MOTOROLA MMBD2005T1 Switching diode Datasheet

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by MMBD1005LT1/D
SEMICONDUCTOR TECHNICAL DATA

Part of the GreenLine Portfolio of devices with energy–conserving traits.
This switching diode has the following features:
• Very Low Leakage (≤ 500 pA) promotes extended battery life by decreasing energy waste. Guaranteed leakage limit is for each diode in the pair
contingent upon the other diode being in a non–forward–biased condition.
Motorola Preferred Devices
• Offered in four Surface Mount package types
• Available in 8 mm Tape and Reel in quantities of 3,000
MMBD1005LT1
Applications
• ESD Protection
• Reverse Polarity Protection
• Steering Logic
CATHODE
1
ANODE
3
• Medium–Speed Switching
3
1
2
2
CATHODE
CASE 318-07, STYLE 12
SOT-23 (TO-236AB)
MMBD2005T1
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Continuous Reverse Voltage
VR
30
Vdc
Peak Forward Current
IF
200
mAdc
IFM
(surge)
500
mA
Peak Forward Surge Current
3
1
2
CASE 419-02, STYLE 4
SC–70/SOT–323
DEVICE MARKING
MMBD1005LT1 = A3
MMBD2005T1 = DI
MMBD3005T1 = XQ
MMBD3005T1
THERMAL CHARACTERISTICS
Characteristic
Symbol
Total Device Dissipation FR-4 Board (1)
TA = 25°C
MMBD1005LT1, MMBD3005T1
MMBD2005T1
Derate above 25°C MMBD1005LT1, MMBD3005T1
MMBD2005T1
PD
Thermal Resistance Junction to Ambient
MMBD1005LT1, MMBD3005T1
MMBD2005T1
RθJA
Junction and Storage Temperature
Max
mW
225
150
1.8
1.2
TJ, Tstg
3
Unit
2
1
mW/°C
CASE 318D-03, STYLE 5
SC–59
°C/W
556
833
– 55 to +150
°C
(1) Device mounted on a FR-4 glass epoxy printed circuit board using the minimum
recommended footprint.
GreenLine is a trademark of Motorola, Inc.
Thermal Clad is a registered trademark of the Berquist Company.
Preferred devices are Motorola recommended choices for future use and best overall value.
Motorola
Small–Signal Transistors, FETs and Diodes Device Data

Motorola, Inc. 1995
1
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Max
Unit
OFF CHARACTERISTICS
Reverse Breakdown Voltage (IBR = 100 µA)
V(BR)
30
—
V
Reverse Voltage Leakage Current (VR = 75 V)(2)
IR
—
500
pA
Forward Voltage (IF = 1.0 mA)
Forward Voltage (IF = 10 mA)
VF
—
—
850
950
mV
Diode Capacitance (VR = 0 V, f = 1.0 MHz)
CD
—
2.0
pF
Reverse Recovery Time (IF = IR = 10 mA) (Figure 1)
trr
—
3.0
µs
(2) Guaranteed leakage limit is for each diode in the pair contingent upon the other diode being
in a non–forward–biased condition.
820 Ω
+10 V
2k
100 µH
0.1 µF
tr
IF
0.1 µF
tp
t
IF
trr
10%
t
DUT
50 Ω OUTPUT
PULSE
GENERATOR
50 Ω INPUT
SAMPLING
OSCILLOSCOPE
90%
IR
VR
INPUT SIGNAL
iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)
Notes: 1. A 2.0 kΩ variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp » trr
Figure 1. Recovery Time Equivalent Test Circuit
2
Motorola Small–Signal Transistors, FETs and Diodes Device Data
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.037
0.95
0.037
0.95
0.037
0.95
0.037
0.95
0.098-0.118
2.5-3.0
0.079
2.0
0.094
2.4
0.039
1.0
0.035
0.9
0.031
0.8
0.031
0.8
inches
inches
mm
mm
SC–59
SOT–23
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
0.025
0.025
0.65
0.65
0.075
1.9
0.035
0.9
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
0.91
0.036
2.36
0.093
4.19
0.165
1.22
0.048
mm
inches
0.028
0.7
inches
SOD–123
mm
SC–70/SOT–323
POWER DISSIPATION FOR A SURFACE MOUNT DEVICE
The power dissipation for a surface mount device is a
function of the drain/collector pad size. These can vary from
the minimum pad size for soldering to a pad size given for
maximum power dissipation. Power dissipation for a surface
mount device is determined by TJ(max), the maximum rated
junction temperature of the die, RθJA, the thermal resistance
from the device junction to ambient, and the operating
temperature, TA. Using the values provided on the data
sheet, PD can be calculated as follows:
PD =
TJ(max) – TA
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25°C, one can
calculate the power dissipation of the device. For example,
for a SOT–23 device, PD is calculated as follows.
PD = 150°C – 25°C = 225 milliwatts
556°C/W
The 556°C/W for the SOT–23 package assumes the use
of the recommended footprint on a glass epoxy printed circuit
board to achieve a power dissipation of 250 milliwatts. There
are other alternatives to achieving higher power dissipation
from the surface mount packages. One is to increase the
area of the drain/collector pad. By increasing the area of the
drain/collector pad, the power dissipation can be increased.
Although the power dissipation can almost be doubled with
this method, area is taken up on the printed circuit board
which can defeat the purpose of using surface mount
technology.
Another alternative would be to use a ceramic substrate or
an aluminum core board such as Thermal Clad. Using a
board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the same
footprint.
Motorola Small–Signal Transistors, FETs and Diodes Device Data
3
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and soldering
should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference should be a maximum of 10°C.
• The soldering temperature and time should not exceed
260°C for more than 10 seconds.
• When shifting from preheating to soldering, the maximum
temperature gradient should be 5°C or less.
• After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied during
cooling
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones, and a
figure for belt speed. Taken together, these control settings
make up a heating “profile” for that particular circuit board.
On machines controlled by a computer, the computer
remembers these profiles from one operating session to the
next. Figure 8 shows a typical heating profile for use when
soldering a surface mount device to a printed circuit board.
This profile will vary among soldering systems but it is a good
starting point. Factors that can affect the profile include the
type of soldering system in use, density and types of
components on the board, type of solder used, and the type
of board or substrate material being used. This profile shows
temperature versus time. The line on the graph shows the
4
actual temperature that might be experienced on the surface
of a test board at or near a central solder joint. The two
profiles are based on a high density and a low density board.
The Vitronics SMD310 convection/infrared reflow soldering
system was used to generate this profile. The type of solder
used was 62/36/2 Tin Lead Silver with a melting point
between 177 –189°C. When this type of furnace is used for
solder reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
Motorola Small–Signal Transistors, FETs and Diodes Device Data
STEP 1
PREHEAT
ZONE 1
“RAMP”
200°C
STEP 2
STEP 3
VENT
HEATING
“SOAK” ZONES 2 & 5
“RAMP”
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
STEP 5
STEP 4
HEATING
HEATING
ZONES 3 & 6 ZONES 4 & 7
“SPIKE”
“SOAK”
STEP 6 STEP 7
VENT COOLING
205° TO
219°C
PEAK AT
SOLDER
JOINT
170°C
160°C
150°C
150°C
140°C
100°C
100°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 2. Typical Solder Heating Profile
Motorola Small–Signal Transistors, FETs and Diodes Device Data
5
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIUMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
A
L
3
B S
1
2
V
DIM
A
B
C
D
G
H
J
K
L
S
V
G
C
H
D
INCHES
MIN
MAX
0.1102 0.1197
0.0472 0.0551
0.0350 0.0440
0.0150 0.0200
0.0701 0.0807
0.0005 0.0040
0.0034 0.0070
0.0180 0.0236
0.0350 0.0401
0.0830 0.0984
0.0177 0.0236
MILLIMETERS
MIN
MAX
2.80
3.04
1.20
1.40
0.89
1.11
0.37
0.50
1.78
2.04
0.013
0.100
0.085
0.177
0.45
0.60
0.89
1.02
2.10
2.50
0.45
0.60
J
K
STYLE 12:
PIN 1. CATHODE
2. CATHODE
3. ANODE
CASE 318–07
ISSUE AD
SOT–23 (TO–236AB)
A
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3
B
S
1
2
D
V
G
C
0.05 (0.002)
H
R N
J
K
DIM
A
B
C
D
G
H
J
K
L
N
R
S
V
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.035
0.049
0.012
0.016
0.047
0.055
0.000
0.004
0.004
0.010
0.017 REF
0.026 BSC
0.028 REF
0.031
0.039
0.079
0.087
0.012
0.016
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.90
1.25
0.30
0.40
1.20
1.40
0.00
0.10
0.10
0.25
0.425 REF
0.650 BSC
0.700 REF
0.80
1.00
2.00
2.20
0.30
0.40
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. ANODE
CASE 419–02
ISSUE E
SC–70/SOT–323
6
Motorola Small–Signal Transistors, FETs and Diodes Device Data
A
3
2
B
1
D
G
J
C
H
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
L
S
DIM
A
B
C
D
G
H
J
K
L
S
MILLIMETERS
MIN
MAX
2.70
3.10
1.30
1.70
1.00
1.30
0.35
0.50
1.70
2.10
0.013
0.100
0.10
0.26
0.20
0.60
1.25
1.65
2.50
3.00
INCHES
MIN
MAX
0.1063 0.1220
0.0512 0.0669
0.0394 0.0511
0.0138 0.0196
0.0670 0.0826
0.0005 0.0040
0.0040 0.0102
0.0079 0.0236
0.0493 0.0649
0.0985 0.1181
STYLE 5:
PIN 1. CATHODE
2. CATHODE
3. ANODE
K
CASE 318D–03
ISSUE E
SC–59
Motorola Small–Signal Transistors, FETs and Diodes Device Data
7
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8
◊
*MMBD1005LT1/D*
Motorola Small–Signal Transistors, FETs and Diodes
Device Data
MMBD1005LT1/D
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