AP4430GM-HF
Halogen-Free Product
Advanced Power
Electronics Corp.
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
▼ Ultra_Low On-resistance
D
D
▼ Simple Drive Requirement
D
D
G
SO-8
S
S
35V
RDS(ON)
4.6mΩ
ID
▼ Fast Switching Characteristic
▼ RoHS Compliant & Halogen-Free
BVDSS
20A
S
Description
D
Advanced Power MOSFETs from APEC provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and cost-effectiveness.
G
S
The SO-8 package is widely preferred for commercial-industrial
surface mount applications and suited for low voltage applications
such as DC/DC converters.
Absolute Maximum Ratings
Symbol
Parameter
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
ID@TA=25℃
ID@TA=70℃
Rating
Units
35
V
+20
V
3
20
A
3
17
A
Continuous Drain Current
Continuous Drain Current
1
IDM
Pulsed Drain Current
80
A
PD@TA=25℃
Total Power Dissipation
3.1
W
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Rthj-a
Parameter
Maximum Thermal Resistance, Junction-ambient
Data and specifications subject to change without notice
3
Value
Unit
40
℃/W
1
200910141
AP4430GM-HF
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max. Units
BVDSS
Drain-Source Breakdown Voltage
VGS=0V, ID=250uA
35
-
-
V
RDS(ON)
Static Drain-Source On-Resistance2
VGS=10V, ID=18A
-
-
4.6
mΩ
VGS=4.5V, ID=12A
-
-
6.8
mΩ
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250uA
1
-
3
V
gfs
Forward Transconductance
VDS=10V, ID=12A
-
36
-
S
IDSS
Drain-Source Leakage Current
VDS=28V, VGS=0V
-
-
10
uA
IGSS
Gate-Source Leakage
VGS=+20V, VDS=0V
-
-
+100
nA
ID=12A
-
22
35
nC
2
Qg
Total Gate Charge
Qgs
Gate-Source Charge
VDS=15V
-
3.5
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=4.5V
-
12
-
nC
VDS=15V
-
9.5
-
ns
2
td(on)
Turn-on Delay Time
tr
Rise Time
ID=1A
-
7.5
-
ns
td(off)
Turn-off Delay Time
RG=3.3Ω,VGS=10V
-
34
-
ns
tf
Fall Time
RD=15Ω
-
20
-
ns
Ciss
Input Capacitance
VGS=0V
-
1600 2560
pF
Coss
Output Capacitance
VDS=25V
-
420
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
235
-
pF
Rg
Gate Resistance
f=1.0MHz
-
1
-
Ω
Min.
Typ.
IS=2.1A, VGS=0V
-
-
1.2
V
Source-Drain Diode
Symbol
VSD
Parameter
2
Forward On Voltage
2
Test Conditions
Max. Units
trr
Reverse Recovery Time
IS=12A, VGS=0V,
-
40
-
ns
Qrr
Reverse Recovery Charge
dI/dt=100A/µs
-
43
-
nC
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse test
3.Surface mounted on 1 in2 copper pad of FR4 board, t <10sec ; 125 ℃/W when mounted on Min. copper pad.
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
AP4430GM-HF
60
60
o
T A = 25 C
40
10 V
7.0 V
6.0 V
5.0 V
V G =4.0V
50
ID , Drain Current (A)
50
ID , Drain Current (A)
T A = 150 o C
10 V
7.0 V
6.0 V
5.0 V
V G =4.0V
30
20
10
40
30
20
10
0
0
0
0
1
1
2
0
2
1
2
3
4
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
7
1.9
I D = 12 A
T A =25 ℃
I D = 18 A
V G =10V
Normalized RDS(ON)
RDS(ON) (mΩ)
6
5
1.4
0.9
4
0.4
3
2
4
6
8
-50
10
0
50
100
150
T j , Junction Temperature ( o C)
V GS , Gate-to-Source Voltage (V)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
1.6
20
o
T j =150 C
o
T j =25 C
Normalized VGS(th) (V)
IS(A)
16
12
8
1.2
0.8
0.4
4
0.0
0
0
0.2
0.4
0.6
0.8
1
V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of
Reverse Diode
1.2
-50
0
50
100
150
T j , Junction Temperature ( o C)
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3
AP4430GM-HF
10
2000
8
C (pF)
VGS , Gate to Source Voltage (V)
f=1.0MHz
2400
I D = 12 A
V DS = 15 V
6
1600
C iss
1200
4
800
2
C oss
C rss
400
0
0
0
10
20
30
40
1
5
Q G , Total Gate Charge (nC)
Fig 7. Gate Charge Characteristics
13
17
21
25
29
Fig 8. Typical Capacitance Characteristics
1
100
Operation in this area
limited by RDS(ON)
1ms
10ms
1
100ms
1s
0.1
T A =25 o C
Single Pulse
DC
0.01
Normalized Thermal Response (Rthja)
Duty factor=0.5
100us
10
ID (A)
9
V DS , Drain-to-Source Voltage (V)
0.2
0.1
0.1
0.05
0.02
0.01
PDM
0.01
t
T
Duty factor = t/T
Peak Tj = PDM x Rthja + T a
Single Pulse
Rthja=125 oC/W
0.001
0.01
0.1
1
10
100
0.0001
0.001
0.01
V DS , Drain-to-Source Voltage (V)
Fig 9. Maximum Safe Operating Area
0.1
1
10
100
1000
t , Pulse Width (s)
Fig 10. Effective Transient Thermal Impedance
VG
VDS
90%
QG
4.5V
QGS
QGD
10%
VGS
td(on) tr
td(off) tf
Fig 11. Switching Time Waveform
Charge
Q
Fig 12. Gate Charge Waveform
4