HLMP-AG62/AG63, AH62/AH63, AL62/AL63 HLMP-HG62/HG63, HH62/HH63, HL62/HL63 5mm Mini Oval and Standard Oval AlInGaP LEDs Data Sheet Description Features These Precision Optical Performance AlInGaP Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. The package epoxy contains both UV-A and UV-B inhibitors to reduce the effects of long term exposure to direct sunlight. • Viewing Angle: 30°x70° and 40°x100° Applications • Package options: Stand-off and Non Stand-off Leads • Full color signs • Colors: 590nm Amber 615nm Red-Orange 626nm Red • Well defined spatial radiation pattern • High brightness material • Superior resistance to moisture • Tinted and diffused Package Dimensions For 5mm Mini Oval 30°x70° Package Drawing A 0.8 max. 0.032 8.70 ± 0.20 0.342 ± 0.008 3.80 ± 0.200 0.150 ± 0.008 0.50 ± 0.10 sq. typ. 0.020 ± 0.004 0.70 max. 0.028 5.20 ± 0.200 0.205 ± 0.008 2.54 ± 0.3 0.100 ± 0.012 cathode lead 1.00 min. 0.038 24.00 min. 0.945 Package Drawing B 11.70 ± 0.50 0.4606 ± 0.020 1.50 ± 0.15 0.0591 ± 0.006 0.70 max. 0.028 0.50 ± 0.10 sq. typ. 0.020 ± 0.004 3.80 ± 0.200 0.150 ± 0.008 5.20 ± 0.20 0.205 ± 0.008 2.54 ± 0.3 0.100 ± 0.012 8.70 ± 0.20 0.342 ± 0.008 0.8 max. 0.032 cathode lead 24.00 min. 0.945 1.00 min. 0.038 For 5mm Standard Oval 40°x100° Package Drawing C 1.02 max. 0.040 3.80 0.150 0.50±0.10 sq. typ. .020±.004 0.70 max. .028 5.20 0.205 cathode lead 7.00 0.276 25.00 min. 0.984 10.80±0.50 0.425±0.020 1.50±0.15 0.059±0.006 1.00 min. .039 2.54 0.10 Package Drawing D 3.80 0.150 0.50±0.10 sq. typ. 0.020±0.004 5.20 0.205 7.00 0.276 Notes: All dimensions in millimeters (inches). 2 1.02 max. 0.040 cathode lead 24.00 min. 0.945 1.00 min. 0.039 2.54±0.30 0.10±0.012 Device Selection Guide 5mm Mini Oval 30°x70° Part Number Color and Dominant Wavelength λd (nm) Typ. Luminous Intensity Iv (mcd) at 20 mA Min. Luminous Intensity Iv (mcd) at 20 mA Max. Stand-Off Package Drawing HLMP-AL62-UX0DD Amber 590 960 1990 No A HLMP-AL62-X10DD Amber 590 1660 3500 No A HLMP-AH62-UX0DD Red-Orange 615 960 1990 No A HLMP-AH62-X10DD Red-Orange 615 1660 3500 No A HLMP-AG62-UX0DD Red 626 960 1990 No A HLMP-AG62-X10DD Red 626 1660 3500 No A HLMP-AL63-UX0DD Amber 590 960 1990 Yes B HLMP-AL63-X10DD Amber 590 1660 3500 Yes B HLMP-AH63-UX0DD Red-Orange 615 960 1990 Yes B HLMP-AH63-X10DD Red-Orange 615 1660 3500 Yes B HLMP-AG63-UX0DD Red 626 960 1990 Yes B HLMP-AG63-X10DD Red 626 1660 3500 Yes B Part Number Color and Dominant Wavelength λd (nm) Typ Luminous Intensity Iv (mcd) at 20 mA Min. Luminous Intensity Iv (mcd) at 20 mA Max. Stand-Off Package Drawing HLMP-HL62-TX0DD Amber 590 800 1990 No C HLMP-HH62-TX0DD Red-Orange 615 800 1990 No C HLMP-HG62-TX0DD Red 626 800 1990 No C HLMP-HL63-TX0DD Amber 590 800 1990 Yes D HLMP-HH63-TX0DD Red-Orange 615 800 1990 Yes D HLMP-HG63-TX0DD Red 626 800 1990 Yes D 5mm Standard Oval 40°x100° Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package. 2. Tolerance for each intensity limit is ± 15%. 3. Please refer to AN 5352 for detail information on features of stand-off and non stand-off LEDs. 3 Part Numbering System HLMP- x x 62/63 - x x x x x Packaging Option DD: Ammopacks Color Bin Selection 0: Open distribution Maximum Intensity Bin Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide. Color G: Red 626nm H: Red Orange 615nm L: Amber 590nm Package A: 5mm Mini Oval 30° x 70° H: 5mm Standard Oval 40°x100° Note: Please refer to AB 5337 for complete information on part numbering system. Absolute Maximum Ratings TA = 25°C Parameter Value Unit DC Forward Current [1] 50 mA Peak Forward Current 100 [2] mA Power Dissipation 120 mW Reverse Voltage 5 (IR = 100 μA) V LED Junction Temperature 130 °C Operating Temperature Range -40 to +100 °C Storage Temperature Range -40 to +100 °C Notes: 1. Derate linearly as shown in Figure 4. 2. Duty Factor 30%, frequency 1kHz. 4 Electrical / Optical Characteristics TA = 25°C Parameter Forward Voltage Amber Red Red-Orange Reverse Voltage Dominant Wavelength [1] Amber Red Red-Orange Peak Wavelength Amber Red Red-Orange Thermal Resistance Luminous Efficacy [2] Amber Red Red-Orange Symbol Min. Typ. Max. Units Test Conditions VF 1.8 2.2 2.1 2.0 2.4 V IF = 20 mA VR 5 V IR = 100 μA λd 584.5 620 612 nm IF = 20 mA 594.5 630 621.7 λPEAK 590 626 615 nm Peak of Wavelength of Spectral Distribution at IF = 20 mA RθJ-PIN 240 °C/W LED Junction-to-Anode Lead ηV 480 150 260 lm/W Emitted Luminous Power/Emitted Radiant Power Notes: 1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp. Tolerance for each color of dominant wavelength is ± 0.5nm. 2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/ηV where IV is the luminous intensity in candelas and ηV is the luminous efficacy in lumens/watt. Figure 1. Relative intensity vs. peak wavelength 5 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 60 RED 50 FORWARD CURRENT - mA RED-ORANGE 40 AMBER 30 20 10 0 0 0.5 1 1.5 2 FORWARD VOLTAGE - V 2.5 1 0.5 0 10 20 30 40 50 DC FORWARD CURRENT - mA Figure 3. Relative luminous intensity vs. forward current 1 50 0.9 45 0.8 40 NORMALIZED INTENSITY IF - FORWARD CURRENT - mA 1.5 0 55 35 30 25 20 15 0.7 0.6 0.5 0.4 0.3 10 0.2 5 0.1 0 0 20 40 60 80 T A - AMBIENT TEMPERATURE - ºC 100 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES 60 90 Figure 5. Representative Radiation pattern for 30°x70° Lamp -Major Axis NORMALIZED INTENSITY 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 0 -90 120 Figure 4. Maximum forward current vs. ambient temperature NORMALIZED INTENSITY 2 3 Figure 2. Forward current vs. forward voltage 60 Figure 6. Representative Radiation pattern 30°x70° Lamp -Minor Axis 6 2.5 90 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES 60 Figure 7. Representative Radiation pattern for 40°x100° Lamp -Major Axis 90 10 RELATIVE LOP (NORMALIZE AT 25 °C ) NORMALIZED INTENSITY 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 AMBER RED-ORANGE 1 0.1 -60 -30 0 30 60 90 -50 -25 0 ANGULAR DISPLACEMENT - DEGREES 25 50 75 100 JUNCTION TEMPERATURE - °C Figure 8. Representative Radiation pattern 40°x100° Lamp –Minor Axis Figure 9. Relative Light Output vs Junction temperature Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio) VF Bin Table (V at 20mA) Intensity (mcd) at 20 mA 125 Bin ID Min Max 1.8 2.0 Bin Min Max VD U 960 1150 VA 2.0 2.2 V 1150 1380 VB 2.2 2.4 W 1380 1660 X 1660 1990 Y 1990 2400 Z 2400 2900 Bin Min Max 1 2900 3500 1 584.5 587.0 2 587.0 589.5 4 589.5 592.0 6 592.0 594.5 Tolerance for each bin limit is ± 15% Tolerance for each bin limit is ±0.05V Amber Color Bin Limits Tolerance for each bin limit is ± 0.5nm. 7 RED 150 Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED configuration Soldering and Handling: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip 1.59mm closer than 1.59mm might damage the LED. • ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105 °C Max. - Preheat time 60 sec Max - Peak temperature 250 °C Max. 260 °C Max. Dwell time 3 sec Max. 5 sec Max Anode Note: Electrical connection between bottom surface of LED die and the lead frame is achieved through conductive paste. • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. Note: In order to further assist customer in designing jig accurately that fit Avago Technologies’ product, 3D model of the product is available upon request. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads. Note: 1. Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) 8 • Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 TEMPERATURE (°C) Flux: Rosin flux 200 Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) 150 Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 100 50 PREHEAT 0 10 20 30 40 60 50 TIME (MINUTES) 70 80 90 100 Ammo Packs Drawing 6.35±1.30 0.25±0.0512 12.70±1.00 0.50±0.0394 CATHODE 20.50±1.00 0.8071±0.0394 9.125±0.625 0.3593±0.0246 18.00±0.50 0.7087±0.0197 12.70±0.30 0.50±0.0118 9 A 0.70±0.20 0.0276±0.0079 A VIEW A - A Ø 4.00±0.20 TYP 0.1575±0.008 Packaging Box for Ammo Packs FROM LEFT SIDE OF BOX ADHESIVE TAPE MUST BE FACING UPWARDS. LABEL ON THIS SIDE OF BOX ANODE LEAD LEAVES THE BOX FIRST. Note: For InGaN device, the ammo pack packaging box contain ESD logo Packaging Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: 10 (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition: BIN: Example: (i) Color bin only or VF bin only (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) OR BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin “VB” only) (ii) Color bin incorporate with VF Bin BIN: 2VB (ii) Color bin incorporated with VF Bin VB: VF bin “VB” (Applicable for part number that have both color bin and VF bin) 2: Color bin 2 only DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved. AV02-1314EN - April 19, 2011