Datasheet
1.5A Variable/Fixed Output
LDO Regulators
BAxxJC5 Series(Fixed)
BA00JC5WT(Variable)
●General Description
The BAxxJC5 are low-saturation regulators with an output current of 1.5A and a voltage accuracy of ±1%. A broad output
voltage range is offered, from 1.5V to 12V, and built-in overcurrent protection and thermal shutdown (TSD) circuits prevent
damage due to short-circuiting and overloading, respectively.
●Features
Output voltage accuracy: ±1%
Broad output voltage range available: 1.5V -12V
(BAxxJC5 series)
Low saturation-voltage type with PNP output
Built-in overcurrent protection circuit
Built-in thermal shutdown circuit
Integrated shutdown switch (BA00JC5WT)
●Packages
TO220FP-3
TO220FP-5
W (Typ.) x D (Typ.) x H (Max.)
10.00mm x 30.50mm x 4.60mm
10.00mm x 30.50mm x 4.60mm
●Key Specifications
Input Power Supply Voltage:
16.0V(Max.)
Output voltage type: BAxxJC5 Series
Fixed
BA00JC5WT
Variable
Output current:
1.5A(Max.)
Shutdown current: (BA00JC5WT)
0μA(Typ.)
Operating temperature range:
-40℃ to +105℃
TO220FP-5
TO220FP-3
●Applications
All electronic devices that use microcontrollers and
logic circuits
●Lineup Matrix
Output Voltage (V)
Part Number
Package
1.5
1.8
2.5
3.0
3.3
5.0
6.0
6.3
8.0
9.0
12.0
Variable
BAxxJC5T
{
{
{
{
{
{
{
{
{
{
{
-
TO220FP-3
BAxxJC5WT
-
-
-
-
-
-
-
-
-
-
-
{
TO220FP-5
●Ordering Information
B
A
x
x
Output voltage
Part
number 00:Variable
Other:Fixed
J
C
Current
capacity
JC5:1.5A
5
x
x
Shutdown
switch
-
Package
T
W : Include
：TO220FP-3
Packaging and forming specification
None:Tube Contener
TO220FP-5
None:without
○Product structure：Silicon monolithic integrated circuit
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TSZ22111･14･001
○This product is not designed protection against radioactive rays.
1/13
TSZ02201-0R6R0A600140-1-2
14.Feb.2012 Rev.001
BAxxJC5 Series(Fixed)
●Lineup
Maximum output
current (Max.)
Shutdown
Switch
Output
voltage(Typ.)
1.5 V
1.8 V
2.5 V
3.0 V
3.3 V
5.0 V
6.0 V
6.3 V
8.0 V
9.0 V
12.0 V
Variable
Package
No Switch
TO220FP-3
With Switch
TO220FP-5
1.5A
Datasheet
BA00JC5WT(Variable)
Tube of 500
Orderable
Part Number
BA15JC5T
BA18JC5T
BA25JC5T
BA30JC5T
BA33JC5T
BA50JC5T
BA60JC5T
BA63JC5T
BA80JC5T
BA90JC5T
BAJ2JC5T
BA00JC5WT
●Block Diagrams / Standard Example Application Circuits / Pin Configurations / Pin Descriptions
[BAxxJC5T]
TOP VIEW
Vcc
Vref
Driver
TSD
1
Pin name
Function
1
Vcc
Power supply voltage input
2
GND
GND
3
OUT
Voltage output
OCP
2
Vcc
Pin No.
3
GND
OUT
PIN
Vcc
1 2 3
0.33μF
22μF
TO220FP-3
External capacit setting range
Vcc (1 Pin）
Approximately 0.33μF
OUT (3 Pin)
22μF to 1000μF
Fig.1
[BA00JC5WT]
Vcc
Vref
Driver
TSD
1
CTL
2
Vcc
TOP VIEW
Pin No.
1
2
3
4
5
Pin name
CTL
Vcc
GND
OUT
C
Function
Output voltage on/off control
Power supply voltage input
GND
Voltage output
ADJ pin
OCP
3
GND
4
OUT
5
PIN
Vcc (2 Pin)
OUT (4 Pin)
C
R2
R1
External capacit setting range
Approximately 0.33μF
22μF to 1000μF
1 23 4 5
Vcc
22μF
0.33μF
TO220FP-5
Fig.2
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TSZ02201-0R6R0A600140-1-2
14.Feb.2012 Rev.001
BAxxJC5 Series(Fixed)
Datasheet
BA00JC5WT(Variable)
●Absolute Maximum Ratings (Ta = 25℃)
Parameter
Symbol
Ratings
Unit
VCC
18*1
V
Power supply voltage
Power dissipation
TO220FP-3
2000*2
Pd
TO220FP-5
mW
2000*2
Operating temperature range
Topr
−40 to +105
℃
Ambient storage temperature
Tstg
−55 to +150
℃
Tjmax
150
℃
Maximum junction temperature
*1
*2
Must not exceed Pd
Derated at 16mW/℃ at Ta>25℃
●Recommended Operating Ratings
Parameter
Ratings
Symbol
Input power supply voltage
VCC*3
Input power supply voltage
*4
Max.
16.0
Unit
V
Vo + 1.0
16.0
V
Output current
Io
-
1.5
A
Variable output voltage setting value
Vo
1.5
12
V
*3
*4
VCC
Min.
3.0
When output voltage is 1.5 V, 1.8 V, or 2.5 V.
When output voltage is 3.0 V or higher.
●Electrical Characteristics
BAxxJC5T
Unless otherwise specified, Ta=25℃, Vcc=3.3V(Vo=1.5V,1.8V,2.5V), Vcc=5.0V(Vo=3.0V,3.3V), Vcc=Vo+3.0V(Vo≧5.0V)
Parameter
Symbol
ΔVd
0.3
Max
0.9
Vo(T)×
1.01
0.5
Io
1.5
－
－
44
55
－
43
53
－
42
52
－
40
50
－
Bias Current
Ib
Output Voltage
Vo
Dropout Voltage *5
Peak Output Current
Limit
Typ
0.5
Min
－
Vo(T)×
0.99
－
Vo(T)
Unit
mA
Conditions
Io=0mA
V
Io=200mA
V
Io=500mA, Vcc=Vo×0.95V
A
Line Regulation *6
Reg.I
－
5
60
mV
f=120Hz, ein*8=-20dBV
Io=100mA, Vo≦6.3V
f=120Hz, ein*8=-20dBV
Io=100mA, Vo=8.0V
f=120Hz, ein*8=-20dBV
Io=100mA, Vo=9.0V
f=120Hz, ein*8=-20dBV
Io=100mA, Vo=12.0V
Vcc=Vo+1.0V→16V, Io=200mA
Load Regulation
Reg.L
－
5
60
mV
Io=5mA→1.5A
Tcvo
－
±0.02
－
%/℃
Ios
－
－
0.7
0.8
－
－
A
Ripple Rejection
Temperature Coefficient of
Output Voltage *7
Output Short Current
R.R.
dB
Io=5mA,Tj=0 to 125℃
Vcc=16V(Vo≦3.3V)
Vcc=16V(Vo≧5.0V)
Vo(T): Output Voltage
*5 Vo≧3.3V
*6 Vcc=3.0V→16V（Vo=1.5V, 1.8V, 2.5V）
*7 Not 100% tested
*8 ein=Input Voltage Ripple
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TSZ02201-0R6R0A600140-1-2
14.Feb.2012 Rev.001
BAxxJC5 Series(Fixed)
Datasheet
BA00JC5WT(Variable)
●Electrical Characteristics - continued
BA00JC5WT
Unless otherwise specified, Ta = 25℃, Vcc = 3.3 V, VCTL = 3 V, Vo=2.5V
Parameter
Symbol
Limit
Unit
Shut Down Current
Isd
Bias Current
Ib
－
0.5
0.9
mA
Io=0mA
C pin Voltage
Vc
ΔVd
1.237
－
1.250
1.263
Io=50mA
Io
1.5
0.3
－
0.5
－
V
V
R.R.
45
55
－
Dropout Voltage1
Peak Output
Typ.
Max.
0
10
μA
Conditions
Min.
－
VCTL=0V, Io=0mA (OFF MODE)
Io=500mA, Vcc=2.5V
A
Line Regulation
Reg.I
－
5
60
mV
f=120Hz, ein*9=-20dBV
Io=100mA
Vcc=4.5V→16V, Io=200mA
Load Regulation
Temperature Coefficient of
Output Voltage *10
Output Short Current
Reg.L
－
5
60
mV
Io=5mA→1.5A
Tcvo
－
±0.02
－
%/℃
0.6
－
－
Ａ
Vcc=16V
－
V
ACTIVE MODE, Io=0mA
Ripple Rejection
Ios
－
CTL ON Mode Voltage
Vth1
CTL OFF Mode Voltage
Vth2
2.0
－
Iin
40
CTL Input Current
dB
－
0.8
V
80
130
μA
Io=5mA,Tj=0～125℃
OFF MODE, Io=0mA
Io=0mA
*9 ein=Input Voltage Ripple
*10 Not 100% tested
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TSZ02201-0R6R0A600140-1-2
14.Feb.2012 Rev.001
BAxxJC5 Series(Fixed)
Datasheet
BA00JC5WT(Variable)
●Typical Performance Curves
(Unless otherwise specified, Ta = 25℃; Vcc = 8V; VCTL = 3V; IO = 0mA)
Fig.4
Input Stability (Io=0mA)
Fig.3
Circuit Current
Fig.6
Load Stability
Fig.5
Input Stability
(Io = 1.5 A)
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5/13
TSZ02201-0R6R0A600140-1-2
14.Feb.2012 Rev.001
BAxxJC5 Series(Fixed)
Datasheet
BA00JC5WT(Variable)
Δ
●Typical Performance Curves - continued
Fig.7
I/O Voltage Difference
Fig.8
Ripple Rejection
Fig.9
Output Voltage vs Temperature
Fig.10
Circuit Current Temperature
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6/13
TSZ02201-0R6R0A600140-1-2
14.Feb.2012 Rev.001
BAxxJC5 Series(Fixed)
Datasheet
BA00JC5WT(Variable)
●Typical Performance Curves - continued
Fig.12
CTL Voltage vs Output Voltage
Fig.11
Circuit Current Classified by Load
Fig.13
CTL Voltage vs CTL Current
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TSZ22111･15･001
Fig.14
Thermal Shutdown Circuit
(Io = 5 mA)
7/13
TSZ02201-0R6R0A600140-1-2
14.Feb.2012 Rev.001
BAxxJC5 Series(Fixed)
Datasheet
BA00JC5WT(Variable)
●I/O equivalence circuit
Vcc
* For the BA00JC5WT, connect R1 and R2
externally between the ADJ and GND pins
and between the OUT and ADJ pins.
Vcc
27kΩ
CTL
2kΩ
OUT
R2
31kΩ
Equation: VO = Vc × (R1 + R2) / R1
(Vc = 1.25V (Typ.))
The recommended R1 value is approximately
30 kΩ to 150 kΩ.
R1
Fig.16
Fig.15
●Power Dissipation
• TO220FP-3/TO220FP-5
POWER DISSIPATION：Pd [W]
25
(1) When using an infinite heat sink.
θj-c = 6.25 (°C/W)
(1)20.0
20
(2) During IC without heat sink operation.
θj-a = 62.5 (°C/W)
15
10
5
(2)2.0
0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE：Ta [°C]
Fig.17
The characteristics of the IC are greatly influenced by the operating temperature. If the temperature exceeds the maximum
junction temperature Tjmax, deterioration or damage may occur. Implement proper thermal designs to ensure that power
dissipation is within the permissible range in order to prevent instantaneous damage resulting from heat and maintain the
reliability of the IC for long-term operation.
The following method is used to calculate the power consumption Pc (W):
Pc = (Vcc – Vo) × Io + Vcc × Icca
Power dissipation Pd ≥ Pc
The load current Io is calculated:
Io ≤
Pd − Vcc × Icca
Vcc − Vo
Vcc
Vo
IO
Icca
: Input voltage
: Output current
: Load current
: Circuit current
Calculation Example:
Vcc = 6.0V and Vo = 5.0V at Ta = 85℃
Io ≤
1.040 − 6.0 × Icca
6.0 − 5.0
θja = 62.5°C/W → −16.0mW/°C
25°C = 2000mW → 85°C = 1040mW
Io ≤ 860mA (Icca ≈ 30mA)
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8/13
TSZ02201-0R6R0A600140-1-2
14.Feb.2012 Rev.001
BAxxJC5 Series(Fixed)
Datasheet
BA00JC5WT(Variable)
Refer to the above and implement proper thermal designs so that the IC will not be used under excessive power dissipation
conditions under the entire operating temperature range.
The power consumption Pc of the IC in the event of shorting (i.e. the Vo and GND pins are shorted) can be obtained from
the following equation: Pc = Vcc × (Icca + Ishort) (Ishort: short current)
●Peripheral Circuit Considerations
• Vcc pin
Insert a capacitor (0.33 μF approx.) between VCC and GND.
The capacitance will vary depending on the application.
Use a suitable capacitance and implement designs with sufficient margins.
• GND pin
Verify that there is no potential difference between the ground of the application board and the IC.
If there is a potential difference, the set voltage will not be output accurately, resulting in unstable IC operation.
Therefore, lower the impedance by designing the ground pattern as wide and as short as possible.
• CTL terminal
The CTL terminal turns on at an operating power supply voltage of 2.0 V or higher and turns off at 0.8 V or lower.
There is no particular order when turning the power supply and CTL terminals on or off.
CTL
27 kΩ
2 kΩ
31 kΩ
Fig.18 Input Equivalent Circuit
●Vo Terminal
Insert a capacitor between the Vo and GND pins in order to prevent output oscillation.
10.0
Oscillation region
2.0
OUT
IC
22 μF
ESR [Ω]
1.0
0.5
Stable region
0.2
0.1
0.075
0.05
0
Fig.19 Output Equivalent Circuit
200
Oscillation region
400 600 800
1000 Io [mA]
Fig.20 IO vs. ESR
The capacitance may vary greatly with temperature changes, thus making it impossible to completely prevent oscillation.
Therefore, use a tantalum aluminum electrolytic capacitor with a low ESR (Equivalent Serial Resistance). The output will
oscillate if the ESR is too high or too low, so refer to the ESR characteristics in Fig.20 and operate the IC within the stable
region. Use a capacitor within a capacitance between 22μF and 1,000μF.
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9/13
TSZ02201-0R6R0A600140-1-2
14.Feb.2012 Rev.001
BAxxJC5 Series(Fixed)
BA00JC5WT(Variable)
Datasheet
●Operational Notes
1. Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc.,
can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open
circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection
devices, such as fuses.
2.
GND voltage
The potential of GND pin must be minimum potential in all operating conditions.
3.
Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
4.
Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
5.
Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
6.
Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to
stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting
it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an
antistatic measure. Use similar precaution when transporting or storing the IC.
7.
Regarding input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated.P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example, the relation between each potential is as follows:
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes
operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should
8.
Ground Wiring Pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change
the GND wiring pattern of any external components, either.
9.
Thermal shutdown circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is
designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its
operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation
of this circuit is assumed.
10. Overcurrent Protection Circuit
An overcurrent protection circuit is incorporated in order to prevention destruction due to short-time overload currents.
Continued use of the protection circuits should be avoided. Please note that the current increases negatively impact the
temperature.
11. Damage to the internal circuit or element may occur when the polarity of the Vcc pin is opposite to that of the other
pins in applications. (I.e. Vcc is shorted with the GND pin while an external capacitor is charged.) Use a maximum
capacitance of 1000μF for the output pins. Inserting a diode to prevent back-current flow in series with Vcc or bypass
diodes between Vcc and each pin is recommended.
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10/13
TSZ02201-0R6R0A600140-1-2
14.Feb.2012 Rev.001
Datasheet
BA00JC5WT(Variable)
Resistor
抵抗
Bypass Diode
Transistor
(NPN)
トランジスタ(NPN)
B
（端子A）
A）
（Pin
（端子
（Pin B）
B）
C
～
～
Back current prevention diode
(Pin B)
～
～
BAxxJC5 Series(Fixed)
C
E
～
～
B
GND
VCC
P＋
N
N
Fig.21 Bypass Diode
Parasitic elements or
transistors
Ｎ
N
N
Parasitic
element
寄生素子
GND
P＋
N
N
Ｎ
N
PPsubstrate
基板
Ｐ
P
P＋
(Pin A)
～
～
P
P＋
Output pin
P substrate
P 基板
Parasitic element
E
GND
N
Parasitic element
GND
GND
Fig.22 Example of Simple Bipolar IC Architecture
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
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TSZ02201-0R6R0A600140-1-2
14.Feb.2012 Rev.001
BAxxJC5 Series(Fixed)
Datasheet
BA00JC5WT(Variable)
●Physical Dimension Tape and Reel Information
TO220FP-3
<Tape and Reel information>
+0.3
4.5 −0.1
7.0 +0.3
−0.1
+0.2
2.8 −0.1
φ3.2±0.1
Container
Tube
Quantity
500pcs
Direction of feed
Direction of products is fixed in a container tube
5.0±0.2
8.0±0.2
+0.4
17.0 −0.2
13.5Min.
12.0±0.2
1.8±0.2
+0.3
10.0 −0.1
1.3
0.8
2.54±0.5
2.54±0.5
0.55 +0.1
−0.05
2.6±0.5
1 2 3
∗ Order quantity needs to be multiple of the minimum quantity.
(Unit : mm)
<Tape and Reel information>
+0.3
4.5 −0.1
+0.2
2.8 −0.1
φ3.2±0.1
Container
Tube
Quantity
500pcs
Direction of feed
Direction of products is fixed in a container tube
8.0±0.2
0.7
12.0±0.2
+0.3
10.0−0.1
+0.3
7.0 −0.1
13.5Min.
+0.4
17.0 −0.2
1.8±0.2
TO220FP-5
1.2
0.8
1.778
0.5±0.1
2.85
1 2 3 4 5
∗ Order quantity needs to be multiple of the minimum quantity.
(Unit : mm)
●Marking Diagrams
TO220FP-3 (TOP VIEW)
Orderable
Part Number
BA15JC5T
BA18JC5T
BA25JC5T
BA30JC5T
BA33JC5T
BA50JC5T
BA60JC5T
BA63JC5T
BA80JC5T
BA90JC5T
BAJ2JC5T
BA00JC5WT
TO220FP-5 (TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
Package
Part Number Marking
TO220FP-3
BA15JC5
BA18JC5
BA25JC5
BA30JC5
BA33JC5
BA50JC5
BA60JC5
BA63JC5
BA80JC5
BA90JC5
BAJ2JC5
00JC5W
TO220FP-5
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12/13
TSZ02201-0R6R0A600140-1-2
14.Feb.2012 Rev.001
BAxxJC5 Series(Fixed)
Datasheet
BA00JC5WT(Variable)
●Revision History
Date
Revision
26.Jun.2012
001
Changes
New Release
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TSZ02201-0R6R0A600140-1-2
14.Feb.2012 Rev.001
Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.