Material Content Data Sheet Sales Product Name BTS50070-1EGA MA# MA001080470 Package PG-DSO-12-16 Issued 29. August 2013 Weight* 397.88 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal noble metal non noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper gold aluminium carbon black epoxy resin silicondioxide tin silver Polyimide silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7440-57-5 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 26023-21-2 7440-22-4 7440-31-5 7439-92-1 7.100 1.78 0.230 0.06 wire encapsulation leadfinish plating glue solder *deviation 0.069 0.02 230.106 57.82 0.224 0.06 0.859 0.22 0.297 0.07 Sum [%] Average Mass [ppm] Sum [ppm] 1.78 17844 17844 579 174 57.90 578326 0.28 2158 2. 3. 2722 747 21.246 5.34 127.032 31.93 37.34 319268 53398 373413 4.235 1.06 1.06 10644 10644 2.172 0.55 0.55 5459 5459 0.205 0.05 0.05 514 514 0.103 0.03 0.082 0.02 3.923 0.99 258 207 1.04 Sum in total: 100,00 Important Remarks: 1. 579079 564 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 9860 10325 1000000