ams AS1117 64 led driver for mobile applications with error detection Datasheet

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D a ta s h e e t
AS1117
64 LED Driver for Mobile Applications with Error Detection
1 General Description
2 Key Features
!
3.4MHz I²C-Compatible Interface
!
Individual LED Segment Control
!
Readback for 8 Keys plus Interrupt
!
Open and Shorted LED Error Detection
- Global or Individual Error Detection
!
Hexadecimal- or BCD-Code for 7-Segment Displays
The devices include an integrated BCD code-B/HEX
decoder, multiplex scan circuitry, segment and display
drivers, and a 64-bit memory. Internal memory stores
the shift register settings, eliminating the need for continuous device reprogramming.
!
200nA Low-Power Shutdown Current (typ; data
retained)
!
Digital and Analog Brightness Control
!
Display Blanked on Power-Up
!
Drive Common-Cathode LED Displays
Table 1. Available Products
!
Supply Voltage Range: 2.7V to 5.5V
Interfaces
!
Software and Hardware Reset
no
I²C
!
Up to 4 devices cascadable
no
SPI
!
Optional External Clock
!
Package: TQFN(4x4)-24
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Devices
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The AS1117 is a compact LED driver for 64 single LEDs
or 8 digits of 7-segments. The devices can be programmed via an I²C compatible 2-wire interface. Every
segment can be individually addressed and updated
separately. Only one external resistor (RSET) is required
to set the current. LED brightness can be controlled by
analog or digital means.
RESET Input
AS1115
AS1116
AS1117
AS1118
yes
I²C
yes
SPI
3 Applications
Additionally the AS1117 offers a detailed error diagnostic
mode for easy and fast production testing in critical
applications. The AS1117 features a low shutdown current of typically 200nA, and an operational current of
typically 350µA. The number of digits can be programmed, the devices can be reset by software, and an
external clock is also supported.
The AS1117 is ideal for seven-segment or dot matrix
user interface displays of mobile applications, set-top
boxes, VCRs, DVD-players, washing machines, micro
wave ovens, refrigerators and other white good or personal electronic applications.
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The device is available in a TQFN(4x4)-24 package.
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Figure 1. AS1117 - Typical Application Diagram
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VDD
2.7V to 5.5V
VDD
DIG0 to
DIG7
8
SEGA-DP
KEY0-7
8
Te
9.53kΩ
µP
SDA
SCL
IRQ
ISET
SDA
AS1117
SCL
KEY
IRQ
RESETN
GND
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Revision 1.00
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AS1117
Datasheet - P i n o u t
4 Pinout
Pin Assignments
18 SEG E
DIG3 2
17 SEGC
GND 3
DIG4 4
DIG5 5
15 SEGG
14 SEGB
Exposed
Pad
8
9
10 11 12
RESETN
ISET
SEGA
SCL
DIG7
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7
13 SEGF
KEY
DIG6 6
Pin Descriptions
16 VDD
AS1117
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24 23 22 21 20 19
DIG2 1
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SEGDP
IRQ
SEGD
SDA
DIG0
DIG1
Figure 2. Pin Assignments (Top View)
Table 2. Pin Descriptions
Pin Name
SDA
Pin Number
22
DIG0:DIG7
1, 2, 4, 5, 6, 7,
23, 24
GND
KEY
3
8
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9
RESETN
10
ISET
11
21
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SCL
IRQ
SEGA:SEGG,
SEGDP
Description
Serial-Data I/O. Open drain digital I/O I²C data pin.
Digit Drive Lines. Eight digit drive lines that sink current from the display
common cathode. Keyscan detection optional, but must be polled by the
µProzessor.
Ground.
Keyscan Input. Keyscan lines for key readback. Can be used for self-adressing.
Reset Input. Pull this pin to low to resest all registers (set to default values) and
to put the device into shutdown. Connect this pin via a pull-up resistor to VDD for
normal operation.
Set Segment Current. Connect to VDD or a reference voltage through RSET to
set the peak segment current (see Selecting RSET Resistor Value and Using
External Drivers on page 19).
Serial-Clock Input. 3.4MHz maximum rate.
Interupt Request Output. Open drain pin.
Seven Segment and Decimal Point Drive Lines. 8 seven-segment drives and
decimal point drive that source current to the display.
Positive Supply Voltage. Connect to +2.7V to +5.5V supply. Bypass this pin to
GND with a 0.1µF capacitor to avoid power supply ripple.
Exposed Pad. This pin also functions as a heat sink. Solder it to a large pad or to
the circuit-board ground plane to maximize power dissipation.
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12-15, 17-20
VDD
16
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Exposed Pad
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AS1117
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical
Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 3. Absolute Maximum Ratings
Max
Units
VDD to GND
-0.3
7
V
All other pins to GND
-0.3
7 or
VDD + 0.3
V
DIG0:DIG7 Sink Current
500
mA
SEGA:SEGG, SEGDP
100
mA
85
%
Input Voltage Range
Current
Humidity
5
Non-condensing
1
kV
Norm: MIL 833 E method 3015
±100
mA
EIA/JESD78
30.5
ºC/W
on PCB
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Digital outputs
ESD
Notes
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Min
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Parameter
All other pins
Latch-Up Immunity
Thermal Resistance ΘJA
Ambient Temperature
-40
+85
ºC
Storage Temperature
-55
150
ºC
+260
ºC
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Package Body Temperature
The reflow peak soldering
temperature (body temperature)
specified is in accordance with IPC/
JEDEC J-STD-020D “Moisture/
Reflow Sensitivity Classification for
Non-Hermetic Solid State Surface
Mount Devices”.
The lead finish for Pb-free leaded
packages is matte tin (100% Sn).
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AS1117
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
6 Electrical Characteristics
VDD = 2.7V to 5.5V, RSET = 9.53kΩ, TAMB = -40°C to +85°C, typ. values @ TAMB = +25ºC and VDD = 5.0V (unless otherwise specified).
Table 4. Electrical Characteristics
Conditions
Min
VDD
Operating Supply Voltage
IDDSD
Shutdown Supply Current
IDD
Operating Supply Current
fOSC
Display Scan Rate
8 digits scanned
0.48
IDIGIT
Digit Drive Sink Current
VOUT = 0.65V
320
ISEG
Segment Drive Source Current
ISEG
2.7
All digital inputs at VDD or
GND, TAMB = +25ºC
0.2
RSET = open circuit.
0.35
All segments and decimal
point on; ISEG = -40mA.
335
VDD = 5.0V, VOUT = (VDD -1V)
-35
Max
Unit
5.5
V
2
Segment Drive Current Matching
Segment Drive Source Current
µA
0.6
mA
0.96
kHz
-47
mA
mA
-41
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ΔISEG
Typ
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Parameter
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Symbol
3
Average Current
%
47
mA
Max
1
Unit
µA
Table 5. Logic Inputs/Outputs Characteristics
Symbol
IIH, IIL
VIH
VIL
VOL(SDA)
VKEYopen
VKEYshort
VOL(IRQ)
ΔVI
Parameter
Input Current SDA, SCL
Logic High Input Voltage
SDA, SCL, RESETN
Logic Low Input Voltage
SDA, SCL, RESETN
SDA Output Low Voltage
Keyscan Open Input Voltage
Conditions
VIN = 0V or VDD
Min
-1
Typ
1.26
ISINK = 3mA
0.54
V
0.4
V
V
0.7x VDD
0.4
V
V
V
0.8xVDD
Keyscan Short Input Voltage
Interrupt Output Low Voltage
ISINK = 3mA
Hysteresis Voltage
DIN, CLK, LD/CS
Capacitive Load for Each Bus Line
1
0.7x
VDD
0.05x
VDD
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Open Detection Level Threshold
0.8x
VDD
0.15x
VDD
pF
V
V
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Short Detection Level Threshold
400
0.75x
VDD
0.1x
VDD
V
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AS1117
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
Table 6. Timing Characteristics
tBUF
tHOLDSTART
tLOW
Parameter
SCL Frequency
Bus Free Time Between STOP and
START Conditions
Hold Time for Repeated
START Condition
SCL Low Period
Conditions
Min
MHz
160
ns
50
tHOLDDATA
Data Hold Time
tRISE(SCL)
10
tFALL(SCL)
SCL Rise Time
SCL Rise Time after Repeated START
Condition and After an ACK Bit
SCL Fall Time
tRISE(SDA)
tFALL(SDA)
50
100
10
75
ns
75
ns
ns
ns
70
ns
40
ns
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tRISE(SCL1)
Unit
3.4
µs
tSETUPDATA
tSETUPSTART
Max
1.3
SCL High Period
Setup Time for Repeated
START Condition
Data Setup Time
tHIGH
Typ
0.1
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fSCL
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Symbol
10
80
ns
10
40
ns
SDA Rise Time
20
80
ns
SDA Fall Time
20
80
ns
tSETUPSTOP STOP Condition Setup Time
160
tSPIKESUP Pulse Width of Spike Suppressed
Key Readback
Debounce Time
Notes:
ns
50
ns
20
ms
1. The Min / Max values of the Timing Characteristics are guaranteed by design.
2. All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or SQC
(Statistical Quality Control) methods.
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Figure 3. Timing Diagram
SDI
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tBUF
tHOLDSTART
tSPIKESUP
tSETUPDATA
tF
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tR
tLOW
tHOLDSTART
tHIGH
tSETUPSTOP
tSETUPSTART
SCL
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STOP START
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tHOLDDATA
Repeated
START
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AS1117
Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
7 Typical Operating Characteristics
RSET = 9.53kΩ, VRset = VDD;
Figure 4. Display Scan Rate vs. Supply Voltage;
Figure 5. Display Scan Rate vs. Temperature;
800
780
Vdd=2.7V
740
720
Vdd=5V
Vdd=5.5V
760
740
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fosc (Hz) .
fosc (Hz) .
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Vdd=4V
780
760
720
700
Tamb=-40°C
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700
Tamb=+25°C
Tamb=+85°C
680
2.7
3.1
3.5
3.9
4.3
4.7
5.1
680
-40
5.5
-15
10
Vdd (V)
Figure 6. Segment Current vs. Temperature;
60
Iseg (mA) .
20
Vseg
Vseg
Vseg
Vseg
10
= 1.7V; Vdd = 2.7V
= 1.7V; Vdd = 5V
= 3V; Vdd = 5V
= 4V; Vdd = 5V
Vseg
Vseg
Vseg
Vseg
30
20
0
-15
10
35
60
85
0
10
20
Tamb (°C)
30
40
50
60
70
80
90
Rset (kOhm)
Figure 9. Segment Current vs. VDD; VRset = 2.8V
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Figure 8. Segment Current vs. Supply Voltage;
50
Vseg
Vseg
Vseg
Vseg
ch
45
40
= 1.7V
= 2V
= 2.3V
= 3.1V
35
Iseg (mA) .
40
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Iseg (mA) .
= 4V; Vdd = 5V
= 3V; Vdd = 5V
= 2V; Vdd = 5V
= 1.7V; Vdd = 2.7V
10
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Iseg (mA) .
30
50
85
Figure 7. Segment Current vs. RSET;
40
40
60
60
50
50
0
-40
35
Tamb (°C)
30
20
25
20
15
Vseg = 1.7V
10
Vseg = 3V
10
30
Vseg = 4V
5
0
0
2.7
3.1
3.5
3.9
4.3
4.7
5.1
5.5
2.7
Vdd (V)
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3
3.3
3.6
3.9
4.2
Vdd (V)
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AS1117
Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
Figure 10. VDIGIT vs. IDIGIT
Figure 11. Input High Level vs. Supply Voltage
0.4
3.5
3
2.5
0.2
1.5
1
= 2.7V
= 3.3V
= 4V
= 5V
= 5.5V
0.5
0
0
0.05
0.1
0.15
0.2
0.25
Idig (A)
0.3
Figure 12. ISEG vs. VSEG; VDD = 5V
50
40
3.5
5.5
50
= 10k
= 13k
= 18k
= 30k
= 56k
Rext
Rext
Rext
Rext
Rext
45
40
= 8k2
= 10k
= 13k
= 18k
= 30k
20
15
15
10
10
5
5
0
0
2
2.5
3
3.5
4
4.5
5
1
1.5
2
3
3.5
4
Rext
Rext
Rext
Rext
Rext
Figure 15. ISEG vs. VSEG; VDD = 2.7V
= 6k8
= 8k2
= 10k
= 13k
= 18k
35
30
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25
20
50
Rext
Rext
Rext
Rext
Rext
45
40
= 4k7
= 5k6
= 6k8
= 10k
= 13k
35
Iseg (mA) .
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Figure 14. ISEG vs. VSEG; VDD = 3.3V
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2.5
Vseg (V)
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Vseg (V)
Iseg (mA) .
5.1
25
20
40
4.7
30
25
45
4.3
Vdd (V)
35
30
50
3.9
Iseg (mA) .
Iseg (mA) .
35
3.1
Figure 13. ISEG vs. VSEG; VDD = 4V
Rext
Rext
Rext
Rext
Rext
45
2.7
0.35
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0
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Vdd
Vdd
Vdd
Vdd
Vdd
0.1
2
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Vih (V) .
Vdig (V) .
0.3
30
25
20
15
15
10
10
5
5
0
0
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2
1
Vseg (V)
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1.2
1.4
1.6
1.8
2
2.2
2.4
2.6
Vseg (V)
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AS1117
Datasheet - D e t a i l e d D e s c r i p t i o n
8 Detailed Description
Block Diagram
VDD
Open/Short
Detection
16
100nF
lv
–
RESETN
VDD
VDD
+
9
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Figure 16. AS1117 - Block Diagram
RSET
+
–
Oszillator
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10
ISET
VDD
8
21
IRQ
SEGA-G,
SEGDP
Digital Control
Logic
8
1,2,4,5,6,7,23,24
DIG0 to DIG7
(PWM, Debounce,....)
VDD
12-15, 17-20
8
KEY
VDD
11
SCL
22
Registers
3
GND
Data - Registers
Control - Registers
Scan - Registers
AS1117
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SDA
I²C
Interface
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Figure 17. ESD Structure
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VDD
valid for the pins:
- IRQ
- SCL
- SDA
- ISET
- SEGA-G, SEGDP
- KEY
- RESETN
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VDD
valid for the pins:
- DIG0 to DIG7
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AS1117
Datasheet - D e t a i l e d D e s c r i p t i o n
I²C Interface
The AS1117 supports the I²C serial bus and data transmission protocol in high-speed mode at 3.4MHz. The AS1117
operates as a slave on the I²C bus. The bus must be controlled by a master device that generates the serial clock
(SCL), controls the bus access, and generates the START and STOP conditions. Connections to the bus are made via
the open-drain I/O pins SCL and SDA.
1
0
8
0
0
0
A1
0
9
A0 R/W
1
8
D15 D14 D13 D12 D11 D10
D9
9
D8
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Default values at power up: A1 = A0 = 0
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Figure 18. I²C Interface Initialisation
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Figure 19. Bus Protocol
MSB
SDI
ACK from
Receiver
Slave Address
R/W
Direction Bit
ACK from
Receiver
1
SCL
2
6
7
8
9
ACK
START
1
2
3-8
8
9
ACK
Repeat if More Bytes Transferred
STOP or
Repeated
START
The bus protocol (as shown in Figure 19) is defined as:
- Data transfer may be initiated only when the bus is not busy.
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- During data transfer, the data line must remain stable whenever the clock line is HIGH. Changes in the data line
while the clock line is HIGH will be interpreted as control signals.
The bus conditions are defined as:
- Bus Not Busy. Data and clock lines remain HIGH.
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- Start Data Transfer. A change in the state of the data line, from HIGH to LOW, while the clock is HIGH, defines a
START condition.
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- Stop Data Transfer. A change in the state of the data line, from LOW to HIGH, while the clock line is HIGH,
defines the STOP condition.
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- Data Valid. The state of the data line represents valid data, when, after a START condition, the data line is stable
for the duration of the HIGH period of the clock signal. There is one clock pulse per bit of data.
Each data transfer is initiated with a START condition and terminated with a STOP condition. The number of data
bytes transferred between START and STOP conditions is not limited and is determined by the master device.
The information is transferred byte-wise and each receiver acknowledges with a ninth-bit.
Within the I²C bus specifications a high-speed mode (3.4MHz clock rate) is defined.
- Acknowledge: Each receiving device, when addressed, is obliged to generate an acknowledge after the reception of each byte. The master device must generate an extra clock pulse that is associated with this acknowledge
bit. A device that acknowledges must pull down the SDA line during the acknowledge clock pulse in such a way
that the SDA line is stable LOW during the HIGH period of the acknowledge clock pulse. Of course, setup and
hold times must be taken into account. A master must signal an end of data to the slave by not generating an
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AS1117
Datasheet - D e t a i l e d D e s c r i p t i o n
acknowledge bit on the last byte that has been clocked out of the slave. In this case, the slave must leave the
data line HIGH to enable the master to generate the STOP condition.
- Figure 19 on page 9 details how data transfer is accomplished on the I²C bus. Depending upon the state of the R/
W bit, two types of data transfer are possible:
- Master Transmitter to Slave Receiver. The first byte transmitted by the master is the slave address, followed by
a number of data bytes. The slave returns an acknowledge bit after the slave address and each received byte.
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- Slave Transmitter to Master Receiver. The first byte, the slave address, is transmitted by the master. The slave
then returns an acknowledge bit. Next, a number of data bytes are transmitted by the slave to the master. The
master returns an acknowledge bit after all received bytes other than the last byte. At the end of the last received
byte, a not-acknowledge is returned. The master device generates all of the serial clock pulses and the START
and STOP conditions. A transfer is ended with a STOP condition or a repeated START condition. Since a
repeated START condition is also the beginning of the next serial transfer, the bus will not be released.
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The AS1117 can operate in the following slave modes:
- Slave Receiver Mode. Serial data and clock are received through SDA and SCL. After each byte is received, an
acknowledge bit is transmitted. START and STOP conditions are recognized as the beginning and end of a serial
transfer. Address recognition is performed by hardware after reception of the slave address and direction bit.
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- Slave Transmitter Mode. The first byte (the slave address) is received and handled as in the slave receiver
mode. However, in this mode the direction bit will indicate that the transfer direction is reversed. Serial data is
transmitted on SDA by the AS1117 while the serial clock is input on SCL. START and STOP conditions are recognized as the beginning and end of a serial transfer.
I²C Device Self Addressing
If this feature is used, 2 of the 8 key readback nodes can be left open or shorted for self-addressing. This is done with
KEY together with SEGG and SEGF. This two nodes cannot be used for key-readback in this case. After startup all
devices have the predefined adress 0000000. A single command for self-addressing will update all connected AS1117.
This command has to be done after startup or everytime the AS1117 gets disconnected from the supply. The I²C
address definition must be done with fixed connection, since I²C detection is excluded from debounce time of key registers.
I²C Device Address Byte
The address byte (see Figure 20) is the first byte received following the START condition from the master device.
Figure 20. I²C Device Address Byte
6
5
4
3
2
1
LSB
0
0
0
0
0
0
0
R/W
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predefined address:
MSB
6
5
4
3
2
1
LSB
0
0
0
0
0
A1
A0
R/W
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updated address:
MSB
Te
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- The default slave address is factory-set to 0000000.
- The two LSB bits of the address byte are the device select bits, A0 to A1, which can be set by the self-adress
command after startup. A maximum of four devices with the same pre-set code can therefore be connected on
the same bus at one time.
- The last bit of the address byte (R/W) define the operation to be performed. When set to a 1 a read operation is
selected; when set to a 0 a write operation is selected.
Following the START condition, the AS1117 monitors the I²C bus, checking the device type identifier being transmitted.
Upon receiving the address code, and the R/W bit, the slave device outputs an acknowledge signal on the SDA line.
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Revision 1.00
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AS1117
Datasheet - D e t a i l e d D e s c r i p t i o n
Command Byte
The AS1117 operation, (see Table 7) is determined by a command byte (see Figure 21 on page 11).
MSB
6
5
4
3
2
1
LSB
D15
D14
D13
D12
D11
D10
D09
D08
Figure 22. Command and Single Data Byte Received
From Master to Slave
AS1117 Registers
S
0
Slave Address
D15 D14 D13 D12 D11 D10 D9
R/W A
D8
D7
D6
D5
A
Command Byte
D4
D3
D2
D1
D0
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From Slave to Master
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Figure 21. Command Byte
A
Data Byte
P
1 Byte
Acknowledge
from AS1117
Acknowledge
from AS1117
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Acknowledge
from AS1117
0
0
0
Autoincrement
Memory Word
Address
Figure 23. Setting the Pointer to a Address Register to select a Data Register for a Read Operation
From Master to Slave
AS1117 Registers
From Slave to Master
S
0
Slave Address
D15 D14 D13 D12 D11 D10 D9
R/W A
Acknowledge
from AS1117
D8
A
Command Byte
Acknowledge
from AS1117
0
P
0
ca
Figure 24. Reading nBytes from AS1117
Autoincrement
Memory Word
Address
From Master to Slave
Slave Address
R/W A
1
Acknowledge
from Master
0
D6
D5
D4
D3
D2
D1
AS1117 Registers
D0
1
n Bytes
A
First Data Byte
D7
Not Acknowledge
from Master
0
/A
Second Data Byte
D7
D6
D5
D4
D3
D2
D1
P
D0
Autoincrement
to next address
Te
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S
Acknowledge
from AS1117
ni
From Slave to Master
Stop reading
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Revision 1.00
11 - 23
AS1117
Datasheet - D e t a i l e d D e s c r i p t i o n
Initial Power-Up
On initial power-up, the AS1117 registers are reset to their default values, the display is blanked, and the device goes
into shutdown mode. At this time, all registers should be programmed for normal operation.
Note: The default settings enable only scanning of one digit; the internal decoder is disabled and the Intensity Control
Register (see page 17) is set to the minimum values.
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Shutdown Mode
The AS1117 devices feature a shutdown mode, where they consume only 200nA (typ) current. Shutdown mode is
entered via a write to the Shutdown Register (see Table 8) or via pulling the pin RESTEN to logic low. When pin
RESETN is set to logic low an according write to the Shutdown Register is done internally. During shutdown mode the
Digit-Registers maintain their data.
lv
Note: When pin RESETN is pulled to logic high again, a write to the Shutdown Register in necessary to leave the
shutdown mode.
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Shutdown mode can either be used as a means to reduce power consumption or for generating a flashing display
(repeatedly entering and leaving shutdown mode). For minimum supply current in shutdown mode, logic input should
be at GND or VDD (CMOS logic level).
When entering or leaving shutdown mode, the Feature Register is reset to its default values (all 0s) when Shutdown
Register bit D7 (page 13) = 0.
Note: When Shutdown Register bit D7 = 1, the Feature Register is left unchanged when entering or leaving shutdown mode. If the AS1117 is used with an external clock, Shutdown Register bit D7 should be set to 1 when
writing to the Shutdown Register.
Digit- and Control-Registers
The AS1117 devices contain 8 Digit-Registers,11 control-registers and 10 diagnostic-registers, which are listed in Table
7. All registers are selected using a 8-bit address word, and communication is done via the I²C interface.
!
Digit Registers – These registers are realized with an on-chip 64-bit memory. Each digit can be controlled directly
without rewriting the whole register contents.
!
Control Registers – These registers consist of decode mode, display intensity, number of scanned digits, shutdown, display test and features selection registers.
Register
Digit 0
D12
D11
D10
D9
D8
D7:D0
Page
000
0
0
0
0
1
N/A
000
0
0
0
1
0
N/A
000
0
0
0
1
1
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Digit 2
D15:D13
N/A
(see Table 10 on page 14,
Table 11 on page 14 and
Table 12 on page 15)
Digit 3
000
0
0
1
0
0
Digit 4
000
0
0
1
0
1
Digit 5
000
0
0
1
1
0
N/A
Digit 6
000
0
0
1
1
1
N/A
Digit 7
000
0
1
0
0
0
N/A
N/A
N/A
Te
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Digit Register
Digit 1
Address
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Type
Table 7. Register Address Map
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Revision 1.00
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AS1117
Datasheet - D e t a i l e d D e s c r i p t i o n
Address
Register
Page
D12
D11
D10
D9
D8
D7:D0
Decode-Mode
000
0
1
0
0
1
(see Table 9 on page 14)
13
Global Intensity
000
0
1
0
1
0
(see Table 18 on page 17)
17
Scan Limit
000
0
1
0
1
1
(see Table 20 on page 17)
17
Shutdown
000
0
1
1
0
0
(see Table 8 on page 13)
12
Self-Adressing
001
0
1
1
0
1
Feature
000
0
1
1
1
0
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D15:D13
N/A
(see Table 21 on page 18)
18
14
000
0
1
1
1
1
(see Table 15 on page 16)
000
1
0
0
0
0
(see Table 19 on page 17)
DIG2:DIG3 Intensity
000
1
0
0
0
1
(see Table 19 on page 17)
DIG4:DIG5 Intensity
000
1
0
0
1
0
(see Table 19 on page 17)
(see Table 19 on page 17)
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Display Test Mode
DIG0:DIG1 Intensity
DIG6:DIG7 Intensity
000
1
0
0
1
1
Diagnostic Digit 0
000
1
0
1
0
0
000
1
0
1
0
1
N/A
000
1
0
1
1
0
N/A
000
1
1
0
1
1
N/A
000
1
1
0
0
0
N/A
000
1
1
0
0
1
N/A
000
1
1
0
1
0
N/A
000
1
1
0
1
1
N/A
000
1
1
1
0
0
Diagnostic Digit 1
Diagnostic Digit 2
Diagnostic Digit 3
Diagnostic Digit 4
Diagnostic Digit 5
Diagnostic Digit 6
Diagnostic Digit 7
KEY
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Keyscan/Diagnostic Register
Control Register
Type
Table 7. Register Address Map
N/A
The Shutdown Register controls AS1117 shutdown mode.
Table 8. Shutdown Register Format (Address (HEX) = 0x0C))
Mode
Register Data
D7
D6
D5
D4
D3
D2
D1
D0
0x00
0
X
X
X
X
X
X
0
0x80
1
X
X
X
X
X
X
0
0x01
0
X
X
X
X
X
X
1
0x81
1
X
X
X
X
X
X
1
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Shutdown Mode,
Reset Feature Register to Default Settings
Shutdown Mode, Feature Register Unchanged
Normal Operation,
Reset Feature Register to Default Settings
Normal Operation, Feature Register Unchanged
HEX Code
Decode Enable Register (0x09)
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The Decode Enable Register sets the decode mode. BCD/HEX decoding (either BCD code – characters 0:9, E, H, L,
P, and -, or HEX code – characters 0:9 and A:F) is selected by bit D2 (page 18) of the Feature Register. The Decode
Enable Register is used to select the decode mode or no-decode for each digit. Each bit in the Decode Enable Register corresponds to its respective display digit (i.e., bit D0 corresponds to digit 0, bit D1 corresponds to digit 1 and so
on). Table 10 on page 14 lists some examples of the possible settings for the Decode Enable Register bits.
Note: A logic high enables decoding and a logic low bypasses the decoder altogether.
When decode mode is used, the decoder looks only at the lower-nibble (bits D3:D0) of the data in the Digit-Registers,
disregarding bits D6:D4. Bit D7 sets the decimal point (SEG DP) independent of the decoder and is positive logic (bit
D7 = 1 turns the decimal point on). Table 10 on page 14 lists the code-B font; Table 11 on page 14 lists the HEX font.
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Revision 1.00
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AS1117
Datasheet - D e t a i l e d D e s c r i p t i o n
When no-decode mode is selected, data bits D7:D0 of the Digit-Registers correspond to the segment lines of the
AS1117. Table 12 on page 15 shows the 1:1 pairing of each data bit to the appropriate segment line.
Table 9. Decode Enable Register Format Examples
HEX Code
No decode for digits 7:0
Code-B/HEX decode for digit 0. No decode for digits 7:1
Code-B/HEX decode for digit 0:2. No decode for digits 7:3
Code-B/HEX decode for digits 0:5. No decode for digits 7:6
Code-B/HEX decode for digits 0,2,5.
No decode for digits 1, 3, 4, 6, 7
0x00
0x01
0x07
0x3F
D7
0
0
0
0
D6
0
0
0
0
0x25
0
0
Register Data
D5 D4 D3 D2
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
0
0
A
F
B
0
1
C
D
Table 10. Code-B Font
1
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G
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D0
0
1
1
1
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Figure 25. Standard 7-Segment LED Intensity Control and Inter-Digit Blanking
D1
0
0
1
1
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Decode Mode
DP
Register Data
Register Data
Register Data
CharCharCharacter D7 D6:D4 D3 D2 D1 D0 acter D7 D6: D4 D3 D2 D1 D0 acter D7 D6:D4 D3 D2 D1 D0
0
0
0
0
X
0
1
1
0
X
1
1
0
0
X
0
0
0
1
X
0
1
1
1
X
1
1
0
1
X
0
0
1
0
X
1
0
0
0
X
1
1
1
0
X
0
0
1
1
X
1
0
0
1
X
1
1
1
1
X
X
X
X
X
X
*
0
1
0
0
X
1
0
1
0
0
1
0
1
X
1
0
1
1
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X
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X
*
1
ch
The decimal point can be enabled with every character by setting bit D7 = 1.
Table 11. HEX Font
Te
Register Data
Register Data
Register Data
CharCharCharacter D7 D6:D4 D3 D2 D1 D0 acter D7 D6: D4 D3 D2 D1 D0 acter D7 D6:D4 D3 D2 D1 D0
X
0
0
0
0
X
0
1
1
0
X
1
1
0
0
X
0
0
0
1
X
0
1
1
1
X
1
1
0
1
X
0
0
1
0
X
1
0
0
0
X
1
1
1
0
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Revision 1.00
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AS1117
Datasheet - D e t a i l e d D e s c r i p t i o n
Table 11. HEX Font
Register Data
Register Data
Register Data
CharCharCharacter D7 D6:D4 D3 D2 D1 D0 acter D7 D6: D4 D3 D2 D1 D0 acter D7 D6:D4 D3 D2 D1 D0
0
1
1
X
1
0
0
1
X
0
1
0
0
X
1
0
1
0
X
0
1
0
1
X
1
0
1
1
*
1
X
1
1
1
1
X
X
X
X
X
The decimal point can be enabled with every character by setting bit D7 = 1.
Table 12. No-Decode Mode Data Bits and Corresponding Segment Lines
I²C Self Addressing
D6
A
D5
B
D4
C
D3
D
D2
E
D1
F
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Corresponding Segment Line
D7
DP
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*
X
D0
G
If this feature is used, 2 of the 8 key readback nodes can be left open or shorted for self-addressing. This is done with
KEY together with SEGG and SEGF. This two nodes cannot be used for key-readback in this case. After startup all
devices have the predefined adress 0000000. A single command for selfaddressing will update all connected AS1117.
This command has to be done after startup or everytime the AS1117 gets disconnected from the supply. The I²C
address definition must be done with fixed connection, since I²C detection is excluded from debounce time of key registers.
Note: A short writes a logical “0” whereas an open writes a logical “1” as address bit.
Table 13. Self Addressing Register (Address (HEX) = 0x2D))
D7
X
X
Factory-set IC address
User-set IC address
Keyscan Register
D6
X
X
D5
X
X
D4
X
X
D3
X
X
D2
X
X
D1
X
X
D0
0
1
ca
These two registers contain the result of the keyscan input of the 8 keys. To ensure proper results the data in these
registers are updated only if the logic data scanned is stable for 20ms (debounce time). A change of the data stored
within these two registers is indicated by a logic low on the IRQ pin. The IRQ is high-impedance if a read operation on
the key scan registers is started.
ni
Table 14. LED Diagnostic Register Address
Register HEX Address
KEY
D6
A
D5
B
Segment
D4
D3
C
D
D2
E
D1
F
D0
G
ch
0x1C
D7
DP
Te
Note: If I²C self addressing is used segment G&F of KEY is used for the two LSB of the I²C address. In this case
these two nodes cannot be used as a key. Additionally the debounce time is disabled for these two bits.
The data within the keyscan register is updated continuously during every cycle (1/10 of refresh rate). Therefore, to get a valid readback of keys it is recommended to read out the keyscan registers immediately after the
IRQ is triggered. A short writes a logical “0” whereas an open writes a logical “1” as keyscan register bit.
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Revision 1.00
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AS1117
Datasheet - D e t a i l e d D e s c r i p t i o n
Display-Test Mode
The AS1117 can detect open or shorted LEDs. Readout of either open LEDs or short LEDs is possible, as well as a OR
relation of open and short.
Note: All settings of the digit- and control-registers are maintained.
Table 15. Testmode Register Summary
D6
RSET_short
D5
RSET_open
D4
LED_global
D3
LED_test
D2
LED_open
D1
LED_short
Table 16. Testmode Register Bit Description (Address (HEX) = 0x0F))
Addr: 0x0F
Bit
Address
Bit Name
Default
Access
D0
DISP_test
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D7
X
D7:D0
DISP_test
0
W
D1
LED_short
0
W
Starts a test for shorted LEDs. (Can be set together with D2)
0: Normal operation; 1: Activate testmode
D2
LED_open
0
W
Starts a test for open LEDs. (Can be set together with D1)
0: Normal operation; 1: Activate testmode
D3
LED_test
0
R
Indicates an ongoing open/short LED test
0: No ongoing LED test; 1: LED test in progress
D4
LED_global
0
R
Indicates that the last open/short LED test has detected an error
0: No error detected; 1: Error detected
D5
RSET_open
0
R
Checks if external resistor RSET is open
0: RSET correct; 1: RSET is open
D6
RSET_short
0
R
Checks if external resistor RSET is shorted
0: RSET correct; 1: RSET is shorted
0
-
Not used
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D0
Optical display test. (Testmode for external visual test.)
0: Normal operation; 1: Run display test (All digits are tested
independently from scan limit & shutdown register.)
D7
LED Diagnostic Registers
These eight registers contain the result of the LED open/short test for the individual LED of each digit.
Table 17. LED Diagnostic Register Address
Digit
ca
Segment
D7
A
B
C
ni
DIG0
DIG1
DP
DIG2
DIG3
D6 D5 D4 D3 D2 D1 D0
D
E
F
G
Register
HEX
Address
0x18
0x19
0x1A
0x1B
Segment
Digit
D7 D6 D5 D4 D3 D2 D1 D0
DIG4
DIG5
DP
DIG6
DIG7
A
B
C
D
E
F
G
ch
Register
HEX
Address
0x14
0x15
0x16
0x17
Note: If one or more short occures in the LED array, detection of individual LED fault could become ambiguous.
Intensity Control Register (0x0A)
Te
The brightness of the display can be controlled by digital means using the Intensity Control Registers and by analog
means using RSET (see Selecting RSET Resistor Value and Using External Drivers on page 19). The intensity can be
controlled globally for all digits, or for each digit individually. The global intensity command will write intensity data to all
four individual brightness registers, while the individual intesity command will only write to the associated individual
intensity register.
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Revision 1.00
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AS1117
Datasheet - D e t a i l e d D e s c r i p t i o n
Display brightness is controlled by an integrated pulse-width modulator which is controlled by the lower-nibble of the
Intensity Control Register. The modulator scales the average segment-current in 16 steps from a maximum of 15/16
down to 1/16 of the peak current set by RSET.
Table 18. Intensity Register Format
1/16 (min on)
2/16
3/16
4/16
5/16
6/16
7/16
8/16
0xX0
0xX1
0xX2
0xX3
0xX4
0xX5
0xX6
0xX7
MSB
0
0
0
0
0
0
0
0
Register Data
D2
D1 LSB
0
0
0
0
0
1
0
1
0
0
1
1
1
0
0
1
0
1
1
1
0
1
1
1
Duty Cycle
HEX Code
9/16
10/16
11/16
12/16
13/16
14/16
15/16
15/16 (max on)
0xX8
0xX9
0xXA
0xXB
0xXC
0xXD
0xXE
0xXF
Register Data
Register HEX Address
0x0A
0x10
0x11
0x12
0x13
Register Data
D2
D1 LSB
0
0
0
0
0
1
0
1
0
0
1
1
1
0
0
1
0
1
1
1
0
1
1
1
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Table 19. Intensity Register Address
MSB
1
1
1
1
1
1
1
1
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HEX Code
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Duty Cycle
Type
Global
Digit
Digit
Digit
Digit
D7:D4
X
Digit 1 Intensity
Digit 3 Intensity
Digit 5 Intensity
Digit 7 Intensity
D3:D0
Global Intensity
Digit 0 Intensity
Digit 2 Intensity
Digit 4 Intensity
Digit 6 Intensity
Scan-Limit Register (0x0B)
The Scan-Limit Register controls which of the digits are to be displayed. When all 8 digits are to be displayed, the
update frequency is typically 700Hz. If the number of digits displayed is reduced, the update frequency is increased.
The frequency can be calculated using 10 x fOSC/(N+2), where N is the number of digits.
Note: To avoid differences in brightness this register should not be used to blank parts of the display (leading zeros).
Table 20. Scan-Limit Register Format (Address (HEX) = 0x0B))
Scan Limit
Scan Limit
Display digits 0:4
Display digits 0:5
Display digits 0:6
Display digits 0:7
Register Data
HEX
Code D7:D3 D2 D1 D0
0xX4
X
1
0
0
0xX5
X
1
0
1
0xX6
X
1
1
0
0xX7
X
1
1
1
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Display digit 0 only
Display digits 0:1
Display digits 0:2
Display digits 0:3
Register Data
HEX
Code D7:D3 D2 D1 D0
0xX0
X
0
0
0
0xX1
X
0
0
1
0xX2
X
0
1
0
0xX3
X
0
1
1
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Revision 1.00
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AS1117
Datasheet - D e t a i l e d D e s c r i p t i o n
Feature Register (0x0E)
The Feature Register is used for enabling various features including switching the device into external clock mode,
applying an external reset, selecting code-B or HEX decoding, enabling or disabling blinking, setting the blinking rate,
and resetting the blink timing.
Note: At power-up the Feature Register is initialized to 0.
D7
D6
D5
D4
D3
D2
D1
blink_
start
sync
blink_
freq_sel
blink_en
NU
decode_sel
reg_res
Table 22. Feature Register Bit Descriptions (Address (HEX) = 0xXE)
D2
D3
D4
D5
D6
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D1
clk_en
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D0
D0
Feature Register
Enables and disables various device features.
Bit Name
Default
Access
Bit Description
External clock active.
clk_en
0
R/W
0 = Internal oscillator is used for system clock.
1 = Pin CLK of the serial interface operates as system clock input.
Resets all control registers except the Feature Register.
0 = Reset Disabled. Normal operation.
reg_res
0
R/W
1 = All control registers are reset to default state (except the Feature
Register) identically after power-up.
Note: The Digit Registers maintain their data.
Selects display decoding for the selected digits (Table 9 on page 14).
decode_sel
0 = Enable Code-B decoding (see Table 10 on page 14).
0
R/W
1 = Enable HEX decoding (see Table 11 on page 14).
NU
Not used
Enables blinking.
blink_en
0
R/W
0 = Disable blinking. 1 = Enable blinking.
Sets blink with low frequency (with the internal oscillator enabled):
blink_freq_sel
0 = Blink period typically is 1 second (0.5s on, 0.5s off).
0
R/W
1 = Blink period is 2 seconds (1s on, 1s off).
Synchronizes blinking on the rising edge of pin LD/CS. The multiplex
and blink timing counter is cleared on the rising edge of pin LD/CS. By
sync
0
R/W
setting this bit in multiple devices, the blink timing can be synchronized
across all the devices.
Start Blinking with display enabled phase. When bit D4 (blink_en) is set,
bit D7 determines how blinking starts.
blink_start
0
R/W
0 = Blinking starts with the display turned off.
1 = Blinking starts with the display turned on.
Addr: 0xXE
Bit
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Table 21. Feature Register Summary
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Revision 1.00
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AS1117
Datasheet - Ty p i c a l A p p l i c a t i o n
9 Typical Application
Selecting RSET Resistor Value and Using External Drivers
Brightness of the display segments is controlled via RSET. The current that flows into ISET defines the current that flows
through the LEDs.
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Segment current is about 200 times the current in ISET. Typical values for RSET for different segment currents, operating voltages, and LED voltage drop (VLED) are given in Table 23 & Table 24. The maximum current the AS1117 can
drive is 47mA. If higher currents are needed, external drivers must be used, in which case it is no longer necessary
that the devices drive high currents.
Note: The display brightness can also be logically controlled (see Intensity Control Register (0x0A) on page 16).
VLED
VLED
VLED
1.5V
2.0V
2.5V
1.5V
5kΩ
6.9kΩ
10.7kΩ
22.2kΩ
4.4kΩ
5.9kΩ
9.6kΩ
20.7kΩ
6.7kΩ
9.1kΩ
13.9kΩ
28.8kΩ
6.4kΩ
8.8kΩ
13.3kΩ
27.7kΩ
5.7kΩ
8.1kΩ
12.6kΩ
26kΩ
7.5kΩ
10.18kΩ
15.6kΩ
31.9kΩ
VDD = 3.6V
2.0V
VDD = 3.3V
1.5V
2.0V
2.5V
3.0V
7.2kΩ
9.8kΩ
15kΩ
31kΩ
6.6kΩ
9.2kΩ
14.3kΩ
29.5kΩ
5.5kΩ
7.5kΩ
13kΩ
27.3kΩ
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40
30
20
10
VDD = 2.7V
ISEG (mA)
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Table 23. RSET vs. Segment Current and LED Forward Voltage, VDD = 2.7V & 3.3V & 3.6V
Table 24. RSET vs. Segment Current and LED Forward Voltage, VDD = 4.0V & 5.0V
VLED
VDD = 4.0V
40
30
20
10
1.5V
2.0V
8.6kΩ
8.3kΩ
11.6kΩ 11.2kΩ
17.7kΩ 17.3kΩ
36.89kΩ 35.7kΩ
2.5V
VLED
3.0V
3.5V
7.9kΩ
7.6kΩ 5.2kΩ
10.8kΩ 9.9kΩ 7.8kΩ
16.6kΩ 15.6kΩ 13.6kΩ
34.5kΩ 32.5kΩ 29.1kΩ
VDD = 5.0V
ISEG
(mA)
1.5V
2.0V
11.35kΩ
15.4kΩ
23.6kΩ
48.9kΩ
11.12kΩ
15.1kΩ
23.1kΩ
47.8kΩ
2.5V
3.0V
10.84kΩ 10.49kΩ
14.7kΩ 14.4kΩ
22.6kΩ
22kΩ
46.9kΩ 45.4kΩ
3.5V
4.0V
10.2kΩ
13.6kΩ
21.1kΩ
43.8kΩ
9.9kΩ
13.1kΩ
20.2kΩ
42kΩ
Calculating Power Dissipation
The upper limit for power dissipation (PD) for the AS1117 is determined from the following equation:
PD = (VDD x 5mA) + (VDD - VLED)(DUTY x ISEG x N)
Where:
(EQ 1)
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VDD is the supply voltage.
DUTY is the duty cycle set by intensity register (page 17).
N is the number of segments driven (worst case is 8)
VLED is the LED forward voltage
ISEG = segment current set by RSET
Dissipation Example:
(EQ 2)
PD = 5V(5mA) + (5V - 2.2V)(15/16 x 40mA x 8) = 0.865W
(EQ 3)
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ISEG = 40mA, N = 8, DUTY = 15/16, VLED = 2.2V at 40mA, VDD = 5V
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Thus, for a TQFN(4x4)-24 package ΘJA = +30.5°C/W, the maximum allowed TAMB is given by:
TJ,MAX = TAMB + PD x ΘJA = 150°C = TAMB + 0.865W x 30.5°C/W
(EQ 4)
In this example the maximum ambient temperature must stay below 123.61°C.
www.austriamicrosystems.com/LED-Driver-ICs/AS1117
Revision 1.00
19 - 23
AS1117
Datasheet - Ty p i c a l A p p l i c a t i o n
8x8 Dot Matrix Mode
The application example in Figure 26 shows the AS1117 in the 8x8 LED dot matrix mode.
The LED columns have common cathodes and are connected to the DIG0:7 outputs. The rows are connected to the
segment drivers. Each of the 64 LEDs can be addressed separately. The columns are selected via the digits as listed
in Table 7 on page 12.
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The Decode Enable Register (see page 13) must be set to ‘00000000’ as described in Table 9 on page 14. Single
LEDs in a column can be addressed as described in Table 12 on page 15, where bit D0 corresponds to segment G and
bit D7 corresponds to segment DP.
VDD
2.7V to 5V
VDD
DIG0 to
DIG7
ISET
SEG A to G
SEP DP
Diode Arrangement
9.53kΩ
SDA
SDA
µP
IRQ
SCL
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SCL
AS1117
IRQ
GND
RESETN
Keyscan
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Figure 26. Application Example as LED Dot Matrix Driver
The key readback of the AS1117 can be used either for push buttons as well as switches. If only a single key is
pressed (shorted) at a time no additional diodes are required. If a detection of multiple simultaneous keystrokes is
required diodes within the keypath, as shown in Figure 27, are required. Pressing multiple keys without the diodes
would result in ambiguous results.
Figure 27. Keyscan Configuration
KEY
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IRQ
SEGB
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SEGA
SEGC
SEGD
SEG E
SEGF
SEGG
SEGDP
Diodes are optional and only required if multiple keystrokes must be
detected simultaneously.
If I²C Self-Adressing is used these two keys cannot be used for readback and must be either hard wired opened or shorted.
A short writes a logical “1” whereas an open writes a logical “0” as
address bit.
Supply Bypassing and Wiring
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In order to achieve optimal performance the AS1117 should be placed very close to the LED display to minimize effects
of electromagnetic interference and wiring inductance.
Furthermore, it is recommended to connect a 10µF and a 0.1µF ceramic capacitor between pins VDD and GND to
avoid power supply ripple (see Figure 16 on page 8).
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Revision 1.00
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AS1117
Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
10 Package Drawings and Markings
The AS1117 is available in the TQFN(4x4)-24 package.
Figure 28. TQFN(4x4)-24 Package
20
21
22
23
24
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18
1
17
2
16
3
4
14
5
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15
6
13
11
10
9
8
7
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12
m
m
Min
0.50
0.00
0.152REF
0.23
4.00BSC
4.00BSC
2.80
2.80
Max
0.60
0.05
0.28
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0.18
Typ
0.55
2.70
2.70
2.90
2.90
Symbol
e
L
L1
aaa
bbb
ccc
ddd
eee
Min
0.30
0.00
Typ
0.50BSC
0.35
Max
0.40
0.10
0.10
0.10
0.10
0.05
0.08
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Symbol
A
A1
A3
b
D
E
D2
E2
Notes:Unilateral coplanarity zone applies to the exposed heat sink slug as well as the terminals.
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1. All dimensions are in millimeters; angles in degrees.
2. Dimension b applies to metallized terminal and is measured between 0.25mm and 0.30mm from terminal tip.
Dimension L1 represents terminal full back from package edge up to 0.1mm is acceptable.
3. Coplanarity applies to the exposed heat slug as well as the terminal.
4. Radius on terminal is optional.
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Revision 1.00
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AS1117
Datasheet - O r d e r i n g I n f o r m a t i o n
11 Ordering Information
The devices are available as the standard products shown in Table 25.
Table 25. Ordering Information
Marking
AS1117-BQFT
ASSU
Description
64 LED Driver for Mobile
Applications with Error Detection
Delivery Form
Package
Tape and Reel
TQFN(4x4)-24
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Ordering Code
Note: All products are RoHS compliant.
Buy our products or get free samples online at ICdirect: http://www.austriamicrosystems.com/ICdirect
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Technical Support is found at http://www.austriamicrosystems.com/Technical-Support
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For further information and requests, please contact us mailto:[email protected]
or find your local distributor at http://www.austriamicrosystems.com/distributor
www.austriamicrosystems.com/LED-Driver-ICs/AS1117
Revision 1.00
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AS1117
Datasheet
Copyrights
Copyright © 1997-2010, austriamicrosystems AG, Tobelbaderstrasse 30, 8141 Unterpremstaetten, Austria-Europe.
Trademarks Registered ®. All rights reserved. The material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of the copyright owner.
All products and companies mentioned are trademarks or registered trademarks of their respective companies.
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Disclaimer
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Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing
in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding
the information set forth herein or regarding the freedom of the described devices from patent infringement.
austriamicrosystems AG reserves the right to change specifications and prices at any time and without notice.
Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for
current information. This product is intended for use in normal commercial applications. Applications requiring
extended temperature range, unusual environmental requirements, or high reliability applications, such as military,
medical life-support or life-sustaining equipment are specifically not recommended without additional processing by
austriamicrosystems AG for each application. For shipments of less than 100 parts the manufacturing flow might show
deviations from the standard production flow, such as test flow or test location.
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The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However,
austriamicrosystems AG shall not be liable to recipient or any third party for any damages, including but not limited to
personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or
consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the
technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of
austriamicrosystems AG rendering of technical or other services.
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Contact Information
Headquarters
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austriamicrosystems AG
Tobelbaderstrasse 30
A-8141 Unterpremstaetten, Austria
Tel: +43 (0) 3136 500 0
Fax: +43 (0) 3136 525 01
For Sales Offices, Distributors and Representatives, please visit:
http://www.austriamicrosystems.com/contact
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Revision 1.00
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