PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED. 8.00 6.40 3.20 12.50 0.42 typ. (x84) 11.20 ISO VIEW 0.80 TOP VIEW 1 1 Substrate: 1.59 0.18mm [0.0625" 0.007"] non clad high temp material. ---------------------------------------------------------------------- 2 4.55 2 2.96 Pins:material-Brass Alloy 360 1/2 hard; finish- 0.25µm [10µ] Au over 1.27µm [50µ"] Ni (min) 0.2032 typ. FRONT VIEW Description: Giga-snaP BGA SMT Land Socket for 8mm x12.5mm 84 pin 0.8mm pitch BGA Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. LS-BGA84H-61 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 0.48 STATUS: Released SHEET: 1 OF 1 REV. A ENG: S. Faiz DRAWN BY: M. Raske SCALE: 5:1 FILE: LS-BGA84H-61 Dwg DATE: 12/04/2015