CEL MC-7884-AZ 870 mhz catv 25 db power doubler amplifier Datasheet

GaAs MULTI-CHIP MODULE
MC-7884
870 MHz CATV 25 dB POWER DOUBLER AMPLIFIER
DESCRIPTION
The MC-7884 is a GaAs Multi-chip Module designed for use in CATV applications up to 870 MHz. This unit has
low distortion, low noise figure and return loss across the entire frequency band.
Reliability and performance uniformity are assured by our stringent quality and control procedures.
FEATURES
• Low distortion
• High linear gain
GL = 25.0 dB MIN. @ f = 870 MHz
• Low return loss
<R>
ORDERING INFORMATION
Part Number
MC-7884
Order Number
Package
MC-7884-AZ
7-pin special with heatsink
Supplying Form
25 pcs MAX./Tray
(Pb-Free)
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: MC-7884
ABSOLUTE MAXIMUM RATINGS (TA = +25°C)
Parameter
Symbol
Ratings
Unit
VDD
30
V
Vi
65.0
dBmV
Operating Case Temperature
TC
−30 to +100
°C
Storage Temperature
Tstg
−40 to +100
°C
Supply Voltage
Input Voltage
Note
Note In case of single tone
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
Document No. PG10316EJ02V0DS (2nd edition)
Date Published December 2006 NS CP(N)
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
2002, 2006
MC-7884
RECOMMENDED OPERATING CONDITIONS (ZS = ZL = 75 Ω)
Parameter
Supply Voltage
Input Voltage
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
23.5
24.0
24.5
V
−
29.0
32.0
dBmV
−30
+25
+85
°C
MIN.
TYP.
MAX.
Unit
f = 870 MHz
25.0
−
26.0
dB
f = 40 to 870 MHz
1.0
1.4
1.8
dB
f = 40 to 870 MHz, Peak to valley
−
−
0.6
dB
VDD
Vi
110 channel,
10 dB tilted across the band
Operating Case Temperature
TC
ELECTRICAL CHARACTERISTICS (TC = 30±5°C, VDD = 24 V, ZS = ZL = 75 Ω)
Parameter
Symbol
Linear Gain
GL
Gain Slope
GSlope
Test Conditions
Gain Flatness
GFlatness
Noise Figure 1
NF1
f = 50 MHz
−
−
5.0
dB
Noise Figure 2
NF2
f = 870 MHz
−
−
5.5
dB
310
−
360
mA
Operating Current
IDD
RF OFF
Composite Triple Beat
CTB
110 channel,
−
−
−60
dBc
Cross Modulation
XM
VO = 52 dBmV at 745.25 MHz,
−
−
−55
dBc
Composite 2nd Order Beat
CSO
10 dB tilted across the band
−
−
−63
dBc
Input Return Loss 1
RLi1
f = 40 to 160 MHz
20
−
−
dB
Input Return Loss 2
RLi2
f = 160 to 320 MHz
20
−
−
dB
Input Return Loss 3
RLi3
f = 320 to 640 MHz
19
−
−
dB
Input Return Loss 4
RLi4
f = 640 to 870 MHz
17
−
−
dB
Output Return Loss 1
RLo1
f = 40 to 160 MHz
20
−
−
dB
Output Return Loss 2
RLo2
f = 160 to 320 MHz
20
−
−
dB
Output Return Loss 3
RLo3
f = 320 to 640 MHz
19
−
−
dB
Output Return Loss 4
RLo4
f = 640 to 870 MHz
18
−
−
dB
2
Data Sheet PG10316EJ02V0DS
MC-7884
PACKAGE DIMENSIONS
7-PIN SPECIAL WITH HEATSINK (UNIT: mm)
8.1 MAX.
38.1±0.25
+0.25
φ 4.25–0.35
27.5 MAX.
4.0±0.25
14.85 MAX.
3.2 MAX.
45.08 MAX.
19.05±0.38
25.4±0.25
6-32UNC2B
0.51±0.05
10.75±0.25
7 8 9
2.62±0.35
5
12.9 MAX.
1 2 3
21.5 MAX.
4.19±0.13
2.54±0.25
A
2.54±0.38
6.3
0.51±0.05
2.5
0.38.. A
±0.05
PIN CONNECTION
VDD
5
1
9
IN
OUT
2
3
7
8
GND
Data Sheet PG10316EJ02V0DS
3
MC-7884
NOTES ON CORRECT USE
(1) The space between PC board and root of the lead should be kept more than 1 mm to prevent undesired stress
to the lead and also should be kept less than 4 mm to prevent undesired parasitic inductance.
Recommended that space is 2.0 to 3.0 mm typical.
(2) Recommended torque strength of the screw is 59 to 78 Ncm.
(3) Form the ground pattern as wide as possible to minimize ground impedance.
(to prevent undesired oscillation)
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Partial Heating
Soldering Conditions
Peak temperature (pin temperature) : 350°C or below
Soldering time (per pin of device)
Recommended Condition Symbol
Note
: 3 seconds or less
Note The point of pin part heating must be kept more than 1.2 mm distance from the root of lead.
4
Data Sheet PG10316EJ02V0DS
−
MC-7884
• The information in this document is current as of December, 2006. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
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M8E 02. 11-1
Data Sheet PG10316EJ02V0DS
5
MC-7884
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
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CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant
with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous
Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive
2003/11/EC Restriction on Penta and Octa BDE.
CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates
that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are
exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals.
All devices with these suffixes meet the requirements of the RoHS directive.
This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that
go into its products as of the date of disclosure of this information.
Restricted Substance
per RoHS
Concentration Limit per RoHS
(values are not yet fixed)
Concentration contained
in CEL devices
-A
Not Detected
Lead (Pb)
< 1000 PPM
Mercury
< 1000 PPM
Not Detected
Cadmium
< 100 PPM
Not Detected
Hexavalent Chromium
< 1000 PPM
Not Detected
PBB
< 1000 PPM
Not Detected
PBDE
< 1000 PPM
Not Detected
-AZ
(*)
If you should have any additional questions regarding our devices and compliance to environmental
standards, please do not hesitate to contact your local representative.
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