MMSZ5221B-MMSZ5260B Surface mount zener diode FEATURES z z z Planar die construction. 500mW power dissipation. General purpose, medium current. z Ideally suited for automated assembly processes. APPLICATIONS z Zener diode. z Ultra-small surface mount package. SOD-123 ORDERING INFORMATION Type No. MMSZ5221B-MMSZ5359B Marking Package Code See table 2 SOD-123 MAXIMUM RATING @ Ta=25℃ unless otherwise specified Characteristic Symbol Value Unit VF 0.9 V Power Dissipation Pd 500 mW Thermal resistance,junction to ambient air RθjA 350 ℃/W Junction temperature Tj 150 ℃ Storage temperature range Tstg -65-150 ℃ Forward Voltage @ IF=10mA Notes: 1. Device mounted on ceramic PCB; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm2. 2. Tested with pulses, Tp ≤1.0ms. www.shunyegroup.com.cn ELECTRICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified Type Type Number Code Zener Voltage Range Vz@IZT Test Maximum Zener Maximum Reverse Current Impedance Leakage Current IZT Nom(V) Min(V) Max(V) mA ZZT@IZT ZZK@IZK=0.25mA Ω IR @VR μA V MMSZ5221B C1 2.4 2.28 2.52 20 30 1200 100 1.0 MMSZ5223B C3 2.7 2.57 2.84 20 30 1300 75 1.0 MMSZ5225B C5 3.0 2.85 3.15 20 30 1600 50 1.0 MMSZ5226B G1 3.3 3.14 3.47 20 28 1600 25 1.0 MMSZ5227B G2 3.6 3.42 3.78 20 24 1700 15 1.0 MMSZ5228B G3 3.9 3.71 4.10 20 23 1900 10 1.0 MMSZ5229B G4 4.3 4.09 4.52 20 22 2000 5.0 1.0 MMSZ5230B G5 4.7 4.47 4.94 20 19 1900 5.0 2.0 MMSZ5231B E1 5.1 4.85 5.36 20 17 1600 5.0 2.0 MMSZ5232B E2 5.6 5.32 5.88 20 11 1600 5.0 3.0 MMSZ5233B E3 6.0 5.70 6.30 20 7 1600 5.0 3.5 MMSZ5234B E4 6.2 5.89 6.51 20 7 1000 5.0 4.0 MMSZ5235B E5 6.8 6.46 7.14 20 5 750 3.0 5.0 MMSZ5236B F1 7.5 7.13 7.88 20 6 500 3.0 6.0 MMSZ5237B F2 8.2 7.79 8.61 20 8 500 3.0 6.5 MMSZ5238B F3 8.7 8.27 9.14 20 8 600 3.0 6.5 MMSZ5239B F4 9.1 8.65 9.56 20 10 600 3.0 7.0 MMSZ5240B F5 10 9.50 10.50 20 17 600 3.0 8.0 MMSZ5241B H1 11 10.45 11.55 20 22 600 2.0 8.4 MMSZ5242B H2 12 11.40 12.60 20 30 600 1.0 9.1 MMSZ5243B H3 13 12.35 13.65 9.5 13 600 0.5 9.9 MMSZ5245B H5 15 14.25 15.75 8.5 16 600 0.1 11 MMSZ5246B J1 16 15.20 16.80 7.8 17 600 0.1 12 MMSZ5248B J3 18 17.10 18.90 7.0 21 600 0.1 14 MMSZ5250B J5 20 19.00 21.00 6.2 25 600 0.1 15 MMSZ5251B K1 22 20.90 23.10 5.6 29 600 0.1 17 MMSZ5252B K2 24 22.80 25.20 5.2 33 600 0.1 18 MMSZ5254B K4 27 25.65 28.35 5.0 41 600 0.1 21 MMSZ5255B K5 28 26.60 29.40 4.5 44 600 0.1 21 MMSZ5256B M1 30 28.50 31.5 4.2 49 600 0.1 23 MMSZ5257B M2 33 31.35 34.65 3.8 58 700 0.1 25 MMSZ5258B M3 36 34.20 37.80 3.4 70 700 0.1 27 MMSZ5259B M4 39 37.05 40.95 3.2 80 800 0.1 30 MMSZ5260B M5 43 40.85 45.15 3.0 93 900 0.1 33 www.shunyegroup.com.cn TYPICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified PACKAGE OUTLINE Plastic surface mounted package SOD-123 SOD-123 K B C A D H E Dim Min Max A 1.4 1.8 B 2.55 2.85 C 1.15 Typical D 0.5 0.6 E 0.3 0.4 H 0.02 0.10 J J K 0.1 Typical 3.55 3.85 All Dimensions in mm SOLDERING FOOTPRINT PACKAGE INFORMATION Device Package Shipping MMSZ5221B-MMSZ5260B SOD-123 3000/Tape&Reel www.shunyegroup.com.cn