Material Content Data Sheet Sales Product Name TLE6214L Issued MA# MA001040882 Package PG-DSO-12-11 28. August 2013 Weight* 406.73 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal inorganic material non noble metal noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin phosphorus nickel silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7723-14-0 7440-02-0 7440-22-4 7440-31-5 7439-92-1 11.431 2.81 0.230 0.06 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 2.81 28106 28106 566 0.069 0.02 230.106 56.58 56.66 565748 170 566484 0.416 0.10 0.10 1024 1024 0.300 0.07 738 13.812 3.40 136.021 33.44 36.91 334426 33959 369123 4.235 1.04 1.04 10413 10413 0.002 0.00 0.630 0.15 0.237 0.06 0.190 0.05 9.049 2.22 4 0.15 1549 466 2.33 22249 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 1553 582 23297 1000000