SPECIFICATION FOR APPROVAL REF : 20090527-A PROD. NAME PAGE: 1 ABC'S DWG NO. HIGH CURRENT MULTILAYER CHIP BEAD MB□□□□□□□□L□-□□□ ABC'S ITEM NO. Ⅰ﹒CONFIGURATION & DIMENSIONS： H A D I C D G I ( PCB Pattern ) B Series MB4532 MB4516 MB3261 MB2029 MB1608 A Unit : m/m B 4.5±0.2 4.5±0.2 3.2±0.2 2.0±0.2 1.6±0.2 3.2±0.2 1.6±0.2 1.6±0.2 1.2±0.2 0.8±0.2 C D 1.5±0.2 1.6±0.2 1.1±0.2 0.9±0.2 0.8±0.2 0.6±0.4 0.6±0.4 0.6±0.4 0.5±0.3 0.3±0.2 G H I 3.0 3.0 2.2 1.0 0.7 3.0 1.4 1.4 1.0 0.7 1.5 1.5 1.1 1.0 0.7 Ⅱ﹒SCHEMATIC DIAGRAM： Ⅲ﹒MATERIALS： a b c a﹒Body：Ferrite b﹒Internal conductor：Silver or Ag / Pd c﹒Terminal：Ag/Ni/Sn d﹒Remark：Products comply with RoHS' requirements Ⅳ﹒GENERAL SPECIFICATION： a﹒Storage temp.：-40℃ ---- +105℃ b﹒Operating temp.：-55℃ ---- +125℃ c﹒Terminal strength： Peak Temp：260℃ max. Max time above 230℃ ：50sec max. Max time above 200℃ ：70sec max. F MB4532 MB4516 MB3261 MB2029 MB1608 F ( kgf ) 1.5 1.0 1.0 0.6 0.5 Time ( sec ) Preheat Area Reflow Area Forced Cooling Area +4.0℃ / sec max. 150 ~ 200 ℃ / 60 ~ 120 sec +2.0 ~ 4.0℃ / sec max. -(1.0 ~ 5.0)℃ / sec max. Peak Temperature: 260℃ 30±5 d﹒Solderability： Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent Solder temp. : 260±5℃ Flux : Rosin Dip time : 4±1 seconds AR-001A Temperature Rising Area 250 50sec max. Temperature ( ℃ ) Type 230℃ 200 150 70sec max. 100 50 0 50 100 150 Time ( seconds ) 200 250 SPECIFICATION FOR APPROVAL REF : 20090527-A PROD. NAME PAGE: 2-1 HIGH CURRENT MULTILAYER CHIP BEAD ABC'S DWG NO. MB□□□□□□□□L□-□□□ ABC'S ITEM NO. Ⅴ﹒ELECTRICAL CHARACTERISTICS： MB4532700YL□ -□□□ Impedance (Ω) at 100MHz 70±25% MB4532121YL□ -□□□ 120±25% 50 3.0 MB4532131YL□ -□□□ 125±25% 50 3.0 MB4516600YL□ -□□□ 60±25% 10 6.0 MB4516750YL□ -□□□ 75±25% 25 3.0 MB4516800YL□ -□□□ 80±25% 50 3.0 DWG No. 1). □：Paclaging Information… A：Bulk 2)."":Reference code □□□ AR-001A RDC (mΩ) max. 30 IDC (A) max. 6.0 B：Taping Reel MB4532700YL□ MB4532121YL□ MB4532131YL□ MB4516600YL□ MB4516750YL□ MB4516800YL□ SPECIFICATION FOR APPROVAL REF : 20090527-A PROD. NAME PAGE: 2-2 ABC'S DWG NO. HIGH CURRENT MULTILAYER CHIP BEAD MB□□□□□□□□L□-□□□ ABC'S ITEM NO. Ⅴ﹒ELECTRICAL CHARACTERISTICS： MB3261190YL□ -□□□ Impedance (Ω) at 100MHz 19±25% RDC (mΩ) max. 40 IDC (A) max. 3.0 MB3261260YL□ -□□□ 26±25% 40 3.0 MB3261310YL□ -□□□ 31±25% 40 3.0 MB3261500YL□ -□□□ 50±25% 25 3.0 MB3261800YL□ -□□□ 80±25% 30 3.0 MB2029070YL□ -□□□ 7±25% 30 3.0 MB2029100YL□ -□□□ 10±25% 30 3.0 MB2029300YL□ -□□□ 30±25% 25 3.0 MB1608300YL□ -□□□ 30±25% 60 1.0 DWG No. 1). □：Paclaging Information… A：Bulk B：Taping Reel 2)."- AR-001A □□□":Reference code MB3261190YL□ MB3261260YL□ MB3261310YL□ MB3261500YL□ MB3261800YL□ MB2029070YL□ MB2029100YL□ MB2029300YL□ MB1608300YL□ SPECIFICATION FOR APPROVAL REF : 20090527-A PROD. PAGE: 3 ABC'S DWG NO. HIGH CURRENT MULTILAYER CHIP BEAD NAME MB□□□□□□□□L□-□□□ ABC'S ITEM NO. Ⅵ﹒PACKAGING INFORMATION： ( 1 ) Configuration T Cover Tape N B A 2.0±0.5 ∮C ∮C D G Embossed Carrier ※Carrier tape width : D P:4 m/m 4 m/m End Start Leader no component 200 m/m min. Trailer no component 400 m/m min. Components User direction of feed Unit:m/m ( 2 ) Dimensions Style A 07 - 08 178 07 - 12 178 B C D G N T 21±0.8 13 8 10 +0 50 -0 12.5 21±0.8 13 12 14 +0 50 -0 16.5 ( 3 ) Q'TY & G.W. Per package Inner : Reel Series MB4532 MB4516 MB3261 MB2029 MB1608 AR-001A Outer : Cartion Q'TY (pcs) G.W. (gw) Style Q'TY(kpcs) G.W. (Kg) 1,000 2,000 3,000 4,000 4,000 170 180 150 120 90 07 - 12 07 - 12 07 - 08 07 - 08 07 - 08 30 80 120 200 200 9.3 9.7 8.5 8.5 7.0 Size (cm) 41 x 39 x 22 41 x 39 x 22 41 x 39 x 22 41 x 39 x 22 41 x 39 x 22 SPECIFICATION FOR APPROVAL REF : 20090527-A PROD. PAGE: 4 HIGH CURRENT MULTILAYER CHIP BEAD NAME ABC'S DWG NO. MB□□□□□□□□L□-□□□ ABC'S ITEM NO. ( 4 ) TYPE DIMENSIONS 4±0.1 (0.157 ±0.004) φ1.55±0.05 2±0.05 (0.079 ±0.002) (0.061 ±0.002) T max. B ±0.1(0.004) F±0.05 (0.002) W±0.2 (0.008) 1.75 ±0.1 (0.069 ±0.004) Fig 1. P±0.1 (0.004) A±0.1 (0.004) 4±0.1 (0.157 ±0.004) φ1.55±0.05 2±0.05 (0.079 ±0.002) (0.061 ±0.002) 0.23 ±0.1(0.00 4) B±0.1(0.004) F±0.05 (0.002) W±0.2 (0.008) 1.75 ±0.1 (0.069 ±0.004) Fig 2. P±0.1 (0.004) T±0. 1(0.00 4) A±0.1 (0.004) Unit:m/m AR-001A Type A B F P T W Fig MB4532 3.66 4.95 5.50 8.0 1.85 12.0 2 MB4516 1.93 4.95 5.50 4.0 1.93 12.0 2 MB3261 1.88 3.50 3.50 4.0 1.27 8.0 2 MB2029 1.50 2.30 3.50 4.0 1.10 8.0 1 MB1608 1.05 1.85 3.50 4.0 1.10 8.0 1 SPECIFICATION FOR APPROVAL REF : 20090527-A PROD. NAME PAGE: 5 HIGH CURRENT MULTILAYER CHIP BEAD ABC'S DWG NO. MB□□□□□□□□L□-□□□ ABC'S ITEM NO. Ⅶ﹒DWGING NUMBER EXPRESSION： M B Reference code Appendix code 2 : Package Appendix code 1 : Classification Tolerance code Electrical code Dimension code Type code Appendix code 1：Product Classification L：Lead Free Standard products comply with RoHS' requirements 1 ~ 9：Lead Free Special products comply with RoHS' requirements Appendix code 2：Package Information Code A B AR-001A Inner package T.B.D. Inner package Q'TY Remark T.B.D. T / R ( Reel package ) 1000 pcs MB4532 T / R ( Reel package ) 2000 pcs MB4516 T / R ( Reel package ) 3000 pcs MB3261 T / R ( Reel package ) 4000 pcs MB2029 T / R ( Reel package ) 4000 pcs MB1608