Production specification Surface mount switching diode BAW56M FEATURES z For General Purpose switching Applications. z Fast Switching Speed. z High Conductance. z Surface Mount Package Ideally Suited for Pb Lead-free Automatic Insertion. APPLICATIONS z SOT-723 High speed switching application. ORDERING INFORMATION Type No. Marking BAW56M Package Code A1 SOT-723 MAXIMUM RATING @ Ta=25℃ unless otherwise specified Characteristic Symbol Limits Unit Non-repetitive peak reverse voltage VRM 100 V Peak Repetitive Reverse Voltage Working peak reverse voltage DC Reverse Voltage VRRM VRWM VR 75 V Continuous Forward Current Single diode loaded Double diode loaded IF 215 125 mA Non-repetitive forward Surge Current @t=1.0ms @t=1.0s IFSM 1 0.5 A Power Dissipation PD 150 mW Thermal resistance junction to ambient air RθJA 357 ℃/W Operating Junction Temperature Range Tj 150 ℃ Storage Temperature Range TSTG -65 to +150 ℃ N009 Rev.A www.gmicroelec.com 1 Production specification Surface mount switching diode BAW56M ELECTRICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified Characteristic Symbol Min MAX Reverse Breakdown Voltage V(BR)R 75 - UNIT Test Condition V IR= 2.5μA V IF=1mA IF=10mA IF=50mA IF=150mA Forward Voltage VF - 0.715 0.855 1.0 1.25 Reverse Leakage Current IR - 2.5 25 μA nA VR=75V VR=20V Diode Capacitance CD - 2 pF VR=0V,f=1MHz Reverse Recovery Time trr - 4 ns IF=IR=10mA, Irr=0.1* IR,RL=100Ω TYPICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified N009 Rev.A www.gmicroelec.com 2 Production specification Surface mount switching diode N009 Rev.A BAW56M www.gmicroelec.com 3 Production specification Surface mount switching diode BAW56M PACKAGE OUTLINE Plastic surface mounted package SOT-723 J D K B E SOT-723 Dim Min Max A 1.10 1.30 B 0.70 0.90 C F C A D 0.22 0.42 E 0.10 0.30 F 0.12 0.32 G 0.80Typical J 0.10Typical K G 0.54Max 1.1 1.3 All Dimensions in mm SOLDERING FOOTPRINT 1.15 0.45 0.50 0.40 0.40 PACKAGE INFORMATION N009 Rev.A Device Package Shipping BAW56M SOT-723 10000/Tape&Reel www.gmicroelec.com 4