ON MC10E336 3-bit registered bus transceiver Datasheet

SEMICONDUCTOR TECHNICAL DATA
The MC10E/MC100E336 contains three bus transceivers with both
transmit and receive registers. The bus outputs (BUS0–BUS2) are
specified for driving a 25Ω bus; the receive outputs (Q0 – Q2) are
specified for 50Ω. The bus outputs feature a normal HIGH level (VOH) and
a cutoff LOW level — when LOW, the outputs go to –2.0V and the output
emitter-follower is “off”, presenting a high impedance to the bus. The bus
outputs also feature edge slow-down capacitors.
3-BIT REGISTERED
•
•
•
•
•
•
•
•
•
25Ω Cutoff Bus Outputs
BUS TRANSCEIVER
50Ω Receiver Outputs
Transmit and Receive Registers
1500ps Max. Clock to Bus
1000ps Max. Clock to Q
Bus Outputs Feature Internal Edge Slow-Down Capacitors
Additional Package Ground Pins
Extended 100E VEE Range of – 4.2V to – 5.46V
75kΩ Input Pulldown Resistors
The Transmit Enable pins (TEN) control whether current data is held in
the transmit register, or new data is loaded from the A/B inputs. A LOW on
both of the Bus Enable inputs (BUSEN), when clocked through the
FN SUFFIX
register, disables the bus outputs to –2.0V.
PLASTIC PACKAGE
CASE 776-02
The receiver section clocks bus data into the receive registers, after
gating with the Receive Enable (RXEN) input.
All registers are clocked by a positive transition of CLK1 or CLK2 (or
both).
Additional leadframe grounding is provided through the Ground pins (GND) which should be connected to 0V. The GND pins
are not electrically connected to the chip.
LOGIC DIAGRAM
Pinout: 28-Lead PLCC (Top View)
TEN2 TEN1
25
BUSEN1
24
B2
23
A2
22
NC
21
VCCO
20
Q2
0
19
26
18
GND
A0
B0
D Q
1
25 Ω CUTOFF
D
Q
BUSEN2
27
17
BUS2
RXEN
28
16
VCC
VEE
1
15
Q1
CLK1
2
14
VCCO
CLK2
3
13
BUS1
A0
4
12
5
6
7
B0
A1
B1
8
9
10
VCCO BUS0 GND
GND
11
Q0
* All VCC and VCCO pins are tied together on the die.
0
A1
B1
50 Ω
Q
0
A2
B2
D Q
1
25 Ω CUTOFF
D
50 Ω
Q
TEN1
TEN2
RXEN
BUSEN1
BUSEN2
D Q
12/93
2–1
25 Ω CUTOFF
D
CLK1
CLK2
 Motorola, Inc. 1996
D Q
1
50 Ω
REV 2
BUS0
Q0
BUS1
Q1
BUS2
Q2
MC10E336 MC100E336
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0°C
Symbol
Characteristic
VCUT
Cut-off Output Voltage1
IIH
Input HIGH Current
RXEN
All Other Inputs
IEE
Power Supply Current
10E
100E
min
typ
– 2.10
25°C
max
min
– 2.03
– 2.10
85°C
typ
max
min
– 2.03
– 2.10
typ
max
Unit
– 2.03
V
Condition
µA
225
150
225
150
225
150
mA
125
125
150
150
125
125
150
150
125
144
150
173
1. Measured with VTT = – 2.10V
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0°C
Symbol
tPLH
tPHL
ts
th
tPW
tr
tf
MOTOROLA
Characteristic
Propagation Delay to Output
Clk to Q
Clk to BUS
Setup Time
BUS, RXEN
BUSEN
A, B Data
TEN
Hold Time
BUS, RXEN
BUSEN
A, B Data
TEN
Minimum Pulse Width
Clk
Rise/Fall Times
20 - 80% (Qn)
20 - 80% (BUSn Rise)
20 - 80% (BUSn Fall)
min
typ
25°C
max
min
typ
85°C
max
min
typ
max
Unit
Condition
ps
500
825
700
1250
150
100
300
450
450
500
350
200
100
1800
500
825
700
1250
–150
– 200
– 50
150
150
100
300
450
150
200
50
–150
450
500
350
200
1000
1800
500
825
700
1250
–150
– 200
– 50
150
150
100
300
450
–150
– 200
– 50
150
150
200
50
–150
450
500
350
200
150
200
50
–150
1000
1800
ps
ps
ps
400
400
400
ps
300
500
300
450
800
500
700
1000
800
2–2
300
500
300
450
800
500
700
1000
800
300
500
300
450
800
500
700
1000
800
ECLinPS and ECLinPS Lite
DL140 — Rev 4
MC10E336 MC100E336
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
0.007 (0.180)
B
Y BRK
-N-
T L –M
M
U
0.007 (0.180)
X
G1
M
S
N
T L –M
S
S
N
S
D
Z
-L-
-M-
D
W
28
V
1
C
A
0.007 (0.180)
M
R
0.007 (0.180)
M
T L –M
S
T L –M
S
N
S
N
S
H
S
N
S
0.007 (0.180)
M
T L –M
N
S
S
0.004 (0.100)
G
J
-T-
K
SEATING
PLANE
F
VIEW S
G1
T L –M
S
N
0.007 (0.180)
M
T L –M
S
N
S
VIEW S
S
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
ECLinPS and ECLinPS Lite
DL140 — Rev 4
T L –M
K1
E
S
S
VIEW D-D
Z
0.010 (0.250)
0.010 (0.250)
2–3
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.485 0.495
0.485 0.495
0.165 0.180
0.090 0.110
0.013 0.019
0.050 BSC
0.026 0.032
0.020
—
0.025
—
0.450 0.456
0.450 0.456
0.042 0.048
0.042 0.048
0.042 0.056
—
0.020
2°
10°
0.410 0.430
0.040
—
MILLIMETERS
MIN
MAX
12.32 12.57
12.32 12.57
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
—
0.64
—
11.43
11.58
11.43
11.58
1.07
1.21
1.07
1.21
1.07
1.42
—
0.50
2°
10°
10.42 10.92
1.02
—
MOTOROLA
MC10E336 MC100E336
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
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MOTOROLA
2–4
*MC10E336/D*
MC10E336/D
ECLinPS and ECLinPS Lite
DL140 — Rev 4
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