AD ADSP-21262SKSTZ200 Embedded processor Datasheet

SHARC®
Embedded Processor
ADSP-21262
a
SUMMARY
KEY FEATURES
High performance 32-bit/40-bit floating-point processor
Code compatibility—at assembly level, uses the same
instruction set as other SHARC DSPs
Single-instruction multiple-data (SIMD) computational architecture—two 32-bit IEEE floating-point/32-bit fixed-point/
40-bit extended precision floating-point computational
units, each with a multiplier, ALU, shifter, and register file
High bandwidth I/O—a parallel port, an SPI® port, six serial
ports, a digital applications interface (DAI), and JTAG
DAI incorporates two precision clock generators (PCGs), an
input data port (IDP) that includes a parallel data acquisition port (PDAP), and three programmable timers, all
under software control by the signal routing unit (SRU)
On-chip memory—2M bit of on-chip SRAM and a dedicated
4M bit of on-chip mask-programmable ROM
The ADSP-21262 is available in commercial and industrial
temperature grades. For complete ordering information,
see Ordering Guide on Page 46.
Serial ports offer left-justified sample-pair and I2S support
via 12 programmable and simultaneous receive or transmit pins, which support up to 24 transmit or 24 receive I2S
channels of audio when all six serial ports (SPORTs) are
enabled or six full duplex TDM streams of up to 128
channels per frame
At 200 MHz (5 ns) core instruction rate, the ADSP-21262
operates at 1200 MFLOPS peak/800 MFLOPS sustained
performance whether operating on fixed- or floating-point
data
400 MMACS sustained performance at 200 MHz
Super Harvard Architecture—three independent buses for
dual data fetch, instruction fetch, and nonintrusive, zerooverhead I/O
Transfers between memory and core at up to four 32-bit
floating- or fixed-point words per cycle, sustained
2.4G byte/s bandwidth at 200 MHz core instruction rate
and 900M byte/sec is available via DMA
DUAL PORTED MEMORY
BLOCK 0
CORE PROCESSOR
INSTRUCTION
CACHE
32 ⴛ 48-BIT
TIMER
DAG1
8 ⴛ 4 ⴛ 32
DAG2
8 ⴛ 4 ⴛ 32
SRAM
1M BIT
PROG RAM
SEQ UENCER
ADDR
DUAL PORTED MEMORY
BLO CK 1
SRAM
1M BIT
ROM
2M BIT
ROM
2M BIT
ADDR
DATA
DATA
32
PM ADDRESS BUS
32
DM ADDRESS BUS
64
PM DATA BUS
64
DM DATA BUS
IOA
(18)
DMA CONTRO LLER
PX REGI STER
PROCESSING
ELEMENT
(PEX)
IOD
(32)
4
2 2 C HA N N ELS
PRO CESSING
ELEMENT
(PEY)
GPIO FLAGS/
IRQ /TIMEXP
4
SPI PORT (1)
AD D R ES S/
D A TA BU S / GPIO
6
CON TR OL/GPIO
SERIAL PORTS (6)
JTAG TEST & EMULATION
20
SIGNAL
RO UTI NG
UNIT
S
INPUT
DATA PORTS (8)
PARALLEL DATA
ACQUISITION PORT
IOP
REGISTERS
(MEMORY MAPPED)
16
3
PARALLEL
PORT
CO NTROL,
STATUS,
DATA BUFFERS
PRECISION CLOCK
GENERATORS (2)
3
TIMERS (3)
DIGITAL APPLICATIONS INTERFACE
I/O PROCESSOR
Figure 1. Functional Block Diagram
SHARC and the SHARC logo are registered trademarks of Analog Devices, Inc.
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
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Tel: 781.329.4700
www.analog.com
FAX: 781.461.3113
© 2005 Analog Devices, Inc. All rights reserved.
ADSP-21262
ADDITIONAL KEY FEATURES
2M bit on-chip dual-ported SRAM (1M bit block 0, 1M bit
block 1) for simultaneous access by core processor and
DMA
4M bit on-chip dual-ported mask-programmable ROM
(2M bit in block 0 and 2M bit in block 1)
Dual data address generators (DAGs) with modulo and bitreverse addressing
Zero-overhead looping with single-cycle loop setup,
providing efficient program sequencing
Single-instruction multiple-data (SIMD) architecture
provides:
Two computational processing elements
Concurrent execution—each processing element executes
the same instruction, but operates on different data
Parallelism in buses and computational units allows single
cycle executions (with or without SIMD) of a multiply
operation; an ALU operation; a dual memory read or
write; and an instruction fetch
Accelerated FFT butterfly computation through a multiply
with add and subtract instruction
DMA controller supports:
22 zero-overhead DMA channels for transfers between the
ADSP-21262 internal memory and serial ports (12), the
input data port (IDP) (eight), the SPI-compatible port
(one), and the parallel port (one)
32-bit background DMA transfers at core clock speed, in
parallel with full-speed processor execution
JTAG background telemetry for enhanced emulation
features
IEEE 1149.1 JTAG standard test access port and on-chip
emulation
Dual voltage: 3.3 V I/O, 1.2 V core
Available in 136-ball BGA and 144-lead LQFP packages
Also available in lead-free packages
Digital applications interface includes six serial ports, two
precision clock generators, an input data port, three programmable timers, and a signal routing unit
Asynchronous parallel/external port provides:
Access to asynchronous external memory
16 multiplexed address/data lines that can support 24-bit
address external address range with 8-bit data or 16-bit
address external address range with 16-bit data
66M byte/sec transfer rate for 200 MHz core rate
50M byte/sec transfer rate for 150 MHz core rate
256 word page boundaries
External memory access in a dedicated DMA channel
8-bit to 32-bit and 16-bit to 32-bit word packing options
Programmable wait state options: 2 to 31 CCLK
Rev. B
Serial ports provide:
Six dual data line serial ports that operate at up to
50M bit/sec for a 200 MHz core and up to 37.5M bit/sec
for a 150 MHz core on each data line—each has a clock,
frame sync, and two data lines that can be configured as
either a receiver or transmitter pair
Left-justified sample-pair and I2S support, programmable
direction for up to 24 simultaneous receive or transmit
channels using two I2S-compatible stereo devices per
serial port
TDM support for telecommunications interfaces including
128 TDM channel support for newer telephony interfaces such as H.100/H.110
Up to 12 TDM stream support, each with 128 channels
per frame
Companding selection on a per channel basis in TDM mode
Input data port provides an additional input path to the
SHARC core configurable as either eight channels of I2S or
serial data or as seven channels plus a single 20-bit wide
synchronous parallel data acquisition port
Supports receive audio channel data in I2S, left-justified
sample pair, or right-justified mode
Signal routing unit (SRU) provides configurable and flexible
connections between all DAI components, six serial ports,
two precision clock generators, three timers, an input data
port/parallel data acquisition port, 10 interrupts, six flag
inputs, six flag outputs, and 20 SRU I/O pins (DAI_Px)
Serial peripheral interface (SPI)
Master or slave serial boot through SPI
Full-duplex operation
Master-slave mode multimaster support
Open drain outputs
Programmable baud rates, clock polarities, and phases
3 Muxed Flag/IRQ lines
1 Muxed Flag/Timer expired line
ROM-based security features:
JTAG access to memory permitted with a 64-bit key
Protected memory regions that can be assigned to limit
access under program control to sensitive code
PLL has a wide variety of software and hardware multiplier/divider ratios
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ADSP-21262
TABLE OF CONTENTS
General Description ................................................. 4
REVISION HISTORY
ADSP-21262 Family Core Architecture ...................... 4
8/05—Rev. A to Rev. B
ADSP-21262 Memory and I/O Interface Features ......... 6
Miscellaneous Format Updates.......................... Universal
Target Board JTAG Emulator Connector .................... 8
Development Tools ............................................... 9
Changed “Digital Audio Interface” to “Digital
Applications Interface”........................................ Global
Evaluation Kit ..................................................... 10
Deleted ROM-Based Security from Page 8
Designing an Emulator-Compatible
DSP Board (Target) ........................................... 10
Applied Corrections and Additional Information to:
Summary ............................................................ 1
Additional Information ......................................... 10
Key Features ........................................................ 1
Pin Function Descriptions ........................................ 11
Additional Key Features .......................................... 2
Address Data Pins as Flags ..................................... 14
General Description ............................................... 4
Core Instruction Rate to CLKIN Ratio Modes ............. 14
ADSP-21262 Family Core Architecture ...................... 4
Address Data Modes ............................................. 14
Serial Ports .......................................................... 6
ADSP-21262 Specifications ....................................... 15
Parallel Port ......................................................... 8
Recommended Operating Conditions ....................... 15
Power Supplies ..................................................... 8
Electrical Characteristics ........................................ 15
Evaluation Kit .................................................... 10
Absolute Maximum Ratings ................................... 16
Pin Function Descriptions ..................................... 11
ESD Sensitivity .................................................... 16
Recommended Operating Conditions ...................... 15
Timing Specifications ........................................... 17
Clock Signals ...................................................... 19
Output Drive Currents .......................................... 38
Precision Clock Generator (Direct Pin Routing) ......... 23
Test Conditions ................................................... 38
Output Drive Currents ......................................... 38
Capacitive Loading ............................................... 38
Capacitive Loading .............................................. 38
Environmental Conditions ..................................... 39
Environmental Conditions .................................... 39
Thermal Characteristics ........................................ 39
Thermal Characteristics ........................................ 39
136-Ball BGA Pin Configurations ............................... 41
Package Dimensions ............................................ 45
144-Lead LQFP Pin Configurations ............................. 44
Ordering Guide .................................................. 46
Package Dimensions ................................................ 45
Ordering Guide ...................................................... 46
Rev. B
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August 2005
ADSP-21262
GENERAL DESCRIPTION
The ADSP-21262 SHARC DSP is a member of the SIMD
SHARC family of DSPs featuring Analog Devices Super Harvard Architecture. The ADSP-21262 is source code compatible
with the ADSP-2126x, ADSP-21160, and ADSP-21161 DSPs as
well as with first generation ADSP-2106x SHARC processors in
SISD (single-instruction, single-data) mode. Like other SHARC
DSPs, the ADSP-21262 is a 32-bit/40-bit floating-point processor optimized for high performance signal processing applications with its dual-ported on-chip SRAM, mask-programmable
ROM, multiple internal buses to eliminate I/O bottlenecks, and
an innovative digital applications interface.
• Three programmable interval timers with PWM generation, PWM capture/pulse width measurement, and
external event counter capabilities
• On-chip dual-ported SRAM (2M bit)
• On-chip dual-ported, mask-programmable ROM
(4M bit)
• JTAG test access port
• 8- or 16-bit parallel port that supports interfaces to off-chip
memory peripherals
• DMA controller
As shown in the Functional Block Diagram on Page 1, the
ADSP-21262 uses two computational units to deliver a five to
ten times performance increase over previous SHARC processors on a range of DSP algorithms. Fabricated in a state-of-theart, high speed, CMOS process, the ADSP-21262 DSP achieves
an instruction cycle time of 5 ns at 200 MHz or 6.6 ns at 150
MHz. With its SIMD computational hardware, the ADSP-21262
can perform 1200 MFLOPS running at 200 MHz or 900
MFLOPS running at 150 MHz.
Table 1 shows performance benchmarks for the ADSP-21262.
Table 1. ADSP-21262 Benchmarks (at 200 MHz)
Benchmark Algorithm
1024 Point Complex FFT (Radix 4, with reversal)
FIR Filter (per tap)1
IIR Filter (per biquad)1
Matrix Multiply (pipelined)
[3×3] × [3×1]
[4×4] × [4×1]
Divide (y/×)
Inverse Square Root
1
Speed
(at 200 MHz)
61.3 µs
3.3 ns
13.3 ns
30 ns
53.3 ns
20 ns
30 ns
• SPI-compatible interface
• Digital applications interface that includes two precision
clock generators (PCG), an input data port (IDP), six serial
ports, eight serial interfaces, a 20-bit synchronous parallel
input port, 10 interrupts, six flag outputs, six flag inputs,
three programmable timers, and a flexible signal routing
unit (SRU)
Figure 2 shows one sample configuration of a SPORT using the
precision clock generator to interface with an I2S ADC and an
I2S DAC with a much lower jitter clock than the serial port
would generate itself. Many other SRU configurations are
possible.
ADSP-21262 FAMILY CORE ARCHITECTURE
The ADSP-21262 is code compatible at the assembly level with
the ADSP-21266, ADSP-2136x, ADSP-2116x, and the first generation ADSP-2106x SHARC DSPs. The ADSP-21262 shares
architectural features with the ADSP-2126x, ADSP-2136x, and
ADSP-2116x SIMD SHARC family of DSPs, as detailed in the
following sections.
SIMD Computational Engine
Assumes two files in multichannel SIMD mode.
The ADSP-21262 continues SHARC’s industry-leading standards of integration for DSPs, combining a high performance
32-bit DSP core with integrated, on-chip system features. These
features include 2M bit dual-ported SRAM memory, 4M bit
dual-ported ROM, an I/O processor that supports 22 DMA
channels, six serial ports, an SPI, external parallel bus, and digital applications interface.
The block diagram of the ADSP-21262 on Page 1 illustrates the
following architectural features:
• Two processing elements, each containing an ALU, multiplier, shifter, and data register file
• Data address generators (DAG1, DAG2)
• Program sequencer with instruction cache
• PM and DM buses capable of supporting four 32-bit data
transfers between memory and the core at every core processor cycle
Rev. B
• Six full-duplex serial ports
The ADSP-21262 contains two computational processing elements that operate as a single-instruction multiple-data (SIMD)
engine. The processing elements are referred to as PEX and PEY
and each contains an ALU, multiplier, shifter, and register file.
PEX is always active, and PEY may be enabled by setting the
PEYEN mode bit in the MODE1 register. When this mode is
enabled, the same instruction is executed in both processing elements, but each processing element operates on different data.
This architecture is efficient at executing math intensive DSP
algorithms.
Entering SIMD mode also has an effect on the way data is transferred between memory and the processing elements. When in
SIMD mode, twice the data bandwidth is required to sustain
computational operation in the processing elements. Because of
this requirement, entering SIMD mode also doubles the bandwidth between memory and the processing elements. When
using the DAGs to transfer data in SIMD mode, two data values
are transferred with each access of memory or the register file.
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August 2005
ADSP-21262
ADS P-21262
CLKOUT
CLKI N
XTAL
CLOCK
2
2
3
LATCH
AD15 –0
DATA
FLAG 3– 1
RD
OE
WR
WE
FLAG0
CS
PARALLE L
PO RT
RAM, ROM
BOOT ROM
I/O DEVICE
DATA
SRU
ADDRESS
DAI_ P1
DAI_P 2
DAI_P 3
SCLK0
SFS0
DAC
(OP TIONAL)
CLK
FS
S DAT
ADDR
BOOTCFG1– 0
CONTROL
ADC
(OPTI ONAL)
CLK
FS
S DAT
ALE
CLK_ CFG 1– 0
SD0A
SD0B
DAI_ P1 8
DAI_ P19
DAI_P 20
S PORT0
SP ORT1
SPO RT2
S PORT3
SPO RT4
SPORT5
CLK
FS
DAI
PCG A
P CGB
RESE T
J TAG
6
Figure 2. ADSP-21262 System Sample Configuration
Independent, Parallel Computation Units
Single-Cycle Fetch of Instruction and Four Operands
Within each processing element is a set of computational units.
The computational units consist of an arithmetic/logic unit
(ALU), multiplier, and shifter. These units perform all operations in a single cycle. The three units within each processing
element are arranged in parallel, maximizing computational
throughput. Single multifunction instructions execute parallel
ALU and multiplier operations. In SIMD mode, the parallel
ALU and multiplier operations occur in both processing elements. These computation units support IEEE 32-bit single
precision floating-point, 40-bit extended precision floatingpoint, and 32-bit fixed-point data formats.
The ADSP-21262 features an enhanced Harvard architecture in
which the data memory (DM) bus transfers data and the program memory (PM) bus transfers both instructions and data
(see Figure 1 on Page 1). With the ADSP-21262’s separate program and data memory buses and on-chip instruction cache,
the processor can simultaneously fetch four operands (two over
each data bus) and one instruction (from the cache), all in a
single cycle.
Data Register File
A general-purpose data register file is contained in each
processing element. The register files transfer data between the
computation units and the data buses, and store intermediate
results. These 10-port, 32-register (16 primary, 16 secondary)
register files, combined with the ADSP-2126x enhanced Harvard architecture, allow unconstrained data flow between
computation units and internal memory. The registers in PEX
are referred to as R0–R15 and in PEY as S0–S15.
Rev. B
Instruction Cache
The ADSP-21262 includes an on-chip instruction cache that
enables three-bus operation for fetching an instruction and four
data values. The cache is selective—only the instructions whose
fetches conflict with PM bus data accesses are cached. This
cache allows full-speed execution of core, looped operations
such as digital filter multiply-accumulates, and FFT butterfly
processing.
Data Address Generators with Zero-Overhead Hardware
Circular Buffer Support
The ADSP-21262’s two data address generators (DAGs) are
used for indirect addressing and implementing circular data
buffers in hardware. Circular buffers allow efficient programming of delay lines and other data structures required in digital
signal processing, and are commonly used in digital filters and
| Page 5 of 48 |
August 2005
ADSP-21262
Fourier transforms. The two DAGs of the ADSP-21262 contain
sufficient registers to allow the creation of up to 32 circular buffers (16 primary register sets, 16 secondary). The DAGs
automatically handle address pointer wraparound, reduce overhead, increase performance, and simplify implementation.
Circular buffers can start and end at any memory location.
Flexible Instruction Set
The 48-bit instruction word accommodates a variety of parallel
operations for concise programming. For example, the
ADSP-21262 can conditionally execute a multiply, an add, and a
subtract in both processing elements while branching and fetching up to four 32-bit values from memory—all in a single
instruction.
ADSP-21262 MEMORY AND I/O INTERFACE
FEATURES
The ADSP-21262 adds the following architectural features to
the SIMD SHARC family core:
Dual-Ported On-Chip Memory
The ADSP-21262 contains two megabits of internal SRAM and
four megabits of internal mask-programmable ROM. Each
block can be configured for different combinations of code and
data storage (see memory map, Figure 3). Each memory block is
dual-ported for single-cycle, independent accesses by the core
processor and I/O processor. The dual-ported memory, in combination with three separate on-chip buses, allows two data
transfers from the core and one from the I/O processor, in a single cycle.
The ADSP-21262’s SRAM can be configured as a maximum of
64K words of 32-bit data, 128K words of 16-bit data, 42K words
of 48-bit instructions (or 40-bit data), or combinations of different word sizes up to two megabits. All of the memory can be
accessed as 16-bit, 32-bit, 48-bit, or 64-bit words. A 16-bit floating-point storage format is supported that effectively doubles
the amount of data that may be stored on-chip. Conversion
between the 32-bit floating-point and 16-bit floating-point formats is performed in a single instruction. While each memory
block can store combinations of code and data, accesses are
most efficient when one block stores data using the DM bus for
transfers, and the other block stores instructions and data using
the PM bus for transfers.
Using the DM bus and PM buses, with one dedicated to each
memory block, assures single-cycle execution with two data
transfers. In this case, the instruction must be available in
the cache.
DMA Controller
The ADSP-21262’s on-chip DMA controller allows zero-overhead data transfers without processor intervention. The DMA
controller operates independently and invisibly to the processor
core, allowing DMA operations to occur while the core is simultaneously executing its program instructions. DMA transfers
can occur between the ADSP-21262’s internal memory and its
serial ports, the SPI-compatible (serial peripheral interface)
port, the IDP (input data port), parallel data acquisition port
Rev. B
(PDAP), or the parallel port. Twenty-two channels of DMA are
available on the ADSP-21262—one for the SPI, 12 via the serial
ports, eight via the input data port, and one via the processor’s
parallel port. Programs can be downloaded to the ADSP-21262
using DMA transfers. Other DMA features include interrupt
generation upon completion of DMA transfers, and DMA
chaining for automatic linked DMA transfers.
Digital Applications Interface (DAI)
The digital applications interface provides the ability to connect
various peripherals to any of the SHARC’s DAI pins
(DAI_P20–1).
Connections are made using the signal routing unit (SRU,
shown in the block diagram on Page 1).
The SRU is a matrix routing unit (or group of multiplexers) that
enables the peripherals provided by the DAI to be interconnected under software control. This allows easy use of the DAI
associated peripherals for a much wider variety of applications
by using a larger set of algorithms than is possible with nonconfigurable signal paths.
The DAI also includes six serial ports, two precision clock generators (PCGs), an input data port (IDP), six flag outputs and
six flag inputs, and three timers. The IDP provides an additional
input path to the ADSP-21262 core, configurable as either eight
channels of I2S or serial data, or as seven channels plus a single
20-bit wide synchronous parallel data acquisition port. Each
data channel has its own DMA channel that is independent
from the ADSP-21262’s serial ports.
For complete information on using the DAI, see the
ADSP-2126x SHARC DSP Peripherals Manual.
Serial Ports
The ADSP-21262 features six full duplex synchronous serial
ports that provide an inexpensive interface to a wide variety of
digital and mixed-signal peripheral devices such as the Analog
Devices AD183x family of audio codecs, ADCs, and DACs. The
serial ports are made up of two data lines, a clock, and frame
sync. The data lines can be programmed to either transmit or
receive and each data line has its own dedicated DMA channel.
Serial ports are enabled via 12 programmable and simultaneous
receive or transmit pins that support up to 24 transmit or 24
receive channels of serial data when all six SPORTs are enabled,
or six full duplex TDM streams of 128 channels per frame.
The serial ports operate at up to one-quarter of the DSP core
clock rate, providing each with a maximum data rate of
50M bit/sec for a 200 MHz core and 37.5M bit/sec for a
150 MHz core. Serial port data can be automatically transferred
to and from on-chip memory via a dedicated DMA. Each of the
serial ports can work in conjunction with another serial port to
provide TDM support. One SPORT provides two transmit signals while the other SPORT provides the two receive signals.
The frame sync and clock are shared.
Serial ports operate in four modes:
| Page 6 of 48 |
• Standard DSP serial mode
• Multichannel (TDM) mode
August 2005
ADSP-21262
ADDRESS
IOP REGISTERS
0x0000 0000–0x0003 FFFF
0x0004 0000
BLOCK 0 SRAM (1M BIT)
0x0004 3FFF
RESERVED
0x0004 4000–0x0005 7FFF
0x0005 8000
LONG WORD
ADDRESS
SPACE
BLOCK 0 ROM (2M BIT)
0x0005 FFFF
0x0006 0000
ADDRESS
BLOCK 1 SRAM (1M BIT)
0x0006 3FFF
RESERVED
0x0020 0000
0x0006 4000–0x0007 7FFF
RESERVED
0x0007 8000
BLOCK 1 ROM (2M BIT)
0x00FF FFFF
0x0100 0000
0x0007 FFFF
0x0008 0000
BLOCK 0 SRAM (1M BIT)
EXTERNAL DMA
ADDRESS SPACE1, 4
0x0008 7FFF
RESERVED
NORMAL WORD
ADDRESS
SPACE
0x0008 8000–0x000A FFFF
0x000B 0000
BLOCK 0 ROM (2M BIT)2
0x02FF FFFF
0x0300 0000
0x000B FFFF
0x000C 0000
RESERVED
0x3FFF FFFF
BLOCK 1 SRAM (1M BIT)
0x000C 7FFF
RESERVED
BLOCK 1 ROM (2M BIT)3
EXTERNAL MEMORY
SPACE
0x000C 8000–0x000E FFFF
0x000F 0000
0x000F FFFF
0x0010 0000
BLOCK 0 SRAM (1M BIT)
0x0010 FFFF
RESERVED
SHORT WORD
ADDRESS
SPACE
0x0011 0000–0x0015 FFFF
0x0016 0000
BLOCK 0 ROM (2M BIT)
0x0017 FFFF
0x0018 0000
(0x000A 0000–0x000A AAAA).
3BLOCK 1 ROM HAS A 48-BIT ADDRESS RANGE
BLOCK 1 SRAM (1M BIT)
RESERVED
1EXTERNAL MEMORY IS NOT DIRECTLY ACCESSIBLE BY THE
CORE. DMA MUST BE USED TO READ OR WRITE TO THIS
MEMORY USING THE SPI OR PARALLEL PORT.
2BLOCK 0 ROM HAS A 48-BIT ADDRESS RANGE
0x0018 FFFF
0x0019 0000–0x001D FFFF
0x001E 0000
(0x000E 0000–0x000E AAAA).
4USE THE EXTERNAL ADDRESSES LISTED HERE WITH THE
PARALLEL PORT DMA REGISTERS. THE PARALLEL PORT
GENERATES ADDRESS WITHIN THE RANGE
0x0000 0000–0x00FF FFFF.
BLOCK 1 ROM (2M BIT)
0x001F FFFF
INTERNAL MEMORY
SPACE
Figure 3. ADSP-21262 Memory Map
• I2S mode
• Left-justified sample pair mode
Left-justified sample pair mode is a mode where in each frame
sync cycle two samples of data are transmitted/received—one
sample on the high segment of the frame sync, the other on the
low segment of the frame sync. Programs have control over various attributes of this mode.
Each of the serial ports supports the left-justified sample pair
and I2S protocols (I2S is an industry-standard interface commonly used by audio codecs, ADCs, and DACs), with two data
pins, allowing four left-justified sample pair or I2S channels
(using two stereo devices) per serial port, with a maximum of up
Rev. B
to 24 audio channels. The serial ports permit little-endian or
big-endian transmission formats and word lengths selectable
from 3 bits to 32 bits. For the left-justified sample pair and I2S
modes, data-word lengths are selectable between 8 bits and 32
bits. Serial ports offer selectable synchronization and transmit
modes as well as optional µ-law or A-law companding selection
on a per channel basis. Serial port clocks and frame syncs can be
internally or externally generated.
Serial Peripheral (Compatible) Interface
Serial peripheral interface is an industry-standard synchronous
serial link, enabling the ADSP-21262 SPI-compatible port to
communicate with other SPI-compatible devices. SPI is an
| Page 7 of 48 |
August 2005
ADSP-21262
interface consisting of two data pins, one device select pin, and
one clock pin. It is a full-duplex synchronous serial interface,
supporting both master and slave modes. The SPI port can
operate in a multimaster environment by interfacing with up to
four other SPI-compatible devices, either acting as a master or
slave device. The ADSP-21262 SPI-compatible peripheral
implementation also features programmable baud rates up to
37.5 MHz, clock phases, and polarities. The ADSP-21262 SPIcompatible port uses open drain drivers to support a multimaster configuration and to avoid data contention.
Parallel Port
The parallel port provides interfaces to SRAM and peripheral
devices. The multiplexed address and data pins (AD15–0) can
access 8-bit devices with up to 24 bits of address, or 16-bit
devices with up to 16 bits of address. In either mode, 8- or 16bit, the maximum data transfer rate is one-third the core clock
speed. As an example, a clock rate of 200 MHz is equivalent to
66M byte/sec, and a clock rate of 150 MHz is equivalent to
50M byte/sec.
DMA transfers are used to move data to and from internal
memory. Access to the core is also facilitated through the parallel port register read/write functions. The RD, WR, and ALE
(address latch enable) pins are the control pins for the
parallel port.
ware control. The ratios are made up of software configurable
numerator values from 1 to 32 and software configurable divisor values of 1, 2, 4, 8, and 16.
Power Supplies
The ADSP-21262 has separate power supply connections for the
internal (VDDINT), external (VDDEXT), and analog (AVDD/AVSS)
power supplies. The internal and analog supplies must meet the
1.2 V requirement. The external supply must meet the 3.3 V
requirement. All external supply pins must be connected to the
same power supply.
Note that the analog supply pin (AVDD) powers the processor’s
internal clock generator PLL. To produce a stable clock, it is recommended that PCB designs use an external filter circuit for the
AVDD pin. Place the filter components as close as possible to the
AVDD/AVSS pins. For an example circuit, see Figure 4. (A recommended ferrite chip is the muRata BLM18AG102SN1D). To
reduce noise coupling, the PCB should use a parallel pair of
power and ground planes for VDDINT and GND. Use wide traces
to connect the bypass capacitors to the analog power (AVDD) and
ground (AVSS) pins. Note that the AVDD and AVSS pins specified
in Figure 4 are inputs to the processor and not the analog
ground plane on the board—the AVSS pin should connect
directly to digital ground (GND) at the chip.
Timers
100nF
The ADSP-21262 has a total of four timers: a core timer able to
generate periodic software interrupts, and three general-purpose timers that can generate periodic interrupts and be
independently set to operate in one of three modes:
10nF
1nF
ADSP-21262
AVDD
VDDINT
HI Z FERRITE
BEAD CHIP
AVSS
• Pulse waveform generation mode
LOCATE ALL COMPONENTS
CLOSE TO AVDD AND AVSS PINS
• Pulse width count/capture mode
• External event watchdog mode
The core timer can be configured to use FLAG3 as a timer
expired output signal, and each general-purpose timer has one
bidirectional pin and four registers that implement its mode of
operation: a 6-bit configuration register, a 32-bit count register,
a 32-bit period register, and a 32-bit pulse width register. A single control and status register enables or disables all three
general-purpose timers independently.
Program Booting
The internal memory of the ADSP-21262 boots at system
power-up from an 8-bit EPROM via the parallel port, an SPI
master, an SPI slave, or an internal boot. Booting is determined
by the boot configuration (BOOTCFG1–0) pins. Selection of the
boot source is controlled via the SPI as either a master or slave
device, or it can immediately begin executing from ROM.
Figure 4. Analog Power Filter Circuit
TARGET BOARD JTAG EMULATOR CONNECTOR
Analog Devices DSP Tools product line of JTAG emulators uses
the IEEE 1149.1 JTAG test access port of the ADSP-21262 processor to monitor and control the target board processor during
emulation. Analog Devices DSP Tools product line of JTAG
emulators provides emulation at full processor speed, allowing
inspection and modification of memory, registers, and processor stacks. The processor’s JTAG interface ensures that the
emulator will not affect target system loading or timing.
For complete information on Analog Devices’ SHARC DSP
Tools product line of JTAG emulator operation, see the appropriate emulator hardware user’s guide.
Phase-Locked Loop
The ADSP-21262 uses an on-chip phase-locked loop (PLL) to
generate the internal clock for the core. On power-up, the
CLKCFG1-0 pins are used to select ratios of 16:1, 8:1, and 3:1.
After booting, numerous other ratios can be selected via soft-
Rev. B
| Page 8 of 48 |
August 2005
ADSP-21262
DEVELOPMENT TOOLS
The ADSP-21262 is supported by a complete set of
CROSSCORE®† software and hardware development tools,
including Analog Devices emulators and VisualDSP++®‡
development environment. The same emulator hardware that
supports other SHARC processors also fully emulates the
ADSP-21262.
The VisualDSP++ project management environment lets programmers develop and debug an application. This environment
includes an easy to use assembler (which is based on an algebraic syntax), an archiver (librarian/library builder), a linker, a
loader, a cycle-accurate instruction-level simulator, a C/C++
compiler, and a C/C++ runtime library that includes DSP and
mathematical functions. A key point for these tools is C/C++
code efficiency. The compiler has been developed for efficient
translation of C/C++ code to DSP assembly. The ADSP-21262
SHARC DSP has architectural features that improve the
efficiency of compiled C/C++ code.
The VisualDSP++ debugger has a number of important features. Data visualization is enhanced by a plotting package that
offers a significant level of flexibility. This graphical representation of user data enables the programmer to quickly determine
the performance of an algorithm. As algorithms grow in complexity, this capability can have increasing significance on the
designer’s development schedule, increasing productivity. Statistical profiling enables the programmer to nonintrusively poll
the processor as it is running the program. This feature, unique
to VisualDSP++, enables the software developer to passively
gather important code execution metrics without interrupting
the real-time characteristics of the program. Essentially, the
developer can identify bottlenecks in software quickly and efficiently. By using the profiler, the programmer can focus on
those areas in the program that impact performance and take
corrective action.
Debugging both C/C++ and assembly programs with the
VisualDSP++ debugger, programmers can:
• View mixed C/C++ and assembly code (interleaved source
and object information)
• Insert breakpoints
• Set conditional breakpoints on registers, memory,
and stacks
• Trace instruction execution
• Perform linear or statistical profiling of program execution
• Fill, dump, and graphically plot the contents of memory
• Perform source level debugging
• Create custom debugger windows
†
‡
The VisualDSP++ IDDE lets programmers define and manage
DSP software development. Its dialog boxes and property pages
let programmers configure and manage all of the SHARC development tools, including the color syntax highlighting in the
VisualDSP++ editor. This capability permits programmers to:
• Control how the development tools process inputs and
generate outputs
• Maintain a one-to-one correspondence with the tools’
command line switches
The VisualDSP++ Kernel (VDK) incorporates scheduling and
resource management tailored specifically to address the memory and timing constraints of DSP programming. These
capabilities enable engineers to develop code more effectively,
eliminating the need to start from the very beginning when
developing new application code. The VDK features include
threads, critical and unscheduled regions, semaphores, events,
and device flags. The VDK also supports priority-based, preemptive, cooperative, and time-sliced scheduling approaches. In
addition, the VDK was designed to be scalable. If the application
does not use a specific feature, the support code for that feature
is excluded from the target system.
Because the VDK is a library, a developer can decide whether to
use it or not. The VDK is integrated into the VisualDSP++
development environment, but can also be used via standard
command line tools. When the VDK is used, the development
environment assists the developer with many error-prone tasks
and assists in managing system resources, automating the generation of various VDK-based objects, and visualizing the
system state, when debugging an application that uses the VDK.
VisualDSP++ Component Software Engineering (VCSE) is
Analog Devices’ technology for creating, using, and reusing
software components (independent modules of substantial
functionality) to quickly and reliably assemble software applications. It also is used for downloading components from the
Web, dropping them into the application, and publishing component archives from within VisualDSP++. VCSE supports
component implementation in C/C++ or assembly language.
Use the expert linker to visually manipulate the placement of
code and data on the embedded system. View memory utilization in a color-coded graphical form, easily move code and data
to different areas of the DSP or external memory with a drag of
the mouse, and examine run-time stack and heap usage. The
expert linker is fully compatible with existing linker definition
file (LDF), allowing the developer to move between the graphical and textual environments.
In addition to the software and hardware development tools
available from Analog Devices, third parties provide a wide
range of tools supporting the SHARC processor family. Hardware tools include SHARC processor PC plug-in cards. Third
party software tools include DSP libraries, real-time operating
systems, and block diagram design tools.
CROSSCORE is a registered trademark of Analog Devices, Inc.
VisualDSP++ is a registered trademark of Analog Devices, Inc.
Rev. B
| Page 9 of 48 |
August 2005
ADSP-21262
EVALUATION KIT
ADDITIONAL INFORMATION
®†
Analog Devices offers a range of EZ-KIT Lite evaluation platforms to use as a cost-effective method to learn more about
developing or prototyping applications with Analog Devices
processors, platforms, and software tools. Each EZ-KIT Lite
includes an evaluation board along with an evaluation suite of
the VisualDSP++ development and debugging environment
with the C/C++ compiler, assembler, and linker. Also included
are sample application programs, power supply, and a USB
cable. All evaluation versions of the software tools are limited
for use only with the EZ-KIT Lite product.
This data sheet provides a general overview of the ADSP-21262
architecture and functionality. For detailed information on the
ADSP-2126x family core architecture and instruction set, refer
to the ADSP-2126x DSP Core Manual and the ADSP-21160
SHARC DSP Instruction Set Reference.
The USB controller on the EZ-KIT Lite board connects the
board to the USB port of the user’s PC, enabling the VisualDSP++ evaluation suite to emulate the on-board processor incircuit. This permits the customer to download, execute, and
debug programs for the EZ-KIT Lite system. It also allows incircuit programming of the on-board flash device to store userspecific boot code, enabling the board to run as a standalone
unit, without being connected to the PC.
With a full version of VisualDSP++ installed (sold separately),
engineers can develop software for the EZ-KIT Lite or any custom-defined system. Connecting an Analog Devices JTAG
emulator to the EZ-KIT Lite board enables high speed, nonintrusive emulation.
DESIGNING AN EMULATOR-COMPATIBLE DSP
BOARD (TARGET)
The Analog Devices family of emulators are tools that every
DSP developer needs to test and debug hardware and software
systems. Analog Devices has supplied an IEEE 1149.1 JTAG test
access port (TAP) on each JTAG DSP. Nonintrusive in-circuit
emulation is assured by the use of the processor’s JTAG interface—the emulator does not affect target system loading or
timing. The emulator uses the TAP to access the internal features of the DSP, allowing the developer to load code, set
breakpoints, observe variables, observe memory, and examine
registers. The DSP must be halted to send data and commands,
but once an operation has been completed by the emulator, the
DSP system is set running at full speed with no impact on system timing.
To use these emulators, the target board must include a header
that connects the DSP’s JTAG port to the emulator.
For details on target board design issues including mechanical
layout, single processor connections, multiprocessor scan
chains, signal buffering, signal termination, and emulator pod
logic, see the EE-68: Analog Devices JTAG Emulation Technical
Reference on the Analog Devices website (www.analog.com)—
use site search on “EE-68.” This document is updated regularly
to keep pace with improvements to emulator support.
†
EZ-KIT Lite is a registered trademark of Analog Devices, Inc.
Rev. B
| Page 10 of 48 |
August 2005
ADSP-21262
PIN FUNCTION DESCRIPTIONS
ADSP-21262 pin definitions are listed below. Inputs identified
as synchronous (S) must meet timing requirements with respect
to CLKIN (or with respect to TCK for TMS, TDI). Inputs identified as asynchronous (A) can be asserted asynchronously to
CLKIN (or to TCK for TRST). Tie or pull unused inputs to
VDDEXT or GND, except for the following:
• DAI_Px, SPICLK, MISO, MOSI, EMU, TMS,TRST, TDI
and AD15–0 (NOTE: These pins have internal pull-up
resistors.)
The following symbols appear in the Type column of Table 2:
A = asynchronous, G = ground, I = input, O = output,
P = power supply, S = synchronous, (A/D) = active drive,
(O/D) = open drain, and T = three-state.
Table 2. Pin Descriptions
Pin
AD15–0
Type
I/O/T
RD
O
WR
O
ALE
O
FLAG3–0
I/O/A
State During and
After Reset
AD15–0 pins are
driven low both
during and after
reset
Function
Parallel Port Address/Data. The ADSP-21262 parallel port and its corresponding
DMA unit output addresses and data for peripherals on these multiplexed pins. The
multiplex state is determined by the ALE pin. The parallel port can operate in either
8-bit or 16-bit mode. Each AD pin has a 22.5 kΩ internal pull-up resistor. See Address
Data Modes on Page 14 for details of the AD pin operation.
For 8-bit mode: ALE is automatically asserted whenever a change occurs in the
upper 16 external address bits, A23–8; ALE is used in conjunction with an external
latch to retain the values of the A23–8.
For 16-bit mode: ALE is automatically asserted whenever a change occurs in the
address bits, A15–0; ALE is used in conjunction with an external latch to retain the
values of the A15–0. To use these pins as flags (FLAG15–0) set (=1) Bit 20 of the
SYSCTL register and disable the parallel port. See Table 3 on Page 14 for a list of how
the AD15–0 pins map to the flag pins. When configured in the IDP_PDAP_CTL
register, the IDP Channel 0 can use these pins for parallel input data.
Output only, driven Parallel Port Read Enable. RD is asserted low whenever the DSP reads 8-bit or
high1
16-bit data from an external memory device. When AD15–0 are flags, this pin
remains deasserted.
Output only, driven Parallel Port Write Enable. WR is asserted low whenever the DSP writes 8-bit or
high1
16-bit data to an external memory device. When AD15–0 are flags, this pin remains
deasserted.
Output only, driven Parallel Port Address Latch Enable. ALE is asserted whenever the DSP drives a
low1
new address on the parallel port address pin. On reset, ALE is active high. However,
it can be reconfigured using software to be active low. When AD15–0 are flags, this
pin remains deasserted.
Three-state
Flag Pins. Each FLAG pin is configured via control bits as either an input or output.
As an input, it can be tested as a condition. As an output, it can be used to signal
external peripherals. These pins can be used as an SPI slave select output during SPI
mastering. These pins are also multiplexed with the IRQx and the TIMEXP signals.
In SPI master boot mode, FLAG0 is the slave select pin that must be connected to
an SPI EPROM. FLAG0 is configured as a slave select during SPI master boot. When
Bit 16 is set (=1) in the SYSCTL register, FLAG0 is configured as IRQ0.
When Bit 17 is set (=1) in the SYSCTL register, FLAG1 is configured as IRQ1.
When Bit 18 is set (=1) in the SYSCTL register, FLAG2 is configured as IRQ2.
When Bit 19 is set (=1) in the SYSCTL register, FLAG3 is configured as TIMEXP, which
indicates that the system timer has expired.
Rev. B
| Page 11 of 48 |
August 2005
ADSP-21262
Table 2. Pin Descriptions (Continued)
State During and
After Reset
Three-state with
programmable
pull-up
Pin
DAI_P20–1
Type
I/O/T
SPICLK
I/O
Three-state with
pull-up enabled
SPIDS
I
Input only
MOSI
I/O (O/D)
Three-state with
pull-up enabled
MISO
I/O (O/D)
Three-state with
pull-up enabled
BOOTCFG1–0
I
Input only
Rev. B
Function
Digital Applications Interface Pins. These pins provide the physical interface to
the SRU. The SRU configuration registers define the combination of on-chip
peripheral inputs or outputs connected to the pin and to the pin’s output enable.
The configuration registers of these peripherals then determine the exact behavior
of the pin. Any input or output signal present in the SRU may be routed to any of
these pins. The SRU provides the connection from the serial ports, input data port,
precision clock generators, and timers to the DAI_P20–1 pins. These pins have
internal 22.5 kΩ pull-up resistors which are enabled on reset. These pull-ups can be
disabled in the DAI_PIN_PULLUP register.
Serial Peripheral Interface Clock Signal. Driven by the master, this signal controls
the rate at which data is transferred. The master can transmit data at a variety of
baud rates. SPICLK cycles once for each bit transmitted. SPICLK is a gated clock that
is active during data transfers, only for the length of the transferred word. Slave
devices ignore the serial clock if the slave select input is driven inactive (HIGH).
SPICLK is used to shift out and shift in the data driven on the MISO and MOSI lines.
The data is always shifted out on one clock edge and sampled on the opposite edge
of the clock. Clock polarity and clock phase relative to data are programmable into
the SPICTL control register and define the transfer format. SPICLK has a 22.5 kΩ
internal pull-up resistor. If SPI master boot mode is selected, MOSI and SPICLK pins
are driven during reset. These pins are not three-stated during reset in SPI master
boot mode.
Serial Peripheral Interface Slave Device Select. An active low signal used to select
the DSP as an SPI slave device. This input signal behaves like a chip select, and is
provided by the master device for the slave devices. In multimaster mode the DSP’s
SPIDS signal can be driven by a slave device to signal to the DSP (as SPI master) that
an error has occurred, as some other device is also trying to be the master device.
If asserted low when the device is in master mode, it is considered a multimaster
error. For a single master, multiple-slave configuration where flag pins are used, this
pin must be tied or pulled high to VDDEXT on the master device. For ADSP-21262 to
ADSP-21262 SPI interaction, any of the master ADSP-21262’s flag pins can be used
to drive the SPIDS signal on the ADSP-21262 SPI slave device.
SPI Master Out Slave In. If the ADSP-21262 is configured as a master, the MOSI pin
becomes a data transmit (output) pin, transmitting output data. If the ADSP-21262
is configured as a slave, the MOSI pin becomes a data receive (input) pin, receiving
input data. In an ADSP-21262 SPI interconnection, the data is shifted out from the
MOSI output pin of the master and shifted into the MOSI input(s) of the slave(s).
MOSI has a 22.5 kΩ internal pull-up resistor. If SPI master boot mode is selected,
MOSI and SPICLK pins are driven during reset. These pins are not three-stated during
reset in SPI master boot mode.
SPI Master In Slave Out. If the ADSP-21262 is configured as a master, the MISO pin
becomes a data receive (input) pin, receiving input data. If the ADSP-21262 is
configured as a slave, the MISO pin becomes a data transmit (output) pin, transmitting output data. In an ADSP-21262 SPI interconnection, the data is shifted out
from the MISO output pin of the slave and shifted into the MISO input pin of the
master. MISO has a 22.5 kΩ internal pull-up resistor. MISO can be configured as O/D
by setting the OPD bit in the SPICTL register.
Note: Only one slave is allowed to transmit data at any given time. To enable broadcast
transmission to multiple SPI slaves, the DSP’s MISO pin may be disabled by setting
(=1) Bit 5 (DMISO) of the SPICTL register.
Boot Configuration Select. Selects the boot mode for the DSP. The BOOTCFG pins
must be valid before reset is asserted. See Table 4 on Page 14 for a description of
the boot modes.
| Page 12 of 48 |
August 2005
ADSP-21262
Table 2. Pin Descriptions (Continued)
Pin
CLKIN
Type
I
State During and
After Reset
Input only
XTAL
O
Output only2
CLKCFG1–0
I
Input only
RSTOUT/CLKOUT
O
Output only
RESET
I/A
Input only
TCK
I
Input only3
TMS
I/S
TDI
I/S
TDO
TRST
O
I/A
Three-state with
pull-up enabled
Three-state with
pull-up enabled
Three-state4
Three-state with
pull-up enabled
EMU
O (O/D)
VDDINT
P
VDDEXT
P
AVDD
P
AVSS
GND
G
G
Three-state with
pull-up enabled
Function
Local Clock In. Used in conjunction with XTAL. CLKIN is the ADSP-21262 clock input.
It configures the ADSP-21262 to use either its internal clock generator or an external
clock source. Connecting the necessary components to CLKIN and XTAL enables the
internal clock generator. Connecting the external clock to CLKIN while leaving XTAL
unconnected configures the ADSP-21262 to use the external clock source such as
an external clock oscillator. The core is clocked either by the PLL output or this clock
input depending on the CLKCFG1–0 pin settings. CLKIN may not be halted,
changed, or operated below the specified frequency.
Crystal Oscillator Terminal. Used in conjunction with CLKIN to drive an external
crystal.
Core/CLKIN Ratio Control. These pins set the start up clock frequency. See Table 5
for a description of the clock configuration modes.
Note that the operating frequency can be changed by programming the PLL multiplier and divider in the PMCTL register at any time after the core comes out of reset.
Reset Out/Local Clock Out. Drives out the core reset signal to an external device.
CLKOUT can also be configured as a reset out pin (RSTOUT). The functionality can
be switched between the PLL output clock and reset out by setting Bit 12 of the
PMCTL register. The default is reset out.
Processor Reset. Resets the ADSP-21262 to a known state. Upon deassertion, there
is a 4096 CLKIN cycle latency for the PLL to lock. After this time, the core begins
program execution from the hardware reset vector address. The RESET input must
be asserted (low) at power-up.
Test Clock (JTAG). Provides a clock for JTAG boundary scan. TCK must be asserted
(pulsed low) after power-up or held low for proper operation of the ADSP-21262.
Test Mode Select (JTAG). Used to control the test state machine. TMS has a
22.5 kΩ internal pull-up resistor.
Test Data Input (JTAG). Provides serial data for the boundary scan logic. TDI has a
22.5 kΩ internal pull-up resistor.
Test Data Output (JTAG). Serial scan output of the boundary scan path.
Test Reset (JTAG). Resets the test state machine. TRST must be asserted (pulsed
low) after power-up or held low for proper operation of the ADSP-21262. TRST has
a 22.5 kΩ internal pull-up resistor.
Emulation Status. Must be connected to the ADSP-21262 Analog Devices DSP
Tools product line of JTAG emulators target board connector only. EMU has a
22.5 kΩ internal pull-up resistor.
Core Power Supply. Nominally +1.2 V dc and supplies the DSP’s core processor
(13 pins on the BGA package, 32 pins on the LQFP package).
I/O Power Supply. Nominally +3.3 V dc (6 pins on the BGA package, 10 pins on the
LQFP package).
Analog Power Supply. Nominally +1.2 V dc and supplies the DSP’s internal PLL
(clock generator). This pin has the same specifications as VDDINT, except that added
filtering circuitry is required. For more information, see Power Supplies on Page 8.
Analog Power Supply Return.
Power Supply Return. (54 pins on the BGA package, 39 pins on the LQFP package).
1
RD, WR, and ALE are continuously driven by the DSP and will not be three-stated.
Output only is a three-state driver with its output path always enabled.
3
Input only is a three-state driver, with both output path and pull-up disabled.
4
Three-state is a three-state driver, with pull-up disabled.
2
Rev. B
| Page 13 of 48 |
August 2005
ADSP-21262
ADDRESS DATA PINS AS FLAGS
ADDRESS DATA MODES
To use these pins as flags (FLAG15–0) set (=1) Bit 20 of the
SYSCTL register and disable the parallel port.
Table 6 shows the functionality of the AD pins for 8-bit and
16-bit transfers to the parallel port. For 8-bit data transfers, ALE
latches address bits A23–A8 when asserted, followed by address
bits A7–A0 and data bits D7–D0 when deasserted. For 16-bit
data transfers, ALE latches address bits A15–A0 when asserted,
followed by data bits D15–D0 when deasserted.
Table 3. AD15–0 to FLAG Pin Mapping
AD Pin
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
AD8
AD9
AD10
AD11
AD12
AD13
AD14
AD15
Flag Pin
FLAG8
FLAG9
FLAG10
FLAG11
FLAG12
FLAG13
FLAG14
FLAG15
FLAG0
FLAG1
FLAG2
FLAG3
FLAG4
FLAG5
FLAG6
FLAG7
Table 6. Address/Data Mode Selection
EP Data
Mode
8-bit
8-bit
16-bit
16-bit
Boot Modes
Table 4. Boot Mode Selection
BOOTCFG1–0
00
01
10
11
Booting Mode
SPI Slave Boot
SPI Master Boot
Parallel Port Boot via EPROM
Internal Boot Mode (ROM code only)
CORE INSTRUCTION RATE TO CLKIN RATIO MODES
Table 5. Core Instruction Rate/CLKIN Ratio Selection
CLKCFG1–0
00
01
10
11
Core to CLKIN Ratio
3:1
16:1
8:1
Reserved
Rev. B
| Page 14 of 48 |
August 2005
ALE
Asserted
Deasserted
Asserted
Deasserted
AD7–0
Function
A15–8
D7–0
A7–0
D7–0
AD15–8
Function
A23–16
A7–0
A15–8
D15–8
ADSP-21262
ADSP-21262 SPECIFICATIONS
RECOMMENDED OPERATING CONDITIONS
Parameter1
Min
Max
Unit
VDDINT
Internal (Core) Supply Voltage
1.14
1.26
V
AVDD
Analog (PLL) Supply Voltage
1.14
1.26
V
VDDEXT
External (I/O) Supply Voltage
3.13
3.47
V
2.0
VDDEXT + 0.5 V
–0.5
+0.8
2
High Level Input Voltage @ VDDEXT = max
VIH
2
Low Level Input Voltage @ VDDEXT = min
VIL
3
V
VIH_CLKIN
High Level Input Voltage @ VDDEXT = max
1.74
VDDEXT + 0.5 V
VIL_CLKIN
Low Level Input Voltage @ VDDEXT = min
–0.5
+1.19
V
Ambient Operating Temperature
4, 5
–40
+85
°C
Ambient Operating Temperature
4, 6
0
+70
°C
TAMB B Grade (Industrial)
TAMB K Grade (Commercial)
1
Specifications subject to change without notice.
Applies to input and bidirectional pins: AD15–0, FLAG3–0, DAI_Px, SPICLK, MOSI, MISO, SPIDS, BOOTCFGx, CLKCFGx, RESET, TCK, TMS, TDI, TRST.
3
Applies to input pin CLKIN.
4
See Thermal Characteristics on Page 39 for information on thermal specifications.
5
See Engineer-to-Engineer Note (No. 250) for further information.
6
See Engineer-to-Engineer Note (No. 216) for further information.
2
ELECTRICAL CHARACTERISTICS
Parameter1
Test Conditions
2
VOH
High Level Output Voltage
VOL
2
Low Level Output Voltage
High Level Input Current
IIL
4
IILPU
Low Level Input Current
@ VDDEXT = min, IOH = –1.0 mA
@ VDDEXT = min, IOL = 1.0 mA
4, 5
IIH
Low Level Input Current Pull-Up
Three-State Leakage Current
IOZL
Three-State Leakage Current6
IDD-INTYP
AIDD
CIN
5
6, 7, 8
IOZH
IOZLPU
Three-State Leakage Current Pull-Up
Supply Current (Internal)
Supply Current (Analog)
Input Capacitance
Min
9, 10, 11
12
13, 14
7
3
2.4
3
Unit
V
0.4
V
@ VDDEXT = max, VIN = VDDEXT max
10
µA
@ VDDEXT = max, VIN = 0 V
10
µA
@ VDDEXT = max, VIN = 0 V
200
µA
@ VDDEXT = max, VIN = VDDEXT max
10
µA
@ VDDEXT = max, VIN = 0 V
10
µA
@ VDDEXT = max, VIN = 0 V
200
µA
tCCLK = 5.0 ns, VDDINT = 1.2 V, TAMB = +25°C
500
mA
AVDD = max
10
mA
fIN = 1 MHz, TCASE = 25°C, VIN = 1.2 V
4.7
pF
1
Specifications subject to change without notice.
Applies to output and bidirectional pins: AD15–0, RD, WR, ALE, FLAG3–0, DAI_Px, SPICLK, MOSI, MISO, EMU, TDO, CLKOUT, XTAL.
3
See Output Drive Currents on Page 38 for typical drive current capabilities.
4
Applies to input pins: SPIDS, BOOTCFGx, CLKCFGx, TCK, RESET, CLKIN.
5
Applies to input pins with 22.5 kΩ internal pull-ups: TRST, TMS, TDI.
6
Applies to three-statable pins: FLAG3–0.
7
Applies to three-statable pins with 22.5 kΩ pull-ups: AD15–0, DAI_Px, SPICLK, MISO, MOSI.
8
Applies to open-drain output pins: EMU, MISO, MOSI.
9
Typical internal current data reflects nominal operating conditions.
10
See Engineer-to-Engineer Note (No. 216) for further information.
11
Characterized, but not tested.
12
Characterized, but not tested.
13
Applies to all signal pins.
14
Guaranteed, but not tested.
2
Rev. B
Max
| Page 15 of 48 |
August 2005
ADSP-21262
ABSOLUTE MAXIMUM RATINGS
Parameter
Internal (Core) Supply Voltage (VDDINT)1
Analog (PLL) Supply Voltage (AVDD)1
External (I/O) Supply Voltage (VDDEXT)1
Input Voltage –0.5 V to VDDEXT1
Output Voltage Swing –0.5 V to VDDEXT1
Load Capacitance1
Storage Temperature Range1
Junction Temperature Under Bias
1
Rating
–0.3 V to +1.4 V
–0.3 V to +1.4 V
–0.3 V to +3.8 V
+0.5 V
+0.5 V
200 pF
–65°C to +150°C
125°C
Stresses greater than those listed above may cause permanent damage to the
device. These are stress ratings only; functional operation of the device at these
or any other conditions greater than those indicated in the operational sections
of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ESD SENSITIVITY
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADSP-21262 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
Rev. B
| Page 16 of 48 |
August 2005
ADSP-21262
TIMING SPECIFICATIONS
CLKOUT
The ADSP-21262’s internal clock (a multiple of CLKIN) provides the clock signal for timing internal memory, processor
core, serial ports, and parallel port (as required for read/write
strobes in asynchronous access mode). During reset, program
the ratio between the DSP’s internal clock frequency and external (CLKIN) clock frequency with the CLKCFG1–0 pins. To
determine switching frequencies for the serial ports, divide
down the internal clock, using the programmable divider control of each port (DIVx for the serial ports).
The ADSP-21262’s internal clock switches at higher frequencies
than the system input clock (CLKIN). To generate the internal
clock, the DSP uses an internal phase-locked loop (PLL). This
PLL-based clocking minimizes the skew between the system
clock (CLKIN) signal and the DSP’s internal clock (the clock
source for the parallel port logic and I/O pads).
Note the definitions of various clock periods that are a function
of CLKIN and the appropriate ratio control (Table 7 and
Table 8).
Table 7. ADSP-21262 CLKOUT and CCLK Clock
Generation Operation
Timing Requirements
CLKIN
CCLK
Description
Input Clock
Core Clock
CLKIN
XTAL
1
PLL
3:1, 8:1,
16:1
CCLK
(CORE CLOCK)
Figure 5. Core Clock and System Clock Relationship to CLKIN
Switching characteristics specify how the processor changes its
signals. Circuitry external to the processor must be designed for
compatibility with these signal characteristics. Switching characteristics describe what the processor will do in a given
circumstance. Use switching characteristics to ensure that any
timing requirement of a device connected to the processor (such
as memory) is satisfied.
Timing requirements apply to signals that are controlled by circuitry external to the processor, such as the data input for a read
operation. Timing requirements guarantee that the processor
operates correctly with other devices.
Calculation
1/tCK
1/tCCLK
Description1
CLKIN Clock Period
(Processor) Core Clock Period
Serial Port Clock Period = (tCCLK) × SR
SPI Clock Period = (tCCLK) × SPIR
where:
SR = serial port-to-core clock ratio (wide range, determined by SPORT
CLKDIV)
SPIR = SPI-to-core clock ratio (wide range, determined by SPIBAUD
register)
DAI_Px = serial port clock
SPICLK = SPI clock
Figure 5 shows core to CLKIN ratios of 3:1, 8:1, and 16:1 with
external oscillator or crystal. Note that more ratios are possible
and can be set through software using the power management
control register (PMCTL). For more information, see the
ADSP-2126x SHARC DSP Core Manual.
Use the exact timing information given. Do not attempt to
derive parameters from the addition or subtraction of others.
While addition or subtraction would yield meaningful results
for an individual device, the values given in this data sheet
reflect statistical variations and worst cases. Consequently, it is
not meaningful to add parameters to derive longer times.
See Figure 30 on Page 38 under Test Conditions for voltage
reference levels.
Rev. B
PLLICLK
CLKCFG1–0
Table 8. Clock Periods
Timing
Requirements
tCK
tCCLK
tSCLK
tSPICLK
XTAL
OSC
| Page 17 of 48 |
August 2005
ADSP-21262
Power-Up Sequencing
The timing requirements for DSP startup are given in Table 9
and Figure 6.
Table 9. Power-Up Sequencing (DSP Startup)
Parameter
Min
Max
Unit
Timing Requirements
tRSTVDD
RESET Low Before VDDINT/VDDEXT On
tIVDDEVDD
VDDINT On Before VDDEXT
0
1
ns
–50
200
0
200
ms
tCLKVDD
CLKIN Valid After VDDINT/VDDEXT Valid
tCLKRST
CLKIN Valid Before RESET Deasserted
102
µs
tPLLRST
PLL Control Setup Before RESET Deasserted
203
µs
ms
Switching Characteristic
tCORERST
4096tCK 4, 5
DSP Core Reset Deasserted After RESET Deasserted
1
Valid VDDINT/VDDEXT assumes that the supplies are fully ramped to their 1.2 and 3.3 volt rails. Voltage ramp rates can vary from microseconds to hundreds of milliseconds
depending on the design of the power supply subsystem.
Assumes a stable CLKIN signal, after meeting worst-case startup timing of crystal oscillators. Refer to the crystal oscillator manufacturer’s data sheet for startup time.
Assume a 25 ms maximum oscillator startup time if using the XTAL pin and internal oscillator circuit in conjunction with an external crystal.
3
Based on CLKIN cycles.
4
Applies after the power-up sequence is complete. Subsequent resets require a minimum of four CLKIN cycles for RESET to be held low in order to properly initialize and
propagate default states at all I/O pins.
5
The 4096 cycle count depends on tSRST specification in Table 11. If setup time is not met, one additional CLKIN cycle may be added to the core reset time, resulting in
4097 cycles maximum.
2
RESET
tRSTVDD
VDDINT
tIVDDEVDD
VDDEXT
tCLKVDD
CLKIN
tCLKRST
CLKCFG1–0
tCORERST
tPLLRST
RSTOUT*
*MULTIPLEXED WITH CLKOUT
Figure 6. Power-Up Sequencing
Rev. B
| Page 18 of 48 |
August 2005
ADSP-21262
Clock Input
See Table 10 and Figure 7.
Table 10. Clock Input
150 MHz
Min
Parameter
Timing Requirements
tCK
CLKIN Period
CLKIN Width Low
tCKL
tCKH
CLKIN Width High
tCKRF
CLKIN Rise/Fall (0.4 V – 2.0 V)
tCCLK
CCLK Period3
Max
201
7.51
7.51
1602
802
802
3
10
6.66
200 MHz
Min
151
61
61
5
Applies only for CLKCFG1–0 = 00 and default values for PLL control bits in PMCTL.
2
Applies only for CLKCFG1–0 = 01 and default values for PLL control bits in PMCTL.
3
Any changes to PLL control bits in the PMCTL register must meet core clock timing specification tCCLK.
1
tCK
CLKIN
tCKH
tCKL
Figure 7. Clock Input
Clock Signals
The ADSP-21262 can use an external clock or a crystal. See
CLKIN pin description. The programmer can configure the
ADSP-21262 to use its internal clock generator by connecting
the necessary components to CLKIN and XTAL. Figure 8 shows
the component connections used for a crystal operating in fundamental mode. Note that the 200 MHz clock rate is achieved
using a 12.5 MHz crystal and a PLL multiplier ratio 16:1
(CCLK:CLKIN).
CLKIN
C1
1M⍀
X1
XTAL
C2
NOTE: C1 AND C2 ARE SPECIFIC TO CRYSTAL SPECIFIED FOR X1.
CONTACT CRYSTAL MANUFACTURER FOR DETAILS. CRYSTAL
SELECTION MUST COMPLY WITH CLKCFG1-0 = 10 OR = 01.
Figure 8. 150 MHz or 200 MHz Operation with a 12.5 MHz
Fundamental Mode Crystal
Rev. B
| Page 19 of 48 |
August 2005
Max
Unit
1602
802
802
3
10
ns
ns
ns
ns
ns
ADSP-21262
Reset
See Table 11 and Figure 9.
Table 11. Reset
Parameter
Timing Requirements
tWRST
RESET Pulse Width Low1
tSRST
RESET Setup Before CLKIN Low
1
Min
Max
Unit
4tCK
8
ns
ns
Applies after the power-up sequence is complete. At power-up, the processor’s internal phase-locked loop requires no more than 100 µs while RESET is low, assuming
stable VDD and CLKIN (not including start-up time of external clock oscillator).
CLKIN
tWRST
tSRST
RESET
Figure 9. Reset
Interrupts
The timing specification in Table 12 and Figure 10 applies to the
FLAG0, FLAG1, and FLAG2 pins when they are configured as
IRQ0, IRQ1, and IRQ2 interrupts. Also applies to DAI_P20–1
pins when configured as interrupts.
Table 12. Interrupts
Parameter
Timing Requirement
tIPW
IRQx Pulse Width
Min
Max
2 × tCCLK +2
DAI_P20–1
(FLAG2–0)
(IRQ2–0)
Unit
ns
tIPW
Figure 10. Interrupts
Core Timer
The timing specification in Table 13 and Figure 11 applies to
FLAG3 when it is configured as the core timer (CTIMER).
Table 13. Core Timer
Parameter
Switching Characteristic
CTIMER Pulse Width
tWCTIM
Min
Max
4 × tCCLK – 1
FLAG3
(C TIM E R )
ns
t W C T IM
Figure 11. Core Timer
Rev. B
| Page 20 of 48 |
Unit
August 2005
ADSP-21262
Timer PWM_OUT Cycle Timing
The timing specification in Table 14 and Figure 12 applies to
Timer PWM_OUT (pulse-width modulation) mode. Timer signals are routed to the DAI_P20–1 pins through the SRU.
Therefore, the timing specifications provided below are valid at
the DAI_P20–1 pins.
Table 14. Timer PWM_OUT Timing
Parameter
Switching Characteristic
tPWMO
Timer Pulse Width Output
Min
Max
Unit
2 tCCLK – 1
2(231 – 1) tCCLK
ns
Min
Max
Unit
2 tCCLK
2(231 – 1) tCCLK
ns
tPWMO
DAI_P20–1
(TIMER)
Figure 12. Timer PWM_OUT Timing
Timer WDTH_CAP Timing
The timing specification in Table 15 and Figure 13 applies to
Timer WDTH_CAP (pulse width count and capture) mode.
Timer signals are routed to the DAI_P20–1 pins through the
SRU. Therefore, the timing specifications provided below are
valid at the DAI_P20–1 pins.
Table 15. Timer Width Capture Timing
Parameter
Timing Requirement
tPWI
Timer Pulse Width
tPWI
DAI_P20–1
(TIMER)
Figure 13. Timer Width Capture Timing
Rev. B
| Page 21 of 48 |
August 2005
ADSP-21262
DAI Pin-to-Pin Direct Routing
See Table 16 and Figure 14 for direct pin connections only (for
example DAI_PB01_I to DAI_PB02_O).
Table 16. DAI Pin-to-Pin Routing
Parameter
Timing Requirement
tDPIO
Delay DAI Pin Input Valid to DAI Output Valid
Min
Max
Unit
1.5
10
ns
DAI_Pn
DAI_Pm
tDPIO
Figure 14. DAI Pin-to-Pin Direct Routing
Rev. B
| Page 22 of 48 |
August 2005
ADSP-21262
cases where the PCG’s inputs and outputs are not directly
routed to/from DAI pins (via pin buffers) there is no timing
data available. All timing parameters and switching characteristics apply to external DAI pins (DAI_P07 – DAI_P20).
Precision Clock Generator (Direct Pin Routing)
The timing in Table 17 and Figure 15 is valid only when the
SRU is configured such that the precision clock generator
(PCG) takes its inputs directly from the DAI pins (via pin buffers) and sends its outputs directly to the DAI pins. For the other
Table 17. Precision Clock Generator (Direct Pin Routing)
Parameter
Timing Requirements
tPCGIW
Input Clock Pulse Width
tSTRIG
PCG Trigger Setup Before Falling Edge of PCG Input Clock
PCG Trigger Hold After Falling Edge of PCG Input Clock
tHTRIG
Min
20
2
2
Switching Characteristics
PCG Output Clock and Frame Sync Active Edge Delay After PCG Input
tDPCGIO
Clock Falling Edge
2.5
tDTRIG
PCG Output Clock and Frame Sync Delay After PCG Trigger
2.5 + 2.5 × tPCGOW
Output Clock Pulse Width
40
tPCGOW
tSTRIG
DAI_Pn
PCG_TRIGx_I
tHTRIG
tPCGIW
DAI_Pm
PCG_EXTx_I
(CLKIN)
tDPCGIO
DAI_Py
PCG_CLKx_O
tPCGOW
DAI_Pz
PCG_FSx_O
tDTRIG
Figure 15. Precision Clock Generator (Direct Pin Routing)
Rev. B
| Page 23 of 48 |
August 2005
Max
Unit
ns
ns
ns
10
ns
10 + 2.5 × tPCGOW ns
ns
ADSP-21262
Flags
The timing specifications in Table 18 and Figure 16 apply to the
FLAG3–0 and DAI_P20–1 pins, the parallel port, and the serial
peripheral interface. See Table 2 on Page 11 for more information on flag use.
Table 18. Flags
Parameter
Timing Requirement
tFIPW
FLAG3–0 IN Pulse Width
Min
Switching Characteristic
tFOPW
FLAG3–0 OUT Pulse Width
ns
2 × tCCLK – 1
ns
tFIPW
DAI_P20–1
(FLAG3–0OUT )
(AD15–0)
tFOPW
Figure 16. Flags
| Page 24 of 48 |
Unit
2 × tCCLK + 3
DAI_P20–1
(FLAG3–0IN)
(AD15–0)
Rev. B
Max
August 2005
ADSP-21262
Memory Read—Parallel Port
The specifications in Table 19, Table 20, Figure 17, and
Figure 18 are for asynchronous interfacing to memories (and
memory-mapped peripherals) when the ADSP-21262 is accessing external memory space.
Table 19. 8-Bit Memory Read Cycle
Parameter
Timing Requirements
tDRS
Address/Data7–0 Setup Before RD High
tDRH
Address/Data7–0 Hold After RD High
Address 15–8 to Data Valid
tDAD
Min
Unit
D + 0.5 × tCCLK – 3.5
ns
ns
ns
3.3
0
Switching Characteristics
ALE Pulse Width
tALEW
tALERW
ALE Deasserted to Read/Write Asserted
tADAS
Address/Data15–0 Setup Before ALE Deasserted1
tADAH
Address/Data15–0 Hold After ALE Deasserted1
tALEHZ
ALE Deasserted1 to Address/Data7–0 in High Z
tRW
RD Pulse Width
Address/Data15–8 Hold After RD High
tADRH
D = (data cycle duration) × tCCLK
H = tCCLK (if a hold cycle is specified, else H = 0)
1
Max
2 × tCCLK – 2
1 × tCCLK – 0.5
2.5 × tCCLK – 2.0
0.5 × tCCLK – 0.8
0.5 × tCCLK – 0.8
D–2
0.5 × tCCLK – 1 + H
0.5 × tCCLK + 2.0
On reset, ALE is an active high cycle. However, it can be reconfigured by software to be active low.
ALE
tALEW
tALERW
RD
tRW
WR
tALEHZ
tADAS
AD15-8
tADAH
tADRH
VALID ADDRESS
VALID ADDRESS
tDRS
AD7-0
VALID ADDRESS
tDAD
Figure 17. 8-Bit Memory Read Cycle
Rev. B
| Page 25 of 48 |
August 2005
tDRH
VALID DATA
ns
ns
ns
ns
ns
ns
ns
ADSP-21262
Table 20. 16-Bit Memory Read Cycle
Parameter
Timing Requirements
tDRS
tDRH
Min
Address/Data15–0 Setup Before RD high
Address/Data15–0 Hold After RD high
Switching Characteristics
tALEW
ALE Pulse Width
ALE Deasserted to Read/Write Asserted
tALERW
tADAS
Address/Data15–0 Setup Before ALE Deasserted1
tADAH
Address/Data15–0 Hold After ALE Deaserted1
tALEHZ
ALE Deasserted1 to Address/Data15–0 in High Z
tRW
RD Pulse Width
D = (data cycle duration) × tCCLK
H = tCCLK (if a hold cycle is specified, else H = 0)
1
Max
3.3
0
ns
ns
2 × tCCLK – 2
1 × tCCLK – 0.5
2.5 × tCCLK – 2.0
0.5 × tCCLK – 0.8
0.5 × tCCLK – 0.8
D–2
ns
ns
ns
ns
ns
ns
ns
On reset, ALE is an active high cycle. However, it can be reconfigured by software to be active low.
ALE
tALEW
tALERW
RD
tRW
WR
tADAH
tADAS
AD15-0
tDRS
tALEHZ
Figure 18. 16-Bit Memory Read Cycle
Rev. B
tDRH
VALID DATA
VALID ADDRESS
| Page 26 of 48 |
Unit
August 2005
0.5tCCLK + 2.0
ADSP-21262
Memory Write—Parallel Port
Use the specifications in Table 21, Table 22, Figure 19, and
Figure 20 for asynchronous interfacing to memories (and
memory-mapped peripherals) when the ADSP-21262 is accessing external memory space.
Table 21. 8-Bit Memory Write Cycle
Parameter
Switching Characteristics
tALEW
ALE Pulse Width
tALERW
ALE Deasserted to Read/Write Asserted
Address/Data15–0 Setup Before ALE Deasserted1
tADAS
tADAH
Address/Data15–0 Hold After ALE Deasserted1
tWW
WR Pulse Width
tADWL
Address/Data15–8 to WR Low
tADWH
Address/Data15–8 Hold After WR High
tALEHZ
ALE Deasserted1 to Address/Data15–0 in High Z
Address/Data7–0 Setup Before WR High
tDWS
tDWH
Address/Data7–0 Hold After WR High
tDAWH
Address/Data to WR High
D = (data cycle duration) × tCCLK
H = tCCLK (if a hold cycle is specified, else H = 0)
1
Min
Max
2 × tCCLK – 2
1 × tCCLK – 0.5
2.5 × tCCLK – 2.0
0.5 × tCCLK – 0.8
D–2
0.5 × tCCLK – 1.5
0.5 × tCCLK – 1 + H
0.5 × tCCLK – 0.8
D
0.5 × tCCLK – 1.5 + H
D
On reset, ALE is an active high cycle. However, it can be reconfigured by software to be active low.
tALERW
ALE
t ALEW
t DAW H
WR
t WW
RD
t ALEHZ
t ADAS
AD15-8
t ADWL
tADWH
t ADAH
VALID ADDRESS
VALID ADDRESS
tDWS
AD7-0
VALID ADDRESS
VALID DATA
Figure 19. 8-Bit Memory Write Cycle
Rev. B
t DWH
| Page 27 of 48 |
August 2005
0.5tCCLK + 2.0
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ADSP-21262
Table 22. 16-Bit Memory Write Cycle
Parameter
Switching Characteristics
tALEW
ALE Pulse Width
ALE Deasserted to Read/Write Asserted
tALERW
tADAS
Address/Data 15–0 Setup Before ALE Deasserted1
tADAH
Address/Data15–0 Hold After ALE Deasserted1
tWW
WR Pulse Width
tALEHZ
ALE Deasserted1 to Address/Data15–0 in High Z
tDWS
Address/Data15–0 Setup Before WR High
tDWH
Address/Data15–0 Hold After WR High
D = (data cycle duration) × tCCLK
H = tCCLK (if a hold cycle is specified, else H = 0)
1
Min
Max
2 × tCCLK – 2
1 × tCCLK – 0.5
2.5 × tCCLK – 2.0
0.5 × tCCLK – 0.8
D–2
0.5 × tCCLK – 0.8
D
0.5 × tCCLK – 1.5 + H
On reset, ALE is an active high cycle. However, it can be reconfigured by software to be active low.
ALE
tALEW
tALERW
tWW
WR
RD
tALEH
tADAS
AD15-0
tADAH
tDWS
VALID ADDRESS
VALID DATA
Figure 20. 16-Bit Memory Write Cycle
Rev. B
| Page 28 of 48 |
tDWH
August 2005
0.5tCCLK + 2.0
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ADSP-21262
Serial Ports
To determine whether communication is possible between two
devices at clock speed n, the specifications in Table 23, Table 24,
Table 25, Table 26, Figure 21, and Figure 22 must be confirmed:
1) frame sync delay and frame sync setup and hold; 2) data delay
and data setup and hold; and 3) SCLK width.
Serial port signals (SCLK, FS, DxA,/DxB) are routed to the
DAI_P20–1 pins using the SRU. Therefore, the timing specifications provided below are valid at the DAI_P20–1 pins.
Table 23. Serial Ports—External Clock
Parameter
Timing Requirements
tSFSE
FS Setup Before SCLK
(Externally Generated FS in Either Transmit or Receive Mode)1
tHFSE
FS Hold After SCLK
(Externally Generated FS in Either Transmit or Receive Mode)1
Receive Data Setup Before Receive SCLK1
tSDRE
tHDRE
Receive Data Hold After SCLK1
tSCLKW
SCLK Width
tSCLK
SCLK Period
Switching Characteristics
tDFSE
FS Delay After SCLK
(Internally Generated FS in Either Transmit or Receive Mode)2
tHOFSE
FS Hold After SCLK
(Internally Generated FS in Either Transmit or Receive Mode)2
tDDTE
Transmit Data Delay After Transmit SCLK2
tHDTE
Transmit Data Hold After Transmit SCLK2
1
2
Min
Max
Unit
2.5
ns
2.5
2.5
2.5
7
20
ns
ns
ns
ns
ns
7
ns
7
ns
ns
ns
2
2
Referenced to sample edge.
Referenced to drive edge.
Table 24. Serial Ports—Internal Clock
Parameter
Timing Requirements
tSFSI
FS Setup Before SCLK
(Externally Generated FS in Either Transmit or Receive Mode)1
tHFSI
FS Hold After SCLK
(Externally Generated FS in Either Transmit or Receive Mode)1
tSDRI
Receive Data Setup Before SCLK1
tHDRI
Receive Data Hold After SCLK1
Switching Characteristics
tDFSI
FS Delay After SCLK (Internally Generated FS in Transmit Mode)2
tHOFSI
FS Hold After SCLK (Internally Generated FS in Transmit Mode)2
tDFSI
FS Delay After SCLK (Internally Generated FS in Receive Mode)2
FS Hold After SCLK (Internally Generated FS in Receive Mode)2
tHOFSI
tDDTI
Transmit Data Delay After SCLK2
tHDTI
Transmit Data Hold After SCLK2
tSCLKIW
Transmit or Receive SCLK Width
1
Referenced to the sample edge.
2
Referenced to drive edge.
Rev. B
| Page 29 of 48 |
August 2005
Min
Max
Unit
6
ns
1.5
6
1.5
ns
ns
ns
3
–1.0
3
–1.0
3
–1.0
0.5tSCLK – 2
0.5tSCLK + 2
ns
ns
ns
ns
ns
ns
ns
ADSP-21262
Table 25. Serial Ports—Enable and Three-State
Parameter
Switching Characteristics
tDDTEN
Data Enable from External Transmit SCLK1
Data Disable from External Transmit SCLK1
tDDTTE
tDDTIN
Data Enable from Internal Transmit SCLK1
1
Min
Max
Unit
7
ns
ns
ns
Max
Unit
7
ns
ns
2
–1
Referenced to drive edge.
Table 26. Serial Ports—External Late Frame Sync
Parameter
Min
Switching Characteristics
tDDTLFSE
Data Delay from Late External Transmit FS or External Receive FS
with MCE = 1, MFD = 01
tDDTENFS
Data Enable for MCE = 1, MFD = 01
0.5
1
The tDDTLFSE and tDDTENFS parameters apply to left-justified sample pair mode as well as DSP serial mode, and MCE = 1, MFD = 0.
EXTERNAL RECEIVE FS WITH MCE = 1, MFD = 0
DAI_P20-1
(SCLK)
DRIVE
SAMPLE
DRIVE
tSFSE/I
tHFSE/I
DAI_P20-1
(FS)
tDDTE/I
tDDTENFS
tHDTE/I
DAI_P20-1
(DATA CHANNEL A/B)
1ST BIT
2ND BIT
tDDTLFSE
LATE EXTERNAL TRANSMIT FS
DAI_P201
(SCLK)
DRIVE
SAMPLE
tSFSE/I
DRIVE
tHFSE/I
DAI_P20-1
(FS)
tDDTE/I
tDDTENFS
tHDTE/I
DAI_P20-1
(DATA CHANNEL A/B)
1ST BIT
2ND BIT
tDDTLFSE
NOTE: SERIAL PORT SIGNALS (SCLK, FS, DATA CHANNEL A/B) ARE ROUTED TO THE DAI_P[20:1] PINS
USING THE SRU. THE TIMING SPECIFICATIONS PROVIDED HERE ARE VALID AT THE DAI_P[20:1] PINS.
Figure 21. External Late Frame Sync1
1
This figure reflects changes made to support left-justified sample pair mode.
Rev. B
| Page 30 of 48 |
August 2005
ADSP-21262
DATA RECEIVE—INTERNAL CLOCK
DRIVE EDGE
DATA RECEIVE—EXTERNAL CLOCK
DRIVE EDGE
SAMPLE EDGE
SAMPLE EDGE
tSCLKIW
tSCLKW
DAI_P20–1
(SCLK)
DAI_P20–1
(SCLK)
tDFSI
tDFSE
tHFSI
tSFSI
tHOFSI
DAI_P20–1
(FS)
tHFSE
tSFSE
tHOFSE
DAI_P20–1
(FS)
tSDRI
tHDRI
DAI_P20–1
(DATA CHANNEL A/B)
tSDRE
tHDRE
DAI_P20–1
(DATA CHANNEL A/B)
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF SCLK (EXTERNAL), SCLK (INTERNAL) CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DATA TRANSMIT—INTERNAL CLOCK
DRIVE EDGE
DATA TRANSMIT—EXTERNAL CLOCK
SAMPLE EDGE
DRIVE EDGE
SAMPLE EDGE
tSCLKIW
tSCLKW
DAI_P20–1
(SCLK)
DAI_P20–1
(SCLK)
tDFSI
tDFSE
tHOFSI
tHFSI
tSFSI
tHOFSE
DAI_P20–1
(FS)
tSFSE
tHFSE
DAI_P20–1
(FS)
tDDTI
tHDTI
tDDTE
tHDTE
DAI_P20–1
(DATA CHANNEL A/B)
DAI_P20–1
(DATA CHANNEL A/B)
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF SCLK (EXTERNAL), SCLK (INTERNAL) CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DRIVE EDGE
DRIVE EDGE
DAI_P20–1
SCLK (EXT)
SCLK
tDDTEN
tDDTTE
DAI_P20–1
(DATA CHANNEL A/B)
DRIVE EDGE
DAI_P20–1
SCLK (INT)
tDDTIN
DAI_P20–1
(DATA CHANNEL A/B)
Figure 22. Serial Ports
Rev. B
| Page 31 of 48 |
August 2005
ADSP-21262
Input Data Port (IDP)
The timing requirements for the IDP are given in Table 27 and
Figure 23. IDP Signals (SCLK, FS, SDATA) are routed to the
DAI_P20–1 pins using the SRU. Therefore, the timing specifications provided below are valid at the DAI_P20–1 pins.
Table 27. Input Data Port (IDP)
Parameter
Timing Requirements
tSISFS
FS Setup Before SCLK Rising Edge1
tSIHFS
FS Hold After SCLK Rising Edge1
SData Setup Before SCLK Rising Edge1
tSISD
tSIHD
SData Hold After SCLK Rising Edge1
tIDPCLKW
Clock Width
tIDPCLK
Clock Period
1
Min
Max
2.5
2.5
2.5
2.5
7
20
Unit
ns
ns
ns
ns
ns
ns
DATA, SCLK, FS can come from any of the DAI pins. SCLK and FS can also come via the precision clock generators (PCG) or SPORTs. PCG input can be either
CLKIN or any of the DAI pins.
SAMPLE EDGE
tIDPCLKW
DAI_P20–1
(SCLK)
tSIHFS
tSISFS
DAI_P20–1
(FS)
tSISD
DAI_P20–1
(SDATA)
Figure 23. Input Data Port (IDP)
Rev. B
| Page 32 of 48 |
August 2005
tSIHD
ADSP-21262
Note that the most significant 16 bits of external PDAP data can
be provided through either the parallel port AD15–0 or the
DAI_P20–5 pins. The remaining four bits can only be sourced
through DAI_P4–1. The timing below is valid at the
DAI_P20–1 pins or at the AD15–0 pins.
Parallel Data Acquisition Port (PDAP)
The timing requirements for the PDAP are provided in Table 28
and Figure 24. PDAP is the parallel mode operation of
Channel 0 of the IDP. For details on the operation of the IDP,
see the IDP chapter of the ADSP-2126x Peripherals Manual.
Table 28. Parallel Data Acquisition Port (PDAP)
1
Parameter
Timing Requirements
tSPCLKEN
PDAP_CLKEN Setup Before PDAP_CLK Sample Edge1
tHPCLKEN
PDAP_CLKEN Hold After PDAP_CLK Sample Edge1
PDAP_DAT Setup Before SCLK PDAP_CLK Sample Edge1
tPDSD
tPDHD
PDAP_DAT Hold After SCLK PDAP_CLK Sample Edge1
tPDCLKW
Clock Width
tPDCLK
Clock Period
Min
Max
Unit
2.5
2.5
2.5
2.5
7
20
ns
ns
ns
ns
ns
ns
Switching Characteristics
tPDHLDD
Delay of PDAP Strobe After Last PDAP_CLK Capture Edge for a Word
tPDSTRB
PDAP Strobe Pulse Width
2 × tCCLK
1 × tCCLK – 1
ns
ns
Source pins of DATA are ADDR7–0, DATA7–0, or DAI pins. Source pins for SCLK and FS are: 1) DAI pins, 2) CLKIN through PCG, or 3) DAI pins through PCG.
SAMPLE EDGE
t PDCLK
tPDCLKW
DAI_P20–1
(PDAP_CLK)
t SPCLKEN
tHPCLKEN
DAI_P20–1
(PDAP_CLKEN)
tPDSD
t PDHD
DATA
DAI_P20–1
(PDAP_STROBE)
tPDSTRB
tPDHLDD
Figure 24. Parallel Data Acquisition Port (PDAP)
Rev. B
| Page 33 of 48 |
August 2005
ADSP-21262
SPI Protocol—Master
Table 29. SPI Protocol—Master
Parameter
Timing Requirements
tSSPIDM
Data Input Valid to SPICLK Edge (Data Input Setup Time)
tHSPIDM
SPICLK Last Sampling Edge to Data Input Not Valid
Min
Switching Characteristics
tSPICLKM
Serial Clock Cycle
tSPICHM
Serial Clock High Period
tSPICLM
Serial Clock Low Period
tDDSPIDM
SPICLK Edge to Data Out Valid (Data Out Delay Time)
tHDSPIDM
SPICLK Edge to Data Out Not Valid (Data Out Hold Time)
FLAG3–0 OUT (SPI Device Select) Low to First SPICLK Edge
tSDSCIM
tHDSM
Last SPICLK Edge to FLAG3–0 OUT High
tSPITDM
Sequential Transfer Delay
Max
5
2
ns
ns
8 × tCCLK
4 × tCCLK – 2
4 × tCCLK – 2
ns
ns
ns
ns
ns
ns
ns
ns
3
10
4 × tCCLK – 2
4 × tCCLK – 1
4 × tCCLK – 1
FLG3-0
(OUTPUT)
tS D S C I M
tS P I C H M
t S P IC LM
t S P IC LM
tS P I C H M
t S P IC LK M
tHDSM
tS P I T D M
SPICLK
(CP = 0)
(OUTPUT)
SPICLK
(CP = 1)
(OUTPUT)
t HDSPIDM
tDDSPIDM
MOSI
(OUTPUT)
MSB
LSB
t S S P ID M
CPHASE = 1
tSSPIDM
MSB
VALID
LSB
VALID
tDDSPIDM
MOSI
(OUTPUT)
CPHASE = 0
MISO
(INPUT)
tHSPIDM
tHSPIDM
MISO
(INPUT)
tHDSPIDM
MSB
tSSPIDM
LSB
t H S P ID M
MSB
VALID
LSB
VALID
Figure 25. SPI Protocol—Master
Rev. B
| Page 34 of 48 |
Unit
August 2005
ADSP-21262
SPI Protocol—Slave
See Table 30 and Figure 26.
Table 30. SPI Protocol—Slave
Parameter
Timing Requirements
tSPICLKS
tSPICHS
tSPICLS
tSDSCO
tHDS
tSSPIDS
tHSPIDS
tSDPPW
Min
Serial Clock Cycle
Serial Clock High Period
Serial Clock Low Period
SPIDS Assertion to First SPICLK Edge
CPHASE = 0
CPHASE = 1
Last SPICLK Edge to SPIDS Not Asserted CPHASE = 0
Data Input Valid to SPICLK Edge (Data Input Setup Time)
SPICLK Last Sampling Edge to Data Input Not Valid
SPIDS Deassertion Pulse Width (CPHASE = 0)
Switching Characteristics
tDSOE
SPIDS Assertion to Data Out Active
tDSDHI
SPIDS Deassertion to Data High Impedance
tDDSPIDS
SPICLK Edge to Data Out Valid (Data Out Delay Time)
tHDSPIDS
SPICLK Edge to Data Out Not Valid (Data Out Hold Time)
tDSOV
SPIDS Assertion to Data Out Valid (CPHASE = 0)
Rev. B
| Page 35 of 48 |
August 2005
Max
Unit
4 × tCCLK
2 × tCCLK – 2
2 × tCCLK – 2
ns
ns
ns
2 × tCCLK + 1
2 × tCCLK + 1
2 × tCCLK
2
2
2 × tCCLK
ns
ns
ns
ns
ns
ns
0
0
5
5
7.5
2 × tCCLK – 2
5 × tCCLK + 2
ns
ns
ns
ns
ns
ADSP-21262
SPIDS
(INPUT)
t S P IC H S
tSPICLS
tSPICL KS
tHDS
SPICLK
(CP = 0)
(INPUT)
tSPICLS
tSDSCO
SPICLK
(CP = 1)
(INPUT)
tSPICHS
tDSDHI
tDDSPIDS
tDSOE
tDDSPIDS
MISO
(OUTPUT)
tSDPPW
tHDSPIDS
MSB
LSB
tHSPIDS
tSSPIDS
CPHASE = 1
MOSI
(INPUT)
tSSPIDS
LSB VALID
MSB VALID
tDSOV
MISO
(OUTPUT)
tDSDHI
LSB
MSB
CPHASE = 0
MOSI
(INPUT)
tHDSPIDS
tDDSPIDS
tD S O E
tHSPIDS
tSSPIDS
MSB VALID
LSB VALID
Figure 26. SPI Protocol—Slave
JTAG Test Access Port and Emulation
See Table 31 and Figure 27.
Table 31. JTAG Test Access Port and Emulation
Parameter
Timing Requirements
tTCK
TCK Period
TDI, TMS Setup Before TCK High
tSTAP
tHTAP
TDI, TMS Hold After TCK High
tSSYS
System Inputs Setup Before TCK High1
tHSYS
System Inputs Hold After TCK High1
tTRSTW
TRST Pulse Width
Min
20
5
6
7
8
4tCK
Switching Characteristics
tDTDO
TDO Delay from TCK Low
tDSYS
System Outputs Delay After TCK Low2
1
2
| Page 36 of 48 |
August 2005
Unit
ns
ns
ns
ns
ns
ns
7
10
System Inputs = AD15–0, SPIDS, CLKCFG1–0, RESET, BOOTCFG1–0, MISO, MOSI, SPICLK, DAI_Px, FLAG3–0.
System Outputs = MISO, MOSI, SPICLK, DAI_Px, AD15–0, RD, WR, FLAG3–0, CLKOUT, EMU, ALE.
Rev. B
Max
ns
ns
ADSP-21262
tTCK
TCK
tSTAP
tHTAP
TMS
TDI
tDTDO
TDO
tSSYS
tHSYS
SYSTEM
INPUTS
tDSYS
SYSTEM
OUTPUTS
Figure 27. JTAG Test Access Port and Emulation
Rev. B
| Page 37 of 48 |
August 2005
ADSP-21262
OUTPUT DRIVE CURRENTS
CAPACITIVE LOADING
Figure 28 shows typical I-V characteristics for the output drivers of the ADSP-21262. The curves represent the current drive
capability of the output drivers as a function of output voltage.
Output delays and holds are based on standard capacitive loads:
30 pF on all pins (see Figure 29). Figure 32 shows graphically
how output delays and holds vary with load capacitance (note
that this graph or derating does not apply to output disable
delays). The graphs of Figure 31, Figure 32, and Figure 33 may
not be linear outside the ranges shown for Typical Output Delay
vs. Load Capacitance and Typical Output Rise Time (20%–80%,
V=Min) vs. Load Capacitance.
40
VOH
3.3V, 25°C
20
3.47V, –45°C
10
12
3.11V, 125°C
0
10
–10
3.11V, 125°C
–20
3.3V, 25°C
–30
–40
0
VOL
3.47V, –45°C
0.5
1
1.5
2
2.5
SWEEP (VDDEXT) VOLTAGE (V)
3
y = 0.0467x + 1.6323
RISE AND FALL TIMES (ns)
SOURCE (VDDEXT) CURRENT (mA)
30
3.5
RISE
FALL
8
6
4
y = 0.045x + 1.524
2
Figure 28. Typical Drive
0
TEST CONDITIONS
0
The ac signal specifications (timing parameters) appear in
Table 10 on Page 19 through Table 31 on Page 36. These include
output disable time, output enable time, and capacitive loading.
50
100
150
200
250
200
250
LOAD CAPACITANCE (pF)
Figure 31. Typical Output Rise Time
(20%–80%, VDDEXT = Max)
Timing is measured on signals when they cross the 1.5 V level as
described in Figure 30. All delays (in nanoseconds) are measured between the point that the first signal reaches 1.5 V and
the point that the second signal reaches 1.5 V.
12
RISE
50⍀
TO
OUTPUT
PIN
1.5V
30pF
RISE AND FALL TIMES (ns)
10
y = 0.049x + 1.5105
FALL
8
6
y = 0.0482x + 1.4604
4
2
Figure 29. Equivalent Device Loading for AC Measurements
(Includes All Fixtures)
0
0
50
100
150
LOAD CAPACITANCE (pF)
INPUT
OR
OUTPUT
1.5V
1.5V
Figure 32. Typical Output Rise/Fall Time
(20%–80%, VDDEXT = Min)
Figure 30. Voltage Reference Levels for AC Measurements
Rev. B
| Page 38 of 48 |
August 2005
ADSP-21262
Values of θJA are provided for package comparison and PCB
design considerations (θJMA indicates moving air). θJA can be
used for a first-order approximation of TJ by the equation:
10
OUTPUT DELAY OR HOLD (ns)
8
T J = T A + ( θ JA × P D )
Y = 0.0488X – 1.5923
6
where:
4
TA = ambient temperature (°C)
Values of θJC are provided for package comparison and PCB
design considerations when an external heat sink is required.
2
Values of θJB are provided for package comparison and PCB
design considerations. Note that the thermal characteristics values provided in Table 32 through Table 36 are modeled values.
0
–2
–4
0
50
100
150
200
Table 32. Thermal Characteristics for Commercial
Grade 144-Lead LQFP
LOAD CAPACITANCE (pF)
Figure 33. Typical Output Delay or Hold vs. Load Capacitance
(at Ambient Temperature)
ENVIRONMENTAL CONDITIONS
The ADSP-21262 processor is rated for performance under
TAMB environmental conditions specified in the Recommended
Operating Conditions on Page 15.
THERMAL CHARACTERISTICS
Table 32 through Table 36 airflow measurements comply with
JEDEC standards JESD51-2 and JESD51-6 and the junction-toboard measurement complies with JESD51-8. Test board and
thermal via design comply with JEDEC standards JESD51-9
(mini-BGA) and JESD51-5 (integrated Heat Sink LQFP). The
junction-to-case measurement complies with MIL-STD-883.
All measurements use a 2S2P JEDEC test board.
T J = T CASE + ( Ψ JT × P D )
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
32.5
28.9
27.8
7.8
Unit
°C/W
°C/W
°C/W
°C/W
ΨJT
ΨJMT
ΨJMT
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
0.5
0.8
1.0
°C/W
°C/W
°C/W
Table 33. Thermal Characteristics for Commercial
Grade 136-Ball BGA (no thermal vias in PCB)
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJMT
ΨJMT
Industrial applications using the mini-BGA package require
thermal vias, to an embedded ground plane, in the PCB. Refer to
JEDEC standard JESD51-9 for printed circuit board thermal
ball land and thermal via design information.
To determine the junction temperature of the device while on
the application PCB, use:
Parameter
θJA
θJMA
θJMA
θJC
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
31.0
27.3
26.0
6.99
0.16
0.30
0.35
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Table 34. Thermal Characteristics for Commercial
Grade 136-Ball BGA (with thermal vias in PCB)
where:
TJ = junction temperature (°C)
TCASE = case temperature (°C) measured at the top center of the
package
ΨJT = junction-to-top (of package) characterization parameter is
the typical value from Table 32 through Table 36 (ΨJMT indicates moving air).
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJMT
ΨJMT
PD = power dissipation (see EE Note No. 250 for industrial
applications and No. 216 for commercial)
Rev. B
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
| Page 39 of 48 |
August 2005
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
27.7
24.1
23.0
6.85
0.14
0.26
0.31
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
ADSP-21262
Table 35. Thermal Characteristics for Industrial
Grade 136-Ball BGA (no thermal vias in PCB)
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJMT
ΨJMT
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
27.9
24.8
23.7
7.93
0.23
0.41
0.51
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Table 36. Thermal Characteristics for Industrial
Grade 136-Ball BGA (with thermal vias in PCB)
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJMT
ΨJMT
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
25.9
23.0
21.9
7.83
0.22
0.39
0.47
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Rev. B
| Page 40 of 48 |
August 2005
ADSP-21262
136-BALL BGA PIN CONFIGURATIONS
Table 37 shows the ADSP-21262’s pin names and their default
function after reset (in parentheses). Figure 34 on Page 43
shows the BGA package pin assignments.
Table 37. 136-Ball BGA Pin Assignments
Pin Name
CLKCFG0
XTAL
TMS
TCK
TDI
CLKOUT
TDO
EMU
MOSI
MISO
SPIDS
VDDINT
GND
GND
VDDINT
GND
GND
GND
GND
GND
GND
GND
GND
FLAG3
BGA Pin
No.
A01
A02
A03
A04
A05
A06
A07
A08
A09
A10
A11
A12
A13
A14
E01
E02
E04
E05
E06
E09
E10
E11
E13
E14
BGA Pin
No.
B01
B02
B03
B04
B05
B06
B07
B08
B09
B10
B11
B12
B13
B14
F01
F02
F04
F05
F06
F09
F10
F11
F13
F14
Pin Name
CLKCFG1
GND
VDDEXT
CLKIN
TRST
AVSS
AVDD
VDDEXT
SPICLK
RESET
VDDINT
GND
GND
GND
FLAG1
FLAG0
GND
GND
GND
GND
GND
GND
FLAG2
DAI_P20 (SFS45)
Rev. B
Pin Name
BOOTCFG1
BOOTCFG0
GND
GND
GND
VDDINT
BGA Pin
No.
C01
C02
C03
C12
C13
C14
AD7
VDDINT
VDDEXT
DAI_P19 (SCLK45)
G01
G02
G13
G14
| Page 41 of 48 |
August 2005
Pin Name
VDDINT
GND
GND
GND
GND
GND
GND
GND
GND
VDDINT
BGA Pin
No.
D01
D02
D04
D05
D06
D09
D10
D11
D13
D14
AD6
VDDEXT
DAI_P18 (SD5B)
DAI_P17 (SD5A)
H01
H02
H13
H14
ADSP-21262
Table 37. 136-Ball BGA Pin Assignments (Continued)
Pin Name
AD5
AD4
GND
GND
GND
GND
GND
GND
VDDINT
DAI_P16 (SD4B)
AD15
ALE
RD
VDDINT
VDDEXT
AD8
VDDINT
DAI_P2 (SD0B)
VDDEXT
DAI_P4 (SFS0)
VDDINT
VDDINT
GND
DAI_P10 (SD2B)
BGA Pin
No.
J01
J02
J04
J05
J06
J09
J10
J11
J13
J14
N01
N02
N03
N04
N05
N06
N07
N08
N09
N10
N11
N12
N13
N14
BGA Pin
No.
K01
K02
K04
K05
K06
K09
K10
K11
K13
K14
P01
P02
P03
P04
P05
P06
P07
P08
P09
P10
P11
P12
P13
P14
Pin Name
AD3
VDDINT
GND
GND
GND
GND
GND
GND
GND
DAI_P15 (SD4A)
AD14
AD13
AD12
AD11
AD10
AD9
DAI_P1 (SD0A)
DAI_P3 (SCLK0)
DAI_P5 (SD1A)
DAI_P6 (SD1B)
DAI_P7 (SCLK1)
DAI_P8 (SFS1)
DAI_P9 (SD2A)
DAI_P11 (SD3A)
Rev. B
Pin Name
AD2
AD1
GND
GND
GND
GND
GND
GND
GND
DAI_P14 (SFS23)
| Page 42 of 48 |
August 2005
BGA Pin
No.
L01
L02
L04
L05
L06
L09
L10
L11
L13
L14
Pin Name
AD0
WR
GND
GND
DAI_P12 (SD3B)
DAI_P13 (SCLK23)
BGA Pin
No.
M01
M02
M03
M12
M13
M14
ADSP-21262
14 13 12 11 10
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
KEY
VDDINT
GND
AVDD
VDDEXT
AVSS
I/O SIGNALS
* USE THE CENTER BLOCK OF GROUND PINS TO PROVIDE
THERMAL PATHWAYS TO YOUR PRINTED
CIRCUIT BOARD’S GROUND PLANE.
Figure 34. 136-Ball BGA Pin Assignments (Bottom View, Summary)
Rev. B
| Page 43 of 48 |
August 2005
ADSP-21262
144-LEAD LQFP PIN CONFIGURATIONS
Table 38 shows the ADSP-21262’s pin names and their default
function after reset (in parentheses).
Table 38. 144-Lead LQFP Pin Assignments
Pin Name
VDDINT
CLKCFG0
CLKCFG1
BOOTCFG0
BOOTCFG1
GND
VDDEXT
GND
VDDINT
GND
VDDINT
GND
VDDINT
GND
FLAG0
FLAG1
AD7
GND
VDDINT
GND
VDDEXT
GND
VDDINT
AD6
AD5
AD4
VDDINT
GND
AD3
AD2
VDDEXT
GND
AD1
AD0
WR
VDDINT
LQFP
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
Pin Name
VDDINT
GND
RD
ALE
AD15
AD14
AD13
GND
VDDEXT
AD12
VDDINT
GND
AD11
AD10
AD9
AD8
DAI_P1 (SD0A)
VDDINT
GND
DAI_P2 (SD0B)
DAI_P3 (SCLK0)
GND
VDDEXT
VDDINT
GND
DAI_P4 (SFS0)
DAI_P5 (SD1A)
DAI_P6 (SD1B)
DAI_P7 (SCLK1)
VDDINT
GND
VDDINT
GND
DAI_P8 (SFS1)
DAI_P9 (SD2A)
VDDINT
LQFP
Pin No.
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
Rev. B
Pin Name
VDDEXT
GND
VDDINT
GND
DAI_P10 (SD2B)
DAI_P11 (SD3A)
DAI_P12 (SD3B)
DAI_P13 (SCLK23)
DAI_P14 (SFS23)
DAI_P15 (SD4A)
VDDINT
GND
GND
DAI_P16 (SD4B)
DAI_P17 (SD5A)
DAI_P18 (SD5B)
DAI_P19 (SCLK45)
VDDINT
GND
GND
VDDEXT
DAI_P20 (SFS45)
GND
VDDINT
FLAG2
FLAG3
VDDINT
GND
VDDINT
GND
VDDINT
GND
VDDINT
GND
VDDINT
VDDINT
| Page 44 of 48 |
August 2005
LQFP
Pin No.
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
Pin Name
GND
VDDINT
GND
VDDINT
GND
VDDINT
GND
VDDEXT
GND
VDDINT
GND
VDDINT
RESET
SPIDS
GND
VDDINT
SPICLK
MISO
MOSI
GND
VDDINT
VDDEXT
AVDD
AVSS
GND
CLKOUT
EMU
TDO
TDI
TRST
TCK
TMS
GND
CLKIN
XTAL
VDDEXT
LQFP
Pin No.
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
ADSP-21262
PACKAGE DIMENSIONS
The ADSP-21262 is available in a 136-ball BGA package and a
144-lead LQFP package shown in Figure 35 and Figure 36.
10.40 BSC SQ
12.00 BSC SQ
0.80
BSC
TYP
PIN A1 INDICATOR
0.80
BSC
TYP
14 13 12 11 10 9 8 7 6 5 4 3 2 1
TOP VIEW
1.70
MAX
A
B
C
D
E
F
G
H
J
K
L
M
N
P
DETAIL A
BOTTOM VIEW
1. DIMENSIONS ARE IN MILIMETERS (MM).
2. THE ACTUAL POSITION OF THE BALL GRID IS
WITHIN 0.15 MM OF ITS IDEAL POSITION RELATIVE
TO THE PACKAGE EDGES.
3. COMPLIANT TO JEDEC STANDARD MO-205-AE, EXCEPT FOR
THE BALL DIAMETER.
4. CENTER DIMENSIONS ARE NOMINAL.
0.25
MIN
SEATING
PLANE
0.50
0.45
0.40
(BALL
DIAMETER)
0.12 MAX (BALL
COPLANARITY)
DETAIL A
Figure 35. 136-Ball BGA (BC-136-3)
22.00 BSC SQ
20.00 BSC SQ
109
144
108
1
PIN 1 INDICATOR
0.50
BSC
TYP
(LEAD
PITCH)
0.27
0.22 TYP
0.17
SEATING
PLANE
0.08 MAX (LEAD
COPLANARITY)
1. DIMENSIONS ARE IN MILLIMETERS
AND COMPLY WITH JEDEC
STANDARD MS-026-BFB.
0.15
0.05
0.75
0.60 TYP
0.45
1.45
1.40
1.35
1.60 MAX
73
36
72
37
DETAIL A
DETAIL A
TOP VIEW (PINS DOWN)
Figure 36. 144-Lead LQFP (ST-144-2)
Rev. B
| Page 45 of 48 |
August 2005
2. ACTUAL POSITION OF EACH LEAD
IS WITHIN 0.08 OF ITS IDEAL POSITION
WHEN MEASURED IN THE LATERAL
DIRECTION.
3. CENTER DIMENSIONS ARE NOMINAL.
ADSP-21262
ORDERING GUIDE
Model
ADSP-21262SKBC-200
ADSP-21262SKBCZ2002
ADSP-21262SKSTZ2002
ADSP-21262SBBC-150
ADSP-21262SBBCZ1502
1
2
Temperature
Range1
0°C to +70°C
0°C to +70°C
0°C to +70°C
–40°C to +85°C
–40°C to +85°C
Instruction
Rate
200 MHz
200 MHz
200 MHz
150 MHz
150 MHz
On-Chip
SRAM
2M bit
2M bit
2M bit
2M bit
2M bit
ROM
4M bit
4M bit
4M bit
4M bit
4M bit
Operating
Voltage
1.2 INT/3.3 EXT V
1.2 INT/3.3 EXT V
1.2 INT/3.3 EXT V
1.2 INT/3.3 EXT V
1.2 INT/3.3 EXT V
Ranges shown represent ambient temperature.
Z=Pb-free part.
Rev. B |
Page 46 of 48 |
September 2005
Package
Description
136-Lead BGA
136-Lead BGA
144-Lead LQFP
136-Lead BGA
136-Lead BGA
Package
Option
BC-136-3
BC-136-3
ST-144-2
BC-136-3
BC-136-3
ADSP-21262
Rev. B
| Page 47 of 48 |
August 2005
ADSP-21262
© 2005 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04442-0-8/05(B)
Rev. B
| Page 48 of 48 |
August 2005