NB3W1900L 3.3 V 100/133 MHz Differential 1:19 HCSL-Compatible Push‐Pull Clock ZDB/Fanout Buffer for PCIe[ www.onsemi.com Description The NB3W1900L differential clock buffers are designed to work in conjunction with a PCIe compliant source clock synthesizer to provide point-to-point clocks to multiple agents. The device is capable of distributing the reference clocks for Intel® QuickPath Interconnect (Intel QPI), PCIe Gen1/Gen2/Gen3.The NB3W1900L internal PLL is optimized to support 100MHz and 133 MHz frequency operation. The NB3W1900L is developed with the low-power NMOS Push-Pull buffer type. Features • • • • • • • • • • • • • • • • July, 2016 − Rev. 1 QFN72 MN SUFFIX CASE 485DK MARKING DIAGRAM 1 19 Low Power Differential Clock Output Pairs @ 0.7 V Output-to-Output Skew Performance: < 85 ps Cycle-to-Cycle Jitter (PLL Mode): < 50ps Low Phase Jitter (Intel QPI, PCIe Gen 2/Gen 3 Phase Jitter Compliant) Input-to-Output Delay Variation: < 50 ps Fixed-Feedback for Lowest Input-to-Output Delay Variation Spread Spectrum Compatible; Tracks Input Clock Spreading for Low EMI 100 MHz and 133 MHz PLL Mode to Meet the Next Generation PCIe Gen2 / Gen 3 and Intel QPI Phase Jitter Individual OE Control via SMBus Low-Power NMOS Push-Pull HCSL−Compatible Outputs PLL Configurable for PLL Mode or Bypass Mode (Fanout Operation) SMBus Address Configurable to Allow Multiple Buffers in a Single Control Network Programmable PLL Bandwidth Two Tri-level Addresses Selection (Nine SMBus Addresses) QFN 72-pin Package, 10 mm × 10 mm These are Pb-Free Devices © Semiconductor Components Industries, LLC, 2016 1 72 1 NB3W 1900L AWLYYWWG A WL YY WW G = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package ORDERING INFORMATION See detailed ordering and shipping information on page 19 of this data sheet. Publication Order Number: NB3W1900L/D NB3W1900L FBOUT_NC FBOUT_NC# SSC Compatible PLL CLK_IN DIF[18:0] MUX DIF[18:0]# CLK_IN# 100M_133M# HBW_BYP_LBW# SA_0 Control Logic SA_1 PWRGD/PWRDN# SDA SCL DIF13# DIF13 VDDIO GND DIF14 DIF14# DIF15 DIF15# GND VDD DIF16 DIF16# DIF17 DIF17# VDDIO 55 GND 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 DIF18 DIF18# Figure 1. Simplified Block Diagram VDDA 1 54 DIF12# GNDA 2 53 DIF12 100M_133M# 3 52 VDDIO HBW_BYP_LBW# 4 51 GND PWRGD/PWRDN# 5 50 DIF11# GND 6 49 DIF11 VDDR 7 48 DIF10# CLK_IN 8 47 DIF10 CLK_IN# 9 46 GND SA_0 10 45 VDD SDA 11 44 DIF9# SCL 12 43 DIF9 SA_1 13 42 DIF8# FBOUT_NC# 14 41 DIF8 FBOUT_NC 15 40 VDDIO GND 16 39 GND DIF0 17 38 DIF7# DIF0# 18 37 DIF7 NB3W1900L Figure 2. Pin Configuration (Top View) www.onsemi.com 2 DIF6# DIF6 GND VDDIO DIF5# DIF5 DIF4# DIF4 VDD GND DIF3# DIF3 DIF2# DIF2 GND VDDIO DIF1 DIF1# 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 NB3W1900L Table 1. POWER DOWN PIN TABLE Inputs Control Bits Outputs CLK_IN / CLK_IN# SMBus EN Bit DIFx / DIFx# FBOUT_NC / FBOUT_NC# PLL Stage 0 X X Low/Low Low/Low OFF 1 Running 0 Low/Low Running ON 1 Running Running ON PWRGD/PWRDN# Table 2. POWER CONNECTIONS Pin Number VDD VDDIO VDDR GND Description 7 2 Analog Input 6 Analog PLL 16, 22, 27, 34, 39, 46, 51, 58, 63, 70 DIF clocks 1 28, 45, 64 21, 33, 40, 52, 57, 69 Table 3. TRI-LEVEL INPUT THRESHOLDS Table 5. PLL OPERATING MODE Level Voltage HBW_BYP_LBW# MODE Low < 0.8 V Low PLL Lo BW Mid 1.2 < Vin < 1.8 V Mid Bypass High Vin > 2.2 V High PLL Hi BW NOTE: PLL is OFF in Bypass Table 4. FUNCTIONALITY AT POWER-UP (PLL Mode) Table 6. MODE TRI−LEVEL INPUT THRESHOLD CLK_IN DIFx 100M_133M# MHz MHz Level Voltage 1 100.00 CLK_IN Low < 0.8 V 0 133.33 CLK_IN Mid 1.2 < Vin < 1.8 V High Vin > 2.2 V www.onsemi.com 3 NB3W1900L Table 7. NB3W1900L PIN DESCRIPTIONS Pin Number Pin Name Type 1 VDDA PWR 3.3 V Power Supply for PLL core. 2 GNDA GND Ground for PLL core. 3 100M_133M# IN Input to select operating frequency. See functionality table for definition. 4 HBW_BYP_LBW# IN Tri-level input to select High BW, Bypass or low BW mode. See PLL operating mode table for definition. 5 PWRGD/PWRDN# IN Notifies device to sample latched inputs and start up on first high assertion, or exit power down mode on subsequent assertions. Low enters power down mode. 6 GND GND Ground pin 7 VDDR PWR 3.3 V power for differential input clock (receiver). This VDD should be treated as an analog power rail and filtered appropriately. 8 CLK_IN IN 0.7 V differential true input Description 9 CLK_IN# IN 0.7 V differential complementary input 10 SA_0 IN SMBus address bit. This is a tri-level input that works in conjunction with the SA_1 to decode 1 of 9 SMBus addresses. 11 SDA I/O Data pin of SMBus circuitry, 5 V tolerant 12 SCL IN Clock pin of SMBus circuitry, 5 V tolerant 13 SA_1 IN SMBus address bit. This is a tri-level input that works in conjunction with the SA_0 to decode 1 of 9 SMBus addresses. 14 FBOUT_NC# OUT Complementary half of differential feedback output. This pin should NOT be connected to anything outside the chip. It exists to provide delay path matching to get 0 ps propagation delay. 15 FBOUT_NC OUT True half of differential feedback output. This pin should NOT be connected to anything outside the chip. It exists to provide delay path matching to get 0 propagation delay. 16 GND GND Ground pin 17 DIF0 OUT 0.7 V differential true clock output 18 DIF0# OUT 0.7 V differential complementary clock output 19 DIF1 OUT 0.7 V differential true clock output 20 DIF1# OUT 0.7 V differential complementary clock output 21 VDDIO PWR Power supply for differential outputs 22 GND GND Ground pin 23 DIF2 OUT 0.7 V differential true clock output 24 DIF2# OUT 0.7 V differential complementary clock output 25 DIF3 OUT 0.7 V differential true clock output 26 DIF3# OUT 0.7 V differential complementary clock output 27 GND GND Ground pin 28 VDD PWR Power supply nominal 3.3 V 29 DIF4 OUT 0.7 V differential true clock output 30 DIF4# OUT 0.7 V differential complementary clock output 31 DIF5 OUT 0.7 V differential true clock output 32 DIF5# OUT 0.7 V differential complementary clock output 33 VDDIO PWR Power supply for differential outputs 34 GND GND Ground pin 35 DIF6 OUT 0.7 V differential true clock output 1. All VDD, VDDR, VDDIO,VDDA and GND pins must be externally connected to a power supply for proper operation. www.onsemi.com 4 NB3W1900L Table 7. NB3W1900L PIN DESCRIPTIONS (continued) Pin Number Pin Name Type Description 36 DIF6# OUT 0.7 V differential complementary clock output 37 DIF7 OUT 0.7 V differential true clock output 38 DIF7# OUT 0.7 V differential complementary clock output 39 GND GND Ground pin 40 VDDIO PWR Power supply for differential outputs 41 DIF8 OUT 0.7 V differential true clock output 42 DIF8# OUT 0.7 V differential complementary clock output 43 DIF9 OUT 0.7 V differential true clock output 44 DIF9# OUT 0.7 V differential complementary clock output 45 VDD PWR Power supply nominal 3.3 V 46 GND GND Ground pin 47 DIF10 OUT 0.7 V differential true clock output 48 DIF10# OUT 0.7 V differential complementary clock output 49 DIF11 OUT 0.7 V differential true clock output 50 DIF11# OUT 0.7 V differential complementary clock output 51 GND GND Ground pin 52 VDDIO PWR Power supply for differential outputs 53 DIF12 OUT 0.7 V differential true clock output 54 DIF12# OUT 0.7 V differential complementary clock output 55 DIF13 OUT 0.7 V differential true clock output 56 DIF13# OUT 0.7 V differential complementary clock output 57 VDDIO PWR Power supply for differential outputs 58 GND GND Ground pin 59 DIF14 OUT 0.7 V differential true clock output 60 DIF14# OUT 0.7 V differential complementary clock output 61 DIF15 OUT 0.7 V differential true clock output 62 DIF15# OUT 0.7 V differential complementary clock output 63 GND GND Ground pin 64 VDD PWR Power supply nominal 3.3 V 65 DIF16 OUT 0.7 V differential true clock output 66 DIF16# OUT 0.7 V differential complementary clock output 67 DIF17 OUT 0.7 V differential true clock output 68 DIF17# OUT 0.7 V differential complementary clock output 69 VDDIO PWR Power supply for differential outputs 70 GND GND Ground pin 71 DIF18 OUT 0.7 V differential true clock output 72 DIF18# OUT 0.7 V differential complementary clock output EP Exposed Pad Thermal The Exposed Pad (EP) on the QFN-72 package bottom is thermally connected to the die for improved heat transfer out of package. The exposed pad must be attached to a heat-sinking conduit. The pad is electrically connected to the die, and must be electrically and thermally connected to GND on the PC board. 1. All VDD, VDDR, VDDIO,VDDA and GND pins must be externally connected to a power supply for proper operation. www.onsemi.com 5 NB3W1900L Table 8. ABSOLUTE MAXIMUM RATINGS (Note 2) Symbol Max Unit VDD / VDDA / VDDR 3.3 V Core Supply Voltage (Note 3) Parameter Conditions Min Typ 4.6 V VDD / VDDIO 3.3 V Logic and Output Supply Voltage (Note 3) 4.6 V VIH Input High Voltage Except for SMBus Interface VDD + 0.5 V VIH VIHSMB SMBus Clock and Data Pins 5.5 V VIL Input Low Voltage GND − 0.5 − V Ts Storage Temperature −65 150 °C TJ Junction Temperature 125 °C ESD prot. ESD Protection (Human Body) Human Body Model qJA Thermal Resistance Junction−to−Ambient qJC Thermal Resistance Junction−to−Case V 2000 Still air 18.1 °C/W 5.0 °C/W Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 2. Guaranteed by design and characterization, not tested in production. 3. Operation under these conditions is neither implied nor guaranteed. Table 9. ELECTRICAL CHARACTERISTICS − CLOCK INPUT PARAMETERS (TA = 0°C − 70°C; Supply Voltage VDD/VDDA = 3.3 V ±5%, VDDIO = 1.05 to 3.3 V ±5%. See Test Loads for Loading Conditions) (Note 4) Parameter Symbol Conditions Min Typ Max Unit VIHDIF Input High Voltage − CLK_IN Differential Inputs (single-ended measurement) 600 1150 mV VILDIF Input Low Voltage − CLK_IN Differential Inputs (single-ended measurement) VSS − 300 300 mV VCOM Input Common Mode Voltage − CLK_IN (not spec’d) Common Mode Input Voltage 300 1000 mV Peak to Peak Value 300 1450 mV Input Slew Rate − CLK_IN (Note 5) Measured Differentially 0.4 8 V/ns IIN Input Leakage Current VIN = VDD, VIN = GND −5 5 mA dtin Input Duty Cycle Measurement from Differential Waveform 45 55 % Differential Measurement 0 125 ps VSWING dv/dt JDIFIn Input Amplitude − CLK_IN not spec’d Input Jitter − Cycle to Cycle Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Guaranteed by design and characterization, not tested in production. 5. Slew rate measured through ±75 mV window centered around differential zero Table 10. ELECTRICAL CHARACTERISTICS−INPUT/SUPPLY/COMMON OUTPUT PARAMETERS (TA = 0°C − 70°C; Supply Voltage VDD/VDDA = 3.3 V ±5%, VDDIO = 1.05 V to 3.3 V ±5%. See Test Loads for Loading Conditions) (Note 6) Symbol Parameter Conditions Min Typ Max Unit VIH Input High Voltage Single-ended inputs, except SMBus, low threshold and tri-level inputs 2 VDD + 0.3 V VIL Input Low Voltage Single-ended inputs, except SMBus, low threshold and tri−level inputs GND − 0.3 0.8 V IIN Input Current Single-ended inputs, VIN = GND, VIN = VDD −5 5 mA VIH_FS Input High Voltage (Note 7) 0.7 VDD + 0.3 V VIL_FS Input Low Voltage (Note 7) GND − 0.3 0.35 V www.onsemi.com 6 NB3W1900L Table 10. ELECTRICAL CHARACTERISTICS−INPUT/SUPPLY/COMMON OUTPUT PARAMETERS (continued) (TA = 0°C − 70°C; Supply Voltage VDD/VDDA = 3.3 V ±5%, VDDIO = 1.05 V to 3.3 V ±5%. See Test Loads for Loading Conditions) (Note 6) Symbol Conditions Min VDD = 3.3 V, Bypass mode (Note 8) 33 Fipll VDD = 3.3 V, 100.00 MHz PLL mode (Note 8) 99 Fipll VDD = 3.3 V, 133.33 MHz PLL mode (Note 8) 132.33 Fibyp Parameter Input Frequency Lpin Pin Inductance CIN Capacitance Typ Max Unit 150 MHz 100.00 101 MHz 133.33 134.33 MHz 7 nH Logic Inputs, except CLK_IN 1.5 5 pF CINCLK_IN CLK_IN differential clock inputs (Note 10) 1.5 2.7 pF COUT Output pin capacitance 6 pF From VDD Power-Up and after input clock stabilization or de-assertion of PD# to 1st clock 1 ms TSTAB Clk Stabilization (Note 8) fMODIN Input SS Modulation Frequency tLATOE# OE# Latency tDRVPD Tdrive_PD# (Note 9) Allowable Frequency (Triangular Modulation) 30 33 kHz DIF start after OE# assertion DIF stop after OE# de-assertion 4 12 clocks DIF output enable after PD# de-assertion 300 ms 5 ns tF Tfall (Note 8) Fall time of control inputs tR Trise (Note 8) Rise time of control inputs VILSMB SMBus Input Low Voltage VIHSMB SMBus Input High Voltage VOLSMB SMBus Output Low Voltage 2.1 @ IPULLUP IPULLUP SMBus Sink Current @ VOL 4 VDDSMB Nominal Bus Voltage 3 V to 5 V ±10% 2.7 tRSMB SCL/SDA Rise Time tFSMB SCL/SDA Fall Time fMAXSMB SMBus Operating Frequency (Note 11) 5 ns 0.8 V VDDSMB V 0.4 V mA 5.5 V (Max VIL − 0.15) to (Min VIH + 0.15) 1000 ns (Min VIH + 0.15) to (Max VIL − 0.15) 300 ns Maximum SMBus operating frequency 100 kHz Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 6. Guaranteed by design and characterization, not tested in production. 7. 100M_133M# Frequency Select (FS). 8. Control input must be monotonic from 20% to 80% of input swing. 9. Time from de-assertion until outputs are > 200 mV 10. CLK_IN input 11. The differential input clock must be running for the SMBus to be active www.onsemi.com 7 NB3W1900L Table 11. ELECTRICAL CHARACTERISTICS − DIF 0.7 V LOW POWER DIFFERENTIAL OUTPUTS (TA = 0°C − 70°C; Supply Voltage VDD/VDDA = 3.3 V ±5%, VDDIO = 1.05 V to 3.3 V ±5%. See Test Loads for Loading Conditions) (Note 12) Parameter Symbol dV/dt DdV/dt Slew Rate (Notes 13, 14) Conditions Min Scope averaging on Typ Max Unit 1 4 V/ns Slew Rate Matching (Notes 13, 15) Slew rate matching, Scope averaging on 20 % VHigh Voltage High 660 850 mV VLow Voltage Low Statistical measurement on single-ended signal using oscilloscope math function. (Scope averaging on) −150 150 Vmax Max Voltage Vmin Min Voltage Measurement on single ended signal using Absolute value. (Scope averaging off) −300 Vswing (Note 13) Scope averaging off 300 Vcross_abs Crossing Voltage (abs) (Note 16) Scope averaging off 250 DVcross Crossing Voltage (var) (Note 17) Scope averaging off Vswing 1150 mV mV 550 mV 140 mV Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 12. Guaranteed by design and characterization, not tested in production. CL = 2 pF with RS = 33 W for Zo = 50 W (100 W differential trace impedance). 13. Measured from differential waveform 14. Slew rate is measured through the Vswing voltage range centered around differential 0 V. This results in a ±150 mV window around differential 0 V. 15. Matching applies to rising edge rate for Clock and falling edge rate for Clock#. It is measured using a ±75 mV window centered on the average cross point where Clock rising meets Clock# falling. The median cross point is used to calculate the voltage thresholds the oscilloscope is to use for the edge rate calculations. 16. Vcross is defined as voltage where Clock = Clock# measured on a component test board and only applies to the differential rising edge (i.e. Clock rising and Clock# falling). 17. The total variation of all Vcross measurements in any particular system. Note that this is a subset of Vcross_min/max (Vcross absolute) allowed. The intent is to limit Vcross induced modulation by setting DVcross to be smaller than Vcross absolute. www.onsemi.com 8 NB3W1900L Table 12. ELECTRICAL CHARACTERISTICS − CURRENT CONSUMPTION (TA = 0°C − 70°C; Supply Voltage VDD/VDDA = 3.3 V ±5%, VDDIO = 1.05 V to 3.3 V ±5%. See Test Loads for Loading Conditions) (Note 18) Max Unit All outputs @ 100.00 MHz, CL = 2 pF; Zo = 85 W 50 mA IDDVDDA/R All outputs @ 100.00 MHz, CL = 2 pF; Zo = 85 W 30 mA IDDVDDIO All outputs @ 100.00 MHz, CL = 2 pF; Zo = 85 W 200 mA All differential pairs low/low 4 mA Symbol IDDVDD IDDVDDPD Parameter Operating Supply Current Powerdown Current (Note 19) Conditions Min Typ IDDVDDA/RPD All differential pairs low/low 5 mA IDDVDDIOPD All differential pairs low/low 0.2 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 18. Guaranteed by design and characterization, not tested in production. 19. With input clock running. Stopping the input clock will result in lower numbers. Table 13. ELECTRICAL CHARACTERISTICS − SKEW AND DIFFERENTIAL JITTER PARAMETERS (TA = 0°C − 70°C; Supply Voltage VDD/VDDA = 3.3 V ±5%, VDDIO = 1.05 to 3.3 V ±5%. See Test Loads for Loading Conditions) Symbol Parameter Conditions Min Typ Max Unit tSPO_PLL CLK_IN, DIF[x:0] (Notes 20, 21, 23, 24 and 27) Input-to-Output Skew in PLL mode nominal value @ 25°C, 3.3 V −100 100 ps tPD_BYP CLK_IN, DIF[x:0] (Notes 20, 21, 22, 24 and 27) Input-to-Output Skew in Bypass mode nominal value @ 25°C, 3.3 V 2.5 4.5 ns tDSPO_PLL CLK_IN, DIF[x:0] (Notes 20, 21, 22, 24 and 27) Input-to-Output Skew Variation in PLL mode across voltage and temperature |100| ps tDSPO_BYP CLK_IN, DIF[x:0] (Notes 20, 21, 22, 24 and 27) Input-to-Output Skew Variation in Bypass mode across voltage and temperature 250 ps tDTE CLK_IN, DIF[x:0] (Notes 20, 21, 22, 24 and 27) Random Differential Tracking error between two NB3W1900L devices in Hi BW Mode 5 ps (rms) tDSSTE CLK_IN, DIF[x:0] (Notes 20, 21, 22, 24 and 27) Random Differential Spread Spectrum Tracking error between two NB3W1900L devices in Hi BW Mode. 75 ps DIF[x:0] (Notes 20, 21, 22 and 27) Output-to-Output Skew across all outputs (Common to Bypass and PLL mode) 85 ps tSKEW_ALL −250 jpeak-hibw PLL Jitter Peaking (Notes 26 and 27) HBW_BYP_LBW# = 1 0 2.5 dB jpeak-lobw PLL Jitter Peaking (Notes 26 and 27) HBW_BYP_LBW# = 0 0 2 dB pllHIBW PLL Bandwidth (Notes 27 and 28) HBW_BYP_LBW# = 1 2 4 MHz pllLOBW PLL Bandwidth (Notes 27 and 28) HBW_BYP_LBW# = 0 0.7 1.4 MHz tDC Duty Cycle (Note 20) Measured differentially, PLL Mode 45 50 55 % tDCD Duty Cycle Distortion (Notes 20 and 29) Measured differentially, Bypass Mode @ 100.00 MHz −2 0 2 % tjcyc-cyc Jitter, Cycle-to-Cycle (Notes 20 and 30) PLL mode 50 ps Additive Jitter in Bypass Mode 50 ps Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 20. Measured into fixed 2 pF load cap. Input to output skew is measured at the first output edge following the corresponding input. 21. Measured from differential cross-point to differential cross-point. This parameter can be tuned with external feedback path, if present. 22. All Bypass Mode Input-to-Output specs refer to the timing between an input edge and the specific output edge created by it. 23. This parameter is deterministic for a given device 24. Measured with scope averaging on to find mean value. 25. t is the period of the input clock 26. Measured as maximum pass band gain. At frequencies within the loop BW, highest point of magnification is called PLL jitter peaking. 27. Guaranteed by design and characterization, not tested in production. 28. Measured at 3 db down or half power point. 29. Duty cycle distortion is the difference in duty cycle between the output and the input clock when the device is operated in bypass mode. 30. Measured from differential waveform www.onsemi.com 9 NB3W1900L Table 14. ELECTRICAL CHARACTERISTICS − PHASE JITTER PARAMETERS (TA = 0°C − 70°C; Supply Voltage VDD/VDDA = 3.3 V ±5%, VDDIO = 1.05 V to 3.3 V ±5%. See Test Loads for Loading Conditions) (Note 31) Max Unit PCIe Gen 1 (Notes 32 and 33) 86 ps (p−p) PCIe Gen 2 Lo Band 10 kHz < f < 1.5 MHz (Note 32) 3 ps (rms) PCIe Gen 2 High Band 1.5 MHz < f < Nyquist (50 MHz) (Note 32) 3.1 ps (rms) tjphPCIeG3 PCIe Gen 3 (PLL BW of 2−4 MHz, CDR = 10 MHz) (Notes 32, 33 and 34) 1 ps (rms) tjphQPI_SMI QPI & SMI (100.00 MHz or 133.33 MHz, 4.8 Gb/s, 6.4 Gb/s 12UI) (Note 35) 0.5 ps (rms) QPI & SMI (100.00 MHz, 8.0 Gb/s, 12UI) (Note 35) 0.3 ps (rms) QPI & SMI (100.00 MHz, 9.6 Gb/s, 12UI) (Note 35) 0.2 ps (rms) PCIe Gen 1 (Notes 32 and 33) 10 ps (p−p) PCIe Gen 2 Lo Band 10 kHz < f < 1.5 MHz (Notes 32 and 36) 0.3 ps (rms) PCIe Gen 2 High Band 1.5 MHz < f < Nyquist (50 MHz) (Notes 32 and 36) 0.7 ps (rms) tjphPCIeG3 PCIe Gen 3 (PLL BW of 2−4 MHz, CDR = 10 MHz) (Notes 32, 34 and 36) 0.3 ps (rms) tjphQPI_SMI QPI & SMI (100.00 MHz or 133.33 MHz, 4.8 Gb/s, 6.4 Gb/s 12UI) (Notes 35 and 36) 0.3 ps (rms) QPI & SMI (100.00 MHz, 8.0 Gb/s, 12UI) (Notes 35 and 36) 0.1 ps (rms) QPI & SMI (100.00 MHz, 9.6 Gb/s, 12UI) (Notes 35 and 36) 0.1 ps (rms) Symbol tjphPCIeG1 Parameter Phase Jitter, PLL Mode tjphPCIeG2 tjphPCIeG1 tjphPCIeG2 Additive Phase Jitter, Bypass Mode Conditions Min Typ Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 31. Applies to all outputs. 32. See http://www.pcisig.com for complete specs 33. Sample size of at least 100k cycles. This figures extrapolates to 108 ps pk-pk @ 1M cycles for a BER of 1−12. 34. Subject to final ratification by PCI SIG. 35. Calculated from Intel-supplied Clock Jitter Tool v 1.6.3 36. For RMS figures, additive jitter is calculated by solving the following equation: (Additive jitter)2 = (total jittter)2 − (input jitter)2 www.onsemi.com 10 NB3W1900L Table 15. CLOCK PERIODS-DIFFERENTIAL OUTPUTS WITH SPREAD SPECTRUM DISABLED Measurement Window 1 Clock 1 ms 0.1 s − ppm −SSC −c 2c jitter Short−Term Long-Term Average AbsPer Average Center Min Min Min SSC OFF Freq. MHz DIF 1 ms 0.1s 0.1s 0 ppm Period Nominal + ppm Long− Term Average Max 1 Clock +SSC +c2c jitter Short−Term Abs Per Average Max Max Unit Notes 1 00.00 9.94900 9.99900 10 .0000 0 1 0.001 00 10.05100 ns 37, 38, 39 1 33.33 7.44925 7.49925 7.50000 7.50075 7.55 075 ns 37, 38, 40 37. Guaranteed by design and characterization, not tested in production. 38. All Long Term Accuracy specifications are guaranteed with the assumption that the input clock complies with CK420BQ/CK410B+ accuracy requirements (±100 ppm). The NB3W1900L it self does not contribute to ppm error. 39. Driven by SRC out put of main clock, 100.00 MHz PLL Mode or Bypass mode. 40. Driven by CPU out put of main clock, 133.33 MHz PLL Mode or Bypass mode. Table 16. CLOCK PERIODS-DIFFERENTIAL OUTPUTS WITH SPREAD SPECTRUM ENABLED Measurement Window 1 Clock 1 ms 0.1s 0.1s − ppm −SSC −c2c jitter Short−Term Long-Term Average 0 ppm PeriAbsPer Average Center od Nominal Min Min Min SSC ON Freq. MHz DIF 1 ms 0.1s + ppm Long− Term Average Max 1 Clock +SSC +c2c jitter Short−Term AbsPer Average Max Max Unit Notes 99.75 9.94906 9. 99906 10.02406 10.02506 10.02607 10.05107 10.10107 ns 41, 42, 43 133.00 7.44930 7. 49930 7.51805 7.51880 7.51955 7.53830 7.58830 ns 41, 42, 44 41. Guaranteed by design and characterization, not tested in production. 42. All Long Term Accuracy specifications are guaranteed with the assumption that the input clock complies with CK420BQ/ CK410B+ accuracy requirements (±100 ppm). The NB3W1900L it self does not contribute to ppm error. 43. Driven by SRC out put of main clock, 100.00 MHz PLL Mode or Bypass mode. 44. Driven by CPU out put of main clock, 133.33 MHz PLL Mode or Bypass mode. TEST LOADS Differential Zo, 10 inches Rs Rs LP−HCSL Differential Output Figure 3. NB3W1900L Differential Test Loads Table 17. DIFFERENTIAL OUTPUT TERMINATIONS DIF Zo (W) Rs (W) 100 33 85 27 www.onsemi.com 11 2pF 2pF NB3W1900L PWRGD/PWRDN# asserted low by two consecutive rising edges of DIF#, all differential outputs are held tri−stated on the next DIF# high to low transition. The assertion and de-assertion of PWRDN# is absolutely asynchronous. WARNING: Disabling of the CLK_IN input clock prior to assertion of PWRDN# is an undefined mode and not recommended. Operation in this mode may result in glitches, excessive frequency shifting, etc. PWRGD/PWRDN# is a dual function pin. PWRGD is asserted high and de−asserted low. De−assertion of PWRGD (pulling the signal low) is equivalent to indicating a powerdown condition. PWRGD (assertion) is used by the NB3W1900L to sample initial configurations such as frequency select condition and SA selections. After PWRGD has been asserted high for the first time, the pin becomes a PWRDN# (Power Down) pin that can be used to shut off all clocks cleanly and instruct the device to invoke power savings mode. PWRDN# is a completely asynchronous active low input. When entering power savings mode, PWRDN# should be asserted low prior to shutting off the input clock or power to ensure all clocks shut down in a glitch free manner. When PWRDN# is Table 18. PWRGD/PWRDN# FUNCTIONALITY PWRGD/PWRDN# DIF DIF# 0 Tri−state Tri−state 1 Running Running www.onsemi.com 12 NB3W1900L Buffer Power−Up State Machine Table 19. BUFFER POWER−UP STATE MACHINE State Description 0 3.3 V Buffer power off 1 After 3.3 V supply is detected to rise above 3.135 V, the buffer enters State 1 and initiates a 0.1 ms–0.3 ms delay. 2 Buffer waits for a valid clock on the CLK input and PWRDN# de−assertion (or PWRGD assertion low to high) 3 Once the PLL is locked to the CLK_IN input clock, the buffer enters state 3 and enables outputs for normal operation. (Notes 45, 46) 45. The total power up latency from power on to all outputs active must be less than 1.8 ms (assuming a valid clock is present on CLK_IN input). 46. If power is valid and powerdown is de−asserted (PWRGD asserted) but no input clocks are present on the CLK_IN input, DIF clocks must remain disabled. Only after valid input clocks are detected, valid power, PWRDN# de−asserted (PWRGD asserted) with the PLL locked/stable and the DIF outputs enabled. No input clock State 1 State 2 Delay 0.1 ms − 0.3 ms Wait for input clock and powerdown de−assertion Powerdown Asserted State 0 State 3 Power Off Normal Operation Figure 4. Buffer Power−Up State Diagram Device Power−Up Sequence 3. Apply power to the device. 4. Once the VDD pin has reached a valid VDDmin level (3.3V −5%), the PWRGD/PWRDN# pin must be asserted High. See Figure 5. Note: If no clock is present on the CLK_IN/CLK_IN# pins when device is powered up, there will be no clock on DIF/DIF# outputs. Follow the power−up sequence below for proper device functionality: 1. PWRGD/PWRDN# pin must be Low. 2. Assign remaining control pins to their required state (100M_133M#, HBW_BYPASS_LBW#, SDA, SCL) Figure 5. PWRGD and VDD Relationship Diagram www.onsemi.com 13 NB3W1900L GENERAL SMBus SERIAL INTERFACE INFORMATION • • • • • • • • How to Write • • • • • • • • • • Controller (host) sends a start bit Controller (host) sends the write address Clock (device) will acknowledge Controller (host) sends the beginning byte location = N Clock (device) will acknowledge Controller (host) sends the byte count = X Clock (device) will acknowledge Controller (host) starts sending Byte N through Byte N+X−1 Clock (device) will acknowledge each byte one at a time Controller (host) sends a Stop bit • • • Controller (host) sends the beginning byte location = N Clock (device) will acknowledge Controller (host) will send a separate start bit Controller (host) sends the read address Clock (device) will acknowledge Clock (device) will send the data byte count = X Clock (device) sends Byte N + X − 1 Clock (device) sends Byte 0 through Byte X (if X(H) was written to Byte 8) Controller (host) will need to acknowledge each byte Controller (host) will send a not acknowledge bit Controller (host) will send a stop bit Table 21. INDEX BLOCK READ OPERATION Table 20. INDEX BLOCK WRITE OPERATION Controller (Host) T Controller (Host) Clock (Device) T Clock (Device) starT bit starT bit Slave Address Slave Address WR WR WRite WRite ACK ACK Beginning Byte = N Beginning Byte = N ACK ACK Data Byte Count = X RT ACK Repeat starT Slave Address Beginning Byte N RD X Byte ReaD ACK ACK O O O O O X Byte Data Byte Count = X ACK Beginning Byte N O ACK Byte N + X − 1 O ACK P stoP bit O O O O O How to Read Byte N + X − 1 • Controller (host) will send a start bit • Controller (host) sends the write address • Clock (device) will acknowledge N Not acknowledge P stoP bit www.onsemi.com 14 NB3W1900L Table 22. SMBus ADDRESSING SA_1 and SA_0 SMBus 8-bit Address (Rd/Wrt bit = 0) 00 D8 0M DA 01 DE M0 C2 MM C4 M1 C6 10 CA 1M CC 11 CE Table 23. SMBus Table: PLL MODE, AND FREQUENCY SELECT REGISTER Byte 0 Pin # Name Control Function Type 0 1 See PLL Operating Mode Readback Table Default Bit 7 4 PLL Mode 1 PLL Operating Mode Rd back 1 R Bit 6 4 PLL Mode 0 PLL Operating Mode Rd back 0 R Bit 5 72/71 DIF_18_En Output Control overrides OE# pin RW Low/Low Enable 1 Bit 4 68/67 DIF_17_En Output Control overrides OE# pin RW Low/Low Enable 1 Bit 3 66/65 DIF_16_En Output Control overrides OE# pin RW Low/Low Enable 1 Bit 2 Reserved Bit 1 Bit 0 100M_133M# Frequency Select Readback Latch 0 Reserved 3 Latch 0 R 133 MHz 100 MHz Latch 0 1 Default Table 24. SMBus TABLE: OUTPUT CONTROL REGISTER Byte 1 Pin # Name Control Function Type Bit 7 38/37 DIF_7_En Output Control overrides OE# pin RW 1 Bit 6 35/36 DIF_6_En Output Control overrides OE# pin RW 1 Bit 5 31/32 DIF_5_En Output Control overrides OE# pin RW 1 Bit 4 29/30 DIF_4_En Output Control overrides OE# pin RW 1 Low/Low Enable Bit 3 25/26 DIF_3_En Output Control overrides OE# pin RW 1 Bit 2 23/24 DIF_2_En Output Control overrides OE# pin RW 1 Bit 1 19/20 DIF_1_En Output Control overrides OE# pin RW 1 Bit 0 17/18 DIF_0_En Output Control overrides OE# pin RW 1 Table 25. SMBus TABLE: OUTPUT CONTROL REGISTER Byte 2 Pin # Name Control Function Type 0 1 Default Bit 7 62/61 DIF_15_En Output Control overrides OE# pin RW 1 Bit 6 60/59 DIF_14_En Output Control overrides OE# pin RW 1 Bit 5 56/55 DIF_13_En Output Control overrides OE# pin RW 1 Bit 4 54/53 DIF_12_En Output Control overrides OE# pin RW 1 Low/Low Enable Bit 3 50/49 DIF_11_En Output Control overrides OE# pin RW Bit 2 48/47 DIF_10_En Output Control overrides OE# pin RW 1 Bit 1 44/43 DIF_9_En Output Control overrides OE# pin RW 1 Bit 0 42/41 DIF_8_En Output Control overrides OE# pin RW 1 www.onsemi.com 15 1 NB3W1900L Table 26. SMBus TABLE: RESERVED REGISTER Byte 3 Pin # Name Control Function Type 0 1 Default Bit 7 Reserved 0 Bit 6 Reserved 0 Bit 5 Reserved 0 Bit 4 Reserved 0 Bit 3 Reserved 0 Bit 2 Reserved 0 Bit 1 Reserved 0 Bit 0 Reserved 0 Table 27. SMBus TABLE: RESERVED REGISTER Byte 4 Pin # Name Control Function Type 0 1 Default Bit 7 Reserved 0 Bit 6 Reserved 0 Bit 5 Reserved 0 Bit 4 Reserved 0 Bit 3 Reserved 0 Bit 2 Reserved 0 Bit 1 Reserved 0 Bit 0 Reserved 0 Table 28. SMBus TABLE: VENDOR & REVISION ID REGISTER Byte 5 Pin # Name Bit 7 − RID3 Bit 6 − RID2 Control Function Type 0 1 Default R − − X R − − X REVISION ID Bit 5 − RID1 R − − X Bit 4 − RID0 R − − X Bit 3 − VID3 R − − 1 Bit 2 − VID2 R − − 1 VENDOR ID Bit 1 − VID1 R − − 1 Bit 0 − VID0 R − − 1 Type 0 1 Default Table 29. SMBus TABLE: DEVICE ID Byte 6 Pin # Bit 7 − Name Device ID 7 (MSB) Control Function R 1 Bit 6 − Device ID 6 R 1 Bit 5 − Device ID 5 R 0 Bit 4 − Device ID 4 R Bit 3 − Device ID 3 R Bit 2 − Device ID 2 R 0 Bit 1 − Device ID 1 R 1 Bit 0 − Device ID 0 R 1 www.onsemi.com 16 Device ID is 130 decimal or 82 hex. 1 1 NB3W1900L Table 30. SMBus TABLE: BYTE COUNT REGISTER Byte 7 Pin # Name Control Function Type 0 1 Default Bit 7 Reserved 0 Bit 6 Reserved 0 Bit 5 Reserved 0 Bit 4 − BC4 Bit 3 − BC3 RW RW Writing to this register configures how many bytes will be read back. Bit 2 − BC2 Bit 1 − BC1 RW RW Bit 0 − BC0 RW 0 Default value is 8 hex, so 9 bytes (0 to 8) will be read back by default. 1 0 0 0 Table 31. SMBus TABLE: RESERVED REGISTER Byte 8 Pin # Name Control Function Type 0 1 Default Bit 7 Reserved 0 Bit 6 Reserved 0 Bit 5 Reserved 0 Bit 4 Reserved 0 Bit 3 Reserved 0 Bit 2 Reserved 0 Bit 1 Reserved 0 Bit 0 Reserved 0 Table 32. DIF REFERENCE CLOCK Common R Recommendations for Differential Routing Dimension or Value Unit L1 length, route as non-coupled 50 W trace (see Figure 6) 0.5 max inch L2 length, route as non-coupled 50 W trace (see Figure 6) 0.2 max inch L3 length, route as non-coupled 50 W trace (see Figure 6) 0.2 max inch Rs (100 W differential traces) (see Figure 6) 33 W Rs (85 W differential traces) (see Figure 6) 27 W 2 min to 16 max inch 1.8 min to 14.4 max inch 0.25 to 14 max inch 0.225 min to 12.6 max inch Down Device Differential Routing L4 length, route as coupled micro strip 100 W differential trace (see Figure 6) L4 length, route as coupled strip line 100 W differential trace (see Figure 6) Differential Routing to PCI Express Connector L4 length, route as coupled microstrip 100 W differential trace (see Figure 7) L4 length, route as coupled stripline 100 W differential trace (see Figure 7) www.onsemi.com 17 NB3W1900L L2 L1 Rs L4 L4’ L2’ L1’ Rs LP−HCSL Differential Output PCI Express Down Device REF_CLK Input Figure 6. Down Device Routing L2 L1 Rs L4 L4’ L2’ L1’ Rs LP−HCSL Differential Output PCI Express Add−in Board REF_CLK Input Figure 7. PCI Express Connector Routing Table 33. CABLE CONNECTED AC COUPLED APPLICATION (Figure 8) Component Value R5a, R5b 8.2k 5% R6a, R6b 1k 5% Cc 0.1 mF Vcm 0.350 V Note 3.3 Volts R5a R5b R6a R6b Cc L4 L4’ Cc Figure 8. www.onsemi.com 18 NB3W1900L POWER FILTERING EXAMPLE Ferrite Bead Power Filtering Recommended ferrite bead filtering equivalent to the following: 600 Q impedance at 100.00 MHz, ≤ 0.1 Q DCR max., ≥ 400 mA current rating. V3P3 Place at pin FB1 R1 FERRITE 2.2 VDDA C9 1 mF R2 2.2 VDD for PLL C7 0.1 mF VDDR C10 1 mF VDD for Input Receiver VDD_DIF C8 0.1 mF F C5 C5 0.1 mF 0.1 mF C5 0.1 mF C5 0.1 mF VDDIO C1 10 mF C4 0.1 mF C2 0.1 mF C3 0.1 mF Figure 9. Schematic Example of the NB3W1900L Power Filtering Table 34. ORDERING INFORMATION Package Shipping† NB3W1900LMNG QFN−72 (Pb−Free) 168 Units / Tray NB3W1900LMNTXG QFN−72 (Pb−Free) 1,000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 19 NB3W1900L PACKAGE DIMENSIONS QFN72 10x10, 0.5P CASE 485DK ISSUE O PIN ONE LOCATION ÉÉÉ ÉÉÉ A B D L1 DETAIL A ALTERNATE CONSTRUCTIONS DIM A A1 A3 b D D2 E E2 e L L1 ÉÉ ÉÉ EXPOSED Cu 0.15 C TOP VIEW MOLD CMPD DETAIL B ALTERNATE CONSTRUCTION (A3) DETAIL B 0.10 C L L E 0.15 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSIONS: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25mm FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.18 0.30 10.00 BSC 5.85 6.15 10.00 BSC 5.85 6.15 0.50 BSC 0.30 0.50 0.00 0.15 A 0.08 C A1 NOTE 4 0.10 DETAIL A M D2 19 SEATING PLANE C SIDE VIEW C A B 72X 36 RECOMMENDED SOLDERING FOOTPRINT 10.30 6.25 L 0.10 M C A B 72X 0.63 1 E2 6.25 10.30 1 72 e 55 BOTTOM VIEW 72X b 0.10 0.05 M M PKG OUTLINE C A B C NOTE 3 0.50 PITCH 72X 0.32 DIMENSIONS: MILLIMETERS Intel is a registered trademark of Intel Corporation. PCIe and PCI−SIG are registered trademarks of PCI−SIG. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. 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