TI MAX232ECDWRG4 Dual rs-232 driver/receiver with iec61000-4-2 protection Datasheet

MAX232E
www.ti.com
SLLS723B – APRIL 2006 – REVISED NOVEMBER 2009
DUAL RS-232 DRIVER/RECEIVER WITH IEC61000-4-2 PROTECTION
Check for Samples: MAX232E
FEATURES
1
•
•
•
•
•
•
•
Meets or Exceeds TIA/RS-232-F and ITU
Recommendation V.28
Operates From a Single 5-V Power Supply
With 1.0-μF Charge-Pump Capacitors
Operates up to 250 kbit/s
Two Drivers and Two Receivers
±30-V Input Levels
Low Supply Current . . . 8 mA Typical
ESD Protection for RS-232 Bus Pins
– ±15-kV Human-Body Model (HBM)
– ±8-kV IEC61000-4-2, Contact Discharge
– ±15-kV IEC61000-4-2, Air-Gap Discharge
D, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
C1+
VS+
C1−
C2+
C2−
VS−
DOUT2
RIN2
1
16
2
15
3
14
4
13
5
12
6
7
11
10
8
9
VCC
GND
DOUT1
RIN1
ROUT1
DIN1
DIN2
ROUT2
APPLICATIONS
•
•
•
•
•
TIA/RS-232-F
Battery-Powered Systems
Terminals
Modems
Computers
DESCRIPTION/ORDERING INFORMATION
The MAX232E is a dual driver/receiver that includes a capacitive voltage generator to supply TIA/RS-232-F
voltage levels from a single 5-V supply. Each receiver converts TIA/RS-232-F inputs to 5-V TTL/CMOS levels.
This receiver has a typical threshold of 1.3 V, a typical hysteresis of 0.5 V, and can accept ±30-V inputs. Each
driver converts TTL/CMOS input levels into TIA/RS-232-F levels. The driver, receiver, and voltage-generator
functions are available as cells in the Texas Instruments LinASIC™ library.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2009, Texas Instruments Incorporated
MAX232E
SLLS723B – APRIL 2006 – REVISED NOVEMBER 2009
www.ti.com
Table 1. ORDERING INFORMATION (1)
PACKAGE (2)
TA
PDIP – N
SOIC – D
0°C to 70°C
SOIC – DW
TSSOP – PW
PDIP – N
SOIC – D
–40°C to 85°C
SOIC – DW
TSSOP – PW
(1)
(2)
ORDERABLE PART NUMBER
Tube of 25
MAX232ECN
Tube of 40
MAX232ECD
Reel of 2500
MAX232ECDR
Tube of 40
MAX232ECDW
Reel of 2000
MAX232ECDWR
Tube of 25
MAX232ECPW
Reel of 2000
MAX232ECPWR
Tube of 25
MAX232EIN
Tube of 40
MAX232EID
Reel of 2500
MAX232EIDR
Tube of 40
MAX232EIDW
Reel of 2000
MAX232EIDWR
Tube of 25
MAX232EIPW
Reel of 2000
MAX232EIPWR
TOP-SIDE MARKING
MAX232ECN
MAX232EC
MAX232EC
MA232EC
MAX232EIN
MAX232EI
MAX232EI
MB232EI
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
Table 2. FUNCTION TABLES
ABC
Each Driver (1)
(1)
INPUT
DIN
OUTPUT
DOUT
L
H
H
L
H = high level, L = low level
Table 3. Each Receiver (1)
(1)
INPUT
RIN
OUTPUT
ROUT
L
H
H
L
H = high level, L = low level
LOGIC DIAGRAM (POSITIVE LOGIC)
11
14
DIN1
DOUT1
10
7
DIN2
DOUT2
12
13
ROUT1
RIN1
9
8
ROUT2
2
RIN2
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MAX232E
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SLLS723B – APRIL 2006 – REVISED NOVEMBER 2009
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
VCC
Input supply voltage range (2)
VS+
Positive output supply voltage range
VS–
Negative output supply voltage range
VI
Input voltage range
VO
Output voltage range
Driver
MIN
MAX
–0.3
6
V
VCC – 0.3
15
V
–0.3
–15
V
–0.3
VCC + 0.3
Receiver
Short-circuit duration
Package thermal impedance (3)
(4)
TJ
Operating virtual junction temperature
Tstg
Storage temperature range
DOUT
VS– – 0.3
VS+ + 0.3
ROUT
–0.3
VCC + 0.3
(2)
(3)
(4)
V
Unlimited
D package
73
DW package
57
N package
67
PW package
(1)
V
±30
DOUT
θJA
UNIT
°C/W
108
–65
150
°C
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network GND.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions
VCC
Supply voltage
VIH
High-level input voltage (DIN1, DIN2)
VIL
Low-level input voltage (DIN1, DIN2)
MIN
NOM
MAX
4.5
5
5.5
V
2
V
Receiver input voltage (RIN1, RIN2)
TA
UNIT
MAX232EC
Operating free-air temperature
MAX232EI
0.8
V
±30
V
0
70
–40
85
°C
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
ICC
(1)
(2)
TEST CONDITIONS
Supply current
VCC = 5.5 V,
MIN
All outputs open, TA = 25°C
TYP (2) MAX
8
10
UNIT
mA
Test conditions are C1–C4 = 1 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 5 V and TA = 25°C.
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MAX232E
SLLS723B – APRIL 2006 – REVISED NOVEMBER 2009
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DRIVER SECTION
abc
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature range
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage
DOUT
RL = 3 kΩ to GND
VOL
Low-level output voltage (3)
DOUT
RL = 3 kΩ to GND
ro
Output resistance
DOUT
VS+ = VS– = 0,
VO = ±2 V
IOS
(4)
Short-circuit output current
DOUT
VCC = 5.5 V,
VO = 0
IIS
Short-circuit input current
DIN
VI = 0
(1)
(2)
(3)
(4)
MIN
5
TYP (2)
MAX
7
–7
UNIT
V
–5
V
Ω
300
±10
mA
200
μA
Test conditions are C1–C4 = 1 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 5 V and TA = 25°C.
The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic
voltage levels only.
Not more than one output should be shorted at a time.
Switching Characteristics (1)
VCC = 5 V, TA = 25°C (see Note 4)
PARAMETER
TEST CONDITIONS
SR
Driver slew rate
RL = 3 kΩ to 7 kΩ, See Figure 2
SR(t)
Driver transition region slew rate
See Figure 3
Data rate
One DOUT switching
(1)
MIN
TYP
MAX
UNIT
30
V/μs
3
V/μs
250
kbit/s
Test conditions are C1–C4 = 1 μF at VCC = 5 V ± 0.5 V.
ESD protection
PARAMETER
DOUT, RIN
4
TYP
UNIT
HBM
TEST CONDITIONS
±15
kV
IEC61000-4-2, Air-Gap Discharge
±15
kV
IEC61000-4-2, Contact Discharge
±8
kV
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Copyright © 2006–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX232E
MAX232E
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SLLS723B – APRIL 2006 – REVISED NOVEMBER 2009
RECEIVER SECTION
abc
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature range
PARAMETER
MIN TYP (2)
TEST CONDITIONS
VOH
High-level output voltage
ROUT
IOH = –1 mA
VOL
Low-level output voltage (3)
ROUT
IOL = 3.2 mA
VIT+
Receiver positive-going input threshold voltage
RIN
VCC = 5 V,
TA = 25°C
VIT–
Receiver negative-going input threshold voltage
RIN
VCC = 5 V,
TA = 25°C
Vhys
Input hysteresis voltage
RIN
VCC = 5 V
ri
Receiver input resistance
RIN
VCC = 5 V,
(1)
(2)
(3)
MAX
3.5
TA = 25°C
UNIT
V
1.7
0.4
V
2.4
V
0.8
1.2
0.2
0.5
1
V
V
3
5
7
kΩ
Test conditions are C1–C4 = 1 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 5 V and TA = 25°C.
The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic
voltage levels only.
Switching Characteristics (1)
VCC = 5 V, TA = 25°C (see Figure 1)
PARAMETER
TYP
UNIT
tPLH(R)
Receiver propagation delay time, low- to high-level output
500
ns
tPHL(R)
Receiver propagation delay time, high- to low-level output
500
ns
(1)
Test conditions are C1–C4 = 1 μF at VCC = 5 V ± 0.5 V.
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MAX232E
SLLS723B – APRIL 2006 – REVISED NOVEMBER 2009
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PARAMETER MEASUREMENT INFORMATION
VCC
RL = 1.3 kΩ
Pulse
Generator
(see Note A)
See Note C
ROUT
RIN
CL = 50 pF
(see Note B)
TEST CIRCUIT
≤10 ns
Input
10%
≤10 ns
90%
50%
90%
50%
3V
10%
0V
500 ns
tPLH
tPHL
VOH
Output
1.5 V
1.5 V
VOL
WAVEFORMS
A.
The pulse generator has the following characteristics: ZO = 50 Ω, duty cycle ≤ 50%.
B.
CL includes probe and jig capacitance.
C.
All diodes are 1N3064 or equivalent.
Figure 1. Receiver Test Circuit and Waveforms for tPHL and tPLH Measurements
6
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MAX232E
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SLLS723B – APRIL 2006 – REVISED NOVEMBER 2009
PARAMETER MEASUREMENT INFORMATION (continued)
Pulse
Generator
(see Note A)
DIN
DOUT
RS-232 Output
CL = 10 pF
(see Note B)
RL
TEST CIRCUIT
≤10 ns
≤10 ns
10%
3V
90%
50%
90%
50%
Input
10%
0V
5 µs
tPLH
tPHL
90%
Output
90%
10%
10%
VOH
VOL
tTLH
tTHL
0.8 (V
SR +
–V )
0.8 (V
–V
)
OH
OL
OL
OH
or
t
t
TLH
THL
WAVEFORMS
A.
The pulse generator has the following characteristics: ZO = 50 Ω, duty cycle ≤ 50%.
B.
CL includes probe and jig capacitance.
Figure 2. Driver Test Circuit and Waveforms for tPHL and tPLH Measurements (5-μs Input)
Pulse
Generator
(see Note A)
DIN
DOUT
RS-232 Output
3 kΩ
CL = 2.5 nF
TEST CIRCUIT
≤10 ns
≤10 ns
Input
90%
1.5 V
90%
1.5 V
10%
10%
20 µs
tTLH
tTHL
Output
3V
3V
−3 V
−3 V
SR +
VOH
VOL
6V
tTHL or t TLH
WAVEFORMS
A.
The pulse generator has the following characteristics: ZO = 50 Ω, duty cycle ≤ 50%.
Figure 3. Test Circuit and Waveforms for tTHL and tTLH Measurements (20-μs Input)
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MAX232E
SLLS723B – APRIL 2006 – REVISED NOVEMBER 2009
www.ti.com
APPLICATION INFORMATION
5V
CBYPASS = 1 µF
+
−
16
1
C1
C1+
1 µF 3
1 µF 5
From CMOS or TTL
To CMOS or TTL
8.5 V
VS+
6
VS−
C2+
1 µF
2
C1−
4
C2
C3†
VCC
−8.5 V
C4
+
C2−
11
14
10
7
12
13
9
8
0V
1 µF
RS-232 Output
RS-232 Output
RS-232 Input
RS-232 Input
15
GND
†
C3 can be connected to VCC or GND.
A.
Resistor values shown are nominal.
B.
Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should
be connected as shown. In addition to the 1-μF capacitors shown, the MAX202E can operate with 0.1-μF capacitors.
Figure 4. Typical Operating Circuit
8
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PACKAGE OPTION ADDENDUM
www.ti.com
17-Nov-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
MAX232ECD
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX232ECDG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX232ECDR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX232ECDRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX232ECDW
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX232ECDWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX232ECDWR
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX232ECDWRG4
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX232ECN
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
MAX232ECNE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
MAX232ECPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX232ECPWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX232ECPWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX232ECPWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX232EID
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX232EIDG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX232EIDR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX232EIDRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX232EIDW
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX232EIDWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX232EIDWR
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX232EIDWRG4
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX232EIN
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
MAX232EINE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
MAX232EIPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
17-Nov-2009
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
MAX232EIPWG4
ACTIVE
TSSOP
PW
16
MAX232EIPWR
ACTIVE
TSSOP
PW
MAX232EIPWRG4
ACTIVE
TSSOP
PW
90
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
MAX232ECDR
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
MAX232ECDWR
SOIC
DW
16
2000
330.0
16.4
10.75
10.7
2.7
12.0
16.0
Q1
MAX232ECPWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
MAX232EIDR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
MAX232EIDWR
SOIC
DW
16
2000
330.0
16.4
10.75
10.7
2.7
12.0
16.0
Q1
MAX232EIPWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MAX232ECDR
SOIC
D
16
2500
346.0
346.0
33.0
MAX232ECDWR
SOIC
DW
16
2000
346.0
346.0
33.0
MAX232ECPWR
TSSOP
PW
16
2000
346.0
346.0
29.0
MAX232EIDR
SOIC
D
16
2500
346.0
346.0
33.0
MAX232EIDWR
SOIC
DW
16
2000
346.0
346.0
33.0
MAX232EIPWR
TSSOP
PW
16
2000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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