MC74AC245, MC74ACT245 Octal Bidirectional Transceiver with 3-State Inputs/Outputs The MC74AC245/74ACT245 contains eight non–inverting bidirectional buffers with 3–state outputs and is intended for bus–oriented applications. Current sinking capability is 24 mA at both the A and B ports. The Transmit/Receive (T/R) input determines the direction of data flow through the bidirectional transceiver. Transmit (active–HIGH) enables data from A ports to B ports; Receive (active–LOW) enables data from B ports to A ports. The Output Enable input, when HIGH, disables both A and B ports by placing them in a High Z condition. • • • • http://onsemi.com PDIP–20 N SUFFIX CASE 738 20 1 SO–20 DW SUFFIX CASE 751 20 Noninverting Buffers Bidirectional Data Path A and B Outputs Source/Sink 24 mA ′ACT245 Has TTL Compatible Inputs 1 20 1 VCC OE B0 B1 B2 B3 B4 B5 B6 B7 20 19 18 17 16 15 14 13 12 11 TSSOP–20 DT SUFFIX CASE 948E EIAJ–20 M SUFFIX CASE 967 20 1 ORDERING INFORMATION 1 2 3 4 T/R A0 A1 A2 5 6 7 8 9 10 A3 A4 A5 A6 A7 GND Figure 1. PIN ASSIGNMENT Device Package Shipping MC74AC245N PDIP–20 18 Units/Rail MC74ACT245N PDIP–20 18 Units/Rail MC74AC245DW SOIC–20 38 Units/Rail MC74AC245DWR2 SOIC–20 1000 Tape & Reel MC74ACT245DW SOIC–20 38 Units/Rail MC74ACT245DWR2 SOIC–20 1000 Tape & Reel MC74AC245DT TSSOP–20 75 Units/Rail PIN FUNCTION OE Output Enable Input T/R Transmit/Receive Input A0–A7 Side A 3–State Inputs or 3–State Outputs MC74AC245DTR2 TSSOP–20 2500 Tape & Reel B0–B7 Side B 3–State Inputs or 3–State Outputs MC74ACT245DT TSSOP–20 MC74ACT245DTR2 TSSOP–20 2500 Tape & Reel TRUTH TABLES Inputs O tp ts Outputs OE T/R L L H L H X Bus B Data to Bus A Bus A Data to Bus B High Z State May, 2001 – Rev. 5 MC74AC245M EIAJ–20 40 Units/Rail MC74AC245MEL EIAJ–20 2000 Tape & Reel MC74ACT245M EIAJ–20 40 Units/Rail MC74ACT245MEL EIAJ–20 2000 Tape & Reel DEVICE MARKING INFORMATION H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Semiconductor Components Industries, LLC, 2001 75 Units/Rail See general marking information in the device marking section on page 6 of this data sheet. 1 Publication Order Number: MC74AC245/D MC74AC245, MC74ACT245 MAXIMUM RATINGS* Symbol Parameter Value Unit –0.5 to +7.0 V DC Input Voltage (Referenced to GND) –0.5 to VCC +0.5 V VOUT DC Output Voltage (Referenced to GND) –0.5 to VCC +0.5 V IIN DC Input Current, per Pin ±20 mA IOUT DC Output Sink/Source Current, per Pin ±50 mA ICC DC VCC or GND Current per Output Pin ±50 mA Tstg Storage Temperature –65 to +150 °C VCC DC Supply Voltage (Referenced to GND) VIN *Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VIN, VOUT DC Input Voltage, Output Voltage (Ref. to GND) tr, tf Input Rise and Fall Time (Note 1) ′AC Devices except Schmitt Inputs Min Typ Max Unit ′AC 2.0 5.0 6.0 ′ACT 4.5 5.0 5.5 0 – VCC VCC @ 3.0 V – 150 – VCC @ 4.5 V – 40 – VCC @ 5.5 V – 25 – VCC @ 4.5 V – 10 – VCC @ 5.5 V – 8.0 – – – 140 °C –40 25 85 °C V V ns/V tr, tf In ut Rise and Fall Time (Note 2) Input ′ACT Devices except Schmitt Inputs TJ Junction Temperature (PDIP) TA Operating Ambient Temperature Range IOH Output Current – High – – –24 mA IOL Output Current – Low – – 24 mA ns/V 1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. http://onsemi.com 2 MC74AC245, MC74ACT245 DC CHARACTERISTICS Symbol Parameter VCC (V) 74AC 74AC TA = +25°C TA = –40°C to +85°C Typ VIH VIL VOH VOL Unit Conditions Guaranteed Limits Minimum u High g Level e e Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 V VOUT = 0.1 V or VCC – 0.1 V Maximum a u Low o Level e e Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 V VOUT = 0.1 V or VCC – 0.1 V Minimum u High g Level e e Output Voltage 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 V 3.0 4.5 5.5 – – – 2.56 3.86 4.86 2.46 3.76 4.76 3.0 4.5 5.5 0.002 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 5.5 – – – 0.36 0.36 0.36 0.44 0.44 0.44 Maximum a u Low o Level e e Output Voltage IOUT = –50 µA V *VIN = VIL or VIH –12 mA IOH –24 mA –24 mA IOUT = 50 µA V V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA IIN Maximum a u Input u Leakage Current 55 5.5 – ±0 1 ±0.1 ±1 0 ±1.0 µA VI = VCC, GND IOZT Maximum a u 3-State C Current 5.5 – ±0.6 ±6.0 µA VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND 5.5 – – 75 mA VOLD = 1.65 V Max 5.5 – – –75 mA VOHD = 3.85 V Min 55 5.5 – 80 8.0 80 0 80.0 µA VIN = VCC or GND IOLD IOHD ICC †Minimum Dynamic O t t Current Output C t Maximum a u Quiescent Qu esce Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. http://onsemi.com 3 MC74AC245, MC74ACT245 AC CHARACTERISTICS (For Figures and Waveforms – See Section 3) Symbol VCC* (V) Parameter 74AC 74AC TA = +25°C CL = 50 pF TA = –40°C to +85°C CL = 50 pF Min Typ Max Min Max Unit Fig. No. tPLH Propagation Delay An to Bn or Bn to An 3.3 5.0 1.5 1.5 5.0 3.5 8.5 6.5 1.0 1.0 9.0 7.0 ns 3–5 tPHL Propagation Delay An to Bn or Bn to An 3.3 5.0 1.5 1.5 5.0 3.5 8.5 6.0 1.0 1.0 9.0 7.0 ns 3–5 tPZH Output Enable Time 3.3 5.0 2.5 1.5 7.0 5.0 11.5 8.5 2.0 1.0 12.5 9.0 ns 3–7 tPZL Output Enable Time 3.3 5.0 2.5 1.5 7.5 5.5 12.0 9.0 2.0 1.0 13.5 9.5 ns 3–8 tPHZ Output Disable Time 3.3 5.0 2.0 1.5 6.5 5.5 12.0 9.0 1.0 1.0 12.5 10.0 ns 3–7 tPLZ Output Disable Time 3.3 5.0 2.0 1.5 7.0 5.5 11.5 9.0 1.5 1.0 13.0 10.0 ns 3–8 *Voltage Range 3.3 V is 3.3 V ±0.3 V. Voltage Range 5.0 V is 5.0 V ±0.5 V. DC CHARACTERISTICS Symbol Parameter VCC (V) 74ACT 74ACT TA = +25°C TA = –40°C to +85°C Typ Guaranteed Limits Unit Conditions VIH Minimum u High g Level e e Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 V VOUT = 0.1 V or VCC – 0.1 V VIL Maximum a u Low o Level e e Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V VOUT = 0.1 V or VCC – 0.1 V VOH Minimum u High g Level e e Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V 4.5 5.5 – – 3.86 4.86 3.76 4.76 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 4.5 5.5 – – 0.36 0.36 0.44 0.44 V *VIN = VIL or VIH 24 mA IOL 24 mA VOL Maximum a u Low o Level e e Output Voltage V V IOUT = –50 µA *VIN = VIL or VIH –24 mA IOH –24 mA IOUT = 50 µA IIN Maximum a u Input u Leakage Current 55 5.5 – ±0 1 ±0.1 ±1 0 ±1.0 µA VI = VCC, GND ∆ICCT Additional Max. ICC/Input 5.5 0.6 – 1.5 mA VI = VCC – 2.1 V IOZT Maximum a u 3–State C Current 5.5 – ±0.6 ±6.0 µA VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND 5.5 – – 75 mA VOLD = 1.65 V Max 5.5 – – –75 mA VOHD = 3.85 V Min 55 5.5 – 80 8.0 80 0 80.0 µA VIN = VCC or GND IOLD IOHD ICC †Minimum Dynamic O t t Current C t Output Maximum Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. http://onsemi.com 4 MC74AC245, MC74ACT245 AC CHARACTERISTICS (For Figures and Waveforms – See Section 3) Symbol tPLH VCC* (V) Parameter Pro agation Delay Propagation An to Bn or Bn to An 74ACT 74ACT TA = +25°C CL = 50 pF TA = –40°C to +85°C CL = 50 pF Unit Fig. No. Min Typ Max Min Max 50 5.0 15 1.5 40 4.0 75 7.5 15 1.5 80 8.0 ns 3–5 50 5.0 15 1.5 40 4.0 80 8.0 10 1.0 90 9.0 ns 3–5 5.0 1.5 5.0 10 1.5 11.0 ns 3–7 tPZH Propagation Pro agation Delay An to Bn or Bn to An Output Enable Time tPZL Output Enable Time 5.0 1.5 5.5 10 1.5 12.0 ns 3–8 tPHZ Output Disable Time 5.0 1.5 5.5 10 1.0 11.0 ns 3–7 tPLZ Output Disable Time 5.0 2.0 5.0 10 1.5 11.0 ns 3–8 tPHL *Voltage Range 5.0 V is 5.0 V ±0.5 V. CAPACITANCE Symbol Parameter Value Typ Unit Test Conditions CIN Input Capacitance 4.5 pF VCC = 5.0 V CI/O Input/Output Capacitance 15 pF VCC = 5.0 V CPD Power Dissipation Capacitance 45 pF VCC = 5.0 V http://onsemi.com 5 MC74AC245, MC74ACT245 MARKING DIAGRAMS PDIP–20 SO–20 MC74AC245N AWLYYWW AC245 AWLYYWW MC74ACT245N AWLYYWW ACT245 AWLYYWW A WL, L YY, Y WW, W TSSOP–20 EIAJ–20 AC 245 ALYW 74AC245 AWLYWW ACT 245 ALYW 74ACT245 AWLYWW = Assembly Location = Wafer Lot = Year = Work Week http://onsemi.com 6 MC74AC245, MC74ACT245 PACKAGE DIMENSIONS PDIP–20 N SUFFIX 20 PIN PLASTIC DIP PACKAGE CASE 738–03 ISSUE E –A– 20 11 1 10 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. B L C –T– K SEATING PLANE M N E G F J D 20 PL 0.25 (0.010) 20 PL 0.25 (0.010) M T A M M T B M DIM A B C D E F G J K L M N INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0 15 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0 15 0.51 1.01 SO–20 DW SUFFIX 20 PIN PLASTIC SOIC PACKAGE CASE 751D–05 ISSUE F A 20 X 45 h 1 10 20X B B 0.25 M T A S B S A L H M E 0.25 10X NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 B M D 18X e A1 SEATING PLANE C T http://onsemi.com 7 DIM A A1 B C D E e H h L MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0 7 MC74AC245, MC74ACT245 PACKAGE DIMENSIONS TSSOP–20 DT SUFFIX 20 PIN PLASTIC TSSOP PACKAGE CASE 948E–02 ISSUE A 20X 0.15 (0.006) T U 2X K REF 0.10 (0.004) S L/2 20 M T U V S S K K1 11 J J1 B L –U– PIN 1 IDENT ÍÍÍ ÍÍÍ ÍÍÍ SECTION N–N 1 10 0.25 (0.010) N 0.15 (0.006) T U S M A –V– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. DIM A B C D F G H J J1 K K1 L M N F DETAIL E –W– C G D H DETAIL E 0.100 (0.004) –T– SEATING MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0 8 INCHES MIN MAX 0.252 0.260 0.169 0.177 --0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0 8 PLANE EIAJ–20 M SUFFIX 20 PIN PLASTIC EIAJ PACKAGE CASE 967–01 ISSUE O 20 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 11 Q1 E HE 1 M L 10 DETAIL P Z D VIEW P e A c A1 b 0.13 (0.005) M 0.10 (0.004) http://onsemi.com 8 DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.18 0.27 12.35 12.80 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 0 0.70 0.90 --0.81 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.486 0.504 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 0 0.028 0.035 --0.032 MC74AC245, MC74ACT245 Notes http://onsemi.com 9 MC74AC245, MC74ACT245 Notes http://onsemi.com 10 MC74AC245, MC74ACT245 Notes http://onsemi.com 11 MC74AC245, MC74ACT245 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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