Material Content Data Sheet Sales Product Name IPD50N06S4-09 MA# MA000667628 Package PG-TO252-3-11 Issued 29. August 2013 Weight* 370.39 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 2.120 0.57 0.234 0.06 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.57 5724 5724 633 0.070 0.02 234.187 63.24 63.32 632267 190 633090 2.088 0.56 0.56 5637 5637 1.257 0.34 3393 21.996 5.94 102.436 27.66 33.94 276562 339340 3.740 1.01 1.01 10098 10098 0.091 0.02 0.000 0.00 0.054 0.01 0.043 0.01 2.074 0.56 59385 245 0.02 2. 3. Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 246 117 0.58 Important Remarks: 1. 1 147 5601 5865 1000000