
For details of clock source selection, see table 15.9 in section 15.3, Operation.
Bit 1
Bit 0
CKE1
CKE0
Description
0
0
Asynchronous mode
Internal clock/SCK pin functions as I/O port* 1
Synchronous mode
Internal clock/SCK pin functions as serial clock
output* 1
Asynchronous mode
Internal clock/SCK pin functions as clock output* 2
Synchronous mode
Internal clock/SCK pin functions as serial clock
output
Asynchronous mode
External clock/SCK pin functions as clock input* 3
Synchronous mode
External clock/SCK pin functions as serial clock
input
Asynchronous mode
External clock/SCK pin functions as clock input* 3
Synchronous mode
External clock/SCK pin functions as serial clock
input
1
1
0
1
Notes: 1. Initial value
2. Outputs a clock of the same frequency as the bit rate.
3. Inputs a clock with a frequency 16 times the bit rate.
362
15.2.7
Serial Status Register (SSR)
Bit
7
6
5
4
3
2
1
0
TDRE
RDRF
ORER
FER
PER
TEND
MPB
MPBT
Initial value
1
0
0
0
0
1
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R
R
R/W
Note: Only 0 can be written, to clear the flag.
SSR is an 8-bit register containing status flags that indicate the operating status of the SCI, and
multiprocessor bits.
SSR can be read or written to by the CPU at all times. However, 1 cannot be written to flags
TDRE, RDRF, ORER, PER, and FER. Also note that in order to clear these flags they must be
read as 1 beforehand. The TEND flag and MPB flag are read-only flags and cannot be modified.
SSR is initialized to H'84 by a reset, and in standby mode, watch mode, subactive mode, subsleep
mode, and module stop mode.
Bit 7—Transmit Data Register Empty (TDRE): Indicates that data has been transferred from
TDR to TSR and the next serial data can be written to TDR.
Bit 7
TDRE
0
1
Description
[Clearing conditions]
•
When 0 is written in TDRE after reading TDRE = 1
•
When the DTC is activated by a TXI interrupt and writes data to TDR
[Setting conditions]
(Initial value)
•
When the TE bit in SCR is 0
•
When data is transferred from TDR to TSR and data can be written to TDR
363
Bit 6—Receive Data Register Full (RDRF): Indicates that the received data is stored in RDR.
Bit 6
RDRF
0
Description
[Clearing conditions]
(Initial value)
•
When 0 is written in RDRF after reading RDRF = 1
•
When the DTC is activated by an RXI interrupt and reads data from RDR
1
[Setting condition]
When serial reception ends normally and receive data is transferred from RSR to RDR
Note: RDR and the RDRF flag are not affected and retain their previous values when an error is
detected during reception or when the RE bit in SCR is cleared to 0.
If reception of the next data is completed while the RDRF flag is still set to 1, an overrun
error will occur and the receive data will be lost.
Bit 5—Overrun Error (ORER): Indicates that an overrun error occurred during reception,
causing abnormal termination.
Bit 5
ORER
Description
0
[Clearing condition]
(Initial value)*1
When 0 is written in ORER after reading ORER = 1
1
[Setting condition]
When the next serial reception is completed while RDRF = 1*2
Notes: 1. The ORER flag is not affected and retains its previous state when the RE bit in SCR is
cleared to 0.
2. The receive data prior to the overrun error is retained in RDR, and the data received
subsequently is lost. Also, subsequent serial reception cannot be continued while the
ORER flag is set to 1. In synchronous mode, serial transmission cannot be continued,
either.
364
Bit 4—Framing Error (FER): Indicates that a framing error occurred during reception in
asynchronous mode, causing abnormal termination.
Bit 4
FER
Description
0
[Clearing condition]
(Initial value)*1
When 0 is written in FER after reading FER = 1
1
[Setting condition]
When the SCI checks the stop bit at the end of the receive data when reception ends,
and the stop bit is 0 * 2
Notes: 1. The FER flag is not affected and retains its previous state when the RE bit in SCR is
cleared to 0.
2. In 2-stop-bit mode, only the first stop bit is checked for a value of 0; the second stop bit
is not checked. If a framing error occurs, the receive data is transferred to RDR but the
RDRF flag is not set. Also, subsequent serial reception cannot be continued while the
FER flag is set to 1. In synchronous mode, serial transmission cannot be continued,
either.
Bit 3—Parity Error (PER): Indicates that a parity error occurred during reception using parity
addition in asynchronous mode, causing abnormal termination.
Bit 3
PER
Description
0
[Clearing condition]
(Initial value)*1
When 0 is written in PER after reading PER = 1
1
[Setting condition]
When, in reception, the number of 1 bits in the receive data plus the parity bit does not
match the parity setting (even or odd) specified by the O/E bit in SMR* 2
Notes: 1. The PER flag is not affected and retains its previous state when the RE bit in SCR is
cleared to 0.
2. If a parity error occurs, the receive data is transferred to RDR but the RDRF flag is not
set. Also, subsequent serial reception cannot be continued while the PER flag is set to
1. In synchronous mode, serial transmission cannot be continued, either.
365
Bit 2—Transmit End (TEND): Indicates that there is no valid data in TDR when the last bit of
the transmit character is sent, and transmission has been ended.
The TEND flag is read-only and cannot be modified.
Bit 2
TEND
Description
0
[Clearing conditions]
1
•
When 0 is written in TDRE after reading TDRE = 1
•
When the DTC is activated by a TXI interrupt and writes data to TDR
[Setting conditions]
(Initial value)
•
When the TE bit in SCR is 0
•
When TDRE = 1 at transmission of the last bit of a 1-byte serial transmit character
Bit 1—Multiprocessor Bit (MPB): When reception is performed using a multiprocessor format
in asynchronous mode, MPB stores the multiprocessor bit in the receive data.
MPB is a read-only bit, and cannot be modified.
Bit 1
MPB
Description
0
[Clearing condition]
When data with a 0 multiprocessor bit is received
1
[Setting condition]
When data with a 1 multiprocessor bit is received
(Initial value)*
Note: * Retains its previous state when the RE bit in SCR is cleared to 0 with multiprocessor
format.
Bit 0—Multiprocessor Bit Transfer (MPBT): When transmission is performed using a
multiprocessor format in asynchronous mode, MPBT stores the multiprocessor bit to be added to
the transmit data.
The MPBT bit setting is invalid when a multiprocessor format is not used, when not transmitting,
and in synchronous mode.
Bit 0
MPBT
Description
0
Data with a 0 multiprocessor bit is transmitted
1
Data with a 1 multiprocessor bit is transmitted
366
(Initial value)
15.2.8
Bit Rate Register (BRR)
Bit
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
BRR is an 8-bit register that sets the serial transfer bit rate in accordance with the baud rate
generator operating clock selected by bits CKS1 and CKS0 in SMR.
BRR can be read or written to by the CPU at all times.
BRR is initialized to H'FF by a reset, and in standby mode, watch mode, subactive mode, subsleep
mode, and module stop mode.
As baud rate generator control is performed independently for each channel, different values can
be set for each channel.
Table 15.3 shows sample BRR settings in asynchronous mode, and table 15.4 shows sample BRR
settings in synchronous mode.
367
Table 15.3 BRR Settings for Various Bit Rates (Asynchronous Mode)
Operating Frequency ø (MHz)
ø = 2 MHz
ø = 2.097152 MHz
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
110
1
141
0.03
1
148
150
1
103
0.16
1
300
0
207
0.16
600
0
103
1200
0
2400
ø = 2.4576 MHz
N
Error
(%)
–0.04 1
174
108
0.21
1
0
217
0.21
0.16
0
108
0.21
51
0.16
0
54
0
25
0.16
0
4800
0
12
0.16
9600
—
—
19200
—
31250
38400
ø = 3 MHz
N
Error
(%)
–0.26 1
212
0.03
127
0.00
1
155
0.16
0
255
0.00
1
77
0.16
0
127
0.00
0
155
0.16
–0.70 0
63
0.00
0
77
0.16
26
1.14
0
31
0.00
0
38
0.16
0
13
–2.48 0
15
0.00
0
19
–2.34
—
0
6
–2.48 0
7
0.00
0
9
–2.34
—
—
—
—
—
0
3
0.00
0
4
–2.34
0
1
0.00
—
—
—
—
—
—
0
2
0.00
—
—
—
—
—
—
0
1
0.00
—
—
—
n
n
Operating Frequency ø (MHz)
ø = 3.6864 MHz
ø = 4 MHz
ø = 4.9152 MHz
ø = 5 MHz
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
2
64
0.70
2
70
0.03
2
86
0.31
2
88
–0.25
150
1
191
0.00
1
207
0.16
1
255
0.00
2
64
0.16
300
1
95
0.00
1
103
0.16
1
127
0.00
1
129
0.16
600
0
191
0.00
0
207
0.16
0
255
0.00
1
64
0.16
1200
0
95
0.00
0
103
0.16
0
127
0.00
0
129
0.16
2400
0
47
0.00
0
51
0.16
0
63
0.00
0
64
0.16
4800
0
23
0.00
0
25
0.16
0
31
0.00
0
32
–1.36
9600
0
11
0.00
0
12
0.16
0
15
0.00
0
15
1.73
19200
0
5
0.00
—
—
—
0
7
0.00
0
7
1.73
31250
—
—
—
0
3
0.00
0
4
–1.70 0
4
0.00
38400
0
2
0.00
—
—
—
0
3
0.00
3
1.73
368
0
Operating Frequency ø (MHz)
ø = 6 MHz
Bit Rate
(bits/s)
n
N
Error
(%)
110
2
106
150
2
300
ø = 6.144 MHz
ø = 7.3728 MHz
N
Error
(%)
n
N
Error
(%)
–0.44 2
108
0.08
2
130
77
0.16
2
79
0.00
2
1
155
0.16
1
159
0.00
600
1
77
0.16
1
79
1200
0
155
0.16
0
2400
0
77
0.16
4800
0
38
0.16
9600
0
19200
ø = 8 MHz
N
Error
(%)
–0.07 2
141
0.03
95
0.00
2
103
0.16
1
191
0.00
1
207
0.16
0.00
1
95
0.00
1
103
0.16
159
0.00
0
191
0.00
0
207
0.16
0
79
0.00
0
95
0.00
0
103
0.16
0
39
0.00
0
47
0.00
0
51
0.16
19
–2.34 0
19
0.00
0
23
0.00
0
25
0.16
0
9
–2.34 0
9
0.00
0
11
0.00
0
12
0.16
31250
0
5
0.00
0
5
2.40
—
—
—
0
7
0.00
38400
0
4
–2.34 0
4
0.00
0
5
0.00
—
—
—
n
n
Operating Frequency ø (MHz)
ø = 9.8304 MHz
Bit Rate
(bits/s)
n
N
Error
(%)
110
2
174
150
2
300
ø = 10 MHz
N
Error
(%)
–0.26 2
177
127
0.00
2
1
255
0.00
600
1
127
1200
0
2400
ø = 12 MHz
ø = 12.288 MHz
N
Error
(%)
n
N
Error
(%)
–0.25 2
212
0.03
2
217
0.08
129
0.16
2
155
0.16
2
159
0.00
2
64
0.16
2
77
0.16
2
79
0.00
0.00
1
129
0.16
1
155
0.16
1
159
0.00
255
0.00
1
64
0.16
1
77
0.16
1
79
0.00
0
127
0.00
0
129
0.16
0
155
0.16
0
159
0.00
4800
0
63
0.00
0
64
0.16
0
77
0.16
0
79
0.00
9600
0
31
0.00
0
32
–1.36 0
38
0.16
0
39
0.00
19200
0
15
0.00
0
15
1.73
0
19
–2.34 0
19
0.00
31250
0
9
–1.70 0
9
0.00
0
11
0.00
11
2.40
38400
0
7
0.00
7
1.73
0
9
–2.34 0
9
0.00
n
0
n
0
369
Operating Frequency ø (MHz)
ø = 14 MHz
ø = 14.7456 MHz
Bit Rate
(bits/s)
n
N
Error
(%)
110
2
248
150
2
300
ø = 16 MHz
ø = 17.2032 MHz
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
–0.17 3
64
0.70
3
70
0.03
3
75
0.48
181
0.16
2
191
0.00
2
207
0.16
2
223
0.00
2
90
0.16
2
95
0.00
2
103
0.16
2
111
0.00
600
1
181
0.16
1
191
0.00
1
207
0.16
1
223
0.00
1200
1
90
0.16
1
95
0.00
1
103
0.16
1
111
0.00
2400
0
181
0.16
0
191
0.00
0
207
0.16
0
223
0.00
4800
0
90
0.16
0
95
0.00
0
103
0.16
0
111
0.00
9600
0
45
–0.93 0
47
0.00
0
51
0.16
0
55
0.00
19200
0
22
–0.93 0
23
0.00
0
25
0.16
0
27
0.00
31250
0
13
0.00
0
14
–1.70 0
15
0.00
0
16
1.20
38400
—
—
—
0
11
0.00
12
0.16
0
13
0.00
n
0
Operating Frequency ø (MHz)
ø = 18 MHz
Bit Rate
(bits/s)
n
N
Error
(%)
110
3
79
150
2
300
ø = 19.6608 MHz
ø = 20 MHz
N
Error
(%)
n
N
Error
(%)
–0.12 3
86
0.31
3
88
–0.25
233
0.16
2
255
0.00
3
64
0.16
2
116
0.16
2
127
0.00
2
129
0.16
600
1
233
0.16
1
255
0.00
2
64
0.16
1200
1
116
0.16
1
127
0.00
1
129
0.16
2400
0
233
0.16
0
255
0.00
1
64
0.16
4800
0
116
0.16
0
127
0.00
0
129
0.16
9600
0
58
–0.69 0
63
0.00
0
64
0.16
19200
0
28
1.02
0
31
0.00
0
32
–1.36
31250
0
17
0.00
0
19
–1.70 0
19
0.00
38400
0
14
–2.34 0
15
0.00
15
1.73
370
n
0
Table 15.4 BRR Settings for Various Bit Rates (Synchronous Mode)
Operating Frequency ø (MHz)
ø = 2 MHz
Bit Rate
ø = 4 MHz
(bits/s)
n
N
n
N
110
3
70
—
—
250
2
124
2
500
1
249
1k
1
2.5 k
ø = 8 MHz
ø = 10 MHz
ø = 16 MHz
n
N
n
N
n
N
249
3
124
—
—
3
249
2
124
2
249
—
—
3
124
1
249
2
124
—
—
0
199
1
99
1
199
1
5k
0
99
0
199
1
99
10 k
0
49
0
99
0
25 k
0
19
0
39
50 k
0
9
0
100 k
0
4
250 k
0
500 k
0
1M
ø = 20 MHz
n
N
124
—
—
2
249
—
—
249
2
99
2
124
1
124
1
199
1
249
199
0
249
1
99
1
124
0
79
0
99
0
159
0
199
19
0
39
0
49
0
79
0
99
0
9
0
19
0
24
0
39
0
49
1
0
3
0
7
0
9
0
15
0
19
0*
0
1
0
3
0
4
0
7
0
9
0
0*
0
1
0
3
0
4
0
1
0
0*
2.5 M
5M
0
0*
Note: As far as possible, the setting should be made so that the error is no more than 1%.
Legend:
Blank: Cannot be set.
—: Can be set, but there will be a degree of error.
*: Continuous transfer is not possible.
371
The BRR setting is found from the following equations.
Asynchronous mode:
N=
φ
× 106 – 1
64 × 22n–1 × B
Synchronous mode:
N=
Where B:
N:
ø:
n:
φ
× 106 – 1
8 × 22n–1 × B
Bit rate (bits/s)
BRR setting for baud rate generator (0 ≤ N ≤ 255)
Operating frequency (MHz)
Baud rate generator input clock (n = 0 to 3)
(See the table below for the relation between n and the clock.)
SMR Setting
n
Clock
CKS1
CKS0
0
ø
0
0
1
ø/4
0
1
2
ø/16
1
0
3
ø/64
1
1
The bit rate error in asynchronous mode is found from the following equation:


φ × 106
Error (%) = 
– 1 × 100
2n–1
(N + 1) × B × 64 × 2

372
Table 15.5 shows the maximum bit rate for each frequency in asynchronous mode. Tables 15.6
and 15.7 show the maximum bit rates with external clock input.
Table 15.5 Maximum Bit Rate for Each Frequency (Asynchronous Mode)
ø (MHz)
Maximum Bit Rate (bits/s)
n
N
2
62500
0
0
2.097152
65536
0
0
2.4576
76800
0
0
3
93750
0
0
3.6864
115200
0
0
4
125000
0
0
4.9152
153600
0
0
5
156250
0
0
6
187500
0
0
6.144
192000
0
0
7.3728
230400
0
0
8
250000
0
0
9.8304
307200
0
0
10
312500
0
0
12
375000
0
0
12.288
384000
0
0
14
437500
0
0
14.7456
460800
0
0
16
500000
0
0
17.2032
537600
0
0
18
562500
0
0
19.6608
614400
0
0
20
625000
0
0
373
Table 15.6 Maximum Bit Rate with External Clock Input (Asynchronous Mode)
ø (MHz)
External Input Clock (MHz)
Maximum Bit Rate (bits/s)
2
0.5000
31250
2.097152
0.5243
32768
2.4576
0.6144
38400
3
0.7500
46875
3.6864
0.9216
57600
4
1.0000
62500
4.9152
1.2288
76800
5
1.2500
78125
6
1.5000
93750
6.144
1.5360
96000
7.3728
1.8432
115200
8
2.0000
125000
9.8304
2.4576
153600
10
2.5000
156250
12
3.0000
187500
12.288
3.0720
192000
14
3.5000
218750
14.7456
3.6864
230400
16
4.0000
250000
17.2032
4.3008
268800
18
4.5000
281250
19.6608
4.9152
307200
20
5.0000
312500
374
Table 15.7 Maximum Bit Rate with External Clock Input (Synchronous Mode)
ø (MHz)
External Input Clock (MHz)
Maximum Bit Rate (bits/s)
2
0.3333
333333.3
4
0.6667
666666.7
6
1.0000
1000000.0
8
1.3333
1333333.3
10
1.6667
1666666.7
12
2.0000
2000000.0
14
2.3333
2333333.3
16
2.6667
2666666.7
18
3.0000
3000000.0
20
3.3333
3333333.3
15.2.9
Serial Interface Mode Register (SCMR)
Bit
7
6
5
4
3
2
1
0
—
—
—
—
SDIR
SINV
—
SMIF
Initial value
1
1
1
1
0
0
1
0
Read/Write
—
—
—
—
R/W
R/W
—
R/W
SCMR is an 8-bit readable/writable register used to select SCI functions.
SCMR is initialized to H'F2 by a reset, and in standby mode, watch mode, subactive mode,
subsleep mode, and module stop mode.
Bits 7 to 4—Reserved: These bits cannot be modified and are always read as 1.
Bit 3—Data Transfer Direction (SDIR): Selects the serial/parallel conversion format.
Bit 3
SDIR
Description
0
TDR contents are transmitted LSB-first
(Initial value)
Receive data is stored in RDR LSB-first
1
TDR contents are transmitted MSB-first
Receive data is stored in RDR MSB-first
375
Bit 2—Data Invert (SINV): Specifies inversion of the data logic level. The SINV bit does not
affect the logic level of the parity bit(s): parity bit inversion requires inversion of the O/E bit in
SMR.
Bit 2
SINV
Description
0
TDR contents are transmitted without modification
(Initial value)
Receive data is stored in RDR without modification
1
TDR contents are inverted before being transmitted
Receive data is stored in RDR in inverted form
Bit 1—Reserved: This bit cannot be modified and is always read as 1.
Bit 0—Serial Communication Interface Mode Select (SMIF): Reserved bit. 1 should not be
written in this bit.
Bit 0
SMIF
Description
0
Normal SCI mode
1
Reserved mode
15.2.10
(Initial value)
Module Stop Control Register (MSTPCR)
MSTPCRH
Bit
7
6
5
4
3
MSTPCRL
2
1
0
7
6
5
4
3
2
1
0
MSTP15 MSTP14 MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTP8 MSTP7 MSTP6 MSTP5 MSTP4 MSTP3 MSTP2 MSTP1 MSTP0
Initial value
Read/Write
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR, comprising two 8-bit readable/writable registers, performs module stop mode control.
When bits MSTP7 and MSTP6 are set to 1, SCI0 and SCI1 operation, respectively, stops at the
end of the bus cycle and a transition is made to module stop mode. For details, see section 21.5.,
Module Stop Mode.
MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in
software standby mode.
376
Bit 7—Module Stop (MSTP7): Specifies the SCI0 module stop mode.
Bit 7
MSTP7
Description
0
SCI0 module stop mode is cleared
1
SCI0 module stop mode is set
(Initial value)
Bit 6—Module Stop (MSTP6): Specifies the SCI1 module stop mode.
Bit 6
MSTP6
Description
0
SCI1 module stop mode is cleared
1
SCI1 module stop mode is set
15.3
Operation
15.3.1
Overview
(Initial value)
The SCI can carry out serial communication in two modes: asynchronous mode in which
synchronization is achieved character by character, and synchronous mode in which
synchronization is achieved with clock pulses.
Selection of asynchronous or synchronous mode and the transmission format is made using SMR
as shown in table 15.8. The SCI clock is determined by a combination of the C/A bit in SMR and
the CKE1 and CKE0 bits in SCR, as shown in table 15.9.
Asynchronous Mode
• Data length: Choice of 7 or 8 bits
• Choice of parity addition, multiprocessor bit addition, and addition of 1 or 2 stop bits (the
combination of these parameters determines the transfer format and character length)
• Detection of framing, parity, and overrun errors, and breaks, during reception
• Choice of internal or external clock as SCI clock source
 When internal clock is selected:
The SCI operates on the baud rate generator clock and a clock with the same frequency as
the bit rate can be output
 When external clock is selected:
377
A clock with a frequency of 16 times the bit rate must be input (the built-in baud rate
generator is not used)
Synchronous Mode
• Transfer format: Fixed 8-bit data
• Detection of overrun errors during reception
• Choice of internal or external clock as SCI clock source
 When internal clock is selected:
The SCI operates on the baud rate generator clock and a serial clock is output off-chip
 When external clock is selected:
The built-in baud rate generator is not used, and the SCI operates on the input serial clock
Table 15.8 SMR Settings and Serial Transfer Format Selection
SMR Settings
SCI Transfer Format
Data
Multiprocessor
Parity
Stop Bit
Mode
Length
Bit
Bit
Length
0
Asynchronous
8-bit data
No
No
1 bit
1
mode
Bit 7
Bit 6
Bit 2
Bit 5
Bit 3
C/A
CHR
MP
PE
STOP
0
0
0
0
1
2 bits
0
Yes
1
1
0
2 bits
0
7-bit data
No
1
1
1
1
0
Yes
1
378
—
—
0
Asynchronous
—
1
mode (multi-
0
—
1
—
—
1 bit
2 bits
—
—
1 bit
2 bits
1
0
1 bit
processor
format)
8-bit data
Yes
No
1 bit
2 bits
7-bit data
1 bit
2 bits
Synchronous mode 8-bit data
No
None
Table 15.9 SMR and SCR Settings and SCI Clock Source Selection
SMR
SCR Setting
SCI Transfer Clock
Bit 7
Bit 1
Bit 0
C/A
CKE1
CKE0
Mode
0
0
0
Asynchronous
mode
1
1
0
Clock
Source
SCK Pin Function
Internal
SCI does not use SCK pin
Outputs clock with same frequency as bit
rate
External
Inputs clock with frequency of 16 times
the bit rate
Internal
Outputs serial clock
External
Inputs serial clock
1
1
0
0
1
1
0
Synchronous
mode
1
15.3.2
Operation in Asynchronous Mode
In asynchronous mode, characters are sent or received, each preceded by a start bit indicating the
start of communication and followed by one or two stop bits indicating the end of communication.
Serial communication is thus carried out with synchronization established on a character-bycharacter basis.
Inside the SCI, the transmitter and receiver are independent units, enabling full-duplex
communication. Both the transmitter and the receiver also have a double-buffered structure, so
that data can be read or written during transmission or reception, enabling continuous data
transfer.
Figure 15.2 shows the general format for asynchronous serial communication.
In asynchronous serial communication, the transmission line is usually held in the mark state (high
level). The SCI monitors the transmission line, and when it goes to the space state (low level),
recognizes a start bit and starts serial communication.
One serial communication character consists of a start bit (low level), followed by data (in LSBfirst order), a parity bit (high or low level), and finally one or two stop bits (high level).
In asynchronous mode, the SCI performs synchronization at the falling edge of the start bit in
reception. The SCI samples the data on the 8th pulse of a clock with a frequency of 16 times the
length of one bit, so that the transfer data is latched at the center of each bit.
379
Idle state
(mark state)
1
Serial
data
LSB
0
D0
1
MSB
D1
D2
D3
D4
D5
Start
bit
Transmit/receive data
1 bit
7 or 8 bits
D6
D7
0/1
1
1
Parity Stop bit(s)
bit
1 bit,
or none
1 or
2 bits
One unit of transfer data (character or frame)
Figure 15.2 Data Format in Asynchronous Communication
(Example with 8-Bit Data, Parity, Two Stop Bits)
380
Data Transfer Format: Table 15.10 shows the data transfer formats that can be used in
asynchronous mode. Any of 12 transfer formats can be selected by settings in SMR.
Table 15.10 Serial Transfer Formats (Asynchronous Mode)
SMR Settings
Serial Transfer Format and Frame Length
CHR
PE
MP
STOP
1
2
3
4
5
6
7
8
9
10
11
12
0
0
0
0
S
8-bit data
STOP
0
0
0
1
S
8-bit data
STOP STOP
0
1
0
0
S
8-bit data
P
STOP
0
1
0
1
S
8-bit data
P
STOP STOP
1
0
0
0
S
7-bit data
STOP
1
0
0
1
S
7-bit data
STOP STOP
1
1
0
0
S
7-bit data
P
STOP
1
1
0
1
S
7-bit data
P
STOP STOP
0
—
1
0
S
8-bit data
MPB STOP
0
—
1
1
S
8-bit data
MPB STOP STOP
1
—
1
0
S
7-bit data
MPB STOP
1
—
1
1
S
7-bit data
MPB STOP STOP
Legend:
S:
Start bit
STOP: Stop bit
P:
Parity bit
MPB: Multiprocessor bit
381
Clock: Either an internal clock generated by the built-in baud rate generator or an external clock
input at the SCK pin can be selected as the SCI’s serial clock, according to the setting of the C/A
bit in SMR and the CKE1 and CKE0 bits in SCR. For details of SCI clock source selection, see
table 15.9.
When an external clock is input at the SCK pin, the clock frequency should be 16 times the bit rate
used.
When the SCI is operated on an internal clock, the clock can be output from the SCK pin. The
frequency of the clock output in this case is equal to the bit rate, and the phase is such that the
rising edge of the clock is at the center of each transmit data bit, as shown in figure 15.3.
0
D0
D1
D2
D3
D4
D5
D6
D7
0/1
1
1
1 frame
Figure 15.3 Relation between Output Clock and Transfer Data Phase
(Asynchronous Mode)
Data Transfer Operations
SCI Initialization (Asynchronous Mode): Before transmitting and receiving data, first clear the
TE and RE bits in SCR to 0, then initialize the SCI as described below.
When the operating mode, transfer format, etc., is changed, the TE and RE bits must be cleared to
0 before making the change using the following procedure. When the TE bit is cleared to 0, the
TDRE flag is set to 1 and TSR is initialized. Note that clearing the RE bit to 0 does not change the
contents of the RDRF, PER, FER, and ORER flags, or the contents of RDR.
When an external clock is used the clock should not be stopped during operation, including
initialization, since operation is uncertain.
382
Figure 15.4 shows a sample SCI initialization flowchart.
[1] Set the clock selection in SCR.
Be sure to clear bits RIE, TIE,
TEIE, and MPIE, and bits TE and
RE, to 0.
Start initialization
Clear TE and RE bits in SCR to 0
Set CKE1 and CKE0 bits in SCR
(TE, RE bits 0)
[1]
Set data transfer format in
SMR and SCMR
[2]
Set value in BRR
[3]
Wait
No
1-bit interval elapsed?
Yes
Set TE and RE bits in
SCR to 1, and set RIE, TIE, TEIE,
and MPIE bits
When the clock is selected in
asynchronous mode, it is output
immediately after SCR settings are
made.
[2] Set the data transfer format in SMR
and SCMR.
[3] Write a value corresponding to the
bit rate to BRR. This is not
necessary if an external clock is
used.
[4] Wait at least one bit interval, then
set the TE bit or RE bit in SCR to 1.
Also set the RIE, TIE, TEIE, and
MPIE bits.
Setting the TE and RE bits enables
the TxD and RxD pins to be used.
[4]
<Initialization completed>
Figure 15.4 Sample SCI Initialization Flowchart
383
Serial Data Transmission (Asynchronous Mode): Figure 15.5 shows a sample flowchart for
serial transmission.
The following procedure should be used for serial data transmission.
[1]
Initialization
Start transmission
Read TDRE flag in SSR
[2]
[2] SCI status check and transmit data
write:
Read SSR and check that the
TDRE flag is set to 1, then write
transmit data to TDR and clear the
TDRE flag to 0.
No
TDRE = 1?
Yes
Write transmit data to TDR
and clear TDRE flag in SSR to 0
No
All data transmitted?
Yes
[3]
Read TEND flag in SSR
No
TEND = 1?
Yes
No
Break output?
Yes
[1] SCI initialization:
The TxD pin is automatically
designated as the transmit data
output pin.
After the TE bit is set to 1, one
frame of 1s is output and
transmission is enabled.
[4]
[3] Serial transmission continuation
procedure:
To continue serial transmission,
read 1 from the TDRE flag to
confirm that writing is possible,
then write data to TDR, and then
clear the TDRE flag to 0. Checking
and clearing of the TDRE flag is
automatic when the DTC is
activated by a transmit-data-empty
interrupt (TXI) request, and data is
written to TDR.
[4] Break output at the end of serial
transmission:
To output a break in serial
transmission, set DDR for the port
corresponding to the TxD pin to 1,
clear DR to 0, then clear the TE bit
in SCR to 0.
Clear DR to 0 and
set DDR to 1
Clear TE bit in SCR to 0
<End>
Figure 15.5 Sample Serial Transmission Flowchart
384
In serial transmission, the SCI operates as described below.
1. The SCI monitors the TDRE flag in SSR, and if it is 0, recognizes that data has been written to
TDR, and transfers the data from TDR to TSR.
2. After transferring data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts
transmission.
If the TIE bit is set to 1 at this time, a transmit data empty interrupt (TXI) is generated.
The serial transmit data is sent from the TxD pin in the following order.
a. Start bit:
One 0-bit is output.
b. Transmit data:
8-bit or 7-bit data is output in LSB-first order.
c. Parity bit or multiprocessor bit:
One parity bit (even or odd parity), or one multiprocessor bit is output.
A format in which neither a parity bit nor a multiprocessor bit is output can also be
selected.
d. Stop bit(s):
One or two 1-bits (stop bits) are output.
e. Mark state:
1 is output continuously until the start bit that starts the next transmission is sent.
3. The SCI checks the TDRE flag at the timing for sending the stop bit.
If the TDRE flag is cleared to 0, the data is transferred from TDR to TSR, the stop bit is sent,
and then serial transmission of the next frame is started.
If the TDRE flag is set to 1, the TEND flag in SSR is set to 1, the stop bit is sent, and then the
mark state is entered in which 1 is output continuously. If the TEIE bit in SCR is set to 1 at this
time, a TEI interrupt request is generated.
385
Figure 15.6 shows an example of the operation for transmission in asynchronous mode.
1
Start
bit
0
Data
D0
D1
Parity Stop Start
bit
bit
bit
D7
0/1
1
0
Data
D0
D1
Parity Stop
bit
bit
D7
0/1
1
1
Idle state
(mark state)
TDRE
TEND
TXI interrupt
Data written to TDR and
TXI interrupt
request generated TDRE flag cleared to 0 in
request generated
TXI interrupt handling routine
TEI interrupt
request generated
1 frame
Figure 15.6 Example of Operation in Transmission in Asynchronous Mode
(Example with 8-Bit Data, Parity, One Stop Bit)
386
Serial Data Reception (Asynchronous Mode): Figure 15.7 shows a sample flowchart for serial
reception.
The following procedure should be used for serial data reception.
Initialization
[1]
Start reception
[1] SCI initialization:
The RxD pin is automatically
designated as the receive data
input pin.
[2] [3] Receive error handling and
break detection:
Read ORER, PER, and
If a receive error occurs, read the
[2]
FER flags in SSR
ORER, PER, and FER flags in
SSR to identify the error. After
performing the appropriate error
Yes
handling, ensure that the ORER,
PER∨FER∨ORER= 1?
PER, and FER flags are all
[3]
cleared to 0. Reception cannot
No
Error handling
be resumed if any of these flags
(Continued on next page) are set to 1. In the case of a
framing error, a break can be
detected by reading the value of
[4]
Read RDRF flag in SSR
the input port corresponding to
the RxD pin.
No
RDRF= 1?
[4] SCI status check and receive
data read :
Read SSR and check that RDRF
= 1, then read the receive data in
RDR and clear the RDRF flag to
0. Transition of the RDRF flag
from 0 to 1 can also be identified
by an RXI interrupt.
Yes
Read receive data in RDR, and
clear RDRF flag in SSR to 0
No
All data received?
Yes
Clear RE bit in SCR to 0
<End>
[5]
[5] Serial reception continuation
procedure:
To continue serial reception,
before the stop bit for the current
frame is received, read the
RDRF flag, read RDR, and clear
the RDRF flag to 0. The RDRF
flag is cleared automatically
when the DTC is activated by an
RXI interrupt and the RDR value
is read.
Figure 15.7 Sample Serial Reception Data Flowchart
387
[3]
Error handling
No
ORER = 1?
Yes
Overrun error handling
No
FER = 1?
Yes
Yes
Break?
No
Framing error handling
Clear RE bit in SCR to 0
No
PER = 1?
Yes
Parity error handling
Clear ORER, PER, and
FER flags in SSR to 0
<End>
Figure 15.7 Sample Serial Reception Data Flowchart (cont)
388
In serial reception, the SCI operates as described below.
1. The SCI monitors the transmission line, and if a 0 stop bit is detected, performs internal
synchronization and starts reception.
2. The received data is stored in RSR in LSB-to-MSB order.
3. The parity bit and stop bit are received.
After receiving these bits, the SCI carries out the following checks.
 Parity check:
The SCI checks whether the number of 1 bits in the receive data agrees with the parity
(even or odd) set in the O/E bit in SMR.
 Stop bit check:
The SCI checks whether the stop bit is 1.
If there are two stop bits, only the first is checked.
 Status check:
The SCI checks whether the RDRF flag is 0, indicating that the receive data can be
transferred from RSR to RDR.
If all the above checks are passed, the RDRF flag is set to 1, and the receive data is stored in
RDR.
If a receive error* is detected in the error check, the operation is as shown in table 15.11.
Note: * Subsequent receive operations cannot be performed when a receive error has occurred.
Also note that the RDRF flag is not set to 1 in reception, and so the error flags must be
cleared to 0.
4. If the RIE bit in SCR is set to 1 when the RDRF flag changes to 1, a receive-data-full interrupt
(RXI) request is generated.
Also, if the RIE bit in SCR is set to 1 when the ORER, PER, or FER flag changes to 1, a
receive-error interrupt (ERI) request is generated.
389
Table 15.11 Receive Errors and Conditions for Occurrence
Receive Error
Abbreviation
Occurrence Condition
Data Transfer
Overrun error
ORER
When the next data reception is Receive data is not
completed while the RDRF flag transferred from RSR to
RDR
in SSR is set to 1
Framing error
FER
When the stop bit is 0
Parity error
PER
When the received data differs Receive data is transferred
from the parity (even or odd) set from RSR to RDR
in SMR
Receive data is transferred
from RSR to RDR
Figure 15.8 shows an example of the operation for reception in asynchronous mode.
1
Start
bit
0
Data
D0
D1
Parity Stop Start
bit
bit
bit
D7
0/1
1
0
Data
D0
D1
Parity Stop
bit
bit
D7
0/1
0
1
Idle state
(mark state)
RDRF
FER
RXI interrupt
request
generated
RDR data read and RDRF
flag cleared to 0 in RXI
interrupt handling routine
ERI interrupt request
generated by framing
error
1 frame
Figure 15.8 Example of SCI Operation in Reception
(Example with 8-Bit Data, Parity, One Stop Bit)
390
15.3.3
Multiprocessor Communication Function
The multiprocessor communication function performs serial communication using a
multiprocessor format, in which a multiprocessor bit is added to the transfer data, in asynchronous
mode. Use of this function enables data transfer to be performed among a number of processors
sharing transmission lines.
When multiprocessor communication is carried out, each receiving station is addressed by a
unique ID code.
The serial communication cycle consists of two component cycles: an ID transmission cycle
which specifies the receiving station, and a data transmission cycle. The multiprocessor bit is used
to differentiate between the ID transmission cycle and the data transmission cycle.
The transmitting station first sends the ID of the receiving station with which it wants to perform
serial communication as data with a 1 multiprocessor bit added. It then sends transmit data as data
with a 0 multiprocessor bit added.
The receiving station skips the data until data with a 1 multiprocessor bit is sent.
When data with a 1 multiprocessor bit is received, the receiving station compares that data with its
own ID. The station whose ID matches then receives the data sent next. Stations whose ID does
not match continue to skip the data until data with a 1 multiprocessor bit is again received. In this
way, data communication is carried out among a number of processors.
Figure 15.9 shows an example of inter-processor communication using a multiprocessor format.
Data Transfer Format: There are four data transfer formats.
When a multiprocessor format is specified, the parity bit specification is invalid.
For details, see table 15.10.
Clock: See the section on asynchronous mode.
391
Transmitting
station
Serial communication line
Receiving
station A
Receiving
station B
Receiving
station C
Receiving
station D
(ID = 01)
(ID = 02)
(ID = 03)
(ID = 04)
Serial
data
H'01
H'AA
(MPB = 1)
ID transmission cycle:
receiving station
specification
(MPB = 0)
Data transmission cycle:
data transmission to
receiving station specified
by ID
Legend:
MPB: Multiprocessor bit
Figure 15.9 Example of Inter-Processor Communication Using Multiprocessor Format
(Transmission of Data H'AA to Receiving Station A)
Data Transfer Operations
Multiprocessor Serial Data Transmission: Figure 15.10 shows a sample flowchart for
multiprocessor serial data transmission.
The following procedure should be used for multiprocessor serial data transmission.
392
[1] [1] SCI initialization:
Initialization
Start transmission
Read TDRE flag in SSR
[2]
No
TDRE = 1?
Yes
Write transmit data to TDR and
set MPBT bit in SSR
Clear TDRE flag to 0
No
All data transmitted?
Yes
Read TEND flag in SSR
No
TEND = 1?
Yes
No
Break output?
The TxD pin is automatically
designated as the transmit data
output pin.
After the TE bit is set to 1, one
frame of 1s is output and
transmission is enabled.
[2] SCI status check and transmit
data write:
Read SSR and check that the
TDRE flag is set to 1, then write
transmit data to TDR. Set the
MPBT bit in SSR to 0 or 1.
Finally, clear the TDRE flag to 0.
[3] Serial transmission continuation
procedure:
To continue serial transmission,
be sure to read 1 from the TDRE
flag to confirm that writing is
[3]
possible, then write data to TDR,
and then clear the TDRE flag to
0. Checking and clearing of the
TDRE flag is automatic when the
DTC is activated by a transmitdata-empty interrupt (TXI)
request, and data is written to
TDR.
[4] Break output at the end of serial
transmission:
To output a break in serial
transmission, set the port DDR to
[4]
1, clear DR to 0, then clear the
TE bit in SCR to 0.
Yes
Clear DR to 0 and set DDR to 1
Clear TE bit in SCR to 0
<End>
Figure 15.10 Sample Multiprocessor Serial Transmission Flowchart
393
In serial transmission, the SCI operates as described below.
1. The SCI monitors the TDRE flag in SSR, and if it is 0, recognizes that data has been written to
TDR, and transfers the data from TDR to TSR.
2. After transferring data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts
transmission.
If the TIE bit is set to 1 at this time, a transmit-data-empty interrupt (TXI) is generated.
The serial transmit data is sent from the TxD pin in the following order.
a. Start bit:
One 0-bit is output.
b. Transmit data:
8-bit or 7-bit data is output in LSB-first order.
c. Multiprocessor bit
One multiprocessor bit (MPBT value) is output.
d. Stop bit(s):
One or two 1-bits (stop bits) are output.
e. Mark state:
1 is output continuously until the start bit that starts the next transmission is sent.
3. The SCI checks the TDRE flag at the timing for sending the stop bit.
If the TDRE flag is cleared to 0, data is transferred from TDR to TSR, the stop bit is sent, and
then serial transmission of the next frame is started.
If the TDRE flag is set to 1, the TEND flag in SSR is set to 1, the stop bit is sent, and then the
mark state is entered in which 1 is output continuously. If the TEIE bit in SCR is set to 1 at this
time, a transmit-end interrupt (TEI) request is generated.
394
Figure 15.11 shows an example of SCI operation for transmission using a multiprocessor format.
1
Start
bit
0
Multiprocessor Stop
bit
bit
Data
D0
D1
D7
0/1
1
Start
bit
0
Multiproces- Stop
1
sor bit bit
Data
D0
D1
D7
0/1
1
Idle state
(mark state)
TDRE
TEND
TXI interrupt
request
generated
Data written to TDR
and TDRE flag cleared to
0 in TXI interrupt handling
routine
TXI interrupt
request generated
TEI interrupt
request generated
1 frame
Figure 15.11 Example of SCI Operation in Transmission
(Example with 8-Bit Data, Multiprocessor Bit, One Stop Bit)
Multiprocessor Serial Data Reception: Figure 15.12 shows a sample flowchart for
multiprocessor serial reception.
The following procedure should be used for multiprocessor serial data reception.
395
Initialization
[1]
[1] SCI initialization:
The RxD pin is automatically
designated as the receive data
input pin.
[2]
[2] ID reception cycle:
Set the MPIE bit in SCR to 1.
Start reception
Read MPIE bit in SCR
Read ORER and FER flags in SSR
[3] SCI status check, ID reception
and comparison:
Read SSR and check that the
RDRF flag is set to 1, then read
the receive data in RDR and
compare it with this station’s ID.
If the data is not this station’s ID,
set the MPIE bit to 1 again, and
clear the RDRF flag to 0.
If the data is this station’s ID,
clear the RDRF flag to 0.
Yes
FER∨ORER = 1?
No
Read RDRF flag in SSR
[3]
No
RDRF = 1?
Yes
[4] SCI status check and data
reception:
Read SSR and check that the
RDRF flag is set to 1, then read
the data in RDR.
Read receive data in RDR
No
This station's ID?
Yes
[5] Receive error handling and break
detection:
If a receive error occurs, read the
ORER and FER flags in SSR to
identify the error. After
performing the appropriate error
handling, ensure that the ORER
and FER flags are both cleared
to 0.
Reception cannot be resumed if
either of these flags is set to 1.
In the case of a framing error, a
break can be detected by reading
the RxD pin value.
Read ORER and FER flags in SSR
Yes
FER∨ORER = 1?
No
Read RDRF flag in SSR
[4]
No
RDRF = 1?
Yes
Read receive data in RDR
No
All data received?
[5]
Error handling
Yes
Clear RE bit in SCR to 0
(Continued on
next page)
<End>
Figure 15.12 Sample Multiprocessor Serial Reception Flowchart
396
[5]
Error handling
No
ORER = 1?
Yes
Overrun error handling
No
FER = 1?
Yes
Yes
Break?
No
Framing error handling
Clear RE bit in SCR to 0
Clear ORER, PER, and
FER flags in SSR to 0
<End>
Figure 15.12 Sample Multiprocessor Serial Reception Flowchart (cont)
397
Figure 15.13 shows an example of SCI operation for multiprocessor format reception.
1
Start
bit
0
Data (ID1)
MPB
D0
D1
D7
1
Stop
bit
Start
bit
1
0
Data (Data1)
MPB
D0
D1
D7
0
Stop
bit
1
1 Idle state
(mark state)
MPIE
RDRF
RDR
value
ID1
MPIE = 0
RXI interrupt
request
(multiprocessor
interrupt)
generated
RDR data read
and RDRF flag
cleared to 0 in
RXI interrupt
handling routine
If not this station’s ID, RXI interrupt request is
not generated, and RDR
MPIE bit is set to 1
retains its state
again
(a) Data does not match station’s ID
1
Start
bit
0
Data (ID2)
MPB
D0
D1
D7
1
Stop
bit
Start
bit
1
0
Data (Data2)
MPB
D0
D1
D7
0
Stop
bit
1
1 Idle state
(mark state)
MPIE
RDRF
RDR
value
ID2
ID1
MPIE = 0
RXI interrupt
request
(multiprocessor
interrupt)
generated
RDR data read and
RDRF flag cleared
to 0 in RXI interrupt
handling routine
Matches this station’s ID,
so reception continues, and
data is received in RXI
interrupt handling routine
(b) Data matches station’s ID
Figure 15.13 Example of SCI Operation in Reception
(Example with 8-Bit Data, Multiprocessor Bit, One Stop Bit)
398
Data2
MPIE bit set to 1
again
15.3.4
Operation in Synchronous Mode
In synchronous mode, data is transmitted or received in synchronization with clock pulses, making
it suitable for high-speed serial communication.
Inside the SCI, the transmitter and receiver are independent units, enabling full-duplex
communication by use of a common clock. Both the transmitter and the receiver also have a
double-buffered structure, so that data can be read or written during transmission or reception,
enabling continuous data transfer.
Figure 15.14 shows the general format for synchronous serial communication.
One unit of transfer data (character or frame)
*
*
Serial
clock
LSB
Serial
data
Bit 0
MSB
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Don’t care
Don’t care
Note: * High except in continuous transfer
Figure 15.14 Data Format in Synchronous Communication
In synchronous serial communication, data on the transmission line is output from one falling edge
of the serial clock to the next. Data is guaranteed valid at the rising edge of the serial clock.
In synchronous serial communication, one character consists of data output starting with the LSB
and ending with the MSB. After the MSB is output, the transmission line holds the MSB state.
In synchronous mode, the SCI receives data in synchronization with the rising edge of the serial
clock.
399
Data Transfer Format: A fixed 8-bit data format is used.
No parity or multiprocessor bits are added.
Clock: Either an internal clock generated by the built-in baud rate generator or an external serial
clock input at the SCK pin can be selected, according to the setting of the C/A bit in SMR and the
CKE1 and CKE0 bits in SCR. For details on SCI clock source selection, see table 15.9.
When the SCI is operated on an internal clock, the serial clock is output from the SCK pin.
Eight serial clock pulses are output in the transfer of one character, and when no transfer is
performed the clock is fixed high. When only receive operations are performed, however, the
serial clock is output until an overrun error occurs or the RE bit is cleared to 0. To perform receive
operations in units of one character, select an external clock as the clock source.
Data Transfer Operations
SCI Initialization (Synchronous Mode): Before transmitting and receiving data, first clear the
TE and RE bits in SCR to 0, then initialize the SCI as described below.
When the operating mode, transfer format, etc., is changed, the TE and RE bits must be cleared to
0 before making the change using the following procedure. When the TE bit is cleared to 0, the
TDRE flag is set to 1 and TSR is initialized. Note that clearing the RE bit to 0 does not change the
settings of the RDRF, PER, FER, and ORER flags, or the contents of RDR.
Figure 15.15 shows a sample SCI initialization flowchart.
400
[1] Set the clock selection in SCR. Be sure
to clear bits RIE, TIE, TEIE, and MPIE,
TE and RE, to 0.
Start initialization
Clear TE and RE bits in SCR to 0
[2] Set the data transfer format in SMR
and SCMR.
Set CKE1 and CKE0 bits in SCR
(TE, RE bits 0)
[1]
[3] Write a value corresponding to the bit
rate to BRR. This is not necessary if an
external clock is used.
Set data transfer format in
SMR and SCMR
[2]
Set value in BRR
[3]
[4] Wait at least one bit interval, then set
the TE bit or RE bit in SCR to 1.
Also set the RIE, TIE, TEIE, and MPIE
bits.
Setting the TE and RE bits enables the
TxD and RxD pins to be used.
Wait
No
1-bit interval elapsed?
Yes
Set TE and RE bits in SCR to 1, and
set RIE, TIE, TEIE, and MPIE bits
[4]
<Transfer start>
Note: In simultaneous transmitting and receiving, the TE and RE bits should both be
cleared to 0 or set to 1 simultaneously.
Figure 15.15 Sample SCI Initialization Flowchart
401
Serial Data Transmission (Synchronous Mode): Figure 15.16 shows a sample flowchart for
serial transmission.
The following procedure should be used for serial data transmission.
[1]
Initialization
Start transmission
Read TDRE flag in SSR
[2]
No
TDRE = 1?
Yes
Write transmit data to TDR and
clear TDRE flag in SSR to 0
No
All data transmitted?
[3]
Yes
Read TEND flag in SSR
[1] SCI initialization:
The TxD pin is automatically
designated as the transmit data output
pin.
[2] SCI status check and transmit data
write:
Read SSR and check that the TDRE
flag is set to 1, then write transmit data
to TDR and clear the TDRE flag to 0.
[3] Serial transmission continuation
procedure:
To continue serial transmission, be
sure to read 1 from the TDRE flag to
confirm that writing is possible, then
write data to TDR, and then clear the
TDRE flag to 0.
Checking and clearing of the TDRE
flag is automatic when the DTC is
activated by a transmit-data-empty
interrupt (TXI) request and data is
written to TDR.
No
TEND = 1?
Yes
Clear TE bit in SCR to 0
<End>
Figure 15.16 Sample Serial Transmission Flowchart
402
In serial transmission, the SCI operates as described below.
1. The SCI monitors the TDRE flag in SSR, and if it is 0, recognizes that data has been written to
TDR, and transfers the data from TDR to TSR.
2. After transferring data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts
transmission. If the TIE bit in SCR is set to 1 at this time, a transmit-data-empty interrupt
(TXI) is generated.
When clock output mode has been set, the SCI outputs 8 serial clock pulses. When use of an
external clock has been specified, data is output synchronized with the input clock.
The serial transmit data is sent from the TxD pin starting with the LSB (bit 0) and ending with
the MSB (bit 7).
3. The SCI checks the TDRE flag at the timing for sending the MSB (bit 7).
If the TDRE flag is cleared to 0, data is transferred from TDR to TSR, and serial transmission
of the next frame is started.
If the TDRE flag is set to 1, the TEND flag in SSR is set to 1, the MSB (bit 7) is sent, and the
TxD pin maintains its state.
If the TEIE bit in SCR is set to 1 at this time, a transmit-end interrupt (TEI) request is
generated.
4. After completion of serial transmission, the SCK pin is held in a constant state.
Figure 15.17 shows an example of SCI operation in transmission.
Transfer direction
Serial clock
Serial data
Bit 0
Bit 1
Bit 7
Bit 0
Bit 1
Bit 6
Bit 7
TDRE
TEND
TXI interrupt
request generated
TXI interrupt
Data written to TDR
request generated
and TDRE flag
cleared to 0 in TXI
interrupt handling routine
TEI interrupt
request generated
1 frame
Figure 15.17 Example of SCI Operation in Transmission
403
Serial Data Reception (Synchronous Mode): Figure 15.18 shows a sample flowchart for serial
reception.
The following procedure should be used for serial data reception.
When changing the operating mode from asynchronous to synchronous, be sure to check that the
ORER, PER, and FER flags are all cleared to 0.
The RDRF flag will not be set if the FER or PER flag is set to 1, and neither transmit nor receive
operations will be possible.
404
[1]
Initialization
Start reception
[2]
Read ORER flag in SSR
Yes
[3]
ORER= 1?
No
Error handling
(Continued below)
Read RDRF flag in SSR
[4]
No
RDRF= 1?
Yes
Read receive data in RDR, and
clear RDRF flag in SSR to 0
No
All data received?
Yes
Clear RE bit in SCR to 0
[5]
[1]
SCI initialization:
The RxD pin is automatically
designated as the receive data
input pin.
[2] [3] Receive error handling:
If a receive error occurs, read the
ORER flag in SSR , and after
performing the appropriate error
handling, clear the ORER flag to
0. Transfer cannot be resumed if
the ORER flag is set to 1.
[4] SCI status check and receive
data read:
Read SSR and check that the
RDRF flag is set to 1, then read
the receive data in RDR and
clear the RDRF flag to 0.
Transition of the RDRF flag from
0 to 1 can also be identified by
an RXI interrupt.
[5] Serial reception continuation
procedure:
To continue serial reception,
before the MSB (bit 7) of the
current frame is received, finish
reading the RDRF flag, reading
RDR, and clearing the RDRF flag
to 0. The RDRF flag is cleared
automatically when the DTC is
activated by a receive-data-full
interrupt (RXI) request and the
RDR value is read.
<End>
[3]
Error handling
Overrun error handling
Clear ORER flag in SSR to 0
<End>
Figure 15.18 Sample Serial Reception Flowchart
405
In serial reception, the SCI operates as described below.
1. The SCI performs internal initialization in synchronization with serial clock input or output.
2. The received data is stored in RSR in LSB-to-MSB order.
After reception, the SCI checks whether the RDRF flag is 0 and the receive data can be
transferred from RSR to RDR.
If this check is passed, the RDRF flag is set to 1, and the receive data is stored in RDR. If a
receive error is detected in the error check, the operation is as shown in table 15.11.
Neither transmit nor receive operations can be performed subsequently when a receive error
has been found in the error check.
3. If the RIE bit in SCR is set to 1 when the RDRF flag changes to 1, a receive-data-full interrupt
(RXI) request is generated.
Also, if the RIE bit in SCR is set to 1 when the ORER flag changes to 1, a receive-error
interrupt (ERI) request is generated.
Figure 15.19 shows an example of SCI operation in reception.
Serial
clock
Serial
data
Bit 7
Bit 0
Bit 7
Bit 0
Bit 1
Bit 6
Bit 7
RDRF
ORER
RXI interrupt request
generated
RDR data read and
RDRF flag cleared to 0
in RXI interrupt handling
routine
RXI interrupt request
generated
ERI interrupt request
generated by overrun
error
1 frame
Figure 15.19 Example of SCI Operation in Reception
Simultaneous Serial Data Transmission and Reception (Synchronous Mode): Figure 15.20
shows a sample flowchart for simultaneous serial transmit and receive operations.
The following procedure should be used for simultaneous serial data transmit and receive
operations.
406
Initialization
[1] SCI initialization:
[1]
The TxD pin is designated as the
transmit data output pin, and the
RxD pin is designated as the
receive data input pin, enabling
simultaneous transmit and receive
operations.
Start transmission/reception
Read TDRE flag in SSR
[2]
[2] SCI status check and transmit data
write:
Read SSR and check that the
TDRE flag is set to 1, then write
transmit data to TDR and clear the
TDRE flag to 0.
Transition of the TDRE flag from 0
to 1 can also be identified by a TXI
interrupt.
No
TDRE = 1?
Yes
Write transmit data to TDR and
clear TDRE flag in SSR to 0
[3] Receive error handling:
If a receive error occurs, read the
ORER flag in SSR , and after
performing the appropriate error
handling, clear the ORER flag to 0.
Transmission/reception cannot be
resumed if the ORER flag is set to
1.
Read ORER flag in SSR
ORER = 1?
No
Read RDRF flag in SSR
Yes
[3]
Error handling
[4] SCI status check and receive data
read:
Read SSR and check that the
RDRF flag is set to 1, then read the
receive data in RDR and clear the
RDRF flag to 0. Transition of the
RDRF flag from 0 to 1 can also be
identified by an RXI interrupt.
[4]
No
RDRF = 1?
Yes
[5] Serial transmission/reception
Read receive data in RDR, and
clear RDRF flag in SSR to 0
No
All data received?
[5]
Yes
Clear TE and RE bits in SCR to 0
<End>
Note: When switching from transmit or receive operation to simultaneous
transmit and receive operations, first clear the TE bit and RE bit to
0, then set both these bits to 1 simultaneously.
continuation procedure:
To continue serial transmission/
reception, before the MSB (bit 7) of
the current frame is received, finish
reading the RDRF flag, reading
RDR, and clearing the RDRF flag to
0. Also, before the MSB (bit 7) of
the current frame is transmitted,
read 1 from the TDRE flag to
confirm that writing is possible, then
write data to TDR and clear the
TDRE flag to 0.
Checking and clearing of the TDRE
flag is automatic when the DTC is
activated by a transmit-data-empty
interrupt (TXI) request and data is
written to TDR. Also, the RDRF flag
is cleared automatically when the
DTC is activated by a receive-datafull interrupt (RXI) request and the
RDR value is read.
Figure 15.20 Sample Flowchart of Simultaneous Serial Transmit and Receive Operations
407
15.4
SCI Interrupts
The SCI has four interrupt sources: the transmit-end interrupt (TEI) request, receive-error interrupt
(ERI) request, receive-data-full interrupt (RXI) request, and transmit-data-empty interrupt (TXI)
request. Table 15.12 shows the interrupt sources and their relative priorities. Individual interrupt
sources can be enabled or disabled with the TIE, RIE, and TEIE bits in SCR. Each kind of
interrupt request is sent to the interrupt controller independently.
When the TDRE flag in SSR is set to 1, a TXI interrupt request is generated. When the TEND flag
in SSR is set to 1, a TEI interrupt request is generated. A TXI interrupt can activate the DTC to
perform data transfer. The TDRE flag is cleared to 0 automatically when data transfer is
performed by the DTC. The DTC cannot be activated by a TEI interrupt request.
When the RDRF flag in SSR is set to 1, an RXI interrupt request is generated. When the ORER,
PER, or FER flag in SSR is set to 1, an ERI interrupt request is generated. An RXI interrupt can
activate the DTC to perform data transfer. The RDRF flag is cleared to 0 automatically when data
transfer is performed by the DTC. The DTC cannot be activated by an ERI interrupt request.
Table 15.12 SCI Interrupt Sources
Channel
Interrupt
Source Description
DTC Activation
0
ERI
Receive error (ORER, FER, or PER)
Not possible
RXI
Receive data register full (RDRF)
Possible
TXI
Transmit data register empty (TDRE)
Possible
TEI
Transmit end (TEND)
Not possible
ERI
Receive error (ORER, FER, or PER)
Not possible
RXI
Receive data register full (RDRF)
Possible
TXI
Transmit data register empty (TDRE)
Possible
TEI
Transmit end (TEND)
Not possible
1
Priority*
High
Low
Note: * The table shows the initial state immediately after a reset. Relative channel priorities can be
changed by the interrupt controller.
The TEI interrupt is requested when the TEND flag is set to 1 while the TEIE bit is set to 1. The
TEND flag is cleared at the same time as the TDRE flag. Consequently, if a TEI interrupt and a
TXI interrupt are requested simultaneously, the TXI interrupt will have priority for acceptance,
and the TDRE flag and TEND flag may be cleared. Note that the TEI interrupt will not be
accepted in this case.
408
15.5
Usage Notes
The following points should be noted when using the SCI.
Relation between Writes to TDR and the TDRE Flag: The TDRE flag in SSR is a status flag
that indicates that transmit data has been transferred from TDR to TSR. When the SCI transfers
data from TDR to TSR, the TDRE flag is set to 1.
Data can be written to TDR regardless of the state of the TDRE flag. However, if new data is
written to TDR when the TDRE flag is cleared to 0, the data stored in TDR will be lost since it has
not yet been transferred to TSR. It is therefore essential to check that the TDRE flag is set to 1
before writing transmit data to TDR.
Operation when Multiple Receive Errors Occur Simultaneously: If a number of receive errors
occur at the same time, the state of the status flags in SSR is as shown in table 15.13. If there is an
overrun error, data is not transferred from RSR to RDR, and the receive data is lost.
Table 15.13 State of SSR Status Flags and Transfer of Receive Data
SSR Status Flags
RDRF
ORER
FER
PER
Receive Data Transfer
RSR to RDR
1
1
0
0
X
Overrun error
0
0
1
0
O
Framing error
0
0
0
1
O
Parity error
1
1
1
0
X
Overrun error + framing error
1
1
0
1
X
Overrun error + parity error
0
0
1
1
O
Framing error + parity error
1
1
1
1
X
Overrun error + framing error +
parity error
Receive Errors
Notes: O: Receive data is transferred from RSR to RDR.
X: Receive data is not transferred from RSR to RDR.
Break Detection and Processing: When a framing error (FER) is detected, a break can be
detected by reading the RxD pin value directly. In a break, the input from the RxD pin becomes all
0s, and so the FER flag is set, and the parity error flag (PER) may also be set.
Note that, since the SCI continues the receive operation after receiving a break, even if the FER
flag is cleared to 0, it will be set to 1 again.
Sending a Break: The TxD pin has a dual function as an I/O port whose direction (input or
output) is determined by DR and DDR. This feature can be used to send a break.
409
Between serial transmission initialization and setting of the TE bit to 1, the mark state is replaced
by the value of DR (the pin does not function as the TxD pin until the TE bit is set to 1).
Consequently, DDR and DR for the port corresponding to the TxD pin should first be set to 1.
To send a break during serial transmission, first clear DR to 0, then clear the TE bit to 0.
When the TE bit is cleared to 0, the transmitter is initialized regardless of the current transmission
state, the TxD pin becomes an I/O port, and 0 is output from the TxD pin.
Receive Error Flags and Transmit Operations (Synchronous Mode Only):
Transmission cannot be started when a receive error flag (ORER, PER, or FER) is set to 1, even if
the TDRE flag is cleared to 0. Be sure to clear the receive error flags to 0 before starting
transmission.
Note also that receive error flags cannot be cleared to 0 even if the RE bit is cleared to 0.
Receive Data Sampling Timing and Reception Margin in Asynchronous Mode:
In asynchronous mode, the SCI operates on a base clock with a frequency of 16 times the transfer
rate.
In reception, the SCI samples the falling edge of the start bit using the base clock, and performs
internal synchronization. Receive data is latched internally at the rising edge of the 8th pulse of the
base clock. This is illustrated in figure 15.21.
16 clocks
8 clocks
0
7
15 0
7
15 0
Internal base
clock
Receive data
(RxD)
Start bit
D0
Synchronization
sampling timing
Data sampling
timing
Figure 15.21 Receive Data Sampling Timing in Asynchronous Mode
410
D1
Thus the receive margin in asynchronous mode is given by equation (1) below.
M = 0.5 –
Where M:
N:
D:
L:
F:
1
D – 0.5
(1 + F) × 100%
– (L – 0.5)F –
2N
N
.......... (1)
Receive margin (%)
Ratio of bit rate to clock (N = 16)
Clock duty (D = 0 to 1.0)
Frame length (L = 9 to 12)
Absolute value of clock rate deviation
Assuming values of F = 0 and D = 0.5 in equation (1), a receive margin of 46.875% is given by
equation (2) below.
When D = 0.5 and F = 0,
M = 0.5 –
1
× 100%
2 × 16
= 46.875%
.......... (2)
However, this is only a theoretical value, and a margin of 20% to 30% should be allowed in
system design.
Restrictions on Use of DTC
• When an external clock source is used as the serial clock, the transmit clock should not be
input until at least 5 ø clock cycles after TDR is updated by the DTC. Misoperation may occur
if the transmit clock is input within 4 clock cycles after TDR is updated. (Figure 15.22)
• When RDR is read by the DTC, be sure to set the activation source to the relevant SCI receivedata-full interrupt (RXI).
SCK
t
TDRE
LSB
Serial data
D0
D1
D2
D3
D4
D5
D6
D7
Note: When operating on an external clock, set t > 4 states.
Figure 15.22 Example of Synchronous Transmission by DTC
411
412
Section 16 I2C Bus Interface (IIC) [H8S/2128 Series Option]
A two-channel I2C bus interface is available as an option in the H8S/2128 Series. The I2C bus
interface is not available for the H8S/2124 Series. Observe the following notes when using this
option.
1. For mask-ROM versions, a W is added to the part number in products in which this optional
function is used.
Example: HD6432127RWF
2. The product number is identical for F-ZTAT versions. However, be sure to inform your
Hitachi sales representative if you will be using this option.
16.1
Overview
A two-channel I2C bus interface is available for the H8S/2128 Series as an option. The I2C bus
interface conforms to and provides a subset of the Philips I2C bus (inter-IC bus) interface
functions. The register configuration that controls the I2C bus differs partly from the Philips
configuration, however.
Each I2C bus interface channel uses only one data line (SDA) and one clock line (SCL) to transfer
data, saving board and connector space.
16.1.1
Features
• Selection of addressing format or non-addressing format
 I2C bus format: addressing format with acknowledge bit, for master/slave operation
 Serial format: non-addressing format without acknowledge bit, for master operation only
• Conforms to Philips I2C bus interface (I2C bus format)
• Two ways of setting slave address (I2C bus format)
• Start and stop conditions generated automatically in master mode (I2C bus format)
• Selection of acknowledge output levels when receiving (I2C bus format)
• Automatic loading of acknowledge bit when transmitting (I2C bus format)
• Wait function in master mode (I 2C bus format)
A wait can be inserted by driving the SCL pin low after data transfer, excluding
acknowledgement. The wait can be cleared by clearing the interrupt flag.
413
• Wait function in slave mode (I2C bus format)
A wait request can be generated by driving the SCL pin low after data transfer, excluding
acknowledgement. The wait request is cleared when the next transfer becomes possible.
• Three interrupt sources
 Data transfer end (including transmission mode transition with I 2C bus format and address
reception after loss of master arbitration)
 Address match: when any slave address matches or the general call address is received in
slave receive mode (I2C bus format)
 Stop condition detection
• Selection of 16 internal clocks (in master mode)
• Direct bus drive (with SCL and SDA pins)
 Two pins—P52/SCL0 and P47/SDA0—(normally NMOS push-pull outputs) function as
NMOS open-drain outputs when the bus drive function is selected.
 Two pins—P24/SCL1 and P23/SDA1—(normally CMOS pins) function as NMOS-only
outputs when the bus drive function is selected.
• Automatic switching from formatless mode to I2C bus format (channel 0 only)
 Formatless operation (no start/stop conditions, non-addressing mode) in slave mode
 Operation using a common data pin (SDA) and independent clock pins (VSYNCI, SCL)
 Automatic switching from formatless mode to I2C bus format on the fall of the SCL pin
16.1.2
Block Diagram
Figure 16.1 shows a block diagram of the I2C bus interface.
Figure 16.2 shows an example of I/O pin connections to external circuits. Channel 0 I/O pins and
channel 1 I/O pins differ in structure, and have different specifications for permissible applied
voltages. For details, see section 22, Electrical Characteristics.
414
Formatless dedicated
clock (channel 0 only)
ø
PS
ICCR
SCL
Clock
control
Noise
canceler
Bus state
decision
circuit
SDA
ICSR
Arbitration
decision
circuit
ICDRT
Output data
control
circuit
ICDRS
Internal data bus
ICMR
ICDRR
Noise
canceler
Address
comparator
SAR, SARX
Legend:
ICCR: I2C bus control register
ICMR: I2C bus mode register
ICSR: I2C bus status register
ICDR: I2C bus data register
SAR: Slave address register
SARX: Slave address register X
PS:
Prescaler
Interrupt
generator
Interrupt
request
Figure 16.1 Block Diagram of I2C Bus Interface
415
Vcc
VCC
SCL
SCL
SDA
SDA
SCL in
SDA out
SCL
SDA
SDA in
SCL
SDA
SCL out
(Master)
SCL in
H8S/2138 Series chip
SCL out
SCL out
SDA in
SDA in
SDA out
SDA out
(Slave 1)
SCL in
(Slave 2)
Figure 16.2 I2C Bus Interface Connections (Example: H8S/2128 Series Chip as Master)
16.1.3
Input/Output Pins
Table 16.1 summarizes the input/output pins used by the I2C bus interface.
Table 16.1 I2C Bus Interface Pins
Channel
Name
Abbreviation
I/O
Function
0
Serial clock
SCL0
I/O
IIC0 serial clock input/output
Serial data
SDA0
I/O
IIC0 serial data input/output
Formatless
serial clock
VSYNCI
Input
IIC0 formatless
serial clock input
Serial clock
SCL1
I/O
IIC1 serial clock input/output
Serial data
SDA1
I/O
IIC1 serial data input/output
1
Note: In the text, the channel subscript is omitted, and only SCL and SDA are used.
416
16.1.4
Register Configuration
Table 16.2 summarizes the registers of the I2C bus interface.
Table 16.2 Register Configuration
Channel
Name
Abbreviation
R/W
Initial Value
Address* 1
0
I 2C bus control register
ICCR0
R/W
H'01
H'FFD8
2
ICSR0
R/W
H'00
H'FFD9
2
I C bus data register
ICDR0
R/W
—
H'FFDE* 2
I 2C bus mode register
ICMR0
R/W
H'00
H'FFDF* 2
Slave address register
SAR0
R/W
H'00
H'FFDF* 2
Second slave address
register
SARX0
R/W
H'01
H'FFDE* 2
I 2C bus control register
I C bus status register
1
ICCR1
R/W
H'01
H'FF88
2
ICSR1
R/W
H'00
H'FF89
2
I C bus data register
ICDR1
R/W
—
H'FF8E* 2
I 2C bus mode register
ICMR1
R/W
H'00
H'FF8F* 2
Slave address register
SAR1
R/W
H'00
H'FF8F* 2
Second slave address
register
SARX1
R/W
H'01
H'FF8E* 2
Serial/timer control
register
STCR
R/W
H'00
H'FFC3
DDC switch register
DDCSWR
R/W
H'0F
H'FEE6
Module stop control
register
MSTPCRH
R/W
H'3F
H'FF86
MSTPCRL
R/W
H'FF
H'FF87
I C bus status register
Common
Notes: 1. Lower 16 bits of the address.
2. The register that can be written or read depends on the ICE bit in the I 2C bus control
register. The slave address register can be accessed when ICE = 0, and the I2C bus
mode register can be accessed when ICE = 1.
The I 2C bus interface registers are assigned to the same addresses as other registers.
Register selection is performed by means of the IICE bit in the serial/timer control
register (STCR).
417
16.2
Register Descriptions
16.2.1
I2C Bus Data Register (ICDR)
Bit
7
6
5
4
3
2
1
0
ICDR7
ICDR6
ICDR5
ICDR4
ICDR3
ICDR2
ICDR1
ICDR0
Initial value
—
—
—
—
—
—
—
—
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
• ICDRR
Bit
ICDRR7 ICDRR6 ICDRR5 ICDRR4 ICDRR3 ICDRR2 ICDRR1 ICDRR0
Initial value
—
—
—
—
—
—
—
—
Read/Write
R
R
R
R
R
R
R
R
7
6
5
4
3
2
1
0
• ICDRS
Bit
ICDRS7 ICDRS6 ICDRR5 ICDRS4 ICDRS3 ICDRS2 ICDRS1 ICDRS0
Initial value
—
—
—
—
—
—
—
—
Read/Write
—
—
—
—
—
—
—
—
7
6
5
4
3
2
1
0
• ICDRT
Bit
ICDRT7 ICDRT6 ICDRT5 ICDRT4 ICDRT3 ICDRT2 ICDRT1 ICDRT0
Initial value
—
—
—
—
—
—
—
—
Read/Write
W
W
W
W
W
W
W
W
—
—
• TDRE, RDRF (internal flags)
Bit
TDRE
RDRF
Initial value
0
0
Read/Write
—
—
418
ICDR is an 8-bit readable/writable register that is used as a transmit data register when
transmitting and a receive data register when receiving. ICDR is divided internally into a shift
register (ICDRS), receive buffer (ICDRR), and transmit buffer (ICDRT). ICDRS cannot be read or
written by the CPU, ICDRR is read-only, and ICDRT is write-only. Data transfers among the three
registers are performed automatically in coordination with changes in the bus state, and affect the
status of internal flags such as TDRE and RDRF.
If IIC is in transmit mode and the next data is in ICDRT (the TDRE flag is 0) following
transmission/reception of one frame of data using ICDRS, data is transferred automatically from
ICDRT to ICDRS. If IIC is in receive mode and no previous data remains in ICDRR (the RDRF
flag is 0) following transmission/reception of one frame of data using ICDRS, data is transferred
automatically from ICDRS to ICDRR.
If the number of bits in a frame, excluding the acknowledge bit, is less than 8, transmit data and
receive data are stored differently. Transmit data should be written justified toward the MSB side
when MLS = 0, and toward the LSB side when MLS = 1. Receive data bits read from the LSB
side should be treated as valid when MLS = 0, and bits read from the MSB side when MLS = 1.
ICDR is assigned to the same address as SARX, and can be written and read only when the ICE
bit is set to 1 in ICCR.
The value of ICDR is undefined after a reset.
The TDRE and RDRF flags are set and cleared under the conditions shown below. Setting the
TDRE and RDRF flags affects the status of the interrupt flags.
419
TDRE
Description
0
The next transmit data is in ICDR (ICDRT), or transmission cannot
be started
(Initial value)
[Clearing conditions]
•
•
•
•
When transmit data is written in ICDR (ICDRT) in transmit mode (TRS = 1)
When a stop condition is detected in the bus line state after a stop condition is
issued with the I 2C bus format or serial format selected
When a stop condition is detected with the I 2C bus format selected
In receive mode (TRS = 0)
(A 0 write to TRS during transfer is valid after reception of a frame containing an
acknowledge bit)
1
The next transmit data can be written in ICDR (ICDRT)
[Setting conditions]
•
•
•
•
In transmit mode (TRS = 1), when a start condition is detected in the bus line state
after a start condition is issued in master mode with the I 2C bus format or serial
format selected
At the first setting to the transmit mode (TRS = 1) (first transmit mode setting only)
after switching from I2C bus mode to the formatless mode.
When data is transferred from ICDRT to ICDRS
(Data transfer from ICDRT to ICDRS when TRS = 1 and TDRE = 0, and ICDRS is
empty)
when detecting a start condition and then switching from slave receive mode (TRS
= 0) state to transmit mode (TRS = 1 ) (first transmit mode switching only).
RDRF
Description
0
The data in ICDR (ICDRR) is invalid
(Initial value)
[Clearing condition]
When ICDR (ICDRR) receive data is read in receive mode
1
The ICDR (ICDRR) receive data can be read
[Setting condition]
When data is transferred from ICDRS to ICDRR
(Data transfer from ICDRS to ICDRR in case of normal termination with TRS = 0 and
RDRF = 0)
420
16.2.2
Slave Address Register (SAR)
Bit
7
6
5
4
3
2
1
0
SVA6
SVA5
SVA4
SVA3
SVA2
SVA1
SVA0
FS
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
SAR is an 8-bit readable/writable register that stores the slave address and selects the
communication format. When the chip is in slave mode (and the addressing format is selected), if
the upper 7 bits of SAR match the upper 7 bits of the first frame received after a start condition,
the chip operates as the slave device specified by the master device. SAR is assigned to the same
address as ICMR, and can be written and read only when the ICE bit is cleared to 0 in ICCR.
SAR is initialized to H'00 by a reset and in hardware standby mode.
Bits 7 to 1—Slave Address (SVA6 to SVA0): Set a unique address in bits SVA6 to SVA0,
differing from the addresses of other slave devices connected to the I2C bus.
Bit 0—Format Select (FS): Used together with the FSX bit in SARX and the SW bit in
DDCSWR to select the communication format.
• I2C bus format: addressing format with acknowledge bit
• Synchronous serial format: non-addressing format without acknowledge bit, for master mode
only
• Formatless mode (channel 0 only): non-addressing format with or without acknowledge bit,
slave mode only, start/stop conditions not detected
The FS bit also specifies whether or not SAR slave address recognition is performed in slave
mode.
421
DDCSWR
Bit 6
SAR
Bit 0
SARX
Bit 0
SW
FS
FSX
Operating Mode
0
0
0
I 2C bus format
•
1
I C bus format
•
•
1
1
1
SAR slave address ignored
SARX slave address recognized
Synchronous serial format
•
0
(Initial value)
SAR slave address recognized
SARX slave address ignored
I 2C bus format
0
•
•
1
SAR and SARX slave addresses recognized
2
SAR and SARX slave addresses ignored
0
Formatless mode (start/stop conditions not detected)
1
•
Acknowledge bit used
0
1
Formatless mode* (start/stop conditions not detected)
•
No acknowledge bit
Note: * Do not set this mode when automatic switching to the I 2C bus format is performed by means
of the DDCSWR setting.
16.2.3
Second Slave Address Register (SARX)
Bit
7
6
5
4
3
2
1
0
SVAX6
SVAX5
SVAX4
SVAX3
SVAX2
SVAX1
SVAX0
FSX
Initial value
0
0
0
0
0
0
0
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
SARX is an 8-bit readable/writable register that stores the second slave address and selects the
communication format. When the chip is in slave mode (and the addressing format is selected), if
the upper 7 bits of SARX match the upper 7 bits of the first frame received after a start condition,
the chip operates as the slave device specified by the master device. SARX is assigned to the same
address as ICDR, and can be written and read only when the ICE bit is cleared to 0 in ICCR.
SARX is initialized to H'01 by a reset and in hardware standby mode.
Bits 7 to 1—Second Slave Address (SVAX6 to SVAX0): Set a unique address in bits SVAX6 to
SVAX0, differing from the addresses of other slave devices connected to the I2C bus.
422
Bit 0—Format Select X (FSX): Used together with the FS bit in SAR and the SW bit in
DDCSWR to select the communication format.
• I2C bus format: addressing format with acknowledge bit
• Synchronous serial format: non-addressing format without acknowledge bit, for master mode
only
• Formatless mode: non-addressing format with or without acknowledge bit, slave mode only,
start/stop conditions not detected
The FSX bit also specifies whether or not SARX slave address recognition is performed in slave
mode. For details, see the description of the FS bit in SAR.
16.2.4
I2C Bus Mode Register (ICMR)
Bit
7
6
5
4
3
2
1
0
MLS
WAIT
CKS2
CKS1
CKS0
BC2
BC1
BC0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
ICMR is an 8-bit readable/writable register that selects whether the MSB or LSB is transferred
first, performs master mode wait control, and selects the master mode transfer clock frequency and
the transfer bit count. ICMR is assigned to the same address as SAR. ICMR can be written and
read only when the ICE bit is set to 1 in ICCR.
ICMR is initialized to H'00 by a reset and in hardware standby mode.
Bit 7—MSB-First/LSB-First Select (MLS): Selects whether data is transferred MSB-first or
LSB-first.
If the number of bits in a frame, excluding the acknowledge bit, is less than 8, transmit data and
receive data are stored differently. Transmit data should be written justified toward the MSB side
when MLS = 0, and toward the LSB side when MLS = 1. Receive data bits read from the LSB
side should be treated as valid when MLS = 0, and bits read from the MSB side when MLS = 1.
Do not set this bit to 1 when the I 2C bus format is used.
Bit 7
MLS
Description
0
MSB-first
1
LSB-first
(Initial value)
423
Bit 6—Wait Insertion Bit (WAIT): Selects whether to insert a wait between the transfer of data
and the acknowledge bit, in master mode with the I2C bus format. When WAIT is set to 1, after
the fall of the clock for the final data bit, the IRIC flag is set to 1 in ICCR, and a wait state begins
(with SCL at the low level). When the IRIC flag is cleared to 0 in ICCR, the wait ends and the
acknowledge bit is transferred. If WAIT is cleared to 0, data and acknowledge bits are transferred
consecutively with no wait inserted.
The IRIC flag in ICCR is set to 1 on completion of the acknowledge bit transfer, regardless of the
WAIT setting.
The setting of this bit is invalid in slave mode.
Bit 6
WAIT
Description
0
Data and acknowledge bits transferred consecutively
1
Wait inserted between data and acknowledge bits
424
(Initial value)
Bits 5 to 3—Serial Clock Select (CKS2 to CKS0): These bits, together with the IICX1 (channel
1) or IICX0 (channel 0) bit in the STCR register, select the serial clock frequency in master mode.
They should be set according to the required transfer rate.
STCR
Bit 5 or 6 Bit 5 Bit 4 Bit 3
Transfer Rate
IICX
CKS2 CKS1 CKS0 Clock
ø=
5 MHz
ø=
8 MHz
ø=
10 MHz
ø=
16 MHz
ø=
20 MHz
0
0
0
1
1
0
1
1
0
0
1
1
0
1
0
ø/28
179 kHz
286 kHz
357 kHz
571 kHz*
714 kHz*
1
ø/40
125 kHz
200 kHz
250 kHz
400 kHz
500 kHz*
0
ø/48
104 kHz
167 kHz
208 kHz
333 kHz
417 kHz*
1
ø/64
78.1 kHz
125 kHz
156 kHz
250 kHz
313 kHz
0
ø/80
62.5 kHz
100 kHz
125 kHz
200 kHz
250 kHz
1
ø/100
50.0 kHz
80.0 kHz
100 kHz
160 kHz
200 kHz
0
ø/112
44.6 kHz
71.4 kHz
89.3 kHz
143 kHz
179 kHz
1
ø/128
39.1 kHz
62.5 kHz
78.1 kHz
125 kHz
156 kHz
0
ø/56
89.3 kHz
143 kHz
179 kHz
286 kHz
357 kHz
1
ø/80
62.5 kHz
100 kHz
125 kHz
200 kHz
250 kHz
0
ø/96
52.1 kHz
83.3 kHz
104 kHz
167 kHz
208 kHz
1
ø/128
39.1 kHz
62.5 kHz
78.1 kHz
125 kHz
156 kHz
0
ø/160
31.3 kHz
50.0 kHz
62.5 kHz
100 kHz
125 kHz
1
ø/200
25.0 kHz
40.0 kHz
50.0 kHz
80.0 kHz
100 kHz
0
ø/224
22.3 kHz
35.7 kHz
44.6 kHz
71.4 kHz
89.3 kHz
1
ø/256
19.5 kHz
31.3 kHz
39.1 kHz
62.5 kHz
78.1 kHz
2
Note: * Outside the I C bus interface specification range (normal mode: max. 100 kHz; high-speed
mode: max. 400 kHz).
425
Bits 2 to 0—Bit Counter (BC2 to BC0): Bits BC2 to BC0 specify the number of bits to be
transferred next. With the I 2C bus format (when the FS bit in SAR or the FSX bit in SARX is 0),
the data is transferred with one addition acknowledge bit. Bits BC2 to BC0 settings should be
made during an interval between transfer frames. If bits BC2 to BC0 are set to a value other than
000, the setting should be made while the SCL line is low.
The bit counter is initialized to 000 by a reset and when a start condition is detected. The value
returns to 000 at the end of a data transfer, including the acknowledge bit.
Bit 2
Bit 1
Bit 0
BC2
BC1
BC0
Synchronous Serial Format
I 2C Bus Format
0
0
0
8
9
1
1
2
0
2
3
1
3
4
0
4
5
1
5
6
0
6
7
1
7
8
1
1
0
1
16.2.5
Bits/Frame
(Initial value)
I2C Bus Control Register (ICCR)
Bit
7
6
5
4
3
2
1
0
ICE
IEIC
MST
TRS
ACKE
BBSY
IRIC
SCP
Initial value
0
0
0
0
0
0
0
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/(W)*
W
Note: * Only 0 can be written, to clear the flag.
ICCR is an 8-bit readable/writable register that enables or disables the I2C bus interface, enables or
disables interrupts, selects master or slave mode and transmission or reception, enables or disables
acknowledgement, confirms the I2C bus interface bus status, issues start/stop conditions, and
performs interrupt flag confirmation.
ICCR is initialized to H'01 by a reset and in hardware standby mode.
426
Bit 7—I2C Bus Interface Enable (ICE): Selects whether or not the I2C bus interface is to be
used. When ICE is set to 1, port pins function as SCL and SDA input/output pins and transfer
operations are enabled. When ICE is cleared to 0, I2C bus interface module functions are halted
and its internal states are cleared.
The SAR and SARX registers can be accessed when ICE is 0. The ICMR and ICDR registers can
be accessed when ICE is 1.
Bit 7
ICE
Description
0
I 2C bus interface module disabled, with SCL and SDA signal pins
set to port function
(Initial value)
I 2C bus interface module internal state initialization
SAR and SARX can be accessed
1
I 2C bus interface module enabled for transfer operations (pins SCL and SCA are driving
the bus)
ICMR and ICDR can be accessed
Bit 6—I2C Bus Interface Interrupt Enable (IEIC): Enables or disables interrupts from the I2C
bus interface to the CPU.
Bit 6
IEIC
Description
0
Interrupts disabled
1
Interrupts enabled
(Initial value)
Bit 5—Master/Slave Select (MST)
Bit 4—Transmit/Receive Select (TRS)
MST selects whether the I2C bus interface operates in master mode or slave mode.
TRS selects whether the I2C bus interface operates in transmit mode or receive mode.
In master mode with the I2C bus format, when arbitration is lost, MST and TRS are both reset by
hardware, causing a transition to slave receive mode. In slave receive mode with the addressing
format (FS = 0 or FSX = 0), hardware automatically selects transmit or receive mode according to
the R/W bit in the first frame after a start condition.
Modification of the TRS bit during transfer is deferred until transfer of the frame containing the
acknowledge bit is completed, and the changeover is made after completion of the transfer.
MST and TRS select the operating mode as follows.
427
Bit 5
Bit 4
MST
TRS
Operating Mode
0
0
Slave receive mode
1
Slave transmit mode
0
Master receive mode
1
Master transmit mode
1
(Initial value)
Bit 5
MST
Description
0
Slave mode
(Initial value)
[Clearing conditions]
1. When 0 is written by software
2. When bus arbitration is lost after transmission is started in I 2C bus
format master mode
1
Master mode
[Setting conditions]
1. When 1 is written by software (in cases other than clearing condition 2)
2. When 1 is written in MST after reading MST = 0 (in case of clearing condition 2)
Bit 4
TRS
Description
0
Receive mode
(Initial value)
[Clearing conditions]
1. When 0 is written by software (in cases other than setting condition
3)
2. When 0 is written in TRS after reading TRS = 1 (in case of clearing
condition 3)
3. When bus arbitration is lost after transmission is started in I 2C bus
format master mode
4. When the SW bit in DDCSWR changes from 1 to 0
1
Transmit mode
[Setting conditions]
1. When 1 is written by software (in cases other than clearing conditions 3 and 4)
2. When 1 is written in TRS after reading TRS = 0 (in case of clearing conditions 3
and 4)
3. When a 1 is received as the R/W bit of the first frame in I2C bus format slave mode
428
Bit 3—Acknowledge Bit Judgement Selection (ACKE): Specifies whether the value of the
acknowledge bit returned from the receiving device when using the I2C bus format is to be ignored
and continuous transfer is performed, or transfer is to be aborted and error handling, etc.,
performed if the acknowledge bit is 1. When the ACKE bit is 0, the value of the received
acknowledge bit is not indicated by the ACKB bit, which is always 0.
In the H8S/2128 Series, the DTC can be used to perform continuous transfer. The DTC is
activated when the IRTR interrupt flag is set to 1 (IRTR is one of two interrupt flags, the other
being IRIC). When the ACKE bit is 0, the TDRE, IRIC, and IRTR flags are set on completion of
data transmission, regardless of the value of the acknowledge bit. When the ACKE bit is 1, the
TDRE, IRIC, and IRTR flags are set on completion of data transmission when the acknowledge
bit is 0, and the IRIC flag alone is set on completion of data transmission when the acknowledge
bit is 1.
When the DTC is activated, the TDRE, IRIC, and IRTR flags are cleared to 0 after the specified
number of data transfers have been executed. Consequently, interrupts are not generated during
continuous data transfer, but if data transmission is completed with a 1 acknowledge bit when the
ACKE bit is set to 1, the DTC is not activated and an interrupt is generated, if enabled.
Depending on the receiving device, the acknowledge bit may be significant, in indicating
completion of processing of the received data, for instance, or may be fixed at 1 and have no
significance.
Bit 3
ACKE
Description
0
The value of the acknowledge bit is ignored, and continuous transfer
is performed
1
If the acknowledge bit is 1, continuous transfer is interrupted
(Initial value)
Bit 2—Bus Busy (BBSY): The BBSY flag can be read to check whether the I2C bus (SCL, SDA)
is busy or free. In master mode, this bit is also used to issue start and stop conditions.
A high-to-low transition of SDA while SCL is high is recognized as a start condition, setting
BBSY to 1. A low-to-high transition of SDA while SCL is high is recognized as a stop condition,
clearing BBSY to 0.
To issue a start condition, write 1 in BBSY and 0 in SCP. A retransmit start condition is issued in
the same way. To issue a stop condition, use a MOV instruction to write 0 in BBSY and 0 in SCP.
It is not possible to write to BBSY in slave mode; the I2C bus interface must be set to master
transmit mode before issuing a start condition. MST and TRS should both be set to 1 before
writing 1 in BBSY and 0 in SCP.
429
Bit 2
BBSY
Description
0
Bus is free
(Initial value)
[Clearing condition]
When a stop condition is detected
1
Bus is busy
[Setting condition]
When a start condition is detected
Bit 1—I2C Bus Interface Interrupt Request Flag (IRIC): Indicates that the I2C bus interface
has issued an interrupt request to the CPU. IRIC is set to 1 at the end of a data transfer, when a
slave address or general call address is detected in slave receive mode, when bus arbitration is lost
in master transmit mode, and when a stop condition is detected. IRIC is set at different times
depending on the FS bit in SAR and the WAIT bit in ICMR. See section 16.3.6, IRIC Setting
Timing and SCL Control. The conditions under which IRIC is set also differ depending on the
setting of the ACKE bit in ICCR.
IRIC is cleared by reading IRIC after it has been set to 1, then writing 0 in IRIC.
When the DTC is used, IRIC is cleared automatically and transfer can be performed continuously
without CPU intervention.
Bit 1
IRIC
Description
0
Waiting for transfer, or transfer in progress
(Initial value)
[Clearing conditions]
1. When 0 is written in IRIC after reading IRIC = 1
2. When ICDR is written or read by the DTC
(When the TDRE or RDRF flag is cleared to 0)
(This is not always a clearing condition; see the description of DTC operation for
details)
430
Bit 1
IRIC
Description
1
Interrupt requested
[Setting conditions]
• I 2C bus format master mode
1. When a start condition is detected in the bus line state after a start condition is
issued
(when the TDRE flag is set to 1 because of first frame transmission)
2. When a wait is inserted between the data and acknowledge bit when WAIT = 1
3. At the end of data transfer
(when a wait is not inserted (WAIT = 0), at the rise of the 9th transmit/receive
clock pulse, or, when a wait is inserted (WAIT = 1), at the fall of the 8th
transmit/receive clock pulse)
4. When a slave address is received after bus arbitration is lost
(when the AL flag is set to 1)
•
5. When 1 is received as the acknowledge bit when the ACKE bit is 1
(when the ACKB bit is set to 1)
I 2C bus format slave mode
1. When the slave address (SVA, SVAX) matches
(when the AAS and AASX flags are set to 1)
and at the end of data transfer up to the subsequent retransmission start
condition or stop condition detection
(when the TDRE or RDRF flag is set to 1)
2. When the general call address is detected
(when FS = 0 and the ADZ flag is set to 1)
and at the end of data transfer up to the subsequent retransmission start
condition or stop condition detection
(when the TDRE or RDRF flag is set to 1)
3. When 1 is received as the acknowledge bit when the ACKE bit is 1
(when the ACKB bit is set to 1)
•
4. When a stop condition is detected
(when the STOP or ESTP flag is set to 1)
Synchronous serial format, and formatless mode
1. At the end of data transfer
(when the TDRE or RDRF flag is set to 1)
2. When a start condition is detected with serial format selected
3. When the SW bit is set to 1 in DDCSWR
Except for above, when the condition to set the TDRE or RDRF internal flag to 1 is
generated.
431
When, with the I2C bus format selected, IRIC is set to 1 and an interrupt is generated, other flags
must be checked in order to identify the source that set IRIC to 1. Although each source has a
corresponding flag, caution is needed at the end of a transfer.
When the TDRE or RDRF internal flag is set, the readable IRTR flag may or may not be set. The
IRTR flag (the DTC start request flag) is not set at the end of a data transfer up to detection of a
retransmission start condition or stop condition after a slave address (SVA) or general call address
match in I 2C bus format slave mode.
Even when the IRIC flag and IRTR flag are set, the TDRE or RDRF internal flag may not be set.
The IRIC and IRTR flags are not cleared at the end of the specified number of transfers in
continuous transfer using the DTC. The TDRE or RDRF flag is cleared, however, since the
specified number of ICDR reads or writes have been completed.
Table 16.3 shows the relationship between the flags and the transfer states.
Table 16.3 Flags and Transfer States
MST TRS BBSY ESTP STOP IRTR
AASX AL
AAS
ADZ
ACKB State
1/0
1/0
0
0
0
0
0
0
0
0
0
Idle state (flag
clearing required)
1
1
0
0
0
0
0
0
0
0
0
Start condition
issuance
1
1
1
0
0
1
0
0
0
0
0
Start condition
established
1
1/0
1
0
0
0
0
0
0
0
0/1
Master mode wait
1
1/0
1
0
0
1
0
0
0
0
0/1
Master mode
transmit/receive end
0
0
1
0
0
0
1/0
1
1/0
1/0
0
Arbitration lost
0
0
1
0
0
0
0
0
1
0
0
SAR match by first
frame in slave mode
0
0
1
0
0
0
0
0
1
1
0
General call
address match
0
0
1
0
0
0
1
0
0
0
0
SARX match
0
1/0
1
0
0
0
0
0
0
0
0/1
Slave mode
transmit/receive end
(except after SARX
match)
0
1/0
1
0
0
1
1
0
0
0
0
0
1
1
0
0
0
1
0
0
0
1
Slave mode
transmit/receive end
(after SARX match)
0
1/0
0
1/0
1/0
0
0
0
0
0
0/1
432
Stop condition
detected
Bit 0—Start Condition/Stop Condition Prohibit (SCP): Controls the issuing of start and stop
conditions in master mode. To issue a start condition, write 1 in BBSY and 0 in SCP. A retransmit
start condition is issued in the same way. To issue a stop condition, write 0 in BBSY and 0 in SCP.
This bit is always read as 1. If 1 is written, the data is not stored.
Bit 0
SCP
Description
0
Writing 0 issues a start or stop condition, in combination with the BBSY flag
1
Reading always returns a value of 1
(Initial value)
Writing is ignored
16.2.6
I2C Bus Status Register (ICSR)
Bit
7
6
5
4
3
2
1
0
ESTP
STOP
IRTR
AASX
AL
AAS
ADZ
ACKB
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/W
Note: * Only 0 can be written, to clear the flags.
ICSR is an 8-bit readable/writable register that performs flag confirmation and acknowledge
confirmation and control.
ICSR is initialized to H'00 by a reset and in hardware standby mode.
Bit 7—Error Stop Condition Detection Flag (ESTP): Indicates that a stop condition has been
detected during frame transfer in I2C bus format slave mode.
433
Bit 7
ESTP
Description
0
No error stop condition
(Initial value)
[Clearing conditions]
1. When 0 is written in ESTP after reading ESTP = 1
2. When the IRIC flag is cleared to 0
1
•
In I 2C bus format slave mode
Error stop condition detected
[Setting condition]
When a stop condition is detected during frame transfer
•
In other modes
No meaning
Bit 6—Normal Stop Condition Detection Flag (STOP): Indicates that a stop condition has been
detected after completion of frame transfer in I2C bus format slave mode.
Bit 6
STOP
Description
0
No normal stop condition
(Initial value)
[Clearing conditions]
1. When 0 is written in STOP after reading STOP = 1
2. When the IRIC flag is cleared to 0
1
•
In I 2C bus format slave mode
Normal stop condition detected
[Setting condition]
When a stop condition is detected after completion of frame transfer
•
In other modes
No meaning
Bit 5—I2C Bus Interface Continuous Transmission/Reception Interrupt Request Flag
(IRTR): Indicates that the I2C bus interface has issued an interrupt request to the CPU, and the
source is completion of reception/transmission of one frame in continuous transmission/reception
for which DTC activation is possible. When the IRTR flag is set to 1, the IRIC flag is also set to 1
at the same time.
IRTR flag setting is performed when the TDRE or RDRF flag is set to 1. IRTR is cleared by
reading IRTR after it has been set to 1, then writing 0 in IRTR. IRTR is also cleared automatically
when the IRIC flag is cleared to 0.
434
Bit 5
IRTR
Description
0
Waiting for transfer, or transfer in progress
(Initial value)
[Clearing conditions]
1. When 0 is written in IRTR after reading IRTR = 1
2. When the IRIC flag is cleared to 0
1
Continuous transfer state
[Setting condition]
•
In I 2C bus interface slave mode
When the TDRE or RDRF flag is set to 1 when AASX = 1
•
In other modes
When the TDRE or RDRF flag is set to 1
Bit 4—Second Slave Address Recognition Flag (AASX): In I2C bus format slave receive mode,
this flag is set to 1 if the first frame following a start condition matches bits SVAX6 to SVAX0 in
SARX.
AASX is cleared by reading AASX after it has been set to 1, then writing 0 in AASX. AASX is
also cleared automatically when a start condition is detected.
Bit 4
AASX
0
Description
Second slave address not recognized
(Initial value)
[Clearing conditions]
1. When 0 is written in AASX after reading AASX = 1
2. When a start condition is detected
3. In master mode
1
Second slave address recognized
[Setting condition]
When the second slave address is detected in slave receive mode while FSX = 0
Bit 3—Arbitration Lost (AL): This flag indicates that arbitration was lost in master mode. The
I2C bus interface monitors the bus. When two or more master devices attempt to seize the bus at
nearly the same time, if the I2C bus interface detects data differing from the data it sent, it sets AL
to 1 to indicate that the bus has been taken by another master.
435
AL is cleared by reading AL after it has been set to 1, then writing 0 in AL. In addition, AL is
reset automatically by write access to ICDR in transmit mode, or read access to ICDR in receive
mode.
Bit 3
AL
Description
0
Bus arbitration won
(Initial value)
[Clearing conditions]
1. When ICDR data is written (transmit mode) or read (receive mode)
2. When 0 is written in AL after reading AL = 1
1
Arbitration lost
[Setting conditions]
1. If the internal SDA and SDA pin disagree at the rise of SCL in master transmit
mode
2. If the internal SCL line is high at the fall of SCL in master transmit mode
Bit 2—Slave Address Recognition Flag (AAS): In I2C bus format slave receive mode, this flag is
set to 1 if the first frame following a start condition matches bits SVA6 to SVA0 in SAR, or if the
general call address (H'00) is detected.
AAS is cleared by reading AAS after it has been set to 1, then writing 0 in AAS. In addition, AAS
is reset automatically by write access to ICDR in transmit mode, or read access to ICDR in receive
mode.
Bit 2
AAS
Description
0
Slave address or general call address not recognized
(Initial value)
[Clearing conditions]
1. When ICDR data is written (transmit mode) or read (receive mode)
2. When 0 is written in AAS after reading AAS = 1
3. In master mode
1
Slave address or general call address recognized
[Setting condition]
When the slave address or general call address is detected in slave receive mode
while FS = 0
436
Bit 1—General Call Address Recognition Flag (ADZ): In I2C bus format slave receive mode,
this flag is set to 1 if the first frame following a start condition is the general call address (H'00).
ADZ is cleared by reading ADZ after it has been set to 1, then writing 0 in ADZ. In addition, ADZ
is reset automatically by write access to ICDR in transmit mode, or read access to ICDR in receive
mode.
Bit 1
ADZ
Description
0
General call address not recognized
(Initial value)
[Clearing conditions]
1. When ICDR data is written (transmit mode) or read (receive mode)
2. When 0 is written in ADZ after reading ADZ = 1
3. In master mode
1
General call address recognized
[Setting condition]
When the general call address is detected in slave receive mode while FSX = 0 or
FS = 0
Bit 0—Acknowledge Bit (ACKB): Stores acknowledge data. In transmit mode, after the
receiving device receives data, it returns acknowledge data, and this data is loaded into ACKB. In
receive mode, after data has been received, the acknowledge data set in this bit is sent to the
transmitting device.
When this bit is read, in transmission (when TRS = 1), the value loaded from the bus line
(returned by the receiving device) is read. In reception (when TRS = 0), the value set by internal
software is read.
When this bit is written to, the set value of the acknowledge data sent in reception is rewritten
regardless of the value of TRS. As the value loaded from the receive device is unchanged, care is
required when using a bit manipulation instruction to modify this register.
Bit 0
ACKB
Description
0
Receive mode: 0 is output at acknowledge output timing
(Initial value)
Transmit mode: Indicates that the receiving device has acknowledged the data (signal
is 0)
1
Receive mode: 1 is output at acknowledge output timing
Transmit mode: Indicates that the receiving device has not acknowledged the data
(signal is 1)
437
16.2.7
Serial/Timer Control Register (STCR)
Bit
7
6
5
4
3
2
1
0
—
IICX1
IICX0
IICE
FLSHE
—
ICKS1
ICKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
STCR is an 8-bit readable/writable register that controls register access, the I2C interface operating
mode (when the on-chip IIC option is included), and on-chip flash memory (F-ZTAT versions),
and selects the TCNT input clock source. For details of functions not related to the I 2C bus
interface, see section 3.2.4, Serial/Timer Control Register (STCR), and the descriptions of the
relevant modules. If a module controlled by STCR is not used, do not write 1 to the corresponding
bit.
STCR is initialized to H'00 by a reset and in hardware standby mode.
Bit 7—Reserved: This bit must not be set to 1.
Bits 6 and 5—I2C Transfer Select 1 and 0 (IICX1, IICX0): These bits, together with bits CKS2
to CKS0 in ICMR, select the transfer rate in master mode. For details, see section 16.2.4, I 2C Bus
Mode Register (ICMR).
Bit 4—I2C Master Enable (IICE): Controls CPU access to the I2C bus interface data and control
registers (ICCR, ICSR, ICDR/SARX, ICMR/SAR), PWMX data and control registers, and SCI
control registers.
Bit 4
IICE
Description
0
CPU access to I 2C bus interface data and control registers is disabled
(Initial value)
CPU access to SCI control registers is enabled
1
CPU access to I 2C bus interface data and control registers is enabled
CPU access to PWMX data and control registers is enabled
Bit 3—Flash Memory Control Register Enable (FLSHE): Controls CPU access to the flash
memory control registers, power-down state control registers, and peripheral module control
registers. For details see section 3.2.4, Serial /Timer Control Register (STCR).
Bit 2—Reserved: This bit must not be set to 1.
Bits 1 and 0—Internal Clock Source Select 1 and 0 (ICKS1, ICSK0): These bits, together with
bits CKS2 to CKS0 in TCR, select the clock input to the timer counters (TCNT). For details, see
section 12.2.4, Timer Control Register.
438
16.2.8
DDC Switch Register (DDCSWR)
Bit
7
6
5
4
3
2
1
0
SWE
SW
IE
IF
CLR3
CLR2
CLR1
CLR0
Initial value
0
0
0
0
1
1
1
1
Read/Write
R/W
R/W
R/W
R/(W)*1
W*2
W*2
W*2
W*2
Notes: 1. Only 0 can be written, to clear the flag.
2. Always read as 1.
DDCSWR is an 8-bit readable/writable register that controls the IIC channel 0 automatic format
switching function and IIC internal latch clearance.
DDCSWR is initialized to H'0F by a reset and in hardware standby mode.
Bit 7—DDC Mode Switch Enable (SWE): Selects the function for automatically switching IIC
channel 0 from formatless mode to the I2C bus format.
Bit 7
SWE
Description
0
Automatic switching of IIC channel 0 from formatless mode to I 2C bus
format is disabled
1
Automatic switching of IIC channel 0 from formatless mode to I 2C bus
format is enabled
(Initial value)
Bit 6—DDC Mode Switch (SW): Selects either formatless mode or the I2C bus format for IIC
channel 0.
Bit 6
SW
Description
0
IIC channel 0 is used with the I 2C bus format
(Initial value)
[Clearing conditions]
1. When 0 is written by software
2. When a falling edge is detected on the SCL pin when SWE = 1
1
IIC channel 0 is used in formatless mode
[Setting condition]
When 1 is written in SW after reading SW = 0
Bit 5—DDC Mode Switch Interrupt Enable Bit (IE): Enables or disables an interrupt request to
the CPU when automatic format switching is executed for IIC channel 0.
439
Bit 5
IE
Description
0
Interrupt when automatic format switching is executed is disabled
1
Interrupt when automatic format switching is executed is enabled
(Initial value)
Bit 4—DDC Mode Switch Interrupt Flag (IF): Flag that indicates an interrupt request to the
CPU when automatic format switching is executed for IIC channel 0.
Bit 4
IF
Description
0
No interrupt is requested when automatic format switching is executed
(Initial value)
[Clearing condition]
When 0 is written in IF after reading IF = 1
1
An interrupt is requested when automatic format switching is executed
[Setting condition]
When a falling edge is detected on the SCL pin when SWE = 1
Bits 3 to 0—IIC Clear 3 to 0 (CLR3 to CLR0): These bits control initialization of the internal
state of IIC0 and IIC1.
These bits can only be written to; if read they will always return a value of 1.
When a write operation is performed on these bits, a clear signal is generated for the internal latch
circuit of the corresponding module(s),and the internal state of the IIC module(s) is initialized.
The write data for these bits is not retained. To perform IIC clearance, bits CLR3 to CLR0 must
be written to simultaneously using an MOV instruction. Do not use a bit manipulation instruction
such as BCLR.
When clearing is required again, all the bits must be written to in accordance with the setting.
Bit 3
Bit 2
Bit 1
Bit 0
CLR3
CLR2
CLR1
CLR0
Description
0
0
—
—
Setting prohibited
1
0
1
1
440
—
—
0
Setting prohibited
1
IIC0 internal latch cleared
0
IIC1 internal latch cleared
1
IIC0 and IIC1 internal latches cleared
—
Invalid setting
16.2.9
Module Stop Control Register (MSTPCR)
MSTPCRH
Bit
7
6
5
4
3
MSTPCRL
2
1
0
7
6
5
4
3
2
1
0
MSTP15 MSTP14 MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTP8 MSTP7 MSTP6 MSTP5 MSTP4 MSTP3 MSTP2 MSTP1 MSTP0
Initial value
Read/Write
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR comprises two 8-bit readable/writable registers, and is used to perform module stop
mode control.
When the MSTP4 or MSTP3 bit is set to 1, operation of the corresponding IIC channel is halted at
the end of the bus cycle, and a transition is made to module stop mode. For details, see section
21.5, Module Stop Mode.
MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in
software standby mode.
MSTPCRL Bit 4—Module Stop (MSTP4): Specifies IIC channel 0 module stop mode.
MSTPCRL
Bit 4
MSTP4
Description
0
IIC channel 0 module stop mode is cleared
1
IIC channel 0 module stop mode is set
(Initial value)
MSTPCRL Bit 3—Module Stop (MSTP3): Specifies IIC channel 1 module stop mode.
MSTPCRL
Bit 3
MSTP3
Description
0
IIC channel 1 module stop mode is cleared
1
IIC channel 1 module stop mode is set
(Initial value)
441
16.3
Operation
16.3.1
I2C Bus Data Format
The I2C bus interface has serial and I2C bus formats.
The I2C bus formats are addressing formats with an acknowledge bit. These are shown in figures
16.3 (a) and (b). The first frame following a start condition always consists of 8 bits.
IIC channel 0 only is capable of formatless operation, as shown in figure 16.4.
The serial format is a non-addressing format with no acknowledge bit. This is shown in figure
16.5.
Figure 16.6 shows the I2C bus timing.
The symbols used in figures 16.3 to 16.6 are explained in table 16.4.
(a) I2C bus format (FS = 0 or FSX = 0)
S
SLA
R/W
A
DATA
A
A/A
P
1
7
1
1
n
1
1
1
1
transfer bit count
(n = 1 to 8)
transfer frame count
(m ≥ 1)
m
(b) I2C bus format (start condition retransmission, FS = 0 or FSX = 0)
S
SLA
R/W
A
DATA
A/A
S
SLA
R/W
A
DATA
A/A
P
1
7
1
1
n1
1
1
7
1
1
n2
1
1
1
m1
1
transfer bit count (n1 and n2 = 1 to 8)
transfer frame count (m1 and m2 ≥ 1)
Figure 16.3 I2C Bus Data Formats (I2C Bus Formats)
442
m2
IIC0 only, FS = 0 or FSX = 0
DATA
A
8
1
DATA
n
1
A
A/A
1
1
m
transfer bit count (n = 1 to 8)
transfer frame count (m ≥ 1)
Note: This mode applies to the DDC (Display Data Channel) which is a PC monitoring
system standard.
Figure 16.4 Formatless
FS = 1 and FSX = 1
S
DATA
DATA
P
1
8
n
1
1
m
n: transfer bit count
(n = 1 to 8)
m: transfer frame count
(m ≥ 1)
Figure 16.5 I2C Bus Data Format (Serial Format)
SDA
SCL
S
1-7
8
9
SLA
R/W
A
1-7
DATA
8
9
A
1-7
DATA
8
9
A/A
P
Figure 16.6 I2C Bus Timing
443
Table 16.4 I2C Bus Data Format Symbols
Legend
S
Start condition. The master device drives SDA from high to low while SCL is high
SLA
Slave address, by which the master device selects a slave device
R/W
Indicates the direction of data transfer: from the slave device to the master device
when R/W is 1, or from the master device to the slave device when R/W is 0
A
Acknowledge. The receiving device (the slave in master transmit mode, or the master
in master receive mode) drives SDA low to acknowledge a transfer
DATA
Transferred data. The bit length is set by bits BC2 to BC0 in ICMR. The MSB-first or
LSB-first format is selected by bit MLS in ICMR
P
Stop condition. The master device drives SDA from low to high while SCL is high
16.3.2
Master Transmit Operation
In I2C bus format master transmit mode, the master device outputs the transmit clock and transmit
data, and the slave device returns an acknowlede signal.
The transmission procedure and operations by which data is sequentially transmitted in
synchronization with ICDR write operations, are described below.
[1] Set the ICE bit in ICCR to l. Set bits MLS, WAIT, and CKS2 to CKS0 in ICMR, and bit IICX
in STCR, according to the operation mode.
[2] Read the BBSY flag to confirm that the bus is free.
[3] Set the MST and TRS bits to 1 in ICCR to select master transmit mode.
[4] Write 1 to BBSY and 0 to SCP. This switches SDA from high to low when SCL is high, and
generates the start condition.
[5] When the start condition is generated, the IRIC and IRTR flags are set to 1. If the IEIC bit in
ICCR has been set to l, an interrupt request is sent to the CPU.
[6] Write data to ICDR (slave address + R/W)
With the I 2C bus format (when the FS bit in SAR or the FSX bit in SARX is 0), the first frame
data following the start condition indicates the 7-bit slave address and transmit/receive
direction.
Then clear the IRIC flag to indicate the end of transfer.
Writing to ICDR and clearing of the IRIC flag must be executed continuously, so that no
interrupt is inserted.
If a period of time that is equal to transfer one byte has elapsed by the time the IRlC flag is
cleared, the end of transfer cannot be identified.
444
The master device sequentially sends the transmit clock and the data written to ICDR with the
timing shown in figure 16.7. The selected slave device (i.e. , the slave device with the
matching slave address) drives SDA low at the 9th transmit clock pulse and returns an
acknowledge signal.
[7] When one frame of data has been transimitted, the IRIC flag is set to 1 at the rise of the 9th
transmit clock pulse. After one frame has been transmitted, SCL is automatically fixed low in
synchronization with the internal clock until the next transmit data is written.
[8] Read the ACKB bit to confirm that ACKB is 0. When the slave device has not returned an
acknowledge signal and ACKB remains 1, execute the transmit end processing described in
step [12] and perfrom transmit operation again.
[9] Write the next data to be transmitted in ICDR. To indicate the end of data transfer, clear the
IRIC flag to 0.
As described in step [6] above, writing to ICDR and clearing of the IRIC flag must be
executed continuously so that no interrupt is inserted.
The next frame is transmitted in synchronization with the internal clock.
[10] When one frame of data has been transmitted, the IRIC flag is set to 1 at the rise of the 9th
transmit clock pulse. After one frame has been transmitted, SCL is automatically fixed low in
synchronization with the internal clock until the next transmit data is written.
[11] Read the ACKB bit of ICSR. Confirm that the slave device has returned an acknowledge
signal and ACKB is 0. When more data is to be transmitted, return to step [9] to execute next
transmit operation. If the slave device has not returned an acknowledge signal and ACKB is 1,
execute the transmit end processing described in step [12].
[12] Clear the IRIC flag to 0. Write BBSY and SCP of ICCR to 0. By doing so, SDA is changed
from low to high while SCL is high and the transmit stop condition is generated.
445
Start condition
generation
SCL
(master output)
1
SDA
(master output)
bit 7
2
bit 6
3
bit 5
4
bit 4
5
bit 3
6
bit 2
Slave address
SDA
(slave output)
7
bit 1
8
1
9
bit 7
bit 0
R/W
2
[7]
bit 6
Data 1
A
[5]
IRIC
IRTR
ICDR
address + R/W
Note: Data write
timing in ICDR
ICDR Writing
prohibited
Data 1
ICDR Writing
enable
User processing [4] Write BBSY = 1
and SCP = 0
(start condition
issuance)
[6] ICDR write
[6] IRIC clear
[9] ICDR write
[9] IRIC clear
Figure 16.7 Example of Master Transmit Mode Operation Timing
(MLS = WAIT = 0)
16.3.3
Master Receive Operation
In master receive mode, the master device outputs the receive clock, receives data, and returns an
acknowledge signal. The slave device transrnits data.
The receive procedure and operations by which data is sequentially received in synchronization
with ICDR read operations, are described below.
[1] Clear the TRS bit of ICCR to 0 and switch from transmit mode to receive mode. Set the
WAIT bit to 1 and clear the ACKB bit of ICSR to 0 (acknowledge data setting).
[2] When ICDR is read (dummy data read), reception is started and the receive clock is output,
and data is received, in synchronization with the internal clock. To indicate the wait, clear the
IRIC flag to 0.
Reading from ICDR and clearing of the IRIC f1ag must be executed continuously so that no
interrupt is inserted.
If a period of time that is equal to transfer one byte has elapsed by the time the IRIC flag is
cleared, the end of transfer cannot be identified.
[3] The IRIC flag is set to 1 at the fall of the 8th clock of a one-frame reception clock. At this
point, if the IEIC bit of ICCR is set to 1, an interrupt request is generated to the CPU.
446
SCL is automatically fixed low in synchronization with the internal clock until the IRIC flag
is cleared. If the first frame is the final reception frame, execute the end processing as
described in [10].
[4] Clear the IRIC flag to 0 to release from the wait state.
The master device outputs the 9th receive clock pulse, sets SDA to low, and returns an
acknowledge signal.
[5] When one frame of data has been transmitted, the IRIC and IRTR flags are set to 1 at the rise
of the 9th transmit clock pulse.
The master device continues to output the receive clock for the next receive data.
[6] Read the ICDR receive data.
[7] Clear the IRIC flag to indicate the next wait.
From clearing of the IRIC flag to completion of data reception as described in steps [5], [6],
and [7], must be performed within the time taken to transfer one byte because releasing of the
wait state as described in step [4] (or [9]).
[8] The IRIC flag is set to 1 at the fall of the 8th receive clock pulse. SCL is automatically fixed
low in synchronization with the internal clock until the IRIC flag is cleared. If this frame is
the final reception frame, execute the end processing as described in [10].
[9] Clear the IRIC flag to 0 to release from the wait state. The master device outputs the 9th
reception clock pulse, sets SDA to low, and returns an acknowledge signal.
By repeating steps [5] to [9] above, more data can be received.
[10] Set the ACKB bit of ICSR to 1 and set the acknowledge data for the final reception.
Set the TRS bit of ICCR to 1 to change receive mode to transmit mode.
[11] Clear the IRIC flag to release from the wait state.
[12] When one frame of data has been received, the IRIC flag is set to 1 at the rise of the 9th
reception clock pulse.
[13] Clear the WAIT bit of ICMR to 0 to cancel wait mode. Read the ICDR receive data and clear
the IRIC flag to 0.
Clear the IRIC flag only when WAIT = 0.
(If the stop-condition generation command is executed after clearing the IRIC flag to 0 and
then clearing the WAIT bit to 0, the SDA line is fixed low and the stop condition cannot be
generated.)
[14] Write 0 to BBSY and SCP. This changes SDA from low to high when SCL is high, and
generates the stop condition.
447
Master transmit mode
Master receive mode
SCL
(master output)
9
1
2
3
4
5
6
7
8
SDA
(slave output)
A
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
9
Data 1
[3]
1
2
Bit7
Bit6
4
5
Bit5
Bit4
Bit3
Data 2
[5]
SDA
(master output)
3
A
IRIC
IRTR
ICDR
Data 1
User processing
[2] IRIC clearance
[1] TRS cleared to 0 [2] ICDR read
(dummy read)
WAIT set to 1
ACKB cleared to 0
[4] IRIC clearance
[6] ICDR read
(Data 1)
[7] IRIC clearance
Figure 16.8 (a) Example of Master Receive Mode Operation Timing
(MLS = ACKB = 0, WAIT = 1)
SCL
(master output)
8
SDA
Bit0
(slave output)
Data 2
9
[8]
SDA
(master output)
1
2
3
4
5
6
7
8
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Data 3
[5]
9
1
2
Bit7
[8]
A
Bit6
Data 4
[5]
A
IRIC
IRTR
ICDR
Data 1
User processing
[9] IRIC clearance
Data 2
[6] ICDR read
(Data 2)
[7] IRIC clearance
Data 3
[9] IRIC Clearance
[6] ICDR read
(Data 3)
[7] IRIC clearance
Figure 16.8 (b) Example of Master Receive Mode Operation Timing
(MLS = ACKB = 0, WAIT = 1) (cont)
16.3.4
Slave Receive Operation
In slave receive mode, the master device outputs the transmit clock and transmit data, and the
slave device returns an acknowledge signal. The reception procedure and operations in slave
receive mode are described below.
448
[1] Set the ICE bit in ICCR to 1. Set the MLS bit in ICMR and the MST and TRS bits in ICCR
according to the operating mode.
[2] When the start condition output by the master device is detected, the BBSY flag in ICCR is set
to 1.
[3] When the slave address matches in the first frame following the start condition, the device
operates as the slave device specified by the master device. If the 8th data bit (R/W) is 0, the
TRS bit in ICCR remains cleared to 0, and slave receive operation is performed.
[4] At the 9th clock pulse of the receive frame, the slave device drives SDA low and returns an
acknowledge signal. At the same time, the IRIC flag in ICCR is set to 1. If the IEIC bit in
ICCR has been set to 1, an interrupt request is sent to the CPU. If the RDRF internal flag has
been cleared to 0, it is set to 1, and the receive operation continues. If the RDRF internal flag
has been set to 1, the slave device drives SCL low from the fall of the receive clock until data
is read into ICDR.
[5] Read ICDR and clear the IRIC flag in ICCR to 0. The RDRF flag is cleared to 0.
Receive operations can be performed continuously by repeating steps [4] and [5]. When SDA is
changed from low to high when SCL is high, and the stop condition is detected, the BBSY flag in
ICCR is cleared to 0.
Start condition
generation
SCL
(master output)
1
2
3
Bit 7
Bit 6
Bit 5
4
5
6
Bit 4
Bit 3
Bit 2
7
8
9
1
2
SCL
(slave output)
SDA
(master output)
Slave address
SDA
(slave output)
Bit 1
Bit 0
R/W
Bit 7
Bit 6
Data 1
[4]
A
RDRF
IRIC
Interrupt request
generation
ICDRS
Address + R/W
ICDRR
User processing
Address + R/W
[5] ICDR read
[5] IRIC clear
Figure 16.9 Example of Slave Receive Mode Operation Timing (1) (MLS = ACKB = 0)
449
SCL
(master output)
7
8
Bit 1
Bit 0
9
1
2
3
4
5
6
7
8
9
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SCL
(slave output)
SDA
(master output)
Data 1
SDA
(slave output)
Bit 7
Bit 6
[4]
Data 2
A
[4]
A
RDRF
Interrupt
request
generation
Interrupt
request
generation
IRIC
ICDRS
Data 1
ICDRR
Data 1
User processing
[5] ICDR read
Data 2
Data 2
[5] IRIC clear
Figure 16.10 Example of Slave Receive Mode Operation Timing (2) (MLS = ACKB = 0)
16.3.5
Slave Transmit Operation
In slave transmit mode, the slave device outputs the transmit data, while the master device outputs
the receive clock and returns an acknowledge signal. The transmission procedure and operations
in slave transmit mode are described below.
[1] Set the ICE bit in ICCR to 1. Set the MLS bit in ICMR and the MST and TRS bits in ICCR
according to the operating mode.
[2] When the slave address matches in the first frame following detection of the start condition,
the slave device drives SDA low at the 9th clock pulse and returns an acknowledge signal. At
the same time, the IRIC flag in ICCR is set to 1. If the IEIC bit in ICCR has been set to 1, an
interrupt request is sent to the CPU. .If the 8th data bit (R/W) is 1, the TRS bit in ICCR is set to
1, and the mode changes to slave transmit mode automatically. The TDRE internal flag is set
to 1. The slave device drives SCL low from the fall of the transmit clock until ICDR data is
written.
[3] After clearing the IRIC flag to 0, write data to ICDR. The TDRE internal flag is cleared to 0.
The written data is transferred to ICDRS, and the TDRE internal flag and the IRIC and IRTR
flags are set to 1 again. After clearing the IRIC flag to 0, write the next data to ICDR. The
450
slave device sequentially sends the data written into ICDR in accordance with the clock output
by the master device at the timing shown in figure 16.11.
[4] When one frame of data has been transmitted, the IRIC flag in ICCR is set to 1 at the rise of
the 9th transmit clock pulse. If the TDRE internal flag has been set to 1, this slave device
drives SCL low from the fall of the transmit clock until data is written to ICDR. The master
device drives SDA low at the 9th clock pulse, and returns an acknowledge signal. As this
acknowledge signal is stored in the ACKB bit in ICSR, this bit can be used to determine
whether the transfer operation was performed normally. When the TDRE internal flag is 0, the
data written into ICDR is transferred to ICDRS, transmission is started, and the TDRE internal
flag and the IRIC and IRTR flags are set to 1 again.
[5] To continue transmission, clear the IRIC flag to 0, then write the next data to be transmitted
into ICDR. The TDRE internal flag is cleared to 0.
Transmit operations can be performed continuously by repeating steps [4] and [5]. To end
transmission, write H'FF to ICDR to release SDA on the slave side. When SDA is changed from
low to high when SCL is high, and the stop condition is detected, the BBSY flag in ICCR is
cleared to 0.
Slave receive mode
SCL
(master output)
8
Slave transmit mode
9
1
2
3
4
5
6
7
8
A
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
9
1
2
SCL
(slave output)
SDA
(slave output)
SDA
(master output) R/W
Bit 7
Data 1
[2]
Bit 6
Data 2
A
TDRE
Interrupt
request
generation
IRIC
[3]
Interrupt
request
generation
Interrupt
request
generation
Data 1
ICDRT
ICDRS
Data 2
Data 1
User processing
[3] IRIC
[3] ICDR write
clearance
[3] ICDR write
Data 2
[5] IRIC
clear
[5] ICDR write
Figure 16.11 Example of Slave Transmit Mode Operation Timing (MLS = 0)
451
16.3.6
IRIC Setting Timing and SCL Control
The interrupt request flag (IRIC) is set at different times depending on the WAIT bit in ICMR, the
FS bit in SAR, and the FSX bit in SARX. If the TDRE or RDRF internal flag is set to 1, SCL is
automatically held low after one frame has been transferred; this timing is synchronized with the
internal clock. Figure 16.12 shows the IRIC set timing and SCL control.
(a) When WAIT = 0, and FS = 0 or FSX = 0 (I2C bus format, no wait)
SCL
7
8
9
1
SDA
7
8
A
1
IRIC
User processing
Clear IRIC
Write to ICDR (transmit)
or read ICDR (receive)
(b) When WAIT = 1, and FS = 0 or FSX = 0 (I2C bus format, wait inserted)
SCL
8
9
1
SDA
8
A
1
IRIC
Clear
IRIC
User processing
Clear Write to ICDR (transmit)
IRIC or read ICDR (receive)
(c) When FS = 1 and FSX = 1 (synchronous serial format)
SCL
7
8
1
SDA
7
8
1
IRIC
User processing
Clear IRIC
Write to ICDR (transmit)
or read ICDR (receive)
Figure 16.12 IRIC Setting Timing and SCL Control
452
16.3.7
Automatic Switching from Formatless Mode to I2C Bus Format
Setting the SW bit to 1 in DDCSWR enables formatless mode to be selected as the IIC0 operating
mode. Switching from formatless mode to the I2C bus format (slave mode) is performed
automatically when a falling edge is detected on the SCL pin.
The following four preconditions are necessary for this operation:
• A common data pin (SDA) for formatless and I2C bus format operation
• Separate clock pins for formatless operation (VSYNCI) and I2C bus format operation (SCL)
• A fixed 1 level for the SCL pin during formatless operation (the SCL pin does not output a low
level)
• Settings of bits other than TRS in ICCR that allow I2C bus format operation
Automatic switching is performed from formatless mode to the I 2C bus format when the SW bit in
DDCSWR is automatically cleared to 0 on detection of a falling edge on the SCL pin. Switching
from the I2C bus format to formatless mode is achieved by having software set the SW bit in
DDCSWR to 1.
In formatless mode, bits (such as MSL and TRS) that control the I 2C bus interface operating mode
must not be modified. When switching from the I2C bus format to formatless mode, set the TRS
bit to 1 or clear it to 0 according to the transmit data (transmission or reception) in formatless
mode, then set the SW bit to 1. After automatic switching from formatless mode to the I2C bus
format (slave mode), in order to wait for slave address reception, the TRS bit is automatically
cleared to 0.
If a falling edge is detected on the SCL pin during formatless operation, the I2C bus interface
operating mode is switched to the I 2C bus format without waiting for a stop condition to be
detected.
453
16.3.8
Operation Using the DTC
The I2C bus format provides for selection of the slave device and transfer direction by means of
the slave address and the R/W bit, confirmation of reception with the acknowledge bit, indication
of the last frame, and so on. Therefore, continuous data transfer using the DTC must be carried out
in conjunction with CPU processing by means of interrupts.
Table 16.5 shows some examples of processing using the DTC. These examples assume that the
number of transfer data bytes is known in slave mode.
Table 16.5 Examples of Operation Using the DTC
Master Receive
Mode
Slave Transmit
Mode
Slave Receive
Mode
Slave address + Transmission by
DTC (ICDR write)
R/W bit
transmission/
reception
Transmission by
CPU (ICDR write)
Reception by
CPU (ICDR read)
Reception by CPU
(ICDR read)
Dummy data
read
—
Processing by
CPU (ICDR read)
—
—
Actual data
transmission/
reception
Transmission by
DTC (ICDR write)
Reception by
DTC (ICDR read)
Transmission by
DTC (ICDR write)
Reception by DTC
(ICDR read)
Dummy data
(H'FF) write
—
—
Processing by
DTC (ICDR write)
—
Last frame
processing
Not necessary
Reception by
CPU (ICDR read)
Not necessary
Reception by CPU
(ICDR read)
Transfer request
processing after
last frame
processing
1st time: Clearing
by CPU
Not necessary
2nd time: End
condition issuance
by CPU
Automatic clearing Not necessary
on detection of end
condition during
transmission of
dummy data (H'FF)
Setting of
number of DTC
transfer data
frames
Reception: Actual
Transmission:
Actual data count data count
+ 1 (+1 equivalent
to slave address +
R/W bits)
Reception: Actual
Transmission:
Actual data count data count
+ 1 (+1 equivalent
to dummy data
(H'FF))
Item
454
Master Transmit
Mode
16.3.9
Noise Canceler
The logic levels at the SCL and SDA pins are routed through noise cancelers before being latched
internally. Figure 16.13 shows a block diagram of the noise canceler circuit.
The noise canceler consists of two cascaded latches and a match detector. The SCL (or SDA)
input signal is sampled on the system clock, but is not passed forward to the next circuit unless the
outputs of both latches agree. If they do not agree, the previous value is held.
Sampling clock
C
SCL or
SDA input
signal
D
C
Q
Latch
D
Q
Latch
Match
detector
Internal
SCL or
SDA
signal
System clock
period
Sampling
clock
Figure 16.13 Block Diagram of Noise Canceler
16.3.10
Sample Flowcharts
Figures 16.14 to 16.17 show sample flowcharts for using the I2C bus interface in each mode.
455
Start
[1] Initialize
Initialize
[2] Test the status of the SCL and SDA lines.
Read BBSY in ICCR
No
BBSY = 0?
Yes
[3] Select master transmit mode.
Set MST = 1 and
TRS = 1 in ICCR
[4] Start condition issuance
Write BBSY = 1
and SCP = 0 in ICCR
[5] Wait for a start condition generation
Read IRIC in ICCR
No
IRIC = 1?
Yes
[6] Set transmit data for the first byte (slave
address + R/W).
(After writing ICDR, clear IRIC
immediately)
Write transmit data in ICDR
Clear IRIC in ICCR
Read IRIC in ICCR
No
[7] Wait for 1 byte to be transmitted.
IRIC = 1?
Yes
Read ACKB in ICSR
ACKB = 0?
No
[8] Test the acknowledge bit, transferred from
slave device.
Yes
Transmit mode?
No
Master receive mode
Yes
Write transmit data in ICDR
Clear IRIC in ICCR
[9] Set transmit data for the second and
subsequent bytes.
(After writing ICDR, clear IRIC
immediately)
Read IRIC in ICCR
No
[10] Wait for 1 byte to be transmitted.
IRIC = 1?
Yes
Read ACKB in ICSR
[11] Test for end of transfer
No
End of transmission
or ACKB = 1?
Yes
Clear IRIC in ICCR
[12] Stop condition issuance
Write BBSY = 0
and SCP = 0 in ICCR
End
Figure 16.14 Flowchart for Master Transmit Mode (Example)
456
Master receive mode
Set TRS = 0 in ICCR
[1] Select receive mode
Set WAIT = 1 in ICMR
Set ACKB = 0 in ICSR
[2] Start receiving. The first read is a dummy
read. After reading ICDR, please clear
IRIC immediately.
Read ICDR
Clear IRIC in ICCR
[3] Wait for 1 byte to be received.
(8th clock falling edge)
Read IRIC in ICCR
No
IRIC=1?
Yes
Last receive ?
Yes
No
No
Clear IRIC in ICCR
[4] Clear IRIC to trigger the 9th clock.
(to end the wait insertion)
Read IRIC in ICCR
[5] Wait for 1 byte to be received.
(9th clock rising edge)
IRIC = 1?
Yes
[6] Read the received data.
Read ICDR
No
Clear IRIC in ICCR
[7] Clear IRIC
Read IRIC in ICCR
[8] Wait for the next data to be received.
(8th clock falling edge)
IRIC = 1?
Yes
Yes
Last receive ?
No
Clear IRIC in ICCR
Set ACKB = 1 in ICSR
Set TRS = 1 in ICCR
Clear IRIC in ICCR
[9] Clear IRIC
(to end the wait insertion)
[10] Set ACKB = 1 so as to return no
acknowledge, or set TRS = 1 so as not
to issue extra clock.
[11] Clear IRIC
(to end the wait insertion)
Read IRIC in ICCR
No
[12] Wait for 1 byte to be received.
IRIC = 1?
Yes
Set WAIT = 0 in ICMR
Read ICDR
[13] Set WAIT = 0.
Read ICDR.
Clear IRIC.
(Note: After setting WAIT = 0, IRIC
should be cleared to 0)
Clear IRIC in ICCR
Write BBSY = 0
and SCP = 0 in ICCR
[14] Stop condition issuance.
End
Figure 16.15 Flowchart for Master Receive Mode (Example)
457
Start
Initialize
Set MST = 0
and TRS = 0 in ICCR
[1]
Set ACKB = 0 in ICSR
Read IRIC in ICCR
[2]
No
IRIC = 1?
Yes
Read AAS and ADZ in ICSR
AAS = 1
and ADZ = 0?
No
General call address processing
* Description omitted
Yes
Read TRS in ICCR
No
TRS = 0?
Slave transmit mode
Yes
Last receive?
No
Read ICDR
Yes
[1] Select slave receive mode.
[3]
Clear IRIC in ICCR
[2] Wait for the first byte to be received (slave
address).
[3] Start receiving. The first read is a dummy read.
Read IRIC in ICCR
No
[4] Wait for the transfer to end.
[4]
IRIC = 1?
[5] Set acknowledge data for the last receive.
[6] Start the last receive.
Yes
[7] Wait for the transfer to end.
[8] Read the last receive data.
Set ACKB = 1 in ICSR
[5]
Read ICDR
[6]
Clear IRIC in ICCR
Read IRIC in ICCR
No
[7]
IRIC = 1?
Yes
Read ICDR
Clear IRIC in ICCR
[8]
End
Figure 16.16 Flowchart for Slave Receive Mode (Example)
458
Slave transmit mode
Clear IRIC in ICCR
Write transmit data in ICDR
[1]
[1] Set transmit data for the second and
subsequent bytes.
[2] Wait for 1 byte to be transmitted.
Clear IRIC in ICCR
[3] Test for end of transfer.
[4] Select slave receive mode.
Read IRIC in ICCR
No
[2]
[5] Dummy read (to release the SCL line).
IRIC = 1?
Yes
Clear IRIC in ICCR
Read ACKB in ICSR
No
[3]
End
of transmission
(ACKB = 1)?
Yes
Set TRS = 0 in ICCR
[4]
Read ICDR
[5]
Clear IRIC in ICCR
End
Figure 16.17 Flowchart for Slave Transmit Mode (Example)
16.3.11
Initialization of Internal State
The IIC has a function for forcible initialization of its internal state if a deadlock occurs during
communication.
Initialization is executed (1) in accordance with the setting of bits CLR3 to CLR0 in the
DDCSWR register or (2) by clearing the ICE bit. For details of CLR3 to CLR0 bit settings, see
section 16.2.8, DDC Switch Register (DDCSWR).
(1) Scope of Initialization
The initialization executed by this function covers the following items:
459
• TDRE and RDRF internal flags
• Transmit/receive sequencer and internal operating clock counter
• Internal latches for retaining the output state of the SCL and SDA pins (wait, clock, data
output, etc.)
The following items are not initialized:
• Actual register values (ICDR, SAR, SARX, ICMR, ICCR, ICSR, DDCSWR, STCR)
• Internal latches used to retain register read information for setting/clearing flags in the ICMR,
ICCR, ICSR, and DDCSWR registers
• The value of the ICMR register bit counter (BC2 to BC0)
• Generated interrupt sources (interrupt sources transferred to the interrupt controller)
(2) Notes on Initialization
• Interrupt flags and interrupt sources are not cleared, and so flag clearing measures must be
taken as necessary.
• Basically, other register flags are not cleared either, and so flag clearing measures must be
taken as necessary.
• When initialization is performed by means of the DDCSWR register, the write data for bits
CLR3 to CLR0 is not retained. To perform IIC clearance, bits CLR3 to CLR0 must be written
to simultaneously using an MOV instruction. Do not use a bit manipulation instruction such as
BCLR. Similarly, when clearing is required again, all the bits must be written to
simultaneously in accordance with the setting.
• If a flag clearing setting is made during transmission/reception, the IIC module will stop
transmitting/receiving at that point and the SCL and SDA pins will be released. When
transmission/reception is started again, register initialization, etc., must be carried out as
necessary to enable correct communication as a system.
The value of the BBSY bit cannot be modified directly by this module clear function, but since the
stop condition pin waveform is generated according to the state and release timing of the SCL and
SDA pins, the BBSY bit may be cleared as a result. Similarly, state switching of other bits and
flags may also have an effect.
To prevent problems caused by these factors, the following procedure should be used when
initializing the IIC state.
(1) Execute initialization of the internal state according to the setting of bits CLR3 to CLR0 or by
means of the ICE bit.
(2) Execute a stop condition issuance instruction (write 0 to BBSY and SCP) to clear the BBST bit
to 0, and wait for two transfer rate clock cycles.
(3) Re-execute initialization of the internal state according to the setting of bits CLR3 to CLR0 or
by means of the ICE bit.
(4) Initialize (re-set) the IIC registers.
460
16.4
Usage Notes
• In master mode, if an instruction to generate a start condition is immediately followed by an
instruction to generate a stop condition, neither condition will be output correctly. To output
consecutive start and stop conditions, after issuing the instruction that generates the start
condition, read the relevant ports, check that SCL and SDA are both low, then issue the
instruction that generates the stop condition. Note that SCL may not yet have gone low when
BBSY is cleared to 0.
• Either of the following two conditions will start the next transfer. Pay attention to these
conditions when reading or writing to ICDR.
 Write access to ICDR when ICE = 1 and TRS = 1 (including automatic transfer from
ICDRT to ICDRS)
 Read access to ICDR when ICE = 1 and TRS = 0 (including automatic transfer from
ICDRS to ICDRR)
• Table 16.6 shows the timing of SCL and SDA output in synchronization with the internal
clock. Timings on the bus are determined by the rise and fall times of signals affected by the
bus load capacitance, series resistance, and parallel resistance.
Table 16.6 I2C Bus Timing (SCL and SDA Output)
Item
Symbol
Output Timing
Unit
Notes
SCL output cycle time
t SCLO
28t cyc to 256tcyc
ns
SCL output high pulse width
t SCLHO
0.5tSCLO
ns
Figure 22.25
(reference)
SCL output low pulse width
t SCLLO
0.5tSCLO
ns
SDA output bus free time
t BUFO
0.5tSCLO – 1t cyc
ns
Start condition output hold time
t STAHO
0.5tSCLO – 1t cyc
ns
Retransmission start condition output
setup time
t STASO
1t SCLO
ns
Stop condition output setup time
t STOSO
0.5tSCLO + 2tcyc
ns
Data output setup time (master)
t SDASO
1t SCLLO – 3tcyc
ns
Data output setup time (slave)
Data output hold time
1t SCLL – (6t cyc or
12t cyc *)
t SDAHO
3t cyc
ns
Note: * 6t cyc when IICX is 0, 12tcyc when 1.
• SCL and SDA input is sampled in synchronization with the internal clock. The AC timing
therefore depends on the system clock cycle tcyc, as shown in I2C Bus Timing in section 22,
Electrical Characteristics. Note that the I2C bus interface AC timing specifications will not be
met with a system clock frequency of less than 5 MHz.
461
• The I2C bus interface specification for the SCL rise time tsr is under 1000 ns (300 ns for highspeed mode). In master mode, the I2C bus interface monitors the SCL line and synchronizes
one bit at a time during communication. If tSr (the time for SCL to go from low to VIH) exceeds
the time determined by the input clock of the I2C bus interface, the high period of SCL is
extended. The SCL rise time is determined by the pull-up resistance and load capacitance of
the SCL line. To insure proper operation at the set transfer rate, adjust the pull-up resistance
and load capacitance so that the SCL rise time does not exceed the values given in the table
16.7 below.
Table 16.7 Permissible SCL Rise Time (tSr) Values
Time Indication
2
IICX
tcyc
Indication
0
7.5tcyc
1
17.5tcyc
I C Bus
Specification ø =
(Max.)
5 MHz
ø=
8 MHz
ø=
ø=
ø=
10 MHz 16 MHz 20 MHz
Normal mode
1000 ns
1000 ns 937 ns
750 ns
468 ns
375 ns
High-speed
mode
300 ns
300 ns
300 ns
300 ns
300 ns
Normal mode
1000 ns
1000 ns 1000 ns
1000 ns 1000 ns 875 ns
High-speed
mode
300 ns
300 ns
300 ns
300 ns
300 ns
300 ns
300 ns
• The I2C bus interface specifications for the SCL and SDA rise and fall times are under 1000 ns
and 300 ns. The I2C bus interface SCL and SDA output timing is prescribed by t cyc, as shown in
table 16.6. However, because of the rise and fall times, the I2C bus interface specifications may
not be satisfied at the maximum transfer rate. Table 16.8 shows output timing calculations for
different operating frequencies, including the worst-case influence of rise and fall times.
tBUFO fails to meet the I2C bus interface specifications at any frequency. The solution is either
(a) to provide coding to secure the necessary interval (approximately 1 µs) between issuance of
a stop condition and issuance of a start condition, or (b) to select devices whose input timing
permits this output timing for use as slave devices connected to the I2C bus.
tSCLLO in high-speed mode and t STASO in standard mode fail to satisfy the I 2C bus interface
specifications for worst-case calculations of tSr/tSf. Possible solutions that should be
investigated include (a) adjusting the rise and fall times by means of a pull-up resistor and
capacitive load, (b) reducing the transfer rate to meet the specifications, or (c) selecting devices
whose input timing permits this output timing for use as slave devices connected to the I 2C
bus.
462
Table 16.8 I2C Bus Timing (with Maximum Influence of tSr/tSf)
Time Indication (at Maximum Transfer Rate) [ns]
Item
t SCLHO
t SCLLO
t BUFO
t STAHO
t STASO
tcyc
Indication
0.5tSCLO
(–tSr)
ø=
8 MHz
ø=
ø=
ø=
10 MHz 16 MHz 20 MHz
–1000
4000
4000
4000
4000
4000
4000
High-speed –300
mode
600
950
950
950
950
950
Standard
mode
–250
4700
4750
4750
4750
4750
4750
High-speed –250
mode
1300
1000* 1 1000* 1 1000* 1 1000* 1 1000* 1
0.5tSCLO – Standard
–1000
1t cyc
mode
( –tSr )
High-speed –300
mode
4700
3800* 1 3875* 1 3900* 1 3938* 1 3950* 1
1300
750* 1
825* 1
850* 1
888* 1
900* 1
0.5tSCLO – Standard
–250
1t cyc
mode
(–tSf )
High-speed –250
mode
4000
4550
4625
4650
4688
4700
600
800
875
900
938
950
4700
9000
9000
9000
9000
9000
600
2200
2200
2200
2200
2200
4000
4400
4250
4200
4125
4100
600
1350
1200
1150
1075
1050
250
3100
3325
3400
3513
3550
100
400
625
700
813
850
250
1300
2200
2500
2950
3100
100
–1400* 1 –500* 1 –200* 1 250
0.5tSCLO
(–tSf )
1t SCLO
(–tSr )
Standard
mode
I 2C Bus
tSr/tSf
SpecifiInfluence cation ø =
(Min.)
5 MHz
(Max.)
Standard
mode
–1000
High-speed –300
mode
t STOSO
0.5tSCLO + Standard
–1000
2t cyc
mode
(–tSr )
High-speed –300
mode
t SDASO
–1000
1t SCLLO*3 – Standard
mode
(master) 3t cyc
(–tSr )
High-speed –300
mode
t SDASO
(slave)
–1000
1t SCLL * 3 – Standard
12t cyc * 2
mode
(–tSr )
High-speed –300
mode
400
463
Time Indication (at Maximum Transfer Rate) [ns]
Item
tcyc
Indication
t SDAHO
3t cyc
I 2C Bus
tSr/tSf
SpecifiInfluence cation ø =
(Min.)
5 MHz
(Max.)
ø=
8 MHz
ø=
ø=
ø=
10 MHz 16 MHz 20 MHz
0
0
600
375
300
188
150
High-speed 0
mode
0
600
375
300
188
150
Standard
mode
Notes: 1. Does not meet the I 2C bus interface specification. Remedial action such as the following
is necessary: (a) secure a start/stop condition issuance interval; (b) adjust the rise and
fall times by means of a pull-up resistor and capacitive load; (c) reduce the transfer rate;
(d) select slave devices whose input timing permits this output timing.
The values in the above table will vary depending on the settings of the IICX bit and bits
CKS0 to CKS2. Depending on the frequency it may not be possible to achieve the
maximum transfer rate; therefore, whether or not the I 2C bus interface specifications are
met must be determined in accordance with the actual setting conditions.
2. Value when the IICX bit is set to 1. When the IICX bit is cleared to 0, the value is (t SCLL –
6t cyc ).
3. Calculated using the I 2C bus specification values (standard mode: 4700 ns min.; highspeed mode: 1300 ns min.).
• Note on ICDR Read at End of Master Reception
To halt reception at the end of a receive operation in master receive mode, set the TRS bit to 1
and write 0 to BBSY and SCP in ICCR. This changes SDA from low to high when SCL is
high, and generates the stop condition. After this, receive data can be read by means of an
ICDR read, but if data remains in the buffer the ICDRS receive data will not be transferred to
ICDR, and so it will not be possible to read the second byte of data.
If it is necessary to read the second byte of data, issue the stop condition in master receive
mode (i.e. with the TRS bit cleared to 0). When reading the receive data, first confirm that the
BBSY bit in the ICCR register is cleared to 0, the stop condition has been generated, and the
bus has been released, then read the ICDR register with TRS cleared to 0.
Note that if the receive data (ICDR data) is read in the interval between execution of the
instruction for issuance of the stop condition (writing of 0 to BBSY and SCP in ICCR) and the
actual generation of the stop condition, the clock may not be output correctly in subsequent
master transmission.
Clearing of the MST bit after completion of master transmission/reception, or other
modifications of IIC control bits to change the transmit/receive operating mode or settings,
must be carried out during interval (a) in figure 16.18 (after confirming that the BBSY bit has
been cleared to 0 in the ICCR register).
464
Stop condition
Start condition
(a)
SDA
Bit 0
A
SCL
8
9
Internal clock
BBSY bit
Master receive mode
ICDR reading
prohibited
Execution of stop
condition issuance
instruction
(0 written to BBSY
and SCP)
Confirmation of stop
condition generation
(0 read from BBSY)
Start condition
issuance
Figure 16.18 Points for Attention Concerning Reading of Master Receive Data
• Notes on Start Condition Issuance for Retransmission
Figure 16.19 shows the timing of start condition issuance for retransmission, and the timing for
subsequently writing data to ICDR, together with the corresponding flowchart. After
retransmission start condition issuance is done and determined the start condition, write the
transmit data to ICDR, as shown below.
465
[1] Wait for end of 1-byte transfer
IRIC=1 ?
No
[1]
[2] Determine wheter SCL is low
Yes
Clear IRIC in ICSR
Start condition
issuance?
[3] Issue restart condition instruction for transmission
No
Other processing
[4] Determine whether start condition is generated or not
Yes
Read SCL pin
SCL=Low ?
[2]
[5] Set transmit data (slave address + R/W)
No
Note: Program so that processing instruction from [3] to [5] is
Yes
executed continuously.
Write BBSY=1,
SCP=0 (ICSR)
[3]
[4]
IRIC=1 ?
No
Yes
Write transmit data to ICDR
[5]
Start condition
(retransmission)
SCL
SDA
9
ACK
bit 7
Data output
IRIC
[5] ICDR write (next transmit data)
[4] IRIC determination
[3] Start condition instruction issuance
[2] Determination of SCL=Low
[1] IRIC determination
Figure 16.19 Flowchart and Timing of Start Condition Instruction Issuance for
Retransmission
466
• Note on I2C Bus Interface Stop Condition Instruction Issuance
If the rise time of the 9th SCL clock exceeds the specification because the bus load capacitance
is large, or if there is a slave devices of the type that drives SCL low to effect a wait, after
rising of the 9th SCL clock, issue the stop condition after reading SCL and determining it to be
low, as shown below.
9th clock
VIH
High period secured
SCL
As waveform rise is late,
SCL is detected as low
SDA
Stop condition generation
IRIC
[2] Stop condition instruction issuance
[1] Determination of SCL=Low
Figure 16.20 Timing of Stop Condition Issuance
467
468
Section 17 A/D Converter
17.1
Overview
The H8S/2128 Series and H8S/2124 Series incorporate a 10-bit successive-approximations A/D
converter that allows up to eight analog input channels to be selected.
In addition to the eight analog input channels, up to 8 channels of digital input can be selected for
A/D conversion. Since the conversion precision falls to the equivalent of 6-bit resolution when
digital input is selected, digital input is ideal for use by a comparator identifying multi-valued
inputs, for example.
17.1.1
Features
A/D converter features are listed below.
• 10-bit resolution
• Eight (analog) or 8 (digital) input channels
• Settable analog conversion voltage range
 The analog conversion voltage range is set using the analog power supply voltage pin
(AVcc) as the analog reference voltage
• High-speed conversion
 Minimum conversion time: 6.7 µs per channel (at 20 MHz operation)
• Choice of single mode or scan mode
 Single mode: Single-channel A/D conversion
 Scan mode: Continuous A/D conversion on 1 to 4 channels
• Four data registers
 Conversion results are held in a 16-bit data register for each channel
• Sample and hold function
• Three kinds of conversion start
 Choice of software or timer conversion start trigger (8-bit timer), or ADTRG pin
• A/D conversion end interrupt generation
 An A/D conversion end interrupt (ADI) request can be generated at the end of A/D
conversion
469
17.1.2
Block Diagram
Figure 17.1 shows a block diagram of the A/D converter.
Internal
data bus
AVSS
AN0
AN1
AN5
AN6/CIN0 to CIN7
AN7
ADCR
ADCSR
ADDRD
ADDRC
ADDRB
+
–
Multiplexer
AN2
AN3
AN4
ADDRA
10-bit D/A
Successive approximations
register
AVCC
Bus interface
Module data bus
Comparator
ø/8
Control circuit
Sample-andhold circuit
ø/16
ADI interrupt
signal
ADTRG
Legend:
ADCR:
ADCSR:
ADDRA:
ADDRB:
ADDRC:
ADDRD:
Conversion start
trigger from 8-bit
timer
A/D control register
A/D control/status register
A/D data register A
A/D data register B
A/D data register C
A/D data register D
Figure 17.1 Block Diagram of A/D Converter
470
17.1.3
Pin Configuration
Table 17.1 summarizes the input pins used by the A/D converter.
The AVCC and AVSS pins are the power supply pins for the analog block in the A/D converter.
Table 17.1 A/D Converter Pins
Pin Name
Symbol
I/O
Function
Analog power supply pin
AVCC
Input
Analog block power supply
Analog ground pin
AVSS
Input
Analog block ground and A/D conversion
reference voltage
Analog input pin 0
AN0
Input
Analog input channel 0
Analog input pin 1
AN1
Input
Analog input channel 1
Analog input pin 2
AN2
Input
Analog input channel 2
Analog input pin 3
AN3
Input
Analog input channel 3
Analog input pin 4
AN4
Input
Analog input channel 4
Analog input pin 5
AN5
Input
Analog input channel 5
Analog input pin 6
AN6
Input
Analog input channel 6
Analog input pin 7
AN7
Input
Analog input channel 7
A/D external trigger input pin
ADTRG
Input
External trigger input for starting A/D
conversion
Expansion A/D input pins
0 to 7
CIN0 to
CIN7
Input
Expansion A/D conversion input (digital
input pin) channels 0 to 7
471
17.1.4
Register Configuration
Table 17.2 summarizes the registers of the A/D converter.
Table 17.2 A/D Converter Registers
Name
Abbreviation
R/W
Initial Value
Address* 1
A/D data register AH
ADDRAH
R
H'00
H'FFE0
A/D data register AL
ADDRAL
R
H'00
H'FFE1
A/D data register BH
ADDRBH
R
H'00
H'FFE2
A/D data register BL
ADDRBL
R
H'00
H'FFE3
A/D data register CH
ADDRCH
R
H'00
H'FFE4
A/D data register CL
ADDRCL
R
H'00
H'FFE5
A/D data register DH
ADDRDH
R
H'00
H'FFE6
A/D data register DL
ADDRDL
R
H'00
H'FFE7
H'00
H'FFE8
2
A/D control/status register
ADCSR
R/(W)*
A/D control register
ADCR
R/W
H'3F
H'FFE9
Module stop control register
MSTPCRH
R/W
H'3F
H'FF86
MSTPCRL
R/W
H'FF
H'FF87
KBCOMP
R/W
H'00
H'FEE4
Keyboard comparator control
register
Notes: 1. Lower 16 bits of the address.
2. Only 0 can be written in bit 7, to clear the flag.
17.2
Register Descriptions
17.2.1
A/D Data Registers A to D (ADDRA to ADDRD)
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 —
—
—
—
—
—
Initial value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
There are four 16-bit read-only ADDR registers, ADDRA to ADDRD, used to store the results of
A/D conversion.
472
The 10-bit data resulting from A/D conversion is transferred to the ADDR register for the selected
channel and stored there. The upper 8 bits of the converted data are transferred to the upper byte
(bits 15 to 8) of ADDR, and the lower 2 bits are transferred to the lower byte (bits 7 and 6) and
stored. Bits 5 to 0 are always read as 0.
The correspondence between the analog input channels and ADDR registers is shown in table
17.3.
The ADDR registers can always be read by the CPU. The upper byte can be read directly, but for
the lower byte, data transfer is performed via a temporary register (TEMP). For details, see section
17.3, Interface to Bus Master.
The ADDR registers are initialized to H'0000 by a reset, and in standby mode, watch mode,
subactive mode, subsleep mode, and module stop mode.
Table 17.3 Analog Input Channels and Corresponding ADDR Registers
Analog Input Channel
Group 0
Group 1
A/D Data Register
AN0
AN4
ADDRA
AN1
AN5
ADDRB
AN2
AN6 or CIN0 to CIN7
ADDRC
AN3
AN7
ADDRD
17.2.2
A/D Control/Status Register (ADCSR)
Bit
7
6
5
4
3
2
1
0
ADF
ADIE
ADST
SCAN
CKS
CH2
CH1
CH0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: * Only 0 can be written in bit 7, to clear the flag.
ADCSR is an 8-bit readable/writable register that controls A/D conversion operations.
ADCSR is initialized to H'00 by a reset, and in standby mode, watch mode, subactive mode,
subsleep mode, and module stop mode.
473
Bit 7—A/D End Flag (ADF): Status flag that indicates the end of A/D conversion.
Bit 7
ADF
Description
0
[Clearing conditions]
1
•
When 0 is written in the ADF flag after reading ADF = 1
•
When the DTC is activated by an ADI interrupt and ADDR is read
(Initial value)
[Setting conditions]
•
Single mode: When A/D conversion ends
•
Scan mode: When A/D conversion ends on all specified channels
Bit 6—A/D Interrupt Enable (ADIE): Selects enabling or disabling of interrupt (ADI) requests
at the end of A/D conversion.
Bit 6
ADIE
Description
0
A/D conversion end interrupt (ADI) request is disabled
1
A/D conversion end interrupt (ADI) request is enabled
(Initial value)
Bit 5—A/D Start (ADST): Selects starting or stopping of A/D conversion. Holds a value of 1
during A/D conversion.
The ADST bit can be set to 1 by software, a timer conversion start trigger, or the A/D external
trigger input pin (ADTRG).
Bit 5
ADST
Description
0
A/D conversion stopped
1
Single mode: A/D conversion is started. Cleared to 0 automatically when conversion
on the specified channel ends
(Initial value)
Scan mode: A/D conversion is started. Conversion continues sequentially on the
selected channels until ADST is cleared to 0 by software, a reset, or a
transition to standby mode or module stop mode
Bit 4—Scan Mode (SCAN): Selects single mode or scan mode as the A/D conversion operating
mode. See section 17.4, Operation, for single mode and scan mode operation. Only set the SCAN
bit while conversion is stopped.
474
Bit 4
SCAN
Description
0
Single mode
1
Scan mode
(Initial value)
Bit 3—Clock Select (CKS): Sets the A/D conversion time. Only change the conversion time
while ADST = 0.
Bit 3
CKS
Description
0
Conversion time = 266 states (max.)
1
Conversion time = 134 states (max.)
(Initial value)
Bits 2 to 0—Channel Select 2 to 0 (CH2 to CH0): Together with the SCAN bit, these bits select
the analog input channel(s).
One analog input channel can be switched to digital input.
Only set the input channel while conversion is stopped.
Group
Selection
Channel Selection
Description
CH2
CH1
CH0
Single Mode
Scan Mode
0
0
0
AN0
AN0
1
AN1
AN0, AN1
0
AN2
AN0 to AN2
1
AN3
AN0 to AN3
0
AN4
AN4
1
AN5
AN4, AN5
0
AN6 or CIN0 to CIN7
AN4, AN5, AN6 or
CIN0 to CIN7
1
AN7
AN4, AN5, AN6 or
CIN0 to CIN7
1
1
0
1
(Initial value)
AN7
475
17.2.3
A/D Control Register (ADCR)
7
6
5
4
3
2
1
0
TRGS1
TRGS0
—
—
—
—
—
—
Bit
Initial value
0
0
1
1
1
1
1
1
Read/Write
R/W
R/W
—
—
—
—
—
—
ADCR is an 8-bit readable/writable register that enables or disables external triggering of A/D
conversion operations.
ADCR is initialized to H'3F by a reset, and in standby mode, watch mode, subactive mode,
subsleep mode, and module stop mode.
Bits 7 and 6—Timer Trigger Select 1 and 0 (TRGS1, TRGS0): These bits select enabling or
disabling of the start of A/D conversion by a trigger signal. Only set bits TRGS1 and TRGS0
while conversion is stopped.
Bit 7
Bit 6
TRGS1
TRGS0
Description
0
0
Start of A/D conversion by external trigger is disabled
1
Start of A/D conversion by external trigger is disabled
0
Start of A/D conversion by external trigger (8-bit timer) is enabled
1
Start of A/D conversion by external trigger pin is enabled
1
Bits 5 to 0—Reserved: These bits cannot be modified and are always read as 1.
476
(Initial value)
17.2.4
Keyboard Comparator Control Register (KBCOMP)
Bit
7
6
5
4
3
IrE
IrCKS2
IrCKS1
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
IrCKS0 KBADE
2
KBCH2
1
0
KBCH1 KBCH0
KBCOMP is an 8-bit readable/writable register that selects the CIN input channels for A/D
conversion.
KBCOMP is initialized to H'00 by a reset and in hardware standby mode.
Bits 7 to 4—Reserved
Bit 3—Keyboard A/D Enable: Selects either analog input pin (AN6) or digital input pin (CIN0
to CIN7) for A/D converter channel 6 input. If digital input pins are selected, input on A/D
converter channel 7 will not be converted correctly.
Bits 2 to 0—Keyboard A/D Channel Select 2 to 0 (KBCH2 to KBCH0): These bits select the
channels for A/D conversion from among the digital input pins. Only set the input channel while
A/D conversion is stopped.
Bit 3
Bit 2
Bit 1
Bit 0
KBADE
KBCH2
KBCH1
KBCH0
A/D Converter
Channel 6 Input
A/D Converter
Channel 7 Input
0
—
—
—
AN6
AN7
1
0
0
0
CIN0
Undefined
1
CIN1
Undefined
0
CIN2
Undefined
1
CIN3
Undefined
0
CIN4
Undefined
1
CIN5
Undefined
0
CIN6
Undefined
1
CIN7
Undefined
1
1
0
1
477
17.2.5
Module Stop Control Register (MSTPCR)
MSTPCRH
Bit
7
6
5
4
3
MSTPCRL
2
1
0
7
6
5
4
3
2
1
0
MSTP15 MSTP14 MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTP8 MSTP7 MSTP6 MSTP5 MSTP4 MSTP3 MSTP2 MSTP1 MSTP0
Initial value
Read/Write
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR, comprising two 8-bit readable/writable registers, performs module stop mode control.
When the MSTP9 bit in MSTPCR is set to 1, A/D converter operation stops at the end of the bus
cycle and a transition is made to module stop mode. Registers cannot be read or written to in
module stop mode. For details, see section 21.5, Module Stop Mode.
MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in
software standby mode.
MSTPCRH Bit 1—Module Stop (MSTP9): Specifies the A/D converter module stop mode.
MSTPCRH
Bit 1
MSTP9
Description
0
A/D converter module stop mode is cleared
1
A/D converter module stop mode is set
478
(Initial value)
17.3
Interface to Bus Master
ADDRA to ADDRD are 16-bit registers, but the data bus to the bus master is only 8 bits wide.
Therefore, in accesses by the bus master, the upper byte is accessed directly, but the lower byte is
accessed via a temporary register (TEMP).
A data read from ADDR is performed as follows. When the upper byte is read, the upper byte
value is transferred to the CPU and the lower byte value is transferred to TEMP. Next, when the
lower byte is read, the TEMP contents are transferred to the CPU.
When reading ADDR, always read the upper byte before the lower byte. It is possible to read only
the upper byte, but if only the lower byte is read, incorrect data may be obtained.
Figure 17.2 shows the data flow for ADDR access.
Upper byte read
Bus master
(H'AA)
Module data bus
Bus interface
TEMP
(H'40)
ADDRnH
(H'AA)
ADDRnL
(H'40)
(n = A to D)
Lower byte read
Bus master
(H'40)
Module data bus
Bus interface
TEMP
(H'40)
ADDRnH
(H'AA)
ADDRnL
(H'40)
(n = A to D)
Figure 17.2 ADDR Access Operation (Reading H'AA40)
479
17.4
Operation
The A/D converter operates by successive approximations with 10-bit resolution. It has two
operating modes: single mode and scan mode.
17.4.1
Single Mode (SCAN = 0)
Single mode is selected when A/D conversion is to be performed on a single channel only. A/D
conversion is started when the ADST bit is set to 1 by software, or by external trigger input. The
ADST bit remains set to 1 during A/D conversion, and is automatically cleared to 0 when
conversion ends.
On completion of conversion, the ADF flag is set to 1. If the ADIE bit is set to 1 at this time, an
ADI interrupt request is generated. The ADF flag is cleared by writing 0 after reading ADCSR.
When the operating mode or analog input channel must be changed during analog conversion, to
prevent incorrect operation, first clear the ADST bit to 0 in ADCSR to halt A/D conversion. After
making the necessary changes, set the ADST bit to 1 to start A/D conversion again. The ADST bit
can be set at the same time as the operating mode or input channel is changed.
Typical operations when channel 1 (AN1) is selected in single mode are described next. Figure
17.3 shows a timing diagram for this example.
1. Single mode is selected (SCAN = 0), input channel AN1 is selected (CH1 = 0, CH0 = 1), the
A/D interrupt is enabled (ADIE = 1), and A/D conversion is started (ADST = 1).
2. When A/D conversion is completed, the result is transferred to ADDRB. At the same time the
ADF flag is set to 1, the ADST bit is cleared to 0, and the A/D converter becomes idle.
3. Since ADF = 1 and ADIE = 1, an ADI interrupt is requested.
4. The A/D interrupt handling routine starts.
5. The routine reads ADCSR, then writes 0 to the ADF flag.
6. The routine reads and processes the conversion result (ADDRB).
7. Execution of the A/D interrupt handling routine ends. After that, if the ADST bit is set to 1,
A/D conversion starts again and steps 2 to 7 are repeated.
480
Set*
ADIE
ADST
A/D
conversion
starts
Set*
Set*
Clear*
Clear*
ADF
State of channel 0 (AN0)
Idle
State of channel 1 (AN1)
Idle
State of channel 2 (AN2)
Idle
State of channel 3 (AN3)
Idle
A/D conversion 1
Idle
A/D conversion 2
Idle
ADDRA
ADDRB
Read conversion result
A/D conversion result 1
Read conversion result
A/D conversion result 2
ADDRC
ADDRD
Note: * Vertical arrows ( ) indicate instructions executed by software.
Figure 17.3 Example of A/D Converter Operation (Single Mode, Channel 1 Selected)
481
17.4.2
Scan Mode (SCAN = 1)
Scan mode is useful for monitoring analog inputs in a group of one or more channels. When the
ADST bit is set to 1 by software, or by timer or external trigger input, A/D conversion starts on the
first channel in the group (AN0 when CH2 = 0; AN4 when CH2 = 1). When two or more channels
are selected, after conversion of the first channel ends, conversion of the second channel (AN1 or
AN5) starts immediately. A/D conversion continues cyclically on the selected channels until the
ADST bit is cleared to 0. The conversion results are transferred for storage into the ADDR
registers corresponding to the channels.
When the operating mode or analog input channel must be changed during analog conversion, to
prevent incorrect operation, first clear the ADST bit to 0 in ADCSR to halt A/D conversion. After
making the necessary changes, set the ADST bit to 1 to start A/D conversion again. The ADST bit
can be set at the same time as the operating mode or input channel is changed.
Typical operations when three channels (AN0 to AN2) are selected in scan mode are described
next. Figure 17.4 shows a timing diagram for this example.
1. Scan mode is selected (SCAN = 1), scan group 0 is selected (CH2 = 0), analog input channels
AN0 to AN2 are selected (CH1 = 1, CH0 = 0), and A/D conversion is started (ADST = 1)
2. When A/D conversion of the first channel (AN0) is completed, the result is transferred to
ADDRA. Next, conversion of the second channel (AN1) starts automatically.
3. Conversion proceeds in the same way through the third channel (AN2).
4. When conversion of all the selected channels (AN0 to AN2) is completed, the ADF flag is set
to 1 and conversion of the first channel (AN0) starts again. If the ADIE bit is set to 1 at this
time, an ADI interrupt is requested after A/D conversion ends.
5. Steps 2 to 4 are repeated as long as the ADST bit remains set to 1. When the ADST bit is
cleared to 0, A/D conversion stops. After that, if the ADST bit is set to 1, A/D conversion
starts again from the first channel (AN0).
482
Continuous A/D conversion execution
Clear*1
Set*1
ADST
Clear*1
ADF
A/D conversion time
State of channel 0 (AN0)
State of channel 1 (AN1)
State of channel 2 (AN2)
Idle
Idle
A/D conversion 1
Idle
Idle
A/D conversion 2
Idle
Idle
A/D conversion 4
A/D conversion 5 *2
Idle
A/D conversion 3
State of channel 3 (AN3)
Idle
Idle
Transfer
ADDRA
A/D conversion result 1
ADDRB
A/D conversion result 4
A/D conversion result 2
ADDRC
A/D conversion result 3
ADDRD
Notes: 1. Vertical arrows ( ) indicate instructions executed by software.
2. Data currently being converted is ignored.
Figure 17.4 Example of A/D Converter Operation
(Scan Mode, Channels AN0 to AN2 Selected)
483
17.4.3
Input Sampling and A/D Conversion Time
The A/D converter has a built-in sample-and-hold circuit. The A/D converter samples the analog
input at a time tD after the ADST bit is set to 1, then starts conversion. Figure 17.5 shows the A/D
conversion timing. Table 17.4 indicates the A/D conversion time.
As indicated in figure 17.5, the A/D conversion time includes t D and the input sampling time. The
length of tD varies depending on the timing of the write access to ADCSR. The total conversion
time therefore varies within the ranges indicated in table 17.4.
In scan mode, the values given in table 17.4 apply to the first conversion time. In the second and
subsequent conversions the conversion time is fixed at 256 states when CKS = 0 or 128 states
when CKS = 1.
(1)
ø
Address
(2)
Write signal
Input sampling
timing
ADF
tD
t SPL
t CONV
Legend:
(1):
ADCSR write cycle
(2):
ADCSR address
A/D conversion start delay
tD:
tSPL: Input sampling time
tCONV: A/D conversion time
Figure 17.5 A/D Conversion Timing
484
Table 17.4 A/D Conversion Time (Single Mode)
CKS = 0
CKS = 1
Item
Symbol
Min
Typ
Max
Min
Typ
Max
A/D conversion start delay
tD
10
—
17
6
—
9
Input sampling time
t SPL
—
63
—
—
31
—
A/D conversion time
t CONV
259
—
266
131
—
134
Note: Values in the table are the number of states.
17.4.4
External Trigger Input Timing
A/D conversion can be externally triggered. When the TRGS1 and TRGS0 bits are set to 11 in
ADCR, external trigger input is enabled at the ADTRG pin. A falling edge at the ADTRG pin sets
the ADST bit to 1 in ADCSR, starting A/D conversion. Other operations, in both single and scan
modes, are the same as when the ADST bit is set to 1 by software. Figure 17.6 shows the timing.
ø
ADTRG
Internal trigger signal
ADST
A/D conversion
Figure 17.6 External Trigger Input Timing
17.5
Interrupts
The A/D converter generates an interrupt (ADI) at the end of A/D conversion. The ADI interrupt
request can be enabled or disabled by the ADIE bit in ADCSR.
485
17.6
Usage Notes
The following points should be noted when using the A/D converter.
Setting Range of Analog Power Supply and Other Pins:
1. Analog input voltage range
The voltage applied to the ANn analog input pins during A/D conversion should be in the
range AVSS ≤ ANn ≤ AVCC (n = 0 to 7).
2. Digital input voltage range
The voltage applied to the CINn digital input pins should be in the range AVSS ≤ CINn ≤ AV CC
and VSS ≤ CINn ≤ VCC (n = 0 to 7).
3. Relation between AV CC, AVSS and V CC, VSS
As the relationship between AVCC, AVSS and V CC, VSS, set AVSS = VSS . If the A/D converter is
not used, the AVCC and AVSS pins must on no account be left open.
If conditions 1 to 3 above are not met, the reliability of the device may be adversely affected.
Notes on Board Design: In board design, digital circuitry and analog circuitry should be as
mutually isolated as possible, and layout in which digital circuit signal lines and analog circuit
signal lines cross or are in close proximity should be avoided as far as possible. Failure to do so
may result in incorrect operation of the analog circuitry due to inductance, adversely affecting A/D
conversion values.
Also, digital circuitry must be isolated from the analog input signals (AN0 to AN7), and analog
power supply (AVCC) by the analog ground (AVSS). Also, the analog ground (AVSS) should be
connected at one point to a stable digital ground (VSS) on the board.
Notes on Noise Countermeasures: A protection circuit connected to prevent damage due to an
abnormal voltage such as an excessive surge at the analog input pins (AN0 to AN7) should be
connected between AVCC and AVSS as shown in figure 17.7.
Also, the bypass capacitors connected to AVCC and the filter capacitor connected to AN0 to AN7
must be connected to AVSS.
If a filter capacitor is connected as shown in figure 17.7, the input currents at the analog input pins
(AN0 to AN7) are averaged, and so an error may arise. Also, when A/D conversion is performed
frequently, as in scan mode, if the current charged and discharged by the capacitance of the
sample-and-hold circuit in the A/D converter exceeds the current input via the input impedance
(Rin ), an error will arise in the analog input pin voltage. Careful consideration is therefore required
when deciding the circuit constants.
486
AVCC
100 Ω
Rin* 2
AN0 to AN7
*1
0.1 µF
AVSS
Notes:
Figures are reference values.
1.
10 µF
0.01 µF
2. Rin: Input impedance
Figure 17.7 Example of Analog Input Protection Circuit
Table 17.5 Analog Pin Specifications
Item
Min
Max
Unit
Analog input capacitance
—
20
pF
Permissible signal source impedance
—
10*
kΩ
Note: * When V CC = 4.0 V to 5.5 V and ø ≤ 12 MHz
10 kΩ
AN0 to
AN7
To A/D
converter
20 pF
Note: Figures are reference values.
Figure 17.8 Analog Input Pin Equivalent Circuit
487
A/D Conversion Precision Definitions: H8S/2128 Series and H8S/2124 Series A/D conversion
precision definitions are given below.
• Resolution
The number of A/D converter digital output codes
• Offset error
The deviation of the analog input voltage value from the ideal A/D conversion characteristic
when the digital output changes from the minimum voltage value B'0000000000 (H'000) to
B'0000000001 (H'001) (see figure 17.10).
• Full-scale error
The deviation of the analog input voltage value from the ideal A/D conversion characteristic
when the digital output changes from B'1111111110 (H'3FE) to B'111111111 (H'3FF) (see
figure 17.10).
• Quantization error
The deviation inherent in the A/D converter, given by 1/2 LSB (see figure 17.9).
• Nonlinearity error
The error with respect to the ideal A/D conversion characteristic between the zero voltage and
the full-scale voltage. Does not include the offset error, full-scale error, or quantization error.
• Absolute precision
The deviation between the digital value and the analog input value. Includes the offset error,
full-scale error, quantization error, and nonlinearity error.
488
Digital output
H'3FF
Ideal A/D conversion
characteristic
H'3FE
H'3FD
H'004
H'003
H'002
Quantization error
H'001
H'000
1
2
1024 1024
1022 1023 FS
1024 1024
Analog
input voltage
Figure 17.9 A/D Conversion Precision Definitions (1)
489
Full-scale error
Digital output
Ideal A/D conversion
characteristic
Nonlinearity
error
Actual A/D conversion
characteristic
FS
Offset error
Analog
input voltage
Figure 17.10 A/D Conversion Precision Definitions (2)
490
Permissible Signal Source Impedance: H8S/2128 Series and H8S/2124 Series analog input is
designed so that conversion precision is guaranteed for an input signal for which the signal source
impedance is 10 kΩ (Vcc = 4.0 to 5.5 V, when ø ≤ 12 MHz or CKS = 0) or less. This specification
is provided to enable the A/D converter’s sample-and-hold circuit input capacitance to be charged
within the sampling time; if the sensor output impedance exceeds 10 kΩ (Vcc = 4.0 to 5.5 V,
when ø ≤ 12 MHz or CKS = 0), charging may be insufficient and it may not be possible to
guarantee the A/D conversion precision.
However, if a large capacitance is provided externally, the input load will essentially comprise
only the internal input resistance of 10 kΩ, and the signal source impedance is ignored.
But since a low-pass filter effect is obtained in this case, it may not be possible to follow an analog
signal with a large differential coefficient (e.g., 5 mV/µsec or greater).
When converting a high-speed analog signal, a low-impedance buffer should be inserted.
Influences on Absolute Precision: Adding capacitance results in coupling with GND, and
therefore noise in GND may adversely affect absolute precision. Be sure to make the connection to
an electrically stable GND such as AVSS .
Care is also required to insure that filter circuits do not communicate with digital signals on the
mounting board, so acting as antennas.
Sensor output
impedance,
up to 10 kΩ
H8S/2128 Series or
H8S/2124 Series
A/D converter
chip
equivalent circuit
10 kΩ
Sensor input
Low-pass
filter
C to 0.1 µF
Cin =
15 pF
20 pF
Figure 17.11 Example of Analog Input Circuit
491
492
Section 18 RAM
18.1
Overview
The H8S/2128 has 4 kbytes of on-chip high-speed static RAM, and the H8S/2127, H8S/2126,
H8S/2122 and H8S/2120 have 2 kbytes. The on-chip RAM is connected to the bus master by a 16bit data bus, enabling both byte data and word data to be accessed in one state. This makes it
possible to perform fast word data transfer.
The on-chip RAM can be enabled or disabled by means of the RAM enable bit (RAME) in the
system control register (SYSCR).
18.1.1
Block Diagram
Figure 18.1 shows a block diagram of the on-chip RAM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'FFE080
H'FFE081
H'FFE082
H'FFE083
H'FFE084
H'FFE085
H'FFEFFE
H'FFEFFF
H'FFFF00
H'FFFF01
H'FFFF7E
H'FFFF7F
Figure 18.1 Block Diagram of RAM (H8S/2128)
493
18.1.2
Register Configuration
The on-chip RAM is controlled by SYSCR. Table 18.1 shows the register configuration.
Table 18.1 Register Configuration
Name
Abbreviation
R/W
Initial Value
Address*
System control register
SYSCR
R/W
H'09
H'FFC4
Note: * Lower 16 bits of the address.
18.2
System Control Register (SYSCR)
Bit
7
6
5
4
3
2
1
0
CS2E
IOSE
INTM1
INTM0
XRST
NMIEG
HIE
RAME
Initial value
0
0
0
0
1
0
0
1
Read/Write
R/W
R/W
R
R/W
R
R/W
R/W
R/W
The on-chip RAM is enabled or disabled by the RAME bit in SYSCR. For details of other bits in
SYSCR, see section 3.2.2, System Control Register (SYSCR).
Bit 0—RAM Enable (RAME): Enables or disables the on-chip RAM. The RAME bit is
initialized when the reset state is released. It is not initialized in software standby mode.
Bit 0
RAME
Description
0
On-chip RAM is disabled
1
On-chip RAM is enabled
494
(Initial value)
18.3
Operation
18.3.1
Expanded Mode (Modes 1, 2, and 3 (EXPE = 1))
When the RAME bit is set to 1, accesses to H8S/2128 addresses H'(FF)E080 to H'(FF)EFFF and
H'(FF)FF00 to H'(FF)FF7F, and H8S/2127, H8S/2126, H8S/2122, and H8S/2120 addresses
H'(FF)E880 to H'(FF)EFFF and H'(FF)FF00 to H'(FF)FF7F, are directed to the on-chip RAM.
When the RAME bit is cleared to 0, accesses to addresses H'(FF)E080 to H'(FF)EFFF and
H'(FF)FF00 to H'(FF)FF7F, are directed to the off-chip address space.
Since the on-chip RAM is connected to the bus master by a 16-bit data bus, it can be written to
and read in byte or word units. Each type of access is performed in one state.
Even addresses use the upper 8 bits, and odd addresses use the lower 8 bits. Word data must start
at an even address.
18.3.2
Single-Chip Mode (Modes 2 and 3 (EXPE = 0))
When the RAME bit is set to 1, accesses to H8S/2128 addresses H'(FF)E080 to H'(FF)EFFF and
H'(FF)FF00 to H'(FF)FF7F, and H8S/2127, H8S/2126, H8S/2122, and H8S/2120 addresses
H'(FF)E880 to H'(FF)EFFF and H'(FF)FF00 to H'(FF)FF7F, are directed to the on-chip RAM.
When the RAME bit is cleared to 0, the on-chip RAM is not accessed. Undefined values are read
from these bits, and writing is invalid.
Since the on-chip RAM is connected to the bus master by a 16-bit data bus, it can be written to
and read in byte or word units. Each type of access is performed in one state.
Even addresses use the upper 8 bits, and odd addresses use the lower 8 bits. Word data must start
at an even address.
495
496
Section 19 ROM
19.1
Overview
The H8S/2128 F-ZTAT has 128 kbytes of on-chip flash memory, the H8S/2127 and H8S/2122
have 64 kbytes of on-chip mask ROM, and the H8S/2126 and H8S/2120 have 32 kbytes of onchip mask ROM. The ROM is connected to the bus master by a 16-bit data bus. The CPU accesses
both byte and word data in one state, enabling faster instruction fetches and higher processing
speed.
The mode pins (MD1 and MD0) and the EXPE bit in MDCR can be set to enable or disable the
on-chip ROM.
The flash memory versions of the H8S/2128 can be erased and programmed on-board as well as
with a general-purpose PROM programmer.
19.1.1
Block Diagram
Figure 19.1 shows a block diagram of the ROM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'000000
H'000001
H'000002
H'000003
H'01FFFE
H'01FFFF
Figure 19.1 ROM Block Diagram (H8S/2128)
497
19.1.2
Register Configuration
The H8S/2128 Series and H8S/2124 Series on-chip ROM is controlled by the operating mode and
register MDCR. The register configuration is shown in table 19.1.
Table 19.1 ROM Register
Register Name
Abbreviation
R/W
Initial Value
Address*
Mode control register
MDCR
R/W
Undefined
Depends on the operating mode
H'FFC5
Note: * Lower 16 bits of the address.
19.2
Register Descriptions
19.2.1
Mode Control Register (MDCR)
Bit
7
6
5
4
3
2
1
0
EXPE
—
—
—
—
—
MDS1
MDS0
Initial value
—*
0
0
0
0
0
—*
—*
Read/Write
R/W*
—
—
—
—
—
R
R
Note: * Determined by the MD1 and MD0 pins.
MDCR is an read-only 8-bit register used to set the H8S/2128 Series or H8S/2124 Series operating
mode and monitor the current operating mode.
The EXPE bit is initialized in accordance with the mode pin states by a reset and in hardware
standby mode.
Bit 7—Expanded Mode Enable (EXPE): Sets expanded mode. In mode 1, EXPE is fixed at 1
and cannot be modified. In modes 2 and 3, EXPE has an initial value of 0 and can be read or
written.
Bit 7
EXPE
Description
0
Single-chip mode selected
1
Expanded mode selected
498
Bits 6 to 2—Reserved: These bits cannot be modified and are always read as 0.
Bits 1 and 0—Mode Select 1 and 0 (MDS1, MDS0): These bits indicate values that reflects the
input levels of mode pins MD1 and MD0 (the current operating mode). Bits MDS1 and MDS0
correspond to pins MD1 and MD0, respectively. These are read-only bits, and cannot be modified.
When MDCR is read, the input levels of mode pins MD1 and MD0 are latched in these bits.
19.3
Operation
The on-chip ROM is connected to the CPU by a 16-bit data bus, and both byte and word data is
accessed in one state. Even addresses are connected to the upper 8 bits, and odd addresses to the
lower 8 bits. Word data must start at an even address.
The mode pins (MD1 and MD0) and the EXPE bit in MDCR can be set to enable or disable the
on-chip ROM, as shown in table 19.2.
In normal mode, the maximum amount of ROM that can be used is 56 kbytes.
Table 19.2 Operating Modes and ROM
Operating Mode
MCU Operating CPU Operating
Mode
Mode
Mode Pins
MDCR
Description
MD1
MD0
EXPE On-Chip ROM
Mode 1
Normal
Expanded mode with on-chip
ROM disabled
0
1
1
Disabled
Mode 2
Advanced
Single-chip mode
1
0
0
Enabled*
Advanced
Expanded mode with on-chip
ROM enabled
Normal
Single-chip mode
Normal
Expanded mode with on-chip
ROM enabled
Mode 3
1
1
0
1
Enabled
(max. 56 kbytes)
Note: * 128 kbytes in the H8S/2128, 64 kbytes in the H8S/2127 and H8S/2122 and 32 kbytes in the
H8S/2126 and H8S/2120.
499
19.4
Overview of Flash Memory
19.4.1
Features
The features of the flash memory are summarized below.
• Four flash memory operating modes
 Program mode
 Erase mode
 Program-verify mode
 Erase-verify mode
• Programming/erase methods
The flash memory is programmed 32 bytes at a time. Erasing is performed by block erase (in
single-block units). When erasing multiple blocks, the individual blocks must be erased
sequentially. Block erasing can be performed as required on 1-kbyte, 8-kbyte, 16-kbyte, 28kbyte, and 32-kbyte.
• Programming/erase times
The flash memory programming time is 10 ms (typ.) for simultaneous 32-byte programming,
equivalent to 300 µs (typ.) per byte, and the erase time is 100 ms (typ.) per block.
• Reprogramming capability
The flash memory can be reprogrammed up to 100 times.
• On-board programming modes
There are two modes in which flash memory can be programmed/erased/verified on-board:
 Boot mode
 User program mode
• Automatic bit rate adjustment
With data transfer in boot mode, the bit rate of the H8S/2128 Series chip can be automatically
adjusted to match the transfer bit rate of the host.
• Protect modes
There are three protect modes, hardware, software, and error protect, which allow protected
status to be designated for flash memory program/erase/verify operations.
• Programmer mode
Flash memory can be programmed/erased in programmer mode, using a PROM programmer,
as well as in on-board programming mode.
500
19.4.2
Block Diagram
Internal address bus
Module bus
Internal data bus (16 bits)
FLMCR1 *
FLMCR2 *
EBR1
EBR2
Bus interface/controller
Operating
mode
Mode pins
*
*
Flash memory
(128 kbytes)
Legend:
FLMCR1:
FLMCR2:
EBR1:
EBR2:
Flash memory control register 1
Flash memory control register 2
Erase block register 1
Erase block register 2
Note: * These registers are used only in the flash memory version. In the mask ROM version,
a read at any of these addresses will return an undefined value, and writes are invalid.
Figure 19.2 Block Diagram of Flash Memory
501
19.4.3
Flash Memory Operating Modes
Mode Transitions: When the mode pins are set in the reset state and a reset-start is executed, the
MCU enters one of the operating modes shown in figure 19.3. In user mode, flash memory can be
read but not programmed or erased.
Flash memory can be programmed and erased in boot mode, user program mode, and programmer
mode.
Reset state
MD1 = 1
RES = 0
User mode with
on-chip ROM
enabled
SWE = 1
RES = 0
*1
SWE = 0
RES = 0
*2
RES = 0
Programmer
mode
User
program mode
Boot mode
On-board programming mode
Notes: Only make a transition between user mode and user program mode when the CPU is
not accessing the flash memory.
1. MD0 = MD1 = 0, P42 = 0, P41 = P40 = 1
2. MD1 = MD0 = 0, P42 = P41 = P40 = 1
Figure 19.3 Flash Memory Mode Transitions
502
On-Board Programming Modes
• Boot mode
1. Initial state
The flash memory is in the erased state when the
device is shipped. The description here applies to
the case where the old program version or data
is being rewritten. The user should prepare the
programming control program and new
application program beforehand in the host.
2. SCI communication check
When boot mode is entered, the boot program in
the H8S/2128 Series chip (originally incorporated
in the chip) is started, an SCI communication
check is carried out, and the boot program
required for flash memory erasing is
automatically transferred to the RAM boot
program area.
Host
Programming control
program
New application
program
New application
program
"#!"
Host
Programming control
program
H8S/2128 Series chip
H8S/2128 Series chip
SCI
Boot program
Flash memory
RAM
SCI
Boot program
Flash memory
RAM
Boot program area
Application program
(old version)
Application program
(old version)
3. Flash memory initialization
The erase program in the boot program area (in
RAM) is executed, and the flash memory is
initialized (to H'FF). In boot mode, entire flash
memory erasure is performed, without regard to
blocks.
4. Writing new application program
The programming control program transferred
from the host to RAM by SCI communication is
executed, and the new application program in the
host is written into the flash memory.
Host
Host
Programming control
program
New application
program
H8S/2128 Series chip
H8S/2128 Series chip
SCI
Boot program
Flash memory
RAM
Flash memory
RAM
Programming
control program
Boot program area
Flash memory
erase
SCI
Boot program
New application
program
Program execution state
Figure 19.4 Boot Mode
503
• User program mode
2. Programming/erase control program transfer
executes the transfer program in the flash
memory, and transfers the programming/erase
control program to RAM.
,
,
! 1. Initial state
(1) The program that will transfer the
programming/ erase control program to on-chip
RAM should be written into the flash memory by
the user beforehand.
(2) The programming/erase control program
should be prepared in the host or in the flash
memory.
Host
Host
Programming/
erase control program
New application
program
New application
program
H8S/2128 Series chip
H8S/2128 Series chip
SCI
Boot program
Flash memory
SCI
Boot program
Flash memory
RAM
Transfer program
RAM
Transfer program
Programming/
erase control program
Application program
(old version)
Application program
(old version)
3. Flash memory initialization
The programming/erase program in RAM is
executed, and the flash memory is initialized (to
H'FF). Erasing can be performed in block units,
but not in byte units.
4. Writing new application program
Next, the new application program in the host is
written into the erased flash memory blocks. Do
not write to unerased blocks.
Host
Host
New application
program
H8S/2128 Series chip
H8S/2128 Series chip
SCI
Boot program
Flash memory
RAM
Transfer program
Flash memory
RAM
Transfer program
Programming/
erase control program
Flash memory
erase
SCI
Boot program
Programming/
erase control program
New application
program
Program execution state
Figure 19.5 User Program Mode (Example)
504
Differences between Boot Mode and User Program Mode
Boot Mode
User Program Mode
Entire memory erase
Yes
Yes
Block erase
No
Yes
Programming control program*
Program/program-verify Erase/erase-verify
Program/program-verify
Note: * To be provided by the user, in accordance with the recommended algorithm.
Block Configuration: The flash memory is divided into two 32-kbyte blocks, two 8-kbyte blocks,
one 16-kbyte block, one 28-kbyte block, and four 1-kbyte blocks.
Address H'00000
1 kbyte
1 kbyte
1 kbyte
1 kbyte
128 kbytes
28 kbytes
16 kbytes
8 kbytes
8 kbytes
32 kbytes
32 kbytes
Address H'1FFFF
Figure 19.6 Flash Memory Block Configuration
505
19.4.4
Pin Configuration
The flash memory is controlled by means of the pins shown in table 19.3.
Table 19.3 Flash Memory Pins
Pin Name
Abbreviation
I/O
Function
Reset
RES
Input
Reset
Mode 1
MD1
Input
Sets MCU operating mode
Mode 0
MD0
Input
Sets MCU operating mode
Port 42
P42
Input
Sets MCU operating mode when MD1 = MD0 = 0
Port 41
P41
Input
Sets MCU operating mode when MD1 = MD0 = 0
Port 40
P40
Input
Sets MCU operating mode when MD1 = MD0 = 0
Transmit data
TxD0
Output
Serial transmit data output
Receive data
RxD0
Input
Serial receive data input
19.4.5
Register Configuration
The registers used to control the on-chip flash memory when enabled are shown in table 19.4.
In order for these registers to be accessed, the FLSHE bit must be set to 1 in STCR.
Table 19.4 Flash Memory Registers
Register Name
Abbreviation R/W
Initial Value
Address* 1
Flash memory control register 1
FLMCR1* 5
R/W*3
H'80
H'FF80* 2
Flash memory control register 2
FLMCR2* 5
R/W*3
H'00* 4
H'FF81* 2
Erase block register 1
EBR1* 5
R/W*3
H'00* 4
H'FF82* 2
Erase block register 2
EBR2* 5
R/W*3
H'00* 4
H'FF83* 2
Serial/timer control register
STCR
R/W
H'00
H'FFC3
Notes: 1. Lower 16 bits of the address.
2. Flash memory registers share addresses with other registers. Register selection is
performed by the FLSHE bit in the serial/timer control register (STCR).
3. In modes in which the on-chip flash memory is disabled, a read will return H'00, and
writes are invalid.
4. When the SWE bit in FLMCR1 is not set, these registers are initialized to H'00.
5. FLMCR1, FLMCR2, EBR1, and EBR2 are 8-bit registers. Only byte accesses are valid
for these registers, the access requiring 2 states. These registers are used only in the
flash memory version. In the mask ROM version, a read at any of these addresses will
return an undefined value, and writes are invalid.
506
19.5
Register Descriptions
19.5.1
Flash Memory Control Register 1 (FLMCR1)
Bit
7
6
5
4
3
2
1
0
FWE
SWE
—
—
EV
PV
E
P
Initial value
1
0
0
0
0
0
0
0
Read/Write
R
R/W
—
—
R/W
R/W
R/W
R/W
FLMCR1 is an 8-bit register used for flash memory operating mode control. Program-verify mode
or erase-verify mode is entered by setting SWE to 1 and setting the corresponding bit. Program
mode is entered by setting SWE to 1, then setting the PSU bit in FLMCR2, and finally setting the
P bit. Erase mode is entered by setting SWE to 1, then setting the ESU bit in FLMCR2, and finally
setting the E bit. FLMCR1 is initialized to H'80 by a reset, and in hardware standby mode,
software standby mode, subactive mode, subsleep mode, and watch mode. When on-chip flash
memory is disabled, a read will return H'00, and writes are invalid.
Writes to the EV and PV bits in FLMCR1 are enabled only when SWE = 1; writes to the E bit
only when SWE = 1, and ESU = 1; and writes to the P bit only when SWE = 1, and PSU = 1.
Bit 7—Flash Write Enable Bit (FWE): Controls programming and erasing of on-chip flash
memory. This bit cannot be modified and is always read as 1.
Bit 6—Software Write Enable Bit (SWE): Enables or disables flash memory programming.
SWE should be set before setting bits ESU, PSU, EV, PV, E, P, and EB9 to EB0, and should not
be cleared at the same time as these bits.
Bit 6
SWE
Description
0
Writes disabled
1
Writes enabled
(Initial value)
Bit 5 and 4—Reserved: These bits cannot be modified and are always read as 0.
507
Bit 3—Erase-Verify (EV): Selects erase-verify mode transition or clearing. Do not set the SWE,
ESU, PSU, PV, E, or P bit at the same time.
Bit 3
EV
Description
0
Erase-verify mode cleared
1
Transition to erase-verify mode
(Initial value)
[Setting condition]
When SWE = 1
Bit 2—Program-Verify (PV): Selects program-verify mode transition or clearing. Do not set the
SWE, ESU, PSU, EV, E, or P bit at the same time.
Bit 2
PV
Description
0
Program-verify mode cleared
1
Transition to program-verify mode
(Initial value)
[Setting condition]
When SWE = 1
Bit 1—Erase (E): Selects erase mode transition or clearing. Do not set the SWE, ESU, PSU, EV,
PV, or P bit at the same time.
Bit 1
E
Description
0
Erase mode cleared
1
Transition to erase mode
[Setting condition]
When SWE = 1, and ESU = 1
508
(Initial value)
Bit 0—Program (P): Selects program mode transition or clearing. Do not set the SWE, PSU,
ESU, EV, PV, or E bit at the same time.
Bit 0
P
Description
0
Program mode cleared
1
Transition to program mode
(Initial value)
[Setting condition]
When SWE = 1, and PSU = 1
19.5.2
Flash Memory Control Register 2 (FLMCR2)
Bit
7
6
5
4
3
2
1
0
FLER
—
—
—
—
—
ESU
PSU
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
—
—
—
—
—
R/W
R/W
FLMCR2 is an 8-bit register that monitors the presence or absence of flash memory program/erase
protection (error protection) and performs setup for flash memory program/erase mode. FLMCR2
is initialized to H'00 by a reset, and in hardware standby mode. The ESU and PSU bits are cleared
to 0 in software standby mode, subactive mode, subsleep mode, and watch mode.
When on-chip flash memory is disabled, a read will return H'00 and writes are invalid.
Bit 7—Flash Memory Error (FLER): Indicates that an error has occurred during an operation on
flash memory (programming or erasing). When FLER is set to 1, flash memory goes to the errorprotection state.
Bit 7
FLER
Description
0
Flash memory is operating normally
(Initial value)
Flash memory program/erase protection (error protection) is disabled
[Clearing condition]
Reset, hardware standby mode
1
An error has occurred during flash memory programming/erasing
Flash memory program/erase protection (error protection) is enabled
[Setting condition]
See section 19.8.3, Error Protection
509
Bits 6 to 2—Reserved: These bits cannot be modified and are always read as 0.
Bit 1—Erase Setup (ESU): Prepares for a transition to erase mode. Set this bit to 1 before setting
the E bit to 1 in FLMCR1. Do not set the SWE, PSU, EV, PV, E, or P bit at the same time.
Bit 1
ESU
Description
0
Erase setup cleared
1
Erase setup
(Initial value)
[Setting condition]
When SWE = 1
Bit 0—Program Setup (PSU): Prepares for a transition to program mode. Set this bit to 1 before
setting the P bit to 1 in FLMCR1. Do not set the SWE, ESU, EV, PV, E, or P bit at the same time.
Bit 0
PSU
Description
0
Program setup cleared
1
Program setup
(Initial value)
[Setting condition]
When SWE = 1
19.5.3
Erase Block Registers 1 and 2 (EBR1, EBR2)
Bit
7
6
5
4
3
2
1
0
EBR1
—
—
—
—
—
—
EB9
EB8
Initial value
0
0
0
0
0
0
0
0
Read/Write
—
—
—
—
—
—
R/W*
R/W*
Bit
7
6
5
4
3
2
1
0
EB7
EB6
EB5
EB4
EB3
EB2
EB1
EB0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
EBR2
Note: * In normal mode, these bits cannot be modified and are always read as 0.
EBR1 and EBR2 are registers that specify the flash memory erase area block by block; bits 1 and
0 in EBR1 and bits 7 to 0 in EBR2 are readable/writable bits. EBR1 and EBR2 are each initialized
to H'00 by a reset, in hardware standby mode, software standby mode, subactive mode, subsleep
510
mode, and watch mode, when the SWE bit in FLMCR1 is not set. When a bit in EBR1 or EBR2 is
set to 1, the corresponding block can be erased. Other blocks are erase-protected. Set only one bit
in EBR1 or EBR2 (more than one bit cannot be set). When on-chip flash memory is disabled, a
read will return H'00, and writes are invalid.
The flash memory block configuration is shown in table 19.5.
Table 19.5 Flash Memory Erase Blocks
Block (Size) 128-kbyte Versions
Address
EB0 (1 kB)
H'(00)0000 to H'(00)03FF
EB1 (1 kB)
H'(00)0400 to H'(00)07FF
EB2 (1 kB)
H'(00)0800 to H'(00)0BFF
EB3 (1 kB)
H'(00)0C00 to H'(00)0FFF
EB4 (28 kB)
H'(00)1000 to H'(00)7FFF
EB5 (16 kB)
H'(00)8000 to H'(00)BFFF
EB6 (8 kB)
H'(00)C000 to H'(00)DFFF
EB7 (8 kB)
H'00E000 to H'00FFFF
EB8 (32 kB)
H'010000 to H'017FFF
EB9 (32 kB)
H'018000 to H'01FFFF
19.5.4
Serial/Timer Control Register (STCR)
Bit
7
6
5
4
3
2
1
0
—
IICX1
IICX0
IICE
FLSHE
—
ICKS1
ICKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
STCR is an 8-bit readable/writable register that controls register access, the IIC operating mode
(when the on-chip IIC option is included), and on-chip flash memory (in F-ZTAT versions), and
also selects the TCNT input clock. For details on functions not related to on-chip flash memory,
see section 3.2.4, Serial/Timer Control Register (STCR), and descriptions of individual modules.
If a module controlled by STCR is not used, do not write 1 to the corresponding bit.
STCR is initialized to H'00 by a reset and in hardware standby mode.
Bit 7—Reserved: Do not write 1 to this bit.
511
Bits 6 and 5—I2C Transfer Rate Select 1 and 0 (IICX1, IICX0): These bits control the
operation of the I2C bus interface. For details see section 16.2.7, Serial/Timer Control Register
(STCR).
Bit 4—I2C Master Enable (IICE): Controls CPU access to the I2C bus interface data and control
registers, PWMX data and control registers, and SCI control registers. For details see section
3.2.4, Serial /Timer Control Register (STCR).
Bit 3—Flash Memory Control Register Enable (FLSHE): Setting the FLSHE bit to 1 enables
read/write access to the flash memory control registers. If FLSHE is cleared to 0, the flash
memory control registers are deselected, and CPU access to the power-down state control registers
and peripheral module control registers is selected. In this case, the flash memory control register
contents are retained.
Bit 3
FLSHE
Description
0
In address area H’(FF)F80 to H’(FF)FF87, power-down state control
registers and peripheral module control registers are accessed
(Initial value)
Flash memory control registers deselected
1
In address area H’(FF)F80 to H’(FF)FF87, flash memory control registers are
accessed
Power-down state registers and peripheral module control registers are deselected
Bit 2—Reserved: Do not write 1 to this bit.
Bits 1 and 0—Internal Clock Source Select 1 and 0 (ICKS1, ICKS0): These bits control 8-bit
timer operation. For details see section 12.2.4, Timer Control Register (TCR).
512
19.6
On-Board Programming Modes
When pins are set to on-board programming mode, a transition is made to in which
program/erase/verify operations can be performed on the on-chip flash memory. There are two onboard programming modes: boot mode and user program mode. The pin settings for transition to
each of these modes are shown in table 19.6. For a diagram of the transitions to the various flash
memory modes, see figure 19.3.
Only advanced mode setting is possible for boot mode.
In the case of user program mode, user program mode is established in advanced mode or normal
mode, depending on the setting of the MD0 pin. In normal mode, only programming of a 56-kbyte
area of flash memory is possible.
Table 19.6 Setting On-Board Programming Modes
Mode
Pin
Mode Name
CPU Operating Mode
MD1
MD0
P42
P41
P40
Boot mode
Advanced mode
0
0
1*
1*
1*
User program mode
Advanced mode
1
0
—
—
—
1
—
—
—
Normal mode
Note: * Can be used as I/O ports after boot mode is initiated.
19.6.1
Boot Mode
When boot mode is used, the flash memory programming control program must be prepared in the
host beforehand. The channel 0 SCI to be used is set to asynchronous mode.
When a reset-start is executed after the H8S/2128 Series MCU’s pins have been set to boot mode,
the boot program built into the MCU is started and the programming control program prepared in
the host is serially transmitted to the MCU via the SCI. In the MCU, the user program received via
the SCI is written into the user program area in on-chip RAM. After the transfer is completed,
control branches to the start address of the user program area and the user program execution state
is entered (flash memory programming is performed).
The transferred user program must therefore include coding that follows the programming
algorithm given later.
The system configuration in boot mode is shown in figure 19.7, and the boot program mode
execution procedure in figure 19.8.
513
H8S/2128 Series chip
Flash memory
Host
Write data reception
Verify data transmission
RxD0
SCI0
TxD0
Figure 19.7 System Configuration in Boot Mode
514
On-chip RAM
Start
Set pins to boot program mode
and execute reset-start
Host transfers data (H'00)
continuously at prescribed bit rate
MCU measures low period
of H'00 data transmitted by host
MCU calculates bit rate and
sets value in bit rate register
After bit rate adjustment, transmits
one H'00 data byte to host to
indicate end of adjustment
Host confirms normal reception
of bit rate adjustment end
indication (H'00), and transmits
one H'55 data byte
After receiving H'55,
MCU transfers part of boot
program to RAM
Check flash memory data, and
if data has already been written,
erase all blocks
After confirming that all flash
memory data has been erased,
MCU transmits one H'AA data
byte to host
Host transmits number
of user program bytes (N),
upper byte followed by lower byte
MCU transmits received
number of bytes to host as verify
data (echo-back)
n=1
Host transmits user program
sequentially in byte units
MCU transmits received user
program to host as verify data
(echo-back)
n+1→n
Transfer received programming
control program to on-chip RAM
No
n = N?
Yes
End of transmission
Transmit one H'AA data byte to host,
and execute programming control
program transferred to on-chip RAM
Note: If a memory cell does not operate normally and cannot be erased, one H'FF byte is
transmitted as an erase error, and the erase operation and subsequent operations
are halted.
Figure 19.8 Boot Mode Execution Procedure
515
Automatic SCI Bit Rate Adjustment
Start
bit
D0
D1
D2
D3
D4
D5
D6
Low period (9 bits) measured (H'00 data)
D7
Stop
bit
High period
(1 or more bits)
Figure 19.9 RxD0 Input Signal when Using Automatic SCI Bit Rate Adjustment
When boot mode is initiated, the H8S/2128 Series MCU measures the low period of the
asynchronous SCI communication data (H'00) transmitted continuously from the host. The SCI
transmit/receive format should be set as follows: 8-bit data, 1 stop bit, no parity. The MCU
calculates the bit rate of the transmission from the host from the measured low period, and
transmits one H'00 byte to the host to indicate the end of bit rate adjustment. The host should
confirm that this adjustment end indication (H'00) has been received normally, and transmit one
H'55 byte to the MCU. If reception cannot be performed normally, initiate boot mode again
(reset), and repeat the above operations. Depending on the host’s transmission bit rate and the
MCU’s system clock frequency, there will be a discrepancy between the bit rates of the host and
the MCU. To ensure correct SCI operation, the host’s transfer bit rate should be set to (2400,
4800, or 9600) bps.
Table 19.7 shows typical host transfer bit rates and system clock frequencies for which automatic
adjustment of the MCU’s bit rate is possible. The boot program should be executed within this
system clock range.
Table 19.7 System Clock Frequencies for which Automatic Adjustment of H8S/2128 Series
Bit Rate is Possible
Host Bit Rate
System Clock Frequency for which Automatic Adjustment
of H8S/2128 Series Bit Rate is Possible
9600 bps
8 MHz to 20 MHz
4800 bps
4 MHz to 20 MHz
2400 bps
2 MHz to 18 MHz
On-Chip RAM Area Divisions in Boot Mode: In boot mode, the 128-byte area from H'(FF)FF00
to H'(FF)FF7F is reserved for use by the boot program, as shown in figure 19.10. The area to
which the programming control program is transferred is the 3968-byte area from H'(FF)E080 to
H'(FF)EFFF. The boot program area can be used when the programming control program
transferred into RAM enters the execution state. A stack area should be set up as required.
516
H'(FF)E080
Programming
control program
area
(3,968 bytes)
H'(FF)EFFF
H'(FF)FF00
H'(FF)FF7F
Boot program
area*
(128 bytes)
Note: * The boot program area cannot be used until a transition is made to the execution state
for the programming control program transferred to RAM. Note that the boot program
remains stored in this area after a branch is made to the programming control program.
Figure 19.10 RAM Areas in Boot Mode
Notes on Use of Boot Mode:
• When the chip comes out of reset in boot mode, it measures the low period of the input at the
SCI’s RxD0 pin. The reset should end with RxD0 high. After the reset ends, it takes about 100
states for the chip to get ready to measure the low period of the RxD0 input.
• In boot mode, if any data has been programmed into the flash memory (if all data is not 1), all
flash memory blocks are erased. Boot mode is for use when user program mode is unavailable,
such as the first time on-board programming is performed, or if the program activated in user
program mode is accidentally erased.
• Interrupts cannot be used while the flash memory is being programmed or erased.
• The RxD0 and TxD0 lines should be pulled up on the board.
• Before branching to the programming control program (RAM area address H'(FF)E080), the
chip terminates transmit and receive operations by the on-chip SCI (channel 0) (by clearing the
RE and TE bits in SCR to 0), but the adjusted bit rate remains set in BRR. The transmit data
output pin, TxD0, goes to the high-level output state (P50DDR = 1, P50DR = 1).
517
The contents of the CPU’s internal general registers are undefined at this time, so these
registers must be initialized immediately after branching to the programming control program.
In particular, since the stack pointer (SP) is used implicitly in subroutine calls, etc., a stack area
must be specified for use by the programming control program.
The initial values of other on-chip registers are not changed.
• Boot mode can be entered by making the pin settings shown in table 19.6 and executing a
reset-start.
When the chip detects the boot mode setting at reset release*1, P42, P41, and P40 can be used
as I/O ports.
Boot mode can be cleared by driving the reset pin low, waiting at least 20 states, then setting
the mode pin and executing reset release*1. Boot mode can also be cleared by a WDT overflow
reset.
The mode pin input levels must not be changed in boot mode.
• If the mode pin input levels are changed (for example, from low to high) during a reset, the
state of ports with multiplexed address functions and bus control output pins (AS, RD, WR)
will change according to the change in the microcomputer’s operating mode*2.
Therefore, care must be taken to make pin settings to prevent these pins from becoming output
signal pins during a reset, or to prevent collision with signals outside the microcomputer.
Notes: 1. Mode pin input must satisfy the mode programming setup time (tMDS = 4 states) with
respect to the reset release timing.
2. Ports with multiplexed address functions will output a low level as the address signal if
a state in which the mode pin setting is for mode 1 is entered during a reset. In other
modes, the port pins go to the high-impedance state. The bus control output signals will
output a high level if a state in which the mode pin setting is for mode 1 is entered
during a reset. In other modes, the port pins go to the high-impedance state.
19.6.2
User Program Mode
When set to user program mode, the chip can program and erase its flash memory by executing a
user program/erase control program. Therefore, on-board reprogramming of the on-chip flash
memory can be carried out by providing on-board supply of programming data, and storing a
program/erase control program in part of the program area as necessary.
To select user program mode, select a mode that enables the on-chip flash memory (mode 2 or 3).
In this mode, on-chip supporting modules other than flash memory operate as they normally
would in mode 2 and 3.
The flash memory itself cannot be read while the SWE bit is set to 1 to perform programming or
erasing, so the control program that performs programming and erasing should be run in on-chip
RAM or external memory.
518
Figure 19.11 shows the procedure for executing the program/erase control program when
transferred to on-chip RAM.
Write the transfer program (and the
program/erase control program
if necessary) beforehand
MD1, MD0 = 10, 11
Reset-start
Transfer program/erase control
program to RAM
Branch to program/erase control
program in RAM area
Execute program/erase control
program (flash memory rewriting)
Branch to flash memory application
program
Note: The watchdog timer should be activated to prevent overprogramming or overerasing due
to program runaway, etc.
Figure 19.11 User Program Mode Execution Procedure
519
19.7
Programming/Erasing Flash Memory
In the on-board programming modes, flash memory programming and erasing is performed by
software, using the CPU. There are four flash memory operating modes: program mode, erase
mode, program-verify mode, and erase-verify mode. Transitions to these modes can be made by
setting the PSU and ESU bits in FLMCR2, and the P, E, PV, and EV bits in FLMCR1.
The flash memory cannot be read while being programmed or erased. Therefore, the program that
controls flash memory programming/erasing (the programming control program) should be
located and executed in on-chip RAM or external memory.
Notes: 1. Operation is not guaranteed if setting/resetting of the SWE, EV, PV, E, and P bits in
FLMCR1, and the ESU and PSU bits in FLMCR2, is executed by a program in flash
memory.
2. Perform programming in the erased state. Do not perform additional programming on
previously programmed addresses.
19.7.1
Program Mode
Follow the procedure shown in the program/program-verify flowchart in figure 19.12 to write data
or programs to flash memory. Performing program operations according to this flowchart will
enable data or programs to be written to flash memory without subjecting the device to voltage
stress or sacrificing program data reliability. Programming should be carried out 32 bytes at a
time.
The wait times (x, y, z, α, β, γ, ε, η) after setting/clearing individual bits in flash memory control
registers 1 and 2 (FLMCR1, FLMCR2) and the maximum number of writes (N) are shown in table
22.12 in section 22.5, Flash Memory Characteristics.
Following the elapse of (x) µs or more after the SWE bit is set to 1 in flash memory control
register 1 (FLMCR1), 32-byte program data is stored in the program data area and reprogram data
area, and the 32-byte data in the reprogram data area written consecutively to the write addresses.
The lower 8 bits of the first address written to must be H'00, H'20, H'40, H'60, H'80, H'A0, H'C0,
or H'E0. Thirty-two consecutive byte data transfers are performed. The program address and
program data are latched in the flash memory. A 32-byte data transfer must be performed even if
writing fewer than 32 bytes; in this case, H'FF data must be written to the extra addresses.
Next, the watchdog timer is set to prevent overprogramming in the event of program runaway, etc.
Set a value greater than (y + z + α + β) µs as the WDT overflow period. After this, preparation for
program mode (program setup) is carried out by setting the PSU bit in FLMCR2, and after the
elapse of (y) µs or more, the operating mode is switched to program mode by setting the P bit in
FLMCR1. The time during which the P bit is set is the flash memory programming time. Make a
program setting so that the time for one programming operation is within the range of (z) µs.
520
19.7.2
Program-Verify Mode
In program-verify mode, the data written in program mode is read to check whether it has been
correctly written in the flash memory.
After the elapse of a given programming time, the programming mode is exited (the P bit in
FLMCR1 is cleared, then the PSU bit in FLMCR2 is cleared at least (α) µs later). The watchdog
timer is cleared after the elapse of (β) µs or more, and the operating mode is switched to programverify mode by setting the PV bit in FLMCR1. Before reading in program-verify mode, a dummy
write of H'FF data should be made to the addresses to be read. The dummy write should be
executed after the elapse of (γ) µs or more. When the flash memory is read in this state (verify data
is read in 16-bit units), the data at the latched address is read. Wait at least (ε) µs after the dummy
write before performing this read operation. Next, the originally written data is compared with the
verify data, and reprogram data is computed (see figure 19.12) and transferred to the reprogram
data area. After 32 bytes of data have been verified, exit program-verify mode, wait for at least
(η) µs, then clear the SWE bit in FLMCR1. If reprogramming is necessary, set program mode
again, and repeat the program/program-verify sequence as before. However, ensure that the
program/program-verify sequence is not repeated more than (N) times on the same bits.
521
Start
Perform programming in the erased state.
Do not perform additional programming
on previously programmed addresses.
Set SWE bit in FLMCR1
Wait (x) µs
*5
Store 32-byte program data in program
data area and reprogram data area
*4
n=1
m=0
Write 32-byte data in RAM reprogram data
area consecutively to flash memory
*1
n←n+1
Enable WDT
Set PSU bit in FLMCR2
Wait (y) µs
Set P bit in FLMCR1
Wait (z) µs
Clear P bit in FLMCR1
Wait (α) µs
*5
Start of programming
*5
End of programming
*5
Clear PSU bit in FLMCR2
Wait (β) µs
*5
Disable WDT
Set PV bit in FLMCR1
Wait (γ) µs
*5
Notes: 1. Data transfer is performed by byte transfer. The lower
8 bits of the first address written to must be H'00, H'20, H'40,
H'60, H'80, H'A0, H'C0, or H'E0. A 32-byte data transfer
must be performed even if writing fewer than 32 bytes;
in this case, H'FF data must be written to the extra addresses.
2. Verify data is read in 16-bit (word) units.
3. If a bit for which programming has been completed in the 32-byte
programming loop fails the following verify phase, additional
programming is performed for that bit.
4. An area for storing program data (32 bytes) and reprogram data
(32 bytes) must be provided in RAM. The contents of the latter
are rewritten as programming progresses.
5. See section 22.5, Flash Memory Characteristics, for the values
of x, y, z, α, β, γ, ε, η, and N.
H'FF dummy write to verify address
Wait (ε) µs
*5
Read verify data
*2
Program data =
verify data?
NG
Increment address
OK
Reprogram data computation
Transfer reprogram data to reprogram
data area
NG
m=1
Program
Data
0
Verify
Data
0
Reprogram
Data
1
0
1
0
Programming incomplete;
reprogram
1
0
1
—
1
1
1
Still in erased state;
no action
Comments
Reprogramming is not
performed if program data
and verify data match
*3
RAM
*4
Program data storage
area (32 bytes)
End of 32-byte
data verification?
OK
Clear PV bit in FLMCR1
Wait (η) µs
m = 0?
OK
Reprogram data storage
area (32 bytes)
*5
NG
n ≥ N?
*5
NG
OK
Clear SWE bit in FLMCR1
Clear SWE bit in FLMCR1
End of programming
Programming failure
Figure 19.12 Program/Program-Verify Flowchart
522
19.7.3
Erase Mode
Flash memory erasing should be performed block by block following the procedure shown in the
erase/erase-verify flowchart (single-block erase) shown in figure 19.13.
The wait times (x, y, z, α, β, γ, ε, η) after setting/clearing individual bits in flash memory control
registers 1 and 2 (FLMCR1, FLMCR2) and the maximum number of erases (N) are shown in table
22.12 in section 22.5, Flash Memory Characteristics.
To perform data or program erasure, make a 1 bit setting for the flash memory area to be erased in
erase block register 1 or 2 (EBR1 or EBR2) at least (x) µs after setting the SWE bit to 1 in flash
memory control register 1 (FLMCR1). Next, the watchdog timer is set to prevent overerasing in
the event of program runaway, etc. Set a value greater than (y + z + α + β) ms as the WDT
overflow period. After this, preparation for erase mode (erase setup) is carried out by setting the
ESU bit in FLMCR2, and after the elapse of (y) µs or more, the operating mode is switched to
erase mode by setting the E bit in FLMCR1. The time during which the E bit is set is the flash
memory erase time. Ensure that the erase time does not exceed (z) ms.
Note: With flash memory erasing, preprogramming (setting all data in the memory to be erased
to 0) is not necessary before starting the erase procedure.
19.7.4
Erase-Verify Mode
In erase-verify mode, data is read after memory has been erased to check whether it has been
correctly erased.
After the elapse of the erase time, erase mode is exited (the E bit in FLMCR1 is cleared, then the
ESU bit in FLMCR2 is cleared at least (α) µs later), the watchdog timer is cleared after the elapse
of (β) µs or more, and the operating mode is switched to erase-verify mode by setting the EV bit
in FLMCR1. Before reading in erase-verify mode, a dummy write of H'FF data should be made to
the addresses to be read. The dummy write should be executed after the elapse of (γ) µs or more.
When the flash memory is read in this state (verify data is read in 16-bit units), the data at the
latched address is read. Wait at least (ε) µs after the dummy write before performing this read
operation. If the read data has been erased (all 1), a dummy write is performed to the next address,
and erase-verify is performed. If the read data has not been erased, set erase mode again, and
repeat the erase/erase-verify sequence in the same way. However, ensure that the erase/eraseverify sequence is not repeated more than N times. When verification is completed, exit eraseverify mode, and wait for at least (η) µs. If erasure has been completed on all the erase blocks,
clear the SWE bit in FLMCR1. If there are any unerased blocks, make a 1 bit setting in EBR1 or
EBR2 for the flash memory area to be erased, and repeat the erase/erase-verify sequence in the
same way.
523
Start
*1
Set SWE bit in FLMCR1
Wait (x) µs
*2
n=1
Set EBR1, EBR2
*4
Enable WDT
Set ESU bit in FLMCR2
Wait (y) µs
*2
Start of erase
Set E bit in FLMCR1
Wait (z) ms
*2
Clear E bit in FLMCR1
n←n+1
Halt erase
Wait (α) µs
*2
Clear ESU bit in FLMCR2
Wait (β) µs
*2
Disable WDT
Set EV bit in FLMCR1
Wait (γ) µs
*2
Set block start address to verify address
H'FF dummy write to verify address
Increment
address
Wait (ε) µs
*2
Read verify data
*3
Verify data = all 1?
NG
OK
NG
Last address of block?
OK
Clear EV bit in FLMCR1
Clear EV bit in FLMCR1
Wait (η) µs
Wait (η) µs
*2
*2
NG
Notes: 1.
2.
3.
4.
5.
*5
End of
erasing of all erase
blocks?
OK
*2
n ≥ N?
Clear SWE bit in FLMCR1
OK
Clear SWE bit in FLMCR1
End of erasing
Erase failure
NG
Preprogramming (setting erase block data to all 0) is not necessary.
See section 22.5, Flash Memory Characteristics, for the values of x, y, z, α, β, γ, ε, η, and N.
Verify data is read in 16-bit (W) units.
Set only one bit in EBR1or EBR2. More than one bit cannot be set.
Erasing is performed in block units. To erase a number of blocks, the individual blocks must be erased sequentially.
Figure 19.13 Erase/Erase-Verify Flowchart (Single-Block Erase)
524
19.8
Flash Memory Protection
There are three kinds of flash memory program/erase protection: hardware protection, software
protection, and error protection.
19.8.1
Hardware Protection
Hardware protection refers to a state in which programming/erasing of flash memory is forcibly
disabled or aborted. Hardware protection is reset by settings in flash memory control registers 1
and 2 (FLMCR1, FLMCR2) and erase block registers 1 and 2 (EBR1, EBR2). (See table 19.8.)
Table 19.8 Hardware Protection
Functions
Item
Description
Program
Erase
Reset/standby
protection
•
In a reset (including a WDT overflow reset)
and in hardware standby mode, software
standby mode, subactive mode, subsleep
mode, and watch mode, FLMCR1, FLMCR2,
EBR1, and EBR2 are initialized, and the
program/erase-protected state is entered.
Yes
Yes
•
In a reset via the RES pin, the reset state is
not entered unless the RES pin is held low
until oscillation stabilizes after powering on.
In the case of a reset during operation, hold
the RES pin low for the RES pulse width
specified in the AC Characteristics section.
19.8.2
Software Protection
Software protection can be implemented by setting the SWE bit in FLMCR1 and erase block
registers 1 and 2 (EBR1, EBR2). When software protection is in effect, setting the P or E bit in
flash memory control register 1 (FLMCR1) does not cause a transition to program mode or erase
mode. (See table 19.9.)
525
Table 19.9 Software Protection
Functions
Item
Description
Program
Erase
SWE bit protection
•
Yes
Yes
—
Yes
Clearing the SWE bit to 0 in FLMCR1 sets
the program/erase-protected state for all
blocks.
(Execute in on-chip RAM or external
memory.)
Block specification
protection
19.8.3
•
Erase protection can be set for individual
blocks by settings in erase block registers
1 and 2 (EBR1, EBR2).
•
Setting EBR1 and EBR2 to H'00 places all
blocks in the erase-protected state.
Error Protection
In error protection, an error is detected when MCU runaway occurs during flash memory
programming/erasing, or operation is not performed in accordance with the program/erase
algorithm, and the program/erase operation is aborted. Aborting the program/erase operation
prevents damage to the flash memory due to overprogramming or overerasing.
If the MCU malfunctions during flash memory programming/erasing, the FLER bit is set to 1 in
FLMCR2 and the error protection state is entered. The FLMCR1, FLMCR2, EBR1, and EBR2
settings are retained, but program mode or erase mode is aborted at the point at which the error
occurred. Program mode or erase mode cannot be re-entered by re-setting the P or E bit. However,
PV and EV bit setting is enabled, and a transition can be made to verify mode.
FLER bit setting conditions are as follows:
• When flash memory is read during programming/erasing (including a vector read or instruction
fetch)
• Immediately after exception handling (excluding a reset) during programming/erasing
• When a SLEEP instruction (transition to software standby, sleep, subactive, subsleep, or watch
mode) is executed during programming/erasing
• When the bus is released during programming/erasing
Error protection is released only by a reset and in hardware standby mode.
Figure 19.14 shows the flash memory state transition diagram.
526
Normal operation mode
Program mode
Erase mode
RD VF PR ER FLER = 0
Reset or standby
(hardware protection)
RES = 0 or STBY = 0
RD VF PR ER FLER = 0
Error occurrence
(software standby)*2
RES = 0 or
STBY = 0
Error
occurrence*1
RES = 0 or
STBY = 0
Error protection mode
RD VF*4 PR ER FLER = 1
Software
standby mode
Software standby
mode release
FLMCR1, FLMCR2,
EBR1, EBR2
initialization state
Error protection mode
(software standby)
RD VF PR ER FLER = 1
FLMCR1, FLMCR2 (except FLER
bit), EBR1, EBR2 initialization state*3
Legend:
RD: Memory read possible
VF: Verify-read possible
PR: Programming possible
ER: Erasing possible
RD:
VF:
PR:
ER:
Memory read not possible
Verify-read not possible
Programming not possible
Erasing not possible
Notes: 1. When an error occurs other than due to a SLEEP instruction, or when a SLEEP
instruction is executed for a transition to subactive mode
2. When an error occurs due to a SLEEP instruction (except subactive mode)
3. Except sleep mode
4. VF in subactive mode
Figure 19.14 Flash Memory State Transitions
19.9
Interrupt Handling when Programming/Erasing Flash Memory
All interrupts, including NMI, should be disabled when flash memory is being programmed or
erased (when the P or E bit is set in FLMCR1), and while the boot program is executing in boot
mode*1, to give priority to the program or erase operation. There are three reasons for this:
1. An interrupt during programming or erasing might cause a violation of the programming or
erasing algorithm, with the result that normal operation could not be assured.
2. In the interrupt exception handling sequence during programming or erasing, the vector would
not be read correctly*2, possibly resulting in MCU runaway.
3. If an interrupt occurred during boot program execution, it would not be possible to execute the
normal boot mode sequence.
527
For these reasons, in on-board programming mode alone there are conditions for disabling
interrupts, as an exception to the general rule. However, this provision does not guarantee normal
erasing and programming or MCU operation. All interrupt requests, including NMI, must
therefore be disabled inside and outside the MCU when programming or erasing flash memory.
Interrupts are also disabled in the error-protection state while the P or E bit remains set in
FLMCR1.
Notes: 1. Interrupt requests must be disabled inside and outside the MCU until the programming
control program has completed initial programming.
2. The vector may not be read correctly in this case for the following two reasons:
• If flash memory is read while being programmed or erased (while the P or E bit is
set in FLMCR1), correct read data will not be obtained (undetermined values will
be returned).
• If the interrupt entry in the vector table has not been programmed yet, interrupt
exception handling will not be executed correctly.
19.10
Flash Memory Programmer Mode
19.10.1
Programmer Mode Setting
Programs and data can be written and erased in programmer mode as well as in the on-board
programming modes. In programmer mode, the on-chip ROM can be freely programmed using a
PROM programmer that supports Hitachi microcomputer device types with 128-kbyte on-chip
flash memory. Flash memory read mode, auto-program mode, auto-erase mode, and status read
mode are supported. In auto-program mode, auto-erase mode, and status read mode, a status
polling procedure is used, and in status read mode, detailed internal signals are output after
execution of an auto-program or auto-erase operation.
Table 19.10 shows writer mode pin settings.
Table 19.10 Programmer Mode Pin Settings
Pin Names
Setting/External Circuit Connection
Mode pins: MD1, MD0
Low-level input to MD1, MD0
STBY pin
High-level input (Hardware standby mode not set)
RES pin
Power-on reset circuit
XTAL and EXTAL pins
Oscillation circuit
Other setting pins: P47, P42, P41,
P40, P67
Low-level input to p42, p67, high-level input to P47, P41, P40
528
19.10.2
Socket Adapters and Memory Map
In programmer mode, a socket adapter is mounted on the PROM programmer to match the
package concerned. Ensure that the socket adapter is obtained from a writer manufacturer
supporting the Hitachi microcomputer device type with 128-kbyte on-chip flash memory.
Figure 19.15 shows the memory map in programmer mode. For pin names in programmer mode,
see section 1.3.2, Pin Functions in Each Operating Mode.
MCU mode
H8S/2128
H'000000
Programmer mode
H'00000
On-chip
ROM area
H'01FFFF
H'1FFFF
Figure 19.15 Memory Map in Programmer Mode
19.10.3
Programmer Mode Operation
Table 19.11 shows how the different operating modes are set when using programmer mode, and
table 19.12 lists the commands used in programmer mode. Details of each mode are given below.
• Memory Read Mode
Memory read mode supports byte reads.
• Auto-Program Mode
Auto-program mode supports programming of 128 bytes at a time. Status polling is used to
confirm the end of auto-programming.
• Auto-Erase Mode
Auto-erase mode supports automatic erasing of the entire flash memory. Status polling is used
to confirm the end of auto-erasing.
• Status Read Mode
Status polling is used for auto-programming and auto-erasing, and normal termination can be
confirmed by reading the FO6 signal. In status read mode, error information is output if an
error occurs.
529
Table 19.11 Settings for Each Operating Mode in Programmer Mode
Pin Names
Mode
CE
OE
WE
FO0 to FO7
FA0 to FA17
Read
L
L
H
Data output
Ain
Output disable
L
H
H
Hi-z
X
Command write
L
H
L
Data input
Ain* 2
Chip disable* 1
H
X
X
Hi-z
X
Legend:
H:
High level
L:
Low level
Hi-z: High impedance
X:
Don’t care
Notes: 1. Chip disable is not a standby state; internally, it is an operation state.
2. Ain indicates that there is also address input in auto-program mode.
Table 19.12 Programmer Mode Commands
1st Cycle
2nd Cycle
Command Name
Number
of Cycles
Mode
Address Data
Mode
Address Data
Memory read mode
1+n
Write
X
H'00
Read
RA
Dout
Auto-program mode
129
Write
X
H'40
Write
WA
Din
Auto-erase mode
2
Write
X
H'20
Write
X
H'20
Status read mode
2
Write
X
H'71
Write
X
H'71
Legend:
RA: Read address
PA: Program address
Notes: 1. In auto-program mode, 129 cycles are required for command writing by a simultaneous
128-byte write.
2. In memory read mode, the number of cycles depends on the number of address write
cycles (n).
530
19.10.4
Memory Read Mode
• After the end of an auto-program, auto-erase, or status read operation, the command wait state
is entered. To read memory contents, a transition must be made to memory read mode by
means of a command write before the read is executed.
• Command writes can be performed in memory read mode, just as in the command wait state.
• Once memory read mode has been entered, consecutive reads can be performed.
• After power-on, memory read mode is entered.
Table 19.13 AC Characteristics in Memory Read Mode
(Conditions: VCC = 5.0 V ±10%, VSS = 0 V, Ta = 25°C ±5°C)
Item
Symbol
Min
Max
Command write cycle
t nxtc
20
µs
CE hold time
t ceh
0
ns
CE setup time
t ces
0
ns
Data hold time
t dh
50
ns
Data setup time
t ds
50
ns
Write pulse width
t wep
70
ns
WE rise time
tr
30
ns
WE fall time
tf
30
ns
FA17 to FA0
Address stable
CE
WE
FO7 to FO0
Notes
Memory read mode
Command write
OE
Unit
twep
tceh
tnxtc
tces
tf
tr
Data
Data
tdh
tds
Note: Data is latched on the rising edge of WE.
Figure 19.16 Memory Read Mode Timing Waveforms after Command Write
531
Table 19.14 AC Characteristics when Entering Another Mode from Memory Read Mode
(Conditions: VCC = 5.0 V ±10%, VSS = 0 V, Ta = 25°C ±5°C)
Item
Symbol
Min
Max
Command write cycle
t nxtc
20
µs
CE hold time
t ceh
0
ns
CE setup time
t ces
0
ns
Data hold time
t dh
50
ns
Data setup time
t ds
50
ns
Write pulse width
t wep
70
ns
WE rise time
tr
30
ns
WE fall time
tf
30
ns
Memory read mode
FA17 to FA0
Unit
Notes
Other mode command write
Address stable
twep
CE
tnxtc
OE
tces
WE
FO7 to FO0
tceh
tf
Data
tr
H'XX
tdh
Note: Do not enable WE and OE at the same time.
tds
Figure 19.17 Timing Waveforms when Entering Another Mode from Memory Read Mode
532
Table 19.15 AC Characteristics in Memory Read Mode
(Conditions: VCC = 5.0 V ±10%, VSS = 0 V, Ta = 25°C ±5°C)
Item
Symbol
Access time
Max
Unit
t acc
20
µs
CE output delay time
t ce
150
ns
OE output delay time
t oe
150
ns
Output disable delay time
t df
100
ns
Data output hold time
t oh
FA17 to FA0
Min
5
Notes
ns
Address stable
Address stable
VIL
CE
OE
VIL
tacc
WE
VIH
tacc
toh
toh
Data
FO7 to FO0
Data
Figure 19.18 Timing Waveforms for CE/OE Enable State Read
FA17 to FA0
Address stable
Address stable
tacc
CE
tce
tce
OE
toe
toe
WE
FO7 to FO0
tdf
tdf
tacc
VIH
Data
Data
toh
toh
Figure 19.19 Timing Waveforms for CE/OE Clocked Read
533
19.10.5
Auto-Program Mode
AC Characteristics
Table 19.16 AC Characteristics in Auto-Program Mode
(Conditions: VCC = 5.0 V ±10%, VSS = 0 V, Ta = 25°C ±5°C)
Item
Symbol
Min
Max
Command write cycle
t nxtc
20
µs
CE hold time
t ceh
0
ns
CE setup time
t ces
0
ns
Data hold time
t dh
50
ns
Data setup time
t ds
50
ns
Write pulse width
t wep
70
ns
Status polling start time
t wsts
1
ms
Status polling access time
t spa
Address setup time
t as
0
ns
Address hold time
t ah
60
ns
Memory write time
t write
1
WE rise time
WE fall time
150
Unit
Notes
ns
3000
ms
tr
30
ns
tf
30
ns
Address
stable
FA17 to FA0
tceh
tas
tah
CE
tnxtc
OE
tnxtc
twep
WE
FO7
Data transfer
1 byte to 128 bytes
tces
twsts
tspa
twrite (1 to 3000 ms)
Programming operation
end identification signal
tr
tf
tds
tdh
Programming normal
end identification signal
FO6
Programming wait
FO7 to FO0
H'40
Data
Data
Figure 19.20 Auto-Program Mode Timing Waveforms
534
FO0 to 5 = 0
Notes on Use of Auto-Program Mode
• In auto-program mode, 128 bytes are programmed simultaneously. This should be carried out
by executing 128 consecutive byte transfers.
• A 128-byte data transfer is necessary even when programming fewer than 128 bytes. In this
case, H'FF data must be written to the extra addresses.
• The lower 8 bits of the transfer address must be H'00 or H'80. If a value other than an effective
address is input, processing will switch to a memory write operation but a write error will be
flagged.
• Memory address transfer is performed in the second cycle (figure 19.20). Do not perform
transfer after the second cycle.
• Do not perform a command write during a programming operation.
• Perform one auto-programming operation for a 128-byte block for each address.
Characteristics are not guaranteed for two or more programming operations.
• Confirm normal end of auto-programming by checking FO6. Alternatively, status read mode
can also be used for this purpose (FO7 status polling uses the auto-program operation end
identification pin).
• The status polling FO6 and FO7 pin information is retained until the next command write.
Until the next command write is performed, reading is possible by enabling CE and OE.
19.10.6
Auto-Erase Mode
AC Characteristics
Table 19.17 AC Characteristics in Auto-Erase Mode
(Conditions: VCC = 5.0 V ±10%, VSS = 0 V, Ta = 25°C ±5°C)
Item
Symbol
Min
Max
Unit
Command write cycle
t nxtc
20
µs
CE hold time
t ceh
0
ns
CE setup time
t ces
0
ns
Data hold time
t dh
50
ns
Data setup time
t ds
50
ns
Write pulse width
t wep
70
ns
Status polling start time
t ests
1
ms
Status polling access time
t spa
Memory erase time
t erase
WE rise time
WE fall time
150
ns
40000
ms
tr
30
ns
tf
30
ns
100
Notes
535
FA17 to FA0
tceh
tces
CE
OE
WE
tnxtc
twep
tf
tests
tr
terase (100 to 40000 ms)
tds
FO7
tnxtc
Erase end identification
signal
tdh
Erase normal end
confirmation signal
FO6
FO7 to FO0
tspa
CLin
DLin
H'20
H'20
FO0 to FO5 = 0
Figure 19.21 Auto-Erase Mode Timing Waveforms
Notes on Use of Auto-Erase-Program Mode
• Auto-erase mode supports only entire memory erasing.
• Do not perform a command write during auto-erasing.
• Confirm normal end of auto-erasing by checking FO6. Alternatively, status read mode can also
be used for this purpose (FO7 status polling uses the auto-erase operation end identification
pin).
• The status polling FO6 and FO7 pin information is retained until the next command write.
Until the next command write is performed, reading is possible by enabling CE and OE.
19.10.7
Status Read Mode
• Status read mode is used to identify what type of abnormal end has occurred. Use this mode
when an abnormal end occurs in auto-program mode or auto-erase mode.
• The return code is retained until a command write for other than status read mode is
performed.
536
Table 19.18 AC Characteristics in Status Read Mode
(Conditions: VCC = 5.0 V ±10%, VSS = 0 V, Ta = 25°C ±5°C)
Item
Symbol
Min
Max
Unit
Command write cycle
t nxtc
20
µs
CE hold time
t ceh
0
ns
CE setup time
t ces
0
ns
Data hold time
t dh
50
ns
Data setup time
t ds
50
ns
Write pulse width
t wep
70
ns
OE output delay time
t oe
150
ns
Disable delay time
t df
100
ns
CE output delay time
t ce
150
ns
WE rise time
tr
30
ns
WE fall time
tf
30
ns
Notes
FA17 to FA0
CE
tnxtc
tce
OE
tnxtc
twep
WE
tceh
tces
tf
tr
tceh
tces
tf
toe
tdf
tr
tds
tds
FO7 to FO0
tnxtc
twep
tdh
tdh
H'71
H'71
Data
Note: FO2 and FO3 are undefined.
Figure 19.22 Status Read Mode Timing Waveforms
537
Table 19.19 Status Read Mode Return Commands
Pin Name FO7
Attribute
FO6
Normal
Command
end
error
identification
Initial value 0
0
Indications Normal
end: 0
Command
error: 1
Abnormal
end: 1
FO5
FO4
FO3
FO2
FO1
Programming error
Erase
error
—
—
ProgramEffective
ming or
address error
erase count
exceeded
0
0
0
0
0
—
Count
Effective
exceeded: 1 address
Otherwise: 0 error: 1
ProgramErase
—
ming
error: 1
Otherwise: 0 error: 1
Otherwise: 0
Otherwise: 0
FO0
0
Otherwise: 0
Note: FO2 and FO3 are undefined.
19.10.8
Status Polling
• The FO7 status polling flag indicates the operating status in auto-program or auto-erase mode.
• The FO6 status polling flag indicates a normal or abnormal end in auto-program or auto-erase
mode.
Table 19.20 Status Polling Output Truth Table
Pin Names
Internal Operation
in Progress
Abnormal End
—
Normal End
FO7
0
1
0
1
FO6
0
0
1
1
FO0 to FO5
0
0
0
0
19.10.9
Programmer Mode Transition Time
Commands cannot be accepted during the oscillation stabilization period or the programmer mode
setup period. After the programmer mode setup time, a transition is made to memory read mode.
Table 19.21 Command Wait State Transition Time Specifications
Item
Symbol
Min
Max
Unit
Standby release (oscillation
stabilization time)
t osc1
20
—
ms
PROM mode setup time
t bmv
10
—
ms
VCC hold time
t dwn
0
—
ms
538
Notes
VCC
tosc1
tbmv
tdwn
Memory read Auto-program mode
Auto-erase mode
mode
Command wait
state
RES
Command
Don't care
wait state
Normal/
abnormal end
identification
Command accepted
Figure 19.23 Oscillation Stabilization Time and Programmer Mode Setup and
Power Supply Fall Sequence
19.10.10
Notes On Memory Programming
• When programming addresses which have previously been programmed, carry out autoerasing before auto-programming.
• When performing programming using programmer mode on a chip that has been
programmed/erased in an on-board programming mode, auto-erasing is recommended before
carrying out auto-programming.
Notes: 1. The flash memory is initially in the erased state when the device is shipped by Hitachi.
For other chips for which the erasure history is unknown, it is recommended that autoerasing be executed to check and supplement the initialization (erase) level.
2. Auto-programming should be performed once only on the same address block.
19.11
Flash Memory Programming and Erasing Precautions
Precautions concerning the use of on-board programming mode and writer mode are summarized
below.
Use the specified voltages and timing for programming and erasing: Applied voltages in
excess of the rating can permanently damage the device. For a PROM programmer, use Hitachi
microcomputer device Types with 128-kbyte on-chip flash memory that support a 5.0 V
Programmer voltage.
Do not select the HN28F101 setting for the PROM programmer, and only use the specified socket
adapter. Incorrect use will result in damaging the device.
Powering on and off: When applying or disconnecting VCC, fix the RES pin low and place the
flash memory in the hardware protection state.
The power-on and power-off timing requirements should also be satisfied in the event of a power
failure and subsequent recovery.
539
Use the recommended algorithm when programming and erasing flash memory: The
recommended algorithm enables programming and erasing to be carried out without subjecting the
device to voltage stress or sacrificing program data reliability. When setting the P or E bit in
FLMCR1, the watchdog timer should be set beforehand as a precaution against program runaway,
etc.
Do not set or clear the SWE bit during program execution in flash memory: Clear the SWE
bit before executing a generated or reading data in flash memory. When the SWE bit is set, data in
flash memory can be rewritten, but flash memory should only be accessed for verify operations
(verification during programming/erasing).
Do not use interrupts while flash memory is being programmed or erased: All interrupt
requests, including NMI, should be disabled when programming or erasing flash memory to give
priority to program/erase operations.
Do not perform additional programming. Erase the memory before reprogramming: In onboard programming, perform only one programming operation on a 32-byte programming unit
block. In programmer mode, too, perform only one programming operation on a 128-byte
programming unit block. Programming should be carried out with the entire programming unit
block erased.
Before programming, check that the chip is correctly mounted in the PROM programmer:
Overcurrent damage to the device can result if the index marks on the PROM programmer socket,
socket adapter, and chip are not correctly aligned.
Do not touch the socket adapter or chip during programming: Touching either of these can
cause contact faults and write errors.
19.12
Note on Switching from F-ZTAT Version to Mask ROM Version
The mask ROM version dose not have the internal registers for flash memory control that are
provided in the F-ZTAT version. Table 19.22 lists the registers that are present in the F-ZTAT
version but not in the mask ROM version. If a register listed in table 19.22 is read in the mask
ROM version, an undefined value will be returned. Therefore, if application software developed
on the F-ZTAT version is switched to a mask ROM version product, it must be modified to ensure
that the registers in table 19.22 have no effect.
540
Table 19.22
Registers Present in F-ZTAT Version but Absent in Mask ROM Version
Register
Abbreviation
Address
Flash memory control register 1
FLMCR1
H'FF80
Flash memory control register 2
FLMCR2
H'FF81
Erase block register 1
EBR1
H'FF82
Erase block register 2
EBR2
H'FF83
541
542
Section 20 Clock Pulse Generator
20.1
Overview
The H8S/2128 Series and H8S/2124 Series have a built-in clock pulse generator (CPG) that
generates the system clock (ø), the bus master clock, and internal clocks.
The clock pulse generator consists of an oscillator circuit, a duty adjustment circuit, clock
selection circuit, medium-speed clock divider, bus master clock selection circuit, subclock input
circuit, and waveform shaping circuit.
20.1.1
Block Diagram
Figure 20.1 shows a block diagram of the clock pulse generator.
EXTAL
Oscillator
XTAL
Duty
adjustment
circuit
Medium-speed
clock divider
Clock
selection
circuit
øSUB
EXCL
Subclock
input circuit
Waveform
shaping
circuit
ø/2 to ø/32
Bus master
clock
selection
circuit
ø
System clock
To ø pin
Internal clock
To supporting
modules
Bus master clock
To CPU, DTC
WDT1 count clock
Figure 20.1 Block Diagram of Clock Pulse Generator
20.1.2
Register Configuration
The clock pulse generator is controlled by the standby control register (SBYCR) and low-power
control register (LPWRCR). Table 20.1 shows the register configuration.
543
Table 20.1 CPG Registers
Name
Abbreviation
R/W
Initial Value
Address*
Standby control register
SBYCR
R/W
H'00
H'FF84
Low-power control register
LPWRCR
R/W
H'00
H'FF85
Note: * Lower 16 bits of the address.
20.2
Register Descriptions
20.2.1
Standby Control Register (SBYCR)
Bit
7
6
5
4
3
2
1
0
SSBY
STS2
STS1
STS0
—
SCK2
SCK1
SCK0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
—
R/W
R/W
R/W
SBYCR is an 8-bit readable/writable register that performs power-down mode control.
Only bits 0 to 2 are described here. For a description of the other bits, see section 21.2.1, Standby
Control Register (SBYCR).
SBYCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bits 2 to 0—System Clock Select 2 to 0 (SCK2 to SCK0): These bits select the bus master clock
for high-speed mode and medium-speed mode.
When operating the device after a transition to subactive mode or watch mode bits SCK2 to SCK0
should all be cleared to 0.
Bit 2
Bit 1
Bit 0
SCK2
SCK1
SCK0
Description
0
0
0
Bus master is in high-speed mode
1
Medium-speed clock is ø/2
0
Medium-speed clock is ø/4
1
Medium-speed clock is ø/8
0
Medium-speed clock is ø/16
1
Medium-speed clock is ø/32
—
—
1
1
0
1
544
(Initial value)
20.2.2
Low-Power Control Register (LPWRCR)
Bit
7
6
5
4
3
2
1
0
DTON
LSON
NESEL
EXCLE
—
—
—
—
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
—
—
—
—
LPWRCR is an 8-bit readable/writable register that performs power-down mode control.
Only bit 4 is described here. For a description of the other bits, see section 21.2.2, Low-Power
Control Register (LPWRCR).
LPWRCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bit 4—Subclock Input Enable (EXCLE): Controls subclock input from the EXCL pin.
Bit 4
EXCLE
Description
0
Subclock input from EXCL pin is disabled
1
Subclock input from EXCL pin is enabled
20.3
(Initial value)
Oscillator
Clock pulses can be supplied by connecting a crystal resonator, or by input of an external clock.
20.3.1
Connecting a Crystal Resonator
Circuit Configuration: A crystal resonator can be connected as shown in the example in figure
20.2. Select the damping resistance Rd according to table 20.2. An AT-cut parallel-resonance
crystal should be used.
CL1
EXTAL
XTAL
Rd
CL2
CL1 = CL2 = 10 to 22pF
Figure 20.2 Connection of Crystal Resonator (Example)
545
Table 20.2 Damping Resistance Value
Frequency (MHz)
2
4
8
10
12
16
20
Rd (Ω)
1k
500
200
0
0
0
0
Crystal resonator: Figure 20.3 shows the equivalent circuit of the crystal resonator. Use a crystal
resonator that has the characteristics shown in table 20.3 and the same frequency as the system
clock (ø).
CL
L
Rs
XTAL
EXTAL
AT-cut parallel-resonance type
C0
Figure 20.3 Crystal Resonator Equivalent Circuit
Table 20.3 Crystal Resonator Parameters
Frequency (MHz)
2
4
8
10
12
16
20
RS max (Ω)
500
120
80
70
60
50
40
C0 max (pF)
7
7
7
7
7
7
7
Note on Board Design: When a crystal resonator is connected, the following points should be
noted.
Other signal lines should be routed away from the oscillator circuit to prevent induction from
interfering with correct oscillation. See figure 20.4.
When designing the board, place the crystal resonator and its load capacitors as close as possible
to the XTAL and EXTAL pins.
546
Avoid
Signal A Signal B
H8S/2128 Series or
H8S/2124 Series
chip
XTAL
CL2
EXTAL
CL1
Figure 20.4 Example of Incorrect Board Design
20.3.2
External Clock Input
Circuit Configuration: An external clock signal can be input as shown in the examples in figure
20.5. If the XTAL pin is left open, make sure that stray capacitance is no more than 10 pF.
In example (b), make sure that the external clock is held high in standby mode, subactive mode,
subsleep mode, and wach mode.
EXTAL
XTAL
External clock input
Open
(a) XTAL pin left open
EXTAL
External clock input
XTAL
(b) Complementary clock input at XTAL pin
Figure 20.5 External Clock Input (Examples)
External Clock: The external clock signal should have the same frequency as the system clock
(ø).
547
Table 20.4 and figure 20.6 show the input conditions for the external clock.
Table 20.4 External Clock Input Conditions
VCC = 2.7 to 5.5 V
Item
Symbol Min
VCC = 5.0 V ±10%
Max
Min
Max
Unit
Test Conditions
Figure 20.6
External clock t EXL
input low pulse
width
40
—
20
—
ns
External clock t EXH
input high pulse
width
40
—
20
—
ns
External clock t EXr
rise time
—
10
—
5
ns
External clock t EXf
fall time
—
10
—
5
ns
Clock low
pulse width
0.4
0.6
0.4
0.6
t cyc
ø ≥ 5 MHz Figure 22.4
80
—
80
—
ns
ø < 5 MHz
0.4
0.6
0.4
0.6
t cyc
ø ≥ 5 MHz
80
—
80
—
ns
ø < 5 MHz
Clock high
pulse width
t CL
t CH
tEXH
tEXL
VCC × 0.5
EXTAL
tEXr
tEXf
Figure 20.6 External Clock Input Timing
Table 20.5 shows the external clock output settling delay time, and figure 20.7 shows the external
clock output settling delay timing. The oscillator and duty adjustment circuit have a function for
adjusting the waveform of the external clock input at the EXTAL pin. When the prescribed clock
signal is input at the EXTAL pin, internal clock signal output is fixed after the elapse of the
external clock output settling delay time (tDEXT). As the clock signal output is not fixed during the
tDEXT period, the reset signal should be driven low to maintain the reset state.
548
Table 20.5 External Clock Output Settling Delay Time
Conditions: VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0 V
Item
Symbol
Min
Max
Unit
Notes
External clock
output settling
delay time
t DEXT*
500
—
µs
Figure 20.7
Note: * t DEXT includes RES pulse width (t RESW).
VCC
STBY
VIH
EXTAL
ø
(internal or external)
RES
tDEXT*
Note: * tDEXT includes RES pulse width (tRESW).
Figure 20.7 External Clock Output Settling Delay Timing
549
20.4
Duty Adjustment Circuit
When the oscillator frequency is 5 MHz or higher, the duty adjustment circuit adjusts the duty
cycle of the clock signal from the oscillator to generate the system clock (ø).
20.5
Medium-Speed Clock Divider
The medium-speed clock divider divides the system clock to generate ø/2, ø/4, ø/8, ø/16, and ø/32
clocks.
20.6
Bus Master Clock Selection Circuit
The bus master clock selection circuit selects the system clock (ø) or one of the medium-speed
clocks (ø/2, ø/4, ø/8, ø/16, or ø/32) to be supplied to the bus master, according to the settings of
bits SCK2 to SCK0 in SBYCR.
20.7
Subclock Input Circuit
The subclock input circuit controls the subclock input from the EXCL pin.
Inputting the Subclock: When a subclock is used, a 32.768 kHz external clock should be input
from the EXCL pin. In this case, clear bit P46DDR to 0 in P4DDR and set bit EXCLE to 1 in
LPWRCR.
The subclock input conditions are shown in table 20.6 and figure 20.8.
Table 20.6 Subclock Input Conditions
VCC = 2.7 to 5.5 V
Item
Min
Typ
Max
Unit
Test Conditions
Subclock input low pulse t EXCLL
width
—
15.26
—
µs
Figure 20.8
Subclock input high pulse t EXCLH
width
—
15.26
—
µs
Subclock input rise time
t EXCLr
—
—
10
ns
Subclock input fall time
t EXCLf
—
—
10
ns
550
Symbol
tEXCLH
tEXCLL
VCC × 0.5
EXCL
tEXCLr
tEXCLf
Figure 20.8 Subclock Input Timing
When Subclock is not Needed: Do not enable subclock input when the subclock is not needed.
20.8
Subclock Waveform Shaping Circuit
To eliminate noise in the subclock input from the EXCL pin, this circuit samples the clock using a
clock obtained by dividing the ø clock. The sampling frequency is set with the NESEL bit in
LPWRCR. For details, see section 21.2.2, Low-Power Control Register (LPWRCR). The clock is
not sampled in subactive mode, subsleep mode, or watch mode.
20.9
Clock Selection Circuit
This circuit selects the system clock used inside the MCU.
When returning from high-speed mode, medium-speed mode, sleep mode, the reset state, or
standby mode, the XTAL/EXTAL pin clock generated by the oscillator is selected as the system
clock.
In subactive mode, subsleep mode, and watch mode, the subclock input from the EXCL pin is
selected as the system clock. In this case, modules and functions including the CPU, TMR0/1,
WDT0/1, ports, and interrupts operate on øSUB, and the count clocks for the timers are also
scaled from øSUB.
551
552
Section 21 Power-Down State
21.1
Overview
In addition to the normal program execution state, the H8S/2128 Series and H8S/2124 Series have
a power-down state in which operation of the CPU and oscillator is halted and power dissipation
is reduced. Low-power operation can be achieved by individually controlling the CPU, on-chip
supporting modules, and so on.
The H8S/2128 Series and H8S/2124 Series operating modes are as follows:
1.
2.
3.
4.
5.
6.
7.
8.
9.
High-speed mode
Medium-speed mode
Subactive mode
Sleep mode
Subsleep mode
Watch mode
Module stop mode
Software standby mode
Hardware standby mode
Of these, 2 to 9 are power-down modes. Sleep mode and subsleep mode are CPU modes, mediumspeed mode is a CPU and bus master mode, subactive mode is a CPU, bus master, and on-chip
supporting module mode, and module stop mode is an on-chip supporting module mode
(including bus masters other than the CPU). Certain combinations of these modes can be set.
After a reset, the MCU is in high-speed mode and module stop mode (excluding the DTC).
Table 21.1 shows the internal chip states in each mode, and table 21.2 shows the conditions for
transition to the various modes. Figure 21.1 shows a mode transition diagram.
553
Table 21.1 H8S/2128 Series and H8S/2124 Series Internal States in Each Mode
Function
HighSpeed
MediumSpeed
System clock
oscillator
Functioning
Function- Functioning
ing
Function- Halted
ing
Halted
Subclock input
Functioning
Function- Functioning
ing
Function- Functioning
ing
CPU
operation
Functioning
Mediumspeed
Function- Halted
ing
Instructions
Registers
External
interrupts
NMI
Sleep
Halted
Module
Stop
Watch
Software Hardware
Subactive Subsleep Standby Standby
Halted
Halted
Halted
Function- Functioning
ing
Halted
Halted
Subclock Halted
operation
Halted
Halted
Retained
Undefined
Retained
Retained
Retained
Functioning
Function- Functioning
ing
Function- Functioning
ing
Function- Functioning
ing
Function- Halted
ing
Functioning
Mediumspeed
Functioning
Function- Halted
ing/halted (retained)
(retained)
Halted
Halted
(retained) (retained)
Halted
Halted
(retained) (reset)
Functioning
Function- Functioning
ing
Function- Subclock
ing
operation
Subclock Subclock
operation operation
Halted
Halted
(retained) (reset)
IRQ0
IRQ1
IRQ2
On-chip
DTC
supporting
module
operation
WDT1
WDT0
TMR0, 1
Functioning/halted
(retained)
FRT
Halted
(retained)
TMRX, Y
Halted
Halted
(retained) (retained)
Timer
connection
IIC0
IIC1
SCI0
Function- Halted
ing/halted (reset)
(reset)
SCI1
Halted
(reset)
Halted
(reset)
Halted
(reset)
PWM
PWMX
A/D
RAM
Functioning
Function- Function- Function- Retained
ing
ing (DTC) ing
Function- Retained
ing
Retained
Retained
I/O
Functioning
Function- Functioning
ing
Function- Retained
ing
Retained
High
impedance
Function- Retained
ing
Note: “Halted (retained)” means that internal register values are retained. The internal state is
“operation suspended.”
“Halted (reset)” means that internal register values and internal states are initialized.
In module stop mode, only modules for which a stop setting has been made are halted
(reset or retained).
554
Program-halted state
STBY pin = low
Reset state
STBY pin = high
RES pin = low
Hardware
standby mode
RES pin = high
Program execution state
SSBY = 0, LSON = 0
High-speed
mode
(main clock)
SCK2 to
SCK0 = 0
SCK2 to
SCK0 ≠ 0
Medium-speed
mode
(main clock)
SLEEP instruction
SSBY = 1, PSS = 1,
DTON = 1, LSON = 0
Clock switching
exception handling
after oscillation
setting time
(STS2 to STS0)
SLEEP
instruction
Any interrupt*3
SLEEP
instruction
External
interrupt*4
SSBY = 1
PSS = 0, LSON = 0
Software
standby mode
SLEEP
instruction
Interrupt*1,
SLEEP instruction
SSBY = 1, PSS = 1, LSON bit = 0
DTON = 1, LSON = 1
Clock switching
SLEEP
exception handling
instruction
Interrupt*1,
LSON bit = 1
Subactive mode
(subclock)
Sleep mode
(main clock)
SLEEP instruction
Interrupt*2
: Transition after exception handling
SSBY = 1
PSS = 1, DTON = 0
Watch mode
(subclock)
SSBY = 0
PSS = 1, LSON = 1
Subsleep mode
(subclock)
: Power-down mode
Notes: • When a transition is made between modes by means of an interrupt, transition cannot be made
on interrupt source generation alone. Ensure that interrupt handling is performed after accepting
the interrupt request.
• From any state except hardware standby mode, a transition to the reset state occurs whenever
RES goes low.
• From any state, a transition to hardware standby mode occurs when STBY goes low.
• When a transition is made to watch mode or subactive mode, high-speed mode must be set.
*1
*2
*3
*4
NMI, IRQ0 to IRQ2, and WDT1 interrupts
NMI, IRQ0 to IRQ2, and WDT0 interrupts, WDT1 interrupt, TMR0 interrupt, TMR1 interrupt
All interrupts
NMI, IRQ0 to IRQ2
Figure 21.1 Mode Transitions
555
Table 21.2 Power-Down Mode Transition Conditions
Control Bit States
at Time of Transition
State before
Transition
PSS
LSON
DTON
State after Transition State after Return
by SLEEP Instruction by Interrupt
High-speed/
0
medium-speed
*
0
*
Sleep
High-speed/
medium-speed
0
*
1
*
—
—
1
0
0
*
Software standby
High-speed/
medium-speed
1
0
1
*
—
—
1
1
0
0
Watch
High-speed
1
1
1
0
Watch
Subactive
1
1
0
1
—
—
1
1
1
1
Subactive
—
0
0
*
*
—
—
0
1
0
*
—
—
0
1
1
*
Subsleep
Subactive
1
0
*
*
—
—
1
1
0
0
Watch
High-speed
1
1
1
0
Watch
Subactive
1
1
0
1
High-speed
—
1
1
1
1
—
—
Subactive
*: Don’t care
—: Do not set.
556
SSBY
21.1.1
Register Configuration
The power-down state is controlled by the SBYCR, LPWRCR, TCSR (WDT1), and MSTPCR
registers. Table 21.3 summarizes these registers.
Table 21.3 Power-Down State Registers
Name
Abbreviation
R/W
Initial Value
Address* 1
Standby control register
SBYCR
R/W
H'00
H'FF84* 2
Low-power control register
LPWRCR
R/W
H'00
H'FF85* 2
Timer control/status register
(WDT1)
TCSR
R/W
H'00
H'FFEA
Module stop control register
MSTPCRH
R/W
H'3F
H'FF86* 2
MSTPCRL
R/W
H'FF
H'FF87* 2
Notes: 1. Lower 16 bits of the address.
2. Some power-down state registers are assigned to the same address as other registers.
In this case, register selection is performed by the FLSHE bit in the serial timer control
register (STCR).
21.2
Register Descriptions
21.2.1
Standby Control Register (SBYCR)
Bit
7
6
5
4
3
2
1
0
SSBY
STS2
STS1
STS0
—
SCK2
SCK1
SCK0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
—
R/W
R/W
R/W
SBYCR is an 8-bit readable/writable register that performs power-down mode control.
SBYCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bit 7—Software Standby (SSBY): Determines the operating mode, in combination with other
control bits, when a power-down mode transition is made by executing a SLEEP instruction. The
SSBY setting is not changed by a mode transition due to an interrupt, etc.
557
Bit 7
SSBY
Description
0
Transition to sleep mode after execution of SLEEP instruction in
high-speed mode or medium-speed mode
(Initial value)
Transition to subsleep mode after execution of SLEEP instruction
in subactive mode
1
Transition to software standby mode, subactive mode, or watch mode after execution
of SLEEP instruction in high-speed mode or medium-speed mode
Transition to watch mode or high-speed mode after execution of SLEEP instruction in
subactive mode
Bits 6 to 4—Standby Timer Select 2 to 0 (STS2 to STS0): These bits select the time the MCU
waits for the clock to stabilize when software standby mode, watch mode, or subactive mode is
cleared and a transition is made to high-speed mode or medium-speed mode by means of a
specific interrupt or instruction. With crystal oscillation, refer to table 21.4 and make a selection
according to the operating frequency so that the standby time is at least 8 ms (the oscillation
settling time). With an external clock, any selection can be made.
Bit 6
Bit 5
Bit 4
STS2
STS1
STS0
Description
0
0
0
Standby time = 8192 states
1
Standby time = 16384 states
0
Standby time = 32768 states
1
Standby time = 65536 states
0
Standby time = 131072 states
1
Standby time = 262144 states
0
Reserved
1
Standby time = 16 states*
1
1
0
1
Note: * This setting must not be used in the flash memory version.
Bit 3—Reserved: This bit cannot be modified and is always read as 0.
558
(Initial value)
Bits 2 to 0—System Clock Select (SCK2 to SCK0): These bits select the clock for the bus
master in high-speed mode and medium-speed mode. When operating the device after a transition
to subactive mode or watch mode, bits SCK2 to SCK0 should all be cleared to 0.
Bit 2
Bit 1
Bit 0
SCK2
SCK1
SCK0
Description
0
0
0
Bus master is in high-speed mode
1
Medium-speed clock is ø/2
0
Medium-speed clock is ø/4
1
Medium-speed clock is ø/8
0
Medium-speed clock is ø/16
1
Medium-speed clock is ø/32
—
—
1
1
0
1
21.2.2
(Initial value)
Low-Power Control Register (LPWRCR)
7
6
5
4
3
2
1
0
DTON
LSON
NESEL
EXCLE
—
—
—
—
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
—
—
—
—
Bit
LPWRCR is an 8-bit readable/writable register that performs power-down mode control.
LPWRCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bit 7—Direct-Transfer On Flag (DTON): Specifies whether a direct transition is made between
high-speed mode, medium-speed mode, and subactive mode when making a power-down
transition by executing a SLEEP instruction. The operating mode to which the transition is made
after SLEEP instruction execution is determined by a combination of other control bits.
559
Bit 7
DTON
Description
0
When a SLEEP instruction is executed in high-speed mode or medium-speed mode,
a transition is made to sleep mode, software standby mode, or watch mode*
When a SLEEP instruction is executed in subactive mode, a transition is made to
subsleep mode or watch mode
(Initial value)
1
When a SLEEP instruction is executed in high-speed mode or medium-speed mode,
a transition is made directly to subactive mode*, or a transition is made to sleep mode
or software standby mode
When a SLEEP instruction is executed in subactive mode, a transition is made directly
to high-speed mode, or a transition is made to subsleep mode
Note: * When a transition is made to watch mode or subactive mode, high-speed mode must be
set.
Bit 6—Low-Speed On Flag (LSON): Determines the operating mode in combination with other
control bits when making a power-down transition by executing a SLEEP instruction. Also
controls whether a transition is made to high-speed mode or to subactive mode when watch mode
is cleared.
Bit 6
LSON
Description
0
When a SLEEP instruction is executed in high-speed mode or medium-speed mode,
a transition is made to sleep mode, software standby mode, or watch mode*
When a SLEEP instruction is executed in subactive mode, a transition is made to
watch mode, or directly to high-speed mode
After watch mode is cleared, a transition is made to high-speed mode
1
(Initial value)
When a SLEEP instruction is executed in high-speed mode a transition is made to
watch mode or subactive mode*
When a SLEEP instruction is executed in subactive mode, a transition is made to
subsleep mode or watch mode
After watch mode is cleared, a transition is made to subactive mode
Note: * When a transition is made to watch mode or subactive mode, high-speed mode must be
set.
Bit 5—Noise Elimination Sampling Frequency Select (NESEL): Selects the frequency at which
the subclock (øSUB) input from the EXCL pin is sampled with the clock (ø) generated by the
system clock oscillator. When ø = 5 MHz or higher, clear this bit to 0.
560
Bit 5
NESEL
Description
0
Sampling at ø divided by 32
1
Sampling at ø divided by 4
(Initial value)
Bit 4—Subclock Input Enable (EXCLE): Controls subclock input from the EXCL pin.
Bit 4
EXCLE
Description
0
Subclock input from EXCL pin is disabled
1
Subclock input from EXCL pin is enabled
(Initial value)
Bits 3 to 0—Reserved: These bits cannot be modified and are always read as 0.
21.2.3
Timer Control/Status Register (TCSR)
TCSR1
Bit
7
6
5
4
3
2
1
0
OVF
WT/IT
TME
PSS
RST/NMI
CKS2
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: * Only 0 can be written in bit 7, to clear the flag.
TCSR1 is an 8-bit readable/writable register that performs selection of the WDT1 TCNT input
clock, mode, etc.
Only bit 4 is described here. For details of the other bits, see section 14.2.2, Timer Control/Status
Register (TCSR).
TCSR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bit 4—Prescaler Select (PSS): Selects the WDT1 TCNT input clock.
This bit also controls the operation in a power-down mode transition. The operating mode to
which a transition is made after execution of a SLEEP instruction is determined in combination
with other control bits.
561
For details, see the description of Clock Select 2 to 0 in section 14.2.2, Timer Control/Status
Register (TCSR).
Bit 4
PSS
Description
0
TCNT counts ø-based prescaler (PSM) divided clock pulses
When a SLEEP instruction is executed in high-speed mode or medium-speed mode,
a transition is made to sleep mode or software standby mode
(Initial value)
1
TCNT counts øSUB-based prescaler (PSM) divided clock pulses
When a SLEEP instruction is executed in high-speed mode or medium-speed mode,
a transition is made to sleep mode, watch mode*, or subactive mode*
When a SLEEP instruction is executed in subactive mode, a transition is made to
subsleep mode, watch mode, or high-speed mode
Note: * When a transition is made to watch mode or subactive mode, high-speed mode must be
set.
21.2.4
Module Stop Control Register (MSTPCR)
MSTPCRH
Bit
7
6
5
4
3
MSTPCRL
2
1
0
7
6
5
4
3
2
1
0
MSTP15 MSTP14 MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTP8 MSTP7 MSTP6 MSTP5 MSTP4 MSTP3 MSTP2 MSTP1 MSTP0
Initial value
Read/Write
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR comprises two 8-bit readable/writable registers that perform module stop mode control.
MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in
software standby mode.
MSTRCRH and MSTPCRL Bits 7 to 0—Module Stop (MSTP 15 to MSTP 0): These bits
specify module stop mode. See table 21.3 for the method of selecting on-chip supporting modules.
MSTPCRH, MSTPCRL
Bits 7 to 0
MSTP15 to MSTP0
Description
0
Module stop mode is cleared
(Initial value of MSTP15, MSTP14)
1
Module stop mode is set
(Initial value of MSTP13 to MSTP0)
562
21.3
Medium-Speed Mode
When the SCK2 to SCK0 bits in SBYCR are set to 1 in high-speed mode, the operating mode
changes to medium-speed mode at the end of the bus cycle. In medium-speed mode, the CPU
operates on the operating clock (ø/2, ø/4, ø/8, ø/16, or ø/32) specified by the SCK2 to SCK0 bits.
The bus master other than the CPU (the DTC) also operates in medium-speed mode. On-chip
supporting modules other than the bus masters always operate on the high-speed clock (ø).
In medium-speed mode, a bus access is executed in the specified number of states with respect to
the bus master operating clock. For example, if ø/4 is selected as the operating clock, on-chip
memory is accessed in 4 states, and internal I/O registers in 8 states.
Medium-speed mode is cleared by clearing all of bits SCK2 to SCK0 to 0. A transition is made to
high-speed mode and medium-speed mode is cleared at the end of the current bus cycle.
If a SLEEP instruction is executed when the SSBY bit in SBYCR and the LSON bit in LPWRCR
are cleared to 0, a transition is made to sleep mode. When sleep mode is cleared by an interrupt,
medium-speed mode is restored.
If a SLEEP instruction is executed when the SSBY bit in SBYCR is set to 1, and the LSON bit in
LPWRCR and the PSS bit in TCSR (WDT1) are both cleared to 0, a transition is made to software
standby mode. When software standby mode is cleared by an external interrupt, medium-speed
mode is restored.
When the RES pin is driven low, a transition is made to the reset state, and medium-speed mode is
cleared. The same applies in the case of a reset caused by overflow of the watchdog timer.
When the STBY pin is driven low, a transition is made to hardware standby mode.
Figure 21.2 shows the timing for transition to and clearance of medium-speed mode.
563
Medium-speed mode
ø,
supporting module
clock
Bus master clock
Internal address
bus
SBYCR
SBYCR
Internal write signal
Figure 21.2 Medium-Speed Mode Transition and Clearance Timing
21.4
Sleep Mode
21.4.1
Sleep Mode
If a SLEEP instruction is executed when the SSBY bit in SBYCR and the LSON bit in LPWRCR
are both cleared to 0, the CPU enters sleep mode. In sleep mode, CPU operation stops but the
contents of the CPU’s internal registers are retained. Other supporting modules do not stop.
21.4.2
Clearing Sleep Mode
Sleep mode is cleared by any interrupt, or with the RES pin or STBY pin.
Clearing with an Interrupt: When an interrupt request signal is input, sleep mode is cleared and
interrupt exception handling is started. Sleep mode will not be cleared if interrupts are disabled, or
if interrupts other than NMI have been masked by the CPU.
Clearing with the RES Pin: When the RES pin is driven low, the reset state is entered. When the
RES pin is driven high after the prescribed reset input period, the CPU begins reset exception
handling.
Clearing with the STBY Pin: When the STBY pin is driven low, a transition is made to hardware
standby mode.
564
21.5
Module Stop Mode
21.5.1
Module Stop Mode
Module stop mode can be set for individual on-chip supporting modules.
When the corresponding MSTP bit in MSTPCR is set to 1, module operation stops at the end of
the bus cycle and a transition is made to module stop mode. The CPU continues operating
independently.
Table 21.4 shows MSTP bits and the corresponding on-chip supporting modules.
When the corresponding MSTP bit is cleared to 0, module stop mode is cleared and the module
starts operating again at the end of the bus cycle. In module stop mode, the internal states of
modules other than the SCI, A/D converter, 8-bit PWM module, and 14-bit PWM module, are
retained.
After reset release, all modules other than the DTC are in module stop mode.
When an on-chip supporting module is in module stop mode, read/write access to its registers is
disabled.
565
Table 21.4 MSTP Bits and Corresponding On-Chip Supporting Modules
Register
Bit
MSTPCRH
MSTPCRL
Module
MSTP15
—
MSTP14*
Data transfer controller (DTC)
MSTP13
16-bit free-running timer (FRT)
MSTP12
8-bit timers (TMR0, TMR1)
MSTP11*
8-bit PWM timer (PWM), 14-bit PWM timer (PWMX)
MSTP10*
—
MSTP9
A/D converter
MSTP8
8-bit timers (TMRX, TMRY), timer connection
MSTP7
Serial communication interface 0 (SCI0)
MSTP6
Serial communication interface 1 (SCI1)
MSTP5*
—
MSTP4*
I 2C bus interface (IIC) channel 0 (option)
MSTP3*
I 2C bus interface (IIC) channel 1 (option)
MSTP2*
—
MSTP1*
—
MSTP0*
—
Note: Bit 15 must not be set to 1. Bits 10, 5, 2, 1, and 0 can be read or written to, but do not
affect operation.
* Must be set to 1 in the H8S/2124 Series.
21.5.2
Usage Note
If there is conflict between DTC module stop mode setting and a DTC bus request, the bus request
has priority and the MSTP bit will not be set to 1.
Write 1 to the MSTP bit again after the DTC bus cycle.
When using an H8S/2124 Series MCU, the MSTP bits for nonexistent modules must be set to 1.
566
21.6
Software Standby Mode
21.6.1
Software Standby Mode
If a SLEEP instruction is executed when the SSBY bit in SBYCR is set to 1, the LSON bit in
LPWRCR is cleared to 0, and the PSS bit in TCSR (WDT1) is cleared to 0, software standby
mode is entered. In this mode, the CPU, on-chip supporting modules, and oscillator all stop.
However, the contents of the CPU’s internal registers, RAM data, and the states of on-chip
supporting modules other than the SCI, PWM, and PWMX, and of the I/O ports, are retained.
In this mode the oscillator stops, and therefore power dissipation is significantly reduced.
21.6.2
Clearing Software Standby Mode
Software standby mode is cleared by an external interrupt (NMI pin, or pin IRQ0, IRQ1, or
IRQ2), or by means of the RES pin or STBY pin.
Clearing with an Interrupt: When an NMI, IRQ0, IRQ1, or IRQ2 interrupt request signal is
input, clock oscillation starts, and after the elapse of the time set in bits STS2 to STS0 in SYSCR,
stable clocks are supplied to the entire chip, software standby mode is cleared, and interrupt
exception handling is started.
Software standby mode cannot be cleared with an IRQ0, IRQ1, or IRQ2 interrupt if the
corresponding enable bit has been cleared to 0 or has been masked by the CPU.
Clearing with the RES Pin: When the RES pin is driven low, clock oscillation is started. At the
same time as clock oscillation starts, clocks are supplied to the entire chip. Note that the RES pin
must be held low until clock oscillation stabilizes. When the RES pin goes high, the CPU begins
reset exception handling.
Clearing with the STBY Pin: When the STBY pin is driven low, a transition is made to hardware
standby mode.
567
21.6.3
Setting Oscillation Settling Time after Clearing Software Standby Mode
Bits STS2 to STS0 in SBYCR should be set as described below.
Using a Crystal Oscillator: Set bits STS2 to STS0 so that the standby time is at least 8 ms (the
oscillation settling time).
Table 21.5 shows the standby times for different operating frequencies and settings of bits STS2 to
STS0.
Table 21.5 Oscillation Settling Time Settings
20
STS2 STS1 STS0 Standby Time MHz
16
MHz
12
MHz
10
MHz
8
MHz
6
MHz
4
MHz
2
MHz
Unit
0
4.1
ms
0
1
1
0
1
0
8192 states
0.41
0.51
0.65
0.8
1.0
1.3
2.0
1
16384 states
0.82
1.0
1.3
1.6
2.0
2.7
4.1
0
32768 states
1.6
2.0
2.7
3.3
4.1
5.5
1
65536 states
3.3
4.1
5.5
6.6
0
131072 states 6.6
8.2
10.9
1
262144 states
13.1 16.4
0
Reserved
—
1
16 states*
0.8
8.2
8.2
16.4
10.9 16.4
32.8
13.1 16.4
21.8
32.8
65.5
21.8
26.2
32.8
43.6
65.6
131.2
—
—
—
—
—
—
—
1.0
1.3
1.6
2.0
2.7
4.0
8.0
8.2
: Recommended time setting
Note: * This setting must not be used in the flash memory version.
µs
*: Don’t care
Using an External Clock: Any value can be set. Normally, use of the minimum time is
recommended.
21.6.4
Software Standby Mode Application Example
Figure 21.3 shows an example in which a transition is made to software standby mode at the
falling edge on the NMI pin, and software standby mode is cleared at the rising edge on the NMI
pin.
In this example, an NMI interrupt is accepted with the NMIEG bit in SYSCR cleared to 0 (falling
edge specification), then the NMIEG bit is set to 1 (rising edge specification), the SSBY bit is set
to 1, and a SLEEP instruction is executed, causing a transition to software standby mode.
Software standby mode is then cleared at the rising edge on the NMI pin.
568
Oscillator
ø
NMI
NMIEG
SSBY
NMI
exception
handling
NMIEG = 1
SSBY = 1
Software standby mode
(power-down state)
Oscillation
settling time
tOSC2
NMI exception
handling
SLEEP instruction
Figure 21.3 Software Standby Mode Application Example
21.6.5
Usage Note
In software standby mode, I/O port states are retained. Therefore, there is no reduction in current
dissipation for the output current when a high-level signal is output.
Current dissipation increases while waiting for oscillation to settle.
569
21.7
Hardware Standby Mode
21.7.1
Hardware Standby Mode
When the STBY pin is driven low, a transition is made to hardware standby mode from any mode.
In hardware standby mode, all functions enter the reset state and stop operation, resulting in a
significant reduction in power dissipation. As long as the prescribed voltage is supplied, on-chip
RAM data is retained. I/O ports are set to the high-impedance state.
In order to retain on-chip RAM data, the RAME bit in SYSCR should be cleared to 0 before
driving the STBY pin low.
Do not change the state of the mode pins (MD1 and MD0) while the chip is in hardware standby
mode.
Hardware standby mode is cleared by means of the STBY pin and the RES pin. When the STBY
pin is driven high while the RES pin is low, the reset state is set and clock oscillation is started.
Ensure that the RES pin is held low until the clock oscillation settles (at least 8 ms—the oscillation
settling time—when using a crystal oscillator). When the RES pin is subsequently driven high, a
transition is made to the program execution state via the reset exception handling state.
570
21.7.2
Hardware Standby Mode Timing
Figure 21.4 shows an example of hardware standby mode timing.
When the STBY pin is driven low after the RES pin has been driven low, a transition is made to
hardware standby mode. Hardware standby mode is cleared by driving the STBY pin high,
waiting for the oscillation settling time, then changing the RES pin from low to high.
Oscillator
RES
STBY
Oscillation
settling time
Reset exception
handling
Figure 21.4 Hardware Standby Mode Timing
571
21.8
Watch Mode
21.8.1
Watch Mode
If a SLEEP instruction is executed in high-speed mode or subactive mode when the SSBY in
SBYCR is set to 1, the DTON bit in LPWRCR is cleared to 0, and the PSS bit in TCSR (WDT1)
is set to 1, the CPU makes a transition to watch mode.
In this mode, the CPU and all on-chip supporting modules except WDT1 stop. As long as the
prescribed voltage is supplied, the contents of some of the CPU’s internal registers and on-chip
RAM are retained, and I/O ports retain their states prior to the transition.
21.8.2
Clearing Watch Mode
Watch mode is cleared by an interrupt (WOVI1 interrupt, NMI pin, or pin IRQ0, IRQ1, or IRQ2),
or by means of the RES pin or STBY pin.
Clearing with an Interrupt: When an interrupt request signal is input, watch mode is cleared and
a transition is made to high-speed mode or medium-speed mode if the LSON bit in LPWRCR is
cleared to 0, or to subactive mode if the LSON bit is set to 1. When making a transition to highspeed mode, after the elapse of the time set in bits STS2 to STS0 in SBYCR, stable clocks are
supplied to the entire chip, and interrupt exception handling is started.
Watch mode cannot be cleared with an IRQ0, IRQ1, or IRQ2 interrupt if the corresponding enable
bit has been cleared to 0, or with an on-chip supporting module interrupt if acceptance of the
relevant interrupt has been disabled by the interrupt enable register or masked by the CPU.
See section 21.6.3, Setting Oscillation Settling Time after Clearing Software Standby Mode, for
the oscillation settling time setting when making a transition from watch mode to high-speed
mode.
Clearing with the RES Pin: See “Clearing with the RES Pin” in section 21.6.2, Clearing
Software Standby Mode.
Clearing with the STBY Pin: When the STBY pin is driven low, a transition is made to hardware
standby mode.
572
21.9
Subsleep Mode
21.9.1
Subsleep Mode
If a SLEEP instruction is executed in subactive mode when the SSBY in SBYCR is cleared to 0,
the LSON bit in LPWRCR is set to 1, and the PSS bit in TCSR (WDT1) is set to 1, the CPU
makes a transition to subsleep mode.
In this mode, the CPU and all on-chip supporting modules except TMR0, TMR1, WDT0, and
WDT1 stop. As long as the prescribed voltage is supplied, the contents of some of the CPU’s
internal registers and on-chip RAM are retained, and I/O ports retain their states prior to the
transition.
21.9.2
Clearing Subsleep Mode
Subsleep mode is cleared by an interrupt (on-chip supporting module interrupt, NMI pin, or pin
IRQ0, IRQ1, or IRQ2), or by means of the RES pin or STBY pin.
Clearing with an Interrupt: When an interrupt request signal is input, subsleep mode is cleared
and interrupt exception handling is started. Subsleep mode cannot be cleared with an IRQ0 to
IRQ2 interrupt if the corresponding enable bit has been cleared to 0, or with an on-chip supporting
module interrupt if acceptance of the relevant interrupt has been disabled by the interrupt enable
register or masked by the CPU.
Clearing with the RES Pin: See “Clearing with the RES Pin” in section 21.6.2, Clearing
Software Standby Mode.
Clearing with the STBY Pin: When the STBY pin is driven low, a transition is made to hardware
standby mode
573
21.10
Subactive Mode
21.10.1
Subactive Mode
If a SLEEP instruction is executed in high-speed mode when the SSBY bit in SBYCR, the DTON
bit in LPWRCR, and the PSS bit in TCSR (WDT1) are all set to 1, the CPU makes a transition to
subactive mode. When an interrupt is generated in watch mode, if the LSON bit in LPWRCR is
set to 1, a direct transition is made to subactive mode. When an interrupt is generated in subsleep
mode, a transition is made to subactive mode.
In subactive mode, the CPU performs sequential program execution at low speed on the subclock.
In this mode, all on-chip supporting modules except TMR0, TMR1, WDT0, and WDT1 stop.
When operating the device in subactive mode, bits SCK2 to SCK0 in SBYCR must all be cleared
to 0.
21.10.2
Clearing Subactive Mode
Subsleep mode is cleared by a SLEEP instruction, or by means of the RES pin or STBY pin.
Clearing with a SLEEP Instruction: When a SLEEP instruction is executed while the SSBY bit
in SBYCR is set to 1, the DTON bit in LPWRCR is cleared to 0, and the PSS bit in TCSR
(WDT1) is set to 1, subactive mode is cleared and a transition is made to watch mode. When a
SLEEP instruction is executed while the SSBY bit in SBYCR is cleared to 0, the LSON bit in
LPWRCR is set to 1, and the PSS bit in TCSR (WDT1) is set to 1, a transition is made to subsleep
mode. When a SLEEP instruction is executed while the SSBY bit in SBYCR is set to 1, the
DTON bit is set to 1 and the LSON bit is cleared to 0 in LPWRCR, and the PSS bit in TCSR
(WDT1) is set to 1, a transition is made directly to high-speed mode.
Fort details of direct transition, see section 21.11, Direct Transition.
Clearing with the RES Pin: See “Clearing with the RES Pin” in section 21.6.2, Clearing
Software Standby Mode.
Clearing with the STBY Pin: When the STBY pin is driven low, a transition is made to hardware
standby mode
574
21.11
Direct Transition
21.11.1
Overview of Direct Transition
There are three operating modes in which the CPU executes programs: high-speed mode, mediumspeed mode, and subactive mode. A transition between high-speed mode and subactive mode
without halting the program is called a direct transition. A direct transition can be carried out by
setting the DTON bit in LPWRCR to 1 and executing a SLEEP instruction. After the transition,
direct transition exception handling is started.
Direct Transition from High-Speed Mode to Subactive Mode: If a SLEEP instruction is
executed in high-speed mode while the SSBY bit in SBYCR, the LSON bit and DTON bit in
LPWRCR, and the PSS bit in TSCR (WDT1) are all set to 1, a transition is made to subactive
mode.
Direct Transition from Subactive Mode to High-Speed Mode: If a SLEEP instruction is
executed in subactive mode while the SSBY bit in SBYCR is set to 1, the LSON bit is cleared to 0
and the DTON bit is set to 1 in LPWRCR, and the PSS bit in TSCR (WDT1) is set to 1, after the
elapse of the time set in bits STS2 to STS0 in SBYCR, a transition is made to directly to highspeed mode.
575
576
Section 22 Electrical Characteristics
[H8S/2128 Series, H8S/2128 F-ZTAT]
22.1
Absolute Maximum Ratings
Table 22.1 lists the absolute maximum ratings.
Table 22.1 Absolute Maximum Ratings
Item
Symbol
Value
Unit
Power supply voltage
VCC
–0.3 to +7.0
V
Input voltage (except ports 6,
and 7)
Vin
–0.3 to VCC +0.3
V
Input voltage (CIN input not
selected for port 6)
Vin
–0.3 to VCC +0.3
V
Input voltage (CIN input selected
for port 6)
Vin
Lower voltage of –0.3 to V CC +0.3 and
AVCC +0.3
V
Input voltage (port 7)
Vin
–0.3 to AVCC + 0.3
V
Analog power supply voltage
AVCC
–0.3 to +7.0
V
Analog input voltage
VAN
–0.3 to AVCC +0.3
V
Operating temperature
Topr
Regular specifications: –20 to +75
°C
Operating temperature
(Flash memory programming/
erasing)
Topr
Storage temperature
Tstg
Wide-range specifications: –40 to +85
°C
Regular specifications: 0 to +75
°C
Wide-range specifications: 0 to +85
–55 to +125
°C
Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded.
577
22.2
DC Characteristics
Table 22.2 lists the DC characteristics. Table 22.3 lists the permissible output currents.
Table 22.2 DC Characteristics (1)
Conditions: VCC = 5.0 V ± 10%, AVCC*1 = 5.0 V ± 10%, VSS = AVSS*1 = 0 V,
Ta = –20 to +75°C*8 (regular specifications),
Ta = –40 to +85°C*8 (wide-range specifications)
Item
Symbol
Min
Typ
Max
Unit
1.0
—
—
V
—
—
VCC × 0.7 V
0.4
—
—
V
VCC – 0.7 —
VCC +0.3
V
EXTAL
VCC × 0.7 —
VCC +0.3
V
Port 7
2.0
—
AVCC +0.3 V
Input pins
except (1) and
(2) above
2.0
—
VCC +0.3
V
–0.3
—
0.5
V
–0.3
—
0.8
V
VCC – 0.5 —
—
V
I OH = –200 µA
3.5
—
—
V
I OH = –1 mA
2.5
—
—
V
I OH = –1 mA
—
—
0.4
V
I OL = 1.6 mA
—
—
1.0
V
I OL = 10 mA
—
—
10.0
µA
Vin = 0.5 to
VCC – 0.5 V
STBY, NMI, MD1,
MD0
—
—
1.0
µA
Port 7
—
—
1.0
µA
2,
Schmitt
P67 to P60* * , (1)
trigger input IRQ2 to IRQ0* 3
voltage
VT
–
VT
+
RES, STBY,
(2)
NMI, MD1, MD0
VIH
Input high
voltage
Input low
voltage
5
RES, STBY,
MD1, MD0
(3)
+
VT – VT
VIL
NMI, EXTAL,
input pins except
(1) and (3)
above
Output high All output pins
voltage
(except P47, and
P52* 4)
P47, P52*
4
Output low
voltage
All output pins
Input
leakage
current
RES
578
VOH
VOL
Ports 1 to 3
Iin
–
Test Conditions
Vin = 0.5 to
AVCC – 0.5 V
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Three-state Ports 1 to 6
leakage
current
(off state)
ITSI
—
—
1.0
µA
Vin = 0.5 to
VCC – 0.5 V
–I P
50
—
300
µA
Vin = 0 V
Cin
—
—
80
pF
NMI
—
—
50
pF
Vin = 0 V
f = 1 MHz
Ta = 25°C
P52, P47,
P24, P23
—
—
20
pF
Input pins
except (4) above
—
—
15
pF
—
70
90
mA
f = 20 MHz
—
55
75
mA
f = 20 MHz
—
0.01
5.0
µA
Ta ≤ 50°C
—
—
20.0
µA
50°C < Ta
—
1.5
3.0
mA
—
0.01
5.0
µA
AVCC =
2.0 V to 5.5 V
4.5
—
5.5
V
Operating
2.0
—
5.5
V
Idle/not used
2.0
—
—
V
Input
pull-up
MOS
current
Ports 1 to 3
Input
RES
capacitance
(4)
Current
Normal operation
dissipation* 6 Sleep mode
Standby mode*
Analog
power
supply
current
I CC
7
During A/D
conversion
AlCC
Idle
Analog power supply voltage* 1
RAM standby voltage
AVCC
VRAM
Notes: 1. Do not leave the AVCC, and AVSS pins open even if the A/D converter is not used.
Even if the A/D converter is not used, apply a value in the range 2.0 V to 5.5 V to AVCC
by connection to the power supply (V CC), or some other method.
2. P67 to P60 include supporting module inputs multiplexed on those pins.
3. IRQ2 includes the ADTRG signal multiplexed on that pin.
4. In the H8S/2128 Series, P52/SCK0/SCL0 and P47/SDA0 are NMOS push-pull outputs.
An external pull-up resistor is necessary to provide high-level output from SCL0 and
SDA0 (ICE = 1).
In the H8S/2128 Series, P52/SCK0 and P47 (ICE = 0) high levels are driven by NMOS.
579
5. The upper limit of the port 6 applied voltage is V CC + 0.3 V when CIN input is not
selected, and the lower of VCC + 0.3 V and AVCC + 0.3 V when CIN input is selected.
When a pin is in output mode, the output voltage is equivalent to the applied voltage.
6. Current dissipation values are for V IH min = VCC – 0.5 V and VIL max = 0.5 V with all
output pins unloaded and the on-chip pull-up MOSs in the off state.
7. The values are for VRAM ≤ VCC < 4.5 V, VIH min = VCC × 0.9, and V IL max = 0.3 V.
8. For flash memory program/erase operations, the applicable range is T a = 0 to +75°C
(regular specifications) or Ta = 0 to +85°C (wide-range specifications).
580
Table 22.2 DC Characteristics (2)
Conditions: VCC = 4.0 V to 5.5 V*8, AVCC*1 = 4.0 V to 5.5 V, VSS = AVSS*1 = 0 V,
Ta = –20 to +75°C*8 (regular specifications),
Ta = –40 to +85°C*8 (wide-range specifications)
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
1.0
—
—
V
—
—
VCC × 0.7 V
VCC =
4.5 V to 5.5 V
0.4
—
—
V
0.8
—
—
V
—
—
VCC × 0.7 V
0.3
—
—
VCC – 0.7
—
VCC +0.3 V
EXTAL
VCC × 0.7 —
VCC +0.3 V
Port 7
2.0
—
AVCC +0.3 V
Input pins
except (1) and
(2) above
2.0
—
VCC +0.3 V
–0.3
—
0.5
V
–0.3
—
0.8
V
VCC – 0.5
—
—
V
I OH = –200 µA
3.5
—
—
V
I OH = –1 mA,
VCC=
4.5 V to 5.5 V
3.0
—
—
V
I OH = –1 mA,
VCC < 4.5 V
2.0
—
—
V
I OH = –1 mA
—
—
0.4
V
I OL = 1.6 mA
—
—
1.0
V
I OL = 10 mA
—
—
10.0
µA
STBY, NMI, MD1,
MD0
—
—
1.0
µA
Vin = 0.5 to
VCC – 0.5 V
Port 7
—
—
1.0
µA
2,
5
Schmitt
P67 to P60* * , (1)
trigger input IRQ2 to IRQ0* 3
voltage
VT
–
VT
+
+
VT – VT
VT
–
VT
+
+
VT – VT
Input high
voltage
Input low
voltage
RES, STBY,
(2)
NMI, MD1, MD0
RES, STBY,
MD1, MD0
(3)
VIH
VIL
NMI, EXTAL,
input pins except
(1) and (3) above
Output high All output pins
voltage
VOH
(except P47, and
P52* 4)
P47, P52* 4
Output low
voltage
All output pins
Input
leakage
current
RES
VOL
Ports 1 to 3
Iin
–
–
VCC < 4.5 V
V
Vin = 0.5 to
AVCC – 0.5 V
581
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Three-state Ports 1 to 6
leakage
current
(off state)
ITSI
—
—
1.0
µA
Vin = 0.5 to
VCC – 0.5 V
Input
pull-up
MOS
current
–I P
50
—
300
µA
Vin = 0 V,
VCC = 4.5 V to
5.5 V
30
—
200
µA
Vin = 0 V,
VCC < 4.5 V
—
—
80
pF
NMI
—
—
50
pF
Vin = 0 V,
f = 1 MHz,
Ta = 25°C
P52, P47,
P24, P23
—
—
20
pF
Input pins
except (4) above
—
—
15
pF
—
55
75
mA
f = 16 MHz
—
42
62
mA
f = 16 MHz
—
0.01
5.0
µA
Ta ≤ 50°C
—
—
20.0
µA
50°C < Ta
—
1.5
3.0
mA
—
0.01
5.0
µA
AVCC =
2.0 V to 5.5 V
4.0
—
5.5
V
Operating
2.0
—
5.5
V
Idle/not used
2.0
—
—
V
Ports 1 to 3
Input
RES
capacitance
(4)
Current
Normal operation
dissipation* 6 Sleep mode
Standby mode*
Analog
power
supply
current
Cin
I CC
7
During A/D
conversion
AlCC
Idle
Analog power supply voltage* 1
RAM standby voltage
AVCC
VRAM
Notes: 1. Do not leave the AVCC, and AVSS pins open even if the A/D converter is not used.
Even if the A/D converter is not used, apply a value in the range 2.0 V to 5.5 V to AVCC
by connection to the power supply (V CC), or some other method.
2. P67 to P60 include supporting module inputs multiplexed on those pins.
3. IRQ2 includes the ADTRG signal multiplexed on that pin.
4. In the H8S/2128 Series, P52/SCK0/SCL0 and P47/SDA0 are NMOS push-pull outputs.
An external pull-up resistor is necessary to provide high-level output from SCL0 and
SDA0 (ICE = 1).
In the H8S/2128 Series, P52/SCK0 and P47 (ICE = 0) high levels are driven by NMOS.
5. The upper limit of the port 6 applied voltage is V CC + 0.3 V when CIN input is not
selected, and the lower of VCC + 0.3 V and AVCC + 0.3 V when CIN input is selected.
When a pin is in output mode, the output voltage is equivalent to the applied voltage.
582
6. Current dissipation values are for VIH min = VCC – 0.5 V and VIL max = 0.5 V with all
output pins unloaded and the on-chip pull-up MOSs in the off state.
7. The values are for VRAM ≤ VCC < 4.0 V, VIH min = VCC × 0.9, and V IL max = 0.3 V.
8. For flash memory program/erase operations, the applicable ranges are VCC = 4.5 V to
5.5 V and T a = 0 to +75°C (regular specifications) or T a = 0 to +85°C (wide-range
specifications).
583
Table 22.2 DC Characteristics (3)
Conditions (Mask ROM version): VCC = 2.7 V to 5.5 V, AVCC*1 = 2.7 V to 5.5 V,
VSS = AVSS*1 = 0 V, Ta = –20 to +75°C
VCC = 3.0 V to 5.5 V, AVCC*1 = 3.0 V to 5.5 V,
VSS = AVSS*1 = 0 V, Ta = –20 to +75°C*8
(Flash memory version):
Item
Symbol
2,
Schmitt
P67 to P60* * , (1)
trigger input IRQ2 to IRQ0* 3
voltage
VT
–
VT
+
RES, STBY,
(2)
NMI, MD1, MD0
VIH
Input high
voltage
Input low
voltage
5
Typ
Max
Unit
VCC × 0.2 —
—
V
—
VCC × 0.7 V
—
Test Conditions
VCC × 0.05 —
—
VCC × 0.9 —
VCC +0.3 V
EXTAL
VCC × 0.7 —
VCC +0.3 V
Port 7
VCC × 0.7 —
AVCC +0.3 V
Input pins
except (1) and
(2) above
VCC × 0.7 —
VCC +0.3 V
–0.3
—
VCC × 0.1 V
–0.3
—
VCC × 0.2 V
VCC < 4.0 V
0.8
V
VCC =
4.0 V to 5.5 V
RES, STBY,
MD1, MD0
(3)
+
VT – VT
VIL
NMI, EXTAL,
input pins except
(1) and (3)
above
Output high All output pins
voltage
(except P47, and
P52* 4)
VOH
–
V
VCC – 0.5
—
—
V
I OH = –200 µA
VCC – 1.0
—
—
V
I OH = –1 mA
(VCC < 4.0 V)
1.0
—
—
V
I OH = –1 mA
—
—
0.4
V
I OL = 1.6 mA
—
—
1.0
V
I OL = 5 mA
(VCC < 4.0 V),
I OL = 10 mA
(4.0 V ≤ VCC ≤
5.5 V)
—
—
10.0
µA
STBY, NMI, MD1,
MD0
—
—
1.0
µA
Vin = 0.5 to
VCC – 0.5 V
Port 7
—
—
1.0
µA
P47, P52* 4
Output low
voltage
All output pins
Input
leakage
current
RES
584
Min
VOL
Ports 1 to 3
Iin
Vin = 0.5 to
AVCC – 0.5 V
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Three-state Ports 1 to 6
leakage
current
(off state)
ITSI
—
—
1.0
µA
Vin = 0.5 to
VCC – 0.5 V
–I P
10
—
150
µA
Vin = 0 V,
VCC = 2.7 V to
3.6 V
Cin
—
—
80
pF
NMI
—
—
50
pF
Vin = 0 V,
f = 1 MHz,
Ta = 25°C
P52, P47,
P24, P23
—
—
20
pF
Input pins
except (4) above
—
—
15
pF
—
40
52
mA
f = 10 MHz
—
30
42
mA
f = 10 MHz
—
0.01
5.0
µA
Ta ≤ 50°C
—
—
20.0
µA
50°C < Ta
—
1.5
3.0
mA
—
0.01
5.0
µA
AVCC =
2.0 V to 5.5 V
2.7
—
5.5
V
Operating
2.0
—
5.5
V
Idle/not used
2.0
—
—
V
Input
pull-up
MOS
current
Ports 1 to 3
Input
RES
capacitance
(4)
Current
Normal operation
dissipation* 6 Sleep mode
Standby mode*
Analog
power
supply
current
I CC
7
During A/D
conversion
AlCC
Idle
Analog power supply voltage* 1
RAM standby voltage
AVCC
VRAM
Notes: 1. Do not leave the AVCC, and AVSS pins open even if the A/D converter is not used.
Even if the A/D converter is not used, apply a value in the range 2.0 V to 5.5 V to AVCC
by connection to the power supply (V CC), or some other method.
2. P67 to P60 include supporting module inputs multiplexed on those pins.
3. IRQ2 includes the ADTRG signal multiplexed on that pin.
4. In the H8S/2128 Series, P52/SCK0/SCL0 and P47/SDA0 are NMOS push-pull outputs.
An external pull-up resistor is necessary to provide high-level output from SCL0 and
SDA0 (ICE = 1).
In the H8S/2128 Series, P52/SCK0 and P47 (ICE = 0) high levels are driven by NMOS.
585
5. The upper limit of the port 6 applied voltage is V CC + 0.3 V when CIN input is not
selected, and the lower of VCC + 0.3 V and AVCC + 0.3 V when CIN input is selected.
When a pin is in output mode, the output voltage is equivalent to the applied voltage.
6. Current dissipation values are for V IH min = VCC – 0.5 V and VIL max = 0.5 V with all
output pins unloaded and the on-chip pull-up MOSs in the off state.
7. The values are for VRAM ≤ VCC < 2.7 V, VIH min = VCC × 0.9, and V IL max = 0.3 V.
8. For flash memory program/erase operations, the applicable range is VCC = 3.0 V to
3.6 V and T a = 0 to +75°C.
586
Table 22.3 Permissible Output Currents
Conditions: VCC = 4.0 to 5.5 V, VSS = 0 V, Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Item
Permissible output
low current (per pin)
Permissible output
low current (total)
Symbol Min
Typ
Max
Unit
—
—
20
mA
Ports 1, 2, 3
—
—
10
mA
Other output pins
—
—
2
mA
SCL1, SCL0, SDA1,
SDA0
I OL
Total of ports 1, 2, and 3 ∑ IOL
—
—
80
mA
Total of all output pins,
including the above
—
—
120
mA
Permissible output
high current (per pin)
All output pins
–I OH
—
—
2
mA
Permissible output
high current (total)
Total of all output pins
∑ –IOH
—
—
40
mA
Notes: 1. To protect chip reliability, do not exceed the output current values in table 22.3.
2. When driving a Darlington pair or LED, always insert a current-limiting resistor in the
output line, as show in figures 22.1 and 22.2.
Table 22.3 Permissible Output Currents (cont)
Conditions: VCC = 2.7 to 5.5 V, VSS = 0 V, Ta = –20 to +75°C
Item
Permissible output
low current (per pin)
Permissible output
low current (total)
Symbol Min
Typ
Max
Unit
—
—
10
mA
Ports 1, 2, 3
—
—
2
mA
Other output pins
—
—
1
mA
Total of ports 1, 2, and 3 ∑ IOL
—
—
40
mA
Total of all output pins,
including the above
—
—
60
mA
SCL1, SCL0, SDA1,
SDA0
I OL
Permissible output
high current (per pin)
All output pins
–I OH
—
—
2
mA
Permissible output
high current (total)
Total of all output pins
∑ –IOH
—
—
30
mA
Notes: 1. To protect chip reliability, do not exceed the output current values in table 22.3.
2. When driving a Darlington pair or LED, always insert a current-limiting resistor in the
output line, as show in figures 22.1 and 22.2.
587
Table 22.4 Bus Drive Characteristics
Conditions: VCC = 2.7 to 5.5 V, VSS = 0 V, Ta = –20 to +75°C
Applicable Pins: SCL1, SCL0, SDA1, SDA0 (bus drive function selected)
Item
Schmitt trigger
input voltage
Symbol
VT
–
VT+
+
VT – VT
–
Min
Typ
Max
Unit
Test Conditions
VCC × 0.3
—
—
V
VCC = 2.7 V to 5.5 V
—
—
VCC × 0.7
VCC = 2.7 V to 5.5 V
VCC × 0.05
—
—
VCC = 2.7 V to 5.5 V
Input high voltage
VIH
VCC × 0.7
—
VCC + 0.5
Input low voltage
VIL
–0.5
—
VCC × 0.3
Output low voltage
VOL
—
—
0.8
—
—
0.5
I OL = 8 mA
—
—
0.4
I OL = 3 mA
—
—
20
pF
Vin = 0 V, f = 1 MHz,
Ta = 25°C
Three-state leakage | ITSI |
current (off state)
—
—
1.0
µA
Vin = 0.5 to VCC – 0.5 V
SCL, SDA output
fall time
20 + 0.1Cb —
250
ns
VCC = 2.7 V to 5.5 V
Input capacitance
Cin
t Of
V
VCC = 2.7 V to 5.5 V
VCC = 2.7 V to 5.5 V
V
I OL = 16 mA,
VCC = 4.5 V to 5.5 V
H8S/2128 Series or
H8S/2124 Series
chip
2 kΩ
Port
Darlington pair
Figure 22.1 Darlington Pair Drive Circuit (Example)
588
H8S/2128 Series or
H8S/2124 Series
chip
600 Ω
Ports 1 to 3
LED
Figure 22.2 LED Drive Circuit (Example)
22.3
AC Characteristics
Figure 22.3 shows the test conditions for the AC characteristics.
VCC
RL
Chip output
pin
C
RH
C = 30 pF: All ports
RL = 2.4 kΩ
RH = 12 kΩ
I/O timing test levels
• Low level: 0.8 V
• High level: 2.0 V
Figure 22.3 Output Load Circuit
589
22.3.1
Clock Timing
Table 22.5 shows the clock timing. The clock timing specified here covers clock (ø) output and
clock pulse generator (crystal) and external clock input (EXTAL pin) oscillation settling times.
For details of external clock input (EXTAL pin and EXCL pin) timing, see section 20, Clock
Pulse Generator.
Table 22.5 Clock Timing
Condition A: VCC = 5.0 V ± 10%, VSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition B: VCC = 4.0 V to 5.5 V, VSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition C: VCC = 2.7 V to 5.5 V*, VSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C
Condition A
Condition B
Condition C
20 MHz
16 MHz
10 MHz
Item
Symbol
Min
Max
Min
Max
Min
Max
Unit
Test
Conditions
Clock cycle time
t cyc
50
500
62.5
500
100
500
ns
Figure 22.4
Clock high pulse
width
t CH
17
—
20
—
30
—
ns
Figure 22.4
Clock low pulse
width
t CL
17
—
20
—
30
—
ns
Clock rise time
t Cr
—
8
—
10
—
20
ns
Clock fall time
t Cf
—
8
—
10
—
20
ns
Oscillation settling
time at reset
(crystal)
t OSC1
10
—
10
—
20
—
ms
Oscillation settling
time in software
standby (crystal)
t OSC2
8
—
8
—
8
—
ms
External clock
output stabilization
delay time
t DEXT
500
—
500
—
500
—
µs
Note: * For the low-voltage F-ZTAT version, V CC = 3.0 V to 5.5 V.
590
Figure 22.5
Figure 22.6
tcyc
tCH
tCf
ø
tCL
tCr
Figure 22.4 System Clock Timing
EXTAL
tDEXT
tDEXT
VCC
STBY
tOSC1
tOSC1
RES
ø
Figure 22.5 Oscillation Settling Timing
ø
NMI
IRQi
(i = 0, 1, 2)
tOSC2
Figure 22.6 Oscillation Setting Timing (Exiting Software Standby Mode)
591
22.3.2
Control Signal Timing
Table 22.6 shows the control signal timing. The only external interrupts that can operate on the
subclock (ø = 32.768 kHz) are NMI and IRQ0, 1, and IRQ2.
Table 22.6 Control Signal Timing
Condition A: VCC = 5.0 V ± 10%, VSS = 0 V, ø = 32.768 kHz, 2 MHz to maximum operating
frequency, Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition B: VCC = 4.0 V to 5.5 V, VSS = 0 V, ø = 32.768 kHz, 2 MHz to maximum operating
frequency, Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition C: VCC = 2.7 V to 5.5 V*, VSS = 0 V, ø = 32.768 kHz, 2 MHz to maximum operating
frequency, Ta = –20 to +75°C
Condition A
Condition B
Condition C
20 MHz
16 MHz
10 MHz
Item
Symbol
Min
Max
Min
Max
Min
Max
Unit
Test
Conditions
RES setup time
t RESS
200
—
200
—
300
—
ns
Figure 22.7
RES pulse width
t RESW
20
—
20
—
20
—
t cyc
NMI setup time
(NMI)
t NMIS
150
—
150
—
250
—
ns
NMI hold time
(NMI)
t NMIH
10
—
10
—
10
—
ns
NMI pulse width
(exiting software
standby mode)
t NMIW
200
—
200
—
200
—
ns
IRQ setup time
(IRQ2 to IRQ0)
t IRQS
150
—
150
—
250
—
ns
IRQ hold time
(IRQ2 to IRQ0)
t IRQH
10
—
10
—
10
—
ns
IRQ pulse width
(IRQ2 to IRQ0)
(exiting software
standby mode)
t IRQW
200
—
200
—
200
—
ns
Note: * For the low-voltage F-ZTAT version, V CC = 3.0 V to 5.5 V.
592
Figure 22.8
ø
tRESS
tRESS
RES
tRESW
Figure 22.7 Reset Input Timing
ø
tNMIH
tNMIS
NMI
tNMIW
IRQi
(i = 2 to 0)
tIRQW
tIRQS
tIRQH
IRQ
Edge input
tIRQS
IRQ
Level input
Figure 22.8 Interrupt Input Timing
593
22.3.3
Bus Timing
Table 22.7 shows the bus timing. Operation in external expansion mode is not guaranteed when
operating on the subclock (ø = 32.768 kHz).
Table 22.7 Bus Timing
Condition A: VCC = 5.0 V ± 10%, VSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition B: VCC = 4.0 V to 5.5 V, VSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition C: VCC = 2.7 V to 5.5 V*, VSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C
Condition A
Condition B
Condition C
20 MHz
16 MHz
10 MHz
Item
Symbol Min
Max
Min
Max
Min
Max
Test
Unit Conditions
Address
delay time
t AD
—
20
—
30
—
40
ns
Address
setup time
t AS
0.5 ×
—
t cyc – 15
0.5 ×
—
t cyc – 20
0.5 ×
—
t cyc – 30
ns
Address
hold time
t AH
0.5 ×
—
t cyc – 10
0.5 ×
—
t cyc – 15
0.5 ×
—
t cyc – 20
ns
CS delay
time (IOS)
t CSD
—
20
—
30
—
40
ns
AS delay
time
t ASD
—
30
—
45
—
60
ns
RD delay
time 1
t RSD1
—
30
—
45
—
60
ns
RD delay
time 2
t RSD2
—
30
—
45
—
60
ns
Read data
setup time
t RDS
15
—
20
—
35
—
ns
Read data
hold time
t RDH
0
—
0
—
0
—
ns
Read data
t ACC1
access time 1
—
1.0 ×
t cyc – 30
—
1.0 ×
t cyc – 40
—
1.0 ×
t cyc – 60
ns
Read data
t ACC2
access time 2
—
1.5 ×
t cyc – 25
—
1.5 ×
t cyc – 35
—
1.5 ×
t cyc – 50
ns
594
Figure 22.9
to
figure 22.13
Item
Condition A
Condition B
Condition C
20 MHz
16 MHz
10 MHz
Symbol Min
Max
Min
Max
Min
Max
Test
Unit Conditions
Read data
t ACC3
access time 3
—
2.0 ×
t cyc – 30
—
2.0 ×
t cyc – 40
—
2.0 ×
t cyc – 60
ns
Read data
t ACC4
access time 4
—
2.5 ×
t cyc – 25
—
2.5 ×
t cyc – 35
—
2.5 ×
t cyc – 50
ns
Read data
t ACC5
access time 5
—
3.0 ×
t cyc – 30
—
3.0 ×
t cyc – 40
—
3.0 ×
t cyc – 60
ns
WR delay
time 1
t WRD1
—
30
—
45
—
60
ns
WR delay
time 2
t WRD2
—
30
—
45
—
60
ns
WR pulse
width 1
t WSW1
1.0 ×
—
t cyc – 20
1.0 ×
—
t cyc – 30
1.0×
—
t cyc – 40
ns
WR pulse
width 2
t WSW2
1.5 ×
—
t cyc – 20
1.5 ×
—
t cyc – 30
1.5 ×
—
t cyc – 40
ns
Write data
delay time
t WDD
—
30
—
45
—
60
ns
Write data
setup time
t WDS
0
—
0
—
0
—
ns
Write data
hold time
t WDH
10
—
15
—
20
—
ns
WAIT setup
time
t WTS
30
—
45
—
60
—
ns
WAIT hold
time
t WTH
5
—
5
—
10
—
ns
Figure 22.9
to
figure 22.13
Note: * For the low-voltage F-ZTAT version, V CC = 3.0 V to 5.5 V.
595
T1
T2
ø
tAD
A15 to A0,
IOS*
tCSD
tAS
tAH
tASD
tASD
AS*
tRSD1
RD
(read)
tACC2
tRSD2
tAS
tACC3
tRDS
tRDH
D7 to D0
(read)
tWRD2
WR
(write)
tWRD2
tAH
tAS
tWDD
tWSW1
tWDH
D7 to D0
(write)
Note: * AS and IOS are the same pin. The function is selected by the IOSE bit in SYSCR.
Figure 22.9 Basic Bus Timing (Two-State Access)
596
T1
T2
T3
ø
tAD
A15 to A0,
IOS*
tCSD
tAS
tASD
tASD
tAH
AS*
tRSD1
RD
(read)
tACC4
tRSD2
tAS
tRDS
tACC5
tRDH
D7 to D0
(read)
tWRD1
tWRD2
WR
(write)
tAH
tWDD tWDS
tWSW2
tWDH
D7 to D0
(write)
Note: * AS and IOS are the same pin. The function is selected by the IOSE bit in SYSCR.
Figure 22.10 Basic Bus Timing (Three-State Access)
597
T1
T2
TW
T3
ø
A15 to A0,
IOS*
AS*
RD
(read)
D7 to D0
(read)
WR
(write)
D7 to D0
(write)
tWTS tWTH
tWTS tWTH
WAIT
Note: * AS and IOS are the same pin. The function is selected by the IOSE bit in SYSCR.
Figure 22.11 Basic Bus Timing (Three-State Access with One Wait State)
598
T1
T2 or T3
T1
T2
ø
tAD
A15 to A0,
IOS*
tAS
tASD
tAH
tASD
AS*
tRSD2
RD
(read)
tACC3
tRDS tRDH
D7 to D0
(read)
Note: * AS and IOS are the same pin. The function is selected by the IOSE bit in SYSCR.
Figure 22.12 Burst ROM Access Timing (Two-State Access)
599
T1
T2 or T3
T1
ø
tAD
A15 to A0,
IOS*
AS*
tRSD2
RD
(read)
tACC1
tRDS
tRDH
D7 to D0
(read)
Note: * AS and IOS are the same pin. The function is selected by the IOSE bit in SYSCR.
Figure 22.13 Burst ROM Access Timing (One-State Access)
600
22.3.4
Timing of On-Chip Supporting Modules
Tables 22.8 and 22.9 show the on-chip supporting module timing. The only on-chip supporting
modules that can operate in subclock operation (ø = 32.768 kHz) are the I/O ports, external
interrupts (NMI and IRQ0, 1, and IRQ2), the watchdog timer, and the 8-bit timer (channels 0 and
1).
Table 22.8 Timing of On-Chip Supporting Modules
Condition A: VCC = 5.0 V ± 10%, VSS = 0 V, ø = 32.768 kHz* 1, 2 MHz to maximum operating
frequency, Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition B: VCC = 4.0 V to 5.5 V, VSS = 0 V, ø = 32.768 kHz* 1, 2 MHz to maximum operating
frequency, Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition C: VCC = 2.7 V to 5.5 V*2, VSS = 0 V, ø = 32.768 kHz* 1, 2 MHz to maximum
operating frequency, Ta = –20 to +75°C
Condition A Condition B Condition C
20 MHz
Item
I/O
ports
FRT
Symbol Min
16 MHz
10 MHz
Max
Min
Max
Min
Max
Test
Unit Conditions
ns
Figure
22.14
ns
Figure
22.15
Output data delay t PWD
time
—
50
—
50
—
100
Input data setup
time
t PRS
30
—
30
—
50
—
Input data hold
time
t PRH
30
—
30
—
50
—
Timer output delay t FTOD
time
—
50
—
50
—
100
Timer input setup t FTIS
time
30
—
30
—
50
—
Timer clock input
setup time
t FTCS
30
—
30
—
50
—
Timer
clock
pulse
width
Single
edge
t FTCWH
1.5
—
1.5
—
1.5
—
Both
edges
t FTCWL
2.5
—
2.5
—
2.5
—
Figure
22.16
t cyc
601
Condition A Condition B Condition C
20 MHz
Max
Min
Max
Min
Max
Test
Unit Conditions
Timer output
delay time
t TMOD
—
50
—
50
—
100
ns
Timer reset input
setup time
t TMRS
30
—
30
—
50
—
Figure
22.19
Timer clock input
setup time
t TMCS
30
—
30
—
50
—
Figure
22.18
Timer
clock
pulse
width
Single
edge
t TMCWH
1.5
—
1.5
—
1.5
—
Both
edges
t TMCWL
2.5
—
2.5
—
2.5
—
t PWOD
—
50
—
50
—
100
ns
Figure
22.20
Asynchro- t Scyc
nous
4
—
4
—
4
—
t cyc
Figure
22.21
Synchronous
6
—
6
—
6
—
PWM, Pulse output
PWMX delay time
SCI
602
10 MHz
Symbol Min
Item
TMR
16 MHz
Input
clock
cycle
Figure
22.17
t cyc
Input clock pulse
width
t SCKW
0.4
0.6
0.4
0.6
0.4
0.6
t Scyc
Input clock rise
time
t SCKr
—
1.5
—
1.5
—
1.5
t cyc
Input clock fall
time
t SCKf
—
1.5
—
1.5
—
1.5
Condition A Condition B Condition C
20 MHz
10 MHz
Symbol Min
Max
Min
Max
Min
Max
Test
Unit Conditions
Transmit data
delay time
(synchronous)
t TXD
—
50
—
50
—
100
ns
Receive data
setup time
(synchronous)
t RXS
50
—
50
—
100
—
ns
Receive data
hold time
(synchronous)
t RXH
50
—
50
—
100
—
ns
t TRGS
30
—
30
—
50
—
ns
Item
SCI
16 MHz
A/D
Trigger input
converter setup time
Figure
22.22
Figure
22.23
Notes: 1. Only supporting modules that can be used in subclock operation
2. For the low-voltage F-ZTAT version, V CC = 3.0 V to 5.5 V
603
T1
T2
ø
tPRS
tPRH
Ports 1 to 7
(read)
tPWD
Ports 1 to 6
(write)
Figure 22.14 I/O Port Input/Output Timing
ø
tFTOD
FTOA, FTOB
tFTIS
FTIA, FTIB,
FTIC, FTID
Figure 22.15 FRT Input/Output Timing
ø
tFTCS
FTCI
tFTCWL
tFTCWH
Figure 22.16 FRT Clock Input Timing
604
ø
tTMOD
TMO0, TMO1
TMOX
Figure 22.17 8-Bit Timer Output Timing
ø
tTMCS
tTMCS
TMCI0, TMCI1
TMIX, TMIY
tTMCWL
tTMCWH
Figure 22.18 8-Bit Timer Clock Input Timing
ø
tTMRS
TMRI0, TMRI1
TMIX, TMIY
Figure 22.19 8-Bit Timer Reset Input Timing
ø
tPWOD
PW15 to PW0,
PWX1, PWX0
Figure 22.20 PWM, PWMX Output Timing
605
tSCKW
tSCKr
tSCKf
SCK0, SCK1
tScyc
Figure 22.21 SCK Clock Input Timing
SCK0, SCK1
tTXD
TxD0, TxD1
(transmit data)
tRXS
tRXH
RxD0, RxD1
(receive data)
Figure 22.22 SCI Input/Output Timing (Synchronous Mode)
ø
tTRGS
ADTRG
Figure 22.23 A/D Converter External Trigger Input Timing
606
Table 22.9 I2C Bus Timing
Conditions: VCC = 2.7 V to 5.5 V, VSS = 0 V, ø = 5 MHz to maximum operating frequency,
Ta = –20 to +75°C
Item
Symbol
Min
Typ
Max
Unit
SCL clock cycle
time
t SCL
12
—
—
t cyc
SCL clock high
pulse width
t SCLH
3
—
—
t cyc
SCL clock low
pulse width
t SCLL
5
—
—
t cyc
SCL, SDA input
rise time
t Sr
—
—
7.5 *
t cyc
SCL, SDA input
fall time
t Sf
—
—
300
ns
SCL, SDA input
spike pulse
elimination time
t SP
—
—
1
t cyc
SDA input bus
free time
t BUF
5
—
—
t cyc
Start condition
input hold time
t STAH
3
—
—
t cyc
Retransmission
start condition
input setup time
t STAS
3
—
—
t cyc
Stop condition
input setup time
t STOS
3
—
—
t cyc
Data input setup
time
t SDAS
0.5
—
—
t cyc
Data input hold
time
t SDAH
0
—
—
ns
SCL, SDA
capacitive load
Cb
—
—
400
pF
Test Conditions Notes
Figure 22.24
Note: * 17.5tcyc can be set according to the clock selected for use by the I 2C module. For details,
see section 16.4, Usage Notes.
607
VIH
SDA0,
SDA1
VIL
tBUF
tSTAH
tSCLH
tSTAS
tSP tSTOS
SCL0,
SCL1
P*
S*
tSf
Sr*
tSCLL
tSDAS
tSr
tSCL
P*
tSDAH
Note: * S, P, and Sr indicate the following conditions.
S: Start condition
P: Stop condition
Sr: Retransmission start condition
Figure 22.24 I2C Bus Interface Input/Output Timing (Option)
608
22.4
A/D Conversion Characteristics
Tables 22.10 and 22.11 list the A/D conversion characteristics.
Table 22.10 A/D Conversion Characteristics
(AN7 to AN0 Input: 134/266-State Conversion)
Condition A: VCC = 5.0 V ± 10%, AVCC = 5.0 V ± 10%
VSS = AVSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition B: VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V
VSS = AVSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition C: VCC = 2.7 V to 5.5 V*5, AVCC = 2.7 V to 5.5 V*5
VSS = AVSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C
Condition A
Condition B
Condition C
20 MHz
16 MHz
10 MHz
Item
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
Resolution
10
10
10
10
10
10
10
10
10
Bits
Conversion time*
—
—
6.7
—
—
8.4
—
—
13.4
µs
Analog input
capacitance
—
—
20
—
—
20
—
—
20
pF
Permissible signalsource
impedance
—
—
10* 3
—
—
10* 3
—
—
10*1
kΩ
Nonlinearity error
—
—
±3.0
—
—
±3.0
—
—
±7.0
LSB
Offset error
—
—
±3.5
—
—
±3.5
—
—
±7.5
LSB
Full-scale error
—
—
±3.5
—
—
±3.5
—
—
±7.5
LSB
Quantization error
—
—
±0.5
—
—
±0.5
—
—
±0.5
LSB
Absolute accuracy
—
—
±4.0
—
—
±4.0
—
—
±8.0
LSB
6
Notes: 1.
2.
3.
4.
5.
6.
5*4
5*4
5*2
When 4.0 V ≤ AVCC ≤ 5.5 V
When 2.7 V ≤ AVCC < 4.0 V
When conversion time ≥ 11. 17 µs (CKS = 1 and ø ≤ 12 MHz, or CKS = 0)
When conversion time < 11. 17 µs (CKS = 1 and ø > 12 MHz)
For the low-voltage F-ZTAT version, V CC = 3.0 V to 5.5 V and AVCC = 3.0 V to 5.5 V.
At the maximum operating frequency in single mode
609
Table 22.11 A/D Conversion Characteristics
(CIN7 to CIN0 Input: 134/266-State Conversion)
Condition A: VCC = 5.0 V ± 10%, AVCC = 5.0 V ± 10%
VSS = AVSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition B: VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V
VSS = AVSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition C: VCC = 2.7 V to 5.5 V*5, AVCC = 2.7 V to 5.5 V*5
VSS = AVSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C
Condition A
Condition B
Condition C
20 MHz
16 MHz
10 MHz
Item
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
Resolution
10
10
10
10
10
10
10
10
10
Bits
Conversion time*
—
—
6.7
—
—
8.4
—
—
13.4
µs
Analog input
capacitance
—
—
20
—
—
20
—
—
20
pF
Permissible signalsource
impedance
—
—
10* 3
—
—
10* 3
—
—
10*1
kΩ
Nonlinearity error
—
—
±5.0
—
—
±5.0
—
—
±11.0
LSB
Offset error
—
—
±5.5
—
—
±5.5
—
—
±11.5
LSB
Full-scale error
—
—
±5.5
—
—
±5.5
—
—
±11.5
LSB
Quantization error
—
—
±0.5
—
—
±0.5
—
—
±0.5
LSB
Absolute accuracy
—
—
±6.0
—
—
±6.0
—
—
±12.0
LSB
6
Notes: 1.
2.
3.
4.
5.
6.
610
5*4
5*4
5*2
When 4.0 V ≤ AVCC ≤ 5.5 V
When 2.7 V ≤ AVCC < 4.0 V
When conversion time ≥ 11. 17 µs (CKS = 1 and ø ≤ 12 MHz, or CKS = 0)
When conversion time < 11. 17 µs (CKS = 1 and ø > 12 MHz)
For the low-voltage F-ZTAT version, V CC = 3.0 V to 5.5 V and AVCC = 3.0 V to 5.5 V.
At the maximum operating frequency in single mode
22.5
Flash Memory Characteristics
Table 22.12 shows the flash memory characteristics.
Table 22.12 Flash Memory Characteristics
Conditions (5 V version): VCC = 5.0 V ± 10%, VSS = 0 V, Ta = 0 to +75°C (regular specifications),
Ta = 0 to +85°C (wide-range specifications)
Conditions for low-voltage version:VCC = 3.0 V to 3.6 V, V SS = 0 V, Ta = 0 to +75°C
(Programming/erasing operating temperature)
Item
Symbol
Min
Typ
Max
Unit
Programming time*1,* 2,* 4
tP
—
10
200
ms/
32 bytes
Erase time* 1,* 3,* 5
tE
—
100
1200
ms/
block
Reprogramming count
NWEC
—
—
100
Times
Programming Wait time after
SWE-bit setting* 1
x
10
—
—
µs
Wait time after
PSU-bit setting* 1
y
50
—
—
µs
Wait time after
P-bit setting* 1, * 4
z
150
—
200
µs
Wait time after
P-bit clear*1
α
10
—
—
µs
Wait time after
PSU-bit clear* 1
β
10
—
—
µs
Wait time after
PV-bit setting* 1
γ
4
—
—
µs
Wait time after
dummy write* 1
ε
2
—
—
µs
Wait time after
PV-bit clear* 1
η
4
—
—
µs
Maximum
programming
count* 1,* 4,* 5
N
—
—
1000
Times
Test
Condition
z = 200 µs
611
Item
Erase
Symbol
Min
Typ
Max
Unit
Wait time after
SWE-bit setting* 1
x
10
—
—
µs
Wait time after
ESU-bit setting* 1
y
200
—
—
µs
Wait time after
E-bit setting* 1,* 6
z
5
—
10
ms
Wait time after
E-bit clear*1
α
10
—
—
µs
Wait time after
ESU-bit clear* 1
β
10
—
—
µs
Wait time after
EV-bit setting* 1
γ
20
—
—
µs
Wait time after
dummy write* 1
ε
2
—
—
µs
Wait time after
EV-bit clear* 1
η
5
—
—
µs
Maximum erase
count* 1,* 6,*7
N
—
—
120
Times
Test
Condition
z = 10 ms
Notes: 1. Set the times according to the program/erase algorithms.
2. Programming time per 32 bytes (Shows the total period for which the P-bit in the flash
memory control register (FLMCR1) is set. It does not include the programming
verification time.)
3. Block erase time (Shows the total period for which the E-bit in FLMCR1 is set. It does
not include the erase verification time.)
4. Maximum programming time (tP (max) = wait time after P-bit setting (z) × maximum
programming count (N))
5. Number of times when the wait time after P-bit setting (z) = 200 µs.
The number of writes should be set according to the actual set value of z to allow
programming within the maximum programming time (tP).
6. Maximum erase time (tE (max) = Wait time after E-bit setting (z) × maximum erase
count (N))
7. Number of times when the wait time after E-bit setting (z) = 10 ms.
The number of erases should be set according to the actual set value of z to allow
erasing within the maximum erase time (tE).
612
22.6
Usage Note
The F-ZTAT and mask ROM versions have been confirmed as fully meeting the reference values
for electrical characteristics shown in this manual. However, actual performance figures, operating
margins, noise margins, and other properties may vary due to differences in the manufacturing
process, on-chip ROM, layout patterns, etc.
When system evaluation testing is carried out using the F-ZTAT version, the same evaluation tests
should also be conducted for the mask ROM version when changing over to that version.
613
614
Section 23 Electrical Characteristics [H8S/2124 Series]
23.1
Absolute Maximum Ratings
Table 23.1 lists the absolute maximum ratings.
Table 23.1 Absolute Maximum Ratings
Item
Symbol
Value
Unit
Power supply voltage
VCC
–0.3 to +7.0
V
Input voltage (except ports 6,
and 7)
Vin
–0.3 to VCC +0.3
V
Input voltage (CIN input not
selected for port 6)
Vin
–0.3 to VCC +0.3
V
Input voltage (CIN input selected
for port 6)
Vin
Lower voltage of –0.3 to V CC +0.3 and
AVCC +0.3
V
Input voltage (port 7)
Vin
–0.3 to AVCC + 0.3
V
Analog power supply voltage
AVCC
–0.3 to +7.0
V
Analog input voltage
VAN
–0.3 to AVCC +0.3
V
Operating temperature
Topr
Regular specifications: –20 to +75
°C
Wide-range specifications: –40 to +85
°C
–55 to +125
°C
Storage temperature
Tstg
Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded.
615
23.2
DC Characteristics
Table 23.2 lists the DC characteristics. Table 23.3 lists the permissible output currents.
Table 23.2 DC Characteristics (1)
Conditions: VCC = 5.0 V ± 10%, AVCC*1 = 5.0 V ± 10%, VSS = AVSS*1 = 0 V,
Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Item
Symbol
Min
Typ
Max
Unit
1.0
—
—
V
—
—
VCC × 0.7 V
0.4
—
—
V
VCC – 0.7 —
VCC +0.3
V
EXTAL
VCC × 0.7 —
VCC +0.3
V
Port 7
2.0
—
AVCC +0.3 V
Input pins
except (1) and
(2) above
2.0
—
VCC +0.3
V
–0.3
—
0.5
V
–0.3
—
0.8
V
VCC – 0.5 —
—
V
I OH = –200 µA
3.5
—
—
V
I OH = –1 mA
—
—
0.4
V
I OL = 1.6 mA
—
—
1.0
V
I OL = 10 mA
—
—
10.0
µA
Vin = 0.5 to
VCC – 0.5 V
STBY, NMI, MD1,
MD0
—
—
1.0
µA
Port 7
—
—
1.0
µA
2,
Schmitt
P67 to P60* * , (1)
trigger input IRQ2 to IRQ0* 3
voltage
VT
–
VT
+
RES, STBY,
(2)
NMI, MD1, MD0
VIH
Input high
voltage
Input low
voltage
4
RES, STBY,
MD1, MD0
(3)
+
VT – VT
VIL
NMI, EXTAL,
input pins except
(1) and (3)
above
Output high All output pins
VOH
voltage
Output low
voltage
All output pins
Input
leakage
current
RES
616
VOL
Ports 1 to 3
Iin
–
Test Conditions
Vin = 0.5 to
AVCC – 0.5 V
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Three-state Ports 1 to 6
leakage
current
(off state)
ITSI
—
—
1.0
µA
Vin = 0.5 to
VCC – 0.5 V
–I P
50
—
300
µA
Vin = 0 V
Cin
—
—
80
pF
NMI
—
—
50
pF
Vin = 0 V
f = 1 MHz
Ta = 25°C
P52, P47,
P24, P23
—
—
20
pF
Input pins
except (4) above
—
—
15
pF
—
70
90
mA
f = 20 MHz
—
55
75
mA
f = 20 MHz
—
0.01
5.0
µA
Ta ≤ 50°C
—
—
20.0
µA
50°C < Ta
—
1.5
3.0
mA
—
0.01
5.0
µA
AVCC =
2.0 V to 5.5 V
4.5
—
5.5
V
Operating
2.0
—
5.5
V
Idle/not used
2.0
—
—
V
Input
pull-up
MOS
current
Ports 1 to 3
Input
RES
capacitance
(4)
Current
Normal operation
dissipation* 5 Sleep mode
Standby mode*
Analog
power
supply
current
I CC
6
During A/D
conversion
AlCC
Idle
Analog power supply voltage* 1
RAM standby voltage
AVCC
VRAM
Notes: 1. Do not leave the AVCC, and AVSS pins open even if the A/D converter is not used.
Even if the A/D converter is not used, apply a value in the range 2.0 V to 5.5 V to AVCC
by connection to the power supply (V CC), or some other method.
2. P67 to P60 include supporting module inputs multiplexed on those pins.
3. IRQ2 includes the ADTRG signal multiplexed on that pin.
4. The upper limit of the port 6 applied voltage is V CC + 0.3 V when CIN input is not
selected, and the lower of VCC + 0.3 V and AVCC + 0.3 V when CIN input is selected.
When a pin is in output mode, the output voltage is equivalent to the applied voltage.
5. Current dissipation values are for V IH min = VCC – 0.5 V and VIL max = 0.5 V with all
output pins unloaded and the on-chip pull-up MOSs in the off state.
6. The values are for VRAM ≤ VCC < 4.5 V, VIH min = VCC × 0.9, and V IL max = 0.3 V.
617
Table 23.2 DC Characteristics (2)
Conditions: VCC = 4.0 V to 5.5 V, AVCC*1 = 4.0 V to 5.5 V, VSS = AVSS*1 = 0 V,
Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
1.0
—
—
V
—
—
VCC × 0.7 V
VCC =
4.5 V to 5.5 V
0.4
—
—
V
0.8
—
—
V
—
—
VCC × 0.7 V
0.3
—
—
VCC – 0.7
—
VCC +0.3 V
EXTAL
VCC × 0.7 —
VCC +0.3 V
Port 7
2.0
—
AVCC +0.3 V
Input pins
except (1) and
(2) above
2.0
—
VCC +0.3 V
–0.3
—
0.5
V
–0.3
—
0.8
V
2,
4
Schmitt
P67 to P60* * , (1)
trigger input IRQ2 to IRQ0* 3
voltage
VT
–
VT
+
+
VT – VT
VT
–
VT
+
+
VT – VT
Input high
voltage
Input low
voltage
RES, STBY,
(2)
NMI, MD1, MD0
RES, STBY,
MD1, MD0
(3)
VIH
VIL
NMI, EXTAL,
input pins except
(1) and (3) above
Output high All output pins
VOH
–
VCC < 4.5 V
V
VCC – 0.5
—
—
V
I OH = –200 µA
3.5
—
—
V
I OH = –1 mA,
VCC=
4.5 V to 5.5 V
3.0
—
—
V
I OH = –1 mA,
VCC < 4.5 V
—
—
0.4
V
I OL = 1.6 mA
—
—
1.0
V
I OL = 10 mA
—
—
10.0
µA
STBY, NMI, MD1,
MD0
—
—
1.0
µA
Vin = 0.5 to
VCC – 0.5 V
Port 7
—
—
1.0
µA
voltage
Output low
voltage
All output pins
Input
leakage
current
RES
618
–
VOL
Ports 1 to 3
Iin
Vin = 0.5 to
AVCC – 0.5 V
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Three-state Ports 1 to 6
leakage
current
(off state)
ITSI
—
—
1.0
µA
Vin = 0.5 to
VCC – 0.5 V
Input
pull-up
MOS
current
–I P
50
—
300
µA
Vin = 0 V,
VCC = 4.5 V to
5.5 V
30
—
200
µA
Vin = 0 V,
VCC < 4.5 V
—
—
80
pF
NMI
—
—
50
pF
Vin = 0 V,
f = 1 MHz,
Ta = 25°C
P52, P47,
P24, P23
—
—
20
pF
Input pins
except (4) above
—
—
15
pF
—
55
75
mA
f = 16 MHz
—
42
62
mA
f = 16 MHz
—
0.01
5.0
µA
Ta ≤ 50°C
—
—
20.0
µA
50°C < Ta
—
1.5
3.0
mA
—
0.01
5.0
µA
AVCC =
2.0 V to 5.5 V
4.0
—
5.5
V
Operating
2.0
—
5.5
V
Idle/not used
2.0
—
—
V
Ports 1 to 3
Input
RES
capacitance
(4)
Current
Normal operation
dissipation* 5 Sleep mode
Standby mode*
Analog
power
supply
current
Cin
I CC
6
During A/D
conversion
AlCC
Idle
Analog power supply voltage* 1
RAM standby voltage
AVCC
VRAM
Notes: 1. Do not leave the AVCC, and AVSS pins open even if the A/D converter is not used.
Even if the A/D converter is not used, apply a value in the range 2.0 V to 5.5 V to AVCC
by connection to the power supply (V CC), or some other method.
2. P67 to P60 include supporting module inputs multiplexed on those pins.
3. IRQ2 includes the ADTRG signal multiplexed on that pin.
4. The upper limit of the port 6 applied voltage is V CC + 0.3 V when CIN input is not
selected, and the lower of VCC + 0.3 V and AVCC + 0.3 V when CIN input is selected.
When a pin is in output mode, the output voltage is equivalent to the applied voltage.
5. Current dissipation values are for V IH min = VCC – 0.5 V and VIL max = 0.5 V with all
output pins unloaded and the on-chip pull-up MOSs in the off state.
6. The values are for VRAM ≤ VCC < 4.0 V, VIH min = VCC × 0.9, and V IL max = 0.3 V.
619
Table 23.2 DC Characteristics (3)
Conditions : VCC = 2.7 V to 5.5 V, AVCC*1 = 2.7 V to 5.5 V,
VSS = AVSS*1 = 0 V, Ta = –20 to +75°C
Item
Symbol
2,
Schmitt
P67 to P60* * , (1)
trigger input IRQ2 to IRQ0* 3
voltage
VT
–
VT
+
RES, STBY,
(2)
NMI, MD1, MD0
VIH
Input high
voltage
Input low
voltage
4
Typ
Max
Unit
VCC × 0.2 —
—
V
—
VCC × 0.7 V
—
Test Conditions
VCC × 0.05 —
—
VCC × 0.9 —
VCC +0.3 V
EXTAL
VCC × 0.7 —
VCC +0.3 V
Port 7
VCC × 0.7 —
AVCC +0.3 V
Input pins
except (1) and
(2) above
VCC × 0.7 —
VCC +0.3 V
–0.3
—
VCC × 0.1 V
–0.3
—
VCC × 0.2 V
VCC < 4.0 V
0.8
V
VCC =
4.0 V to 5.5 V
RES, STBY,
MD1, MD0
(3)
+
VT – VT
VIL
NMI, EXTAL,
input pins except
(1) and (3)
above
Output high All output pins
voltage
VOH
Output low
voltage
All output pins
VOL
Input
leakage
current
RES
620
Min
–
V
VCC – 0.5
—
—
V
I OH = –200 µA
VCC – 1.0
—
—
V
I OH = –1 mA
(VCC < 4.0 V)
—
—
0.4
V
I OL = 1.6 mA
—
—
1.0
V
I OL = 5 mA
(VCC < 4.0 V),
I OL = 10 mA
(4.0 V ≤ VCC ≤
5.5 V)
—
—
10.0
µA
STBY, NMI, MD1,
MD0
—
—
1.0
µA
Vin = 0.5 to
VCC – 0.5 V
Port 7
—
—
1.0
µA
Ports 1 to 3
Iin
Vin = 0.5 to
AVCC – 0.5 V
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Three-state Ports 1 to 6
leakage
current
(off state)
ITSI
—
—
1.0
µA
Vin = 0.5 to
VCC – 0.5 V
–I P
10
—
150
µA
Vin = 0 V,
VCC = 2.7 V to
3.6 V
Cin
—
—
80
pF
NMI
—
—
50
pF
Vin = 0 V,
f = 1 MHz,
Ta = 25°C
P52, P47,
P24, P23
—
—
20
pF
Input pins
except (4) above
—
—
15
pF
—
40
52
mA
f = 10 MHz
—
30
42
mA
f = 10 MHz
—
0.01
5.0
µA
Ta ≤ 50°C
—
—
20.0
µA
50°C < Ta
—
1.5
3.0
mA
—
0.01
5.0
µA
AVCC =
2.0 V to 5.5 V
2.7
—
5.5
V
Operating
2.0
—
5.5
V
Idle/not used
2.0
—
—
V
Input
pull-up
MOS
current
Ports 1 to 3
Input
RES
capacitance
(4)
Current
Normal operation
dissipation* 5 Sleep mode
Standby mode*
Analog
power
supply
current
I CC
6
During A/D
conversion
AlCC
Idle
Analog power supply voltage* 1
RAM standby voltage
AVCC
VRAM
Notes: 1. Do not leave the AVCC, and AVSS pins open even if the A/D converter is not used.
Even if the A/D converter is not used, apply a value in the range 2.0 V to 5.5 V to AVCC
by connection to the power supply (V CC), or some other method.
2. P67 to P60 include supporting module inputs multiplexed on those pins.
3. IRQ2 includes the ADTRG signal multiplexed on that pin.
4. The upper limit of the port 6 applied voltage is V CC + 0.3 V when CIN input is not
selected, and the lower of VCC + 0.3 V and AVCC + 0.3 V when CIN input is selected.
When a pin is in output mode, the output voltage is equivalent to the applied voltage.
5. Current dissipation values are for V IH min = VCC – 0.5 V and VIL max = 0.5 V with all
output pins unloaded and the on-chip pull-up MOSs in the off state.
6. The values are for VRAM ≤ VCC < 2.7 V, VIH min = VCC × 0.9, and V IL max = 0.3 V.
621
Table 23.3 Permissible Output Currents
Conditions: VCC = 4.0 to 5.5 V, VSS = 0 V, Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Item
Symbol Min
I OL
Typ
Max
Unit
—
—
10
mA
Permissible output
Ports 1, 2, 3
low current (per pin)
Other output pins
—
—
2
mA
Permissible output
low current (total)
Total of ports 1, 2, and 3 ∑ IOL
—
—
80
mA
Total of all output pins,
including the above
—
—
120
mA
Permissible output
high current (per pin)
All output pins
–I OH
—
—
2
mA
Permissible output
high current (total)
Total of all output pins
∑ –IOH
—
—
40
mA
Notes: 1. To protect chip reliability, do not exceed the output current values in table 23.3.
2. When driving a Darlington pair or LED, always insert a current-limiting resistor in the
output line, as show in figures 23.1 and 23.2.
Table 23.3 Permissible Output Currents (cont)
– Preliminary –
Conditions: VCC = 2.7 to 5.5 V, VSS = 0 V, Ta = –20 to +75°C
Item
Symbol Min
Permissible output
Ports 1, 2, 3
low current (per pin)
Other output pins
Permissible output
low current (total)
I OL
Typ
Max
Unit
—
—
2
mA
—
—
1
mA
Total of ports 1, 2, and 3 ∑ IOL
—
—
40
mA
Total of all output pins,
including the above
—
—
60
mA
Permissible output
high current (per pin)
All output pins
–I OH
—
—
2
mA
Permissible output
high current (total)
Total of all output pins
∑ –IOH
—
—
30
mA
Notes: 1. To protect chip reliability, do not exceed the output current values in table 23.3.
2. When driving a Darlington pair or LED, always insert a current-limiting resistor in the
output line, as show in figures 23.1 and 23.2.
622
H8S/2128 Series or
H8S/2124 Series
chip
2 kΩ
Port
Darlington pair
Figure 23.1 Darlington Pair Drive Circuit (Example)
H8S/2128 Series or
H8S/2124 Series
chip
600 Ω
Ports 1 to 3
LED
Figure 23.2 LED Drive Circuit (Example)
23.3
AC Characteristics
Figure 23.3 shows the test conditions for the AC characteristics.
VCC
RL
Chip output
pin
C
RH
C = 30 pF: All ports
RL = 2.4 kΩ
RH = 12 kΩ
I/O timing test levels
• Low level: 0.8 V
• High level: 2.0 V
Figure 23.3 Output Load Circuit
623
23.3.1
Clock Timing
Table 23.5 shows the clock timing. The clock timing specified here covers clock (ø) output and
clock pulse generator (crystal) and external clock input (EXTAL pin) oscillation settling times.
For details of external clock input (EXTAL pin and EXCL pin) timing, see section 20, Clock
Pulse Generator.
Table 23.5 Clock Timing
Condition A: VCC = 5.0 V ± 10%, VSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition B: VCC = 4.0 V to 5.5 V, VSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition C: VCC = 2.7 V to 5.5 V, VSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C
Condition A
Condition B
Condition C
20 MHz
16 MHz
10 MHz
Item
Symbol
Min
Max
Min
Max
Min
Max
Unit
Test
Conditions
Clock cycle time
t cyc
50
500
62.5
500
100
500
ns
Figure 23.4
Clock high pulse
width
t CH
17
—
20
—
30
—
ns
Figure 23.4
Clock low pulse
width
t CL
17
—
20
—
30
—
ns
Clock rise time
t Cr
—
8
—
10
—
20
ns
Clock fall time
t Cf
—
8
—
10
—
20
ns
Oscillation settling
time at reset
(crystal)
t OSC1
10
—
10
—
20
—
ms
Oscillation settling
time in software
standby (crystal)
t OSC2
8
—
8
—
8
—
ms
External clock
output stabilization
delay time
t DEXT
500
—
500
—
500
—
µs
624
Figure 23.5
Figure 23.6
tcyc
tCH
tCf
ø
tCL
tCr
Figure 23.4 System Clock Timing
EXTAL
tDEXT
tDEXT
VCC
STBY
tOSC1
tOSC1
RES
ø
Figure 23.5 Oscillation Settling Timing
ø
NMI
IRQi
(i = 0, 1, 2)
tOSC2
Figure 23.6 Oscillation Setting Timing (Exiting Software Standby Mode)
625
23.3.2
Control Signal Timing
Table 23.6 shows the control signal timing. The only external interrupts that can operate on the
subclock (ø = 32.768 kHz) are NMI and IRQ0, 1, and IRQ2.
Table 23.6 Control Signal Timing
Condition A: VCC = 5.0 V ± 10%, VSS = 0 V, ø = 32.768 kHz, 2 MHz to maximum operating
frequency, Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition B: VCC = 4.0 V to 5.5 V, VSS = 0 V, ø = 32.768 kHz, 2 MHz to maximum operating
frequency, Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition C: VCC = 2.7 V to 5.5 V, VSS = 0 V, ø = 32.768 kHz, 2 MHz to maximum operating
frequency, Ta = –20 to +75°C
Condition A
Condition B
Condition C
20 MHz
16 MHz
10 MHz
Item
Symbol
Min
Max
Min
Max
Min
Max
Unit
Test
Conditions
RES setup time
t RESS
200
—
200
—
300
—
ns
Figure 23.7
RES pulse width
t RESW
20
—
20
—
20
—
t cyc
NMI setup time
(NMI)
t NMIS
150
—
150
—
250
—
ns
NMI hold time
(NMI)
t NMIH
10
—
10
—
10
—
ns
NMI pulse width
(exiting software
standby mode)
t NMIW
200
—
200
—
200
—
ns
IRQ setup time
(IRQ2 to IRQ0)
t IRQS
150
—
150
—
250
—
ns
IRQ hold time
(IRQ2 to IRQ0)
t IRQH
10
—
10
—
10
—
ns
IRQ pulse width
(IRQ2 to IRQ0)
(exiting software
standby mode)
t IRQW
200
—
200
—
200
—
ns
626
Figure 23.8
ø
tRESS
tRESS
RES
tRESW
Figure 23.7 Reset Input Timing
ø
tNMIH
tNMIS
NMI
tNMIW
IRQi
(i = 2 to 0)
tIRQW
tIRQS
tIRQH
IRQ
Edge input
tIRQS
IRQ
Level input
Figure 23.8 Interrupt Input Timing
627
23.3.3
Bus Timing
Table 23.7 shows the bus timing. Operation in external expansion mode is not guaranteed when
operating on the subclock (ø = 32.768 kHz).
Table 23.7 Bus Timing
Condition A: VCC = 5.0 V ± 10%, VSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition B: VCC = 4.0 V to 5.5 V, VSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition C: VCC = 2.7 V to 5.5 V, VSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C
Condition A
Condition B
Condition C
20 MHz
16 MHz
10 MHz
Item
Symbol Min
Max
Min
Max
Min
Max
Test
Unit Conditions
Address
delay time
t AD
—
20
—
30
—
40
ns
Address
setup time
t AS
0.5 ×
—
t cyc – 15
0.5 ×
—
t cyc – 20
0.5 ×
—
t cyc – 30
ns
Address
hold time
t AH
0.5 ×
—
t cyc – 10
0.5 ×
—
t cyc – 15
0.5 ×
—
t cyc – 20
ns
CS delay
time (IOS)
t CSD
—
20
—
30
—
40
ns
AS delay
time
t ASD
—
30
—
45
—
60
ns
RD delay
time 1
t RSD1
—
30
—
45
—
60
ns
RD delay
time 2
t RSD2
—
30
—
45
—
60
ns
Read data
setup time
t RDS
15
—
20
—
35
—
ns
Read data
hold time
t RDH
0
—
0
—
0
—
ns
Read data
t ACC1
access time 1
—
1.0 ×
t cyc – 30
—
1.0 ×
t cyc – 40
—
1.0 ×
t cyc – 60
ns
Read data
t ACC2
access time 2
—
1.5 ×
t cyc – 25
—
1.5 ×
t cyc – 35
—
1.5 ×
t cyc – 50
ns
628
Figure 23.9
to
figure 23.13
Item
Condition A
Condition B
Condition C
20 MHz
16 MHz
10 MHz
Symbol Min
Max
Min
Max
Min
Max
Test
Unit Conditions
Read data
t ACC3
access time 3
—
2.0 ×
t cyc – 30
—
2.0 ×
t cyc – 40
—
2.0 ×
t cyc – 60
ns
Read data
t ACC4
access time 4
—
2.5 ×
t cyc – 25
—
2.5 ×
t cyc – 35
—
2.5 ×
t cyc – 50
ns
Read data
t ACC5
access time 5
—
3.0 ×
t cyc – 30
—
3.0 ×
t cyc – 40
—
3.0 ×
t cyc – 60
ns
WR delay
time 1
t WRD1
—
30
—
45
—
60
ns
WR delay
time 2
t WRD2
—
30
—
45
—
60
ns
WR pulse
width 1
t WSW1
1.0 ×
—
t cyc – 20
1.0 ×
—
t cyc – 30
1.0×
—
t cyc – 40
ns
WR pulse
width 2
t WSW2
1.5 ×
—
t cyc – 20
1.5 ×
—
t cyc – 30
1.5 ×
—
t cyc – 40
ns
Write data
delay time
t WDD
—
30
—
45
—
60
ns
Write data
setup time
t WDS
0
—
0
—
0
—
ns
Write data
hold time
t WDH
10
—
15
—
20
—
ns
WAIT setup
time
t WTS
30
—
45
—
60
—
ns
WAIT hold
time
t WTH
5
—
5
—
10
—
ns
Figure 23.9
to
figure 23.13
629
T1
T2
ø
tAD
A15 to A0,
IOS*
tCSD
tAS
tAH
tASD
tASD
AS*
tRSD1
RD
(read)
tACC2
tRSD2
tAS
tACC3
tRDS
tRDH
D7 to D0
(read)
tWRD2
WR
(write)
tWRD2
tAH
tAS
tWDD
tWSW1
tWDH
D7 to D0
(write)
Note: * AS and IOS are the same pin. The function is selected by the IOSE bit in SYSCR.
Figure 23.9 Basic Bus Timing (Two-State Access)
630
T1
T2
T3
ø
tAD
A15 to A0,
IOS*
tCSD
tAS
tASD
tASD
tAH
AS*
tRSD1
RD
(read)
tACC4
tRSD2
tAS
tRDS
tACC5
tRDH
D7 to D0
(read)
tWRD1
tWRD2
WR
(write)
tAH
tWDD tWDS
tWSW2
tWDH
D7 to D0
(write)
Note: * AS and IOS are the same pin. The function is selected by the IOSE bit in SYSCR.
Figure 23.10 Basic Bus Timing (Three-State Access)
631
T1
T2
TW
T3
ø
A15 to A0,
IOS*
AS*
RD
(read)
D7 to D0
(read)
WR
(write)
D7 to D0
(write)
tWTS tWTH
tWTS tWTH
WAIT
Note: * AS and IOS are the same pin. The function is selected by the IOSE bit in SYSCR.
Figure 23.11 Basic Bus Timing (Three-State Access with One Wait State)
632
T1
T2 or T3
T1
T2
ø
tAD
A15 to A0,
IOS*
tAS
tASD
tAH
tASD
AS*
tRSD2
RD
(read)
tACC3
tRDS tRDH
D7 to D0
(read)
Note: * AS and IOS are the same pin. The function is selected by the IOSE bit in SYSCR.
Figure 23.12 Burst ROM Access Timing (Two-State Access)
633
T1
T2 or T3
T1
ø
tAD
A15 to A0,
IOS*
AS*
tRSD2
RD
(read)
tACC1
tRDS
tRDH
D7 to D0
(read)
Note: * AS and IOS are the same pin. The function is selected by the IOSE bit in SYSCR.
Figure 23.13 Burst ROM Access Timing (One-State Access)
634
23.3.4
Timing of On-Chip Supporting Modules
Tables 23.8 and 23.9 show the on-chip supporting module timing. The only on-chip supporting
modules that can operate in subclock operation (ø = 32.768 kHz) are the I/O ports, external
interrupts (NMI and IRQ0, 1, and IRQ2), the watchdog timer, and the 8-bit timer (channels 0 and
1).
Table 23.8 Timing of On-Chip Supporting Modules
Condition A: VCC = 5.0 V ± 10%, VSS = 0 V, ø = 32.768 kHz*, 2 MHz to maximum operating
frequency, Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition B: VCC = 4.0 V to 5.5 V, VSS = 0 V, ø = 32.768 kHz*, 2 MHz to maximum operating
frequency, Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition C: VCC = 2.7 V to 5.5 V, VSS = 0 V, ø = 32.768 kHz*, 2 MHz to maximum operating
frequency, Ta = –20 to +75°C
Condition A Condition B Condition C
20 MHz
Item
I/O
ports
FRT
Symbol Min
16 MHz
10 MHz
Max
Min
Max
Min
Max
Test
Unit Conditions
ns
Figure
23.14
ns
Figure
23.15
Output data delay t PWD
time
—
50
—
50
—
100
Input data setup
time
t PRS
30
—
30
—
50
—
Input data hold
time
t PRH
30
—
30
—
50
—
Timer output delay t FTOD
time
—
50
—
50
—
100
Timer input setup t FTIS
time
30
—
30
—
50
—
Timer clock input
setup time
t FTCS
30
—
30
—
50
—
Timer
clock
pulse
width
Single
edge
t FTCWH
1.5
—
1.5
—
1.5
—
Both
edges
t FTCWL
2.5
—
2.5
—
2.5
—
Figure
23.16
t cyc
635
Condition A Condition B Condition C
20 MHz
SCI
A/D
converter
10 MHz
Symbol Min
Max
Min
Max
Min
Max
Test
Unit Conditions
Timer output
delay time
t TMOD
—
50
—
50
—
100
ns
Timer reset input
setup time
t TMRS
30
—
30
—
50
—
Figure
23.19
Timer clock input
setup time
t TMCS
30
—
30
—
50
—
Figure
23.18
Timer
clock
pulse
width
Single
edge
t TMCWH
1.5
—
1.5
—
1.5
—
Both
edges
t TMCWL
2.5
—
2.5
—
2.5
—
Input
clock
cycle
Asynchro- t Scyc
nous
4
—
4
—
4
—
Synchronous
6
—
6
—
6
—
Item
TMR
16 MHz
636
t cyc
t cyc
Input clock pulse
width
t SCKW
0.4
0.6
0.4
0.6
0.4
0.6
t Scyc
Input clock rise
time
t SCKr
—
1.5
—
1.5
—
1.5
t cyc
Input clock fall
time
t SCKf
—
1.5
—
1.5
—
1.5
Transmit data
delay time
(synchronous)
t TXD
—
50
—
50
—
100
ns
Receive data setup t RXS
time (synchronous)
50
—
50
—
100
—
ns
Receive data hold t RXH
time (synchronous)
50
—
50
—
100
—
ns
Trigger input setup t TRGS
time
30
—
30
—
50
—
ns
Note: * Only supporting modules that can be used in subclock operation
Figure
23.17
Figure
23.20
Figure
23.21
Figure
23.22
T1
T2
ø
tPRS
tPRH
Ports 1 to 7
(read)
tPWD
Ports 1 to 6
(write)
Figure 23.14 I/O Port Input/Output Timing
ø
tFTOD
FTOA, FTOB
tFTIS
FTIA, FTIB,
FTIC, FTID
Figure 23.15 FRT Input/Output Timing
ø
tFTCS
FTCI
tFTCWL
tFTCWH
Figure 23.16 FRT Clock Input Timing
637
ø
tTMOD
TMO0, TMO1
Figure 23.17 8-Bit Timer Output Timing
ø
tTMCS
tTMCS
TMCI0, TMCI1,
TMIY
tTMCWL
tTMCWH
Figure 23.18 8-Bit Timer Clock Input Timing
ø
tTMRS
TMRI0, TMRI1,
TMIY
Figure 23.19 8-Bit Timer Reset Input Timing
tSCKW
tSCKr
tSCKf
SCK0, SCK1
tScyc
Figure 23.20 SCK Clock Input Timing
638
SCK0, SCK1
tTXD
TxD0, TxD1
(transmit data)
tRXS
tRXH
RxD0, RxD1
(receive data)
Figure 23.21 SCI Input/Output Timing (Synchronous Mode)
ø
tTRGS
ADTRG
Figure 23.22 A/D Converter External Trigger Input Timing
639
23.4
A/D Conversion Characteristics
Tables 23.9 and 23.10 list the A/D conversion characteristics.
Table 23.9 A/D Conversion Characteristics
(AN7 to AN0 Input: 134/266-State Conversion)
Condition A: VCC = 5.0 V ± 10%, AVCC = 5.0 V ± 10%
VSS = AVSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition B: VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V
VSS = AVSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition C: VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V
VSS = AVSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C
Condition A
Condition B
Condition C
20 MHz
16 MHz
10 MHz
Item
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
Resolution
10
10
10
10
10
10
10
10
10
Bits
Conversion time*
—
—
6.7
—
—
8.4
—
—
13.4
µs
Analog input
capacitance
—
—
20
—
—
20
—
—
20
pF
Permissible signalsource
impedance
—
—
10* 3
—
—
10* 3
—
—
10*1
kΩ
Nonlinearity error
—
—
±3.0
—
—
±3.0
—
—
±7.0
LSB
Offset error
—
—
±3.5
—
—
±3.5
—
—
±7.5
LSB
Full-scale error
—
—
±3.5
—
—
±3.5
—
—
±7.5
LSB
Quantization error
—
—
±0.5
—
—
±0.5
—
—
±0.5
LSB
Absolute accuracy
—
—
±4.0
—
—
±4.0
—
—
±8.0
LSB
5
Notes: 1.
2.
3.
4.
5.
640
5*4
5*4
5*2
When 4.0 V ≤ AVCC ≤ 5.5 V
When 2.7 V ≤ AVCC < 4.0 V
When conversion time ≥ 11. 17 µs (CKS = 1 and ø ≤ 12 MHz, or CKS = 0)
When conversion time < 11. 17 µs (CKS = 1 and ø > 12 MHz)
At the maximum operating frequency in single mode
Table 23.10 A/D Conversion Characteristics
(CIN7 to CIN0 Input: 134/266-State Conversion)
Condition A: VCC = 5.0 V ± 10%, AVCC = 5.0 V ± 10%
VSS = AVSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition B: VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V
VSS = AVSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C (regular specifications),
Ta = –40 to +85°C (wide-range specifications)
Condition C: VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V
VSS = AVSS = 0 V, ø = 2 MHz to maximum operating frequency,
Ta = –20 to +75°C
Condition A
Condition B
Condition C
20 MHz
16 MHz
10 MHz
Item
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
Resolution
10
10
10
10
10
10
10
10
10
Bits
Conversion time*
—
—
6.7
—
—
8.4
—
—
13.4
µs
Analog input
capacitance
—
—
20
—
—
20
—
—
20
pF
Permissible signalsource
impedance
—
—
10* 3
—
—
10* 3
—
—
10*1
kΩ
Nonlinearity error
—
—
±5.0
—
—
±5.0
—
—
±11.0
LSB
Offset error
—
—
±5.5
—
—
±5.5
—
—
±11.5
LSB
Full-scale error
—
—
±5.5
—
—
±5.5
—
—
±11.5
LSB
Quantization error
—
—
±0.5
—
—
±0.5
—
—
±0.5
LSB
Absolute accuracy
—
—
±6.0
—
—
±6.0
—
—
±12.0
LSB
5
Notes: 1.
2.
3.
4.
5.
5*4
5*4
5*2
When 4.0 V ≤ AVCC ≤ 5.5 V
When 2.7 V ≤ AVCC < 4.0 V
When conversion time ≥ 11. 17 µs (CKS = 1 and ø ≤ 12 MHz, or CKS = 0)
When conversion time < 11. 17 µs (CKS = 1 and ø > 12 MHz)
At the maximum operating frequency in single mode
641
23.5
Usage Note
The specifications of the H8S/2128 F-ZTAT version and H8S/2124 Series mask ROM version
differ in terms of on-chip module functions provided and port (P47, P52) output specifications.
Also, while the FZTAT and mask ROM versions both satisfy the electrical characteristics shown
in this manual, actual electrical characteristic values, operating margins, noise margins, and other
properties may vary due to differences in manufacturing process, on-chip ROM, layout patterns,
etc.
When system evaluation testing is carried out using the H8S/2128 F-ZTAT version, the above
differences must be taken into consideration in system design, and the same evaluation testing
should also be conducted for the mask ROM version when changing over to that version.
642
Appendix A Instruction Set
A.1
Instruction
Operation Notation
Rd
General register (destination)* 1
Rs
General register (source)* 1
Rn
General register* 1
ERn
General register (32-bit register)
MAC
Multiply-and-accumulate register (32-bit register)*2
(EAd)
Destination operand
(EAs)
Source operand
EXR
Extend register
CCR
Condition code register
N
N (negative) flag in CCR
Z
Z (zero) flag in CCR
V
V (overflow) flag in CCR
C
C (carry) flag in CCR
PC
Program counter
SP
Stack pointer
#IMM
Immediate data
disp
Displacement
+
Addition
–
Subtraction
×
Multiplication
÷
Division
∧
Logical AND
∨
Logical OR
⊕
Exclusive logical OR
→
Transfer from left-hand operand to right-hand operand, or transition from lefthand state to right-hand state
¬
NOT (logical complement)
( ) < >
Operand contents
:8/:16/:24/:32
8-, 16-, 24-, or 32-bit length
Notes: 1. General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0
to R7, E0 to E7), and 32-bit registers (ER0 to ER7).
2. MAC instructions cannot be used in the H8S/2128 Series and H8S/2124 Series.
643
Condition Code Notation
Symbol
Meaning
Changes according operation result.
*
Indeterminate (value not guaranteed).
0
Always cleared to 0.
1
Always set to 1.
—
Not affected by operation result.
644
Table A.1
Instruction Set
1. Data Transfer Instructions
B
MOV.B @ERs+,Rd
B
MOV.B @aa:8,Rd
B
MOV.B @aa:16,Rd
H N Z
V C
Advanced
MOV.B @(d:32,ERs),Rd
No. of
States*1
Normal
B
I
—
MOV.B @(d:16,ERs),Rd
@@aa
B
@(d,PC)
MOV.B @ERs,Rd
Condition Code
Operation
@aa
2
B
@-ERn/@ERn+
B
MOV.B Rs,Rd
@ERn
MOV.B #xx:8,Rd
Rn
#xx
MOV
Size
Mnemonic
@(d,ERn)
Addressing Mode and
Instruction Length (Bytes)
#xx:8→Rd8
— —
0 —
1
Rs8→Rd8
— —
0 —
1
@ERs→Rd8
— —
0 —
2
4
@(d:16,ERs)→Rd8
— —
0 —
3
8
@(d:32,ERs)→Rd8
— —
0 —
5
@ERs→Rd8,ERs32+1→ERs32
— —
0 —
3
2
@aa:8→Rd8
— —
0 —
2
B
4
@aa:16→Rd8
— —
0 —
3
MOV.B @aa:32,Rd
B
6
@aa:32→Rd8
— —
0 —
4
MOV.B Rs,@ERd
B
————
0 ——
2
MOV.B Rs,@(d:16,ERd)
B
4
Rs8→@(d:16,ERd)
— —
0 —
3
MOV.B Rs,@(d:32,ERd)
B
8
Rs8→@(d:32,ERd)
— —
0 —
5
MOV.B Rs,@-ERd
B
ERd32-1→ERd32,Rs8→@ERd
— —
0 —
3
MOV.B Rs,@aa:8
B
2
Rs8→@aa:8
— —
0 —
2
MOV.B Rs,@aa:16
B
4
Rs8→@aa:16
— —
0 —
3
MOV.B Rs,@aa:32
B
6
Rs8→@aa:32
— —
0 —
4
MOV.W #xx:16,Rd
W
#xx:16→Rd16
— —
0 —
2
MOV.W Rs,Rd
W
Rs16→Rd16
— —
0 —
1
MOV.W @ERs,Rd
W
@ERs→Rd16
— —
0 —
2
MOV.W @(d:16,ERs),Rd
W
4
@(d:16,ERs)→Rd16
— —
0 —
3
MOV.W @(d:32,ERs),Rd
W
8
@(d:32,ERs)→Rd16
— —
0 —
5
MOV.W @ERs+,Rd
W
@ERs→Rd16,ERs32+2→ERs32
— —
0 —
3
MOV.W @aa:16,Rd
W
4
@aa:16→Rd16
— —
0 —
3
MOV.W @aa:32,Rd
W
6
@aa:32→Rd16
— —
0 —
4
MOV.W Rs,@ERd
W
Rs16→@ERd
— —
0 —
2
MOV.W Rs,@(d:16,ERd)
W
4
Rs16→@(d:16,ERd)
— —
0 —
3
MOV.W Rs,@(d:32,ERd)
W
8
Rs16→@(d:32,ERd)
— —
0 —
5
MOV.W Rs,@-ERd
W
ERd32-2→ERd32,Rs16→@ERd
— —
0 —
3
MOV.W Rs,@aa:16
W
4
Rs16→@aa:16
— —
0 —
3
MOV.W Rs,@aa:32
W
6
Rs16→@aa:32
— —
0 —
4
2
2
2
2
Rs8→@ERd
2
4
2
2
2
2
2
645
L
MOV.L @ERs+,ERd
L
MOV.L @aa:16,ERd
L
MOV.L @aa:32,ERd
L
MOV.L ERs,@ERd
L
MOV.L ERs,@(d:16,ERd)
L
MOV.L ERs,@(d:32,ERd)
L
MOV.L ERs,@-ERd
L
MOV.L ERs,@aa:16
L
MOV.L ERs,@aa:32
L
POP.W Rn
W
POP.L ERn
H N
Z
V C
Advanced
MOV.L @(d:32,ERs),ERd
No. of
States*1
Normal
L
I
—
MOV.L @(d:16,ERs),ERd
@@aa
L
@(d,PC)
MOV.L @ERs,ERd
Condition Code
Operation
@aa
6
L
@-ERn/@ERn+
L
MOV.L ERs,ERd
@ERn
MOV.L #xx:32,ERd
Rn
#xx
MOV
Size
Mnemonic
@(d,ERn)
Addressing Mode and
Instruction Length (Bytes)
#xx:32→Rd32
— —
0 —
3
ERs32→ERd32
— —
0 —
1
@ERs→ERd32
— —
0 —
4
6
@(d:16,ERs)→ERd32
— —
0 —
5
10
@(d:32,ERs)→ERd32
— —
0 —
7
@ERs→ERd32,ERs32+4→ERs32
— —
0 —
5
6
@aa:16→ERd32
— —
0 —
5
8
@aa:32→ERd32
— —
0 —
6
ERs32→@ERd
— —
0 —
4
6
ERs32→@(d:16,ERd)
— —
0 —
5
10
ERs32→@(d:32,ERd)
— —
0 —
7
ERd32-4→ERd32,ERs32→@ERd
— —
0 —
5
6
ERs32→@aa:16
— —
0 —
5
8
ERs32→@aa:32
— —
0 —
6
2 @SP→Rn16,SP+2→SP
— —
0 —
3
L
4 @SP→ERn32,SP+4→SP
— —
0 —
5
PUSH.W Rn
W
2 SP-2→SP,Rn16→@SP
— —
0 —
3
PUSH.L ERn
L
4 SP-4→SP,ERn32→@SP
— —
0 —
5
LDM*4
LDM @SP+,(ERm-ERn)
L
4 (@SP→ERn32,SP+4→SP)
— — — — — — 7/9/11 [1]
STM*4
STM (ERm-ERn),@-SP
L
4 (SP-4→SP,ERn32→@SP)
POP
PUSH
2
4
4
4
4
Repeated for each restored register.
— — — — — — 7/9/11 [1]
Repeated for each saved register.
MOVFPE MOVFPE @aa:16,Rd
MOVTPE MOVTPE Rs,@aa:16
646
Cannot be used with the H8S/2128 Series and H8S/2124 Series.
[2]
[2]
2. Arithmetic Instructions
L
ADD.L ERs,ERd
L
ADDX #xx:8,Rd
B
ADDX Rs,Rd
B
ADDS #1,ERd
H N
Z
V C
Advanced
ADD.L #xx:32,ERd
No. of
States*1
Normal
W
I
—
ADD.W Rs,Rd
@@aa
W
@(d,PC)
ADD.W #xx:16,Rd
Condition Code
Operation
@aa
2
B
@-ERn/@ERn+
B
ADD.B Rs,Rd
@ERn
ADD.B #xx:8,Rd
Rn
#xx
ADD
Size
Mnemonic
@(d,ERn)
Addressing Mode and
Instruction Length (Bytes)
Rd8+#xx:8→Rd8
—
1
Rd8+Rs8→Rd8
—
1
Rd16+#xx:16→Rd16
— [3]
2
Rd16+Rs16→Rd16
— [3]
1
ERd32+#xx:32→ERd32
— [4]
3
ERd32+ERs32→ERd32
— [4]
Rd8+#xx:8+C→Rd8
—
[5]
1
2
Rd8+Rs8+C→Rd8
—
[5]
1
L
2
ERd32+1→ERd32
— — — — — —
1
ADDS #2,ERd
L
2
ERd32+2→ERd32
— — — — — —
1
ADDS #4,ERd
L
2
ERd32+4→ERd32
— — — — — —
1
INC.B Rd
B
2
Rd8+1→Rd8
— —
—
1
INC.W #1,Rd
W
2
Rd16+1→Rd16
— —
—
1
INC.W #2,Rd
W
2
Rd16+2→Rd16
— —
—
1
INC.L #1,ERd
L
2
ERd32+1→ERd32
— —
—
1
INC.L #2,ERd
L
2
ERd32+2→ERd32
— —
—
1
DAA
DAA Rd
B
2
Rd8 decimal adjust →Rd8
— *
SUB
SUB.B Rs,Rd
B
2
Rd8-Rs8→Rd8
—
1
SUB.W #xx:16,Rd
W
Rd16-#xx:16→Rd16
— [3]
2
SUB.W Rs,Rd
W
Rd16-Rs16→Rd16
— [3]
1
SUB.L #xx:32,ERd
L
ERd32-#xx:32→ERd32
— [4]
3
SUB.L ERs,ERd
L
ERd32-ERs32→ERd32
— [4]
SUBX #xx:8,Rd
B
Rd8-#xx:8-C→Rd8
—
[5]
1
SUBX Rs,Rd
B
2
Rd8-Rs8-C→Rd8
—
[5]
1
SUBS #1,ERd
L
2
ERd32-1→ERd32
— — — — — —
1
SUBS #2,ERd
L
2
ERd32-2→ERd32
— — — — — —
1
SUBS #4,ERd
L
2
ERd32-4→ERd32
— — — — — —
1
DEC.B Rd
B
2
Rd8-1→Rd8
— —
—
1
DEC.W #1,Rd
W
2
Rd16-1→Rd16
— —
—
1
DEC.W #2,Rd
W
2
Rd16-2→Rd16
— —
—
1
DEC.L #1,ERd
L
2
ERd32-1→ERd32
— —
—
1
DEC.L #2,ERd
L
2
ERd32-2→ERd32
— —
—
1
ADDX
ADDS
INC
SUBX
SUBS
DEC
2
4
2
6
2
2
4
2
6
2
2
1
*
1
1
647
Condition Code
No. of
States*1
Z
V C
Advanced
H N
Normal
I
—
@@aa
@(d,PC)
Operation
@aa
@-ERn/@ERn+
@ERn
Rn
#xx
Size
Mnemonic
@(d,ERn)
Addressing Mode and
Instruction Length (Bytes)
DAS
DAS Rd
B
2
Rd8 decimal adjust →Rd8
— *
* —
1
MULXU
MULXU.B Rs,Rd
B
2
Rd8×Rs8→Rd16 (unsigned
multiplication)
— — — — — —
12
MULXU.W Rs,ERd
W
2
Rd16×Rs16→ERd32 (unsigned
multiplication)
— — — — — —
20
MULXS.B Rs,Rd
B
4
Rd8×Rs8→Rd16 (signed
multiplication)
— —
— —
13
MULXS.W Rs,ERd
W
4
Rd16×Rs16→ERd32 (signed
multiplication)
— —
— —
21
DIVXU.B Rs,Rd
B
2
Rd16÷Rs8→Rd16
(RdH: remainder, RdL: quotient)
(unsigned division)
— — [6] [7] — —
12
DIVXU.W Rs,ERd
W
2
ERd32÷Rs16→ERd32
(Ed: remainder, Rd: quotient)
(unsigned division)
— — [6] [7] — —
20
DIVXS.B Rs,Rd
B
4
Rd16÷Rs8→Rd16
(RdH: remainder, RdL: quotient)
(signed division)
— — [8] [7] — —
13
DIVXS.W Rs,ERd
W
4
ERd32÷Rs16→ERd32
(Ed: remainder, Rd: quotient)
(signed division)
— — [8] [7] — —
21
CMP.B #xx:8,Rd
B
Rd8-#xx:8
—
1
CMP.B Rs,Rd
B
Rd8-Rs8
—
1
CMP.W #xx:16,Rd
W
Rd16-#xx:16
— [3]
2
CMP.W Rs,Rd
W
Rd16-Rs16
— [3]
1
CMP.L #xx:32,ERd
L
ERd32-#xx:32
— [4]
3
CMP.L ERs,ERd
L
2
ERd32-ERs32
— [4]
1
NEG.B Rd
B
2
0-Rd8→Rd8
—
1
NEG.W Rd
W
2
0-Rd16→Rd16
—
1
NEG.L ERd
L
2
0-ERd32→ERd32
—
EXTU.W Rd
W
2
0 → (<bits 5 to 8> of Rd16)
— — 0
0 —
1
EXTU.L ERd
L
2
0 → (<bits 31 to 16> of ERd32)
— — 0
0 —
1
EXTS.W Rd
W
2
(<bit 7> of Rd16) →
(<bits 15 to 8> of Rd16)
— —
0 —
1
EXTS.L ERd
L
2
(<bit 15> of ERd32) →
(<bits 31 to 16> of ERd32)
— —
0 —
1
TAS @ERd*3
B
@ERd-0 → CCR set, (1) →
(<bit 7> of @ERd)
— —
0 —
4
MULXS
DIVXU
DIVXS
CMP
NEG
EXTU
EXTS
TAS
648
2
2
4
2
6
4
1
MAC
MAC @ERn+,@ERm+
Condition Code
No. of
States*1
Cannot be used with the H8S/2128 Series and H8S/2124 Series.
V C
Advanced
H N Z
Normal
I
—
@@aa
@(d,PC)
Operation
@aa
@-ERn/@ERn+
@ERn
Rn
#xx
Size
Mnemonic
@(d,ERn)
Addressing Mode and
Instruction Length (Bytes)
[2]
CLRMAC CLRMAC
LDMAC
LDMAC ERs,MACH
LDMAC ERs,MACL
STMAC
STMAC MACH,ERd
STMAC MACL,ERd
649
3. Logic Instructions
OR
XOR
NOT
650
L
AND.L ERs,ERd
L
OR.B #xx:8,Rd
B
OR.B Rs,Rd
B
OR.W #xx:16,Rd
W
OR.W Rs,Rd
W
OR.L #xx:32,ERd
L
OR.L ERs,ERd
L
XOR.B #xx:8,Rd
B
XOR.B Rs,Rd
B
XOR.W #xx:16,Rd
W
XOR.W Rs,Rd
W
XOR.L #xx:32,ERd
L
XOR.L ERs,ERd
L
NOT.B Rd
H N
Z
V C
Advanced
AND.L #xx:32,ERd
No. of
States*1
Normal
W
I
—
AND.W Rs,Rd
@@aa
W
@(d,PC)
AND.W #xx:16,Rd
Condition Code
Operation
@aa
2
B
@-ERn/@ERn+
B
AND.B Rs,Rd
@ERn
AND.B #xx:8,Rd
Rn
#xx
AND
Size
Mnemonic
@(d,ERn)
Addressing Mode and
Instruction Length (Bytes)
Rd8∧#xx:8→Rd8
— —
0 —
1
Rd8∧Rs8→Rd8
— —
0 —
1
Rd16∧#xx:16→Rd16
— —
0 —
2
Rd16∧Rs16→Rd16
— —
0 —
1
ERd32∧#xx:32→ERd32
— —
0 —
3
ERd32∧ERs32→ERd32
— —
0 —
2
Rd8∨#xx:8→Rd8
— —
0 —
1
Rd8∨Rs8→Rd8
— —
0 —
1
Rd16∨#xx:16→Rd16
— —
0 —
2
Rd16∨Rs16→Rd16
— —
0 —
1
ERd32∨#xx:32→ERd32
— —
0 —
3
ERd32∨ERs32→ERd32
— —
0 —
2
Rd8⊕#xx:8→Rd8
— —
0 —
1
Rd8⊕Rs8→Rd8
— —
0 —
1
Rd16⊕#xx:16→Rd16
— —
0 —
2
Rd16⊕Rs16→Rd16
— —
0 —
1
ERd32⊕#xx:32→ERd32
— —
0 —
3
4
ERd32⊕ERs32→ERd32
— —
0 —
2
B
2
¬ Rd8→Rd8
— —
0 —
1
NOT.W Rd
W
2
¬ Rd16→Rd16
— —
0 —
1
NOT.L ERd
L
2
¬ ERd32→ERd32
— —
0 —
1
2
4
2
6
4
2
2
4
2
6
4
2
2
4
2
6
4. Shift Instructions
SHAL
SHAR
SHLL
SHLR
ROTXL
Condition Code
No. of
States*1
Z
V C
Advanced
H N
Normal
I
—
@@aa
@(d,PC)
Operation
@aa
@-ERn/@ERn+
@ERn
Rn
#xx
Size
Mnemonic
@(d,ERn)
Addressing Mode and
Instruction Length (Bytes)
SHAL.B Rd
B
2
— —
1
SHAL.B #2,Rd
B
2
— —
1
SHAL.W Rd
W
2
0 — —
1
SHAL.W #2,Rd
W
2
— —
1
SHAL.L ERd
L
2
— —
1
SHAL.L #2,ERd
L
2
— —
SHAR.B Rd
B
2
— —
0
1
SHAR.B #2,Rd
B
2
— —
0
1
SHAR.W Rd
W
2
— —
0
1
SHAR.W #2,Rd
W
2
— —
0
1
SHAR.L ERd
L
2
— —
0
1
SHAR.L #2,ERd
L
2
— —
0
1
SHLL.B Rd
B
2
— —
0
1
SHLL.B #2,Rd
B
2
— —
0
1
SHLL.W Rd
W
2
0 — —
0
1
SHLL.W #2,Rd
W
2
— —
0
1
SHLL.L ERd
L
2
— —
0
1
SHLL.L #2,ERd
L
2
— —
0
1
SHLR.B Rd
B
2
— —
0
1
SHLR.B #2,Rd
B
2
— —
0
1
SHLR.W Rd
W
2
— —
0
1
SHLR.W #2,Rd
W
2
— —
0
1
SHLR.L ERd
L
2
— —
0
1
SHLR.L #2,ERd
L
2
— —
0
1
ROTXL.B Rd
B
2
— —
0
1
ROTXL.B #2,Rd
B
2
— —
0
1
ROTXL.W Rd
W
2
— —
0
1
ROTXL.W #2,Rd
W
2
— —
0
1
ROTXL.L ERd
L
2
— —
0
1
ROTXL.L #2,ERd
L
2
— —
0
1
C
MSB
MSB
C
MSB
LSB
LSB
C
LSB
0
MSB
C
MSB
LSB
LSB
C
1
651
ROTXR
ROTL
ROTR
Condition Code
Advanced
V C
Normal
H N Z
—
@@aa
@(d,PC)
I
ROTXR.B Rd
B
2
— —
0
1
ROTXR.B #2,Rd
B
2
— —
0
1
ROTXR.W Rd
W
2
— —
0
1
ROTXR.W #2,Rd
W
2
— —
0
1
ROTXR.L ERd
L
2
— —
0
1
ROTXR.L #2,ERd
L
2
— —
0
1
ROTL.B Rd
B
2
— —
0
1
ROTL.B #2,Rd
B
2
— —
0
1
ROTL.W Rd
W
2
— —
0
1
ROTL.W #2,Rd
W
2
— —
0
1
ROTL.L ERd
L
2
— —
0
1
ROTL.L #2,ERd
L
2
— —
0
1
ROTR.B Rd
B
2
— —
0
1
ROTR.B #2,Rd
B
2
— —
0
1
ROTR.W Rd
W
2
— —
0
1
ROTR.W #2,Rd
W
2
— —
0
1
ROTR.L ERd
L
2
— —
0
1
ROTR.L #2,ERd
L
2
— —
0
1
MSB
C
MSB
MSB
652
No. of
States*1
Operation
@aa
@-ERn/@ERn+
@ERn
Rn
#xx
Size
Mnemonic
@(d,ERn)
Addressing Mode and
Instruction Length (Bytes)
LSB
C
LSB
LSB
C
5. Bit Manipulation Instructions
BSET
BCLR
BNOT
Condition Code
No. of
States*1
Z
V C
Advanced
H N
Normal
I
—
@@aa
@(d,PC)
Operation
@aa
@-ERn/@ERn+
@ERn
Rn
#xx
Size
Mnemonic
@(d,ERn)
Addressing Mode and
Instruction Length (Bytes)
(#xx:3 of Rd8)←1
— — — — — —
1
(#xx:3 of @ERd)←1
— — — — — —
4
4
(#xx:3 of @aa:8)←1
— — — — — —
4
B
6
(#xx:3 of @aa:16)←1
— — — — — —
5
BSET #xx:3,@aa:32
B
8
(#xx:3 of @aa:32)←1
— — — — — —
6
BSET Rn,Rd
B
(Rn8 of Rd8)←1
— — — — — —
1
BSET Rn,@ERd
B
(Rn8 of @ERd)←1
— — — — — —
4
BSET Rn,@aa:8
B
4
(Rn8 of @aa:8)←1
— — — — — —
4
BSET Rn,@aa:16
B
6
(Rn8 of @aa:16)←1
— — — — — —
5
BSET Rn,@aa:32
B
8
(Rn8 of @aa:32)←1
— — — — — —
6
BCLR #xx:3,Rd
B
(#xx:3 of Rd8)←0
— — — — — —
1
BCLR #xx:3,@ERd
B
(#xx:3 of @ERd)←0
— — — — — —
4
BCLR #xx:3,@aa:8
B
4
(#xx:3 of @aa:8)←0
— — — — — —
4
BCLR #xx:3,@aa:16
B
6
(#xx:3 of @aa:16)←0
— — — — — —
5
BCLR #xx:3,@aa:32
B
8
(#xx:3 of @aa:32)←0
— — — — — —
6
BCLR Rn,Rd
B
(Rn8 of Rd8)←0
— — — — — —
1
BCLR Rn,@ERd
B
(Rn8 of @ERd)←0
— — — — — —
4
BCLR Rn,@aa:8
B
4
(Rn8 of @aa:8)←0
— — — — — —
4
BCLR Rn,@aa:16
B
6
(Rn8 of @aa:16)←0
— — — — — —
5
BCLR Rn,@aa:32
B
8
(Rn8 of @aa:32)←0
— — — — — —
6
BNOT #xx:3,Rd
B
(#xx:3 of Rd8)← [¬ (#xx:3 of Rd8)]
— — — — — —
1
BNOT #xx:3,@ERd
B
(#xx:3 of @ERd)← [¬ (#xx:3
of @ERd)]
— — — — — —
4
BNOT #xx:3,@aa:8
B
4
(#xx:3 of @aa:8)← [¬ (#xx:3
of @aa:8)]
— — — — — —
4
BNOT #xx:3,@aa:16
B
6
(#xx:3 of @aa:16)← [¬ (#xx:3
of @aa:16)]
— — — — — —
5
BNOT #xx:3,@aa:32
B
8
(#xx:3 of @aa:32)← [¬ (#xx:3
of @aa:32)]
— — — — — —
6
BNOT Rn,Rd
B
(Rn8 of Rd8)← [¬ (Rn8 of Rd8)]
BNOT Rn,@ERd
B
BNOT Rn,@aa:8
B
BNOT Rn,@aa:16
BNOT Rn,@aa:32
BSET #xx:3,Rd
B
BSET #xx:3,@ERd
B
BSET #xx:3,@aa:8
B
BSET #xx:3,@aa:16
2
4
2
4
2
4
2
4
2
4
— — — — — —
1
(Rn8 of @ERd)← [¬ (Rn8 of @ERd)] — — — — — —
4
4
(Rn8 of @aa:8)← [¬ (Rn8 of @aa:8)] — — — — — —
4
B
6
(Rn8 of @aa:16)← [¬ (Rn8
of @aa:16)]
— — — — — —
5
B
8
(Rn8 of @aa:32)← [¬ (Rn8
of @aa:32)]
— — — — — —
6
2
4
653
BTST
BLD
BILD
BST
BIST
654
Condition Code
No. of
States*1
V C
Advanced
H N Z
Normal
I
—
@@aa
@(d,PC)
Operation
@aa
@-ERn/@ERn+
@ERn
Rn
#xx
Size
Mnemonic
@(d,ERn)
Addressing Mode and
Instruction Length (Bytes)
¬ (#xx:3 of Rd8)→Z
— — —
— —
1
¬ (#xx:3 of @ERd)→Z
— — —
— —
3
4
¬ (#xx:3 of @aa:8)→Z
— — —
— —
3
B
6
¬ (#xx:3 of @aa:16)→Z
— — —
— —
4
BTST #xx:3,@aa:32
B
8
¬ (#xx:3 of @aa:32)→Z
— — —
— —
5
BTST Rn,Rd
B
¬ (Rn8 of Rd8)→Z
— — —
— —
1
BTST Rn,@ERd
B
¬ (Rn8 of @ERd)→Z
— — —
— —
3
BTST Rn,@aa:8
B
4
¬ (Rn8 of @aa:8)→Z
— — —
— —
3
BTST Rn,@aa:16
B
6
¬ (Rn8 of @aa:16)→Z
— — —
— —
4
BTST Rn,@aa:32
B
8
¬ (Rn8 of @aa:32)→Z
— — —
— —
5
BLD #xx:3,Rd
B
(#xx:3 of Rd8)→C
— — — — —
1
BLD #xx:3,@ERd
B
(#xx:3 of @ERd)→C
— — — — —
3
BLD #xx:3,@aa:8
B
4
(#xx:3 of @aa:8)→C
— — — — —
3
BLD #xx:3,@aa:16
B
6
(#xx:3 of @aa:16)→C
— — — — —
4
BLD #xx:3,@aa:32
B
8
(#xx:3 of @aa:32)→C
— — — — —
5
BILD #xx:3,Rd
B
¬ (#xx:3 of Rd8)→C
— — — — —
1
BILD #xx:3,@ERd
B
¬ (#xx:3 of @ERd)→C
— — — — —
3
BILD #xx:3,@aa:8
B
4
¬ (#xx:3 of @aa:8)→C
— — — — —
3
BILD #xx:3,@aa:16
B
6
¬ (#xx:3 of @aa:16)→C
— — — — —
4
BILD #xx:3,@aa:32
B
8
¬ (#xx:3 of @aa:32)→C
— — — — —
5
BST #xx:3,Rd
B
C→(#xx:3 of Rd8)
— — — — — —
1
BST #xx:3,@ERd
B
C→(#xx:3 of @ERd)
— — — — — —
4
BST #xx:3,@aa:8
B
4
C→(#xx:3 of @aa:8)
— — — — — —
4
BST #xx:3,@aa:16
B
6
C→(#xx:3 of @aa:16)
— — — — — —
5
BST #xx:3,@aa:32
B
8
C→(#xx:3 of @aa:32)
— — — — — —
6
BIST #xx:3,Rd
B
¬ C→(#xx:3 of Rd8)
— — — — — —
1
BIST #xx:3,@ERd
B
¬ C→(#xx:3 of @ERd)
— — — — — —
4
BIST #xx:3,@aa:8
B
4
¬ C→(#xx:3 of @aa:8)
— — — — — —
4
BIST #xx:3,@aa:16
B
6
¬ C→(#xx:3 of @aa:16)
— — — — — —
5
BIST #xx:3,@aa:32
B
8
¬ C→(#xx:3 of @aa:32)
— — — — — —
6
BTST #xx:3,Rd
B
BTST #xx:3,@ERd
B
BTST #xx:3,@aa:8
B
BTST #xx:3,@aa:16
2
4
2
4
2
4
2
4
2
4
2
4
BAND
BIAND
BOR
BIOR
BXOR
BIXOR
Condition Code
No. of
States*1
V C
Advanced
H N Z
Normal
I
—
@@aa
@(d,PC)
Operation
@aa
@-ERn/@ERn+
@ERn
Rn
#xx
Size
Mnemonic
@(d,ERn)
Addressing Mode and
Instruction Length (Bytes)
C∧ (#xx:3 of Rd8)→C
— — — — —
1
C∧ (#xx:3 of @ERd)→C
— — — — —
3
4
C∧ (#xx:3 of @aa:8)→C
— — — — —
3
B
6
C∧ (#xx:3 of @aa:16)→C
— — — — —
4
BAND #xx:3,@aa:32
B
8
C∧ (#xx:3 of @aa:32)→C
— — — — —
5
BIAND #xx:3,Rd
B
C∧ [¬ (#xx:3 of Rd8)]→C
— — — — —
1
BIAND #xx:3,@ERd
B
C∧ [¬ (#xx:3 of @ERd)]→C
— — — — —
3
BIAND #xx:3,@aa:8
B
4
C∧ [¬ (#xx:3 of @aa:8)]→C
— — — — —
3
BIAND #xx:3,@aa:16
B
6
C∧ [¬ (#xx:3 of @aa:16)]→C
— — — — —
4
BIAND #xx:3,@aa:32
B
8
C∧ [¬ (#xx:3 of @aa:32)]→C
— — — — —
5
BOR #xx:3,Rd
B
C∨ (#xx:3 of Rd8)→C
— — — — —
1
BOR #xx:3,@ERd
B
C∨ (#xx:3 of @ERd)→C
— — — — —
3
BOR #xx:3,@aa:8
B
4
C∨ (#xx:3 of @aa:8)→C
— — — — —
3
BOR #xx:3,@aa:16
B
6
C∨ (#xx:3 of @aa:16)→C
— — — — —
4
BOR #xx:3,@aa:32
B
8
C∨ (#xx:3 of @aa:32)→C
— — — — —
5
BIOR #xx:3,Rd
B
C∨ [¬ (#xx:3 of Rd8)]→C
— — — — —
1
BIOR #xx:3,@ERd
B
C∨ [¬ (#xx:3 of @ERd)]→C
— — — — —
3
BIOR #xx:3,@aa:8
B
4
C∨ [¬ (#xx:3 of @aa:8)]→C
— — — — —
3
BIOR #xx:3,@aa:16
B
6
C∨ [¬ (#xx:3 of @aa:16)]→C
— — — — —
4
BIOR #xx:3,@aa:32
B
8
C∨ [¬ (#xx:3 of @aa:32)]→C
— — — — —
5
BXOR #xx:3,Rd
B
C⊕ (#xx:3 of Rd8)→C
— — — — —
1
BXOR #xx:3,@ERd
B
C⊕ (#xx:3 of @ERd)→C
— — — — —
3
BXOR #xx:3,@aa:8
B
4
C⊕ (#xx:3 of @aa:8)→C
— — — — —
3
BXOR #xx:3,@aa:16
B
6
C⊕ (#xx:3 of @aa:16)→C
— — — — —
4
BXOR #xx:3,@aa:32
B
8
C⊕ (#xx:3 of @aa:32)→C
— — — — —
5
BIXOR #xx:3,Rd
B
C⊕ [¬ (#xx:3 of Rd8)]→C
— — — — —
1
BIXOR #xx:3,@ERd
B
C⊕ [¬ (#xx:3 of @ERd)]→C
— — — — —
3
BIXOR #xx:3,@aa:8
B
4
C⊕ [¬ (#xx:3 of @aa:8)]→C
— — — — —
3
BIXOR #xx:3,@aa:16
B
6
C⊕ [¬ (#xx:3 of @aa:16)]→C
— — — — —
4
BIXOR #xx:3,@aa:32
B
8
C⊕ [¬ (#xx:3 of @aa:32)]→C
— — — — —
5
BAND #xx:3,Rd
B
BAND #xx:3,@ERd
B
BAND #xx:3,@aa:8
B
BAND #xx:3,@aa:16
2
4
2
4
2
4
2
4
2
4
2
4
655
6. Branch Instructions
Bcc
656
—
2
—
4
BRN d:8(BF d:8)
—
2
BRN d:16(BF d:16)
—
4
BHI d:8
—
2
BHI d:16
—
4
BLS d:8
—
2
BLS d:16
—
4
BCC d:8(BHS d:8)
—
2
BCC d:16(BHS d:16)
—
4
BCS d:8(BLO d:8)
—
2
BCS d:16(BLO d:16)
—
4
BNE d:8
—
2
BNE d:16
—
4
BEQ d:8
—
2
BEQ d:16
—
4
BVC d:8
—
2
BVC d:16
—
4
BVS d:8
—
2
BVS d:16
—
4
BPL d:8
—
2
BPL d:16
—
4
BMI d:8
—
2
BMI d:16
—
4
BGE d:8
—
2
BGE d:16
—
4
BLT d:8
—
2
BLT d:16
—
BGT d:8
H N
Z
V C
— — — — — —
2
— — — — — —
3
— — — — — —
2
— — — — — —
3
— — — — — —
2
— — — — — —
3
— — — — — —
2
— — — — — —
3
— — — — — —
2
— — — — — —
3
— — — — — —
2
— — — — — —
3
— — — — — —
2
— — — — — —
3
— — — — — —
2
— — — — — —
3
— — — — — —
2
— — — — — —
3
— — — — — —
2
— — — — — —
3
— — — — — —
2
— — — — — —
3
— — — — — —
2
— — — — — —
3
— — — — — —
2
— — — — — —
3
— — — — — —
2
4
— — — — — —
3
—
2
Z∨(N⊕V)=0 — — — — — —
2
BGT d:16
—
4
— — — — — —
3
BLE d:8
—
2
Z∨(N⊕V)=1 — — — — — —
2
BLE d:16
—
4
— — — — — —
3
if condition is true then
PC←PC+d
else next;
Always
Advanced
I
—
@@aa
@(d,PC)
BRA d:8(BT d:8)
BRA d:16(BT d:16)
Branch
Condition
No. of
States*1
Normal
Condition Code
Operation
@aa
@-ERn/@ERn+
@ERn
Rn
#xx
Size
Mnemonic
@(d,ERn)
Addressing Mode and
Instruction Length (Bytes)
Never
C∨Z=0
C∨Z=1
C=0
C=1
Z=0
Z=1
V=0
V=1
N=0
N=1
N⊕V=0
N⊕V=1
JMP
BSR
JSR
RTS
JMP @ERn
—
JMP @aa:24
—
JMP @@aa:8
—
BSR d:8
—
BSR d:16
—
JSR @ERn
—
JSR @aa:24
—
JSR @@aa:8
—
RTS
—
Condition Code
No. of
States*1
2
V C
Advanced
H N Z
Normal
I
—
@@aa
@(d,PC)
Operation
@aa
@-ERn/@ERn+
@ERn
Rn
#xx
Size
Mnemonic
@(d,ERn)
Addressing Mode and
Instruction Length (Bytes)
PC←ERn
— — — — — —
PC←aa:24
— — — — — —
PC←@aa:8
— — — — — —
4
5
2
PC→@-SP,PC←PC+d:8
— — — — — —
3
4
4
PC→@-SP,PC←PC+d:16
— — — — — —
4
5
PC→@-SP,PC←ERn
— — — — — —
3
4
PC→@-SP,PC←aa:24
— — — — — —
4
5
PC→@-SP,PC←@aa:8
— — — — — —
4
6
— — — — — —
4
5
4
2
2
4
2
2 PC←@SP+
2
3
657
7. System Control Instructions
Condition Code
V C
TRAPA #xx:2
—
PC→@-SP,CCR→@-SP,
EXR→@-SP,<vector>→PC
RTE
RTE
—
EXR←@SP+,CCR←@SP+,
PC←@SP+
SLEEP
SLEEP
—
LDC
LDC #xx:8,CCR
B
2
#xx:8→CCR
LDC #xx:8,EXR
B
4
#xx:8→EXR
LDC Rs,CCR
B
2
Rs8→CCR
LDC Rs,EXR
B
2
Rs8→EXR
LDC @ERs,CCR
W
4
@ERs→CCR
LDC @ERs,EXR
W
4
@ERs→EXR
LDC @(d:16,ERs),CCR
W
6
@(d:16,ERs)→CCR
LDC @(d:16,ERs),EXR
W
6
@(d:16,ERs)→EXR
LDC @(d:32,ERs),CCR
W
10
@(d:32,ERs)→CCR
LDC @(d:32,ERs),EXR
W
10
@(d:32,ERs)→EXR
LDC @ERs+,CCR
W
4
@ERs→CCR,ERs32+2→ERs32
LDC @ERs+,EXR
W
4
@ERs→EXR,ERs32+2→ERs32
LDC @aa:16,CCR
W
6
@aa:16→CCR
LDC @aa:16,EXR
W
6
@aa:16→EXR
LDC @aa:32,CCR
W
8
@aa:32→CCR
LDC @aa:32,EXR
W
8
@aa:32→EXR
Transition to power-down state
Advanced
Z
Normal
H N
—
@@aa
@(d,PC)
I
TRAPA
658
No. of
States*1
Operation
@aa
@-ERn/@ERn+
@ERn
Rn
#xx
Size
Mnemonic
@(d,ERn)
Addressing Mode and
Instruction Length (Bytes)
1 — — — — — 7 [9] 8 [9]
5 [9]
— — — — — —
2
1
— — — — — —
2
1
— — — — — —
1
3
— — — — — —
3
4
— — — — — —
4
6
— — — — — —
6
4
— — — — — —
4
4
— — — — — —
4
5
— — — — — —
5
STC
ANDC
ORC
XORC
NOP
Condition Code
No. of
States*1
Z
V C
Advanced
H N
Normal
I
—
@@aa
@(d,PC)
Operation
@aa
@-ERn/@ERn+
@ERn
Rn
#xx
Size
Mnemonic
@(d,ERn)
Addressing Mode and
Instruction Length (Bytes)
STC CCR,Rd
B
2
CCR→Rd8
— — — — — —
1
STC EXR,Rd
B
2
EXR→Rd8
— — — — — —
1
STC CCR,@ERd
W
4
CCR→@ERd
— — — — — —
3
STC EXR,@ERd
W
4
EXR→@ERd
— — — — — —
3
STC CCR,@(d:16,ERd)
W
6
CCR→@(d:16,ERd)
— — — — — —
4
STC EXR,@(d:16,ERd)
W
6
EXR→@(d:16,ERd)
— — — — — —
4
STC CCR,@(d:32,ERd)
W
10
CCR→@(d:32,ERd)
— — — — — —
6
STC EXR,@(d:32,ERd)
W
10
EXR→@(d:32,ERd)
— — — — — —
6
STC CCR,@-ERd
W
4
ERd32-2→ERd32,CCR→@ERd
— — — — — —
4
STC EXR,@-ERd
W
4
ERd32-2→ERd32,EXR→@ERd
— — — — — —
4
STC CCR,@aa:16
W
6
CCR→@aa:16
— — — — — —
4
STC EXR,@aa:16
W
6
EXR→@aa:16
— — — — — —
4
STC CCR,@aa:32
W
8
CCR→@aa:32
— — — — — —
5
STC EXR,@aa:32
W
8
EXR→@aa:32
— — — — — —
5
ANDC #xx:8,CCR
B
2
CCR∧#xx:8→CCR
ANDC #xx:8,EXR
B
4
EXR∧#xx:8→EXR
ORC #xx:8,CCR
B
2
CCR∨#xx:8→CCR
ORC #xx:8,EXR
B
4
EXR∨#xx:8→EXR
XORC #xx:8,CCR
B
2
CCR⊕#xx:8→CCR
XORC #xx:8,EXR
B
4
EXR⊕#xx:8→EXR
NOP
—
2 PC←PC+2
1
— — — — — —
2
1
— — — — — —
2
1
— — — — — —
2
— — — — — —
1
659
8. Block Transfer Instructions
No. of
States*1
Z
V C
Normal
H N
—
@@aa
@(d,PC)
I
Advanced
Condition Code
Operation
@aa
@-ERn/@ERn+
@ERn
Rn
#xx
Size
Mnemonic
@(d,ERn)
Addressing Mode and
Instruction Length (Bytes)
EEPMOV EEPMOV.B
—
4 if R4L≠0
Repeat @ER5→@ER6
ER5+1→ER5
ER6+1→ER6
R4L-1→R4L
Until R4L=0
else next;
— — — — — —
4+2n*2
EEPMOV.W
—
4 if R4≠0
Repeat @ER5→@ER6
ER5+1→ER5
ER6+1→ER6
R4-1→R4
Until R4=0
else next;
— — — — — —
4+2n*2
Notes: 1. The number of states is the number of states required for execution when the
instruction and its operands are located in on-chip memory.
2. n is the initial value set in R4L or R4.
3. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
4. Only registers ER0 to ER6 should be used when using the STM/LDM instruction.
[1] 7 states when the number of saved/restored registers is 2, 9 states when 3, and 11
states when 4.
[2] Cannot be used with the H8S/2128 Series and H8S/2124 Series.
[3] Set to 1 when there is a carry from or borrow to bit 11; otherwise cleared to 0.
[4] Set to 1 when there is a carry from or borrow to bit 27; otherwise cleared to 0.
[5] If the result is zero, the previous value of the flag is retained; otherwise the flag is
cleared to 0.
[6] Set to 1 if the divisor is negative; otherwise cleared to 0.
[7] Set to 1 if the divisor is zero; otherwise cleared to 0.
[8] Set to 1 if the quotient is negative; otherwise cleared to 0.
[9] When EXR is valid, the number of states is increased by 1.
660
Bcc
BAND
ANDC
AND
ADDX
0
0
0
9
L
L
L
B
ADDS #1,ERd
ADDS #2,ERd
ADDS #4,ERd
ADDX #xx:8,Rd
ADDX Rs,Rd
1
7
6
7
0
0
0
7
7
7
6
6
4
5
4
5
B
W
W
L
L
B
B
B
B
B
B
B
—
—
—
—
AND.B Rs,Rd
AND.W #xx:16,Rd
AND.W Rs,Rd
AND.L #xx:32,ERd
AND.L ERs,ERd
ANDC #xx:8,CCR
ANDC #xx:8,EXR
BAND #xx:3,Rd
BAND #xx:3,@ERd
BAND #xx:3,@aa:8
BAND #xx:3,@aa:16
BAND #xx:3,@aa:32
BRA d:8 (BT d:8)
BRA d:16 (BT d:16)
BRN d:8 (BF d:8)
BRN d:16 (BF d:16)
0
0
L
ADD.L ERs,ERd
E
7
L
ADD.L #xx:32,ERd
B
0
W
ADD.W Rs,Rd
B
7
ADD.W #xx:16,Rd
AND.B #xx:8,Rd
0
B
W
ADD.B Rs,Rd
8
8
1
8
0
A
A
E
C
6
1
6
1
A
6
9
6
rd
E
rd
B
B
B
A
A
9
9
8
rd
1st Byte
B
Size
ADD.B #xx:8,Rd
Mnemonic
0 erd
rd
rd
rd
IMM
1
0
3
1
disp
disp
abs
0 erd
rd
rd
rd
0
0
0
0
0
rd
1
0
0 erd
IMM
rd
0 erd
0 erd
0 erd
IMM
0 IMM
4
F
6
rs
6
rs
rs
9
8
0
1 ers 0 erd
1
rs
1
rs
IMM
2nd Byte
7
7
0
6
6
6
6
6
3rd Byte
IMM
IMM
disp
disp
abs
0 IMM
0 IMM
IMM
0
0
abs
0 ers 0 erd
IMM
IMM
4th Byte
7
6
0 IMM
0
6th Byte
Instruction Format
5th Byte
7
6
7th Byte
0 IMM
0
8th Byte
9th Byte
10th Byte
Table A.2
ADDS
ADD
Instruction
A.2
Instruction Codes
Instruction Codes
661
662
Bcc
Instruction
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
BHI d:16
BLS d:8
BLS d:16
BCC d:8 (BHS d:8)
BCC d:16 (BHS d:16)
BCS d:8 (BLO d:8)
BCS d:16 (BLO d:16)
BNE d:8
BNE d:16
BEQ d:8
BEQ d:16
BVC d:8
BVC d:16
BVS d:8
BVS d:16
BPL d:8
BPL d:16
BMI d:8
BMI d:16
BGE d:8
BGE d:16
BLT d:8
BLT d:16
BGT d:8
BGT d:16
BLE d:8
BLE d:16
Size
BHI d:8
Mnemonic
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
8
F
8
E
8
D
8
C
8
B
8
A
8
9
8
8
8
7
8
6
8
5
8
4
8
3
8
2
1st Byte
F
E
D
C
B
A
9
8
7
6
5
4
3
2
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2nd Byte
3rd Byte
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
4th Byte
6th Byte
Instruction Format
5th Byte
7th Byte
8th Byte
9th Byte
10th Byte
663
BIOR
BILD
BIAND
BCLR
Instruction
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
BCLR #xx:3,@ERd
BCLR #xx:3,@aa:8
BCLR #xx:3,@aa:16
BCLR #xx:3,@aa:32
BCLR Rn,Rd
BCLR Rn,@ERd
BCLR Rn,@aa:8
BCLR Rn,@aa:16
BCLR Rn,@aa:32
BIAND #xx:3,Rd
BIAND #xx:3,@ERd
BIAND #xx:3,@aa:8
BIAND #xx:3,@aa:16
BIAND #xx:3,@aa:32
BILD #xx:3,Rd
BILD #xx:3,@ERd
BILD #xx:3,@aa:8
BILD #xx:3,@aa:16
BILD #xx:3,@aa:32
BIOR #xx:3,Rd
BIOR #xx:3,@ERd
BIOR #xx:3,@aa:8
BIOR #xx:3,@aa:16
BIOR #xx:3,@aa:32
Size
BCLR #xx:3,Rd
Mnemonic
6
6
7
7
7
6
6
7
7
7
6
6
7
7
7
6
6
7
7
6
6
6
0 erd
D
0 erd
C
0 erd
C
0 erd
C
0
0
1
3
A
0
A
abs
1 IMM
4
E
0
3
A
rd
0
1
0
A
abs
1 IMM
7
E
0
3
A
rd
0
1
0
A
abs
1 IMM
6
E
8
3
A
rd
8
1
A
0
rd
rn
2
abs
8
3
A
F
8
1
0
A
abs
0 erd
D
7
7
F
rd
0 IMM
2
7
2nd Byte
1st Byte
0 IMM
2
1 IMM
6
1 IMM
7
7
1 IMM
4
7
abs
1 IMM
4
7
abs
1 IMM
7
7
abs
1 IMM
6
7
0
0
0
0
0
0
0
rn
2
7
0
rn
2
6
0
0
6
abs
abs
0 IMM
2
7
4th Byte
7
3rd Byte
abs
abs
abs
abs
abs
7
7
7
6
7
4
7
6
2
2
1 IMM
1 IMM
1 IMM
rn
0 IMM
0
0
0
0
0
6th Byte
Instruction Format
5th Byte
7
7
7
6
7
4
7
6
2
2
7th Byte
1 IMM
1 IMM
1 IMM
rn
0 IMM
0
0
0
0
0
8th Byte
9th Byte
10th Byte
664
BNOT
BLD
BIXOR
BIST
Instruction
8
8
0
0
0
0
8
8
rd
8
8
1
3
1 IMM
0 erd
1
3
0 IMM
0 erd
1
3
0 IMM
0 erd
1
3
rn
0 erd
1
3
A
A
5
C
E
A
A
7
C
E
A
A
1
D
F
A
A
1
D
F
A
A
6
6
7
7
7
6
6
7
7
7
6
6
7
7
7
6
6
6
7
7
6
6
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
BIST #xx:3,@aa:16
BIST #xx:3,@aa:32
BIXOR #xx:3,Rd
BIXOR #xx:3,@ERd
BIXOR #xx:3,@aa:8
BIXOR #xx:3,@aa:16
BIXOR #xx:3,@aa:32
BLD #xx:3,Rd
BLD #xx:3,@ERd
BLD #xx:3,@aa:8
BLD #xx:3,@aa:16
BLD #xx:3,@aa:32
BNOT #xx:3,Rd
BNOT #xx:3,@ERd
BNOT #xx:3,@aa:8
BNOT #xx:3,@aa:16
BNOT #xx:3,@aa:32
BNOT Rn,Rd
BNOT Rn,@ERd
BNOT Rn,@aa:8
BNOT Rn,@aa:16
BNOT Rn,@aa:32
abs
abs
abs
abs
0
0
rd
0
rd
0
rd
0
F
7
B
BIST #xx:3,@aa:8
abs
0 erd
D
7
B
BIST #xx:3,@ERd
rd
1 IMM
7
6
2nd Byte
1st Byte
B
Size
BIST #xx:3,Rd
Mnemonic
1 IMM
7
1 IMM
5
7
0 IMM
7
7
0 IMM
1
7
rn
rn
1
1
6
6
abs
abs
0 IMM
1
7
abs
0 IMM
7
7
abs
1 IMM
5
7
abs
1 IMM
7
6
0
0
0
0
0
0
0
0
0
0
4th Byte
6
3rd Byte
abs
abs
abs
abs
abs
6
7
7
7
6
1
1
7
5
7
rn
0 IMM
0 IMM
1 IMM
1 IMM
0
0
0
0
0
6th Byte
Instruction Format
5th Byte
6
7
7
7
6
1
1
7
5
7
7th Byte
rn
0 IMM
0 IMM
1 IMM
1 IMM
0
0
0
0
0
8th Byte
9th Byte
10th Byte
665
BTST
BST
BSR
BSET
BOR
Instruction
0
0
8
8
rd
8
8
1
3
0 IMM
0 erd
1
3
rn
0 erd
1
3
A
A
0
D
F
A
A
0
D
F
A
A
5
6
6
7
7
7
6
6
6
7
7
6
6
5
B
B
B
B
B
B
B
B
B
B
B
B
—
BOR #xx:3,@aa:16
BOR #xx:3,@aa:32
BSET #xx:3,Rd
BSET #xx:3,@ERd
BSET #xx:3,@aa:8
BSET #xx:3,@aa:16
BSET #xx:3,@aa:32
BSET Rn,Rd
BSET Rn,@ERd
BSET Rn,@aa:8
BSET Rn,@aa:16
BSET Rn,@aa:32
BSR d:8
BSR d:16
8
8
0
0
rd
1
3
0 IMM
0 erd
1
3
rn
0 erd
D
F
A
A
3
C
E
A
A
3
C
7
7
6
6
7
7
7
6
6
6
7
B
B
B
B
B
B
B
B
B
B
B
BST #xx:3,@ERd
BST #xx:3,@aa:8
BST #xx:3,@aa:16
BST #xx:3,@aa:32
BTST #xx:3,Rd
BTST #xx:3,@ERd
BTST #xx:3,@aa:8
BTST #xx:3,@aa:16
BTST #xx:3,@aa:32
BTST Rn,Rd
BTST Rn,@ERd
abs
abs
0 erd
7
6
B
0
0
rd
0
rd
0
0 IMM
C
5
—
0
0
0
BST #xx:3,Rd
disp
abs
abs
rd
0
E
7
B
BOR #xx:3,@aa:8
abs
0 erd
C
7
B
BOR #xx:3,@ERd
rd
0 IMM
4
7
2nd Byte
1st Byte
B
Size
BOR #xx:3,Rd
Mnemonic
0 IMM
4
0 IMM
0
7
0 IMM
7
6
6
3
rn
0 IMM
3
7
abs
0 IMM
3
7
abs
0 IMM
7
6
0
0
0
0
0
0
rn
0
disp
0
rn
0
6
0
0
0
0
6
abs
abs
0 IMM
0
7
abs
0 IMM
4
7
4th Byte
7
3rd Byte
abs
abs
abs
abs
abs
7
6
6
7
7
3
7
0
0
4
0 IMM
0 IMM
rn
0 IMM
0 IMM
0
0
0
0
0
6th Byte
Instruction Format
5th Byte
7
6
6
7
7
3
7
0
0
4
7th Byte
0 IMM
0 IMM
rn
0 IMM
0 IMM
0
0
0
0
0
8th Byte
9th Byte
10th Byte
666
0
0
0 IMM
0 erd
1
3
5
C
E
A
A
7
7
7
6
6
B
B
B
B
B
BXOR #xx:3,Rd
BXOR #xx:3,@ERd
BXOR #xx:3,@aa:8
BXOR #xx:3,@aa:16
BXOR #xx:3,@aa:32
0
abs
0 IMM
5
7
abs
0 IMM
5
7
0
0
0
rn
3
6
4th Byte
3rd Byte
abs
abs
rd
rd
rd
0 erd
rd
2
rs
2
0
C
9
D
A
F
F
F
1
7
1
7
1
0
1
B
B
W
W
L
L
B
B
CMP.B #xx:8,Rd
CMP.B Rs,Rd
CMP.W #xx:16,Rd
CMP.W Rs,Rd
CMP.L #xx:32,ERd
CMP.L ERs,ERd
CMP
rd
0 erd
F
F
rs
rs
8
8
1
3
9
9
5
5
5
5
0 erd
0
0
rd
0 erd
C
4
F
D
D
rs
rs
5
D
1
1
1
3
B
B
0
5
5
7
7
W
B
W
—
—
DIVXS.W Rs,ERd
DIVXU.B Rs,Rd
DIVXU.W Rs,ERd
EEPMOV EEPMOV.B
EEPMOV.W
DEC.L #2,ERd
B
DEC.L #1,ERd
0
7
B
1
L
DEC.W #2,Rd
1
rd
0 erd
D
B
1
W
DEC.W #1,Rd
L
rd
5
B
1
W
DEC.B Rd
DEC
IMM
B
rd
0
A
1
B
DAS Rd
DAS
IMM
DIVXS.B Rs,Rd
rd
0
DAA Rd
DAA
1 ers 0 erd
IMM
rs
rd
A
—
DIVXU
DIVXS
7
6
5
3
0 IMM
rn
0
0
6th Byte
Instruction Format
5th Byte
Cannot be used with the H8S/2128 Series and H8S/2124 Series.
abs
0
3
A
6
B
BTST Rn,@aa:32
rd
0
1
A
6
B
BTST Rn,@aa:16
abs
E
2nd Byte
7
1st Byte
B
Size
BTST Rn,@aa:8
Mnemonic
CLRMAC CLRMAC
BXOR
BTST
Instruction
7
6
5
3
7th Byte
0 IMM
rn
0
0
8th Byte
9th Byte
10th Byte
667
LDC
JSR
JMP
INC
EXTU
EXTS
Instruction
B
W
W
W
W
W
W
W
W
W
W
LDC @ERs,EXR
LDC @(d:16,ERs),CCR
LDC @(d:16,ERs),EXR
LDC @(d:32,ERs),CCR
LDC @(d:32,ERs),EXR
LDC @ERs+,CCR
LDC @ERs+,EXR
LDC @aa:16,CCR
LDC @aa:16,EXR
B
LDC Rs,CCR
LDC @ERs,CCR
B
LDC Rs,EXR
B
—
JSR @@aa:8
LDC #xx:8,EXR
—
JSR @aa:24
LDC #xx:8,CCR
—
JSR @ERn
—
JMP @@aa:8
INC.L #2,ERd
—
L
INC.L #1,ERd
JMP @aa:24
L
INC.W #2,Rd
—
W
INC.W #1,Rd
JMP @ERn
B
W
INC.B Rd
L
EXTU.L ERd
L
W
EXTS.L ERd
EXTU.W Rd
W
Size
EXTS.W Rd
Mnemonic
0
0
0
0
0
0
0
0
0
0
0
0
0
0
5
5
5
5
5
5
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
3
3
1
7
F
E
D
B
A
9
B
B
B
B
A
7
7
7
7
1st Byte
4
4
4
4
4
4
4
4
4
4
1
0
4
rd
IMM
1
0
1
0
1
0
1
0
1
0
rs
rs
1
0
0
0 erd
0 erd
rd
rd
rd
0 erd
abs
0 ern
rd
0 erd
abs
0 ern
F
7
D
5
0
7
5
F
D
2nd Byte
6
6
6
6
7
7
6
6
6
6
0
abs
abs
B
B
D
D
8
8
F
F
9
9
7
3rd Byte
0
0
0
0
0
0
0 ers
0 ers
0 ers
0 ers
0 ers
0 ers
0
0
0
0
0 ers
0
0
0 ers
IMM
4th Byte
6
6
B
B
abs
abs
disp
disp
2
2
0
0
6th Byte
Instruction Format
5th Byte
7th Byte
8th Byte
disp
disp
9th Byte
10th Byte
668
0
0 ern+1
0 ern+2
0 ern+3
2
7
7
7
B
D
D
D
6
6
6
6
1
0
0
0
4
1
2
3
1
1
1
1
0
W
L
L
L
LDC @aa:32,EXR
LDM.L @SP+, (ERn-ERn+1)
LDM.L @SP+, (ERn-ERn+2)
LDM.L @SP+, (ERn-ERn+3)
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
W
W
W
W
W
MOV.B #xx:8,Rd
MOV.B Rs,Rd
MOV.B @ERs,Rd
MOV.B @(d:16,ERs),Rd
MOV.B @(d:32,ERs),Rd
MOV.B @ERs+,Rd
MOV.B @aa:8,Rd
MOV.B @aa:16,Rd
MOV.B @aa:32,Rd
MOV.B Rs,@ERd
MOV.B Rs,@(d:16,ERd)
MOV.B Rs,@(d:32,ERd)
MOV.B Rs,@-ERd
MOV.B Rs,@aa:8
MOV.B Rs,@aa:16
MOV.B Rs,@aa:32
MOV.W #xx:16,Rd
MOV.W Rs,Rd
MOV.W @ERs,Rd
MOV.W @(d:16,ERs),Rd
MOV.W @(d:32,ERs),Rd
MOV
L
—
LDMAC ERs,MACL
MAC @ERn+,@ERm+
L
LDMAC ERs,MACH
rd
rd
rs
rs
rd
rd
0 ers
0
2
1 erd
1 erd
0 erd
1 erd
8
A
0
rs
0 ers
0 ers
0 ers
8
C
rd
A
A
8
E
8
C
rs
A
A
9
D
9
F
8
7
6
2
6
6
6
6
7
6
3
6
6
7
0
6
6
7
abs
abs
0 ers
E
6
0
rd
rd
rs
0
rs
rs
rd
0
rd
rd
0 ers
8
6
rd
0 ers
C
0
IMM
rs
rd
F
6
6
6
B
A
A
disp
IMM
abs
disp
abs
disp
2
A
2
rd
rs
rd
abs
abs
6th Byte
Instruction Format
5th Byte
Cannot be used with the H8S/2128 Series and H8S/2124 Series.
0
0
0
0
2
B
6
0
LDC @aa:32,CCR
4
4th Byte
1
3rd Byte
2nd Byte
1st Byte
0
Size
W
Mnemonic
MAC
LDMAC
LDM*3
LDC
Instruction
disp
disp
disp
abs
abs
7th Byte
8th Byte
9th Byte
10th Byte
669
5
MULXU
5
0
L
MOV.L ERs,@aa:32
B
0
L
MOV.L ERs,@aa:16
W
0
L
MOV.L ERs,@-ERd
MULXU.W Rs,ERd
0
MOV.L ERs,@(d:32,ERd)*1 L
MULXU.B Rs,Rd
0
L
MOV.L ERs,@(d:16,ERd)
0
0
L
MOV.L ERs,@ERd
0
0
L
MOV.L @aa:32 ,ERd
B
0
L
MOV.L @aa:16 ,ERd
W
0
L
MOV.L @ERs+,ERd
MULXS.W Rs,ERd
0
L
MOV.L @(d:32,ERs),ERd
B
0
L
MOV.L @(d:16,ERs),ERd
MULXS.B Rs,Rd
0
L
MOV.L @ERs,ERd
MULXS
0
L
MOV.L ERs,ERd
MOVTPE MOVTPE Rs,@aa:16
7
L
MOV.L #xx:32,Rd
0 erd
0
A
abs
0 ers 0 erd
0 ers 0 erd
0 erd
0 erd
0 ers
0
2
1 erd 0 ers
1 erd 0 ers
8
D
B
B
9
F
6
7
6
6
6
6
6
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1 erd 0 ers
0 ers
0 ers
0 erd
8
A
8
D
B
B
7
6
6
6
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0 ers 0 erd
9
F
6
IMM
0
rs
0
A
0
abs
disp
0
B
abs
1
6
abs
4th Byte
1
1 ers 0 erd
rs
B
F
rs
8
A
B
0
rs
3rd Byte
6
6
B
B
rd
0 erd
rs
rs
0
2
5
5
0
0
rd
0 erd
C
C
rs
rs
1
1
0
2
abs
disp
abs
disp
A
2
disp
abs
0 ers
abs
0 erd
6th Byte
Instruction Format
5th Byte
Cannot be used with the H8S/2128 Series and H8S/2124 Series.
6
W
MOV.W Rs,@aa:32
B
6
W
MOV.W Rs,@aa:16
rs
1 erd
D
6
W
0 erd
MOV.W Rs,@-ERd
1 erd
8
7
W
MOV.W Rs,@(d:32,ERd)
F
6
W
MOV.W Rs,@(d:16,ERd)
rs
1 erd
9
6
W
rd
2
MOV.W Rs,@ERd
rd
0
B
6
W
MOV.W @aa:32,Rd
B
6
W
MOV.W @aa:16,Rd
rd
0 ers
D
6
2nd Byte
1st Byte
W
Size
MOV.W @ERs+,Rd
Mnemonic
MOVFPE MOVFPE @aa:16,Rd
MOV
Instruction
7th Byte
8th Byte
disp
disp
9th Byte
10th Byte
670
6
7
0
0
0
6
W
L
L
B
B
W
OR.W Rs,Rd
OR.L #xx:32,ERd
OR.L ERs,ERd
ORC #xx:8,CCR
ORC #xx:8,EXR
POP.W Rn
POP.L ERn
ROTL
PUSH
POP
ORC
1
1
1
1
1
B
W
W
L
L
ROTL.W Rd
ROTL.W #2, Rd
ROTL.L ERd
ROTL.L #2, ERd
1
ROTL.B #2, Rd
0
L
B
ROTL.B Rd
PUSH.L ERn
7
W
OR.W #xx:16,Rd
6
1
B
OR.B Rs,Rd
0
C
B
OR.B #xx:8,Rd
L
1
L
NOT.L ERd
W
1
W
NOT.W Rd
PUSH.W Rn
1
B
OR
0
—
NOT.B Rd
1
L
NEG.L ERd
NOP
1
W
NEG.W Rd
NOT
1
2
2
2
2
2
2
1
D
1
D
1
4
1
A
4
9
4
rd
7
7
7
0
7
7
7
1st Byte
B
Size
NEG.B Rd
Mnemonic
NOP
NEG
Instruction
rd
0 erd
0
1
3
rd
rd
0 erd
0
4
rs
4
F
rd
0 erd
F
9
0 erd
rd
C
B
rd
8
D
0
rd
0
0
rn
0
7
F
1
rn
4
IMM
rd
rs
IMM
0
rd
0
rd
0 erd
9
B
rd
8
2nd Byte
6
6
0
6
D
D
4
4
3rd Byte
IMM
F
7
0 ern
0 ern
IMM
0 ers 0 erd
IMM
4th Byte
6th Byte
Instruction Format
5th Byte
7th Byte
8th Byte
9th Byte
10th Byte
671
rd
rd
rd
0 erd
0 erd
C
9
D
B
F
0
0
0
0
0
1
1
1
1
1
B
W
W
L
L
SHAL.B #2, Rd
SHAL.W Rd
SHAL.W #2, Rd
SHAL.L ERd
SHAL.L #2, ERd
0
rd
8
0
4
5
—
1
7
6
5
B
0
7
3
1
L
—
ROTXR.L #2, ERd
SHAL.B Rd
0 erd
3
3
1
L
ROTXR.L ERd
SHAL
rd
0 erd
5
3
1
W
ROTXR.W #2, Rd
7
rd
1
3
1
W
ROTXR.W Rd
RTS
rd
4
3
1
B
ROTXR.B #2, Rd
RTS
rd
0
RTE
0 erd
7
3
ROTXL.L #2, ERd
2
3
2
1
L
ROTXL.L ERd
1
rd
0 erd
5
2
1
W
ROTXL.W #2, Rd
1
rd
1
2
1
W
ROTXL.W Rd
L
rd
4
2
1
B
ROTXL.B #2, Rd
B
rd
0
2
ROTXR.B Rd
0 erd
F
3
1
ROTR.L #2, ERd
1
B
3
1
L
ROTR.L ERd
L
rd
0 erd
D
3
1
W
ROTR.W #2, Rd
B
rd
9
3
1
ROTR.W Rd
ROTXL.B Rd
rd
C
3
1
B
W
ROTR.B #2, Rd
rd
8
3
1
2nd Byte
1st Byte
B
Size
ROTR.B Rd
Mnemonic
RTE
ROTXR
ROTXL
ROTR
Instruction
3rd Byte
4th Byte
6th Byte
Instruction Format
5th Byte
7th Byte
8th Byte
9th Byte
10th Byte
672
6
6
6
6
7
7
6
6
rd
rd
rd
rd
0 erd
0 erd
rd
rd
rd
rd
0 erd
0 erd
rd
rd
rd
rd
0 erd
0 erd
0
rd
rd
0
1
0
1
0
1
0
1
8
C
9
D
B
F
0
4
1
5
3
7
0
4
1
5
3
7
8
0
1
4
4
4
4
4
4
4
4
1
1
1
1
1
0
0
0
0
0
0
1
1
1
1
1
1
1
2
2
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
B
W
W
STC.W EXR,@ERd
STC.W EXR,@(d:16,ERd) W
STC.W CCR,@(d:32,ERd) W
STC.W EXR,@(d:32,ERd) W
W
STC.W CCR,@ERd
STC.W CCR,@(d:16,ERd) W
W
STC.B EXR,Rd
STC.W CCR,@-ERd
STC.W EXR,@-ERd
0
1
L
—
SHLR.L #2, ERd
B
1
L
SHLR.L ERd
STC.B CCR,Rd
1
W
SHLR.W #2, Rd
STC
1
W
SHLR.W Rd
SLEEP
1
B
SHLR.B #2, Rd
SHLL.L #2, ERd
1
1
L
SHLL.L ERd
1
1
W
SHLL.W #2, Rd
L
1
W
SHLL.W Rd
B
1
B
SHLL.B #2, Rd
SHLR.B Rd
1
SHAR.L #2, ERd
1
1
L
SHAR.L ERd
L
1
W
SHAR.W #2, Rd
B
1
SHAR.W Rd
SHLL.B Rd
1
B
W
SHAR.B #2, Rd
1
1
D
D
8
8
F
F
9
9
3rd Byte
2nd Byte
1st Byte
B
Size
SHAR.B Rd
Mnemonic
SLEEP
SHLR
SHLL
SHAR
Instruction
1 erd
1 erd
0 erd
0 erd
1 erd
1 erd
1 erd
1 erd
0
0
0
0
0
0
0
0
4th Byte
6
6
B
B
disp
disp
A
A
0
0
6th Byte
Instruction Format
5th Byte
7th Byte
8th Byte
disp
disp
9th Byte
10th Byte
673
D
1
7
6
7
0
B
B
W
W
L
L
XOR.B #xx:8,Rd
XOR.B Rs,Rd
XOR.W #xx:16,Rd
XOR.W Rs,Rd
XOR.L #xx:32,ERd
XOR.L ERs,ERd
XOR
1
5
B
B
SUBX #xx:8,Rd
—
1
L
SUBS #4,ERd
TRAPA #x:2
1
L
SUBS #2,ERd
TRAPA
1
L
SUBS #1,ERd
0
1
L
SUB.L ERs,ERd
B
7
L
SUB.L #xx:32,ERd
B
1
W
SUB.W Rs,Rd
TAS @ERd*2
7
SUBX Rs,Rd
1
W
SUB.W #xx:16,Rd
L
B
STMAC MACL,ERd
1
1
1
1
1
1
1
3
2
1
4
4
4
4
0
0
0
1
0
1
0
2nd Byte
6
6
6
6
6
6
6
D
D
D
B
B
B
B
3rd Byte
F
F
F
A
A
8
8
0 ern
0 ern
0 ern
0
0
0
0
4th Byte
1
A
5
9
5
rd
7
1
E
rd
B
B
B
A
A
9
9
8
0 erd
rd
rd
rd
F
5
rs
5
rs
rd
rd
rd
0
0
rd
0
0 erd
IMM
00 IMM
E
0 erd
0 erd
0 erd
IMM
rs
9
8
0
1 ers 0 erd
3
rs
3
rs
6
7
5
B
C
IMM
IMM
0 ers 0 erd
IMM
0 erd
IMM
abs
abs
6th Byte
Instruction Format
5th Byte
Cannot be used with the H8S/2128 Series and H8S/2124 Series.
0
0
0
0
0
0
0
1st Byte
SUB.B Rs,Rd
L
L
STMAC MACH,ERd
L
STM.L (ERn-ERn+3), @-SP
W
STC.W EXR,@aa:32
STM.L (ERn-ERn+2), @-SP
W
STC.W CCR,@aa:32
L
W
STC.W EXR,@aa:16
STM.L (ERn-ERn+1), @-SP
W
Size
STC.W CCR,@aa:16
Mnemonic
TAS
SUBX
SUBS
SUB
STMAC
STM*3
STC
Instruction
abs
abs
7th Byte
8th Byte
9th Byte
10th Byte
674
B
XORC #xx:8,EXR
0
0
1
5
1st byte
4
IMM
1
2nd byte
0
5
3rd byte
IMM
4th byte
7th byte
8th byte
9th byte
10th byte
General
Register
ER0
ER1
•
•
•
ER7
Register
Field
000
001
•
•
•
111
Address Registers
32-Bit Registers
0000
0001
•
•
•
0111
1000
1001
•
•
•
1111
Register
Field
R0
R1
•
•
•
R7
E0
E1
•
•
•
E7
General
Register
16-Bit Register
0000
0001
•
•
•
0111
1000
1001
•
•
•
1111
Register
Field
R0H
R1H
•
•
•
R7H
R0L
R1L
•
•
•
R7L
General
Register
8-Bit Register
The correspondence between register fields and general registers is shown in the following table.
Immediate data (2, 3, 8, 16, or 32 bits)
Absolute address (8, 16, 24, or 32 bits)
Displacement (8, 16, or 32 bits)
Register field (4 bits, indicating an 8-bit or 16-bit register. rs, rd, and rn correspond to operand formats Rs, Rd, and Rn, respectively.)
Register field (3 bits, indicating an address register or 32-bit register. ers, erd, ern, and erm correspond to operand formats ERs, ERd,
ERn, and ERm, respectively.)
6th byte
Instruction Format
5th byte
1. Bit 7 of the 4th byte of the MOV.L ERs, @ (d:32, ERd) instruction can be either 0 or 1.
2. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
3. Only registers ER0 to ER6 should be used when using the STM/LDM instruction.
B
Size
XORC #xx:8,CCR
Mnemonic
Legend
IMM:
abs:
disp:
rs, rd, rn:
ers, erd, ern, erm:
Note:
XORC
Instruction
1
2
BH
3
BL
XOR
BSR
BCS
AND
RTE
BNE
BST
TRAPA
BEQ
SUB
ADD
CMP
SUBX
OR
XOR
AND
MOV
B
C
D
E
F
MOV
BVS
9
Table
A.3 (2)
MOV
Table
A.3 (2)
A
Note: * Cannot be used with the H8S/2128 Series and H8S/2124 Series.
8
BVC
MOV.B
Table
A.3 (2)
LDC
7
BIST
BOR
BLD
BXOR
BAND
BIOR
BILD
BIXOR
BIAND
OR
RTS
BCC
AND
ANDC
6
ADD
BTST
DIVXU
BLS
XOR
XORC
5
ADDX
BCLR
MULXU
BHI
OR
ORC
4
B
BMI
Table
A.3 (2)
Table
A.3 (2)
Table
A.3 (2)
Table
A.3 (2) EEPMOV
JMP
BPL
Table
A.3 (2)
Table
A.3 (2)
A
Instruction when most significant bit of BH is 1.
Instruction when most significant bit of BH is 0.
9
BNOT
DIVXU
BRN
LDC
Table STC
*
*
A.3 (2)
STMAC
LDMAC
Table
Table
Table
A.3 (2)
A.3 (2)
A.3 (2)
AL
2nd byte
8
7
BSET
MULXU
5
6
BRA
4
3
2
NOP
Table
A.3 (2)
0
1
AL
0
AH
AH
1st byte
BSR
BGE
C
CMP
BLT
JSR
BGT
SUBX
ADDX
E
Table A.3 (3)
MOV
MOV
D
F
BLE
Table
A.3 (2)
Table
A.3 (2)
Table A.3
Instruction code:
A.3
Operation Code Map
Table A.3 shows the operation code map.
Operation Code Map (1)
675
676
DAS
BRA
MOV
MOV
MOV
58
6A
79
7A
ADD
CMP
CMP
MOV
Table
A.3 (4)
ADD
BHI
BRN
2
SUB
SUB
Table
A.3 (4)
BLS
NOT
STM
3
BL
2nd byte
BH
OR
OR
*
MOVFPE
BCC
ROTXR
ROTXL
SHLR
SHLL
STC
4
LDC
XOR
XOR
BCS
DEC
EXTU
INC
5
Note: * Cannot be used with the H8S/2128 Series and H8S/2124 Series.
SUBS
1F
NOT
17
1B
ROTXR
13
DEC
ROTXL
12
1A
SHLR
11
DAA
0F
SHLL
ADDS
0B
1
LDM
AL
1st byte
AH
10
INC
0A
0
MOV
BH
01
AH AL
Instruction code:
6
AND
AND
BNE
*
MAC
BEQ
DEC
EXTU
ROTXR
ROTXL
SHLR
SHLL
INC
7
8
MOV
BVC
9
BVS
SUBS
NEG
ROTR
ROTL
SHAR
SHAL
ADDS
SLEEP
A
MOV
BPL
*
CLRMAC
BMI
NEG
B
C
BGE
*
MOVTPE
CMP
SUB
ROTR
ROTL
SHAR
SHAL
MOV
ADD
Table
A.3 (3)
D
BLT
DEC
EXTS
INC
Table
A.3 (3)
E
BGT
TAS
F
BLE
DEC
EXTS
ROTR
ROTL
SHAR
SHAL
INC
Table
A.3 (3)
Table A.3
Operation Code Map (2)
BCLR
MULXS
2
3
BSET
7Faa7*2
BNOT
BNOT
BCLR
BCLR
Notes: 1. r is the register specification field.
2. aa is the absolute address specification.
BSET
7Faa6*2
BTST
BCLR
BTST
BNOT
7Eaa7*2
BSET
7Dr07*1
7Eaa6*2
BSET
7Dr06*1
XOR
5
DH
AND
6
DL
4th byte
7
BOR
BXOR
BAND
BLD
BIOR
BIXOR
BIAND
BILD
BST
BIST
BOR
BXOR
BAND
BLD
BIOR
BIXOR
BIAND
BILD
BST
BIST
OR
4
CL
3rd byte
CH
DIVXS
BL
BTST
BNOT
DIVXS
1
BH
7Cr07*1
MULXS
0
AL
2nd byte
BTST
CL
AH
1st byte
7Cr06*1
01F06
01D05
01C05
AH AL BH BL CH
Instruction code:
8
9
A
B
C
D
E
F
Instruction when most significant bit of DH is 0.
Instruction when most significant bit of DH is 1.
Table A.3
Operation Code Map (3)
677
678
BSET
0
AH
BNOT
1
AL
1st byte
BNOT
1
0
BSET
AL
1st byte
AH
BCLR
2
BH
3
6
7
EL
5th byte
EH
5
DH
6
DL
4th byte
7
EH
EL
5th byte
BXOR
BAND
BLD
BOR
BIXOR
BIAND
BILD
BIOR
BST
BIST
4
CL
3rd byte
CH
BTST
3
5
DL
4th byte
DH
BXOR
BAND
BLD
BOR
BIXOR
BIAND
BILD
BIOR
BST
BIST
4
CL
3rd byte
CH
BTST
BL
2nd byte
BCLR
2
BL
2nd byte
BH
Note: * aa is the absolute address specification.
6A38aaaaaaaa7*
6A38aaaaaaaa6*
6A30aaaaaaaa7*
6A30aaaaaaaa6*
AHALBHBL ... FHFLGH
GL
Instruction code:
6A18aaaa7*
6A18aaaa6*
6A10aaaa7*
6A10aaaa6*
AHALBHBLCHCLDHDLEH
EL
Instruction code:
8
8
FH
9
FL
6th byte
9
FL
6th byte
FH
A
B
HH
HL
8th byte
C
D
E
B
C
D
E
Indicates case where MSB of HH is 0.
Indicates case where MSB of HH is 1.
GL
7th byte
GH
A
F
F
Instruction when most significant bit of FH is 0.
Instruction when most significant bit of FH is 1.
Table A.3
Operation Code Map (4)
A.4
Number of States Required for Execution
The tables in this section can be used to calculate the number of states required for instruction
execution by the H8S/2000 CPU. Table A.5 shows the number of instruction fetch, data
read/write, and other cycles occurring in each instruction, and table A.4 shows the number of
states required per cycle according to the bus size. The number of states required for execution of
an instruction can be calculated from these two tables as follows:
Number of states = I × S I + J × S J + K × S K + L × S L + M × S M + N × S N
Examples of Calculation of Number of States Required for Execution
Examples: Advanced mode, external address space designated for the program area and stack area,
on-chip supporting modules accessed in two states with 8-bit bus width, external devices accessed
in three states with one wait state and 8-bit bus width.
1. BSET #0,@FFFFC7:8
From table A.5, I = L = 2 and J = K = M = N = 0
From table A.4, SI = 8 and SL = 2
Number of states = 2 × 8 + 2 × 2 = 20
2. JSR @@30
From table A.5, I = J = K = 2 and L = M = N = 0
From table A.4, SI = SJ= SK = 8
Number of states = 2 × 8 + 2 × 8 + 2 × 8 = 48
679
Table A.4
Number of States per Cycle
Access Conditions
External Device
On-Chip
Supporting Module
8-Bit Bus
16-Bit Bus*
Execution State
(Cycle)
On-Chip
Memory
8-Bit
Bus
16-Bit
Bus
2-State
Access
3-State
Access
2-State
Access
3-State
Access
Instruction fetch
1
4
2
4
6 + 2m
2
3+m
2
2
3+m
4
4
6 + 2m
1
1
1
1
SI
Branch address fetch
SJ
Stack operation
SK
Byte data access
SL
Word data access
SM
Internal operation
1
1
1
SN
Legend:
m: Number of wait states inserted into external device access
Note: * Cannot be used in the H8S/2128 Series and H8S/2124 Series.
680
Table A.5
Number of Cycles per Instruction
Instruction Mnemonic
Instruction
Fetch
I
ADD
ADD.B #xx:8,Rd
1
ADD.B Rs,Rd
1
ADD.W #xx:16,Rd
2
ADD.W Rs,Rd
1
ADD.L #xx:32,ERd
3
ADD.L ERs,ERd
1
ADDS
ADDS #1/2/4,ERd
1
ADDX
ADDX #xx:8,Rd
1
ADDX Rs,Rd
1
AND.B #xx:8,Rd
1
AND.B Rs,Rd
1
AND.W #xx:16,Rd
2
AND.W Rs,Rd
1
AND.L #xx:32,ERd
3
AND.L ERs,ERd
2
ANDC #xx:8,CCR
1
ANDC #xx:8,EXR
2
BAND #xx:3,Rd
1
AND
ANDC
BAND
Bcc
Branch
Address
Read
J
Stack
Operation
K
Byte Data
Access
L
BAND #xx:3,@ERd
2
1
BAND #xx:3,@aa:8
2
1
BAND #xx:3,@aa:16
3
1
BAND #xx:3,@aa:32
4
1
BRA d:8
(BT d:8)
2
BRN d:8
(BF d:8)
2
BHI d:8
2
BLS d:8
2
BCC d:8
(BHS d:8)
2
BCS d:8
(BLO d:8)
2
BNE d:8
2
BEQ d:8
2
BVC d:8
2
BVS d:8
2
BPL d:8
2
BMI d:8
2
BGE d:8
2
BLT d:8
2
Word Data
Access
M
Internal
Operation
N
681
Instruction Mnemonic
Instruction
Fetch
I
Bcc
2
BGT d:8
BLE d:8
BCLR
BIAND
682
Branch
Address
Read
J
Stack
Operation
K
Byte Data
Access
L
Word Data
Access
M
Internal
Operation
N
2
BRA d:16
(BT d:16)
2
1
BRN d:16
(BF d:16)
2
1
BHI d:16
2
1
BLS d:16
2
1
BCC d:16
(BHS d:16)
2
1
BCS d:16
(BLO d:16)
2
1
BNE d:16
2
1
BEQ d:16
2
1
BVC d:16
2
1
BVS d:16
2
1
BPL d:16
2
1
BMI d:16
2
1
BGE d:16
2
1
BLT d:16
2
1
BGT d:16
2
1
BLE d:16
2
1
BCLR #xx:3,Rd
1
BCLR #xx:3,@ERd
2
2
BCLR #xx:3,@aa:8
2
2
BCLR #xx:3,@aa:16
3
2
BCLR #xx:3,@aa:32
4
2
BCLR Rn,Rd
1
BCLR Rn,@ERd
2
2
BCLR Rn,@aa:8
2
2
BCLR Rn,@aa:16
3
2
BCLR Rn,@aa:32
4
2
BIAND #xx:3,Rd
1
BIAND #xx:3,@ERd
2
1
BIAND #xx:3,@aa:8
2
1
BIAND #xx:3,@aa:16
3
1
BIAND #xx:3,@aa:32
4
1
Instruction Mnemonic
Instruction
Fetch
I
BILD
1
BIOR
BIST
BIXOR
BLD
BNOT
BILD #xx:3,Rd
Branch
Address
Read
J
Stack
Operation
K
Byte Data
Access
L
BILD #xx:3,@ERd
2
1
BILD #xx:3,@aa:8
2
1
BILD #xx:3,@aa:16
3
1
BILD #xx:3,@aa:32
4
1
BIOR #xx:8,Rd
1
BIOR #xx:8,@ERd
2
1
BIOR #xx:8,@aa:8
2
1
BIOR #xx:8,@aa:16
3
1
BIOR #xx:8,@aa:32
4
1
BIST #xx:3,Rd
1
BIST #xx:3,@ERd
2
2
BIST #xx:3,@aa:8
2
2
BIST #xx:3,@aa:16
3
2
BIST #xx:3,@aa:32
4
2
BIXOR #xx:3,Rd
1
BIXOR #xx:3,@ERd
2
1
BIXOR #xx:3,@aa:8
2
1
BIXOR #xx:3,@aa:16
3
1
BIXOR #xx:3,@aa:32
4
1
BLD #xx:3,Rd
1
BLD #xx:3,@ERd
2
1
BLD #xx:3,@aa:8
2
1
BLD #xx:3,@aa:16
3
1
BLD #xx:3,@aa:32
4
1
BNOT #xx:3,Rd
1
BNOT #xx:3,@ERd
2
2
BNOT #xx:3,@aa:8
2
2
BNOT #xx:3,@aa:16
3
2
BNOT #xx:3,@aa:32
4
2
BNOT Rn,Rd
1
BNOT Rn,@ERd
2
2
BNOT Rn,@aa:8
2
2
BNOT Rn,@aa:16
3
2
BNOT Rn,@aa:32
4
2
Word Data
Access
M
Internal
Operation
N
683
Instruction Mnemonic
Instruction
Fetch
I
BOR
1
BSET
BSR
BOR #xx:3,Rd
BTST
684
Stack
Operation
K
Byte Data
Access
L
BOR #xx:3,@ERd
2
1
BOR #xx:3,@aa:8
2
1
BOR #xx:3,@aa:16
3
1
BOR #xx:3,@aa:32
4
1
BSET #xx:3,Rd
1
BSET #xx:3,@ERd
2
2
BSET #xx:3,@aa:8
2
2
BSET #xx:3,@aa:16
3
2
BSET #xx:3,@aa:32
4
2
BSET Rn,Rd
1
Word Data
Access
M
Internal
Operation
N
BSET Rn,@ERd
2
2
BSET Rn,@aa:8
2
2
BSET Rn,@aa:16
3
2
BSET Rn,@aa:32
4
BSR d:8
Normal
2
Advanced
2
2
BSR d:16
Normal
2
1
1
2
2
1
Advanced
BST
Branch
Address
Read
J
BST #xx:3,Rd
2
1
1
BST #xx:3,@ERd
2
2
BST #xx:3,@aa:8
2
2
BST #xx:3,@aa:16
3
2
BST #xx:3,@aa:32
4
2
BTST #xx:3,Rd
1
BTST #xx:3,@ERd
2
1
BTST #xx:3,@aa:8
2
1
BTST #xx:3,@aa:16
3
1
BTST #xx:3,@aa:32
4
1
BTST Rn,Rd
1
BTST Rn,@ERd
2
1
BTST Rn,@aa:8
2
1
BTST Rn,@aa:16
3
1
BTST Rn,@aa:32
4
1
Instruction Mnemonic
Instruction
Fetch
I
BXOR
1
BXOR #xx:3,Rd
Branch
Address
Read
J
Stack
Operation
K
Byte Data
Access
L
Word Data
Access
M
BXOR #xx:3,@ERd
2
1
BXOR #xx:3,@aa:8
2
1
BXOR #xx:3,@aa:16
3
1
BXOR #xx:3,@aa:32
4
1
CLRMAC
CLRMAC
Cannot be used with the H8S/2128 Series and H8S/2124 Series.
CMP
CMP.B #xx:8,Rd
1
CMP.B Rs,Rd
1
CMP.W #xx:16,Rd
2
Internal
Operation
N
CMP.W Rs,Rd
1
CMP.L #xx:32,ERd
3
CMP.L ERs,ERd
1
DAA
DAA Rd
1
DAS
DAS Rd
1
DEC
DEC.B Rd
1
DEC.W #1/2,Rd
1
DEC.L #1/2,ERd
1
DIVXS.B Rs,Rd
2
11
DIVXS.W Rs,ERd
2
19
DIVXU.B Rs,Rd
1
11
DIVXU.W Rs,ERd
1
EEPMOV.B
2
2n+2 * 2
EEPMOV.W
2
2n+2 * 2
EXTS.W Rd
1
EXTS.L ERd
1
EXTU.W Rd
1
EXTU.L ERd
1
INC.B Rd
1
INC.W #1/2,Rd
1
INC.L #1/2,ERd
1
JMP @ERn
2
DIVXS
DIVXU
EEPMOV
EXTS
EXTU
INC
JMP
JMP @aa:24
JMP @@aa:8
19
2
1
Normal
2
1
1
Advanced
2
2
1
685
Instruction
Fetch
I
Instruction Mnemonic
JSR
LDM* 4
LDMAC
2
Stack
Operation
K
Byte Data
Access
L
Word Data
Access
M
Internal
Operation
N
JSR @ERn
Normal
Advanced
2
2
JSR @aa:24
Normal
2
1
1
Advanced
2
2
1
JSR @@aa:8
Normal
2
1
1
2
2
2
Advanced
LDC
Branch
Address
Read
J
1
LDC #xx:8,CCR
1
LDC #xx:8,EXR
2
LDC Rs,CCR
1
LDC Rs,EXR
1
LDC @ERs,CCR
2
LDC @ERs,EXR
2
1
LDC @(d:16,ERs),CCR
3
1
LDC @(d:16,ERs),EXR
3
1
LDC @(d:32,ERs),CCR
5
1
LDC @(d:32,ERs),EXR
5
1
LDC @ERs+,CCR
2
1
1
1
1
LDC @ERs+,EXR
2
1
LDC @aa:16,CCR
3
1
LDC @aa:16,EXR
3
1
LDC @aa:32,CCR
4
1
LDC @aa:32,EXR
4
LDM.L @S P+, (ERn-ERn+1)
2
1
4
1
LDM.L @S P+, (ERn-ERn+2)
2
6
1
LDM.L @S P+, (ERn-ERn+3)
2
8
1
LDMAC ERs, MACH
Cannot be used with the H8S/2128 Series and H8S/2124 Series.
LDMAC ERs, MACL
MAC
MAC @ERn+, @ERm+
MOV
MOV.B #xx:8,Rd
1
MOV.B Rs,Rd
1
686
MOV.B @ERs,Rd
1
1
MOV.B @(d:16,ERs),Rd
2
1
MOV.B @(d:32,ERs),Rd
4
1
MOV.B @ERs+,Rd
1
1
MOV.B @aa:8,Rd
1
1
MOV.B @aa:16,Rd
2
1
1
Branch
Address
Read
J
Instruction Mnemonic
Instruction
Fetch
I
Stack
Operation
K
Byte Data
Access
L
Word Data
Access
M
MOV
MOV.B @aa:32,Rd
3
MOV.B Rs,@ERd
1
1
MOV.B Rs,@(d:16,ERd)
2
1
MOV.B Rs,@(d:32,ERd)
4
1
MOV.B Rs,@-ERd
1
1
MOV.B Rs,@aa:8
1
1
MOV.B Rs,@aa:16
2
1
MOV.B Rs,@aa:32
3
1
MOV.W #xx:16,Rd
2
MOV.W Rs,Rd
1
MOV.W @ERs,Rd
1
1
MOV.W @(d:16,ERs),Rd
2
1
MOV.W @(d:32,ERs),Rd
4
1
MOV.W @ERs+,Rd
1
1
MOV.W @aa:16,Rd
2
1
MOV.W @aa:32,Rd
3
1
MOV.W Rs,@ERd
1
1
MOV.W Rs,@(d:16,ERd)
2
1
MOV.W Rs,@(d:32,ERd)
4
1
MOV.W Rs,@-ERd
1
1
MOV.W Rs,@aa:16
2
1
MOV.W Rs,@aa:32
3
1
MOV.L #xx:32,ERd
3
MOV.L ERs,ERd
1
Internal
Operation
N
1
1
MOV.L @ERs,ERd
2
2
MOV.L @(d:16,ERs),ERd
3
2
MOV.L @(d:32,ERs),ERd
5
2
MOV.L @ERs+,ERd
2
2
MOV.L @aa:16,ERd
3
2
MOV.L @aa:32,ERd
4
2
MOV.L ERs,@ERd
2
2
MOV.L ERs,@(d:16,ERd)
3
2
MOV.L ERs,@(d:32,ERd)
5
2
MOV.L ERs,@-ERd
2
2
MOV.L ERs,@aa:16
3
2
MOV.L ERs,@aa:32
4
2
1
1
1
1
687
Branch
Address
Read
J
Instruction Mnemonic
Instruction
Fetch
I
MOVFPE
MOVFPE @:aa:16,Rd
Cannot be used with the H8S/2128 Series and H8S/2124 Series.
MOVTPE
MOVTPE Rs,@:aa:16
MULXS
MULXS.B Rs,Rd
2
11
MULXS.W Rs,ERd
2
19
MULXU.B Rs,Rd
1
11
MULXU.W Rs,ERd
1
19
NEG.B Rd
1
NEG.W Rd
1
NEG.L ERd
1
NOP
NOP
1
NOT
NOT.B Rd
1
NOT.W Rd
1
NOT.L ERd
1
OR .B #xx:8,Rd
1
MULXU
NEG
OR
ORC
POP
PUSH
ROTL
688
OR .B Rs,Rd
1
OR .W #xx:16,Rd
2
OR.W Rs,Rd
1
OR.L #xx:32,ERd
3
OR.L ERs,ERd
2
ORC #xx:8,CCR
1
Stack
Operation
K
Byte Data
Access
L
Word Data
Access
M
Internal
Operation
N
ORC #xx:8,EXR
2
POP.W Rn
1
1
1
POP.L ERn
2
2
1
PUSH.W Rn
1
1
1
PUSH.L ERn
2
2
1
ROTL.B Rd
1
ROTL.B #2,Rd
1
ROTL.W Rd
1
ROTL.W #2,Rd
1
ROTL.L ERd
1
ROTL.L #2,ERd
1
Instruction Mnemonic
Instruction
Fetch
I
ROTR
1
ROTXL
ROTXR
ROTR.B Rd
ROTR.B #2,Rd
1
ROTR.W Rd
1
ROTR.W #2,Rd
1
ROTR.L ERd
1
ROTR.L #2,ERd
1
ROTXL.B Rd
1
ROTXL.B #2,Rd
1
ROTXL.W Rd
1
ROTXL.W #2,Rd
1
ROTXL.L ERd
1
ROTXL.L #2,ERd
1
ROTXR.B Rd
1
ROTXR.B #2,Rd
1
ROTXR.W Rd
1
ROTXR.W #2,Rd
1
ROTXR.L ERd
1
Branch
Address
Read
J
Stack
Operation
K
Byte Data
Access
L
Word Data
Access
M
Internal
Operation
N
ROTXR.L #2,ERd
1
RTE
RTE
2
2/3 * 1
1
RTS
RTS
Normal
2
1
1
Advanced
2
2
1
SHAL
SHAR
SHAL.B Rd
1
SHAL.B #2,Rd
1
SHAL.W Rd
1
SHAL.W #2,Rd
1
SHAL.L ERd
1
SHAL.L #2,ERd
1
SHAR.B Rd
1
SHAR.B #2,Rd
1
SHAR.W Rd
1
SHAR.W #2,Rd
1
SHAR.L ERd
1
SHAR.L #2,ERd
1
689
Instruction Mnemonic
Instruction
Fetch
I
SHLL
1
SHLL.B Rd
SHLR
SHLL.B #2,Rd
1
SHLL.W Rd
1
SHLL.W #2,Rd
1
SHLL.L ERd
1
SHLL.L #2,ERd
1
SHLR.B Rd
1
SHLR.B #2,Rd
1
SHLR.W Rd
1
SHLR.W #2,Rd
1
SHLR.L ERd
1
SHLR.L #2,ERd
1
SLEEP
SLEEP
1
STC
STC.B CCR,Rd
1
STC.B EXR,Rd
1
STC.W CCR,@ERd
2
STM*
SUB
690
4
Branch
Address
Read
J
Stack
Operation
K
Byte Data
Access
L
Word Data
Access
M
Internal
Operation
N
1
1
STC.W EXR,@ERd
2
1
STC.W CCR,@(d:16,ERd)
3
1
STC.W EXR,@(d:16,ERd)
3
1
STC.W CCR,@(d:32,ERd)
5
1
STC.W EXR,@(d:32,ERd)
5
1
STC.W CCR,@-ERd
2
1
1
STC.W EXR,@-ERd
2
1
1
STC.W CCR,@aa:16
3
1
STC.W EXR,@aa:16
3
1
STC.W CCR,@aa:32
4
1
STC.W EXR,@aa:32
4
1
STM.L (ERn-ERn+1),@-SP
2
4
1
STM.L (ERn-ERn+2),@-SP
2
6
1
STM.L (ERn-ERn+3),@-SP
2
8
1
SUB.B Rs,Rd
1
SUB.W #xx:16,Rd
2
SUB.W Rs,Rd
1
SUB.L #xx:32,ERd
3
SUB.L ERs,ERd
1
Instruction Mnemonic
Instruction
Fetch
I
SUBS
SUBS #1/2/4,ERd
1
SUBX
SUBX #xx:8,Rd
1
SUBX Rs,Rd
1
TAS @ERd* 3
2
TAS
TRAPA
XOR
XORC
Notes: 1.
2.
3.
4.
TRAPA #x:2
Branch
Address
Read
J
Stack
Operation
K
Word Data
Access
M
Internal
Operation
N
2
1
2
2
Normal
2
1
2/3 *
Advanced
2
2
2/3 * 1
XOR.B #xx:8,Rd
Byte Data
Access
L
1
XOR.B Rs,Rd
1
XOR.W #xx:16,Rd
2
XOR.W Rs,Rd
1
XOR.L #xx:32,ERd
3
XOR.L ERs,ERd
2
XORC #xx:8,CCR
1
XORC #xx:8,EXR
2
2 when EXR is invalid, 3 when valid.
When n bytes of data are transferred.
Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
Only registers ER0 to ER6 should be used when using the STM/LDM instruction.
691
A.5
Bus States During Instruction Execution
Table A.6 indicates the types of cycles that occur during instruction execution by the CPU. See
table A.4 for the number of states per cycle.
How to Read the Table:
Order of execution
Instruction
JMP@aa:24
1
R:W 2nd
2
Internal
operation
2 state
3
5
4
6
7
R:W EA
End of instruction
Read effective address (word-size read)
No read or write
Read 2nd word of current instruction
(word-size read)
Legend
R:B
Byte-size read
R:W
Word-size read
W:B
Byte-size write
W:W
Word-size write
:M
Transfer of the bus is not performed immediately after this cycle
2nd
Address of 2nd word (3rd and 4th bytes)
3rd
Address of 3rd word (5th and 6th bytes)
4th
Address of 4th word (7th and 8th bytes)
5th
Address of 5th word (9th and 10th bytes)
NEXT
Start address of instruction following executing instruction
EA
Effective address
VEC
Vector address
692
8
Figure A.1 shows timing waveforms for the address bus and the RD, WR signals during execution
of the above instruction with an 8-bit bus, using three-state access with no wait states.
ø
Address bus
RD
WR
High level
R:W 2nd
Fetching
3rd byte
of instruction
Fetching
4th byte
of instruction
Internal
operation
R:W EA
Fetching
1st byte of
branch instruction
Fetching
2nd byte of
branch instruction
Figure A.1 Address Bus, RD, WR Timing
(8-Bit Bus, Three-State Access, No Wait States)
693
Table A.6
Instruction Execution Cycle
Instruction
1
ADD.B #xx:8,Rd
R:W NEXT
ADD.B Rs,Rd
R:W NEXT
ADD.W #xx:16,Rd
R:W 2nd
ADD.W Rs,Rd
R:W NEXT
ADD.L #xx:32,ERd R:W 2nd
ADD.L ERs,ERd
R:W NEXT
ADDS #1/2/4,ERd
R:W NEXT
ADDX #xx:8,Rd
R:W NEXT
ADDX Rs,Rd
R:W NEXT
AND.B #xx:8,Rd
R:W NEXT
AND.B Rs,Rd
R:W NEXT
AND.W #xx:16,Rd
R:W 2nd
AND.W Rs,Rd
R:W NEXT
2
3
4
R:W NEXT
R:W 3rd
R:W NEXT
R:W NEXT
AND.L #xx:32,ERd R:W 2nd
R:W 3rd
AND.L ERs,ERd
R:W 2nd
R:W NEXT
ANDC #xx:8,CCR
R:W NEXT
ANDC #xx:8,EXR
R:W 2nd
BAND #xx:3,Rd
R:W NEXT
R:W NEXT
R:W NEXT
BAND #xx:3,@ERd R:W 2nd
R:B EA
R:W:M
NEXT
BAND #xx:3,@aa:8 R:W 2nd
R:B EA
R:W:M
NEXT
BAND #xx:3,
@aa:16
R:W 2nd
R:W 3rd
R:B EA
R:W:M
NEXT
BAND #xx:3,
@aa:32
R:W 2nd
R:W 3rd
R:W 4th
R:B EA
BRA d:8
(BT d:8) R:W NEXT R:W EA
BRN d:8
(BF d:8) R:W NEXT R:W EA
BHI d:8
R:W NEXT R:W EA
BLS d:8
R:W NEXT R:W EA
BCC d:8 (BHS d:8) R:W NEXT R:W EA
BCS d:8 (BLO d:8) R:W NEXT R:W EA
BNE d:8
R:W NEXT R:W EA
BEQ d:8
R:W NEXT R:W EA
BVC d:8
R:W NEXT R:W EA
BVS d:8
R:W NEXT R:W EA
BPL d:8
R:W NEXT R:W EA
694
5
R:W:M
NEXT
6
7
8
9
Instruction
1
2
BMI d:8
R:W NEXT R:W EA
BGE d:8
R:W NEXT R:W EA
BLT d:8
R:W NEXT R:W EA
BGT d:8
R:W NEXT R:W EA
BLE d:8
R:W NEXT R:W EA
3
BRA d:16 (BT d:16) R:W 2nd
Internal
R:W EA
operation,
1 state
BRN d:16 (BF d:16) R:W 2nd
Internal
R:W EA
operation,
1 state
BHI d:16
R:W 2nd
Internal
R:W EA
operation,
1 state
BLS d:16
R:W 2nd
Internal
R:W EA
operation,
1 state
BCC d:16
(BHS d:16)
R:W 2nd
Internal
R:W EA
operation,
1 state
BCS d:16
(BLO d:16)
R:W 2nd
Internal
R:W EA
operation,
1 state
BNE d:16
R:W 2nd
Internal
R:W EA
operation,
1 state
BEQ d:16
R:W 2nd
Internal
R:W EA
operation,
1 state
BVC d:16
R:W 2nd
Internal
R:W EA
operation,
1 state
BVS d:16
R:W 2nd
Internal
R:W EA
operation,
1 state
BPL d:16
R:W 2nd
Internal
R:W EA
operation,
1 state
BMI d:16
R:W 2nd
Internal
R:W EA
operation,
1 state
BGE d:16
R:W 2nd
Internal
R:W EA
operation,
1 state
4
5
6
7
8
9
695
Instruction
1
2
3
BLT d:16
R:W 2nd
Internal
R:W EA
operation,
1 state
BGT d:16
R:W 2nd
Internal
R:W EA
operation,
1 state
BLE d:16
R:W 2nd
Internal
R:W EA
operation,
1 state
BCLR #xx:3,Rd
R:W NEXT
4
BCLR #xx:3,@ERd R:W 2nd
R:B:M EA R:W:M
NEXT
W:B EA
BCLR #xx:3,@aa:8 R:W 2nd
R:B:M EA R:W:M
NEXT
W:B EA
BCLR#xx:3,@aa:16 R:W 2nd
R:W 3rd
R:B:M EA R:W:M
NEXT
BCLR#xx:3,@aa:32 R:W 2nd
R:W 3rd
R:W 4th
R:W NEXT
BCLR Rn,@ERd
R:W 2nd
R:B:M EA R:W:M
NEXT
W:B EA
BCLR Rn,@aa:8
R:W 2nd
R:B:M EA R:W:M
NEXT
W:B EA
BCLR Rn,@aa:16
R:W 2nd
R:W 3rd
R:B:M EA R:W:M
NEXT
BCLR Rn,@aa:32
R:W 2nd
R:W 3rd
R:W 4th
R:W NEXT
BIAND #xx:3,
@ERd
R:W 2nd
R:B EA
R:W:M
NEXT
BIAND #xx:3,
@aa:8
R:W 2nd
R:B EA
R:W:M
NEXT
BIAND #xx:3,
@aa:16
R:W 2nd
R:W 3rd
R:B EA
R:W:M
NEXT
BIAND #xx:3,
@aa:32
R:W 2nd
R:W 3rd
R:W 4th
R:B EA
BILD #xx:3,Rd
R:W NEXT
BILD #xx:3,@ERd
R:W 2nd
R:B EA
R:W:M
NEXT
BILD #xx:3,@aa:8
R:W 2nd
R:B EA
R:W:M
NEXT
R:W 3rd
R:B: EA
696
R:W:M
NEXT
W:B EA
W:B EA
R:B:M EA R:W:M
NEXT
BIAND #xx:3,Rd
6
W:B EA
R:B:M EA R:W:M
NEXT
BCLR Rn,Rd
BILD #xx:3,@aa:16 R:W 2nd
5
R:W:M
NEXT
W:B EA
7
8
9
Instruction
1
BILD #xx:3,@aa:32 R:W 2nd
2
3
4
R:W 3rd
R:W 4th
BIOR #xx:3,@ERd R:W 2nd
R:B EA
R:W:M
NEXT
BIOR #xx:3,@aa:8 R:W 2nd
R:B EA
R:W:M
NEXT
BIOR #xx:3,@aa:16 R:W 2nd
R:W 3rd
R:B EA
R:W:M
NEXT
BIOR #xx:3,@aa:32 R:W 2nd
R:W 3rd
R:W 4th
R:B EA
BIOR #xx:3,Rd
R:B EA
6
7
8
9
R:W:M
NEXT
R:W NEXT
BIST #xx:3,Rd
R:W NEXT
BIST #xx:3,@ERd
R:W 2nd
R:B:M EA R:W:M
NEXT
W:B EA
BIST #xx:3,@aa:8
R:W 2nd
R:B:M EA R:W:M
NEXT
W:B EA
BIST #xx:3,@aa:16 R:W 2nd
R:W 3rd
R:B:M EA R:W:M
NEXT
BIST #xx:3,@aa:32 R:W 2nd
R:W 3rd
R:W 4th
R:W:M
NEXT
W:B EA
R:B:M EA R:W:M
NEXT
BIXOR #xx:3,Rd
R:W NEXT
BIXOR #xx:3,
@ERd
R:W 2nd
R:B EA
R:W:M
NEXT
BIXOR #xx:3,
@aa:8
R:W 2nd
R:B EA
R:W:M
NEXT
BIXOR #xx:3,
@aa:16
R:W 2nd
R:W 3rd
R:B EA
R:W:M
NEXT
BIXOR #xx:3,
@aa:32
R:W 2nd
R:W 3rd
R:W 4th
R:B EA
BLD #xx:3,Rd
R:W NEXT
BLD #xx:3,@ERd
R:W 2nd
R:B EA
R:W:M
NEXT
BLD #xx:3,@aa:8
R:W 2nd
R:B EA
R:W:M
NEXT
BLD #xx:3,@aa:16 R:W 2nd
R:W 3rd
R:B EA
R:W:M
NEXT
BLD #xx:3,@aa:32 R:W 2nd
R:W 3rd
R:W 4th
R:B EA
BNOT #xx:3,Rd
5
W:B EA
R:W:M
NEXT
R:W:M
NEXT
R:W NEXT
BNOT #xx:3,@ERd R:W 2nd
R:B:M EA R:W:M
NEXT
W:B EA
697
Instruction
1
2
3
4
BNOT #xx:3,@aa:8 R:W 2nd
R:B:M EA R:W:M
NEXT
BNOT #xx:3,
@aa:16
R:W 2nd
R:W 3rd
R:B:M EA R:W:M
NEXT
BNOT #xx:3,
@aa:32
R:W 2nd
R:W 3rd
R:W 4th
BNOT Rn,Rd
R:W NEXT
BNOT Rn,@ERd
R:W 2nd
R:B:M EA R:W:M
NEXT
W:B EA
BNOT Rn,@aa:8
R:W 2nd
R:B:M EA R:W:M
NEXT
W:B EA
BNOT Rn,@aa:16
R:W 2nd
R:W 3rd
R:B:M EA R:W:M
NEXT
BNOT Rn,@aa:32
R:W 2nd
R:W 3rd
R:W 4th
BOR #xx:3,Rd
R:W NEXT
BOR #xx:3,@ERd
R:W 2nd
R:B EA
R:W:M
NEXT
BOR #xx:3,@aa:8
R:W 2nd
R:B EA
R:W:M
NEXT
BOR #xx:3,@aa:16 R:W 2nd
R:W 3rd
R:B EA
R:W:M
NEXT
BOR #xx:3,@aa:32 R:W 2nd
R:W 3rd
R:W 4th
R:B EA
BSET #xx:3,Rd
6
W:B EA
W:B EA
R:B:M EA R:W:M
NEXT
W:B EA
W:B EA
R:B:M EA R:W:M
NEXT
W:B EA
R:W NEXT
R:W NEXT
BSET #xx:3,@ERd R:W 2nd
R:B:M EA R:W:M
NEXT
W:B EA
BSET #xx:3,@aa:8 R:W 2nd
R:B:M EA R:W:M
NEXT
W:B EA
BSET #xx:3,
@aa:16
R:W 2nd
R:W 3rd
R:B:M EA R:W:M
NEXT
BSET #xx:3,
@aa:32
R:W 2nd
R:W 3rd
R:W 4th
BSET Rn,Rd
R:W NEXT
BSET Rn,@ERd
R:W 2nd
R:B:M EA R:W:M
NEXT
W:B EA
BSET Rn,@aa:8
R:W 2nd
R:B:M EA R:W:M
NEXT
W:B EA
BSET Rn,@aa:16
R:W 2nd
R:W 3rd
R:B:M EA R:W:M
NEXT
BSET Rn,@aa:32
R:W 2nd
R:W 3rd
R:W 4th
698
5
W:B EA
R:B:M EA R:W:M
NEXT
W:B EA
W:B EA
R:B:M EA R:W:M
NEXT
W:B EA
7
8
9
Instruction
1
2
BSR
d:8
Advanced R:W NEXT R:W EA
BSR
d:16
Advanced R:W 2nd
3
W:W:M
Stack (H)
4
5
6
8
9
W:W
Stack (L)
Internal
R:W EA
operation,
1 state
W:W:M
Stack (H)
BST #xx:3,Rd
R:W NEXT
BST #xx:3,@ERd
R:W 2nd
R:B:M EA R:W:M
NEXT
W:B EA
BST #xx:3,@aa:8
R:W 2nd
R:B:M EA R:W:M
NEXT
W:B EA
W:W
Stack (L)
BST #xx:3,@aa:16 R:W 2nd
R:W 3rd
R:B:M EA R:W:M
NEXT
BST #xx:3,@aa:32 R:W 2nd
R:W 3rd
R:W 4th
BTST #xx:3,@ERd R:W 2nd
R:B EA
R:W:M
NEXT
BTST #xx:3,@aa:8 R:W 2nd
R:B EA
R:W:M
NEXT
BTST #xx:3,
@aa:16
R:W 2nd
R:W 3rd
R:B EA
R:W:M
NEXT
BTST #xx:3,
@aa:32
R:W 2nd
R:W 3rd
R:W 4th
R:B EA
BTST Rn,Rd
R:W NEXT
BTST Rn,@ERd
R:W 2nd
R:B EA
R:W:M
NEXT
BTST Rn,@aa:8
R:W 2nd
R:B EA
R:W:M
NEXT
BTST Rn,@aa:16
R:W 2nd
R:W 3rd
R:B EA
R:W:M
NEXT
BTST Rn,@aa:32
R:W 2nd
R:W 3rd
R:W 4th
R:B EA
BXOR #xx:3,Rd
R:W NEXT
BXOR #xx:3,@ERd R:W 2nd
R:B EA
R:W:M
NEXT
BXOR #xx:3,@aa:8 R:W 2nd
R:B EA
R:W:M
NEXT
BXOR #xx:3,
@aa:16
R:W 2nd
R:W 3rd
R:B EA
R:W:M
NEXT
BXOR #xx:3,
@aa:32
R:W 2nd
R:W 3rd
R:W 4th
R:B EA
CLRMAC
Cannot be used in the H8S/2128 Series and H8S/2124 Series
BTST #xx:3,Rd
7
W:B EA
R:B:M EA R:W:M
NEXT
W:B EA
R:W NEXT
R:W:M
NEXT
R:W:M
NEXT
R:W:M
NEXT
699
Instruction
1
CMP.B #xx:8,Rd
R:W NEXT
CMP.B Rs,Rd
R:W NEXT
CMP.W #xx:16,Rd
R:W 2nd
CMP.W Rs,Rd
R:W NEXT
CMP.L #xx:32,ERd R:W 2nd
CMP.L ERs,ERd
R:W NEXT
DAA Rd
R:W NEXT
DAS Rd
R:W NEXT
DEC.B Rd
R:W NEXT
DEC.W #1/2,Rd
R:W NEXT
2
3
4
5
6
R:W NEXT
R:W 3rd
R:W NEXT
DEC.L #1/2,ERd
R:W NEXT
DIVXS.B Rs,Rd
R:W 2nd
R:W NEXT Internal operation, 11 states
DIVXS.W Rs,ERd
R:W 2nd
R:W NEXT Internal operation, 19 states
DIVXU.B Rs,Rd
R:W NEXT Internal operation, 11 states
DIVXU.W Rs,ERd
R:W NEXT Internal operation, 19 states
EEPMOV.B
R:W 2nd
R:B EAs*1 R:B EAd* 1 R:B EAs*2 W:B EAd*2 R:W NEXT
EEPMOV.W
R:W 2nd
R:B EAs*1 R:B EAd* 1 R:B EAs*2 W:B EAd*2 R:W NEXT
EXTS.W Rd
R:W NEXT
EXTS.L ERd
R:W NEXT
EXTU.W Rd
R:W NEXT
EXTU.L ERd
R:W NEXT
INC.B Rd
R:W NEXT
INC.W #1/2,Rd
R:W NEXT
INC.L #1/2,ERd
R:W NEXT
JMP @ERn
R:W NEXT R:W EA
JMP @aa:24
R:W 2nd
← Repeated n times *2 →
Internal
R:W EA
operation,
1 state
JMP
Advanced R:W NEXT R:W:M
@@aa:8
aa:8
R:W aa:8
Internal
R:W EA
operation,
1 state
JSR
@ERn
W:W:M
Stack (H)
W:W
Stack (L)
Advanced R:W NEXT R:W EA
JSR
Advanced R:W 2nd
@aa:24
Internal
R:W EA
operation,
1 state
JSR
Advanced R:W NEXT R:W:M
@@aa:8
aa:8
700
R:W aa:8
W:W:M
Stack (H)
W:W
Stack (L)
W:W:M
Stack (H)
W:W
Stack (L)
R:W EA
7
8
9
Instruction
1
2
3
4
5
6
LDC #xx:8,CCR
R:W NEXT
LDC #xx:8,EXR
R:W 2nd
LDC Rs,CCR
R:W NEXT
LDC Rs,EXR
R:W NEXT
LDC @ERs,CCR
R:W 2nd
R:W NEXT R:W EA
LDC @ERs,EXR
R:W 2nd
R:W NEXT R:W EA
LDC@(d:16,ERs),
CCR
R:W 2nd
R:W 3rd
R:W NEXT R:W EA
LDC@(d:16,ERs),
EXR
R:W 2nd
R:W 3rd
R:W NEXT R:W EA
LDC@(d:32,ERs),
CCR
R:W 2nd
R:W 3rd
R:W 4th
R:W 5th
R:W NEXT R:W EA
LDC@(d:32,ERs),
EXR
R:W 2nd
R:W 3rd
R:W 4th
R:W 5th
R:W NEXT R:W EA
LDC @ERs+,CCR
R:W 2nd
R:W NEXT Internal
R:W EA
operation,
1 state
LDC @ERs+,EXR
R:W 2nd
R:W NEXT Internal
R:W EA
operation,
1 state
LDC @aa:16,CCR
R:W 2nd
R:W 3rd
R:W NEXT R:W EA
LDC @aa:16,EXR
R:W 2nd
R:W 3rd
R:W NEXT R:W EA
LDC @aa:32,CCR
R:W 2nd
R:W 3rd
R:W 4th
R:W NEXT R:W EA
LDC @aa:32,EXR
R:W 2nd
R:W 3rd
R:W 4th
R:W NEXT R:W EA
LDM.L @SP+,
(ERn-ERn+1)* 9
R:W 2nd
R:W:M
NEXT
Internal
R:W:M
operation, Stack (H)
1 state
*3
R:W
Stack (L)
*3
LDM.L @SP+,
(ERn-ERn+2) *9
R:W 2nd
R:W:M
NEXT
Internal
R:W:M
operation, Stack (H)
1 state
*3
R:W
Stack (L)
*3
LDM.L @SP+,
(ERn-ERn+3) *9
R:W 2nd
R:W:M
NEXT
Internal
R:W:M
operation, Stack (H)
1 state
*3
R:W
Stack (L)
*3
7
8
9
R:W NEXT
LDMAC ERs,MACH Cannot be used in the H8S/2128 Series and H8S/2124 Series
LDMAC ERs,MACL
MAC @ERn+,
@ERm+
MOV.B #xx:8,Rd
R:W NEXT
MOV.B Rs,Rd
R:W NEXT
MOV.B @ERs,Rd
R:W NEXT R:B EA
MOV.B
@(d:16,ERs),Rd
R:W 2nd
R:W NEXT R:B EA
701
Instruction
MOV.B
@(d:32,ERs),Rd
1
R:W 2nd
2
R:W 3rd
3
R:W 4th
4
5
R:W NEXT R:B EA
MOV.B @ERs+,Rd R:W NEXT Internal
R:B EA
operation,
1 state
MOV.B @aa:8,Rd
R:W NEXT R:B EA
MOV.B @aa:16,Rd R:W 2nd
R:W NEXT R:B EA
MOV.B @aa:32,Rd R:W 2nd
R:W 3rd
R:W NEXT R:B EA
MOV.B Rs,@ERd
R:W NEXT W:B EA
MOV.B Rs,
@(d:16,ERd)
R:W 2nd
R:W NEXT W:B EA
MOV.B Rs,
@(d:32,ERd)
R:W 2nd
R:W 3rd
R:W 4th
R:W NEXT W:B EA
MOV.B Rs,@-ERd R:W NEXT Internal
W:B EA
operation,
1 state
MOV.B Rs,@aa:8
R:W NEXT W:B EA
MOV.B Rs,@aa:16 R:W 2nd
R:W NEXT W:B EA
MOV.B Rs,@aa:32 R:W 2nd
R:W 3rd
MOV.W #xx:16,Rd
R:W 2nd
R:W NEXT
MOV.W Rs,Rd
R:W NEXT
MOV.W @ERs,Rd
R:W NEXT R:W EA
MOV.W
@(d:16,ERs),Rd
R:W 2nd
R:W NEXT R:W EA
MOV.W
@(d:32,ERs),Rd
R:W 2nd
R:W 3rd
R:W NEXT W:B EA
R:W 4th
R:W NEXT R:W EA
MOV.W @ERs+,Rd R:W NEXT Internal
R:W EA
operation,
1 state
MOV.W @aa:16,Rd R:W 2nd
R:W NEXT R:W EA
MOV.W @aa:32,Rd R:W 2nd
R:W 3rd
R:W NEXT R:B EA
MOV.W Rs,@ERd
R:W NEXT W:W EA
MOV.W Rs,
@(d:16,ERd)
R:W 2nd
R:W NEXT W:W EA
MOV.W Rs,
@(d:32,ERd)
R:W 2nd
R:W 3rd
R:W 4th
R:W NEXT W:W EA
MOV.W Rs,@-ERd R:W NEXT Internal
W:W EA
operation,
1 state
MOV.W Rs,@aa:16 R:W 2nd
R:W NEXT W:W EA
MOV.W Rs,@aa:32 R:W 2nd
R:W 3rd
702
R:W NEXT W:W EA
6
7
8
9
Instruction
1
MOV.L #xx:32,ERd R:W 2nd
2
3
4
5
R:W 3rd
R:W NEXT
MOV.L @ERs,ERd R:W 2nd
R:W:M
NEXT
R:W:M EA R:W EA+2
MOV.L
@(d:16,ERs),ERd
R:W 2nd
R:W:M 3rd R:W NEXT R:W:M EA R:W EA+2
MOV.L
@(d:32,ERs),ERd
R:W 2nd
R:W:M 3rd R:W:M 4th R:W 5th
MOV.L @ERs+,
ERd
R:W 2nd
R:W:M
NEXT
MOV.L @aa:16,
ERd
R:W 2nd
R:W:M 3rd R:W NEXT R:W:M EA R:W EA+2
MOV.L @aa:32,
ERd
R:W 2nd
R:W:M 3rd R:W 4th
MOV.L ERs,ERd
6
7
8
9
R:W NEXT
R:W NEXT R:W:M EA R:W EA+2
Internal
R:W:M EA R:W EA+2
operation,
1 state
R:W NEXT R:W:M EA R:W EA+2
MOV.L ERs,@ERd R:W 2nd
R:W:M
NEXT
W:W:M EA W:W EA+2
MOV.L ERs,
@(d:16,ERd)
R:W 2nd
R:W:M 3rd R:W NEXT W:W:M EA W:W EA+2
MOV.L ERs,
@(d:32,ERd)
R:W 2nd
R:W:M 3rd R:W:M 4th R:W 5th
R:W NEXT W:W:M EA W:W EA+2
MOV.L ERs,@-ERd R:W 2nd
R:W:M
NEXT
Internal
W:W:M EA W:W EA+2
operation,
1 state
MOV.L ERs,
@aa:16
R:W 2nd
R:W:M 3rd R:W NEXT W:W:M EA W:W EA+2
MOV.L ERs,
@aa:32
R:W 2nd
R:W:M 3rd R:W 4th
MOVFPE
@aa:16,Rd
Cannot be used in the H8S/2128 Series and H8S/2124 Series
R:W NEXT W:W:M EA W:W EA+2
MOVTPE
Rs,@aa:16
MULXS.B Rs,Rd
R:W 2nd
R:W NEXT Internal operation, 11 states
MULXS.W Rs,ERd R:W 2nd
R:W NEXT Internal operation, 19 states
MULXU.B Rs,Rd
R:W NEXT Internal operation, 11 states
MULXU.W Rs,ERd R:W NEXT Internal operation, 19 states
NEG.B Rd
R:W NEXT
NEG.W Rd
R:W NEXT
NEG.L ERd
R:W NEXT
NOP
R:W NEXT
NOT.B Rd
R:W NEXT
NOT.W Rd
R:W NEXT
703
Instruction
1
NOT.L ERd
R:W NEXT
OR.B #xx:8,Rd
R:W NEXT
OR.B Rs,Rd
R:W NEXT
OR.W #xx:16,Rd
R:W 2nd
2
3
R:W NEXT
OR.L #xx:32,ERd
R:W 2nd
R:W 3rd
OR.L ERs,ERd
R:W 2nd
R:W NEXT
ORC #xx:8,CCR
R:W NEXT
R:W NEXT
ORC #xx:8,EXR
R:W 2nd
POP.W Rn
R:W NEXT Internal
R:W EA
operation,
1 state
POP.L ERn
R:W 2nd
PUSH.W Rn
R:W NEXT Internal
W:W EA
operation,
1 state
PUSH.L ERn
R:W 2nd
ROTL.B Rd
R:W NEXT
ROTL.B #2,Rd
R:W NEXT
ROTL.W Rd
R:W NEXT
R:W NEXT
ROTL.L ERd
R:W NEXT
ROTL.L #2,ERd
R:W NEXT
ROTR.B Rd
R:W NEXT
ROTR.B #2,Rd
R:W NEXT
ROTR.W Rd
R:W NEXT
ROTR.W #2,Rd
R:W NEXT
ROTR.L ERd
R:W NEXT
ROTR.L #2,ERd
R:W NEXT
ROTXL.B Rd
R:W NEXT
ROTXL.B #2,Rd
R:W NEXT
ROTXL.W Rd
R:W NEXT
ROTXL.W #2,Rd
R:W NEXT
ROTXL.L ERd
R:W NEXT
704
5
R:W NEXT
OR.W Rs,Rd
ROTL.W #2,Rd
4
R:W NEXT
R:W:M
NEXT
R:W:M
NEXT
Internal
R:W:M EA R:W EA+2
operation,
1 state
Internal
W:W:M EA W:W EA+2
operation,
1 state
6
7
8
9
Instruction
1
2
ROTXL.L #2,ERd
R:W NEXT
ROTXR.B Rd
R:W NEXT
ROTXR.B #2,Rd
R:W NEXT
ROTXR.W Rd
R:W NEXT
ROTXR.W #2,Rd
R:W NEXT
ROTXR.L ERd
R:W NEXT
ROTXR.L #2,ERd
R:W NEXT
RTE
R:W NEXT R:W
Stack
(EXR)
RTS
Advanced R:W NEXT R:W:M
Stack (H)
SHAL.B Rd
R:W NEXT
SHAL.B #2,Rd
R:W NEXT
SHAL.W Rd
R:W NEXT
SHAL.W #2,Rd
R:W NEXT
SHAL.L ERd
R:W NEXT
SHAL.L #2,ERd
R:W NEXT
SHAR.B Rd
R:W NEXT
SHAR.B #2,Rd
R:W NEXT
SHAR.W Rd
R:W NEXT
SHAR.W #2,Rd
R:W NEXT
SHAR.L ERd
R:W NEXT
SHAR.L #2,ERd
R:W NEXT
SHLL.B Rd
R:W NEXT
SHLL.B #2,Rd
R:W NEXT
SHLL.W Rd
R:W NEXT
SHLL.W #2,Rd
R:W NEXT
SHLL.L ERd
R:W NEXT
SHLL.L #2,ERd
R:W NEXT
SHLR.B Rd
R:W NEXT
SHLR.B #2,Rd
R:W NEXT
SHLR.W Rd
R:W NEXT
SHLR.W #2,Rd
R:W NEXT
SHLR.L ERd
R:W NEXT
SHLR.L #2,ERd
R:W NEXT
3
4
5
6
7
8
9
Internal
R:W *4
operation,
1 state
R:W
Stack (H)
R:W
Stack (L)
R:W
Stack (L)
Internal
R:W *4
operation,
1 state
705
Instruction
SLEEP
1
2
3
4
5
6
R:W NEXT Internal
operation
:M
STC CCR,Rd
R:W NEXT
STC EXR,Rd
R:W NEXT
STC CCR,@ERd
R:W 2nd
R:W NEXT W:W EA
STC EXR,@ERd
R:W 2nd
R:W NEXT W:W EA
STC CCR,
@(d:16,ERd)
R:W 2nd
R:W 3rd
R:W NEXT W:W EA
STC EXR,
@(d:16,ERd)
R:W 2nd
R:W 3rd
R:W NEXT W:W EA
STC CCR,
@(d:32,ERd)
R:W 2nd
R:W 3rd
R:W 4th
R:W 5th
R:W NEXT W:W EA
STC EXR,
@(d:32,ERd)
R:W 2nd
R:W 3rd
R:W 4th
R:W 5th
R:W NEXT W:W EA
STC CCR,@-ERd
R:W 2nd
R:W NEXT Internal
W:W EA
operation,
1 state
STC EXR,@-ERd
R:W 2nd
R:W NEXT Internal
W:W EA
operation,
1 state
STC CCR,@aa:16
R:W 2nd
R:W 3rd
R:W NEXT W:W EA
STC EXR,@aa:16
R:W 2nd
R:W 3rd
R:W NEXT W:W EA
STC CCR,@aa:32
R:W 2nd
R:W 3rd
R:W 4th
R:W NEXT W:W EA
STC EXR,@aa:32
R:W 2nd
R:W 3rd
R:W 4th
R:W NEXT W:W EA
STM.L
(ERn-ERn+1),
@-SP* 9
R:W 2nd
R:W:M
NEXT
Internal
W:W:M
operation, Stack (H)
1 state
*3
W:W
Stack (L)
*3
STM.L
(ERn-ERn+2),
@-SP* 9
R:W 2nd
R:W:M
NEXT
Internal
W:W:M
operation, Stack (H)
1 state
*3
W:W
Stack (L)
*3
STM.L
(ERn-ERn+3),
@-SP* 9
R:W 2nd
R:W:M
NEXT
Internal
W:W:M
operation, Stack (H)
1 state
*3
W:W
Stack (L)
*3
STMAC MACH,ERd Cannot be used in the H8S/2128 Series and H8S/2124 Series
STMAC MACL,ERd
SUB.B Rs,Rd
R:W NEXT
SUB.W #xx:16,Rd
R:W 2nd
SUB.W Rs,Rd
R:W NEXT
SUB.L #xx:32,ERd R:W 2nd
SUB.L ERs,ERd
706
R:W NEXT
R:W NEXT
R:W 3rd
R:W NEXT
7
8
9
Instruction
1
SUBS #1/2/4,ERd
R:W NEXT
SUBX #xx:8,Rd
R:W NEXT
SUBX Rs,Rd
R:W NEXT
TAS @ERd* 8
R:W 2nd
2
3
R:W NEXT
XOR.B Rs,Rd
R:W NEXT
XOR.W #xx:16,Rd
R:W 2nd
XOR.W Rs,Rd
R:W NEXT
5
6
7
8
9
R:W NEXT R:B:M EA W:B EA
TRAPA Advanced R:W NEXT Internal
W:W
#x:2
operation, Stack (L)
1 state
XOR.B #xx8,Rd
4
W:W
Stack (H)
W:W
Stack
(EXR)
R:W:M
VEC
R:W
VEC+2
Internal
R:W *7
operation,
1 state
W:W
Stack
(EXR)
R:W:M
VEC
R:W
VEC+2
Internal
R:W *7
operation,
1 state
R:W NEXT
XOR.L #xx:32,ERd R:W 2nd
R:W 3rd
XOR.L ERs,ERd
R:W 2nd
R:W NEXT
XORC #xx:8,CCR
R:W NEXT
XORC #xx:8,EXR
R:W 2nd
R:W NEXT
R:W NEXT
Internal
R:W *5
operation,
1 state
Reset
Advanced R:W:M
excepVEC
tion
handling
R:W
VEC+2
Interrupt Advanced R:W *6
exception
handling
Internal
W:W
operation, Stack (L)
1 state
W:W
Stack (H)
Notes: 1. EAs is the contents of ER5. EAd is the contents of ER6.
2. EAs is the contents of ER5. EAd is the contents of ER6. Both registers are incremented
by 1 after execution of the instruction. n is the initial value of R4L or R4. If n = 0, these
bus cycles are not executed.
3. Repeated two times to save or restore two registers, three times for three registers, or
four times for four registers.
4. Start address after return.
5. Start address of the program.
6. Prefetch address, equal to two plus the PC value pushed onto the stack. In recovery
from sleep mode or software standby mode the read operation is replaced by an
internal operation.
7. Start address of the interrupt-handling routine.
8. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
9. Only registers ER0 to ER6 should be used when using the STM/LDM instruction.
707
Appendix B Internal I/O Registers
B.1
Addresses
Register
Address Name
H'EC00
to
H'EFFF
MRA
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
Bus
Width
SM1
SM0
DM1
DM0
MD1
MD0
DTS
Sz
DTC
16/32*
CHN E
DISEL
—
—
—
—
—
—
IrCKS2
IrCKS1
IrCKS0
KBADE
KBCH2
KBCH1
KBCH0
Expansion 8
A/D
SAR
MRB
DAR
CRA
CRB
H'FEE4
KBCOMP IrE
H'FEE6
DDCSWR SWE
SW
IE
IF
CLR3
CLR2
CLR1
CLR0
IIC0
8
H'FEE8
ICRA
ICR7
ICR6
ICR5
ICR4
ICR3
ICR2
ICR1
ICR0
8
H'FEE9
Interrupt
controller
DTC
8
Interrupt
controller
8
ICRB
ICR7
ICR6
ICR5
ICR4
ICR3
ICR2
ICR1
ICR0
H'FEEA ICRC
ICR7
ICR6
ICR5
ICR4
ICR3
ICR2
ICR1
ICR0
H'FEEB ISR
—
—
—
—
—
IRQ2F
IRQ1F
IRQ0F
H'FEEC ISCRH
—
—
—
—
—
—
—
—
H'FEED ISCRL
—
—
IRQ2SCB IRQ2SCA IRQ1SCB IRQ1SCA IRQ0SCB IRQ0SCA
H'FEEE DTCERA
DTCEA7 DTCEA6 DTCEA5 DTCEA4 DTCEA3 DTCEA2 DTCEA1 DTCEA0
H'FEEF DTCERB
DTCEB7 DTCEB6 DTCEB5 DTCEB4 DTCEB3 DTCEB2 DTCEB1 DTCEB0
H'FEF0
DTCERC
DTCEC7 DTCEC6 DTCEC5 DTCEC4 DTCEC3 DTCEC2 DTCEC1 DTCEC0
H'FEF1
DTCERD
DTCED7 DTCED6 DTCED5 DTCED4 DTCED3 DTCED2 DTCED1 DTCED0
H'FEF2
DTCERE
DTCEE7 DTCEE6 DTCEE5 DTCEE4 DTCEE3 DTCEE2 DTCEE1 DTCEE0
H'FEF3
DTVECR
SWDTE
DTVEC6 DTVEC5 DTVEC4 DTVEC3 DTVEC2 DTVEC1 DTVEC0
H'FEF4
ABRKCR
CMF
—
—
—
—
—
—
BIE
H'FEF5
BARA
A23
A22
A21
A20
A19
A18
A17
A16
H'FEF6
BARB
A15
A14
A13
A12
A11
A10
A9
A8
H'FEF7
BARC
A7
A6
A5
A4
A3
A2
A1
—
708
Register
Address Name
Bit 7
H'FF80
FLMCR1
FWE
SWE
—
—
EV
PV
H'FF81
FLMCR2
FLER
—
—
—
—
—
H'FF82
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 0
Module
Name
Bus
Width
E
P
FLASH
8
ESU
PSU
Bit 1
PCSR
—
—
—
—
—
PWCKB
PWCKA
—
PWM
8
EBR1
—
—
—
—
—
—
EB9
EB8
FLASH
8
H'FF83
EBR2
EB7
EB6
EB5
EB4
EB3
EB2
EB1
EB0
H'FF84
SBYCR
SSBY
STS2
STS1
STS0
—
SCK2
SCK1
SCK0
SYSTEM
8
H'FF85
LPWRCR DTON
LSON
NESEL
EXCLE
—
—
—
H'FF86
MSTPCRH MSTP15 MSTP14 MSTP13 MSTP12 MSTP11 MSTP10 MSTP9
MSTP8
H'FF87
MSTPCRL MSTP7
MSTP6
MSTP5
MSTP4
MSTP3
MSTP2
MSTP1
MSTP0
H'FF88
SMR1
C/A
CHR
PE
O/E
STOP
MP
CKS1
CKS0
SCI1
8
ICCR1
ICE
IEIC
MST
TRS
ACKE
BBSY
IRIC
SCP
IIC1
H'FF89
—
BRR1
SCI1
8
ICSR1
ESTP
STOP
IRTR
AASX
AL
AAS
ADZ
ACKB
IIC1
H'FF8A
SCR1
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
SCI1
8
H'FF8B
TDR1
H'FF8C
SSR1
TDRE
RDRF
ORER
FER
PER
TEND
MPB
MPBT
IIC1
8
FRT
16
H'FF8D
RDR1
H'FF8E
SCMR1
—
—
—
—
SDIR
SINV
—
SMIF
ICDR1
ICDR7
ICDR6
ICDR5
ICDR4
ICDR3
ICDR2
ICDR1
ICDR0
SARX1
SVAX6
SVAX5
SVAX4
SVAX3
SVAX2
SVAX1
SVAX0
FSX
H'FF8F
ICMR1
MLS
WAIT
CKS2
CKS1
CKS0
BC2
BC1
BC0
SAR1
SVA6
SVA5
SVA4
SVA3
SVA2
SVA1
SVA0
FS
H'FF90
TIER
ICIAE
ICIBE
ICICE
ICIDE
OCIAE
OCIBE
OVIE
—
H'FF91
TCSR
ICFA
ICFB
ICFC
ICFD
OCFA
OCFB
OVF
CCLRA
H'FF92
FRCH
H'FF93
FRCL
IEDGB
IEDGC
IEDGD
BUFEA
BUFEB
CKS1
CKS0
OCRS
OEA
OEB
OLVLA
OLVLB
H'FF94
OCRAH
OCRBH
H'FF95
OCRAL
OCRBL
H'FF96
TCR
IEDGA
H'FF97
TOCR
ICRDMS OCRAMS ICRS
H'FF98
ICRAH
OCRARH
709
Register
Address Name
H'FF99
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ICRAL
Module
Name
Bus
Width
FRT
16
PWMX
8
WDT0
16
Ports
8
OCRARL
H'FF9A
ICRBH
OCRAFH
H'FF9B
ICRBL
OCRAFL
H'FF9C
ICRCH
OCRDMH 0
H'FF9D
0
0
0
0
0
0
0
ICRCL
OCRDML
H'FF9E
ICRDH
H'FF9F
ICRDL
H'FFA0
DADRAH
DA13
DA12
DA11
DA10
DA9
DA8
DA7
DA6
DACR
TEST
PWME
—
—
OEB
OEA
OS
CKS
H'FFA1
DADRAL
DA5
DA4
DA3
DA2
DA1
DA0
CFS
—
H'FFA6
DADRBH
DA13
DA12
DA11
DA10
DA9
DA8
DA7
DA6
DA5
DA4
DA3
DA2
DA1
DA0
CFS
REGS
—
REGS
OVF
WT/IT
TME
RSTS
RST/NMI CKS2
CKS1
CKS0
DACNTH
H'FFA7
DADRBL
DACNTL
H'FFA8
TCSR0
TCNT0
(write)
H'FFA9
TCNT0
(read)
H'FFAC P1PCR
P17PCR P16PCR P15PCR P14PCR P13PCR P12PCR P11PCR P10PCR
H'FFAD P2PCR
P27PCR P26PCR P25PCR P24PCR P23PCR P22PCR P21PCR P20PCR
H'FFAE P3PCR
P37PCR P36PCR P35PCR P34PCR P33PCR P32PCR P31PCR P30PCR
H'FFB0
P1DDR
P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR
H'FFB1
P2DDR
P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR
H'FFB2
P1DR
P17DR
P16DR
P15DR
P14DR
P13DR
P12DR
P11DR
P10DR
H'FFB3
P2DR
P27DR
P26DR
P25DR
P24DR
P23DR
P22DR
P21DR
P20DR
H'FFB4
P3DDR
P37DDR P36DDR P35DDR P34DDR P33DDR P32DDR P31DDR P30DDR
H'FFB5
P4DDR
P47DDR P46DDR P45DDR P44DDR P43DDR P42DDR P41DDR P40DDR
H'FFB6
P3DR
P37DR
P36DR
P35DR
P34DR
P33DR
P32DR
P31DR
P30DR
H'FFB7
P4DR
P47DR
P46DR
P45DR
P44DR
P43DR
P42DR
P41DR
P40DR
H'FFB8
P5DDR
—
—
—
—
—
P52DDR P51DDR P50DDR
H'FFB9
P6DDR
P67DDR P66DDR P65DDR P64DDR P63DDR P62DDR P61DDR P60DDR
H'FFBA P5DR
710
—
—
—
—
—
P52DR
P51DR
P50DR
Register
Address Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
Bus
Width
H'FFBB P6DR
P67DR
P66DR
P65DR
P64DR
P63DR
P62DR
P61DR
P60DR
Ports
8
H'FFBE P7PIN
P77PIN
P76PIN
P75PIN
P74PIN
P73PIN
P72PIN
P71PIN
P70PIN
H'FFC2
IER
—
—
—
—
—
IRQ2E
IRQ1E
IRQ0E
Interrupt
controller
8
H'FFC3
STCR
IICS
IICX1
IICX0
IICE
FLSHE
—
ICKS1
ICKS0
System
8
H'FFC4
SYSCR
CS2E
IOSE
INTM1
INTM0
XRST
NMIEG
HIE
RAME
H'FFC5
MDCR
EXPE
—
—
—
—
—
MDS1
MDS0
H'FFC6
BCR
ICIS1
ICIS0
BRSTRM BRSTS1 BRSTS0 —
IOS1
IOS0
WSCR
RAMS
RAM0
ABW
AST
WMS1
WMS0
WC1
WC0
Bus
controller
8
H'FFC7
H'FFC8
TCR0
CMIEB
CMIEA
OVIE
CCLR1
CCLR0
CKS2
CKS1
CKS0
TCR1
CMIEB
CMIEA
OVIE
CCLR1
CCLR0
CKS2
CKS1
CKS0
TMR0,
TMR1
16
H'FFC9
H'FFCA TCSR0
CMFB
CMFA
OVF
ADTE
OS3
OS2
OS1
OS0
H'FFCB TCSR1
CMFB
CMFA
OVF
—
OS3
OS2
OS1
OS0
PWM
8
8
H'FFCC TCORA0
H'FFCD TCORA1
H'FFCE TCORB0
H'FFCF TCORB1
H'FFD0
TCNT0
H'FFD1
TCNT1
H'FFD2
PWOERB OE15
OE14
OE13
OE12
OE11
OE10
OE9
OE8
H'FFD3
PWOERA OE7
OE6
OE5
OE4
OE3
OE2
OE1
OE0
H'FFD4
PWDPRB OS15
OS14
OS13
OS12
OS11
OS10
OS9
OS8
H'FFD5
PWDPRA OS7
OS6
OS5
OS4
OS3
OS2
OS1
OS0
H'FFD6
PWSL
PWCKE
PWCKS
—
—
RS3
RS2
RS1
RS0
H'FFD7
PWDR0
to
PWDR15
H'FFD8
SMR0
C/A
CHR
PE
O/E
STOP
MP
CKS1
CKS0
SCI0
ICCR0
ICE
IEIC
MST
TRS
ACKE
BBSY
IRIC
SCP
IIC0
H'FFD9
BRR0
ICSR0
SCI0
ESTP
STOP
IRTR
AASX
AL
AAS
ADZ
ACKB
IIC0
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
SCI0
TDRE
RDRF
ORER
FER
PER
TEND
MPB
MPBT
—
—
—
—
SDIR
SINV
—
SMIF
ICDR0
ICDR7
ICDR6
ICDR5
ICDR4
ICDR3
ICDR2
ICDR1
ICDR0
SARX0
SVAX6
SVAX5
SVAX4
SVAX3
SVAX2
SVAX1
SVAX0
FSX
H'FFDA SCR0
H'FFDB TDR0
H'FFDC SSR0
H'FFDD RDR0
H'FFDE SCMR0
IIC0
711
Register
Address Name
H'FFDF ICMR0
SAR0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
Bus
Width
IIC0
8
A/D
8
WDT1
16
8
MLS
WAIT
CKS2
CKS1
CKS0
BC2
BC1
BC0
SVA6
SVA5
SVA4
SVA3
SVA2
SVA1
SVA0
FS
H'FFE0
ADDRAH
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
H'FFE1
ADDRAL
AD1
AD0
—
—
—
—
—
—
H'FFE2
ADDRBH
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
H'FFE3
ADDRBL
AD1
AD0
—
—
—
—
—
—
H'FFE4
ADDRCH
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
H'FFE5
ADDRCL
AD1
AD0
—
—
—
—
—
—
H'FFE6
ADDRDH
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
H'FFE7
ADDRDL
AD1
AD0
—
—
—
—
—
—
H'FFE8
ADCSR
ADF
ADIE
ADST
SCAN
CKS
CH2
CH1
CH0
H'FFE9
ADCR
TRGS1
TRGS0
—
—
—
—
—
—
OVF
WT/IT
TME
PSS
RST/NMI CKS2
CKS1
CKS0
H'FFEA TCSR1
TCNT1
(write)
H'FFEB TCNT1
(read)
H'FFF0
H'FFF1
H'FFF2
H'FFF3
H'FFF4
H'FFF5
TCRX
CMIEB
CMIEA
OVIE
CCLR1
CCLR0
CKS2
CKS1
CKS0
TMRX
TCRY
CMIEB
CMIEA
OVIE
CCLR1
CCLR0
CKS2
CKS1
CKS0
TMRY
TCSRX
CMFB
CMFA
OVF
ICF
OS3
OS2
OS1
OS0
TMRX
TCSRY
CMFB
CMFA
OVF
ICIE
OS3
OS2
OS1
OS0
TMRY
TICRR
TMRX
TCORAY
TMRY
TICRF
TMRX
TCORBY
TMRY
TCNTX
TMRX
TCNTY
TMRY
TCORC
TISR
H'FFF6
TCORAX
H'FFF7
TCORBX
H'FFFC TCONRI
TMRX
—
—
—
—
—
—
—
IS
TMRX
SIMOD1 SIMOD0 SCONE
H'FFFD TCONRO HOE
VOE
CLOE
ICST
HFINV
VFINV
HIINV
CBOE
HOINV
VOINV
CLOINV CBOINV
VIINV
H'FFFE
TCONRS
TMRX/Y ISGENE HOMOD1 HOMOD0 VOMOD1 VOMOD0 CLMOD1 CLMOD0
H'FFFF
SEDGR
VEDG
712
TMRY
HEDG
CEDG
HFEDG
VFEDG
PREQF
IHI
IVI
Timer
8
connection
B.2
Register Selection Conditions
Lower
Register
Address Name
H8S/2128 Series Register Selection
Conditions
H8S/2124 Series Register Selection
Conditions
Module
Name
H'EC00
to
H'EFFF
RAME = 1 in SYSCR
—
DTC
MRA
SAR
MRB
DAR
CRA
CRB
H'FEE4
KBCOMP
No conditions
No conditions
Expansion
A/D
H'FEE6
DDCSWR
MSTP4 = 0
—
IIC0
H'FEE8
ICRA
No conditions
No conditions
H'FEE9
ICRB
Interrupt
controller
H'FEEA
ICRC
H'FEEB
ISR
H'FEEC
ISCRH
H'FEED
ISCRL
H'FEEE
DTCERA
No conditions
—
DTC
H'FEEF
DTCERB
H'FEF0
DTCERC
H'FEF1
DTCERD
H'FEF2
DTCERE
H'FEF3
DTVECR
H'FEF4
ABRKCR
No conditions
No conditions
H'FEF5
BARA
Interrupt
controller
H'FEF6
BARB
H'FEF7
BARC
H'FF80
FLMCR1
FLSHE = 1 in STCR
FLSHE = 1 in STCR
H'FF81
FLMCR2
Flash
memory
H'FF82
PCSR
FLSHE = 0 in STCR
—
PWM
EBR1
FLSHE = 1 in STCR
FLSHE = 1 in STCR
Flash
memory
H'FF83
EBR2
FLSHE = 1 in STCR
FLSHE = 1 in STCR
Flash
memory
H'FF84
SBYCR
FLSHE = 0 in STCR
FLSHE = 0 in STCR
System
H'FF85
LPWRCR
H'FF86
MSTPCRH
H'FF87
MSTPCRL
713
Lower
Register
Address Name
H8S/2128 Series Register Selection
Conditions
H8S/2124 Series Register
Selection Conditions
Module Name
H'FF88
SMR1
MSTP6=0, IICE=0 in STCR
MSTP6=0, IICE=0 in STCR
SCI1
ICCR1
MSTP3=0, IICE=1 in STCR
—
IIC1
BRR1
MSTP6=0, IICE=0 in STCR
MSTP6=0, IICE=0 in STCR
SCI1
ICSR1
MSTP3=0, IICE=1 in STCR
—
IIC1
H'FF8A
SCR1
MSTP6=0
MSTP6=0
SCI1
H'FF8B
TDR1
H'FF8C
SSR1
H'FF8D
RDR1
H'FF8E
SCMR1
MSTP6=0, IICE=0 in STCR
MSTP6=0, IICE=0 in STCR
ICDR1
MSTP3=0, IICE=1 in STCR ICE=1 in ICCR1
—
IIC1
MSTP13 = 0
FRT
H'FF89
SARX1
ICE = 0 in ICCR1
H'FF8F
ICMR1
ICE = 1 in ICCR1
H'FF90
TIER
H'FF91
TCSR
H'FF92
FRCH
H'FF93
FRCL
H'FF94
OCRAH
OCRBH
OCRS = 1 in TOCR
OCRS = 1 in TOCR
H'FF95
OCRAL
OCRS = 0 in TOCR
OCRS = 0 in TOCR
OCRBL
OCRS = 1 in TOCR
OCRS = 1 in TOCR
H'FF96
TCR
H'FF97
TOCR
H'FF98
ICRAH
ICRS = 0 in TOCR
ICRS = 0 in TOCR
OCRARH
ICRS = 1 in TOCR
ICRS = 1 in TOCR
H'FF99
ICRAL
ICRS = 0 in TOCR
ICRS = 0 in TOCR
OCRARL
ICRS = 1 in TOCR
ICRS = 1 in TOCR
H'FF9A
ICRBH
ICRS = 0 in TOCR
ICRS = 0 in TOCR
OCRAFH
ICRS = 1 in TOCR
ICRS = 1 in TOCR
H'FF9B
ICRBL
ICRS = 0 in TOCR
ICRS = 0 in TOCR
OCRAFL
ICRS = 1 in TOCR
ICRS = 1 in TOCR
H'FF9C
ICRCH
ICRS = 0 in TOCR
ICRS = 0 in TOCR
OCRDMH
ICRS = 1 in TOCR
ICRS = 1 in TOCR
H'FF9D
ICRCL
ICRS = 0 in TOCR
ICRS = 0 in TOCR
OCRDML
ICRS = 1 in TOCR
ICRS = 1 in TOCR
SAR1
714
ICE = 0 in ICCR1
MSTP13 = 0
OCRS = 0 in TOCR
OCRS = 0 in TOCR
Lower
Register
Address Name
H8S/2128 Series Register Selection
Conditions
H8S/2124 Series Register Selection
Conditions
Module
Name
H'FF9E
ICRDH
MSTP13 = 0
MSTP13 = 0
FRT
H'FF9F
ICRDL
H'FFA0
DADRAH
MSTP11 = 0, IICE = 1 in STCR REGS = 0
in DACNT/
DADRB
—
PWMX
—
PWMX
No conditions
No conditions
WDT0
No conditions
No conditions
Ports
DACR
REGS = 1
in DACNT/
DADRB
H'FFA1
DADRAL
MSTP11 = 0, IICE = 1 in STCR REGS = 0
in DACNT/
DADRB
H'FFA6
DADRBH
MSTP11 = 0, IICE = 1 in STCR REGS = 0
in DACNT/
DADRB
DACNTH
REGS = 1
in DACNT/
DADRB
DADRBL
REGS = 0
in DACNT/
DADRB
DACNTL
REGS = 1
in DACNT/
DADRB
H'FFA7
H'FFA8
TCSR0
TCNT0
(write)
H'FFA9
TCNT0
(read)
H'FFAC
P1PCR
H'FFAD
P2PCR
H'FFAE
P3PCR
H'FFB0
P1DDR
H'FFB1
P2DDR
H'FFB2
P1DR
H'FFB3
P2DR
H'FFB4
P3DDR
H'FFB5
P4DDR
H'FFB6
P3DR
H'FFB7
P4DR
H'FFB8
P5DDR
H'FFB9
P6DDR
H'FFBA
P5DR
H'FFBB
P6DR
715
Lower
Register
Address Name
H8S/2128 Series Register Selection
Conditions
H8S/2124 Series Register Selection
Conditions
Module
Name
H'FFBE
P7PIN
No conditions
No conditions
Ports
H'FFC2
IER
No conditions
No conditions
Interrupt
controller
H'FFC3
STCR
No conditions
No conditions
System
H'FFC4
SYSCR
H'FFC5
MDCR
H'FFC6
BCR
H'FFC7
WSCR
H'FFC8
TCR0
H'FFC9
TCR1
H'FFCA
TCSR0
H'FFCB
TCSR1
H'FFCC
TCORA0
H'FFCD
TCORA1
H'FFCE
TCORB0
Bus
controller
MSTP12 = 0
MSTP12 = 0
TMR0,
TMR1
No conditions
—
PWM
H'FFCF
TCORB1
H'FFD0
TCNT0
H'FFD1
TCNT1
H'FFD2
PWOERB
H'FFD3
PWOERA
H'FFD4
PWDPRB
H'FFD5
PWDPRA
H'FFD6
PWSL
H'FFD7
PWDR0 to
15
H'FFD8
SMR0
MSTP7 = 0, IICE = 0 in STCR
MSTP7 = 0, IICE = 0 in STCR
SCI0
ICCR0
MSTP4 = 0, IICE = 1 in STCR
—
IIC0
BRR0
MSTP7 = 0, IICE = 0 in STCR
MSTP7 = 0, IICE = 0 in STCR
SCI0
ICSR0
MSTP4 = 0, IICE = 1 in STCR
—
IIC0
H'FFDA
SCR0
MSTP7 = 0
MSTP7 = 0
SCI0
H'FFDB
TDR0
H'FFDC
SSR0
H'FFDD
RDR0
H'FFDE
SCMR0
MSTP7 = 0, IICE = 0 in STCR
ICDR0
MSTP4 = 0, IICE = 1 in STCR
H'FFD9
SARX0
716
MSTP11 = 0
MSTP7 = 0, IICE = 0 in STCR
ICE = 1
in ICCR0
ICE = 0
in ICCR0
—
IIC0
Lower
Register
Address Name
H8S/2128 Series Register Selection
Conditions
H8S/2124 Series Register Selection
Conditions
Module
Name
H'FFDF
MSTP4 = 0, IICE = 1 in STCR
—
IIC0
MSTP9 = 0
MSTP9 = 0
A/D
No conditions
No conditions
WDT1
ICMR0
SAR0
H'FFE0
ADDRAH
H'FFE1
ADDRAL
H'FFE2
ADDRBH
H'FFE3
ADDRBL
H'FFE4
ADDRCH
H'FFE5
ADDRCL
H'FFE6
ADDRDH
H'FFE7
ADDRDL
H'FFE8
ADCSR
H'FFE9
ADCR
H'FFEA
TCSR1
ICE = 1
in ICCR0
ICE = 0
in ICCR0
TCNT1
(write)
H'FFEB
TCNT1
(read)
H'FFF0
TCRX
TCRY
H'FFF1
TCSRX
TCSRY
H'FFF2
TICRR
TCORAY
H'FFF3
TICRF
TCORBY
H'FFF4
TCNTX
TCNTY
H'FFF5
TCORC
TISR
MSTP8 = 0, HIE = 0 in SYSCR TMRX/Y = 0 —
in TCONRS
TMRX/Y = 1 MSTP8 = 0, HIE = 0 in SYSCR
in TCONRS
MSTP8 = 0, HIE = 0 in SYSCR TMRX/Y = 0 —
in TCONRS
TMRX/Y = 1 MSTP8 = 0, HIE = 0 in SYSCR
in TCONRS
MSTP8 = 0, HIE = 0 in SYSCR TMRX/Y = 0 —
in TCONRS
TMRX/Y = 1 MSTP8 = 0, HIE = 0 in SYSCR
in TCONRS
MSTP8 = 0, HIE = 0 in SYSCR TMRX/Y = 0 —
in TCONRS
TMRX/Y = 1 MSTP8 = 0, HIE = 0 in SYSCR
in TCONRS
MSTP8 = 0, HIE = 0 in SYSCR TMRX/Y = 0 —
in TCONRS
TMRX/Y = 1 MSTP8 = 0, HIE = 0 in SYSCR
in TCONRS
MSTP8 = 0, HIE = 0 in SYSCR TMRX/Y = 0 —
in TCONRS
TMRX/Y = 1 MSTP8 = 0, HIE = 0 in SYSCR
in TCONRS
TMRX
TMRY
TMRX
TMRY
TMRX
TMRY
TMRX
TMRY
TMRX
TMRY
TMRX
TMRY
717
Lower
Register
Address Name
H8S/2128 Series Register Selection
Conditions
H'FFF6
TCORAX
TMRX
H'FFF7
TCORBX
MSTP8 = 0, HIE = 0 in SYSCR TMRX/Y = 0 —
in TCONRS
H'FFFC
TCONRI
MSTP8 = 0, HIE = 0 in SYSCR
H'FFFD
TCONRO
Timer
connection
H'FFFE
TCONRS
H'FFFF
SEDGR
718
H8S/2124 Series Register Selection
Conditions
—
Module
Name
B.3
Functions
Register
acronym
Register
name
Address to which the
register is mapped
DACR—D/A Control Register
H'FFFA
Name of
on-chip
supporting
module
D/A Converter
Bit
numbers
Bit
Initial bit
values
7
6
5
4
3
2
1
0
DAOE1
DAOE0
DAE
—
—
—
—
—
Initial value
0
0
0
1
1
1
1
1
Read/Write
R/W
R/W
R/W
—
—
—
—
—
Names of the
bits. Dashes
(—) indicate
reserved bits.
D/A enabled
DAOE1 DAOE0
Possible types of access
R
Read only
W
Write only
0
DAE
Conversion result
0
*
Channel 0 and 1 D/A conversion disabled
1
0
Channel 0 D/A conversion enabled
Full name
of bit
Channel 1 D/A conversion disabled
R/W Read and write
1
0
1
Channel 0 and 1 D/A conversion enabled
0
Channel 0 D/A conversion disabled
Channel 1 D/A conversion enabled
1
1
Channel 0 and 1 D/A conversion enabled
*
Channel 0 and 1 D/A conversion enabled
Descriptions
of bit settings
D/A output enable 0
0
Analog output DA0 disabled
1
Channel 0 D/A conversion enabled.
Analog output DA0 enabled
D/A output enable 1
0
Analog output DA1 disabled
1
Channel 1 D/A conversion enabled.
Analog output DA1 enabled
719
MRA—DTC Mode Register A
Bit
Initial value
Read/Write
H'EC00–H'EFFF
DTC
7
6
5
4
3
2
1
0
SM1
SM0
DM1
DM0
MD1
MD0
DTS
Sz
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
—
—
—
—
—
—
—
—
DTC data transfer size
0 Byte-size transfer
1 Word-size transfer
DTC transfer mode select
0 Destination side is repeat
area or block area
1 Source side is repeat area
or block area
DTC mode
0
0 Normal mode
1 Repeat mode
1
0 Block transfer mode
1 —
Destination address mode
0 — DAR is fixed
1
0 DAR is incremented after a transfer
(by +1 when Sz = 0; by +2 when Sz = 1)
1 DAR is decremented after a transfer
(by –1 when Sz = 0; by –2 when Sz = 1)
Source Address Mode
0 — SAR is fixed
1
0 SAR is incremented after a transfer
(by +1 when Sz = 0; by +2 when Sz = 1)
1 SAR is decremented after a transfer
(by –1 when Sz = 0; by –2 when Sz = 1)
720
MRB—DTC Mode Register B
DTC
7
6
5
4
3
2
1
0
CHNE
DISEL
—
—
—
—
—
—
Bit
Initial value
H'EC00–H'EFFF
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Read/Write
—
—
—
—
—
—
—
—
DTC interrupt select
0 After a data transfer ends, the CPU interrupt is
disabled unless the transfer counter is 0
1 After a data transfer ends, the CPU interrupt is
enabled
DTC chain transfer enable
0 End of DTC data transfer
1 DTC chain transfer
SAR—DTC Source Address Register
Bit
23
22
21
20
19
H'EC00–H'EFFF
---
4
DTC
3
2
1
0
--Initial value
Read/Write
Unde- Unde- Unde- Unde- Undefined fined fined fined fined
—
—
—
—
—
-----
Unde- Unde- Unde- Unde- Undefined fined fined fined fined
—
—
—
—
—
Specifies DTC transfer data source address
DAR—DTC Destination Address Register
Bit
23
22
21
20
19
H'EC00–H'EFFF
---
4
DTC
3
2
1
0
--Initial value
Read/Write
Unde- Unde- Unde- Unde- Undefined fined fined fined fined
—
—
—
—
—
-----
Unde- Unde- Unde- Unde- Undefined fined fined fined fined
—
—
—
—
—
Specifies DTC transfer data destination address
721
CRA—DTC Transfer Count Register A
Bit
Initial value
Read/Write
15
14
13
12
11
10
H'EC00–H'EFFF
9
8
7
6
5
4
DTC
3
2
1
0
Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Undefined fined fined fined fined fined fined fined fined fined fined fined fined fined fined fined
—
—
—
—
—
—
—
—
—
—
—
CRAH
—
—
—
—
—
CRAL
Specifies the number of DTC data transfers
CRB—DTC Transfer Count Register B
Bit
Initial value
Read/Write
15
14
13
12
11
10
H'EC00–H'EFFF
9
8
7
6
5
4
DTC
3
1
0
Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Undefined fined fined fined fined fined fined fined fined fined fined fined fined fined fined fined
—
—
—
—
—
—
—
—
—
—
—
—
—
Specifies the number of DTC block data transfers
722
2
—
—
—
KBCOMP—Keyboard Comparator Control Register
Bit
H'FEE4
COMP
7
6
5
4
3
2
1
0
KBCH0
IrE
IrCKS2
IrCKS1
IrCKS0
KBADE
KBCH2
KBCH1
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reserved bits
Keyboard comparator control
Bit 3
Bit 3
Bit 3
Bit 3
A/D converter
KBADE KBCH2 KBCH1 KBCH0 channel 6 input
A/D converter
channel 7 input
0
—
—
—
AN6
AN7
1
0
0
0
CIN0
Undefined
1
CIN1
0
CIN2
1
CIN3
0
CIN4
1
CIN5
0
CIN6
1
CIN7
1
1
0
1
723
DDCSWR—DDC Switch Register
Bit
H'FEE6
IIC0
7
6
5
4
3
2
1
0
SWE
SW
IE
IF
CLR3
CLR2
CLR1
CLR0
Initial value
0
0
0
0
1
1
1
1
Read/Write
R/W
R/W
R/W
R/(W)*1
W*2
W*2
W*2
W*2
IIC clear bits
Bit 3 Bit 2 Bit 1 Bit 0
Description
CLR3 CLR2 CLR1 CLR0
0
0
—
—
Setting prohibited
1
0
0
Setting prohibited
1
IIC0 internal latch cleared
0
IIC1 internal latch cleared
1
IIC0 and IIC1 internal latches cleared
—
Invalid setting
1
1
—
—
DDC mode switch interrupt flag
0
No interrupt is requested when automatic
format switching is executed
[Clearing condition]
When 0 is written in IF after reading IF = 1
1
An interrupt is requested when automatic
format switching is executed
[Setting condition]
When a falling edge is detected on the
SCL pin when SWE = 1
DDC mode switch interrupt enable bit
0
Interrupt when automatic format switching is executed
is disabled
1
Interrupt when automatic format switching is executed
is enabled
DDC mode switch
0
IIC channel 0 is used with the I2C bus format
[Clearing conditions]
• When 0 is written by software
• When a falling edge is detected on the SCL pin when SWE = 1
1
IIC channel 0 is used in formatless mode
[Setting condition]
When 1 is written in SW after reading SW = 0
DDC Mode switch enable
0
Automatic switching of IIC channel 0 from formatless mode
to I2C bus format is disabled
1
Automatic switching of IIC channel 0 from formatless mode
to I2C bus format is enabled
Notes: 1. Only 0 can be written, to clear the flag.
2. Always read as 1.
724
ICRA—Interrupt Control Register A
ICRB—Interrupt Control Register B
ICRC—Interrupt Control Register C
Bit
H'FEE8
H'FEE9
H'FEEA
Interrupt Controller
Interrupt Controller
Interrupt Controller
7
6
5
4
3
2
1
0
ICR7
ICR6
ICR5
ICR4
ICR3
ICR2
ICR1
ICR0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Interrupt control level
0
Corresponding interrupt source is control level 0 (non-priority)
1
Corresponding interrupt source is control level 1 (priority)
Correspondence between Interrupt Sources and ICR Settings
Register
Bits
7
6
5
4
3
2
ICRA
IRQ0
IRQ1
IRQ2
—
—
ICRB
A/D
Freeconverter running
timer
—
—
8-bit timer 8-bit timer 8-bit timer —
channel 0 channel 1 channels
X, Y
ICRC
SCI
SCI
—
channel 0 channel 1
DTC
IIC
IIC
—
channel 0 channel 1
(option)
(option)
1
0
Watchdog Watchdog
timer 0
timer 1
—
—
725
ISR—IRQ Status Register
H'FEEB
Interrupt Controller
7
6
5
4
3
2
1
0
—
—
—
—
—
IRQ2F
IRQ1F
IRQ0F
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
Bit
IRQ2 to IRQ0 flags
0
[Clearing conditions]
• When 0 is written in IRQnF after reading IRQnF = 1
• When interrupt exception handling is executed while low-level detection
is set (IRQnSCB = IRQnSCA = 0) and IRQn input is high
• When IRQn interrupt exception handling is executed while falling, rising,
or both-edge detection is set (IRQnSCB = 1 or IRQnSCA = 1)
1
[Setting conditions]
• When IRQn input goes low while low-level detection is set
(IRQnSCB = IRQnSCA = 0)
• When a falling edge occurs in IRQn input while falling edge detection is
set (IRQnSCB = 0, IRQnSCA = 1)
• When a rising edge occurs in IRQn input while rising edge detection is
set (IRQnSCB = 1, IRQnSCA = 0)
• When a falling or rising edge occurs in IRQn input while both-edge
detection is set (IRQnSCB = IRQnSCA = 1)
(n = 2 to 0)
Note: * Only 0 can be written, to clear the flag.
726
ISCRH—IRQ Sense Control Register H
ISCRL—IRQ Sense Control Register L
H'FEEC
H'FEED
Interrupt Controller
Interrupt Controller
ISCRH
15
14
13
12
11
10
9
8
—
—
—
—
—
—
—
—
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
2
1
0
Bit
Reserved
ISCRL
7
6
—
—
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
5
4
3
IRQ2SCB IRQ2SCA IRQ1SCB IRQ1SCA IRQ0SCB IRQ0SCA
IRQ2 to IRQ0 sense control A and B
ISCRL bits 5–0
Description
IRQ2SCB–
IRQ0SCB
IRQ2SCA–
IRQ0SCA
0
0
Interrupt request generated by low level
of IRQ2–IRQ0 input
1
Interrupt request generated by falling edge
of IRQ2–IRQ0 input
0
Interrupt request generated by rising edge
of IRQ2–IRQ0 input
1
Interrupt request generated by rising and
falling edges of IRQ2–IRQ0 input
1
727
DTCER—DTC Enable Register
H'FFEE to H'FFF2
DTC
7
6
5
4
3
2
1
0
DTCE7
DTCE6
DTCE5
DTCE4
DTCE3
DTCE2
DTCE1
DTCE0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
DTC activation enable
0
DTC activation by interrupt is disabled
[Clearing conditions]
• When data transfer ends while the DISEL bit is 1
• When the specified number of transfers are completed
1
DTC activation by interrupt is enabled
[Maintenance condition]
When the DISEL bit is 0 and the specified number of transfers
have not been completed
DTVECR—DTC Vector Register
Bit
7
6
H'FEF3
5
4
3
DTC
2
0
1
SWDTE DTVEC6 DTVEC5 DTVEC4 DTVEC3 DTVEC2 DTVEC1 DTVEC0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Sets vector number for DTC software activation
DTC software activation enable
0
DTC software activation is disabled
[Clearing condition]
When the DISEL bit is 0 and the specified number of transfers have
not been completed
1
DTC software activation is enabled
[Maintenance conditions]
• When data transfer ends while the DISEL bit is 1
• When the specified number of transfers are completed
• During data transfer activated by software
Note: * A value of 1 can always be written to the SWDTE bit, but 0 can only be written
after 1 is read.
728
ABRKCR—Address Break Control Register
H'FEF4
Interrupt Controller
7
6
5
4
3
2
1
0
CMF
—
—
—
—
—
—
BIE
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
—
—
—
—
—
—
R/W
Bit
Break interrupt enable
0
Address break disabled
1
Address break enabled
Condition match flag
0
[Clearing condition]
When address break interrupt exception handling is executed
1
[Setting condition]
When address set by BARA–BARC is prefetched while BIE = 1
729
BARA—Break Address Register A
BARB—Break Address Register B
BARC—Break Address Register C
Bit
H'FEF5
H'FEF6
H'FEF7
Interrupt Controller
Interrupt Controller
Interrupt Controller
7
6
5
4
3
2
1
0
A23
A22
A21
A20
A19
A18
A17
A16
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
BARA
Specifies address (bits 23–16) at which address break is to be generated
7
6
5
4
3
2
1
0
A15
A14
A13
A12
A11
A10
A9
A8
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
BARB
Specifies address (bits 15–8) at which address break is to be generated
7
6
5
4
3
2
1
0
A7
A6
A5
A4
A3
A2
A1
—
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
—
Bit
BARC
Specifies address (bits 7–1) at which address break is to be generated
730
FLMCR1—Flash Memory Control Register 1
H'FF80
Flash Memory
7
6
5
4
3
2
1
0
FWE
SWE
—
—
EV
PV
E
P
Initial value
1
0
0
0
0
0
0
0
Read/Write
R
R/W
—
—
R/W
R/W
R/W
R/W
Bit
Program
0
Program mode cleared
1
Transition to program mode
[Setting condition]
When SWE = 1, and PSU = 1
Erase
0
Erase mode cleared
1
Transition to erase mode
[Setting condition]
When SWE = 1, and ESU = 1
Program-verify
0
Program-verify mode cleared
1
Transition to program-verify mode
[Setting condition]
When SWE = 1
Erase-verify
0
Erase-verify mode cleared
1
Transition to erase-verify mode
[Setting condition]
When SWE = 1
Software write enable
0
Writes disabled
1
Writes enabled
Reserved
731
FLMCR2—Flash Memory Control Register 2
H'FF81
Flash Memory
7
6
5
4
3
2
1
0
FLER
—
—
—
—
—
ESU
PSU
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
—
—
—
—
—
R/W
R/W
Bit
Program setup bit
0
Program setup cleared
1
Program setup
[Setting condition]
When SWE = 1
Erase setup bit
0
Erase setup cleared
1
Erase setup
[Setting condition]
When SWE = 1
Flash memory error
732
0
Flash memory is operating normally
Flash memory program/erase protection (error protection) is disabled
[Clearing condition]
Reset or hardware standby mode
1
An error has occurred during flash memory programming/erasing
Flash memory program/erase protection (error protection) is enabled
[Setting condition]
See section 19.8.3, Error Protection
PCSR—Peripheral Clock Select Register
H'FF82
PWM
7
6
5
4
3
—
—
—
—
—
Initial value
0
0
0
0
0
0
0
0
Read/Write
—
—
—
—
—
R/W
R/W
—
Bit
2
1
PWCKB PWCKA
0
—
PWM clock select
PWSL
Bit 7
PCSR
Bit 6
Bit 2
Bit 1
Description
PWCKE PWCKS PWCKB PWCKA
0
—
—
—
Clock input disabled
1
0
—
—
ø (system clock) selected
1
0
0
ø/2 selected
1
ø/4 selected
0
ø/8 selected
1
ø/16 selected
1
733
EBR1—Erase Block Register 1
EBR2—Erase Block Register 2
Bit
H'FF82
H'FF83
Flash Memory
Flash Memory
7
6
5
4
3
2
1
0
—
—
—
—
—
—
EB9
EB8
Initial value
0
0
0
0
0
0
0
0
Read/Write
—
—
—
—
—
—
R/W*
R/W*
Bit
7
6
5
4
3
2
1
0
EB7
EB6
EB5
EB4
EB3
EB2
EB1
EB0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: * In normal mode, a read will return 0, and writes are invalid.
Erase Blocks
Block (Size)
128-kbyte versions
734
Addresses
EB0 (1 kbyte)
H'(00)0000–H'(00)03FF
EB1 (1 kbyte)
H'(00)4000–H'(00)07FF
EB2 (1 kbyte)
H'(00)8000–H'(00)0BFF
EB3 (1 kbyte)
H'(00)C000–H'(00)0FFF
EB4 (28 kbytes)
H'(00)1000–H'(00)7FFF
EB5 (16 kbytes)
H'(00)8000–H'(00)BFFF
EB6 (8 kbytes)
H'(00)C000–H'(00)DFFF
EB7 (8 kbytes)
H'00E000–H'00FFFF
EB8 (32 kbytes)
H'010000–H'017FFF
EB9 (32 kbytes)
H'018000–H'01FFFF
SBYCR—Standby Control Register
H'FF84
System
7
6
5
4
3
2
1
0
SSBY
STS2
STS1
STS0
—
SCK2
SCK1
SCK0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
—
R/W
R/W
R/W
Bit
System clock select 2 to 0
0
0
0
Bus master is in high-speed mode
1
Medium-speed clock = ø/2
0
Medium-speed clock = ø/4
1
Medium-speed clock = ø/8
0
0
Medium-speed clock = ø/16
1
Medium-speed clock = ø/32
1
—
—
1
1
Standby timer select 2 to 0
0
0
0
Standby time = 8192 states
1
1
0
1
1
Standby time = 16384 states
0
Standby time = 32768 states
1
Standby time = 65536 states
0
Standby time = 131072 states
1
Standby time = 262144 states
0
Reserved
1
Standby time = 16 states*
Note: * This setting must not be used in the flash memory version.
Software standby
0
Transition to sleep mode on execution of SLEEP instruction in high-speed mode
or medium-speed mode
Transition to subsleep mode on execution of SLEEP instruction in subactive mode
1
Transition to software standby mode, subactive mode, or watch mode on execution
of SLEEP instruction in high-speed mode or medium-speed mode
Transition to watch mode or high-speed mode on execution of SLEEP instruction in
subactive mode
735
LPWRCR—Low-Power Control Register
H'FF85
System
7
6
5
4
3
2
1
0
DTON
LSON
NESEL
EXCLE
—
—
—
—
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
—
—
—
—
Bit
Subclock input enable
0
Subclock input from EXCL pin disabled
1
Subclock input from EXCL pin enabled
Noise elimination sampling frequency select
0
Sampling at ø divided by 32
1
Sampling at ø divided by 4
Low-speed on flag
0
• Transition to sleep mode, software standby mode, or watch
mode* on execution of SLEEP instruction in high-speed mode or
medium-speed mode
• Transition to watch mode, or direct transition to high-speed mode,
on execution of SLEEP instruction in subactive mode
• Transition to high-speed mode after watch mode is cleared
1
• Transition to watch mode or subactive mode* on execution of
SLEEP instruction in high-speed mode
• Transition to subsleep mode or watch mode on execution of
SLEEP instruction in subactive mode
• Transition to subactive mode after watch mode is cleared
Note: * When a transition is made to watch mode or subactive mode,
high-speed mode must be set.
Direct transfer on flag
0
• Transition to sleep mode, software standby mode, or watch mode*
on execution of SLEEP instruction in high-speed mode or
medium-speed mode
• Transition to subsleep mode or watch mode on execution of
SLEEP instruction in subactive mode
1
• Direct transition to subactive mode*, or transition to sleep mode or
software standby mode, on execution of SLEEP instruction in
high-speed mode or medium-speed mode
• Direct transition to high-speed mode, or transition to subsleep mode,
on execution of SLEEP instruction in subactive mode
Note: * When a transition is made to watch mode or subactive mode,
high-speed mode must be set.
736
MSTPCRH—Module Stop Control Register H
MSTPCRL—Module Stop Control Register L
H'FF86
H'FF87
System
System
MSTPCRH
7
Bit
6
5
4
3
MSTPCRL
2
1
0
7
6
5
4
3
2
1
0
MSTP15 MSTP14 MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTP8 MSTP7 MSTP6 MSTP5 MSTP4 MSTP3 MSTP2 MSTP1 MSTP0
Initial value
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Module stop
0
Module stop mode cleared
1
Module stop mode set
The correspondence between MSTPCR bits and on-chip supporting modules is shown below.
Register
Bit
MSTPCRH
MSTP15
Module
—
MSTP14* Data transfer controller (DTC)
MSTP13
16-bit free-running timer (FRT)
MSTP12
8-bit timers (TMR0, TMR1)
MSTP11* 8-bit PWM timer (PWM), 14-bit PWM timer (PWMX)
MSTP10* —
MSTPCRL
MSTP9
A/D converter
MSTP8
8-bit timers (TMRX, TMRY), timer connection
MSTP7
Serial communication interface 0 (SCI0)
MSTP6*
Serial communication interface 1 (SCI1)
MSTP5*
—
MSTP4*
I2C bus interface (IIC) channel 0 (option)
MSTP3*
I2C bus interface (IIC) channel 1 (option)
MSTP2*
—
MSTP1*
—
MSTP0*
—
Note: Bit 15 must not be set to 1. Bits 10, 5, 2, 1, and 0 can be read or written to, but do not
affect operation.
* Must be set to 1 in the H8S/2124 Series.
737
SMR1—Serial Mode Register 1
SMR0—Serial Mode Register 0
H'FF88
H'FFD8
SCI1
SCI0
7
6
5
4
3
2
1
0
C/A
CHR
PE
O/E
STOP
MP
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
Clock select 1 and 0
0
1
0
ø clock
1
ø/4 clock
0
ø/16 clock
1
ø/64 clock
Multiprocessor mode
0
Multiprocessor function disabled
1
Multiprocessor format selected
Stop bit length
0
1 stop bit
1
2 stop bits
Parity mode
0
Even parity
1
Odd parity
Parity enable
0
Parity bit addition and checking disabled
1
Parity bit addition and checking enabled
Character length
0
8-bit data
1
7-bit data*
Note: * When 7-bit data is selected, the MSB (bit 7)
of TDR is not transmitted, and the choice of
LSB-first or MSB-first mode is not available.
Communication mode
738
0
Asynchronous mode
1
Synchronous mode
ICCR1—I2C Bus Control Register 1
ICCR0—I2C Bus Control Register 0
H'FF88
H'FFD8
IIC1
IIC0
7
6
5
4
3
2
1
0
ICE
IEIC
MST
TRS
ACKE
BBSY
IRIC
SCP
Initial value
0
0
0
0
0
0
0
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/(W)*
W
Bit
Start condition/stop condition
prohibit
0
Writing issues a start or stop
condition, in combination
with the BBSY flag
1
Reading always returns a
value of 1; writing is ignored
I2C bus interface interrupt request flag
0
Waiting for transfer, or transfer in
progress
1
Interrupt requested
Note: For the clearing and setting
conditions, see section 16.2.5,
I2C Bus Control Register (ICCR).
Bus busy
0
Bus is free
[Clearing condition]
When a stop condition is detected
1
Bus is busy
[Setting condition]
When a start condition is detected
I2C bus interface interrupt
enable
0
Interrupt requests
disabled
1
Interrupt requests
enabled
Acknowledge mode select
I2C bus interface enable
0
1
Module is non-operational (SCL/SDA
pin has port function)
SAR and SARX can be accessed
Module is enabled for transfer operations
(SC/SDA pin in bus drive state)
ICMR and ICDR can be accessed
Note: * Only 0 can be written, to clear the flag.
0
Acknowledge bit is ignored and transfer is
performed continuously
1
When acknowledge bit is 1, continuous
transfer is discontinued
Master/slave select (MST), transmit/receive select (TRS)
0
1
0
Slave receive mode
1
Slave transmit mode
0
Master receive mode
1
Master transmit mode
Note: For details, see section 16.2.5, I2C Bus Control
Register (ICCR).
739
BRR1—Bit Rate Register 1
BRR0—Bit Rate Register 0
H'FF89
H'FFD9
SCI1
SCI0
Bit
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Sets the serial transmit/receive bit rate
740
ICSR1—I2C Bus Status Register 1
ICSR0—I2C Bus Status Register 0
Bit
H'FF89
H'FFD9
IIC1
IIC0
7
6
5
4
3
2
1
0
ESTP
STOP
IRTR
AASX
AL
AAS
ADZ
ACKB
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*1
R/(W)*1
R/(W)*1
R/(W)*1
R/(W)*1
R/(W)*1
R/(W)*1
R/W
Acknowledge bit
0
Receive mode: 0 is output at
acknowledge output timing
Transmit mode: indicates that
the receiving device has
acknowledged the data (0 value)
1
Receive mode: 1 is output at
acknowledge output timing
Transmit mode: indicates that
the receiving device has not
acknowledged the data (1 value)
General call address recognition flag*2
0
General call address not recognized
1
General call address recognized
Slave address recognition flag*2
0
Slave address or general call address
not recognized
1
Slave address or general call address
recognized
Arbitration lost flag*2
0
Bus arbitration won
1
Bus arbitration lost
Second slave address recognition flag*2
I2C
0
Second slave address not recognized
1
Second slave address recognized
bus interface continuous transmission/reception interrupt request flag*2
0
Waiting for transfer, or transfer in progress
1
Continuous transfer state
Normal stop condition detection flag*2
0
No normal stop condition
1
In I2C bus format slave mode: Normal stop condition detected
In other modes: No meaning
Error stop condition detection flag*2
0
No error stop condition
1
In I2C bus format slave mode: Error stop condition detected
In other modes: No meaning
Notes: 1. Only 0 can be written, to clear the flag.
2. For the clearing and setting conditions, see section 16.2.6, I2C Bus Status Register (ICSR).
741
SCR1—Serial Control Register 1
SCR0—Serial Control Register 0
H'FF8A
H'FFDA
SCI1
SCI0
7
6
5
4
3
2
1
0
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
Clock enable 1 and 0
0
1
0
Asynchronous
mode
Internal clock/SCK pin
functions as I/O port
1
Synchronous
mode
Internal clock/SCK pin
functions as serial clock output
0
Asynchronous
mode
Internal clock/SCK pin
functions as clock output
1
Synchronous
mode
Internal clock/SCK pin
functions as serial clock output
0
Asynchronous
mode
External clock/SCK pin
functions as clock input
1
Synchronous
mode
External clock/SCK pin
functions as serial clock input
0
Asynchronous
mode
External clock/SCK pin
functions as clock input
1
Synchronous
mode
External clock/SCK pin
functions as serial clock input
Transmit end interrupt enable
0
Transmit end interrupt (TEI) request disabled
1
Transmit end interrupt (TEI) request enabled
Multiprocessor interrupt enable
0
Multiprocessor interrupts disabled (normal reception performed)
[Clearing conditions]
• When the MPIE bit is cleared to 0
• When data with MPB = 1 is received
1
Multiprocessor interrupts enabled
Receive interrupt (RXI) requests, receive error interrupt (ERI)
requests, and setting of the RDRF, FER, and ORER flags in
SSR are disabled until data with the multiprocessor bit set to
1 is received
Transmit interrupt enable
0
Transmit data empty interrupt
(TXI) request disabled
1
Transmit data empty interrupt
(TXI) request enabled
Receive enable
Receive interrupt enable
0
Receive data full interrupt (RXI)
request and receive error interrupt
(ERI) request disabled
1
Receive data full interrupt (RXI)
request and receive error interrupt
(ERI) request enabled
742
0
Reception disabled
1
Reception enabled
Transmit enable
0
Transmission disabled
1
Transmission enabled
RDR1—Receive Data Register 1
RDR0—Receive Data Register 0
H'FF8D
H'FFDD
SCI1
SCI0
Bit
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
Stores serial receive data
TDR1—Transmit Data Register 1
TDR0—Transmit Data Register 0
Bit
7
6
H'FF8B
H'FFDB
5
4
SCI1
SCI0
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Stores serial transmit data
743
SSR1—Serial Status Register 1
SSR0—Serial Status Register 0
H'FF8C
H'FFDC
SCI1
SCI0
7
6
5
4
3
2
1
0
TDRE
RDRF
ORER
FER
PER
TEND
MPB
MPBT
Initial value
1
0
0
0
0
1
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R
R
R/W
Bit
Multiprocessor bit transfer
0
Data with a 0 multiprocessor
bit is transmitted
1
Data with a 1 multiprocessor
bit is transmitted
Multiprocessor bit
0
[Clearing condition]
When data with a 0 multiprocessor
bit is received
1
[Setting condition]
When data with a 1 multiprocessor
bit is received
Transmit end
0
[Clearing conditions]
• When 0 is written in TDRE after reading TDRE = 1
• When the DTC is activated by a TXI interrupt and
writes data to TDR
1
[Setting conditions]
• When the TE bit in SCR is 0
• When TDRE = 1 at transmission of the last bit of
a 1-byte serial transmit character
Parity error
0
[Clearing condition]
When 0 is written in PER after reading PER = 1
1
[Setting condition]
When, in reception, the number of 1 bits in the receive
data plus the parity bit does not match the parity setting
(even or odd) specified by the O/E bit in SMR
Framing error
0
[Clearing condition]
When 0 is written in FER after reading FER = 1
1
[Setting condition]
When the SCI checks whether the stop bit at the end of the receive
data is 1 when reception ends, and the stop bit is 0
Overrun error
0
[Clearing condition]
When 0 is written in ORER after reading ORER = 1
1
[Setting condition]
When the next serial reception is completed while RDRF = 1
Receive data register full
0
[Clearing conditions]
• When 0 is written in RDRF after reading RDRF = 1
• When the DTC is activated by an RXI interrupt and reads data from RDR
1
[Setting condition]
When serial reception ends normally and receive data is transferred from RSR to RDR
Transmit data register empty
0
[Clearing conditions]
• When 0 is written in TDRE after reading TDRE = 1
• When the DTC is activated by a TXI interrupt and writes data to TDR
1
[Setting conditions]
• When the TE bit in SCR is 0
• When data is transferred from TDR to TSR and data can be written in TDR
744
Note: * Only 0 can be written, to clear the flag.
SCMR1—Serial Interface Mode Register 1
SCMR0—Serial Interface Mode Register 0
H'FF8E
H'FFDE
SCI1
SCI0
7
6
5
4
3
2
1
0
—
—
—
—
SDIR
SINV
—
SMIF
Initial value
1
1
1
1
0
0
1
0
Read/Write
—
—
—
—
R/W
R/W
—
R/W
Bit
Serial communication
interface mode select
0
Normal SCI mode
1
Setting prohibited
Data invert
0
TDR contents are transmitted as they are
TDR contents are stored in RDR as they are
1
TDR contents are inverted before being transmitted
Receive data is stored in RDR in inverted form
Data transfer direction
0
TDR contents are transmitted LSB-first
Receive data is stored in RDR LSB-first
1
TDR contents are transmitted MSB-first
Receive data is stored in RDR MSB-first
745
ICDR1—I2C Bus Data Register 1
ICDR0—I2C Bus Data Register 0
H'FF8E
H'FFDE
IIC1
IIC0
7
6
5
4
3
2
1
0
ICDR7
ICDR6
ICDR5
ICDR4
ICDR3
ICDR2
ICDR1
ICDR0
Initial value
—
—
—
—
—
—
—
—
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
Bit
ICDRR
Bit
ICDRR7 ICDRR6 ICDRR5 ICDRR4 ICDRR3 ICDRR2 ICDRR1 ICDRR0
Initial value
—
—
—
—
—
—
—
—
Read/Write
R
R
R
R
R
R
R
R
7
6
5
4
3
2
1
0
ICDRS
Bit
ICDRS7 ICDRS6 ICDRS5 ICDRS4 ICDRS3 ICDRS2 ICDRS1 ICDRS0
Initial value
—
—
—
—
—
—
—
—
Read/Write
—
—
—
—
—
—
—
—
7
6
5
4
3
2
1
0
ICDRT
Bit
ICDRT7 ICDRT6 ICDRT5 ICDRT4 ICDRT3 ICDRT2 ICDRT1 ICDRT0
Initial value
—
—
—
—
—
—
—
—
Read/Write
W
W
W
W
W
W
W
W
—
—
TDRE
RDRF
TDRE, RDRF (internal flags)
Bit
Initial value
0
0
Read/Write
—
—
Note: For details, see section 16.2.1, I2C Bus Data Register (ICDR).
746
SARX1—Second Slave Address Register 1
SAR1—Slave Address Register 1
SARX0—Second Slave Address Register 0
SAR0—Slave Address Register 0
H'FF8E
H'FF8F
H'FFDE
H'FFDF
IIC1
IIC1
IIC0
IIC0
SAR
7
6
5
4
3
2
1
0
SVA6
SVA5
SVA4
SVA3
SVA2
SVA1
SVA0
FS
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
Slave address
Format select
SARX
7
6
5
4
3
2
1
0
SVAX6
SVAX5
SVAX4
SVAX3
SVAX2
SVAX1
SVAX0
FSX
Bit
Initial value
0
0
0
0
0
0
0
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Second slave address
Format select
DDCSWR
Bit 6
SAR
Bit 0
SARX
Bit 0
SW
FS
FSX
0
0
0
I2C bus format
• SAR and SARX slave addresses recognized
1
I2C bus format
• SAR slave address recognized
• SARX slave address ignored
0
I2C bus format
• SAR slave address ignored
• SARX slave address recognized
1
Synchronous serial format
• SAR and SARX slave addresses ignored
0
Formatless mode (start/stop conditions not
detected)
• Acknowledge bit present
1
1
0
1
1
0
1
Operating Mode
Formatless mode*
(start/stop conditions not detected)
• No acknowledge bit
Note: * Do not select this mode when automatic switching to the I2C bus format is
performed by means of a DDCSWR setting.
747
ICMR1—I 2C Bus Mode Register 1
ICMR0—I 2C Bus Mode Register 0
H'FF8F
H'FFDF
IIC1
IIC0
7
6
5
4
3
2
1
0
MLS
WAIT
CKS2
CKS1
CKS0
BC2
BC1
BC0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
Bit counter
BC2
BC1
BC0
0
0
0
1
0
1
0
1
0
1
1
1
0
1
Transfer clock select
IICX
CKS2
CKS1
0
0
0
1
1
0
1
1
0
0
1
1
0
1
CKS0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Synchronous
serial format
8
1
2
3
4
5
6
7
Clock
ø/28
ø/40
ø/48
ø/64
ø/80
ø/100
ø/112
ø/128
ø/56
ø/80
ø/96
ø/128
ø/160
ø/200
ø/224
ø/256
Wait insertion bit
0
Data and acknowledge transferred consecutively
1
Wait inserted between data and acknowledge
MSB-first/LSB-first select*
0
MSB-first
1
LSB-first
Note: * Do not set this bit to 1 when using the I2C bus format.
748
I2C bus
format
9
2
3
4
5
6
7
8
TIER—Timer Interrupt Enable Register
H'FF90
FRT
7
6
5
4
3
2
1
0
ICIAE
ICIBE
ICICE
ICIDE
OCIAE
OCIBE
OVIE
—
Initial value
0
0
0
0
0
0
0
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
—
Bit
Timer overflow interrupt
enable
0
OVF interrupt request
(FOVI) is disabled
1
OVF interrupt request
(FOVI) is enabled
Output compare interrupt B enable
0
OCFB interrupt request (OCIB)
is disabled
1
OCFB interrupt request (OCIB)
is enabled
Output compare interrupt A enable
0
OCFA interrupt request (OCIA)
is disabled
1
OCFA interrupt request (OCIA)
is enabled
Input capture interrupt D enable
0
ICFD interrupt request (ICID) is disabled
1
ICFD interrupt request (ICID) is enabled
Input capture interrupt C enable
0
ICFC interrupt request (ICIC) is disabled
1
ICFC interrupt request (ICIC) is enabled
Input capture interrupt B enable
0
ICFB interrupt request (ICIB) is disabled
1
ICFB interrupt request (ICIB) is enabled
Input capture interrupt A enable
0
ICFA interrupt request (ICIA) is disabled
1
ICFA interrupt request (ICIA) is enabled
749
TCSR—Timer Control/Status Register
Bit
H'FF91
FRT
7
6
5
4
3
2
1
0
ICFA
ICFB
ICFC
ICFD
OCFA
OCFB
OVF
CCLRA
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/W
Counter clear A
0
1
FRC clearing is
disabled
FRC is cleared at
compare match A
Timer overflow
0
1
[Clearing condition]
When 0 is written in OVF after
reading OVF = 1
[Setting condition]
When the FRC value overflows
from H'FFFF to H'0000
Output compare flag B
0
1
[Clearing condition]
When 0 is written in OCFB after reading OCFB = 1
[Setting condition]
When FRC = OCRB
Output compare flag A
0
1
[Clearing condition]
When 0 is written in OCFA after reading OCFA = 1
[Setting condition]
When FRC = OCRA
Input capture flag D
0
1
[Clearing condition]
When 0 is written in ICFD after reading ICFD = 1
[Setting condition]
When an input capture signal is generated
Input capture flag C
0
1
[Clearing condition]
When 0 is written in ICFC after reading ICFC = 1
[Setting condition]
When an input capture signal is generated
Input capture flag B
0
1
[Clearing condition]
When 0 is written in ICFB after reading ICFB = 1
[Setting condition]
When an input capture signal causes the FRC value to be transferred to ICRB
Input capture flag A
0
1
[Clearing condition]
When 0 is written in ICFA after reading ICFA = 1
[Setting condition]
When an input capture signal causes the FRC value to be transferred to ICRA
Note: * Only 0 can be written in bits 7 to 1, to clear the flags.
750
FRC—Free-Running Counter
H'FF92
FRT
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Count value
OCRA/OCRB—Output Compare Register A/B
H'FF94
FRT
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Constantly compared with FRC value; OCF is set when OCR = FRC
751
TCR—Timer Control Register
H'FF96
FRT
7
6
5
4
3
2
1
0
IEDGA
IEDGB
IEDGC
IEDGD
BUFEA
BUFEB
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
Clock select
0
1
0
Internal clock:
counting on ø/2
1
Internal clock:
counting on ø/8
0
Internal clock:
counting on ø/32
1
External clock:
counting on
rising edge
Buffer enable B
0
ICRD is not used as ICRB buffer
register
1
ICRD is used as ICRB buffer
register
Buffer enable A
0
ICRC is not used as ICRA buffer register
1
ICRC is used as ICRA buffer register
Input edge select D
0
Capture at falling edge of input capture input D
1
Capture at rising edge of input capture input D
Input edge select C
0
Capture at falling edge of input capture input C
1
Capture at rising edge of input capture input C
Input edge select B
0
Capture at falling edge of input capture input B
1
Capture at rising edge of input capture input B
Input edge select A
752
0
Capture at falling edge of input capture input A
1
Capture at rising edge of input capture input A
TOCR—Timer Output Compare Control Register
7
Bit
FRT
5
4
3
2
1
0
ICRS
OCRS
OEA
OEB
OLVLA
OLVLB
6
ICRDMS OCRAMS
H'FF97
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Output level B
0
0 output at compare
match B
1
1 output at compare
match B
Output level A
0
0 output at compare match A
1
1 output at compare match A
Output enable B
0
Output compare B output disabled
1
Output compare B output enabled
Output enable A
0
Output compare A output disabled
1
Output compare A output enabled
Output compare register select
0
OCRA register selected
1
OCRB register selected
Input capture register select
0
ICRA, ICRB, and ICRC registers selected
1
OCRAR, OCRAF, and OCRDM registers selected
Output compare A mode select
0
OCRA set to normal operating mode
1
OCRA set to operating mode using OCRAR and OCRAF
Input capture D mode select
0
ICRD set to normal operating mode
1
ICRD set to operating mode using OCRDM
753
OCRAR—Output Compare Register AR
OCRAF—Output Compare Register AF
H'FF98
H'FF9A
FRT
FRT
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Used for OCRA operation when OCRAMS = 1 in TOCR
(For details, see section 11.2.4, Output Compare Registers
AR and AF (OCRAR, OCRAF).)
OCRDM—Output Compare Register DM
H'FF9C
FRT
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R R/W R/W R/W R/W R/W R/W R/W R/W
Used for ICRD operation when ICRDMS = 1 in TOCR
(For details, see section 11.2.5, Output Compare Register
DM (OCRDM).)
ICRA—Input Capture Register A
ICRB—Input Capture Register B
ICRC—Input Capture Register C
ICRD—Input Capture Register D
H'FF98
H'FF9A
H'FF9C
H'FF9E
FRT
FRT
FRT
FRT
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
Stores FRC value when input capture signal is input
(ICRC and ICRD can be used for buffer operation.
For details, see section 11.2.3, Input Capture Registers
A to D (ICRA to ICRD).)
754
DADRAH—PWM (D/A) Data Register AH
DADRAL—PWM (D/A) Data Register AL
DADRBH—PWM (D/A) Data Register BH
DADRBL—PWM (D/A) Data Register BL
H'FFA0
H'FFA1
H'FFA6
H'FFA7
PWMX
PWMX
PWMX
PWMX
DADRH
Bit (CPU)
Bit (data)
DADRA
Initial value
DADRL
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
13
12
11
10
9
8
7
6
5
4
3
2
1
0
—
—
DA13 DA12 DA11 DA10 DA9 DA8 DA7 DA6 DA5 DA4 DA3 DA2 DA1 DA0 CFS
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
—
1
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W —
DADRB
Initial value
DA13 DA12 DA11 DA10 DA9 DA8 DA7 DA6 DA5 DA4 DA3 DA2 DA1 DA0 CFS REGS
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Register select (DADRB only)
0
DADRA and DADRB can be accessed
1
DACR and DACNT can be accessed
Carrier frequency select
0
Operates on basic cycle = resolution (T) × 64
DADR value range is H'0401 to H'FFFD
1
Operates on basic cycle = resolution (T) × 256
DADR value range is H'0103 to H'FFFF
D/A conversion data
755
DACR—PWM (D/A) Control Register
H'FFA0
PWMX
7
6
5
4
3
2
1
0
TEST
PWME
—
—
OEB
OEA
OS
CKS
Initial value
0
0
1
1
0
0
0
0
Read/Write
R/W
R/W
—
—
R/W
R/W
R/W
R/W
Bit
Clock select
0
Operates at resolution (T) =
system clock cycle (tcyc)
1
Operates at resolution (T) =
system clock cycle (tcyc) × 2
Output select
0
PWM direct output
1
PWM inverted output
Output enable A
0
PWM (D/A) channel A output
(PWX0 output pin) disabled
1
PWM (D/A) channel A output
(PWX0 output pin) enabled
Output enable B
0
PWM (D/A) channel B output
(PWX1 output pin) disabled
1
PWM (D/A) channel B output
(PWX1 output pin) enabled
PWM enable
0
DACNT operates as 14-bit up-counter
1
Stop at DACNT = H'0003
Test mode
756
0
PWM (D/A) in user state, normal operation
1
PWM (D/A) in test state, correct conversion results unobtainable
DACNTH—PWM (D/A) Counter H
DACNTL—PWM (D/A) Counter L
H'FFA6
H'FFA7
PWMX
PWMX
DACNTH
DACNTL
Bit (CPU)
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Bit (counter)
7
6
5
4
3
2
1
0
8
9
10
11
12
13
—
—
—
REGS
Initial value
Read/Write
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W —
1
R/W
Register select
0
DADRA and DADRB can be accessed
1
DACR and DACNT can be accessed
Up-counter
757
TCSR0—Timer Control/Status Register 0
H'FFA8
WDT0
7
6
5
4
3
2
1
0
OVF
WT/IT
TME
RSTS
RST/NMI
CKS2
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
Clock select 2 to 0
CKS2
CKS1
CKS0
0
0
0
ø/2
1
ø/64
0
ø/128
1
ø/512
0
ø/2048
1
ø/8192
0
ø/32768
1
ø/131072
1
1
0
1
Clock
Reset or NMI
0
NMI interrupt requested
1
Internal reset requested
Reserved
Timer enable
0
TCNT is initialized to H'00 and halted
1
TCNT counts
Timer mode select
0
Interval timer mode: Interval timer interrupt request (WOVI)
sent to CPU when TCNT overflows
1
Watchdog timer mode: Reset or NMI interrupt request sent
to CPU when TCNT overflows
Overflow flag
0
[Clearing conditions]
• When 0 is written in the TME bit
• When 0 is written in OVF after reading TCSR when OVF = 1
1
[Setting condition]
When TCNT overflows from H'FF to H'00
When internal reset request is selected in watchdog timer mode,
OVF is cleared automatically by an internal reset after being set
Note: * Only 0 can be written, to clear the flag.
758
TCNT0—Timer Counter 0
TCNT1—Timer Counter 1
H'FFA8 (W), H'FFA9 (R)
H'FFEA (W), H'FFEB (R)
WDT0
WDT1
Bit
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Up-counter
P1PCR—Port 1 MOS Pull-Up Control Register
Bit
7
6
5
4
H'FFAC
3
Port 1
2
1
0
P17PCR P16PCR P15PCR P14PCR P13PCR P12PCR P11PCR P10PCR
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Control of port 1 built-in MOS input pull-ups
P2PCR—Port 2 MOS Pull-Up Control Register
Bit
7
6
5
4
H'FFAD
3
Port 2
2
1
0
P27PCR P26PCR P25PCR P24PCR P23PCR P22PCR P21PCR P20PCR
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Control of port 2 built-in MOS input pull-ups
P3PCR—Port 3 MOS Pull-Up Control Register
Bit
7
6
5
4
H'FFAE
3
Port 3
2
1
0
P37PCR P36PCR P35PCR P34PCR P33PCR P32PCR P31PCR P30PCR
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Control of port 3 built-in MOS input pull-ups
759
P1DDR—Port 1 Data Direction Register
Bit
7
6
5
H'FFB0
4
3
Port 1
2
1
0
P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Specification of input or output for port 1 pins
P2DDR—Port 2 Data Direction Register
Bit
7
6
5
H'FFB1
4
3
Port 2
2
1
0
P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Specification of input or output for port 2 pins
P1DR—Port 1 Data Register
H'FFB2
Port 1
7
6
5
4
3
2
1
0
P17DR
P16DR
P15DR
P14DR
P13DR
P12DR
P11DR
P10DR
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
Stores output data for port 1 pins
P2DR—Port 2 Data Register
H'FFB3
Port 2
7
6
5
4
3
2
1
0
P27DR
P26DR
P25DR
P24DR
P23DR
P22DR
P21DR
P20DR
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
Stores output data for port 2 pins
760
P3DDR—Port 3 Data Direction Register
7
Bit
6
5
H'FFB4
4
3
Port 3
2
1
0
P37DDR P36DDR P35DDR P34DDR P33DDR P32DDR P31DDR P30DDR
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Specification of input or output for port 3 pins
P4DDR—Port 4 Data Direction Register
Bit
7
6
5
H'FFB5
4
3
Port 4
2
1
0
P47DDR P46DDR P45DDR P44DDR P43DDR P42DDR P41DDR P40DDR
Mode 1
Initial value
0
1
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Modes 2 and 3
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Specification of input or output for port 4 pins
P3DR—Port 3 Data Register
H'FFB6
Port 3
7
6
5
4
3
2
1
0
P37DR
P36DR
P35DR
P34DR
P33DR
P32DR
P31DR
P30DR
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
Stores output data for port 3 pins
P4DR—Port 4 Data Register
H'FFB7
Port 4
7
6
5
4
3
2
1
0
P47DR
P46DR
P45DR
P44DR
P43DR
P42DR
P41DR
P40DR
Initial value
0
—*
0
0
0
0
0
0
Read/Write
R/W
R
R/W
R/W
R/W
R/W
R/W
R/W
Bit
Stores output data for port 4 pins
Note: * Determined by state of pin P46.
761
P5DDR—Port 5 Data Direction Register
H'FFB8
Port 5
7
6
5
4
3
—
—
—
—
—
Initial value
1
1
1
1
1
0
0
0
Read/Write
—
—
—
—
—
W
W
W
Bit
2
1
0
P52DDR P51DDR P50DDR
Specification of input or
output for port 5 pins
P6DDR—Port 6 Data Direction Register
Bit
7
6
5
H'FFB9
4
3
Port 6
2
1
0
P67DDR P66DDR P65DDR P64DDR P63DDR P62DDR P61DDR P60DDR
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Specification of input or output for port 6 pins
P5DR—Port 5 Data Register
H'FFBA
Port 5
7
6
5
4
3
2
1
0
—
—
—
—
—
P52DR
P51DR
P50DR
Initial value
1
1
1
1
1
0
0
0
Read/Write
—
—
—
—
—
R/W
R/W
R/W
Bit
Stores output data for port 5 pins
P6DR—Port 6 Data Register
Bit
H'FFBB
Port 6
7
6
5
4
3
2
1
0
P67DR
P66DR
P65DR
P64DR
P63DR
P62DR
P61DR
P60DR
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Stores output data for port 6 pins
762
P7PIN—Port 7 Input Data Register
Bit
7
P77PIN
6
H'FFBE
5
4
Port 7
3
2
0
1
P76PIN P75PIN P74PIN P73PIN P72PIN
P71PIN P70PIN
Initial value
—*
—*
—*
—*
—*
—*
—*
—*
Read/Write
R
R
R
R
R
R
R
R
Port 7 pin states
Note: * Determined by state of pins P77 to P70.
IER—IRQ Enable Register
Bit
H'FFC2
Interrupt Controller
7
6
5
4
3
2
1
0
—
—
—
—
—
IRQ2E
IRQ1E
IRQ0E
Initial value
1
1
1
1
1
0
0
0
Read/Write
R
R
R
R
R
R/W
R/W
R/W
IRQ2 to IRQ0 enable
0
IRQn interrupt disabled
1
IRQn interrupt enabled
(n = 0 to 2)
763
STCR—Serial Timer Control Register
H'FFC3
System
7
6
5
4
3
2
1
0
—
IICX1
IICX0
IICE
FLSHE
—
ICKS1
ICKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
Internal clock source
select*1
Reserved
Flash memory control register enable
0
CPU access to power-down state control registers and
some peripheral module control registers is enabled
1
CPU access to flash memory control registers is enabled
I2C master enable
0
CPU access to SCI0 and SCI1 control registers is
disabled
1
CPU access to I2C bus interface data, PWMX
data register and control registers is enabled
I2C transfer rate select 1 and 0*2
Reserved
Notes: 1. Used for 8-bit timer input clock selection. For details, see section 12.2.4, Timer
Control Register (TCR).
2. Used for I2C bus interface transfer clock selection. For details, see section 16.2.4,
I2C Bus Mode Register (ICMR).
764
SYSCR—System Control Register
H'FFC4
System
7
6
5
4
3
2
1
0
CS2E
IOSE
INTM1
INTM0
XRST
NMIEG
HIE
RAME
Initial value
0
0
0
0
1
0
0
1
Read/Write
R/W
R/W
R
R/W
R
R/W
R/W
R/W
Bit
RAM Enable
0 On-chip RAM is disabled
1
On-chip RAM is enabled
Host interface enable
0 Access to 8-bit timer (channel
X and Y) data registers and
control registers, and timer
connection control registers is
disabled
1
Access to 8-bit timer (channel
X and Y) data registers and
control registers, and timer
connection control registers
is enabled
NMI edge select
0 Falling edge
1
Rising edge
External reset
0 Reset generated by watchdog timer overflow
1
Reserved
Reset generated by an external reset
Interrupt control mode select
0 0 Interrupt control mode 0
1
Interrupt control mode 1
IOS enable
0
AS/IOS is address strobe pin
(low output in external area access)
1
AS/IOS is I/O strobe pin
(low output when accessing specified address from H'(FF)F000 to H(FF)FE4F)
765
MDCR—Mode Control Register
H'FFC5
System
7
6
5
4
3
2
1
0
EXPE
—
—
—
—
—
MDS1
MDS0
Initial value
—*
0
0
0
0
0
—*
—*
Read/Write
R/W*
—
—
—
—
—
R
R
Bit
Current mode pin operating mode
Expanded mode enable
0
Single-chip mode selected
1
Expanded mode selected
Note: * Determined by pins MD1 and MD0.
766
BCR—Bus Control Register
H'FFC6
7
6
ICIS1
ICIS0
Initial value
1
1
0
1
Read/Write
R/W
R/W
R/W
R/W
Bit
5
4
3
Bus Controller
2
1
0
—
IOS1
IOS0
0
1
1
1
R/W
R/W
R/W
R/W
BRSTRM BRSTS1 BRSTS0
IOS select
IOS1 IOS0 Addresses for which AS/IOS pin
output goes low when IOSE = 1
0
1
0
Low in accesses to addresses
H'(FF)F000 to H'(FF)F03F
1
Low in accesses to addresses
H'(FF)F000 to H'(FF)F0FF
0
Low in accesses to addresses
H'(FF)F000 to H'(FF)F3FF
1
Low in accesses to addresses
H'(FF)F000 to H'(FF)FE4F
Burst cycle select 0
0
Max. 4 words in burst access
1
Max. 8 words in burst access
Burst cycle select 1
0
Burst cycle comprises 1 state
1
Burst cycle comprises 2 states
Burst ROM enable
Reserved
0
Basic bus interface
1
Burst ROM interface
Idle Cycle Insert 0
0
Idle cycle not inserted in case of successive
external read and external write cycles
1
Idle cycle inserted in case of successive
external read and external write cycles
767
WSCR—Wait State Control Register
H'FFC7
Bus Controller
7
6
5
4
3
2
1
0
RAMS
RAM0
ABW
AST
WMS1
WMS0
WC1
WC0
Initial value
0
0
1
1
0
0
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
Wait count 1 and 0
0
1
Reserved
0
No programmable
waits inserted
1
1 programmable
wait state inserted
in external memory
space access
0
2 programmable
wait states inserted
in external memory
space access
1
3 programmable
wait states inserted
in external memory
space access
Wait mode select 1 and 0
0
1
0
Programmable wait mode
1
Wait disabled mode
0
Pin wait mode
1
Pin auto-wait mode
Access state control
0
External memory space designated as 2-state
access space
Wait state insertion in external memory space
access is disabled
1
External memory space designated as 3-state
access space
Wait state insertion in external memory space
access is enabled
Bus width control
768
0
External memory space designated as 16-bit access space
1
External memory space designated as 8-bit access space
TCR0—Timer Control Register 0
TCR1—Timer Control Register 1
TCRX—Timer Control Register X
TCRY—Timer Control Register Y
Bit
H'FFC8
H'FFC9
H'FFF0
H'FFF0
TMR0
TMR1
TMRX
TMRY
7
6
5
4
3
2
1
0
CMIEB
CMIEA
OVIE
CCLR1
CCLR0
CKS2
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Clock select 2 to 0
Channel
Bit 2
Bit 1
Bit 0
Description
CKS2 CKS1 CKS0
Counter clear 1 and 0
0
1
0
1
0
1
0
0
Clear is disabled
Clear by compare
match A
0
1*1 Internal clock: counting at falling edge of ø/8
Internal clock: counting at falling edge of ø/2
1
Clear by compare
match B
Internal clock: counting at falling edge of ø/32
Internal clock: counting at falling edge of ø/256
1
1
0
0
Counting at TCNT1 overflow signal*2
0
0
0
Clock input disabled
Timer overflow interrupt enable
OVF interrupt request (OVI) is disabled
1
OVF interrupt request (OVI) is enabled
0*1 Internal clock: counting at falling edge of ø/64
1*1 Internal clock: counting at falling edge of ø/1024
Clear by rising edge
of external reset input
0
0
Clock input disabled
1*1 Internal clock: counting at falling edge of ø/8
Internal clock: counting at falling edge of ø/2
1
0*1 Internal clock: counting at falling edge of ø/64
Internal clock: counting at falling edge of ø/128
1*1 Internal clock: counting at falling edge of ø/1024
Compare match interrupt enable A
0
CMFA interrupt request (CMIA) is disabled
1
CMFA interrupt request (CMIA) is enabled
Internal clock: counting at falling edge of ø/2048
X
1
0
0
Count at TCNT0 compare match A*2
0
0
0
Clock input disabled
1
Internal clock: counting on ø
0
Internal clock: counting at falling edge of ø/2
1
Internal clock: counting at falling edge of ø/4
1
Compare Match Interrupt Enable B
0
CMFB interrupt request (CMIB) is disabled
1
CMFB interrupt request (CMIB) is enabled
Y
1
0
0
Clock input disabled
0
0
0
Clock input disabled
1
Internal clock: counting at falling edge of ø/4
0
Internal clock: counting at falling edge of ø/256
1
Internal clock: counting at falling edge of ø/2048
1
All
1
0
0
Clock input disabled
1
0
1
External clock: counting at rising edge
1
0
External clock: counting at falling edge
1
External clock: counting at both rising and falling
edges
Notes: 1. Selected by ICKS1 and ICKS0 in STCR. For details, see section 12.2.4,
Timer Control Register (TCR).
2. If the clock input of channel 0 is the TCNT1 overflow signal and that of
channel 1 is the TCNT0 compare match signal, no incrementing clock is
generated. Do not use this setting.
769
TCSR0—Timer Control/Status Register 0
TCSR0
Bit
H'FFCA
TMR0
7
6
5
4
3
2
1
0
CMFB
CMFA
OVF
ADTE
OS3
OS2
OS1
OS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/W
R/W
R/W
R/W
R/W
Output select 1 and 0
0
0
No change at compare match A
1
0 output at compare match A
1
0
1 output at compare match A
1
Output inverted at compare
match A (toggle output)
Output select 3 and 2
0
1
0
No change at compare match B
1
0 output at compare match B
0
1 output at compare match B
1
Output inverted at compare
match B (toggle output)
A/D trigger enable
0
A/D converter start requests by compare match A
are disabled
1
A/D converter start requests by compare match A
are enabled
Timer overflow flag
0
[Clearing condition]
When 0 is written in OVF after reading OVF = 1
1
[Setting condition]
When TCNT overflows from H'FF to H'00
Compare match flag A
0
[Clearing conditions]
• When 0 is written in CMFA after reading CMFA = 1
• When the DTC is activated by a CMIA interrupt
1
[Setting condition]
When TCNT = TCORA
Compare match flag B
0
[Clearing conditions]
• When 0 is written in CMFB after reading CMFB = 1
• When the DTC is activated by a CMIB interrupt
1
[Setting condition]
When TCNT = TCORB
Note: * Only 0 can be written in bits 7 to 5, to clear the flags.
770
TCSR1—Timer Control/Status Register 1
H'FFCB
TMR1
7
6
5
4
3
2
1
0
CMFB
CMFA
OVF
—
OS3
OS2
OS1
OS0
Initial value
0
0
0
1
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
—
R/W
R/W
R/W
R/W
Bit
Output select 1 and 0
0
1
0
No change at compare match A
1
0 output at compare match A
0
1 output at compare match A
1
Output inverted at compare
match A (toggle output)
Output select 3 and 2
0
1
0
No change at compare match B
1
0 output at compare match B
0
1 output at compare match B
1
Output inverted at compare
match B (toggle output)
Timer overflow flag
0
[Clearing condition]
When 0 is written in OVF after reading OVF = 1
1
[Setting condition]
When TCNT overflows from H'FF to H'00
Compare match flag A
0
[Clearing conditions]
• When 0 is written in CMFA after reading CMFA = 1
• When the DTC is activated by a CMIA interrupt
1
[Setting condition]
When TCNT = TCORA
Compare match flag B
0
[Clearing conditions]
• When 0 is written in CMFB after reading CMFB = 1
• When the DTC is activated by a CMIB interrupt
1
[Setting condition]
When TCNT = TCORB
Note: * Only 0 can be written in bits 7 to 5, to clear the flags.
771
TCORA0—Time Constant Register A0
TCORA1—Time Constant Register A1
TCORB0—Time Constant Register B0
TCORB1—Time Constant Register B1
TCORAY—Time Constant Register AY
TCORBY—Time Constant Register BY
TCORC—Time Constant Register C
TCORAX—Time Constant Register AX
TCORBX—Time Constant Register BX
H'FFCC
H'FFCD
H'FFCE
H'FFCF
H'FFF2
H'FFF3
H'FFF5
H'FFF6
H'FFF7
TMR0
TMR1
TMR0
TMR1
TMRY
TMRY
TMRX
TMRX
TMRX
TCORA0
TCORB0
TCORA1
TCORB1
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Compare match flag (CMF) is set when TCOR and TCNT values match
TCORAX, TCORAY
TCORBX, TCORBY
Bit
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Compare match flag (CMF) is set when TCOR and TCNT values match
TCORC
Bit
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Compare match C signal is generated when sum of TCORC and TICR
contents match TCNT value
772
TCNT0—Timer Counter 0
TCNT1—Timer Counter 1
TCNTX—Timer Counter X
TCNTY—Timer Counter Y
H'FFD0
H'FFD1
H'FFF4
H'FFF4
TMR0
TMR1
TMRX
TMRY
TCNT0
TCNT1
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Up-counter
TCNTX, TCNTY
Bit
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Up-counter
773
PWOERA—PWM Output Enable Register A
PWOERB—PWM Output Enable Register B
H'FFD3
H'FFD2
PWM
PWM
7
6
5
4
3
2
1
0
PWOERA
OE7
OE6
OE5
OE4
OE3
OE2
OE1
OE0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
OE15
OE14
OE13
OE12
OE11
OE10
OE9
OE8
Bit
Bit
PWOERB
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Switching between PWM output and port output
DDR
OE
0
0
Port input
1
Port input
0
Port output or PWM 256/256 output
1
PWM output (0 to 255/256 output)
1
Description
PWDPRA—PWM Data Polarity Register A
PWDPRB—PWM Data Polarity Register B
Bit
H'FFD5
H'FFD4
PWM
PWM
7
6
5
4
3
2
1
0
OS7
OS6
OS5
OS4
OS3
OS2
OS1
OS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PWDPRA
7
6
5
4
3
2
1
0
OS15
OS14
OS13
OS12
OS11
OS10
OS9
OS8
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
PWDPRB
PWM output polarity control
0 PWM direct output (PWDR value corresponds to high width of output)
1 PWM inverted output (PWDR value corresponds to low width of output)
774
PWSL—PWM Register Select
7
Bit
H'FFD6
6
PWCKE PWCKS
PWM
5
4
3
2
1
0
—
—
RS3
RS2
RS1
RS0
Initial value
0
0
1
1
0
0
0
0
Read/Write
R/W
R/W
—
—
R/W
R/W
R/W
R/W
Register Select
0
0
0
0 PWDR0 selected
1 PWDR1 selected
1
0 PWDR2 selected
1 PWDR3 selected
1
0
0 PWDR4 selected
1 PWDR5 selected
1
0 PWDR6 selected
1 PWDR7 selected
1
0
0
0 PWDR8 selected
1 PWDR9 selected
1
0 PWDR10 selected
1 PWDR11 selected
1
0
0 PWDR12 selected
1 PWDR13 selected
1
0 PWDR14 selected
1 PWDR15 selected
PWM clock enable, PWM clock select
PWSL
Bit 7
PCSR
Bit 6
Bit 2
Bit 1
Description
PWCKE PWCKS PWCKB PWCKA
0
—
—
—
Clock input disabled
1
0
—
—
ø (system clock) selected
1
0
0
ø/2 selected
1
ø/4 selected
0
ø/8 selected
1
ø/16 selected
1
775
PWDR0 to PWDR15—PWM Data Registers
H'FFD7
PWM
Bit
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Specifies duty factor of basic output pulse and number of additional pulses
ADDRAH—A/D Data Register AH
ADDRAL—A/D Data Register AL
ADDRBH—A/D Data Register BH
ADDRBL—A/D Data Register BL
ADDRCH—A/D Data Register CH
ADDRCL—A/D Data Register CL
ADDRDH—A/D Data Register DH
ADDRDL—A/D Data Register DL
H'FFE0
H'FFE1
H'FFE2
H'FFE3
H'FFE4
H'FFE5
H'FFE6
H'FFE7
A/D Converter
A/D Converter
A/D Converter
A/D Converter
A/D Converter
A/D Converter
A/D Converter
A/D Converter
ADDRH
Bit
14
12
ADDRL
10
8
6
5
4
3
2
1
0
AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 —
—
—
—
—
—
15
13
11
9
7
Initial value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
Stores A/D data
Correspondence between analog input channels and ADDR registers
Analog Input Channel
776
A/D Data Register
Group 0
Group 1
AN0
AN4
ADDRA
AN1
AN5
ADDRB
AN2
AN6 or CIN0–CIN7
ADDRC
AN3
AN7
ADDRD
ADCSR—A/D Control/Status Register
H'FFE8
A/D Converter
7
6
5
4
3
2
1
0
ADF
ADIE
ADST
SCAN
CKS
CH2
CH1
CH0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
Channel select
Group
selection
Channel
selection
Description
CH2
CH1
CH0
0
0
0
AN0
AN0
1
AN1
AN0, AN1
0
AN2
AN0, AN1, AN2
1
AN3
AN0, AN1, AN2, AN3
0
AN4
AN4
1
AN5
AN4, AN5
0
AN6 or CIN0–7
AN4, AN5, AN6 or CIN0–7
1
AN7
AN4, AN5, AN6 or CIN0–7,
AN7
1
1
0
1
Single mode
Scan mode
Clock select
0
Conversion time = 266 states (max.)
1
Conversion time = 134 states (max.)
Scan mode
0
Single mode
1
Scan mode
A/D start
0
A/D conversion stopped
1
• Single mode: A/D conversion is started. Cleared to 0 automatically
when conversion on the specified channel ends
• Scan mode: A/D conversion is started. Conversion continues
consecutively on the selected channels until ADST is cleared to
0 by software, a reset, or a transition to standby mode or module
stop mode
A/D interrupt enable
0
A/D conversion end interrupt (ADI) request disabled
1
A/D conversion end interrupt (ADI) request enabled
A/D end flag
0
[Clearing conditions]
• When 0 is written to ADF after reading ADF = 1
• When the DTC is activated by an ADI interrupt, and ADDR is read
1
[Setting conditions]
• Single mode: When A/D conversion ends
• Scan mode: When A/D conversion ends for all specified channels
Note: * Only 0 can be written, to clear the flag.
777
ADCR—A/D Control Register
H'FFE9
A/D Converter
7
6
5
4
3
2
1
0
TRGS1
TRGS0
—
—
—
—
—
—
Initial value
0
0
1
1
1
1
1
1
Read/Write
R/W
R/W
—
—
—
—
—
—
Bit
Timer trigger select
0
1
778
0
A/D conversion start by external trigger is disabled
1
A/D conversion start by external trigger is disabled
0
A/D conversion start by external trigger (8-bit timer) is enabled
1
A/D conversion start by external trigger pin is enabled
TCSR1—Timer Control/Status Register 1
H'FFEA
WDT1
7
6
5
4
3
2
1
0
OVF
WT/IT
TME
PSS
RST/NMI
CKS2
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
Clock select 2 to 0
PSS CSK2 CSK1 CSK0
0
0
0
1
1
0
1
1
0
0
1
1
0
1
Clock
0
ø/2
1
ø/64
0
ø/128
1
ø/512
0
ø/2048
1
ø/8192
0
ø/32768
1
ø/131072
0
øSUB/2
1
øSUB/4
0
øSUB/8
1
øSUB/16
0
øSUB/32
1
øSUB/64
0
øSUB/128
1
øSUB/256
Reset or NMI
Prescaler
0
NMI interrupt requested
1
Internal reset requested
select*2
0
TCNT counts on a ø-based prescaler (PSM) scaled clock
1
TCNT counts on a øSUB-based prescaler (PSS) scaled clock
Timer enable
0
TCNT is initialized to H'00 and halted
1
TCNT counts
Timer mode select
0
Interval timer mode: Interval timer interrupt request (WOVI)
sent to CPU when TCNT overflows
1
Watchdog timer mode: Reset or NMI interrupt request sent
to CPU when TCNT overflows
Overflow flag
0
[Clearing conditions]
• When 0 is written in the TME bit
• When 0 is written in OVF after reading TCSR when OVF = 1
1
[Setting condition]
When TCNT overflows from H'FF to H'00
When internal reset request is selected in watchdog timer mode, OVF is cleared
automatically by an internal reset after being set
Notes: 1. Only 0 can be written, to clear the flag.
2. For operation control when a transition is made to power-down mode, see section 21.2.3, Timer Control/Status Register (TCSR).
779
TCSRX—Timer Control/Status Register X
H'FFF1
TMRX
7
6
5
4
3
2
1
0
CMFB
CMFA
OVF
ICF
OS3
OS2
OS1
OS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/W
R/W
R/W
R/W
Bit
Output select 1 and 0
0
1
0
No change at compare match A
1
0 output at compare match A
0
1 output at compare match A
1
Output inverted at compare
match A (toggle output)
Output select 3 and 2
0
1
0
No change at compare match B
1
0 output at compare match B
0
1 output at compare match B
1
Output inverted at compare
match B (toggle output)
Input capture flag
0
[Clearing condition]
When 0 is written in ICF after reading ICF = 1
1
[Setting condition]
When a rising edge followed by a falling edge is
detected in the external reset signal after the
ICST bit is set to 1 in TCONRI
Timer overflow flag
0
[Clearing condition]
When 0 is written in OVF after reading OVF = 1
1
[Setting condition]
When TCNT overflows from H'FF to H'00
Compare match flag A
0
[Clearing conditions]
• When 0 is written in CMFA after reading CMFA = 1
• When the DTC is activated by a CMIA interrupt
1
[Setting condition]
When TCNT = TCORA
Compare match flag B
0
[Clearing conditions]
• When 0 is written in CMFB after reading CMFB = 1
• When the DTC is activated by a CMIB interrupt
1
[Setting condition]
When TCNT = TCORB
Note: * Only 0 can be written in bits 7 to 4, to clear the flags.
780
TCSRY—Timer Control/Status Register Y
H'FFF1
TMRY
7
6
5
4
3
2
1
0
CMFB
CMFA
OVF
ICIE
OS3
OS2
OS1
OS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/W
R/W
R/W
R/W
R/W
Bit
Output select 1 and 0
0
1
0
No change at compare match A
1
0 output at compare match A
0
1 output at compare match A
1
Output inverted at compare
match A (toggle output)
Output select 3 and 2
0
1
0
No change at compare match B
1
0 output at compare match B
0
1 output at compare match B
1
Output inverted at compare
match B (toggle output)
Input capture interrupt enable
0
ICF interrupt request (ICIX) is disabled
1
ICF interrupt request (ICIX) is enabled
Timer overflow flag
0
[Clearing condition]
When 0 is written in OVF after reading OVF = 1
1
[Setting condition]
When TCNT overflows from H'FF to H'00
Compare match flag A
0
[Clearing conditions]
• When 0 is written in CMFA after reading CMFA = 1
• When the DTC is activated by a CMIA interrupt
1
[Setting condition]
When TCNT = TCORA
Compare match flag B
0
[Clearing conditions]
• When 0 is written in CMFB after reading CMFB = 1
• When the DTC is activated by a CMIB interrupt
1
[Setting condition]
When TCNT = TCORB
Note: * Only 0 can be written in bits 7 to 5, to clear the flags.
781
TICRR—Input Capture Register R
TICRF—Input Capture Register F
H'FFF2
H'FFF3
TMRX
TMRX
Bit
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
Stores TCNT value at fall of external trigger input
TISR—Timer Input Select Register
H'FFF5
TMRY
7
6
5
4
3
2
1
0
—
—
—
—
—
—
—
IS
Initial value
1
1
1
1
1
1
1
0
Read/Write
—
—
—
—
—
—
—
R/W
Bit
Input select
782
0
IVG signal is selected (H8S/2128 Series)
External clock/reset input is disabled (H8S/2124 Series)
1
VSYNC1/TMIY (TMCIY/TMRIY) is selected
TCONRI—Timer Connection Register I
Bit
7
6
H'FFFC
5
SIMOD1 SIMOD0 SCONE
Timer Connection
4
3
2
1
0
ICST
HFINV
VFINV
HIINV
VIINV
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Input synchronization
signal inversion
0
The VSYNCI pin state
is used directly as
the VSYNCI input
1
The VSYNCI pin state
is inverted before use
as the VSYNCI input
Input synchronization signal inversion
0
The HSYNCI and CSYNCI pin states are used
directly as the HSYNCI and CSYNCI inputs
1
The HSYNCI and CSYNCI pin states are inverted
before use as the HSYNCI and CSYNCI inputs
Input synchronization signal inversion
0
The VFBACKI pin state is used directly as the VFBACKI input
1
The VFBACKI pin state is inverted before use as the VFBACKI input
Input synchronization signal inversion
0
The HFBACKI pin state is used directly as the HFBACKI input
1
The HFBACKI pin state is inverted before use as the HFBACKI input
Input capture start bit
0
The TICRR and TICRF input capture functions are stopped
[Clearing condition]
When a rising edge followed by a falling edge is detected on TMRIX
1
The TICRR and TICRF input capture functions are operating
(Waiting for detection of a rising edge followed by a falling edge on TMRIX)
[Setting condition]
When 1 is written in ICST after reading ICST = 0
Synchronization signal connection enable
SCONE
Mode
FTIA
0
Normal
connection
1
Synchronization IVI
signal connecsignal
tion mode
FTIA
input
FTID
TMCI1
TMRI1
FTIB
input
FTIB
FTIC
input
FTIC
FTID
input
TMCI1
input
TMRI1
input
TMO1
signal
VFBACKI
input
IHI
signal
IHI
signal
IVI
inverse
signal
Input synchronization mode select 1 and 0
SIMOD1
SIMOD0
IHI signal
IVI signal
0
0
No signal
HFBACKI input
VFBACKI input
1
S-on-G mode
CSYNCI input
PDC input
0
Composite mode
HSYNCI input
PDC input
1
Separate mode
HSYNCI input
VSYNCI input
1
Mode
783
TCONRO—Timer Connection Register O
Bit
H'FFFD
Timer Connection
7
6
5
4
3
2
1
0
HOE
VOE
CLOE
CBOE
HOINV
VOINV
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
CLOINV CBOINV
Output synchronization
signal inversion
0
The CBLANK signal is
used directly as the
CBLANK output
1
The CBLANK signal is
inverted before use as
the CBLANK output
Output synchronization signal inversion
0
The CLO signal (CL1, CL2, CL3,
or CL4 signal) is used directly as
the CLAMPO output
1
The CLO signal (CL1, CL2, CL3,
or CL4 signal) is inverted before
use as the CLAMPO output
Output synchronization signal inversion
0
The IVO signal is used directly as
the VSYNCO output
1
The IVO signal is inverted before
use as the VSYNCO output
Output synchronization signal inversion
0
The IHO signal is used directly as the HSYNCO output
1
The IHO signal is inverted before use as the HSYNCO output
Output enable
0
The P27/A15/PW15/CBLANK pin functions as the P27/A15/PW15 pin
1
In mode 1 (expanded mode with on-chip ROM disabled): The P27/A15/
PW15/CBLANK pin functions as the A15 pin
In modes 2 and 3 (expanded modes with on-chip ROM enabled): The P27/
A15/PW15/CBLANK pin functions as the CBLANK pin
Output enable
0
The P64/FTIC/CIN4/CLAMPO pin functions as the P64/FTIC/CIN4 pin
1
The P64/FTIC/CIN4/CLAMPO pin functions as the CLAMPO pin
Output enable
0
The P61/FTOA/CIN1/VSYNCO pin functions as the P61/FTOA/CIN1 pin
1
The P61/FTOA/CIN1/VSYNCO pin functions as the VSYNCO pin
Output enable
784
0
The P67/TMO1/TMOX/CIN7/HSYNCO pin functions as the P67/TMO1/TMOX/CIN7 pin
1
The P67/TMO1/TMOX/CIN7/HSYNCO pin functions as the HSYNCO pin
TCONRS—Timer Connection Register S
7
Bit
6
TMRX/Y
5
H'FFFE
4
3
Timer Connection
2
1
0
ISGENE HOMOD1 HOMOD0 VOMOD1 VOMOD0 CLMOD1 CLMOD0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Clamp waveform mode select 1 and 0
ISGENE CLMOD1 CLMOD0
Description
0
0
The CL1 signal is selected
1
The CL2 signal is selected
0
The CL3 signal is selected
0
1
1
0
1
0
The CL4 signal is selected
1
1
0
1
Vertical synchronization output mode select 1 and 0
ISGENE VOMOD1 VOMOD0
0
0
1
1
0
Description
0
The IVI signal (without fall modification
or IHI synchronization) is selected
1
The IVI signal (without fall modification,
with IHI synchronization) is selected
0
The IVI signal (with fall modification,
without IHI synchronization) is selected
1
The IVI signal (with fall modification and
IHI synchronization) is selected
0
The IVG signal is selected
1
1
0
1
Horizontal synchronization output mode select 1 and 0
ISGENE HOMOD1 HOMOD0
Description
0
0
The IHI signal (without 2fH modification) is selected
1
The IHI signal (with 2fH modification) is selected
0
The CLI signal is selected
0
1
1
1
0
0
The IHG signal is selected
1
1
0
1
Internal synchronization signal select
8-bit timer access select
0
The TMRX registers are accessed at addresses H'FFF0 to H'FFF5
1
The TMRY registers are accessed at addresses H'FFF0 to H'FFF5
785
SEDGR—Edge Sense Register
Bit
7
6
5
VEDG
HEDG
CEDG
0
0
0
Initial value
Read/Write
H'FFFF
*1
R/(W)
*1
R/(W)
4
3
R/(W)
2
HFEDG VFEDG PREQF
0
*1
Timer Connection
0
*1
R/(W)
0
*1
*1
R/(W)
R/(W)
1
0
IHI
IVI
—*2
—*2
R
R
IVI signal level
0
The IVI signal is low
1
The IVI signal is high
IHI signal level
0
The IHI signal is low
1
The IHI signal is high
Pre-equalization flag
0
[Clearing condition]
When 0 is written in PREQF after
reading PREQF = 1
1
[Setting condition]
When an IHI signal 2fH modification
condition is detected
VFBACKI edge
0
[Clearing condition]
When 0 is written in VFEDG after reading VFEDG = 1
1
[Setting condition]
When a rising edge is detected on the VFBACKI pin
HFBACKI edge
0
[Clearing condition]
When 0 is written in HFEDG after reading HFEDG = 1
1
[Setting condition]
When a rising edge is detected on the HFBACKI pin
CSYNCI edge
0
[Clearing condition]
When 0 is written in CEDG after reading CEDG = 1
1
[Setting condition]
When a rising edge is detected on the CSYNCI pin
HSYNCI edge
0
[Clearing condition]
When 0 is written in HEDG after reading HEDG = 1
1
[Setting condition]
When a rising edge is detected on the HSYNCI pin
VSYNCI edge
0
[Clearing condition]
When 0 is written in VEDG after reading VEDG = 1
1
[Setting condition]
When a rising edge is detected on the VSYNCI pin
Notes: 1. Only 0 can be written, to clear the flags.
2. The initial value is undefined since it depends on the pin states.
786
Appendix C I/O Port Block Diagrams
C.1
Port 1 Block Diagram
Mode 2, 3
EXPE
Mode 1
RP1P
Hardware
standby
Mode 1
WP1P
Reset
R
D
Q
P1nDDR
C
WP1D
Reset
P1n
Internal address bus
R
Q
D
P1nPCR
C
Internal data bus
Reset
8-bit PWM
PWM output enable
PWM output
R
Q
D
P1nDR
C
WP1
14-bit PWM
PWX0, PWX1 output
Output enable
RP1
WP1P: Write to P1PCR
WP1D: Write to P1DDR
WP1: Write to port 1
RP1P: Read P1PCR
RP1:
Read port 1
n = 0 or 1
Figure C.1 Port 1 Block Diagram (Pins P10 and P11)
787
Mode 2, 3
EXPE
Mode 1
RP1P
Hardware
standby
Mode 1
WP1P
Reset
R
D
Q
P1nDDR
C
WP1D
Reset
P1n
R
Q
D
P1nDR
C
WP1
RP1
WP1P: Write to P1PCR
WP1D: Write to P1DDR
WP1: Write to port 1
RP1P: Read P1PCR
RP1:
Read port 1
n = 2 to 7
Figure C.2 Port 1 Block Diagram (Pins P12 to P17)
788
Internal address bus
R
Q
D
P1nPCR
C
Internal data bus
Reset
8-bit PWM
PWM output enable
PWM output
C.2
Port 2 Block Diagrams
Mode 2, 3
EXPE
Mode 1
RP2P
Hardware
standby
Mode 1
WP2P
Reset
R
D
Q
P2nDDR
C
WP2D
Reset
P2n
Internal address bus
R
Q
D
P2nPCR
C
Internal data bus
Reset
8-bit PWM
PWM output enable
PWM output
R
Q
D
P2nDR
C
WP2
RP2
WP2P: Write to P2PCR
WP2D: Write to P2DDR
WP2: Write to port 2
RP2P: Read P2PCR
RP2:
Read port 2
n = 0 to 2
Figure C.3 Port 2 Block Diagram (Pins P20 to P22)
789
Hardware
standby
Mode 2, 3
EXPE
Mode 1
RP2P
Hardware
standby
WP2P
Reset
Mode 1
R
D
Q
P23DDR
C
WP2D
*1
Reset
P23
Internal address bus
R
Q
D
P23PCR
C
Internal data bus
Reset
8-bit PWM
PWM output enable
PWM output
R
Q
D
P23DR
C
*2
WP2
IIC1
SDA1 output
Transmit enable
RP2
SDA1 input
WP2P:
WP2D:
WP2:
RP2P:
RP2:
Write to P2PCR
Write to P2DDR
Write to port 2
Read P2PCR
Read port 2
Notes: 1. Output enable signal
2. Open-drain control signal
Figure C.4 Port 2 Block Diagram (Pin 23)
790
Mode 2, 3
EXPE
IOSE
Mode 1
RP2P
Hardware
standby
WP2P
Reset
Mode 1
R
D
Q
P24DDR
C
WP2D
*1
Reset
P24
Internal address bus
R
Q
D
P24PCR
C
Internal data bus
Reset
8-bit PWM
PWM output enable
PWM output
R
Q
D
P24DR
C
*2
WP2
IIC1
SCL1 output
Transmit enable
RP2
SCL1 input
WP2P:
WP2D:
WP2:
RP2P:
RP2:
Write to P2PCR
Write to P2DDR
Write to port 2
Read P2PCR
Read port 2
Notes: 1. Output enable signal
2. Open-drain control signal
Figure C.5 Port 2 Block Diagram (Pin 24)
791
Mode 2, 3
EXPE
Mode 1
Hardware
standby
RP2P
WP2P
Reset
Mode 1
R
D
Q
P25DDR
C
WP2D
Reset
P2n
Internal address bus
R
Q
D
P25PCR
C
Internal data bus
Reset
8-bit PWM
PWM output enable
PWM output
R
Q
D
P25DR
C
WP2
SCI1
Output enable
Serial transmit data
RP2
WP2P
WP2D
WP2
RP2P
RP2
: Write to P2PCR
: Write to P2DDR
: Write to port 2
: Read P2PCR
: Read port 2
Figure C.6 Port 2 Block Diagram (Pin P25)
792
Mode 2, 3
EXPE
Mode 1
RP2P
Hardware
standby
WP2P
Reset
Mode 1
R
D
Q
P26DDR
C
WP2D
Internal address bus
R
Q
D
P26PCR
C
Internal data bus
Reset
8-bit PWM
PWM output enable
PWM output
P2n
Reset
R
Q
D
P26DR
C
WP2
SCI1
Input enable
RP2
Serial receive data
WP2P
WP2D
WP2
RP2P
RP2
: Write to P2PCR
: Write to P2DDR
: Write to port 2
: Read P2PCR
: Read port 2
Figure C.7 Port 2 Block Diagram (Pin P26)
793
Mode 2, 3
EXPE
IOSE
Mode 1
RP2P
Hardware
standby
Mode 1
WP2P
Reset
R
D
Q
P27DDR
C
Internal address bus
R
Q
D
P27PCR
C
Internal data bus
Reset
WP2D
8-bit PWM
Reset
P27
PWM output enable
PWM output
R
Q
D
P27DR
C
Mode 2, 3
WP2
Timer connection
CBLANK
CBLANK output
enable
SCI1
RP2
Input enable
Clock output
Output enable
Clock input
WP2P:
WP2D:
WP2:
RP2P:
RP2:
Write to P2PCR
Write to P2DDR
Write to port 2
Read P2PCR
Read port 2
Figure C.8 Port 2 Block Diagram (Pin P27)
794
Port 3 Block Diagram
Mode 2, 3
EXPE
Mode 1
Reset
R
Q
D
P3nPCR
C
RP3P
WP3P
Hardware
standby
Reset
R
D
Q
P3nDDR
C
Internal data bus
C.3
WP3D
Reset
P3n
R
Q
D
P3nDR
C
WP3
RP3
External address read
WP3P: Write to P3PCR
WP3D: Write to P3DDR
WP3: Write to port 3
RP3P: Read P3PCR
RP3:
Read port 3
n = 0 to 7
Figure C.9 Port 3 Block Diagram
795
Port 4 Block Diagrams
Reset
R
D
Q
P40DDR
C
Internal data bus
C.4
WP4D
Reset
R
Q
D
P40DR
C
P40
WP4
RP4
A/D converter
External trigger
input
IRQ2 input
WP4D: Write to P4DDR
WP4: Write to port 4
RP4:
Read port 4
Figure C.10 Port 4 Block Diagram (Pin P40)
796
IRQ2 enable
R
D
Q
P4nDDR
C
Internal data bus
Reset
WP4D
Reset
R
Q
D
P4nDR
C
P4n
WP4
RP4
WP4D: Write to P4DDR
WP4: Write to port 4
RP4:
Read port 4
n = 1 or 2
IRQ1 input
IRQ0 input
IRQ1 enable
IRQ0 enable
Figure C.11 Port 4 Block Diagram (Pins P41, P42)
797
EXPE
Internal data bus
Reset
Mode 2, 3
EXPE
R
D
Q
P4nDDR
C
WP4D
Reset
P4n
R
Q
D
P4nDR
C
WP4
RP4
WP4D: Write to P4DDR
WP4: Write to port 4
RP4:
Read port 4
n = 3 to 5
Figure C.12 Port 4 Block Diagram (Pins P43 to P45)
798
Bus controller
RD output
WR output
AS/IOS output
Internal data bus
Reset
Mode 1
Hardware
standby
S R
D
Q
P46DDR
C
Subclock input
enable
WP4D
ø output
P46
RP4
Subclock input
WP4D: Write to P4DDR
RP4:
Read port 4
Figure C.13 Port 4 Block Diagram (Pin P46)
799
R
D
Q
P47DDR
C
WP4D
Internal data bus
Reset
Bus controller
Input enable
EXPE
*1
Reset
R
Q
D
P47DR
C
P47
*2
WP4
WAIT input
IIC0
SDA0 output
Transmit enable
RP4
SDA0 input
WP4D: Write to P4DDR
WP4: Write to port 4
RP4:
Read port 4
Notes: 1. Output enable signal
2. Open drain control signal
Figure C.14 Port 4 Block Diagram (Pin P47)
800
Port 5 Block Diagrams
Reset
R
D
Q
P50DDR
C
WP5D
Internal data bus
C.5
SCI0
Serial transmit data
Output enable
Reset
P50
R
Q
D
P50DR
C
WP5
RP5
WP5D: Write to P5DDR
WP5: Write to port 5
RP5:
Read port 5
Figure C.15 Port 5 Block Diagram (Pin P50)
801
R
D
Q
P51DDR
C
Internal data bus
Reset
WP5D
SCI0
Input enable
Reset
R
Q
D
P51DR
C
P51
WP5
RP5
WP5D: Write to P5DDR
WP5: Write to port 5
RP5:
Read port 5
Figure C.16 Port 5 Block Diagram (Pin P51)
802
Serial receive
data
R
D
Q
P52DDR
C
WP5D
*1
Reset
R
Q
D
P52DR
C
P52
*2
WP5
Internal data bus
Reset
SCI0
Input enable
Clock output
Output enable
Clock input
IIC0
SCL0 output
Transmit enable
RP5
SCL0 input
WP5D: Write to P5DDR
WP5: Write to port 5
RP5:
Read port 5
Notes: 1. Output enable signal
2. Open drain control signal
Figure C.17 Port 5 Block Diagram (Pin P52)
803
Port 6 Block Diagrams
Hardware
standby
Reset
R
D
Q
P6nDDR
C
Internal data bus
C.6
WP6D
Reset
R
Q
D
P6nDR
C
P6n
WP6
RP6
16-bit FRT
FTCI input
FTIA input
FTIB input
FTID input
Timer connection
8-bit timers Y, X
HFBACKI input, TMIX input,
VSYNCI input, TMIY input,
VFBACKI input
A/D converter
Analog input
WP6D: Write to P6DDR
WP6: Write to port 6
RP6:
Read port 6
n = 0, 2, 3, 5
Figure C.18 Port 6 Block Diagram (Pins P60, P62, P63, P65)
804
Reset
R
D
Q
P61DDR
C
WP6D
Internal data bus
Hardware
standby
16-bit FRT
FTOA output
Output enable
Reset
R
Q
D
P61DR
C
P61
WP6
Timer connection
VSYNCO output
Output enable
RP6
A/D converter
Analog input
WP6D: Write to P6DDR
WP6: Write to port 6
RP6:
Read port 6
Figure C.19 Port 6 Block Diagram (Pin P61)
805
Reset
R
D
Q
P64DDR
C
WP6D
Internal data bus
Hardware
standby
Timer connection
CLAMPO output
Output enable
Reset
P64
R
Q
D
P64DR
C
WP6
RP6
16-bit FRT
FTIC input
A/D converter
Analog input
WP6D: Write to P6DDR
WP6: Write to port 6
RP6:
Read port 6
Figure C.20 Port 6 Block Diagram (Pin P64)
806
Reset
R
D
Q
P66DDR
C
WP6D
Internal data bus
Hardware
standby
16-bit FRT
FTOB output
Output enable
Reset
P66
R
Q
D
P66DR
C
WP6
RP6
A/D converter
Analog input
WP6D: Write to P6DDR
WP6: Write to port 6
RP6:
Read port 6
Figure C.21 Port 6 Block Diagram (Pin P66)
807
Reset
R
D
Q
P67DDR
C
WP6D
Internal data bus
Hardware
standby
8-bit timer X
TMOX output
Output enable
Reset
P67
R
Q
D
P67DR
C
WP6
RP6
A/D converter
Analog input
WP6D: Write to P6DDR
WP6: Write to port 6
RP6:
Read port 6
Figure C.22 Port 6 Block Diagram (Pin P67)
808
Port 7 Block Diagrams
RP7
P7n
Internal data bus
C.7
A/D converter
Analog input
RP7: Read port 7
n = 0 to 7
Figure C.23 Port 7 Block Diagram (Pins P70 to P77)
809
Appendix D Pin States
D.1
Port States in Each Processing State
Table D.1
Port Name
Pin Name
Port 1
A7 to A0
I/O Port States in Each Processing State
Hardware Software
MCU Operating
Standby Standby
Mode
Reset Mode
Mode
Watch
Mode
Sleep
Mode
Subsleep
Mode
Subactive
Mode
Program
Execution
State
1
L
keep*
keep*
keep*
A7 to A0
A7 to A0
2, 3 (EXPE = 1)
T
Address
output/
input port
Address
output/
input port
I/O port
I/O port
A15 to A8
A15 to A8
Address
output/
input port
Address
output/
input port
I/O port
I/O port
T
D7 to D0
D7 to D0
keep
T
keep*
2, 3 (EXPE = 0)
Port 2
A15 to A8
1
L
2, 3 (EXPE = 1)
T
T
keep*
keep*
keep*
keep*
2, 3 (EXPE = 0)
Port 3
D7 to D0
1
Port 47
WAIT
1
T
T
T
T
T
keep
2, 3 (EXPE = 0)
T
keep
keep
keep
I/O port
I/O port
T/keep
T/keep T/keep
T/keep WAIT/
I/O port
WAIT/
I/O port
keep
keep
keep
I/O port
I/O port
[DDR = 1]
clock
output
EXCL
input
EXCL input
Clock output/
EXCL input/
input port
H
AS, WR, RD
AS, WR, RD
2, 3 (EXPE = 1)
2, 3 (EXPE = 0)
Port 46
ø
EXCL
T
2, 3 (EXPE = 1)
1
2, 3 (EXPE = 1)
Clock T
output
[DDR = 1] H EXCL
input
[DDR = 0] T
T
[DDR = 0] T
2, 3 (EXPE = 0)
Port 45 to 43 1
AS, WR, RD
2, 3 (EXPE = 1)
H
T
H
keep
keep
keep
keep
I/O port
I/O port
T
T
keep
keep
keep
keep
I/O port
I/O port
T
T
keep
keep
keep
keep
I/O port
I/O port
2, 3 (EXPE = 0)
Port 42 to 40 1
H
H
T
2, 3 (EXPE = 1)
2, 3 (EXPE = 0)
Port 5
1
2, 3 (EXPE = 1)
2, 3 (EXPE = 0)
810
Port Name
Pin Name
Hardware Software
MCU Operating
Standby Standby
Mode
Reset Mode
Mode
Watch
Mode
Sleep
Mode
Subsleep
Mode
Subactive
Mode
Program
Execution
State
Port 6
1
T
T
keep
keep
keep
keep
I/O port
I/O port
T
T
T
T
T
T
Input port
Input port
2, 3 (EXPE = 1)
2, 3 (EXPE = 0)
Port 7
1
2, 3 (EXPE = 1)
2, 3 (EXPE = 0)
Legend:
H:
High
L:
Low
T:
High-impedance state
keep: Input ports are in the high-impedance state (when DDR = 0 and PCR = 1, MOS input pullups remain on).
Output ports maintain their previous state.
Depending on the pins, the on-chip supporting modules may be initialized and the I/O port
function determined by DDR and DR used.
DDR: Data direction register
Note: * In the case of address output, the last address accessed is retained.
811
Appendix E Timing of Transition to and Recovery from
Hardware Standby Mode
E.1
Timing of Transition to Hardware Standby Mode
(1) To retain RAM contents with the RAME bit set to 1 in SYSCR, drive the RES signal low 10
system clock cycles before the STBY signal goes low, as shown in figure E.1. RES must
remain low until STBY signal goes low (minimum delay from STBY low to RES high: 0 ns).
STBY
t1 ≥ 10tcyc
t2 ≥ 0 ns
RES
Figure E.1 Timing of Transition to Hardware Standby Mode
(2) To retain RAM contents with the RAME bit cleared to 0 in SYSCR, or when RAM contents do
not need to be retained, RES does not have to be driven low as in (1).
E.2
Timing of Recovery from Hardware Standby Mode
Drive the RES signal low at least 100 ns before STBY goes high to execute a reset.
STBY
t ≥ 100 ns
tOSC
RES
Figure E.2 Timing of Recovery from Hardware Standby Mode
812
Appendix F Product Code Lineup
Table F.1
H8S/2128 Series and H8S/2124 Series Product Code Lineup
Product Type
H8S/2128
Series
F-ZTAT
version
Standard product
(5 V/4 V version)
Low-voltage version
(3 V version)
— Preliminary —
Package
(Hitachi
Package
Code)
Product
Code
Mark Code
HD64F2128
HD64F2128PS20
64-pin shrink
DIP (DP-64S)
HD64F2128FA20
64-pin QFP
(FP-64A)
HD64F2128TF20
80-pin TQFP
(TFP-80C)
HD64F2128VPS10
64-pin shrink Under
DIP (DP-64S) development
HD64F2128VFA10
64-pin QFP
(FP-64A)
HD64F2128VTF10
80-pin TQFP
(TFP-80C)
HD6432127R(***)PS
64-pin shrink
DIP (DP-64S)
HD6432127R(***)FA
64-pin QFP
(FP-64A)
HD6432127R(***)TF
80-pin TQFP
(TFP-80C)
HD64F2128V
H8S/2127 Mask ROM Standard product
HD6432127R
version
(5 V version, 4 V version,
3 V version)
Notes
Version with on-chip
HD6432127RW HD6432127RW(***)PS64-pin shrink
I2C bus interface
DIP (DP-64S)
(5 V version, 4 V version,
HD6432127RW(***)FA 64-pin QFP
3 V version)
(FP-64A)
HD6432127RW(***)TF 80-pin TQFP
(TFP-80C)
H8S/2128 H8S/2126 Mask ROMStandard product
HD6432126R
Series
version
(5 V version, 4 V version,
3 V version)
HD6432126R(***)PS 64-pin shrink
DIP (DP-64S)
HD6432126R(***)FA
64-pin QFP
(FP-64A)
HD6432126R(***)TF
80-pin TQFP
(TFP-80C)
Version with on-chip
HD6432126RW HD6432126RW(***)PS64-pin shrink
I2C bus interface
DIP (DP-64S)
(5 V version, 4 V version,
HD6432126RW(***)FA 64-pin QFP
3 V version)
(FP-64A)
HD6432126RW(***)TF 80-pin TQFP
(TFP-80C)
813
Product Type
Product
Code
H8S/2124 H8S/2122 Mask ROMStandard product
HD6432122
Series
version
(5 V version, 4 V version,
3 V version)
H8S/2120 Mask ROMStandard product
HD6432120
version
(5 V version, 4 V version,
3 V version)
Mark Code
Package
(Hitachi
Package
Code)
HD6432122(***)PS
64-pin shrink
DIP (DP-64S)
HD6432122(***)FA
64-pin QFP
(FP-64A)
HD6432122(***)TF
80-pin TQFP
(TFP-80C)
HD6432120(***)PS
64-pin shrink
DIP (DP-64S)
HD6432120(***)FA
64-pin QFP
(FP-64A)
HD6432120(***)TF
80-pin TQFP
(TFP-80C)
Notes
Note: (***) is the ROM code.
The F-ZTAT version of the H8S/2128 has an on-chip I 2C bus interface as standard.
The F-ZTAT 5 V/4 V version supports the operating ranges of the 5 V version and the 4 V
version.
The operating range of the F-ZTAT low-voltage version will be decided later.
The above table includes products in the planning stage or under development. Information
on the status of individual products can be obtained from Hitachi’s sales offices.
814
Appendix G Package Dimensions
Figures G.1, G.2 and G.3 show the package dimensions of the H8S/2128 Series and H8S/2124
Series.
Unit: mm
57.6
58.5 Max
33
17.0
18.6 Max
64
32
1.0
1.78 ± 0.25
0.48 ± 0.10
0.51 Min
1.46 Max
2.54 Min 5.08 Max
1
19.05
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
DP-64S
—
Conforms
8.8 g
Figure G.1 Package Dimensions (DP-64S)
815
Unit: mm
17.2 ± 0.3
14
33
48
32
0.8
17.2 ± 0.3
49
64
17
1
0.10
*Dimension including the plating thickness
Base material dimension
*0.17 ± 0.05
0.15 ± 0.04
3.05 Max
1.0
2.70
0.15 M
0.10 +0.15
–0.10
*0.37 ± 0.08
0.35 ± 0.06
16
0° – 8°
0.8 ± 0.3
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
Figure G.2 Package Dimensions (FP-64A)
816
1.6
FP-64A
—
Conforms
1.2 g
14.0 ± 0.2
Unit: mm
12
60
41
40
80
21
0.5
14.0 ± 0.2
61
0.10
*Dimension including the plating thickness
Base material dimension
0.10 ± 0.10
1.25
1.00
0.10 M
*0.17 ± 0.05
0.15 ± 0.04
20
1.20 Max
1
*0.22 ± 0.05
0.20 ± 0.04
1.0
0° – 8°
0.5 ± 0.1
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
TFP-80C
—
Conforms
0.4 g
Figure G.3 Package Dimensions (TFP-80C)
817
818
H8S/2128 Series and H8S/2124 Series Hardware Manual
Publication Date: 1st Edition, September 1997
3rd Edition, March 2001
Published by:
Electronic Devices Sales & Marketing Group
Semiconductor & Integrated Circuits
Hitachi, Ltd.
Edited by:
Technical Documentation Group
Hitachi Kodaira Semiconductor Co., Ltd.
Copyright © Hitachi, Ltd., 1997. All rights reserved. Printed in Japan.