Infineon BAS21U For high-speed switching application Datasheet

BAS21...
Silicon Switching Diode
• For high-speed switching applications
• High breakdown voltage
• Pb-free (RoHS compliant) package 1)
• Qualified according AEC Q101
BAS21
BAS21-03W
BAS21U
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Type
Package
Configuration
Marking
BAS21
BAS21-03W
BAS21U
SOT23
SOD323
SC74
single
single
parallel triple
JSs
D
JSs
Maximum Ratings at TA = 25°C, unless otherwise specified
Parameter
Symbol
Diode reverse voltage
VR
200
Peak reverse voltage
VRM
250
Forward current
IF
250
Peak forward current
IFM
625
Peak forward current
IFM
625
Surge forward current, t = 10 µs
IFS
4
Non-repetitive peak surge forward current
IFSM
-
Total power dissipation
Ptot
Value
V
mA
mA
A
mW
BAS21, T S ≤ 70°C
350
BAS21-03W, TS ≤ 124°C
BAS21U, TS ≤ 122°C
250
250
Junction temperature
Tj
Storage temperature
Tstg
1Pb-containing
Unit
150
°C
-65 ... 150
package may be available upon special request
1
2007-04-19
BAS21...
Thermal Resistance
Parameter
Symbol
Junction - soldering point 1)
RthJS
Value
Unit
K/W
BAS21
≤ 230
BAS21-03W
≤ 105
BAS21U
≤ 110
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ. max.
DC Characteristics
250
V
Breakdown voltage
V(BR)
I(BR) = 100 µA
Reverse current
IR
µA
VR = 200 V
-
-
0.1
VR = 200 V, TA = 150 °C
-
-
100
Forward voltage
V
VF
IF = 100 mA
-
-
1
IF = 200 mA
-
-
1.25
CT
-
-
5
pF
trr
-
-
50
ns
AC Characteristics
Diode capacitance
VR = 0 V, f = 1 MHz
Reverse recovery time
IF = 30 mA, IR = 30 mA, measured at IR = 3mA,
RL = 100 Ω
Test circuit for reverse recovery time
D.U.T.
ΙF
Puls generator: tp = 1µs, D = 0.05
tr = 0.6ns, Ri = 50Ω
Oscillograph
Oscillograph: R = 50Ω , tr = 0.35ns, C ≤ 1pF
EHN00018
1For
calculation of RthJA please refer to Application Note Thermal Resistance
2
2007-04-19
BAS21...
Reverse current IR = ƒ (TA)
Forward Voltage VF = ƒ (TA)
IF = Parameter
VR = 200V
10 2
BAS 19...21
EHB00027
µA
ΙR
BAS 19...21
1.5
VF
EHB00029
Ι F = 625 mA
V
max
10 1
5
250 mA
1.0
typ.
100 mA
10 0
10 mA
5
0.5
10 -1
5
10 -2
0
50
100
˚C
0.0
150
50
0
100
TA
˚C
150
TA
Forward current IF = ƒ (VF)
Forward current IF = ƒ (T S)
BAS21-03W
BAS 19...21
EHB00028
300
mA
600
200
500
IF
ΙF
800
mA
700
400
150
300
100
200
50
100
0
0.0
0.5
1.0
V
0
0
1.5
15
30
45
60
75
90 105 120 °C
150
TS
VF
3
2007-04-19
BAS21...
Forward current IF = ƒ (T S)
Permissible Puls Load R thJS = ƒ (tp)
BAS21
BAS21U
10 3
250
mA
RthJS
IF
10 2
150
10 1
D = 0.5
0.2
0.1
0.05
0.02
0.01
0.005
0
100
10 0
50
0
0
15
30
45
60
90 105 120 °C
75
10 -1 -6
10
150
10
-5
10
-4
10
-3
10
-2
TS
s
10
0
tP
Permissible Puls Load R thJS = ƒ (tp)
BAS21-03W
Permissible Pulse Load
IFmax / I FDC = ƒ (tp )
BAS21
10 2
10 3
IFmax/IFDC
K/W
10 2
10 1
RthJS
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
D=0.5
0.2
0.1
0.05
0.02
0.01
0.005
0
10 1
10 0
10 0 -6
10
10
-5
10
-4
10
-3
10
-2
s
10
10 -1 -6
10
0
tP
10
-5
10
-4
10
-3
10
-2
s
10
0
tP
4
2007-04-19
BAS21...
Permissible Puls Load R thJS = ƒ (tp)
BAS21U
Permissible Pulse Load
IFmax / I FDC = ƒ (tp )
BAS21-03W
10 2
10 3
K/W
10 1
10 2
RthJS
I Fmax/IFDC
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
10 1
D=0.5
0.2
0.1
0.05
0.02
0.01
0.005
0
10 0
10 0 -6
10
10
-5
10
-4
10
-3
10
-2
s
10
10 -1 -6
10
0
tP
10
-5
10
-4
10
-3
10
-2
s
10
0
tP
Permissible Pulse Load
IFmax / I FDC = ƒ (tp )
BAS21U
IFmax/IFDC
10 2
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
10 1
10 0 -6
10
10
-5
10
-4
10
-3
10
-2
s
10
0
tP
5
2007-04-19
Package SC74
BAS21...
Package Outline
B
1.1 MAX.
1
2
3
0.35 +0.1
-0.05
Pin 1
marking
0.2
B 6x
M
A
0.1 MAX.
0.95
0.2
1.9
1.6 ±0.1
4
10˚ MAX.
5
2.5 ±0.1
6
0.25 ±0.1
0.15 +0.1
-0.06
(0.35)
10˚ MAX.
2.9 ±0.2
(2.25)
M
A
Foot Print
2.9
1.9
0.5
0.95
Marking Layout (Example)
Small variations in positioning of
Date code, Type code and Manufacture are possible.
Manufacturer
2005, June
Date code (Year/Month)
Pin 1 marking
Laser marking
BCW66H
Type code
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
For symmetric types no defined Pin 1 orientation in reel.
0.2
2.7
8
4
Pin 1
marking
3.15
1.15
6
2007-04-19
Package SOD323
BAS21...
Package Outline
0.9 +0.2
-0.1
+0.2
1.25 -0.1
0 ±0.05
A
1.7 +0.2
-0.1
Cathode
marking
0.45 ±0.15
2.5 ±0.2
2
1
0.3 +0.1
-0.05
+0.05
0.3 -0.2
0.15 +0.1
-0.06
0.25 M A
0.8
1.7
0.8
Foot Print
0.6
Marking Layout (Example)
BAR63-03W
Type code
Cathode marking
Laser marking
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
0.2
2
2.9
8
4
Cathode
marking
0.65
1.35
7
1
2007-04-19
Package SOT23
BAS21...
0.4 +0.1
-0.05
1)
2
0.08...0.1
C
0.95
1.3 ±0.1
1
2.4 ±0.15
3
0.1 MAX.
10˚ MAX.
B
1 ±0.1
10˚ MAX.
2.9 ±0.1
0.15 MIN.
Package Outline
A
5
0...8˚
1.9
0.2
0.25 M B C
M
A
1) Lead width can be 0.6 max. in dambar area
Foot Print
0.8
0.9
1.3
0.9
0.8
1.2
Marking Layout (Example)
Manufacturer
EH s
2005, June
Date code (YM)
Pin 1
BCW66
Type code
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
4
0.2
8
2.13
2.65
0.9
Pin 1
1.15
3.15
8
2007-04-19
BAS21...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office ( www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
9
2007-04-19
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