ON MBRD620CTT4G Switchmode power rectifier Datasheet

MBRD620CT, MBRD630CT,
MBRD640CT, MBRD650CT,
MBRD660CT
MBRD620CT, MBRD640CT and MBRD660CT are Preferred Devices
SWITCHMODE
Power Rectifiers
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DPAK−3 Surface Mount Package
These state−of−the−art devices are designed for use in switching
power supplies, inverters and as free wheeling diodes.
Features
•
•
•
•
Extremely Fast Switching
Extremely Low Forward Drop
Platinum Barrier with Avalanche Guardrings
Pb−Free Packages are Available
SCHOTTKY BARRIER
RECTIFIERS
6.0 AMPERES, 20 − 60 VOLTS
1
4
3
Mechanical Characteristics:
4
• Case: Epoxy, Molded
• Weight: 0.4 Gram (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
•
1 2
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
3
DPAK
CASE 369C
MARKING DIAGRAM
YWW
B
6x0TG
Y
WW
B6x0T
x
G
= Year
= Work Week
= Device Code
= 2, 3, 4, 5, or 6
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the
package dimensions section on page 3 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2010
July, 2010 − Rev. 7
1
Publication Order Number:
MBRD620CT/D
MBRD620CT, MBRD630CT, MBRD640CT, MBRD650CT, MBRD660CT
MAXIMUM RATINGS
Rating
Symbol
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
TC = 130°C (Rated VR)
VRRM
VRWM
VR
Per Diode
Per Device
MBRD
620CT
630CT
640CT
650CT
660CT
20
30
40
50
60
Unit
V
IF(AV)
3
6
A
Peak Repetitive Forward Current, TC = 130°C
(Rated VR, Square Wave, 20 kHz) Per Diode
IFRM
6
A
Nonrepetitive Peak Surge Current − (Surge applied at rated load
conditions halfwave, single phase, 60 Hz)
IFSM
75
A
Peak Repetitive Reverse Surge Current (2 ms, 1 kHz)
IRRM
1
A
Operating Junction Temperature (Note 1)
TJ
−65 to +175
°C
Storage Temperature
Tstg
−65 to +175
°C
dv/dt
10,000
V/ms
Symbol
Value
Unit
Maximum Thermal Resistance, Junction−to−Case
RqJC
6
°C/W
Maximum Thermal Resistance, Junction−to−Ambient (Note 2)
RqJA
80
°C/W
Voltage Rate of Change (Rated VR)
THERMAL CHARACTERISTICS PER DIODE
Rating
ELECTRICAL CHARACTERISTICS PER DIODE
Maximum Instantaneous Forward Voltage (Note 3)
iF = 3 Amps, TC = 25°C
iF = 3 Amps, TC = 125°C
iF = 6 Amps, TC = 25°C
iF = 6 Amps, TC = 125°C
VF
Maximum Instantaneous Reverse Current (Note 3)
(Rated dc Voltage, TC = 25°C)
(Rated dc Voltage, TC = 125°C)
iR
V
0.7
0.65
0.9
0.85
mA
0.1
15
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA.
2. Rating applies when surface mounted on the minimum pad size recommended.
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
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2
MBRD620CT, MBRD630CT, MBRD640CT, MBRD650CT, MBRD660CT
ORDERING INFORMATION
Package
Shipping†
DPAK
2500 Tape & Reel
DPAK
(Pb−Free)
2500 Tape & Reel
DPAK−3
2500 Tape & Reel
DPAK
(Pb−Free)
2500 Tape & Reel
DPAK−3
75 Units / Rail
MBRD640CTG
DPAK−3
(Pb−Free)
75 Units / Rail
MBRD640CTT4
DPAK−3
2500 Tape & Reel
DPAK−3
(Pb−Free)
2500 Tape & Reel
DPAK−3
75 Units / Rail
MBRD650CTG
DPAK
(Pb−Free)
75 Units / Rail
MBRD650CTT4
DPAK−3
2500 Tape & Reel
DPAK
(Pb−Free)
2500 Tape & Reel
DPAK−3
75 Units / Rail
MBRD660CTG
DPAK−3
(Pb−Free)
75 Units / Rail
MBRD660CTRL
DPAK−3
1800 Tape & Reel
DPAK−3
(Pb−Free)
1800 Tape & Reel
DPAK−3
2500 Tape & Reel
DPAK−3
(Pb−Free)
2500 Tape & Reel
Device
MBRD620CTT4
MBRD620CTT4G
MBRD630CTT4
MBRD630CTT4G
MBRD640CT
MBRD640CTT4G
MBRD650CT
MBRD650CTT4G
MBRD660CT
MBRD660CTRLG
MBRD660CTT4
MBRD660CTT4G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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3
MBRD620CT, MBRD630CT, MBRD640CT, MBRD650CT, MBRD660CT
TYPICAL CHARACTERISTICS
100
100
TJ = 150°C
70
I R , REVERSE CURRENT (mA)
50
30
20
125°C
1.0
75°C
0.1
0.01
25°C
10
0.001
7.0
0
10
20
30
40
50
VR, REVERSE VOLTAGE (VOLTS)
5.0
60
70
*The curves shown are typical for the highest voltage device in the
voltage grouping. Typical reverse current for lower voltage selections
can be estimated from these curves if VR is sufficient below rated VR.
3.0
Figure 2. Typical Reverse Current,* Per Leg
125°C
2.0
PF(AV) , AVERAGE POWER DISSIPATION (WATTS)
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)
10
150°C
1.0
TC = 25°C
0.7
75°C
0.5
0.3
0.2
0.1
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
14
13
12
11
10
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
SINE
WAVE
5
10
IPK/IAV = 20
SQUARE
WAVE
dc
TJ = 150°C
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
vF, INSTANTANEOUS VOLTAGE (VOLTS)
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 1. Typical Forward Voltage, Per Leg
Figure 3. Average Power Dissipation, Per Leg
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4
10
I F(AV) , AVERAGE FORWARD CURRENT (AMPS)
8.0
RATED VOLTAGE APPLIED
7.0
RqJC = 6°C/W
6.0
TJ = 150°C
5.0
SINE
WAVE
OR
SQUARE
WAVE
4.0
3.0
dc
2.0
1.0
0
80
90
100
110
120
130
140
150
160
4.0
RqJA = 80°C/W
SURFACE MOUNTED ON MIN.
PAD SIZE RECOMMENDED
TJ = 150°C
3.5
3.0
dc
SQUARE WAVE
OR
SINE WAVE
2.5
VR = 25 V
2.0
1.5
VR = 60 V
1.0
0.5
0
0
20
40
60
80
100
120
140
160
TC, CASE TEMPERATURE (°C)
TA, AMBIENT TEMPERATURE (°C)
Figure 4. Current Derating, Case, Per Leg
Figure 5. Current Derating, Ambient, Per Leg
1K
C, CAPACITANCE (pF)
I F(AV) , AVERAGE FORWARD CURRENT (AMPS)
MBRD620CT, MBRD630CT, MBRD640CT, MBRD650CT, MBRD660CT
TJ = 25°C
100
10
0
10
20
30
40
50
60
VR, REVERSE VOLTAGE (VOLTS)
Figure 6. Typical Capacitance, Per Leg
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5
70
MBRD620CT, MBRD630CT, MBRD640CT, MBRD650CT, MBRD660CT
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C−01
ISSUE D
A
E
b3
c2
B
Z
D
1
L4
A
4
L3
b2
e
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN
DIMENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
C
H
DETAIL A
3
c
b
0.005 (0.13)
M
H
C
L2
GAUGE
PLANE
C
L
SEATING
PLANE
A1
L1
DETAIL A
ROTATED 905 CW
DIM
A
A1
b
b2
b3
c
c2
D
E
e
H
L
L1
L2
L3
L4
Z
INCHES
MIN
MAX
0.086 0.094
0.000 0.005
0.025 0.035
0.030 0.045
0.180 0.215
0.018 0.024
0.018 0.024
0.235 0.245
0.250 0.265
0.090 BSC
0.370 0.410
0.055 0.070
0.108 REF
0.020 BSC
0.035 0.050
−−− 0.040
0.155
−−−
MILLIMETERS
MIN
MAX
2.18
2.38
0.00
0.13
0.63
0.89
0.76
1.14
4.57
5.46
0.46
0.61
0.46
0.61
5.97
6.22
6.35
6.73
2.29 BSC
9.40 10.41
1.40
1.78
2.74 REF
0.51 BSC
0.89
1.27
−−−
1.01
3.93
−−−
SOLDERING FOOTPRINT*
6.20
0.244
2.58
0.102
5.80
0.228
3.00
0.118
1.60
0.063
6.17
0.243
SCALE 3:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
+−
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent
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MBRD620CT/D
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