AKM EM-0791 Shipped in packet-tape reel(5000pcs/reel) Datasheet

Monolithic Hall Effect ICs
EM-series
EM-0791
Shipped in packet-tape reel(5000pcs/Reel)
EM-0791 is ultra-small Hall effect ICs of a single silicon chip composed of Hall element and a signal processing IC.
Unipolar Hall
Effect Switch
Two output for S
and N-pole
Supply Voltage
1.6〜5.5V
Output
CMOS
Two output
for S and N-pole
High Sensitivity
Hall Element
Pulse
Excitation
Bop:2.5mT
SON
Notice:It is requested to read and accept "IMPORTANT NOTICE" written on the back of the front cover of this catalogue.
●Operational Characteristics
Vout1
Vout 2
S or N
Marking
1
H
H
VOH
VOH
2
1:VDD
Bh1
Bh2
2:VSS
3:OUT 2(S-pole)
N or S
L
VOL
4:OUT 1(N-pole)
0
Brp1
L
Bop1
N-pole
VOL
Bop2
S-pole
0
Brp2
Magnetic flux density
Magnetic flux density
●Functional Block Diagram
1:VDD
●Absolute Maximum Ratings(Ta=25℃)
Symbol
Limit
Unit
Supply Voltage VDD
−0.1 〜 6.0
V
Output Current Iout
±0.5
mA
Operating Temperature Range Topr
−30 〜 +85
℃
Storage Temperature Range Tstg
−40 〜 +125
℃
Switch
4:OUT1
(N-pole)
Dynamic
Offset Cancellation
Item
3:OUT2
(S-pole)
Oscillator Hall
Chopper
&
Element Stabilizer
Timing Logic
Amplifier
Schmitt Output
Trigger Stage
&
Latch
2:VSS
●Magnetic q and Electrical Characteristics(Ta=25℃ VDD=1.85V) ●Magnetic Characteristics w(Ta=−30〜+85℃ VDD=1.85V)
Item
Symbol Conditions
Supply Voltage VDD
Min.
Typ.
1.6
Max.
Unit
Item
5.5
V
Operating Point
BOP1
*1.4
2.5
3.2
BOP2
−3.2
−2.5
*−1.4
Brp1
1.2
2.0
*3.0
Operating Point
mT
Brp2
*−3.0
H y s t e r e s i s Bh1,Bh2
P e r i o d
50
Tp
Io=−0.2mA VDD−0.4
Output Low Voltage VOL
Io=+0.2mA
Supply Current IDD
Average
25
−2.0
−1.2
0.5
Output High Voltage VOH
※
※
Hysteresis
mT
Release Point
Conditions
BOPS
|BOPN|
BrpS
|BrpN|
BhS
Min.
Typ. Max. Unit
1.3
2.5
3.5
mT
1.1
2.0
3.3
mT
0.5
|BhN|
Note) The above specifications are design targets.
mT
100
ms
V
6.5
Release Point
Symbol
0.4
V
9
μA
1[mT]=10[Gauss]
The characteristics with「*」marks are design targets.
OUT1 responds to the positive flux from the north pole(Bop1,Brp1) ,OUT2 to the
negative flux from the south pole(Bop2,Brp2) .
●Application Circuit
VDD
Bypass Capacitor
0.1μF
GND
VDD OUT
CMOS
OUTPUT
EM-0791
VSS OUT
CMOS
OUTPUT
mT
EM-0791
•Please be aware that our products are not intended for use in life support equipment, devices, or systems. Use of our products in such applications requires the
advance written approval of our sales staff.
Certain applications using semiconductor devices may involve potential risks of personal injury, property damage, or loss of life. In order to minimize these risks,
adequate design and operating safeguards should be provided by the customer to minimize inherent or procedural hazards. Inclusion of our products in such
applications is understood to be fully at the risk of the customer using our devices or systems.
a
●Package(Unit:mm)
2
3
0.3
0.75
4
0.50+0
−0.1
Pin No.
1
2
3
4
0.3
3
1
1.3
0.3
4
0.75
1
1.8±0.1
1
0.45±0.1
0.25±0.1
1.2±0.1
●(For reference only)Land Pattern(Unit:mm)
φ0.3
Sensor Center
0.15±0.1
2
Pin Name Function Comment
VDD Supply Voltage
VSS
GND
S-pole
OUT2 Output Voltage
OUT1 Output Voltage N-pole
f
※Note1) The sensor center is located within the φ0.3mm circle.
Note2) The tolerances of dimensions with no mentions is ±0.1mm.
Note3) Coplanarity:The differnces between standoff of terminals are
max.50μm.
Note4) Shaded area is plating area
●Function Timing Chart
IDD
Note5) The center shadow area of the bottom of
HIC does not need to be soldered.
This area shares the lead frame with VSS
inside the package and please be careful
not to short this area to pins except No.2.
●IDD Pulse Driving(VDD=1.85V)
IDD
50ms
t
B
t
B
Bop
146μs
IDD ON
(TYP=1.8mA)
Brp
t
Vout
High
Vout
High
48.8μs
IDD
t (TYP=6.5μA)
IDD OFF
(TYP=1.3μA)
48.8μs
k
Time
Low
Low
t
Operating Point Timing
Release Point Timing
t
T h i s H all IC s output is held as inter nal dat a just befor e the int er nal cir c u it
t u r n s O F F ( I D D O F F ) . A n d a f t e r 4 8 . 8 μs , t h e o u t p u t c h a n g e s .
N o t e ) 4 8 . 8 μs i n f i g u r e s i s t y p i c a l v a l u e
●Supply Voltage
●Temparature Dependence of Bop. Brp
4
6
3
Operating Point[mT]
Supply Voltage[V]
5
4
3
2
1
2
N-pole
1
0
−40
−20
0
20
40
60
Ambient Temperature[℃]
80
100
n
Brp1
o
VDD=1.85V
p
−1
Brp2
S-pole
−2
−3
0
Bop1
−4
−40
Bop2
−20
0
20
40
60
80
100
Ambient Temperature[℃]
26
IMPORTANT NOTICE
 These products and their specifications are subject to change without notice.
When you consider any use or application of these products, please make
inquiries the sales office of Asahi Kasei Microdevices Corporation (AKM) or
authorized distributors as to current status of the products.
 Descriptions of external circuits, application circuits, software and other related
information contained in this document are provided only to illustrate the
operation and application examples of the semiconductor products. You are
fully responsible for the incorporation of these external circuits, application
circuits, software and other related information in the design of your
equipments. AKM assumes no responsibility for any losses incurred by you or
third parties arising from the use of these information herein. AKM assumes no
liability for infringement of any patent, intellectual property, or other rights in
the application or use of such information contained herein.
 Any export of these products, or devices or systems containing them, may
require an export license or other official approval under the law and
regulations of the country of export pertaining to customs and tariffs, currency
exchange, or strategic materials.
 AKM products are neither intended nor authorized for use as critical
componentsNote1) in any safety, life support, or other hazard related device or
systemNote2), and AKM assumes no responsibility for such use, except for the
use approved with the express written consent by Representative Director of
AKM. As used here:
Note1) A critical component is one whose failure to function or perform
may reasonably be expected to result, whether directly or indirectly, in the
loss of the safety or effectiveness of the device or system containing it,
and which must therefore meet very high standards of performance and
reliability.
Note2) A hazard related device or system is one designed or intended for
life support or maintenance of safety or for applications in medicine,
aerospace, nuclear energy, or other fields, in which its failure to function
or perform may reasonably be expected to result in loss of life or in
significant injury or damage to person or property.
 It is the responsibility of the buyer or distributor of AKM products, who
distributes, disposes of, or otherwise places the product with a third party, to
notify such third party in advance of the above content and conditions, and
the buyer or distributor agrees to assume any and all responsibility and
liability for and hold AKM harmless from any and all claims arising from the
use of said product in the absence of such notification.
June 2, 2010
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