Rohm BD2055AFJ-E2 0.5a current limit high side switch ic Datasheet

Datasheet
1ch High Side Switch ICs
0.5A Current Limit High Side Switch ICs
BD2045AFJ
BD2055AFJ
General Description
BD2045AFJ and BD2055AFJ are single channel high
side switch ICs with over-current protection for
Universal Serial Bus (USB) power supply line. These
ICs have low ON-Resistance N-Channel power
MOSFETs with low supply current, built-in over-current
protection circuit, thermal shutdown circuit, under
voltage lockout and soft-start circuit.
Features
Key Specifications







Input Voltage Range:
2.7V to 5.5V
ON-Resistance:
80mΩ(Typ)
Continuous Current Load:
0.25A
Over-Current Threshold:
0.3A (Min), 0.8A (Max)
Standby Current:
0.01μA (Typ)
Output Rise Time:
1.2ms(Typ)
Operating Temperature Range:
-40°C to +85°C
W(Typ)
Package
 Built-In Low ON-Resistance Nch MOSFET
( Typ=80mΩ )
 Control Input Logic
 Active-Low:
BD2045AFJ
 Active-High:
BD2055AFJ
 Soft-Start Circuit
 Over-Current Protection
 Thermal Shutdown
 Under Voltage Lockout Function
 Open Drain Error Flag Output
 Reverse-Current Protection when Switch Off
 Flag Output Delay
D(Typ)
H (Max)
SOP-J8
4.90mm x 6.00mm x 1.65mm
Applications
USB Hub in Consumer Appliances, PC, PC Peripheral
Equipment, and so forth
Typical Application Circuit
5V(Typ)
C IN
GND
OUT
IN
OUT
IN
OUT
VBUS
D+
+
CL -
DGND
EN( /EN ) /OC
Lineup
Min
0.3A
0.3A
Over-Current Threshold
Typ
Max
0.5A
0.8A
0.5A
0.8A
Control Input
Logic
Low
SOP-J8
Reel of 2500
BD2045AFJ-E2
High
SOP-J8
Reel of 2500
BD2055AFJ-E2
Package
Orderable Part Number
○Product structure：Silicon monolithic integrated circuit ○This product has not designed protection against radioactive rays
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Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
BD2045AFJ
BD2055AFJ
Block Diagram
GND
OUT
IN
UVLO
IN
EN(/EN)
Charge
pump
OUT
OCD
Gate logic
OUT
TSD
/OC
Pin Configurations
BD2055AFJ
TOP VIEW
BD2045AFJ
TOP VIEW
1
GND
OUT
8
1
GND
OUT
8
2
IN
OUT
7
2
IN
OUT
7
3
IN
OUT
6
3
IN
OUT
6
4
/EN
/OC
5
4
EN
/OC
5
Pin Description
Pin No.
Symbol
I/O
1
GND
I
2, 3
IN
I
4
EN, /EN
I
5
/OC
O
6, 7, 8
OUT
O
Pin Function
Ground.
Power supply input.
Input terminal to the power switch and power supply input terminal of the internal circuit.
When used, connect each pin outside.
Enable input.
/EN: Power switch on at low level. (BD2045AFJ)
EN: Power switch on at high level. (BD2055AFJ)
High level input > 2.0V, low level input < 0.8V.
Error flag output.
Low at over current, thermal shutdown.
Open drain output.
Power switch output.
When used, connect each pin outside.
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BD2045AFJ
BD2055AFJ
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Supply Voltage
V IN
-0.3 to +6.0
V
Enable Voltage
V EN , V /EN
-0.3 to +6.0
V
V /OC
-0.3 to +6.0
V
/OC Voltage
/OC Current
I /OC
10
mA
OUT Voltage
V OUT
-0.3 to +6.0
V
Storage Temperature
Tstg
-55 to +150
°C
Power Dissipation
Pd
0.67
(Note 1)
W
(Note 1) Derating in done 5.4 mW/°C for operating above Ta≧25°C (Mount on 1-layer 70.0mm x 70.0mm x 1.6mm board)
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Symbol
Rating
Min
Typ
Max
Unit
Operating Voltage
V IN
2.7
-
5.5
V
Operating Temperature
Topr
-40
-
+85
°C
I LO
0
-
250
mA
Continuous Output Current
Electrical Characteristics
BD2045AFJ
(Unless otherwise specified, V IN = 5.0V, Ta = 25°C)
Limit
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Operating Current
I DD
-
90
120
μA
V /EN = 0V, OUT = OPEN
Standby Current
I STB
-
0.01
1
μA
V /EN = 5V, OUT = OPEN
V /ENH
2.0
-
-
V
High Input
-
-
0.8
V
Low Input
/EN Input Voltage
V /ENL
-
-
0.4
V
Low Input 2.7V≤ V IN ≤4.5V
/EN Input Current
I /EN
-1.0
+0.01
+1.0
μA
V /EN = 0V or V /EN = 5V
/OC Output Low Voltage
V /OC
-
-
0.5
V
I /OC = 5mA
/OC Output Leak Current
I L/OC
-
0.01
1
μA
V /OC = 5V
/OC Delay Time
t /OC
-
2.5
8
ms
ON-Resistance
R ON
-
80
100
mΩ
Over-Current Threshold
I TH
0.3
0.5
0.8
A
Output Current at Short
I SC
0.3
0.5
0.7
A
Output Rise Time
t ON1
-
1.2
10
ms
Output Turn ON Time
t ON2
-
1.5
20
ms
Output Fall Time
t OFF1
-
1
20
μs
Output Turn OFF Time
t OFF2
-
3
40
μs
V TUVH
2.1
2.3
2.5
V
Increasing V IN
V TUVL
2.0
2.2
2.4
V
Decreasing V IN
UVLO Threshold
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I OUT = 250mA
V IN = 5V, V OUT = 0V,
C L = 100μF (RMS)
R L = 20Ω , C L = OPEN
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21.Aug.2014 Rev.002
BD2045AFJ
BD2055AFJ
Electrical Characteristics - continued
BD2055AFJ
(Unless otherwise specified, V IN = 5.0V, Ta = 25°C)
Limit
Parameter
Symbol
Min
Typ
Operating Current
I DD
Standby Current
EN Input Voltage
Max
Unit
Conditions
-
90
120
μA
I STB
-
0.01
1
μA
V EN = 0V, OUT = OPEN
V ENH
2.0
-
-
V
High Input
-
-
0.8
V
Low Input
V ENL
V EN = 5V, OUT = OPEN
-
-
0.4
V
Low Input 2.7V≤ V IN ≤4.5V
I EN
-1.0
+0.01
+1.0
μA
V EN = 0V or V EN = 5V
/OC Output Low Voltage
V /OC
-
-
0.5
V
I /OC = 5mA
/OC Output Leak Current
I L/OC
-
0.01
1
μA
V /OC = 5V
/OC Delay Time
t /OC
-
2.5
8
ms
ON-Resistance
R ON
-
80
100
mΩ
Over-Current Threshold
I TH
0.3
0.5
0.8
A
Output Current at Short
I SC
0.3
0.5
0.7
A
Output Rise Time
t ON1
-
1.2
10
ms
Output Turn ON Time
t ON2
-
1.5
20
ms
Output Fall Time
t OFF1
-
1
20
μs
Output Turn OFF Time
t OFF2
-
3
40
μs
V TUVH
2.1
2.3
2.5
V
Increasing V IN
V TUVL
2.0
2.2
2.4
V
Decreasing V IN
EN Input Current
UVLO Threshold
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I OUT = 250mA
V IN = 5V, V OUT = 0V,
C L = 100μF (RMS)
R L = 20Ω , C L = OPEN
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21.Aug.2014 Rev.002
BD2045AFJ
BD2055AFJ
Measurement Circuit
VIN
VIN
A
1uF
1uF
GND
OUT
GND
OUT
IN
OUT
IN
OUT
IN
OUT
IN
OUT
/OC
EN(/EN)
/OC
EN(/EN)
RL
VEN (V/EN )
VEN (V/EN )
A. Operating Current
B.
VIN
EN, /EN Input Voltage, Output Rise / Fall Time
VIN
VIN
10k
1uF
VIN
1uF
I/OC
GND
OUT
GND
OUT
IN
OUT
IN
OUT
IN
OUT
IN
OUT
EN(/EN)
/OC
EN(/EN)
CL
/OC
IOUT
CL
VEN (V/EN )
VEN (V/EN )
C. ON-Resistance, Over Current Detection
D. /OC Output Low Voltage
Figure 1. Measurement Circuit
Timing Diagram
tOFF1
tOFF1
tON1
tON1
90%
90%
90%
VOUT
90%
VOUT
10%
10%
10%
10%
tOFF2
tOFF2
tON2
tON2
V/EN
VEN
V/ENL
V/ENH
VENH
Figure 2. Timing Diagram(BD2045AFJ)
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TSZ22111･15･001
VENL
Figure 3. Timing Diagram (BD2055AFJ)
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BD2045AFJ
BD2055AFJ
Typical Performance Curves
120
120
VIN=5.0V
100
Operating Current : IDD[μA]
Operating Current : IDD[μA]
Ta=25°C
80
60
40
20
3
4
5
Supply Voltage : VIN[V]
80
60
40
20
0
-50
0
2
100
6
50
100
Ambient Temperature : Ta[°C]
Figure 5. Operating Current vs Ambient Temperature
( EN, /EN Enable)
Figure 4. Operating Current vs Supply Voltage
(EN, /EN Enable)
1.0
1.0
Ta=25°C
VIN=5.0V
0.8
Standby Current : ISTB[μA]
Standby Current : ISTB[μA]
0
0.6
0.4
0.2
0.0
0.8
0.6
0.4
0.2
0.0
2
3
4
5
Supply Voltage : VIN[V]
6
-50
Figure 6. Standby Current vs Supply Voltage
(EN, /EN Disable)
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TSZ22111･15･001
0
50
100
Ambient Temperature : Ta[°C]
Figure 7. Standby Current vs Ambient Temperature
(EN, /EN Disable)
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BD2045AFJ
BD2055AFJ
Typical Performance Curves - continued
2.0
Enable Input Voltage : VEN, V/EN [V]
Enable Input Voltage : VEN, V/EN [V]
2.0
Ta=25°C
1.5
Low to High
High to Low
1.0
0.5
VIN=5.0V
1.5
Low to High
High to Low
1.0
0.5
0.0
0.0
2
3
4
5
Supply Voltage : VIN[V]
-50
6
0
50
Ambient Temperature : Ta[°C]
Figure 8. EN, /EN Input Voltage
vs Supply Voltage
Figure 9. EN, /EN Input Voltage
vs Ambient Temperature
0.5
0.5
Ta=25°C
/OC Output Low Voltage : V/OC[V]
/OC Output Low Voltage : V/OC[V]
100
0.4
0.3
0.2
0.1
VIN=5.0V
0.4
0.3
0.2
0.1
0.0
0.0
2
3
4
5
Supply Voltage : VIN[V]
-50
6
50
100
Ambient Temperature : Ta[°C]
Figure 10. /OC Output Low Voltage
vs Supply Voltage
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TSZ22111･15･001
0
Figure 11. /OC Output Low Voltage vs
Ambient Temperature
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BD2045AFJ
BD2055AFJ
Typical Performance Curves - continued
200
Ta=25°C
VIN=5.0V
ON-Resistance
: RON[mΩ]
ON RESISTANCE
:
150
150
RON [mΩ]
ON-Resistance: RON[mΩ]
200
100
50
0
2
3
4
5
100
50
0
-50
6
Supply Voltage : VIN[V]
Figure 12. ON-Resistance
vs Supply Voltage
Figure 13. ON-Resistance
vs Ambient Temperature
5.0
5.0
VIN=5.0V
4.0
4.0
/OC DELAY TIME :
TD/OC[mS]
/OC Delay
Time: t/OC [ms]
/OC DELAY TIME :
/OC Delay Time: t/OC [ms]
TD/OC[mS]
Ta=25°C
3.0
2.0
1.0
0.0
0
50
100
AMBIENT
: Ta[℃]
AmbientTEMPERATURE
Temperature : Ta[°C]
3.0
2.0
1.0
0.0
2
3
4
5
SupplyVOLTAGE:
Voltage: VV
[V]
ININ
SUPPLY
[V]
6
0
50
100
Ambient Temperature: Ta [°C]
Figure 14. /OC Delay Time vs
Supply Voltage
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TSZ22111･15･001
-50
Figure 15. /OC Delay Time vs
Ambient Temperature
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BD2045AFJ
BD2055AFJ
Typical Performance Curves - continued
1.00
Ta=25°C
Short Circuit Current : ISC[A]
Short Circuit Current : ISC[A]
1.00
0.75
0.50
0.25
0.00
2
3
4
5
VIN=5.0V
0.75
0.50
0.25
0.00
6
-50
Supply Voltage : VIN[V]
Figure 17. Short Circuit Current
vs Ambient Temperature
Figure 16. Short Circuit Current
vs Supply Voltage
5.0
5.0
Output Rise Time : tON1[ms]
Ta=25°C
Output Rise Time : tON1[ms]
0
50
100
Ambient Temperature : Ta[°C]
4.0
3.0
2.0
1.0
0.0
2
3
4
5
Supply Voltage : VIN[V]
4.0
3.0
2.0
1.0
0.0
6
-50
Figure 18. Output Rise Time
vs Supply Voltage
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VIN=5.0V
0
50
Ambient Temperature : Ta[°C]
100
Figure 19. Output Rise Time
vs Ambient Temperature
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BD2045AFJ
BD2055AFJ
Typical Performance Curves - continued
5.0
Ta=25°C
Output Turn ON Time : tON2[ms]
Output Turn ON Time : tON2[ms]
5.0
4.0
3.0
2.0
1.0
VIN=5.0V
4.0
3.0
2.0
1.0
0.0
0.0
2
3
4
5
Supply Voltage : VIN[V]
-50
6
100
Figure 21. Output Turn ON Time
vs Ambient Temperature
Figure 20. Output Turn ON Time
vs Supply Voltage
5.0
5.0
VIN=5.0V
Output Fall Time : tOFF1[µs]
Ta=25°C
Output Fall Time : tOFF1[µs]
0
50
Ambient Temperature : Ta[°C]
4.0
3.0
2.0
1.0
4.0
3.0
2.0
1.0
0.0
0.0
2
3
4
5
Supply Voltage : VIN[V]
-50
6
50
100
Ambient Temperature : Ta[°C]
Figure 23. Output Fall Time
vs Ambient Temperature
Figure 22. Output Fall Time
vs Supply Voltage
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BD2045AFJ
BD2055AFJ
Typical Performance Curves - continued
5.0
Ta=25°C
Output Turn OFF Time : tOFF2[µs]
Output Turn OFF Time : tOFF2[µs]
5.0
4.0
3.0
2.0
1.0
0.0
2
3
4
5
VIN=5.0V
4.0
3.0
2.0
1.0
0.0
6
-50
Supply Voltage : VIN[V]
100
Figure 25. Output Turn OFF Time
vs Ambient Temperature
Figure 24. Output Turn OFF Time
vs Supply Voltage
2.5
1.0
UVLO Hysteresis Voltage : VHYS[V]
UVLO Threshold : VUVLOH, VUVLOL [V]
0
50
Ambient Temperature : Ta[°C]
2.4
VUVLOH
2.3
VUVLOL
2.2
2.1
2.0
-50
0
50
100
Ambient Temperature : Ta[°C]
0.6
0.4
0.2
0.0
-50
0
50
100
Ambient Temperature : Ta[°C]
Figure 26. UVLO Threshold Voltage
vs Ambient Temperature
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TSZ22111･15･001
0.8
Figure 27. UVLO Hysteresis Voltage
vs Ambient Temperature
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BD2045AFJ
BD2055AFJ
Typical Wave Forms
V/EN
(5V/div.)
V/EN
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VIN=5V
RL=20Ω
VIN=5V
RL=20Ω
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
Time(1ms/div.)
Time(1ms/div.)
Figure 28. Output Rise Characteristic
(BD2045AFJ)
Figure 29. Output Fall Characteristic
(BD2045AFJ)
V/OC
(5V/div.)
V/EN
(1V/div.)
VOUT
(5V/div.)
IOUT
(0.1A/div.)
V/OC
(1V/div.)
CL=100μF
CL=47μF
CL=147μF
VIN=5V
RL=20Ω
IOUT
(0.5A/div.)
VIN=5V
Time (2ms/div.)
Time (20ms/div.)
Figure 30. Inrush Current Response
(BD2045AFJ)
Figure 31. Over Current Response
Ramped Load
(BD2045AFJ)
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BD2045AFJ
BD2055AFJ
Typical Wave Forms - continued
V/OC
(5V/div.)
V/EN
(5V/div.)
VOUT
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
VIN=5V
CL=100μF
VIN=5V
Time (2ms/div.)
Time (2ms/div.)
Figure 32. Over Current Response
Ramped Load
(BD2045AFJ)
Figure 33. Over Current Response
Enable to Short-Circuit
(BD2045AFJ)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VIN=5V
CL=100μF
Thermal Shutdown
IOUT
(0.5A/div.)
IOUT
(1.0A/div.)
VIN=5V
CL=100μF
Time (2ms/div.)
Time (1s/div.)
Figure 34. Over Current Response
Output 1Ω short at Enable
(BD2045AFJ)
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TSZ22111･15･001
Figure 35. Over Current Response
Output 1Ω short at Enable
(BD2045AFJ)
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BD2045AFJ
BD2055AFJ
Typical Wave Forms - continued
VIN
(5V/div.)
VIN
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
V/OC
(5V/div.)
RL=20Ω
CL=100μF
V/OC
(5V/div.)
RL=20Ω
CL=100μF
Time (10ms/div.)
Time (10ms/div.)
Figure 36. UVLO Response Increasing VIN
(BD2045AFJ)
Figure 37. UVLO Response Decreasing VIN
(BD2045AFJ)
Regarding the output rise/fall and over current detection characteristics of BD2055AFJ, refer to the characteristic of BD2045AFJ.
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BD2045AFJ
BD2055AFJ
Typical Application Circuit
5V(Typ)
VBUS
D+
IN
Regulator
OUT
DGND
USB
Controller
10k to
100kΩ
CIN
GND
OUT
IN
OUT
IN
OUT
VBUS
+
CL -
D+
DGND
EN(/EN) /OC
Application Information
When excessive current flows due to output short circuit or so, ringing occurs by inductance of power source line and IC.
This may cause bad effects on IC operations. In order to avoid this case, a bypass capacitor should be connected across
the IN terminal and GND terminal of IC. A 1μF or higher value is recommended.
Pull-up /OC output by resistance 10kΩ to 100kΩ.
Set-up values for C L which satisfies the application.
This application circuit does not guarantee its operation. When using the circuit with changes to the external circuit
constants, it is better to have an adequate margin for the external components such as static and transient characteristics
as well as dispersion of the IC.
Functional Description
1. Switch Operation
IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. The IN terminal
is also used as power source input to internal control circuit.
When the switch is turned ON by EN(/EN) control input, both the IN and OUT terminals are connected by a 80mΩ
bidirectional switch. Therefore, current flows from OUT terminal to IN terminal since the flow of current is from higher to
lower potentials.
On the other hand, when the switch is turned OFF, it is possible to prevent current from flowing reversely from OUT to IN
since a parasitic diode between the drain and the source of switch MOSFET is not present.
2. Thermal Shutdown Circuit (TSD)
If over-current would continue, the temperature of the IC would increase drastically. If the junction temperature goes
beyond 140°C (Typ) during the condition of over-current detection, thermal shutdown circuit operates and turns the power
switch OFF, causing the IC to output an error flag (/OC). Then, when the junction temperature drops lower than 120°C
(Typ), the power switch is turned ON and error flag (/OC) is cancelled. This operation repeats unless the cause of the
increase of chip’s temperature is removed or the output of power switch is turned OFF.
The thermal shutdown circuit operates when the switch is ON (EN(/EN) signal is active).
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BD2045AFJ
BD2055AFJ
3. Over-Current Detection (OCD)
The over-current detection circuit limits current (I SC ) and outputs error flag (/OC) when current flowing in each switch
MOSFET exceeds a specified value. The over-current detection circuit works when the switch is ON (EN(/EN) signal is
active). There are three types of response against over-current:
(1) When the switch is turned on while the output is in short circuit status, the switch goes into current limit status
immediately.
(2) When the output short circuits or high-current load is connected while the switch is ON, very large current flows until
the over-current limit circuit reacts. When it exceeds the detection value, current limitation is carried out.
(3) When the output current increases gradually, current limit circuit would not operate unless the output current
exceeds the over-current detection value. But when the output current increases gradually and it exceeds the
detection value, current limitation is carried out.
4. Under Voltage Lockout (UVLO)
UVLO circuit prevents the switch from turning on until V IN exceeds 2.3V(Typ). If V IN drops below 2.2V(Typ) while the
switch is ON, then UVLO shuts off the power switch. UVLO has hysteresis of a 100mV(Typ).
Under voltage lockout circuit works when the switch is on (EN(/EN) signal is active).
5. Error Flag (/OC) Output
Error flag output is N-MOS open drain output. During detection of over-current and/or thermal shutdown, the output level
is low.
Over-current detection has delay filter. This delay filter prevents current detection flags from being sent during
instantaneous events such as inrush current at switch on or during hot plug. If fault flag output is unused, /OC pin should
be connected to open or ground line.
V/EN
Output Short Circuit
VOUT
Thermal Shutdown
IOUT
V/OC
/OC Delay Time
Figure 38. Over Current Detection, Thermal Shutdown Timing
(BD2045AFJ)
VEN
Output Short Circuit
VOUT
Thermal Shutdown
IOUT
V/OC
/OC Delay Time
Figure 39. Over Current Detection, Thermal Shutdown Timing
(BD2055AFJ)
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BD2045AFJ
BD2055AFJ
Power Dissipation
(SOP-J8)
700
Power Dissipation : Pd[mW]
POWER DISSIPATION : Pd [mW]
600
500
400
300
200
100
0
0
25
50
75
100
125
AMBIENT
TEMPERATURE
: Ta [℃]
Ambient
Temperature
: Ta[°C]
150
70mm x 70mm x 1.6mm Glass Epoxy Board
Figure 40. Power Dissipation Curve (Pd-Ta Curve)
I/O Equivalence Circuit
Symbol
Pin No
EN(/EN)
4
/OC
5
OUT
6,7,8
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Equivalence Circuit
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BD2045AFJ
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
In rush Current
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes - continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin A
N
P+
N
P
N
P+
N
Parasitic
Elements
N
P+
GND
E
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
Parasitic
Elements
Pin B
B
Parasitic
Elements
GND
GND
Figure 41. Example of monolithic IC structure
N Region
close-by
GND
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
15. Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in
actual states of use.
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BD2045AFJ
BD2055AFJ
Ordering Information
B
D
2
0
4
5
A
Part Number
B
D
F
J
-
Package
FJ: SOP-J8
2
0
5
5
A
Part Number
F
J
Package
FJ: SOP-J8
E2
Packaging and forming specification
E2: Embossed tape and reel
-
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SOP-J8 (TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Part Number
Part Number Marking
BD2045AFJ
D045A
BD2055AFJ
D055A
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BD2045AFJ
BD2055AFJ
Physical Dimension, Tape and Reel Information
Package Name
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BD2045AFJ
BD2055AFJ
Revision History
Date
11.Mar.2013
21.Aug.2014
Revision
001
002
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Changes
New Release
Applied the ROHM Standard Style and improved understandability.
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice – GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice – GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
BD2045AFJ - Web Page
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Distribution Inventory
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BD2045AFJ
SOP-J8
2500
2500
Taping
inquiry
Yes